LED lamp

Abstract

This technology enables reliable wireless communication while suppressing the entry of insects and dust into LED lamps. [Solution] An LED lamp 1 comprising a light source unit 30 including an LED element 40 and an LED mounting substrate 50 on which the LED element 40 is mounted, a circuit 80 that supplies power to the light source unit 30, and a wireless communication capable antenna 84, wherein the LED mounting substrate 50 has an opening 51 at a position that overlaps with the antenna 84 in a plan view, and further comprises a resin sealing member 100 that is mounted on the LED mounting substrate 50 and covers the opening 51.

Description

Technical Field

[0001] The present disclosure relates to an LED lamp. Background Art

[0002] Conventionally, LED lamps that are detachably attachable to sockets of lighting fixtures are widely known. Patent Document 1 discloses a configuration including a base, an LED mounting substrate disposed on one surface side of the base, and an antenna capable of wireless communication disposed on the other surface side of the base. Further, Patent Document 1 discloses that, for the purpose of achieving satisfactory wireless communication, an opening through which electromagnetic waves for wireless communication pass is formed in a region near the antenna. Prior Art Documents Patent Documents

[0003] Patent Document 1 Japanese Unexamined Patent Application Publication No. 2017-16756 Summary of the Invention Problem to be Solved by the Invention

[0004] When an opening through which electromagnetic waves for wireless communication pass is provided as in Patent Document 1, there is a possibility that insects, dust and the like may enter the region on the light-emitting surface side inside the LED lamp through the opening. When insects or dust enter the region on the light-emitting surface side inside the LED lamp, the aesthetic appearance of the LED lamp is impaired, and the light-emitting performance deteriorates. Therefore, there is a demand for achieving satisfactory wireless communication while suppressing the intrusion of insects and dust into the LED lamp. Means for Solving the Problem

[0005] An LED lamp according to one aspect of the present disclosure comprises a light source unit including an LED element and an LED mounting substrate on which the LED element is mounted, a circuit for supplying power to the light source unit, and a wireless communication-capable antenna, wherein the LED mounting substrate has an opening in a position that overlaps with the antenna in a plan view, and further comprises a resin sealing member that is mounted on the LED mounting substrate and covers the opening. [Effects of the Invention]

[0006] According to one embodiment of the present disclosure, an LED lamp can achieve good wireless communication while suppressing the intrusion of insects and dust into the LED lamp. Furthermore, according to one embodiment of the present disclosure, an LED lamp can suppress the reduction in light extraction efficiency due to an opening provided in the LED mounting substrate, and the appearance of dark areas on the emission surface. [Brief explanation of the drawing]

[0007] [Figure 1] This is a perspective view of an LED lamp, which is an example of an embodiment, seen from below. [Figure 2] This is a perspective view from above of an LED lamp, which is an example of an embodiment. [Figure 3] This is an exploded perspective view of an LED lamp, which is an example of an embodiment. [Figure 4] This is an axial cross-sectional view of an LED lamp, which is an example of an embodiment. [Figure 5] This is a plan view of an LED lamp, which is an example of an embodiment, showing the lamp with the translucent cover removed. [Figure 6] This is a perspective view of an LED lamp, which is an example of an embodiment, and shows a magnified view of the vicinity of the resin cover with the outer cover and light-transmitting cover removed. [Figure 7] This is a perspective view of a resin cover for an LED lamp, which is an example of an embodiment. [Modes for carrying out the invention]

[0008] Hereinafter, an example of an embodiment of the LED lamp according to this disclosure will be described in detail with reference to the drawings. The embodiment described below is merely an example, and this disclosure is not limited to the embodiments described below. Furthermore, forms obtained by selectively combining each component of the embodiments described below are included in this disclosure.

[0009] Figure 1 is a perspective view of the LED lamp 1 from a diagonal downward angle, and Figure 2 is a perspective view of the LED lamp 1 from a diagonal upward angle. In this specification, "up and down" refers to the direction in which the protruding portion 12 of the outer cover 10 is "up" and the light-emitting surface 21 of the translucent cover 20 is "down". Also, the up and down direction in this specification does not necessarily refer to the vertical direction.

[0010] As shown in Figures 1 and 2, the LED lamp 1 is a thin, flat lamp with a cylindrical shape, and is lit by power supplied through a socket (not shown) of a lighting fixture when installed in the socket. When the LED lamp 1 is installed in the socket, a lighting fixture such as a downlight, spotlight, or ceiling light is formed.

[0011] The outer diameter of the LED lamp 1 is not particularly limited. For example, the outer diameter of the LED lamp 1 is φ70 mm. In this embodiment, the outer diameter of the LED lamp 1 is set to be larger than the height (axial length) of the LED lamp 1.

[0012] LED lamp 1 is a replaceable lamp with a base that can be attached to and detached from a socket. In this embodiment, the base of LED lamp 1 is a GX53 base. However, the base of LED lamp 1 is not limited to this and may have other bases such as GH76p.

[0013] As shown in Figures 1 and 2, the LED lamp 1 comprises a cylindrical outer cover 10 and a translucent cover 20 attached to the outer cover 10. The LED lamp 1 is attached to the socket by inserting the base pins 11 protruding from the outer cover 10 into the pin insertion part of the socket, thereby electrically connecting the LED lamp 1 and the socket.

[0014] The LED lamp 1 has a structure in which a light source unit 30 (see Figure 3 below) and the like are housed inside an outer cover 10. The outer cover 10 forms the external appearance of the LED lamp 1 and also functions as a housing that accommodates the light source unit 30 and the circuit 80 (see Figure 3 below).

[0015] In the LED lamp 1, light emitted from the light source unit 30 is emitted through the translucent cover 20. The translucent cover 20 has, for example, a circular emission surface 21 in plan view. In this specification, unless otherwise specified, "plan view" means the view from a direction perpendicular to the emission surface 21 of the translucent cover 20.

[0016] In this embodiment, a projection 22 for attaching and detaching the lamp is formed on the emission surface 21. When removing the LED lamp 1 from the socket, a rotational load is applied to the translucent cover 20 using this projection 22, causing the LED lamp 1 to rotate relative to the socket and allowing it to be removed.

[0017] LED lamp 1 is a lamp that allows the user to freely adjust the brightness and color of light by controlling the built-in LEDs with different color temperatures through the operation of a terminal device (not shown). An example of a terminal device is the remote control included with LED lamp 1. The user can change the brightness and color of light settings to suit their needs, such as relaxation, concentration, or sleep preparation.

[0018] Next, constituent members of the LED lamp 1 will be described with reference to FIGS. 3 to 5. FIG. 3 is an exploded perspective view of the LED lamp 1, FIG. 4 is an axial cross-sectional view of the LED lamp 1, and FIG. 5 is a plan view of the LED lamp 1, showing a state where the translucent cover 20 is removed.

[0019] As shown in FIGS. 3 and 4, the LED lamp 1 includes: a light source unit 30 including an LED element; a first heat sink 60 that dissipates heat from the light source unit 30; a heat dissipation sheet 70; a circuit 80 that supplies electric power to the light source unit 30; a second heat sink 90 that dissipates heat from the circuit 80; and a translucent cover 20 from which light emitted from the light source unit 30 exits. The LED lamp 1 further includes, as described above, a bottomed cylindrical outer cover 10 that accommodates the light source unit 30, the first heat sink 60, the heat dissipation sheet 70, the circuit 80, and the second heat sink 90. As will be described in detail later, a wireless communication module 83 including an antenna 84 is mounted on the circuit 80.

[0020] The light source unit 30 includes an LED element 40 (see FIG. 5) and an LED mounting substrate 50 on which the LED element 40 is mounted. The light source unit 30 is fixed to the first heat sink 60 with screws 56 such that the light-emitting surface of the LED element 40 is disposed opposite to the translucent cover 20.

[0021] As shown in FIG. 5, the LED element 40 includes a first LED element 41 that emits first light, and a second LED element 42 that emits second light having a color temperature different from that of the first light. Including the first LED element 41 and the second LED element 42 having different color temperatures makes it possible to change the color temperature while maintaining constant brightness, or change the brightness while maintaining constant color temperature. In the present embodiment, the first LED element 41 emits warm-colored light having a color temperature of about 2700 K, and the second LED element 42 emits cool-colored light having a color temperature of about 6500 K. Note that the color temperatures of the first LED element 41 and the second LED element 42 are not limited thereto.

[0022] The first LED element 41 and the second LED element 42 are both surface-mount (SMD) type LED light sources in which the LED is packaged. The first LED element 41 and the second LED element 42 each consist of a container, an LED chip mounted inside the container, and a sealant that encapsulates the LED chip.

[0023] The LED chips included in the first LED element 41 and the second LED element 42 are semiconductor elements that emit light in response to a predetermined DC power, and are bare chips that emit monochromatic visible light. The LED chips are, for example, blue LEDs that emit blue light when power is applied. The emission wavelengths of the LED chips included in the first LED element 41 and the LED chips included in the second LED element 42 may be different from each other, but in this embodiment they are substantially the same.

[0024] The encapsulant contained in the first LED element 41 and the second LED element 42 is a light-transmitting insulating resin material such as silicone. The encapsulant in this embodiment contains a phosphor as a wavelength conversion material that converts the wavelength of light from the LED chip. In other words, the encapsulant in this embodiment is a phosphor-containing resin in which a phosphor is contained in a light-transmitting resin.

[0025] The first LED element 41 and the second LED element 42 differ in the type and composition of the phosphor used as the wavelength conversion material in the encapsulant. For example, when the first LED element 41 emits light with a color temperature of 2700K, a nitride-based phosphor or a YAG (yttrium aluminum garnet)-based phosphor can be used. Also, for example, when the second LED element 42 emits light with a color temperature of 6500K, a YAG-based phosphor or a silicate-based phosphor can be used.

[0026] In this embodiment, a pair of one first LED element 41 and one second LED element 42 is used as a basic unit, and this basic unit is arranged across the entire surface. By arranging a pair of one first LED element 41 and one second LED element 42 as a basic unit, color unevenness of the emission surface 21 can be reduced, for example, even when the brightness is reduced.

[0027] The LED mounting substrate 50 has a roughly circular shape. The diameter of the LED mounting substrate 50 is slightly smaller than the inner diameter of the outer cover 10. The gap between the LED mounting substrate 50 and the outer cover 10 is sealed with a resin material such as silicone resin.

[0028] The LED mounting substrate 50 is a metal base substrate obtained by applying an insulating coating to a substrate made of a metal material such as aluminum. Metal wiring (not shown) electrically connected to the LED elements 40 is formed on the LED mounting substrate 50, and the LED elements 40 are arranged throughout the entire surface.

[0029] The LED mounting board 50 is provided with an opening 51 at a position that axially overlaps with the antenna 84 included in the wireless communication module 83 mounted on the circuit 80. The opening 51 is a hole through which electromagnetic waves for wireless communication with the antenna 84 can pass. In particular, when a metal base substrate is used for the LED mounting board 50, electromagnetic waves are easily blocked by the LED mounting board 50. As in this embodiment, by providing an opening 51 at a position that axially overlaps with the antenna 84 on the LED mounting board 50, communication performance can be ensured.

[0030] In a plan view of the LED mounting board 50, the length from the outer edge of the opening 51 to the antenna 84 can be appropriately set according to the characteristics of the antenna 84, but is, for example, 3 mm or more. Increasing the length from the outer edge of the opening 51 to the antenna 84 makes it easier for electromagnetic waves for wireless communication with the antenna 84 to pass through, thereby ensuring better communication performance. On the other hand, if the length from the outer edge of the opening 51 to the antenna 84 becomes too large, the number of LED elements 40 that can be placed on the LED mounting board 50 will decrease. Therefore, from the viewpoint of ensuring light emission output, etc., the length from the outer edge of the opening 51 to the antenna 84 is, for example, 15 mm or less.

[0031] In this embodiment, the opening 51 is a notch provided on the outer edge of the LED mounting substrate 50, having a substantially rectangular shape in plan view. However, the shape of the opening 51 is not limited to this. For example, the opening 51 may have a substantially circular shape in plan view. As will be described in detail later, the opening 51 of the LED mounting substrate 50 is covered with a resin cover 100 as a sealing member, preventing insects and dust from entering the light-emitting surface side from the circuit 80 side through the opening 51.

[0032] In addition to the opening 51, the LED mounting board 50 is provided with through holes 52 through which screws 56 for fixing the light source unit 30 to the first heat sink 60 pass. In this embodiment, the LED mounting board 50 is provided with two through holes 52.

[0033] Furthermore, in addition to the opening 51 and through-hole 52, the LED mounting substrate 50 is provided with a wiring insertion section 53 through which wiring 85 (see Figure 5) connecting the power supply unit 82 (see Figure 4) mounted on the circuit 80 and the LED element 40 is inserted. In other words, in this embodiment, the wiring 85 connecting the power supply unit 82 and the LED element 40 does not pass through the opening 51, but passes through the wiring insertion section 53. This makes it easier to cover the opening 51 with the resin cover 100, and prevents insects and dust from entering the light-emitting surface side from the circuit 80 side through the opening 51. It also prevents the wiring 85 from being damaged by the resin cover 100.

[0034] In this embodiment, the wiring insertion section 53 has a substantially circular shape in plan view and is provided as one on the LED mounting substrate 50. Three wires 85 pass through the wiring insertion section 53. The shape and number of wiring insertion sections 53 are not limited to this. For example, the wiring insertion section 53 may have a substantially rectangular shape in plan view.

[0035] The wiring insertion section 53 is sealed with a resin material (not shown). Examples of resin materials include silicone resin. This prevents insects and dust from entering from the circuit 80 side through the wiring insertion section 53.

[0036] Three connectors 54 are provided on the surface of the LED mounting board 50. Three wires 85 that have passed through the wiring insertion section 53 are connected to each of the connectors 54.

[0037] As shown in Figures 3 and 4, the first heat sink 60 is in contact with the back surface (the side facing the circuit 80) of the LED mounting substrate 50 and has the function of dissipating heat from the light source unit 30. The first heat sink 60 also functions as a support base for the light source unit 30. The first heat sink 60 is made of a metal material such as aluminum, or a resin material with high thermal conductivity. In this embodiment, the first heat sink 60 is made of aluminum.

[0038] The first heatsink 60 has a substantially circular shape in plan view. The diameter of the first heatsink 60 is slightly smaller than the inner diameter of the outer cover 10 and is substantially the same as the diameter of the LED mounting substrate 50. The surface of the first heatsink 60 is formed flat.

[0039] The first heat sink 60 has a substantially cylindrical wall 61 on its outer edge that extends away from the light source unit 30. The presence of the cylindrical wall 61 in the first heat sink 60 allows for better dissipation of heat from the light source unit 30. A heat dissipation sheet 70 is housed inside the cylindrical wall 61. Note that the first heat sink 60 does not necessarily have to have the cylindrical wall 61.

[0040] The first heat sink 60 has an opening 62 positioned to overlap axially with an opening 51 provided in the LED mounting substrate 50. The opening 62 is the same size as or larger than the opening 51. Like the opening 51, the opening 62 is a hole through which electromagnetic waves for wireless communication with the antenna 84 can pass. In this embodiment, the opening 62 is a notch provided on the outer edge of the first heat sink 60 and has a substantially L-shape in plan view. However, the shape of the opening 62 is not limited to this. For example, the opening 62 may have a substantially circular shape in plan view.

[0041] The first heat sink 60 has a through hole 63 into which a screw 56 for fixing the light source unit 30 is inserted. The first heat sink 60 also has a through hole 64 in a position that overlaps with a wiring insertion portion 53 provided on the LED mounting substrate 50. The through hole 64 is the same size as or larger than the wiring insertion portion 53. In this embodiment, the through hole 64 has a substantially circular shape in plan view, similar to the wiring insertion portion 53.

[0042] The heat dissipation sheet 70 is positioned between the first heat sink 60 and the circuit 80. The heat dissipation sheet 70 is preferably an elastic material with higher thermal conductivity than general resins and is compressible. A suitable heat dissipation sheet 70 is a sheet made of a flexible resin, which may contain a thermally conductive filler dispersed in the resin. Examples of resins constituting the heat dissipation sheet 70 include silicone resin and urethane resin. The thermally conductive filler dispersed in the resin is preferably an insulating filler with high thermal conductivity; examples include aluminum oxide, aluminum nitride, and boron nitride. In this embodiment, the heat dissipation sheet 70 has a rectangular shape in plan view and is housed inside the cylindrical wall 61 of the first heat sink 60. The shape of the heat dissipation sheet 70 is not particularly limited; for example, it may have a substantially circular shape in plan view.

[0043] Circuit 80 is a power supply circuit that converts alternating current (for example, AC100V commercial power supply) into direct current to light up the LED element 40. In addition to the power supply circuit, circuit 80 also includes a control circuit for controlling dimming, color adjustment, etc. Circuit 80 includes a circuit board 81 and a power supply unit 82 (see Figure 4) mounted on the circuit board 81.

[0044] The circuit board 81 is a printed circuit board (PCB) on which metal wiring such as copper foil is patterned. In this embodiment, the circuit board 81 has a roughly D-shape in plan view, with a part of the circle missing. The circuit board 81 is held in a position perpendicular to the axial direction.

[0045] A socket pin 11 is connected to the outer edge of the circuit board 81, and alternating current is supplied from the socket to the circuit 80 via the socket pin 11. In this embodiment, the socket pin 11 and the circuit board 81 are electrically connected by the socket pin 11 passing through a through hole 81A provided in the circuit board 81. However, the method of connecting the socket pin 11 and the circuit board 81 is not limited to this, and they may be electrically connected via, for example, a wire.

[0046] The power supply unit 82 includes components such as switching elements, choke coils, and capacitors. The components constituting the power supply unit 82 are mounted (through-hole mounting) by inserting leads into through-holes formed in the circuit board 81 from the back side (the side facing the second heat sink 90).

[0047] The circuit 80 further includes a wireless communication module 83. The wireless communication module 83 includes an antenna 84 and a wireless communication circuit. In this embodiment, the wireless communication module 83 is positioned perpendicular to the circuit board 81. That is, the wireless communication module 83 is mounted on the circuit board 81 in an axial direction. The leading edge of the wireless communication module 83 extends to a position that does not overlap with the circuit board 81 in a plan view. The wireless communication circuit of the wireless communication module 83 is configured, for example, to acquire control commands from wireless signals received by the antenna 84 and to transmit control signals.

[0048] Antenna 84 is located at the tip of the wireless communication module 83. Antenna 84 is configured to emit electromagnetic waves (for example, radio waves in the 920 MHz band or 2.4 GHz band) into space and to receive electromagnetic waves from space. The configuration of antenna 84 is not particularly limited and examples include pattern antennas, patch antennas, chip antennas, rod antennas, film antennas, etc.

[0049] As described above, the LED mounting board 50 and the first heat sink 60 are provided with openings 51 and 62, respectively, at positions that overlap with the antenna 84 in a plan view. This suppresses the blocking of electromagnetic waves for wireless communication with the antenna 84 by the LED mounting board 50 and the first heat sink 60, thereby improving communication performance.

[0050] Furthermore, as in this embodiment, by providing openings 51 and 62 in the LED mounting substrate 50 and the first heat sink 60, respectively, it is not necessary to make the wireless communication module 83 protrude from the LED mounting substrate 50 in order to ensure the communication performance of the antenna 84. In other words, even if the wireless communication module 83 is placed on the circuit 80 side of the LED mounting substrate 50, communication performance can be ensured.

[0051] Furthermore, if the wireless communication module 83 protrudes from the LED mounting substrate 50, there is a possibility that jigs or other fixtures may come into contact with the wireless communication module 83 during the assembly process, potentially damaging it. Also, if the wireless communication module 83 protrudes from the LED mounting substrate 50, there is a possibility that the expansion and contraction of the silicone resin may damage the wireless communication module 83 when the surface of the LED mounting substrate 50 is sealed with silicone resin or the like. In the LED lamp 1 of this embodiment, there is no need to make the wireless communication module 83 protrude from the LED mounting substrate 50, and the wireless communication module 83 can be positioned closer to the circuit 80 than the LED mounting substrate 50, thus reducing the above risks.

[0052] Furthermore, in order to make the wireless communication module 83 protrude from the LED mounting board 50, an additional circuit board is required, which can complicate the configuration of the circuit 80. In the LED lamp 1 of this embodiment, there is no need to make the wireless communication module 83 protrude from the LED mounting board 50, so the configuration of the circuit 80 can be simplified. As a result, for example, the assembly process of the LED lamp 1 can be simplified, and productivity can be improved.

[0053] As shown in Figures 3 and 4, the second heat sink 90 contacts the outer edge of the circuit board 81 and has the function of dissipating heat from the circuit 80. The second heat sink 90 also functions as a support base for the circuit 80. The second heat sink 90, like the first heat sink 60, is made of a metal material such as aluminum or a resin material with high thermal conductivity. In this embodiment, the second heat sink 90 is made of aluminum.

[0054] The second heatsink 90 has a roughly C-shape with an opening 91 formed at the position through which the wireless communication module 83 passes. This suppresses the blocking of electromagnetic waves for wireless communication with the antenna 84 by the second heatsink 90, thereby improving communication performance. Depending on the shape of the wireless communication module 83, the second heatsink 90 does not necessarily have to have an opening 91. In other words, the second heatsink 90 may have an annular shape formed around its entire circumference.

[0055] The second heatsink 90 is fixed to the circuit 80 by screws (not shown) or the like. The second heatsink 90 also has through holes 92 formed in the portion through which the socket pins 11 pass. In this embodiment, the second heatsink 90 is thicker than the first heatsink 60. This allows for better heat dissipation from the circuit 80.

[0056] The outer cover 10 is formed as a bottomed, roughly cylindrical shape and houses the light source unit 30, the first heat sink 60, the heat dissipation sheet 70, the circuit 80, and the second heat sink 90. ​​The opening of the outer cover 10 is covered by a light-transmitting cover 20.

[0057] The outer cover 10 has a protrusion 12 on the bottom side from which the socket pins 11 protrude. The protrusion 12 is the part that is inserted into the socket. Components that make up the power supply unit 82 are arranged inside the space formed by the protrusion 12.

[0058] The outer cover 10 may be made of metal or resin. An example of a resin that makes up the outer cover 10 is polybutylene terephthalate (PBT).

[0059] The translucent cover 20 is a component through which light emitted from the light source unit 30 passes. As described above, the translucent cover 20 closes the opening of the outer cover 10. Specifically, the translucent cover 20 is joined to the outer cover 10 by a locking portion 23 provided on the translucent cover 20 that catches on the inner circumferential surface of the outer cover 10. In this embodiment, the gap between the translucent cover 20 and the outer cover 10 is sealed with a resin material such as silicone resin.

[0060] The translucent cover 20 can be made of a translucent resin material such as acrylic or polycarbonate, or a glass material such as silica glass. In this embodiment, the translucent cover 20 is made of a resin material. The translucent cover 20 may be a transparent cover that does not have light-diffusing (light-scattering) properties, or a diffuse cover that does have light-diffusing properties.

[0061] Next, the resin cover 100 as a sealing member will be described in detail with reference to Figures 6 and 7. Figure 6 is a perspective view of the LED lamp 1, showing a magnified view of the vicinity of the resin cover 100 with the outer cover 10 and the translucent cover 20 removed, and Figure 7 is a perspective view of the resin cover 100.

[0062] As shown in Figure 6, the opening 51 of the LED mounting substrate 50 is covered with a resin cover 100 as a sealing member. The resin cover 100 is a plate material that is directly attached to the LED mounting substrate 50 and is positioned so as not to overlap the LED elements 40. From the viewpoint of ensuring communication performance, the resin material constituting the resin cover 100 can be polybutylene terephthalate (PBT), polypropylene (PP), polycarbonate (PC), acrylic, polyethylene (PE), polystyrene (PS), polymethylpentene (PMP), epoxy resin, fluororesin, etc. However, the resin material constituting the resin cover 100 is not limited to the above resins as long as it is a material that transmits electromagnetic waves for wireless communication with the antenna 84.

[0063] By covering the opening 51 of the LED mounting board 50 with the resin cover 100, it is possible to prevent insects and dust from entering the light-emitting surface from the circuit 80 side through the opening 51. Furthermore, since the resin cover 100 is made of resin material, it does not easily interfere with electromagnetic waves used for wireless communication with the antenna 84. Therefore, even when the resin cover 100 is provided, good wireless communication can be ensured.

[0064] Furthermore, by covering the opening 51 of the LED mounting substrate 50 with the resin cover 100, the light from the LED element 40 is reflected by the resin cover 100. As a result, a decrease in light extraction efficiency due to the opening 51 and the occurrence of dark areas on the emission surface 21 can be suppressed. In other words, if the opening 51 is not covered by the resin cover 100, the light that passes through the opening 51 will not be properly emitted from the emission surface 21, the light extraction efficiency will decrease, and dark areas will be more likely to occur on the emission surface 21 near the opening 51.

[0065] In a plan view, the resin cover 100 is slightly larger than the opening 51. The resin cover 100 also has a through hole 101 (see Figure 7) through which a screw 110, which serves as a locking member, passes, and is fixed to the LED mounting substrate 50 by the screw 110 so as not to create a gap. This further suppresses the entry of insects and dust from the circuit 80 side to the light-emitting surface side through the opening 51.

[0066] The screw 110 passes through a through hole 55 (see Figure 3) formed in the LED mounting substrate 50 and a through hole 65 (see Figure 3) provided in the first heat sink 60. In other words, the resin cover 100 is fixed to the LED mounting substrate 50 and the first heat sink 60.

[0067] In this embodiment, the resin cover 100 is fixed by one screw 110, but it may be fixed by multiple screws. The resin cover 100 may be fixed to the LED mounting board 50 by screws provided at both ends in the longitudinal direction of the resin cover 100.

[0068] As shown in Figure 7, the resin cover 100 has a recess 102 that can hold the LED mounting substrate 50. The resin cover 100 is configured to be attachable to the LED mounting substrate 50 by sliding. This makes it easier to attach the resin cover 100 to the LED mounting substrate 50.

[0069] In this embodiment, a projection 103 is provided on the inner surface of the recess 102. This allows the resin cover 100 and the LED mounting board 50 to be firmly locked together when the LED mounting board 50 is fitted into the recess 102. As a result, the gap between the opening 51 and the resin cover 100 can be made smaller, and the entry of insects and dust from the circuit 80 side to the light-emitting surface side through the opening 51 can be suppressed. Note that the resin cover 100 does not necessarily have the projection 103.

[0070] As described above, the LED lamp 1 of this embodiment comprises a light source unit 30 including an LED element 40 and an LED mounting substrate 50 on which the LED element 40 is mounted, a circuit 80 that supplies power to the light source unit 30, and a wireless communication-capable antenna 84. The LED mounting substrate 50 has an opening 51 at a position that overlaps with the antenna 84 in a plan view, and the opening 51 is covered by a resin cover 100. This prevents insects and dust from entering the light-emitting surface from the circuit 80 side through the opening 51. Furthermore, because the opening 51 is provided at a position that overlaps with the antenna 84 in a plan view, the electromagnetic waves for wireless communication with the antenna 84 are less likely to be blocked by the LED mounting substrate 50, thereby improving communication performance. Therefore, the LED lamp 1 of this embodiment can achieve good wireless communication while suppressing the entry of insects and dust into the LED lamp 1.

[0071] The above embodiments can be modified as appropriate within the scope of the purpose of this disclosure. For example, in the above embodiments, a plate-shaped resin cover 100 is used as a sealing member to cover the opening 51, but the sealing member is not limited to resin as long as it is made of resin. For example, the sealing member may be silicone or a flexible resin film.

[0072] Furthermore, in the above embodiment, the circuit board 81 has a roughly D-shape in plan view with a part of the circle missing, but the shape of the circuit board 81 is not limited to this. For example, the circuit board 81 may have a roughly circular shape in plan view, and may be arranged so that a part of the circuit board 81 overlaps with the opening 51 in plan view.

[0073] Furthermore, in the above embodiment, the wireless communication module 83 is positioned so as not to protrude from the LED mounting substrate 50, but the wireless communication module 83 may protrude from the LED mounting substrate 50. In that case, the resin cover 100 may have, for example, a cap shape with a bulge in the center.

[0074] Furthermore, in the above embodiment, the resin cover 100 is attached to the LED mounting substrate 50 by screws 110, but the method of attaching the resin cover 100 is not limited to this. For example, the resin cover 100 may be attached to the LED mounting substrate 50 by adhesive or the like. Alternatively, the resin cover 100 may be attached to the LED mounting substrate 50 by screws 110 while its outer edge is sealed with a sealant such as silicone.

[0075] Furthermore, in the above embodiment, the LED element 40 includes a first LED element 41 that emits first light and a second LED element 42 that emits second light with a different color temperature from the first light, but is not limited to this. The LED element 40 may be composed of, for example, one type of LED element.

[0076] This disclosure is further illustrated by the following embodiments. Configuration 1: A light source unit including an LED element and an LED mounting substrate on which the LED element is mounted, A circuit that supplies power to the light source unit, A wireless communication antenna, An LED lamp equipped with, The LED mounting substrate has an opening in a position that overlaps with the antenna in a plan view. An LED lamp further comprising a resin sealing member that is mounted on the LED mounting substrate and covers the opening. Configuration 2: The LED lamp according to configuration 1, wherein the sealing member is a plate-shaped resin cover. Configuration 3: The LED lamp according to configuration 1 or 2, wherein the antenna is provided so as not to protrude from the light-emitting surface side of the LED mounting substrate. Configuration 4: The LED mounting board is provided with a wiring insertion section through which wiring connecting the circuit and the LED element is inserted. The aforementioned wiring insertion portion is provided at a position spaced apart from the opening, The aforementioned wiring does not pass through the opening, and the LED lamp is as described in any one of configurations 1 to 3. Configuration 5: The LED lamp according to configuration 4, wherein the wiring insertion portion is sealed with a resin material. Configuration 6: The LED lamp according to configuration 2, wherein the resin cover has a recess capable of holding the LED mounting substrate and is configured to be mounted on the LED mounting substrate by sliding movement. Composition 7: The resin cover is attached to the LED mounting substrate by a locking member, as in the LED lamp according to configuration 2 or 6. [Explanation of symbols]

[0077] 1 LED lamp, 10 outer cover, 11 base pin, 12 protrusion, 20 translucent cover, 21 emission surface, 22 projection, 23 locking part, 30 light source part, 40 LED element, 41 first LED element, 42 second LED element, 50 LED mounting board, 51 opening, 52 through hole, 53 wiring insertion part, 54 connector, 55 through hole, 56 screw, 60 first heat sink, 61 cylindrical wall, 62 opening, 63 through hole, 64 through hole, 65 through hole, 70 heat dissipation sheet, 80 circuit, 81 circuit board, 81A through hole, 82 power supply unit, 83 wireless communication module, 84 antenna, 85 wiring, 90 second heat sink, 91 opening, 92 through hole, 100 resin cover, 101 through hole, 102 recess, 103 Protrusion, 110 screw

Claims

1. A light source unit including an LED element and an LED mounting substrate on which the LED element is mounted, A circuit that supplies power to the light source unit, A wireless communication antenna, An LED lamp equipped with, The LED mounting substrate has an opening in a position that overlaps with the antenna in a plan view. An LED lamp further comprising a resin sealing member that is mounted on the LED mounting substrate and covers the opening.

2. The LED lamp according to claim 1, wherein the sealing member is a plate-shaped resin cover.

3. The LED lamp according to claim 1, wherein the antenna is provided so as not to protrude from the light-emitting surface side of the LED mounting substrate.

4. The LED mounting board is provided with a wiring insertion section through which wiring connecting the circuit and the LED element is inserted. The aforementioned wiring insertion portion is provided at a position spaced apart from the opening, The LED lamp according to claim 1, wherein the wiring does not pass through the opening.

5. The LED lamp according to claim 4, wherein the wiring insertion portion is sealed with a resin material.

6. The LED lamp according to claim 2, wherein the resin cover has a recess capable of holding the LED mounting substrate and is configured to be mounted on the LED mounting substrate by sliding movement.

7. The LED lamp according to claim 2, wherein the resin cover is attached to the LED mounting substrate by a locking member.

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