Joining device and joining method

Abstract

This technology provides an improvement in the throughput of bonding equipment used to join dies and substrates. [Solution] The bonding device separates the dies from a carrier that adsorbs a plurality of dies, and bonds the dies and the substrate by facing the bonding surface of the dies and the bonding surface of the substrate toward each other. The bonding device includes a second holding part that holds the substrate with the bonding surface of the substrate facing downward, and a mounting part. The mounting part has a stage that holds the die with the bonding surface of the die facing upward, and a second moving mechanism that moves the stage horizontally relative to the second holding part. The stage has a plurality of lifting units. Each of the plurality of lifting units includes a third holding part that holds the die, and a first lifting shaft that raises and lowers the third holding part. The stage has a first support part that supports the plurality of lifting units, and an adjustment part that adjusts the height and inclination of the first support part.

Description

Technical Field

[0001] The present disclosure relates to a bonding apparatus and a bonding method.

Background Art

[0002] The mounting apparatus described in Patent Document 1 mounts an electronic component held by a bonding head onto a mounting region of a substrate.

Prior Art Literature

Patent Literature

[0003]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0004] One aspect of the present disclosure provides a technique capable of improving the throughput of a bonding apparatus that bonds a die and a substrate.

Means for Solving the Problem

[0005] A bonding apparatus according to one aspect of the present disclosure separates a die from a carrier that adsorbs a plurality of dies, and bonds the die and the substrate with the bonding surface of the die facing the bonding surface of the substrate. The bonding apparatus comprises a first holding part for holding the carrier, a second holding part for holding the substrate with the bonding surface of the substrate facing downward, a pickup part for picking up the die from the carrier, and a mounting part for mounting the die picked up by the pickup part onto the substrate held by the second holding part. The mounting part has a stage for holding the die picked up by the pickup part with the bonding surface of the die facing upward, and a second moving mechanism for moving the stage horizontally relative to the second holding part. The stage has a plurality of lifting units. Each of the plurality of lifting units includes a third holding part for holding the die and a first lifting shaft for raising and lowering the third holding part. The stage has a first support part for supporting the plurality of lifting units and an adjustment part for adjusting the height and inclination of the first support part. [Effects of the Invention]

[0006] According to one aspect of this disclosure, the throughput of a bonding apparatus for bonding a die and a substrate can be improved. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a plan view showing an example of a joining system. [Figure 2] Figure 2 is a cross-sectional view showing an example of a carrier before the die is picked up. [Figure 3] Figure 3 is a cross-sectional view showing an example of a substrate before the die is bonded. [Figure 4] Figure 4 is a cross-sectional view showing an example of a substrate after the die has been bonded. [Figure 5] Figure 5 is a flowchart showing an example of the operation of the joining system. [Figure 6] Figure 6 is a perspective view showing an example of a joining device. [Figure 7]Figure 7 is a perspective view showing an example of die transport in a bonding device. [Figure 8] Figure 8 is a plan view showing an example of die-substrate alignment. [Figure 9] Figure 9 is a cross-sectional view showing an example of a stage. [Figure 10] Figure 10 is a plan view showing an example of a stage. [Figure 11] Figure 11 is a flowchart showing an example of stage operation. [Figure 12] Figure 12 is a cross-sectional view showing an example of step S101. [Figure 13] Figure 13 is a cross-sectional view showing an example of step S102. [Figure 14] Figure 14 is a cross-sectional view showing an example of step S104. [Figure 15] Figure 15 is a cross-sectional view showing an example of step S106. [Figure 16] Figure 16 is a flowchart showing a modified version of Figure 11. [Modes for carrying out the invention]

[0008] Embodiments of this disclosure will be described below with reference to the drawings. In each drawing, identical or similar components are denoted by the same reference numerals, and their descriptions may be omitted. In this specification, the X-axis, Y-axis, and Z-axis directions are perpendicular to each other. The X-axis and Y-axis directions are horizontal, and the Z-axis direction is vertical.

[0009] The X-axis direction includes the positive X-axis direction and the negative X-axis direction, which is the opposite direction to the positive X-axis direction. The Y-axis direction includes the positive Y-axis direction and the negative Y-axis direction, which is the opposite direction to the positive Y-axis direction. The Z-axis direction includes the positive Z-axis direction and the negative Z-axis direction, which is the opposite direction to the positive Z-axis direction. The positive Z-axis direction is upward, and the negative Z-axis direction is downward.

[0010] An example of the bonding system 1 will be described with reference to FIGS. 1 to 4. The bonding system 1 bonds the die D and the substrate W with the bonding surface Da of the die D facing the bonding surface Wa of the substrate W. The die D has the bonding surface Da and a non-bonding surface Db opposite to the bonding surface Da. Further, the substrate W has the bonding surface Wa and a non-bonding surface Wb opposite to the bonding surface Wa. The bonding system 1 repeatedly bonds the dies D and the substrates W, and bonds a plurality of dies D to the substrate W one by one in sequence.

[0011] As shown in FIG. 2, the carrier C adsorbs a plurality of dies D. The carrier C holds each die with the bonding surface Da of each die D facing upward. This enables activation and hydrophilization of the bonding surface Da of each die D. The carrier C includes a carrier substrate C1 and a resin film C2 provided on a surface of the carrier substrate C1 facing the die D. The resin film C2 is in contact with the die D. The carrier C adsorbs the die D by, for example, intermolecular force. Note that the carrier C may electrostatically adsorb the die D. Further, the resin film C2 can be deformed so as to degas from between the die D and the resin film C2, and the die D can also be vacuum-adsorbed onto the resin film C2.

[0012] The carrier substrate C1 has conductivity and is formed of, for example, a silicon wafer. However, the carrier substrate C1 may have insulating properties, and may be formed of, for example, a glass substrate. A first through hole C3 penetrating the carrier substrate C1 in the thickness direction is formed in the carrier substrate C1. By supplying gas to the first through hole C3, the die D can be peeled from the carrier C. Instead of supplying gas to the first through hole C3, a pin (not shown) may be inserted thereinto. The number and arrangement of the first through holes C3 are not particularly limited. One or more first through holes C3 may be formed for each die D. However, the first through hole C3 does not have to be formed in the carrier substrate C1.

[0013] Preferably, the resin film C2 is formed of a flexible material, specifically a material having an elastic modulus of 2 GPa or less, more preferably 0.5 GPa or less. From the viewpoint of durability when modifying the bonding surface Da of the die D, the resin film C2 is preferably formed of, for example, polyimide or EVA (ethylene-vinyl acetate copolymer), and more preferably formed of polyimide. The thickness of the resin film C2 is, for example, 10 μm. Note that although the resin film C2 is a single layer in the present embodiment, it may be a plurality of layers.

[0014] Note that the carrier C may have a configuration different from that shown in FIG. 2. For example, the carrier C may include a frame and a tape covering an opening of the frame, and the die D may be attached onto the tape.

[0015] As shown in FIG. 3, the substrate W includes a semiconductor substrate W1 and a plurality of devices W2 formed on the semiconductor substrate W1. Although the semiconductor substrate W1 is a silicon wafer in the present embodiment, it may be a compound semiconductor wafer. The plurality of devices W2 are formed on the bonding surface Wa. The plurality of devices W2 are partitioned by a plurality of mutually orthogonal streets. Each device W2 includes an electronic circuit. As shown in FIG. 4, the die D is electrically connected to each device W2. Thereafter, the substrate W is cut along the streets and singulated into individual devices W2, whereby a semiconductor device is obtained. The semiconductor device includes the device W2 and the die D. Although the carrier C and the semiconductor substrate W1 are circular, they may be rectangular. A glass substrate may be used instead of the semiconductor substrate W1.

[0016] The die D is obtained by singulating a semiconductor substrate, on which a plurality of devices different from the devices W2 are formed, into individual devices. The electronic circuit of the device of the die D and the electronic circuit of the device W2 of the substrate W are electrically connected. Note that the type and number of dies D electrically connected to one device W2 are not particularly limited. Although not shown, a plurality of dies D may be electrically connected to one device W2.

[0017] As shown in Figure 1, the junction system 1 includes a control circuit 9. The control circuit 9 is, for example, a computer. The control circuit 9 includes an arithmetic unit 91, such as a CPU (Central Processing Unit), and a storage unit 92, such as memory. The storage unit 92 stores programs that control various processes executed in the junction system 1.

[0018] The control circuit 9 controls the operation of the junction system 1 by causing the arithmetic unit 91 to execute a program stored in the memory unit 92. A lower-level control circuit may be provided for each device constituting the junction system 1 to control the operation of that device, and a higher-level control circuit may be provided to comprehensively control multiple lower-level control circuits. The control circuit 9 may be composed of multiple lower-level control circuits and a higher-level control circuit.

[0019] The control circuit 9 includes electronic circuits such as a CPU, GPU (Graphics Processing Unit), FPGA (Field Programmable Gate Array), or ASIC (Application Specific Integrated Circuit), and performs various control operations described in this specification by executing instruction codes stored in memory or by designing the circuit for special applications.

[0020] As shown in Figure 1, the joining system 1 comprises an input / output station 2, a first processing station 3, and a second processing station 5. The input / output station 2, the first processing station 3, and the second processing station 5 are arranged in this order, in a line from the negative X-axis direction to the positive X-axis direction. Although not shown, there may be multiple second processing stations 5, and multiple second processing stations 5 may be arranged in a line from the negative X-axis direction to the positive X-axis direction.

[0021] The loading / unloading station 2 is equipped with a mounting table 20. The mounting table 20 is used to mount a first cassette Cs1, a second cassette Cs2, a third cassette Cs3, and a fourth cassette Cs4. The first cassette Cs1 contains the substrate W before the die D is bonded. The second cassette Cs2 contains the substrate W after the die D has been bonded (i.e., the laminated substrate DW composed of the substrate W and the die D). The third cassette Cs3 contains the carrier C before the die D is picked up. The fourth cassette Cs4 contains the carrier C after the die D has been picked up.

[0022] The loading / unloading station 2 comprises a first transport area 21 and a first transport device 22. The first transport area 21 is adjacent to the mounting table 20. The first transport area 21 extends in the Y-axis direction. The first transport device 22 has a transport arm. The transport arm holds and transports the substrate W and carrier C in the first transport area 21. There may be one or more transport arms. A transport arm for the substrate W and a transport arm for the carrier C may be provided separately. The first transport device 22 has a drive unit (not shown) for moving or rotating the transport arm. The transport arm is capable of moving horizontally (in both the X-axis and Y-axis directions) and vertically (in the Z-axis direction), and rotating about the vertical axis.

[0023] The first processing station 3 includes a first storage device 30. The first storage device 30 is adjacent to the first transport area 21. The first storage device 30 is positioned on the opposite side from the mounting table 20 with respect to the first transport area 21. The first storage device 30 temporarily stores the substrates W and carriers C. The first storage device 30 has a plurality of stages arranged vertically. Each stage places a substrate W or a carrier C on it. The stage for the substrates W and the stage for the carriers C may be provided separately.

[0024] The first processing station 3 comprises a second transport area 31 and a second transport device 32. The second transport area 31 is adjacent to the first storage device 30 and extends from the first storage device 30 in the positive X-axis direction. The second transport device 32 has a transport arm. The transport arm holds and transports the substrate W and carrier C in the second transport area 31. There may be one or more transport arms. A separate transport arm for the substrate W and a separate transport arm for the carrier C may be provided. The second transport device 32 has a drive unit (not shown) for moving or rotating the transport arm. The transport arm is capable of moving horizontally (both in the X-axis direction and the Y-axis direction) and vertically (in the Z-axis direction), and rotating about the vertical axis.

[0025] The first processing station 3 comprises a first activation device 33, a first hydrophilization device 34, a second activation device 35, and a second hydrophilization device 36. The first activation device 33, the first hydrophilization device 34, the second activation device 35, and the second hydrophilization device 36 are adjacent to the second transport area 31 and are provided on the positive or negative Y-axis side of the second transport area 31.

[0026] The first activation device 33 activates the bonding surface Da of the die D while the die D is held in place by the carrier C. The first activation device 33 is, for example, a plasma processing device. In the first activation device 33, for example, oxygen gas, which is the processing gas, is excited and plasma-generated under reduced pressure and then ionized. The bonding surface Da of the die D is activated when oxygen ions are irradiated onto it. The processing gas is not limited to oxygen gas, and may be nitrogen gas, for example.

[0027] The first hydrophilization device 34 hydrophilizes the bonding surface Da of the die D while the die D is held in place by the carrier C. For example, the first hydrophilization device 34 supplies pure water (e.g., deionized water) onto the die D while rotating the carrier C held in the spin chuck. The pure water imparts OH groups to the bonding surface Da of the die D, which has been previously activated. The die D and the substrate W can then be bonded using the hydrogen bonds between the OH groups.

[0028] The second activation device 35 activates the bonding surface Wa of the substrate W. The second activation device 35 is, for example, a plasma processing device. In the second activation device 35, for example, oxygen gas, which is the processing gas, is excited and plasma-generated under reduced pressure and then ionized. The bonding surface Wa of the substrate W is activated when oxygen ions are irradiated onto it. The processing gas is not limited to oxygen gas, and may be nitrogen gas, for example.

[0029] The second hydrophilization device 36 hydrophilizes the bonding surface Wa of the substrate W. For example, the second hydrophilization device 36 rotates the substrate W, which is held in a spin chuck, while supplying pure water (e.g., deionized water) onto the substrate W. The pure water imparts OH groups to the bonding surface Wa of the substrate W, which has been previously activated. The die D and the substrate W can be bonded by utilizing the hydrogen bonds between the OH groups.

[0030] The second processing station 5 includes a second storage device 50. The second storage device 50 is adjacent to the second transport area 31. The second storage device 50 is positioned on the opposite side from the first storage device 30 with respect to the second transport area 31. The second storage device 50 temporarily stores the substrates W and carriers C. The second storage device 50 has a plurality of stages arranged vertically. Each stage places a substrate W or a carrier C on it. The stage for the substrates W and the stage for the carriers C may be provided separately.

[0031] The second processing station 5 comprises a third transport area 51 and a third transport device 52. The third transport area 51 is adjacent to the second storage device 50 and extends from the second storage device 50 in the positive X-axis direction. The third transport device 52 has a transport arm. The transport arm holds and transports the substrate W and carrier C in the third transport area 51. There may be one or more transport arms. A separate transport arm may be provided for the substrate W and a separate transport arm for the carrier C. The third transport device 52 has a drive unit (not shown) for moving or rotating the transport arm. The transport arm is capable of moving horizontally (in both the X-axis and Y-axis directions) and vertically (in the Z-axis direction), and rotating about the vertical axis.

[0032] The second processing station 5 is equipped with a bonding device 60. The bonding device 60 is adjacent to the third transport area 51 and is located on the positive or negative Y-axis side of the third transport area 51. The bonding device 60 separates the die D from the carrier C and bonds the die D and the substrate W with the bonding surface Da of the separated die D facing the bonding surface Wa of the substrate W. Details of the bonding device 60 will be described later.

[0033] Next, an example of a joining method will be described with reference to Figure 5. Steps S101 to S105 shown in Figure 5 are carried out under the control of the control circuit 9. First, the first transport device 22 takes the carrier C from the third cassette Cs3 and transports it to the first storage device 30. Next, the second transport device 32 takes the carrier C from the first storage device 30 and transports it to the first activation device 33.

[0034] Next, the first activation device 33 activates the bonding surface Da of the die D while the die D is held by the carrier C (step S101). After that, the second transport device 32 removes the carrier C from the first activation device 33 and transports it to the first hydrophilization device 34.

[0035] Next, the first hydrophilization device 34 hydrophilizes the bonding surface Da of the die D while the die D is held by the carrier C (step S102). Then, the second conveying device 32 removes the carrier C from the first hydrophilization device 34 and conveys it to the second storage device 50. Subsequently, the third conveying device 52 removes the carrier C from the second storage device 50 and conveys it to the bonding device 60.

[0036] In parallel with the above steps S101 to S102, the following steps S103 to S104 are performed. First, the first transport device 22 takes the substrate W from the first cassette Cs1 and transports it to the first storage device 30. Next, the second transport device 32 takes the substrate W from the first storage device 30 and transports it to the second activation device 35.

[0037] Next, the second activation device 35 activates the bonding surface Wa of the substrate W (step S103). After that, the second transport device 32 removes the substrate W from the second activation device 35 and transports it to the second hydrophilization device 36.

[0038] Next, the second hydrophilization device 36 hydrophilizes the bonding surface Wa of the substrate W (step S104). Then, the second transport device 32 removes the substrate W from the second hydrophilization device 36 and transports it to the second storage device 50. Subsequently, the third transport device 52 removes the substrate W from the second storage device 50 and transports it to the bonding device 60.

[0039] Next, the bonding apparatus 60 separates the die D from the carrier C, and then faces the bonding surface Da of the separated die D toward the bonding surface Wa of the substrate W, thereby bonding the die D to the substrate W (step S105). Note that if multiple dies D are electrically connected to a single device W2, the bonding of the die D to the substrate W is performed separately for each type of die D.

[0040] After the die D is bonded, the substrate W is transported to the second cassette Cs2. First, the third transport device 52 removes the substrate W with the die D bonded from the bonding device 60 and transports it to the second storage device 50. Next, the second transport device 32 removes the substrate W with the die D bonded from the second storage device 50 and transports it to the first storage device 30. Finally, the first transport device 22 removes the substrate W with the die D bonded from the first storage device 30 and stores it in the second cassette Cs2.

[0041] After die D is separated, carrier C is stored in the fourth cassette Cs4. First, the third transport device 52 removes carrier C after die D has been separated from the joining device 60 and transports it to the second storage device 50. Next, the second transport device 32 removes carrier C after die D has been separated from the second storage device 50 and transports it to the first storage device 30. Finally, the first transport device 22 removes carrier C after die D has been separated from the first storage device 30 and stores it in the fourth cassette Cs4.

[0042] An example of the joining device 60 will be described with reference to Figure 6. A third transport area 51 is located on the positive Y-axis side of the illustrated joining device 60. The joining device 60 has a frame 100. The frame 100 has a first frame 101 and a second frame 102. The first frame 101 and the second frame 102 are arranged side-by-side in the horizontal direction (X-axis direction). The first frame 101 and the second frame 102 may be provided as a single unit. The first frame 101 mainly supports the first holding part 110 and the pickup part 140. On the other hand, the second frame 102 mainly supports the second holding part 120 and the mounting part 150.

[0043] The bonding device 60 includes a first holding part 110. The first holding part 110 holds the carrier C. For example, the first holding part 110 holds the carrier substrate C1 from below with the resin film C2 of the carrier C facing upward. The first holding part 110 is, for example, a vacuum suction chuck. The first holding part 110 holds the carrier C horizontally from below with the bonding surface Da of the die D adsorbed to the carrier C facing upward. The bonding device 60 may have a third moving mechanism 111. The third moving mechanism 111 moves the first holding part 110 in the X-axis direction and the Y-axis direction. The third moving mechanism 111 includes, for example, a linear motor.

[0044] The bonding device 60 includes a second holding part 120. The second holding part 120 holds the substrate W. For example, the second holding part 120 holds the substrate W from above with the bonding surface Wa of the substrate W facing downwards. The bonding device 60 may also have a fourth moving mechanism 121. The fourth moving mechanism 121 moves the second holding part 120 in the Y-axis direction. The fourth moving mechanism 121 includes, for example, a Y-axis guide 122, a Y-axis drive unit 123, and a support column 124. A pair of Y-axis guides 122 are provided on either side of the second holding part 120. The Y-axis drive unit 123 moves the second holding part 120 along the pair of Y-axis guides 122. The Y-axis drive unit 123 includes, for example, a linear motor. The support column 124 is fixed to the upper surface of the second frame 102 and supports the Y-axis guides 122 and the Y-axis drive unit 123.

[0045] The bonding apparatus 60 includes a transport unit 130. The transport unit 130 transports the die D from the carrier C held by the first holding unit 110 to the substrate W held by the second holding unit 120. The transport unit 130 includes, for example, a pickup unit 140 and a mounting unit 150. By having the pickup unit 140 and the mounting unit 150 share roles as shown in Figure 7, the transport efficiency of the die D can be improved.

[0046] The pickup unit 140 picks up the die D from the carrier C held by the first holding unit 110 and transports it. The pickup unit 140 has a first suction head 141 and a first moving mechanism 142. The first suction head 141 picks up the die D. The first moving mechanism 142 moves the first suction head 141.

[0047] The first suction head 141 adsorbs, for example, the bonding surface Da of the die D. The first suction head 141 may be in contact with the bonding surface Da of the die D, for example, by vacuum adsorption of the die D. Alternatively, the first suction head 141 may adsorb the die D without contact, so as not to contaminate the bonding surface Da of the die D.

[0048] For example, the first suction head 141 has a suction nozzle (not shown) and an injection nozzle on the surface facing the die D (e.g., the bottom surface). The suction nozzle draws in gas, and the injection nozzle injects gas. The first suction head 141 can non-contact adsorb the die D using the gas injection pressure (positive pressure) and the gas suction pressure (negative pressure). The adsorption method is not particularly limited. Examples of non-contact adsorption methods include the Bernoulli method or the ultrasonic method.

[0049] The first moving mechanism 142 moves the die D together with the first suction head 141. The first moving mechanism 142 includes, for example, a holder 143, an arm 144, an X-axis guide 145, an X-axis drive unit 146, and a support column 147. The holder 143 supports the first suction head 141 and moves in the X-axis direction along the X-axis guide 145 together with the arm 144. The X-axis drive unit 146 moves the first suction head 141 in the X-axis direction. More specifically, the X-axis drive unit 146 moves the holder 143 and the first suction head 141 in the X-axis direction together with the arm 144. The X-axis drive unit 146 includes, for example, a linear motor. The support column 147 is fixed to the upper surface of the first frame 101 and supports the X-axis guide 145 and the X-axis drive unit 146.

[0050] The first moving mechanism 142 may further include at least one of a Y-axis drive unit and a Z-axis drive unit. The Y-axis drive unit moves the first suction head 141 in the Y-axis direction. The Z-axis drive unit moves the first suction head 141 in the Z-axis direction. The Y-axis drive unit and the Z-axis drive unit include, for example, linear motors. The first moving mechanism 142 may further include a rotation drive unit. The rotation drive unit rotates the first suction head 141 around the Z-axis. The rotation drive unit includes, for example, a rotary motor.

[0051] The mounting unit 150 mounts the die D picked up by the pickup unit 140 onto the substrate W held by the second holding unit 120. The mounting unit 150 has a stage 151 and a second moving mechanism 160. The stage 151 holds the die D picked up by the pickup unit 140 with the bonding surface Wa of the die D facing upward. The stage 151 has a first lifting axis for raising and lowering the die D, which will be described in detail later. The second moving mechanism 160 moves the stage 151 relative to the second holding unit 120 in a horizontal direction (for example, in the X-axis direction and the Y-axis direction). In this embodiment, the second moving mechanism 160 moves the stage 151, but it may also move the second holding unit 120, or both the stage 151 and the second holding unit 120.

[0052] The second moving mechanism 160 moves the die D together with the stage 151. The second moving mechanism 160 includes, for example, an X-axis guide 161, an X-axis drive unit 162, a Y-axis guide 163, and a Y-axis drive unit 164. The stage 151 moves in the X-axis and Y-axis directions along the X-axis guide 161 and the Y-axis guide 163. The Y-axis guide 163 is provided in a pair on either side of the X-axis guide 161 and supports the X-axis guide 161 so that it can move freely in the Y-axis direction. The Y-axis guide 163 is fixed to the upper surface of the second frame 102. The X-axis drive unit 162 moves the stage 151 in the X-axis direction. The X-axis drive unit 162 includes, for example, a linear motor. The Y-axis drive unit 164 moves the stage 151 in the Y-axis direction. More specifically, the Y-axis drive unit 164 moves the stage 151 in the Y-axis direction together with the X-axis guide 161. The Y-axis drive unit 164 includes, for example, a linear motor.

[0053] The bonding device 60 preferably includes a pressing section 170. The pressing section 170 assists in the pickup of the die D by the pickup section 140. The pressing section 170 presses the resin film C2, for example, by supplying gas to the first through-hole C3 of the carrier substrate C1. The direction of pressing is the direction in which the die D is picked up (for example, the positive Z-axis direction). The resin film C2 can be deformed only in the vicinity of one of the multiple dies D, a wedge-shaped gap can be formed between the resin film C2 and the die D, and the die D can be smoothly picked up from the resin film C2. Instead of supplying gas to the first through-hole C3, the pressing section 170 may press the resin film C2 by inserting a pin (not shown). The pressing section 170 is provided inside or below the first holding section 110.

[0054] The bonding device 60 includes a control circuit 190. The control circuit 190 is part of the control circuit 9. The control circuit 190 includes, for example, an arithmetic unit such as a CPU and a storage unit such as memory. The storage unit stores a program that controls various processes performed in the bonding device 60. The control circuit 190 controls the operation of the bonding device 60 by causing the arithmetic unit to execute the program stored in the storage unit.

[0055] Referring to Figure 8, an example of alignment between die D and substrate W will be described. Die D has a first mark Dm. Substrate W has multiple devices W2 on its bonding surface Wa that are electrically connected to die D, and each device W2 has a second mark Wm. The bonding apparatus 60 aligns die D and substrate W based on the relative positions of the first mark Dm and the second mark Wm, and then bonds die D and substrate W.

[0056] The first mark Dm is formed, for example, on the bonding surface Da of die D. However, the first mark Dm may also be formed on the non-bonding surface Db of die D. The number and shape of the first marks Dm are not limited to those shown in Figure 8. The first mark Dm may be a dedicated mark or may be part of the electronic circuit of die D.

[0057] The second mark Wm is formed, for example, on the bonding surface Wa of the substrate W. However, the second mark Wm may also be formed on the non-bonding surface Wb of the substrate W. The number and shape of the second marks Wm are not limited to those shown in Figure 8. The second mark Wm may be a dedicated mark or may be part of the electronic circuit of the device W2.

[0058] As shown in Figure 7, the bonding apparatus 60 includes a first imaging unit 181 and a second imaging unit 182. The first imaging unit 181 images the first mark Dm. The second imaging unit 182 images the second mark Wm. Note that imaging of the first mark Dm and the second mark Wm does not have to be performed each time the die D and the substrate W are bonded, but may be performed periodically.

[0059] The first imaging unit 181 and the second imaging unit 182 each have a light source, an optical system, and a camera. The light source generates light. The optical system forms an optical path that irradiates the die D or substrate W with the light generated by the light source. The camera receives the reflected light from the light irradiated by the optical system. The first imaging unit 181 or the second imaging unit 182 may have a switching mechanism. The switching mechanism switches the light that the optical system irradiates the die D or substrate W between a first light and a second light having a different wavelength from the first light. An example of the first light is visible light, and an example of the second light is infrared light.

[0060] Visible light does not penetrate the die D or the substrate W. Therefore, visible light is suitable when the first mark Dm or the second mark Wm is exposed as viewed from the first imaging unit 181 or the second imaging unit 182. On the other hand, near-infrared light penetrates the die D or the substrate W. Therefore, infrared light is suitable when the first mark Dm or the second mark Wm is hidden behind the die D or the substrate W as viewed from the first imaging unit 181 or the second imaging unit 182.

[0061] The first imaging unit 181 is provided, for example, above the stage 151 and fixed to the second holding unit 120. Before bonding the die D and the substrate W, the first imaging unit 181 images the bonding surface Da of the die D held by the stage 151 and images the first mark Dm. The control circuit 190 processes the image captured by the first imaging unit 181 and detects the position of the first mark Dm.

[0062] The second imaging unit 182 is located, for example, below the second holding unit 120 and is moved horizontally together with the stage 151 by the second moving mechanism 160. Before bonding the die D and the substrate W, the second imaging unit 182 images the bonding surface Wa of the substrate W held by the second holding unit 120 and images the second mark Wm. The control circuit 190 processes the image captured by the second imaging unit 182 to detect the position of the second mark Wm.

[0063] The control circuit 190 aligns the die D and the substrate W based on the positions of the first mark Dm and the second mark Wm, and then joins the die D and the substrate W. After joining the die D and the substrate W, the control circuit 190 may control the first imaging unit 181 or the second imaging unit 182 to simultaneously image the first mark Dm and the second mark Wm. Based on the images of the first mark Dm and the second mark Wm taken after the nth joining, the die D and the substrate W may be aligned when performing the (n+1)th joining or subsequent joinings.

[0064] Although not shown in the diagram, a third imaging unit may be provided in addition to the first imaging unit 181 and the second imaging unit 182. The third imaging unit simultaneously images the first mark Dm and the second mark Wm after bonding the die D and the substrate W. The control circuit 190 may align the die D and the substrate W when performing the (n+1)th bonding or subsequent bonding, based on the images of the first mark Dm and the second mark Wm taken after the nth bonding.

[0065] An example of stage 151 will be described with reference to Figures 9 and 10. Stage 151 has a plurality of lifting units 152. Each of the lifting units 152 includes a third holding part 153 for holding the die D and a first lifting shaft 154 for raising and lowering the third holding part 153. The third holding part 153 attracts the non-jointed surface Db of the die D. The third holding part 153 contacts the non-jointed surface Db of the die D, but does not have to. The first lifting shaft 154 includes, for example, a linear motor. An example of a linear motor is a voice coil motor. The first lifting shaft 154 may also include an air cylinder.

[0066] According to this embodiment, multiple dies D can be held simultaneously by multiple third holding units 153. Compared to the case where only one die D can be held, the time during which the pickup unit 140 stops operating until the stage 151 becomes free can be reduced. Therefore, the throughput of the bonding device 60 can be improved. Furthermore, as will be described later, multiple dies D can be raised sequentially by multiple first lifting axes 154, and consequently, multiple dies D can be bonded to the substrate W sequentially. Therefore, for each die D, the first mark Dm and the second mark Wm can be aligned before bonding the die D to the substrate W, as shown in Figure 8.

[0067] The first lifting shaft 154 raises and lowers the third holding part 153 relative to the first support part 155, which will be described later, between a standby position and a joining position above the standby position. The joining position is the position when the die D and the substrate W are joined. The standby position is set so that the suction surface (e.g., the top surface) of the third holding part 153 is aligned with the target plane. However, due to assembly errors of the stage 151, the suction surface of the third holding part 153 may be tilted relative to the target plane, or shifted upward or downward from the target plane, as shown in Figure 9. Furthermore, even if the suction surface of the third holding part 153 coincides with the target plane, the height and inclination of the joining surface Da of the die D may vary due to variations in the thickness of the die D.

[0068] Therefore, the stage 151 has a first support section 155 that supports a plurality of lifting units 152, and an adjustment section 156 that adjusts the height and inclination of the first support section 155. By adjusting the height and inclination of the first support section 155 with the adjustment section 156, the height and inclination of the bonding surface Da of the die D can be adjusted. It is preferable that at least one of the height and inclination of the first support section 155 differs when bonding one die D to a substrate W and when bonding another die D to a substrate W. The adjustment section 156 allows each die D to be bonded to the substrate W in the desired position, and each die D and the substrate W can be bonded with high precision.

[0069] The adjustment unit 156 has a plurality of second lifting shafts 157 that raise and lower the first support unit 155, and a second support unit 158 ​​that supports the plurality of second lifting shafts 157. By using two or more second lifting shafts 157, the height and inclination of the first support unit 155 can be adjusted. The second support unit 158 ​​is moved horizontally (for example, in the X-axis direction and the Y-axis direction) by the second moving mechanism 160 shown in Figure 6.

[0070] The number of second lifting shafts 157 is preferably three or more. With three or more second lifting shafts 157, movement in the Z-axis direction, rotation around the X-axis, rotation around the Y-axis, and rotation around the Z-axis can be performed. From the viewpoint of controllability, the number of second lifting shafts 157 is preferably three or four, and more preferably three. The remaining second lifting shaft 157 is provided at a position off the line connecting two of the second lifting shafts 157.

[0071] The adjustment unit 156 may have a rotating mechanism in addition to, or instead of, the second lifting shaft 157. The rotating mechanism includes a rotary motor.

[0072] The second imaging unit 182 is fixed to the first support unit 155. By adjusting the height and tilt of the first support unit 155 using the adjustment unit 156, the height and tilt of the second imaging unit 182 can be adjusted. The second imaging unit 182 may move horizontally together with the stage 151 by the second moving mechanism 160 shown in Figure 6, and may be fixed to the second support unit 158 ​​instead of the first support unit 155.

[0073] An example of the operation of stage 151 will be described with reference to Figures 11 to 15. The control circuit 190 performs steps S101 to S107 shown in Figure 11.

[0074] As shown in Figure 12, the control circuit 190 aligns the second holding unit 120 and the stage 151 (step S101). Step S101 includes the first imaging unit 181 imaging a reference mark M1 provided on the stage 151, and the second imaging unit 182 imaging a reference mark M2 provided on the second holding unit 120. Although not shown, the first imaging unit 181 and the second imaging unit 182 may both image the same reference mark.

[0075] The control circuit 190 processes the image captured by the first imaging unit 181 to detect the position of the reference mark M1. The control circuit 190 also processes the image captured by the second imaging unit 182 to detect the position of the reference mark M2. By detecting the positions of the reference marks M1 and M2, the control circuit 190 can detect the relative position of the second holding unit 120 and the stage 151 in the horizontal direction (for example, in the X-axis and Y-axis directions).

[0076] After step S101, the control circuit 190 performs the fourth, fifth, sixth, and seventh controls as shown in Figure 13 (step S102). The fourth control includes raising the joint surface Da of one die D higher than the joint surface Da of the remaining die D using one first lifting shaft 154. At this time, one third holding part 153 rises from the standby position to the joint position, while the remaining third holding part 153 remains in the standby position.

[0077] The fifth control includes detecting the inclination and height of the joint surface Da of the die D raised in the fourth control using a detection unit 183. The detection unit 183 includes, for example, a displacement meter. The displacement meter measures the distance to the joint surface Da of the die D. The displacement meter is, for example, a white light interferometer or a laser interferometer. There are three or more measurement points in order to measure the three-dimensional inclination.

[0078] The sixth control includes adjusting the orientation of the joint surface Da of the die D, whose tilt and height were detected in the fifth control, using the adjustment unit 156. For example, the fifth and sixth controls are performed alternately until the joint surface Da of the die D coincides with a desired plane. During this time, one third holding unit 153 remains in the joint position, and the remaining third holding units 153 remain in the standby position. The control circuit 190 stores the adjustment result of the adjustment unit 156 for each die D.

[0079] The seventh control includes capturing an image of the first mark Dm of the die D, which was raised in the fourth control, with the first imaging unit 181. At this time, one of the third holding units 153 remains in the bonding position, and the remaining third holding units 153 remain in the standby position. The control circuit 190 processes the image captured by the first imaging unit 181 to detect the position of the first mark Dm. The detection of the position of the first mark Dm does not have to be performed in step S102, but may be performed by step S106.

[0080] When the first mark Dm of die D is formed on the bonding surface Da of die D, it is preferable that the seventh control is performed after the sixth control. With the bonding surface Da of die D aligned with the desired plane, the first imaging unit 181 can image the first mark Dm. A clear image of the first mark Dm can be obtained, and the position of the first mark Dm can be detected with high accuracy. However, as long as the position of the first mark Dm can be detected, the seventh control may be performed before the sixth control.

[0081] After step S102, the control circuit 190 lowers one of the third holding parts 153 from the joining position to the standby position, and places all of the third holding parts 153 into standby positions. This suppresses collisions between the die D and the substrate W when the stage 151 is moved by the second moving mechanism 160 thereafter.

[0082] In the modified example shown in Figure 16, which will be described later, the control circuit 190 performs steps S104 and S106 while maintaining the first third holding part 153 in the joined position without lowering it from the joined position to the standby position after step S102.

[0083] In the example shown in Figure 11, after step S102, the control circuit 190 checks whether the preparation of all dies D held simultaneously by the stage 151 has been completed (step S103). The preparation of the dies D includes the fourth, fifth, sixth, and seventh controls. Alternatively, the preparation of the dies D may include only the fourth, fifth, and sixth controls, or only the fourth and seventh controls.

[0084] If all dies D are not ready (step S103, NO), the control circuit 190 repeats step S102 to prepare the remaining die D. On the other hand, if all dies D are ready (step S103, YES), the control circuit 190 performs step S104.

[0085] The control circuit 190 performs the eighth control as shown in Figure 14 (step S104). The eighth control includes capturing an image of the second mark Wm of the device W2, which is to be joined with the die D raised in the fourth control, using the second imaging unit 182. The control circuit 190 processes the image captured by the second imaging unit 182 to detect the position of the second mark Wm. The detection of the position of the second mark Wm does not have to be performed in step S104, but may be performed by step S106.

[0086] The control circuit 190 checks whether the preparation of all devices W2 to be bonded with all dies D held simultaneously by the stage 151 has been completed (step S105). The preparation of devices W2 includes the eighth control. When one die D is bonded to one device W2, the total number of dies D imaged in the seventh control is equal to the total number of devices W2 imaged in the eighth control. However, multiple dies D may be bonded to one device W2.

[0087] If all devices W2 are not ready (step S105, NO), the control circuit 190 repeats step S104 to prepare the remaining device W2. On the other hand, if all devices W2 are ready (step S105, YES), the control circuit 190 performs step S106.

[0088] The control circuit 190 performs first, second, and third control as shown in Figure 15 (step S106). The first control includes raising the joint surface Da of one die D higher than the joint surface Da of the remaining die D using one first lifting shaft 154. At this time, one third holding part 153 rises from the standby position to the joint position, while the remaining third holding part 153 remains in the standby position.

[0089] The second control includes adjusting the inclination of the bonding surface Da of the die D raised in the first control using the adjustment unit 156. The second control also includes making the bonding surface Da of the die D raised in the first control parallel to the bonding surface Wa of the substrate W. In addition, in the second control, the height of the bonding surface Da may also be adjusted by the adjustment unit 156.

[0090] The second control includes utilizing the adjustment result of the adjustment unit 156 in the sixth control. Since the adjustment has already been made, the adjustment time can be shortened.

[0091] The third control includes joining the die D, whose tilt was adjusted in the second control, to the substrate W using the adjustment unit 156. The adjustment unit 156 raises the die D, whose tilt was adjusted in the second control, by raising the first support unit 155, and presses it against the substrate W. This joins the die D and the substrate W.

[0092] After step S106, the control circuit 190 checks whether the joining of all dies D held simultaneously by the stage 151 has been completed (step S107). The joining of the dies D includes a first control, a second control, and a third control.

[0093] If the bonding of all dies D is not complete (step S107, NO), the control circuit 190 repeats step S106 to bond the remaining die D. On the other hand, if the bonding of all dies D is complete (step S107, YES), the control circuit 190 terminates the current process.

[0094] Incidentally, step S102 is performed below the first imaging unit 181 or the detection unit 183, while steps S104 and S106 are performed below the second holding unit 120. In other words, the location where step S102 is performed is different from the location where steps S104 and S106 are performed. Therefore, it is preferable that step S102 be performed before steps S104 and S106. The total travel distance and total travel time of the stage 151 by the second moving mechanism 160 can be shortened, and the throughput of the bonding device 60 can be improved.

[0095] As shown in Figure 11, the control circuit 190 repeatedly performs step S102, then repeatedly performs step S104, and then repeatedly performs step S106. This reduces the total travel distance and total travel time of the stage 151 by the second moving mechanism 160, and improves the throughput of the joining device 60.

[0096] However, as shown in Figure 16, the control circuit 190 may repeatedly perform steps S102, S104, and S106 in this order multiple times. In this case, after step S102, the control circuit 190 performs steps S104 and S106 while maintaining the first third holding part 153 in the joined position without lowering it from the joined position to the standby position.

[0097] The method shown in Figure 16 is effective when the operation of the first lifting shaft 154 is not reproducible. Here, "not reproducible" means that when one third holding part 153 is lowered from the joining position to the standby position by one first lifting shaft 154 and then raised back to the joining position, the positional displacement of the third holding part 153 before lowering and after raising is outside the acceptable range. The acceptable range is determined based on the required joining accuracy.

[0098] The method shown in Figure 16 involves performing steps S104 and S106 while maintaining the first third holding part 153 in the joined position without lowering it from the joined position to the standby position after step S102. In other words, the fifth, sixth, seventh, eighth, first, second, and third controls are performed with the first lifting shaft 154, which raised the die D in the preceding fourth control, stopped. Therefore, the reproducibility of the operation of the first lifting shaft 154 is not an issue.

[0099] Furthermore, the adjustment unit 156 adjusts the height of the first support unit 155 so that the die D and the substrate W do not collide when the stage 151 is moved by the second moving mechanism 160. Before the stage 151 is moved, the adjustment unit 156 lowers the first support unit 155, and after the stage 151 is moved, the adjustment unit 156 raises the first support unit 155 back to its original position.

[0100] While embodiments of the joining apparatus and joining method described above have been explained, this disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These also naturally fall within the technical scope of this disclosure. [Explanation of Symbols]

[0101] 60 Bonding equipment 110 1st holding part 120 Second holding part 140 Pickup Unit 150 Mounting section 151 stages 152 Lifting Unit 153 Third holding part 154 First lifting shaft 160 Second movement mechanism C Career D W board

Claims

1. A bonding apparatus that separates the dies from a carrier that adsorbs multiple dies, and bonds the dies and the substrate by facing the bonding surface of the dies and the bonding surface of the substrate toward each other, A first holding part that holds the carrier, The substrate is held by a second holding portion which holds the substrate with the bonding surface of the substrate facing downward, A pickup unit for picking up the die from the carrier, A mounting section for mounting the die picked up by the pickup section onto the substrate held by the second holding section, Equipped with, The mounting section includes a stage that holds the die picked up by the pickup section with the joint surface of the die facing upward, and a second moving mechanism that moves the stage horizontally relative to the second holding section. The aforementioned stage has a plurality of lifting units, Each of the multiple lifting units includes a third holding portion for holding the die and a first lifting shaft for raising and lowering the third holding portion. The stage is a joining device having a first support section that supports a plurality of the lifting units, and an adjustment section that adjusts the height and inclination of the first support section.

2. The joining device according to claim 1, wherein the adjustment unit comprises a plurality of second lifting shafts for raising and lowering the first support unit, and a second support unit for supporting the plurality of second lifting shafts.

3. Equipped with a control circuit, The bonding apparatus according to claim 1, wherein the control circuit performs: a first control that raises the bonding surface of one die higher than the bonding surfaces of the remaining dies using one of the first lifting shafts; a second control that adjusts the inclination of the bonding surface of the die raised in the first control using the adjustment unit; and a third control that bonds the die whose inclination has been adjusted in the second control to the substrate using the adjustment unit.

4. The system includes a detection unit for detecting the inclination of the bonding surface of the die, The bonding apparatus according to claim 3, wherein the control circuit performs a fourth control, which raises the bonding surface of one die higher than the bonding surfaces of the remaining dies using one of the first lifting shafts; a fifth control, which detects the inclination and height of the bonding surface of the die raised in the fourth control using the detection unit; and a sixth control, which adjusts the posture of the bonding surface of the die whose inclination and height were detected in the fifth control using the adjustment unit.

5. The bonding apparatus according to claim 4, wherein the control circuit repeatedly performs the fourth control, the fifth control, and the sixth control in this order multiple times, and then repeatedly performs the first control, the second control, and the third control in this order multiple times.

6. The control circuit repeatedly performs the fourth control, the fifth control, the sixth control, the first control, the second control, and the third control in this order multiple times. The joining apparatus according to claim 4, wherein the fifth control, the sixth control, the first control, the second control, and the third control are performed while the first lifting shaft that raised the die in the preceding fourth control is stopped.

7. The die has a first mark, The substrate has a plurality of devices electrically connected to the die on the bonding surface of the substrate, and each of the devices has a second mark. The bonding apparatus includes a first imaging unit for imaging the first mark and a second imaging unit for imaging the second mark. The control circuit performs a fourth control, which raises the bonding surface of one die higher than the bonding surfaces of the remaining dies using one of the first lifting axes; a seventh control, which images the first mark of the die raised in the fourth control with the first imaging unit; and an eighth control, which images the second mark of the device to be bonded with the die raised in the fourth control with the second imaging unit. The bonding apparatus according to claim 3, wherein the control circuit aligns the die and the device to be bonded using the image captured by the seventh control and the image captured by the eighth control.

8. The bonding apparatus according to claim 7, wherein the control circuit repeatedly performs the fourth control and the seventh control multiple times in this order, then repeatedly performs the eighth control multiple times, and then repeatedly performs the first control, the second control and the third control multiple times in this order.

9. The control circuit repeatedly performs the fourth control, the seventh control, the eighth control, the first control, the second control, and the third control in this order multiple times. The joining apparatus according to claim 7, wherein the seventh control, the eighth control, the first control, the second control, and the third control are performed while the first lifting shaft that raised the die in the preceding fourth control is stopped.

10. A bonding method comprising separating the die from the carrier using a bonding apparatus according to any one of claims 1 to 9, and bonding the die and the substrate with the bonding surface of the die and the bonding surface of the substrate facing each other.

Images