Measuring device, positioning device, lithography device, and method for manufacturing articles

Abstract

This technology provides advantages for properly retracting the sensor that measures the position of the surface being measured. [Solution] A measuring device for measuring the position of a surface to be measured comprises a sensor having a facing portion that faces the surface to be measured, the facing portion being positioned at a predetermined distance from the surface to be measured, and a moving unit that moves at least the facing portion of the sensor, wherein the moving unit operates in a first mode in which it moves the facing portion away from the surface to be measured in response to the reception of a first signal instructing the facing portion to retract when the measurement by the sensor is completed, and in a second mode in which it moves the facing portion in the direction in response to the reception of a second signal instructing the facing portion to retract in an emergency, and the time from the reception of the second signal to the completion of the retraction of the facing portion in the second mode is shorter than the time from the reception of the first signal to the completion of the retraction of the facing portion in the first mode.

Description

[Technical Field]

[0001] The present invention relates to a measurement apparatus, a positioning apparatus, a lithography apparatus, and an article manufacturing method. [Background Art]

[0002] Patent Document 1 describes an air sensor (gas measurement proximity sensor) that arranges a measurement probe that injects gas through a conduit in proximity to a measurement surface (surface to be measured) and measures the position of the measurement surface based on the pressure in the conduit. In the air sensor described in Patent Document 1, the separation distance between the measurement probe and the measurement surface is controlled to be constant in order to avoid collision between the measurement probe and the measurement surface. [Prior Art Documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Laid-Open No. 2006-189429 [Summary of the Invention] [Problem to be Solved by the Invention]

[0004] A sensor such as an air sensor, which has a portion arranged in proximity to a surface to be measured during measurement of the position of the surface to be measured, is retracted away from the surface to be measured after completion of the position measurement of the surface to be measured, in order to avoid contact between the air sensor and the surface to be measured. On the other hand, in an emergency such as when an abnormality (for example, vibration) occurs in the relative position between the sensor and the surface to be measured, the retraction operation performed at the end of measurement may not be sufficient to retract the air sensor in time, and there is a possibility that the air sensor comes into contact with the surface to be measured.

[0005] Accordingly, an object of the present invention is to provide an advantageous technique for appropriately retracting a sensor that measures the position of a surface to be measured. [Means for Solving the Problem]

[0006] To achieve the above objective, a measuring device as one aspect of the present invention is a measuring device for measuring the position of a surface to be measured, comprising: a sensor having a facing portion facing the surface to be measured, the facing portion being positioned at a predetermined distance from the surface to be measured in a first state, and a moving unit that moves at least the facing portion of the sensor, wherein the moving unit operates in a first mode in which it moves the facing portion away from the surface to be measured in response to the reception of a first signal instructing the facing portion to retract when measurement by the sensor is completed, and a second mode in which it moves the facing portion in the aforementioned direction in response to the reception of a second signal instructing the facing portion to retract in an emergency, wherein the time from the reception of the second signal to the completion of the retraction of the facing portion in the second mode is shorter than the time from the reception of the first signal to the completion of the retraction of the facing portion in the first mode.

[0007] Further objects or other aspects of the present invention will be revealed by preferred embodiments described below with reference to the accompanying drawings. [Effects of the Invention]

[0008] According to the present invention, for example, it is possible to provide an advantageous technique for appropriately retracting a sensor that measures the position of a surface to be measured. [Brief explanation of the drawing]

[0009] [Figure 1] This figure schematically shows an example of the configuration of the exposure apparatus according to the first embodiment. [Figure 2A] This diagram schematically shows a first example configuration of an air sensor. [Figure 2B] This diagram schematically shows a second configuration example of the air sensor. [Figure 3] This figure schematically shows an example of the configuration of the measuring device according to the first embodiment. [Figure 4] Flowchart showing the operation of the measuring device of the first embodiment [Figure 5] The diagram shows an example of the time change in the movement speed of the air sensor for each of the first and second modes. [Figure 6] This figure schematically shows an example of the configuration of the measuring device according to the second embodiment. [Figure 7] This figure schematically shows an example of the configuration and operation of the measuring device according to the second embodiment. [Figure 8] This figure schematically shows an example of the configuration of the measuring device according to the third embodiment. [Modes for carrying out the invention]

[0010] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0011] The lithography apparatus according to the present invention is an apparatus for forming a pattern on a substrate. Examples of lithography apparatuses include an exposure apparatus that exposes a substrate to transfer a pattern from a master plate (mask) onto the substrate, and an imprint apparatus that uses a master plate (mold) to form a pattern on an imprint material on a substrate. In the following, an exposure apparatus will be used as an example to explain the lithography apparatus.

[0012] <First Embodiment> A first embodiment of the present invention will now be described. Figure 1 schematically shows an example of the configuration of the exposure apparatus 100 of this embodiment. The exposure apparatus 100 may be configured to expose the substrate 1 by projecting the pattern of the original plate 11 onto the substrate 1 using the projection optical system 13, and comprising an illumination optical system 12 for illuminating the original plate 11 and a projection optical system 13 for projecting the pattern of the original plate 11 onto the substrate 1 using the projection optical system 13. The exposure apparatus 100 may also comprise a substrate stage 41 that holds and moves the substrate 1, a measuring device 20 for measuring the position (height) of the surface to be measured, and a control unit CNT. The measuring device 20 of this embodiment may be configured to measure the surface height (surface position) of the substrate 1 as the position of the surface to be measured. Furthermore, the substrate stage 41, measuring device 20, and control unit CNT in the exposure apparatus 100 of this embodiment may constitute a positioning device for positioning the substrate 1. In this positioning device, the control unit CNT controls the substrate stage 41 based on the measurement results of the measuring device 20.

[0013] The substrate stage 41 holds the substrate 1 and drives the substrate 1 in the XY direction by moving it on a stage base plate (not shown) in the XY direction. The substrate stage 41 may be configured to drive the substrate 1 not only in the XY direction but also in the six axes (X, Y, Z, θX, θY, θZ). The substrate stage 41 may also be provided with a reference plate 2 having a reference surface. The reference surface of the reference plate 2 is a flat surface, and reference marks whose position is detected by an alignment sensor (not shown) may be provided on this reference surface.

[0014] The position and orientation of the substrate stage 41 are measured by a position measurement system MS and can be controlled by a control unit CNT based on the output of the position measurement system MS. The position measurement system MS comprises multiple position measuring instruments and measures the position and orientation of the substrate stage 41 in terms of six axes (X, Y, Z, θX, θY, θZ). Figure 1 shows two position measuring instruments 42-43 that measure the position of the substrate stage 41 in the Y direction, but in reality, position measuring instruments that measure the position of the substrate stage 41 in the X direction, and position measuring instruments that measure the position of the substrate stage 41 in the Z direction may also be provided. Each position measuring instrument may include, for example, an interferometer, an encoder, or one or more interferometers and one or more encoders.

[0015] The measuring device 20 includes an air sensor 21, which is used to measure the surface height of the substrate 1. The air sensor 21 is a sensor (measuring instrument) that measures the surface height of the substrate 1 based on the pressure in the conduit while discharging (injecting) air (gas) onto the surface of the substrate 1 through the conduit. Since the air discharged from the air sensor 21 only hits the outermost surface of the substrate 1 and does not enter the interior of the substrate 1, the air sensor 21 can accurately measure the surface height of the substrate 1 without being affected by the internal structure of the substrate 1. For example, the air sensor 21 can be configured to measure the surface height of the substrate 1 with a resolution of the nanometer order or higher than 1 nm. The air sensor 21 is also sometimes called an air gauge sensor, air gap sensor, or air microsensor.

[0016] The control unit CNT is constituted by a computer (information processing apparatus) including, for example, a processor such as a CPU (Central Processing Unit) and a storage unit such as a memory, and controls each part of the exposure apparatus 100. The control unit CNT may be constituted by, for example, a PLD (abbreviation of Programmable Logic Device) such as an FPGA (abbreviation of Field Programmable Gate Array), an ASIC (abbreviation of Application Specific Integrated Circuit), a general-purpose or special-purpose computer with an embedded program, or a combination of all or part of any of the foregoing.

[0017] Next, a configuration example of the air sensor 21 will be described. FIG. 2A schematically shows a first configuration example of the air sensor 21. The air sensor 21 may include a reference nozzle 31 that discharges air through a first pipeline C1, a measurement nozzle 32 that discharges air through a second pipeline C2, and a differential pressure sensor 33 that detects a difference between the pressure of the first pipeline C1 and the pressure of the second pipeline C2. In each of the reference nozzle 31 and the measurement nozzle 32, orifices 30 are provided at an air inlet and an air outlet.

[0018] Air can be supplied from a mass flow controller 36 to the reference nozzle 31 (the first pipeline C1) and the measurement nozzle 32 (the second pipeline C2) via a sensor 35 such as a pressure gauge or a flow meter. Air is supplied to the mass flow controller 36 from a gas supply source 39 via a valve 38 and a filter 37. The valve 38 can be provided to turn on / off the supply of air from the gas supply source 39 to the mass flow controller 36. The filter 37 can be provided to supply clean air from the gas supply source 39 to the mass flow controller 36. In addition, the output of the differential pressure sensor 33 is transmitted to a processor 34, and the processor 34 converts the output of the differential pressure sensor 33 (that is, the difference between the pressure of the first pipeline C1 and the pressure of the second pipeline C2) into height information.

[0019] The mass flow controller 36 supplies air with a constant pressure and flow rate to the reference nozzle 31 and the measurement nozzle 32. Specifically, the mass flow controller 36 may operate to maintain the pressure at the outlet side of the mass flow controller 36 at a predetermined pressure (e.g., 70 kPa ± 0.01 kPa) based on the output of the sensor 35. The diameter of the orifice 30 provided in the reference nozzle 31 and the measurement nozzle 32 may be in the range of, for example, 0.1 to 0.2 mm. The orifice 30 acts as a resistance to the airflow, so that the pressure in the first conduit C1 of the reference nozzle 31 can be maintained at a constant level. On the other hand, the pressure in the second conduit C2 of the measurement nozzle 32 is a value that depends on the distance between the measurement nozzle 32 and the surface to be measured. That is, the pressure in the second conduit C2 increases as the distance between the measurement nozzle 32 and the surface to be measured decreases, and the pressure in the second conduit C2 decreases as the distance increases. In this embodiment, the surface to be measured is the surface of the substrate 1, but it may also be the surface of the reference plate 2.

[0020] The differential pressure sensor 33 is supplied with the pressure in the first conduit C1 of the reference nozzle 31 and the pressure in the second conduit C2 of the measuring nozzle 32. In other words, the differential pressure sensor 33 is supplied with a differential pressure corresponding to the distance between the measuring nozzle 32 and the surface to be measured. The processor 34 converts the output of the differential pressure sensor 33 into height information of the surface to be measured and provides this height information to the control unit CNT. In this way, the air sensor 21 measures the height of the surface to be measured by discharging air onto the outermost surface, so measurement errors caused by internal structures that may exist below the surface to be measured do not occur.

[0021] The air sensor 21 of this embodiment has a measuring nozzle 32 as a facing portion that faces the surface of the substrate 1, which is the surface to be measured, and measures the surface height of the substrate 1 when the measuring nozzle 32 is positioned at a predetermined distance from the surface of the substrate 1 (first state). This state may also be understood as a state in which the tip (lower end) of the measuring nozzle 32 is close to the surface of the substrate 1, and will be referred to as the "nozzle proximity state" below. In other words, the air sensor 21 discharges air from the measuring nozzle 32 toward the surface of the substrate 1 in the nozzle proximity state and measures the surface height of the substrate 1 based on the internal pressure of the measuring nozzle 32 at that time (i.e., the pressure of the second pipeline C2).

[0022] Furthermore, the measuring device 20 is provided with a moving unit 22 for moving the air sensor 21. When the measurement of the surface height of the substrate 1 by the air sensor 21 is started, the moving unit 22 moves the air sensor 21 in the -Z direction so that the measuring nozzle 32 is positioned at a predetermined distance from the surface of the substrate 1. On the other hand, when the measurement of the surface height of the substrate 1 by the air sensor 21 is completed (at the end of measurement), the moving unit 22 moves the air sensor 21 in the +Z direction (away from the surface of the substrate 1) to retract the air sensor 21. In other words, the moving unit 22 may be configured to move the air sensor 21 (measuring nozzle 32) relative to the substrate 1 in the ±Z direction. The moving unit 22 may also be understood as a drive unit that drives the air sensor 21 in the ±Z direction.

[0023] Figure 2B schematically shows a second configuration example of the air sensor 21. In the second configuration example, a first differential pressure sensor 33A and a second differential pressure sensor 33B are provided instead of the differential pressure sensor 33 of the first configuration example. The first differential pressure sensor 33A detects the difference between the pressure in the first conduit C1 of the reference nozzle 31 and the pressure in the second conduit 72 of the measurement nozzle 32. Similarly, the second differential pressure sensor 33B detects the difference between the pressure in the first conduit C1 of the reference nozzle 31 and the pressure in the second conduit C2 of the measurement nozzle 32. The first differential pressure sensor 33A and the second differential pressure sensor 33B have different sensitivities (and measurement ranges). The processor 34 can convert the output of the first differential pressure sensor 33A into height information and can also convert the output of the second differential pressure sensor 33B into height information.

[0024] Incidentally, in the air sensor 21, if internal components are deformed or misaligned due to shocks such as vibrations, the measurement accuracy may decrease. Therefore, when retracting the air sensor 21 at the end of measurement, it is desirable to move the air sensor 21 in a way that prevents shocks (vibrations) that cause deformation or misalignment of internal components from being applied to the air sensor 21. On the other hand, in the exposure apparatus 100, if an emergency occurs, such as an earthquake, a malfunction of the support member of the measurement device 20 (air sensor 21), or a malfunction of the substrate stage 41, the air sensor 21 and the substrate 1 on the substrate stage 41, which are in close proximity to each other, may come into contact. In this case, a large shock may be applied to the air sensor 21, causing deformation or misalignment of its internal components, and other components such as the substrate stage 41 may also be damaged. In addition, the operator may press the emergency stop button 14 (see Figure 1) provided on the exposure apparatus 100 to make an emergency stop of the exposure apparatus 100.

[0025] Therefore, the measuring device 20 of this embodiment includes a first mode and a second mode as operating modes in which the moving unit 22 moves the air sensor 21 in the +Z direction (away from the surface of the substrate 1) in order to retract the air sensor 21. The first mode is an operating mode in which the moving unit 22 moves (retracts) the air sensor 21 in the +Z direction in response to the reception of a normal retraction signal (first signal) that instructs the air sensor 21 to retract when measurement by the air sensor 21 is completed. The second mode is an operating mode in which the moving unit 22 moves (retracts) the air sensor 21 in the +Z direction in response to the reception of an emergency retraction signal (second signal) that instructs the air sensor 21 to retract in an emergency, and the retraction time of the air sensor 21 is shorter than in the first mode. The retraction time of the air sensor 21 means the time from the reception of the retraction signal instructing the air sensor 21 to the completion of the retraction of the air sensor 21. In other words, the time from receiving the emergency evacuation signal in the second mode until the air sensor 21 has finished retracting is shorter than the time from receiving the normal evacuation signal until the air sensor 21 has finished retracting in the first mode. This allows the air sensor 21 to be appropriately retracted according to the status of the measuring device 20. Here, the normal evacuation signal and the emergency evacuation signal are trigger signals (control signals) supplied from the control unit CNT to the moving unit 22 in order to retract the air sensor 21 (i.e., move it in the +Z direction).

[0026] Figure 3 schematically shows an example configuration of the measuring device 20 of this embodiment. As described above, the measuring device 20 may include an air sensor 21 and a moving part 22. The moving part 22 of this embodiment includes one type of moving mechanism 22a, and the movement of the air sensor 21 in each of the first and second modes can be performed by this one type of moving mechanism 22a. The moving mechanism 22a is attached to the frame 15 (support member). For example, the moving mechanism 22a includes an actuator having a stator provided on the frame 15 and a movable element provided on the air sensor 21, and moves the air sensor 21 in the ±Z direction by moving the movable element relative to the stator. As the actuator of the moving mechanism 22a, an air cylinder, a linear motor, a voice coil motor, or a solenoid may be used. The frame 15 may be supported by the structure of the exposure apparatus 100 via a vibration damping mount 16.

[0027] Figure 4 is a flowchart illustrating the operation of the measuring device 20 in this embodiment. The flowchart in Figure 4 shows the operation flow of the measuring device 20 under the control of the control unit CNT. The flowchart in Figure 4 starts with the air sensor 21 (measuring nozzle 32) positioned in the retracted position. The retracted position is the position in which the air sensor 21 is positioned so as to be further away from the substrate 1 in the +Z direction than the measurement position. The measurement position is the position in which the air sensor 21 is positioned at a predetermined distance from the surface of the substrate 1 in order to measure the surface height of the substrate 1.

[0028] When the measuring device 20 receives the placement signal in step S11, it proceeds to step S12, where the moving unit 22 moves the air sensor 21 (measurement nozzle 32) in the -Z direction to position the air sensor 21 at the measurement position. The placement signal is a trigger signal (control signal) supplied from the control unit CNT to the moving unit 22 to instruct the air sensor 21 (measurement nozzle 32) to be positioned at the measurement position. Next, the process proceeds to step S13, where the measuring device 20 starts measuring the surface height of the substrate 1 using the air sensor 21 in response to receiving the measurement start signal. The measurement start signal is a trigger signal (control signal) supplied from the control unit CNT to the air sensor 21 to instruct the start of measuring the surface height of the substrate 1.

[0029] When the measuring device 20 receives an emergency retraction signal in step S14 while measuring the surface height of the substrate 1, it proceeds to step S15, where the moving unit 22 moves the air sensor 21 (measuring nozzle 32) in the +Z direction in second mode, and positions the air sensor 21 in the retraction position. The retraction of the air sensor 21 is completed when the air sensor 11 is positioned in the retraction position. As mentioned above, the emergency retraction signal is a trigger signal (control signal) supplied from the control unit CNT to the moving unit 22 to instruct the retraction of the air sensor 21 in an emergency.

[0030] Here, the exposure apparatus 100 is equipped with an abnormality detection sensor that detects various abnormalities within the apparatus, and when an abnormality is detected by the abnormality detection sensor, the control unit CNT can supply an emergency evacuation signal to the mobile unit 22. Examples of various abnormalities include the following. The control unit CNT can also supply an emergency evacuation signal to the mobile unit 22 when the emergency stop button 14 is pressed by the operator. • Abnormal condition of exposure device 100 • Abnormal deviation, current, and / or position of the air sensor 21. • Abnormalities in deviation, current, and / or position of the substrate stage 41. • Frame 15 deviation, current and / or positional abnormalities • Abnormalities in the deviation, current, and / or position of the vibration damping mount 16

[0031] Furthermore, when the measuring device 20 receives the normal retraction signal in step S16, it proceeds to step S17, where the moving unit 22 moves the air sensor 21 (measuring nozzle 32) in the +Z direction in the first mode, placing the air sensor 21 in the retraction position. The retraction of the air sensor 21 is completed when the air sensor 11 is placed in the retraction position. As mentioned above, the normal retraction signal is a trigger signal (control signal) supplied from the control unit CNT to the moving unit 22 to instruct the air sensor 21 to retract when measurement by the air sensor 21 is completed. When the control unit CNT acquires height information output from the air sensor 21, it determines that measurement by the air sensor 21 is complete and can supply the normal retraction signal to the moving unit 22.

[0032] Next, the first and second modes for the mobile unit 22 to move (retract) the air sensor 21 in the +Z direction will be described. As mentioned above, the first mode is an operating mode in which the mobile unit 22 moves (retracts) the air sensor 21 in the +Z direction when measurement by the air sensor 21 has been completed normally. On the other hand, the second mode is an operating mode in which the mobile unit 22 moves (retracts) the air sensor 21 in the +Z direction in an emergency, and the retraction time of the air sensor 21 is shorter than in the first mode.

[0033] Figure 5(a) shows an example of the time variation of the moving speed of the air sensor 21 for both the first and second modes. In Figure 5(a), "T1" indicates the timing when the moving unit 22 starts moving the air sensor 21 in the first mode, and "T2" indicates the timing when the moving unit 22 starts moving the air sensor 21 in the second mode. "T0" indicates the timing when the moving unit 22 receives a retraction signal (normal retraction signal or emergency retraction signal).

[0034] In the first mode, upon receiving a normal retraction signal at timing T0, predetermined preparatory operations are performed, and then the air sensor 21 begins to move at timing T1. On the other hand, in the second mode, upon receiving an emergency retraction signal at timing T0, predetermined preparatory operations are omitted, and the air sensor 21 begins to move at timing T2. This makes the waiting time P2 from the reception of the emergency retraction signal to the start of movement of the air sensor 21 in the second mode shorter than the waiting time P1 from the reception of the normal retraction signal to the start of movement of the air sensor 21 in the first mode. Therefore, the retraction time of the air sensor 21 in the second mode can be shorter than the retraction time of the air sensor 21 in the first mode.

[0035] Figure 5(b) shows an example of the time variation of the moving speed of the air sensor 21 for each of the first and second modes. In Figure 5(b), "Ts" indicates the timing when the moving unit 22 starts moving the air sensor 21 in each of the first and second modes. "T0" indicates the timing when the moving unit 22 receives a retraction signal (normal retraction signal or emergency retraction signal).

[0036] In the first mode, when a normal retraction signal is received at timing T0, the air sensor 21 starts moving at timing Ts and moves with acceleration A1. On the other hand, in the second mode, when an emergency retraction signal is received at timing T0, the air sensor 21 starts moving at timing Ts and moves with acceleration A2 which is greater than acceleration A1. This makes it possible to shorten the retraction time of the air sensor 21 in the second mode compared to the retraction time of the air sensor 21 in the first mode. Here, in the second mode, it is also possible to shorten the waiting time compared to the first mode as shown in Figure 5(a) and to increase the acceleration compared to the first mode as shown in Figure 5(b).

[0037] As described above, the measuring device 20 of this embodiment includes a first mode in which the moving unit 22 moves (retracts) the air sensor 21 in response to the reception of a normal retraction signal, and a second mode in which the moving unit 22 moves (retracts) the air sensor 21 in response to the reception of an emergency retraction signal. In the second mode, the retraction time of the air sensor 21 is shorter than in the first mode. This allows the air sensor 21 to be appropriately retracted according to the status of the measuring device 20.

[0038] In the above embodiment, an air sensor 21 using gas was exemplified as the sensor moved by the moving unit 22 in each of the first and second modes. However, the sensor moved by the moving unit 22 may be any sensor that has a facing portion that faces the surface to be measured, and that measures the position of the surface to be measured while the facing portion is positioned at a predetermined distance from the surface to be measured. For example, an optical sensor or a capacitive sensor may be used as the sensor moved by the moving unit 22.

[0039] <Second Embodiment> A second embodiment of the present invention will now be described. In this embodiment, an example will be described in which multiple types of moving mechanisms, each with a different method of moving the air sensor 21, are provided on the moving part 22. This embodiment basically follows the first embodiment, and can be followed in all respects except for those mentioned below.

[0040] Figure 6 schematically shows an example of the configuration of the measuring device 20 of this embodiment. In the measuring device 20 of this embodiment, a first moving mechanism 22b and a second moving mechanism 22c, which move the air sensor 21 in different ways, are provided on the moving part 22. The movement of the air sensor 21 in the first mode and the second mode is performed using the first moving mechanism and the second moving mechanism, respectively. The first moving mechanism 22b includes an actuator having a stator and a movable element, and moves the air sensor 21 in the ±Z direction by moving the movable element relative to the stator. As the actuator of the first moving mechanism 22b, an air cylinder, linear motor, voice coil motor, or solenoid may be used. The second moving mechanism 22c may include a spring member that applies a force in the +Z direction to the air sensor 21 (measuring nozzle 32) which is positioned at a predetermined distance from the surface of the substrate 1.

[0041] Furthermore, the measuring device 20 of this embodiment may further include a fixing mechanism 23 for fixing the position of the air sensor 21, which is positioned at a predetermined distance from the surface of the substrate 1 to measure the surface height of the substrate 1, i.e., the position of the air sensor 21 positioned at the measurement location. For example, the fixing mechanism 23 is provided on a support member 17 attached to the frame 15, and fixes the position of the air sensor 21 (measuring nozzle 32) using at least one of vacuum suction force and electromagnetic force. As the fixing mechanism 23, a vacuum chuck, electromagnet, electrostatic chuck, voice coil motor, or solenoid may be used.

[0042] Figure 7 schematically shows a specific configuration example and operation example of the measuring device 20 of this embodiment. In the measuring device 20 of this embodiment, the first moving mechanism 22b includes an actuator having a stator 22b1 provided on the frame 15 and a movable element 22b2 that can move in the ±Z direction relative to the stator 22b1. The movable element 22b2 of the first moving mechanism 22b can contact the upper surface of the air sensor 21. The second moving mechanism 22c includes a spring member with one end connected to the frame 15 and the other end connected to the air sensor 21. By using a spring member in the second moving mechanism 22c, complex control is unnecessary, and the measuring device 20 can be made into a simple configuration. Hereafter, the first moving mechanism 22b may be referred to as "actuator 22b" and the second moving mechanism 22c may be referred to as "spring member 22c".

[0043] The measuring device 20 of this embodiment can operate according to the flowchart in Figure 4 described above. Figure 7(a) shows the state of the measuring device 20 before the flowchart in Figure 4 starts, that is, the state in which the air sensor 21 is in the retracted position. When the measuring device 20 receives the positioning signal in step S11, it proceeds to step S12 and moves the air sensor 21 in the -Z direction by moving the movable element 22b2 of the actuator 22b in the -Z direction, as shown in Figure 7(b). Once the air sensor 21 is in the measurement position, the position of the air sensor 21 is fixed by the fixing mechanism 23.

[0044] Furthermore, as shown in Figure 7(c), the measuring device 20 moves the movable element 22b2 of the actuator in the +Z direction, separating the movable element 22b2 from the air sensor 21. In this state where the movable element 22b2 is separated from the air sensor 21 (separated state, second state), a force in the -Z direction is applied to the air sensor 21 by the restoring force of the spring member 22c. However, since the position of the air sensor 21 is fixed by the fixing mechanism 23, the air sensor 21 remains in the measurement position. In this state, the process proceeds to step S13, and the measuring device 20 starts measuring the surface height of the substrate 1 using the air sensor 21 in response to the receipt of the measurement start signal.

[0045] If an emergency retraction signal is received in step S14 while measuring the surface height of substrate 1, the process proceeds to step S15, where the measuring device 20 moves the air sensor 21 in the +Z direction in second mode and places the air sensor 21 in the retracted position. Specifically, as shown in Figure 7(d), the measuring device 20 releases the fixation of the position of the air sensor 21 by the fixing mechanism 23, and moves the air sensor 21 in the +Z direction by the force of the spring member 22c, placing the air sensor 21 in the retracted position. In other words, in the second mode of this embodiment, when the position of the air sensor 21 is released by the fixing mechanism 23 in the separated state, the air sensor 21 is moved in the +Z direction by the force of the spring member 22c and placed in the retracted position.

[0046] After the measurement of the surface height of the substrate 1 is completed and a normal retraction signal is received in step S16, the process proceeds to step S17, where the measuring device 20 moves the air sensor 21 in the +Z direction in first mode, positioning the air sensor 21 in the retracted position. Specifically, as shown in Figure 7(e), the measuring device 20 moves the movable element 22b2 of the actuator 22b in the -Z direction to bring the movable element 22b2 into contact with the air sensor 21, and in this state releases the fixing mechanism 23 from fixing the position of the air sensor 21. This operation of moving the movable element 22b2 in the -Z direction to bring it into contact with the air sensor 21 corresponds to the preparation operation described above using Figure 5(a). Next, as shown in Figure 7(f), the measuring device 20 moves the movable element 22b2 of the actuator 22b in the +Z direction, so that the air sensor 21 is supported by the movable element 22b2 and moved in the +Z direction by the force of the spring member 22c. This causes the air sensor 21 to be positioned in a retracted position.

[0047] Thus, in the first mode, upon receiving a normal retraction signal, the movable element 22b2 is moved in the -Z direction to prepare for contact with the air sensor 21 before the air sensor 21 begins to move. On the other hand, in the second mode, upon receiving an emergency retraction signal, the preparation is omitted and the air sensor 21 begins to move. This makes the waiting time P2 from the reception of the emergency retraction signal to the start of movement of the air sensor 21 in the second mode shorter than the waiting time P1 from the reception of the normal retraction signal to the start of movement of the air sensor 21 in the first mode. Therefore, the retraction time of the air sensor 21 in the second mode can be shorter than the retraction time of the air sensor 21 in the first mode.

[0048] Furthermore, in the first mode, the movable element 22b2 of the actuator 22b supports the air sensor 21, and the movable element 22b2 is moved in the +Z direction, causing the air sensor 21 to move in the +Z direction by the force of the spring member 22c. On the other hand, in the second mode, the air sensor 21 is moved in the +Z direction solely by the force of the spring member 22c, without support from the movable element 22b2 of the actuator 22b. This makes it possible to make the acceleration A2 that moves the air sensor 21 in the second mode greater than the acceleration A1 that moves the air sensor 21 in the first mode. Therefore, the retraction time of the air sensor 21 in the second mode can be made shorter than the retraction time of the air sensor 21 in the first mode.

[0049] <Third Embodiment> A third embodiment of the present invention will now be described. In this embodiment, an example will be described in which only a part of the air sensor 21 (measurement nozzle 32) is moved by the moving part 22. In other words, in this embodiment, it will be shown that the measuring device 20 may be configured such that the moving part 22 moves at least the opposing portion (measurement nozzle 32) of the air sensor 21. This embodiment basically follows the first embodiment, and can be followed in accordance with the first embodiment except for the matters mentioned below. Furthermore, the second embodiment may be applied to this embodiment, and an example in which the configuration of the second embodiment is applied will be described below.

[0050] Figure 8 schematically shows an example of the configuration of the measuring device 20 of this embodiment. In the measuring device 20 of this embodiment, the moving unit 22 (first moving mechanism 22a, second moving mechanism 22b) can be configured to move only the measuring nozzle 32, which is the opposing portion of the air sensor 21 that faces the surface of the substrate 1. Specifically, the measuring nozzle 32 of the air sensor 21 is provided on a holder 24, and the moving unit 22 moves the measuring nozzle 32 in the ±Z direction by moving the holder 24 in the ±Z direction. The components of the air sensor 21 other than the measuring nozzle 32 are supported by a frame 15, and air is supplied to the measuring nozzle 32 via piping T. By configuring the measuring device 20 in this way, the weight of the object moved by the moving unit 22 is reduced, so that the acceleration of moving the object in the second mode can be further increased.

[0051] In this embodiment, the measuring device 20 has a margin of error in the weight of the object moved by the moving unit 22, making it possible to move other parts using the moving unit 22. For example, in the measuring device 20, a sensor that measures the surface height of the substrate 1 in a different way than the air sensor 21 can be moved by the moving unit 22. In Figure 8, an optical sensor 25 (second sensor) that measures the surface height of the substrate 1 using light is provided on the holder 24. The optical sensor 25 is a measuring instrument that irradiates light onto the surface of the substrate 1 and receives reflected light from the substrate 1, and measures the surface height of the substrate 1 based on the reflected light. The moving unit 22 moves the holder 24 in the ±Z direction, thereby moving the optical sensor 25 together with the measuring nozzle 32 of the air sensor 21 in the ±Z direction.

[0052] <Embodiment of Article Manufacturing Method> The article manufacturing method according to an embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having a microstructure. The article manufacturing method of this embodiment includes a formation step of forming a pattern on a substrate using the above-described lithography apparatus (lithography method), a processing step of processing the substrate on which the pattern was formed in the formation step, and a manufacturing step of manufacturing an article from the substrate processed in the processing step. When the lithography apparatus is configured as an exposure apparatus, the formation step may be a step of forming a latent image pattern on a photosensitive agent coated on a substrate by exposing the substrate using the above-described exposure apparatus (exposure method). In this case, the processing step may include a step of developing the substrate on which the latent image pattern was formed. Furthermore, the article manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of this embodiment is advantageous compared to conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

[0053] <Summary of Embodiments> The disclosures herein include at least the following measuring devices, positioning devices, lithography devices, and methods for manufacturing articles. (Item 1) A measuring device for measuring the position of a surface to be measured, A sensor having a facing portion that faces the surface to be measured, and measuring the position of the surface to be measured in a first state in which the facing portion is positioned at a predetermined distance from the surface to be measured, The system includes a moving part that moves at least the opposing portion of the sensor, The moving unit operates in a first mode in which, upon receiving a first signal instructing the opposing part to retract when measurement by the sensor is completed, the opposing part moves in a direction away from the surface being measured, and in a second mode in which, upon receiving a second signal instructing the opposing part to retract in an emergency, the opposing part moves in the aforementioned direction. A measuring device characterized in that, in the second mode, the time from receiving the second signal to the completion of retraction of the opposing portion is shorter than the time from receiving the first signal to the completion of retraction of the opposing portion in the first mode. (Item 2) The measuring device according to item 1, characterized in that the time from receiving the second signal to starting the movement of the opposing portion in the second mode is shorter than the time from receiving the first signal to starting the movement of the opposing portion in the first mode. (Item 3) The measuring device according to item 1 or 2, characterized in that the second mode is greater than the acceleration used to move the opposing portion in the first mode. (Item 4) The moving part includes a first moving mechanism and a second moving mechanism, each having a different method for moving the opposing parts. The measuring device according to any one of items 1 to 3, characterized in that the movement of the opposing portion in each of the first mode and the second mode is performed using the first movement mechanism and the second movement mechanism. (Item 5) The first moving mechanism includes an actuator having a movable element that is movable in the direction, The measuring device according to item 4, characterized in that the second moving mechanism includes a spring member that applies a force in the direction to the opposing portion in the first state. (Item 6) During measurement by the aforementioned sensor, the movable element is positioned at a distance from the opposing portion. In the first mode, the moving part brings the movable element into contact with the opposing portion, and moves the opposing portion in the direction by the force of the spring member while supporting the opposing portion with the movable element. The measuring device according to item 5, characterized in that, in the second mode, the moving part moves the opposing part in the direction by the force of the spring member in a second state in which the movable element is separated from the opposing part. (Item 7) The device further includes a fixing mechanism for fixing the position of the opposing parts in the first state, The measuring device according to item 6, characterized in that, in the second mode, the moving part moves the opposing part in the direction by the spring member when the fixing mechanism releases the fixing of the position of the opposing part. (Item 8) The measuring device according to item 7, characterized in that the fixing mechanism fixes the position of the opposing portion using at least one of a vacuum suction force and an electromagnetic force. (Item 9) The aforementioned moving part includes one type of moving mechanism, The measuring device according to any one of items 1 to 4, characterized in that the movement of the opposing portion in each of the first mode and the second mode is performed using the one type of movement mechanism. (Item 10) The measuring device according to any one of items 1 to 9, characterized in that the sensor has a nozzle as the opposing part that discharges gas toward the surface to be measured through a pipeline, and measures the height of the surface to be measured based on the pressure in the pipeline. (Item 11) The system further includes a second sensor that measures the position of the surface to be measured using light, The measuring device according to any one of items 1 to 10, characterized in that the moving part moves the second sensor in the direction together with the opposing part. (Item 12) A positioning device for positioning a substrate, A stage that holds and moves the substrate, A measuring device described in any one of items 1 to 11, which measures the position of the surface of the substrate as the surface to be measured, A control unit that controls the stage based on the measurement results of the measuring device, A positioning device characterized by comprising: (Item 13) A lithography apparatus for forming patterns on a substrate, A lithography apparatus characterized by having a positioning device as described in item 12. (Item 14) A forming step of forming a pattern on a substrate using the lithography apparatus described in item 13, A processing step for processing the substrate that has undergone the forming step, A manufacturing process for producing an article from the substrate that has undergone the processing step, A method for manufacturing articles, characterized by including the following:

[0054] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of Symbols]

[0055] 1: Substrate, 20: Measuring device, 21: Air sensor, 22: Drive unit, 22a: Drive mechanism (actuator), 22b: First drive mechanism (actuator), 22c: Second drive mechanism (spring member), 32: Measuring nozzle, 100: Exposure device (lithography device)

Claims

1. A measuring device for measuring the position of a surface to be measured, A sensor having a facing portion that faces the surface to be measured, and measuring the position of the surface to be measured in a first state in which the facing portion is positioned at a predetermined distance from the surface to be measured, The system includes a moving part that moves at least the opposing portion of the sensor, The moving unit operates in a first mode in which, upon receiving a first signal instructing the opposing part to retract when measurement by the sensor is completed, the opposing part moves in a direction away from the surface being measured, and in a second mode in which, upon receiving a second signal instructing the opposing part to retract in an emergency, the opposing part moves in the aforementioned direction. A measuring device characterized in that, in the second mode, the time from receiving the second signal to the completion of retraction of the opposing portion is shorter than the time from receiving the first signal to the completion of retraction of the opposing portion in the first mode.

2. The measuring device according to claim 1, characterized in that the time from receiving the second signal to starting the movement of the opposing portion in the second mode is shorter than the time from receiving the first signal to starting the movement of the opposing portion in the first mode.

3. The measuring device according to claim 1, characterized in that the acceleration for moving the opposing portion in the second mode is greater than that in the first mode.

4. The moving part includes a first moving mechanism and a second moving mechanism, each having a different method for moving the opposing parts. The measuring device according to claim 1, characterized in that the movement of the opposing portions in each of the first and second modes is performed using the first movement mechanism and the second movement mechanism.

5. The first moving mechanism includes an actuator having a movable element that can move in the direction, The measuring device according to claim 4, characterized in that the second moving mechanism includes a spring member that applies a force in the direction to the opposing portion in the first state.

6. During measurement by the aforementioned sensor, the movable element is positioned at a distance from the opposing portion. In the first mode, the moving part brings the movable element into contact with the opposing portion, and moves the opposing portion in the direction by the force of the spring member while supporting the opposing portion with the movable element. The measuring device according to claim 5, characterized in that, in the second mode, the moving part moves the opposing part in the direction by the force of the spring member in a second state in which the movable element is separated from the opposing part.

7. The device further includes a fixing mechanism for fixing the position of the opposing parts in the first state, The measuring device according to claim 6, wherein in the second mode, the moving part is moved in the direction by the spring member when the fixing mechanism releases the fixing of the position of the opposing part.

8. The measuring device according to claim 7, characterized in that the fixing mechanism fixes the position of the opposing portion using at least one of a vacuum suction force and an electromagnetic force.

9. The aforementioned moving part includes one type of moving mechanism, The measuring device according to claim 1, characterized in that the movement of the opposing portions in each of the first and second modes is performed using the one type of movement mechanism.

10. The measuring device according to claim 1, wherein the sensor has a nozzle as the opposing part that discharges gas toward the surface to be measured through a pipeline, and measures the height of the surface to be measured based on the pressure in the pipeline.

11. The system further includes a second sensor that measures the position of the surface to be measured using light, The measuring device according to claim 1, characterized in that the moving part moves the second sensor in the direction together with the opposing part.

12. A positioning device for positioning a substrate, A stage that holds and moves the substrate, A measuring device according to any one of claims 1 to 11, which measures the position of the surface of the substrate as the surface to be measured, A control unit that controls the stage based on the measurement results of the measuring device, A positioning device characterized by comprising:

13. A lithography apparatus for forming patterns on a substrate, A lithography apparatus characterized by having the positioning device described in claim 12.

14. A forming step of forming a pattern on a substrate using the lithography apparatus described in claim 13, A processing step for processing the substrate that has undergone the forming step, A manufacturing process for producing an article from the substrate that has undergone the processing step, A method for manufacturing articles, characterized by including the following:

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