Circuit board cleaning system

JP2026145018APending Publication Date: 2026-09-09KC TECH CO LTD
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Patent Information

Application Number
JP2026028013
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-28
Filing Date
2026-02-25
Publication Date
2026-09-09

AI Technical Summary

Benefits of technology

【0016】 一実施例に係る基板洗浄システムは上部ロードセルおよび上部ストッパーを通じて基板に作用するブラシの加圧力を感知し、感知されたブラシの加圧力情報に基づいてブラシの加圧力をフィードバック調節することができる。

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Abstract

We provide a circuit board cleaning system that adjusts the pressure applied by the brush. [Solution] The substrate cleaning system 1 includes a base B, a plurality of support structures 10 arranged on the base, a plurality of support frames 11 including guide rails 11b, a plurality of upper brackets 12 movable in the Z-axis direction, a plurality of lower brackets 13 located below the plurality of upper brackets and movable in the Z-axis direction, an upper brush 14 for cleaning the upper surface of the substrate W, a lower brush 15 for cleaning the lower surface of the substrate, a rotary actuator 16 connected to the upper brush and the lower brush, an upper load cell LC1 connected to the upper bracket, an upper stopper S1 connected to the frame body 11a of the support frame so as to be located below the upper load cell, a lower load cell LC2 arranged on the base, and a hinge portion 17 connected to the frame body of the support frame that pressurizes the lower load cell when the support frame rotates in a first rotational direction.
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Description

Technical Field

[0001] The present disclosure relates to a substrate cleaning system. Background Art

[0002] Generally, semiconductors are manufactured by repeatedly performing a series of processes such as lithography, vapor deposition, and etching. Contaminants such as various particles, metal impurities, or organic substances remain on the surface of a substrate constituting such a semiconductor through repeated processes. Since contaminants remaining on a substrate reduce the reliability of the manufactured semiconductor, a process of cleaning or buffing the substrate during the semiconductor manufacturing process is required to improve this problem. The substrate cleaning process can be performed with a brush, and research and development have been continuously conducted to adjust the pressing force of the brush against the substrate during the substrate cleaning process and prevent or reduce the tilting phenomenon in which the brush tilts left and right.

[0003] However, the above description shall not be construed as the applicant acknowledging it as prior art for the content described in this document, and shall only be construed as related art relating to the invention described in this document. Summary of the Invention Problems to be Solved by the Invention

[0004] An object according to an embodiment is to provide a substrate cleaning system including an upper load cell and an upper stopper for adjusting the pressing force of a brush.

[0005] An object according to an embodiment is to provide a substrate cleaning system including a hinge portion, a lower load cell, and a lower stopper for preventing or reducing the tilting phenomenon of a brush.

[0006] The problems that the substrate cleaning system according to one embodiment aims to solve are not limited to those mentioned above, and other problems not mentioned can be clearly understood by an ordinary engineer from the following description. [Means for solving the problem]

[0007] In one embodiment, the substrate cleaning system includes a base, a plurality of support structures arranged side by side on the base, a plurality of support frames rotatably connected to each of the plurality of support structures about a first axis and including a frame body and guide rails formed in the height direction on the frame body, a plurality of upper brackets connected to each of the plurality of support frames so as to be movable in the height direction along the guide rails, a plurality of lower brackets positioned below the plurality of upper brackets and connected to each of the plurality of support frames so as to be movable in the height direction along the guide rails, and a plurality of upper brackets parallel to the first axis The system may include: an upper brush rotatably connected around a rotation axis for cleaning the upper surface of the substrate; a lower brush rotatably connected to the plurality of lower brackets around a second rotation axis parallel to the first axis for cleaning the lower surface of the substrate; a rotary actuator connected to the upper brush and the lower brush; an upper load cell connected to the upper bracket; an upper stopper connected to the frame body of the support frame so as to be located below the upper load cell; a lower load cell positioned on the base; and a hinge portion connected to the frame body of the support frame that pressurizes the lower load cell when the support frame rotates in a first rotational direction.

[0008] In one embodiment, the upper load cell can contact the upper stopper when the upper bracket moves downward along the height direction on the guide rail, and can detect the pressure applied by the upper stopper.

[0009] In one embodiment, the substrate cleaning system further includes a control unit, which, based on the detected pressure information of the upper load cell, moves the upper bracket and the lower bracket away from each other if the pressure is greater than a set range, and moves the upper bracket and the lower bracket closer together if the pressure is less than a set range.

[0010] In one embodiment, the substrate cleaning system may further include a lower stopper positioned on the base such that it contacts the hinge portion when the support frame rotates in a second rotation direction opposite to the first rotation direction.

[0011] In one embodiment, the hinge portion may include a hinge body connected to the frame body, a first flange extending from the hinge body and pressurizing the lower load cell, and a second flange extending from the hinge body and pressurizing the lower stopper.

[0012] In one embodiment, the lower load cell can detect the pressure applied by the first flange of the hinge when the support frame rotates in the first rotational direction.

[0013] In one embodiment, the substrate cleaning system further includes a torque detection unit for detecting the rotational torque of the rotary actuator and a control unit, wherein the control unit can detect the frictional force between the substrate and the lower brush based on the pressure information detected by the lower load cell and the rotational torque information detected by the torque detection unit, and can control the operation of the rotary actuator based on the detected frictional force information.

[0014] In one embodiment, the upper bracket may include a first upper bracket portion connected to the upper brush, a second upper bracket portion extending from the first upper bracket portion and connected to the support frame, and a third upper bracket portion extending from the second upper bracket portion and connected to the upper load cell.

[0015] In one embodiment, the lower bracket may include a first lower bracket portion connected to the lower brush and a second lower bracket portion extending from the first lower bracket portion and connected to the support frame. [Effects of the Invention]

[0016] The substrate cleaning system according to one embodiment senses the pressure applied by the brush acting on the substrate through an upper load cell and an upper stopper, and can provide feedback adjustment of the brush pressure based on the sensed brush pressure information.

[0017] A substrate cleaning system according to one embodiment can prevent or reduce tilting, a phenomenon in which the left-right inclination of the brush changes through the hinge, lower load cell, and lower stopper.

[0018] In one embodiment, the substrate cleaning system detects the frictional force between the substrate and the brush by comparing the applied pressure at the hinge portion sensed by the lower load cell with the rotational torque of the rotary actuator that rotates the brush. It then analyzes the frictional characteristics between the brush and the substrate surface and can increase the efficiency of the substrate cleaning process based on the analyzed frictional characteristics.

[0019] The effects of the substrate cleaning system according to one embodiment are not limited to those mentioned above, and other effects not mentioned can be clearly understood by an ordinary engineer from the following description. [Brief explanation of the drawing]

[0020] The following drawings attached to the present specification illustrate a preferred embodiment of the present invention, and serve to further understand the technical idea of the present invention together with the detailed description of the invention. Therefore, the present invention should not be construed as being limited only to the matters described in such drawings.

[0021] [Figure 1] It is a perspective view of a substrate cleaning system according to one embodiment. [Figure 2] It is a drawing illustrating one side of a substrate cleaning system for showing in detail an upper load cell, an upper stopper, a lower load cell, a lower stopper and a hinge part of the substrate cleaning system according to one embodiment. [Figure 3] It is a front view of a substrate cleaning system according to one embodiment. [Figure 4] It is a right side view of a substrate cleaning system according to one embodiment. [Figure 5] It is a left side view of a substrate cleaning system according to one embodiment. Mode for Carrying Out the Invention

[0022] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, since various modifications can be made to the embodiments, the scope of the right in a patent application is not restricted or limited by these embodiments. All changes, equivalents or alternatives to the embodiments should be understood as being included in the scope of the right.

[0023] The terms used in the embodiments are merely used for the purpose of description, and should not be construed as an intention of limitation. A singular expression includes a plural expression unless the context clearly dictates otherwise. It should be understood in this specification that terms such as "comprising" or "having" are intended to specify the presence of the features, numbers, steps, operations, components, parts or combinations thereof described in the specification, and do not exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0024] Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by a person skilled in the art to which the embodiments belong. Terms defined in commonly used dictionaries should be construed to have meanings consistent with their meanings in the context of the relevant art, and shall not be construed in an idealized or overly formal sense unless expressly defined in the present application.

[0025] In the description with reference to the accompanying drawings, the same components are denoted by the same reference numerals regardless of drawing symbols, and duplicate descriptions thereof will be omitted. In describing the embodiments, if it is judged that a specific description of related known technologies may unnecessarily obscure the gist of the embodiments, the detailed description thereof will be omitted. The singular form of a noun corresponding to an item may include one or more of said items, unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B", "at least one of A and B", "at least one of A or B", "at least one of A, B or C", "at least one of A, B and C", and "at least one of A, B or C" may each include any one of the items listed together in the corresponding phrase, or any possible combination thereof.

[0026] In describing the components of the embodiments, terms such as first, second, A, B, (a), (b) may be used. These terms are only used to distinguish the components from other components, and do not limit the nature, order or sequence of the corresponding components by such terms. When a component is described as being "linked", "coupled" or "connected" to another component, it is to be understood that although the component may be directly linked or connected to the other component, another component may also be "linked", "coupled" or "connected" between the respective components.

[0027] In this document, terms such as “substantially,” “approximately,” “generally,” and “about” used to refer to a given parameter, attribute, or condition may include the degree to which an ordinary engineer can understand that the given parameter, attribute, or condition will be met with a small degree of variance, such as within an acceptable manufacturing tolerance. For example, a particular parameter that is substantially met may be met to at least 90%, at least 95%, or at least 99%.

[0028] Components included in any one embodiment and components that share a common function shall be described using the same name in the other embodiments. Unless otherwise stated, the descriptions in any one embodiment may also apply to the other embodiments, and specific descriptions shall be omitted to the extent of duplication.

[0029] Figure 1 is a perspective view of a substrate cleaning system according to one embodiment. Figure 2 is a drawing showing one side of the substrate cleaning system to show in detail the upper load cell, upper stopper, lower load cell, lower stopper, and hinge portion of the substrate cleaning system according to one embodiment. Figure 3 is a front view of the substrate cleaning system according to one embodiment. Figure 4 is a right side view of the substrate cleaning system according to one embodiment. Figure 5 is a left side view of the substrate cleaning system according to one embodiment. In the following description of the substrate cleaning system, unless otherwise stated, the right side means the -X axis direction relative to the direction shown in the drawings, and the left side means the +X axis direction. Also, the top (or upward) or upper side may be understood to mean the +Z axis direction, and the bottom (or downward) or lower side may be understood to mean the -Z axis direction.

[0030] Referring to Figures 1 to 5, a substrate cleaning system (1) according to one embodiment can clean a substrate (W). For example, the substrate cleaning system (1) can clean a cleaned, buffed, or polished substrate (W), in particular the surface of the substrate (W). The substrate cleaning system (1) can support the substrate (W). The substrate cleaning system (1) can clean the supported substrate (W) with a plurality of brushes. In one embodiment, the substrate cleaning system (1) may include a base (B), a plurality of support structures (10), a plurality of support frames (11), a plurality of upper brackets (12), a plurality of lower brackets (13), an upper brush (14), a lower brush (15), a rotary actuator (16), an upper load cell (LC1), an upper stopper (S1), a lower load cell (LC2), a lower stopper (S2), a hinge (17), a control unit, a torque detection unit, and / or a displacement sensor (18).

[0031] In one embodiment, the base (B) can form the lower part of the substrate cleaning system (1). The base (B) may be a member that contacts the ground, or it may be the ground itself. That is, the form of the base (B) is not defined as any single object, but can be formed into any form on which other components of the substrate cleaning system (1), described later, are arranged or supported. The base (B) can be placed on the ground to support other components of the substrate cleaning system (1) (for example, a plurality of support structures (10)).

[0032] In one embodiment, a plurality of support structures (10) may be arranged on a base (B). The support structures (10) may be provided as a plurality of support structures (for example, the plurality of support structures (101, 102) in Figure 1) arranged on the base (B). The support structures (10) may be arranged on the base (B) so as to face each other in directions parallel to each other (for example, in a direction parallel to the X-axis). Each support structure (10) may include a hinge bearing (100) that is rotatably provided about a first axis (X1). A support frame (11), which will be described later, may be rotatably connected to the hinge bearing (100). The number of support structures (10) is shown as two, but the number of support structures (10) is not limited to this. In the following, the explanation will be based on the premise that the number of support structures (10) is two.

[0033] In one embodiment, the support frame (11) may be rotatably connected to a support structure (10) positioned on a base (B). Multiple support frames (11) may be provided (for example, support frames (111, 112) in Figure 3). Each of the multiple support frames (11) may be rotatably connected to each of the support structures (10). Each of the multiple support frames (11) may rotate about a first axis (X1). Each of the support frames (11) may support other components of the substrate cleaning system (1) described later (for example, an upper bracket (12) and / or a lower bracket (13)). In one embodiment, the support frame (11) may include a frame body (11a) and a guide rail (11b). The frame body (11a) may be the main body portion of the support frame (11). The guide rail (11b) may be formed on the frame body (11a). The guide rail (11b) can form a movement path that allows the upper bracket (12) and / or lower bracket (13), described later, to move up and down along the height direction (for example, the Z-axis direction). In one embodiment, the number of support frames (11) is shown as two, but is not limited to this, and the number of support frames (11) may be the same as the number of support structures (10) if the number of support structures (10) exceeds two.

[0034] In one embodiment, the upper bracket (12) may be connected to the support frame (11). Multiple upper brackets (12) may be provided. For example, each of multiple upper brackets (12) (121, 122) may be connected to each of multiple support frames (11) (111, 112). That is, one upper bracket (12) may be connected to one support frame (11). When compared to the lower bracket (13) described later, the upper bracket (12) may be positioned above the lower bracket (13). The upper bracket (12) may be connected to the support frame (11) so as to be movable along the height direction of the support frame (11) along the guide rail (11b) formed on the support frame (11). The upper bracket (12) may include a first upper bracket portion (12a), a second upper bracket portion (12b), and a third upper bracket portion (12c). An upper brush (14), described later, may be connected to the first upper bracket portion (12a). A support frame (11) may be connected to the second upper bracket portion (12b). An upper load cell (LC1), described later, may be connected to the third upper bracket portion (12c). The second upper bracket portion (12b) may extend from one end of the first upper bracket portion (12a), and the third upper bracket portion (12c) may extend from one end of the second upper bracket portion (12b). For example, the second upper bracket portion (12b) may be located extending from the first upper bracket portion (12a) in a first direction (e.g., the -X axis direction). The third upper bracket portion (12c) may be located extending from the second upper bracket portion (12b) in a second direction different from the first direction (e.g., the +Z axis direction). Since the extension directions of the first upper bracket portion (12a), the second upper bracket portion (12b), and the third upper bracket portion (12c) are the first and second directions which are different from each other, the usability of the space may be increased. Furthermore, by extending in different directions from one another, interference between the first upper bracket portion (12a), the second upper bracket portion (12b), and the third upper bracket portion (12c) can be prevented or reduced as they move along the height direction of the support frame (11).

[0035] In one embodiment, the lower bracket (13) can be connected to the support frame (11). Multiple lower brackets (13) may be provided. For example, referring to Figure 3, each of the multiple lower brackets (13) (131, 132) can be connected to each of the multiple support frames (11) (111, 112). That is, one lower bracket (13) can be connected to one support frame (11). The lower bracket (13) can be positioned on the support frame (11) below the upper bracket (12). The lower bracket (13) can be connected to the support frame (11) so as to be movable in the height direction along the guide rail (11b) of the support frame (11). The lower bracket (13) may include a first lower bracket portion (13a) and a second lower bracket portion (13b). A lower brush (15), described later, can be connected to the first lower bracket portion (13a). The support frame (11) can be connected to the second lower bracket portion (13b). The second lower bracket portion (13b) may extend from one end of the first lower bracket portion (13a). For example, the second lower bracket portion (13b) may extend from the first lower bracket portion (13a) in a first direction (e.g., the -X axis direction). In one embodiment, an upper bracket (12) and a lower bracket (13) connected to a single support frame (11) may be positioned side by side along the height direction. For example, the first upper bracket portion (12a) of the upper bracket (12) and the first lower bracket portion (13a) of the lower bracket (13) may be positioned side by side along the height direction (e.g., the Z axis direction), and the second upper bracket portion (12b) and the second lower bracket portion (13b) may be positioned side by side along the height direction.

[0036] In one embodiment, the upper brush (14) is positioned to contact the surface of the substrate (W), particularly the surface of the substrate (W) (for example, the surface of the substrate (W) facing the +Z axis), so as to clean the surface of the substrate (W). The upper brush (14) may be rotatably connected to the upper bracket (12) about a first rotation axis (Y1). The upper brush (14) connected to the upper bracket (12) may be provided so as to be movable along the height direction together with the upper bracket (12) as the upper bracket (12) moves in the height direction along the guide rail (11b). The first rotation axis (Y1) of the upper brush (14) may be parallel to the first axis (X1) of the support frame (11).

[0037] In one embodiment, the lower brush (15) is positioned to contact the lower surface of the substrate (W) (for example, the surface of the substrate (W) facing the -Z axis) to clean the surface of the substrate (W). The lower brush (15) may be connected to the lower bracket (13) so as to be rotatable about a second rotation axis (Y2). The lower brush (15) connected to the lower bracket (13) may be provided so as to be movable along the height direction together with the lower bracket (13) as the lower bracket (13) moves in the height direction along the guide rail (11b). The lower brush (15) may be positioned alongside the upper brush (14) on either side of the substrate (W). When the upper brush (14) and lower brush (15) are positioned side by side, they press on the same area of ​​the substrate (W) surface when viewed in the height direction, and the pressing forces cancel each other out, thereby preventing or reducing tilting of the substrate (W) surface.

[0038] In one embodiment, the rotary actuator (16) is connected to the upper brush (14) and the lower brush (15), and can provide rotational power to each of the upper brush (14) and the lower brush (15). For example, the rotary actuator (16) can generate rotational power and transmit it to the upper brush (14) and the lower brush (15). Powered by the rotary actuator (16), the upper brush (14) and the lower brush (15) rotate in the same direction to clean the surface of the substrate (W). In the drawing, the rotary actuator (16) is shown as a separate configuration consisting of a first rotary actuator (161) connected to the upper brush (14) and a second rotary actuator (162) connected to the lower brush (15), but the rotary actuator (16) may be a single configuration. For example, the first rotary actuator (161) and the second rotary actuator (162) may be integrally formed with each other, and a single rotary actuator (16) may be connected to both the upper brush (14) and the lower brush (15). The amount of rotational torque generated by the first rotary actuator (161) and the amount of rotational torque generated by the second rotary actuator (162) will generally be the same, but the amount of rotational torque may differ from each other as needed through feedback adjustment by the control unit described later.

[0039] The following describes the mechanism by which the upper load cell (LC1) and upper stopper (S1) detect the brush pressure acting on the substrate (W).

[0040] In one embodiment, an upper load cell (LC1) may be connected to an upper bracket (12). Multiple upper load cells (LC1) may be provided. For example, each of multiple upper load cells (LC1) (LC11, LC12) may be connected to each of multiple upper brackets (12) (121, 122). An upper load cell (LC1) may be connected to a third upper bracket portion (12c) of the upper bracket (12). As the upper brush (14) and lower brush (15) approach the surface of the substrate (W) to clean the surface of the substrate (W), the upper brush (14) and lower brush (15) can apply weak pressure to the surface of the substrate (W). In this process, the upper bracket (12) and upper brush (14) may move together, and the lower bracket (13) and lower brush (15) may move together. In other words, the upper bracket (12) can move downward (e.g., in the -Z axis direction) along the height direction (e.g., the Z axis direction in Figure 1) of the support frame (11) during the cleaning process of the substrate (W). When the upper bracket (12) moves downward, the upper load cell (LC1) connected to the upper bracket (12) can also move downward together with the upper bracket (12).

[0041] In one embodiment, the upper stopper (S1) may be connected to the frame body (11a) of the support frame (11) so as to be located below the upper load cell (LC1). Multiple upper stoppers (S1) may be provided. For example, each of the multiple upper stoppers (S1) (S11, S12) may be connected to the frame body (11a) of each of the multiple support frames (11) (111, 112). The upper stopper (S1) can restrict the downward movement of the upper load cell (LC1) as it moves downward together with the upper bracket (12). The upper stopper (S1) may be configured to contact the upper load cell (LC1) as it moves downward. In one embodiment, when the upper load cell (LC1) contacts the upper stopper (S1), it can detect the pressure applied by the upper stopper (S1). The pressure information detected by the upper load cell (LC1) may be transmitted to a control unit described later.

[0042] In one embodiment, a control unit (not shown) can feedback adjust the distance in the height direction (e.g., distance in the Z-axis direction) between the upper bracket (12) and the lower bracket (13) based on the detected pressure information of the upper load cell (LC1). For example, if the detected pressure of the upper load cell (LC1) is greater than a set range, the control unit can move the upper bracket (12) and the lower bracket (13) away from each other, that is, the upper bracket (12) can be moved upward (e.g., in the +Z-axis direction) and the lower bracket (13) can be moved downward (e.g., in the -Z-axis direction). A pressure of the upper load cell (LC1) being greater than a set range may mean that the upper brush (14) is pressing the substrate (W) with an excessive force beyond the set range. In this case, the control unit can prevent or reduce the substrate (W) from being excessively pressed by the brush by increasing the distance between the upper bracket (12) and the lower bracket (13). If the detected pressure of the upper load cell (LC1) is less than the set range, the control unit can move the upper bracket (12) and the lower bracket (13) closer together, that is, move the upper bracket (12) downward and the lower bracket (13) upward. If the pressure of the upper load cell (LC1) is less than the set range, it may mean that the upper brush (14) is applying less pressure to the substrate (W) than the set range, and therefore the surface of the substrate (W) is not being cleaned sufficiently. In this case, the control unit can narrow the distance between the upper bracket (12) and the lower bracket (13) so that the substrate (W) is sufficiently pressurized by the brush and the surface of the substrate (W) is cleaned sufficiently. As described above, the control unit can increase the efficiency of the substrate cleaning process by feedback adjusting the distance between the upper bracket (12) and the lower bracket (13) based on the detected pressure information of the upper load cell (LC1).

[0043] The following describes the mechanism by which the hinge (17), lower load cell (LC2), and lower stopper (S2) detect the frictional force between the substrate (W) and the brush generated by the rotation of the brush.

[0044] In one embodiment, the hinge portion (17) can be connected to the frame body (11a) of the support frame (11). Multiple hinge portions (17) may be provided. For example, each of the multiple hinge portions (17) (171, 172) can be connected to the frame body (11a) of each of the multiple support frames (11) (111, 112). Since the support frame (11) is rotatably connected to the support structure (10), when the support frame (11) rotates in a first rotational direction (R1) about a first axis (X1) relative to the support structure (10), the hinge portion (17) can also rotate together with the support frame (11) in the first rotational direction (R1). When the support frame (11) rotates in a second rotational direction (R2) opposite to the first rotational direction (R1) around the first axis (X1), the hinge portion (17) can also rotate together with the support frame (11) in the second rotational direction (R2). In one embodiment, the hinge portion (17) may include a hinge body (17a) and a first flange (17b) and a second flange (17c) extending in both directions from the hinge body (17a). The hinge body (17a) may mean the main body of the hinge portion (17) connected to the frame body (11a) of the support frame (11).

[0045] In one embodiment, the lower load cell (LC2) may be positioned on the base (B) adjacent to the hinge portion (17). Multiple lower load cells (LC2) may be provided. Each of the multiple lower load cells (LC2) (LC21, LC22) may be positioned on the base (B) facing each other. The lower load cell (LC2) can be pressurized by the first flange (17b) of the hinge portion (17). For example, when the hinge portion (17) rotates in a first rotational direction (R1) due to the rotation of the support frame (11), the first flange (17b) of the hinge portion (17) can pressurize the lower load cell (LC2). At this time, the lower load cell (LC2) can detect the pressure applied by the first flange (17b). The lower load cell (LC2) can transmit or transmit the detected pressure information of the first flange (17b) to a control unit described later.

[0046] In one embodiment, a torque detection unit (not shown) can detect the rotational torque of a rotary actuator (16). The torque detection unit can transmit or transmit information regarding the detected rotational torque of the rotary actuator (16) to a control unit described later.

[0047] In one embodiment, the control unit (not shown) can detect the frictional force between the substrate (W) and the lower brush (15) based on the pressure information detected by the lower load cell (LC2) and the rotational torque information detected by the torque detection unit. For example, the torque value of the rotation actuator (16)

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[0048] In one embodiment, the lower stopper (S2) may be positioned on the base (B) adjacent to the hinge portion (17). Multiple lower stoppers (S2) may be provided. For example, each of the multiple lower stoppers (S2) (S21, S22) may be positioned on the base (B) facing each other. The lower stopper (S2) can be pressed by the second flange (17c) of the hinge portion (17). For example, when the hinge portion (17) rotates in a second rotational direction (R2) due to the rotation of the support frame (11), the second flange (17c) of the hinge portion (17) can press on the lower stopper (S2). At this time, the lower stopper (S2) can restrict the rotational movement of the second flange (17c) that is attempting to rotate in the second rotational direction (R2). For example, the lower stopper (S2) can be positioned at substantially the same height as the lower end surface of the second flange (17c) of the hinge portion (17), with respect to its length in the height direction relative to the ground (e.g., in the +Z axis direction). That is, the lower stopper (S2) can restrict the rotation of the support frame (11) to which the hinge portion (17) is connected in the second rotation direction (R2) by restricting the rotation of the second flange (17c) of the hinge portion (17) in the second rotation direction (R2). The lower stopper (S2) can prevent or reduce the release of the substrate cleaning state due to the rotation of the support frame (11) in the second rotation direction (R2). By maintaining the substrate cleaning state, the lower stopper (S2) can ensure uniformity of the substrate cleaning efficiency.

[0049] As described above, although the embodiments are illustrated with limited drawings, a person with ordinary skill in the relevant art can apply a variety of technical modifications and variations based on the foregoing. For example, the described techniques may be performed in a different order than described, and / or the described systems, structures, devices, circuits, and other components may be combined or assembled in a different manner than described, or substituted or replaced by other components or equivalents, and still the appropriate results may be achieved.

[0050] Therefore, other embodiments, other embodiments, and equivalents of the claims described below also fall within the scope of the claims.

Claims

1. In a circuit board cleaning system, Bass and, A plurality of support structures arranged side by side on the base, Each of the aforementioned plurality of support structures is rotatably connected about a first axis, and includes a frame body and a plurality of support frames including guide rails formed in the height direction on the frame body, Multiple upper brackets are connected to each of the multiple support frames so as to be movable in the height direction along the guide rail, A plurality of lower brackets are arranged below the plurality of upper brackets and connected to each of the plurality of support frames so as to be movable in the height direction along the guide rail, The plurality of upper brackets are rotatably connected about a first rotation axis parallel to the first axis, and an upper brush for cleaning the upper surface of the substrate is provided. The plurality of lower brackets are rotatably connected about a second rotation axis parallel to the first axis, and a lower brush for cleaning the lower surface of the substrate is provided. A rotary actuator connected to the upper brush and the lower brush, The upper load cell connected to the upper bracket, An upper stopper is connected to the frame body of the support frame so as to be located below the upper load cell, A lower load cell is placed on the base, A substrate cleaning system comprising: a hinge portion connected to the frame body of the support frame, which pressurizes the lower load cell when the support frame rotates in a first rotational direction.

2. The aforementioned upper load cell is The substrate cleaning system according to claim 1, wherein when the upper bracket moves downward along the height direction on the guide rail, it comes into contact with the upper stopper and detects the pressure applied by the upper stopper.

3. The substrate cleaning system further includes a control unit, Based on the detected pressure information of the upper load cell, the control unit, If the pressing force is greater than the set range, the upper bracket and the lower bracket are moved away from each other. The substrate cleaning system according to claim 2, wherein if the pressure is less than a set range, the upper bracket and the lower bracket are moved closer to each other.

4. The aforementioned substrate cleaning system is The substrate cleaning system according to claim 1, further comprising a lower stopper positioned on the base such that it contacts the hinge portion when the support frame rotates in a second rotation direction opposite to the first rotation direction.

5. The aforementioned hinge portion is A hinge body connected to the frame body, A first flange extending from the hinge body and pressurizing the lower load cell, The substrate cleaning system according to claim 4, further comprising a second flange extending from the hinge body and pressurizing the lower stopper.

6. The lower load cell is The substrate cleaning system according to claim 5, wherein when the support frame rotates in the first rotational direction, the pressure applied by the first flange of the hinge portion is detected.

7. The aforementioned substrate cleaning system is A torque detection unit for detecting the rotational torque of the aforementioned rotary actuator, The system further includes a control unit, The control unit, Based on the pressure information detected by the lower load cell and the rotational torque information detected by the torque detection unit, the frictional force between the substrate and the lower brush is detected. The substrate cleaning system according to claim 6, wherein the operation of the rotary actuator is controlled based on the detected friction force information.

8. The aforementioned upper bracket is A first upper bracket portion connected to the upper brush, A second upper bracket portion extending from the first upper bracket portion and connected to the support frame, A substrate cleaning system according to claim 1, comprising: a third upper bracket portion extending from the second upper bracket portion and to which the upper load cell is connected.

9. The aforementioned lower bracket is A first lower bracket portion connected to the lower brush, A substrate cleaning system according to claim 1, comprising: a second lower bracket portion extending from the first lower bracket portion and connected to the support frame.