heating furnace

Abstract

It suppresses the intrusion of oxidizing gases contained in the outside air. [Solution] The heating furnace 100 is a heating furnace 100 that circulates an oxidation-preventive gas in an internal space 110P, and comprises at least two structures 110A, 110B that abut each other and constitute a furnace wall 110 that defines the internal space 110P from the external space, a flow path 113P formed in the abutting portion of the at least two structures 110A, 110B that abut each other and is formed at a position away from the internal space 110P and the external space in the thickness direction of the furnace wall 110, a barrier gas supply port Pin3 that supplies barrier gas to the flow path 113P, and a barrier gas outlet Pout3 that discharges barrier gas from the flow path 113P.

Description

[Technical Field]

[0001] The present invention relates to a heating furnace. [Background Art]

[0002] A heat treatment apparatus may be provided with a heating furnace for the purpose of preventing oxidation of an object to be subjected to heat treatment. For example, a bonding apparatus that bonds electronic components to a substrate is provided with a heating furnace that creates an antioxidant gas atmosphere inside the heating furnace in order to suppress bonding defects caused by oxidation.

[0003] Patent Document 1 discloses a heating device including: a heating main body that heats an object to be heated; a conveyance path that conveys the object to be heated; and an outside air inflow preventing portion that prevents outside air from flowing in through an entrance and exit of the heating main body, wherein the heating main body has a nitrogen gas supply port that supplies nitrogen gas into the interior. [Prior Art Literature] [Patent Literature]

[0004] [Patent Document 1] Japanese Unexamined Patent Publication No. 2008-128544 [Summary of the Invention] [Problem to be Solved by the Invention]

[0005] In the heating device described in Patent Document 1, the internal pressure of the heating main body becomes lower than the external pressure of the heating main body in accordance with the flow rate of nitrogen gas. When the furnace wall of the heating main body is formed by joining a plurality of structures together, outside air may flow into the heating main body through the joints of the structures due to the pressure difference between the inside and outside of the furnace wall of the heating main body. When outside air flows into the heating main body, the oxygen concentration inside the heating main body increases.

[0006] The present invention has been made in view of such circumstances, and an object thereof is to provide a heating furnace capable of suppressing intrusion of oxidizing gas contained in outside air. [Means for solving the problem]

[0007] A heating furnace according to one aspect of the present invention is a heating furnace for circulating an antioxidant gas in an internal space, comprising: at least two structures that abut each other and constitute a furnace wall defining the internal space from the external space; a flow path formed at the abutting portion of the at least two structures, the flow path being formed at a position away from the internal space and the external space in the thickness direction of the furnace wall; a barrier gas supply port for supplying barrier gas to the flow path; and a barrier gas discharge port for discharging barrier gas from the flow path. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a heating furnace that can suppress the intrusion of oxidizing gases contained in the outside air. [Brief explanation of the drawing]

[0009] [Figure 1] This is a perspective view showing a bonding apparatus according to the first embodiment of the present invention. [Figure 2] This is a cross-sectional view of a heating furnace according to the first embodiment of the present invention. [Figure 3] This is a cross-sectional view of a heating furnace according to the first embodiment of the present invention. [Figure 4] This is a cross-sectional view of a heating furnace according to the first embodiment of the present invention. [Figure 5] This is a flowchart showing a bonding method according to the first embodiment of the present invention. [Figure 6] This figure shows the bonding process in progress. [Figure 7] This figure shows the bonding process in progress. [Figure 8] This figure shows the bonding process in progress. [Figure 9] This figure shows the bonding process in progress. [Figure 10] This figure shows the bonding process in progress. [Figure 11]This is a cross-sectional view of a heating furnace according to a second embodiment of the present invention. [Figure 12] This is a cross-sectional view of a heating furnace according to a third embodiment of the present invention. [Modes for carrying out the invention]

[0010] Embodiments of the present invention are described below. In the following drawings, identical or similar components are represented by identical or similar reference numerals. The drawings are illustrative, and the dimensions and shapes of each part are schematic; the technical scope of the present invention should not be interpreted as being limited to these embodiments.

[0011] <First Embodiment> <<Bonding equipment>> First, the configuration of the bonding apparatus 1 according to one embodiment of the present invention will be described with reference to Figures 1 to 4. Figure 1 is a perspective view showing the bonding apparatus 1 according to the first embodiment of the present invention. Figures 2 to 4 are cross-sectional views of the heating furnace 100 according to the first embodiment of the present invention. Figure 2 is a cross-sectional view of the internal space 110P along the transport direction (X-axis direction) of the substrate SB, and is a cross-sectional view of the heating furnace 100 in the ZX plane passing through the oxidation prevention gas supply port 130, which will be described later. Figure 3 is a cross-sectional view of the flow path 113P along the transport direction (X-axis direction) of the substrate SB. The cross-section of the flow path 112P along the transport direction of the substrate SB is similar. Figure 4 is a cross-sectional view of the internal space 110P and flow paths 112P, 113P along the direction (Y-axis direction) perpendicular to the transport direction (X-axis direction) of the substrate SB, and is a cross-sectional view of the heating furnace 100 in the YZ plane passing through the opening 117, which will be described later.

[0012] Bonding apparatus 1 is a die bonder that bonds electronic components CH to a substrate SB via a bonding member BM, and is a eutectic die bonder as an example. The substrate SB has a pair of main surfaces SBa and SBb, and the main surface SBa is the bonding surface to which the electronic components CH are bonded.

[0013] The substrate SB is a lead frame made of a metal such as a copper (Cu) alloy, but is not limited thereto. The substrate SB may be, for example, an iron (Fe) alloy lead frame, a ceramic substrate, or a semiconductor substrate.

[0014] The electronic component CH is a bonding target, for example, a semiconductor chip (also referred to as a "die"), but is not limited thereto. The electronic component CH may be, for example, various active components or passive components.

[0015] The bonding member BM is an adhesive metal, for example, a gold-tin (Au-Sn) based eutectic alloy, but is not limited thereto. The bonding member BM may be, for example, a eutectic alloy such as a gold-silicon (Au-Si) based alloy, a metal material that undergoes a eutectic reaction with the substrate SB, solder, an organic adhesive, or an inorganic adhesive.

[0016] Before bonding the electronic component CH to the substrate SB, the bonding member BM is provided, for example, on the electronic component CH side, but is not limited thereto. Before bonding the electronic component CH to the substrate SB, the bonding member BM may be provided on the substrate SB side, or a part of the bonding member BM may be provided on the electronic component CH side and another part of the bonding member BM may be provided on the substrate SB side. Further, although the substrate SB and the electronic component CH are separated from each other, for example, before being carried into the heating furnace 100 described later, the electronic component CH may be placed or temporarily bonded onto the substrate SB that is carried into the heating furnace 100.

[0017] The bonding apparatus 1 bonds the electronic component CH to the substrate SB in an antioxidant gas atmosphere. The antioxidant gas is, for example, a forming gas obtained by mixing a reducing gas such as hydrogen into an inert gas such as nitrogen, but is not limited thereto. The antioxidant gas may be, for example, an inert gas such as nitrogen, or a reducing gas such as hydrogen.

[0018] As shown in FIG. 1, the bonding apparatus 1 includes a heating furnace 100, a conveyance mechanism 20, an imaging unit 30, a bonding head 40, and an electronic component supply unit 50.

[0019] Here, Figure 1 is conveniently labeled with three orthogonal axes: the X-axis, Y-axis, and Z-axis. The X-axis direction is the transport direction in which the transport mechanism 20 transports the substrate SB, and the substrate SB is transported from the negative X-axis direction to the positive X-axis direction. The Y-axis direction defines the planes along the pair of main surfaces SBa and SBb of the substrate SB being transported by the transport mechanism 20, together with the X-axis direction. The Y-axis direction is also the direction in which the heating furnace 100 and the electronic component supply unit 50 are aligned. The Z-axis direction is the direction in which the pair of main surfaces SBa and SBb of the substrate SB being transported by the transport mechanism 20 overlap, and is the bonding direction in which the electronic component CH is bonded to the substrate SB. The electronic component CH is bonded to the substrate SB from the positive Z-axis direction. The X-axis, Y-axis, and Z-axis labeled in Figures 2 and onward correspond to each other.

[0020] In the following explanation, a plan view from the positive Z-axis direction will simply be referred to as a "plan view." Furthermore, the negative X-axis direction may be described as "front," the positive X-axis direction as "back," the positive Z-axis direction as "up," and the positive Z-axis direction as "down," but this does not limit the position or orientation of the bonding apparatus 1.

[0021] The heating furnace 100 is an example of an oxidation prevention passage. The heating furnace 100 circulates an oxidation prevention gas in its internal space 110P and heats the joining member BM under an oxidation prevention gas atmosphere. As shown in Figures 1 and 2, the heating furnace 100 has a furnace wall 110, an oxidation prevention gas supply port 130, a partition wall 140, and a heating section 180.

[0022] The furnace wall 110 is an outer wall that defines the internal space 110P of the heating furnace 100 where bonding is performed, and provides an oxidation-preventing gas atmosphere for the internal space 110P. The space enclosed by the furnace wall 110 is the internal space 110P, and the space outside the furnace wall 110 is the external space 110Q. The furnace wall 110 is provided in a rectangular tubular shape that forms an elongated internal space 110P in the direction along the transport mechanism 20. As shown in Figures 1 and 2, the furnace wall 110 has a top wall 111, side walls 112, 113, a bottom wall 114, a substrate inlet 115, a substrate outlet 116, and an opening 117. The top wall 111, side walls 112, 113, and bottom wall 114 are examples of multiple structures that define the internal space 110P.

[0023] The top wall 111 is a wall portion that faces the main surface SBa of the substrate SB being transported by the transport mechanism 20, with a gap between them. The side wall 112 is a wall portion that connects the end of the top wall 111 on the negative Y-axis side to the end of the bottom wall 114 on the negative Y-axis side. The side wall 113 is a wall portion that connects the end of the top wall 111 on the positive Y-axis side to the end of the bottom wall 114 on the positive Y-axis side. The bottom wall 114 is a wall portion that faces the main surface SBb of the substrate SB being transported by the transport mechanism 20, with a gap between them. The top wall 111, side walls 112, 113 and bottom wall 114 have a longitudinal direction that extends in the X-axis direction.

[0024] As shown in Figures 1 and 4, the side wall 112 has an upper side wall 112A and a lower side wall 112B, and the side wall 113 has an upper side wall 113A and a lower side wall 113B. The upper side wall 112A is connected to the negative Y-axis end of the top wall 111, and the lower side wall 112B is connected to the negative Y-axis end of the bottom wall 114. The upper side wall 113A is connected to the positive Y-axis end of the top wall 111, and the lower side wall 113B is connected to the positive Y-axis end of the bottom wall 114. The top wall 111, the upper side wall 112A, and the upper side wall 113A are integrally provided and constitute a single structure that defines the internal space 110P. The bottom wall 114, the lower side wall 112B, and the lower side wall 113B are integrally provided and constitute a single structure that defines the internal space 110P. The structure consisting of the top wall 111, upper side walls 112A and 113A is designated as the superstructure 110A, and the structure consisting of the bottom wall 114, lower side walls 112B and 113B is designated as the substructure 110B.

[0025] As shown in Figures 1 and 4, the upper structure 110A and the lower structure 110B abut each other to form the furnace wall 110. The upper side wall 112A and the lower side wall 112B abut each other, and a flow path 112P is provided at the abutment point. The upper side wall 113A and the lower side wall 113B abut each other, and a flow path 113P is provided at the abutment point. The longitudinal direction of the flow paths 112P and 113P extends in the X-axis direction. The flow paths 112P and 113P are located away from both the internal space 110P and the external space 110Q in the thickness direction of the furnace wall 110.

[0026] The flow path 112P is generally isolated from the internal space 110P and the external space 110Q by the upper side wall 112A and the lower side wall 112B. However, a gap (hereinafter referred to as the "joint") is created between the contact surfaces of the upper side wall 112A and the lower side wall 112B at the point of contact, so the isolation of the flow path 112P from the internal space 110P and the external space 110Q is not complete. Through this gap, gas can pass between the internal space 110P and the flow path 112P, and gas can also pass between the external space 110Q and the flow path 112P. Similarly, the flow path 113P is not completely isolated from the internal space 110P and the external space 110Q by the upper side wall 113A and the lower side wall 113B. Gas can pass between the internal space 110P and the flow path 113P through the joint between the upper side wall 113A and the lower side wall 113B, and gas can also pass between the external space 110Q and the flow path 113P.

[0027] As shown in Figure 3, the flow path 113P is provided with a barrier gas supply port Pin3 and a barrier gas outlet Pout3. The barrier gas supply port Pin3 supplies barrier gas to the flow path 113P, and the barrier gas outlet Pout3 discharges barrier gas from the flow path 113P. The barrier gas supply port Pin3 is located at one end of the flow path 113P in the longitudinal direction, and the barrier gas outlet Pout3 is located at the other end of the flow path 113P in the longitudinal direction. For example, the barrier gas supply port Pin3 is an open end that opens on the negative X-axis side of the flow path 113P, and the barrier gas outlet Pout3 is an open end that opens on the positive X-axis side of the flow path 113P. The presence of the barrier gas supply port Pin3, which acts as the inlet for the barrier gas, and the barrier gas outlet Pout3, which acts as the outlet for the barrier gas, allows barrier gas to flow through the flow path 113P.

[0028] A supply pipe Tin3 is connected to the barrier gas supply port Pin3, which supplies barrier gas to the flow path 113P. The supply pipe Tin3 pressurizes the barrier gas into the flow path 113P, forming a barrier gas flow within the flow path 113P. At the connection point between the barrier gas supply port Pin3 and the supply pipe Tin3, it is desirable that the angle between the central axis of the supply pipe Tin3 and the central axis of the flow path 113P is small, it is even more desirable that the central axis of the supply pipe Tin3 and the central axis of the flow path 113P are parallel, and it is even more desirable that the central axis of the supply pipe Tin3 and the central axis of the flow path 113P are aligned in a straight line. According to this, the barrier gas flow formed by the supply pipe Tin3 in the flow path 113P can be made laminar. Compared to the case where turbulent flow of barrier gas is formed in the flow path 113P, when laminar flow of barrier gas is formed in the flow path 113P, local variations in the amount of pressure drop caused by the barrier gas flow in the flow path 113P are suppressed. Here, the "central axis" is defined as the axis that extends in the direction of the barrier gas flow and passes through the center of a plane perpendicular to the direction of the barrier gas flow.

[0029] The barrier gas outlet Pout3 is open to the external space 110Q. The barrier gas that has flowed from the barrier gas supply port Pin3 to the barrier gas outlet Pout3 is released into the external space 110Q from the barrier gas outlet Pout3.

[0030] The structure of the flow path 112P is the same as that of the flow path 113P, and the flow path 112P is also provided with a barrier gas supply port opening on the negative X-axis side and a barrier gas outlet opening on the positive X-axis side. A barrier gas supply pipe is connected to the barrier gas supply port of the flow path 112P, and the barrier gas outlet of the flow path 112P is open to the external space 110Q.

[0031] The barrier gas that forms the flow in the flow paths 112P and 113P is, for example, clean dry air, an inert gas, a reducing gas, or a foaming gas. The barrier gas may also be the gas in the external space 110Q (hereinafter referred to as "outside air"). The flow velocity of the barrier gas in the flow path 113P is specified, for example, as the flow velocity at the barrier gas outlet Pout3, or the flow velocity at the barrier gas supply port Pin3. The flow velocity at the barrier gas outlet Pout3 is specified, for example, as the average value of the flow velocity at the barrier gas outlet Pout3, but may also be specified as the maximum value of the flow velocity at the barrier gas outlet Pout3, or as the flow velocity at a predetermined position of the barrier gas outlet Pout3. Here, the predetermined position of the barrier gas outlet Pout3 is, for example, the center of the barrier gas outlet Pout3. The flow velocity at the barrier gas supply port Pin3 is specified in a similar manner. If the inner diameter of the flow path 113P and the inner diameter of the air supply pipe Tin3 are the same, the flow velocity of the barrier gas in the flow path 113P may be determined as the flow velocity of the barrier gas in the air supply pipe Tin3. The flow velocity of the barrier gas in the flow path 112P is determined in the same way.

[0032] The upper structure 110A is fitted to the lower structure 110B by a spigot joint, for example, but the manner in which the upper structure and the lower structure come into contact is not limited to this. The upper structure and the lower structure may be engaged with each other, or they may be fixed to each other by jigs such as screws or clamps. Furthermore, the positions of the barrier gas supply port and barrier gas outlet with respect to the flow path are not limited to the above, and the barrier gas supply port may be provided on the positive X-axis side and the barrier gas outlet may be provided on the negative X-axis side.

[0033] The substrate inlet 115 and substrate outlet 116 are a pair of open ends of a cylindrical furnace wall 110. The substrate inlet 115 is the open end on the negative X-axis side of the furnace wall 110, and the substrate outlet 116 is the open end on the positive X-axis side of the furnace wall 110. The substrate SB to which the electronic component CH is bonded is fed into the internal space 110P of the heating furnace 100 through the substrate inlet 115. The substrate SB with the bonded electronic component CH is discharged from the internal space 110P of the heating furnace 100 through the substrate outlet 116. The substrate inlet 115 and substrate outlet 116 are examples of oxidation prevention gas outlets that discharge oxidation prevention gas.

[0034] The opening 117 is an opening for the bonding tool 43, described later, to approach or move away from the substrate SB. The opening 117 is a through hole that penetrates the top wall 111 in the Z-axis direction. The opening 117 is provided in the shape of a slit with a longitudinal direction extending in the Y-axis direction. The opening 117 is also used by the imaging unit 33, described later, to image the substrate SB or the electronic component CH bonded to the substrate SB. The opening 117 is an example of an oxidation prevention gas outlet for discharging oxidation prevention gas. However, since the opening 117 is smaller than the substrate inlet 115 and substrate outlet 116, the substrate inlet 115 and substrate outlet 116 mainly function as oxidation prevention gas outlets.

[0035] The oxidation prevention gas supply port 130 supplies oxidation prevention gas to the internal space 110P, and the oxidation prevention gas outlets (substrate inlet 115, substrate outlet 116, and opening 117) discharge oxidation prevention gas from the internal space 110P. The oxidation prevention gas flows through the internal space 110P due to the presence of the oxidation prevention gas supply port 130, which acts as the inlet, and the oxidation prevention gas outlets (substrate inlet 115, substrate outlet 116, and opening 117), which act as the outlet. The oxidation prevention gas supply port 130 has four oxidation prevention gas supply ports 131, 132, 133, and 134. Each of the oxidation prevention gas supply ports 131 to 134 is configured, for example, to allow for independent adjustment of the oxidation prevention gas supply amount. Specifically, although not shown in the figures, flow meters, flow control valves, etc., are provided in the piping connected to each of the oxidation prevention gas supply ports 131 to 134.

[0036] As shown in Figures 1 and 2, the oxidation prevention gas supply ports 131 to 134 are connected to the top wall 111. The oxidation prevention gas supply ports 131 to 134 are aligned in the X-axis direction at the center of the top wall 111 in the Y-axis direction. The oxidation prevention gas supply port 131 is located between the substrate inlet 115 and the opening 117. The oxidation prevention gas supply port 132 is located between the oxidation prevention gas supply port 131 and the opening 117. The oxidation prevention gas supply port 133 is located between the opening 117 and the substrate outlet 116. The oxidation prevention gas supply port 134 is located between the oxidation prevention gas supply port 133 and the substrate outlet 116. The area of ​​each oxidation prevention gas supply port 131 to 134 in plan view (hereinafter simply referred to as "area") is, for example, approximately equal to each other.

[0037] The number of oxidation prevention gas supply ports is not limited to four. For example, one oxidation prevention gas supply port may be provided on both the inlet and outlet sides of the opening, or three or more oxidation prevention gas supply ports may be provided. Furthermore, the number of oxidation prevention gas supply ports provided on the inlet and outlet sides of the opening may differ. For example, when substrates are brought into the internal space, oxidizing gases contained in the outside air are easily brought inside the furnace wall, so more oxidation prevention gas supply ports may be provided on the inlet side than on the outlet side. The oxidation prevention gas supply ports are not limited to those connected to the top wall. For example, the oxidation prevention gas supply ports may be connected to the partition wall described later, or to the side walls or bottom walls of the furnace wall. Oxidizing gases contained in the outside air include, for example, oxygen, ozone, nitrous oxide, nitric oxide, and nitrogen dioxide.

[0038] Partition wall 140 includes partition walls 144, 146, 147, and 149. Partition walls 144 and 149 are examples of outer partition walls that separate the antioxidant gas supplied from the antioxidant gas supply port 130 from the outside air. Partition wall 144 suppresses the intrusion of outside air into the internal space 110P through the substrate inlet 115 by narrowing the intrusion path from the substrate inlet 115 to the internal space 110P. Partition wall 149 suppresses the intrusion of outside air into the internal space 110P through the substrate outlet 116 by narrowing the intrusion path from the substrate outlet 116 to the internal space 110P. Partition walls 146 and 147 are examples of inner partition walls that divide the internal space 110P. Partition walls 146 and 147 suppress the intrusion of outside air into the internal space 110P through the opening 117 by lengthening the intrusion path from the opening 117 to the internal space 110P.

[0039] As shown in Figures 2 and 3, the upper ends of partitions 144, 146, 147, and 149 are connected to the top wall 111. Partition 144 is connected to the negative X-axis end of the top wall 111 and extends from the negative Y-axis end to the positive Y-axis end of the top wall 111. Partition 146 is connected to the portion of the top wall 111 between the oxidation prevention gas supply port 132 and the opening 117 and extends from the negative Y-axis end to the positive Y-axis end of the top wall 111. Partition 147 is connected to the portion of the top wall 111 between the opening 117 and the oxidation prevention gas supply port 133 and extends from the negative Y-axis end to the positive Y-axis end of the top wall 111. Partition 149 is connected to the positive X-axis end of the top wall 111 and extends from the negative Y-axis end to the positive Y-axis end of the top wall 111. One end of bulkheads 144, 146, 147, and 149 is connected to side wall 112, and the other end of bulkheads 144, 146, 147, and 149 is connected to side wall 113.

[0040] The flow velocity of the antioxidant gas in the internal space 110P is specified, for example, as the flow velocity of the antioxidant gas at the main antioxidant gas outlets, the substrate inlet 115 and the substrate outlet 116. Specifically, the flow velocity of the antioxidant gas is specified as the flow velocity at the substrate inlet 115, the flow velocity at the substrate outlet 116, or the average value of these flow velocities. The flow velocity at the substrate inlet 115 is specified, for example, as the average value of the flow velocity at the substrate inlet 115, but it may also be specified as the maximum value of the flow velocity at the substrate inlet 115, or as the flow velocity at a predetermined position in the substrate inlet 115. Here, the predetermined position for specifying the flow velocity at the substrate inlet 115 is, for example, the center of the substrate inlet 115. The flow velocity at the substrate outlet 116 may be specified in a similar manner.

[0041] The flow of the antioxidant gas in the internal space 110P causes a pressure drop in proportion to its flow velocity. As the pressure in the internal space 110P decreases, outside air containing oxidizing gases attempts to enter from the external space 110Q in proportion to the pressure difference between the internal space 110P and the external space 110Q. Outside air attempts to enter the internal space 110P not only through the substrate inlet 115, substrate outlet 116, and opening 117, but also through the joint between the upper side wall 112A and the lower side wall 112B.

[0042] The flow of outside air attempting to enter the internal space 110P from the substrate inlet 115, substrate outlet 116, and opening 117, in accordance with the pressure difference between the internal space 110P and the external space 110Q, is opposed to the flow of antioxidant gas released from the substrate inlet 115, substrate outlet 116, and opening 117. Therefore, the outside air attempting to enter from the substrate inlet 115, substrate outlet 116, and opening 117 is pushed back into the external space 110Q by the antioxidant gas. However, the flow of outside air attempting to enter from the joint between the upper structure 110A and the lower structure 110B in accordance with the pressure difference between the internal space 110P and the external space 110Q mainly follows the Y-axis direction, while the flow of antioxidant gas in the internal space 110P mainly follows the X-axis direction. Therefore, the intrusion of outside air into the internal space 110P from the joint between the upper structure 110A and the lower structure 110B is not easily obstructed by the flow of antioxidant gas.

[0043] However, flow paths 112P and 113P are provided at the contact point between the upper structure 110A and the lower structure 110B, and a barrier gas flow is formed in flow paths 112P and 113P. As a result, a pressure drop occurs in flow paths 112P and 113P in proportion to the flow velocity of the barrier gas. Here, the heating furnace 100 is configured so that the flow velocity of the barrier gas in each of the flow paths 112P and 113P can be made greater than the flow velocity of the antioxidant gas in the internal space 110P. The flow velocity of the barrier gas in each of the flow paths 112P and 113P is configured to be greater than the flow velocity of the antioxidant gas in the internal space 110P.

[0044] If the flow velocity of the barrier gas in each of the flow paths 112P and 113P is greater than the flow velocity of the antioxidant gas in the internal space 110P, the pressure in flow paths 112P and 113P will be lower than the pressure in the external space 110Q and also lower than the pressure in the internal space 110P. Based on the pressure difference between the external space 110Q and flow paths 112P and 113P, outside air enters flow paths 112P and 113P from the external space 110Q. Also, based on the pressure difference between flow paths 112P and 113P and the internal space 110P, the antioxidant gas enters flow paths 112P and 113P from the internal space 110P. Because the pressure in flow paths 112P and 113P is lower than that in the internal space 110P, the mixed gas of outside air and barrier gas in flow paths 112P and 113P does not enter the internal space 110P from flow paths 112P and 113P through the joint. The mixed gas of outside air and barrier gas in the channel 113P is released into the external space 110Q through the barrier gas outlet without entering the internal space 110P. The mixed gas in the channel 113P is released in the same manner. This further suppresses the occurrence of defective products caused by oxidation of substrates SB and bonding members BM. In other words, the reliability of bonding is further improved.

[0045] Since the barrier gas does not penetrate the internal space 110P, the barrier gas may contain oxidizing gases such as clean dry air or outside air. Even with a barrier gas containing oxidizing gases, the penetration of oxidizing gases into the internal space 110P is suppressed to the same extent as when the barrier gas is a non-oxidizing gas.

[0046] Furthermore, in the case of eutectic bonding, where bonding is performed at high temperatures and the substrate SB and bonding member BM are prone to oxidation, it is particularly important to reduce the concentration of oxidizing gases inside the furnace wall 110, and therefore this embodiment is effective.

[0047] The gas discharge section 170 has a gas outlet 171 that forms a gas curtain of antioxidant gas across the opening 117 on the outside of the furnace wall 110. The gas discharge section 170 is installed on the top wall 111. The gas outlet 171 extends along the Y-axis direction, which intersects with the X-axis direction, which is the transport direction of the substrate SB. The gas discharge section 170 is installed on the negative X-axis side of the opening 117, and the gas outlet 171 opens towards the opening 117.

[0048] The gas curtain formed by the gas outlet 171 is formed along the furnace wall 110 in the positive X-axis direction from the substrate inlet 115 to the substrate outlet 116. In the case of a gas curtain that flows in the same direction as the transport direction of the substrate SB, even if the gas curtain entrains outside air and enters the inside of the furnace wall 110 through the opening 117, the gas curtain and outside air that have entered the inside of the furnace wall 110 will flow toward the substrate outlet 116 side together with the transported substrate SB. Therefore, the opportunity for outside air that has entered the inside of the furnace wall 110 to come into contact with substrates that have not yet been bonded is less than the opportunity for contact with substrates that have already been bonded. The gas curtain is laminar flow. A laminar flow gas curtain is less likely to entrain outside air and enter the inside of the furnace wall 110 through the opening 117 compared to turbulent flow. The components of the antioxidant gas that forms the gas curtain are, for example, the same as, but not limited to, the components of the antioxidant gas supplied to the internal space 110P by the antioxidant gas supply port 130. For example, the antioxidant gas supplied to the internal space 110P may be a forming gas, and the antioxidant gas forming the gas curtain may be an inert gas.

[0049] The gas curtain formed by the gas outlet 171 suppresses the drawing of outside air into the furnace wall 110 by the bonding tool 43, described later, which moves in and out of the furnace wall 110 through the opening 117. In other words, when the bonding tool 43 enters the internal space 110P from the external space 110Q through the opening 117, it blows away the outside air clinging to the bonding tool 43, preventing outside air from being brought into the internal space 110P. Also, when the bonding tool 43 exits the external space 110Q from the internal space 110P through the opening 117, it prevents outside air from being drawn into the space occupied by the bonding tool 43. As a result, the occurrence of defective products caused by oxidation of substrates SB and bonding members BM is suppressed. In other words, the reliability of bonding is improved.

[0050] The gas curtain formed by the gas outlet 171 also contributes to sharpening the image captured by the imaging unit 30. The antioxidant gas in the internal space 110P is heated by the heating unit 180 and released as a heated gas stream from the opening 117. The heated gas stream becomes a heat haze, causing fluctuations in the image captured by the imaging unit 30. The gas curtain formed by the gas outlet 171 removes the heated gas stream from above the opening 117, thus suppressing the generation of heat haze. As a result, the image captured by the imaging unit 30 becomes sharper.

[0051] The heating unit 180 is a heater that heats the bonding member BM by heating the substrate SB. The heating unit 180 is provided in the internal space 110P, for example, on the upper surface of the bottom wall 114 or inside the bottom wall 114. The heating unit 180 is provided below the opening 117. When the bonding head 40 pressurizes the bonding member BM through the electronic component CH, the heating unit 180 contacts the main surface SBb of the substrate SB and also functions as a stage that supports the substrate SB against the pressure of the bonding head 40. The heating unit 180 is, for example, a hot plate with a flat top surface. The heating unit 180 may be provided closer to the substrate inlet 115 in order to preheat the substrate SB so that the bonding member BM reaches a sufficiently high temperature during bonding. However, in order to suppress oxidation of the substrate SB, it is desirable that the heating unit 180 be provided away from the substrate outlet 116. The heating unit may also be provided on the inner surface or inside the side walls 112, 113.

[0052] The imaging unit 30 images the substrate SB or the electronic component CH bonded to the substrate SB. For example, based on the acquired image, the imaging unit 30 compares the bonding area of ​​the substrate SB with the camera field of view and corrects the landing position of the bonding tool 43. Alternatively, for example, after mounting the electronic component CH to the substrate SB, the imaging unit 30 acquires images of the mounted substrate SB and electronic component CH and corrects the landing position during the next bonding. As the image becomes clearer, mounting accuracy is improved and the frequency of defective products being released is reduced. In other words, the reliability of bonding is improved.

[0053] As shown in Figure 1, the imaging unit 30 includes an imaging unit drive mechanism 31 and an imaging unit 33. The imaging unit drive mechanism 31 is a two-axis orthogonal actuator that moves the imaging unit 33 in the Y-axis and Z-axis directions. The imaging unit 33 is a two-dimensional image sensor. The imaging unit 33 is not particularly limited and can be, for example, a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

[0054] The imaging unit may also be a three-dimensional image sensor. If the imaging unit is a three-dimensional image sensor, the imaging unit drive mechanism may be a single-axis actuator that moves the imaging unit in the Y-axis direction.

[0055] The bonding head 40 bonds the electronic component CH to the substrate SB. The bonding head 40 transports the electronic component CH picked up from the electronic component supply unit 50, approaches the substrate SB through the opening 117, and bonds the electronic component CH to the substrate SB.

[0056] As shown in Figure 1, the bonding head 40 includes a bonding tool drive mechanism 41 and a bonding tool 43. The bonding tool drive mechanism 41 is a three-axis orthogonal actuator that moves the bonding tool 43 in the X, Y, and Z directions. The bonding tool 43 bonds the electronic component CH to the substrate SB. For example, if the bonding member BM is a eutectic alloy, the bonding tool 43 has a pressurizing function that pressurizes the bonding member BM via the electronic component CH. The bonding tool 43 may also have a heating function that heats the bonding member BM via the electronic component CH, or a scrubbing function that scrubs the bonding member BM. The bonding tool 43 is a pickup collet that picks up the electronic component CH from the electronic component supply unit 50. The bonding tool 43 holding the electronic component CH approaches the substrate SB through the opening 117. At this time, the trajectory of the tip of the bonding tool 43 that holds the electronic component CH is, for example, arc-shaped. According to this, the travel distance and travel time of the bonding tool 43 are reduced compared to the case where the track is straight.

[0057] The electronic component supply unit 50 supplies electronic components CH. The electronic component supply unit 50 is not particularly limited and may be, for example, a tray feeder, a tape feeder, or a pre-cut wafer held on a wafer sheet.

[0058] <<Bonding Method>> Next, a bonding method using the bonding apparatus 1 will be described with reference to Figures 5 to 10. Figure 5 is a flowchart showing a bonding method according to the first embodiment of the present invention. Figures 6 to 10 show the bonding process in progress.

[0059] First, the antioxidant gas Gao is supplied to the internal space 110P (S10).

[0060] Specifically, as shown in Figure 6, antioxidant gas Gao is supplied to the internal space 110P from the antioxidant gas supply port 130. The antioxidant gas Gao supplied from each of the antioxidant gas supply ports 131 to 134 diffuses into the internal space 110P. The antioxidant gas Gao diffused into the internal space 110P fills the internal space 110P and forms an antioxidant gas atmosphere. In the internal space 110P, the antioxidant gas Gao forms a flow in the X-axis direction. The antioxidant gas that has flowed through the internal space 110P is mainly released into the external space 110Q from the substrate inlet 115 and substrate outlet 116, which are antioxidant gas outlets. A portion of the antioxidant gas is also released into the external space 110Q from the opening 117, which is an antioxidant gas outlet. At the substrate inlet 115, the antioxidant gas Gao is released at a flow rate Van1, and at the substrate outlet 116, the antioxidant gas Gao is released at a flow rate Van2. For example, the flow velocity Van1 of the antioxidant gas Gao is equivalent to the flow velocity Van2 of the antioxidant gas Gao (Van1 = Van2 = Van). However, the flow velocities Van1 and Van2 may be different (Van1 ≠ Van2). Note that the antioxidant gas Gao is also released from the opening 117.

[0061] Next, barrier gas Gba is supplied to the flow paths 112P and 113P (S20).

[0062] Specifically, as shown in Figure 7, barrier gas Gba is supplied from the air supply pipe Tin3 to the flow path 113P through the barrier gas supply port Pin3. The barrier gas Gba supplied to the flow path 113P fills the flow path 113P and forms a barrier gas atmosphere. In the flow path 113P, the barrier gas Gba forms a flow in the X-axis direction. The barrier gas Gba that has flowed through the flow path 113P is released into the external space 110Q from the barrier gas outlet Pout3. At the barrier gas supply port Pin3, the barrier gas Gba is supplied at a flow velocity Vba, and at the barrier gas outlet Pout3, the barrier gas Gba is discharged at a flow velocity Vba. The flow velocity Vba of the barrier gas Gba is greater than the flow velocities Van1 and Van2 of the antioxidant gas Gao (Van <Vba)。

[0063] Although not shown in the diagram, a flow of barrier gas Gba is formed in channel 112P, similar to channel 113P.

[0064] When the barrier gas Gba forms a flow with velocity Vba in channel 113P, the pressure in channel 113P becomes lower than the pressure in the external space 110Q in proportion to the flow velocity Vba, and as shown in Figure 8, outside air Gair enters channels 112P and 113P from the external space 110Q through the joint between the upper structure 110A and the lower structure 110B. Also, since the flow velocity Vba of the barrier gas in channels 112P and 113P is greater than the flow velocity Van of the antioxidant gas Gao in the internal space 110P, the pressure in channels 112P and 113P becomes lower than the pressure in the internal space 110P in proportion to the flow velocity difference Vba-Van, and as shown in Figure 8, antioxidant gas Gao enters channels 112P and 113P from the internal space 110P through the joint between the upper structure 110A and the lower structure 110B. The outside air Gair and antioxidant gas Gao that enter the flow path 113P are pushed away by the barrier gas Gba and discharged together with the barrier gas Gba from the barrier gas outlet Pout3. Although not shown in the diagram, similarly in the flow path 112P, the incoming outside air Gair and antioxidant gas Gao are discharged together with the barrier gas Gba from the barrier gas outlet.

[0065] Next, the circuit board SB is loaded into the internal space 110P (S30).

[0066] Specifically, as shown in Figure 9, the substrate SB is transported from the substrate inlet 115 into the internal space 110P by the transport mechanism 20. In the internal space 110P, the substrate SB is transported to below the opening 117 while being heated by the heating unit 180. The substrate SB being transported into the internal space 110P is surrounded by outside air containing oxidizing gases, but these oxidizing gases are removed by the antioxidant gas released from the substrate inlet 115.

[0067] Next, the electronic component CH is bonded to the substrate SB in the internal space 110P (S40).

[0068] Specifically, the bonding tool 43 picks up the electronic component CH from the electronic component supply unit 50, and as shown in Figure 9, the bonding tool 43 holding the electronic component CH enters the internal space 110P through the opening 117. The electronic component CH and the bonding tool 43 holding the electronic component CH are surrounded by outside air containing oxidizing gas, but this oxidizing gas is removed by an anti-oxidation gas released from the internal space 110P through the opening 117. In addition, the outside air containing oxidizing gas that clings to the bonding tool 43 and the electronic component CH is also removed by a gas curtain formed by the gas outlet 171 of the gas discharge unit 170.

[0069] The bonding tool 43 bonds the electronic component CH to the substrate SB supported by the heating unit 180. The bonding member BM is heated by the heating unit 180 and pressurized by the bonding tool 43. Once bonding of one electronic component CH is complete, the bonding tool 43 releases the electronic component CH and exits the internal space 110P through the opening 117. The bonding tool 43 then moves to the electronic component supply unit 50 to pick up the next electronic component CH.

[0070] When the bonding tool 43 exits the internal space 110P through the opening 117, outside air containing oxidizing gas is drawn into the space where the bonding tool 43 was located. This outside air is removed by the antioxidant gas released from the opening 117 and also by the gas curtain formed by the gas outlet 171 of the gas discharge section 170.

[0071] While the bonding tool 43 is moving to the external space 110Q, the imaging unit 33 images the orientation and posture of the electronic component CH through the opening 117 to check for bonding defects. Antioxidant gas emitted from the opening 117, which causes heat haze that degrades the image quality of the image captured by the imaging unit 33, is removed by a gas curtain formed by the gas outlet 171 of the gas discharge unit 170. As a result, the image captured by the imaging unit 33 becomes clearer, and the accuracy of determining bonding defects is improved.

[0072] Next, the substrate SB to which the electronic component CH is bonded is removed from the internal space 110P (S50).

[0073] As shown in Figure 10, the substrate SB to which a predetermined number of electronic components CH are bonded is transported out of the internal space 110P from the substrate outlet 116 by the transport mechanism 20. The substrate SB, having been removed from above the heating section 180, is cooled during transport, and by the time it is transported out of the substrate outlet 116, the temperature of the substrate SB has dropped to a temperature at which oxidation does not occur.

[0074] When the substrate SB is discharged from the internal space 110P through the substrate outlet 116, outside air containing oxidizing gases is drawn into the space where the substrate SB was located. This outside air is removed by the antioxidant gas released from the substrate outlet 116.

[0075] Other embodiments are described below. Components identical or similar to those shown in the first embodiment are denoted by the same or similar reference numerals, and their descriptions are omitted as appropriate. Furthermore, similar effects and benefits from similar components are not mentioned sequentially.

[0076] <Second Embodiment> Next, the configuration of the heating furnace 200 according to the second embodiment will be described with reference to Figure 11. Figure 11 is a cross-sectional view of the heating furnace 200 according to the second embodiment of the present invention. Figure 11 is a cross-sectional view of the flow path 113P along the transport direction (X-axis direction) of the substrate SB.

[0077] In the heating furnace 200, an exhaust pipe Tout3 is connected to the barrier gas exhaust port Pout3 of the flow path 113P, which discharges barrier gas Gba from the flow path 113P. The exhaust pipe Tout3, for example, draws barrier gas Gba from the flow path 113P, forming a continuous flow of barrier gas Gba in the flow path 113P. At the connection point between the barrier gas exhaust port Pout3 and the exhaust pipe Tout3, it is desirable that the angle between the central axis of the flow path 113P and the central axis of the exhaust pipe Tout3 be small, and it is even more desirable that the central axis of the flow path 113P and the central axis of the exhaust pipe Tout3 be parallel. For example, at the connection point between the barrier gas exhaust port Pout3 and the exhaust pipe Tout3, the central axis of the flow path 113P and the central axis of the exhaust pipe Tout3 are aligned on the same straight line. Because the central axis of the exhaust pipe Tout3 and the central axis of the flow path 113P are aligned in the X-axis direction, the flow of barrier gas Gba formed by the exhaust pipe Tout3 in the flow path 113P is laminar.

[0078] The intake pipe Tin3 is connected to one end of the flow path 113P in the X-axis direction, and the exhaust pipe Tout3 is connected to the other end of the flow path 113P in the X-axis direction. By the cooperation of the intake pipe Tin3 and the exhaust pipe Tout3, a flow of barrier gas Gba is formed in the flow path 113P, thereby increasing the flow velocity of the barrier gas Gba. The barrier gas Gba recovered from the exhaust pipe Tout3 may be reused; for example, the recovered barrier gas Gba may be supplied again to the flow path 113P from the intake pipe Tin3. Although not shown in the figure, an exhaust pipe may similarly be connected to the barrier gas exhaust port of the flow path 112P.

[0079] <Third Embodiment> Next, the configuration of the heating furnace 300 according to the third embodiment will be described with reference to Figure 12. Figure 12 is a cross-sectional view of the heating furnace 300 according to the third embodiment of the present invention. Figure 11 is a cross-sectional view of the flow path 113P along the transport direction (X-axis direction) of the substrate SB.

[0080] In the heating furnace 300, the barrier gas supply port Pin3 is open to the external space 110Q, and the barrier gas discharge port Pout3 is connected to the exhaust pipe Tout3. Outside air Gair collected from the external space 110Q is supplied to the flow path 113P through the barrier gas supply port Pin3, and the outside air Gair functions as the barrier gas Gba. The exhaust pipe Tout3 draws in the barrier gas Gba from the flow path 113P, forming a flow of barrier gas Gba in the flow path 113P. Although not shown in the figure, a barrier gas suction port may also be provided in place of the barrier gas supply port in the flow path 112P.

[0081] Some or all embodiments of the present invention are described below. However, the present invention is not limited to the embodiments described below.

[0082] [Note 1] A heating furnace that circulates an antioxidant gas atmosphere in its internal space, At least two structures that abut each other and constitute a furnace wall that demarcates the internal space from the external space, A flow channel formed in the contact portion where at least two structures abut each other, the flow channel being formed at a position away from the internal space and the external space in the thickness direction of the furnace wall, A barrier gas supply port that supplies barrier gas to the flow path, A barrier gas outlet that discharges barrier gas from the flow path, Having, Heating furnace.

[0083] According to this embodiment, by creating an antioxidant gas atmosphere in the internal space, unwanted oxidation of the workpiece is suppressed within the internal space of the heating furnace. Outside air attempting to directly enter the internal space through openings such as antioxidant gas outlets in the furnace wall is pushed back into the external space by the outflowing antioxidant gas that forms a flow toward the external space. Therefore, the intrusion of outside air into the internal space via the antioxidant gas outlets is suppressed.

[0084] Since an oxidation-preventing gas supply port and an oxidation-preventing gas outlet are provided in the internal space, a continuous flow of oxidation-preventing gas is formed in the internal space. Since a barrier gas supply port and a barrier gas outlet are provided in the flow path, a continuous flow of barrier gas is formed in the flow path. A pressure drop occurs in the internal space in proportion to the flow velocity of the oxidation-preventing gas, and a pressure drop occurs in the flow path in proportion to the flow velocity of the barrier gas. By adjusting the flow velocity of the barrier gas in the flow path and the flow velocity of the oxidation-preventing gas in the internal space, the relative pressures in the internal space, flow path, and external space can be controlled.

[0085] By controlling the pressure in the internal space to be lower than the pressure in the external space, and the pressure in the flow path to be lower than the pressure in the internal space, the intrusion of outside air from the external space into the internal space through the joints of the furnace wall structure can be suppressed. Specifically, by making the pressure in the flow path lower than the pressure in both the external and internal spaces, outside air enters the flow path from the external space through the joints of the furnace wall structure, and antioxidant gas enters the flow path from the internal space through the joints of the furnace wall structure. The outside air and antioxidant gas that enter the flow path are pushed away by the barrier gas and discharged together with the barrier gas from the barrier gas outlet. The intrusion of gas from the flow path into the internal space through the joints of the furnace wall structure is unlikely to occur because it is moving against the pressure difference. Therefore, the intrusion of outside air into the internal space through the joints of the furnace wall structure is suppressed.

[0086] In this way, not only is the intrusion of outside air into the internal space through the oxidation prevention gas outlet, which is an opening in the furnace wall, suppressed, but the intrusion of outside air into the internal space through the joints of the furnace wall structure is also suppressed. Therefore, the intrusion of oxidizing gases contained in the outside air into the internal space is suppressed, and unwanted oxidation of the workpiece in the internal space can be suppressed.

[0087] [Note 2] The flow velocity of the barrier gas in the flow path is configured to be greater than the flow velocity of the antioxidant gas in the internal space. The heating furnace described in [Note 1].

[0088] According to this embodiment, the pressure in the flow path can be made lower than the pressure in the internal space. Therefore, the intrusion of oxidizing gases contained in the outside air into the internal space is suppressed, and unwanted oxidation of the workpiece in the internal space of the heating furnace can be suppressed.

[0089] [Note 3] The longitudinal direction of the flow path extends along the longitudinal direction of the internal space. The heating furnace described in [Appendix 1] or [Appendix 2].

[0090] According to this embodiment, the intrusion of oxidizing gases from the joints of the furnace wall structure into the internal space can be suppressed throughout the entire longitudinal region.

[0091] [Note 4] The barrier gas supply port is provided at one end in the longitudinal direction of the flow path. The barrier gas outlet is located at the end of the flow path opposite to one end in the longitudinal direction. The heating furnace described in [Note 3].

[0092] According to this embodiment, it is possible to suppress pressure loss caused by the barrier gas colliding with the inner wall of the flow path between the barrier gas supply port and the barrier gas outlet. Therefore, the flow velocity of the barrier gas in the flow path can be made uniform, and localized fluctuations in the flow path pressure can be suppressed. Consequently, it is possible to suppress localized pressure in the flow path from becoming higher than the pressure in the internal space, and the intrusion of oxidizing gases contained in the outside air into the internal space is further suppressed.

[0093] [Note 5] The barrier gas is clean dry air. A heating furnace as described in any one of the following: [Appendix 1] to [Appendix 4].

[0094] According to this embodiment, since clean dry air is less expensive than inert gas or foaming gas, the cost required to suppress oxidation of the workpiece in the internal space of the heating furnace can be reduced.

[0095] [Note 6] The barrier gas is an inert gas. A heating furnace as described in any one of the following: [Appendix 1] to [Appendix 4].

[0096] According to this embodiment, since the barrier gas does not contain oxidizing gases, even if the barrier gas enters the internal space of the heating furnace, it is possible to suppress unwanted oxidation of the workpiece in the internal space of the heating furnace.

[0097] [Note 7] Barrier gas is a foaming gas. A heating furnace as described in any one of the following: [Appendix 1] to [Appendix 4].

[0098] According to this embodiment, since the barrier gas is a reducing gas that does not contain oxidizing gases, even if the barrier gas enters the internal space of the heating furnace, it is possible to suppress the unwanted oxidation of the workpiece in the internal space of the heating furnace.

[0099] [Note 8] The barrier gas supply port is connected to the air supply pipe that supplies barrier gas to the flow path. A heating furnace as described in any one of the appendices [1] through [4].

[0100] According to this method, a continuous flow of barrier gas can be formed in the flow path by pressurizing and supplying barrier gas from the air supply pipe to the flow path. Furthermore, the flow velocity of the barrier gas in the flow path can be controlled by adjusting the pressure of the barrier gas supplied from the air supply pipe.

[0101] [Note 9] At the connection point between the barrier gas supply port and the air supply pipe, the central axis of the flow path and the central axis of the air supply pipe are parallel. A heating furnace as described in any one of the footnotes [8].

[0102] According to this, the flow of barrier gas formed in the flow path by the air supply pipe becomes laminar. Compared to the case where turbulent flow of barrier gas is formed in the flow path, when laminar flow of barrier gas is formed in the flow path, local variations in the amount of pressure drop caused by the flow of barrier gas in the flow path are suppressed. Therefore, the intrusion of oxidizing gases contained in the outside air into the internal space is further suppressed.

[0103] [Note 10] The barrier gas supply port is open to the outside space. A heating furnace as described in any one of the appendices [1] through [4].

[0104] According to this, since there is no need to connect piping to the barrier gas supply port, the structure of the heating furnace can be simplified.

[0105] [Note 11] The barrier gas outlet is open to the outside space. A heating furnace as described in any one of the appendices [1] through [4].

[0106] According to this, since there is no need to connect piping to the barrier gas outlet, the structure of the heating furnace can be simplified.

[0107] [Note 12] The barrier gas outlet is connected to the exhaust pipe that discharges the barrier gas from the flow path. A heating furnace as described in any one of the appendices [1] through [4].

[0108] According to this, the exhaust pipe can draw the barrier gas from the flow path, thereby creating a continuous flow of barrier gas in the flow path. Furthermore, the flow velocity of the barrier gas in the flow path can be controlled by adjusting the pressure of the barrier gas drawn in from the exhaust pipe. The barrier gas recovered from the exhaust pipe may be reused and supplied to the flow path.

[0109] [Note 13] At the connection point between the barrier gas outlet and the exhaust pipe, the central axis of the flow path and the central axis of the exhaust pipe are parallel. A heating furnace as described in any one of the footnotes

[12] .

[0110] According to this, the flow of barrier gas formed in the flow path by the exhaust pipe becomes laminar. Compared to the case where turbulent flow of barrier gas is formed in the flow path, when laminar flow of barrier gas is formed in the flow path, local variations in the amount of pressure drop caused by the flow of barrier gas in the flow path are suppressed. Therefore, the intrusion of oxidizing gases contained in the outside air into the internal space is further suppressed.

[0111] [Note 14] A transport mechanism for transporting substrates, A bonding tool for bonding electronic components to a circuit board, A heating furnace as described in any one of [Appendix 1] to [Appendix 13], wherein the internal space is provided along the transport mechanism, Equipped with, The furnace wall is, A circuit board entrance for loading circuit boards into the internal space, An opening in the interior space through which bonding tools enter and exit, A substrate outlet for removing a substrate with bonded electronic components from its internal space, Having, Bonding equipment.

[0112] According to this embodiment, the occurrence of defective products caused by oxidation of substrates and other materials during bonding is suppressed. In other words, a bonding apparatus with improved bonding reliability can be provided.

[0113] As explained above, it is possible to provide a heating furnace that can suppress the intrusion of oxidizing gases contained in the outside air.

[0114] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit its interpretation. The elements, arrangement, materials, conditions, shapes, and sizes of the embodiments are not limited to those exemplified and can be modified as appropriate. Furthermore, it is possible to partially substitute or combine the configurations shown in different embodiments. [Explanation of symbols]

[0115] 1…Bonding equipment 20…Conveying mechanism 30…Imaging Unit 31…Imaging Unit Drive Mechanism 33…Imaging Unit 40... Bonding head 41…Bonding tool drive mechanism 43…Bonding Tools 50…Electronic Components Supply Department 100...Heating furnace 110...furnace wall 110A…Superstructure 110B…Substructure 110P…inner space 110Q...External space 111...Heavenly Wall 112,113…Side wall 112A,113A…Top side wall 112B,113B…Lower side wall 112P, 113P…flow channels 114...Bottom wall 115... Circuit board entrance 116...Board exit 117…Opening 130, 131~134... Antioxidant gas supply port Pin 3... Barrier gas supply port Pout3…Barrier gas outlet Tin3...Air intake pipe 140,144,146,147,149...Bulkhead 170...Gas discharge section 171...Gas outlet 180...Heating section SB... Circuit board CH…Electronic parts BM... Joining member

Claims

1. A heating furnace in which an antioxidant gas is circulated in the internal space, At least two structures that abut each other and constitute a furnace wall defining the internal space from the external space, A flow channel formed in the contact portion of the at least two structures that are in contact with each other, the flow channel being formed at a position away from the internal space and the external space in the thickness direction of the furnace wall, A barrier gas supply port for supplying barrier gas to the aforementioned flow path, A barrier gas outlet for discharging the barrier gas from the aforementioned flow path, Having, Heating furnace.

2. The flow velocity of the barrier gas in the flow path is configured to be greater than the flow velocity of the antioxidant gas in the internal space. The heating furnace according to claim 1.

3. The longitudinal direction of the flow path extends along the longitudinal direction of the internal space. The heating furnace according to claim 1.

4. The barrier gas supply port is provided at one end in the longitudinal direction of the flow path, The barrier gas outlet is provided at the other end of the flow path opposite to the one end in the longitudinal direction. The heating furnace according to claim 3.

5. The barrier gas is clean dry air. The heating furnace according to claim 1.

6. The barrier gas is an inert gas. The heating furnace according to claim 1.

7. The barrier gas is a foaming gas. The heating furnace according to claim 1.

8. The barrier gas supply port is connected to an air supply pipe that supplies the barrier gas to the flow path. The heating furnace according to claim 1.

9. At the connection between the barrier gas supply port and the air supply pipe, the central axis of the flow path and the central axis of the air supply pipe are parallel. The heating furnace according to claim 8.

10. The barrier gas supply port is open to the outside space. The heating furnace according to claim 1.

11. The aforementioned barrier gas outlet is open to the external space. The heating furnace according to claim 1.

12. The barrier gas outlet is connected to an exhaust pipe that discharges the barrier gas from the flow path. The heating furnace according to claim 1.

13. At the connection between the barrier gas outlet and the exhaust pipe, the central axis of the flow path and the central axis of the exhaust pipe are parallel. The heating furnace according to claim 12.

14. A transport mechanism for transporting substrates, A bonding tool for bonding electronic components to the aforementioned substrate, A heating furnace according to any one of claims 1 to 13, wherein the internal space is provided along the transport mechanism, Equipped with, The aforementioned furnace wall is The internal space includes a substrate entrance for loading the substrate, The aforementioned internal space includes an opening through which the bonding tool enters and exits, A substrate outlet for transporting the substrate to which the aforementioned electronic components are bonded out of the internal space, Having, Bonding equipment.

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