Multilayer electronic components

Abstract

To provide a multilayer electronic component that offers excellent reliability and can suppress crack generation due to arc discharge and electrostrictive phenomena. [Solution] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and internal electrodes arranged alternately with the dielectric layer in the thickness direction, and comprises a body including first and second faces facing each other in the thickness direction, third and fourth faces connected to the first and second faces and facing each other in the length direction, and fifth and sixth faces connected to the first, second, third, and fourth faces and facing each other in the width direction, a first external electrode arranged on the third face, and a second external electrode arranged on the fourth face, wherein a center external electrode is arranged on one or more of the first and second faces of the body, spaced apart from the first external electrode, the second external electrode and the internal electrodes, and when the length of the stacked electronic component is L and the length of the center external electrode is CL, CL / L can be 0.10 or more and 0.35 or less.

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays the role of charging or discharging electricity.

[0003] Multilayer ceramic capacitors offer the advantages of being small yet guaranteeing high capacitance and being easy to mount, making them suitable for use as components in various electronic devices. As computers, mobile devices, and other electronic equipment become smaller and more powerful, the demand for smaller and / or higher-capacitance multilayer ceramic capacitors is increasing.

[0004] Because high-voltage MLCCs have significantly higher rated voltages than general MLCCs, their reliability is evaluated based on these higher voltages.

[0005] In the case of high-voltage MLCCs, high voltage application and use in humid environments can sometimes cause arc discharge, where the potential difference between the external electrodes temporarily induces dielectric breakdown via gas. Such arc discharge reduces the reliability of the MLCC.

[0006] Attempts have been made to ensure reliability at high voltages by increasing the thickness of the dielectric layer or modifying the pattern design of the internal electrodes. However, attempts to ensure reliability at high voltages by modifying the design of the external electrodes are relatively few.

[0007] Therefore, there is a need for the development of multilayer electronic components that can ensure reliability at high voltages by modifying the design of the external electrodes. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Japanese Patent Publication No. 2016-195236 [Overview of the project] [Problems that the invention aims to solve]

[0009] One of the various objectives of the present invention is to provide a highly reliable stacked electronic component.

[0010] One of the various objectives of the present invention is to provide a multilayer electronic component that can suppress arc discharge.

[0011] One of the various objectives of the present invention is to provide a multilayer electronic component that can suppress crack generation due to electrostrictive phenomena.

[0012] However, the objectives of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0013] A multilayer electronic component according to an embodiment of the present invention includes dielectric layers and internal electrodes alternately arranged with the dielectric layers in a thickness direction, a main body including a first surface and a second surface facing each other in the thickness direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a length direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and facing each other in a width direction, a first external electrode disposed on the third surface, and a second external electrode disposed on the fourth surface, wherein a center external electrode spaced apart from the first external electrode, the second external electrode and the internal electrodes is disposed on at least one of the first surface and the second surface of the main body, and when a length of the multilayer electronic component is L and a length of the center external electrode is CL, CL / L may be 0.10 or more and 0.35 or less.

Effects of the Invention

[0014] As one of various effects of the present invention, a multilayer electronic component with excellent reliability can be provided.

[0015] As one of various effects of the present invention, arc discharge can be suppressed even in a high-voltage use environment.

[0016] As one of various effects of the present invention, occurrence of cracks due to electrostriction can be suppressed.

[0017] However, the various and significant advantages and effects of the present invention are not limited to the above description, and can be more easily understood in the process of describing specific embodiments of the present invention.

Brief Description of Drawings

[0018] [Figure 1] This is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention. [Figure 2] This is a schematic cross-sectional view taken along the line I-I' in FIG. 1. [Figure 3] This is a schematic cross-sectional view taken along the line II-II' in FIG. 1. [Figure 4]This is a disassembled view of the main unit shown in Figure 1. [Figure 5] This is a schematic perspective view of a stacked electronic component according to one modified example of the present invention. [Figure 6] This is a schematic cross-sectional view along the line III-III' in Figure 5. [Figure 7] Figure 1 shows a cross-sectional view of a circuit board on which the multilayer electronic components are mounted. [Figure 8] This is a diagram illustrating the effect of suppressing volume expansion due to electrostrictive phenomena according to the example invention. [Figure 9] This is a diagram illustrating volume expansion due to electrostriction in the comparative example. [Modes for carrying out the invention]

[0019] Embodiments of the present invention will be described below with reference to specific embodiments and accompanying drawings. However, embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person of the ordinary skill. Accordingly, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0020] Furthermore, in order to clearly illustrate the present invention in the drawings, parts unrelated to the description have been omitted, and the size and thickness of each component shown are arbitrarily indicated for the convenience of explanation; therefore, the present invention is not necessarily limited by the illustrations. Also, components with the same function within the scope of the same concept are described using the same reference numerals. Moreover, throughout the specification, when a part "includes" a certain component, unless otherwise stated to the contrary, it does not mean that other components are excluded, but rather that other components may be further included.

[0021] In drawings, the X direction can be defined as the first direction, the lamination direction, or the thickness (T) direction; the Y direction as the second direction or the length (L) direction; and the Z direction as the third direction or the width (W) direction.

[0022] Multilayer electronic components Figure 1 shows a schematic perspective view of a stacked electronic component according to one embodiment of the present invention, Figure 2 shows a schematic cross-sectional view along the line I-I' in Figure 1, Figure 3 shows a schematic cross-sectional view along the line II-II' in Figure 1, and Figure 4 shows the main body of Figure 1 disassembled.

[0023] The following describes in detail a multilayer electronic component 100 according to one embodiment of the present invention with reference to Figures 1 to 4. While a multilayer ceramic capacitor (MLCC) will be described as an example of a multilayer electronic component, the present invention is not limited to this and can be applied to various multilayer electronic components using ceramic materials, such as inductors, piezoelectric elements, varistors, or thermistors.

[0024] A stacked electronic component 100 according to one embodiment of the present invention includes a dielectric layer 111 and internal electrodes 121, 122 arranged alternately with the dielectric layer in the thickness direction, and comprises a body 110 including a first surface 1 and a second surface 2 facing each other in the thickness direction, a third surface 3 and a fourth surface 4 connected to the first and second surfaces and facing each other in the length direction, and a fifth surface 5 and a sixth surface 6 connected to the first, second, third, and fourth surfaces and facing each other in the width direction, and a first external electrode 131 arranged on the third surface and a second external electrode 132 arranged on the fourth surface, wherein a center external electrode 140 is arranged on one or more of the first and second surfaces of the body, spaced apart from the first external electrode, the second external electrode and the internal electrodes, and when the length of the stacked electronic component is L and the length of the center external electrode is CL, CL / L may be 0.10 or more and 0.35 or less.

[0025] The following describes each component included in the stacked electronic component 100 according to one embodiment of the present invention.

[0026] The main body 110 may have dielectric layers 111 and internal electrodes 121 and 122 stacked alternately.

[0027] There are no particular restrictions on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be hexahedral or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 is not a perfectly straight hexahedron, but can be substantially hexahedral.

[0028] The main body 110 may have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2 and connected to the third surface 3 and the fourth surface 4 and facing each other in a third direction.

[0029] As margin regions where internal electrodes 121 and 122 are not placed overlap on the dielectric layer 111, steps are created due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface and the third to fifth surfaces and / or the second surface and the third to fifth surfaces may have a shape that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, due to the contraction behavior during the sintering process of the main body, the corners connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, and 6 and / or the corners connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, and 6 may have a shape that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, to prevent chipping defects, the corners connecting each surface of the main body 110 can be rounded by performing a separate process to round the corners connecting the first surface with the third to sixth surfaces and / or the corners connecting the second surface with the third to sixth surfaces.

[0030] On the other hand, in order to suppress steps formed by the internal electrodes 121 and 122, after cutting such that the internal electrodes after lamination are exposed at the fifth surface 5 and the sixth surface 6 of the main body, when a single dielectric layer or two or more dielectric layers are laminated on both side surfaces of the capacitance forming portion Ac in the third direction (width direction) to form side margin portions 114 and 115, the portion connecting the first surface to the fifth surface and the sixth surface and the portion connecting the second surface to the fifth surface and the sixth surface may not have a contracted shape.

[0031] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM). The number of laminated dielectric layers does not need to be particularly limited, and can be determined in consideration of the size of the multilayer electronic component. For example, the main body can be formed by laminating 400 or more dielectric layers.

[0032] The dielectric layer 111 can be formed by: producing a ceramic slurry containing ceramic powder, an organic solvent and a binder; applying the slurry onto a carrier film and drying the slurry to form a ceramic green sheet; and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as a sufficient capacitance can be obtained. For example, a barium titanate (BaTiO3) based powder can be used as the ceramic powder. To give more specific examples, the ceramic powder may be barium titanate (BaTiO3) based powder, paraelectric powder based on CaZrO3, or the like. To give more specific examples, the barium titanate (BaTiO3) based powder includes BaTiO3, (Ba 1-x Ca x )TiO3(0<x<1), Ba(Ti 1-y Ca y )O3(0<y<1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3(0<x<1, 0<y<1) and Ba(Ti 1-y Zr y)O3, wherein 0<y<1, and the paraelectric powder based on CaZrO3 may be (Ca 1-x Sr x )(Zr 1-y Ti y )O3, wherein 0<x<1 and 0<y<1.

[0033] Accordingly, the dielectric layer 111 may include one or more selected from BaTiO3, (Ba 1-x Ca x )TiO3, wherein 0<x<1, Ba(Ti 1-y Ca y )O3, wherein 0<y<1, (Ba 1-x Ca x )(Ti 1-y Zr y )O3, wherein 0<x<1 and 0<y<1, Ba(Ti 1-y Zr y )O3, wherein 0<y<1, and (Ca 1-x Sr x )(Zr 1-y Ti y )O3, wherein 0<x<1 and 0<y<1. In one embodiment, the dielectric layer 111 may contain (Ca 1-x Sr x )(Zr 1-y Ti y )O3, wherein 0<x<1 and 0<y<1, as a main component.

[0034] The main body 110 includes a capacitance forming part Ac which is disposed inside the main body 110 and has a capacitance formed by including a first internal electrode 121 and a second internal electrode 122 disposed to face each other with the dielectric layer 111 interposed therebetween, and cover parts 112 and 113 formed at upper and lower parts in a first direction of the capacitance forming part Ac.

[0035] Further, the capacitance forming part Ac, as a part contributing to capacitance formation of a capacitor, can be formed by repeatedly laminating a plurality of first internal electrodes 121 and second internal electrodes 122 with the dielectric layer 111 interposed therebetween.

[0036] The cover portions 112 and 113 may include an upper cover portion 112 positioned above the volume-forming portion Ac in the first direction and a lower cover portion 113 positioned below the volume-forming portion Ac in the first direction.

[0037] The upper cover portion 112 and the lower cover portion 113 described above can be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, respectively, and can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0038] The upper cover portion 112 and the lower cover portion 113 described above do not include internal electrodes and may contain the same material as the dielectric layer 111.

[0039] In other words, the upper cover portion 112 and the lower cover portion 113 may include a ceramic material, for example, a barium titanate (BaTiO3) based ceramic material.

[0040] On the other hand, the thickness of the cover portions 112 and 113 is not particularly limited. For example, in order to achieve miniaturization and high capacitance of the stacked electronic component, the thickness tc of the cover portions 112 and 113 may be 15 μm or less.

[0041] The average thickness tc of the cover portions 112 and 113 can represent the size in the first direction, and may be the average value of the sizes of the cover portions 112 and 113 in the first direction measured at five equally spaced points on the upper or lower part of the volume forming portion Ac.

[0042] Furthermore, margin portions 114 and 115 can be arranged on the side surface of the volume-forming portion Ac.

[0043] The margin portions 114 and 115 may include a first margin portion 114 located on the fifth surface 5 of the main body 110 and a second margin portion 115 located on the sixth surface 6. That is, the margin portions 114 and 115 can be located on both end surfaces in the width direction of the ceramic main body 110.

[0044] The margin portions 114 and 115 can refer to the regions between the interface between both ends of the first internal electrode 121 and the second internal electrode 122 and the body 110 in a cross-section obtained by cutting the body 110 in the width-thickness (WT) direction.

[0045] The margins 114 and 115 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0046] The margin portions 114 and 115 may be formed by applying conductive paste to the ceramic green sheet, except where the margin portions are formed, to form internal electrodes.

[0047] Furthermore, in order to suppress the step caused by the internal electrodes 121 and 122, after cutting the laminated internal electrodes so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, a single dielectric layer or two or more dielectric layers can be laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115.

[0048] On the other hand, the width of the margin portions 114 and 115 does not need to be particularly limited. For example, in order to achieve miniaturization and high capacitance of the stacked electronic component, the average width of the margin portions 114 and 115 may be 15 μm or less.

[0049] The average width of the margin portions 114 and 115 can represent the average size MW1 in the third direction of the region where the internal electrodes are separated from the fifth surface and the average size MW2 in the third direction of the region where the internal electrodes are separated from the sixth surface, and can be the average value of the sizes of the margin portions 114 and 115 in the third direction measured at five equally spaced points on the side surface of the capacitance forming portion Ac.

[0050] Therefore, in one embodiment, the average size MW1 and MW2 in the third direction of the region where the internal electrodes 121 and 122 are separated from the fifth and sixth surfaces may be 15 μm or less, respectively.

[0051] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are arranged alternately so as to face each other across the dielectric layer 111 that constitutes the main body 110, and can be exposed on the third surface 3 and the fourth surface 4 of the main body 110, respectively.

[0052] The first internal electrode 121 is separated from the fourth surface 4 and exposed via the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed via the fourth surface 4. The first external electrode 131 is positioned on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 is positioned on the fourth surface 4 of the main body and can be connected to the second internal electrode 122.

[0053] In other words, the first internal electrode 121 is not connected to the second external electrode 132, but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131, but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance apart on the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance apart on the third surface 3. Furthermore, the first internal electrode 121 and the second internal electrode 122 may be arranged at a distance from the fifth and sixth surfaces of the main body 110.

[0054] The conductive metals contained in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, W, Ti, and alloys thereof, but the present invention is not limited thereto.

[0055] The average thickness td of the dielectric layer 111 does not need to be particularly limited, but can be, for example, 0.1 μm to 10 μm. The average thickness te of the internal electrodes 121 and 122 does not need to be particularly limited, but can be, for example, 0.05 μm to 3.0 μm. Furthermore, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be arbitrarily set according to the desired characteristics and application. For example, in the case of electronic components for high-voltage electrical equipment to achieve miniaturization and high capacitance, the average thickness td of the dielectric layer 111 can be less than 2.8 μm, and the average thickness te of the internal electrodes 121 and 122 can be less than 1 μm. Also, in the case of electronic components for small IT to achieve miniaturization and high capacitance, the average thickness td of the dielectric layer 111 can be 0.4 μm or less, and the average thickness te of the internal electrodes 121 and 122 can be 0.4 μm or less.

[0056] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 refer to the dimensions of the dielectric layer 111 and the internal electrodes 121 and 122 in the first direction, respectively. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average thickness td of the dielectric layer 111 can be measured by taking the average value of the thickness at multiple points on one dielectric layer 111, for example, 30 points equally spaced in the second direction. Similarly, the average thickness te of the internal electrodes 121 and 122 can be measured by taking the average value of the thickness at multiple points on one internal electrode 121 or 122, for example, 30 points equally spaced in the second direction. The 30 equally spaced points can be specified in the capacitance forming section Ac. On the other hand, if such average values ​​are measured for 10 dielectric layers 111 and 10 internal electrodes 121 and 122, and then the average values ​​are measured, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be further generalized.

[0057] The first external electrode 131 may be placed on the third surface 3 of the main body 110, and the second external electrode 132 may be placed on the fourth surface 4 of the main body 110.

[0058] The first external electrode 131 can be connected to the first internal electrode 121, and the second external electrode 132 can be connected to the second internal electrode 122.

[0059] The center external electrode 140 can be positioned on one or more of the first surface 1 and second surface 2 of the main body 110, spaced apart from the first external electrode 131, the second external electrode 132, and the internal electrodes 121 and 122. When the length of the stacked electronic component is L and the length of the center external electrode is CL, CL / L can be between 0.10 and 0.35. This suppresses arc discharge and cracks caused by electrostrictive phenomena.

[0060] The center external electrode 140 is positioned on one or more of the first and second surfaces, and is positioned at a distance from the first and second external electrodes, so that it is positioned between the first and second external electrodes and can absorb the current flow due to arc discharge that may occur between the first and second external electrodes, thereby suppressing arc discharge. Also, referring to Figure 7, the multilayer electronic component 100 is mounted on the substrate 210, and the first external electrode 131, the second external electrode 132, and the center external electrode 140 can be joined to the first pad 211, the second pad 212, and the third pad 213, respectively, via solder Sd. The center external electrode 140 can be grounded via the third pad 213, so that the absorbed current flow e can be discharged through grounding.

[0061] Furthermore, since the center external electrode 140 is positioned at a distance from the first external electrode 131, the second external electrode 132, and the internal electrodes 121 and 122, it can be made to have no effect whatsoever on the function of the capacitor of the multilayer electronic component.

[0062] Furthermore, by arranging the center external electrode 140 on one or more of the first surface 1 and second surface 2 of the main body 110, volume expansion of the main body due to electrostrictive phenomena can be suppressed, and the occurrence of cracks due to electrostrictive phenomena can be suppressed.

[0063] Referring to Figure 9, when a voltage is applied to a typical MLCC 10', an internal electric field is generated, and electrostrictive stress F1 may be generated in the stacking direction between the internal electrodes and the dielectric layer due to deformation such as contraction or expansion of the dielectric layer. As a result, the main body 110 expands in the stacking direction, and strong electrostrictive stress F1 is applied to the first surface 1 and the second surface 2 of the main body, which may cause cracks to occur.

[0064] On the other hand, referring to Figure 8, in one embodiment of the present invention, the center external electrode 140 is arranged on one or more of the first surface 1 and second surface 2 of the main body 110, so that a stress F2 can be applied in the opposite direction to the electrostrictive stress F1, thereby suppressing cracks caused by the electrostrictive phenomenon.

[0065] When the length of the stacked electronic component is L and the length of the center external electrode is CL, the suppression of crack generation due to electrostrictive phenomena and the suppression of arc discharge of the present invention can be further improved by satisfying CL / L as 0.10 or more and 0.35 or less.

[0066] If CL / L is less than 0.10, it may indicate that the current flow due to arc discharge cannot be adequately absorbed, or that the effect of suppressing crack formation due to electrostriction is insufficient.

[0067] On the other hand, if CL / L exceeds 0.35, it becomes difficult to adequately secure the band portions P1b and P2b of the first and second external electrodes, which may reduce moisture resistance reliability.

[0068] Here, the length L of the multilayer electronic component can mean the maximum length of the multilayer electronic component measured in the length-thickness cross section (LT cross section) cut at the center in the width direction, and the length CL of the center external electrode can mean the maximum length of the center external electrode 140 measured in the length-thickness cross section (LT cross section) mentioned above.

[0069] In one embodiment, the first external electrode 131 and the second external electrode 132 may include band portions P1b and P2b that extend and are arranged on parts of the first and second surfaces, respectively.

[0070] Referring to Figure 2, the length of the band portion of the first external electrode can be defined as BW1, which is the length from the end BE1 of the band portion of the first external electrode to the outermost edge OE1 of the first external electrode, and the length of the band portion of the second external electrode can be defined as BW2, which is the length from the end BE2 of the band portion of the second external electrode to the outermost edge OE2 of the second external electrode. The length of the band portion of the first external electrode BW1 and the length of the band portion of the second external electrode BW2 may be substantially the same, but are not limited to this, and may have an error of about 10%.

[0071] In one embodiment, when GL is the distance between the end BE1 of the band portion of the first external electrode 131 and the end BE2 of the band portion of the second external electrode 132, GL / L may be 0.50 or less.

[0072] This is because, if the GL / L exceeds 0.50, arc discharge may not occur, and therefore, even without the center external electrode 140, a decrease in reliability due to arc discharge may not occur.

[0073] More preferably, the above GL / L may be 0.47 or less.

[0074] In one embodiment, when GL is the distance between the end BE1 of the band portion of the first external electrode and the end BE2 of the band portion of the second external electrode, GL may be 1500 μm or less.

[0075] This is because, when the GL exceeds 1500 μm, the probability of arc discharge not occurring is relatively high, and therefore, even without the center external electrode 140, a decrease in reliability due to arc discharge may not occur.

[0076] In one embodiment, when the thickness of the center external electrode 140 is defined as CT, the CT may be 10 μm or more. This further improves the suppression of crack generation due to electrostrictive phenomena and the suppression of arc discharge in the present invention. The upper limit of CT is not particularly limited and may be, for example, 80 μm or less.

[0077] In one embodiment, the multilayer electronic component 100 may have a rated voltage of 250V or higher. That is, the multilayer electronic component 100 may be a high-voltage MLCC.

[0078] This is because, in operating environments with a voltage of less than 250V, the probability of arc discharge occurring is relatively low, and therefore, even without the center external electrode 140, a decrease in reliability due to arc discharge may not occur.

[0079] Furthermore, according to one embodiment of the present invention, reliability can be ensured even in operating environments where the applied voltage is 1kV or higher.

[0080] In one embodiment, L may be 3.3 mm or less. When L is 3.3 mm or less, the distance GL between the end BE1 of the band portion of the first external electrode and the end BE2 of the band portion of the second external electrode decreases, increasing the probability of arc discharge occurring. Therefore, the effect of the center external electrode 140 of the present invention in absorbing the current flow due to arc discharge may become more pronounced.

[0081] In one embodiment, the center external electrode 140 can be arranged on both the first and second surfaces. As shown in Figures 1 to 3, the center external electrode 140 may include a first center external electrode 141 arranged on the first surface and a second center external electrode 142 arranged on the second surface.

[0082] By placing the center external electrodes 141 and 142 on both the first and second surfaces, the effect of suppressing electrostrictive stress F1 can be further improved.

[0083] On the other hand, the center external electrode 140 can be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc. Furthermore, it can have a multilayer structure.

[0084] For example, the center external electrode 140 may include center electrode layers 141a, 142a arranged on the main body 110 and center plating layers 141b, 142b formed on the center electrode layers 141a, 142a.

[0085] To give a more specific example for the center electrode layers 141a and 142a, the center electrode layers 141a and 142a may be firing electrodes containing a conductive metal and glass, or resin-based electrodes containing a conductive metal and resin.

[0086] Furthermore, the center electrode layers 141a and 142a may be formed in a manner in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Also, the center electrode layers 141a and 142a may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto the fired electrode.

[0087] The conductive metal contained in the center electrode layers 141a and 142a can be any material with excellent electrical conductivity, but is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys.

[0088] The center plating layers 141b and 142b play a role in improving mounting characteristics. The type of center plating layers 141b and 142b is not particularly limited and may be plating layers containing one or more of Ni, Sn, Pd, and their alloys, and may be formed in multiple layers.

[0089] To give a more specific example of the center plating layers 141b and 142b, the center plating layers 141b and 142b may be Ni plating layers or Sn plating layers, and may be in a form in which Ni plating layers and Sn plating layers are formed sequentially on the center electrode layers 141a and 142a, or may be in a form in which Sn plating layers, Ni plating layers and Sn plating layers are formed sequentially. Furthermore, the center plating layers 141b and 142b may include multiple Ni plating layers and / or multiple Sn plating layers.

[0090] In one embodiment, the center external electrode 140 may include center electrode layers 141a and 142a containing a conductive metal and glass, in contact with the main body 110. In this case, the center external electrode 140 may further include center plating layers 141b and 142b disposed on the center electrode layers 141a and 142a.

[0091] On the other hand, the external electrodes 131 and 132, like the center external electrode 140, can be formed using any material that has electrical conductivity, such as a metal. The specific material can be determined by considering electrical properties, structural stability, etc., and they can also have a multilayer structure. However, the external electrodes 131 and 132 do not need to have the same material and structure as the center external electrode 140; they can have different materials and structures from the center external electrode 140.

[0092] For example, the external electrodes 131 and 132 may include electrode layers 131a and 132a placed on the main body 110, and plating layers 131b and 132b formed on the electrode layers 131a and 132a. The center external electrode 140 may include center electrode layers 141a and 142a placed on the main body 110, and center plating layers 141b and 142b formed on the center electrode layers 141a and 142a.

[0093] To give a more specific example for the electrode layers 131a and 132a, the electrode layers 131a and 132a may be firing electrodes containing a conductive metal and glass, or resin-based electrodes containing a conductive metal and resin.

[0094] Furthermore, the electrode layers 131a and 132a may be formed in a manner in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Also, the electrode layers 131a and 132a may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0095] The conductive metal contained in the electrode layers 131a and 132a can be any material with excellent electrical conductivity, and is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys.

[0096] The plating layers 131b and 132b play a role in improving mounting characteristics. The types of plating layers 131b and 132b are not particularly limited and may be plating layers containing one or more of Ni, Sn, Pd, and their alloys, and may be formed in multiple layers.

[0097] To give a more specific example for the plating layers 131b and 132b, the plating layers 131b and 132b may be Ni plating layers or Sn plating layers, and may be in a form in which Ni plating layers and Sn plating layers are formed sequentially on the electrode layers 131a and 132a, or may be in a form in which Sn plating layers, Ni plating layers and Sn plating are formed sequentially. Furthermore, the plating layers 131b and 132b may include multiple Ni plating layers and / or multiple Sn plating layers.

[0098] The size of the multilayer electronic component 100 is not particularly limited. For example, the size of the multilayer electronic component 100 may be 0201 (length x width, 0.2 mm x 0.1 mm), 0603 (length x width, 0.6 mm x 0.3 mm), 1005 (length x width, 1.0 mm x 0.5 mm), 2012 (length x width, 2.0 mm x 1.2 mm), 3216 (length x width, 3.2 mm x 1.6 mm), 3225 (length x width, 3.2 mm x 2.5 mm), etc.

[0099] On the other hand, the configuration of the center external electrodes 141 and 142 is not limited to the configurations shown in Figures 1 to 3.

[0100] Figure 5 schematically shows a perspective view of a stacked electronic component 100' according to one modified example of the present invention. Figure 6 schematically shows a cross-sectional view along the line III-III' in Figure 5. Referring to Figures 5 and 6, the center external electrode 140' of the stacked electronic component 100' according to one modified example of the present invention can be arranged to surround the first, second, fifth, and sixth surfaces of the main body. This allows the center external electrode 140' to be fixed to the main body even more firmly, thereby further improving the effect of suppressing electrostrictive stress F1.

[0101] (Example of experiment) After fabricating sample chips to meet the requirements of Table 1 below, their moisture resistance reliability was evaluated. BW1 and BW2 were fabricated in the same manner, and in Table 1 below, BW refers to BW1 and BW2.

[0102] Humidity resistance reliability was assessed by applying a 1kV voltage to a sample chip mounted on a substrate at a temperature of 85°C and relative humidity of 85%. If the insulation resistance value decreased to 1 / 100 or less of the initial value, the elapsed time (hr) after voltage application was recorded. If the insulation resistance value remained above 1 / 100 of the initial value for 1000 hours after applying a 1kV voltage, it was marked as PASS.

[0103] [Table 1]

[0104] Referring to Table 1, it can be confirmed that comparative examples 1 and 2, which lack a center external electrode, exhibited degraded moisture resistance reliability. This can be interpreted as the occurrence of electrostrictive cracks or radiative cracks due to prolonged use under high voltage (1kV), resulting in a decrease in insulation resistance.

[0105] Examples 1 to 11 satisfy the CL / L requirement of 0.10 to 0.35, and it can be confirmed that they have excellent moisture resistance reliability.

[0106] On the other hand, in Comparative Examples 3 to 6, although a central external electrode was placed, the CL / L ratio could not be satisfied with 0.10 to 0.35, confirming that the moisture resistance reliability deteriorated.

[0107] Although embodiments of the present invention have been described in detail above, the present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims provided. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0108] Furthermore, the expression "one embodiment" as used in this disclosure does not mean that each embodiment is identical to the others, but is provided to highlight and describe the unique and distinct features of each embodiment. However, the present embodiments are not excluded from being realized in combination with features of other embodiments. For example, even if a matter described in one embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description in the other embodiment that contradicts or is inconsistent with that matter.

[0109] The terms used in this disclosure are used solely to describe one embodiment and are not intended to limit the disclosure. Where otherwise, singular expressions include plural expressions unless the context clearly indicates otherwise. [Explanation of Symbols]

[0110] 100 Stacked Electronic Components 110 Main Unit 111 Dielectric layer 112, 113 Cover section 114, 115 Margin section 121, 122 Internal electrode 131, 132 External electrode 131a, 132a electrode layer 131b, 132b Plating layer 140 Center external electrode

Claims

1. It includes a dielectric layer and internal electrodes arranged alternately with the dielectric layer in the thickness direction, A body including a first and second surface facing each other in the thickness direction, a third and fourth surface connected to the first and second surfaces and facing each other in the length direction, and a fifth and sixth surface connected to the first, second, third, and fourth surfaces and facing each other in the width direction, The first external electrode is arranged on the third surface, A stacked electronic component including a second external electrode arranged on the fourth surface, A center external electrode is positioned on one or more of the first and second surfaces of the main body, spaced apart from the first external electrode, the second external electrode, and the internal electrode. A multilayer electronic component in which, when the length of the multilayer electronic component is L and the length of the center external electrode is CL, CL / L is 0.10 or more and 0.35 or less.

2. The stacked electronic component according to claim 1, wherein the first external electrode and the second external electrode each include a band portion that extends to a part of the first surface and a part of the second surface, respectively.

3. When GL is the distance between the end of the band portion of the first external electrode and the end of the band portion of the second external electrode, The stacked electronic component according to claim 2, wherein the GL / L is 0.50 or less.

4. The stacked electronic component according to claim 3, wherein the GL / L is 0.47 or less.

5. When GL is the distance between the end of the band portion of the first external electrode and the end of the band portion of the second external electrode, The stacked electronic component according to claim 2, wherein GL is 1500 μm or less.

6. The stacked electronic component according to claim 1, wherein the thickness of the center external electrode is CT, and CT is 10 μm or more.

7. The stacked electronic component according to claim 1, wherein the stacked electronic component has a rated voltage of 250V or more.

8. The stacked electronic component according to claim 1, wherein L is 3.3 mm or less.

9. The stacked electronic component according to claim 1, wherein the center external electrode is arranged on all of the first and second surfaces.

10. The stacked electronic component according to claim 1, wherein the center external electrode is arranged to surround the first surface, the second surface, the fifth surface, and the sixth surface.

11. The stacked electronic component according to any one of claims 1 to 10, wherein the center external electrode is in contact with the main body and includes a center electrode layer comprising a conductive metal and glass.

12. The stacked electronic component according to claim 11, wherein the center external electrode further comprises a center plating layer disposed on the center electrode layer.

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