Integrated sensor package structure

Abstract

This invention discloses an integrated sensor package structure. [Solution] The integrated sensor package structure comprises a substrate, a plurality of sensor package units, and a package layer. The substrate has a first surface and a second surface. The plurality of sensor package units are installed on the first surface. Each sensor package unit comprises a sensor chip installed on the first surface, a light-transmitting component installed above the sensor chip, and an optical module installed on the surface of the light-transmitting component. The optical module comprises a frame installed on the sensor chip and a lens installed within the frame. The package layer surrounds each of the sensor package units. The thickness of the sensor chip in at least one of the sensor package units is different from the thickness of the sensor chip in another sensor package unit.

Description

Technical Field

[0001] The present invention relates to a sensor package structure, and in particular to an integrated sensor package structure.

Background Art

[0002] In general, in a conventional sensor package structure, a plurality of different sensor package units are usually individually packaged, and then the plurality of different packaged sensor package units are combined. However, this method has a problem that the structure of the conventional sensor package structure is not sufficiently simplified.

Summary of the Invention

Problem to be Solved by the Invention

[0003] The present invention discloses an integrated sensor package structure, and mainly aims to improve the problem that the structure of a conventional sensor package structure is not sufficiently simplified.

Means for Solving the Problem

[0004] One embodiment of the present invention discloses an integrated sensor package structure. The integrated sensor package structure comprises a substrate having a first surface and a second surface facing each other, a plurality of sensor package units mounted on the first surface, and a package layer, each of the sensor package units comprising a sensor chip mounted on the first surface, a light-transmitting component mounted above the sensor chip, and an optical module mounted on the surface of the light-transmitting component away from the sensor chip, the optical module comprising a frame mounted on the sensor chip and at least one lens mounted within the frame, the package layer surrounding the periphery of the sensor chip and the light-transmitting component of each of the sensor package units, the thickness of the sensor chip of at least one of the sensor package units being different from the thickness of the sensor chip of another of the sensor package units, and the thickness of the light-transmitting component of at least one of the sensor package units being different from the thickness of the light-transmitting component of another of the sensor package units.

[0005] One embodiment of the present invention discloses an integrated sensor package structure. The integrated sensor package structure comprises a substrate having a first surface and a second surface facing each other, a plurality of sensor package units mounted on the first surface, and a package layer, each of the sensor package units comprising a sensor chip mounted on the first surface, a light-transmitting component mounted above the sensor chip, and an optical module mounted on the surface of the light-transmitting component away from the sensor chip, the optical module comprising a frame mounted on the sensor chip and at least one lens mounted within the frame, the package layer surrounding the sensor chip and the light-transmitting component of each of the sensor package units, and the thickness of the sensor chip of at least one of the sensor package units is different from the thickness of the sensor chip of another of the sensor package units. [Effects of the Invention]

[0006] From the above, the integrated sensor package structure according to the present invention can improve the problem that the structure of conventional sensor package structures is not sufficiently simplified by the technical means that "a plurality of the sensor package units are installed on the first surface of the substrate" and "the thickness of the sensor chip of at least one of the sensor package units is different from the thickness of the sensor chip of another sensor package unit".

[0007] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention, however, these descriptions and drawings are intended solely to illustrate the present invention and do not limit the scope of protection of the present invention in any way. [Brief explanation of the drawing]

[0008] [Figure 1] This is a schematic three-dimensional diagram of an integrated sensor package structure according to the first embodiment of the present invention. [Figure 2] This is an exploded schematic diagram of an integrated sensor package structure according to the first embodiment of the present invention. [Figure 3] This is a schematic cross-sectional view along line III-III in Figure 1. [Figure 4] This is a schematic diagram showing that the package layer of the integrated sensor package structure according to the first embodiment is composed of a liquid package adhesive. [Figure 5] This is a schematic diagram of an integrated sensor package structure according to a second embodiment of the present invention. [Figure 6] Figure 5 is an enlarged schematic diagram of region IV. [Modes for carrying out the invention]

[0009] The following describes embodiments of the "integrated sensor package structure" disclosed herein by specific examples. Those skilled in the art will be able to understand the advantages and effects of the present invention from the disclosed content. The present invention can be implemented or applied through other different specific embodiments, and the various detailed descriptions herein can be modified and changed in various ways based on different perspectives and applications without departing from the spirit of the invention. It should also be noted that the drawings of the present invention are for illustrative purposes only and are not based on actual dimensions. The following embodiments will describe the technical content of the present invention in more detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

[0010] In this specification, terms such as “first,” “second,” etc., may be used to describe various elements or signals, but it should be understood that these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another, or one signal from another. Furthermore, the term “or” in this specification should be understood to include any one or more of the items listed in relation to it, depending on the actual situation. [First Embodiment]

[0011] As shown in Figures 1 and 2, Figure 1 is a schematic three-dimensional view of an integrated sensor package structure according to a first embodiment of the present invention, and Figure 2 is an exploded schematic view of an integrated sensor package structure according to a first embodiment of the present invention. A first embodiment of the present invention provides an integrated sensor package structure 100. The integrated sensor package structure 100 comprises a substrate 1, a plurality of sensor package units 2, and a package layer 3. The substrate 1 has a first surface 11 and a second surface 12 facing each other. The substrate 1 may be, for example, a ceramic substrate or a printed circuit board.

[0012] As shown in Figures 3 and 4, Figure 3 is a schematic cross-sectional view along line III-III in Figure 1, and Figure 4 is a schematic diagram showing that the package layer of the integrated sensor package structure according to the first embodiment is composed of a liquid package adhesive. The multiple sensor package units 2 are installed on the first surface 11 of the substrate 1. Each sensor package unit 2 may be, for example, a ball grid array (BGA) package unit. Each sensor package unit 2 comprises a sensor chip 21, a light-transmitting component 22, and an optical module 23.

[0013] Furthermore, each sensor package unit 2 may further include a plurality of wires W. One end of each wire W is connected to the first surface 11 of the substrate 1, and the other end of each wire W is connected to the sensor chip 21. The package layer 3 surrounds the sensor chip 21 and the light-transmitting component 22 of each sensor package unit 2. Preferably, as shown in Figure 4, the package layer 3 may be formed of a liquid package adhesive, but the present invention is not limited thereto.

[0014] An electrical connector 13 (see Figures 1 and 2) may be installed on the substrate 1. A plurality of solder balls 14 may be formed on the second surface 12 of the substrate 1. The sensor package unit 2 is electrically connected to an electronic component (not shown) by soldering the plurality of solder balls 14 to the electronic component. In this embodiment, the number of the plurality of sensor package units 2 is three, for example, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the number of the plurality of sensor package units 2 may be two or three or more.

[0015] In each of the sensor package units 2, the sensor chip 21 is installed on the first surface 11 of the substrate 1. The sensor chip 21 may be an image sensor chip, and the light-transmitting component 22 may be, for example, transparent glass, but the present invention is not limited thereto. The light-transmitting component 22 is installed above the sensor chip 21, and the optical module 23 is installed on the surface of the light-transmitting component 22 that is away from the sensor chip 21.

[0016] The thickness of the sensor chip 21 of at least one of the sensor package units 2 is different from the thickness of the sensor chip 21 of another of the sensor package units 2. In this embodiment, the sensor chip 21 of each sensor package unit 2 has a different thickness, but the present invention is not limited thereto.

[0017] In other words, in the integrated sensor package structure 100 of the present invention, the overall structure is simplified by integrating a plurality of different sensor package units 2 onto the substrate 1. Furthermore, by providing a plurality of sensor chips 21 having different thicknesses in the plurality of sensor package units 2, the integrated sensor package structure 100 can be adapted to different focal lengths.

[0018] In the integrated sensor package structure 100 of this embodiment, the thickness of the light-transmitting component 22 of at least one of the sensor package units 2 is different from the thickness of the light-transmitting component 22 of another sensor package unit 2. In this embodiment, the light-transmitting component 22 of each of the sensor package units 2 may have different thicknesses, but the present invention is not limited thereto.

[0019] Furthermore, in each of the sensor package units 2 of the present embodiment, the thickness of the sensor chip 21 and the thickness of the light-transmitting component 22 have a negative correlation, but the present invention is not limited thereto. In other words, in each of the sensor package units 2, the greater the thickness of the sensor chip 21, the smaller the thickness of the light-transmitting component 22. Preferably, in each of the sensor package units 2, the sum of the thickness of the sensor chip 21 and the thickness of the light-transmitting component 22 is less than 2 millimeters, but the present invention is not limited thereto.

[0020] Furthermore, in each of the sensor package units 2, a support adhesive layer 24 may be formed between the sensor chip 21 and the light-transmitting component 22. The support adhesive layer 24 is annular and is disposed between the sensor chip 21 and the light-transmitting component 22. In addition, the support adhesive layer 24, the sensor chip 21, and the light-transmitting component 22 may together form a sealed space SP. Furthermore, one end of each of the wires W is connected to the sensor chip 21 and may be disposed in the support adhesive layer 24, but the present invention is not limited thereto. In other embodiments of the present invention that are not shown, one end of each of the wires W does not need to be disposed in the support adhesive layer 24, but the present invention is not limited thereto.

[0021] The optical module 23 of each of the sensor package units 2 includes a frame 231 disposed on the sensor chip 21, and at least one lens 232 mounted in the frame 231. Notably, the optical module 23 may be directly disposed, via the bottom edge of the frame 231, on a surface of the light-transmitting component 22 on a side away from the sensor chip 21. In other words, other optical modules that are not directly disposed on a sensor chip are not suitable for comparison with the optical module 23 of the present embodiment. In addition, the projection area formed by orthographic projection of the optical module 23 of each of the sensor package units 2 onto the sensor chip 21 may be located only on the surface of the sensor chip 21, but the present invention is not limited thereto.

[0022] Furthermore, in this embodiment, the optical module 23 of each said sensor package unit 2 includes three said lenses 232, but the present invention is not limited thereto. In other embodiments, the number of said lenses 232 provided in said optical module 23 of each said sensor package unit 2 may be one or more.

[0023] In this embodiment, the optical modules 23 included in each said sensor package unit 2 may be arranged at substantially the same height, but the present invention is not limited thereto. In other embodiments, the optical modules 23 included in each said sensor package unit 2 may have different heights, but the present invention is not limited thereto. [Second Embodiment]

[0024] As shown in FIG. 5 and FIG. 6, FIG. 5 is a schematic diagram of an integrated sensor package structure according to a second embodiment of the present invention, and FIG. 6 is an enlarged schematic diagram of region IV in FIG. 5. The second embodiment of the present invention is similar to the first embodiment of the present invention, and common features between the two embodiments will not be repeatedly described, and the differences between the two embodiments will be described below.

[0025] In each said sensor package unit 2 of the present embodiment, the thickness of said sensor chip 21 and the thickness of said light-transmitting component 22 do not necessarily have a negative correlation, and further, said light-transmitting components 22 of each said sensor package unit 2 may have substantially the same thickness.

[0026] Furthermore, in each said sensor package unit 2 of the present embodiment, the thickness of said sensor chip 21 and the distance between said light-transmitting component 22 and said substrate 1 may have a positive correlation, but the present invention is not limited thereto. In other words, in each said sensor package unit 2, the greater the thickness of said sensor chip 21, the greater the distance between said light-transmitting component 22 and said substrate 1.

[0027] In this embodiment, the light-transmitting component 22 of at least one sensor package unit 2 has an annular blocking wall 25 formed on the surface away from the sensor chip 21. Furthermore, the distance between the light-transmitting component 22 of at least one sensor package unit 2 and the substrate 1 is smaller than the distance between the light-transmitting component 22 of another sensor package unit 2 and the substrate 1. The annular blocking wall 25 may be positioned to surround one end of the optical module 23 closest to the sensor chip 21. The annular blocking wall 25 may be formed, for example, by a curing adhesive, but the present invention is not limited thereto. Furthermore, the ratio of the height of the annular blocking wall 25 to the thickness of the light-transmitting component 22 may be in the range of 1 / 2 to 1 / 3, or the height of the annular blocking wall 25 may be in the range of 100 micrometers to 300 micrometers, but the present invention is not limited thereto.

[0028] One point to explain is that since the distance between the sensor chip 21 and the substrate 1 of each sensor package unit 2 may differ, forming the annular blocking wall 25 on the surface of the light-transmitting component 22, which is at a shorter distance from the substrate 1, ensures that the liquid package adhesive does not overflow onto the surface of the light-transmitting component 22.

[0029] Notably, in the first embodiment, the distance between the light-transmitting component 22 of any one of the sensor package units 2 and the substrate 1 may be approximately the same as the distance between the light-transmitting component 22 of another sensor package unit 2 and the substrate 1. In other words, the light-transmitting components 22 of each sensor package unit 2 may be installed at the same horizontal height, and the annular blocking wall 25 may not be formed on the surface of the light-transmitting component 22 of each sensor package unit 2.

[0030] Furthermore, in this embodiment, the height of the optical module 23 (for example, the distance between one end of the optical module 23 away from the sensor chip 21 and the sensor chip 21) can be changed according to the thickness of the sensor chip 21 or actual requirements, but the present invention is not limited thereto.

[0031] In this embodiment, the height of the optical module 23 in one of the sensor package units 2 is different from the height of the optical module 23 in another sensor package unit 2, but the present invention is not limited thereto. In other embodiments, the optical modules 23 in each sensor package unit 2 may have approximately the same height. Furthermore, the horizontal dimensions of the optical module 23 can also be changed as needed, and the optical modules 23 in each sensor package unit 2 may have approximately the same or different horizontal dimensions. [Beneficial effects from the examples]

[0032] The integrated sensor package structure according to the present invention can improve upon the problem that the structure of conventional sensor package structures is not sufficiently simplified by technical means such as "a plurality of the sensor package units are installed on the first surface of the substrate" and "the thickness of the sensor chip of at least one of the sensor package units is different from the thickness of the sensor chip of another sensor package unit."

[0033] The foregoing are merely preferred embodiments of the present invention and do not limit the scope of the claims of the present invention. Accordingly, all equivalent technical modifications made using the specification and drawings of the present invention are all within the scope of protection of the present invention. [Explanation of Symbols]

[0034] 100: Integrated sensor package structure 1: Circuit board 11: 1st page 12:Second side 13: Electrical connector 14: Solder ball 2: Sensor package unit 21: Sensor chip 22: Translucent parts 23: Optical Module 231: Frame 232: Lens 24: Support adhesive layer 25: Annular blocking wall 3: Packaging layer W: Wire SP: Closed space

Claims

1. A substrate having a first surface and a second surface facing each other, Multiple sensor package units installed on the first surface, The package layer, Equipped with, Each of the aforementioned sensor package units is The sensor chip installed on the first surface, A light-transmitting component is installed above the aforementioned sensor chip, An optical module installed on the surface of the light-transmitting component that is away from the sensor chip, Equipped with, The optical module is The frame installed on the aforementioned sensor chip, At least one lens mounted within the frame, Equipped with, The package layer surrounds the sensor chip and the light-transmitting component of each sensor package unit. The thickness of the sensor chip in at least one of the sensor package units is different from the thickness of the sensor chip in another of the sensor package units. The thickness of the light-transmitting component of at least one of the sensor package units is different from the thickness of the light-transmitting component of another of the sensor package units. An integrated sensor package structure characterized by the following features.

2. The aforementioned package layer is formed by a liquid package adhesive. The integrated sensor package structure according to claim 1.

3. In each of the sensor package units, the thickness of the sensor chip and the thickness of the light-transmitting component have a negative correlation. The integrated sensor package structure according to claim 1.

4. In each of the sensor package units, the sum of the thickness of the sensor chip and the thickness of the light-transmitting component is less than 2 millimeters. The integrated sensor package structure according to claim 3.

5. The distance between the light-transmitting component and the substrate of any one of the sensor package units is the same as the distance between the light-transmitting component and the substrate of another of the sensor package units. The integrated sensor package structure according to claim 1.

6. Each sensor package unit comprises a support adhesive layer, the support adhesive layer being annular and positioned between the sensor chip and the light-transmitting component, and the support adhesive layer, the sensor chip, and the light-transmitting component together form a sealed space. The integrated sensor package structure according to claim 1.

7. Each sensor package unit includes a plurality of wires, one end of each wire connected to the first surface, and the other end of each wire connected to the sensor chip and placed in the support adhesive layer. The integrated sensor package structure according to claim 6.

8. A substrate having a first surface and a second surface facing each other, Multiple sensor package units installed on the first surface, The package layer, Equipped with, Each of the aforementioned sensor package units is The sensor chip installed on the first surface, A light-transmitting component is installed above the aforementioned sensor chip, An optical module installed on the surface of the light-transmitting component that is away from the sensor chip, Equipped with, The optical module is The frame installed on the aforementioned sensor chip, At least one lens mounted within the frame, Equipped with, The package layer surrounds the sensor chip and the light-transmitting component of each sensor package unit. The thickness of the sensor chip in at least one of the sensor package units is different from the thickness of the sensor chip in another of the sensor package units. An integrated sensor package structure characterized by the following features.

9. The aforementioned package layer is formed by a liquid package adhesive. The integrated sensor package structure according to claim 8.

10. In each of the sensor package units, the thickness of the sensor chip and the distance between the light-transmitting component and the substrate are positively correlated. The integrated sensor package structure according to claim 8.

11. The light-transmitting component of at least one of the sensor package units has an annular blocking wall formed on the surface away from the sensor chip. The integrated sensor package structure according to claim 8.

12. The distance between the light-transmitting component and the substrate of at least one of the sensor package units is smaller than the distance between the light-transmitting component and the substrate of another of the sensor package units. The integrated sensor package structure according to claim 11.

13. Each sensor package unit comprises a support adhesive layer, the support adhesive layer being annular and positioned between the sensor chip and the light-transmitting component, and the support adhesive layer, the sensor chip, and the light-transmitting component together form a sealed space. The integrated sensor package structure according to claim 8.

14. Each sensor package unit includes a plurality of wires, one end of each wire connected to the first surface, and the other end of each wire connected to the sensor chip and placed in the support adhesive layer. The integrated sensor package structure according to claim 13.

Images