Integrated sensor package structure

Abstract

This invention discloses an integrated sensor package structure. [Solution] The integrated sensor package structure comprises a substrate, a plurality of sensor modules mounted on the substrate, and a plurality of optical modules mounted on the substrate. Each sensor module comprises a sensor chip, a frame surrounding the sensor chip, and a light-transmitting component mounted on the frame. The light-transmitting component, the frame, and the substrate together form a sealed space, in which the sensor chip is installed. Each optical module comprises a frame surrounding any one of the sensor modules and at least one lens attached to the frame. The thickness of the sensor chip in at least one of the sensor modules is different from the thickness of the sensor chip in another sensor module.

Description

[Technical Field]

[0001] The present invention relates to a sensor package structure, and in particular to an integrated sensor package structure. [Background Art]

[0002] Generally, in a conventional sensor package structure, after a plurality of different sensor modules are usually individually packaged, the plurality of packaged different sensor modules are combined. However, this method has a problem that in the conventional sensor package structure, the structure is not sufficiently simplified. [Summary of the Invention] [Problem to be Solved by the Invention]

[0003] The present invention discloses an integrated sensor package structure, and mainly aims to improve the problem that the structure in the conventional sensor package structure is not sufficiently simplified. [Means for Solving the Problem]

[0004] One embodiment of the present invention discloses an integrated sensor package structure. The integrated sensor package structure comprises a substrate, a plurality of sensor modules and a plurality of optical modules; each of the sensor modules comprises a sensor chip disposed on the substrate, a frame body disposed on the substrate and surrounding the sensor chip, and a light-transmissive component disposed on the frame body, the light-transmissive component, the frame body and the substrate collectively enclose and form a closed space, and the sensor chip is disposed in the closed space; each of the optical modules comprises a frame surrounding a corresponding one of the sensor modules, and at least one lens mounted on the frame; the thickness of the sensor chip of at least one of the sensor modules is different from the thickness of the sensor chip of another one of the sensor modules.

[0005] The integrated sensor package structure comprises a substrate, a plurality of sensor modules, and an optical module, each of which comprises a sensor chip mounted on the substrate, a frame mounted on the substrate and surrounding the sensor chip, and a light-transmitting component mounted on the frame, the light-transmitting component, the frame, and the substrate together form a sealed space, the sensor chip being mounted in the sealed space, the optical module comprises a frame mounted on the substrate and surrounding the outer periphery of each of the sensor modules, integrally molded, and at least one lens attached to the frame, the thickness of the sensor chip of at least one of the sensor modules being different from the thickness of the sensor chip of another of the sensor modules.

[0006] The integrated sensor package structure comprises a substrate, a plurality of sensor chips mounted on the substrate, a light-transmitting component mounted above the plurality of sensor chips, and an optical module, wherein the optical module comprises a frame and a plurality of lenses, the frame comprises a support portion mounted on the substrate and surrounding the plurality of sensor chips and the light-transmitting component, and a plurality of retaining portions, each mounted on the side of the support portion away from the substrate, the plurality of lenses are attached to the plurality of retaining portions on the frame, and the thickness of at least one of the sensor chips is different from the thickness of another sensor chip. [Effects of the Invention]

[0007] Based on the above, the integrated sensor package structure according to the present invention can improve upon the problem in conventional sensor package structures, which is that the structure is not sufficiently simplified, by technical means such as "a plurality of sensor chips are installed on the substrate" and "the thickness of at least one of the sensor chips is different from the thickness of another sensor chip."

[0008] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention, however, these descriptions and drawings are intended solely to illustrate the present invention and do not limit the scope of protection of the present invention in any way. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic three-dimensional diagram of an integrated sensor package structure according to the first embodiment of the present invention. [Figure 2] This is an exploded schematic diagram of an integrated sensor package structure according to the first embodiment of the present invention. [Figure 3] This is a schematic cross-sectional view along line III-III in Figure 1. [Figure 4] Figure 3 is an enlarged schematic diagram of region IV. [Figure 5] This is a schematic three-dimensional diagram of an integrated sensor package structure according to a second embodiment of the present invention. [Figure 6] This is an exploded schematic diagram of an integrated sensor package structure according to a second embodiment of the present invention. [Figure 7] Figure 5 is a schematic cross-sectional view along the line VII-VII. [Figure 8] This is a schematic diagram of an integrated sensor package structure according to a third embodiment of the present invention. [Modes for carrying out the invention]

[0010] The following describes embodiments of the "integrated sensor package structure" disclosed herein by specific examples. Those skilled in the art will be able to understand the advantages and effects of the present invention from the disclosed content. The present invention can be implemented or applied through other different specific embodiments, and the various detailed descriptions herein can be modified and changed in various ways based on different perspectives and applications without departing from the spirit of the invention. It should also be noted that the drawings of the present invention are for illustrative purposes only and are not based on actual dimensions. The following embodiments will describe the technical content of the present invention in more detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

[0011] In this specification, terms such as “first,” “second,” etc., may be used to describe various elements or signals, but it should be understood that these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another, or one signal from another. Furthermore, the term “or” in this specification should be understood to include any one or more of the items listed in relation to it, depending on the actual situation. [First Embodiment]

[0012] As shown in Figures 1 to 3, Figure 1 is a three-dimensional schematic diagram of an integrated sensor package structure according to the first embodiment of the present invention, Figure 2 is an exploded schematic diagram of an integrated sensor package structure according to the first embodiment of the present invention, and Figure 3 is a schematic cross-sectional diagram along line III-III in Figure 1. The first embodiment of the present invention provides an integrated sensor package structure 100. The integrated sensor package structure 100 comprises a substrate 1, a plurality of sensor modules 2 installed on the substrate 1, and a plurality of optical modules 3 installed on the substrate 1. Each of the sensor modules 2 may correspond in position to any one of the optical modules 3.

[0013] In this embodiment, the substrate 1 may be a ceramic substrate or a printed circuit board, but the present invention does not limit the material of the substrate 1. An electrical connector 11 may be further installed on the substrate 1 for electrically connecting the sensor module 2 to an electronic component (not shown).

[0014] In this embodiment, the number of sensor modules 2 is, for example, three, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the number of sensor modules 2 may be two or three or more. Furthermore, the sensor modules 2 may be in a multi-package BGA (Multi-Package Ball Grid Array, mPBGA) or a plastic leaded chip carrier (PLCC), but the present invention is not limited thereto.

[0015] Each sensor module 2 comprises a sensor chip 21, a frame 22, and a light-transmitting component 23. The sensor chip 21 is installed on the substrate 1, the frame 22 is installed on the substrate 1 and surrounds the sensor chip 21, and the light-transmitting component 23 is installed on the frame 22. Specifically, the light-transmitting component 23, the frame 22, and the substrate 1 together form a sealed space SP, and the sensor chip 21 is installed in the sealed space SP.

[0016] The sensor chip 21 may be an image sensor chip, but the present invention is not limited thereto. Furthermore, each sensor module 2 may further comprise a plurality of wires W. One end of each wire W is connected to the substrate 1, and the other end of each wire W is connected to the sensor chip 21.

[0017] Notably, the thickness of the sensor chip (21) of at least one of the sensor modules (2) is different from the thickness of the sensor chip (21) of another one of the sensor modules (2). In this embodiment, the sensor chip (21) of each of the sensor modules (2) has different thicknesses, but the present invention is not limited thereto.

[0018] In other words, in the integrated sensor package structure (100) of the present invention, the overall structure is simplified by integrating a plurality of different sensor modules (2) onto the substrate (1). Furthermore, since the plurality of sensor modules (2) include the plurality of sensor chips (21) having different thicknesses, the integrated sensor package structure (100) can adapt to different focal lengths.

[0019] As shown in FIGS. 1 to 3 and FIG. 4, FIG. 4 is an enlarged schematic view of region IV in FIG. 3. In each of the sensor modules (2), the frame body (22) has an annular shape. A notch (222) is formed on the upper surface (221) of the frame body (22) such that the upper surface (221) of the frame body (22) has a step structure S. Specifically, the notch (222) may have an annular shape, and the notch (222) may be formed on a side of the upper surface (221) of the frame body (22) close to the sensor chip (21) (for example, an inner edge side of the upper surface (221)). Furthermore, in each of the sensor modules (2), the frame body (22) may be a molding compound, but the present invention is not limited thereto.

[0020] The light-transmissive component (23) may be, for example, transparent glass, but the present invention is not limited thereto. The light-transmissive component (23) may be disposed on the upper surface (221) of the frame body (22), and a gap (not shown) may be formed between the light-transmissive component (23) and the notch (222) of the frame body (22).

[0021] Furthermore, each of the sensor modules 2 may further include an adhesive layer 24, and the adhesive layer 24 may be bonded without a gap between the notch 222 of the frame body 22 and the light-transmitting component 23. The adhesive layer 24 may be provided in the gap between the light-transmitting component 23 and the notch 222 of the frame body 22. Accordingly, the light-transmitting component 23 is bonded to the frame body 22 via the adhesive layer 24. Furthermore, the frame body 22 of each of the sensor modules 2 may have a flange portion 223. The flange portion 223 has an annular shape, protrudes from the upper surface 221 of the frame body 22, and surrounds the annular side surface 231 of the light-transmitting component 23, but the present invention is not limited thereto.

[0022] Each of the optical modules 3 includes a frame 31 surrounding one corresponding sensor module 2, and at least one lens 32 attached to the frame 31. Furthermore, in the present embodiment, each optical module 3 is exemplified as including three of the lenses 32, but the present invention is not limited thereto. In other non-illustrated embodiments of the present invention, the number of the lenses 32 provided in each optical module 3 may be one, two, or three or more. Further, the frame 31 may be made of, for example, a solder resist material, a ceramic material, or a molding resin, but the present invention is not limited thereto.

[0023] In each of the optical modules 3, the frame 31 includes a support portion 311 and a holding portion 312. The support portion 311 is disposed on the substrate 1 and surrounds one corresponding sensor module 2. The holding portion 312 is located at an end of the support portion 311 away from the substrate 1, and can hold at least one of the lenses 32. Furthermore, each of the optical modules 3 may further include a lens barrel 33. The lens barrel 33 is disposed on the holding portion 312. Accordingly, the holding portion 312 can hold the lens 32 via the lens barrel 33.

[0024] Notably, in each of the sensor modules 2, the thickness of the sensor chip 21 has a positive correlation with the height of the frame 31 of the corresponding optical module 3 (for example, the distance between one end of the frame 31 away from the substrate 1 and the substrate 1), but the present invention is not limited thereto. In other words, in each of the sensor modules 2, the greater the thickness of the sensor chip 21, the greater the height of the frame 31 of the corresponding optical module 3. As a result, the greater the thickness of the sensor chip 21, the greater the distance between the lens 32 mounted on the corresponding frame 31 and the sensor chip 21. In other embodiments, the height of the frame 31 can be changed according to actual requirements, and the present invention is not limited thereto. [Second Example]

[0025] As shown in Figures 5 to 7, Figure 5 is a schematic three-dimensional view of an integrated sensor package structure according to the second embodiment of the present invention, Figure 6 is an exploded schematic view of the integrated sensor package structure according to the second embodiment of the present invention, and Figure 7 is a schematic cross-sectional view along line VII-VII in Figure 5. The second embodiment of the present invention is similar to the first embodiment of the present invention, and the common points between the two embodiments will not be explained repeatedly. The differences between the two embodiments will be explained below.

[0026] In this embodiment, the integrated sensor package structure 100 may comprise only one optical module 3. The frame 31 is mounted on the substrate 1 and surrounds the outer periphery of each sensor module 2. Furthermore, the frame 31 may be integrally molded.

[0027] Specifically, in the optical module 3, the frame 31 comprises a plurality of support portions 311 and a plurality of holding portions 312. Each support portion 311 is installed on the substrate 1 and surrounds a corresponding sensor module 2. Each holding portion 312 is capable of holding the lens 32. Furthermore, the plurality of support portions 311 and the plurality of holding portions 312 are integrally molded.

[0028] In each sensor module 2, the thickness of the sensor chip 21 has a positive correlation with the height of a corresponding retaining portion 312 in the frame 31 (for example, the distance between one end of the retaining portion 312 away from the substrate 1 and the substrate 1). Therefore, the greater the thickness of the sensor chip 21, the greater the distance between the lens 32 attached to the corresponding retaining portion 312 and the sensor chip 21. [Third Embodiment]

[0029] As shown in Figure 8, Figure 8 is a schematic diagram of an integrated sensor package structure according to the third embodiment of the present invention. The third embodiment of the present invention is similar to the second embodiment of the present invention, and the common points between the two embodiments will not be explained repeatedly. The differences between the two embodiments will be explained below.

[0030] In this embodiment, the number of support portions 311 provided on the frame 31 is one, and the number of frame bodies 22 is one, with the support portion 311 surrounding the plurality of sensor chips 21, the light-transmitting component 23 and the frame body 22, and the frame body 22 surrounding the plurality of sensor chips 21.

[0031] Furthermore, in this embodiment, there is one light-transmitting component 23, and the light-transmitting component 23 is installed above the plurality of sensor chips 21. In other words, the projection area formed by the orthographic projection of each sensor chip 21 onto the light-transmitting component 23 may be located on the bottom surface of the light-transmitting component 23. Furthermore, the plurality of sensor chips 21 are installed in the sealed space SP. In addition, each of the holding parts 312 is installed on the side of the support part 311 away from the substrate 1, and the bottom surface of each of the holding parts 312 of the frame 31 may be directly installed on the light-transmitting component 23, but the present invention is not limited thereto. [Beneficial effects from the examples]

[0032] The integrated sensor package structure according to the present invention can improve upon the problem that the structure of conventional sensor package structures is not sufficiently simplified by technical means such as "a plurality of sensor chips are installed on the substrate" and "the thickness of at least one of the sensor chips is different from the thickness of another sensor chip."

[0033] The foregoing describes only preferred embodiments of the present invention and does not limit the scope of the claims of the present invention. Accordingly, all equivalent technical modifications made using the specification and drawings of the present invention are all within the scope of protection of the present invention. [Explanation of Symbols]

[0034] 100: Integrated sensor package structure 1: Circuit board 11: Electrical connector 2: Sensor module 21: Sensor chip 22: Frame 221:Top surface 222: Notch 223: Flange section 23: Translucent parts 231: Annular side view 24: Adhesive layer 3: Optical module 31: Frame 311: Support part 312: Holding part 32: Lens 33: Telescope tube S: Stepped structure SP: Closed space W: Wire

Claims

1. circuit board and Multiple sensor modules, Multiple optical modules, Equipped with, Each of the aforementioned sensor modules is A sensor chip installed on the aforementioned substrate, A frame body installed on the substrate and surrounding the sensor chip, A light-transmitting component installed in the frame, Equipped with, The light-transmitting component, the frame, and the substrate together form a sealed space, and the sensor chip is installed in the sealed space. Each of the optical modules is A frame surrounding one of the corresponding sensor modules, At least one lens attached to the frame, Equipped with, The thickness of the sensor chip of at least one of the sensor modules is different from the thickness of the sensor chip of another of the sensor modules. An integrated sensor package structure characterized by the following features.

2. In each of the sensor modules, a notch is formed on the upper surface of the frame such that the upper surface of the frame has a stepped structure. The integrated sensor package structure according to claim 1.

3. Each of the sensor modules further comprises an adhesive layer, which is bonded without gap between the notch of the frame and the light-transmitting component. The integrated sensor package structure according to claim 2.

4. The frame of each sensor module has a flange portion, the flange portion has an annular shape, protrudes from the upper surface of the frame, and surrounds the annular side surface of the light-transmitting component. The integrated sensor package structure according to claim 2.

5. In each optical module, the frame comprises a support portion and a holding portion, the support portion is mounted on the substrate and surrounds one corresponding sensor module, and the holding portion is capable of holding at least one lens. The integrated sensor package structure according to claim 1.

6. In each of the sensor modules, the thickness of the sensor chip has a positive correlation with the height of the frame of the corresponding optical module. The integrated sensor package structure according to claim 1.

7. circuit board and Multiple sensor modules, Optical module and Equipped with, Each of the aforementioned sensor modules is A sensor chip installed on the aforementioned substrate, A frame body installed on the substrate and surrounding the sensor chip, A light-transmitting component installed in the frame, Equipped with, The light-transmitting component, the frame, and the substrate together form a sealed space, and the sensor chip is installed in the sealed space. The optical module is A frame, which is mounted on the substrate and surrounds the outer periphery of each sensor module, and is integrally molded, At least one lens attached to the frame, Equipped with, The thickness of the sensor chip of at least one of the sensor modules is different from the thickness of the sensor chip of another of the sensor modules. An integrated sensor package structure characterized by the following features.

8. In each of the sensor modules, a notch is formed on the upper surface of the frame such that the upper surface of the frame has a stepped structure. The integrated sensor package structure according to claim 7.

9. Each of the sensor modules further comprises an adhesive layer, which is bonded without gap between the notch of the frame and the light-transmitting component. The integrated sensor package structure according to claim 8.

10. The frame of each sensor module has a flange portion, the flange portion has an annular shape, protrudes from the upper surface of the frame, and surrounds the annular side surface of the light-transmitting component. The integrated sensor package structure according to claim 8.

11. In the optical module, the frame comprises a plurality of support portions and a plurality of holding portions, each of the support portions being mounted on the substrate and surrounding a corresponding sensor module, each of the holding portions being capable of holding at least one lens, and the plurality of support portions and the plurality of holding portions being integrally molded. The integrated sensor package structure according to claim 7.

12. In each of the sensor modules, the thickness of the sensor chip has a positive correlation with the height of one of the corresponding retaining portions in the frame. The integrated sensor package structure according to claim 11.

13. circuit board and Multiple sensor chips installed on the aforementioned substrate, A light-transmitting component is installed above the multiple sensor chips, Optical module and Equipped with, The optical module is Frame and, Multiple lenses, Equipped with, The aforementioned frame is A support portion is installed on the substrate and surrounds a plurality of the sensor chips and the light-transmitting component, Each of the following is a plurality of holding parts, which are installed on the side of the support part away from the substrate, Equipped with, Multiple lenses are attached to multiple retaining parts in the frame. The thickness of at least one of the sensor chips is different from the thickness of another of the sensor chips. An integrated sensor package structure characterized by the following features.

14. The substrate is further provided with a frame that surrounds a plurality of the sensor chips, and the light-transmitting component is installed in the frame. The integrated sensor package structure according to claim 13.

15. A notch is formed on the upper surface of the frame so that it has a stepped structure. The integrated sensor package structure according to claim 14.

16. The adhesive layer is further provided, and the adhesive layer is joined without any gaps between the notch of the frame and the light-transmitting component. The integrated sensor package structure according to claim 15.

17. The frame has a flange portion, the flange portion has an annular shape, protrudes from the upper surface of the frame, and surrounds the annular side surface of the light-transmitting component. The integrated sensor package structure according to claim 15.

18. The thickness of each sensor chip has a positive correlation with the height of a corresponding holding portion in the frame. The integrated sensor package structure according to claim 13.

19. In the optical module, the bottom surface of each of the holding parts of the frame is directly attached to the light-transmitting component. The integrated sensor package structure according to claim 13.

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