Substrate processing apparatus and substrate processing method

Abstract

To provide a substrate processing apparatus and a substrate processing method that can reduce the amount of chemicals used in substrate processing by reusing the chemicals used in substrate processing. [Solution] A substrate processing apparatus and a substrate processing method are disclosed. The disclosed substrate processing apparatus includes a substrate support section for supporting a substrate, a discharge section for discharging a chemical solution onto the substrate, a recovery wall section surrounding the substrate support section so as to recover the chemical solution discharged from the substrate support section after it has been discharged onto the substrate, a trench section where the chemical solution falling along the recovery wall section collects, and a cup provided on one side of the trench section for discharging the chemical solution from the trench section. The bottom of the trench section includes a first bottom and a second bottom section that is stepped with the first bottom and is dug deeper below the first bottom.

Description

[[Technical Field]]

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate used in semiconductor manufacturing with a chemical solution. [[Background Art]]

[0002] A semiconductor manufacturing process can include a thin film deposition step, an etching step, and a cleaning step. Among these, the cleaning step is a step of discharging a chemical solution onto a substrate to remove particles and foreign matters remaining on the substrate. Meanwhile, the waste chemical solution discharged after being supplied onto the substrate increases the environmental burden and raises the operation cost.

[0003] The background art of the present invention is disclosed in Patent Document 1 (published on March 02, 2012, title of the invention: Semiconductor wafer cleaning method and apparatus). [[Prior Art Documents]] [[Patent Documents]]

[0004] [[Patent Document 1]] Korean Patent Application Publication No. 10-2012-0018296 Specification [[Summary of the Invention]] [[Problem to be Solved by the Invention]]

[0005] The present invention has been created to solve the above-described problems, and provides a substrate processing apparatus and a substrate processing method that can reduce the consumption of the chemical solution used for substrate processing by reusing the chemical solution used for substrate processing. [[Means for Solving the Problem]]

[0006] The substrate processing apparatus according to the present invention includes a substrate support portion for supporting a substrate, a discharge portion for discharging a chemical solution onto the substrate, a recovery wall portion surrounding the substrate support portion so as to recover the chemical solution discharged from the substrate support portion after it has been discharged onto the substrate, a trench portion for collecting the chemical solution that falls along the recovery wall portion, and a cup provided on one side of the trench portion so as to discharge the chemical solution from the trench portion, wherein the bottom of the trench portion includes a first bottom portion and a second bottom portion that is stepped with the first bottom portion and is dug further deeper below the first bottom portion.

[0007] The longitudinal cross-sectional shape of the second bottom portion may be a concave, curved shape.

[0008] The vertical cross-sectional shape of the first bottom portion may be a linear shape that is inclined such that the height increases as it moves away from the second bottom portion in the width direction of the trench portion.

[0009] In the width direction of the trench portion, the first bottom portion may be provided in a pair such that the second bottom portion is interposed between them.

[0010] In the width direction of the trench portion, the width occupied by the second bottom portion may be even greater than the width occupied by the first bottom portion.

[0011] The trench portion extends along a closed curved path surrounding the substrate support portion, and the height of the bottom of the trench portion is lowest at the point where the drain outlet is located, and the height of the bottom of the trench portion may increase as it moves away from the point where the drain outlet is located.

[0012] The substrate processing apparatus according to the present invention includes a substrate support portion for supporting a substrate, a discharge portion for discharging a chemical solution onto the substrate, a recovery wall portion surrounding the substrate support portion so as to recover the chemical solution discharged from the substrate support portion after it has been discharged onto the substrate, a trench portion extending along a closed curve path surrounding the substrate support portion and collecting the chemical solution that falls along the recovery wall portion, and a cup provided on one side of the trench portion so as to discharge the chemical solution from the trench portion, characterized in that the height of the bottom of the trench portion is lowest at the point where the drainage port is located, and the height of the bottom of the trench portion increases as it moves away from the point where the drainage port is located.

[0013] The chemical solution comprises a first chemical solution and a second chemical solution different from the first chemical solution, and the cup may include a first cup from which the first chemical solution is collected, and a second cup from which the second chemical solution is collected and the first chemical solution is not collected.

[0014] The substrate processing apparatus may further include a drainage channel for guiding the second chemical solution discharged from the second cup to the outside of the substrate processing apparatus, and a chemical solution recovery unit for recovering the second chemical solution discharged from the second cup.

[0015] The chemical solution recovery unit may include a reuse chemical solution tank for containing the second chemical solution discharged from the second cup, a chemical solution recovery channel branching off from the drain channel to guide the second chemical solution flowing along the drain channel to the reuse chemical solution tank, and a channel switching unit for selectively switching the direction of travel of the second chemical solution so that the second chemical solution discharged from the second cup and entering the drain channel is directed towards either the outside of the substrate processing device or the reuse chemical solution tank.

[0016] Before the concentration of the second chemical solution collected in the second cup becomes the same as the concentration of the second chemical solution supplied to the discharge unit, the flow path switching unit may be controlled so that the second chemical solution collected in the second cup is directed towards the outside of the substrate processing device. After the concentration of the second chemical solution collected in the second cup becomes the same as the concentration of the second chemical solution supplied to the discharge unit, the flow path switching unit may be controlled so that the second chemical solution collected in the second cup is directed towards the reuse chemical solution tank.

[0017] The substrate processing apparatus further includes a first chemical solution tank containing the first chemical solution supplied to the discharge section, and a second chemical solution tank containing the second chemical solution supplied to the discharge section. The chemical solution recovery section may include a chemical solution recovery channel that branches off from the drainage channel and guides the chemical solution flowing along the drainage channel to the second chemical solution tank, and a channel switching section that selectively switches the direction of travel of the second chemical solution so that the second chemical solution discharged from the second cup and entering the drainage channel is directed towards either the outside of the substrate processing apparatus or the second chemical solution tank.

[0018] Before the concentration of the second chemical solution collected in the second cup becomes the same as the concentration of the second chemical solution in the second chemical solution tank, the flow path switching unit can be controlled so that the second chemical solution collected in the second cup flows outwards from the substrate processing device. After the concentration of the second chemical solution collected in the second cup becomes the same as the concentration of the second chemical solution in the second chemical solution tank, the flow path switching unit can be controlled so that the second chemical solution collected in the second cup flows towards the second chemical solution tank.

[0019] The substrate processing method according to the present invention is characterized by comprising: a first cup first chemical dispensing step of dispensing a first chemical solution onto a substrate supported by the substrate support at a first cup position where the level of the upper part of the first cup corresponds to the level of the substrate support; a first cup second chemical dispensing step of stopping the dispensing of the first chemical solution and dispensing a second chemical solution different from the first chemical solution onto the substrate while maintaining the first cup position; a cup shifting step of moving the second cup to a second cup position where the level of the upper part of the second cup corresponds to the level of the substrate support; and a second cup second chemical dispensing step of dispensing the second chemical solution onto the substrate at the second cup position.

[0020] The substrate processing method may further include a second chemical solution recovery step in which, at the second cup position, the concentration of the second chemical solution discharged onto the substrate and recovered in the second cup becomes the same as the concentration of the second chemical solution discharged into the second cup, and then the second chemical solution is recovered.

[0021] At the start of the second cup second drug solution dispensing step, the concentration of the second drug solution collected in the second cup may be different from the concentration of the second drug solution dispensed into the second cup.

[0022] The second drug solution recovery step may be initiated after a set time has elapsed since the start of the second drug solution dispensing step from the second cup.

[0023] The set time may be the time required for the concentration of the second chemical solution collected in the second cup to become the same as the concentration of the second chemical solution contained in the second chemical solution tank.

[0024] The second cup comprises: a recovery wall portion surrounding the substrate support part so as to recover the second chemical liquid discharged from the substrate support part after being discharged onto the substrate; a trench portion that collects the second chemical liquid falling along the recovery wall portion; and a drain outlet provided on one side of the trench portion to allow the second chemical liquid to be discharged from the trench portion, wherein a bottom of the trench portion may include a first bottom portion, and a second bottom portion that forms a step with the first bottom portion and is dug deeper below the first bottom portion.

[0025] The second cup comprises: a recovery wall portion surrounding the substrate support part so as to recover the second chemical liquid discharged from the substrate support part after being discharged onto the substrate; a trench portion extending along a closed curve path surrounding the substrate support part and collecting the second chemical liquid falling along the recovery wall portion; and a drain outlet provided on one side of the trench portion to allow the second chemical liquid to be discharged from the trench portion, wherein the height of the bottom of the trench portion is lowest at the point where the drain outlet is located, and the height of the bottom of the trench portion may increase as the distance from the point where the drain outlet is located increases.

Effects of the Invention

[0026] According to the present invention, by reusing the chemical liquid used for substrate processing to reduce the consumption of the chemical liquid used for substrate processing, the operation cost can be reduced.

[0027] According to the present invention, the discharge amount of waste chemical liquid generated by substrate processing is reduced, the burden of environmental pollution is alleviated, and the purification treatment cost of waste chemical liquid can also be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] [Figure 1] It is a configuration diagram of a substrate processing apparatus according to a first embodiment of the present invention. [Figure 2] It is a configuration diagram of the processing chamber in FIG. 1. [Figure 3] It is a configuration diagram showing a state where a first cup and a second cup in FIG. 2 are lifted. [Figure 4]Figures 2 and 3 show a cross-sectional view of the second cup separated. [Figure 5] This is a magnified view of section A in Figure 4. [Figure 6] Figure 4 is a cross-sectional view obtained by cutting along S1-S1. [Figure 7] This is a block diagram showing an example of a substrate processing method according to one embodiment of the present invention. [Figure 8] This is a configuration diagram of a substrate processing apparatus according to a second embodiment of the present invention. [Modes for carrying out the invention]

[0029] Hereinafter, a substrate processing apparatus according to an embodiment of the present invention will be described in detail with reference to the attached drawings. The terminology used herein is used to appropriately express preferred embodiments of the present invention and may vary depending on the intent of the user or operator or the conventions of the art to which the present invention pertains. Therefore, definitions of these terms should be based on the content throughout this specification.

[0030] Figure 1 is a configuration diagram of a substrate processing apparatus according to the first embodiment of the present invention; Figure 2 is a configuration diagram of the processing chamber in Figure 1; Figure 3 is a configuration diagram showing the first and second cups in Figure 2 in a raised state; Figure 4 is a cross-sectional view showing the second cup in Figures 2 and 3 separated; Figure 5 is an enlarged view of portion A in Figure 4; and Figure 6 is a cross-sectional view showing Figure 4 cut along S1-S1.

[0031] Referring to Figures 1 to 6, the substrate processing apparatus 100A according to the first embodiment of the present invention may be, for example, an apparatus that cleans a substrate 10 by discharging a chemical solution onto the upper surface 11 and lower surface 12 of the substrate 10. The substrate 10 may be, for example, a disk-shaped semiconductor wafer.

[0032] The substrate processing apparatus 100A includes a processing chamber 101. The processing chamber 101 includes a substrate support section 110, a discharge section 120, and a second cup 130. Processing of the substrate 10 is performed inside the processing chamber 101. The substrate processing apparatus 100A may further include a first chemical supply section 240, a second chemical supply section 230, and a chemical recovery section 200A.

[0033] The substrate support section 110 supports the substrate 10. The substrate support section 110 may include a table 115 that supports the substrate 10 and a spindle 112 that rotates the table 115 at high speed around a vertical axis (AX).

[0034] The dispensing unit 120 dispenses a chemical solution onto the substrate 10. The dispensing unit 120 may include a first chemical solution nozzle 122 that dispenses a first chemical solution onto the surface of the substrate 10, for example, the upper surface 11. The dispensing unit 120 may also include a second chemical solution nozzle 125 that dispenses a second chemical solution different from the first chemical solution onto the upper surface 11 of the substrate 10, and a third chemical solution nozzle 127 that dispenses the second chemical solution onto the lower surface 12 of the substrate 10.

[0035] The second chemical nozzle 125 can move along the axis (AX) so that the chemical is discharged to the center of the substrate 10 when discharging the second chemical, and can move to the outer periphery of the substrate 10 when not discharging the second chemical. The first chemical nozzle 122 can move along the axis (AX) so that the first chemical is discharged to the center of the substrate 10 when discharging the first chemical, and can move to the outer periphery of the substrate 10 when not discharging the first chemical.

[0036] In the embodiments shown in Figures 2 and 3, the first chemical nozzle 122 is shown to discharge the first chemical solution only onto the upper surface 11 of the substrate 10. However, in other embodiments of the present invention, the first chemical nozzle may further include one that discharges the first chemical solution to the lower surface 12 of the substrate 10 as well.

[0037] The second chemical supply unit 230 can supply chemical solution to the discharge unit 120. For example, the second chemical supply unit 230 can supply the second chemical solution to the second chemical solution nozzle 125 and the third chemical solution nozzle 127.

[0038] The second chemical supply unit 230 may include a second chemical tank 231, a second chemical supply channel 234, a pump 236, and a valve 238. The second chemical tank 231 may contain the second chemical. The second chemical may be, for example, one of HF (Hydrogen Fluoride), SP (Sulfate Peroxide), SPM (Sulfate Acid Peroxide Mixture), FPM (Fluoric Acid Peroxide Mixture), SC-1 (Standard Clean 1), SC-2 (Standard Clean 2), or a combination thereof.

[0039] The second chemical supply channel 234 guides the second chemical solution to move from the second chemical tank 231 to the discharge section 120. The second chemical supply channel 234 may include, for example, a pipe. A pump 236 can pump the second chemical solution released from the second chemical tank 231 towards the discharge section 120. A valve 238 opens and closes the second chemical supply channel 234 so that the second chemical solution can be selectively supplied to the discharge section 120.

[0040] Although not shown in Figure 1, the second chemical supply unit 230 may further include a filter. The filter can remove impurities from the chemical supplied from the second chemical tank 231 to the discharge unit 120.

[0041] The first chemical supply unit 240 supplies the first chemical solution to the discharge unit 120. The first chemical supply unit 240 may include a first chemical tank 241, a first chemical supply channel 244, a pump 246, and a valve 248. The first chemical tank 241 may contain the first chemical solution. For example, the first chemical solution may be DIW (deionized water).

[0042] The first chemical supply channel 244 guides the first chemical to move from the first chemical tank 241 to the discharge section 120. For example, the first chemical may be supplied to the first chemical nozzle 122. The first chemical supply channel 244 may include, for example, a pipe. A pump 246 can pump the first chemical released from the first chemical tank 241 towards the discharge section 120. A valve 248 opens and closes the first chemical supply channel 244 so that the first chemical can be selectively supplied to the discharge section 120.

[0043] Although not shown in Figure 1, the first chemical supply unit 240 may further include a filter. The filter can remove impurities from the first chemical supplied from the first chemical tank 241 to the discharge unit 120.

[0044] For example, the second chemical solution discharged from the second chemical solution nozzle 125 onto the upper surface 11 of the substrate 10 and the second chemical solution discharged from the third chemical solution nozzle 127 onto the lower surface 12 of the substrate are discharged radially from the outer circumference of the table 115 by centrifugal force caused by the rotation of the table 115.

[0045] The second cup 130 collects the chemical solution that is discharged from the substrate support section 110 after being dispensed onto the substrate 10 in this manner. The chemical solution collected in the second cup 130 may be the second chemical solution. The first chemical solution may not be collected in the second cup 130.

[0046] The second cup 130 includes a collection wall 131, a trench 140, and a drain 150. The collection wall 131 surrounds the substrate support 110. For example, the collection wall 131 surrounds the table 115 and can be erected vertically. The upper end of the collection wall 131 may extend inclined upwards, approaching the axis (AX) as it goes upwards.

[0047] Using Figures 2 to 6 as a reference, the horizontal direction is parallel to the plane containing the X and Y axes, and the vertical direction may be parallel to the Z axis. The up-down direction may be a direction that intersects the plane containing the X and Y axes. The up-down direction may also be the same direction as the vertical direction.

[0048] The chemical liquid that falls along the collection wall 131 collects in the trench section 140. As illustrated in Figure 6, the trench section 140 can have an annular planar shape centered on the axis (AX) when viewed from above. In other words, the trench section 140 can extend along a circular path centered on the axis (AX).

[0049] However, the trench portion of the second cup provided in other embodiments of the present invention may surround the substrate support portion and extend along a closed curved path that is not circular.

[0050] A drain port 150 is provided on one side of the trench section 140. The chemical solution discharged from the table 115 and collected in the trench section 140 is discharged to the outside of the second cup 130 through the drain port 150. The chemical solution discharged through the drain port 150 can move to the drain channel 190 via the drain tube 152.

[0051] The trench section 140 may include a first trench 140a and a second trench 140b. The first trench 140a may include a first bottom 144, and the second trench 140b may include a second bottom 147. The second trench 140b may be provided recessed downward from the first bottom 144 of the first trench 140a. That is, the trench section 140 may be a single unit in which the first trench 140a and the second trench 140b are connected. The width of the first trench 140a (TL1 + CU + TL2) may be greater than the width of the second trench 140b (CU).

[0052] The bottom of the trench section 140 includes a first bottom 144 and a second bottom 147. The second bottom 147 is stepped with the first bottom 144 and is dug deeper below the first bottom 144.

[0053] The longitudinal cross-sectional shape of the second bottom 147 may be a concave, curved shape. The longitudinal cross-sectional shape of the first bottom 144 may be a linear shape that is inclined in the width direction of the trench portion 140 such that the height increases as it moves away from the second bottom 147.

[0054] In the width direction of the trench section 140, the first bottom 144 may be provided in pairs with a second bottom 147 interposed between them. The longitudinal cross-sectional shape of the first bottom 144 may coincide with a symmetrical inclined line that intersects at the center point (WC) of the trench section 140 in the width direction of the trench section 140.

[0055] For example, after forming a bottom with a V-shaped longitudinal cross-section by machining using a tool having a V-shaped cross-section, a second bottom 147 with a U-shaped longitudinal cross-section can be formed by further machining the bottom using a tool having a U-shaped cross-section.

[0056] This makes it possible to form the bottom of the trench portion 140, which includes a pair of separated first bottom portions 144 and a second bottom portion 147 between the pair of first bottom portions 144.

[0057] The width (CU) of the second bottom 147 may be larger than the width (TL1 + TL2) of the first bottom 144 in the width direction of the trench section 140. Because the bottom of the trench section 140 further comprises the second bottom 147 in addition to the first bottom 144, the bottom is deeper than that of a trench section having only a V-shaped inclined bottom in its vertical cross-section, the flow rate of the liquid that can be contained in the bottom is even greater, and the flow velocity of the chemical solution flowing along the length direction of the trench section 140 becomes faster.

[0058] Therefore, more of the chemical solution can be quickly discharged from the second cup 130 through the drain 150 from the trench portion 140 of the second cup 130.

[0059] The trench section 140 may have its lowest bottom height (LP) at the point where the drain outlet 150 is located, and the bottom height of the trench section 140 may increase as it moves away from the point where the drain outlet 150 is located.

[0060] For example, with respect to the axis (AX), the height of the bottom of the trench section 140 may be highest at a point (FA) in the trench section 140 opposite to the point where the drain outlet 150 is located. The imaginary straight line (DL) connecting the point at the bottom of the trench section 140 where the drain outlet 150 is located and the point (FA) where the bottom of the trench section 140 is highest may be inclined at an acute angle (AN) with respect to the horizontal line (PL).

[0061] Thus, as the height of the bottom of the trench section 140 decreases along its length towards the drain port 150, the chemical solution collected in the trench section 140 moves more quickly towards the drain port 150 and can be discharged even faster to the outside of the second cup 130 through the drain port 150.

[0062] The substrate processing apparatus 100A may further include a first cup 160 and a lifting drive mechanism 270 inside the processing chamber 101.

[0063] The first cup 160 collects the chemical solution that has been dispensed onto the substrate 10 and then discharged from the substrate support section 110. The first cup 160 can collect at least one of the first and second chemical solutions.

[0064] For example, the first chemical solution discharged from the first chemical solution nozzle 122 onto the surface of the substrate 10 is discharged radially from the outer circumference of the table 115 by centrifugal force caused by the rotation of the table 115, and the first cup 160 can collect the first chemical solution that has been discharged onto the substrate 10 and then discharged from the substrate support part 110.

[0065] As another example, the second chemical solution discharged onto the surface of the substrate 10 from the second chemical solution nozzle 125 and the third chemical solution nozzle 127 is discharged radially from the outer circumference of the table 115 by centrifugal force due to the rotation of the table 115, and the first cup 160 can collect the second chemical solution that has been discharged onto the substrate 10 and then discharged from the substrate support part 110.

[0066] When the second chemical solution is discharged after the first chemical solution has been discharged onto the surface of the substrate 10, the first chemical solution remaining on the surface of the substrate 10 can be washed away from the substrate support part 110 into the first cup 160 along with the second chemical solution. As a result, the first cup 160 can collect a chemical solution in which the first and second chemical solutions are mixed.

[0067] The first cup 160 includes a collection wall 161, a trench 170, and a drain 180. The collection wall 161 surrounds the substrate support 110. For example, the collection wall 161 may be erected vertically around the table 115. The upper end of the collection wall 161 may extend inclined upwards, approaching the axis (AX) as it goes higher.

[0068] The upper level of the first cup 160 may be different from the upper level of the second cup 130. For example, the height of the upper end of the collection wall 161 of the first cup 160 may be higher than the height of the upper end of the collection wall 131 of the second cup 130.

[0069] The trench portion 170 collects the chemical liquid that falls along the collection wall portion 161. The trench portion 170, like the trench portion 140 of the chemical liquid collection wall 130, may have an annular planar shape centered on the axis (AX). However, the trench portion of the first cup provided in other embodiments of the present invention may surround the substrate support portion and extend along a closed curved path that is not circular.

[0070] A drain port 180 is provided on one side of the trench section 170. The chemical solution discharged from the table 115 and collected in the trench section 170 is discharged to the outside of the first cup 160 through the drain port 180. The chemical solution discharged through the drain port 180 can move to the drain channel 190 via the drain tube 182.

[0071] Similar to the bottom of the trench section 140 of the second cup 130, the bottom of the trench section 170 of the first cup 160 may include a first bottom 174 and a second bottom 177. The second bottom 177 is stepped with the first bottom 174 and is dug further below the first bottom 174.

[0072] The longitudinal cross-sectional shape of the second bottom 177 may be a concave, curved shape. The longitudinal cross-sectional shape of the first bottom 174 may be a linear shape that is inclined in the width direction of the trench portion 170 such that the height increases as it moves away from the second bottom 177.

[0073] In the width direction of the trench portion 170, the first bottom portion 174 may be provided in a pair with the second bottom portion 177 interposed between them. The shapes of the first bottom portion 174, the second bottom portion 177, and the drain port 180 of the trench portion 170 of the first cup 160 are the same as the shapes of the first bottom portion 144, the second bottom portion 147, and the drain port 150 of the trench portion 140 of the second cup 130 described above, so redundant explanations are omitted.

[0074] As the height of the bottom of the trench section 170 decreases along its length towards the drain port 180, the chemical solution collected in the trench section 170 can move more quickly towards the drain port 180 and be discharged more quickly to the outside of the first cup 160 through the drain port 180.

[0075] The lifting drive 270 can raise and lower the first cup 160 and the second cup 130. The second cup 130 and the first cup 160 are coupled together, allowing the lifting drive 270 to raise and lower the first cup 160 and the second cup 130 simultaneously.

[0076] For example, when the first chemical solution is discharged from the first chemical solution nozzle 122 and discharged to the outer periphery of the table 115, the height of the upper end of the collection wall portion 161 of the first cup 160 may be higher than the height of the substrate 10, and the height of the upper end of the collection wall portion 131 of the second cup 130 may be lower than the height of the substrate 10.

[0077] Furthermore, even when the second chemical solution is discharged from the second chemical solution nozzle 125 and the third chemical solution nozzle 127, and the second chemical solution, or a mixture of the first and second chemical solutions, is discharged to the outer circumference of the table 115, the height of the upper end of the collection wall portion 161 of the first cup 160 may be higher than the height of the substrate 10, and the height of the upper end of the collection wall portion 131 of the second cup 130 may be lower than the height of the substrate 10.

[0078] In this case, the level of the top of the first cup 160 corresponds to the level of the substrate support portion 110, and hereafter, the position of the first cup 160 in this state will be referred to as the first cup position.

[0079] When the second chemical solution is discharged from the second chemical solution nozzle 125 and the third chemical solution nozzle 127, and the second chemical solution is discharged to the outer periphery of the table 115, the lifting drive 270 can raise the second cup 130 and the first cup 160 so that the height of the upper end of the collection wall portion 131 of the second cup 130, which is lower than the height of the upper end of the collection wall portion 161 of the first cup 160, becomes higher than the height of the substrate 10.

[0080] In this case, the upper level of the second cup 130, which is different from the upper level of the first cup 160, corresponds to the level of the substrate support portion 110, and below, the position of the second cup 130 in this state will be referred to as the second cup position.

[0081] When the discharge of the second chemical solution is stopped and the first chemical solution is discharged again from the first chemical solution nozzle 122 and discharged to the outer circumference of the table 115, the lifting drive 270 can lower the second cup 130 and the first cup 160 to their original heights such that the height of the upper end of the collection wall portion 161 of the first cup 160 is higher than the height of the substrate 10, and the height of the upper end of the collection wall portion 131 of the second cup 130 is lower than the height of the substrate 10. In other words, the first cup 160 can return to the first cup position.

[0082] The substrate processing apparatus 100A may further include a drainage channel 190 that guides the chemical solution discharged from the second cup 130 via a drainage port 150 to the outside of the substrate processing apparatus 100A.

[0083] The drainage channel 190 can be connected to the drainage tube 152 of the second cup 130 and the drainage tube 182 of the first cup 160. Therefore, when the first or second chemical solution is discharged to the outside of the first cup 160, it can be drained to the outside of the substrate processing apparatus 100A via the drainage channel 190.

[0084] The chemical solution recovery unit 200A recovers the second chemical solution discharged from the second cup 130 via the drain port 150. The chemical solution recovery unit 200A may include a reuse chemical solution tank 201, a chemical solution recovery channel 204, and a channel switching unit 207.

[0085] The reuse chemical tank 201 can contain the second chemical solution discharged from the second cup 130. The chemical recovery channel 204 can branch off from the drain channel 190 and guide the chemical solution flowing along the drain channel 190 to the reuse chemical tank 201.

[0086] The flow path switching unit 207 selectively switches the direction of flow of the second chemical solution, which has been discharged from the second cup 130 and entered the drainage flow path 190, so that it is directed towards either the outside of the substrate processing apparatus 100A or the reuse chemical solution tank 201. The flow path switching unit 207 may include, for example, a three-way valve.

[0087] The substrate processing apparatus 100A may further include a reuse chemical supply unit 220 and a control unit 260.

[0088] The recycled chemical supply unit 220 can supply the second chemical solution, i.e., the recycled chemical solution, contained in the recycled chemical solution tank 201, to the discharge unit 120. The recycled chemical solution supply unit 220 may include a recycled chemical solution supply channel 221, a pump 224, and a valve 226.

[0089] The recycled chemical supply channel 221 can guide the recycled chemical to move from the recycled chemical tank 201 to the discharge section 120. The recycled chemical supply channel 221 may include, for example, a pipe. The pump 224 can pump the recycled chemical released from the recycled chemical tank 201 towards the discharge section 120. The valve 226 opens and closes the recycled chemical supply channel 221 so that the recycled chemical contained in the recycled chemical tank 201 is selectively supplied to the discharge section 120.

[0090] Although not shown in Figure 1, the recycled chemical supply unit 220 may further include a filter. The filter can remove impurities from the recycled chemical supplied from the recycled chemical tank 201 to the discharge unit 120.

[0091] The control unit 260 can control the operation of the first chemical supply unit 240, the second chemical supply unit 230, the substrate support unit 110, the discharge unit 120, the first cup 160, the second cup 130, the lifting drive unit 270, the chemical recovery unit 200A, and the reuse chemical supply unit 220 according to the sequence of operations performed via the substrate processing device 100A.

[0092] For example, the control unit 260 can control the on / off switching of pumps 224, 236, and 246 included in the substrate processing apparatus 100A, the opening and closing of valves 226, 238, and 248, the opening and closing of nozzles 122, 125, and 127, the on / off switching of the spindle 112, the upward and downward driving of the lifting drive unit 270, and the operation of the flow path switching unit 207.

[0093] For example, when the first cup 160 is in the first cup position, if the first chemical solution is discharged from the first chemical solution nozzle 122 of the discharge unit 120, the first chemical solution collected in the first cup 160 is drained to the outside of the substrate processing apparatus 100A via the drainage channel 190, and the discharge of the first chemical solution via the first chemical solution nozzle 122 of the discharge unit 120 is stopped. When the second chemical solution is discharged via the second chemical solution nozzle 125 and the third chemical solution nozzle 127, the second chemical solution collected in the first cup 160 is drained to the outside of the substrate processing apparatus 100A via the drainage channel 190, thus the channel switching unit 207 can be controlled by the control unit 260.

[0094] Furthermore, when the second cup is in the second cup position and the second chemical solution is discharged onto the substrate 10 from the second chemical solution nozzle 125 and the third chemical solution nozzle 127, the control unit 260 can control the flow path switching unit 207 so that the second chemical solution collected in the second cup 130 is directed outwards from the substrate processing apparatus 100A before the concentration of the second chemical solution collected in the second cup 130 becomes the same as the concentration of the second chemical solution discharged onto the substrate 10.

[0095] After the concentration of the second chemical solution collected in the second cup 130 becomes the same as the concentration of the second chemical solution discharged to the substrate 10, the control unit 260 can control the flow path switching unit 207 so that the second chemical solution collected in the second cup 130 is directed toward the reuse chemical solution tank 201 of the chemical solution collection unit 200A. Here, the concentration of the second chemical solution discharged to the substrate 10 may be the same as the concentration of the second chemical solution contained in the second chemical solution tank 231 of the second chemical solution supply unit 230.

[0096] For example, the first chemical solution supplied to the discharge unit 120 via the first chemical solution supply unit 240 may be DIW, and the second chemical solution supplied to the discharge unit 120 via the second chemical solution supply unit 230 may be HF (Hydrogen Fluoride).

[0097] With the first cup 160 in the first cup position, the first chemical solution is discharged onto the substrate 10 via the first chemical solution nozzle 122, and then the second chemical solution is discharged onto the substrate 10 via the second chemical solution nozzle 125 and the third chemical solution nozzle 127.

[0098] While the second liquid agent is being dispensed onto the substrate 10, the first cup 160 and the second cup 130 can be raised by the lifting drive 270 from the height shown in Figure 2 to the height shown in Figure 3. In other words, the second cup 130 can be moved to the second cup position.

[0099] The second cup 130 may contain the second chemical solution that was collected in the second cup 130 during the processing of the preceding substrate 10 and has not been drained through the drain port 150. The second chemical solution remaining in the second cup 130 may become more concentrated over time due to reasons such as the evaporation of the solvent. Alternatively, the concentration of the second chemical solution remaining in the second cup 130 may become less concentrated.

[0100] When the second cup 130 is in the second cup position, and the second chemical solution is discharged onto the substrate 10 via the second chemical solution nozzle 125 and the third chemical solution nozzle 127, the trench portion 140 of the second cup 130 may mix with the second chemical solution whose concentration has changed and which remains in the second cup 130, as described above, and with the second chemical solution that is discharged onto the substrate 10 and then discharged from the substrate support portion 110.

[0101] Therefore, at the start of the recovery of the second chemical solution into the second cup 130, the concentration of the second chemical solution recovered into the second cup 130 may differ from the concentration of the second chemical solution discharged onto the substrate 10. For example, at the start of the recovery of the second chemical solution into the second cup 130, the concentration of the second chemical solution recovered into the second cup 130 may be higher than the concentration of the second chemical solution discharged onto the substrate 10. The concentration of the second chemical solution discharged onto the substrate 10 may be the same as the concentration of the second chemical solution contained in the second chemical solution tank 231.

[0102] However, when the second cup 130 is in the second cup position, if the second chemical solution is continuously collected in the second cup 130 and continuously discharged through the drain port 150, the concentration of the second chemical solution collected in the second cup 130 may be the same as the concentration of the second chemical solution discharged to the substrate 10. In other words, the concentration of the second chemical solution collected in the second cup 130 can be adjusted to a recyclable concentration.

[0103] After the concentration of the second chemical solution collected in the second cup 130 and remaining in the trench section 140 becomes the same as the concentration of the second chemical solution contained in the second chemical solution tank 231, the flow path switching unit 207 switches the second chemical solution in the drainage flow path 190 toward the reuse chemical solution tank 201, and it can be supplied to the reuse chemical solution tank 201.

[0104] As mentioned above, since the bottom of the trench section 140 is equipped with a second bottom section 147, the second chemical solution is quickly discharged from the trench section 140 to the outside of the second cup 130. Therefore, the time required from the moment the second chemical solution is discharged onto the substrate 10 and begins to be collected in the second cup 130 until the concentration of the second chemical solution collected in the second cup 130 becomes the same as the concentration of the second chemical solution contained in the second chemical solution tank 231 can be shortened.

[0105] For example, in the case of a second cup without a second bottom 147, the time required from the moment the second chemical solution is discharged onto the substrate 10 and begins to be collected in the second cup until the concentration of the second chemical solution collected in the second cup becomes the same as the concentration of the second chemical solution contained in the second chemical solution tank 231 may be greater than the time required in the case of the second cup 130 of the first embodiment of the present invention from the moment the second chemical solution is discharged onto the substrate 10 and begins to be collected in the second cup 130 until the concentration of the second chemical solution collected in the second cup 130 becomes the same as the concentration of the chemical solution in the second chemical solution supply unit 230.

[0106] In other words, in one embodiment of the present invention, the second chemical solution is drained to the outside via the drainage channel 190 from the time it begins to be collected in the second cup 130 until a set time has elapsed. However, after the set time has elapsed from the time it begins to be collected in the second cup 130, the control unit 260 can control the channel switching unit 207 so that the second chemical solution is collected in the reuse chemical solution tank 201 and reused. Therefore, the reuse rate of the chemical solution can be increased.

[0107] Figure 7 is a block diagram showing an example of a substrate processing method according to one embodiment of the present invention. The substrate processing method shown in Figure 7 may be an example of a substrate processing method using the substrate processing apparatus 100A according to the first embodiment of the present invention.

[0108] Referring to Figures 1 to 7, a substrate processing method according to one embodiment of the present invention may be a method of cleaning a substrate 10 using a substrate processing apparatus 100A according to the first embodiment of the present invention.

[0109] The substrate processing method includes a first cup first chemical dispensing step (S110), a first cup second chemical dispensing step (S120), a cup shifting step (S130), a second cup second chemical dispensing step (S140), and a second chemical recovery step (S150).

[0110] The first cup first liquid dispensing step (S110) is a step in which the first liquid is dispensed onto the substrate 10 supported by the substrate support 110 at a first cup position where the level of the upper part of the first cup 160 corresponds to the level of the substrate support 110.

[0111] At the first cup position, the first chemical solution, which is discharged onto the substrate 10 and collected in the first cup 160 after being discharged from the substrate support 110, is drained from the first cup 160 via the drain port 180 and discharged to the outside of the substrate processing apparatus 100A via the drain channel 190.

[0112] The first cup position has already been mentioned in the description of the substrate processing apparatus 100A according to the present invention, so a redundant explanation will be omitted. As shown in Figure 2, at the first cup position, the upper end of the first cup 160 may be slightly higher than the height of the substrate 10 supported by the substrate support portion 110, and the upper end of the second cup 130 may be slightly lower than the height of the substrate 10.

[0113] The first cup second chemical solution dispensing step involves stopping the dispensing of the first chemical solution and dispensing a second chemical solution, different from the first chemical solution, onto the substrate 10 while maintaining the position of the first cup. The second chemical solution, which is dispensed onto the substrate 10 at the first cup position, discharged from the substrate support 110 and collected in the first cup 160, is drained from the first cup 160 via the drain port 180 and discharged to the outside of the substrate processing apparatus 100A via the drain channel 190.

[0114] The cup shifting step (S130) is a step of moving the second cup 130 to a second cup position where the level of the upper part of the second cup 130 corresponds to the level of the substrate support 110. The cup shifting step (S130) can be performed by the operation of the lifting drive 270.

[0115] The second cup position has already been mentioned in the description of the substrate processing apparatus 100A according to the present invention, so a redundant explanation will be omitted. As shown in Figure 3, at the second cup position, the upper end of the second cup 130 is slightly higher than the height of the substrate 10 supported by the substrate support portion 110, and the upper end of the first cup 160 may be even higher than the height of the upper end of the second cup 130.

[0116] The second cup second chemical dispensing step (S140) is a step in which the second chemical is dispensed onto the substrate 10 at the second cup position. If the cup shifting step (S130) is performed while the second chemical is being dispensed onto the substrate 10, the second cup 130 may be moved to the second cup position and the second cup second chemical dispensing step (S140) may be performed at the same time.

[0117] In the second cup second chemical dispensing step (S140), the second chemical dispensing solution that is dispensed onto the substrate 10 and discharged from the substrate support section 110 is collected in the second cup 130. As mentioned in the description of the substrate processing apparatus 100A, at the start of the second cup second chemical dispensing step (S140), the second chemical dispensing solution collected in the second cup 130 may include the second chemical dispensing solution that remains in the second cup 130 throughout the previous substrate processing process.

[0118] Therefore, at the start of the second cup second chemical dispensing step, the concentration of the second chemical solution collected in the second cup 130 may differ from the concentration of the second chemical solution dispensed onto the substrate 10, i.e., the concentration of the second chemical solution contained in the second chemical solution tank 231. For example, at the start of the second cup second chemical dispensing step, the concentration of the second chemical solution collected in the second cup 130 may be higher than the concentration of the second chemical solution dispensed onto the substrate 10, i.e., the concentration of the second chemical solution contained in the second chemical solution tank 231.

[0119] On the other hand, in other embodiments of the present invention, at the start of the second cup second chemical dispensing step, the concentration of the second chemical solution collected in the second cup 130 may be lower than the concentration of the second chemical solution dispensed onto the substrate 10, i.e., the concentration of the second chemical solution contained in the second chemical solution tank 231.

[0120] The second chemical solution recovery step (S150) is a step in which the second chemical solution is recovered after the concentration of the second chemical solution discharged onto the substrate 10 and discharged from the substrate support part 110 and recovered into the second cup 130 at the second cup position has become the same as the concentration of the second chemical solution discharged into the second cup 130, that is, the concentration of the second chemical solution contained in the second chemical solution tank 231.

[0121] The second chemical solution recovery step (S150) may be performed by the chemical solution recovery unit 200A. The recovered second chemical solution may be stored in the reuse chemical solution tank 201.

[0122] The second chemical solution recovery step (S150) may be started after a set time has elapsed since the start of the second cup second chemical solution dispensing step (S140). The time elapsed from the start of the second cup second chemical solution dispensing step (S140) until the concentration of the chemical solution recovered in the second cup 130 becomes the same as the concentration of the second chemical solution contained in the second chemical solution tank 231 can be determined in advance through repeated testing, and this determined time can be set as the aforementioned set time.

[0123] The second chemical solution collected in the second cup 130 between the start of the second chemical solution dispensing step (S140) and the start of the second chemical solution recovery step (S150) can be discharged from the second cup 130 via the drain port 150 and drained to the outside of the substrate processing apparatus 100A via the drain channel 190.

[0124] The second chemical solution, recovered in the reuse chemical tank 201, can be discharged onto the substrate 10 supported by the substrate support 110 for substrate processing. Alternatively, the recovered second chemical solution can be discharged onto the next substrate 10 in the sequence, or used later for processing the substrate 10.

[0125] Although not shown in Figure 7, a substrate processing method according to one embodiment of the present invention may further include a step of loading the substrate 10 onto the substrate support portion 110 prior to the first cup first chemical dispensing step (S110).

[0126] Furthermore, the substrate processing method according to one embodiment of the present invention may further include the steps of: returning the first cup 160 to the first cup position, that is, lowering the first cup 160 and the second cup 130 to their original positions as shown in Figure 2, after impurities have been removed from the substrate 10 through the second cup second chemical dispensing step (S140); dispensing the first chemical solution onto the substrate 10 to rinse the substrate 10; drying the substrate 10; and unloading the substrate 10 from the substrate support part 110.

[0127] Figure 8 is a configuration diagram of a substrate processing apparatus according to a second embodiment of the present invention. Referring to Figures 2 and 8, the substrate processing apparatus 100B according to the second embodiment of the present invention may include a processing chamber 101, a second chemical supply unit 230, a first chemical supply unit 240, a chemical recovery unit 200B, a drainage channel 190, and a control unit 260.

[0128] The processing chamber 101 may include, internally, a substrate support section 110, a discharge section 120, a first cup 160, a second cup 130, drain tubes 152 and 182, and a lifting drive 270, as shown in Figures 2 and 3. The substrate support section 110, the discharge section 120, the first cup 160, the second cup 130, the drain tubes 152 and 182, and the lifting drive 270 have already been mentioned in the description of the substrate processing apparatus 100A according to the first embodiment of the present invention, so a redundant explanation will be omitted.

[0129] The first chemical supply unit 240, the second chemical supply unit 230, the drainage channel 190, and the control unit 260 have already been mentioned in the description of the substrate processing apparatus 100A according to the first embodiment of the present invention, so redundant explanations will be omitted.

[0130] The chemical recovery unit 200B may include a chemical recovery channel 210 and a channel switching unit 213. The chemical recovery channel 210 branches off from the drain channel 190 and guides the second chemical flowing along the drain channel 190 to the second chemical tank 231.

[0131] The flow path switching unit 213 can selectively switch the direction of flow of the second chemical solution, which is discharged from the second cup 130 and enters the drainage flow path 190, so that it flows towards either the outside of the substrate processing apparatus 100B or the second chemical solution tank 231. The flow path switching unit 213 may include, for example, a three-way valve.

[0132] Before the concentration of the second chemical solution collected in the second cup 130 becomes the same as the concentration of the second chemical solution in the second chemical solution tank 231, the flow path switching unit 213 is controlled so that the second chemical solution collected in the second cup 130 flows out of the substrate processing device 100B.

[0133] On the other hand, after the concentration of the second chemical solution collected in the second cup 130 becomes the same as the concentration of the second chemical solution in the second chemical solution tank 231, the flow path switching unit 213 is controlled so that the second chemical solution collected in the second cup 130 is directed towards the second chemical solution tank 231. The reused second chemical solution flowing into the second chemical solution tank 231 can be combined with the existing second chemical solution in the second chemical solution tank 231 and discharged to the substrate 10 via the discharge unit 120.

[0134] According to the substrate processing apparatus 100A, 100B and substrate processing method described above, by reusing the chemical solution used in substrate processing and reducing the amount of chemical solution consumed for substrate processing, it is possible to reduce operating costs.

[0135] Furthermore, the amount of waste chemicals generated during substrate processing will decrease, reducing the burden of environmental pollution and potentially lowering the cost of waste chemical treatment.

[0136] The present invention has been described with reference to one embodiment shown in the drawings, which is merely illustrative, and a person with ordinary skill in the art will understand that a variety of modifications and equivalent other embodiments are possible thereon. Therefore, the true scope of protection of the present invention should be defined solely by the appended claims. [Explanation of Symbols]

[0137] 10: Substrate 100A, 100B: Substrate processing equipment 101: Processing chamber 110: Substrate support section 120: Dispensing part 130: Second cup 140: Trench section 144: First bottom section 147: Second bottom 150: Drain port 160: First cup 190: Drain channel 200A, 200B: Chemical recovery unit; 201: Reusable chemical tank 204, 210: Chemical solution recovery channel 207, 213: Channel switching section 220: Reused chemical supply unit 230: Second chemical supply unit 240: First chemical supply unit 270: Lifting drive unit

Claims

1. A substrate support section that supports the substrate, The substrate is provided with a dispensing unit for dispensing a liquid chemical, The system includes a collection wall surrounding the substrate support portion so as to collect the chemical solution discharged from the substrate support portion after it has been dispensed onto the substrate, a trench portion where the chemical solution falling along the collection wall portion collects, and a cup having a drain port provided on one side of the trench portion so as to discharge the chemical solution from the trench portion. The bottom of the trench section is A substrate processing apparatus characterized by including a first bottom and a second bottom that is stepped with the first bottom and is further excavated below the first bottom.

2. The substrate processing apparatus according to claim 1, characterized in that the vertical cross-sectional shape of the second bottom portion is a concave, curved shape.

3. The substrate processing apparatus according to claim 1, characterized in that the vertical cross-sectional shape of the first bottom is a linear shape that is inclined such that the height increases as it moves away from the second bottom in the width direction of the trench portion.

4. The substrate processing apparatus according to claim 1, characterized in that, in the width direction of the trench portion, the first bottom portion is provided in a pair such that the second bottom portion is interposed between them.

5. The substrate processing apparatus according to claim 1, characterized in that, in the width direction of the trench portion, the width occupied by the second bottom portion is even greater than the width occupied by the first bottom portion.

6. The substrate processing apparatus according to claim 1, characterized in that the trench portion extends along a closed curve path surrounding the substrate support portion, the height of the bottom of the trench portion is lowest at the point where the drain port is located, and the height of the bottom of the trench portion increases as it moves away from the point where the drain port is located.

7. The aforementioned drug solution includes a first drug solution and a second drug solution different from the first drug solution. The aforementioned cup is A first cup from which at least one of the first and second chemical solutions is collected, The substrate processing apparatus according to claim 1, comprising a second cup from which the second chemical solution is collected and from which the first chemical solution is not collected.

8. A substrate support section that supports the substrate, The substrate is provided with a dispensing unit for dispensing a liquid chemical, The system includes a collection wall surrounding the substrate support portion so as to collect the chemical solution discharged from the substrate support portion after it has been dispensed onto the substrate, a trench portion extending along a closed curve path surrounding the substrate support portion and collecting the chemical solution that falls along the collection wall portion, and a cup having a drain port provided on one side of the trench portion so as to discharge the chemical solution from the trench portion. A substrate processing apparatus characterized in that the height of the bottom of the trench is lowest at the point where the drain is located, and the height of the bottom of the trench increases as you move away from the point where the drain is located.

9. The aforementioned drug solution includes a first drug solution and a second drug solution different from the first drug solution. The aforementioned cup is A first cup from which at least one of the first and second chemical solutions is collected, The substrate processing apparatus according to claim 8, comprising a second cup from which the second chemical solution is recovered and from which the first chemical solution is not recovered.

10. The substrate processing apparatus is A drainage channel for guiding the second chemical solution discharged from the second cup to the outside of the substrate processing apparatus, The substrate processing apparatus according to claim 9, further comprising a chemical solution recovery unit for recovering the second chemical solution discharged from the second cup.

11. The aforementioned chemical solution recovery unit is A reuse chemical tank containing the second chemical solution discharged from the second cup, A chemical recovery channel is branched from the drainage channel to guide the second chemical solution flowing along the drainage channel to the reuse chemical solution tank, The substrate processing apparatus according to claim 10, further comprising: a flow path switching unit that selectively switches the direction of travel of the second chemical solution, which has been discharged from the second cup and entered the drainage flow path, toward one of the outside of the substrate processing apparatus and the reuse chemical solution tank.

12. Before the concentration of the second chemical solution collected in the second cup becomes the same as the concentration of the second chemical solution supplied to the discharge unit, the flow path switching unit is controlled so that the second chemical solution collected in the second cup is directed towards the outside of the substrate processing device. The substrate processing apparatus according to claim 11, characterized in that, after the concentration of the second chemical solution collected in the second cup becomes the same as the concentration of the second chemical solution supplied to the discharge unit, the flow path switching unit is controlled so that the second chemical solution collected in the second cup is directed toward the reuse chemical solution tank.

13. The substrate processing apparatus is A first chemical solution tank containing the first chemical solution supplied to the discharge section, The present invention further includes a second chemical solution tank containing the second chemical solution supplied to the discharge section, The aforementioned chemical solution recovery unit is A chemical recovery channel branches off from the drainage channel and guides the chemical solution flowing along the drainage channel to the second chemical solution tank, The substrate processing apparatus according to claim 10, further comprising: a flow path switching unit that selectively switches the direction of travel of the second chemical solution, which has been discharged from the second cup and entered the drainage flow path, toward one of the outside of the substrate processing apparatus and the second chemical solution tank.

14. Before the concentration of the second chemical solution collected in the second cup becomes the same as the concentration of the second chemical solution in the second chemical solution tank, the flow path switching unit is controlled so that the second chemical solution collected in the second cup flows outwards from the substrate processing device. The substrate processing apparatus according to claim 13, characterized in that, after the concentration of the second chemical solution collected in the second cup becomes the same as the concentration of the second chemical solution in the second chemical solution tank, the flow path switching unit is controlled so that the second chemical solution collected in the second cup is directed toward the second chemical solution tank.

15. A first cup first liquid dispensing step in which the first liquid is dispensed onto a substrate supported by the substrate support at a first cup position in which the level of the upper part of the first cup corresponds to the level of the substrate support, A first cup second chemical solution dispensing step in which the dispensing of the first chemical solution is stopped and a second chemical solution different from the first chemical solution is dispensed onto the substrate while maintaining the position of the first cup, A cup shifting step involves moving the second cup to a second cup position where the level of the upper part of the second cup corresponds to the level of the substrate support portion. A substrate processing method characterized by comprising a second cup second chemical solution dispensing step of dispensing the second chemical solution onto the substrate at the second cup position.

16. The substrate processing method according to claim 15, further comprising a second chemical solution recovery step of recovering the second chemical solution after the concentration of the second chemical solution discharged onto the substrate and recovered in the second cup at the second cup position has become the same as the concentration of the second chemical solution discharged into the second cup.

17. The substrate processing method according to claim 16, characterized in that, at the start of the second cup second chemical solution dispensing step, the concentration of the second chemical solution collected in the second cup is different from the concentration of the second chemical solution dispensed into the second cup.

18. The substrate processing method according to claim 16, characterized in that the second chemical solution recovery step is started after a set time has elapsed from the start of the second cup second chemical solution dispensing step.

19. The second cup is, The system includes a collection wall surrounding the substrate support portion so as to collect the second chemical solution discharged from the substrate support portion after it has been discharged onto the substrate, a trench portion where the second chemical solution that falls along the collection wall portion collects, and a drain port provided on one side of the trench portion so as to discharge the second chemical solution from the trench portion. The bottom of the trench section is The substrate processing method according to claim 15, characterized by including a first bottom and a second bottom that is stepped with the first bottom and is dug even deeper below the first bottom.

20. The second cup is, The system includes a collection wall surrounding the substrate support portion so as to collect the second chemical solution discharged from the substrate support portion after it has been discharged onto the substrate, a trench portion extending along a closed curve path surrounding the substrate support portion and collecting the second chemical solution that falls along the collection wall portion, and a drain port provided on one side of the trench portion so as to discharge the second chemical solution from the trench portion. The substrate processing method according to claim 15, characterized in that the height of the bottom of the trench is lowest at the point where the drain is located, and the height of the bottom of the trench increases as you move away from the point where the drain is located.

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