Substrate processing equipment, supply equipment

Abstract

The present invention provides a substrate processing apparatus that allows for the oscillation of a swing arm through which the utility supply unit is inserted, while also providing a utility supply unit that supplies utilities to the substrate processing table. [Solution] A substrate processing apparatus 1 according to one embodiment comprises a substrate processing table 23, a processing unit 27 that performs predetermined processing on a substrate W placed on the upper surface 23a of the substrate processing table 23, a supply line 25 having a swing arm 251 that extends upward toward the upper surface of the substrate processing table 23, a utility supply unit 255 that is inserted into the swing arm 251 from outside the swing arm 251 and supplies utilities to the substrate placed on the upper surface 23a of the substrate processing table 23, and a swing mechanism 50 that swings the swing arm 251 about a swing axis, wherein a part of the utility supply unit 255 extends along the swing axis and is located on the swing axis.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and a supply apparatus.

Background Art

[0002] Conventionally, as disclosed in Patent Document 1, a substrate processing apparatus for processing a substrate such as a silicon wafer has been known. In this substrate processing apparatus, a substrate is placed on a rotating table, and utilities such as pure water and an abrasive are supplied to the center of the table or the vicinity of the center of the table.

Prior Art Literature

Patent Literature

[0003]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0004] However, in the above substrate processing apparatus, a plurality of pipes and the like are arranged at high density at and in the vicinity of the center of the table. Therefore, in the above substrate processing apparatus, it may be difficult to newly arrange a pipe for supplying utilities at and in the vicinity of the center of the table.

[0005] Further, in a chemical mechanical polishing (CMP) apparatus for flatly polishing the surface of a substrate such as a silicon wafer, it has been newly discovered that supplying a large flow rate of pure water as a utility to the center of the table or the vicinity of the center of the table and performing polishing using the pure water has effects such as reduction of particles generated during polishing. Since a pipe for supplying such a large flow rate of pure water has a larger diameter than each pipe or the like in the above substrate processing apparatus, flexibility is lowered, which may hinder the swinging of a swing arm through which the pipe is inserted.

[0006] The present invention has been made in view of the circumstances described above, and aims to provide a substrate processing apparatus and a supply apparatus that enables the oscillation of an oscillating arm through which a utility supply unit is inserted, while a utility supply unit is provided to supply a utility to at least a part of the oscillating arm or to the outside of the oscillating arm. [Means for solving the problem]

[0007] (1) A substrate processing apparatus according to a first aspect of the present invention comprises a substrate processing table, a processing unit for performing a predetermined process on a substrate placed on the upper surface of the substrate processing table, a supply line having a swing arm extending from the outside of the substrate processing table toward the space above the substrate processing table, a utility supply unit inserted into the swing arm from the outside of the swing arm and supplying utilities to the substrate placed on the upper surface of the substrate processing table, and a swing mechanism for swinging the swing arm about a swing axis, wherein a part of the utility supply unit extends along the swing axis and is located on the swing axis.

[0008] (2) A substrate processing apparatus as described in (1) above, wherein the utility supply unit may include: a first utility pipe extending along the pivot axis and located on the pivot axis; a plurality of second utility pipes extending along the pivot axis and connected to the first utility pipe; a third utility pipe, a portion of which extends along the pivot axis and is located on the pivot axis, connected to the plurality of second utility pipes, inserted into the pivot arm, and pivoting together with the pivot arm about the pivot axis; a first pipe connection part connecting the first utility pipe and the plurality of second utility pipes; and a second pipe connection part connecting the plurality of second utility pipes and the third utility pipe.

[0009] (3) The substrate processing apparatus described in (2) above, wherein the second utility pipe may have higher flexibility than the first utility pipe and the third utility pipe.

[0010] (4) A substrate processing apparatus as described in (2) or (3) above, wherein the outer diameter of the second utility pipe may be smaller than the outer diameter of the first utility pipe and the outer diameter of the third utility pipe, respectively.

[0011] (5) A substrate processing apparatus as described in (2) to (4) above, wherein the total flow area of ​​the plurality of second utility pipes may be 80% or more of the flow area of ​​the first utility pipe and the flow area of ​​the third utility pipe, respectively.

[0012] (6) A substrate processing apparatus as described in (2) to (5) above, wherein the upper end of the first utility pipe is fixed so as not to rotate, and the plurality of second utility pipes may be twisted such that when the swing arm swings about the swing axis, the positions of the upper and lower ends of each of the plurality of second utility pipes in a vertical view are different in the circumferential direction around the swing axis.

[0013] (7) In the substrate processing apparatus described in (2) to (6) above, the plurality of second utility pipes may be arranged so as to surround the pivot axis when viewed in the vertical direction.

[0014] (8) A substrate processing apparatus as described in (1) to (7) above, wherein the utility supply unit may supply a fluid as the utility.

[0015] (9) The substrate processing apparatus described in (8) above, wherein the utility supply unit may supply pure water as the fluid.

[0016] (10) A substrate processing apparatus as described in (1) to (9) above, further comprising a polishing head, wherein a polishing pad is attached to the upper surface of the substrate processing table, the surface of the polishing pad forms a polishing surface for polishing the substrate, and the polishing pad may hold the substrate, which is the object to be polished, and polish while pressing it against the polishing surface of the polishing pad on the substrate processing table.

[0017] (11) A substrate processing apparatus as described in (1) to (10) above, wherein the supply line further comprises a slurry supply unit that is inserted into the oscillating arm from outside the oscillating arm and supplies slurry to the upper surface of the substrate processing table.

[0018] (12) The substrate processing apparatus described in (11) above, wherein the slurry supply unit may cross the utility supply unit horizontally within the oscillating arm.

[0019] (13) A substrate processing apparatus as described in (11) or (12) above, wherein the position on the upper surface of the substrate processing table from which the slurry supply unit supplies the slurry may be closer to the center of the substrate processing table than the position on the upper surface of the substrate processing table from which the utility supply unit supplies the utility.

[0020] (14) A substrate processing apparatus as described in (11) or (12) above, wherein at least a part of the utility supply unit is located below the slurry supply unit inside the oscillating arm.

[0021] (15) A substrate processing apparatus as described in (1) to (14) above, wherein the supply line may be provided in the processing unit.

[0022] (16) A substrate processing apparatus as described in (1) to (14) above, further comprising a dresser, wherein the supply line may be provided in the dresser.

[0023] (17) A substrate processing apparatus according to a second aspect of the present invention includes: a substrate processing table; a processing unit that performs predetermined processing on a substrate placed on an upper surface of the substrate processing table; a swing arm extending from an outer side of the substrate processing table toward a space above the substrate processing table; a utility supply unit that is inserted into the swing arm from outside the swing arm and supplies a utility to the swing arm; and a swing mechanism that swings the swing arm about a swing axis, wherein a part of the utility supply unit may extend along the swing axis and be positioned on the swing axis.

[0024] (18) A supply apparatus according to a third aspect of the present invention is a supply apparatus that supplies a utility to the outside from a distal end, and includes: a supply line having a swing arm that swings about a swing axis, and a utility supply unit that is inserted into the swing arm from outside the swing arm and supplies the utility to the outside from the distal end of the swing arm; and a swing mechanism that swings the swing arm about the swing axis, wherein a part of the utility supply unit may extend along the swing axis and be positioned on the swing axis. [Effects of the Invention]

[0025] According to one aspect of the present invention described above, there can be provided a substrate processing apparatus and a supply apparatus that enable swinging of a swing arm through which a utility supply unit is inserted, even while the utility supply unit that supplies a utility to at least a part of the swing arm or to the outside of the swing arm is provided. [Brief Description of Drawings]

[0026] [Figure 1] FIG. 1 is a plan view showing an overall configuration of a substrate processing apparatus according to a first embodiment. [Figure 2] FIG. 2 is a perspective view showing a configuration of a polishing module provided in the substrate processing apparatus according to the first embodiment. [Figure 3] FIG. 3 is an enlarged perspective view of a supply line provided in the substrate processing apparatus according to the first embodiment. [Figure 4]This is a cross-sectional view of the main part of the supply line according to the first embodiment. [Figure 5] This is a plan view showing the arrangement of the supply line, polishing head, dresser, and atomizer on the substrate processing table according to the first embodiment. [Figure 6] This is a perspective view showing the configuration of a cleaning module provided in a substrate processing apparatus according to the second embodiment. [Figure 7] This is an enlarged perspective view showing the configuration of a dresser provided in a substrate processing apparatus according to the third embodiment. [Figure 8] This is a cross-sectional view of the main part of the dresser according to the third embodiment. [Modes for carrying out the invention]

[0027] In the following explanation, "vertical direction" does not necessarily coincide with the vertical direction. Also, in the following explanation, "horizontal direction" does not necessarily have to deviate from the exact horizontal direction.

[0028] <First Embodiment> Hereinafter, a substrate processing apparatus 1 according to the first embodiment of the present invention will be described with reference to the drawings. Figure 1 is a plan view showing the overall configuration of the substrate processing apparatus 1 according to the first embodiment. Figure 2 is a perspective view showing the configuration of the polishing module 21 provided in the substrate processing apparatus 1 according to the first embodiment.

[0029] The substrate processing apparatus 1 is a chemical mechanical polishing (CMP) apparatus for polishing the surface of a substrate W, such as a silicon wafer, to a flat surface. As shown in Figure 1, the substrate processing apparatus 1 includes a rectangular box-shaped housing 2. The housing 2 is formed in a substantially rectangular shape when viewed from above. The inside of the housing 2 is divided by partitions into a loading / unloading section 10, a polishing section 20, and a cleaning section 30. The substrate processing apparatus 1 also includes a substrate transport section 40 that transports the substrate W from the loading / unloading section 10 to the polishing section 20, and a control unit 3 (control panel) that controls the operation of the loading / unloading section 10, the polishing section 20, the cleaning section 30, and the substrate transport section 40.

[0030] The load / unload section 10 includes a front load section 11 for housing the circuit board W. Multiple front load sections 11 are provided on one side of the housing 2 in the longitudinal direction. The multiple front load sections 11 are arranged in the width direction of the housing 2 (a direction perpendicular to the longitudinal direction in a plan view). The front load section 11 can house, for example, an open cassette, an SMIF (Standard Manufacturing Interface) pod, or a FOUP (Front Opening Unified Pod). The SMIF and FOUP are sealed containers that house a cassette of the circuit board W inside and are covered with a partition wall, allowing them to maintain an environment independent of the external space.

[0031] The load / unload unit 10 also includes a transport robot 12 for loading and unloading substrates W from the front load unit 11, and a travel mechanism 13 for moving the transport robot 12 along the alignment of the front load unit 11. The transport robot 12 has two hands, one above and one below, which are used before and after processing the substrates W. For example, the upper hand is used when returning the substrates W to the front load unit 11, and the lower hand is used when removing the substrates W from the front load unit 11 before processing.

[0032] The substrate transport unit 40 includes a substrate transport path 41 that extends in the longitudinal direction of the housing 2. The substrate transport path 41 passes through the area where the cleaning unit 30 is located in a plan view, with one end 41a communicating with the load / unload unit 10 and the other end 41b communicating with the polishing unit 20. The substrate transport path 41 is provided with a slide stage that supports the substrate W, and a stage moving mechanism that moves this slide stage between the one end 41a and the other end 41b. The one end 41a is the entrance for the substrate W, which is normally closed with a shutter and opened when the transport robot 12 of the load / unload unit 10 needs to access it. The other end 41b is the exit for the substrate W, which is normally closed with a shutter and opened when the transport robot 28 of the polishing unit 20 needs to access it.

[0033] The polishing unit 20 comprises a plurality of polishing modules 21 (21A, 21B, 21C, 21D) for polishing the substrate W. The plurality of polishing modules 21 are arranged in the longitudinal direction of the housing 2. As shown in Figure 2, the polishing module 21 includes a substrate processing table (polishing table) 23 on which an upper surface (polishing surface) 23a is formed by a polishing pad 22; a polishing head 24 for holding the substrate W to be polished and polishing it while pressing it against the upper surface 23a of the polishing pad 22 on the substrate processing table 23; a supply line 25 for supplying slurry (polishing liquid), dressing liquid (e.g., pure water), and a large flow rate of pure water (utility) to the upper surface 23a of the substrate processing table 23; a dresser 26 for dressing the upper surface 23a; an atomizer (processing unit) 27 for spraying a mixed fluid of liquid (e.g., pure water) and gas (e.g., nitrogen gas) or liquid (e.g., pure water) in a mist onto the upper surface 23a; and a rocking mechanism 50 for rocking the rocking arm 251 of the supply line 25 around the rocking axis O1.

[0034] The polishing module 21 supplies slurry from a slurry supply unit 253 inserted through a oscillating arm 251 of the supply line 25 to the upper surface 23a of the substrate processing table 23, while pressing the substrate W against the upper surface 23a with the polishing head 24, and further polishing the substrate W to flatten its surface by moving the polishing head 24 and the substrate processing table 23 relative to each other. The dresser 26 has hard particles such as diamond particles or ceramic particles fixed to the rotating tip that contacts the upper surface 23a. In addition, the polishing module 21 supplies a large flow rate of pure water from a utility supply unit 255 inserted through a oscillating arm 251 of the supply line 25 to the upper surface 23a of the substrate processing table 23, while pressing the substrate W against the upper surface 23a with the polishing head 24, and further polishing the substrate W to flatten its surface by moving the polishing head 24 and the substrate processing table 23 relative to each other. The polishing module 21 may polish the substrate W while simultaneously supplying slurry and a large flow rate of pure water to the upper surface 23a of the substrate processing table 23, or it may polish the substrate W while supplying only one of slurry and a large flow rate of pure water to the upper surface 23a of the substrate processing table 23.

[0035] The dresser 26 supplies dressing liquid from a dressing liquid supply unit 254 inserted through a swing arm 251 of the supply line 25 to the upper surface 23a of the substrate processing table 23, and swings while rotating the rotating part at its tip, thereby uniformly dressing the entire upper surface 23a and forming a flat upper surface 23a. The atomizer 27 washes away polishing debris and abrasive particles remaining on the upper surface 23a with a high-pressure fluid, thereby purifying the upper surface 23a and achieving surface sharpening by the dresser 26, which is a mechanical contact, i.e., regeneration of the upper surface 23a. In other words, the atomizer 27, which is a processing unit, performs a predetermined process on the substrate W placed on the upper surface 23a of the substrate processing table 23.

[0036] Returning to Figure 1, the polishing unit 20 includes a transport robot 28, a first exchanger 29a, and a second exchanger 29b. In the polishing unit 20, along the arrangement of multiple polishing modules 21, the first transport position TP1, second transport position TP2, third transport position TP3, and fourth transport position TP4 are set in order from the load / unload unit 10 side. The first transport position TP1, second transport position TP2, third transport position TP3, and fourth transport position TP4 are the positions where the substrate W is transferred to polishing module 21A, polishing module 21B, polishing module 21C, and polishing module 21D, respectively. Each polishing module 21 accesses the first transport position TP1, second transport position TP2, third transport position TP3, and fourth transport position TP4 by the rotation of the support arm 242 (see Figure 2) of the polishing head 24.

[0037] The transport robot 28 transfers substrates W between the substrate transport unit 40, the first exchanger 29a, and the second exchanger 29b. The transport robot 28 is equipped with a hand for holding substrates W, an inversion mechanism for inverting the hand, an extendable arm for supporting the hand, an arm vertical movement mechanism for moving the arm up and down, and an arm rotation mechanism for rotating the arm around an axis extending in the vertical direction. The transport robot 28 is movable between the second transport position TP2 and the third transport position TP3, and distributes the substrates W received from the substrate transport unit 40 to either the first exchanger 29a or the second exchanger 29b. The transport robot 28 also receives the substrates W polished by the polishing module 21 from either the first exchanger 29a or the second exchanger 29b and transfers them to the cleaning unit 30.

[0038] The first exchanger 29a is a mechanism for transporting the substrate W between a first transport position TP1 and a second transport position TP2. The first exchanger 29a includes a plurality of slide stages that support the substrate W, a stage moving mechanism that moves each slide stage horizontally at different heights, a first pusher located at the first transport position TP1, a second pusher located at the second transport position TP2, and the like. Each slide stage has a roughly U-shaped notch through which the first pusher and the second pusher can pass vertically, and moves between the first transport position TP1 and the second transport position TP2 by the stage moving mechanism. The first pusher moves vertically at the first transport position TP1, transferring the substrate W between the slide stage and the polishing head 24 of the polishing module 21A. The second pusher also moves vertically at the second transport position TP2, transferring the substrate W between the slide stage and the polishing head 24 of the polishing module 21B.

[0039] The second exchanger 29b is a mechanism for transporting the substrate W between the third transport position TP3 and the fourth transport position TP4. The second exchanger 29b includes a plurality of slide stages that support the substrate W, a stage movement mechanism that moves each slide stage horizontally at different heights, a third pusher located at the third transport position TP3, a fourth pusher located at the fourth transport position TP4, and the like. Each slide stage has a roughly U-shaped notch through which the third pusher and the fourth pusher can pass vertically, and moves between the third transport position TP3 and the fourth transport position TP4 by the stage movement mechanism. The third pusher moves vertically at the third transport position TP3 to transfer the substrate W between the slide stage and the polishing head 24 of the polishing module 21C. The fourth pusher also moves vertically at the fourth transport position TP4 to transfer the substrate W between the slide stage and the polishing head 24 of the polishing module 21D.

[0040] The cleaning unit 30 comprises a plurality of cleaning modules 31 (31A, 31B, 31C, 31Add) for cleaning the substrate W, and a drying module 32 for drying the cleaned substrate W. The plurality of cleaning modules 31 and drying module 32 are arranged in the longitudinal direction of the housing 2. A transport chamber 33 (wafer station) is provided between cleaning module 31A and cleaning module 31Add. The transport chamber 33 is provided with a stage on which the substrate W received from the transport robot 28 is placed. The cleaning unit 30 also includes a cleaning unit substrate transport mechanism 34 that picks up the substrate W placed on the stage in the transport chamber 33 and transports the substrate W between the plurality of cleaning modules 31, the drying module 32, and the transport chamber 33.

[0041] The cleaning module 31A is located next to the transport chamber 33 and performs primary cleaning of the substrate W. The cleaning module 31B is located next to cleaning module 31A and performs secondary cleaning of the substrate W. The cleaning module 31C is located next to cleaning module 31B and performs tertiary cleaning of the substrate W. The drying module 32 is located next to cleaning module 31C and performs, for example, rotagoni drying (IPA (Iso-Propyl Alcohol) drying). The cleaning module 31Add, located on the opposite side of the transport chamber 33 from cleaning module 31A, is added according to the cleaning specifications and, for example, pre-cleans the substrate W before the cleaning process of cleaning modules 31A, 31B, and 31C.

[0042] The cleaning module 31 is composed of, for example, a roll cleaning module using a roll cleaning member, a pencil cleaning module using a pencil cleaning member, a two-fluid cleaning module using a two-fluid nozzle, and the like. Each cleaning module 31 may be of the same type or different types. Each of these cleaning modules 31 and drying module 32 is equipped with a shuttered opening through which the substrate W and the cleaning unit substrate transport mechanism 34 that transports the substrate W can pass. After drying, a shutter provided in the partition wall between the drying module 32 and the load / unload unit 10 is opened, and the substrate W is removed from the drying module 32 by the transport robot 12.

[0043] Next, we will explain the configuration of the polishing module 21 in detail. As described above, the polishing module 21 comprises a substrate processing table 23, a polishing head 24, a supply line 25, a dresser 26, an atomizer (processing section, atomizer arm) 27, and a rocking mechanism 50.

[0044] The substrate processing table 23 is connected via a table axis to a substrate processing table rotation motor (not shown) located below it, and is rotatable around the table axis. A polishing pad 22 is attached to the upper surface of the substrate processing table 23, and the surface of the polishing pad 22 forms the upper surface (polishing surface) 23a for polishing the substrate W. For the polishing pad 22, for example, Rodel's SUBA800, IC-1000, IC-1000 / SUBA400 (two-layer cloth) are used. SUBA800 is a nonwoven fabric made of fibers hardened with urethane resin. IC-1000 is a hard foamed polyurethane pad with numerous fine pores on its surface, and is also called a perforated pad.

[0045] In the space above the substrate processing table 23, a swing arm 251 of the supply line 25 is installed, and slurry (polishing liquid), dressing liquid, and a large flow rate of pure water are supplied to the upper surface 23a of the polishing pad 22 on the substrate processing table 23 through a nozzle 251a provided at the tip of the swing arm 251 of the supply line 25. As the slurry, for example, a functional liquid containing silica (SiO2) or ceria (CeO2) as abrasive particles is used. As the dressing liquid, for example, pure water is used. The rear end of the swing arm 251 is supported by a shaft 51, and the swing arm 251 is able to swing about the shaft 51.

[0046] The polishing head 24 is designed to hold the substrate W on its underside. The polishing head 24 is connected to a shaft 241, which moves up and down relative to a support arm 242. The up and down movement of the shaft 241 causes the polishing head 24 to move up and down relative to the support arm 242, thereby positioning it. The shaft 241 is rotated by a polishing head rotation motor (not shown). The rotation of the shaft 241 causes the polishing head 24 to rotate around the shaft 241.

[0047] The support arm 242 is configured to pivot about the shaft 243, and the polishing head 24 can move from the substrate W receiving position (first transport position TP1 to fourth transport position TP4 shown in Figure 1) to above the substrate processing table 23 by the rotation of the support arm 242. The polishing head 24, having moved above the substrate processing table 23, presses the substrate W held on its lower surface against the upper surface 23a. At this time, the substrate processing table 23 and the polishing head 24 are rotated, and slurry and a large flow rate of pure water (utility) are supplied to the upper surface 23a from the slurry supply unit 253 and the utility supply unit 255, which are inserted through the oscillating arm 251 that extends into the space above the substrate processing table 23. In this way, while supplying slurry and a large flow rate of pure water onto the polishing pad 22, the substrate W is pressed against the polishing pad 22, causing the substrate W and the polishing pad 22 to move relative to each other and polish the insulating film, metal film, etc. on the substrate W.

[0048] The dresser 26 comprises a shaft 261, a dresser arm 262, and a support arm 263. The dresser 26 is connected to the shaft 261, which is rotatably attached to the tip of the dresser arm 262. The dresser 26 has a circular dressing surface, on which hard particles are fixed by electrodeposition or the like. Examples of these hard particles include diamond particles and ceramic particles. A motor (not shown) is built into the dresser arm 262, and this motor rotates the dresser 26. The other end of the dresser arm 262 is pivotably connected to the support arm 263, which is pivotably supported by a dresser pivoting mechanism 264.

[0049] When dressing the upper surface 23a, the substrate processing table 23 is rotated, and the dresser 26 is rotated by a motor (not shown). Then, the dresser 26 is lowered by a lifting mechanism (not shown), and the lower surface of the dresser 26 is brought into sliding contact with the rotating upper surface 23a. In this state, by swinging the dresser arm 262 and the support arm 263, the dresser 26 can move across the upper surface 23a from the outer edge to the center. At this time, dressing liquid is supplied to the upper surface 23a from the dressing liquid supply unit 254 inserted through the swinging arm 251 of the supply line 25. In this way, while supplying dressing liquid to the upper surface 23a, the dresser 26 can dress the entire upper surface 23a, including its center.

[0050] The dresser 26 does not necessarily have to be equipped with a dresser arm 262. In this case, the shaft 261 is rotatably attached to the tip of the support arm 263, and a motor (not shown) is built into the support arm 263, which rotates the dresser 26.

[0051] The atomizer 27 is positioned above the polishing pad 22 and extends approximately radially across the substrate processing table 23, parallel to the upper surface 23a. The atomizer 27 extends to the outside of the substrate processing table 23 and is fixed to the housing 2 (see Figure 1) or the like via the atomizer oscillating mechanism 271. The atomizer 27 has a nozzle (not shown) on its lower surface 27b, which faces the upper surface 23a. Multiple nozzles are provided, for example, at predetermined intervals along the longitudinal direction of the atomizer 27.

[0052] The atomizer 27 is connected to a pure water supply line (not shown). The pure water supply line is equipped with a control valve, and a control signal is input to the control valve from the control unit 3, which is a CMP controller, to control the flow rate of pure water sprayed from the nozzle. As a result, pure water at an optimal flow rate is sprayed onto the upper surface 23a, removing foreign matter (polishing pad residue, abrasive fluid deposits, etc.) from the upper surface 23a. When a mixed fluid is sprayed from the nozzle, the atomizer 27 is also connected to a gas source.

[0053] Figure 3 is an enlarged perspective view of the supply line 25 according to this embodiment. Figure 4 is a cross-sectional view of the main part of the supply line 25 according to this embodiment. The supply line 25 comprises a swing arm 251, a slurry supply unit 253, a dressing liquid supply unit 254, and a utility supply unit 255.

[0054] The oscillating arm 251 is provided at the upper end of the shaft 51 and extends horizontally. The oscillating arm 251 extends from the outside of the substrate processing table 23 toward the space above the substrate processing table 23. The oscillating arm 251 is formed in a shape that has a cavity inside, through which the slurry supply unit 253, the dressing liquid supply unit 254, and the utility supply unit 255 are inserted. The oscillating arm 251 supports the slurry supply unit 253, the dressing liquid supply unit 254, and the utility supply unit 255 that are inserted inside. A nozzle 251a, which is a discharge unit, is provided at the tip of the oscillating arm 251 on the central side of the substrate processing table 23.

[0055] The slurry supply section 253 is a pipe inserted into the oscillating arm 251 from the outside and supplies slurry from the nozzle 251a to the upper surface 23a of the substrate processing table 23. The slurry supply section 253 is formed from a flexible tube. The slurry supply section 253 is inserted into the interior of the oscillating arm 251 from the side of the oscillating arm 251 at the rear end opposite to the tip (one end where the nozzle 251a is provided) and extends horizontally. The tip of the slurry supply section 253 bends downward inside the oscillating arm 251 and is exposed to the outside at the lower surface of the oscillating arm 251, acting as the nozzle 251a to drip slurry onto the upper surface 23a of the substrate processing table 23.

[0056] The dressing liquid supply unit 254 is a pipe inserted into the rocking arm 251 from the outside and supplies dressing liquid to the upper surface 23a of the substrate processing table 23. The dressing liquid supply unit 254 is formed from a flexible tube. When pure water is supplied as the dressing liquid, the dressing liquid supply unit 254 supplies, for example, 0.5 L / min to 1.5 L / min of pure water. The dressing liquid supply unit 254 is inserted into the rocking arm 251 from the side of the rocking arm 251, opposite the nozzle 251a at the tip of the rocking arm 251, and extends horizontally. The tip of the dressing liquid supply unit 254 bends downward inside the rocking arm 251 and is exposed to the outside at the lower surface of the rocking arm 251, acting as the nozzle 251a to drip dressing liquid onto the upper surface 23a of the substrate processing table 23.

[0057] Furthermore, at least one of the slurry supply unit 253 and the dressing liquid supply unit 254 may be configured such that a portion of it extends along the oscillation axis O1 and is located on the oscillation axis O1. In this case, at least one of the slurry supply unit 253 and the dressing liquid supply unit 254 extends downward in the vertical direction from its upper end and is inserted into the interior of the oscillation arm 251 from the upper surface of the oscillation arm 251.

[0058] The utility supply unit (DIW supply unit) 255 is a pipe inserted into the oscillating arm 251 from the outside of the oscillating arm 251 and supplies a large flow rate of pure water (DIW, De-Ionized Water) as a utility fluid to the upper surface 23a of the substrate processing table 23. The utility supply unit 255 supplies pure water at a rate of, for example, 0.5 L / min to 10 L / min. Preferably, the utility supply unit 255 supplies pure water at a rate of 10 L / min. When the dressing liquid supply unit 254 supplies pure water as the dressing liquid, the amount of pure water supplied by the utility supply unit 255 is greater than the amount of pure water supplied by the dressing liquid supply unit 254.

[0059] The utility supply unit 255 includes a first utility pipe (first DIW pipe) 256, a plurality of second utility pipes (a plurality of second DIW pipes) 257, a third utility pipe (third DIW pipe) 258, and a plurality of pipe connection parts 259 (first pipe connection part 259a, second pipe connection part 259b).

[0060] The first pipe connection 259a connects the first utility pipe 256 and a plurality of second utility pipes 257. The second pipe connection 259b connects the plurality of second utility pipes 257 and the third utility pipe 258. The first utility pipe 256 is fixed at its upper end so as not to rotate, and its lower end is connected to a plurality of second utility pipes 257 by a first pipe connection part 259a.

[0061] Multiple second utility pipes 257 are connected at their upper ends to the first utility pipe 256 by a first pipe connection part 259a, and at their lower ends to the third utility pipe 258 (pipe 258b) by a second pipe connection part 259b. In this embodiment, four second utility pipes 257 are provided, but any number of second utility pipes 257, two or more, may be provided.

[0062] The third utility pipe 258 has its upper end connected to the second utility pipe by a second pipe connection part 259b, extends downward from its upper end in the vertical direction, and is inserted into the interior of the swing arm 251 from the upper surface of the swing arm 251. The third utility pipe 258 swings together with the swing arm 251 around the swing axis O1. The third utility pipe 258 is composed of a joint 258a and a plurality of pipes 258b, 258c, and the plurality of pipes 258b, 258c are connected by the joint 258a.

[0063] The joint 258a is bent at a right angle (90°). The joint 258a may also be bent at an angle other than a right angle (for example, 45° or 60°). The upper end of the pipe 258b is connected to the second utility pipe by the second pipe connection part 259b, and the lower end is inserted inside the swing arm 251 and connected to the pipe 258c by the joint 258a. The pipe 258c is inserted inside the swing arm 251, and one end of it is connected to the pipe 258b by the joint 258a. The pipe 258c extends horizontally from the joint 258a, and the other end (tip) is bent downward inside the tip block 252, exposed to the outside on the lower surface of the tip block 252, and acts as a nozzle 251a to drip pure water onto the upper surface 23a of the substrate processing table 23.

[0064] The first utility pipe 256 and a portion of the third utility pipe 258 (pipe 258b) extend along the oscillation axis O1 and are located on the oscillation axis O1. In other words, a portion of the utility supply section 255 extends along the oscillation axis O1 and is located on the oscillation axis O1. In a vertical view (view in the direction of the oscillation axis O1), the first utility pipe 256 and pipe 258b of the third utility pipe 258 overlap with the oscillation axis O1.

[0065] The first pipe connection 259a and the second pipe connection 259b are located on the oscillation axis O1 and overlap with the oscillation axis O1 in a vertical view. In addition, the multiple second utility pipes 257 extend along the oscillation axis O1 and are arranged to surround the oscillation axis O1 in a vertical view.

[0066] The first utility pipe 256, the multiple second utility pipes 257, and the third utility pipe 258 (pipes 258b, 258c) are formed from flexible tubular bodies.

[0067] The inner diameter, outer diameter, and flow area of ​​the first utility pipe 256 and the third utility pipe 258 (pipes 258b and 258c) are the same. The inner diameter, outer diameter, and flow area of ​​the first utility pipe 256 and the third utility pipe 258 (pipes 258b and 258c) are larger than the inner diameter, outer diameter, and flow area of ​​the slurry supply section 253 and the dressing liquid supply section 254. The inner diameter, outer diameter, and flow area of ​​the first utility pipe 256 and the third utility pipe 258 (pipes 258b and 258c) may be different. Furthermore, at least one of the inner diameter, outer diameter, and flow area of ​​the first utility pipe 256 and the third utility pipe 258 (pipes 258b, 258c) may be the same as at least one of the inner diameter, outer diameter, and flow area of ​​the slurry supply section 253 and the dressing liquid supply section 254.

[0068] On the other hand, the inner diameter, outer diameter, and flow area of ​​the second utility pipe 257 are smaller than the inner diameter, outer diameter, and flow area of ​​the first utility pipe 256 and the third utility pipe 258 (pipes 258b and 258c), respectively. Because the outer diameter of the second utility pipe 257 is smaller than that of the first utility pipe 256 and the third utility pipe 258 (pipes 258b and 258c), the second utility pipe 257 has higher flexibility than the first utility pipe 256 and the third utility pipe 258 (pipes 258b and 258c). In other words, the second utility pipe 257 is more easily bent and twisted than the first utility pipe 256 and the third utility pipe 258 (pipes 258b and 258c).

[0069] Multiple second utility pipes 257 are configured such that the sum of their flow area is approximately the same as the flow area of ​​the first utility pipe 256 and the third utility pipes 258 (pipes 258b and 258c). Specifically, the multiple second utility pipes 257 are configured such that the sum of their flow area is 80% or more of the flow area of ​​the first utility pipe 256 and the flow area of ​​the third utility pipes 258 (pipes 258b and 258c), respectively.

[0070] The utility supply unit 255, configured as described above, branches the pure water supplied from the outside to the first utility pipe 256 via the first pipe connection unit 259a and supplies it to a plurality of second utility pipes 257. The utility supply unit 255 then merges the pure water supplied to the plurality of second utility pipes 257 via the second pipe connection unit 259b and supplies it to the third utility pipe 258 (pipe 258b).

[0071] As shown in Figure 4, the slurry supply section 253 and the dressing liquid supply section 254 are inserted into the interior of the swing arm 251 from a position opposite to the tip of the swing arm 251 (the end where the nozzle 251a is provided) than the utility supply section 255 (third utility pipe 258, pipe 258b). Therefore, inside the swing arm 251, the slurry supply section 253 and the dressing liquid supply section 254 cross the utility supply section 255 (third utility pipe 258, pipe 258b) in the horizontal direction. That is, inside the swing arm 251, when viewed from the direction perpendicular to the extension direction of pipe 258c along the horizontal direction and the vertical direction (in the cross-sectional view shown in Figure 4), the slurry supply section 253 and the dressing liquid supply section 254 intersect the utility supply section 255 (third utility pipe 258, pipe 258b).

[0072] Within the oscillating arm 251, the slurry supply section 253 and the dressing fluid supply section 254 may bend to cross the utility supply section 255 (third utility pipe 258, pipe 258b). Within the oscillating arm 251, the slurry supply section 253 and the dressing fluid supply section 254 may surround (encircle) the utility supply section 255 (third utility pipe 258, pipe 258b). That is, within the oscillating arm 251, the slurry supply section 253 and the dressing fluid supply section 254 may sandwich the pipe 258c from both sides in the direction of extension of the pipe 258c along the horizontal direction and in the direction perpendicular to the vertical direction.

[0073] Furthermore, as shown in Figure 4, within the swing arm 251, the utility supply unit 255 (third utility piping 258, piping 258c) is located below the slurry supply unit 253 and the dressing liquid supply unit 254. Furthermore, within the swing arm 251, the utility supply unit 255 (third utility piping 258, piping 258c) may be located above the slurry supply unit 253 and the dressing liquid supply unit 254.

[0074] Figure 5 is a plan view showing the arrangement of the supply line 25, polishing head 24, dresser 26, and atomizer 27 on the substrate processing table 23 according to this embodiment. As shown in Figure 5, the polishing head 24, dresser 26, and atomizer 27 are arranged so as to divide the space on the polishing pad 22 into three circumferential sections with respect to the rotation center O of the substrate processing table 23. The polishing head 24 and atomizer 27 are positioned on opposite sides of the rotation center O of the substrate processing table 23. The supply line 25 is positioned adjacent to the polishing head 24 and atomizer 27 and supplies slurry, dressing liquid, and pure water to the fluid dropping position P1 on the upper surface 23a of the substrate processing table 23.

[0075] The fluid dropping position P1 is set near the rotation center O of the substrate processing table 23. The fluid dropping position P1 may coincide with the rotation center O of the substrate processing table 23, or the rotation center O of the substrate processing table 23 may overlap with the fluid dropping position P1. Alternatively, the fluid dropping position P1 may be a region occupying a certain range on the upper surface 23a of the substrate processing table 23.

[0076] The positions on the upper surface 23a of the substrate processing table 23 where the slurry supply unit 253 supplies the slurry (the slurry dropping position by the slurry supply unit 253), the positions on the upper surface 23a of the substrate processing table 23 where the dressing liquid supply unit 254 supplies the dressing liquid (the dressing liquid dropping position by the dressing liquid supply unit 254), and the positions on the upper surface 23a of the substrate processing table 23 where the utility supply unit 255 supplies pure water (the pure water dropping position by the utility supply unit 255) do not need to coincide perfectly, but it is sufficient that they overlap with the fluid dropping position P1. In this embodiment, as shown in Figures 3 and 5, the dropping position of the slurry by the slurry supply unit 253 is closer to the rotation center O of the substrate processing table 23 than the dropping position of the dressing liquid by the dressing liquid supply unit 254 and the dropping position of the pure water by the utility supply unit 255. Also, the dropping position of the dressing liquid by the dressing liquid supply unit 254 is closer to the rotation center O of the substrate processing table 23 than the dropping position of the pure water by the utility supply unit 255. Furthermore, the dropping position of the dressing liquid by the dressing liquid supply unit 254 may be closer to the rotation center O of the substrate processing table 23 than the dropping position of the slurry by the slurry supply unit 253. Also, the dropping position of the pure water by the utility supply unit 255 may be closer to the rotation center O of the substrate processing table 23 than the dropping position of the slurry by the slurry supply unit 253 and the dropping position of the dressing liquid by the dressing liquid supply unit 254.

[0077] The swing arm 251 of the supply line 25 is configured to swing around a shaft 51. In the plan view shown in Figure 5, the shaft 51 constitutes a swing mechanism 50 that swings the swing arm 251 of the supply line 25 along a swing path L between a retracted position P2 set outside the substrate processing table 23 and a fluid dripping position P1. The swing mechanism 50 comprises a shaft 51 and a rotational drive unit (not shown). The rotational drive unit includes a motor that rotates the shaft 51 around a swing axis O1 extending vertically outside the substrate processing table 23. When the shaft 51 rotates, the swing arm 251 of the supply line 25 swings around the swing axis O1 (around the shaft 51), as shown in Figure 5. In other words, the swing mechanism 50 swings the swing arm 251 around the swing axis O1.

[0078] As shown in Figure 2, at least a portion of the oscillating arm 251 of the supply line 25 is positioned below the upper surface 27a of the atomizer 27. That is, the atomizer 27 is positioned above the oscillating path L of the supply line 25. The supply line 25 is configured to drop slurry, dressing liquid, and pure water at a position below the upper surface 27a of the atomizer 27 at the fluid dropping position P1 set on the substrate processing table 23. The oscillating arm 251 of the supply line 25 is configured to be movable in the vertical direction or to be rotatable around an axis extending horizontally. Therefore, when the oscillating arm 251 oscillates along the oscillating path L, it is configured to move upward so as not to interfere with the atomizer 27.

[0079] Furthermore, the entire oscillating arm 251 may be positioned above the upper surface 27a of the atomizer 27. In this case, the oscillating arm 251 will not interfere with the atomizer 27 even if it does not move upward when moving along the oscillating path L. Also, in this case, the oscillating arm 251 does not need to be configured to move vertically, nor does it need to be configured to rotate around an axis extending horizontally.

[0080] When the oscillating arm 251 oscillates around the oscillating axis O1, parts of the slurry supply unit 253 and the dressing fluid supply unit 254, which are located inside the oscillating arm 251, also oscillate around the oscillating axis O1. Simultaneously, in conjunction with this oscillating motion, parts of the slurry supply unit 253 and the dressing fluid supply unit 254, which are not located inside the oscillating arm 251, also twist or bend.

[0081] When the oscillating arm 251 oscillates around the oscillating axis O1, a portion of the utility supply unit 255 located inside the oscillating arm 251 also oscillates around the oscillating axis O1. In other words, when the oscillating arm 251 oscillates around the oscillating axis O1, the pipe 258c of the third utility pipe 258 also oscillates around the oscillating axis O1. When pipe 258c of the third utility pipe 258 oscillates around the oscillation axis O1, pipe 258b of the third utility pipe 258 rotates in place in a twisting motion in conjunction with the oscillating motion, and the second pipe connection part 259b rotates in place. Then, multiple second utility pipes 257 twist, the first pipe connection part 259a rotates in place, and the first utility pipe 256 rotates in place in a twisting motion.

[0082] Here, when the swing arm 251 swings about the swing axis O1, the multiple second utility pipes 257 twist such that the positions of the upper and lower ends of each of the multiple second utility pipes 257 differ (shift) in the circumferential direction around the swing axis O1 when viewed in the vertical direction (viewed in the direction of the swing axis O1). As a result, the utility supply unit 255 allows the swinging motion of the swing arm 251 about the swing axis O1. In other words, by providing multiple second utility pipes 257 with small inner and outer diameters and high flexibility (easily bent and twisted) between the first utility pipe 256 and the third utility pipe 258, which have large inner and outer diameters, it is possible to supply a large flow rate of pure water by the utility supply unit 255 while allowing the swing arm 251 to swing around the swing axis O1.

[0083] As described above, the substrate processing apparatus 1 of this embodiment comprises a substrate processing table 23, a processing unit 27 that performs predetermined processing on a substrate W placed on the upper surface 23a of the substrate processing table 23, a supply line 25 having a swing arm 251 that extends from the outside of the substrate processing table 23 toward the space above the substrate processing table 23, and a utility supply unit 255 that is inserted into the swing arm 251 from the outside of the swing arm 251 and supplies utilities to the substrate W placed on the upper surface 23a of the substrate processing table 23, and a swing mechanism 50 that swings the swing arm 251 about a swing axis O1, wherein a part of the utility supply unit 255 extends along the swing axis O1 and is located on the swing axis O1. With this configuration, it is possible to provide a substrate processing apparatus 1 that allows the swing arm 251 through which the utility supply unit 255 is inserted to swing while a utility supply unit 255 that supplies utilities to the substrate processing table 23 is provided.

[0084] Furthermore, the utility supply unit 255 includes a first utility pipe 256 that extends along and is located on the pivot axis O1, a plurality of second utility pipes 257 that extend along the pivot axis O1 and are connected to the first utility pipe 256, a third utility pipe 258 that partially extends along and is located on the pivot axis O1, is connected to the plurality of second utility pipes 257, is inserted into the pivot arm 251 and pivots together with the pivot arm 251 around the pivot axis O1, a first pipe connection part 259a that connects the first utility pipe 256 and the plurality of second utility pipes 257, and a second pipe connection part 259b that connects the plurality of second utility pipes 257 and the third utility pipe 258. With this configuration, the pivot arm 251 through which the utility supply unit 255 is inserted can be made to swing even more easily.

[0085] Furthermore, the second utility pipe 257 has greater flexibility than the first utility pipe 256 and the third utility pipe 258. This configuration makes the second utility pipe 257 more flexible and prone to twisting, thereby making it easier to swing the swing arm 251 through which the utility supply section 255 is inserted.

[0086] Furthermore, the outer diameter of the second utility pipe 257 is smaller than the outer diameter of the first utility pipe 256 and the outer diameter of the third utility pipe 258. This configuration gives the second utility pipe 257 high flexibility, making it easier to bend and twist, thereby making it easier to swing the swing arm 251 through which the utility supply section 255 is inserted.

[0087] Furthermore, the sum of the flow area of ​​the multiple second utility pipes 257 is 80% or more of the flow area of ​​the first utility pipe 256 and the flow area of ​​the third utility pipe 258, respectively. With this configuration, a sufficient amount of utility can be supplied through the utility supply unit 255 while making it easy to swing the swing arm 251 through which the utility supply unit 255 is inserted.

[0088] Furthermore, the upper end of the first utility pipe 256 is fixed so as not to rotate, and when the swing arm 251 swings around the swing axis O1, the multiple second utility pipes 257 twist so that the positions of the upper and lower ends of each of the multiple second utility pipes 257 differ in the circumferential direction around the swing axis O1 when viewed in the vertical direction. With this configuration, the twisting of the multiple second utility pipes 257 makes it easier to swing the swing arm 251 through which the utility supply unit 255 is inserted.

[0089] Furthermore, in a vertical view, the multiple second utility pipes 257 are arranged to surround the pivot axis O1. With this configuration, only a portion of the multiple second utility pipes 257 do not twist, and each of the multiple second utility pipes 257 becomes more prone to twisting, thereby making it easier to pivot the pivot arm 251 through which the utility supply unit 255 is inserted.

[0090] Furthermore, the utility supply unit 255 supplies fluid as a utility. With this configuration, fluid can be supplied as a utility to the upper surface 23a of the substrate processing table 23 while allowing the swinging arm 251 through which the utility supply unit 255 is inserted to swing.

[0091] Furthermore, the utility supply unit 255 supplies pure water as a fluid. With this configuration, pure water can be supplied as a utility to the upper surface 23a of the substrate processing table 23 while allowing the swinging arm 251 through which the utility supply unit 255 is inserted to swing.

[0092] Furthermore, the utility supply unit 255 has a slurry supply unit 253 that is inserted into the oscillating arm 251 from outside the oscillating arm 251 and supplies slurry to the upper surface 23a of the substrate processing table 23. With this configuration, slurry can be supplied to the upper surface 23a of the substrate processing table 23 along with the utility while allowing the oscillating arm 251 through which the utility supply unit 255 is inserted to oscillate.

[0093] Furthermore, within the oscillating arm 251, the slurry supply unit 253 crosses the utility supply unit 255 horizontally. This configuration allows for the efficient arrangement of both the slurry supply unit 253 and the utility supply unit 255 while both are inserted into the oscillating arm 251.

[0094] Furthermore, the position on the upper surface 23a of the substrate processing table 23 where the slurry supply unit 253 supplies slurry is closer to the center of the substrate processing table 23 than the position on the upper surface 23a of the substrate processing table 23 where the utility supply unit 255 supplies utility. With this configuration, slurry can be supplied to a position on the upper surface 23a of the substrate processing table 23 that is closer to the center of the substrate processing table 23.

[0095] Furthermore, within the oscillating arm 251, at least a portion of the utility supply unit 255 is positioned below the slurry supply unit 253. With this configuration, the utility supply unit 255 can be supported upward by the lower surface of the oscillating arm 251 within the oscillating arm 251, thereby enabling a stable supply of utility to the substrate processing table 23 through the utility supply unit 255.

[0096] <Second Embodiment> Hereinafter, a substrate processing apparatus 1A according to a second embodiment of the present invention will be described with reference to the drawings. Figure 6 is a perspective view showing the configuration of a cleaning module 311 provided in the substrate processing apparatus according to the second embodiment. Regarding the substrate processing apparatus 1A according to this embodiment, the explanation of points common to the substrate processing apparatus 1 of the first embodiment will be omitted or the same reference numerals will be used for explanation, and the explanation will focus on the differences.

[0097] The substrate processing apparatus 1A is a substrate cleaning apparatus for cleaning the surface of a substrate W such as a silicon wafer. The substrate processing apparatus 1A includes a cleaning module 311. As shown in Figure 6, the cleaning module 311 includes a substrate processing table (cleaning table) 23A having an upper surface 23a, a supply line 25A for supplying cleaning liquid (utility, for example, pure water) to the upper surface 23a of the substrate processing table 23A, and a rocking mechanism 50 for rocking the rocking arm 251 of the supply line 25A around a rocking axis O1.

[0098] The supply line 25A comprises a swing arm 251 and a utility supply unit 255. In this embodiment, the swing arm 251 has the utility supply unit 255 inserted through it and supports the utility supply unit 255 inserted through it.

[0099] The substrate processing table 23A has a plurality of holding parts 231. The plurality of holding parts 231 grip the substrate W placed on the upper surface 23a of the substrate processing table 23A and hold it on the upper surface 23a. The substrate W held by the plurality of holding parts 231 does not detach from the upper surface 23a even when the substrate processing table 23A rotates around the table axis.

[0100] In the example shown in Figure 6, four holding parts 231 are provided, and the four holding parts 231 are arranged at equal intervals in the circumferential direction around the table axis of the substrate processing table 23A. Any number of holding parts 231 can be provided as long as the substrate W can be held on the upper surface 23a of the substrate processing table 23A. For example, only one holding part 231 may be provided, or multiple holding parts 231 other than four may be provided.

[0101] As described above, in this embodiment, a substrate processing apparatus 1A is provided that allows the swinging arm 251 through which the utility supply unit 255 is inserted to swing, while a utility supply unit 255 is provided to supply utilities to the substrate processing table 23A.

[0102] <Third Embodiment> Hereinafter, a dresser 26A according to a third embodiment of the present invention will be described with reference to the drawings. Figure 7 is an enlarged perspective view showing the configuration of the dresser 26A according to the third embodiment. Figure 8 is a cross-sectional view of the main part of the dresser 26A according to the third embodiment. With respect to the substrate processing apparatus 1B according to this embodiment, the explanation of points common to the substrate processing apparatus 1 of the first embodiment will be omitted or the same reference numerals will be used for explanation, and the explanation will focus on the differences.

[0103] The substrate processing apparatus 1B of this embodiment has a polishing module 211. The polishing module 211 includes a dresser 26A instead of the dresser 26 of the first embodiment described above. The polishing module 211 of the substrate processing apparatus 1B of this embodiment may or may not include the utility supply unit (DIW supply unit) 255 of the first embodiment.

[0104] The dresser 26A comprises a shaft 261, a support arm (oscillating arm) 263, a first dresser cover 265, a second dresser cover 265A, a rotary motor 266, a lifting mechanism 267, a sensor 268, and a utility supply unit 269. The dresser 26A is connected to the shaft 261, which is rotatably attached to the tip of the support arm 263. The dresser 26A in this embodiment may also include a dresser arm 262, similar to the dresser 26 in the first embodiment.

[0105] The support arm 263 extends from the outside of the substrate processing table 23 toward the space above the substrate processing table 23. The support arm 263 is supported by the dresser oscillating mechanism 264 so as to be able to swing around the oscillating axis O2. The dresser swing mechanism 264 swings the support arm 263 around the swing axis O2. The dresser swing mechanism 264 is located below the support arm 263. Alternatively, the dresser swing mechanism 264 may be located above the support arm 263.

[0106] The first dresser cover 265 and the second dresser cover 265A are each formed in a hollow cylindrical shape. The diameter of the first dresser cover 265 is smaller than the diameter of the second dresser cover 265A. As a result, the first dresser cover 265 is inserted through the second dresser cover 265A, and the second dresser cover 265A is positioned to cover the outer circumference of the first dresser cover 265. Therefore, the first dresser cover 265 and the second dresser cover 265A function as a seal (labyrinth seal) to prevent foreign matter (e.g., water, dust, etc.) from entering the interior of the second dresser cover 265A and the first dresser cover 265A. Note that the dresser 26A does not necessarily have to be equipped with the first dresser cover 265 and the second dresser cover 265A.

[0107] The rotary motor 266 rotates the dresser 26A. The lifting mechanism 267 lowers the dresser 26A, bringing the lower surface of the dresser 26A into sliding contact with the rotating upper surface 23a of the substrate processing table 23. The sensor 268 monitors whether there is any abnormality in the dresser 26A, or the condition of the upper surface 23a of the substrate processing table 23, etc.

[0108] The utility supply unit 269 is inserted through the first dresser cover 265, the second dresser cover 265A, and the support arm 263. The utility supply unit 269 supplies electricity as a utility to the rotary motor 266, the lifting mechanism 267, and the sensor 268 located inside the support arm 263. In other words, the utility supply unit 269 is inserted into the support arm 263 from the outside and supplies utility to the support arm 263.

[0109] A portion (first portion) of the utility supply unit 269 extends along the oscillation axis O2 and is located on the oscillation axis O2. In a vertical view (view in the direction of the oscillation axis O2), the first portion of the utility supply unit 269 overlaps with the oscillation axis O2. The other portion (second portion) of the utility supply unit 269 extends inside the support arm 263 and oscillates together with the support arm 263 around the oscillation axis O2.

[0110] The utility supply section 269 extends from above downwards and is then inserted into the support arm 263 from the upper surface. Alternatively, the utility supply section 269 may extend from below upwards and then be inserted into the support arm 263 from the lower surface.

[0111] As described above, in this embodiment, a substrate processing apparatus 1B is provided that allows the support arm 263 through which the utility supply unit 269 is inserted to swing, while a utility supply unit 269 for supplying utilities to the dresser 26A is provided.

[0112] While preferred embodiments of the present invention have been described and explained above, it should be understood that these are illustrative and should not be considered limiting. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the invention. Therefore, the present invention should not be considered limited by the foregoing description, but rather limited by the claims.

[0113] In the first embodiment described above, an example was described in which the supply line 25 has only one slurry supply unit 253, but the supply line 25 may have multiple slurry supply units 253. In this case, the slurry dispensing positions of each of the multiple slurry supply units 253 may be different from each other. Also in this case, within the oscillating arm 251, the multiple slurry supply units 253 may surround the utility supply unit 255 (third utility piping 258, piping 258b).

[0114] In the first embodiment described above, an example was described in which the supply line 25 includes a slurry supply unit 253, a dressing liquid supply unit 254, and a utility supply unit 255. However, the supply line 25 may not include at least one of the slurry supply unit 253 and the dressing liquid supply unit 254. The supply line 25 may not include the slurry supply unit 253 and the dressing liquid supply unit 254, and may only include the utility supply unit 255.

[0115] In the first embodiment described above, the slurry supply unit 253, the dressing liquid supply unit 254, the first utility pipe 256, the plurality of second utility pipes 257, and the third utility pipe 258 (pipes 258b, 258c) may be formed from materials other than flexible tubular bodies, as long as they allow for oscillating motion around the oscillation axis O1 of the oscillation arm 251.

[0116] In the first embodiment described above, the slurry supply unit 253, the dressing liquid supply unit 254, the first utility pipe 256, the plurality of second utility pipes 257, and the third utility pipe 258 (pipes 258b, 258c) may be formed from a material other than a flexible tubular body, but only in part. For example, the slurry supply section 253, the dressing liquid supply section 254, and the piping 258c of the third utility piping 258 may be formed from a material other than a flexible tubular body only in the portion exposed to the outside on the lower surface of the swing arm 251, while the remaining portion is formed from a flexible tubular body. For example, the first utility pipe 256, the multiple second utility pipes 257, and the third utility pipe 258 (pipes 258b, 258c) may be formed from a material other than a flexible tube only in the portion connected to other components (e.g., pipe connection part 259 or fitting 258a), while the remaining portion is formed from a flexible tube.

[0117] In the first and second embodiments described above, the utility supply unit 255 extends from above downward and is then inserted into the oscillating arm 251, and the oscillating mechanism 50 (shaft 51) is provided below the oscillating arm 251. However, the utility supply unit 255 may extend downward from above and then be inserted into the oscillating arm 251, and the oscillating mechanism 50 (shaft 51) may be provided above the oscillating arm 251. Alternatively, the utility supply section 255 may extend upward from below and then be inserted into the oscillating arm 251, and the oscillating mechanism 50 (shaft 51) may be provided above the oscillating arm 251. Alternatively, the utility supply section 255 may extend upward from below and then be inserted into the oscillating arm 251, and the oscillating mechanism 50 (shaft 51) may be provided below the oscillating arm 251.

[0118] In the first embodiment described above, the slurry supply unit 253 and the dressing liquid supply unit 254 extend from top to bottom and are then inserted into the swing arm 251. However, the slurry supply unit 253 and the dressing liquid supply unit 254 may extend from bottom to top and then be inserted into the swing arm 251.

[0119] In the first embodiment described above, an example was described in which a supply line 25, provided separately from the atomizer 27 and dresser 26, supplies slurry, dressing liquid, and pure water to the substrate processing table 23. However, the atomizer 27 may supply slurry, dressing liquid, and at least one of the pure water to the substrate processing table 23. That is, the supply line 25 may be provided on the atomizer 27. In this case, for example, the atomizer 27 functions as a swing arm 251, and at least one of the slurry supply unit 253, dressing liquid supply unit 254, and utility supply unit 255 is inserted inside the atomizer 27. By providing the supply line 25 on the atomizer 27 in this way, space can be saved.

[0120] Furthermore, in the first embodiment described above, the dresser 26 may supply slurry, dressing liquid, and at least one of pure water to the substrate processing table 23. That is, the supply line 25 may be provided on the dresser 26. In this case, for example, the dresser arm 262 and support arm 263 of the dresser 26 function as a swing arm 251, and at least one of the slurry supply unit 253, the dressing liquid supply unit 254, and the utility supply unit 255 is inserted inside the dresser arm 262 and the support arm 263. By providing the supply line 25 on the dresser 26 in this way, space can be saved.

[0121] In the first and second embodiments described above, an example was described in which the utility supply unit 255 comprises a first utility pipe 256, a plurality of second utility pipes 257, a third utility pipe 258, and a plurality of pipe connection parts 259. However, the utility supply unit 255 does not necessarily have to include the first utility pipe 256, the plurality of second utility pipes 257, and the plurality of pipe connection parts 259. In this case, the upper end of the third utility pipe 258 (pipe 258b) is fixed so as not to rotate, and pure water is supplied to the third utility pipe 258 from the outside.

[0122] In the first and second embodiments described above, an example was described in which the utility supply unit 255 supplies a large flow rate of pure water as a utility to the upper surface 23a of the substrate processing table 23. However, the utility supply unit 255 may supply utilities other than pure water. For example, in the first embodiment described above, the utility supply unit 255 may supply slurry as a utility to the upper surface 23a of the substrate processing table 23. In this case, the supply line 25 does not need to include the slurry supply unit 253. For example, in the first embodiment described above, the utility supply unit 255 may supply dressing liquid as a utility to the upper surface 23a of the substrate processing table 23. In this case, the supply line 25 does not need to include the dressing liquid supply unit 254.

[0123] For example, the utility supply unit 255 may supply gas as a utility. For example, the utility supply unit 255 may supply electricity as a utility (this may also be an electric wire). For example, the utility supply unit 255 may supply vacuum as a utility (it may also be a vacuum generator that provides a vacuum state).

[0124] In the first and second embodiments described above, an example was described in which the utility supply unit 255 supplies utility (high-flow rate pure water) to the upper surface 23a of the substrate processing table 23. However, the utility supply unit 255 may also supply utility to components or equipment inside the oscillating arm 251. That is, the utility supply unit 255 may supply utility to at least a part of the oscillating arm 251. In this case, the utility supply unit 255 may supply gas, electricity, or vacuum as utility. For example, if the dresser arm 262 and support arm 263 of the dresser 26 function as a swing arm 251, the utility supply unit 255 may supply utilities to the internal components or equipment of the dresser arm 262 and support arm 263 (for example, a motor provided on the dresser 26, various sensors such as image sensors, or a lifting stage for raising and lowering sensors, etc.). In this case, the utility supply unit 255 may supply gas, electricity, or vacuum as utilities.

[0125] In the first embodiment described above, a configuration was illustrated in which a utility supply unit 255, which supplies a large flow rate of pure water as a utility, is applied to the polishing module 21 of the substrate processing apparatus 1. However, as in the second embodiment described above, the utility supply unit 255 may be applied to components other than the polishing module 21 of the substrate processing apparatus 1. For example, the utility supply unit 255 may be applied to the cleaning module 31 of the substrate processing apparatus 1. The utility supply unit 255 may also be applied to substrate processing apparatuses other than CMP apparatuses (for example, back surface polishing apparatuses, bevel polishing apparatuses, etching apparatuses, or plating apparatuses). The utility supply unit 255 may also be applied to the drying module 32. In this case, the utility supply unit 255 may supply gas, electricity, or vacuum as a utility.

[0126] Furthermore, a configuration comprising a supply line 25 for supplying utilities to the outside may be applied as a supply device to a substrate processing apparatus or a configuration other than a substrate processing apparatus. In this case, the supply device is a supply device that supplies utilities to the outside from its tip, and comprises a supply line 25 having a swing arm 251 that swings about a swing axis O1, and a utility supply section 255 that is inserted into the swing arm 251 from outside the swing arm 251 and supplies utilities to the outside from the tip of the swing arm 251, and a swing mechanism 50 that swings the swing arm 251 about the swing axis O1, and a part of the utility supply section 255 may extend along the swing axis O1 and be located on the swing axis O1.

[0127] A substrate processing apparatus may be adopted that combines the configurations of multiple embodiments from the first to third embodiments described above. For example, the cleaning module 311 of the second embodiment may be applied to the cleaning module 31 of the substrate processing apparatus 1 of the first embodiment. For example, the polishing module 21 of the substrate processing apparatus 1 of the first embodiment may be equipped with the dresser 26A of the third embodiment instead of the dresser 26. [Explanation of symbols]

[0128] 1, 1A, 1B... Substrate processing equipment, 22... Polishing pad, 23, 23A... Substrate processing table, 23a... Top surface, 25... Supply line, 251... Swivel arm, 251a... Nozzle, 253... Slurry supply unit, 254... Dressing liquid supply unit, 255, 269... Utility supply unit, 256... First utility piping (first DIW piping), 257... Second utility piping (second DIW piping), 258...Third utility piping (third DIW piping), 258a...Fittings, 258b, 258c...Piping, 259...Piping connection, 259a...First piping connection, 259b...Second piping connection, 26, 26A...Dresser, 27...Atomizer (processing section), 27a...Top surface, 50...Oscillating mechanism, P1...Fluid dripping position, P2...Retracted position, W...Substrate, O1, O2...Oscillating axis

Claims

1. A circuit board processing table, A processing unit that performs predetermined processing on a substrate placed on the upper surface of the substrate processing table, A supply line comprising: a pivoting arm extending from the outside of the substrate processing table toward the space above the substrate processing table; and a utility supply unit inserted into the pivoting arm from the outside of the pivoting arm and supplying utilities to the substrate placed on the upper surface of the substrate processing table; A rocking mechanism that rocks the rocking arm around the rocking axis, Equipped with, A portion of the utility supply unit extends along the pivot axis and is located on the pivot axis, wherein the substrate processing apparatus is a substrate processing apparatus.

2. The aforementioned utility supply unit is A first utility pipe that extends along the pivot axis and is located on the pivot axis, A plurality of second utility pipes extending along the pivot axis and connected to the first utility pipe, A third utility pipe, partly extending along the pivot axis and located on the pivot axis, connected to the plurality of second utility pipes, inserted into the pivot arm, and pivoting together with the pivot arm around the pivot axis, A first pipe connection section that connects the first utility pipe and the plurality of second utility pipes, The substrate processing apparatus according to claim 1, further comprising a plurality of second utility pipes and a second pipe connection portion for connecting the third utility pipes.

3. The substrate processing apparatus according to claim 2, wherein the second utility pipe has higher flexibility than the first utility pipe and the third utility pipe.

4. The substrate processing apparatus according to claim 3, wherein the outer diameter of the second utility pipe is smaller than the outer diameter of the first utility pipe and the outer diameter of the third utility pipe, respectively.

5. The substrate processing apparatus according to claim 3, wherein the sum of the flow path areas of the plurality of second utility pipes is 80% or more of the flow path area of ​​the first utility pipe and the flow path area of ​​the third utility pipe, respectively.

6. The upper end of the first utility pipe is fixed in a non-rotatable manner. The substrate processing apparatus according to claim 2, wherein when the swing arm swings about the swing axis, the plurality of second utility pipes twist such that the positions of the upper end and the lower end of each of the plurality of second utility pipes are different in the circumferential direction around the swing axis when viewed in the vertical direction.

7. In a vertical view, the plurality of second utility pipes are arranged to surround the pivot axis, as described in claim 2.

8. The substrate processing apparatus according to claim 1, wherein the utility supply unit supplies fluid as the utility.

9. The substrate processing apparatus according to claim 8, wherein the utility supply unit supplies pure water as the fluid.

10. Equipped with an additional polishing head, A polishing pad is attached to the upper surface of the substrate processing table, and the surface of the polishing pad forms a polishing surface for polishing the substrate. The polishing pad holds the substrate, which is the object to be polished, and polishes it while pressing it against the polishing surface of the polishing pad on the substrate processing table. The substrate processing apparatus according to claim 1.

11. The substrate processing apparatus according to claim 10, wherein the supply line is inserted into the rocking arm from outside the rocking arm and further comprises a slurry supply unit that supplies slurry to the upper surface of the substrate processing table.

12. The substrate processing apparatus according to claim 11, wherein, within the oscillating arm, the slurry supply unit crosses the utility supply unit in a horizontal direction.

13. The substrate processing apparatus according to claim 11, wherein the position on the upper surface of the substrate processing table from which the slurry supply unit supplies slurry is closer to the center of the substrate processing table than the position on the upper surface of the substrate processing table from which the utility supply unit supplies the utility.

14. The substrate processing apparatus according to claim 11, wherein at least a portion of the utility supply unit is located below the slurry supply unit inside the oscillating arm.

15. The substrate processing apparatus according to claim 1, wherein the supply line is provided in the processing unit.

16. With an additional dresser, The substrate processing apparatus according to claim 10, wherein the supply line is provided in the dresser.

17. A circuit board processing table, A processing unit that performs predetermined processing on a substrate placed on the upper surface of the substrate processing table, A swinging arm extending from the outside of the substrate processing table toward the space above the substrate processing table, A utility supply unit is inserted into the rocking arm from the outside of the rocking arm and supplies utility to the rocking arm. A rocking mechanism that rocks the rocking arm around the rocking axis, Equipped with, A portion of the utility supply unit extends along the pivot axis and is located on the pivot axis, wherein the substrate processing apparatus is a substrate processing apparatus.

18. A supply device that supplies utilities from its tip to the outside, A supply line having a swing arm that swings about a swing axis, and a utility supply unit that is inserted into the swing arm from the outside of the swing arm and supplies utility to the outside from the tip of the swing arm, A rocking mechanism that rocks the rocking arm around the aforementioned rocking axis, Equipped with, A portion of the utility supply unit is a supply device that extends along the pivot axis and is located on the pivot axis.

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