Multilayer circuit board

Abstract

To provide a multilayer circuit board capable of stabilizing vibration characteristics. [Solution] The surface layer on which the gyro sensor is mounted on the multilayer circuit board has a specific region corresponding to the installation area of ​​the gyro sensor when viewed from the stacking direction. At least a portion of the wiring pattern that is wired from the terminal land of the gyro sensor is not formed in the specific region.

Description

[[Technical Field]]

[0001] The technology of the present disclosure relates to a multilayer circuit board. [[Background Art]]

[0002] Patent Document 1 describes an electronic device including a substrate, a shake detection sensor, and a vibrating electronic component. Electronic components can be respectively mounted on a first mounting surface of the substrate and a second mounting surface that is a back surface of the first mounting surface. The shake detection sensor is mounted on the first mounting surface of the substrate. The vibrating electronic component is mounted on the second mounting surface of the substrate and vibrates when a voltage is applied thereto. The vibrating electronic component is mounted on the second mounting surface of the substrate avoiding a region that is the back surface of a region where the shake detection sensor is mounted.

[0003] Patent Document 2 describes an electronic circuit board including: a multilayer-structured substrate including at least one ground layer; and an oscillation circuit provided on the substrate, the oscillation circuit including an oscillator and a circuit including an amplifier connected to a signal terminal of the oscillator. Among the multilayer structure, the ground layer closest to the signal terminal has a first ground electrode configuration in which a region overlapping the signal terminal in a plan view viewed from a direction perpendicular to the substrate surface is a non-formation region of a ground electrode; among the multilayer structure, the ground layer closest to a first wire connecting the signal terminal and an input portion of the amplifier has a second ground electrode configuration in which a region overlapping the first wire in the plan view is a non-formation region of a ground electrode; and among the multilayer structure, the ground layer closest to a second wire connecting the signal terminal and an output portion of the amplifier has a third ground electrode configuration in which a region overlapping the second wire in the plan view is a non-formation region of a ground electrode. The electronic circuit board includes at least one of the above ground electrode configurations.

[0004] Patent Document 3 describes an electronic device comprising a multilayer substrate on which an electronic component that serves as a heat source is mounted, a first ground pattern for electrically connecting with the electronic component is provided, and a metal chassis is fixed to the substrate with metal screws. The multilayer substrate has a second ground pattern in the region where the chassis is fixed with screws for electrically connecting with the chassis. An insulating portion is provided between the second ground pattern and the first ground pattern. The first and second ground patterns are electrically connected by a connection pattern that is drawn from the second ground pattern and connected to the first ground pattern. No conductor pattern is provided in the region corresponding to the second ground pattern in each layer of the multilayer substrate, excluding the layer on which the second ground pattern is provided.

[0005] Patent Document 4 describes a substrate structure for a dome-type surveillance camera, comprising at least a dome and an electromagnetically shieldable housing cover, a lens disposed inside the dome, a sensor board disposed inside the housing cover that captures an image of a subject incident through the dome and lens and outputs an electrical signal, a camera DSP (Digital Signal Processor) board that performs image correction processing on the electrical signal, a main board that compresses and encodes the image-corrected signal, a LAN (Local Area Network) board that outputs the compressed and encoded signal to the outside, a spacer that mechanically connects the sensor board and the camera DSP board to form a composite of upper and lower circuit boards, a rolling fixing bracket for mounting the composite and rotating it in the pan direction, and a tilt bracket attached to the rolling bracket for rotating the composite in the tilt direction. The composite is disposed inside the housing cover, sandwiched between the tilt bracket and the rolling fixing bracket, with the dome side being a sensor board formed of frame ground and the side furthest from the dome being a camera DSP board formed of frame ground. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2012-058519 [Patent Document 2] Japanese Patent Publication No. 2019-145683 [Patent Document 3] Japanese Patent Publication No. 2016-189385 [Patent Document 4] Japanese Patent Publication No. 2011-151538 [Overview of the project]

[0007] One embodiment of the technology described herein provides a multilayer circuit board capable of stabilizing vibration characteristics. [Means for solving the problem]

[0008] The multilayer circuit board of this disclosure is a multilayer circuit board in which a gyro sensor is mounted on the first layer, wherein at least a portion of the wiring pattern that is wired from the terminal land of the gyro sensor is not formed in a specific region of the first layer corresponding to the installation area of ​​the gyro sensor when viewed from the stacking direction.

[0009] It is preferable that terminal lands are formed in the first layer, wiring patterns are formed in a layer different from the first layer, and the terminal lands and wiring patterns are connected via conductive holes.

[0010] It is preferable that no conductor planes exist in a specific region.

[0011] The specific area preferably includes both the area inside and outside the installation area.

[0012] The specific area is preferably an area obtained by multiplying the installation area by a set magnification factor.

[0013] It is preferable that terminal lands are formed in the first layer and that the installation area includes the terminal lands.

[0014] Preferably, a vibration transmission suppression pattern is formed around the installation area of ​​the first layer.

[0015] It is preferable that the vibration transmission suppression patterns are formed in multiple layers.

[0016] It is preferable that the vibration transmission suppression pattern has a curved portion.

[0017] It is preferable to have a layer that functions as a shield for a wiring pattern that becomes a noise source.

[0018] It is preferable that, in addition to the gyro sensor, a heat-generating component is mounted on the first layer, and a heat dissipation mechanism that dissipates heat from the heat-generating component to the outside is provided.

[0019] It is preferable to have a substrate fixing portion within a set distance from the gyro sensor.

[0020] It is preferable that the present invention is incorporated in an imaging device or an interchangeable lens. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] [Figure 1] It is a perspective view of an imaging device. [Figure 2] It is a diagram showing a multilayer circuit board incorporated in an interchangeable lens. [Figure 3] It is a cross-sectional view of a multilayer circuit board. [Figure 4] It is a diagram showing the configuration of a gyro sensor and the connection state between the gyro sensor and a multilayer circuit board. [Figure 5] It is a top view of a surface layer around an installation area for a gyro sensor. [Figure 6] It is a top view of an inner layer adjacent to the surface layer around an installation area for a gyro sensor. [Figure 7] It is a top view of a surface layer around an installation area for a gyro sensor according to a second embodiment. [Figure 8] It is a top view of an inner layer and a back layer around an installation area for a gyro sensor according to a second embodiment. [Figure 9]This figure shows the inner layer, which functions as a shield for wiring patterns that are sources of noise. [Figure 10] This is a diagram showing the vibration transmission suppression pattern. [Figure 11] This figure shows a dual vibration transmission suppression pattern. [Figure 12] This figure shows a vibration transmission suppression pattern with curved sections. [Figure 13] This is a diagram showing the heat dissipation mechanism. [Figure 14] This figure shows an embodiment in which a multilayer circuit board is built into an imaging device. [Modes for carrying out the invention]

[0022] [First Embodiment] As an example, as shown in Figure 1, the imaging device 10 is, for example, a digital single-lens reflex camera and comprises a device body 11 and an interchangeable lens 12. Various operating elements, including a shutter release button, are provided on the top surface of the device body 11. In addition, an LCD monitor, viewfinder, menu keys, directional keys, etc. (all not shown) are provided on the back surface of the device body 11. The interchangeable lens 12 is a combination of multiple lenses, such as an objective lens, a focus lens, and a zoom lens. Note that the imaging device 10 is not limited to the digital single-lens reflex camera exemplified, but may also be a digital still camera, a smartphone, or a tablet device.

[0023] A mount (not shown) is provided on the front of the device body 11. The interchangeable lens 12 is detachably connected to the device body 11 via this mount. The mount has a structure (e.g., a bayonet structure) for securely fixing the interchangeable lens 12 to the device body 11. The mount also has electrical contacts that are responsible for transmitting electrical signals between the device body 11 and the interchangeable lens 12.

[0024] The main unit 11 of the device incorporates an image sensor 13 for capturing the subject image captured by the interchangeable lens 12. The image sensor 13 is, for example, a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

[0025] As an example, as shown in Figure 2, a multilayer circuit board 15 is arranged inside the interchangeable lens 12. The multilayer circuit board 15 has a fan shape that follows the cylindrical shape of the interchangeable lens 12. The multilayer circuit board 15 has substrate fixing parts 16A, 16B, and 16C. Substrate fixing parts 16A and 16B are provided at both ends of the multilayer circuit board 15. Substrate fixing part 16C is provided at a position closer to the substrate fixing part 16A side from the upper center of the multilayer circuit board 15. Substrate fixing parts 16A to 16C are C-shaped claws that protrude from the outer circumference of the multilayer circuit board 15. The multilayer circuit board 15 is fixed to the interchangeable lens 12 by screws with rubber bushings (not shown) that are inserted through the substrate fixing parts 16A to 16C.

[0026] Numerous electronic components, such as a gyro sensor 17 and an integrated circuit 18, are mounted on the multilayer circuit board 15. The gyro sensor 17 is mounted on the side of the board fixing portion 16A. The gyro sensor 17 detects vibrations applied to the interchangeable lens 12 and, consequently, to the imaging device 10. The gyro sensor 17 is, for example, a vibration type. A vibration type is one in which a cantilevered vibrator is vibrated at a predetermined resonant frequency, and the Coriolis force generated by the influence of angular velocity is detected by a piezoelectric element or the like. The integrated circuit 18 is mounted slightly from the center of the multilayer circuit board 15 towards the side of the board fixing portion 16A. The integrated circuit 18 controls the driving of the gyro sensor 17 and other electronic components. The integrated circuit 18 is an example of a "heat-generating component" related to the technology of this disclosure.

[0027] The integrated circuit 18 derives the direction and amount of movement of the image stabilization mechanism based on the vibration detection signal from the gyro sensor 17. The image stabilization mechanism is, for example, a correction lens movement mechanism that moves a correction lens built into the interchangeable lens 12 along a plane normalized to the optical axis. The image stabilization mechanism corrects the blur of the subject image by moving the correction lens in the direction and amount of movement derived by the integrated circuit 18. Alternatively, an image sensor movement mechanism that moves the image sensor 13 along a plane normalized to the optical axis may be used as the image stabilization mechanism. In this case, the integrated circuit 18 transmits the vibration detection signal to the device body 11 through the electrical contacts of the mount.

[0028] The distance D between the circuit board fixing part 16A and the gyro sensor 17 is within the set distance PD (D ≤ PD). Distance D is the shortest distance from the center of the C-shaped part of the circuit board fixing part 16A to the outer circumference of the gyro sensor 17. The set distance PD is, for example, 1 mm to 10 mm (1 ≤ PD ≤ 10).

[0029] As an example, as shown in Figure 3, the multilayer circuit board 15 has a laminated structure having a surface layer TL, a back layer BL, and inner layers IL1 to IL4. These surface layer TL, back layer BL, and inner layers IL1 to IL4 are made of, for example, copper foil. The symbol LSD indicates the lamination direction of these surface layer TL, back layer BL, and inner layers IL1 to IL4.

[0030] Wiring patterns are formed, for example, on the surface layer TL and back layer BL, as well as on the inner layers IL1 and IL4. Inner layer IL2 functions as a ground plane, for example, and inner layer IL3 functions as a power plane, for example. In other words, inner layers IL2 and IL3 are examples of "conductor planes" according to the technology of this disclosure. Here, a "conductor plane" is a continuous, relatively large area of ​​copper foil where no slits are formed by wiring patterns, etc. A "conductor plane" is also commonly called a solid pattern. A "conductor plane" is not limited to the ground plane and power plane exemplified, but may also exist in a part of a layer on which wiring patterns are formed. Note that the number of inner layers is not limited to the four layers exemplified, but may be two, six, or eight, for example.

[0031] The surfaces of the surface layer TL and the back layer BL are covered with a resist (solder resist) 20. The resist 20 is, for example, epoxy resin. More specifically, the resist 20 is PSR-4000 AM02 manufactured by Taiyo Ink Manufacturing Co., Ltd.

[0032] The resist 20 protects the wiring patterns formed on the surface layer TL and the back layer BL. However, the terminal lands 21 on the surface layer TL and the back layer BL are not covered by the resist 20 and are exposed to the outside. The terminal lands 21 are, for example, terminal lands for soldering electronic components. Therefore, the surface layer TL and the back layer BL are mounting layers for electronic components. The terminal lands 21 are plated with copper plating or gold plating or the like to improve solder adhesion. Alternatively, they may be terminal lands for conductive adhesives such as silver paste.

[0033] Prepreg 22 is placed between the surface layer TL and the inner layer IL1, between the inner layer IL1 and the inner layer IL2, between the inner layer IL3 and the inner layer IL4, and between the inner layer IL4 and the back layer BL. Prepreg 22 plays the role of bonding and insulating two adjacent layers, such as the surface layer TL and the inner layer IL1. Prepreg 22 is a glass cloth substrate, for example, made by weaving glass fibers into a cloth and impregnating it with epoxy resin, with the epoxy resin in a semi-cured state. More specifically, prepreg 22 is GEA-705G manufactured by Resonac Corporation.

[0034] A core 23 is positioned between inner layers IL2 and IL3. The core 23 is located precisely at the center of the layered structure of the multilayer circuit board 15. The core 23 plays a role in bonding and insulating the inner layers IL2 and IL3. The core 23 is a so-called core material and is provided to enhance the rigidity and dimensional stability of the multilayer circuit board 15. The core 23 is a glass cloth substrate, for example, made by weaving glass fibers into a cloth, impregnating it with epoxy resin, and allowing the epoxy resin to harden. More specifically, the core 23 is MCL-E-75G manufactured by Resonac Co., Ltd. Although only a single layer of core 23 is shown as an example, the core 23 is not limited to this and may consist of multiple layers.

[0035] The multilayer circuit board 15 has through-holes 24 and vias 25 inside. The through-holes 24 and vias 25 are formed, for example, by laser, plasma etching, or photolithography. The through-holes 24 penetrate all layers of the multilayer circuit board 15, including the surface layer TL, inner layers IL1 to IL4, back layer BL, and also the prepreg 22 and core 23. The inner walls of the through-holes 24 are, for example, copper plated. As a result, the surface layer TL, inner layers IL1 to IL4, and back layer BL are electrically connected by the through-holes 24.

[0036] Via 25 penetrates the prepreg 22 or core 23 between specific layers, such as the surface layer TL and the inner layer IL1. The inner wall of via 25 is, for example, copper-plated. Therefore, the layers connected by via 25 are electrically connected by via 25.

[0037] As an example, as shown in Figure 4, the gyro sensor 17 has a structure in which the chip 30, wire wiring 31, and one end (inner lead) of the lead frame 32 are sealed within a rectangular mold 33. The mold 33 is made of, for example, epoxy resin. The chip 30 and the other components are protected by the mold 33. The chip 30 and the lead frame 32 are connected by wire wiring 31. The wire wiring 31 is made of, for example, gold wire. The lead frame 32 is made of, for example, copper, copper-nickel alloy, etc., and is plated with gold or silver plating.

[0038] The other end (outer lead) of the lead frame 32 is exposed to the outside and is soldered to the terminal land 21G of the gyro sensor 17 on the surface layer TL. In other words, the gyro sensor 17 is mounted on the surface layer TL. The surface layer TL is an example of the "first layer" related to the technology of this disclosure. Terminal lands 21 for electronic components other than the gyro sensor 17, such as the integrated circuit 18, are also formed on the surface layer TL.

[0039] As an example, as shown in Figure 5, in the surface layer TL, only terminal lands 21G are formed in a specific region SA, and the wiring pattern 35G (see Figure 6) for the gyro sensor 17, which is wired from the terminal lands 21G, is not formed. The specific region SA corresponds to the installation region MA of the gyro sensor 17. The installation region MA is the region where the outer shape of the mold 33 of the gyro sensor 17 overlaps when the multilayer circuit board 15 is viewed from the stacking direction LSD (the direction perpendicular to the plane of the paper in Figure 5). For this reason, the installation region MA is rectangular in shape, following the outer shape of the mold 33.

[0040] The specified area SA includes the area inside and outside the installation area MA. The specified area SA has the same shape and center as the installation area MA, and is the area obtained by multiplying the installation area MA by a set magnification factor. More specifically, the specified area SA is the area obtained by enlarging or shrinking the area of ​​the installation area MA based on the set magnification factor. The set magnification factor is, for example, a value between 0.8 and less than 1.2. Therefore, the specified area SA may coincide with the installation area MA (set magnification factor 1.0). Note that the set magnification factor is not limited to the area ratio exemplified, but may also be a similarity ratio. Also, the installation area MA and the specified area SA do not have to be rectangular as exemplified. They may be circular, elliptical, triangular, pentagonal, octagonal, etc.

[0041] The terminal land 21G of the gyro sensor 17 is included in the installation area MA. Below the terminal land 21G of the gyro sensor 17, the via 25GA of the gyro sensor 17 is formed. Although the wiring pattern 35G of the gyro sensor 17 is not formed on the surface layer TL, wiring patterns for other electronic components such as the integrated circuit 18 are formed.

[0042] As an example, as shown in Figure 6, via 25GA reaches the surface layer TL and the inner layer IL1 directly beneath the adjacent surface layer TL. Via 25GA connects the surface layer TL and the inner layer IL1. Via 25GA is an example of a "conducting hole" according to the technology of this disclosure.

[0043] In the inner layer IL1, one end of the wiring pattern 35G of the gyro sensor 17 is connected to via 25GA. The other end of the wiring pattern 35G is connected to via 25GB. Via 25GB extends from inner layer IL1 to inner layer IL2. Inner layer IL1 and inner layer IL2 are electrically connected by via 25GB. Vias 25GA and 25GB and the wiring pattern 35G are located in a clearance region CA where no copper foil constituting the inner layer IL1 exists. In the vicinity of a specific region SA, inner layer IL1 functions as a conductor plane where no wiring pattern is formed except in the clearance region CA. Inner layer IL1 is an example of a "layer different from the first layer" according to the technology of this disclosure. In Figure 6, the regions where vias 25GA and 25GB, the wiring pattern 35G, and the copper foil constituting the inner layer IL1 other than the clearance region CA exist are shown with hatching. The same applies to subsequent Figures 7, etc.

[0044] Thus, in the multilayer circuit board 15 of this disclosure, a wiring pattern 35G is not formed in a specific region SA corresponding to the installation region MA of the gyro sensor 17 within the surface layer TL on which the gyro sensor 17 is mounted, and this wiring pattern is not formed from the terminal land 21G of the gyro sensor 17. Therefore, it is possible to stabilize the vibration characteristics of the multilayer circuit board 15.

[0045] The wiring pattern may complicate the vibration characteristics of the multilayer circuit board 15. In particular, the wiring pattern 35G of the gyro sensor 17, formed on the surface layer TL on which the gyro sensor 17 is mounted, is a major factor in generating various vibration modes in the multilayer circuit board 15, in combination with other factors such as temperature and humidity changes and the degree of solder adhesion between the lead frame 32 of the gyro sensor 17 and the terminal land 21G. If the vibration modes are diverse and not reproducible, it becomes difficult to calibrate the output of the gyro sensor 17 according to the vibration mode. As a result, the reliability of the output of the gyro sensor 17 decreases, and consequently, the accuracy of shake correction also decreases.

[0046] However, in the technology disclosed herein, the vibration characteristics of the multilayer circuit board 15 are stabilized by not forming the wiring pattern 35G of the gyro sensor 17 in a specific region SA of the surface layer TL. As a result, the reproducibility of the vibration modes of the multilayer circuit board 15 can be improved, and the calibration of the output of the gyro sensor 17 can be performed without any problems. Therefore, the reliability of the output of the gyro sensor 17 and the accuracy of the shake correction can be improved.

[0047] In addition, the wiring pattern 35G for the gyro sensor 17 may be formed in the surface layer TL regions other than the specific region SA. Furthermore, although an example is shown in which the wiring pattern 35G for the gyro sensor 17 is not formed at all in the specific region SA, the present invention also includes cases in which at least a portion of the wiring pattern 35G for the gyro sensor 17 is not formed in the specific region SA. In this case as well, the effect of stabilizing the vibration characteristics of the multilayer circuit board 15 can be obtained compared to the case in which the entire wiring pattern 35G for the gyro sensor 17 is formed in the specific region SA. Furthermore, the stress on the gyro sensor 17 can be reduced compared to the case in which the entire wiring pattern 35G for the gyro sensor 17 is formed in the specific region SA.

[0048] The terminal land 21G of the gyro sensor 17 is formed on the surface layer TL, and the wiring pattern 35G of the gyro sensor 17 is formed on the inner layer IL1, which is different from the surface layer TL. The terminal land 21G and the wiring pattern 35G are connected via 25GA. Therefore, the terminal land 21G on the surface layer TL and the wiring pattern 35G, which is formed on the inner layer IL1 but not on the surface layer TL, can be easily connected by via 25GA. A configuration in which the wiring pattern 35G of the gyro sensor 17 is not formed on the surface layer TL can be easily realized.

[0049] The specific region SA includes the area inside and outside the installation region MA. More specifically, the specific region SA is the region obtained by multiplying the installation region MA by a set multiplier. Therefore, it is possible to configure the system so that the wiring pattern 35G is not formed only in the specific region SA which is thought to affect the gyro sensor 17, and the effect of stabilizing the vibration characteristics of the multilayer circuit board 15 can be easily obtained.

[0050] The installation area MA includes the terminal land 21G of the gyro sensor 17. Therefore, the area that is thought to affect the gyro sensor 17 can be designated as the specific area SA.

[0051] As shown in Figure 2, the multilayer circuit board 15 has a substrate fixing portion 16A within a set distance PD from the gyro sensor 17. Therefore, the risk of the gyro sensor 17 detecting vibrations of the multilayer circuit board 15 itself caused by distortion of the multilayer circuit board 15 can be reduced.

[0052] [Second Embodiment] In the first embodiment described above, the inner layer IL1 functions as a conductor plane except in the clearance region CA, but this is not limited to this configuration. As an example, as shown in Figures 7 and 8, the inner layers IL1 to IL4 and a specific region SA of the back layer BL may be configured so that at least conductor planes (such as the ground plane of the inner layer IL2 and the power plane of the inner layer IL3) do not exist. In the inner layers IL2 to IL4 and the specific region SA of the back layer BL, only vias 25GC of the gyro sensor 17 are formed, and neither conductor planes nor wiring patterns 35G exist. Methods for creating a configuration without conductor planes include removing the originally formed conductor planes by etching or the like, and not forming conductor planes from the beginning.

[0053] Thus, in the second embodiment, there are no conductor planes in the specific region SA. Since there are no conductor planes that, along with the wiring pattern 35G, could complicate the vibration characteristics of the multilayer circuit board 15 surrounding the gyro sensor 17, it becomes possible to further stabilize the vibration characteristics of the multilayer circuit board 15. Therefore, the reliability of the output of the gyro sensor 17 and the accuracy of the shake correction can be further improved.

[0054] Conductive planes conduct heat. Furthermore, an integrated circuit 18, which is a "heat-generating component," is mounted on the multilayer circuit board 15. Therefore, there is a risk that heat from the integrated circuit 18 may be transferred to the area around the gyro sensor 17 via the conductive planes. If heat from the integrated circuit 18 is transferred to the area around the gyro sensor 17, the multilayer circuit board 15 will deform due to the difference in thermal expansion coefficients of each layer of the multilayer circuit board 15, particularly the difference in thermal expansion coefficients between the metal surface layer TL, inner layers IL1 to IL4, and back layer BL, and the resin prepreg 22 and core 23, and stress will be applied to the gyro sensor 17. In addition, stress will be applied to the gyro sensor 17 due to the thermal expansion of the solder attached to the terminal land 21G of the gyro sensor 17. Such unnecessary stress on the gyro sensor 17 leads to a decrease in the reliability of the output of the gyro sensor 17 and the accuracy of the shake correction.

[0055] Therefore, by configuring the circuit so that there are no conductor planes in a specific region SA, the risk of heat from the integrated circuit 18 being transferred to the vicinity of the gyro sensor 17 can be reduced. Consequently, the reliability of the output of the gyro sensor 17 and the accuracy of the shake correction can be further improved. It is also conceivable to mount the integrated circuit 18 on a separate multilayer circuit board from the gyro sensor 17. However, this would increase the cost and space allocated to the multilayer circuit board, which would be counterproductive to the demands for cost reduction and miniaturization.

[0056] As an example, as shown in Figure 9, if a wiring pattern 35N that acts as a noise source is formed in a specific region SA of the back layer BL, then at least in the specific region SA, the inner layer IL4 may be configured to have a conductor plane instead of being configured to be without a conductor plane, and the inner layer IL4 may function as a shield. The wiring pattern 35N is, for example, a high-speed communication line or a power supply line. By doing so, it is possible to suppress the transmission of noise emitted by the wiring pattern 35N to the gyro sensor 17.

[0057] [Third Embodiment] As an example, as shown in Figure 10, a vibration transmission suppression pattern 40 may be formed around the installation area MA of the surface layer TL. The vibration transmission suppression pattern 40 is an independent pattern that is not connected to the wiring pattern. The vibration transmission suppression pattern 40 has the same shape and center as the installation area MA, similar to the specific area SA, and is a rectangular frame-shaped pattern with an outer shape that is the installation area MA multiplied by a set magnification factor. The set magnification factor is, for example, a value of 1.5 or more and less than 2.0. That is, the vibration transmission suppression pattern 40 is larger than the installation area MA and the specific area SA. The vibration transmission suppression pattern 40 can suppress the transmission of vibrations from outside the vibration transmission suppression pattern 40 to the gyro sensor 17. Conversely, it can also suppress the transmission of vibrations from the gyro sensor 17 to the integrated circuit 18, etc., outside the vibration transmission suppression pattern 40.

[0058] As an example, as shown in Figure 11, the vibration transmission suppression pattern 40 may be formed in a double layer. By forming the vibration transmission suppression pattern 40 in a double layer, the effect of suppressing vibration transmission can be further enhanced. Although a double layer is used in this example, the vibration transmission suppression pattern 40 may be formed in triple, quadruple, or other multiple layers.

[0059] The vibration transmission suppression pattern 40 illustrated in Figures 10 and 11 is rectangular with four corners, following the shape of the installation area MA, but is not limited to this. As an example, as shown in Figure 12, the four corners of the vibration transmission suppression pattern 40 may be rounded to form curved sections 42. A vibration transmission suppression pattern 40 with such curved sections 42 can further enhance the vibration transmission suppression effect compared to a vibration transmission suppression pattern 40 with four corners. If the vibration transmission suppression pattern 40 is circular or elliptical, the entire vibration transmission suppression pattern 40 becomes a curved section 42. The vibration transmission suppression pattern 40 may be a pattern that encloses the installation area MA without interruption, as illustrated, or it may be a pattern that is interrupted in places. Furthermore, the width of the vibration transmission suppression pattern 40 may be increased in areas where vibration is easily transmitted, or multiple layers of the vibration transmission suppression pattern 40 may be formed only in areas where vibration is easily transmitted.

[0060] [Fourth Embodiment] As an example, as shown in Figure 13, a heat dissipation mechanism 45 may be provided near the integrated circuit 18, which is a "heat-generating component." The heat dissipation mechanism 45 consists of a screw 46 and a heat sink 47. The screw 46 and heat sink 47 are made of, for example, copper, aluminum, etc. The screw 46 is screwed into a screw hole 48 that penetrates through all layers of the multilayer circuit board 15. In the screw hole 48, the screw 46 is in contact with the heat dissipation patterns of the surface layer TL, inner layers IL1 to IL4, and back layer BL. The heat dissipation patterns are formed independently of the wiring patterns 35G and vibration transmission suppression patterns 40, etc.

[0061] A screw hole 49 is also formed in the heat sink 47, and the tip of the screw 46 is screwed into the screw hole 49. As indicated by the arrow, the heat generated by the integrated circuit 18 is mainly transferred from the heat dissipation pattern of the surface layer TL to the screw 46, and then from the screw 46 to the heat sink 47, where it is dissipated to the outside. This heat dissipation mechanism 45 allows for effective heat dissipation of the integrated circuit 18. The amount of heat from the integrated circuit 18 that is transmitted to the vicinity of the gyro sensor 17 can be reduced. The risk of unnecessary stress on the gyro sensor 17 due to the heat from the integrated circuit 18 can be reduced, further improving the reliability of the output of the gyro sensor 17 and the accuracy of the shake correction. Alternatively, instead of the heat sink 47, a screw hole 49 may be formed in the chassis of the interchangeable lens 12 and the screw 46 may be screwed into it.

[0062] Although an example in which the multilayer circuit board 15 is built into the interchangeable lens 12 has been described, it is not limited to this. For example, as shown in Figure 14, the multilayer circuit board 55 may be built into the imaging device 10. The multilayer circuit board 55 is provided, for example, in the grip portion 56 of the main body 11 of the imaging device 10.

[0063] From the above description, the technology described in the following supplementary information can be understood.

[0064] [Additional note 1] In a multilayer circuit board in which a gyro sensor is mounted on the first layer, In the first layer, at least a portion of the wiring pattern that runs from the terminal land of the gyro sensor is not formed in a specific region corresponding to the installation area of ​​the gyro sensor when viewed from the stacking direction. Multilayer circuit board. [Additional note 2] The terminal land is formed in the first layer, The wiring pattern is formed on a layer different from the first layer. The multilayer circuit board according to Appendix 1, wherein the terminal land and the wiring pattern are connected via conductive holes. [Additional note 3] A multilayer circuit board as described in Appendix 1 or Appendix 2, wherein no conductor planes exist in a specific region. [Additional note 4] The specified region is a multilayer circuit board according to any one of the appendix 1 to 3, including the inner region and the outer region of the installation region. [Additional note 5] The multilayer circuit board described in any one of the appendix items 1 to 4, wherein the specified area is the area obtained by multiplying the installation area by a set multiplier. [Additional note 6] The terminal land is formed in the first layer, The installation area is a multilayer circuit board as described in any one of the appendix items 1 to 5, including the terminal land. [Additional note 7] A multilayer circuit board according to any one of appendices 4 to 6, wherein a vibration transmission suppression pattern is formed around the installation area of ​​the first layer. [Additional note 8] The multilayer circuit board described in Appendix 7, wherein the vibration transmission suppression pattern is formed in multiple layers. [Additional note 9] The vibration transmission suppression pattern is a multilayer circuit board according to Appendix 7 or Appendix 8, having a curved portion. [Additional Note 10] A multilayer circuit board according to any one of Appendix 1 to Appendix 9, having a layer that functions as a shield for wiring patterns that are sources of noise. [Additional Note 11] In addition to the gyro sensor, a heat-generating component is mounted on the first layer. A multilayer circuit board according to any one of the appendices 1 to 10, which is provided with a heat dissipation mechanism for dissipating heat from the heat-generating component to the outside. [Additional Note 12] A multilayer circuit board according to any one of the appendices 1 to 11, having a substrate fixing portion within a set distance from the gyro sensor. [Additional Note 13] A multilayer circuit board as described in any one of Appendix 1 to Appendix 12, which is incorporated into an imaging device or interchangeable lens.

[0065] The technology disclosed herein can be appropriately combined with the various embodiments and / or variations described above. Furthermore, it is understood that various configurations can be adopted without departing from the spirit of the invention, and are not limited to the embodiments described above.

[0066] The descriptions and illustrations presented above are detailed explanations of the technical aspects of this disclosure and are merely examples of the technical aspects. For example, the above descriptions of the structure, function, operation, and effect are examples of the structure, function, operation, and effect of the technical aspects of this disclosure. Therefore, it goes without saying that you may delete unnecessary parts, add new elements, or replace elements in the descriptions and illustrations presented above, as long as you do not deviate from the essence of the technical aspects of this disclosure. Furthermore, in order to avoid confusion and facilitate understanding of the technical aspects of this disclosure, explanations of common technical knowledge and the like that do not require special explanation to enable the implementation of the technical aspects of this disclosure have been omitted from the descriptions and illustrations presented above.

[0067] In this specification, "A and / or B" is synonymous with "at least one of A and B." That is, "A and / or B" means that it may be A alone, or B alone, or a combination of A and B. Furthermore, in this specification, the same concept as "A and / or B" applies when expressing three or more things linked by "and / or."

[0068] All documents, patent applications, and technical standards described herein are incorporated by reference to the same extent as if each individual document, patent application, and technical standard were specifically and individually noted to be incorporated by reference. [Explanation of symbols]

[0069] 10 Imaging device 11. Main unit of the device 12 interchangeable lenses 13 Image sensor 15, 55 Multilayer circuit board 16A~16C Board fixing part 17 Gyro sensor 18 Integrated Circuits 20 Resist 21 Terminal Land 21G gyro sensor terminal pad 22 prepregs 23 cores 24 Through Holes 25 Beer 25GA, 25GB, 25GC Gyro sensor vias 30 chips 31 Wire wiring 32 Lead Frames 33 molds Wiring pattern for 35G gyro sensor 35N Noise source wiring pattern 40 Vibration transmission suppression patterns 42 Curved section 45 Heat dissipation mechanism 46 screws 47 Heatsink 48, 49 Screw holes 56 Grip section BL Underlayer CA clearance area D distance IL1, IL2, IL3, IL4 Inner Layer LSD stacking direction MA installation area PD setting distance SA specific area TL surface layer

Claims

1. In a multilayer circuit board in which a gyro sensor is mounted on the first layer, In the first layer, at least a portion of the wiring pattern that runs from the terminal land of the gyro sensor is not formed in a specific region corresponding to the installation area of ​​the gyro sensor when viewed from the stacking direction. Multilayer circuit board.

2. The terminal land is formed in the first layer, The wiring pattern is formed on a layer different from the first layer. The multilayer circuit board according to claim 1, wherein the terminal land and the wiring pattern are connected via a conductive hole.

3. The multilayer circuit board according to claim 1, wherein no conductor planes exist in the specified region.

4. The multilayer circuit board according to claim 1, wherein the specified region includes an inner region and an outer region of the installation region.

5. The multilayer circuit board according to claim 1, wherein the specified region is a region obtained by multiplying the installation region by a set magnification factor.

6. The terminal land is formed in the first layer, The multilayer circuit board according to claim 1, wherein the installation area includes the terminal land.

7. The multilayer circuit board according to claim 4, wherein a vibration transmission suppression pattern is formed around the installation area of ​​the first layer.

8. The multilayer circuit board according to claim 7, wherein the vibration transmission suppression pattern is formed in multiple layers.

9. The multilayer circuit board according to claim 7, wherein the vibration transmission suppression pattern has a curved portion.

10. A multilayer circuit board according to claim 1, having a layer that functions as a shield for wiring patterns that are sources of noise.

11. In addition to the gyro sensor, a heat-generating component is mounted on the first layer. The multilayer circuit board according to claim 1, further comprising a heat dissipation mechanism for dissipating heat from the heat-generating component to the outside.

12. The multilayer circuit board according to claim 1, having a substrate fixing portion within a set distance from the gyro sensor.

13. A multilayer circuit board according to claim 1, which is incorporated into an imaging device or interchangeable lens.

Images