Multilayer electronic components and their mounting substrates

Abstract

The present invention provides a multilayer electronic component that reduces acoustic noise while offering excellent bending strength and improved fixing strength between external electrodes and metal terminals. [Solution] The stacked electronic component includes a dielectric layer and internal electrodes arranged alternately with the dielectric layer, and comprises a body 110 including a first and second surface facing each other in the X direction, a third and fourth surface connected to the first and second surfaces and facing each other in the Y direction, and a fifth and sixth surface connected to the first to fourth surfaces and facing each other in the Z direction, external electrodes 131, 132 disposed on the third or fourth surface and extending to a part of the first and second surfaces, and metal terminals 141, 142 disposed on the first or second surface and connected to the external electrodes, recesses R1, R2 disposed on the outer surface of the metal terminals in the Y direction, and upper holes and lower holes LH1, LH2 disposed on the upper surface and lower surfaces LS1, LS2 of the metal terminals, respectively, and the upper holes do not have to overlap with the lower holes in the X direction.

Description

[Technical Field]

[0001] This invention relates to a multilayer electronic component and its mounting substrate. [Background technology]

[0002] Multi-Layered Ceramic Capacitors (MLCCs), a type of multilayer electronic component, are chip-type capacitors mounted on printed circuit boards of various electronic products such as LCDs (Liquid Crystal Displays) and PDPs (Plasma Display Panels), computers, smartphones, and mobile phones, where they play the role of charging or discharging electricity. MLCCs are used as components in a wide range of electronic devices due to their advantages of being small, yet guaranteeing high capacitance, and being easy to mount.

[0003] Because the dielectric layer of an MLCC (Multilayer Cellular Capacitor) is piezoelectric, it vibrates when a voltage is applied to it. This vibration is transmitted to the printed circuit board via solder, generating vibration noise. This vibration noise can correspond to an audible frequency that is unpleasant to humans, and is called acoustic noise. Furthermore, regardless of whether the user perceives it or not, if piezoelectric vibration of an MLCC occurs in the high-frequency range of 20 kHz or higher, it can cause malfunctions in various sensors used in the IT and electronics industries.

[0004] Conventionally, methods have been proposed to reduce acoustic noise by either installing bumps on the external electrodes or installing an interposer between the MLCC and the printed circuit board. However, installing bumps on the external electrodes may reduce the bending strength of the MLCC, and the bonding strength between the external electrodes and the bumps must be further considered. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Korean Published Patent Publication 10-2020-0125456 [Overview of the project] [Problems that the invention aims to solve]

[0006] One of the several objectives of the present invention is to provide a laminated electronic component that exhibits excellent bending strength while reducing acoustic noise.

[0007] One of the several objectives of the present invention is to provide a multilayer electronic component with improved fixing strength between external electrodes and metal terminals.

[0008] However, the objectives of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0009] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and internal electrodes arranged alternately with the dielectric layer, and comprises a body including first and second surfaces facing each other in the thickness direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the length direction, fifth and sixth surfaces connected to the first, second, third and fourth surfaces and facing each other in the width direction, an external electrode disposed on the third or fourth surface and extending to a part of the first and second surfaces, and a metal terminal disposed on the first or second surface and connected to the external electrode, wherein a recess is provided on the outer surface of the metal terminal in the length direction, and an upper hole and a lower hole are provided on the upper and lower surfaces of the metal terminal, respectively, and the upper hole does not have to overlap with the lower hole in the thickness direction. [Effects of the Invention]

[0010] One of the various effects of the present invention is that it is possible to provide a laminated electronic component that has excellent bending strength while reducing acoustic noise.

[0011] As one of the various effects of the present invention, it is possible to provide a multilayer electronic component with improved bonding strength between an external electrode and a metal terminal. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] [Figure 1] FIG. 1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 2] FIG. 2 is an exploded perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention. [Figure 3] FIG. 3 is a cross-sectional view schematically showing a cut cross-section of a main body and an external electrode. [Figure 4] FIG. 4 is a cross-sectional view schematically showing a cut cross-section taken along line I-I' of FIG. 1. [Figure 5] FIG. 5 is a cross-sectional view schematically showing a cut cross-section taken along line II-II' of FIG. 1. [Figure 6] FIG. 6 is a cross-sectional view schematically showing a state where the multilayer electronic component shown in FIG. 5 is mounted on a printed circuit board. [Figure 7] FIG. 7 is a plan view of (a) a first metal terminal and (b) a second metal terminal of FIG. 1 as viewed from above. [Figure 8] FIG. 8 is a plan view of (a) a first metal terminal and (b) a second metal terminal according to another embodiment of the present invention, corresponding to FIG. 7. [Figure 9] FIG. 9 is a plan view of (a) a first metal terminal and (b) a second metal terminal according to another embodiment of the present invention, corresponding to FIG. 7. [Figure 10] FIG. 10 is a plan view of (a) a first metal terminal and (b) a second metal terminal according to another embodiment of the present invention, corresponding to FIG. 7. [Figure 11] FIG. 11 is a plan view of (a) a first metal terminal and (b) a second metal terminal according to another embodiment of the present invention, corresponding to FIG. 7. [Figure 12] FIG. 12 is a plan view of (a) a first metal terminal and (b) a second metal terminal according to another embodiment of the present invention, corresponding to FIG. 7. [Figure 13]This graph shows the measured adhesion strength of the comparative example, Example 1, and Example 2. [Figure 14] This is a schematic perspective view showing a stacked electronic component according to another embodiment of the present invention. [Figure 15] This is a schematic cross-sectional view showing a section along the line III-III' in Figure 14. [Figure 16] Figure 14 shows (a) the first metal terminal and (b) the second metal terminal as viewed from above. [Figure 17] This figure is a plan view of (a) a first metal terminal and (b) a second metal terminal of another embodiment of the present invention, corresponding to Figure 16. [Figure 18] This figure is a plan view of (a) a first metal terminal and (b) a second metal terminal of another embodiment of the present invention, corresponding to Figure 16. [Figure 19] This figure is a plan view of (a) a first metal terminal and (b) a second metal terminal of another embodiment of the present invention, corresponding to Figure 16. [Modes for carrying out the invention]

[0013] Embodiments of the present invention will be described below with reference to specific embodiments and accompanying drawings. However, embodiments of the present invention can be modified into various different forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person of ordinary skill. Therefore, the shapes and sizes of elements in the drawings may be exaggerated for the sake of clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0014] Furthermore, in order to clearly illustrate the present invention in the drawings, parts unrelated to the explanation have been omitted, and the size and thickness of each component shown in the drawings are shown arbitrarily for the convenience of explanation; therefore, the present invention is not necessarily limited to what is shown. Components with the same function within the scope of the same concept will be described using the same reference numerals. Moreover, throughout the specification, when a part is said to "include" a component, this does not mean that other components are excluded, but rather that other components may be included, unless otherwise stated.

[0015] In drawings, the X direction can be defined as the thickness (T) direction, the Y direction as the length (L) direction, and the Z direction as the width (W) direction.

[0016] 1. First Embodiment Multilayer electronic components Figure 1 is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention; Figure 2 is a schematic exploded perspective view of a stacked electronic component according to one embodiment of the present invention; Figure 3 is a schematic cross-sectional view showing the cross-section of the main body and external electrodes; Figure 4 is a schematic cross-sectional view showing the cross-section along line I-I' in Figure 1; Figure 5 is a schematic cross-sectional view showing the cross-section along line II-II' in Figure 1; Figure 6 is a schematic cross-sectional view showing the stacked electronic component shown in Figure 5 mounted on a printed circuit board; and Figure 7 is a plan view of (a) the first metal terminal and (b) the second metal terminal of Figure 1 as seen from above.

[0017] Hereinafter, with reference to Figures 1 to 7, a multilayer electronic component 100 according to one embodiment of the present invention will be described in detail. Furthermore, a multilayer ceramic capacitor will be described as an example of a multilayer electronic component, but the present invention is not limited thereto and can be applied to various multilayer electronic components, such as inductors, piezoelectric elements, varistors, or thermistors.

[0018] The length of the stacked electronic component 100 may be greater than its width and thickness, but the present invention is not limited thereto. For example, the length of the stacked electronic component 100 may be less than its width. The width of the stacked electronic component 100 may be less than or greater than its thickness, and this may vary depending on the specifications and characteristics of the stacked electronic component 100.

[0019] The stacked electronic component 100 may include a main body 110, external electrodes 131 and 132, and metal terminals 141 and 142.

[0020] There are no particular restrictions on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be a hexahedron or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, or due to the polishing process on the corners of the main body 110, the main body 110 may not be a perfectly straight hexahedron, but may have a substantially hexahedron shape.

[0021] The main body 110 may have a first surface 1 and a second surface 2 facing each other in the thickness direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in the length direction, a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and facing each other in the width direction.

[0022] The main body 110 may include dielectric layers 111 and internal electrodes 121 and 122 arranged alternately with the dielectric layers 111. The multiple dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0023] The dielectric layer 111 may mainly consist of a perovskite-type compound represented by ABO3, for example. The perovskite-type compound represented by ABO3 is, for example, BaTiO3, (Ba 1-x Ca x )TiO3(0 <x<1)、Ba(Ti 1-y Cay )O3(0<y<1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3(0<x<1, 0<y<1), Ba(Ti 1-y Zr y )O3(0<y<1), CaZrO3 and (Ca 1-x Sr x )(Zr 1-y Ti y )O3, may include one or more selected from the group consisting of where 0<x≦0.5 and 0<y≦0.5.

[0024] The average thickness of the dielectric layer 111 may be, for example, 0.1 μm to 20 μm, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm.

[0025] The main body 110 may include a capacitance forming portion Ac that forms a capacitance, the capacitance forming portion Ac including first internal electrodes 121 and second internal electrodes 122 alternately arranged with the dielectric layers 111 interposed therebetween. The lamination direction of the internal electrodes 121 and 122 may be a thickness direction or a width direction. In the present invention, description will be made based on an embodiment in which the lamination direction of the internal electrodes 121 and 122 is the thickness direction.

[0026] The first internal electrode 121 is spaced apart from the fourth surface 4, and may be connected to the first external electrode 131 at the third surface 3. The second internal electrode 122 is spaced apart from the third surface 3, and may be connected to the second external electrode 132 at the fourth surface 4.

[0027] The conductive metal included in the internal electrodes 121 and 122 may be one or more selected from Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti and alloys thereof, and more preferably may include Ni, but the present invention is not limited thereto.

[0028] The average thickness of the internal electrodes 121 and 122 may be, for example, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0029] The average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121 and 122 can be measured by scanning the cross-section (hereinafter referred to as the LT cross-section) of the multilayer electronic component 100 in the length direction and thickness direction with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average thickness of the dielectric layer 111 can be measured by measuring the thickness at multiple points on one dielectric layer 111, for example, at five points equally spaced in the length direction, and then taking the average value. Similarly, the average thickness of the internal electrodes 121 and 122 can be measured at multiple points on one internal electrode 121 or 122, for example, at five points equally spaced in the length direction, and then taking the average value. The five equally spaced points can be specified in the capacitance forming section Ac. If such average value measurements are performed for 10 dielectric layers 111 and 10 internal electrodes 121 and 122, and then the average value is measured, the average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121 and 122 can be further generalized.

[0030] The main body 110 may include cover portions 112 and 113 arranged on both sides facing each other in the thickness direction of the capacitance forming portion Ac, and margin portions 114 and 115 arranged on both sides facing each other in the width direction of the capacitance forming portion Ac. The cover portions 112 and 113 and the margin portions 114 and 115 may have a configuration similar to that of the dielectric layer 111, except that they do not include internal electrodes.

[0031] The average thickness of the cover portions 112 and 113 may be, for example, 150 μm or less, 100 μm or less, 30 μm or less, or 20 μm or less. The average thickness of the cover portions 112 and 113 may be, for example, 5 μm or more, 10 μm or more, or 30 μm or more. Here, the average thickness tc of the cover portions 112 and 113 refers to the average thickness of the first cover portion 112 and the second cover portion 113, respectively. The average thickness tc of the cover portions 112 and 113 may be the average value of the thickness measured at five equally spaced points in the LT cross-section of the stacked electronic component 100.

[0032] The average width of the margin portions 114 and 115 may be, for example, 150 μm or less, 100 μm or less, 20 μm or less, or 15 μm or less. The average width of the margin portions 114 and 115 may be, for example, 5 μm or more, 10 μm or more, or 30 μm or more. Here, the average width of the margin portions 114 and 115 refers to the average width of the first margin portion 114 and the second margin portion 115, respectively. The average width of the margin portions 114 and 115 may be the average value of the widths measured at five equally spaced points in the cross section (WT cross section) of the multilayer electronic component 100 in the width direction and thickness direction.

[0033] External electrodes 131 and 132 are positioned on the third surface 3 or the fourth surface 4 and may extend over portions of the first surface 1 and the second surface 2. The external electrode 131 may include, for example, a first external electrode 131 positioned on the third surface 3 and extending over portions of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6, and a second external electrode 132 positioned on the fourth surface 4 and extending over portions of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6.

[0034] Of the first external electrode 131, the region located on the third surface 3 can be defined as the first connection portion CP1, and the regions extending from the first connection portion CP1 and located on the first surface 1 and the second surface 2 can be defined as the first band portion BP1. Of the second external electrode 132, the region located on the fourth surface 4 can be defined as the second connection portion CP2, and the regions extending from the second connection portion CP2 and located on the first surface 1 and the second surface 2 can be defined as the second band portion BP2.

[0035] The type and form of the external electrodes 131 and 132 are not particularly limited and may have a multilayer structure. For example, the external electrodes 131 and 132 may include underlay electrode layers 131a and 132a that come into contact with the internal electrodes 121 and 122, and plating layers 131b and 132b placed on the underlay electrode layers 131a and 132a.

[0036] The base electrode layers 131a and 132a may include a fired electrode layer containing metal and glass. The metal included in the fired electrode layer may include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, and / or alloys containing them. The glass included in the fired electrode layer may include, for example, one or more oxides of Ba, Ca, Zn, Al, B, and Si.

[0037] On the other hand, the base electrode layers 131a and 132a may consist only of a fired electrode layer, but the present invention is not limited thereto, and the base electrode layers 131a and 132a may also include a fired electrode layer containing metal and glass, and a resin electrode layer disposed on the fired electrode layer containing metal particles and resin.

[0038] The metal particles contained in the resin electrode layer may include one or more spherical particles and flake-shaped particles. The metal particles contained in the resin electrode layer may include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn and / or alloys containing them. The resin contained in the resin electrode layer may include, for example, one or more epoxy resin, acrylic resin, and ethylcellulose.

[0039] The metal layers 131b and 132b may include, for example, Ni, Sn, Pd, and / or alloys containing them, and may be formed in multiple layers. The metal layers 131b and 132b may be, for example, Ni-plated layers or Sn-plated layers, and may be formed in a manner in which the Ni-plated layers and Sn-plated layers are formed sequentially. The metal layers 131b and 132b may also include multiple Ni-plated layers and / or multiple Sn-plated layers.

[0040] The drawings illustrate a structure in which the stacked electronic component 100 has two external electrodes 131 and 132, but it is not limited to this, and the number and shape of the external electrodes 131 and 132 can be changed according to the form of the internal electrodes 121 and 122 or other purposes.

[0041] The metal terminals 141 and 142 can be arranged on the first surface 1 or the second surface 2 and connected to the external electrodes 131 and 132. The first metal terminal 141 may be arranged on the first surface 1 or the second surface 2 and connected to the first external electrode 131, and the second metal terminal 142 may be arranged on the first surface 1 or the second surface 2 and connected to the second external electrode 132. Specifically, the metal terminals 141 and 142 can be connected to the band portions BP1 and BP2.

[0042] Referring to Figures 4 and 5, a first conductive adhesive 151 can be placed between the first external electrode 131 and the first metal terminal 141. A second conductive adhesive (not shown) can be placed between the second external electrode 132 and the second metal terminal 142. The conductive adhesive 151 may be, for example, solder or a conductive epoxy resin.

[0043] The metal terminals 141 and 142 essentially serve to sufficiently separate the main body 110 from the printed circuit board, preventing piezoelectric vibrations generated in the main body 110 from being transmitted to the printed circuit board. The material of the metal terminals 141 and 142 may be a metallic component, and since metallic components have better ductility than ceramic components, they can effectively absorb piezoelectric vibrations generated in the main body 110 and reduce the acoustic noise of the multilayer electronic component 100.

[0044] Recesses R1 and R2 can be provided on the metal terminals 141 and 142. The first metal terminal 141 may have a first recess R1, and the second metal terminal 142 may have a second recess R2. Referring to Figure 7, the recesses R1 and R2 can be provided on the longitudinal outer surfaces OS1 and OS2 of the metal terminals 141 and 142.

[0045] Referring to Figure 7, the recesses R1 and R2 can have a shape that is recessed toward the inner surfaces IS1 and IS2 in the longitudinal direction of the metal terminals 141 and 142. However, the present invention is not limited thereto, and the longitudinal and widthwise cross-sections (LW cross-sections) of the recesses R1 and R2 may have a rectangular shape.

[0046] When mounting the multilayer electronic component 100 onto a printed circuit board using a conductive mounting agent, the recesses R1 and R2 can function as solder pockets by providing spaces into which molten conductive mounting agent can be filled. This reduces the height of the solder fillet formed when the conductive mounting agent travels up the external electrodes 131 and 132 and rises in the thickness direction. This blocks the transmission path of piezoelectric vibrations generated in the main body 110, thereby reducing the acoustic noise of the multilayer electronic component 100.

[0047] Referring to Figure 2, upper holes UH1 and UH2 can be located on the upper surfaces US1 and US2 of the metal terminals 141 and 142. Referring to Figure 1, lower holes LH1 and LH2 may be located on the lower surfaces LS1 and LS2 of the metal terminals 141 and 142. The first metal terminal 141 includes a first upper hole UH1 and a first lower hole LH1 located on the upper surface US1 and the lower surface LS1, respectively, and the second metal terminal 142 may include a second upper hole UH2 and a second lower hole LH2 located on the upper surface US2 and the lower surface LS2, respectively. The upper holes UH1 and UH2 and the lower holes LH1 and LH2 have a configuration that does not completely penetrate the metal terminals 141 and 142, and can, for example, have the form of blind holes.

[0048] By including upper holes UH1 and UH2 and lower holes LH1 and LH2, the stiffness of the metal terminals 141 and 142 can be reduced, thereby improving the bending strength of the laminated electronic component 100.

[0049] Furthermore, the upper holes UH1 and UH2 can increase the contact area between the metal terminals 141 and 142 and the conductive adhesive, thereby improving the bonding strength between the external electrodes 131 and 132 and the metal terminals 141 and 142. For example, referring to Figure 4, the first conductive adhesive 151 can fill at least a portion of the first upper hole UH1.

[0050] The lower holes LH1 and LH2 can increase the contact area between the metal terminals 141 and 142 and the conductive mounting material, thereby improving the adhesion strength between the metal terminals 141 and 142 and the printed circuit board.

[0051] According to one embodiment of the present invention, the upper holes UH1 and UH2 do not have to overlap with the lower holes LH1 and LH2 in the thickness direction. Specifically, the first upper hole UH1 does not have to overlap with the first lower hole LH1 in the thickness direction, and the second upper hole UH2 does not have to overlap with the second lower hole LH2 in the thickness direction. This allows each upper hole UH1, UH2 and lower holes LH1, LH2 to have sufficient depth, and the contact area between the metal terminals 141, 142 and the conductive adhesive and the contact area between the metal terminals 141, 142 and the conductive mounting material can be sufficiently increased.

[0052] In one embodiment, multiple upper holes UH1, UH2 and multiple lower holes LH1, LH2 may be arranged, and the multiple upper holes UH1, UH2 do not have to overlap with the multiple lower holes LH1, LH2 in the thickness direction. The number of upper holes UH1, UH2 and lower holes LH1, LH2 is not particularly limited, and there may be two or more, three or more, four or more, or five or more of each. By ensuring that each of the multiple upper holes UH1, UH2 does not overlap with the multiple lower holes LH1, LH2 in the thickness direction, the improvement in bending strength and fixing strength of the present invention may become even more pronounced.

[0053] Referring to Figures 4 to 6, the first metal terminal 141 may include a first metal core MC and a first plating layer PL disposed on the first metal core MC. Similarly, the second metal terminal 142 may include a second metal core (not shown) and a second plating layer (not shown) disposed on the second metal core. The first plating layer PL may be disposed, for example, to cover the outer surface of the first metal core MC, and the first plating layer PL may extend into the interior of the first upper hole UH1 and the first lower hole LH1. The first plating layer PL may extend into the interior of each of the multiple first upper holes UH1 and the multiple first lower holes LH1. This allows the first conductive bonding agent 151 to flow sufficiently into the interior of the first upper hole UH1 via the first plating layer PL.

[0054] The metal core MC may include, for example, one or more of Cu, Ni, Ag, Sn, Pt, Pd, Fe, Al, and their alloys, phosphor bronze, and stainless steel. The plating layer PL may include, for example, one or more of Ni, Sn, and Au. The plating layer PL may be formed of multiple layers and may include sequentially stacked Ni plating layers and Sn plating layers.

[0055] Mounting board for multilayer electronic components The mounting substrate 300 for a stacked electronic component according to one embodiment of the present invention will be described below with reference to Figure 6. A redundant explanation of the configuration of the stacked electronic component 100 described above will be omitted.

[0056] Referring to Figure 6, the mounting substrate 300 for the multilayer electronic component may include a printed circuit board 310 including electrode pads 320. The printed circuit board 310 may include, for example, a resin such as glass epoxy or a ceramic such as glass ceramic. The printed circuit board 310 may have, for example, a configuration in which multiple insulating layers are laminated. The printed circuit board 310 may include a first electrode pad 320 connected to a first external electrode 131, and a second electrode pad (not shown) connected to a second external electrode.

[0057] The mounting substrate 300 for the stacked electronic component may include a conductive mounting agent 330 placed between the electrode pads 320 and the metal terminals 141. The conductive mounting agent 330 may be, for example, bonding solder, and may contain at least one of tin (Sn), antimony (Sb), cadmium (Cd), lead (Pb), zinc (Zn), aluminum (Al), and copper (Cu), but the present invention is not limited thereto.

[0058] According to one embodiment, the conductive mounting agent 330 can fill at least a portion of the lower hole LH1 located on the lower surface LS1 of the metal terminal 141. This improves the adhesion strength between the metal terminal 141 and the printed circuit board, and provides a mounting substrate 300 for a stacked electronic component on which the stacked electronic component 100 is stably mounted.

[0059] Various variations of metal terminals Figures 8 to 12 are plan views of (a) a first metal terminal and (b) a second metal terminal of another embodiment of the present invention, corresponding to Figure 7. Various modifications of the metal terminals will be described below with reference to Figures 7 to 12. Each modification will be described separately, but redundant explanations will be omitted.

[0060] Referring to Figure 7, the multiple upper holes UH1 and UH2 may be positioned closer to the inner surfaces IS1 and IS2 in the longitudinal direction of the metal terminals 141 and 142 than the multiple lower holes LH1 and LH2. The multiple upper holes UH1 and UH2 may be positioned closer to the central part of the metal terminals 141 and 142 in the width direction than the multiple lower holes LH1 and HL2. The multiple upper holes UH1 and UH2 may be positioned spaced apart from each other in the width direction, and the multiple lower holes LH1 and LH2 may be positioned spaced apart from each other in the width direction. The distance in the width direction between the multiple upper holes UH1 and UH2 may be shorter than the distance in the width direction between the multiple lower holes LH1 and LH2.

[0061] Referring to Figure 8, multiple upper holes UH1, UH2 and multiple lower holes LH1, LH2 may be arranged in each of the metal terminals 141a, 142a. Multiple lower holes LH1, LH2 may be arranged more adjacent to the inner surfaces IS1, IS2 in the longitudinal direction of the metal terminals 141a, 142a than multiple upper holes UH1, UH2. Multiple lower holes LH1, LH2 may be arranged more adjacent to the center of the metal terminals 141a, 142a in the width direction than multiple upper holes UH1, UH2. Multiple upper holes UH1, UH2 may be arranged spaced apart from each other in the width direction, and multiple lower holes LH1, LH2 may be arranged spaced apart from each other in the width direction. The distance in the width direction between multiple lower holes LH1, LH2 may be shorter than the distance in the width direction between multiple upper holes UH1, UH2. In other words, the metal terminals 141a and 142a shown in Figure 8 may have the upper and lower holes in the opposite positions to those of the metal terminals 141 and 142 shown in Figure 7.

[0062] Referring to Figure 9, multiple upper holes UH1, UH2 and lower holes LH1, LH2 can be arranged in the metal terminals 141b and 142b, respectively. In one embodiment, the upper holes UH1, UH2 and the lower holes LH1, LH2 can be arranged alternately around the recesses R1, R2 when viewed in the thickness direction.

[0063] In Figures 7 to 9, the cross-sections of the upper holes UH1 and UH2 and the lower holes LH1 and LH2 may be circular or elliptical, but the present invention is not limited thereto.

[0064] In Figure 9, the upper holes UH1 and UH2 are positioned adjacent to the longitudinal inner surfaces IS1 and IS2 of the metal terminals 141b and 142b, and the lower holes LH1 and LH2 are positioned adjacent to the longitudinal outer surfaces OS1 and OS2 of the metal terminals 141b and 142b. However, the present invention is not limited to this. For example, the positions of the upper holes UH1 and UH2 and the lower holes LH1 and LH2 can be reversed. In this case, the upper holes may be positioned adjacent to the longitudinal outer surfaces of the metal terminals, and the lower holes may be positioned adjacent to the longitudinal inner surfaces of the metal terminals.

[0065] Referring to Figure 10, the metal terminals 141c and 142c may include main portions M1 and M2 that are longitudinally opposite to the recess portions R1 and R2, and extension portions E1 and E2 that are positioned on both sides of the main portions M1 and M2 in the width direction. For example, the main portions M1 and M2 may represent regions of the metal terminals 141c and 142c whose length changes along the width direction, and the extension portions E1 and E2 may represent regions of the metal terminals 141c and 142c whose length does not change along the width direction. The length of the main portions M1 and M2 may decrease as they are adjacent to the center of the metal terminals 141c and 142c in the width direction. The cross-section of the extension portions E1 and E2 may be, for example, rectangular.

[0066] In one embodiment, the upper holes UH1-1 and UH2-1 may be located in the main sections M1 and M2, and the lower holes LH1-1 and LH2-1 may be located in the extension sections E1 and E2. The upper holes UH1-1 and UH2-1 may have a configuration that extends in the width direction, and the lower holes LH1-1 and LH2-1 may have a configuration that extends in the length direction. The upper holes UH1-1 and UH2-1 may have a configuration in which the dimension in the width direction is greater than the dimension in the length direction, and the lower holes LH1-1 and LH2-1 may have a configuration in which the dimension in the length direction is greater than the dimension in the width direction.

[0067] The upper holes UH1-1 and UH2-1 may, for example, be arranged across the entire width of the main sections M1 and M2. The lower holes LH1-1 and LH2-1 may be arranged on two extensions E1 and E2 located on either side of the main sections M1 and M2, respectively. The cross-sections of the upper holes UH1-1 and UH2-1 and the lower holes LH1-1 and LH2-1 may be rectangular.

[0068] In one embodiment, when viewed in the thickness direction, the area of ​​the region where the upper holes UH1-1, UH2-1 and the lower holes LH1-1, LH2-1 are located may be larger than the area of ​​the region where the upper holes UH1-1, UH2-1 and the lower holes LH1-1, LH2-1 are not located.

[0069] Figure 10 shows a structure in which upper holes UH1-1 and UH2-1 are arranged in main sections M1 and M2, and lower holes LH1-1 and LH2-1 are arranged in extension sections E1 and E2, but the present invention is not limited to this. The upper holes may be arranged in the extension sections, and the lower holes may be arranged in the main sections. In this case, the upper holes may have a form that extends in the length direction, and the lower holes may have a form that extends in the width direction. That is, the form and position of the upper and lower holes can be changed from one another.

[0070] Referring to Figure 11, the metal terminals 141d and 142d may include main portions M1 and M2 that face the recess portions R1 and R2 in the longitudinal direction, and extension portions E1 and E2 that are positioned on both sides of the main portions M1 and M2 in the width direction.

[0071] In one embodiment, the upper holes UH1-2 and UH2-2 may include main upper holes mh1-2 and mh2-2 located in the main sections M1 and M2, and auxiliary upper holes ah1-2 and ah2-2 located in the extension sections E1 and E2. The area of ​​the main upper holes mh1-2 and mh2-2 in the length-width direction may be larger than the area of ​​the auxiliary upper holes ah1-2 and ah2-2 in the length-width direction. The auxiliary upper holes ah1-2 and ah2-2 may be located in two extension sections E1 and E2 located on either side of the main sections M1 and M2, respectively.

[0072] The lower holes LH1-2 and LH2-2 are arranged on both sides of the width direction of the main upper holes mh1-2 and mh2-2, and can be positioned more adjacent to the inner surfaces IS1 and IS2 in the longitudinal direction of the metal terminals 141d and 142d than the auxiliary upper holes ah1-2 and ah2-2. The lower holes LH1-2 and LH2-2 may be formed across the main sections M1 and M2 and the extensions E1 and E2.

[0073] The length-width cross-sections of the upper holes UH1-2, UH2-2 and the lower holes LH1-2, LH2-2 may be rectangular.

[0074] In one embodiment, when viewed in the thickness direction, the area of ​​the region where the upper holes UH1-2, UH2-2 and the lower holes LH1-2, LH2-2 are located may be larger than the area of ​​the region where the upper holes UH1-2, UH2-2 and the lower holes LH2-2, LH2-2 are not located.

[0075] On the other hand, the form and position of the upper holes UH1-2, UH2-2 and the lower holes LH1-2, LH2-2 can be changed from one another. In this case, the lower holes may include a main lower hole located in the main section and an auxiliary lower hole located in the extension section, and the upper holes may be located on both sides of the main lower hole in the width direction and adjacent to the inner surface of the metal terminal in the longitudinal direction more closely than the auxiliary lower hole.

[0076] Referring to Figure 12, the metal terminals 141e and 142e may include main portions M1 and M2 that face the recess portions R1 and R2 in the longitudinal direction, and extension portions E1 and E2 that are positioned on both sides of the main portions M1 and M2 in the width direction.

[0077] In one embodiment, the upper holes UH1-3 and UH2-3 may include auxiliary upper holes ah1-3 and ah2-3 located in the main sections M1 and M2, and main upper holes mh1-3 and mh2-3 located in the extension sections E1 and E2. The area of ​​the main upper holes mh1-3 and mh2-3 in the length-width direction may be larger than the area of ​​the auxiliary upper holes ah1-3 and ah2-3 in the length-width direction. The main upper holes mh1-3 and mh2-3 may also be located in two extension sections E1 and E2 located on either side of the main sections M1 and M2.

[0078] The lower holes LH1-3 and LH2-3 can be positioned between the auxiliary upper holes ah1-3 and ah2-3 and the main upper holes mh1-3 and mh2-3 when viewed in the thickness direction. The lengthwise dimensions of the lower holes LH1-3 and LH2-3 may be greater than the lengthwise dimensions of the auxiliary upper holes ah1-3 and ah2-3, and smaller than the lengthwise dimensions of the main upper holes mh1-3 and mh2-3.

[0079] The length-width cross-sections of the upper holes UH1-3, UH2-3 and the lower holes LH1-3, LH2-3 may be rectangular.

[0080] On the other hand, the form and position of the upper holes UH1-3, UH2-3 and the lower holes LH1-3, LH2-3 can be interchanged. In this case, the lower holes may include auxiliary lower holes located in the main section and main lower holes located in the extension section, and the upper holes may be located between the auxiliary lower holes and the main lower holes when viewed in the thickness direction.

[0081] Manufacturing method for multilayer electronic components An example of a method for forming multilayer electronic component 100 will be described below. The description will be made with reference to the multilayer electronic component 100 including the metal terminals 141 and 142 shown in FIGS. 1 to 7, but the method for manufacturing the multilayer electronic component 100 is not limited thereto.

[0082] First, ceramic powder for forming the dielectric layer 111 is prepared. The ceramic powder may be a perovskite compound powder represented by ABO3. The ceramic powder is, for example, BaTiO3, (Ba 1-x Ca x )xTiO3 (0<x<1), Ba(Ti 1-y Ca y )yO3 (0<y<1), (Ba 1-x Ca x x)(Ti 1-y Zr y y)O3 (0<x<1, 0<y<1), Ba(Ti 1-y Zr y y)O3 (0<y<1), CaZrO3, and (Ca 1-x Sr x x)(Zr 1-y Ti y y)O3 (0<x≦0.5, 0<y≦0.5) may contain one or more of them. BaTiO3 powder can be synthesized, for example, by reacting a titanium raw material such as titanium dioxide with a barium raw material such as barium carbonate. Examples of the method for synthesizing the ceramic powder include a solid phase method, a sol-gel method, a hydrothermal synthesis method, and the like, but the present invention is not limited thereto. Next, after drying and pulverizing the prepared ceramic powder, an organic solvent such as ethanol and a binder such as polyvinyl butyral are mixed to produce a ceramic slurry, and the ceramic slurry is applied onto a carrier film and dried to provide a ceramic green sheet.

[0083] Next, an internal electrode pattern is formed by printing a conductive paste for internal electrodes containing metal powder, a binder, an organic solvent, etc. at a predetermined thickness on the ceramic green sheet using a screen printing method, a gravure printing method, or the like.

[0084] Subsequently, after peeling the ceramic green sheet with the printed internal electrode pattern from the carrier film, a predetermined number of layers of ceramic green sheets with the printed internal electrode pattern are laminated and pressed together to form a ceramic laminate. A predetermined number of ceramic green sheets without the printed internal electrode pattern can be laminated on the upper and lower parts of the ceramic laminate to form cover portions 112 and 113 after firing. After that, the ceramic laminate can be cut to have a predetermined chip size, and the cut chips can be fired to form the main body 110. The firing can be carried out, for example, in a 1.0%H2 / 99.0%N2~3.5%H2 / 96.5%N2 (H2O / H2 / N2 atmosphere) at a temperature of 1000°C to 1400°C for 1 to 3 hours.

[0085] Next, external electrodes 131 and 132 are formed. For example, if the base electrode layers 131a and 132a include a fired electrode layer, the main body 110 can be dipped in a conductive paste for external electrodes containing metal powder, glass frit, binder, and organic solvent, and then the conductive paste for external electrodes can be fired at a temperature of 500°C to 900°C to form a fired electrode layer.

[0086] For example, if the base electrode layers 131a and 132a include a resin electrode layer, the main body can be dipped in a conductive resin composition containing metal powder, resin, binder, and organic solvent, and then cured at a temperature of 250°C to 550°C to form the resin electrode layer.

[0087] Furthermore, metal layers 131b and 132b can be formed on the underlying electrode layers 131a and 132a by further electroplating and / or electroless plating.

[0088] Next, after providing a metal core MC with recesses R1 and R2 formed therein, the surface of the metal core MC can be hole-processed using a method such as half etching. By this hole-processing, upper holes UH1 and UH2 and lower holes LH1 and LH2 can be formed. Metal terminals 141 and 142 can be formed on the surface of the hole-processed metal core MC by forming a plating layer PL using electroplating and / or electroless plating. The metal core MC can include, for example, one or more of Cu, Ni, Ag, Sn, Pt, Pd, Fe, Al, and their alloys, phosphor bronze, and stainless steel, and the plating layer PL can include, for example, one or more of Ni, Sn, and Au.

[0089] Next, the metal terminals 141 and 142 can be attached to the external electrodes 131 and 132 using a conductive adhesive to form the stacked electronic component 100.

[0090] Experimental example After setting up a 1608-size (length: approximately 1.6 mm, width: approximately 0.8 mm, thickness: approximately 0.8 mm) multilayer ceramic capacitor, metal terminals were attached to the external electrodes to create a sample chip.

[0091] In the comparative example, only a recess was formed in the metal terminal, and the upper and lower holes were not formed. In Example 1, the upper and lower holes were formed in the metal terminal, and the metal terminal had the shape shown in Figure 7. In Example 2, the upper and lower holes were formed in the metal terminal, and the metal terminal had the shape shown in Figure 8.

[0092] The sample chips from the Comparative Example, Example 1, and Example 2 were mounted on a printed circuit board using a conductive mounting agent, and then their respective adhesion strength and bending strength were measured.

[0093] In the adhesion strength test, the force applied to the printed circuit board at the moment the sample chip broke was defined as the fixing strength when the opposite side of the printed circuit board on which the sample chip was mounted was pressed until the sample chip broke. The average fixing strength of 40 sample chips each for Comparative Example, Example 1, and Example 2 was measured.

[0094] Figure 13 is a graph showing the measured adhesion strength of the Comparative Example, Example 1, and Example 2. Referring to Figure 13, the average adhesion strength of the Comparative Example was 39.163 N, the average adhesion strength of Example 1 was 42.3732 N, and the average adhesion strength of Example 2 was 42.1183 N. In other words, it can be confirmed that Examples 1 and 2 have superior adhesion strength compared to the Comparative Example.

[0095] The bending strength test involved pressing the printed circuit board on which the sample chip was mounted, both sides, for approximately 2 mm for 10 seconds. Then, a voltage of 1 Vr was applied for 24 hours at a temperature of 85°C, relative humidity of 85%, and the opposite side. Afterward, the cross-section of the sample chip was observed under a microscope, and the number of sample chips that developed bending cracks is recorded in Table 1 below. The number of sample chips for Comparative Example, Example 1, and Example 2 was 10 each.

[0096] [Table 1]

[0097] Referring to Table 1 above, Examples 1 and 2 showed less bending crack occurrence compared to the comparative example. In particular, Example 1 had a lower rate of bending crack occurrence than Example 2, which is judged to be because the bending cracks mainly occurred at the ends of the band portion, and in Example 1, the upper hole was positioned adjacent to this, effectively reducing the rigidity of the metal terminal and absorbing stress.

[0098] 2. Second Embodiment Multilayer electronic components Figure 14 is a schematic perspective view showing a stacked electronic component according to another embodiment of the present invention; Figure 15 is a schematic cross-sectional view showing a cross section along the line III-III' in Figure 14; Figure 16 is a top view of (a) the first metal terminal and (b) the second metal terminal of Figure 14; and Figures 17 to 19 are top views of (a) the first metal terminal and (b) the second metal terminal of another embodiment of the present invention, corresponding to Figure 16.

[0099] Hereinafter, a stacked electronic component 200 according to another embodiment of the present invention will be described with reference to Figures 14 to 19. For components that are the same as or similar to those of the stacked electronic component 100 described in Figures 1 to 12, the same or similar reference numerals will be used, and redundant explanations will be omitted.

[0100] The stacked electronic component 200 may include a main body 110, external electrodes 131, 132, and metal terminals 241, 242.

[0101] Recesses R1 and R2 can be provided on the metal terminals 241 and 242. The first metal terminal 241 may have a first recess R1, and the second metal terminal 242 may have a second recess R2.

[0102] The recesses R1 and R2 may have a shape that is recessed toward the inner surfaces IS1 and IS2 in the longitudinal direction of the metal terminals 241 and 242. However, the present invention is not limited thereto, and the longitudinal and widthwise cross-sections (LW cross-sections) of the recesses R1 and R2 may have a rectangular shape.

[0103] When mounting the multilayer electronic component 200 onto a printed circuit board using a conductive mounting agent, the recesses R1 and R2 can function as solder pockets by providing spaces into which molten conductive mounting agent can be filled. This reduces the height of the solder fillet formed when the conductive mounting agent travels up the external electrodes 131 and 132 and rises in the thickness direction. This blocks the transmission path of piezoelectric vibrations generated in the main body 110, thereby reducing the acoustic noise of the multilayer electronic component 200.

[0104] In one embodiment, the metal terminals 241 and 242 may include stepped portions SP1 and SP2 having relatively thin thicknesses. The first metal terminal 241 may include a first stepped portion SP1 having a relatively thin thickness, and the second metal terminal 242 may include a second stepped portion SP2 having a relatively thin thickness.

[0105] In other words, the metal terminals 241 and 242 may have stepped portions SP1 and SP2 defined on their upper surfaces US1 and US2 and their longitudinal inner surfaces IS1 and IS2. Here, the upper surfaces US1 and US2 of the metal terminals 241 and 242 can mean the uppermost surfaces of the metal terminals 241 and 242.

[0106] The rigidity of the metal terminals 241 and 242 can be reduced via the stepped portions SP1 and SP2, thereby improving the bending strength of the multilayer electronic component 200. In particular, the stepped portions SP1 and SP2 can be positioned on the upper surfaces US1 and US2 of the metal terminals 241 and 242 adjacent to the ends of the external electrodes 131 and 132, and on the longitudinal inner surfaces IS1 and IS2. Since the ends of the external electrodes 131 and 132 are the main points where bending cracks begin, forming the stepped portions SP1 and SP2 in this region can effectively improve the bending strength of the multilayer electronic component 200.

[0107] Referring to Figure 16, the stepped portions SP1 and SP2 can have a shape that extends in the width direction. Specifically, the stepped portions SP1 and SP2 can be formed over the entire width direction of the metal terminals 241 and 242.

[0108] The following describes various modifications of the above metal terminals, referring to Figures 17 to 19. Each modification will be explained separately, but redundant explanations will be omitted.

[0109] Referring to Figure 17, the metal terminals 241a and 242a may include stepped portions SP1-1 and SP2-1 having a relatively thin thickness. Stepped portions SP1-1 and SP2-1 may also be defined on the upper surfaces US1 and US2 and the longitudinal inner surfaces IS1 and IS2 of the metal terminals 241a and 242a.

[0110] The stepped portions SP1-1 and SP2-1 may have a shape that extends in the width direction. However, the stepped portions SP1-1 and SP2-1 may be formed over a portion of the width direction of the metal terminals 241a and 242a. For example, the stepped portions SP1-1 and SP2-1 may be arranged at a distance from both sides of the width direction of the metal terminals 241a and 242a. For example, the width direction dimension of the stepped portions SP1-1 and SP2-1 may be smaller than the width direction dimension of the metal terminals 241a and 242a.

[0111] Referring to Figure 18, the metal terminals 241b and 242b may include stepped portions SP1-2 and SP2-2 having a relatively thin thickness. The stepped portions SP1-2 and SP2-2 may also be defined on the upper surfaces US1 and US2 of the metal terminals 241b and 242b.

[0112] The stepped portions SP1-2 and SP2-2 may have a shape that extends in the width direction. However, the stepped portions SP1-2 and SP2-2 may be formed over a portion of the width direction of the metal terminals 241b and 242b. For example, the stepped portions SP1-2 and SP2-2 may be arranged at a distance from both sides of the width direction of the metal terminals 241b and 242b. For example, the width direction dimension of the stepped portions SP1-2 and SP2-2 may be smaller than the width direction dimension of the metal terminals 241b and 242b.

[0113] Multiple stepped portions SP1-2 and SP2-2 can be arranged. For example, multiple first stepped portions SP1-2 may be arranged on the first metal terminal 241b, and multiple second stepped portions SP2-2 may be arranged on the second metal terminal 242b. Multiple first stepped portions SP1-2 may be spaced apart in the width direction, and multiple second stepped portions SP2-2 may be spaced apart in the width direction. Multiple stepped portions SP1-2 and SP2-2 may be spaced apart from the inner surfaces in the longitudinal direction of the metal terminals 241b and 242b. However, the present invention is not limited thereto, and multiple stepped portions SP1-2 and SP2-2 may be open to the inner surfaces in the longitudinal direction of the metal terminals 241b and 242b.

[0114] Referring to Figure 19, the metal terminals 241c and 242c may include stepped portions SP1-3 and SP2-3 having a relatively thin thickness. Stepped portions SP1-3 and SP2-3 may also be defined on the upper surfaces US1 and US2 and the longitudinal inner surfaces IS1 and IS2 of the metal terminals 241c and 242c.

[0115] The stepped portions SP1-3 and SP2-3 may have an arc shape when viewed in the thickness direction. The stepped portions SP1-3 and SP2-3 may be formed over a portion of the width direction of the metal terminals 241c and 242c. For example, the stepped portions SP1-3 and SP2-3 may be positioned at a distance from both sides of the width direction of the metal terminals 241c and 242c. For example, the width dimension of the stepped portions SP1-3 and SP2-3 may be smaller than the width dimension of the metal terminals 241c and 242c.

[0116] Multiple stepped portions SP1-3 and SP2-3 can be arranged. For example, multiple first stepped portions SP1-3 may be arranged on the first metal terminal 241c, and multiple second stepped portions SP2-3 may be arranged on the second metal terminal 242c. Multiple first stepped portions SP1-3 may be spaced apart in the width direction, and multiple second stepped portions SP2-3 may be spaced apart in the width direction. Multiple stepped portions SP1-3 and SP2-3 may be open to the inner surfaces IS1 and IS2 in the longitudinal direction of the metal terminals 241c and 242c. However, the present invention is not limited thereto, and multiple stepped portions SP1-3 and SP2-3 may be spaced apart from the inner surfaces in the longitudinal direction of the metal terminals 241c and 242c.

[0117] The present invention is not limited by the embodiments described above or the accompanying drawings, but is limited by the claims provided herein. Accordingly, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, without departing from the technical idea of ​​the present invention as described in the claims, and these also fall within the scope of the present invention.

[0118] Furthermore, the expression "one embodiment" does not mean that each embodiment is the same as another, but is provided to highlight and explain the unique and distinct characteristics of each embodiment. However, the above-presented embodiments do not preclude their realization in combination with the features of other embodiments. For example, even if a matter described in one embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description in the other embodiment that contradicts or is contrary to that matter.

[0119] In this invention, "connected" is a concept that includes not only direct connection but also indirect connection via an adhesive layer or the like. Furthermore, "electrically connected" is a concept that includes both cases where physically connected and cases where not connected. In addition, expressions such as "first," "second," etc., are used to distinguish one component from another and do not limit the order and / or importance of the components. In some cases, within the scope of the rights, the first component may be named the second component, and similarly, the second component may be named the first component. [Explanation of symbols]

[0120] 100, 200: Multilayer electronic components 110: Main unit 111: Dielectric layer 112, 113: Cover section 114, 115: Margin section 121, 122: Internal electrode 131, 132: External electrode 131a, 132a: Base electrode layer 131b, 132b: Metal layer 141, 142, 241, 242: Metal terminal R1, R2: Recessed section UH1, UH2: Upper Hall LH1, LH2: Lower Hole

Claims

1. A body including a dielectric layer and internal electrodes arranged alternately with the dielectric layer, having a first and second surface facing each other in the thickness direction, a third and fourth surface connected to the first and second surfaces and facing each other in the length direction, and a fifth and sixth surface connected to the first, second, third and fourth surfaces and facing each other in the width direction, External electrodes arranged on the third or fourth surface and extending over parts of the first and second surfaces, A metal terminal disposed on the first or second surface and connected to the external electrode, A recess is provided on the outer surface of the metal terminal in the longitudinal direction. Upper and lower holes are provided on the upper and lower surfaces of the aforementioned metal terminals, respectively. The upper hole does not overlap with the lower hole in the thickness direction in a stacked electronic component.

2. Multiple upper holes and multiple lower holes are arranged, The laminated electronic component according to claim 1, wherein the plurality of upper holes do not overlap with the plurality of lower holes in the thickness direction.

3. Multiple upper holes and multiple lower holes are arranged, The plurality of upper holes are positioned more adjacent to the inner surface of the metal terminal in the longitudinal direction than the plurality of lower holes. The stacked electronic component according to claim 1, wherein the plurality of upper holes are arranged more adjacent to the center of the metal terminal in the width direction than the plurality of lower holes.

4. Multiple upper holes and multiple lower holes are arranged, The plurality of lower holes are positioned more adjacent to the inner surface of the metal terminal in the longitudinal direction than the plurality of upper holes. The stacked electronic component according to claim 1, wherein the plurality of lower holes are arranged more adjacent to the center of the metal terminal in the width direction than the plurality of upper holes.

5. The plurality of upper holes are arranged spaced apart from each other in the width direction, The stacked electronic component according to claim 3 or 4, wherein the plurality of lower holes are arranged spaced apart from each other in the width direction.

6. The stacked electronic component according to claim 1, wherein the recess portion has a shape that is concave toward the inner surface of the metal terminal in the longitudinal direction.

7. The stacked electronic component according to claim 6, wherein the upper hole and the lower hole are arranged alternately with respect to each other along the periphery of the recess when viewed in the thickness direction.

8. The metal terminal includes a main portion facing the recess portion in the longitudinal direction, and extension portions arranged on both sides of the main portion in the width direction. The upper hole is located in the main section and extends in the width direction, The stacked electronic component according to claim 1, wherein the lower hole is located in the extension and extends in the longitudinal direction.

9. The metal terminal includes a main portion facing the recess portion in the longitudinal direction, and extension portions arranged on both sides of the main portion in the width direction. The upper hole includes a main upper hole located in the main section and an auxiliary upper hole located in the extension section. The stacked electronic component according to claim 1, wherein the lower holes are arranged on both sides of the main upper hole in the width direction and are positioned more adjacent to the inner surface of the metal terminal in the length direction than the auxiliary upper hole.

10. The metal terminal includes a main portion facing the recess portion in the longitudinal direction, and extension portions arranged on both sides of the main portion in the width direction. The upper hole includes an auxiliary upper hole located in the main section and a main upper hole located in the extension section. The stacked electronic component according to claim 1, wherein the lower hole is located between the auxiliary upper hole and the main upper hole when viewed in the thickness direction.

11. A conductive adhesive is placed between the external electrode and the metal terminal. The laminated electronic component according to claim 1, wherein the conductive bonding agent fills at least a portion of the upper hole.

12. The metal terminal includes a metal core and a plating layer disposed on the metal core. The laminated electronic component according to claim 1, wherein the plating layer extends into the interior of the upper hole and the lower hole.

13. A printed circuit board including electrode pads, A stacked electronic component according to claim 1, disposed on the printed circuit board, A conductive mounting material is disposed between the electrode pad and the metal terminal, The conductive mounting material is a mounting substrate for a stacked electronic component that fills at least a portion of the lower hole.

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