Component mounting device and pressure diagnostic method in component mounting device

Abstract

The objective is to provide a component mounting device and a pressure diagnostic method for a component mounting device that can accurately diagnose the pressure supplied from a pressure source. [Solution] The system includes a nozzle 22 for adsorbing component BH and mounting it onto a substrate KB, a nozzle communication conduit 23 communicating with the nozzle 22, a negative pressure supply conduit LN to which negative pressure is supplied from a vacuum pump PN as a negative pressure source, a valve unit 15 for intermittently supplying negative pressure from the negative pressure supply conduit LN to the nozzle communication conduit 23, a negative pressure sensor 16 for measuring the negative pressure supplied to the negative pressure supply conduit LN, and a diagnostic unit 35 that diagnoses the negative pressure supplied from the vacuum pump PN based on the negative pressure measured by the negative pressure sensor 16 when the supply of negative pressure from the negative pressure supply conduit LN to the nozzle communication conduit 23 is interrupted by the valve unit 15. The diagnostic unit 35 performs the above diagnosis based on the negative pressure measured after a predetermined time has elapsed since the vacuum pump PN was started.

Description

[[Technical Field]]

[0001] The present disclosure relates to a component mounting apparatus that sucks components by a nozzle and mounts the components on a substrate, and a pressure diagnosis method for a component mounting apparatus. [[Background Art]]

[0002] A component mounting apparatus that mounts components on a substrate introduces negative pressure supplied from a pressure source (vacuum pump) to a nozzle, and sucks components by suction pressure generated in the nozzle by this. Some such component mounting apparatuses that are provided with a function of determining (diagnosing) the state of negative pressure supplied from a vacuum pump based on the negative pressure supplied from the vacuum pump when starting a component mounting operation of mounting components on a substrate, for example, are known (see, for example, Patent Document 1 below). [[Prior Art Literature]] [[Patent Literature]]

[0003] [[Patent Document 1]] Japanese Unexamined Patent Publication No. 2012-33522 [[Summary of Invention]] [[Problem to be Solved by the Invention]]

[0004] However, in conventional component mounting apparatuses, since diagnosis of pressure (negative pressure) supplied from a pressure source (vacuum pump) is normally performed immediately after the pressure source is started, there has been a problem that the diagnosis result may be incorrect.

[0005] Accordingly, an object of the present disclosure is to provide a component mounting apparatus and a pressure diagnosis method for a component mounting apparatus that can accurately diagnose pressure supplied from a pressure source. [[Means for Solving the Problem]]

[0006] The component mounting apparatus of the present disclosure comprises a nozzle for adsorbing and mounting components onto a substrate, a nozzle communication conduit communicating with the nozzle, a negative pressure supply conduit from which negative pressure is supplied from a negative pressure source, an intermittent means for intermittently supplying negative pressure from the negative pressure supply conduit to the nozzle communication conduit, a negative pressure sensor for measuring the negative pressure supplied to the negative pressure supply conduit, and a diagnostic unit for diagnosing the negative pressure supplied from the negative pressure source based on the negative pressure measured by the negative pressure sensor when the supply of negative pressure from the negative pressure supply conduit to the nozzle communication conduit is interrupted by the intermittent means, wherein the diagnostic unit performs the diagnosis based on the negative pressure measured after a predetermined time has elapsed since the negative pressure source was activated.

[0007] The component mounting apparatus of the present disclosure comprises a nozzle for adsorbing and mounting components onto a substrate, a nozzle communication conduit communicating with the nozzle, a positive pressure supply conduit from which positive pressure is supplied from a positive pressure source, an intermittent means for intermittently supplying positive pressure from the positive pressure supply conduit to the nozzle communication conduit, a positive pressure sensor for measuring the positive pressure supplied to the positive pressure supply conduit, and a diagnostic unit for diagnosing the positive pressure supplied from the positive pressure source based on the positive pressure measured by the positive pressure sensor while positive pressure is being supplied from the positive pressure supply conduit to the nozzle communication conduit by the intermittent means, wherein the diagnostic unit performs the diagnosis based on the positive pressure measured after a predetermined time has elapsed since the positive pressure source was started.

[0008] The pressure diagnostic method for a component mounting apparatus according to the present disclosure comprises a nozzle for adsorbing and mounting components onto a substrate, a nozzle communication conduit communicating with the nozzle, a negative pressure supply conduit from which negative pressure is supplied from a negative pressure source, an intermittent means for intermittently supplying negative pressure from the negative pressure supply conduit to the nozzle communication conduit, and a negative pressure sensor for measuring the negative pressure supplied to the negative pressure supply conduit, wherein the diagnostic method for a component mounting apparatus diagnoses the negative pressure supplied from the negative pressure source based on the negative pressure measured by the negative pressure sensor when the supply of negative pressure from the negative pressure supply conduit to the nozzle communication conduit is interrupted by the intermittent means, and the diagnostic is performed based on the negative pressure measured after a predetermined time has elapsed since the negative pressure source was activated.

[0009] The pressure diagnostic method for a component mounting device according to the present disclosure comprises a nozzle for adsorbing and mounting components onto a substrate, a nozzle communication conduit communicating with the nozzle, a positive pressure supply conduit from which positive pressure is supplied from a positive pressure source, an intermittent means for intermittently supplying positive pressure from the positive pressure supply conduit to the nozzle communication conduit, and a positive pressure sensor for measuring the positive pressure supplied to the positive pressure supply conduit, wherein the diagnostic method for a component mounting device diagnoses the positive pressure supplied from the positive pressure source based on the positive pressure measured by the positive pressure sensor while positive pressure is being supplied from the positive pressure supply conduit to the nozzle communication conduit by the intermittent means, and the diagnostic is performed based on the positive pressure measured after a predetermined time has elapsed since the positive pressure source was started. [Effects of the Invention]

[0010] According to this disclosure, it is possible to accurately diagnose the pressure supplied from a pressure source. [Brief explanation of the drawing]

[0011] [Figure 1] This is a simplified configuration diagram of a component mounting system in one embodiment of the present disclosure. [Figure 2] This is a diagram showing the main components of a component mounting device that constitutes a component mounting system in one embodiment of the present disclosure. [Figure 3] This is a pneumatic circuit diagram relating to a nozzle in a component mounting device according to one embodiment of the present disclosure. [Figure 4] This figure shows the combination of operations between a vacuum valve and a blow valve that constitute a valve unit in a component mounting device according to one embodiment of the present disclosure. [Figure 5] This is a pneumatic circuit diagram relating to a nozzle in a component mounting device according to one embodiment of the present disclosure. [Figure 6] This is a pneumatic circuit diagram relating to a nozzle in a component mounting device according to one embodiment of the present disclosure. [Figure 7] This is a block diagram showing the control system of a component mounting device in one embodiment of the present disclosure. [Figure 8]This is a flowchart showing the flow of pressure diagnostics performed by a component mounting device in one embodiment of the present disclosure. [Modes for carrying out the invention]

[0012] Embodiments of the present disclosure will be described below with reference to the drawings. Figure 1 shows a component mounting system 10 in one embodiment of the present disclosure. The component mounting system 10 is a system for producing mounted substrates JK by mounting components BH on substrate KB, and includes a printing device 10A, a component mounting device 10B, an inspection device 10C, and a management device 10D.

[0013] In Figure 1, the printing device 10A, the component mounting device 10B, and the inspection device 10C are arranged in series in this order from upstream to downstream (from left to right in Figure 1), and each performs its predetermined task while sequentially passing the circuit board KB downstream. Specifically, the printing device 10A prints solder paste on the top surface of the incoming circuit board KB, and the component mounting device 10B mounts components BH onto the circuit board KB on which the printing device 10A has printed the solder paste. The inspection device 10C inspects the components BH mounted on the circuit board KB by the component mounting device 10B.

[0014] The control device 10D is signal-transmitted to the printing device 10A, the component mounting device 10B, and the inspection device 10C. The control device 10D receives information related to the work from the printing device 10A, the component mounting device 10B, and the inspection device 10C, and transmits the necessary information to the printing device 10A, the component mounting device 10B, and the inspection device 10C, respectively. This disclosure features the component mounting device 10B of such a component mounting system 10, which will be described below.

[0015] Figure 2 shows the main components of the component mounting device 10B. The component mounting device 10B is a device that performs component mounting work, mounting components BH onto a substrate KB, and includes a substrate positioning unit 11, a component supply unit 12, a mounting head 13, a head moving mechanism 14, a valve unit 15, a negative pressure sensor 16, a positive pressure sensor 17, and a control unit 18.

[0016] The substrate positioning portion 11 is composed of a pair of conveyors 11a, conveys the substrate KB in a direction perpendicular to the paper surface of FIG. 1 and positions it at a predetermined position. The component supply portion 12 is composed of, for example, a tape feeder, and supplies the component BH to be mounted on the substrate KB to the component take-out position 12K.

[0017] In FIG. 1, the mounting head 13 includes a shaft member 21 extending downward. An elevating means 13L is provided inside the mounting head 13, and the shaft member 21 is raised and lowered by the operation of the elevating means 13L. The head moving mechanism 14 is composed of, for example, an XY table, and moves the mounting head 13 in a horizontal plane direction.

[0018] In FIG. 3, a nozzle 22 is attached to the lower end of the shaft member 21 (see also FIG. 1). A nozzle inner conduit 22L extending downward is provided inside the nozzle 22. The nozzle inner conduit 22L is connected to a shaft inner flow path 21L extending vertically inside the shaft member 21. The shaft inner flow path 21L is connected to a nozzle communication conduit 23 that communicates to the outside from the side surface of the shaft member 21. That is, the nozzle communication conduit 23 communicates with the nozzle 22 via the shaft inner flow path 21L.

[0019] In FIG. 1 and FIG. 3, a vacuum pump PN and a positive pressure source PP are installed outside the component mounting apparatus 10B. The vacuum pump PN supplies negative pressure (negative pressure air) to a negative pressure supply conduit LN connected thereto, and the positive pressure source PP supplies positive pressure (positive pressure air) to a positive pressure supply conduit LP connected thereto. The valve unit 15 is connected to the nozzle communication conduit 23, and is also connected to the negative pressure supply conduit LN, the positive pressure supply conduit LP, and an atmosphere opening path LA opened to the atmosphere.

[0020] In FIG. 3, the valve unit 15 includes a vacuum valve 15a and a blow valve 15b. The vacuum valve 15a is connected to the nozzle communication conduit 23 and the negative pressure supply conduit LN, and the blow valve 15b is connected to the positive pressure supply conduit LP and the atmosphere opening path LA. The vacuum valve 15a and the blow valve 15b are connected by a connecting conduit SL.

[0021] In Figure 3, the vacuum valve 15a and the blow valve 15b are each composed of a two-position switchable electromagnetic solenoid valve. When both the vacuum valve 15a and the blow valve 15b are off (the electromagnetic solenoid is not energized), both the vacuum valve 15a and the blow valve 15b are in the normal position (Figure 3). At this time, the negative pressure air supplied from the vacuum pump PN flows into the nozzle communication line 23 through the vacuum valve 15a, and the positive pressure air supplied from the positive pressure source PP is blocked by the blow valve 15b. As a result, negative pressure air is supplied to the nozzle internal line 22L, and suction pressure is generated at the lower end of the nozzle 22 (see the "Suction" section in Figure 4).

[0022] As shown in Figure 5, when both the vacuum valve 15a and the blow valve 15b are turned on (the electromagnetic solenoid is energized), both the vacuum valve 15a and the blow valve 15b are in an offset position. At this time, the negative pressure air supplied from the vacuum pump PN is blocked by the vacuum valve 15a, and the positive pressure air supplied from the positive pressure source PP flows into the nozzle communication line 23 through the blow valve 15b and the vacuum valve 15a. As a result, positive pressure air is supplied to the nozzle internal line 22L, and blow pressure is generated at the lower end of the nozzle 22 (see the "Blow" section in Figure 4).

[0023] As shown in Figure 6, when the vacuum valve 15a is ON and the blow valve 15b is OFF, the vacuum valve 15a is in the offset position and the blow valve 15b is in the normal position. In this state, the negative pressure air supplied from the vacuum pump PN is blocked by the vacuum valve 15a, and the positive pressure air supplied from the positive pressure source PP is also blocked by the blow valve 15b. In this state, the nozzle communication line 23 is connected to the atmospheric opening line LA through the vacuum valve 15a and the blow valve 15b, so the nozzle internal line 22L is open to the atmosphere (see the "Open to the Atmosphere" section in Figure 4).

[0024] In this embodiment, the valve unit 15 is capable of switching between a state in which negative pressure is supplied from the negative pressure supply line LN to the nozzle communication line 23 (negative pressure air flows) by connecting the negative pressure supply line LN to the nozzle communication line 23 (suction state in Figure 3), and a state in which negative pressure is not supplied from the negative pressure supply line LN to the nozzle communication line 23 (negative pressure air does not flow) by not connecting the negative pressure supply line LN to the nozzle communication line 23 (blow state in Figure 5 or open to the atmosphere state in Figure 6). Furthermore, the valve unit 15 can switch between a state in which positive pressure is supplied from the positive pressure supply line LP to the nozzle communication line 23 (positive pressure air flows) by connecting the positive pressure supply line LP to the nozzle communication line 23 (blow state in Figure 5), and a state in which positive pressure is not supplied from the positive pressure supply line LP to the nozzle communication line 23 (positive pressure air does not flow) by not connecting the positive pressure supply line LP to the nozzle communication line 23 (suction state in Figure 3 or atmospheric release state in Figure 6).

[0025] In other words, in this embodiment, the valve unit 15 is an intermittent means that intermittently supplies negative pressure from the negative pressure supply line LN to the nozzle communication line 23, and intermittently supplies positive pressure from the positive pressure supply line LP to the nozzle communication line 23.

[0026] In Figure 7, the control unit 18 controls the substrate positioning unit 11, the component supply unit 12, the lifting / lowering means 13L of the mounting head 13, the head movement mechanism 14, and the valve unit 15. Specifically, the control unit 18 controls the substrate positioning unit 11 to transport and position the substrate KB, controls the component supply unit 12 to supply components BH, and controls the head movement mechanism 14 to move the mounting head 13. The control unit 18 also controls the lifting / lowering means 13L to raise and lower the shaft member 21 (i.e., the nozzle 22), and controls the vacuum valve 15a and blow valve 15b that constitute the valve unit 15 (power supply control to the electromagnetic solenoid) to generate suction pressure or blow pressure at the lower end of the nozzle 22, or to open the nozzle internal conduit 22L to the atmosphere.

[0027] In Figures 2 and 7, a touch panel 18T is connected to the control unit 18. The touch panel 18T functions as both an input unit and a display unit. By operating the touch panel 18T, the operator can input the necessary information to the control unit 18 (the input function of the touch panel 18T). The operator can also receive information transmitted by the control unit 18 through the touch panel 18T (the display function of the touch panel 18T).

[0028] In Figure 7, the control unit 18 is connected to the management device 10D via signal transmission. The control unit 18 can exchange signals and information with the management device 10D.

[0029] In Figure 3, the control unit 18 includes a storage unit 31, an operation control unit 32, a first timer 33, a second timer 34, and a diagnostic unit 35. The storage unit 31 stores a mounting operation program that records the operation procedures of each part when the component mounting device 10B performs component mounting work, as well as information on the circuit board KB and information on the components BH to be mounted on the circuit board KB. The storage unit 31 also stores data on reference values ​​(reference time for starting negative pressure diagnosis KTn and reference time for starting positive pressure diagnosis KTp) of pressure (negative pressure and positive pressure) necessary when performing pressure diagnosis, which will be described later. The operation control unit 32 controls the operation of each part of the component mounting device 10B based on the operation program stored in the storage unit 31.

[0030] The first timer 33 measures the elapsed time Tn after pump startup, which is the time elapsed since the vacuum pump PN was started, when the negative pressure supply line LN is not connected to the nozzle communication line 23 (blowout state in Figure 5). The second timer 34 measures the elapsed time Tp after positive pressure source startup, which is the time elapsed since the positive pressure source PP was started, when the positive pressure supply line LP is connected to the nozzle communication line 23 (blowout state in Figure 5).

[0031] The diagnostic unit 35 diagnoses the negative pressure supplied from the vacuum pump PN based on the magnitude of the negative pressure measured by the negative pressure sensor 16 when the negative pressure supply line LN and the nozzle communication line 23 are not connected (blowout state in Figure 5) (determines whether the negative pressure supplied from the vacuum pump PN is within the normal range). In addition, the diagnostic unit 35 diagnoses the positive pressure supplied from the positive pressure source PP based on the magnitude of the positive pressure measured by the positive pressure sensor 17 when the positive pressure supply line LP and the nozzle communication line 23 are connected (blowout state in Figure 5) (determines whether the positive pressure supplied from the positive pressure source PP is within the normal range).

[0032] As described above, the component mounting device 10B in this embodiment includes a nozzle 22 for adsorbing component BH and mounting it on a substrate KB, a nozzle communication line 23 communicating with the nozzle 22, a negative pressure supply line LN to which negative pressure is supplied from a vacuum pump PN as a negative pressure source, a positive pressure supply line LP to which positive pressure is supplied from a positive pressure source PP, and a valve unit 15 as an intermittent means for intermittently supplying negative pressure from the negative pressure supply line LN to the nozzle communication line 23 and intermittently supplying positive pressure from the positive pressure supply line LP to the nozzle communication line 23. Furthermore, the component mounting device 10B is equipped with a negative pressure sensor 16 that measures the negative pressure supplied to the negative pressure supply line LN and a positive pressure sensor 17 that measures the positive pressure supplied to the positive pressure supply line LP. It also includes a diagnostic unit 35 that diagnoses the negative pressure supplied from the vacuum pump PN based on the negative pressure (magnitude of negative pressure) measured by the negative pressure sensor 16 when the supply of negative pressure from the negative pressure supply line LN to the nozzle communication line 23 is cut off by the valve unit 15, and diagnoses the positive pressure supplied from the positive pressure source PP based on the positive pressure (magnitude of positive pressure) measured by the positive pressure sensor 17 when positive pressure is supplied from the positive pressure supply line LP to the nozzle communication line 23 by the valve unit 15.

[0033] When performing component mounting work to mount components BH onto a substrate KB using a component mounting device 10B with this configuration, the control unit 18 first activates the substrate positioning unit 11 to receive the substrate KB sent from the upstream device of the component mounting device 10B, and transports it horizontally to position it at a predetermined work position.

[0034] Once the substrate KB is positioned in the working position, the control unit 18 activates the head movement mechanism 14 to cause the mounting head 13 to repeatedly perform mounting turns. In one mounting turn, the mounting head 13 moves above the component supply unit 12 and performs a suction operation to pick up the component BH supplied by the component supply unit 12, and after the suction operation, moves above the substrate KB and performs a mounting operation to release the component BH and mount it onto the substrate KB.

[0035] During the mounting turn described above, when the component supply unit 12 supplies component BH to the nozzle 22, the control unit 18 turns on both the vacuum valve 15a and the blow valve 15b (Figure 3) while the lower end of the nozzle 22 is in contact with component BH, thereby generating suction pressure at the lower end of the nozzle 22. When the adsorbed component BH is released from the nozzle 22 and mounted on the substrate KB, the control unit 18 turns on both the vacuum valve 15a and the blow valve 15b (Figure 5) thereby generating blow pressure at the lower end of the nozzle 22. After the component BH is mounted on the substrate KB, the control unit 18 turns off only the blow valve 15b (Figure 6) to open the nozzle 22 to the atmosphere.

[0036] The component mounting device 10B repeatedly performs mounting turns with the mounting head 13 to mount the components BH to be mounted on the substrate KB, and then operates the substrate positioning unit 11 to transport the substrate KB downstream. This completes the component mounting work for one substrate KB.

[0037] The component mounting device 10B performs component mounting work according to the procedure described above. In addition to before commencing component mounting work, it also performs the following pressure diagnosis during periodic or ad-hoc maintenance. This pressure diagnosis diagnoses the negative pressure supplied from the vacuum pump PN based on the measurement results from the negative pressure sensor 16 (determining whether the negative pressure is at a normal value) and diagnoses the positive pressure supplied from the positive pressure source PP based on the measurement results from the positive pressure sensor 17 (determining whether the positive pressure is at a normal value).

[0038] Figure 8 is a flowchart showing the flow of pressure diagnosis performed by the component mounting device 10B. As shown in this flowchart, when the control unit 18 performs pressure diagnosis, it first activates the valve unit 15 and opens the nozzle 22 to the atmosphere (step ST1). Specifically, the control unit 18 turns on the vacuum valve 15a of the valve unit 15 and turns off the blow valve 15b (atmospheric opening state in Figure 6). The reason for initially opening the nozzle 22 to the atmosphere in this way is to remove the pressure (residual pressure) remaining in the nozzle 22 and the nozzle communication pipeline 23.

[0039] After the control unit 18 opens the nozzle 22 to the atmosphere to remove residual pressure in the nozzle 22 and the nozzle communication pipeline, it disconnects the negative pressure supply pipeline LN from the nozzle 22 and connects the positive pressure supply pipeline LP to the nozzle 22 (step ST2). Specifically, the control unit 18 turns on the vacuum valve 15a of the valve unit 15 and also turns on the blow valve 15b (blow state in Figure 5). In this state, the negative pressure air supplied from the vacuum pump PN is blocked by the vacuum valve 15a, and the positive pressure air supplied from the positive pressure source PP flows into the nozzle communication pipeline 23 (i.e., into the nozzle 22) through the blow valve 15b and the vacuum valve 15a.

[0040] In step ST2, the control unit 18 disconnects the negative pressure supply line LN from the nozzle 22 and connects the positive pressure supply line LP to the nozzle 22 (blowout state). Then, in step ST3, the control unit 18 starts the vacuum pump PN and the positive pressure source PP (step ST4). As a result, the negative pressure air supplied from the vacuum pump PN does not flow out of the nozzle 22 (air is not drawn in from the nozzle 22), simulating the state in which the part BH is adsorbed by the nozzle 22, and the pressure in the negative pressure supply line LN (i.e., the negative pressure supplied by the vacuum pump PN) at the time of adsorption of part BH can be accurately measured. In addition, the positive pressure air supplied from the positive pressure source PP flows out of the nozzle 22, simulating the blowout state, and the pressure in the positive pressure supply line LP (i.e., the positive pressure supplied by the positive pressure source PP) at the time of blowout can be accurately measured.

[0041] When the control unit 18 starts the vacuum pump PN and the positive pressure source PP respectively, the first timer 33 starts measuring the elapsed time Tn after the pumps have started (step ST5), and the second timer 34 starts measuring the elapsed time Tp after the positive pressure source has started (step ST6).

[0042] When the control unit 18 starts measuring the elapsed time Tp since the positive pressure source was started by the second timer 34, it waits until the elapsed time Tp measured by the second timer 34 reaches a preset positive pressure diagnosis start reference time KTp (for example, 1 second) (step ST7). When the elapsed time Tp since the positive pressure source was started reaches the positive pressure diagnosis start reference time KTp ("Y" in step ST7), the control unit 18 acquires the pressure (positive pressure) in the positive pressure supply pipeline LP measured by the positive pressure sensor 17 as positive pressure data (step ST8). Once the control unit 18 has acquired the positive pressure data, it stops the positive pressure source PP (stops the supply of positive pressure air by the positive pressure source PP) (step ST9).

[0043] After stopping the positive pressure source PP, the control unit 18 waits until the elapsed time Tn since pump startup, measured by the first timer 33, reaches a preset negative pressure diagnosis start reference time KTn (a time longer than the positive pressure diagnosis start reference time KTp, for example, 5 seconds) (step ST10). When the elapsed time Tn since pump startup reaches the negative pressure diagnosis start reference time KTn ("Y" in step ST10), the control unit 18 acquires the pressure (negative pressure) in the negative pressure supply pipeline LN, measured by the negative pressure sensor 16, as negative pressure data (step ST11). After acquiring the negative pressure data, the control unit 18 stops the vacuum pump PN (stops the supply of negative pressure air by the vacuum pump PN) (step ST12).

[0044] When the vacuum pump PN is stopped, the control unit 18 diagnoses the negative pressure supplied from the vacuum pump PN based on the pressure (negative pressure data) in the negative pressure supply pipeline LN measured by the negative pressure sensor 16 (determining whether the negative pressure is at a normal value), and diagnoses the positive pressure supplied from the positive pressure source PP based on the pressure (positive pressure data) in the positive pressure supply pipeline LP measured by the positive pressure sensor 17 (determining whether the positive pressure is at a normal value), and displays the diagnosis results on the touch panel 18T which serves as a display unit (step ST13).

[0045] Specifically, the control unit 18 compares the negative pressure data acquired in step ST11 with data within a predetermined range of appropriate negative pressure values ​​(appropriate negative pressure range). If the acquired negative pressure value is within the appropriate negative pressure range, it determines that the negative pressure data is normal and displays this on the touch panel 18T. If the acquired negative pressure value is not within the appropriate negative pressure range, it determines that the negative pressure data is abnormal and displays this on the touch panel 18T. Similarly, the control unit 18 compares the positive pressure data acquired in step ST8 with data within a predetermined range of appropriate positive pressure values ​​(appropriate positive pressure range). If the acquired positive pressure value is within the appropriate positive pressure range, it determines that the positive pressure data is normal and displays this on the touch panel 18T. If the acquired positive pressure value is not within the appropriate positive pressure range, it determines that the positive pressure data is abnormal and displays this on the touch panel 18T.

[0046] Thus, in the component mounting device 10B of this embodiment, the diagnosis of whether the negative pressure supplied from the vacuum pump PN (negative pressure in the negative pressure supply pipeline LN) is normal is performed based on the pressure (negative pressure) measured by the negative pressure sensor 16 after a predetermined time (negative pressure diagnosis start reference time KTn) has elapsed since the vacuum pump PN was started. In other words, the diagnosis is performed not immediately after the vacuum pump PN is started, when its operation is not yet stable, but after a predetermined time has elapsed since the vacuum pump PN was started and its operation has stabilized.

[0047] Furthermore, in the component mounting device 10B of this embodiment, the diagnosis of whether the positive pressure supplied from the positive pressure source PP (positive pressure in the positive pressure supply pipeline LP) is normal is performed based on the pressure (positive pressure) measured by the positive pressure sensor 17 after a predetermined time has elapsed since the positive pressure source PP was started. In other words, the diagnosis is performed not immediately after the positive pressure source PP is started, when its operation is not yet stable, but after a predetermined time has elapsed since the positive pressure source PP was started and its operation has stabilized.

[0048] The control unit 18 transmits the diagnostic results obtained in step ST13, namely information on whether the negative pressure supplied from the vacuum pump PN is normal and information on whether the positive pressure supplied from the positive pressure source PP is normal, to the management device 10D (step ST14). This allows the management device 10D to determine whether the vacuum pump PN that supplies negative pressure to the nozzle 22 of the component mounting device 10B and the positive pressure source PP that supplies positive pressure to the nozzle 22 of the component mounting device 10B are operating normally. If necessary, it transmits information on countermeasures to the component mounting device 10B, and the component mounting device 10B can give the operator the necessary instructions via the touch panel 18T.

[0049] As described above, the component mounting device 10B in this embodiment diagnoses whether the negative pressure supplied from the vacuum pump PN (i.e., the negative pressure supplied to the nozzle 22) is normal based on the pressure (negative pressure) measured after a predetermined time has elapsed since the vacuum pump PN was started, rather than the pressure (negative pressure) measured immediately after the vacuum pump PN was started. Similarly, the component mounting device 10B diagnoses whether the positive pressure supplied from the positive pressure source PP (i.e., the positive pressure supplied to the nozzle 22) is normal based on the pressure (positive pressure) measured after a predetermined time has elapsed since the positive pressure source PP was started, rather than the pressure (positive pressure) measured immediately after the positive pressure source PP was started.

[0050] Thus, in the component mounting device 10B of this embodiment, the diagnosis of the pressure (negative or positive pressure) supplied by the pressure source is performed not immediately after the start of the pressure source (vacuum pump PN or positive pressure source PP) when the operation of the pressure source is not yet stable, but after a predetermined time has elapsed since the start of the pressure source and the operation of the pressure source has stabilized. Therefore, the diagnosis can be performed accurately.

[0051] The embodiments of this disclosure are described above, and include the following technologies (component mounting devices and pressure diagnostic methods in component mounting devices).

[0052] (Item 1) A component mounting device (component mounting device 10B) comprises: a nozzle (nozzle 22) for adsorbing a component (component BH) and mounting it onto a substrate (substrate KB); a nozzle communication conduit (nozzle communication conduit 23) communicating with the nozzle; a negative pressure supply conduit (negative pressure supply conduit LN) from which negative pressure is supplied from a negative pressure source (vacuum pump PN); an intermittent means (valve unit 15) for intermittently supplying negative pressure from the negative pressure supply conduit to the nozzle communication conduit; a negative pressure sensor (negative pressure sensor 16) for measuring the negative pressure supplied to the negative pressure supply conduit; and a diagnostic unit (diagnostic unit 35) for diagnosing the negative pressure supplied from the negative pressure source based on the negative pressure measured by the negative pressure sensor when the supply of negative pressure from the negative pressure supply conduit to the nozzle communication conduit is interrupted by the intermittent means, wherein the diagnostic unit performs the diagnosis based on the negative pressure measured after a predetermined time has elapsed since the negative pressure source was started.

[0053] According to the component mounting device in item 1, it is possible to accurately diagnose the state of the pressure (negative pressure) supplied from the pressure source (negative pressure source).

[0054] (Item 2) A component mounting device comprising: a nozzle for adsorbing and mounting components onto a substrate; a nozzle communication conduit communicating with the nozzle; a positive pressure supply conduit (positive pressure supply conduit LP) from which positive pressure is supplied from a positive pressure source (positive pressure source PP); an intermittent means for intermittently supplying positive pressure from the positive pressure supply conduit to the nozzle communication conduit; a positive pressure sensor (positive pressure sensor 17) for measuring the positive pressure supplied to the positive pressure supply conduit; and a diagnostic unit for diagnosing the positive pressure supplied from the positive pressure source based on the positive pressure measured by the positive pressure sensor while positive pressure is being supplied from the positive pressure supply conduit to the nozzle communication conduit by the intermittent means, wherein the diagnostic unit performs the diagnosis based on the positive pressure measured after a predetermined time has elapsed since the positive pressure source was started.

[0055] According to the component mounting device in item 2, it is possible to accurately diagnose the state of the pressure (positive pressure) supplied from the pressure source (positive pressure source).

[0056] (Item 3) A pressure diagnostic method for a component mounting device, comprising: a nozzle for adsorbing and mounting components onto a substrate; a nozzle communication conduit communicating with the nozzle; a negative pressure supply conduit supplied with negative pressure from a negative pressure source; an intermittent means for intermittently supplying negative pressure from the negative pressure supply conduit to the nozzle communication conduit; and a negative pressure sensor for measuring the negative pressure supplied to the negative pressure supply conduit, wherein the diagnostic method for a component mounting device diagnoses the negative pressure supplied from the negative pressure source based on the negative pressure measured by the negative pressure sensor when the supply of negative pressure from the negative pressure supply conduit to the nozzle communication conduit is interrupted by the intermittent means, and the diagnostic method for a component mounting device is performed based on the negative pressure measured after a predetermined time has elapsed since the negative pressure source was activated.

[0057] According to the technology in item 3, as in the case of item 1, it is possible to accurately diagnose the state of the pressure (negative pressure) supplied from the pressure source (negative pressure source).

[0058] (Item 4) A pressure diagnostic method for a component mounting device, comprising: a nozzle for adsorbing and mounting components onto a substrate; a nozzle communication conduit communicating with the nozzle; a positive pressure supply conduit from which positive pressure is supplied from a positive pressure source; an intermittent means for intermittently supplying positive pressure from the positive pressure supply conduit to the nozzle communication conduit; and a positive pressure sensor for measuring the positive pressure supplied to the positive pressure supply conduit, wherein the diagnostic is performed based on the positive pressure measured by the positive pressure sensor while positive pressure is being supplied from the positive pressure supply conduit to the nozzle communication conduit by the intermittent means, and the diagnostic is performed based on the positive pressure measured after a predetermined time has elapsed since the positive pressure source was started.

[0059] According to the technology in item 4, as in the case of item 2, it is possible to accurately diagnose the state of the pressure (positive pressure) supplied from the pressure source (positive pressure source).

[0060] While embodiments of the present disclosure have been described so far, the technology of the present disclosure is not limited to those described above, and various modifications are possible. For example, in the above-described embodiment, the measurement of the elapsed time Tn after pump startup by the first timer 33 and the measurement of the elapsed time Tp after positive pressure source startup by the second timer 34 were performed in parallel in time, but the measurement of the elapsed time Tn after pump startup and the elapsed time Tp after positive pressure source startup may be performed sequentially. [Industrial applicability]

[0061] The present invention provides a component mounting device and a pressure diagnostic method for a component mounting device that can accurately diagnose the pressure supplied from a pressure source. [Explanation of symbols]

[0062] 10-component mounting system 10A printing device 10B Component mounting device 10C Inspection Device 10D management device 11 Substrate positioning section 12. Parts Supply Department 13 Mounted Heads 14. Head movement mechanism 15 Valve Unit 16. Negative pressure sensor 17. Positive pressure sensor 18 Control Unit 18T Touch Panel 21 Shaft component 22 nozzles 23 Nozzle connecting pipeline 31 Storage section 32 Operation Control Unit 33 First Timer 34 Second Timer 35. Diagnostic Department PN Vacuum Pump (Negative Pressure Source) PP positive pressure source LN negative pressure supply pipeline LP Positive pressure supply line Tn pump startup time Tp: Time elapsed since positive pressure source activation KTn Negative Pressure Diagnosis Start Criteria Time KTp (Keeping Time for Initiation of Positive Pressure Diagnosis) BH parts KB board

Claims

1. A nozzle that picks up components and mounts them onto a substrate, A nozzle communication conduit that communicates with the nozzle, A negative pressure supply pipeline from which negative pressure is supplied from a negative pressure source, Intermittent means for intermittently supplying negative pressure from the negative pressure supply pipeline to the nozzle communication pipeline, A negative pressure sensor for measuring the negative pressure supplied to the negative pressure supply pipeline, A diagnostic unit that diagnoses the negative pressure supplied from the negative pressure source based on the negative pressure measured by the negative pressure sensor while the supply of negative pressure from the negative pressure supply pipeline to the nozzle communication pipeline is interrupted by the intermittent means, Equipped with, The diagnostic unit performs the diagnosis based on the negative pressure measured after a predetermined time has elapsed since the negative pressure source was activated, in a component mounting device.

2. A nozzle that picks up components and mounts them onto a substrate, A nozzle communication conduit that communicates with the nozzle, A positive pressure supply pipeline from which positive pressure is supplied from a positive pressure source, Intermittent means for intermittently supplying positive pressure from the positive pressure supply pipeline to the nozzle communication pipeline, A positive pressure sensor for measuring the positive pressure supplied to the positive pressure supply pipeline, A diagnostic unit that diagnoses the positive pressure supplied from the positive pressure source based on the positive pressure measured by the positive pressure sensor while positive pressure is being supplied from the positive pressure supply pipeline to the nozzle communication pipeline by the intermittent means, Equipped with, The diagnostic unit performs the diagnosis based on the positive pressure measured after a predetermined time has elapsed since the positive pressure source was activated, in a component mounting device.

3. A pressure diagnostic method for a component mounting device comprising: a nozzle for adsorbing and mounting components onto a substrate; a nozzle communication conduit communicating with the nozzle; a negative pressure supply conduit supplied with negative pressure from a negative pressure source; an intermittent means for intermittently supplying negative pressure from the negative pressure supply conduit to the nozzle communication conduit; and a negative pressure sensor for measuring the negative pressure supplied to the negative pressure supply conduit, wherein the negative pressure supplied from the negative pressure source is diagnosed based on the negative pressure measured by the negative pressure sensor when the supply of negative pressure from the negative pressure supply conduit to the nozzle communication conduit is interrupted by the intermittent means, A pressure diagnostic method for a component mounting device, wherein the diagnosis is performed based on a negative pressure measured after a predetermined time has elapsed since the negative pressure source was activated.

4. A pressure diagnostic method for a component mounting device comprising: a nozzle for adsorbing and mounting components onto a substrate; a nozzle communication conduit communicating with the nozzle; a positive pressure supply conduit from which positive pressure is supplied from a positive pressure source; an intermittent means for intermittently supplying positive pressure from the positive pressure supply conduit to the nozzle communication conduit; and a positive pressure sensor for measuring the positive pressure supplied to the positive pressure supply conduit, wherein the positive pressure supplied from the positive pressure source is diagnosed based on the positive pressure measured by the positive pressure sensor while positive pressure is being supplied from the positive pressure supply conduit to the nozzle communication conduit by the intermittent means, A pressure diagnostic method for a component mounting device, wherein the diagnosis is performed based on a positive pressure measured after a predetermined time has elapsed since the positive pressure source was activated.

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