Implementation tools and implementation devices

Abstract

To provide mounting tools and mounting equipment that can suppress the occurrence of bump deformation. [Solution] The mounting tool 200 of the embodiment includes a holder 210 for holding an electronic component 1 to be heated, and a support 220 for supporting the holder 210. The holder 210 has a holding portion 211 for holding the electronic component 1 on its lower surface, a holding surface 211a, and a mounting portion 212 provided above the holding surface 211a and having a mounting surface 212a that faces downward. The support 220 has a housing portion 221 for housing the mounting portion 212 so that the holding surface 211a is exposed downward and the holder 211 can move up and down, and a support portion 222 that supports the holder 211 by contacting the mounting surface 212a.

Description

[Technical Field]

[0001] The present invention relates to a mounting tool and a mounting apparatus. [Background Art]

[0002] For mounting electronic components on a substrate, for example, flip-chip mounting is performed. Flip-chip mounting is a method in which a substrate having a conductive pattern formed thereon is mounted with the surface of an electronic component such as a semiconductor chip on which electrodes are formed facing the substrate.

[0003] In flip-chip mounting, for example, a mounting tool at the lower end of a mounting head holds an electronic component such that the surface provided with bumps, which are electrodes formed using solder, faces the substrate. For example, when the mounting head is arranged above the substrate, the substrate is arranged with the surface on which the conductive pattern is formed facing upward, and the electronic component is held by the mounting tool such that the surface of the electronic component provided with bumps faces downward. Then, the mounting head is lowered to bring the bumps of the electronic component held by the mounting tool into contact with protruding electrodes (bumps) formed of a solder material on the conductive pattern of the substrate, and heating is performed while applying a load, so that both bumps are melted and then cured to establish electrical connection. [Prior Art Documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 11-145197 [Brief Summary of the Invention] [Problem to be Solved by the Invention]

[0005] When a bump melts, if the load applied by the mounting head causes the bump to shift or collapse, a short circuit can occur in the electrodes or conductive patterns. To prevent this, it is preferable that the mounting head applies a low load during bump melting, such that the molten bump is not crushed. However, the mounting head needs to be equipped with piping for vacuum suction of electronic components by the mounting tool, heaters and wiring for heating the bump, etc. Therefore, the load applied from the mounting head to the electronic component via the mounting tool can become very large compared to a load that does not crush the bump, and moreover, it cannot be controlled. Furthermore, if the mounting tool expands due to heating and pushes the electronic component downward, it becomes even more difficult to control the load applied to the bump, and a short circuit due to bump collapse is more likely to occur.

[0006] To address this, conventional methods involved raising the mounting tool at the moment of bump melting to prevent the bumps from collapsing. However, this type of mounting tool operation complicated the process, requiring the detection of the moment of melting. Furthermore, even when attempting to raise the mounting head at the moment of bump melting, there is a time lag between melting detection and the movement of the mounting head. As a result, the load applied to the electronic component and the thermal expansion of the mounting tool are applied to the bump in the instant immediately after melting. Bump sizes on electronic components and substrates have been miniaturized in recent years. Therefore, even a small load can cause bump collapse. In other words, the method of raising the mounting tool at the moment of bump melting has limitations in suppressing bump collapse. Therefore, it is desirable to reduce the load on the bumps before they melt. Controlling the stopping position of the mounting tool so that it does not crush the molten bumps in order to reduce the load on the mounting head before the bumps melt becomes extremely complex and difficult, considering the thermal expansion of the mounting tool.

[0007] The present invention was made to solve the above-mentioned problems, and its objective is to provide a mounting tool and mounting apparatus that can suppress the occurrence of bump crushing. [Means for solving the problem]

[0008] An embodiment of the present invention provides a mounting tool comprising a holder for holding an electronic component to be heated, and a support for supporting the holder, wherein the holder has a holding portion for holding an electronic component on its lower surface, and a mounting portion provided above the holding surface and having a mounting surface that faces downward, and the support comprises a housing portion for housing the mounting portion such that the holding surface is exposed downward and the holder is movable up and down, and a support portion that supports the holder by contacting the mounting surface.

[0009] The mounting apparatus according to an embodiment of the present invention comprises a mounting tool and a mounting head that is movable toward and toward a substrate on which electronic components are mounted, and to which the mounting tool is attached at its lower end. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide a mounting tool and mounting apparatus that can suppress the occurrence of bump deformation. [Brief explanation of the drawing]

[0011] [Figure 1] This is a partial cross-sectional view showing the mounting tool for the electronic components of the embodiment before mounting. [Figure 2] This is a mounting apparatus of an embodiment, with side view (A) showing imaging by the imaging unit and side view (B) showing electronic component mounting. [Figure 3] This is a partial cross-sectional view of a mounting tool showing the contact between the bumps of an electronic component and the bumps on the circuit board. [Figure 4] This is a partial cross-sectional view of the implementation tool showing the release of negative pressure at the suction port. [Figure 5] This is a partial cross-sectional view of the mounting tool showing the melting of the bump due to heating. [Figure 6] This is a partial cross-sectional view of a mounting tool showing the detachment of the holding part from the electronic component. [Figure 7] This is a timing chart showing the operation of the implementation tool. [Figure 8] It is a partial cross-sectional view showing a modified example in which the suction port is provided above. [Figure 9] It is a partial cross-sectional view showing the modified example of FIG. 8 during suction. [Figure 10] It is a partial cross-sectional view showing a mounting tool having a suction port provided laterally. [Figure 11] It is a partial cross-sectional view showing a modified example having inclined portions in part of the support portion and the mounting surface. [Figure 12] It is a partial cross-sectional view showing a modified example having inclined portions in part of the support portion and the mounting surface. [Figure 13] It is a partial cross-sectional view showing a modified example having vertical portions in part of the support portion and the mounting surface. [Figure 14] It is a partial cross-sectional view showing a modified example of the mounting portion. [Figure 15] It is a partial cross-sectional view showing a modified example in which a heating unit is provided on a mounting head. [Figure 16] It is a partial cross-sectional view showing an example of a method for manufacturing a mounting tool. MODE FOR CARRYING OUT THE INVENTION

[0012] Embodiments of the mounting tool and the mounting apparatus according to the present invention will be described in detail with reference to the accompanying drawings. Note that the drawings are schematic diagrams, and the sizes and ratios of respective parts include portions exaggerated to facilitate understanding.

[0013] As shown in FIG. 1, the electronic component 1 mounted according to the present embodiment is, for example, a semiconductor chip made of silicon. Bumps 11, which are protruding electrodes made of solder material, are formed on the electronic component 1. The object on which the electronic component 1 is mounted is a plate-shaped substrate 2. Bumps 21, which are protruding electrodes made of solder material, are formed on the conductive pattern of the substrate 2. The bumps 11 and 21 have, for example, a structure in which a solder material is provided in a dome shape on the top of a copper (Cu) column (pillar) erected on an aluminum electrode pad.

[0014] [Mounting Apparatus] The mounting apparatus 100 is a device for mounting electronic components 1 onto a substrate 2. As shown in Figure 2, the mounting apparatus 100 includes a mounting head 110, a head movement mechanism 120, a substrate stage 130, a stage movement mechanism 140, an imaging unit 300, and a control device 400. In this mounting apparatus 100, the electronic components 1 picked up from the electronic component supply device by a pickup device are transferred to the mounting tool 200 of the mounting head 110. The mounting tool 200 is then lowered by the head movement mechanism 120, and the transferred electronic components 1 are mounted onto the substrate 2, which is placed on the substrate stage 130 and positioned at the mounting position by the stage movement mechanism 140. At this time, the electronic components 1 and the substrate 2 are imaged by the imaging unit 300 to position them. Each of these parts is controlled by the control device 400.

[0015] The mounting head 110 is provided so as to be movable in a direction toward and away from the substrate 2 on which the electronic component 1 is mounted, and a mounting tool 200 for holding the electronic component 1 is attached to its lower end. Specifically, the mounting head 110 receives the electronic component 1 from a pickup device (not shown) at a transfer position, and mounts the electronic component 1 to the substrate 2 by descending toward the substrate 2 at the mounting position (see Figure 2(B)).

[0016] The head movement mechanism 120 moves the mounting head 110 between the transfer position and the mounting position. Furthermore, at the mounting position, the head movement mechanism 120 raises and lowers the mounting head 110 to mount the electronic component 1 onto the substrate 2.

[0017] The substrate stage 130 is a platform on which the substrate 2 is placed. The substrate stage 130 slides along a horizontal XY plane. The stage moving mechanism 140 slides the substrate stage 130 along the XY plane.

[0018] The imaging unit 300 is a camera that captures the alignment marks of the electronic component 1 and the alignment marks of the substrate 2 at the mounting position. The imaging unit 300 is, for example, a dual-field camera positioned vertically and horizontally, which can enter between the mounting head 110 and the substrate stage 130 (see Figure 2(A)).

[0019] [Implementation Tools] As shown in Figure 1, the mounting tool 200 is a tool used when heat-melt bonding or heat-press bonding the electronic component 1 and the substrate 2. The mounting tool 200 has a holder 210 for holding the electronic component 1 and a support 220 for supporting the holder 210.

[0020] (holding body) The holder 210 has a holding portion 211 and a mounting portion 212. The holding portion 211 is a rectangular block. The lower surface of the holding portion 211 is a holding surface 211a for holding the electronic component 1. The holding surface 211a is a rectangle larger than the size of the top surface of the electronic component 1. The holding surface 211a has suction holes (not shown), and the electronic component 1 is attracted and held by applying negative pressure through a ventilation passage (not shown) provided inside the holding portion 211. The configuration for applying negative pressure involves a support 220 and will be described later.

[0021] The mounting portion 212 is provided above the holding surface 211a of the holding portion 211 and has a mounting surface 212a that extends downward. In this embodiment, the mounting portion 212 is a rectangular plate that extends horizontally outward from the holding surface 211a. The mounting portion 212 is integrally formed with the holding portion 211, and the holding body 210 has an inverted convex shape in the cross-section in the Z direction (vertical direction) perpendicular to the XY plane.

[0022] In order to achieve the low load described later, when the holder 210 is separated from the support of the support body 220, the ratio of the weight of the holder 210 to the horizontal area of ​​the electronic component 1 is 0.1 g / mm². 2 The following is preferable. For example, the weight of the holder 210 is 10g to 20g. However, the weight of the holder 210 is not limited to these values.

[0023] (Support) The support body 220 has a housing section 221 and a support section 222. The housing section 221 houses the mounting section 212 such that the holding surface 211a is exposed downwards and the holder 210 can move up and down.

[0024] In this embodiment, the support 220 is rectangular in shape, and a accommodating section 221, which is a rectangular prism-shaped cavity capable of accommodating the mounting section 212, is formed inside it. An opening 221a is provided at the bottom of the accommodating section 221. The opening 221a is smaller than the bottom surface of the support 220 and is a through-hole large enough for the holding section 211 to pass through. When the mounting section 212 is housed in the accommodating section 221, the holding surface 211a of the holder 210 protrudes downward from the opening 221a.

[0025] The support portion 222 supports the holder 210 by contacting the mounting surface 212a. The support portion 222 is the outer peripheral portion of the opening 221a on the bottom surface of the support body 220, and its upper surface contacts the mounting surface 212a housed in the housing portion 221 from below.

[0026] The holding surface 211a holds the electronic component 1 to be mounted, and releases the electronic component 1 after mounting. Specifically, the holding surface 211a has a plurality of suction holes (not shown). These suction holes communicate with a negative pressure generating device, including a vacuum pump and valves, via flow channels provided inside the holder 210 and the support 220. By generating negative pressure inside the suction holes with the negative pressure generating device, the electronic component 1 is attracted to the suction holes. By attracting the electronic component 1 to the suction holes, the electronic component 1 is held on the holding surface 211a. Furthermore, by releasing the negative pressure, the electronic component 1 is released from the holding surface 211a. As will be described later, when the bump 11 of the electronic component 1 comes into contact with the bump 21 of the substrate 2, the electronic component 1 is supported by the substrate 2, and at this moment the negative pressure is released and the electronic component 1 is released from the support 220.

[0027] Furthermore, as described above, the support 220 allows the mounting portion 212 to move up and down within the housing portion 221, but a suction port 222a is provided to suck the holder 210 with negative pressure. In this embodiment, the suction port 222a is an opening provided at a position that sucks the mounting surface 212a with negative pressure. In other words, the suction port 222a is provided at a position facing the mounting surface 212a from below. The suction port 222a is in communication with a negative pressure generating device including a vacuum pump, valve, etc. (not shown) via a flow path provided inside the support 220. The suction port 222a can be switched on or off by a valve.

[0028] Furthermore, the support 220 incorporates a heating unit 240. The heating unit 240 uses, for example, a pulse heater that generates heat instantaneously when a voltage is applied. The support 220 is attached to the lower end of the mounting head 110 via an insulating material 111. The heating unit 240 heats the electronic component 1 and the bumps 11 and 21 from the support 220 via the holder 210.

[0029] As will be described later, even if the mounting surface 212a separates from the support portion 222, the holder 210 is heated by contact between the inner surface of the support body 220 and the outer surface of the holder 210, or by radiant heat through a very narrow gap, thus enabling the bumps 11 and 21 to be heated.

[0030] [Control device] The control device 400 controls the startup, shutdown, speed, and operating timing of the mounting device 100. The control device 400 can be implemented, for example, by a dedicated electronic circuit or a computer operating with a predetermined program. The control device 400 is connected to an input device for workers to input instructions and information necessary for control, and an output device for checking the status of the device.

[0031] In this embodiment, when the holding surface 211a holds the electronic component 1 by suction using negative pressure, the control device 400 fixes the holder 210 to the support 220 by sucking the mounting section 212 with the negative pressure acting on the suction port 222a. Furthermore, when the control device 400 detects, using a detection unit such as a laser sensor (not shown), that the mounting tool 200 has descended to a height position where the bump 11 of the electronic component 1 is in contact with the bump 21 of the substrate 2, it initiates heating by the heating section 240 and releases the negative pressure acting on the suction port 222a.

[0032] [Operation] The operation of this embodiment described above will be explained with reference to Figures 3 to 7, in addition to Figures 1 and 2. Figure 7 is a timing chart showing the changes in the height of the mounting tool 200, the temperature of the heating section 240, and the presence or absence of negative pressure suction by the suction port 222a.

[0033] First, the heating unit 240 preheats the holder 210 to approximately 180°C. Then, as shown in Figure 1, the negative pressure acting on the suction port 222a attracts the mounting unit 212, thereby fixing the holder 210 to the support 220. In this state, as shown in Figure 1, the electronic component 1 transported by the pickup device is received by the holding surface 211a, which attracts and holds it due to the negative pressure. As a result, the electronic component 1 is held on the mounting head 110 with the bump 11 facing downwards.

[0034] The head movement mechanism 120 moves the mounting head 110 to the mounting position, and the stage movement mechanism 140 moves the substrate stage 130 to the mounting position. At this time, the stage movement mechanism 140 moves the substrate stage 130 so that the area on the substrate 2 where the electronic component 1 will be mounted (hereinafter referred to as the mounting area) is at the mounting position. After this, as shown in Figure 2(A), a dual-view camera (imaging unit 300) is brought between the mounting head 110 and the substrate 2 to capture the alignment mark of the electronic component 1 located above and the alignment mark of the mounting area on the substrate 2 located below, thereby aligning the electronic component 1 with the mounting area on the substrate 2.

[0035] After alignment, as shown in Figure 3, the head movement mechanism 120 lowers the mounting head 110 to a position where the bump 11 of the electronic component 1 and the bump 21 of the substrate 2 come into contact (see mounting tool height in Figure 7). Along with this contact, the negative pressure acting on the suction port 222a is released (see negative pressure suction OFF in Figure 7). As a result, as shown in Figure 4, the mounting section 212 is slightly separated from the support section 222 of the support body 220, resulting in a low load state where only the weight of the holder 210 is applied to the bumps 11 and 21.

[0036] Next, the heating section 240 is heated to approximately 250°C (see heating section temperature in Figure 7). As the heating section 240 heats up to approximately 250°C, the bumps 11 and 21 melt, as shown in Figure 5. Subsequently, by lowering the temperature of the heating section 240 to the preheating temperature of 180°C (see heating section temperature in Figure 7), the bumps 11 and 21 are cooled and solidified. At this time, the electronic component 1 and the bumps 11 and 21 are under low load, with only the weight of the holder 210 acting on them, so crushing of the bumps 11 and 21 is unlikely.

[0037] Subsequently, as shown in Figure 6, the negative pressure on the holding surface 211a is released, and after the bumps 11 and 21 have cooled and solidified, the mounting tool 200 rises (see mounting tool height in Figure 7), thereby mounting the electronic component 1 onto the substrate 2.

[0038] [effect] (1) The mounting tool 200 of this embodiment includes a holder 210 for holding an electronic component 1 to be heated, and a support 220 for supporting the holder 210. The holder 210 has a holding portion 211 for holding the electronic component 1 on its lower surface, a holding surface 211a, and a mounting portion 212 provided above the holding surface 211a and having a mounting surface 212a that faces downward. The support 220 has a housing portion 221 for housing the mounting portion 212 so that the holding surface 211a is exposed downward and the holder 210 can move up and down, and a support portion 222 that supports the holder 210 by contacting the mounting surface 212a.

[0039] As a result, when the bumps 11 and 21 melt due to heating, the holder 210 becomes movable relative to the support 220. Therefore, even if the bumps 11 and 21 come into contact, the holder 210 is separated from the mounting head 110, and the load on the electronic component 1 becomes extremely light, consisting only of the weight of the holder 210, thereby suppressing the crushing of the bumps 11 and 21. In this way, the load on the single holder 210 holding the electronic component 1 is far smaller than the load on the mounting head 110, resulting in a low load that cannot be achieved even with a cylinder or voice coil motor.

[0040] Since the holder 210 separates from the support 220, it is isolated from the effects of thermal expansion of the support 220. Furthermore, the holder 210 is allowed to move upward. As a result, the displacement of the holder 210 itself due to thermal expansion is directed upward rather than downward, where the bumps 11 and 21 are in contact. Therefore, the downward displacement of the electronic component 1 due to thermal expansion is minimized, and the crushing of the bumps 11 and 21 due to indentation caused by thermal expansion can be suppressed. Moreover, complex control such as detecting the moment of melting of the bumps 11 and 21 and raising the mounting tool 200 is not required.

[0041] (2) The mounting section 212 extends outward beyond the holding surface 211a. Therefore, the support section 222 supports the mounting section 212 at a position outside the holding surface 211a, thus stabilizing the support of the holder 210. Furthermore, even if the holder 210 moves downward due to its own weight when the bumps 11 and 21 melt, the support section 222 supports the mounting section 212. Therefore, the holder 210 does not move downward beyond the position where the support section 222 supports the mounting section 212. In other words, the support section 222 acts as a stopper for the holder 210. This prevents the molten bumps from being crushed without complex control of the mounting head's movement.

[0042] (3) The support body 220 allows the mounting section 212 to move up and down within the housing section 221 and has a suction port 222a that sucks the holder 210 with negative pressure. In this embodiment, the suction port 222a is positioned to suck the mounting surface 212a with negative pressure. Therefore, from the time the position of the electronic component 1 is recognized and positioned relative to the substrate 2 until the bumps 11 and 21 make contact, the holder 210 can be fixed by applying negative pressure to the suction port 222a. By fixing the holder 210 with negative pressure from the suction port 222a, the position of the electronic component 1 can be stabilized and the positions of the opposing bumps 11 and 21 can be accurately aligned. Furthermore, the release of the holder 210 from the support body 220 can be easily controlled by releasing the negative pressure. In addition, by fixing the holder 210 with negative pressure from the suction port 222a when the mounting head 110 moves up and down, the holder 210 does not rattle (shake around, sway) within the housing section 221. Therefore, it is possible to suppress the generation of particles by preventing the holder 210 from coming into contact with the housing 221.

[0043] (4) The support body 220 has a heating section 240. Heat from the support body 220 is transferred to the holder 210 by contact with the support body 220 or by radiant heat, so that the electronic component 1 can be heated quickly by the holder 210. Furthermore, since the heating section 240 is not mounted on the holder 210, the electronic component 1 can be heated without increasing the weight of the holder 210.

[0044] [Differentiation] This embodiment is not limited to the above-described configuration. For example, the following modified configurations are also possible.

[0045] (1) Pressing the holder 210 while it is in contact with the ceiling of the housing section 221 allows for pressurization with a high load. However, as shown in Figure 8, it is even better to provide a suction port 222b in a position that sucks the upper surface of the holder 210 with negative pressure, separate from the suction port 222a. The suction port 222b is provided on the ceiling of the housing section 221 facing the mounting section 212 from above. In this case, the presence or absence of suction by negative pressure from the negative pressure generating device can be switched between the suction port 222a and the suction port 222b using a valve. As a result, as shown in Figure 9, by applying negative pressure to the suction port 222b and sucking the upper surface of the holder 210, the load of the mounting head 110 is directly applied to the electronic component 1, enabling pressurization with a high load. In this configuration, it is possible to switch between low load and high load depending on the electronic component 1 to be mounted. Note that the number of suction ports 222b is not limited to the number shown in Figure 8. The suction port 222b may be one or three or more.

[0046] Furthermore, it is preferable that the suction port 222a be provided along the inner side of the outer circumference of the mounting surface 212a. If it is difficult to provide it along the inner side of the outer circumference of the mounting surface 212a, it is preferable to provide a pair of suction ports 222a at opposing positions on the left and right sides.

[0047] (2) As shown in Figure 10, the suction port 222c may be provided at a position that sucks the side surface of the holder 210 with negative pressure. That is, the suction port 222c is provided on the inner surface of the support 220, relative to the outer surface of the holder 210, and to which negative pressure from a negative pressure generating device is applied. Figure 10 is an example in which the suction ports 222c are provided on two opposing inner surfaces of the support 220, corresponding to two opposing sides of the holder 210. In this case, by applying negative pressure to either one of the suction ports 222c, the side surface of the holder 210 is attracted and held on the inner surface where the suction port 222c is provided. However, the suction port 222c may be provided at a position corresponding to any one side surface of the holder 210 or at a position corresponding to any two adjacent sides, so that the holder 210 is attracted and held. When attracting two adjacent sides, the position of the holding part 211 is fixed, which is more preferable.

[0048] Furthermore, as shown in Figure 10, a suction port 222b may be provided at a position where negative pressure is applied to the upper surface of the holder 210. In Figure 10, a suction port 222b is provided at a position where the upper surface is sucked, and a suction port 222c is also provided at a position where the side surface is sucked, but either one may be provided. In any of the above embodiments, when the mounting tool 200 moves, the holder 210 should be fixed in the housing section 221 by suction from any of the suction ports 222a, 222b, or 222c.

[0049] (3) The negative pressure at the suction port 222a or 222c may be released when the bumps 11 and 21 make contact, or after the bumps 11 and 21 have melted. Also, the negative pressure at the suction port 222a or 222c does not need to be completely released. In other words, even if suction by negative pressure is continued, if the suction is relatively weak, the load applied to the bumps 11 and 21 can be reduced as described above, thereby suppressing the crushing of the bumps 11 and 21. In other words, the strength of the negative pressure may be adjusted. Also, the force obtained by adding the suction force of the negative pressure and the weight of the holder 210 is 0.1 g / mm² over the horizontal area of ​​the electronic component 1. 2 In the following cases, it is not necessary to release the negative pressure or adjust the strength of the negative pressure. Also, the shape of the suction ports 222a, 222b, and 222c is sufficient to hold the holder 210, and can be a round hole, an elongated hole, or a slit shape.

[0050] If the load on the mounting tool 200 is too low, variations in the height of the bumps 11 and 21 may result in some bumps 11 and 21 not making contact. Therefore, it is necessary to apply a load sufficient to prevent such non-contact bumps 11 and 21 from occurring. This load adjustment can be achieved not only by the weight of the mounting tool 200 itself but also by adding suction using negative pressure.

[0051] (4) As shown in Figures 11 and 12, the upper surface of the support portion 222 and the mounting surface 212a may have surfaces at an angle different from the horizontal. For example, as shown in Figures 11 and 12, the upper surface of the support portion 222 and the mounting surface 212a may have portions that are inclined with respect to the horizontal, or as shown in Figure 13, they may have portions that are vertical. The suction port 222d may be provided to match the angle of the support portion 222 and the mounting surface 212a. The inclined surfaces of the support portion 222 and the mounting surface 212a should be at an angle that does not hinder the mounting portion 212 from moving up and down within the housing portion 221. Furthermore, it is preferable that the inclination angles of the inclined or vertical surfaces of the support portion 222 and the mounting surface 212a that are in contact with each other be the same. However, they are not limited to the same angle. The angles may be different as long as the suction port 222d can suck the mounting surface 212a.

[0052] In the embodiment shown in Figure 13, it is preferable to provide the suction port 222d at a position corresponding to the mounting surface 212a of the holder 210. Figure 13 is an example in which the suction ports 222d are provided on two opposing inner surfaces of the support 220, corresponding to the opposing mounting surfaces 212a of the holder 210. However, the suction ports 222d may be provided at a position corresponding to any one of the mounting surfaces 212a of the holder 210 or at a position corresponding to any two adjacent mounting surfaces 212a, so that the mounting surfaces 212a are attracted and held. When two adjacent mounting surfaces 212a are attracted, the position of the holding portion 211 is determined to a fixed position, which is more preferable.

[0053] Furthermore, in the embodiments illustrated in Figures 11 and 12, the holder 210 has the effect of centering, thus preventing misalignment.

[0054] (5) The mounting portion 212 does not have to extend outward beyond the holding surface 211a. For example, as shown in Figure 14, the horizontal size of the mounting portion 212 may be less than or equal to the holding surface 211a.

[0055] (6) The heating unit 240 may be separate from the support body 220. For example, as shown in Figure 15, the heating unit 240 may be provided on the mounting head 110, and the electronic component 1 and bumps 11 and 21 may be heated via the support body 220 and the holder 210. This eliminates the need for heating wiring on the mounting tool 200 side, making it easy to replace the mounting tool 200 according to the electronic component 1.

[0056] (7) The holder 210 may be configured to have a detachable holding portion 211 and a mounting portion 212. This allows the holding surface 211a to be replaced according to the electronic component 1.

[0057] (8) Various methods can be considered for manufacturing the mounting tool 200 including the holder 210 and the support 220. For example, as shown in Figure 16, the support 220 may be manufactured by combining separately formed members. That is, the support 220 is constructed by attaching a separately formed support part 222 to the main body of the support 220 at the dashed-dotted line portion after inserting the holder 210 into the housing portion 221. This makes it easy to insert and replace the holder 210 in the housing portion 221. More specifically, if the support 220 is configured to be separable into an upper member and a lower member including the support part 222 with the dashed-dotted line portion as the boundary, the holder 210 may be placed on the lower member and then fixed at the dashed-dotted line portion by joining or fasteners such as screws.

[0058] In the embodiment illustrated in Figure 16, the heating unit 240 is provided on the mounting head 110, but the heating unit 240 may also be provided on the support 220. In other words, the heating unit 240 may be provided on one or both of the mounting head 110 and the support 220. Although the heat insulating material 111 is not shown in Figure 16, the heat insulating material 111 can be provided at the boundary between the area requiring heat insulation and the area above the heating unit 240 (on the mounting head 110 side) on one or both of the mounting head 110 and the support 220.

[0059] (9) The support 220 may have an outlet for blowing gas onto the holder 210. By blowing gas from the outlet, the holder 210 can be pressed against the inner surface (inner surface, ceiling, support part 222) of the housing 221 and fixed in place. This provides the same fixing effect as described above. For example, the suction port 222a illustrated in Figure 1 above may be used as the outlet. The outlet is in communication with a positive pressure generating device, including a vacuum pump and valves, via a flow path provided inside the support 220. The positive pressure generating device can blow gas from the outlet, thereby pressing the holder 210 against the ceiling of the housing 221. The holder 210 can also be pressed against the support part 222 by blowing gas from an outlet provided in the ceiling of the housing 221. The holder 210 can also be pressed against the other inner surface of the housing 221 by blowing gas from an outlet provided on one inner surface of the housing 221. It is preferable to blow gas from two adjacent inner surfaces of the housing 221, thereby pressing the holder 210 against the corners of the two opposing inner surfaces, which determines the position of the holder 211 to a fixed position.

[0060] Furthermore, as illustrated in Figure 8 above, in addition to the suction port 222a which serves as the outlet, a suction port 222b may be provided to fix the holder 210 to the ceiling of the housing 221 by suctioning the holder 210. In other words, the holder 210 can be fixed by blowing gas out from the outlet and drawing gas in from the suction port at a pair of opposing outlets and suction ports.

[0061] Similarly, as illustrated in Figures 10 and 13, the holder 210 may be fixed by blowing gas from one of the suction ports 222c (corresponding to an outlet) or one of the suction ports 222d (corresponding to an outlet) corresponding to two opposing sides, and sucking gas from the other of the suction ports 222c (corresponding to an outlet) or suction ports 222d (corresponding to an outlet) corresponding to two opposing sides, among the suction ports 222c (corresponding to an outlet) or suction ports 222d (corresponding to an outlet) corresponding to two adjacent sides, among the suction ports 222c (corresponding to an outlet) or suction ports 222d (corresponding to an outlet) corresponding to four sides, and sucking gas from the suction ports 222c or suction ports 222d corresponding to two opposing sides, because this is more preferable as it determines the position of the holder 211 to a fixed position.

[0062] Furthermore, in the embodiments illustrated in Figures 8, 10, 11, 12, and 13, the holder 210 may be fixed by using all the suction ports 222a, 222b, 222c, and 222d in each embodiment as outlets and blowing gas out from all the suction ports 222a, 222b, 222c, and 222d in each embodiment.

[0063] [Other embodiments] Although embodiments and modifications of the present invention have been described above, these embodiments and modifications are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, modifications, and combinations can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the invention described in the claims. [Explanation of Symbols]

[0064] 1 Electronic components 2 circuit boards 11, 21 Bump 100 mounting device 110 Mounting Head 111 Insulation 120 Head movement mechanism 130 PCB stage 140 Stage Movement Mechanism 200 Implementation Tools 210 Holding body 211 Holding part 211a Holding surface 212 Mounting section 212a mounting surface 220 Support 221 Storage Unit 221a aperture 222 Support part 222a, 222b, 222c, 222d Suction port 240 Heating section 300 Imaging Unit 400 Control Unit

Claims

1. A holder for holding an electronic component to be heated, and a support for the holder, It has, The retainer is The lower surface, which is the holding surface, has a holding part for holding electronic components, A mounting portion provided above the aforementioned holding surface and having a mounting surface that faces downward, It has, The aforementioned support is The holding surface is exposed downwards, and the holding body is movable up and down, with a housing that accommodates the mounting portion, A support portion that contacts the mounting surface and supports the holder, Having An implementation tool characterized by the following features.

2. The mounting portion is characterized in that it extends outward from the holding surface, as described in claim 1.

3. The mounting tool according to claim 1, characterized in that the support body allows the mounting portion to move up and down within the housing portion and has a suction port for sucking the holder by negative pressure.

4. The mounting tool according to claim 3, characterized in that the suction port is provided in a position that sucks the mounting surface with negative pressure.

5. The mounting tool according to claim 3, characterized in that the suction port is provided in a position that sucks the side surface of the holder by negative pressure.

6. The mounting tool according to claim 3, characterized in that the suction port is provided in a position that sucks the upper surface of the holder with negative pressure.

7. The mounting tool according to claim 1, characterized in that the support has a heating section.

8. The mounting tool according to claim 1, characterized in that part or all of the upper surface of the support portion and part or all of the mounting surface have surfaces at an angle different from the horizontal.

9. The mounting tool according to claim 1, characterized in that the support body allows the mounting portion to move up and down within the housing portion and has an outlet for blowing gas out onto the holder.

10. An opening is provided at the lower part of the housing section through which the retaining section can be inserted. The mounting tool according to claim 1, characterized in that the support portion is the outer peripheral portion of the opening.

11. An implementation tool according to any one of claims 1 to 10, A mounting head is provided so as to be movable in a direction toward or toward a substrate on which electronic components are mounted, and the mounting tool is attached to its lower end, An implementation device characterized by having the following features.

12. The mounting apparatus according to claim 11, characterized in that the mounting head has a heating section.

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