Non-contact wound field rotor

Abstract

In a non-contact wound-field rotor, the rectifier elements are arranged in a manner that is less susceptible to the effects of centrifugal force. [Solution] A non-contact wound field rotor is disclosed, comprising a rotor shaft, a rotor core around which coil wires are wound, and a power receiving device that receives power from a non-rotating power supply device in a non-contact manner, wherein the power receiving device comprises a plurality of rectifier elements arranged in the axial direction passing through the rotation axis of the rotor, and a wiring member that electrically connects the power supply device and the coil wires via the rectifier elements.

Description

Technical Field

[0001] The present disclosure relates to a non-contact wound-field rotor.

Background Art

[0002] In a non-contact wound-field rotor, a technology is known that arranges the entire rectifier including rectifying elements near the rotation axis of the rotor.

Prior Art Literature

Patent Literature

[0003]

Patent Literature 1

Summary of Invention

Problem to be Solved by the Invention

[0004] However, in the above-described conventional technology, although the rectifying elements are close to the rotation axis of the rotor, they are still spaced apart therefrom, so there is a possibility that the technology cannot appropriately cope with the increase in centrifugal force accompanying higher rotation speeds of a motor, leaving room for improvement.

[0005] Therefore, in one aspect, an object of the present disclosure is to arrange rectifying elements in a non-contact wound-field rotor in a manner that makes the arrangement less susceptible to the influence of centrifugal force.

Means for Solving the Problem

[0006] In one aspect, a rotor shaft; a rotor core around which a coil wire is wound; a power receiving device that receives non-contact power supply from a power feeding device on the non-rotation side; the power receiving device comprises: a plurality of rectifying elements arranged side by side in the axial direction in a form passing through the rotation axis of the rotor; and a wiring member that electrically connects the power feeding device and the coil wire via the rectifying elements; wherein there is provided a non-contact wound-field rotor. [Effects of the Invention]

[0007] In one aspect, the present disclosure makes it possible to arrange the rectifier elements in a non-contact wound-field rotor in a manner that is less susceptible to the effects of centrifugal force. [Brief explanation of the drawing]

[0008] [Figure 1] This is a diagram showing a vehicle drive system including a rotating electric machine according to this embodiment. [Figure 2] This is a schematic cross-sectional view showing a portion of the cross-section of a rotating electric machine. [Figure 3] This is a cross-sectional view showing the configuration of related components at the axial end of the rotor. [Figure 4] This diagram schematically shows an example of the configuration of a rectifier device, including a rectifier circuit. [Figure 5] This is a two-view drawing showing the substrate as viewed in the direction normal to the substrate surface. [Figure 6] This is a cross-sectional view along line AA in Figure 5. [Figure 7] This is a cross-sectional view along line BB in Figure 5. [Figure 8] This is an explanatory diagram showing the arrangement of each circuit board (position in orientation and rotation direction), and is a plan view as seen from the X1 side. [Figure 9] This is an explanatory diagram of each wiring component that is fixed to each notch on each circuit board. [Figure 10] This is a cross-sectional view taken from a cross-section passing through two specific wiring members and their central axis. [Figure 11] This is a cross-sectional view taken from two other specific wiring members and through a cross-section passing through the central axis. [Figure 12] This diagram schematically shows another example of the configuration of a rectifier device, including a rectifier circuit. [Modes for carrying out the invention]

[0009] Hereinafter, each embodiment will be described in detail with reference to the accompanying drawings. Note that the dimensional ratios in the drawings are merely examples and are not limited thereto, and shapes and the like in the drawings may be partially exaggerated for convenience of explanation. In addition, in the drawings, for the sake of visibility, reference numerals may be given only to some parts among a plurality of portions having the same attribute.

[0010] FIG. 1 is a configuration diagram showing a vehicle drive system 100 including a rotating electric machine 3 according to the present embodiment. FIG. 2 is a schematic cross-sectional view showing a part of a cross-section of the rotating electric machine 3.

[0011] The vehicle drive system 100 has a dual power supply configuration including a low-voltage battery 2A and a high-voltage battery 2B, and includes a vehicle drive device 101. The vehicle drive device 101 includes a rotating electric machine 3 and a drive device 5.

[0012] The low-voltage battery 2A is, for example, a lead battery, and has a rated voltage of, for example, 12 V.

[0013] The high-voltage battery 2B is, for example, a lithium ion battery, and has a rated voltage significantly higher than that of the low-voltage battery 2A, for example, 40 V or higher. In the present embodiment, as an example, it is assumed that the rated voltage of the high-voltage battery 2B is 300 V or higher. Note that the high-voltage battery 2B may be in the form of a fuel cell or the like.

[0014] The rotating electric machine 3 is a wound field type, and a rotor 310 includes a rotor core 312, a rotor coil 316, and a rotor shaft 318 (see FIG. 3 described later). The rotor coil 316 is formed by winding a coil wire for a field coil around the rotor core 312. As shown in FIG. 2, the rotor core 312 has tooth portions 3122 projecting radially outward, and the coil wire for the field coil forming the rotor coil 316 is wound around the tooth portions 3122. A stator 320 is provided radially outward of the rotor 310. As shown in FIG. 2, the coil wire forming a stator coil 322 is wound around tooth portions 3210 of a stator core 321.

[0015] The drive device 5 includes a microcomputer 50 (hereinafter referred to as "microcomputer 50") and an electric circuit unit 60.

[0016] The microcomputer 50 may be implemented as, for example, an ECU (Electronic Control Unit). The microcomputer 50 is connected to various electronic components (other ECUs and sensors) in the vehicle via a network 6 such as a CAN (Controller Area Network).

[0017] The microcomputer 50 receives various commands such as control commands from a host ECU (not shown) via the network 6. The microcomputer 50 controls the rotating electrical machine 3 via the electric circuit unit 60 based on the control commands. The microcomputer 50 operates based on electric power from the low-voltage battery 2A.

[0018] The electric circuit unit 60 includes a smoothing capacitor 62, a power conversion circuit unit 63, a power feeding circuit unit 64, and a power receiving circuit unit 65. The power feeding circuit unit 64 and the power receiving circuit unit 65 cooperate with a transformer Tr to implement a function of supplying electric power to a rotor coil 316 in a non-contact manner. Accordingly, unlike a configuration that performs power feeding in a contact manner, there is no wear, and reliability (such as durability) can be improved. The transformer Tr has a primary side coil 741 and a secondary side coil 742.

[0019] The smoothing capacitor 62 is provided between the high-potential side line 20 and the low-potential side line 22 of the high-voltage battery 2B. A passive discharge resistor R0 may be connected in parallel to the smoothing capacitor 62 at both ends of the smoothing capacitor 62.

[0020] The power conversion circuit 63 is in the form of an inverter, for example, forming a three-phase bridge circuit. The power conversion circuit 63 supplies three-phase AC power to the stator 320 of the rotating electric machine 3 under the control of the microcontroller 50. The power conversion circuit 63 is connected in parallel with the smoothing capacitor 62 between the high-potential side line 20 and the low-potential side line 22. The power conversion circuit 63 includes switching elements SW3 for each arm on the high-potential side and switching elements SW4 for each arm on the low-potential side. The power conversion circuit 63 is controlled by the microcontroller 50 via the drive circuit 52.

[0021] The power supply circuit section 64 includes a bridge circuit section 641 and a drive circuit section 642.

[0022] The bridge circuit section 641 is connected in parallel with the smoothing capacitor 62 and the passive discharge resistor R0 between the high-potential line 20 and the low-potential line 22. The bridge circuit section 641 is in the form of a full bridge circuit and includes switching elements SW1-1, SW1-2 and switching elements SW2-1, SW2-2.

[0023] Switching elements SW1-1 and SW1-2 are connected in series between the high-potential line 20 and the low-potential line 22. One end of the rotor coil 316 is connected between switching elements SW1-1 and SW1-2. Switching elements SW2-1 and SW2-2 are connected in series between the high-potential line 20 and the low-potential line 22, in parallel with switching elements SW1-1 and SW1-2. The other end of the rotor coil 316 is connected between switching elements SW2-1 and SW2-2. Hereinafter, for distinction, the configurations related to switching elements SW1-1 and SW2-1 may be labeled "high-potential side," and the configurations related to switching elements SW1-2 and SW2-2 may be labeled "low-potential side."

[0024] The switching elements SW1-1, SW1-2, SW2-1, and SW2-2 are switched on / off via the drive circuit 642. The switching elements SW1-1, SW1-2, SW2-1, and SW2-2 change the energization state to the rotor coil 316 under the control of the drive circuit 642. The switching elements SW1-1, SW1-2, SW2-1, and SW2-2 are, for example, IGBTs (Insulated Gate Bipolar Transistors), but may also be of other forms such as MOSFETs (Metal Oxide Semiconductor Field-Effect Transistors).

[0025] The drive circuit 642 supplies power to the rotor coil 316 via the power receiving circuit 65 by driving the gates of the switching elements SW1-1, SW1-2, SW2-1, and SW2-2 based on control signals from the microcontroller 50.

[0026] The power receiving circuit section 65 includes a rectifier circuit 652.

[0027] The rectifier circuit 652 is electrically connected between the transformer Tr and the rotor coil 316. The rectifier circuit 652 rectifies the secondary current (drive current) of the transformer Tr and supplies it to the rotor coil 316. The rectifier circuit 652 may be a diode bridge circuit, as shown in Figure 1.

[0028] Next, we will describe the characteristic configuration of this embodiment, mainly referring to Figure 3 and subsequent figures.

[0029] Figure 3 is a cross-sectional view showing the configuration of related components at the axial end of the rotor 310. The stator 320 is not shown in Figure 3. Figure 4 is a schematic diagram showing the configuration of the rectifier 72, including the rectifier circuit 652.

[0030] In the following explanation, "axial direction" refers to the direction in which the central axis I (see Figure 3, etc.), which forms the rotation axis of the rotor 310, extends, and "radial direction" refers to the radial direction centered on the central axis I. Therefore, "radial outward" refers to the side away from the central axis I from that position, and "radial inward" refers to the side toward the central axis I from that position. Also, in Figure 3, etc., the X direction parallel to the axial direction is defined. "Axial outward" refers to the side away from the axial center of the rotor 310 from that position, and "axial inward" refers to the side closer to the axial center of the rotor 310 from that position. Furthermore, "circumferential direction" corresponds to the direction of rotation around the central axis I.

[0031] In this embodiment, a power receiving device 70 is provided at the axial end of the rotor 310.

[0032] The power receiving device 70 receives power from the non-rotating power supply device in a non-contact manner. The non-rotating power supply device includes the power supply circuit section 64 described above and the primary coil 741 of the transformer Tr. The primary coil 741 of the transformer Tr may be provided on the non-rotating ferrite core 711. In this case, the ferrite core 711 is fixed to the case (not shown) of the rotating electric machine 3, or to a support member (e.g., a cover) fixed to the case (not shown).

[0033] The power receiving device 70 includes the secondary coil 742 of the transformer Tr, the rectifier 72 related to the rectifier circuit 652, and connections.

[0034] The secondary coil 742 is provided on the rotating annular coil substrate 722. The secondary coil 742 may take the form of a wiring pattern formed on the coil substrate 722.

[0035] In this embodiment, the rectifier 72 is arranged such that each diode D1 to D4 (rectifier element) passes through the axis (central axis I) of the rotor shaft 318. Specifically, the tips of each diode D1 to D4 of the rectifier 72 are provided so as to pass through the central axis I. In this case, the centrifugal force that may act on the tips of each diode D1 to D4 due to the rotation of the rotor shaft 318 can be substantially minimized. For example, the rectifier 72 may be arranged such that the centroid or center of gravity of each diode D1 to D4 tip substantially coincides with the axis of the rotor shaft 318.

[0036] In this embodiment, diodes D1 to D4 are provided on substrates 81-1 to 81-4, respectively. That is, diode D1 is provided on substrate 81-1, diode D2 is provided on substrate 81-2, and so on.

[0037] The substrates 81-1 to 81-4 are arranged in an axial direction. The substrates 81-1 to 81-4 may be arranged in an axial direction with gaps between them in the axial direction, or they may be stacked without gaps in the axial direction. The substrates 81-1 to 81-4 may be circular in shape when viewed in the axial direction, in which case the centers of the circles of the substrates 81-1 to 81-4 may be arranged so that they pass through the axis (central axis I) of the rotor shaft 318. In a modified example, the substrates 81-1 to 81-4 may be non-circular when viewed in the axial direction, in which case the centroids or center of gravity of the substrates 81-1 to 81-4 may be arranged so that they pass through the axis (central axis I) of the rotor shaft 318.

[0038] In this embodiment, substrates 81-1 to 81-4 are provided on a sub-shaft 3182 fixed to the end of the main shaft 3180 of the rotor shaft 318, as shown in Figure 3. The sub-shaft 3182 is fixed to the X1 side end of the main shaft 3180. The sub-shaft 3182 may, for example, be press-fitted into the hollow portion of the main shaft 3180. The sub-shaft 3182 is rotatably supported in a case (not shown) via bearings BR. In a modified example, the main shaft 3180 may be rotatably supported in a case (not shown) via bearings instead of or in addition to the sub-shaft 3182.

[0039] The sub-shaft 3182 has a recess 31820 that extends into the hollow portion of the main shaft 3180, and substrates 81-1 to 81-4 may be provided in the recess 31820. The substrates 81-1 to 81-4 may be fixed within the recess 31820 by a resin molded portion 3184.

[0040] Diodes D1 to D4 may be mounted on the surface of substrates 81-1 to 81-4, but preferably, diodes D1 to D4 are embedded in substrates 81-1 to 81-4, as described below. In this case, diodes D1 to D4 and the wiring connected to them can be protected compared to when the diodes are mounted on the surface of substrates 81-1 to 81-4. Also, unlike when they are mounted on the surface of substrates 81-1 to 81-4, it is possible to prevent diodes D1 to D4 from becoming detached from substrates 81-1 to 81-4.

[0041] Figure 5 is a two-view drawing showing both sides of substrate 81 as viewed in the direction normal to the substrate surface. Note that the direction normal to the substrate surface is parallel to the axial direction. Figure 6 is a cross-sectional view along line AA in Figure 5. Figure 7 is a cross-sectional view along line BB in Figure 5. Here, referring to Figures 5 to 7, we will mainly describe substrate 81-1 of substrates 81-1 to 81-4. However, the configurations of substrates 81-2 to 81-4 may be substantially the same, except that the diodes placed in place of diode D1 are different (diodes D2 to D4 are placed in this configuration) and the electrical connection configuration between diodes D2 to D4 is different (described later).

[0042] In this embodiment, the substrate 81-1 is a multilayer substrate, as shown in Figures 5 to 7, for example. Here, as an example, it is assumed to have a 6-layer structure, and in Figures 6 and 7, L1 to L6 indicate the corresponding 6 layers.

[0043] The substrate 81-1 is, for example, a glass epoxy multilayer substrate, and has a diode D1 chip embedded inside. In the illustrated example, the diode D1 is embedded in the L3 layer of the substrate 81-1, but the diode D1 may also be embedded in other inner layers (L2 layer, L4 layer, or L5 layer).

[0044] The substrate 81-1 has notches 811 to 814 on its outer periphery. The notches 811 to 814 may be arranged at 90-degree intervals, as shown in Figure 5. The shape of the notches 811 to 814 is arbitrary, but as shown in Figure 5, they may be in the form of a circular outer periphery punched out in a rectangle when viewed in the axial direction. Conductor patterns 821 to 824 are formed around the notches 811 to 814, respectively.

[0045] Conductor pattern 821 is electrically connected to a wiring member (one of the wiring members 91 to 94 described later) that fits into the notch 811. Similarly, conductor pattern 822 is electrically connected to a wiring member (one of the wiring members 91 to 94 described later) that fits into the notch 812. Conductor pattern 823 is electrically connected to a wiring member (one of the wiring members 91 to 94 described later) that fits into the notch 813. Conductor pattern 824 is electrically connected to a wiring member (one of the wiring members 91 to 94 described later) that fits into the notch 814. Note that conductor patterns 821 to 824 and their corresponding wiring members from among the wiring members 91 to 94 described later may be joined via solder or the like.

[0046] Conductor patterns 821 to 824 are formed on the front (L1) and back (L6) surfaces, and are formed in a manner that penetrates the substrate 81-1. Conductor pattern 821 is electrically connected to the cathode of diode D1 in the inner layers (L2 to L5), as shown in Figure 7. Conductor pattern 822 is electrically connected to the anode of diode D1 in the inner layers, as shown in Figure 6. Conductor patterns 823 and 824 are not electrically connected to anything in particular in the inner layers. Details of the functions of conductor patterns 821 to 824 will be described later.

[0047] Figure 8 is an explanatory diagram showing the arrangement (orientation and rotational position) of substrates 81-1 to 81-4, and is a plan view as seen from the X1 side.

[0048] As shown in Figure 8, substrate 81-2 is positioned relative to substrate 81-1 with the same front and back orientation, and rotated 90 degrees clockwise. The same front and back orientation means that the L1 layer of substrate 81-2 faces the X1 side.

[0049] Furthermore, substrate 81-3 is positioned relative to substrate 81-1 with its front and back reversed, and with a rotational angle relationship such that the notch 811 is at the same angular position. The front and back reversed relationship means that the L1 layer of substrate 81-3 is on the X2 side.

[0050] Furthermore, substrate 81-4 is positioned with respect to substrate 81-1 in the opposite orientation (front and back), and with a rotational angle relationship where the notch 811 is rotated 90 degrees counterclockwise.

[0051] Figure 9 is an explanatory diagram of wiring members 91 to 94 fixed to the respective notches 811 to 814 of substrates 81-1 to 81-4. In Figure 9, the arrangement of substrates 81-1 to 81-4 corresponds to the arrangement shown in Figure 8.

[0052] Wiring members 91 to 94 are fixed to substrates 81-1 to 81-4. Wiring members 91 to 94 are in the form of conductive members. For example, wiring members 91 to 94 may be in the form of metal plates called busbars. Also, wiring members 91 to 94 may include insulated conductive wires such as coil wires in part.

[0053] The wiring member 91 is fixed to the substrates 81-1 through 81-4 in such a manner that it fits into the notch 811 of the substrate 81-1.

[0054] In this embodiment, substrates 81-1 to 81-4 are provided in the arrangement shown in Figure 8. In this case, the notches that are in the same rotational position as the notch 811 of substrate 81-1 are the notch 814 of substrate 81-2, the notch 811 of substrate 81-3, and the notch 814 of substrate 81-4.

[0055] Therefore, the wiring member 91 is electrically connected to the conductor pattern 821 on substrate 81-1, electrically connected to the conductor pattern 824 on substrate 81-2, electrically connected to the conductor pattern 821 on substrate 81-3, and electrically connected to the conductor pattern 824 on substrate 81-4.

[0056] The end of the wiring member 91 on the X1 side is electrically connected to the terminal 3161 (see Figure 3) of the rotor coil 316 of the rotating electric machine 3.

[0057] As a result, the wiring member 91 can electrically connect the cathodes of diodes D1 and D3 to the terminals 3161 of the rotor coil 316 of the rotating electric machine 3 via substrates 81-1 and 81-3.

[0058] Furthermore, the wiring member 91 only needs to be electrically connected to the substrates 81-1 and 81-3, and in the modified example, the wiring member 91 does not need to extend to the substrate 81-4.

[0059] The wiring member 92 is fixed to substrates 81-1 through 81-4 in such a manner that it fits into the notch 812 of substrate 81-1.

[0060] Similarly, the notches that are in the same rotational position as the notch 812 on substrate 81-1 are the notch 811 on substrate 81-2, the notch 814 on substrate 81-3, and the notch 813 on substrate 81-4.

[0061] Therefore, the wiring member 92 is electrically connected to the conductor pattern 822 on substrate 81-1, to the conductor pattern 821 on substrate 81-2, to the conductor pattern 824 on substrate 81-3, and to the conductor pattern 823 on substrate 81-4.

[0062] The end of the wiring component 92 on the X1 side is electrically connected to terminal 7421 of the secondary coil 742 of the transformer Tr.

[0063] As a result, the wiring member 92 can electrically connect the anode of diode D1 and the cathode of diode D2 to the terminal 7421 of the secondary coil 742 of transformer Tr via substrates 81-1 and 81-2.

[0064] Furthermore, the wiring member 92 only needs to be electrically connected to the substrates 81-1 and 81-2, and in the modified example, the wiring member 92 does not need to extend to substrates 81-3 or 81-4.

[0065] The wiring member 93 is fixed to the substrates 81-1 through 81-4 in such a manner that it fits into the notch 813 of the substrate 81-1.

[0066] Similarly, the notches that are in the same rotational position as the notch 813 on substrate 81-1 are the notch 812 on substrate 81-2, the notch 813 on substrate 81-3, and the notch 812 on substrate 81-4.

[0067] Therefore, the wiring member 92 is electrically connected to the conductor pattern 823 on substrate 81-1, to the conductor pattern 822 on substrate 81-2, to the conductor pattern 823 on substrate 81-3, and to the conductor pattern 822 on substrate 81-4.

[0068] The end of the wiring member 93 on the X1 side is electrically connected to the terminal 3162 (see Figure 3) of the rotor coil 316 of the rotating electric machine 3.

[0069] As a result, the wiring member 93 can electrically connect the anodes of diodes D2 and D4 to the terminals 3162 of the rotor coil 316 of the rotating electric machine 3 via substrates 81-2 and 81-4.

[0070] The wiring member 94 is fixed to the substrates 81-1 through 81-4 in such a manner that it fits into the notch 814 of the substrate 81-1.

[0071] Similarly, the notches that are in the same rotational position as the notch 814 on substrate 81-1 are the notch 813 on substrate 81-2, the notch 812 on substrate 81-3, and the notch 811 on substrate 81-4.

[0072] Therefore, the wiring member 94 is electrically connected to the conductor pattern 824 on substrate 81-1, to the conductor pattern 823 on substrate 81-2, to the conductor pattern 822 on substrate 81-3, and to the conductor pattern 821 on substrate 81-4.

[0073] The end of the wiring component 94 on the X1 side is electrically connected to terminal 7422 of the secondary coil 742 of the transformer Tr.

[0074] As a result, the wiring member 94 can electrically connect the anode of diode D3 and the cathode of diode D4 to terminal 7422 of the secondary coil 742 of transformer Tr via substrates 81-3 and 81-4.

[0075] In this way, by devising the arrangement of substrates 81-1 to 81-4, it is possible to use substrates 81-1 to 81-4 with the same substrate configuration while connecting each conductor pattern 821 to 824 to the appropriate connection target (the appropriate connection target for realizing the rectifier circuit 652).

[0076] In the above configuration, the connection configurations of each conductor pattern 821 to 824 are as follows.

[0077] As shown in Figure 7, the conductor pattern 821 is electrically connected to the cathode of diode D1 in the inner layer of substrate 81-1. Although not shown, the conductor pattern 821 is electrically connected to the cathode of diode D1 in the inner layer of substrate 81-3. Although not shown, the conductor pattern 821 is not electrically connected to anything in the inner layer of substrate 81-2 or substrate 81-4.

[0078] As shown in Figure 6, the conductor pattern 822 is electrically connected to the anode of diode D1 in the inner layer of substrate 81-1. Although not shown, the conductor pattern 822 is electrically connected to the cathode of diode D2 in the inner layer of substrate 81-2. Although not shown, the conductor pattern 822 is not electrically connected to anything in the inner layer of substrate 81-3 or substrate 81-4.

[0079] As shown in Figure 7, the conductor pattern 823 is not electrically connected to anything in particular in the inner layer of substrate 81-1. Although not shown, the conductor pattern 823 is electrically connected to the anode of diode D2 in the inner layer of substrate 81-2. Also, although not shown, the conductor pattern 823 is electrically connected to the anode of diode D4 in the inner layer of substrate 81-3. Although not shown, the conductor pattern 823 is not electrically connected to anything in particular in the inner layer of substrate 81-4.

[0080] As shown in Figure 6, the conductor pattern 824 is not electrically connected to anything in the inner layers of substrate 81-1 or substrate 81-2 (not shown). In the inner layers of substrate 81-3 (not shown), the conductor pattern 824 is electrically connected to the anode of diode D3. Also, in the inner layers of substrate 81-4 (not shown), the conductor pattern 824 is electrically connected to the cathode of diode D4.

[0081] Next, with reference to Figures 10 and 11, a preferred example of the fixing structure 150 for substrates 81-3 and 81-4 and wiring members 91 to 94 in the subshaft 3182 will be described.

[0082] Figures 10 and 11 are cross-sectional views of the fixed structure 150. Figure 10 is a cross-sectional view taken from a plane passing through wiring members 92 and 94 and the central axis I, and Figure 11 is a cross-sectional view taken from a plane passing through wiring members 91 and 93 and the central axis I. Figures 10 and 11 are cross-sectional views taken from directions 90 degrees apart around the axis. Note that the diodes D1 to D4 are not shown in Figures 10 and 11.

[0083] As shown in Figures 10 and 11, the subshaft 3182 secures the substrates 81-1 to 81-4 and the wiring members 91 to 94 via a resin molded portion 3184. Specifically, the substrates 81-1 to 81-4 and the wiring members 91 to 94, which are positioned in the recess 31820 of the subshaft 3182, are secured by a resin material (molding resin) injected into the recess 31820. This increases the fixing strength of the substrates 81-1 to 81-4 (and the diodes D1 to D4 mounted thereon) and the wiring members 91 to 94. As a result, the possibility of them detaching from the rotor shaft 318 due to centrifugal force is effectively reduced. Furthermore, by being contained within the recess 31820, the possibility of the substrates 81-1 to 81-4 (and the diodes D1 to D4 mounted thereon) and the wiring members 91 to 94 detaching radially outward from the rotor shaft 318 is effectively reduced.

[0084] Here, as shown in Figure 10, the wiring members 92 and 94 extend linearly in the axial direction, with their X1-side ends exposed from the resin molded portion 3184. The exposed X1-side ends of the wiring members 92 and 94 are joined to terminals 7421 and 7422. As shown in Figure 11, the wiring members 91 and 93 have an L-shape with the X1 side curving radially outward. The radially outward ends of the wiring members 91 and 93 are exposed from the resin molded portion 3184 and joined to terminals 3161 and 3162.

[0085] During assembly, the wiring components 91 to 94 may be placed in the recess 31820 after being assembled to the circuit boards 81-1 to 81-4.

[0086] Although each embodiment has been described in detail above, the invention is not limited to any particular embodiment, and various modifications and changes are possible within the scope described in the claims. Furthermore, it is possible to combine all or more of the components of the embodiments described above.

[0087] For example, in the embodiment described above, the rectifier 72 consists of diodes D2 and D4, but is not limited to this. For example, it may further include a capacitor C, as in the rectifier 72A shown in Figure 12. In this case, the capacitor C, like the diodes D1 to D4, may be built into a separate substrate (not shown) and positioned to pass through the central axis I. [Explanation of Symbols]

[0088] 310 Rotor (wound field rotor), 318 Rotor shaft, 31820 Recess, 312 Rotor core, 70 Power receiving device, D1 to D4 Diodes (rectifier elements), 91 to 94 Wiring components, 81 (81-1 to 81-4) Circuit board, I Central axis (rotor rotation axis)

Claims

1. Rotor shaft and A rotor core around which coil wires are wound, It includes a power receiving device that receives power from a non-rotating power supply device in a non-contact manner, The power receiving device is A rectifier element is provided in a manner that passes through the rotor's axis of rotation, with multiple rectifier elements arranged in the axial direction, A non-contact type wound field rotor comprising a wiring member that electrically connects the power supply device and the coil wire via the rectifier element.

2. A non-contact wound field rotor according to claim 1, wherein a plurality of the rectifier elements are built into a substrate.

3. The power receiving device further comprises multiple substrates arranged in a row in the axial direction, with the direction normal to the substrate surface coinciding with the axial direction. Each of the plurality of rectifier elements is provided on a corresponding one of the plurality of substrates in a manner that passes through the rotation axis of the rotor, The aforementioned wiring member is in the form of a conductor member extending in the axial direction, The non-contact type wound field rotor according to claim 1, wherein the wiring member is electrically connected to the plurality of rectifier elements on the radially outer side of the plurality of substrates.

4. The rotor shaft has an axial recess at its axial end that passes through the rotor's axis of rotation, The non-contact type wound field rotor according to claim 3, wherein the plurality of substrates and the wiring members are resin-molded in the recess.

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