Multilayer electronic components

Abstract

To provide a stacked electronic component that allows for easy differentiation of the stacking direction of internal electrodes. [Solution] The stacked electronic component includes a dielectric layer 111 and internal electrodes 121 arranged alternately in the thickness direction. The second surface 2 further includes a pattern including a first side portion 141 and a second side portion 142 arranged at one end in the length direction, and a connecting portion 143 connecting them, and external electrodes arranged on the third surface 3 and the fourth surface 4. The width Wh1 of the first side portion and the width Wh2 of the second side portion are wider than the width Wh3 of the connecting portion, and the lengths Lh1 and Lh2 of the first and second side portions are shorter than the length Lh3 of the connecting portion.

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as liquid crystal displays (LCDs), plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays the role of charging or discharging electricity.

[0003] MLCCs have a structure in which dielectric layers and internal electrodes are stacked alternately in parallel within the main body. When mounting MLCCs on a substrate, the high-frequency impedance, noise, and reliability characteristics may change depending on whether the stacking direction of the internal electrodes is parallel or perpendicular to the mounting surface. Therefore, a method is needed that allows for easy determination of the stacking direction of the internal electrodes.

[0004] Furthermore, as the operating environment for MLCCs becomes increasingly harsh, there is a growing need to improve the bending strength of MLCCs to suppress issues such as substrate warping and crack formation due to external impacts. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2020-072136 [Overview of the project] [Problems that the invention aims to solve]

[0006] One of the various objectives of the present invention is to provide a stacked electronic component that allows for easy differentiation of the stacking direction of internal electrodes.

[0007] One of the various objectives of the present invention is to provide a multilayer electronic component with improved bending strength.

[0008] However, the object of the present invention is not limited to the above-described content and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0009] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and internal electrodes arranged alternately with the dielectric layer in the thickness direction, and comprises a body including first and second surfaces facing each other in the thickness direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the length direction, fifth and sixth surfaces connected to the first, second, third and fourth surfaces and facing each other in the width direction, a pattern including a first side portion arranged at one end of the second surface in the length direction, a second side portion arranged at the other end of the second surface in the length direction, and a connecting portion connecting the first side portion and the second side portion, and external electrodes arranged on the third and fourth surfaces, wherein the width of the first and second side portions may be wider than the width of the connecting portion, and the length of the first and second side portions may be shorter than the length of the connecting portion. [Effects of the Invention]

[0010] One of the various effects of the present invention is that by arranging a pattern on the second surface of the main body, the stacking direction of the internal electrodes can be easily distinguished.

[0011] One of the various effects of this invention is that it can improve the bending strength of multilayer electronic components.

[0012] However, the diverse and beneficial advantages and effects of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Brief explanation of the drawing]

[0013] [Figure 1] It is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention. [Figure 2] It is a perspective view shown with external electrodes removed from FIG. 1. [Figure 3] It is a schematic sectional view taken along line I-I' of FIG. 1. [Figure 4] It is a schematic sectional view taken along line II-II' of FIG. 1. [Figure 5] It is an exploded schematic view of a main body. [Figure 6] It is a drawing corresponding to FIG. 2 according to an embodiment of the present invention. [Figure 7] It is a drawing corresponding to FIG. 2 according to another embodiment of the present invention. DETAILED DESCRIPTION OF EMBODIMENTS

[0014] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be exaggerated for clearer description, and elements denoted by the same reference numerals in the drawings are the same elements.

[0015] In order to clearly describe the present invention in the drawings, portions unrelated to the description are omitted. The sizes and thicknesses of each component shown in the drawings are arbitrarily shown for convenience of description, so the present invention is not necessarily limited to what is illustrated. Constituent elements having the same function within the scope of the same idea are described using the same reference numerals. Furthermore, throughout the specification, when a portion "comprises" a certain constituent element, this does not exclude other constituent elements unless specifically stated to the contrary, and means that the portion can further include other constituent elements.

[0016] In the drawings, the X direction can be defined as a first direction, a lamination direction or a thickness (T) direction, the Y direction can be defined as a second direction or a length (L) direction, and the Z direction can be defined as a third direction or a width (W) direction.

[0017] Multilayer electronic component Fig. 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention, Fig. 2 is a perspective view of Fig. 1 with external electrodes omitted, Fig. 3 is a schematic cross-sectional view taken along line I-I' of Fig. 1, Fig. 4 is a schematic cross-sectional view taken along line II-II' of Fig. 1, and Fig. 5 is a schematic exploded view of a main body.

[0018] Hereinafter, a multilayer electronic component 100 according to an embodiment of the present invention will be described in detail with reference to Figs. 1 to 5. Further, although a multi-layered ceramic capacitor (MLCC, hereinafter referred to as "MLCC") is described as an example of a multilayer electronic component, the present invention is not limited thereto, and can also be applied to various multilayer electronic components using ceramic materials, such as inductors, piezoelectric elements, varistors, or thermistors, for example.

[0019] A multilayer electronic component 100 according to an embodiment of the present invention includes a main body 110 including dielectric layers 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layers in a thickness direction, the main body 110 including a first surface 1 and a second surface 2 facing each other in the thickness direction, a third surface 3 and a fourth surface 4 connected to the first surface and the second surface and facing each other in a length direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface, the second surface, the third surface and the fourth surface and facing each other in a width direction; a pattern 140 including a first side portion 141 disposed at one end in the length direction of the second surface, a second side portion 142 disposed at the other end in the length direction of the second surface, and a connecting portion 143 connecting the first side portion and the second side portion; and external electrodes 131 and 132 disposed on the third surface and the fourth surface, wherein widths Wh1 and Wh2 of the first side portion and the second side portion are wider than a width Wh3 of the connecting portion, and lengths Lh1 and Lh2 of the first side portion and the second side portion may be shorter than a length Lh3 of the connecting portion.

[0020] MLCCs have a structure in which dielectric layers and internal electrodes are stacked alternately in parallel within the main body. When mounting MLCCs on a substrate, high-frequency impedance, noise, and reliability characteristics may change depending on whether the stacking direction of the internal electrodes is parallel or perpendicular to the mounting surface. Therefore, a method is needed to easily determine the stacking direction of the internal electrodes. Furthermore, as the operating environment of MLCCs becomes increasingly harsh, there is a need to improve the bending strength of MLCCs to suppress substrate warping and crack formation due to external impacts.

[0021] Conventionally, methods have been used to distinguish the stacking direction of internal electrodes by using magnets for orientation alignment, or by applying a lighter-hue cover (Light cover) to one of the upper or lower cover sections to distinguish the stacking direction of internal electrodes and the thicker cover section, and then determining the hue through a camera.

[0022] However, when using magnets for alignment, errors often occur, and even when using a method that determines hue through a camera, there was a possibility that hue recognition would not work properly.

[0023] On the other hand, according to one embodiment of the present invention, by arranging the pattern 140 on the second surface of the main body, it is possible not only to easily distinguish the stacking direction of the internal electrodes, but also to improve the bending strength of the stacked electronic component.

[0024] The following describes each component included in the stacked electronic component 100 according to one embodiment of the present invention.

[0025] The main body 110 can have dielectric layers 111 and internal electrodes 121 and 122 stacked alternately.

[0026] There are no particular restrictions on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be a hexahedron or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 may not be a perfectly straight hexahedron, but may have a substantially hexahedron shape.

[0027] The main body 110 may have a first surface 1 and a second surface 2 facing each other in the thickness direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in the length direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2 and connected to the third surface 3 and the fourth surface 4 and facing each other in the width direction.

[0028] Due to the overlap of margin regions on the dielectric layer 111 where internal electrodes 121 and 122 are not placed, a step difference occurs due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface with the third to fifth surfaces and / or the corners connecting the second surface with the third to fifth surfaces may have a shape that is contracted toward the first central side of the main body 110 when viewed with respect to the first or second surface. Alternatively, due to the shrinkage behavior during the sintering process of the main body, the corners connecting the first surface 1 with the third to sixth surfaces 3, 4, 5, and 6 and / or the corners connecting the second surface 2 with the third to sixth surfaces 3, 4, 5, and 6 may have a shape that is contracted toward the first central side of the main body 110 when viewed with respect to the first or second surface. Alternatively, to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded by performing a separate process to round the corners connecting the first face with the third to sixth faces and / or the corners connecting the second face with the third to sixth faces.

[0029] On the other hand, in order to suppress the step caused by the internal electrodes 121 and 122, if, after lamination, the internal electrodes are cut so that they are exposed on the fifth surface 5 and sixth surface 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, the portions connecting the first surface and the fifth and sixth surfaces, and the portions connecting the second surface and the fifth and sixth surfaces do not need to have a contracted form.

[0030] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM). There is no particular need to limit the number of laminated dielectric layers, and the number can be determined in consideration of the size of the multilayer electronic component. For example, the main body can be formed by laminating 400 or more dielectric layers.

[0031] The dielectric layer 111 can be formed by producing a ceramic slurry containing ceramic powder, an organic solvent and a binder, applying the slurry onto a carrier film and drying it to obtain a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate-based (BaTiO3) powder can be used as the ceramic powder. To give a more specific example, the ceramic powder includes BaTiO3, (Ba 1-x Ca x )TiO3 (0<x<1), Ba(Ti 1-y Ca y )O3 (0<y<1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0<x<1, 0<y<1) and Ba(Ti 1-y Zr y )O3 (0<y<1).

[0032] There is no particular limitation on the average thickness (td) of the dielectric layer 111. For example, in the case of a high-voltage MLCC, the average thickness (td) of the dielectric layer can be 0.2 to 20 μm. However, the present invention is not limited thereto, and the average thickness (td) of the dielectric layer 111 can be arbitrarily set according to desired properties and applications.

[0033] Here, the average thickness (td) of the dielectric layer 111 refers to the size of the dielectric layer 111 in the first direction, which is positioned between the internal electrodes 121 and 122. The average thickness of the dielectric layer 111 can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the thickness of a single dielectric layer 111 can be measured at multiple points, for example, at 30 equally spaced points in the second direction, and the average value can be measured. These 30 equally spaced points can be specified in the capacitance forming section Ac, which will be described later. Furthermore, by extending this average value measurement to 10 dielectric layers 111 and measuring the average value, the average thickness of the dielectric layer 111 can be further generalized.

[0034] The main body 110 may include a capacitance forming section Ac in which a dielectric layer 111 and internal electrodes 121 and 122 are alternately arranged in the thickness direction, and an upper cover section 112 and a lower cover section 113 which are respectively arranged at the upper and lower parts of the capacitance forming section in the thickness direction.

[0035] The capacitance forming section Ac is located inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 that are arranged facing each other with the dielectric layer 111 in between, thereby forming a capacitance.

[0036] Furthermore, the capacitance-forming portion Ac is a part that contributes to the capacitance formation of the capacitor, and can be formed by repeatedly stacking a plurality of first internal electrodes 121 and second internal electrodes 122 with a dielectric layer 111 in between.

[0037] The upper cover portion 112 and the lower cover portion 113 can be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, respectively, and can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0038] The upper cover portion 112 and the lower cover portion 113 do not include internal electrodes and may contain the same material as the dielectric layer 111.

[0039] In other words, the upper cover portion 112 and the lower cover portion 113 may include a ceramic material, for example, a barium titanate (BaTiO3) based ceramic material.

[0040] On the other hand, the thickness of the cover portions 112 and 113 is not particularly limited. For example, the thickness (Tc) of the cover portions 112 and 113 can be 20 to 400 μm.

[0041] The thickness (Tc) of the cover portions 112 and 113 can represent the size in the first direction and may be the average value of the sizes of the cover portions 112 and 113 in the first direction measured at five equally spaced points on the upper or lower part of the volume forming portion Ac.

[0042] Furthermore, margin portions 114 and 115 can be arranged on the side surface of the capacity forming portion Ac.

[0043] The margin portions 114 and 115 may include a first margin portion 114 located on the fifth surface 5 of the main body 110 and a second margin portion 115 located on the sixth surface 6. That is, the margin portions 114 and 115 can be located on both end surfaces in the width direction of the ceramic main body 110.

[0044] As shown in Figure 3, the margin portions 114 and 115 can refer to the regions between the interface between both ends of the first internal electrode 121 and the second internal electrode 122 and the body 110 in a cross-section of the body 110 cut in the width-thickness (WT) direction.

[0045] The margins 114 and 115 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0046] The margin portions 114 and 115 can be formed by applying a conductive paste to the ceramic green sheet, except in the areas where the margin portions are formed, to form internal electrodes.

[0047] Furthermore, in order to suppress the step caused by the internal electrodes 121 and 122, after lamination, the internal electrodes can be cut so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers can be laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115.

[0048] On the other hand, the width of the margin portions 114 and 115 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average width of the margin portions 114 and 115 can be 20 to 400 μm.

[0049] The average width of the margin portions 114 and 115 can represent the average size in the third direction of the region where the internal electrode is separated from the fifth surface and the average size in the third direction of the region where the internal electrode is separated from the sixth surface, and can be the average value of the third-direction size of the margin portions 114 and 115 measured at five equally spaced points on the side surface of the capacitance forming portion Ac.

[0050] Therefore, in one embodiment, the average size in the third direction of the region where the internal electrodes 121 and 122 are separated from the fifth and sixth surfaces can be 20 to 400 μm, respectively.

[0051] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are arranged alternately so as to face each other across the dielectric layer 111 that constitutes the main body 110, and can be exposed on the third surface 3 and the fourth surface 4 of the main body 110, respectively.

[0052] The first internal electrode 121 is separated from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed through the fourth surface 4. The first external electrode 131 is positioned on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 is positioned on the fourth surface 4 of the main body and can be connected to the second internal electrode 122.

[0053] In other words, the first internal electrode 121 is not connected to the second external electrode 132 but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131 but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance from the third surface 3. Furthermore, the first internal electrode 121 and the second internal electrode 122 can be arranged at a distance from the fifth and sixth surfaces of the main body 110.

[0054] The conductive metals contained in the internal electrodes 121 and 122 can be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present invention is not limited thereto.

[0055] The method for forming the internal electrodes 121 and 122 is not particularly limited. For example, the internal electrodes 121 and 122 can be formed by applying a conductive paste for internal electrodes containing a conductive metal onto a ceramic green sheet and firing it. The method for applying the conductive paste for internal electrodes can be screen printing or gravure printing, but the present invention is not limited thereto.

[0056] As another example, the internal electrodes 121 and 122 can also be formed using sputtering, vacuum deposition, and / or chemical vapor deposition.

[0057] The average thickness (te) of the internal electrodes does not need to be particularly limited. In this case, the thickness of internal electrodes 121 and 122 can represent the size of internal electrodes 121 and 122 in the first direction. For example, the average thickness (te) of internal electrodes 121 and 122 can be 0.2 to 1.2 μm.

[0058] Here, the average thickness (te) of the internal electrodes can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the thickness of one internal electrode 121, 122 can be measured at multiple points, for example, 30 points equally spaced in the second direction, and the average value can be measured. These 30 equally spaced points can be specified in the capacitance forming section Ac. Furthermore, by extending this average value measurement to 10 internal electrodes 121, 122 and measuring the average value, the average thickness of the internal electrodes 121, 122 can be more generalized.

[0059] A pattern 140 can be placed on the second surface 2 of the main body 110.

[0060] The pattern 140 may include a first side portion 141 positioned at one end of the second surface in the longitudinal direction, a second side portion 142 positioned at the other end of the second surface in the longitudinal direction, and a connecting portion 143 connecting the first and second side portions. The widths Wh1 and Wh2 of the first and second side portions may be wider than the width Wh3 of the connecting portion, and the lengths Lh1 and Lh2 of the first and second side portions may be shorter than the length Lh3 of the connecting portion. That is, as shown in Figure 2, the pattern 140 may have an H shape when observed on the second surface. This makes it easy to visually recognize the stacking direction of the internal electrodes and improves the bending strength of the stacked electronic component.

[0061] In one embodiment, the first side portion 141 and the second side portion 142 can be arranged from the region adjacent to the fifth surface to the region adjacent to the sixth surface.

[0062] In other words, the first side portion 141 can be arranged to substantially cover one end of the second surface in the longitudinal direction, and the second side portion 142 can be arranged to substantially cover the other end of the second surface in the longitudinal direction.

[0063] This further enhances the bending strength improvement effect of pattern 140, suppresses moisture penetration through the corners of the main body, and improves moisture resistance reliability.

[0064] In one embodiment, when the width of the main body is W, the width of the first side portion is Wh1, and the width of the second side portion is Wh2, the following conditions can be satisfied: 0.9 ≤ Wh1 / W ≤ 1.1 and 0.9 ≤ Wh2 / W ≤ 1.1. That is, the first side portion 141 can be arranged to substantially cover one end of the second surface in the longitudinal direction, and the second side portion 142 can be arranged to substantially cover the other end of the second surface in the longitudinal direction. Furthermore, the first side portion 141 can be arranged to extend to at least a portion of the third, fifth, and sixth surfaces, and the second side portion 142 can be arranged to extend to at least a portion of the fourth, fifth, and sixth surfaces.

[0065] In one embodiment, when the length of the main body is L, the length of the first side portion is Lh1, and the length of the second side portion is Lh2, the conditions 0.1 ≤ Lh1 / L ≤ 0.3 and 0.1 ≤ Lh2 / L ≤ 0.3 can be satisfied. This ensures a sufficient improvement in bending strength and secures the bonding force between the external electrode and the main body.

[0066] If Lh1 / L and / or Lh2 / L are less than 0.1, the bending strength improvement effect may not be sufficiently secured, and if they are greater than 0.3, the bonding force between the external electrode and the main body may be insufficient.

[0067] In one embodiment, the connecting portion 143 can be positioned in the widthwise center of the second surface. Here, the widthwise center can mean the central region when the second surface is divided into three equal parts in the widthwise direction.

[0068] In one embodiment, when the width of the main body is W and the width of the connecting portion is Wh3, the condition 0.1 ≤ Wh3 / W ≤ 0.3 can be satisfied.

[0069] If Wh3 / W is less than 0.1, the connecting portion 143 may be difficult to easily recognize visually, and it may be difficult to realize the shape of the connecting portion 143. If Wh3 / W exceeds 0.3, the coupling force between the external electrode and the main body may weaken.

[0070] The width (W) of the main body 110 can be the width in the Y direction from the extension line E5 of the fifth face to the extension line E6 of the sixth face. When the width in the Y direction from the fifth face of the main body 110 to the connecting part 143 is Ws1, and the width in the Y direction from the sixth face of the main body 110 to the connecting part 143 is Ws2, the following conditions can be satisfied: 0.35 ≤ Ws1 / W ≤ 0.45 and 0.35 ≤ Ws2 / W ≤ 0.45.

[0071] In one embodiment, when the length of the main body is L and the length of the connecting portion is Lh3, the condition 0.5 ≤ Lh3 / L ≤ 0.8 can be satisfied. This makes it easier to secure the bonding force between the external electrode and the main body, and further improves the bending strength improvement effect.

[0072] In one embodiment, when the average thickness of the pattern 140 is T1, T1 can be 10 μm or more. This can further improve the identification effect by the pattern and further improve the bending strength improvement effect.

[0073] The average thickness of pattern 140 can be measured in the lengthwise and thicknesswise cross-sections obtained by cutting the multilayer electronic component in the widthwise center, or it can be the average value of the pattern thickness measured at five points that are evenly spaced in the lengthwise direction in the lengthwise center of pattern 140.

[0074] In one embodiment, the pattern 140 may contain a polymer. This not only improves the bending strength of the multilayer electronic component but also makes it easier to form the pattern shape described above.

[0075] The polymer included in pattern 140 is not particularly limited. For example, the polymer included in pattern 140 may be one or more selected from epoxy resin, acrylic resin, and ethylcellulose. On the other hand, pattern 140 may further include a fluorescent dye in addition to the polymer, which can make it easier to identify. Furthermore, the first side portion 141 and the second side portion 142 may contain metal particles to be conductive. However, if metal particles are included in the connecting portion 143, there is a risk of short-circuiting between the first external electrode and the second external electrode, so it is preferable that the connecting portion 143 does not contain metal particles.

[0076] The method for forming pattern 140 is not particularly limited. For example, it can be formed by applying a paste containing one or more selected from epoxy resin, acrylic resin, and ethylcellulose in an H shape to the second surface 2 of the main body 110 after the sintering process and before the formation of the external electrodes.

[0077] External electrodes 131 and 132 can be arranged on the third and fourth surfaces. The external electrodes 131 and 132 are arranged on the third surface 3 and fourth surface 4 of the main body 110, respectively, and may include a first external electrode 131 and a second external electrode 132 connected to a first internal electrode 121 and a second internal electrode 122, respectively. In addition, the first and second external electrodes can be arranged as extensions on parts of the first and second surfaces.

[0078] Furthermore, the external electrodes 131 and 132 can be arranged to cover both end faces of the margin portions 114 and 115 in the second direction.

[0079] On the other hand, although this embodiment describes a structure in which the stacked electronic component 100 has two external electrodes 131 and 132, the number and shape of the external electrodes 131 and 132 can be changed depending on the form of the internal electrodes 121 and 122 or other purposes.

[0080] Referring to Figure 3, the external electrodes 131 and 132 include a first external electrode 131 and a second external electrode 132, wherein the first external electrode includes a first connection portion P1a located on the third surface and a first band portion P1b extending from the first connection portion to parts of the first and second surfaces, and the second external electrode includes a second connection portion P2a located on the fourth surface and a second band portion P2b extending from the second connection portion to parts of the first and second surfaces.

[0081] In one embodiment, the first band portion P1b can be arranged to cover the first side portion 141, and the second band portion P2b can be arranged to cover the second side portion 142. This not only improves the bonding force between the pattern 140 and the main body 110, but also improves the bonding force between the external electrodes 131 and 132 and the main body 110, thereby improving reliability. That is, the external electrodes 131 and 132 can play a role in fixing both ends of the pattern 140. In this case, the external electrodes 131 and 132 can be arranged to cover a part of the connecting portion 143.

[0082] Because pattern 140 contains polymers, the bonding force with the main body may be insufficient. However, according to one embodiment of the present invention, the first band portion P1b is arranged to cover the first side portion 141, and the second band portion P2b is arranged to cover the second side portion 142, thereby improving the bonding force between pattern 140 and the main body 110. Furthermore, if the end of the first band portion P1b is positioned on the first side portion 141, the bonding force between the first external electrode 131 and the main body 110 may decrease, and if the end of the second band portion P2b is positioned on the second side portion 142, the bonding force between the second external electrode 132 and the main body 110 may decrease.

[0083] In one embodiment, when the length from the third surface to the end of the first band portion is BL1, the length of the first side portion is Lh1, the length from the fourth surface to the end of the second band portion is BL2, and the length of the second side portion is Lh2, the conditions BL1 / Lh1≧1.1 and BL2 / Lh2≧1.1 can be satisfied. BL1 can be the Y-direction length from the extension line E3 of the third surface to the end of the first band portion P1b located on the second surface, and BL2 can be the Y-direction length from the extension line E4 of the fourth surface to the end of the second band portion P2b located on the second surface.

[0084] On the other hand, the external electrodes 131 and 132 can be formed using any material that has electrical conductivity, such as a metal, and the specific material can be determined by considering electrical properties, structural stability, etc. Furthermore, they can have a multilayer structure.

[0085] For example, the external electrodes 131 and 132 may include electrode layers 131a and 132a placed on the main body 110, and plating layers 131b and 132b formed on the electrode layers 131a and 132a.

[0086] More specifically, the electrode layers 131a and 132a can be firing electrodes containing a conductive metal and glass, or resin-based electrodes containing a conductive metal and resin. Any material with excellent electrical conductivity can be used as the conductive metal in the electrode layers 131a and 132a, but there are no particular limitations. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), and their alloys.

[0087] In one embodiment, the external electrodes 131 and 132 may be in contact with the internal electrodes 121 and 122 and may include electrode layers 131a and 132a containing Cu and glass, and plating layers 131b and 132b disposed on the electrode layers.

[0088] Furthermore, the electrode layers 131a and 132a can be configured such that a fired electrode and a resin-based electrode are sequentially formed on the main body. In one embodiment, the electrode layers 131a and 132a may be in contact with the internal electrodes 121 and 122 and may include a base electrode layer containing Cu and glass, and a conductive resin layer disposed on the base electrode layer containing a conductive metal and resin.

[0089] Furthermore, the electrode layers 131a and 132a can be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0090] The plating layers 131b and 132b play a role in improving mounting characteristics. The types of plating layers 131b and 132b are not particularly limited and can be plating layers containing one or more of Ni, Sn, Pd, and their alloys, and can be formed in multiple layers.

[0091] To give a more specific example for the plating layers 131b and 132b, the plating layers 131b and 132b can be Ni plating layers or Sn plating layers, and can be configured such that the Ni plating layer and the Sn plating layer are formed sequentially on the electrode layers 131a and 132a, or can be configured such that the Sn plating layer, Ni plating layer, and Sn plating layer are formed sequentially. Furthermore, the plating layers 131b and 132b can also contain multiple Ni plating layers and / or multiple Sn plating layers.

[0092] Figure 6 is a diagram corresponding to Figure 2, according to one embodiment of the present invention.

[0093] Referring to Figure 6, an additional pattern 150 containing a polymer can be further arranged on the first surface, including a first additional side portion 151 positioned at one end of the first surface in the longitudinal direction, a second additional side portion 152 positioned at the other end of the first surface in the longitudinal direction, and an additional connecting portion 153 connecting the first additional side portion and the second additional side portion.

[0094] The additional pattern 150 may have a shape corresponding to pattern 140, the length Lh1' of the first additional side portion may be substantially the same as the length Lh1 of the first side portion, the length Lh2' of the second additional side portion may be substantially the same as the length Lh1 of the second side portion, and the length Lh3' of the additional connecting portion may be substantially the same as the length Lh3 of the connecting portion. Furthermore, the width and thickness of the first additional side portion, the second additional side portion and the additional connecting portion may also be substantially the same as the width and thickness of the first side portion, the second side portion and the connecting portion.

[0095] Figure 7 is a drawing corresponding to Figure 2, representing another embodiment of the present invention.

[0096] Referring to Figure 7, the main body 110 includes a capacitance forming section Ac in which dielectric layers and internal electrodes are alternately arranged in the thickness direction, and an upper cover section 112' and a lower cover section 113' arranged above and below the capacitance forming section in the thickness direction, respectively. When the average thickness of the upper cover section is Tc1 and the average thickness of the lower cover section is Tc2, Tc1 > Tc2 can be satisfied. When the upper cover section 112', which is thicker than the lower cover section 113', is mounted facing the substrate, not only can acoustic noise be reduced, but the pattern 140 can also play a role in mitigating shocks transmitted from the substrate.

[0097] Although embodiments of the present invention have been described in detail above, the present invention is not limited by the embodiments described above and the attached drawings, but is intended to be limited by the attached claims. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0098] Furthermore, the expression “one embodiment” as used in this disclosure does not mean that each embodiment is identical to another, but is provided to highlight and describe the unique and distinct features of each embodiment. However, the present embodiments are not excluded from being realized in combination with features of other embodiments. For example, even if a matter described in one embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description in the other embodiment that contradicts or inconsistes with that matter.

[0099] The terms used in this disclosure are used solely to describe one embodiment and are not intended to limit the disclosure. Where otherwise, singular expressions include plural expressions unless the context clearly indicates otherwise. [Explanation of symbols]

[0100] 100: Stacked Electronic Components 110: Main unit 111: Dielectric layer 112, 113: Cover section 114, 115: Margin section 121, 122: Internal electrode 131, 132: External electrode 131a, 132a: Electrode layer 131b, 132b: Plating layer 140: Pattern 141, 142: Side section 143:Connection part

Claims

1. A body comprising a dielectric layer and internal electrodes arranged alternately with the dielectric layer in the thickness direction, the body comprising a first and second surface facing each other in the thickness direction, a third and fourth surface connected to the first and second surfaces and facing each other in the length direction, and a fifth and sixth surface connected to the first, second, third and fourth surfaces and facing each other in the width direction, A pattern including a first side portion arranged at one end of the second surface in the longitudinal direction, a second side portion arranged at the other end of the second surface in the longitudinal direction, and a connecting portion connecting the first side portion and the second side portion, Includes external electrodes disposed on the third and fourth surfaces, The width of the first side portion and the second side portion is wider than the width of the connecting portion, and the length of the first side portion and the second side portion is shorter than the length of the connecting portion. Stacked electronic components.

2. The first side portion and the second side portion are arranged from the region adjacent to the fifth surface to the region adjacent to the sixth surface. The stacked electronic component according to claim 1.

3. When the width of the main body is W, the width of the first side portion is Wh1, and the width of the second side portion is Wh2, Satisfying 0.9 ≤ Wh1 / W ≤ 1.1 and 0.9 ≤ Wh2 / W ≤ 1.1, The stacked electronic component according to claim 1.

4. When the length of the main body is L, the length of the first side portion is Lh1, and the length of the second side portion is Lh2, Satisfying 0.1 ≤ Lh1 / L ≤ 0.3 and 0.1 ≤ Lh2 / L ≤ 0.3, The stacked electronic component according to claim 1.

5. The connecting portion is located in the center of the second surface in the width direction. The stacked electronic component according to claim 1.

6. When the width of the main body is W and the width of the connecting part is Wh3, Satisfying 0.1 ≤ Wh3 / W ≤ 0.3, The stacked electronic component according to claim 1.

7. When the length of the main body is L and the length of the connecting part is Lh3, Satisfying 0.5 ≤ Lh3 / L ≤ 0.8, The stacked electronic component according to claim 1.

8. When the average thickness of the pattern is T1, T1 is 10 μm or larger. The stacked electronic component according to claim 1.

9. The aforementioned pattern includes polymers. The stacked electronic component according to claim 1.

10. The polymer is one or more selected from epoxy resin, acrylic resin, and ethylcellulose. The stacked electronic component according to claim 9.

11. The external electrode includes a first external electrode and a second external electrode. The first external electrode includes a first connecting portion arranged on the third surface and a first band portion extending from the first connecting portion to a part of the first and second surfaces. The second external electrode includes a second connecting portion arranged on the fourth surface and a second band portion extending from the second connecting portion to a part of the first and second surfaces. The stacked electronic component according to claim 1.

12. The first band portion is arranged to cover the first side portion. The second band portion is arranged to cover the second side portion. The stacked electronic component according to claim 11.

13. When the length from the third surface to the end of the first band portion is BL1, the length of the first side portion is Lh1, the length from the fourth surface to the end of the second band portion is BL2, and the length of the second side portion is Lh2, Satisfying BL1 / Lh1 ≥ 1.1 and BL2 / Lh2 ≥ 1.1, The stacked electronic component according to claim 11.

14. The additional pattern further includes a polymer, comprising a first additional side portion disposed at one end of the first surface in the longitudinal direction, a second additional side portion disposed at the other end of the first surface in the longitudinal direction, and an additional connecting portion connecting the first additional side portion and the second additional side portion. A stacked electronic component according to any one of claims 1 to 13.

15. The main body includes a capacitance forming section in which the dielectric layer and internal electrodes are arranged alternately in the thickness direction, and an upper cover section and a lower cover section arranged at the upper and lower parts of the capacitance forming section in the thickness direction, respectively. When the average thickness of the upper cover portion is Tc1 and the average thickness of the lower cover portion is Tc2, the following conditions must be met: A stacked electronic component according to any one of claims 1 to 13.

16. The first side portion and the second side portion contain metal particles. A stacked electronic component according to any one of claims 1 to 13.

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