Manufacturing method for multilayer electronic components

Abstract

This invention provides a method for manufacturing multilayer electronic components with improved moisture resistance reliability and dielectric properties per unit volume. [Solution] The method includes the steps of: providing a ceramic green sheet on which an internal electrode pattern is formed; providing a laminated ceramic green sheet by stacking the ceramic green sheets; providing a green body by cutting the laminated ceramic green sheet so that the internal electrode pattern is exposed in the lateral direction; attaching a margin green sheet to the lateral direction of the green body under the conditions of the first step; and performing a punching step on the green body to which the margin green sheet is attached under the conditions of the second step. After the punching step, the margin green sheet has a structure in which it is extended and arranged on at least one of the two sides of the green body in the stacking direction and the two sides in the length direction.

Description

[Technical Field]

[0001] This invention relates to a method for manufacturing stacked electronic components. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays the role of charging or discharging electricity.

[0003] These multilayer ceramic capacitors offer the advantages of being small yet guaranteeing high capacitance and being easy to mount, making them suitable for use as components in various electronic devices. As electronic devices such as computers and mobile devices become smaller and more powerful, the demand for smaller and higher-capacitance multilayer ceramic capacitors is increasing.

[0004] To miniaturize and increase the capacitance of multilayer ceramic capacitors, it is necessary to maximize the effective electrode area (increase the effective volume fraction required to achieve the desired capacitance). To realize such miniaturized and high-capacitance multilayer ceramic capacitors, the internal electrodes are manufactured so that they are exposed in the width direction of the main body. This allows for a margin-free design, thereby maximizing the area of ​​the internal electrodes in the width direction. In this process, a ceramic green sheet for the side margin is separately attached to the exposed surface of the internal electrodes in the width direction before sintering, thereby blocking external exposure.

[0005] While forming the side margin by separately attaching a ceramic green sheet for the side margin can improve the capacitance per unit volume of the capacitor, problems such as shortened chip life or defects may occur due to moisture penetration from the outside or penetration of the plating solution during the plating process through the interface between the main body and the side margin. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2021-061356 [Overview of the initiative] [Problems that the invention aims to solve]

[0007] One of the various problems that this invention aims to solve is to provide a multilayer electronic component with improved moisture resistance reliability.

[0008] One of the various problems that this invention aims to solve is to provide a multilayer electronic component with improved dielectric properties per unit volume.

[0009] However, the various problems that the present invention aims to solve are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0010] A method for manufacturing a stacked electronic component according to one embodiment of the present invention includes the steps of: providing a ceramic green sheet on which an internal electrode pattern is formed; stacking the ceramic green sheets in a first direction to provide a stacked ceramic green sheet; when the direction perpendicular to the first direction is defined as the second direction, and the directions perpendicular to the first and second directions are defined as the third direction, the stacked ceramic green sheet is cut to provide a green body so that the internal electrode pattern is exposed in the third direction; attaching a margin green sheet to the green body in the third direction under first process conditions; and performing a punching process on the green body to which the margin green sheet is attached under second process conditions, wherein after the punching process, the margin green sheet may have a structure in which it is extended and arranged on at least one of the two sides of the green body in the first direction and the two sides in the second direction.

[0011] A method for manufacturing a stacked electronic component according to another embodiment of the present invention includes the steps of: providing a ceramic green sheet on which an internal electrode pattern is formed; stacking the ceramic green sheets in a first direction to provide a stacked ceramic green sheet; providing a green body by cutting the stacked ceramic green sheet so that the internal electrode pattern is exposed in the third direction, when the direction perpendicular to the first direction is defined as the second direction and the directions perpendicular to the first and second directions are defined as the third direction; attaching a margin green sheet to the green body in the third direction under first process conditions; and performing a punching process on the green body to which the margin green sheet is attached under second process conditions, wherein the first process conditions include adding a pressure condition of 0.1 tons or more and 1.2 tons or less, and a temperature condition of 60°C or more and 120°C or less, and the second process conditions may include adding a pressure condition of 5 tons or more and 12 tons or less, and a temperature condition of 20°C or more and 60°C or less. [Effects of the Invention]

[0012] One of the various effects of the present invention is to improve the moisture resistance reliability of multilayer electronic components.

[0013] One of the various effects of the present invention is to improve dielectric properties per unit volume of a multilayer electronic component.

[0014] However, the various but significant advantages and effects of the present invention are not limited to the above description, and can be more easily understood in the process of describing specific embodiments of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] [Figure 1] 1 is a schematic flowchart generally showing a method for manufacturing a multilayer electronic component according to an embodiment of the present invention. [Figure 2a] 2 is a schematic plan view generally showing a method for manufacturing a multilayer electronic component according to an embodiment of the present invention. [Figure 2b] 3 is a schematic cross-sectional view generally showing a method for manufacturing a multilayer electronic component according to an embodiment of the present invention. [Figure 2c] 4 is a schematic cross-sectional view generally showing a method for manufacturing a multilayer electronic component according to an embodiment of the present invention. [Figure 2d] 5 is a schematic perspective view generally showing a method for manufacturing a multilayer electronic component according to an embodiment of the present invention. [Figure 2e] 6 is a schematic cross-sectional view generally showing a method for manufacturing a multilayer electronic component according to an embodiment of the present invention. [Figure 2f] 7 is a schematic cross-sectional view generally showing a method for manufacturing a multilayer electronic component according to an embodiment of the present invention. [Figure 2g] 8 is a schematic cross-sectional view generally showing a method for manufacturing a multilayer electronic component according to an embodiment of the present invention. [Figure 3] 9 is a schematic perspective view generally showing a main body with a margin portion formed by the method for manufacturing a multilayer electronic component according to an embodiment of the present invention attached thereto. [Figure 4] 10 is a schematic perspective view generally showing a multilayer electronic component manufactured by the method for manufacturing a multilayer electronic component according to an embodiment of the present invention. DETAILED DESCRIPTION OF EMBODIMENTS

[0016] Embodiments of the present invention will be described below with reference to specific embodiments and accompanying drawings. However, embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person of the ordinary skill. Accordingly, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0017] Furthermore, in order to clearly illustrate the present invention in the drawings, parts unrelated to the explanation have been omitted, and the size and dimensions of each illustrated component are shown arbitrarily for the convenience of explanation; therefore, the present invention is not necessarily limited by the illustrations. Also, components with the same function within the scope of the same concept are described using the same reference numerals. Moreover, throughout the specification, when a part "includes" a certain component, unless otherwise stated to the contrary, it does not mean that other components are excluded, but rather that other components may be further included.

[0018] In the drawing, the Z direction can be defined as the thickness direction or the first direction, the X direction as the length direction or the second direction, and the Y direction as the width direction or the third direction. The lamination direction can be the thickness direction or the width direction.

[0019] Manufacturing method for multilayer electronic components Figure 1 schematically shows a process flowchart of a method for manufacturing a stacked electronic component according to one embodiment of the present invention, Figures 2a to 2g are schematic plan views, perspective views, or cross-sectional views showing a method for manufacturing a stacked electronic component according to one embodiment of the present invention, Figure 3 schematically shows a perspective view of a main body with a margin portion attached by the method for manufacturing a stacked electronic component according to one embodiment of the present invention, and Figure 4 schematically shows a perspective view of a stacked electronic component manufactured by the method for manufacturing a stacked electronic component according to one embodiment of the present invention.

[0020] The following describes in detail a method for manufacturing a multilayer electronic component according to one embodiment of the present invention, with reference to Figures 1 to 4. However, although a multilayer ceramic capacitor will be described as an example of a multilayer electronic component, the present invention can also be applied to various electronic products using dielectric compositions, such as inductors, piezoelectric elements, varistors, or thermistors.

[0021] A method for manufacturing a stacked electronic component according to one embodiment of the present invention includes the steps of: providing a ceramic green sheet 211 on which internal electrode patterns 221 and 222 are formed (S100); stacking the ceramic green sheets 211 in a first direction to provide a stacked ceramic green sheet 220 (S200); and, when the direction perpendicular to the first direction is considered the second direction, and the directions perpendicular to the first and second directions are considered the third direction, cutting the stacked ceramic green sheet 220 so that the internal electrode patterns 221 and 222 are exposed in the third direction to form the green body 210. The process includes the steps of setting up (S300), attaching the margin green sheet 215 to the third directions 5 and 6 of the green body 210 under first process conditions (S400), and performing a punching process on the green body 210 to which the margin green sheet 215 is attached under second process conditions (S500), wherein after the punching process (S500), the margin green sheet 215 may have a structure in which it is extended and arranged on at least one of the two surfaces 1 and 2 in the first direction and the two surfaces 3 and 4 in the second direction of the green body 210.

[0022] A method for manufacturing a stacked electronic component according to another embodiment of the present invention includes the steps of: providing a ceramic green sheet 211 on which internal electrode patterns 221 and 222 are formed (S100); stacking the ceramic green sheets 211 in a first direction to provide a stacked ceramic green sheet 220 (S200); and, when the direction perpendicular to the first direction is considered the second direction, and the directions perpendicular to the first and second directions are considered the third direction, cutting the stacked ceramic green sheet 220 so that the internal electrode patterns 221 and 222 are exposed in the third direction to provide a green body 210. The process includes a step of forming (S300), a step of attaching the margin portion green sheet 215 to the third directions 5 and 6 of the green body 210 under first process conditions (S400), and a step of performing a punching process on the green body 210 to which the margin portion green sheet 215 is attached under second process conditions (S500), wherein the first process conditions include adding a pressure condition of 0.1 tons or more and 1.2 tons or less, and a temperature condition of 60°C or more and 120°C or less, and the second process conditions may include adding a pressure condition of 5 tons or more and 12 tons or less, and a temperature condition of 20°C or more and 60°C or less.

[0023] Step (S100) of providing a ceramic green sheet on which an internal electrode pattern has been formed. As shown in Figure 2a, multiple stripe-shaped first internal electrode patterns 221 are formed on the ceramic green sheet 211 at predetermined intervals. The multiple stripe-shaped first internal electrode patterns 221 can be formed parallel to each other, and the ceramic green sheet on which the first internal electrode patterns 221 are formed can be defined as the first ceramic green sheet.

[0024] The ceramic green sheet 211 may comprise a ceramic slurry containing a ceramic material, an organic solvent and an organic binder. The ceramic material is not particularly limited as long as it has a high dielectric constant, and perovskite (ABO3) based materials can be used, for example, barium titanate based materials, lead composite perovskite based materials, or strontium titanate based materials can be used. The barium titanate based material may comprise BaTiO3 based ceramic powder. Examples of the ceramic powder include BaTiO3, and (Ba in which Ca (calcium), Zr (zirconium), etc. are partially dissolved in solid solution in BaTiO3 1-x Ca x )TiO3 (0<x<1), Ba(Ti 1-y Ca y )O3 (0<y<1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0<x<1, 0<y<1) or Ba(Ti 1-y Zr y )O3 (0<y<1), etc. are exemplified.

[0025] The stripe-shaped first internal electrode pattern 221 can be formed from an internal electrode paste containing a conductive metal. The conductive metal is not particularly limited, and a material excellent in electrical conductivity can be used.

[0026] The first internal electrode pattern 221 can be formed on the first ceramic green sheet by, but not limited to, screen printing or gravure printing.

[0027] Further, although not shown in the drawings, a plurality of stripe-shaped second internal electrode patterns 222 can be formed on another ceramic green sheet 211 at predetermined intervals, and the ceramic green sheet on which the second internal electrode patterns 222 are formed can be defined as the second ceramic green sheet.

[0028] Step of providing a laminated ceramic green sheet (S200) Next, as shown in Figure 2b, the first ceramic green sheet and the second ceramic green sheet can be alternately stacked in the first direction so that the striped first internal electrode pattern 221 and the striped second internal electrode pattern 222 are intersectingly stacked.

[0029] In this case, the portion where the ceramic green sheet 211 and internal electrode patterns 221 and 222 are stacked in a first direction to form a capacitance can be defined as the green capacitance forming portion, and the cover portion green sheets 212 and 213 can be placed on both end faces in the first direction of the green capacitance forming portion.

[0030] Specifically, the cover green sheets 212 and 213 may include a first cover green sheet 212 positioned on one end face in the first direction of the green volume forming section, and a second cover green sheet 213 positioned on the other end face in the first direction. More specifically, the first cover green sheet 212 may be positioned at the lower part in the first direction of the green volume forming section, and the second cover green sheet 213 may be positioned at the upper part in the first direction.

[0031] After this, through a firing process, the ceramic green sheet 211 can become the dielectric layer 111, the striped first internal electrode pattern 221 can become the first internal electrode 121, and the striped second internal electrode pattern 222 can become the second internal electrode 122. In addition, the first cover green sheet 212 can become the first cover 112, and the second cover green sheet 213 can become the second cover 113.

[0032] The thickness td of the ceramic green sheet 211 does not need to be particularly limited, and the explanation for the thickness td of the ceramic green sheet can be equivalent to the explanation for the thickness td of the first ceramic green sheet and the second ceramic green sheet, respectively.

[0033] To more easily achieve miniaturization and high capacity of stacked electronic components, the thickness td of the ceramic green sheet 211 can be 1.0 μm or less, 0.8 μm or less, preferably 0.6 μm or less, 0.5 μm or less, and more preferably 0.45 μm or less, 0.4 μm or less.

[0034] Here, the thickness td of the ceramic green sheet can be said to represent the size of the ceramic green sheet in the first direction.

[0035] The thickness te of the internal electrode patterns 211 and 222 does not need to be particularly limited, and the explanation for the thickness te of the internal electrode patterns 211 and 222 can be equivalent to the explanation for the thickness te of the first internal electrode pattern 211 and the second internal electrode pattern 222, respectively.

[0036] To more easily achieve miniaturization and high capacitance of stacked electronic components, the thickness te of the internal electrode pattern can be 1.0 μm or less, 0.8 μm or less, preferably 0.6 μm or less, 0.5 μm or less, and more preferably 0.45 μm or less, 0.4 μm or less.

[0037] Figure 2c is a cross-sectional view showing the first ceramic green sheet and the second ceramic green sheet in the first direction, forming a laminated ceramic green sheet 220, and Figure 2d is a schematic perspective view of the laminated ceramic green sheet 220.

[0038] Referring to Figures 2c and 2d, a first ceramic green sheet printed with multiple parallel stripe-shaped first internal electrode patterns 221 and a second ceramic green sheet printed with multiple parallel stripe-shaped second internal electrode patterns 222 are alternately laminated to each other.

[0039] More specifically, the layers may be stacked such that the central portion of the striped first internal electrode pattern 221 printed on the first ceramic green sheet and the space between the striped second internal electrode pattern 222 printed on the second ceramic green sheet overlap.

[0040] Stage where the green main body is installed (S300) Next, as shown in Figure 2d, the multilayer ceramic green sheet 220 can be cut across multiple striped first internal electrode patterns 221 and striped second internal electrode patterns 222. That is, the multilayer ceramic green sheet 220 can be cut along mutually orthogonal C1-C1 and C2-C2 cutting lines, and multiple green bodies 210 can be provided.

[0041] More specifically, the striped first internal electrode pattern 221 and the striped second internal electrode pattern 222 can be divided along the C1-C1 cutting line into multiple internal electrode patterns 211 and 222 having a constant size in a third direction. At this time, the ceramic green sheet 211 can also be cut into multiple pieces together with the internal electrode patterns 221 and 222, becoming multiple cut green bodies 210. On the other hand, the size of the cut ceramic green sheet 211 and the cut internal electrode patterns 221 and 222 in the third direction may be the same.

[0042] Furthermore, the material can be cut along the C2-C2 cutting line to fit individual body sizes. That is, before attaching the margin green sheet 215, the rod-shaped laminated ceramic green sheet 220 can be cut along the C2-C2 cutting line to fit individual ceramic body sizes.

[0043] After this, the green body 210 can be installed as shown in Figure 2e.

[0044] Step of attaching the green sheet to the margin area (S400) On the other hand, in order to achieve miniaturization and high capacitance of stacked electronic components, the internal electrodes are exposed in the width direction of the main body, thereby maximizing the area of ​​the internal electrodes in the width direction through a design without margins. In such cases, a method is applied in which a margin green sheet is separately attached to the exposed electrode surface in the width direction of the green main body before firing after chip fabrication.

[0045] In conventional margin formation methods, the margin green sheet is attached to the cross-section of the green body in the width direction. This is done by first attaching the margin green sheet to the green body, then applying heat and pressure to compress it, and finally punching out the parts of the margin green sheet that are not attached to the green body to remove the remaining margin green sheet.

[0046] At this time, the remaining margin green sheet was removed so that it was the same as the first direction of the green body, and the product was manufactured so that no margin green sheet adhered to either the first side (first and second sides) or the second side (third and fourth sides) of the green body.

[0047] However, this type of margin green sheet structure has a structure in which the interface between the main green sheet and the margin green sheet is exposed to the outside. Even after firing, this creates an open path through which moisture from the outside can penetrate the interface between the main sheet and the margin, which has always led to problems with the moisture resistance reliability of multilayer electronic components.

[0048] Therefore, the manufacturing method for a multilayer electronic component according to one embodiment of the present invention can improve the moisture resistance reliability of the multilayer electronic component by minimizing the area in which the interface between the main body and the margin portion is exposed to the outside, and by increasing the pathways for moisture penetration from the outside. The specific manufacturing method will be described below.

[0049] Next, as shown in Figure 2f, the margin green sheet 215 can be attached to the third direction of the green body 210 under the conditions of the first process.

[0050] The drawing shows that the margin green sheet 215 is attached to one side of the green body 210 in the third direction (e.g., the sixth side), but the margin green sheet can also be attached to the other side in the third direction (e.g., the fifth side). When attaching the margin green sheet to the other side in the third direction (e.g., the fifth side) of the green body 210, this can be done after the step of attaching the margin green sheet 215 to one side in the third direction (e.g., the sixth side) and after the punching step described later.

[0051] Furthermore, the margin green sheet attached to the fifth surface 5 can be designated as the first margin green sheet, and the margin green sheet attached to the sixth surface 6 can be designated as the second margin green sheet 215. The first margin green sheet and the second margin green sheet can become the first margin portion 114 and the second margin portion 115, respectively, after firing.

[0052] The first process conditions may include at least one of the following conditions: a pressure condition of 0.1 tons or more and 1.2 tons or less, and a temperature condition of 60°C or more and 120°C or less. Preferably, the first process conditions apply all of the pressure and temperature conditions.

[0053] By attaching the margin green sheet 215 under the first process conditions, the margin green sheet 215 can be extended and positioned on at least one of the two sides 1 and 2 in the first direction and the two sides 3 and 4 in the second direction of the green body 210.

[0054] In the present invention, "both sides in the first direction" and "at least one of both sides in the second direction" can mean at least one of the first surface 1 and the second surface 2, and the third surface 3 and the fourth surface 4, and it can mean that the margin green sheet has a structure in which it extends to at least one of the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 of the green body. For example, the second margin green sheet 215 located on the sixth surface 6 may have a structure in which it extends to at least one of the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4, and the first margin green sheet located on the fifth surface 5 may have a structure in which it extends to at least one of the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4, in which case it is preferable that the first margin green sheet and the second margin green sheet are spaced apart from each other, but is not particularly limited thereto.

[0055] On the other hand, the margin green sheet 215 can be attached using the first heating and pressurizing member.

[0056] For example, the margin green sheet 215 and the green body 210 can be placed between the first-first heating and pressing member and the first-second heating and pressing member, and then pressed together to adhere them.

[0057] The first-1 heating and pressing member may include a first lower steel plate 311a and a first elastic member 312 positioned on the upper surface of the first lower steel plate 311a, and the first-2 heating and pressing member may include a first upper steel plate 311b and a first adhesive sheet 312 positioned on the lower surface of the first upper steel plate 311b.

[0058] Here, the first elastic member 312 may include a soft elastomer, and it is preferable that it be a soft elastomer.

[0059] Here, the soft elastomer preferably has an elastic modulus exceeding 50 MPa, and more specifically, it may include, but is not limited to, at least one of the following: natural rubber, neoprene rubber, silicone rubber, polyurethane, EPDM (ethylene propylene diene monomer), SBR (styrene-butadiene rubber), polybutadiene, and thermoplastic elastomer.

[0060] The first elastic member 312 includes a soft elastomer, which allows the green body 210 to have a structure that extends to at least one of the two surfaces in the first direction (first and second surfaces) and the two surfaces in the second direction (third and fourth surfaces).

[0061] This may be because, when heating and pressurizing the green body 210 to attach the margin green sheet 215, the green body 210 is pulled in the direction of the first elastic member 312 together with the margin green sheet 215 and the first elastic member 312, and adheres to other surfaces of the green body 210, including the third direction surface.

[0062] When attaching the margin green sheet 215, if it is pressurized with a pressure of less than 0.1 tons or heated at a temperature of less than 60°C, the margin green sheet 215 may not extend to at least one of the two sides of the green body 210 in the first direction and the two sides of the green body 210. If it is pressurized with a pressure exceeding 1.2 tons or heated at a temperature exceeding 120°C, excessive pressure may be applied to the green body 210, inducing deformation and potentially causing defects in the manufactured laminated electronic component.

[0063] In this case, the temperature condition of 60°C to 120°C among the first process conditions can mean the temperature of the first lower steel plate 311a. This is because the temperature of the first elastic member 312 changes depending on the temperature of the first lower steel plate 311a, and the temperature of the margin green sheet 215 changes depending on the temperature of the first elastic member 312, thereby facilitating deformation when the margin green sheet 215 is attached to the green body 210, but it is not limited to this.

[0064] Furthermore, among the conditions for the first process, the pressure condition of 0.1 tons or more and 1.2 tons or less can be interpreted as applying pressure to the green body 210 using the upper first steel plate 311b.

[0065] The stage in which the punching process is performed (S500) Next, as shown in Figure 2g, a punching process can be performed on the green body 210 to which the margin green sheet 215 is attached, under the conditions of the second process.

[0066] The second process conditions may include at least one of the following: a pressure condition of 5 tons or more and 12 tons or less, and a temperature condition of 20°C or more and 60°C or less. Preferably, the second process conditions apply all of the pressure and temperature conditions.

[0067] By performing the punching process under the conditions of the second process, the remaining margin portion of the green sheet 215' that is extended and positioned on at least one of the two sides 1 and 2 in the first direction and the two sides 3 and 4 in the second direction of the green body 210 can be easily attached and removed.

[0068] In this case, the pressure conditions of the first and second process conditions may differ from each other, or the temperature conditions of the first and second process conditions may differ from each other, or both the pressure and temperature conditions of the first and second process conditions may differ from each other.

[0069] On the other hand, the punching process can be carried out using a second heating and pressing member.

[0070] For example, the green body 210 with the margin green sheet 215 attached can be placed between the second-first heating and pressing member and the second-second heating and pressing member, and then pressed and punched out.

[0071] The second-first heating and pressing member may include a second lower steel plate 411a and a second elastic member 412 positioned on the upper surface of the second lower steel plate 411a, and the second-second heating and pressing member may include a second upper steel plate 411b and a second adhesive sheet 412 positioned on the lower surface of the second upper steel plate 411b.

[0072] Here, the second elastic member 412 may contain an elastomer, and it is preferable that the elastomer has a lower elastic modulus than the first elastic member 312.

[0073] When attaching the margin green sheet 215, if pressure is applied at less than 5 tons or heating at a temperature below 20°C, there is a risk that the excess margin green sheet 215 will not detach from the green body 210 to which it is attached. If pressure is applied at more than 12 tons or heating at a temperature above 60°C, there is a risk of damaging the green body 210 or inducing excessive deformation of the margin green sheet 215, resulting in poor adhesion to the green body 210.

[0074] In this case, the temperature condition of 20°C to 60°C among the second process conditions can mean the temperature of the second lower steel plate 411a. This is because the temperature of the second elastic member 412 changes depending on the temperature of the second lower steel plate 411a, and the temperature of the margin green sheet 215 changes depending on the temperature of the second elastic member 412. This makes it easier to detach and remove the remaining margin green sheet 215' when applying the punching process to the green body 210 to which the margin green sheet 215 is attached, but the process is not limited to this.

[0075] Furthermore, the pressure condition of 5 tons or more and 12 tons or less among the conditions for the second process can mean applying pressure to the green body 210 using the upper second steel plate 411b.

[0076] The following is a brief explanation of the stacked electronic component 100.

[0077] The multilayer electronic component 100 may include a main body 110, the main body 110 may have dielectric layers 111 and internal electrodes 121 and 122 stacked alternately.

[0078] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122, and the first internal electrode 121 and the second internal electrode 122 may be arranged alternately facing each other across the dielectric layer 111 that constitutes the main body 110.

[0079] Furthermore, the main body 110 may include cover portions 112 and 113 positioned on both end surfaces (end-surfaces) of the capacity forming portion Ac in the first direction.

[0080] The stacked electronic component 100 may include margin portions 114 and 115 positioned on both end surfaces (end-surfaces) of the main body 110 in the third direction.

[0081] More specifically, the margin portions 114 and 115 may include a first margin portion 114 and a second margin portion 115, respectively, which are located on the fifth surface 5 and the sixth surface 6, and the first margin portion 114 and the second margin portion 115 may extend to at least one of the first surface 1 and the second surface 2, and the third surface 3 and the fourth surface 4, respectively. That is, the first margin portion 114 may be located on the third surface 3 and extend from the third surface 3 to at least one of the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4, and the second margin portion 115 may be located on the fourth surface 4 and extend from the fourth surface 4 to at least one of the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4.

[0082] The stacked electronic component 100 may include external electrodes 131 and 132 that are placed on the main body 110 and connected to the internal electrodes 121 and 122.

[0083] The size of the stacked electronic component 100 does not need to be particularly limited.

[0084] However, in order to achieve both miniaturization and high capacitance simultaneously, the thickness of the dielectric layer and internal electrodes must be reduced and the number of layers increased. Therefore, the effects of the present invention may be more pronounced in multilayer electronic components 100 having a size of 2012 (length × width: 2.0 mm × 1.2 mm, where the length and width satisfy an error of ±10%) or less. In addition, the width of the multilayer electronic component 100 may be greater than the length.

[0085] Although embodiments of the present invention have been described in detail above, the present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims provided. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0086] Furthermore, the term "embodiment" as used in this invention does not mean that each embodiment is identical to the others, but rather is provided to emphasize and describe the unique and distinct characteristics of each embodiment. However, the embodiments presented above do not preclude their implementation in combination with the features of other embodiments. For example, even if a matter described in one particular embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, as long as there is no description in the other embodiment that contradicts or is contrary to that matter.

[0087] The terms used in this invention are used merely to describe one embodiment and are not intended to limit the invention. In this context, singular expressions may include plural expressions unless they clearly mean something different in context. [Explanation of symbols]

[0088] 210 Green Body 211 Ceramic Green Sheet 212, 213 Cover part green sheet 215 Margin area green sheet 215' Remaining margin area green sheet 220 Laminated Ceramic Green Sheet 221, 222 Internal electrode patterns 311a, 311b 1st steel plate 312 First Elastic Member 313 First adhesive member 411a, 411b 2nd steel plate 412 Second Elastic Member 413 Second adhesive member 100 Stacked Electronic Components 110 Main Unit 111 Dielectric layer 112, 113 Cover section 114, 115 Margin section 121, 122 Internal electrode 131, 132 External electrode

Claims

1. The step of providing a ceramic green sheet on which an internal electrode pattern has been formed, The steps include: stacking the aforementioned ceramic green sheets in a first direction to form a laminated ceramic green sheet; When the direction perpendicular to the first direction is designated as the second direction, and the directions perpendicular to the first and second directions are designated as the third direction, the multilayer ceramic green sheet is cut so that the internal electrode pattern is exposed in the third direction, thereby providing the green body. The steps include: attaching a margin green sheet to the green body in the third direction under the first step conditions; The step includes performing a punching process on the green body to which the margin green sheet is attached, under second process conditions, A method for manufacturing a laminated electronic component, wherein, after the punching step, the margin green sheet has a structure in which it is extended and arranged on at least one of the two surfaces of the green body in the first direction and the two surfaces in the second direction.

2. The method for manufacturing a stacked electronic component according to claim 1, wherein the first and second process conditions are pressure conditions that are different from each other.

3. The method for manufacturing a stacked electronic component according to claim 1, wherein the first and second process conditions are temperature conditions that are different from each other.

4. The method for manufacturing a stacked electronic component according to claim 1, wherein the first step condition includes applying a pressure condition of 0.1 tons or more and 1.2 tons or less.

5. The method for manufacturing a stacked electronic component according to claim 1, wherein the first step condition includes adding a temperature condition of 60°C to 120°C.

6. The step of attaching the margin green sheet is as follows: This is done by pressing the green body onto a steel plate, an elastic member placed on the steel plate, and a margin green sheet placed on the elastic member. The method for manufacturing a laminated electronic component according to claim 1, wherein the elastic member includes a soft elastomer.

7. The method for manufacturing a laminated electronic component according to claim 6, wherein the soft elastomer has an elastic modulus exceeding 50 MPa.

8. The method for manufacturing a laminated electronic component according to claim 6, wherein the soft elastomer comprises at least one of natural rubber, neoprene rubber, silicone rubber, polyurethane, EPDM (Ethylene Propylene Diene Monomer), SBR (Styrene-Butadiene Rubber), polybutadiene, and thermoplastic elastomer.

9. The method for manufacturing a stacked electronic component according to any one of claims 1 to 8, wherein the second step condition includes applying a pressure condition of 5 tons or more and 12 tons or less.

10. The method for manufacturing a stacked electronic component according to any one of claims 1 to 8, wherein the second step condition includes adding a temperature condition of 20°C or more and 60°C or less.

11. The step of providing a ceramic green sheet on which an internal electrode pattern has been formed, The steps include: stacking the aforementioned ceramic green sheets in a first direction to form a laminated ceramic green sheet; When the direction perpendicular to the first direction is designated as the second direction, and the directions perpendicular to the first and second directions are designated as the third direction, the multilayer ceramic green sheet is cut so that the internal electrode pattern is exposed in the third direction, thereby providing the green body. The steps include: attaching a margin green sheet to the green body in the third direction under the first step conditions; The step includes performing a punching process on the green body to which the margin green sheet is attached, under second process conditions, The first process conditions include adding pressure conditions of 0.1 tons or more and 1.2 tons or less, and temperature conditions of 60°C or more and 120°C or less. A method for manufacturing a stacked electronic component, wherein the second step conditions include adding a pressure condition of 5 tons or more and 12 tons or less, and a temperature condition of 20°C or more and 60°C or less.

12. The method for manufacturing a laminated electronic component according to claim 11, wherein, after the step of performing the punching step, the margin green sheet has a structure in which it is extended and arranged on at least one of the two surfaces of the green body in the first direction and the two surfaces in the second direction.

13. The step of attaching the margin green sheet is as follows: This is done by pressing the green body onto a steel plate, an elastic member placed on the steel plate, and a margin green sheet placed on the elastic member. The method for manufacturing a laminated electronic component according to claim 11 or 12, wherein the elastic member includes a soft elastomer.

14. The method for manufacturing a laminated electronic component according to claim 13, wherein the soft elastomer has an elastic modulus exceeding 50 MPa.

15. The method for manufacturing a laminated electronic component according to claim 13, wherein the soft elastomer comprises at least one of natural rubber, neoprene rubber, silicone rubber, polyurethane, EPDM (Ethylene Propylene Diene Monomer), SBR (Styrene-Butadiene Rubber), polybutadiene, and thermoplastic elastomer.

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