Multilayer electronic components

Abstract

Efficiently dissipating heat generated inside multilayer electronic components. [Solution] A stacked electronic component according to one embodiment of the present invention includes a body including a dielectric layer, first internal electrodes and second internal electrodes arranged alternately with respect to the dielectric layer, and an external electrode connected to the first internal electrode 121 and the second internal electrode 122, wherein the body further includes a first dummy electrode 123 arranged between the first internal electrode and the surface of the body, and a second dummy electrode 124 arranged between the second internal electrode and the surface of the body and spaced apart from the first dummy electrode, wherein the first dummy electrode is positioned closer to the surface of the body than the first internal electrode, and the second dummy electrode is positioned closer to the surface of the body than the second internal electrode.

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products, such as video equipment like liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones and mobile phones, on-board chargers (OBCs) in electric vehicles, and DC-DC converters, and plays the role of charging or discharging electricity.

[0003] MLCCs generate heat due to the flow of current during operation, and excessive heat can accumulate inside the MLCC in all small, high-capacity IT devices and electrical devices operating in high-voltage, high-temperature environments. This accumulated heat can reduce the lifespan and reliability of the MLCC.

[0004] Conventionally, methods have been used to improve heat generation inside MLCCs by increasing the thickness of the internal electrodes. In this case, steps may occur due to the presence or absence of the internal electrode pattern, and such steps can cause the ends of the internal electrodes to warp, potentially leading to cracking of the MLCC.

[0005] Therefore, there is a need to improve the structural characteristics of MLCCs to efficiently dissipate the heat generated inside them, thereby ensuring the lifespan and reliability of the MLCCs, while also suppressing the occurrence of cracks. [Overview of the project] [Problems that the invention aims to solve]

[0006] One of the several objectives of this invention is to efficiently dissipate the heat generated inside a multilayer electronic component.

[0007] One of the several objectives of the present invention is to suppress the occurrence of cracks in multilayer electronic components.

[0008] However, the problems that the present invention aims to solve are not limited to those described above, and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0009] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer, first internal electrodes and second internal electrodes arranged alternately on either side of the dielectric layer, a body including a first and second surface facing each other in a first direction on either side of the dielectric layer, a third and fourth surface connected to the first and second surfaces and facing each other in a direction perpendicular to the first direction, a fifth and sixth surface connected to the first, second, third and fourth surfaces and facing each other in directions perpendicular to the first and second directions, and disposed on the body, The main body includes a first internal electrode and an external electrode connected to the second internal electrode, and further includes a first dummy electrode disposed between the first internal electrode and the surface of the main body, and a second dummy electrode disposed between the second internal electrode and the surface of the main body and spaced apart from the first dummy electrode, wherein the first dummy electrode is positioned closer to the fourth, fifth, and sixth surfaces than the first internal electrode, and the second internal electrode is positioned closer to the third, fifth, and sixth surfaces than the second internal electrode. [Effects of the Invention]

[0010] One of the several effects of the present invention is to efficiently dissipate the heat generated inside the multilayer electronic component.

[0011] One of the several effects of the present invention is to suppress the occurrence of cracks in multilayer electronic components.

[0012] However, the diverse yet beneficial advantages and effects of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Brief explanation of the drawing]

[0013] [Figure 1] A schematic perspective view of a stacked electronic component according to one embodiment of the present invention is shown. [Figure 2] This is a cross-sectional view along the line I-I' in Figure 1. [Figure 3] This is a cross-sectional view along the line II-II' in Figure 1. [Figure 4] This is a plan view showing the configuration of an internal electrode and a dummy electrode according to one embodiment. [Figure 5] This is an enlarged view of region P in Figure 3. [Figure 6] This is an exploded perspective view of the main body according to one embodiment. [Modes for carrying out the invention]

[0014] Embodiments of the present invention will be described below with reference to specific embodiments and accompanying drawings. However, embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person of the ordinary skill. Accordingly, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0015] In order to clearly describe the present invention in the drawings, portions irrelevant to the description are omitted, and the sizes and thicknesses of respective components shown in the drawings are arbitrarily shown for convenience of description, so the present invention is not necessarily limited to those shown in the drawings. Constituent elements having the same function within the scope of the same idea will be described using the same reference numerals. Further, throughout the specification, when a certain portion is described as "comprising" a certain constituent element, this does not exclude other constituent elements, and means that other constituent elements may be further included, unless specifically stated to the contrary.

[0016] In the drawings, the x-direction can refer to the thickness direction, the y-direction can refer to the length direction, and the z-direction can refer to the width direction, and the lamination direction of internal electrodes or dielectric layers can be the thickness direction or the width direction.

[0017] Fig. 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention, Fig. 2 is a cross-sectional view taken along line I-I' of Fig. 1, Fig. 3 is a cross-sectional view taken along line II-II' of Fig. 1, Fig. 4 is a plan view showing the shapes of an internal electrode and a dummy electrode according to an example, Fig. 5 is an enlarged view of a region P in Fig. 3, and Fig. 6 is an exploded perspective view of a main body according to an example.

[0018] Hereinafter, a multilayer electronic component 100 according to an embodiment of the present invention and examples thereof will be described in detail with reference to Figs. 1 to 6.

[0019] A multilayer electronic component 100 according to an embodiment of the present invention includes dielectric layers 111, first internal electrodes 121 and second internal electrodes 122 that are alternately arranged with the dielectric layers 111 interposed therebetween. The first internal electrodes 121 and the second internal electrodes 122 are connected to a first face 1 and a second face 2 opposing each other in a first direction in which the dielectric layers 111 are interposed, and connected to the first face 1 and the second face 2, and have a third face 3 and a fourth face 4 opposing each other in a direction perpendicular to the first direction, and a main body 110 including a fifth face and a sixth face 5, 6 connected to the first face to the fourth face 1, 2, 3, 4 and opposing each other in a direction perpendicular to the first direction and the second direction; and external electrodes 130 and 140 disposed on the main body 110 and connected to the first internal electrodes 121 and the second internal electrodes 122, wherein the main body 110 further includes a first dummy electrode 123 disposed between the first internal electrode 121 and a surface of the main body 110, and a second dummy electrode 124 disposed between the second internal electrode 122 and the surface of the main body 110 and spaced apart from the first dummy electrode 123, the first dummy electrode 123 may be disposed closer to the fourth face, the fifth face 5, and the sixth face 6 than the first internal electrode 121, and the second dummy electrode 124 may be disposed closer to the third face 3, the fifth face 5, and the sixth face 6 than the second internal electrode 122.

[0020] Referring to FIG. 2, the main body 110 may include dielectric layers 111, first internal electrodes 121 and second internal electrodes 122 alternately arranged with the dielectric layers 111 interposed therebetween.

[0021] There is no particular limitation on the specific shape of the main body 110, but as illustrated, the main body 110 may have a hexahedral shape or a shape similar thereto. Due to shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 does not have a perfect hexahedral shape with straight edges, but can substantially have a hexahedral shape.

[0022] The body 110 may have a first surface 1 and a second surface 2 opposed to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposed to each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4 and opposed to each other in a third direction. Here, the first direction may mean the direction in which the first internal electrode 121 and the second internal electrode 122 are arranged with the dielectric layer 111 interposed therebetween, but the present invention is not limited thereto, and the direction in which the first internal electrode 121 and the second internal electrode 122 are arranged with the dielectric layer 111 interposed therebetween may be the second direction or the third direction.

[0023] The dielectric layer 111 included in the body 110 may be formed of a plurality of layers, and in a fired state, boundaries between adjacent dielectric layers 111 may be integrated to such an extent that it is difficult to confirm the boundaries without using a scanning electron microscope (SEM: Scanning Electron Microscope). The number of laminated dielectric layers is not particularly limited, and can be determined in consideration of the size of the multilayer electronic component. For example, the body can be formed by laminating 400 or more dielectric layers.

[0024] The dielectric layer 111 can be formed by producing a ceramic slurry containing ceramic powder, an organic solvent and a binder, applying and drying the slurry on a carrier film to obtain a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate (BaTiO3) based powder can be used as the ceramic powder. As a more specific example, the barium titanate (BaTiO3) based powder includes BaTiO3, (Ba 1-x Ca x )TiO3 (0<x<1), Ba(Ti 1-y Ca y )O3 (0<y<1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0<x<1, 0<y<1) and Ba(Ti 1-y Zry It may be one or more of O₃ (0<y<1).

[0025] On the other hand, since the dielectric layer 111 is in a fired state, the ceramic powder used as the material of the dielectric layer 111 can form dielectric crystal grains and grain boundaries.

[0026] The average thickness td of the dielectric layer 111 can be arbitrarily set according to desired characteristics and applications. As a specific example, the average thickness of the dielectric layer 111 may be 300 nm or more and 10 μm or less. Further, the average thickness of at least one of the plurality of dielectric layers 111 may be 300 nm or more and 10 μm or less.

[0027] The average thickness td of the dielectric layer 111 is obtained based on one dielectric layer adjacent to a point where a center line in the length direction and a center line in the thickness direction of a capacitance forming portion intersect among dielectric layers extracted from an image obtained by scanning, with a scanning electron microscope (SEM, Scanning Electron Microscope), a cross section in a first direction and a second direction obtained by polishing the main body 100 to a central portion in a third direction, and may be an average value of thicknesses measured at 1 / 4, 2 / 4, and 3 / 4 positions obtained by equally dividing the dielectric layer into four parts in the length direction. If such measurement is extended to two upper dielectric layers and two lower dielectric layers equally spaced based on one dielectric layer adjacent to the intersection point of the center line in the length direction and the center line in the thickness direction of the capacitance forming portion, the average thickness of the dielectric layers can be further generalized.

[0028] The internal electrodes 121 and 122 can be alternately arranged in the first direction with the dielectric layer 111 interposed therebetween.

[0029] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are arranged alternately facing each other across the dielectric layer 111 that constitutes the main body 110, and can be connected to the third surface 3 and the fourth surface 4 of the main body 110, respectively. Specifically, one end of the first internal electrode 121 can be connected to the third surface, and one end of the second internal electrode 122 can be connected to the fourth surface. That is, in one embodiment, the internal electrodes 121 and 122 can be in contact with the third surface 3 or the fourth surface 4.

[0030] As shown in Figure 4, the first internal electrode 121 can be separated from the fourth surface 4 and exposed via the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed via the fourth surface 4. The first external electrode 130 can be placed on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 140 can be placed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0031] In other words, the first internal electrode 121 is not connected to the second external electrode 132 but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131 but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance from the third surface 3. In this case, the first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 placed in between.

[0032] The materials used to form the internal electrodes 121 and 122 are not particularly limited, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 may include one or more of the following: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0033] Furthermore, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of the following onto a ceramic green sheet: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys. While screen printing or gravure printing can be used as the printing method for the conductive paste for internal electrodes, the present invention is not limited thereto.

[0034] The average thickness of the internal electrodes 121 and 122 is not particularly limited and can be arbitrarily set according to the desired characteristics and application. For example, the average thickness of the internal electrodes 121 and 122 may be 300 nm or more and 10 μm or less. Alternatively, the average thickness of at least one of the multiple internal electrodes 121 and 122 may be 300 nm or more and 10 μm or less.

[0035] The average thickness te of the internal electrodes 121 and 122 can be calculated by taking the average of the thicknesses measured at the 1 / 4, 2 / 4, and 3 / 4 points, which divide the internal electrodes into four equal parts in the length direction, based on one layer of internal electrodes adjacent to the point where the center line in the length direction and the center line in the thickness direction of the capacitance forming section intersect, extracted from images of the internal electrodes extracted from images scanned with a scanning electron microscope (SEM) of the cross-sections in the first and second directions of the main body 110 polished to the center in the third direction. If such measurements are extended to the two upper and two lower internal electrodes that are equally spaced relative to one layer of internal electrodes adjacent to the point where the center line in the length direction and the center line in the thickness direction of the capacitance forming section intersect, the average thickness of the internal electrodes can be further generalized.

[0036] Referring to Figures 2 and 3, the main body 110 may include a capacitance forming section Ac which is located inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 which are arranged to face each other with a dielectric layer 111 in between, and cover sections 112 and 113 formed on the upper and lower parts of the capacitance forming section Ac in a first direction.

[0037] Furthermore, the capacitance-forming portion Ac is the part that contributes to the capacitance formation of the capacitor, and can be formed by repeatedly stacking a plurality of first internal electrodes 121 and second internal electrodes 122 with a dielectric layer 111 in between.

[0038] The cover portions 112 and 113 can be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, respectively, and can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0039] The cover portions 112 and 113 do not contain internal electrodes and can contain the same material as the dielectric layer 111, for example, a barium titanate (BaTiO3) based ceramic material.

[0040] On the other hand, the thickness of the cover portions 112 and 113 is not particularly limited. For example, the thickness of the cover portions 112 and 113 may be 10 to 300 μm. However, in order to more easily achieve miniaturization and high capacitance of the stacked electronic component, the thickness of the cover portions 112 and 113 may be 15 μm or less.

[0041] The average thickness of the cover portions 112 and 113 can represent the size in the first direction, and can be the average value of the sizes of the cover portions 112 and 113 in the first direction measured at five equally spaced points on the upper or lower part of the volume forming portion Ac.

[0042] Referring to Figure 3, margin portions 114 and 115 can be arranged on both sides of the volume-forming portion Ac in the third direction.

[0043] The margin portions 114 and 115 may include a first margin portion 114 located on the fifth surface 5 of the main body 110 and a second margin portion 115 located on the sixth surface 6. That is, the margin portions 114 and 115 can be located on both end surfaces in the width direction of the main body 110.

[0044] As shown in Figure 3, the margin portions 114 and 115 can refer to the regions between the interface between both ends of the first internal electrode 121 and the second internal electrode 122 and the body 110 in a cross-section obtained by cutting the body 110 in the width-thickness (WT) direction.

[0045] The margins 114 and 115 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0046] The margin portions 114 and 115 may be formed by applying a conductive paste to the ceramic green sheet, except for the areas where the margin portions are formed, to form internal electrodes.

[0047] Furthermore, in order to suppress the step caused by the internal electrodes 121 and 122, after cutting the laminated internal electrodes so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, a single dielectric layer or two or more dielectric layers can be laminated in the third direction (width direction) on both sides of the capacitance forming portion Ac to form margin portions 114 and 115.

[0048] On the other hand, the width of the margin portions 114 and 115 is not particularly limited. For example, the width of the margin portions 114 and 115 may be 5 to 300 μm. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average width of the margin portions 114 and 115 may be 15 μm or less.

[0049] The average width of the margin portions 114 and 115 can represent the average size in the third direction of the region where the internal electrode is separated from the fifth surface, and the average size in the third direction of the region where the internal electrode is separated from the sixth surface, and can be the average value of the sizes of the margin portions 114 and 115 in the third direction measured at five equally spaced points on the side surface of the capacitance forming portion Ac.

[0050] Referring to Figure 1, the external electrodes 130 and 140 can be arranged on the third surface 3 and fourth surface 4 of the main body 110.

[0051] The external electrodes 130 and 140 are arranged on the third surface 3 and fourth surface 4 of the main body 110, respectively, and may include the first external electrode 130 and the second external electrode 140 which are connected to the first internal electrode 121 and the second internal electrode 122, respectively.

[0052] In this embodiment, a structure in which the stacked electronic component 100 has two external electrodes 131 and 132 is described, but the number and shape of the external electrodes 131 and 132 can be changed according to the form of the internal electrodes 121 and 122 or other purposes.

[0053] On the other hand, the external electrodes 130 and 140 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined by considering electrical properties, structural stability, etc., and may also have a multilayer structure.

[0054] For example, the external electrodes 130 and 140 may include electrode layers 131 and 141 placed on the main body 110, and plating layers 132, 133, 142, and 143 placed on the electrode layers 131 and 141.

[0055] As a more specific example for the electrode layers 131 and 141, the electrode layers 131 and 141 may be firing electrodes containing a conductive metal and glass, or resin-based electrodes containing a conductive metal and resin.

[0056] Furthermore, the electrode layers 131 and 141 may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body. Alternatively, the electrode layers 131 and 141 may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode. The electrode layers may also be formed as a plating layer, or as a layer formed using a vapor deposition method such as sputtering or ALD (Atomic Layer Deposition).

[0057] The conductive metal contained in the electrode layers 131 and 141 can be any material with excellent electrical conductivity, and is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys.

[0058] The plating layers 132, 133, 142, and 143 play a role in improving mounting characteristics. The types of plating layers 132, 133, 142, and 143 are not particularly limited and may be plating layers containing one or more of Ni, Sn, Pd, and their alloys, and may be formed in multiple layers.

[0059] As more specific examples for the plating layers 132, 133, 142, and 143, the plating layers may be Ni plating layers or Sn plating layers, and may be in a form in which Ni plating layers and Sn plating layers are sequentially formed on the electrode layer, or may be in a form in which Sn plating layers, Ni plating layers and Sn plating layers are sequentially formed. Furthermore, the plating layers 132, 133, 142, and 143 may include multiple Ni plating layers and / or multiple Sn plating layers. Also, the plating layers 132, 133, 142, and 143 may be in a form in which Ni plating layers and Pd plating layers are sequentially formed on the electrode layers 131 and 141.

[0060] The size of the stacked electronic component 100 is not particularly limited. According to the present invention, it is advantageous for miniaturization and high capacity, so it can be applied to the size of small IT products, and because high reliability can be ensured in various environments, it can also be applied to the size of automotive electronic products where high reliability is required.

[0061] Referring to Figures 2 to 4, the main body 110 may further include a first dummy electrode 123 positioned between the first internal electrode 121 and the fourth surface 4, the fifth surface 5, and the sixth surface 6, and a second dummy electrode 124 positioned between the second internal electrode 122 and the third surface 3, the fifth surface 5, and the sixth surface 6, and positioned at a distance from the first dummy electrode 123.

[0062] Conventionally, methods have been used to improve heat generation inside multilayer electronic components by increasing the thickness of the internal electrodes. In this case, steps may occur due to the presence or absence of the internal electrode pattern, and such steps can cause the ends of the internal electrodes 121 and 122 adjacent to the margin portions 114 and 115 of the main body 110 and the ends of the dielectric layer 111 to warp, potentially causing cracks in the multilayer electronic component.

[0063] Therefore, in one embodiment of the present invention, by arranging dummy electrodes 123 and 124 in the margin between the internal electrodes 121 and 122 and the surface of the main body 110, a heat dissipation path can be formed that allows heat generated inside the main body 110 to be released to the outside of the main body 110. Heat generated inside the main body 110 can be efficiently released to the outside without excessively increasing the thickness of the internal electrodes 121 and 122.

[0064] On the other hand, the warping of the ends of the internal electrodes 121 and 122 and the ends of the dielectric layer 111 due to the step difference may become more severe the closer they are to the surface of the main body 110. However, according to one embodiment of the present invention, the first dummy electrode 123 is positioned even closer to the fourth surface 4, fifth surface 5 and sixth surface 6 than the first internal electrode 121, and the second dummy electrode 124 is positioned even closer to the third surface 3, fifth surface 5 and sixth surface 6 than the second internal electrode 122. Therefore, the effect of mitigating the step difference can be further improved, and the phenomenon of cracks concentrating at the ends of the dielectric layer 111 close to the surface of the main body 110 can be further mitigated.

[0065] Referring to Figure 4, in one embodiment, the first dummy electrode 123 can be arranged to surround at least a portion of the first internal electrode 121, and the second dummy electrode 124 can be arranged to surround at least a portion of the second internal electrode 122. This allows the heat generated by the internal electrodes 121 and 122 to be released through the third surface 3, fourth surface 4, fifth surface 5, and sixth surface 6 of the main body 110, thereby further improving the heat dissipation effect of the present invention.

[0066] Referring to Figure 4, in one embodiment, the first dummy electrode 123 can be continuously arranged between the first internal electrode 121 and the fourth surface 4, fifth surface 5, and sixth surface 6, and the second dummy electrode 124 can be continuously arranged between the second internal electrode 122 and the third surface 3, fifth surface 5, and sixth surface 6. This allows the heat generated by the internal electrodes 121 and 122 to be released through the third surface 3, fourth surface 4, fifth surface 5, and sixth surface 6 of the main body 110, thereby further improving the heat dissipation effect of the present invention.

[0067] Referring to Figure 4, in one embodiment, the first dummy electrode 123 and the second dummy electrode 124 may have different lengths and widths. Specifically, the width WD in the third direction of the region of the first dummy electrode 123 located between the first internal electrode 121 and the fifth surface 5 and the sixth surface 6 may be smaller than the length LD in the second direction of the region of the first dummy electrode 123 located between the first internal electrode 121 and the fourth surface 4. This allows the heat generated in the first internal electrode 121 to be more efficiently dissipated to the region adjacent to the first external electrode 130 containing the conductive metal.

[0068] Similarly, the width in the third direction of the region positioned between the second internal electrode 122 of the second dummy electrode 124 and the fifth surface 5 and the sixth surface 6 may be smaller than the length in the second direction of the region positioned between the second internal electrode 122 of the second dummy electrode 124 and the third surface 3.

[0069] Referring to Figure 4, in one embodiment, when WD is the width in the third direction of the region positioned between the first internal electrode 121 of the first dummy electrode 123 and the fifth and sixth surfaces, and WM is the distance in the third direction from which the first internal electrode separates from the fifth and sixth surfaces, WD / WM can satisfy the condition of 0.05 or more and less than 1. If WD / WM is less than 0.05, the step reduction effect and heat dissipation effect according to the present invention may be somewhat insufficient. There is no need to limit the upper limit of WD / WM, but since the first dummy electrode 123 and the first internal electrode 121 can be positioned separated from each other in the third direction, WD / WM may be less than 1.

[0070] On the other hand, the aforementioned correlation between WD and WM can also be applied to the relationship between the second dummy electrode 124 and the second internal electrode 122.

[0071] In one embodiment, when WS1 is the distance in the third direction between the first internal electrode 121 and the first dummy electrode 123, and WS2 is the distance in the third direction between the first dummy electrode 123 and the fifth surface 5 or the sixth surface 6, the condition WS1 > WS2 can be satisfied. As a result, by positioning the first dummy electrode 123 closer to the fifth surface 5 or the sixth surface 6 than the first internal electrode 121, the effect of mitigating the step difference in the third direction can be further improved.

[0072] In one embodiment, WS1 and WS2 may be 30 μm or more and less than 100 μm. This allows for sufficient formation of the first dummy electrode 123 in the margin portion in the third direction where the first internal electrode 121 is not formed, thereby improving the heat dissipation characteristics of the laminated electronic component 100, achieving a step reduction effect, and preventing overlap between the first internal electrode 121 and the first dummy electrode 123.

[0073] On the other hand, the correlation between WS1 and WS2 described above can also be applied to the relationship between the second dummy electrode 124 and the second internal electrode 122.

[0074] In one embodiment, when the length in the second direction of the region positioned between the first internal electrode and the fourth surface of the first dummy electrode is LD, and the distance in the second direction from the fourth surface of the first internal electrode is LM, then LD / LM can satisfy the condition of 0.05 or more and less than 1. If LD / LM is less than 0.05, the step reduction effect and heat dissipation effect according to the present invention may be somewhat insufficient. There is no need to limit the upper limit of LD / LM, but since the first dummy electrode 123 and the first internal electrode 121 can be positioned separated from each other in the second direction, LD / LM may be less than 1.

[0075] On the other hand, the aforementioned correlation between LD and LM can also be applied to the relationship between the second dummy electrode 124 and the second internal electrode 122.

[0076] In one embodiment, when LS1 is the distance in the second direction between the first internal electrode 121 and the first dummy electrode 123, and LS2 is the distance in the second direction between the first dummy electrode 123 and the fourth surface, it is possible to satisfy LS1 > LS2. As a result, by positioning the first dummy electrode 123 closer to the fourth surface than the first internal electrode 121, the effect of mitigating the step difference in the second direction can be further improved.

[0077] In one embodiment, LS1 and LS2 may be 30 μm or more and less than 100 μm. This allows for sufficient formation of the first dummy electrode 123 in the margin portion in the second direction where the first internal electrode 121 is not formed, thereby improving the heat dissipation characteristics of the laminated electronic component 100, achieving a step reduction effect, and preventing overlap between the first internal electrode 121 and the first dummy electrode 123.

[0078] On the other hand, the correlation between LS1 and LS2 described above can also be applied to the relationship between the second dummy electrode 124 and the second internal electrode 122.

[0079] The WD, WM, WS1, and WS2 described above can be measured by averaging the values ​​measured at two upper and two lower dummy electrodes that are equally spaced with respect to the dummy electrode located in the center of the first direction, or by averaging the values ​​measured at two left and two right areas that are equally spaced with respect to the center of the dummy electrode in the second direction, in an image scanned with a scanning electron microscope (SEM) or optical microscope (OM), etc., of the cross-sections in the first and third directions polished to the center of the second direction of the stacked electronic component 100, or the cross-sections in the second and third directions polished until the dummy electrodes 123 and 124 are exposed, or by averaging the values ​​measured at two left and two right areas that are equally spaced with respect to the center of the dummy electrode in the second direction, but are not limited to these methods.

[0080] The LD, LM, LS1, and LS2 described above can measure the values ​​obtained by scanning an image obtained by scanning the cross-sections of the stacked electronic component 100 in the first and second directions, polished to the center of the third direction, or the cross-sections of the second and third directions, polished until the dummy electrodes 123 and 124 are exposed, using a scanning electron microscope (SEM) or optical microscope (OM), and averaging the values ​​measured at two upper and two lower dummy electrodes that are equally spaced with respect to the dummy electrode located in the center of the first direction, or averaging the values ​​measured at two upper and two lower regions that are equally spaced with respect to the center of the dummy electrode in the third direction, but are not limited to these methods.

[0081] In one embodiment, the distance in the second direction from which the first dummy electrode 123 is separated from the third surface 3, and the distance in the second direction from which the second dummy electrode 124 is separated from the fourth surface 4, may be 30 μm or more and less than 100 μm. This improves the heat dissipation characteristics of the stacked electronic component 100, provides a step-reducing effect, and prevents the dummy electrodes 123 and 124 from being exposed to the outside of the main body 110.

[0082] In one embodiment, the first dummy electrode 123 can be placed on a dielectric layer such as the first internal electrode 121, and the second dummy electrode 124 can be placed on a dielectric layer such as the second internal electrode 122. This reduces the heat dissipation path between the dummy electrodes 123, 124 and the internal electrodes 121, 122, thereby further improving the heat dissipation characteristics.

[0083] The first dummy electrode 123 and the second dummy electrode 124 can be positioned at a distance from the third surface to the sixth surface 2, 3, 4, 5, and 6. This prevents short circuits from occurring between the dummy electrodes 123 and 124 and the external electrodes 130 and 140, and also prevents or mitigates the problem of reduced moisture resistance reliability of the stacked electronic component 100 due to the exposure of the dummy electrodes 123 and 124 to the surface of the main body 110.

[0084] Referring to Figure 5, in one embodiment, when the average thickness of the first internal electrode 121 and the second internal electrode 122 is te, and the average thickness of the first dummy electrode 123 and the second dummy electrode 124 is tu, it is possible to satisfy te > tu. If the specific gravity occupied by the first dummy electrode 123 and the second dummy electrode 124 in the multilayer electronic component 100 is excessive, the dielectric ceramic component of the main body 110 will be insufficient, resulting in a decrease in the interlayer adhesion strength of the dielectric layer 111, which may lead to a problem of reduced mechanical strength of the multilayer electronic component 100. Therefore, in one embodiment, by satisfying te > tu, even when the first dummy electrode 123 and the second dummy electrode 124 are formed, it is possible to ensure a sufficient specific gravity occupied by the dielectric ceramic component in the main body 110, thereby mitigating the phenomenon of reduced mechanical strength of the multilayer electronic component 100.

[0085] The above-mentioned tu can be measured by averaging the values ​​measured in the two upper and two lower regions with respect to a dummy electrode located in the center of the first direction, in an image obtained by scanning the cross-sections in the first and third directions of the stacked electronic component 100, which have been polished up to the center in the second direction, using a scanning electron microscope (SEM) or optical microscope (OM), but is not limited to this.

[0086] In one embodiment, the first dummy electrode 123 and the second dummy electrode 124 may include an oxide containing a conductive metal. Specifically, the first dummy pattern 123 and the second dummy pattern 124 may include one or more of a conductive metal and an oxide of a conductive metal.

[0087] The higher the content of conductive metal in the first dummy electrode 123 and the second dummy electrode 124, the more advantageous it is for improving heat dissipation characteristics. Furthermore, the higher the content of conductive metal oxide in the first dummy electrode 123 and the second dummy electrode 124, the more the bonding strength between the dielectric layer 111 and the first dummy electrode 123 and the second dummy electrode 124 can be improved.

[0088] The type of conductive metal included in the first dummy electrode 123 and the second dummy electrode 124 is not particularly limited, but in one embodiment, the conductive metal may include one or more of nickel (Ni), silver (Ag), aluminum (Al), and copper (Cu).

[0089] In one embodiment, the ratio of oxygen content to conductive metal content in the first dummy electrode 123 and the second dummy electrode 124 may be 0.5 at% or more and 10 at% or less. This makes it possible to simultaneously improve the heat dissipation characteristics of the multilayer electronic component 100 and ensure the interlayer bonding strength between the dielectric layer 111 and the first dummy electrode 123 and the second dummy electrode 124.

[0090] The conductive metal and oxygen content of the first dummy electrode 123 and the second dummy electrode 124 can be analyzed using energy dispersive X-ray spectroscopy (EDS) mode of a scanning electron microscope (SEM), EDS mode of a transmission electron microscope (TEM), or EDS mode of a scanning transmission electron microscope (STEM) in cross-sections in the first and second directions, polished to the center of the second direction of the multilayer electronic component 100. First, a thin analytical sample is prepared using a focused ion beam (FIB) in the area to be measured. Then, the surface damage layer of the thinned sample is removed using xenon (Xe) or argon (Ar) ion milling, and then each component to be measured is mapped using an image obtained with SEM-EDS, TEM-EDS, or STEM-EDS for qualitative / quantitative analysis. In this case, the qualitative / quantitative analysis graphs for each component can be expressed in terms of the content of each element, for example, mass percentage (wt%), atomic percentage (at%), or mole percentage (mol%), and can also represent the content of other specific components relative to the content of a particular component.

[0091] Referring to Figure 6, the first dummy electrode 123 may be formed in each layer on which the first internal electrode 121 is formed, and the second dummy electrode 124 may be formed in each layer on which the second internal electrode 122 is formed. This further improves the heat dissipation characteristics of the stacked electronic component 100 and the crack formation suppression effect.

[0092] Although embodiments of the present invention have been described in detail above, the present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims provided herein. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0093] Furthermore, the expression “one embodiment” as used in this disclosure does not mean that each embodiment is the same as another, but is provided to highlight and illustrate the unique and distinct features of each embodiment. However, the embodiments presented above do not preclude their realization in combination with the features of other embodiments. For example, even if a matter described in one embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment unless there is a contradictory or contrary description of that matter in the other embodiment.

[0094] The terms used in this disclosure are used solely to illustrate one embodiment and are not intended to limit the disclosure. Where otherwise clearly the context indicates otherwise, singular expressions include plural expressions. [Explanation of symbols]

[0095] 100: Stacked Electronic Components 110: Main unit 111: Dielectric layer 121, 122: Internal electrode 123, 124: Dummy electrodes 112:113: Cover section 114, 115: Margin section 130, 140: External electrode 131, 141: Electrode layer 132, 133, 142, 143: Plating layer

Claims

1. A body comprising a dielectric layer, first internal electrodes and second internal electrodes arranged alternately on either side of the dielectric layer, the first internal electrodes and the second internal electrodes facing each other in a first direction on either side of the dielectric layer, a third and fourth surface connected to the first and second surfaces and facing each other in a direction perpendicular to the first direction, and a fifth and sixth surface connected to the first, second, third and fourth surfaces and facing each other in directions perpendicular to the first and second directions, The body includes an external electrode that is positioned on the main body and connected to the first internal electrode and the second internal electrode, The main body further includes a first dummy electrode disposed between the first internal electrode and the surface of the main body, and a second dummy electrode disposed between the second internal electrode and the surface of the main body, spaced apart from the first dummy electrode. A stacked electronic component in which the first dummy electrode is positioned closer to the fourth, fifth, and sixth surfaces than the first internal electrode, and the second dummy electrode is positioned closer to the third, fifth, and sixth surfaces than the second internal electrode.

2. The stacked electronic component according to claim 1, wherein the first dummy electrode is arranged to surround at least a portion of the first internal electrode, and the second dummy electrode is arranged to surround at least a portion of the second internal electrode.

3. The stacked electronic component according to claim 1, wherein the first dummy electrode is continuously arranged between the first internal electrode and the fourth, fifth, and sixth surfaces, and the second dummy electrode is continuously arranged between the second internal electrode and the third, fifth, and sixth surfaces.

4. The width in the third direction of the region positioned between the first internal electrode and the fifth and sixth surfaces of the first dummy electrode is smaller than the length in the second direction of the region positioned between the first internal electrode and the fourth surface of the first dummy electrode. The stacked electronic component according to claim 1, wherein the width in the third direction of the region disposed between the second internal electrode of the second dummy electrode and the fifth and sixth surfaces is smaller than the length in the second direction of the region disposed between the second internal electrode of the second dummy electrode and the third surface.

5. When WD is the width in the third direction of the region positioned between the first internal electrode of the first dummy electrode and the fifth and sixth surfaces, and WM is the distance in the third direction from the first internal electrode to the fifth and sixth surfaces, The stacked electronic component according to claim 1, wherein WD / WM satisfies 0.05 or more and less than 1.

6. When the length in the second direction of the region of the first dummy electrode positioned between the first internal electrode and the fourth surface is LD, and the distance in the second direction from the first internal electrode to the fourth surface is LM, The stacked electronic component according to claim 1, wherein LD / LM satisfies 0.05 or more and less than 1.

7. When WS1 is the distance in the third direction between the first internal electrode and the first dummy electrode, and WS2 is the distance in the third direction between the first dummy electrode and the fifth or sixth surface, A stacked electronic component according to claim 1, satisfying WS1 > WS2.

8. The stacked electronic component according to claim 7, wherein WS1 and WS2 are 30 μm or more and less than 100 μm.

9. When LS1 is the distance in the second direction between the first internal electrode and the first dummy electrode, and LS2 is the distance in the second direction between the first dummy electrode and the fourth surface, A stacked electronic component according to claim 1, satisfying LS1 > LS2.

10. The stacked electronic component according to claim 9, wherein LS1 and LS2 are 30 μm or more and less than 100 μm.

11. The stacked electronic component according to any one of claims 1 to 10, wherein the first dummy electrode is disposed on a dielectric layer such as the first internal electrode, and the second dummy electrode is disposed on a dielectric layer such as the second internal electrode.

12. When the average thickness of the first internal electrode and the second internal electrode is te, and the average thickness of the first dummy electrode and the second dummy electrode is tu, A stacked electronic component according to any one of claims 1 to 10, satisfying te > tu.

13. The stacked electronic component according to any one of claims 1 to 10, wherein the first dummy electrode and the second dummy electrode include an oxide containing a conductive metal.

14. The multilayer electronic component according to claim 13, wherein the ratio of oxygen content to the content of conductive metal included in the first heat dissipation pattern and the second heat dissipation pattern is 0.5 at% or more and 10 at% or less.

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