Electronic device storage case and its assembly method

Abstract

By dividing the side of the case, the number of parts does not increase, and the lower side of the case during the assembly process enables assembly work by robotic equipment. [Solution] The case body 16 of the electronic device storage case is divided in the height direction into upper case sides 28, 32, 34 and lower case sides 22, 24. The upper case side 28 is formed integrally with the case side 26, and the upper case sides 32, 34 are formed integrally with the intermediate bottom surface 30 of the case, preventing an increase in the number of components. Soldering work is performed on the circuit board of the case body using a robotic soldering device without the upper case sides 28, 32, 34 being positioned. The height of the lower case sides 22, 24 is set so that the soldering iron does not come into contact with the soldering iron when the soldering work is stopped in an emergency and the soldering iron returns linearly to a predetermined origin position.

Description

Technical Field

[0001] The present invention relates to an electronic device storage case such as a power supply device that stores an electronic device including a circuit board, and an assembling method thereof.

Background Art

[0002] Conventionally, general electronic devices have a structure in which a circuit board and electronic components are attached to a sheet metal storage case (Patent Documents 1 and 2).

[0003] The storage case is constituted by, for example, a box-shaped case body opened at an upper portion, and a case cover that covers the case body. In a mounting step of attaching and fixing a circuit board inside the case body, a robotic soldering apparatus may be used to solder electronic components arranged on the circuit board in some cases.

[0004] The robotic soldering apparatus three-dimensionally movably supports a soldering iron provided with a wire solder supply mechanism at a tip end of a robot arm, and automatically performs soldering work while moving the soldering iron based on positioning control for electronic components on a circuit board arranged inside a case body placed on a worktable of the robotic soldering apparatus.

Prior Art Literature

Patent Literature

[0005]

Patent Literature 1

Patent Literature 2

Summary of the Invention

Problem to be Solved by the Invention

[0006] Incidentally, in robotic soldering equipment, an emergency stop may occur due to a malfunction or other issue during soldering of the case body, and recovery control is performed to return the soldering iron in a straight line to a predetermined origin position near the workbench. However, if the side of the case body being assembled is high, there is a possibility that the soldering iron returning to the origin position during an emergency stop may come into contact with it and cause damage.

[0007] To solve this problem, one possible solution is to divide the case side into a first and second case side in the height direction, and during the assembly process, remove the second case side, leaving only the first case side to reduce the height of the side, thereby preventing contact with the soldering iron that returns to its origin in the event of an emergency stop, and then assemble the second case side after the assembly process is complete.

[0008] However, dividing the case sides increases the number of parts and thus the cost, and gaps are likely to form at the joints when the divided case sides are assembled, potentially allowing foreign objects to enter.

[0009] The present invention aims to provide an electronic device housing case and a method for assembling the same, which allows for lowering the case sides during the mounting process and enabling mounting work by robotic equipment, without increasing the number of parts even when the case sides are divided. [Means for solving the problem]

[0010] (Electronic device storage case) The present invention relates to an electronic device storage case comprising a box-shaped case body in which the case sides are integrally raised to surround the entire or a part of the bottom surface of the case, and an electronic device including a circuit board is arranged inside the case body, The case body is divided into a first case side and a second case side in the width direction from the bottom of the case to the case opening. The first case side is formed integrally with the case bottom. The second case side is characterized by being formed integrally with one or more other case members that are attached and fixed to the case body, and being positioned on the case opening side of the first case side.

[0011] (The circuit board is placed on the case body and soldered using a robotic soldering machine.) A heatsink is positioned outside the bottom opening of the case body, a power module is positioned inside the case body behind the heatsink, and terminal leads on the case opening side of the power module are inserted through a circuit board on which electronic components are mounted. The structure involves soldering terminal leads connected to a circuit board using a designated robotic soldering device.

[0012] (Case lid) Furthermore, the electronic device storage case is provided with a case lid that covers the case body.

[0013] (Coordination between the robotic work device and the side of the split case) The case body is structured such that, after soldering the circuit board using a predetermined robotic soldering device, the second case side, which is integrated with other case components, is positioned on the case opening side of the first case side, without placing the second case side, which is integrated with other case components, in place.

[0014] (Emergency stop of robot soldering machine and width of the first case side) The width of the first case side is such that the soldering iron will not come into contact with the device if the robotic soldering device makes an emergency stop during soldering and the soldering iron returns linearly to a predetermined origin position.

[0015] (Labyrinth structure) The joint between the side of the first case and the side of the second case is designed as a stepped overlapping structure where the outer surfaces overlap flush with each other.

[0016] (Structure of the embodiment) The second case side is further divided along its length. The case body has a pair of first case sides that are integrally raised on both sides of the case bottom, and the side end faces on both sides perpendicular to the pair of first case sides are open. A part of the second case side face is integrally formed with a case side face serving as another case member arranged on one open side end face, both sides of an intermediate bottom face serving as another case member attached and fixed within the case main body are integrally formed with the remaining part of the second case side face.

[0017] (Method for assembling electronic device housing case) The present invention relates to a method for assembling an electronic device housing case that houses an electronic device including a circuit board, wherein the electronic device housing case comprises a box-shaped case main body in which a case side face is integrally erected so as to surround the whole or a part of the periphery of a case bottom face, a pair of opposing case side faces of the case main body are divided into a first case side face and a second case side face in the width direction from the case bottom face toward the case opening, the first case side face is integrally formed with the case bottom face, and the second case side face is integrally formed with one or a plurality of other case members attached and fixed to the case main body and arranged on the case opening side of the first case side face, a heat sink is arranged outside a bottom opening of the case main body, a power module is arranged inside the case main body which is on the inner side of the heat sink, and terminal leads arranged on the case opening side of the power module are arranged so as to pass through a circuit board on which electronic components are mounted, the case main body is arranged at a working position of a predetermined robotic soldering device in a state where the case opening side of the first case side face is opened without arranging the second case side face integrated with another case member, soldering work is performed on the terminal leads passed through the circuit board by the robotic soldering device, after the soldering work by the robotic soldering device is completed, the second case side face integrated with another case member is attached and fixed so as to be arranged on the case opening side of the first case side face.

[0018] (Case lid) Further, the electronic device housing case is provided with a case lid that covers the case main body.

[0019] (Emergency stop of robotic working device and width of first case side face) The width of the first case side surface is set to a width that the soldering iron will not hit when the robotic soldering apparatus makes an emergency stop during soldering work and the soldering iron returns linearly to the predetermined origin position.

[0020] (Labyrinth Structure) A mating portion between the first case side surface and the second case side surface is formed into a stepped overlapping structure in which outer surfaces overlap flush with each other.

[0021] (Structure of Embodiment) The second case side surface is further divided in the longitudinal direction, In the case body, a pair of first case side surfaces are integrally erected on both sides of a case bottom surface, and both side end surfaces orthogonal to the pair of first case side surfaces are open, a case side surface serving as another case member disposed at one open side end surface and a part of the second case side surface are integrally formed, both sides of an intermediate bottom surface serving as another case member attached and fixed inside the case body and the remaining portion of the second case side surface are integrally formed.

Effects of the Invention

[0022] (Effects of Electronic Device Storage Case) The present invention provides an electronic device storage case comprising a box-shaped case body in which a case side surface is integrally erected so as to surround the whole or a part of the periphery of a case bottom surface, and an electronic device including a circuit board is disposed inside the case body, wherein a pair of opposing case side surfaces of the case body are divided into a first case side surface and a second case side surface in a width direction from the case bottom surface toward a case opening, the first case side surface is formed integrally with the case bottom surface, and the second case side surface is formed integrally with one or a plurality of other case members attached and fixed to the case body and disposed on the case opening side of the first case side surface. Therefore, by integrating the second case side surface on the case opening side divided in the width direction with another case member, the case side surface can be formed into a divided structure without increasing the number of parts, and cost increase can be suppressed.

[0023] (Effects of Structure in which Circuit Board is Disposed in Case Body and Soldered by Robotic Soldering Apparatus) Furthermore, a heatsink is positioned outside the bottom opening of the case body, a power module is positioned inside the case body behind the heatsink, and terminal leads positioned on the case opening side of the power module are inserted through a circuit board on which electronic components are mounted. The terminal leads connected to the circuit board are then soldered using a designated robotic soldering device. This structure allows for space-efficient arrangement of the heatsink, power module, and circuit board within the case body.

[0024] (Effect of the case lid) Furthermore, since the electronic device storage case is provided with a case lid that covers the case body, it is possible to create an electronic device storage case with a box-shaped, closed structure.

[0025] (Coordination between the robotic work device and the side of the split case) Furthermore, the case body is designed so that, after soldering the circuit board using a predetermined robotic soldering device with the case opening side of the first case side left open without the second case side integrated with other case components, the second case side integrated with other case components is positioned on the case opening side of the first case side. Therefore, even if initialization control is performed to return the work tool to its home position due to an emergency stop of the robotic soldering device used in the soldering process, the split structure lowers the case side, reliably preventing the work tool from hitting and damaging the case side when returning to its home position.

[0026] (Emergency shutdown of the robotic soldering machine and the effect of the width of the first case side) Furthermore, the width of the first case side is designed so that the soldering iron will not come into contact with the case when the robot soldering device makes an emergency stop during soldering and the soldering iron returns linearly to a predetermined origin position. This ensures that damage to the case side is reliably prevented when the soldering iron returns to its origin position due to an emergency stop of the robot soldering device.

[0027] (The effect of the labyrinth structure) Furthermore, the joint between the first and second case sides is designed as a stepped overlapping structure, or so-called labyrinth structure, where the outer surfaces overlap flush. This prevents gaps from forming at the joint between the divided case sides, thus preventing the intrusion of foreign matter.

[0028] (Effects of the structure of the embodiment) Furthermore, the second case side is further divided in the longitudinal direction. The case body has a pair of first case sides that stand integrally on both sides of the case bottom, and the side end faces on both sides perpendicular to the pair of first case sides are open. A part of the second case side and another case member that is positioned on one of the open side end faces are integrally formed, and both sides of the intermediate bottom, which is another case member that is attached and fixed inside the case body, and the remaining part of the second case side are integrally formed. As a result, even if the case side is made into a divided structure and the divided second case side is further divided in the longitudinal direction, the number of parts does not increase, and cost increases can be suppressed.

[0029] (Effectiveness of the assembly method for electronic device storage cases) The present invention relates to a method for assembling an electronic device storage case for housing electronic equipment including a circuit board, wherein the electronic device storage case comprises a box-shaped case body in which the case sides are integrally erected, surrounding the entire or a part of the perimeter of the case bottom surface, and a pair of opposing case sides of the case body are divided into a first case side and a second case side in the width direction from the case bottom surface toward the case opening, the first case side is formed integrally with the case bottom surface, and the second case side is formed integrally with one or more other case members attached and fixed to the case body and is positioned on the case opening side of the first case side, a heat sink is positioned outside the bottom opening of the case body, a power module is positioned inside the case body which is inside the heat sink, and the power module is positioned on the case opening side The terminal leads are inserted through a circuit board on which electronic components are mounted, and the case body is positioned at a predetermined working position of the robot soldering device with the case opening side of the first case side open, without the second case side integrated with other case members being positioned. The robot soldering device then solders the terminal leads connected to the circuit board, and after the soldering work by the robot soldering device is completed, the second case side integrated with other case members is attached and fixed to the case opening side of the first case side. By integrating the second case side on the case opening side, which is divided in the width direction, with other case members, the case side can be made into a divided structure without increasing the number of parts, thereby suppressing cost increases. Furthermore, even if initialization control is performed to return the soldering iron to its home position due to an emergency stop of the robot soldering device used in the soldering process, the case side is lowered by the divided structure, so that it is possible to reliably prevent the soldering iron from hitting and damaging the case side when it returns to its home position.

[0030] The effects of other features in the assembly method of electronic device storage cases are the same as those described above, so we will omit further explanation. [Brief explanation of the drawing]

[0031] [Figure 1] This is an explanatory diagram showing a power supply unit incorporating a power supply device using the electronic device housing case of the present invention. [Figure 2] This is an explanatory diagram showing the external appearance of the electronic equipment housing case, with the DC / AC inverter removed from the power supply unit in Figure 1. [Figure 3] This is an explanatory diagram showing the DC / AC inverter with the case cover removed from the main case body. [Figure 4] This is an explanatory diagram showing the assembled and disassembled state of the case body. [Figure 5] This is an explanatory diagram showing the bottom of the case. [Figure 6] This is an explanatory diagram showing the top surface of the case, the left side, and the front. [Figure 7] This is an explanatory diagram showing the oblique view, top view, left side view, and front view of the case's side. [Figure 8] This is an explanatory diagram showing the middle bottom surface of the case. [Figure 9] This is an explanatory diagram showing the left side, bottom, and back of the case's middle bottom surface. [Figure 10] This is an explanatory diagram showing the bottom of the case where the circuit board is located. [Figure 11] This is an explanatory diagram showing the assembly structure of a circuit board. [Figure 12] This is an explanatory diagram showing the soldering process on the circuit board at the bottom of the case using a robotic soldering device. [Figure 13] This is an explanatory diagram showing a cross-sectional view of the stepped overlapping structure of the upper side of the case relative to the lower side of the case. [Modes for carrying out the invention]

[0032] Embodiments of the electronic device storage case according to the present invention will be described below with reference to the drawings. However, the present invention is not limited to the following embodiments.

[0033] [Basic Concepts of the Embodiment] First, the basic concept of the embodiment will be explained. The embodiment generally relates to an electronic device storage case consisting of a case body and a case lid, in which electronic devices including a circuit board are arranged inside the case body.

[0034] Here, "case body" refers to a box-shaped sheet metal component in which the case sides are integrally raised, enclosing the entire or a part of the bottom surface of the case. "Case lid" refers to a sheet metal component that covers the case body. The case body and case lid are made of lightweight and easily workable aluminum sheet metal. Furthermore, "electronic equipment including a circuit board" refers to any electronic equipment in which semiconductor elements, electrical components, etc., are mounted on a conductive pattern on a circuit board, and includes, for example, a DC / AC inverter that converts direct current power to alternating current power.

[0035] Furthermore, the electronic device enclosure has a structure in which a heatsink is positioned outside the bottom opening of the case body, a power module is positioned inside the case body behind the heatsink, terminal leads positioned on the case opening side of the power module are inserted through a circuit board on which electronic components are mounted, and the terminal leads connected to the circuit board are soldered using a designated robotic soldering device. This makes it possible to arrange the heatsink, power module, and circuit board in the case body in a space-efficient manner. Note that the power module includes concepts such as IC modules and circuit modules that require a heatsink.

[0036] Furthermore, in the embodiment, the electronic device storage case has a case body whose side surface is divided into a first case side surface and a second case side surface in the width direction from the case bottom surface to the case opening. The first case side surface on the case bottom surface side is formed integrally with the case bottom surface, and the second case side surface on the case opening surface side is formed integrally with other case members that are attached and fixed to the case body and is positioned on the case opening side of the first case side surface.

[0037] Therefore, even if the case side is divided in the width direction, the first case side is formed integrally with the case bottom, and the second case side is formed integrally with other case components. This allows the case side plate to be made into a divided structure without increasing the number of parts, thereby suppressing cost increases.

[0038] Furthermore, the "case body" is constructed with the case opening side of the first case side left open without the second case side integrated with other case components. After the circuit board is soldered using a predetermined robotic soldering device, the second case side integrated with other case components is attached and fixed to the case opening side of the first case side.

[0039] Here, a "robot soldering device" is a robotic device in which a soldering iron equipped with a solder wire supply mechanism is attached to the tip of a multi-jointed robotic arm, and the soldering iron is moved to the soldering position on a circuit board through which the terminal leads of a circuit module located inside the case body are inserted, thereby automatically performing the soldering work.

[0040] Furthermore, in the "robot soldering device," the soldering iron is initially positioned at the origin near the workbench, and performs soldering work on the circuit board inside the case body placed on the workbench. If an emergency stop occurs due to a malfunction during operation, an initialization control is performed to move the soldering iron linearly back to the origin position.

[0041] Therefore, even if initialization control is performed to return the soldering iron to its home position due to an emergency stop of the robotic soldering machine used in the assembly process, the split structure lowers the sides of the case, making it possible to reliably prevent the soldering iron from hitting the sides of the case and being damaged when it returns to its home position.

[0042] Furthermore, the width of the first case side from the bottom of the case is set to a predetermined width so that the soldering iron does not come into contact with the case when the robot soldering device makes an emergency stop during soldering and the soldering iron returns linearly to a predetermined origin position. This prevents the soldering iron from hitting the side of the case and causing damage when it returns to its origin position due to an emergency stop of the robot soldering device.

[0043] Furthermore, the joint between the first and second case sides is constructed with a stepped overlapping structure, a so-called labyrinth structure, where the outer surfaces overlap flush. As a result, no gaps are created at the joint between the divided case sides, preventing the intrusion of foreign matter.

[0044] Furthermore, the "case body" of the embodiment has a pair of first case sides that are integrally erected on both sides of the case bottom surface, and the side end surfaces perpendicular to the pair of first case sides are open. A part of the second case side is integrally formed with a case side that will become another case member and is positioned on the open side end surface, and the remaining part of the second case side is integrally formed with the intermediate bottom surface of the case, which will become another case member and is attached and fixed inside the case body. That is, the second case side, which is divided in the width direction, is further divided in the longitudinal direction, with one second case side being integrated with the perpendicular case side and the other second case side being integrated with the intermediate bottom surface.

[0045] Here, the "intermediate bottom surface of the case" refers to the bottom surface of the case positioned midway above the main bottom surface. This creates a two-tiered structure inside the case, allowing for the placement of circuit boards and electronic components, thereby increasing the mounting density.

[0046] Therefore, the assembly method of this embodiment allows for a structure in which the case side plate is divided in the width direction from the bottom of the case to the case opening, and the divided second case side is further divided in the longitudinal direction, without increasing the number of parts, and thus keeping costs down.

[0047] Furthermore, the assembly method of the embodiment relates to a method for assembling an electronic device storage case that houses electronic devices including a circuit board.

[0048] Furthermore, the method for assembling the electronic device storage case is assumed to be a box-shaped case body in which the case sides are integrally erected, surrounding the entire or a part of the bottom surface of the case, and the pair of opposing case sides of the case body are divided into a first case side and a second case side in the width direction from the bottom surface to the case opening, the first case side is formed integrally with the bottom surface of the case, and the second case side is formed integrally with one or more other case members attached and fixed to the case body and is positioned on the case opening side of the first case side, a heat sink is positioned outside the bottom opening of the case body, a circuit module is positioned inside the case body which is inside the heat sink, and terminal leads positioned on the case opening side of the circuit module are inserted through a circuit board on which electronic components are mounted.

[0049] The assembly method of the embodiment first involves positioning the case body at a predetermined working position of the robot soldering device with the case opening side of the first case side open, without arranging the second case side which is integrated with other case components.

[0050] Next, a robotic soldering machine performs the soldering work, connecting the terminal leads of the circuit module to the circuit board.

[0051] Next, after the soldering work by the robotic soldering machine is completed, the second case side, which is integrated with the other case components, is attached and fixed so that it is positioned on the upper side of the case side.

[0052] This method of assembling electronic device enclosure cases allows for a segmented case side panel without increasing the number of parts, by integrating the divided second case side with other case components, thereby suppressing cost increases. Furthermore, even if the robotic soldering machine used in the mounting process is stopped in an emergency and initialization control is performed to return the soldering iron to its home position, the segmented structure lowers the case side, reliably preventing the soldering iron from hitting and damaging the case side as it returns to its home position.

[0053] The following describes a specific embodiment. The specific embodiment described below is an inverter storage case, and assuming the positional relationship of the top, bottom, left, right, front, and back when the bottom surface of the inverter storage case is placed on a horizontal workbench, the first case side is the lower case side and is formed integrally with the bottom surface of the case, the second case side is the upper case side and is further divided in the longitudinal direction, one of the lower case sides is formed integrally with the orthogonal case side, and the other lower case side is formed integrally with the intermediate bottom surface of the case which is located inside the case body.

[0054] The electronic device storage case of the embodiment will be described in more detail. The details will be explained in the following sections. a. Power supply unit b. DC / AC inverter electronic device storage case c. Case body d. Bottom of the case e. Side of the case f. Middle bottom of the case g. Circuit board assembly structure requiring soldering h. Case body mounting process using robotic soldering equipment i. Connecting structure of the side of the split case j. Modifications of the present invention

[0055] [a. Power supply unit] First, a power supply unit using the electronic device housing case of this embodiment will be described. In this description, refer to Figure 1, which shows a power supply unit incorporating a power supply device using the electronic device housing case of the present invention. Figure 1(A) shows the front view, and Figure 1(B) shows the side view.

[0056] As shown in Figure 1, inside the housing of the power supply unit 100 with the front panel removed, a DC / DC converter 10 is located at the top, and a DC / AC inverter 12 is located below it. The DC / DC converter 10 receives high-voltage DC power from, for example, a battery of a solar power generation system, converts it to a predetermined low-voltage DC power, and outputs it.

[0057] The DC / AC inverter 12 receives the DC power output from the DC / DC converter 10, converts it to AC power of a predetermined voltage, for example, 100 volts or 200 volts at 50 Hz or 60 Hz, and supplies it to the load device. The electronic equipment housing case of this embodiment is applied to the DC / AC inverter 12 provided in the power supply unit 100.

[0058] [b. Storage case for DC / AC inverter electronic equipment] Next, we will describe the electronic equipment housing case for the DC / AC inverter. In this description, please refer to Figure 2, which shows the external appearance of the electronic equipment housing case after removing the DC / AC inverter from the power supply unit in Figure 1; Figure 3, which shows the DC / AC inverter with the case cover removed from the case body; and Figure 4, which shows the assembled and disassembled state of the case body.

[0059] In the explanation of Figure 2, the XYZ directions are mutually orthogonal. Specifically, when the electronic device enclosure case of the DC / AC converter is placed on a horizontal workbench or the like and viewed from above, the left-right direction is the X direction, the up-down direction is the Y direction, and the front-back direction is the Z direction. Furthermore, in the X direction, the +X side is the right side and the -X side is the left side; in the Y direction, the +Y side is the top and the -Y side is the bottom; and in the Z direction, the +Z side is the front and the -Z side is the rear. This aspect of the XYZ directions is the same in Figures 3 to 12, which represent embodiments of the present invention.

[0060] As shown in Figure 2, the electronic equipment housing case 14 of the DC / AC inverter 12 consists of a case body 16 and a case lid 18.

[0061] As shown in Figure 3, the case body 16 is a box-shaped structure with an opening at the top, and electronic equipment including a circuit board is incorporated inside the case. The case lid 18 is attached to the top of the case body 16 and is secured by screws.

[0062] The case body 16 and case lid 18 are formed by sheet metal processing using thin aluminum sheets, which offer excellent lightness and workability. However, the material is not limited to aluminum; sheet metal processing of iron plates may also be used.

[0063] [c. Case body] Next, the case body will be described. The case body 16 is made up of multiple case components, and as shown in Figure 4, for example, it is made up of three components: the case bottom surface 20, the case side surface 26, and the case middle bottom surface 30.

[0064] The case bottom surface 20 is formed with case lower sides 22 and 24 integrally upright on both sides in the front-to-back direction, flanking the bottom surface portion 2010. Furthermore, a case upper side 28 is integrally formed on the case side 26 located at the left end of the case bottom surface 20, in a direction perpendicular to the upper side of the side. Additionally, the case middle bottom surface 30 is formed with case upper sides 32 and 34 integrally upright on both sides in the front-to-back direction, flanking the middle bottom surface portion 3010.

[0065] Therefore, as is clear from the case body 16 shown in Figure 3, the case sides located in the front-rear direction of the case body 16 are divided in the height direction into lower case sides 22, 24 which are formed integrally with the case bottom surface 20, and upper case sides 28 which are formed integrally with the case side 26 and upper case sides 32, 34 which are formed integrally with the intermediate bottom surface 30.

[0066] Furthermore, the upper side of the case located at the front of the case body 16 is divided into a left upper side 28 and a right upper side 32, with a gap between them in the longitudinal direction (left-right direction).

[0067] The heights of the lower sides 22, 24 and the upper sides 28, 32, 34 of the case are arbitrary, but in this embodiment, for example, they are set to approximately half the height of the case body 16. However, as will be described later, the height of the lower sides 22, 24 of the case is set to a height that allows soldering work by a robotic soldering device.

[0068] [d. Bottom of the case] Next, the bottom of the case will be described. For this description, please refer to Figure 5, which shows the bottom of the case, and Figure 6, which shows the top view, left side view, and front view of the bottom of the case. Figure 6(A) shows the top view, Figure 6(B) shows the left side view, and Figure 6(C) shows the front view.

[0069] As shown in Figures 5 and 6, the case bottom surface 20 has the lower case sides 22 and 24 integrally erected at both ends in the front-to-back direction of the bottom surface portion 2010 which serves as the bottom plate, and the left-to-right sides are open.

[0070] At the upper ends of the lower side surfaces 22 and 24 of the case, horizontally bent side connecting ribs 2210 and 2410 are formed, and the divided upper side surfaces of the case, specifically the upper side surfaces 32 and 34 of the intermediate bottom surface 30 of the case shown in Figure 4, are placed here and fixed with screws.

[0071] Furthermore, a rectangular heatsink placement hole 2012 is formed in the bottom portion 2010. A predetermined power module is placed inside the heatsink placement hole 2012 with its terminal leads facing upwards, and a heatsink used for heat dissipation from the power module is placed outside the heatsink placement hole 2012.

[0072] [e. Side of the case] Next, we will describe the side of the case located at the left-side opening of the case body. For this description, please refer to Figure 7, which shows the oblique view, top view, left side view, and front view of the side of the case. Figure 7(A) shows the oblique view, Figure 7(B) shows the top view, Figure 7(C) shows the left side view, and Figure 7(D) shows the front view.

[0073] As shown in Figure 7, the case side surface 26 is positioned at the left end of the opening of the case bottom surface 20 shown in Figure 4, and has a side surface portion 2610 that closes the opening. An upper case side surface 28 of a predetermined length is integrally formed on the upper side of the front end of the side surface portion 2610, in a direction perpendicular to it (to the right).

[0074] The lower end of the upper side surface 28 of the case has a stepped mating surface 2810 formed therein, which connects to a part (left side) of the lower side surface 22 of the case bottom surface 20, shown in Figure 4, located below it.

[0075] [f. Middle bottom of the case] Next, the middle bottom surface of the case will be described. For this description, please refer to Figure 8, which shows the middle bottom surface of the case in an oblique view, and Figure 9, which shows the left side, bottom, and back of the middle bottom surface of the case. Figure 9(A) shows the left side, Figure 9(B) shows the bottom, and Figure 9(C) shows the back.

[0076] As shown in Figures 8 and 9, the intermediate bottom surface 30 of the case has the upper side surfaces 32 and 34 of the case integrally erected at both ends in the front-to-back direction of the bottom surface 3010. As shown in Figure 4, the intermediate bottom surface 30 of the case is positioned in an intermediate location on the upper right side of the bottom surface 20, creating a two-story structure for the bottom surface, thereby increasing the mounting density of circuit boards and electronic components in the height direction.

[0077] [g. Assembly structure of circuit boards requiring soldering] Next, we will describe the assembly structure of a circuit board that requires a soldering process using a robotic soldering device. In this description, refer to Figure 10, which shows the bottom surface of the case on which the circuit board is placed, and Figure 11, which shows the assembly structure of the circuit board.

[0078] As shown in Figure 10, a circuit board 35 with electronic components mounted on it is attached and fixed to the bottom surface 20 of the case. The circuit board 35 has electronic components arranged on its top surface, and is attached and fixed after the soldering work to the circuit pattern is completed on the back side.

[0079] Furthermore, multiple power modules, for example, three power modules, are arranged on the underside of the circuit board 35, and terminal leads extending upward from the multiple power modules are inserted into the circuit board 35 and brought out to the top surface of the board.

[0080] As shown in Figure 11, the circuit board 35 is mounted to the bottom of the case. A heat sink 50 is positioned below a heat sink placement hole 2012 (see Figures 5 and 6) opened in the bottom of the case 20. Three power modules 52 are mounted and fixed inside the bottom of the case 20 in contact with the heat sink 50.

[0081] The power module 52 has multiple terminal leads 54 extending upwards in a rectangular arrangement, and the circuit board 35 is positioned above the power module 52 so that the terminal leads 54 can be inserted through it. Soldering is performed on the terminal leads 54 that extend upwards on the circuit board 35 using a robotic soldering device.

[0082] [h. Case assembly process using robotic soldering equipment] Next, we will describe the assembly process of the case body using a robotic soldering device. In this description, please refer to Figure 12, which shows the soldering work performed by the robotic soldering device on the circuit board at the bottom of the case.

[0083] As shown in Figure 12, a robotic soldering device 38 is used to automatically solder terminal leads 54 that are inserted from a power module located on the underside of a circuit board 35 positioned on the bottom surface 20 of the case.

[0084] The type, structure, and function of the robotic soldering apparatus 38 are arbitrary, but for example, the robot body 3810 is installed at a predetermined position on the workbench 40, and the robot arm 42 is positioned at the upper end of the robot body 3810. The robot arm 42 is, for example, a three-jointed arm, and the tip of the arm is capable of moving in three dimensions.

[0085] A soldering iron 44 is attached to the tip of the robot arm 42. A solder wire supply mechanism 46 is also provided to supply solder wire 48 to the soldering iron 44.

[0086] In its initial state, the robotic soldering device 38 positions the tip of the soldering iron 44 at a predetermined origin O near the workbench 40. The case bottom surface 20, on which the circuit board 35 shown in Figure 10 is mounted and fixed before soldering, is then fixed to a predetermined working position on the workbench 40 in preparation.

[0087] Next, the robotic soldering device 38 is started, and the soldering iron 44 is moved to the circuit board 35 via a predetermined path that does not come into contact with the side of the case, under program control. The soldering operation is then performed automatically on the terminal leads 54 on the circuit board 35 while supplying solder wire 48. Once the soldering operation is complete, the soldering iron 44 is returned to its home position O.

[0088] However, if the robotic soldering device 38 is stopped due to a malfunction or other reason while soldering to the circuit board 35, for example, if it is stopped while working at point P on the circuit board 35, an emergency stop control is performed to return the soldering iron 44 to the origin O via the shortest straight path from point P.

[0089] In this embodiment, the bottom surface 20 of the electronic device storage case is divided vertically, leaving only the lower side surfaces 22 and 24, and is made lower by making them half the height of the upper side surfaces 32 and 34, which are shown by dashed lines.

[0090] Therefore, if the upper side surface 34 of the case were positioned along the path from point P back to the origin O due to an emergency stop, as shown by the dashed line, the soldering iron 44 could collide with the upper side surface 34 at point Q and be damaged. However, the upper side surface 34 of the case does not exist during the soldering work by the robot soldering device 38, and instead consists of the lower side surfaces 22 and 24 of the case. In the event of an emergency stop, the soldering iron 44 can return to the origin O without colliding with the lower side surface 24 of the case.

[0091] Here, the height of the lower sides 22 and 24 of the case is set to half the height of the original side of the case. The height of the lower sides 22 and 24 of the case should be such that the soldering iron 44 does not hit the soldering iron when it is returned to the origin O in a straight line due to an emergency stop of the robot soldering machine 38. By setting the height of the lower sides 22 and 24 of the case to half the height of the original side of the case, the condition that the soldering iron 44 does not hit the soldering iron is met.

[0092] After the soldering work on the case bottom surface 20 to the circuit board 35 by the robotic soldering device 38 is completed, the intermediate case bottom surface 30, on which the circuit board and electronic components have been mounted, is attached and fixed to the case bottom surface 20 shown in Figure 10, as shown in Figure 4, and the upper case sides 32 and 34 are placed on top of the lower case sides 22 and 24 to complete the divided case sides. Furthermore, as shown in Figure 4, the case side 26 is attached and fixed to the case bottom surface 20, and the upper case side 28 is placed on top of the lower case side 22 to complete the divided case sides.

[0093] [i. Connecting structure on the side of the split case] Next, we will describe the connecting structure of the side surfaces of the divided case in the electronic device storage case. For this description, please refer to Figure 13, which shows a cross-sectional view of the stepped overlapping structure of the upper case surface relative to the lower case surface.

[0094] As shown in Figure 3, the connection structure between the lower case side 22 and the upper case side 28 in the case body 16 is such that, as shown in Figure 13, the upper case side 28 is connected to the upper part of the lower case side 22, which rises from the bottom surface 2010 so that the outer case surface is flush with the surface. As shown in Figure 7, a stepped mating surface 2810 is formed at the lower end of the upper case side 28. By arranging the upper case side 28 so that the stepped mating surface 2810 fits into the inside of the tip of the lower case side 22, a so-called labyrinth structure is created, which prevents gaps from forming in the divided surfaces and prevents foreign matter from entering from the outside.

[0095] Furthermore, regarding the connection between the lower side surface 22 of the case bottom surface 20 and the upper side surfaces 32 and 34 of the intermediate bottom surface 30 of the case, the side connecting rib 2210 of the lower side surface 22 and the intermediate bottom surface portion 3010 (corner bottom surface) that continues from the upper side surfaces 32 and 34 of the case are overlapped and fixed with screws. As a result, no gaps are created in the divided recessed surfaces, and similarly, the intrusion of foreign matter from the outside can be prevented.

[0096] [i. Variations of the present invention] Modifications of the electronic device housing case according to the present invention will now be described. In addition to the embodiments described above, the electronic device housing case of the present invention includes the following modifications.

[0097] (Side of the case) The above embodiment uses an electronic device storage case as an example, in which case sides are formed on the front, rear, and left sides of the case body 16. However, it is not limited to this, and an electronic device storage case in which case sides are formed on the entire front, rear, left, and right sides of the case body 16 may also be used, and the case sides may be similarly divided in the height direction. In addition, although the case upper sides 28 and 32, which are divided in the longitudinal direction (left and right direction), are placed on the case lower side 22, the case upper side may be a single integrated unit in the longitudinal direction.

[0098] (electronic equipment) Furthermore, although the above embodiment uses a DC / AC inverter as an example of electronic equipment, it is not limited to this and may include a power supply or housing case for the electronic equipment as appropriate.

[0099] (Robot soldering equipment) Furthermore, although the above embodiment uses a robotic soldering apparatus as an example, it is not limited to this and includes any suitable robotic work apparatus that automatically performs the necessary work for mounting electronic components, including circuit boards, onto an electronic device housing case.

[0100] (others) Furthermore, the present invention includes appropriate modifications that do not impair its purpose and advantages, and is not limited by the numerical values ​​shown in the above embodiments. [Explanation of symbols]

[0101] 10: DC / DC Converter 12: DC / AC Converter 14: Electronic device storage case 16: Case body 18: Case lid 20: Bottom of the case 2010: Bottom part 2012: Heatsink placement holes 22,24: Bottom side of the case 2210, 2410: Side connecting ribs 26: Side of the case 2610: Side part 28, 32, 34: Top side of the case 2810: Stepped joint surface 30: Middle bottom of the case 3010: Middle bottom part 35: Circuit board 38: Robot Soldering Equipment 3810: Robot body 40: Workbench 42: Robot Arm 44: Soldering iron 46: Solder Wire Supply Mechanism 48: Itohanda 50: Heatsink 52: Power Module 54: Terminal Leads 100: Power supply unit

Claims

1. An electronic device storage case comprising a box-shaped case body in which the sides of the case are integrally raised to surround the entire or a part of the bottom surface of the case, and an electronic device including a circuit board is arranged inside the case body, The pair of opposing side surfaces of the case body are divided into a first side surface and a second side surface in the width direction from the bottom surface of the case toward the case opening. The first case side surface is formed integrally with the case bottom surface, The electronic device storage case is characterized in that the second case side is formed integrally with one or more other case members that are attached and fixed to the case body and is positioned on the case opening side of the first case side.

2. An electronic device storage case according to claim 1, A heatsink is positioned outside the bottom opening of the case body, a power module is positioned inside the case body behind the heatsink, and terminal leads positioned on the case opening side of the power module are inserted through a circuit board on which electronic components are mounted. An electronic device housing case characterized by having a structure in which terminal leads connected to the circuit board are soldered using a predetermined robotic soldering device.

3. An electronic device storage case according to claim 1, An electronic device storage case characterized by having a case lid that covers the case body.

4. An electronic device storage case according to claim 1, The case body is characterized in that, after soldering the circuit board using a predetermined robotic soldering device with the case opening side of the first case side left open without the second case side integrated with the other case members being positioned, the second case side integrated with the other case members is positioned on the case opening side of the first case side.

5. The electronic device storage case according to claim 2, The width of the first case side is such that the soldering iron does not come into contact with the device when the robotic soldering device makes an emergency stop during soldering and the soldering iron returns linearly to a predetermined origin position.

6. An electronic device storage case according to claim 1, An electronic device storage case characterized in that the joint between the first case side and the second case side is a stepped overlapping structure in which the outer surfaces overlap flush.

7. An electronic device storage case according to claim 1, The aforementioned second case side is further divided in the longitudinal direction, The case body has a pair of first case sides that are integrally erected on both sides of the bottom surface of the case, and the side end faces on both sides perpendicular to the pair of first case sides are open. A part of the second case side surface is integrally formed with the other case member that is positioned on the open side end face, An electronic device storage case characterized in that both sides of the intermediate bottom surface, which will become other case members to be attached and fixed inside the case body, and the remaining portion of the second case side are integrally formed.

8. A method for assembling an electronic device storage case that houses electronic devices including a circuit board, The electronic device storage case comprises a box-shaped case body in which the case sides are integrally erected, enclosing the entire or a part of the perimeter of the case bottom surface, and a pair of opposing case sides of the case body are divided into a first case side and a second case side in the width direction from the case bottom surface toward the case opening, the first case side is formed integrally with the case bottom surface, and the second case side is formed integrally with one or more other case members attached and fixed to the case body and is positioned on the case opening side of the first case side. A heatsink is positioned outside the bottom opening of the case body, a power module is positioned inside the case body behind the heatsink, and terminal leads positioned on the case opening side of the power module are inserted through a circuit board on which electronic components are mounted. The case body is positioned at a predetermined working position of the robot soldering device with the case opening side of the first case side open, without the second case side integrated with the other case members being placed therein. The robotic soldering device performs the task of soldering terminal leads connected to the circuit board. A method for assembling an electronic device storage case, characterized in that, after the soldering work by the robotic soldering device is completed, the second case side, which is integrated with the other case members, is attached and fixed so as to be positioned on the case opening side of the first case side.

9. A method for assembling an electronic device storage case according to claim 8, A method for assembling an electronic device storage case, characterized in that a case lid is provided to cover the case body.

10. A method for assembling an electronic device storage case according to claim 9, A method for assembling an electronic device storage case, characterized in that the width of the first case side is such that the soldering iron does not come into contact with the robot soldering device when it makes an emergency stop during soldering work and the soldering iron returns linearly to a predetermined origin position.

11. A method for assembling an electronic device storage case according to claim 8, A method for assembling an electronic device storage case, characterized in that the joint between the first case side and the second case side is a stepped overlapping structure in which the outer surfaces overlap flush.

12. A method for assembling an electronic device storage case according to claim 8, The aforementioned second case side is further divided in the longitudinal direction, The case body has a pair of first case sides that are integrally erected on both sides of the bottom surface of the case, and the side end faces on both sides perpendicular to the pair of first case sides are open. A part of the second case side surface is integrally formed with the other case member that is positioned on the open side end face, A method for assembling an electronic device storage case, characterized in that both sides of the intermediate bottom surface, which will become other case members to be attached and fixed inside the case body, and the remaining portion of the second case side are integrally formed.

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