Manufacturing management system for electronic devices, and manufacturing method for electronic devices.

Abstract

In order to manufacture electronic devices by reusing components that have not yet exceeded their product lifespan, it was sometimes difficult to accurately determine whether or not a component had exceeded its product lifespan. [Solution] A method for manufacturing an electronic device comprising a circuit board, a control unit having a first component and a second component provided on the circuit board, and a drive unit controlled by the control unit, wherein when the control unit is to be reused in the manufacture of other electronic devices, the first component is to be determined to be reusable using a first criterion based on the power-on time of the electronic device, and the second component is to be determined to be reusable using a second criterion based on the operating time of the drive unit, and if the first component is determined not to need replacement using the first criterion, and the second component is determined not to need replacement using the second criterion, the control unit is to be reused in the manufacture of other electronic devices.

Description

[Technical Field]

[0001] The present invention relates to an electronic device manufacturing management system and an electronic device manufacturing method. [Background Art]

[0002] Conventionally, a technology related to so-called refurbishing, in which new electronic devices are manufactured by reconditioning used electronic devices, is known. For example, Patent Document 1 discloses a technology that, based on a current consumption value of a circuit board provided in an electronic device, determines whether each of a plurality of components provided on the circuit board has exceeded its product life, and reuses components that have not exceeded the product life. [Prior Art Document] [Patent Document]

[0003] [Patent Document 1] Japanese Unexamined Patent Publication No. 2004-239944 [Summary of the Invention] [Problem to be Solved by the Invention]

[0004] However, according to the conventional technology, since the product life of a plurality of components provided on a circuit board is determined using a single determination criterion based on the current consumption value of the circuit board, the determination on whether each of the plurality of components provided on the circuit board has exceeded its product life may be inaccurate. [Means for Solving the Problem]

[0005] To solve the above problems, the present invention provides a method for manufacturing an electronic device comprising: a first circuit board; a first control unit comprising a first component and a second component provided on the first circuit board; and a first drive unit controlled by the first control unit, wherein the third component is determined not to need replacement using a first criterion based on the energizing time of the other electronic device, and the If the fourth component is determined not to require replacement using a second criterion based on the operating time of the second drive unit, the electronic device is manufactured with a shorter quality assurance period than the other electronic device by adopting the second control unit provided by the other electronic device as the first control unit. If the third component is determined to require replacement using the first criterion, and the fourth component is determined not to require replacement using the second criterion, the electronic device is manufactured without using the second control unit provided by the other electronic device. If the third component is determined not to require replacement using the first criterion, and the fourth component is determined to require replacement using the second criterion, the electronic device is manufactured without using the second control unit provided by the other electronic device.

[0006] Furthermore, the manufacturing management system for electronic equipment according to the present invention comprises a first circuit board, a first control unit comprising a first component and a second component provided on the first circuit board, and a first drive unit controlled by the first control unit, the manufacturing management system for electronic equipment comprising a second circuit board, a third component having the same function as the first component and provided on the second circuit board, a fourth component having the same function as the second component and provided on the second circuit board, a second control unit having the same function as the first control unit, and a second drive unit controlled by the second control unit and having the same function as the first drive unit, the acquisition unit acquires first information indicating the power-on time of the other electronic equipment and second information indicating the drive time of the second drive unit, and the acquisition unit determines the necessity of replacing the third component using a first criterion based on the power-on time of the other electronic equipment and the first information. The invention is characterized by comprising: a determination unit that determines the necessity of replacing the fourth component using a second criterion based on the operating time of the second drive unit and the second information; if the determination unit determines that there is no need to replace the third component and that there is no need to replace the fourth component, it decides to manufacture the electronic device with a shorter quality assurance period than the other electronic device by adopting the second control unit provided by the other electronic device as the first control unit; if the determination unit determines that there is a need to replace the third component and that there is no need to replace the fourth component, it decides to manufacture the electronic device without using the second control unit provided by the other electronic device; and if the determination unit determines that there is no need to replace the third component and that there is a need to replace the fourth component, it decides to manufacture the electronic device without using the second control unit provided by the other electronic device. [Brief explanation of the drawing]

[0007] [Figure 1] This is a schematic diagram showing an example of the configuration of the manufacturing management system Sys according to an embodiment of the present invention. [Figure 2]This is a block diagram showing an example of the configuration of management server 9. [Figure 3] This is a block diagram showing an example of the configuration of the printing device 1. [Figure 4] This is a block diagram showing an example of the configuration of the drive signal generation circuit 40. [Figure 5] This is a perspective view showing an example of the structure of the drive control unit 5. [Figure 6] This is a plan view showing an example of the structure of the drive control unit 5. [Figure 7] This is a cross-sectional view showing an example of the structure of circuit board 500. [Figure 8] This is a schematic diagram illustrating an example of a dendrite DN. [Figure 9] This is a schematic diagram illustrating an example of a dendrite DN. [Figure 10] This is a flowchart illustrating an example of the operation of management server 9. [Figure 11] This is a flowchart illustrating an example of the operation of management server 9. [Figure 12] This is a flowchart illustrating an example of the operation of management server 9. [Figure 13] This is a flowchart illustrating an example of the operation of management server 9. [Figure 14] This flowchart shows an example of the operation of the management server 9 according to Modification 1 of the present invention. [Figure 15] This is a block diagram showing an example of the configuration of projector 1B according to modified example 2 of the present invention. [Figure 16] This is a perspective view showing an example of the structure of the display control unit 5B. [Modes for carrying out the invention]

[0008] Hereinafter, modes for carrying out the present invention will be described with reference to the drawings. However, in each drawing, the dimensions and scale of each part are appropriately changed from the actual ones. Further, the embodiments described below are preferred specific examples of the present invention, and thus various technically preferable limitations are applied thereto. However, the scope of the present invention is not limited to these modes unless there is a statement specifically limiting the present invention in the following description.

[0009] <<A. Embodiment>> In the present embodiment, a production management system Sys for reconditioning a used printing apparatus 1 to manufacture a new printing apparatus 1 will be described as an example.

[0010] <<A.1. Outline of Production Management System Sys>> An example of the configuration of the production management system Sys according to the present embodiment will be described below with reference to FIGS. 1 and 2.

[0011] FIG. 1 is a block diagram showing an example of the configuration of the production management system Sys.

[0012] As shown in FIG. 1, the production management system Sys includes a management server 9, a data acquisition device 81 capable of communicating with the management server 9 via a network NW, an inspection device 82 capable of communicating with the management server 9 via the network NW, and an instruction device 83 capable of communicating with the management server 9 via the network NW, and manages the process of reconditioning a used printing apparatus 1 to manufacture a new printing apparatus 1. In the following description, the used printing apparatus 1 to be reconditioned is referred to as a used printing apparatus 1x, and the new printing apparatus 1 manufactured by reconditioning the used printing apparatus 1x is referred to as a new printing apparatus 1y.

[0013] The data acquisition device 81 acquires usage status information DD from the used printing apparatus 1x. Here, the usage status information DD is information indicating the usage status of the used printing apparatus 1x.

[0014] The inspection device 82 inspects the circuit board 500 included in the used printing device 1x, and outputs board inspection result information DK indicating the inspection result. In the present embodiment, a case is assumed where the circuit board 500 is provided with an aluminum electrolytic capacitor Cd and a fan FN.

[0015] The management server 9 generates manufacturing instruction information DG based on usage status information DD supplied from the data acquisition device 81 and board inspection result information DK supplied from the inspection device 82, and supplies the generated manufacturing instruction information DG to the instruction device 83. Here, the manufacturing instruction information DG is information indicating reusable parts among the used printing device 1x when the used printing device 1x is rehabilitated to manufacture a new printing device 1y.

[0016] The instruction device 83 presents, based on the manufacturing instruction information DG, a screen displaying information indicating reusable parts among the used printing device 1x to a worker US who performs work of rehabilitating the used printing device 1x to manufacture the new printing device 1y.

[0017] In the following description, the process in which the management server 9 generates the manufacturing instruction information DG based on the usage status information DD and the board inspection result information DK, thereby giving instructions regarding manufacturing of the new printing device 1y to the worker US, is referred to as a "manufacturing management process".

[0018] FIG. 2 is a block diagram showing an example of the configuration of the management server 9.

[0019] As shown in FIG. 2, the management server 9 includes a control device 91, a storage device 92, and a communication device 93.

[0020] The storage device 92 is a recording medium that can be read by the control device 91. The storage device 92 is configured to include, for example, a volatile memory such as RAM (Random Access Memory) that functions as a work area for the control device 91, and a non-volatile memory such as EEPROM (Electrically Erasable Programmable Read-Only Memory) that stores various information, and stores usage status information DD, board inspection result information DK, manufacturing instruction information DG, reusability information DS, quality assurance period information DmT, remaining warranty period information DzT, and the control program PG of the management server 9.

[0021] Usage information DD includes power-on time information DC and printing time information DF.

[0022] The energizing time information DC is information indicating the energizing time TC. The energizing time TC is the energizing time for the printing device 1. In this embodiment, it is assumed that a voltage is applied to the aluminum electrolytic capacitor Cd during the period when power is supplied to the printing device 1. In other words, in this embodiment, the energizing time TC corresponds to the voltage application time for the aluminum electrolytic capacitor Cd.

[0023] The print time information DF is information indicating the print time TF. The print time TF is the time during which the printing device 1 performs the printing process to form an image on a medium such as printing paper. In this embodiment, it is assumed that the fan FN is operated during the period in which the printing device 1 performs the printing process. In other words, in this embodiment, the print time TF corresponds to the operating time of the fan FN. In this embodiment, the case in which the print time information DF indicates the print time TF is explained as an example, but the present invention is not limited to this embodiment. The print time information DF may also be information indicating the number of times the printing process is performed, or the print time information DF may also be information indicating the number of sheets of medium on which an image is formed by the printing process (number of printed sheets).

[0024] The substrate inspection result information DK includes standard inspection result information DK1 and rigorous inspection result information DK2.

[0025] Standard inspection result information DK1 is information that shows the results of the standard circuit board inspection. Here, the standard circuit board inspection is an inspection to determine whether or not the circuit board 500 meets the standard quality criteria. The rigorous inspection result information DK2 is information that shows the results of the rigorous circuit board inspection. Here, the rigorous circuit board inspection is an inspection to determine whether the circuit board 500 meets rigorous quality standards that are stricter than the standard quality standards.

[0026] Manufacturing instruction information DG includes board reuse instruction information DG1 and head reuse instruction information DG2.

[0027] The circuit board reuse instruction information DG1 is information that instructs the worker US who manufactures the new printing machine 1y whether or not to reuse the circuit board 500 that is installed in the used printing machine 1x when the used printing machine 1x is refurbished to manufacture the new printing machine 1y. The head reuse instruction information DG2 is information that instructs the worker US manufacturing the new printing machine 1y whether or not to reuse the head unit 3 equipped in the used printing machine 1x when the used printing machine 1x is refurbished to manufacture the new printing machine 1y. The head unit 3 will be described later in Figure 3.

[0028] The reusability information DS includes the capacitor reusability flag FC, the fan reusability flag FF, the head reusability flag FH, and the circuit board reusability flag FK.

[0029] The capacitor reuse flag FC indicates whether or not the aluminum electrolytic capacitor Cd installed in the used printing machine 1x can be reused in the manufacture of the new printing machine 1y when the used printing machine 1x is refurbished. The fan reuse flag FF indicates whether the fan FN of a used printing device 1x can be reused in the manufacture of a new printing device 1y when the used printing device 1x is refurbished. The head reuse flag FH indicates whether the head unit 3 of a used printing machine 1x can be reused in the manufacture of a new printing machine 1y when the used printing machine 1x is refurbished. The circuit board reuse flag FK indicates whether the circuit board 500 equipped in a used printing device 1x can be reused in the manufacture of a new printing device 1y when the used printing device 1x is refurbished.

[0030] The quality assurance period information DmT includes the capacitor quality assurance period information DmC, the fan quality assurance period information DmF, the head quality assurance period information DmH, and the circuit board quality assurance period information DmK.

[0031] The capacitor quality guarantee period information DmC indicates the quality guarantee period for the aluminum electrolytic capacitor Cd installed in the printing device 1, provided that the Cd is new and not a used part. Hereinafter, the quality guarantee period for a new aluminum electrolytic capacitor Cd will be referred to as the capacitor quality guarantee period TmC. The fan quality guarantee period information DmF indicates the quality guarantee period for the fan FN installed in the printing device 1, provided that the fan FN is new and not a used part. Hereinafter, the quality guarantee period for a new fan FN will be referred to as the fan quality guarantee period TmF. The head quality guarantee period information DmH indicates the quality guarantee period for the head unit 3 installed in the printing device 1, provided that the head unit 3 is new and not used. Hereinafter, the quality guarantee period for a new head unit 3 will be referred to as the head quality guarantee period TmH. The circuit board quality guarantee period information DmK indicates the quality guarantee period of a circuit board 500 installed in the printing apparatus 1, provided that the circuit board 500 is new and not a used item. Hereinafter, the quality guarantee period of a new circuit board 500 will be referred to as the circuit board quality guarantee period TmK.

[0032] The remaining warranty period information DzT includes the capacitor remaining warranty period information DzC, the fan remaining warranty period information DzF, the head remaining warranty period information DzH, and the circuit board remaining warranty period information DzK.

[0033] The capacitor remaining warranty period information DzC indicates the remaining warranty period for a used aluminum electrolytic capacitor Cd installed in a used printing machine 1x when that capacitor is reused in the manufacture of a new printing machine 1y. Hereinafter, the remaining warranty period for a used aluminum electrolytic capacitor Cd will be referred to as the capacitor remaining warranty period TzC. The remaining warranty period information DzF indicates the remaining warranty period for a used fan FN installed in a used printing machine 1x when that fan FN is reused in the manufacture of a new printing machine 1y. Hereinafter, the remaining warranty period for a used fan FN will be referred to as the remaining warranty period TzF. The head remaining warranty period information DzH indicates the remaining warranty period of a used head unit 3 installed in a used printing machine 1x when that unit is reused in the manufacture of a new printing machine 1y. Hereinafter, the remaining warranty period of the used head unit 3 will be referred to as the head remaining warranty period TzH. The remaining warranty period information DzK indicates the remaining warranty period for a used circuit board 500 installed in a used printing machine 1x when that circuit board 500 is reused in the manufacture of a new printing machine 1y. Hereinafter, the remaining warranty period for a used circuit board 500 will be referred to as the remaining warranty period TzK.

[0034] The control device 91 is configured to include a processor. The processor provided in the control device 91 is configured to include, for example, one or more CPUs (Central Processing Units). However, the processor provided in the control device 91 may be configured to include hardware such as a GPU (Graphics Processing Unit), DSP (Digital Signal Processor), ASIC (Application Specific Integrated Circuit), PLD (Programmable Logic Device), FPGA (Field Programmable Gate Array), etc., in addition to one or more CPUs, or in place of some or all of one or more CPUs. The processor provided in the control device 91 can function as an information acquisition unit 911, a replacement necessity determination unit 912, and a reuse determination unit 913 by executing a control program PG stored in the storage device 92 and operating according to the control program PG.

[0035] The information acquisition unit 911 acquires usage status information DD, which includes power-on time information DC and printing time information DF, from the used printing machine 1x via the data acquisition device 81. The information acquisition unit 911 also acquires the inspection results of the used printing machine 1x from the inspection device 82, namely, substrate inspection result information DK, which includes standard inspection result information DK1 and strict inspection result information DK2.

[0036] The replacement necessity determination unit 912, when refurbishing a used printing device 1x to manufacture a new printing device 1y, determines the necessity of replacing the aluminum electrolytic capacitor Cd provided on the circuit board 500 of the used printing device 1x based on the energizing time information DC, determines the necessity of replacing the fan FN provided on the circuit board 500 of the used printing device 1x based on the printing time information DF, determines the necessity of replacing the head unit 3 of the used printing device 1x based on the printing time information DF, and also determines the necessity of replacing the circuit board 500 of the used printing device 1x based on the standard inspection result information DK1.

[0037] Specifically, the replacement necessity determination unit 912 determines that there is no need to replace the aluminum electrolytic capacitor Cd if the energizing time TC indicated by the energizing time information DC is less than or equal to the threshold TthC, and determines that there is a need to replace the aluminum electrolytic capacitor Cd if it is greater than the threshold TthC. Furthermore, the replacement necessity determination unit 912 determines that there is no need to replace the fan FN if the printing time TF indicated by the printing time information DF is less than or equal to the threshold TthF, and determines that there is a need to replace the fan FN if it is greater than the threshold TthF. Furthermore, the replacement necessity determination unit 912 determines that there is no need to replace the head unit 3 if the print time TF indicated by the print time information DF is less than or equal to the threshold TthH, and determines that there is a need to replace the head unit 3 if it is greater than the threshold TthH. Furthermore, the replacement necessity determination unit 912 determines that there is no need to replace the circuit board 500 if the standard inspection result information DK1 indicates that the circuit board 500 meets the standard quality criteria, and determines that there is a need to replace the circuit board 500 if the standard inspection result information DK1 indicates that the circuit board 500 does not meet the standard quality criteria.

[0038] Then, if the replacement necessity determination unit 912 determines that there is no need to replace the aluminum electrolytic capacitor Cd, it sets the capacitor reuse flag FC to the value "1" which indicates that there is no need to replace the aluminum electrolytic capacitor Cd. If it determines that there is a need to replace the aluminum electrolytic capacitor Cd, it sets the capacitor reuse flag FC to the value "0" which indicates that there is a need to replace the aluminum electrolytic capacitor Cd. Furthermore, if the replacement necessity determination unit 912 determines that the fan FN does not need to be replaced, it sets the fan reuse flag FF to a value of "1" to indicate that the fan FN does not need to be replaced. If it determines that the fan FN does need to be replaced, it sets the fan reuse flag FF to a value of "0" to indicate that the fan FN needs to be replaced. Furthermore, if the replacement necessity determination unit 912 determines that the head unit 3 does not need to be replaced, it sets the head reuse flag FH to a value of "1" to indicate that the head unit 3 does not need to be replaced. If the unit determines that the head unit 3 does need to be replaced, it sets the head reuse flag FH to a value of "0" to indicate that the head unit 3 needs to be replaced. Furthermore, if the replacement necessity determination unit 912 determines that the circuit board 500 does not need to be replaced, it sets the board reuse flag FK to a value of "1" which indicates that the circuit board 500 does not need to be replaced. If the unit determines that the circuit board 500 does need to be replaced, it sets the board reuse flag FK to a value of "0" which indicates that the circuit board 500 needs to be replaced.

[0039] When a used printing device 1x is refurbished to manufacture a new printing device 1y, the reuse decision unit 913 decides, based on the determination result by the replacement necessity decision unit 912, whether or not to reuse the various parts of the used printing device 1x in the manufacture of the new printing device 1y.

[0040] Specifically, the reuse decision unit 913 decides to reuse the aluminum electrolytic capacitor Cd in the used printing device 1x for the manufacture of the new printing device 1y, provided that the capacitor reuse flag FC indicates a value of "1" which indicates that there is no need to replace the aluminum electrolytic capacitor Cd. Furthermore, when a used printing device 1x is refurbished to manufacture a new printing device 1y, the reuse decision unit 913 decides to reuse the fan FN of the used printing device 1x in the manufacture of the new printing device 1y, provided that the fan reuse flag FF indicates a value of "1" which indicates that there is no need to replace the fan FN. Furthermore, when a used printing device 1x is refurbished to manufacture a new printing device 1y, the reuse decision unit 913 decides to reuse the head unit 3 of the used printing device 1x in the manufacture of the new printing device 1y, provided that the head reuse flag FH indicates a value of "1" which indicates that there is no need to replace the head unit 3. Furthermore, when a used printing apparatus 1x is refurbished to manufacture a new printing apparatus 1y, the reuse determination unit 913 determines to divert the circuit board 500 included in the used printing apparatus 1x for use in manufacturing the new printing apparatus 1y, on condition that at least the board reuse flag FK indicates a value "1" representing that there is no need to replace the circuit board 500.

[0041] Then, the reuse determination unit 913 generates manufacturing instruction information DG including board diversion instruction information DG1 and head diversion instruction information DG2 based on a determination result of whether to divert various components included in the used printing apparatus 1x for manufacturing the new printing apparatus 1y, and supplies the generated manufacturing instruction information DG to the instruction apparatus 83.

[0042] The communication apparatus 93 is hardware for communicating with an external apparatus existing outside the management server 9 via the network NW. In the present embodiment, the information acquisition unit 911 acquires usage status information DD from the data acquisition apparatus 81 via the communication apparatus 93, and acquires board inspection result information DK from the inspection apparatus 82 via the communication apparatus 93. Furthermore, the reuse determination unit 913 supplies the manufacturing instruction information DG to the instruction apparatus 83 via the communication apparatus 93.

[0043] <<A.2.Outline of Printing Apparatus 1>> Hereinafter, an example of the configuration of the printing apparatus 1 according to the present embodiment will be described with reference to FIG. 3.

[0044] FIG. 3 is a functional block diagram showing an example of the configuration of the printing apparatus 1.

[0045] As shown in FIG. 3, image data Img representing an image to be formed by the printing apparatus 1 is supplied to the printing apparatus 1 from a host computer such as a personal computer or a digital camera. The printing apparatus 1 executes print processing for forming an image represented by the image data Img supplied from the host computer on recording paper PP.

[0046] As shown in Figure 3, the printing apparatus 1 comprises a printing control unit 2 that controls each part of the printing apparatus 1, a head unit 3 equipped with an ejection unit D that ejects ink onto recording paper PP, a drive signal generation unit 4 equipped with a drive signal generation circuit 40 that generates a drive signal Com for driving the ejection unit D, and a transport unit 6 for transporting the head unit 3 and the recording paper PP. Hereafter, the configuration including the printing control unit 2 and the drive signal generation unit 4 will be referred to as the "drive control unit 5".

[0047] In this embodiment, it is assumed that the printing apparatus 1 comprises one head unit 3 and one drive signal generation unit 4. However, the present invention is not limited to this embodiment. The printing apparatus 1 may also comprise a plurality of head units 3 and a plurality of drive signal generation units 4 that correspond one-to-one with the plurality of head units 3.

[0048] The print control unit 2 includes a print control circuit 21 and a memory circuit 22.

[0049] The memory circuit 22 is composed of a volatile memory such as RAM and a non-volatile memory such as ROM, EEPROM, or PROM, and stores various information such as the control program of the printing device 1. The memory circuit 22 also stores power-on time information DC, which indicates the power-on time TC, and printing time information DF, which indicates the printing time TF.

[0050] The printing control circuit 21 is configured to include one or more CPUs. However, the printing control circuit 21 may include a programmable logic device such as an FPGA instead of, or in addition to, a CPU. The printing control circuit 21 executes the control program for the printing device 1 stored in the memory circuit 22 and controls each part of the printing device 1 by operating according to the control program. Specifically, the printing control circuit 21 generates signals for controlling the operation of each part of the printing device 1, such as the designation signal SI, the waveform designation signal dCom, and the carrier control signal SH. The printing control circuit 21 also updates the power-on time TC indicated by the power-on time information DC according to the time the printing device 1 is powered on. Furthermore, the printing control circuit 21 updates the printing time TF indicated by the printing time information DF according to the time the printing device 1 is performing the printing process.

[0051] Here, the waveform specification signal dCom is a digital signal that defines the waveform of the drive signal Com. The drive signal Com is an analog signal for driving the ejection unit D. The specification signal SI is a digital signal that specifies the type of operation of the ejection unit D. Specifically, the specification signal SI specifies whether or not to supply the drive signal Com to the ejection unit D, thereby specifying the type of operation of the ejection unit D, such as whether or not ink is ejected from the ejection unit D. The transport control signal SH is a signal for controlling the transport unit 6.

[0052] When print processing is executed, the print control unit 2 generates signals for controlling the head unit 3, such as the designation signal SI, based on image data Img. Additionally, when print processing is executed, the print control unit 2 generates signals for controlling the drive signal generation unit 4, such as the waveform designation signal dCom. Furthermore, when print processing is executed, the print control unit 2 generates signals for controlling the conveyance unit 6, such as the conveyance control signal SH. Accordingly, in the print processing, the print control unit 2 controls the conveyance unit 6 to move the head unit 3 and the recording paper PP, while adjusting whether ink is ejected from the ejection unit D, the ink ejection timing, and the like, and controls each section of the printing apparatus 1 such that an image corresponding to the image data Img is formed on the recording paper PP.

[0053] The head unit 3 includes a supply circuit 31 and a head section 32. The head section 32 includes M ejection units D. Here, the value M is a natural number satisfying "M≧1". The supply circuit 31 switches whether to supply the drive signal Com to the ejection unit D based on the designation signal SI.

[0054] The drive control unit 5 includes a circuit board 500. In the present embodiment, a print control circuit 21 and a storage circuit 22 included in the print control unit 2, and a drive signal generation circuit 40 included in the drive signal generation unit 4 are provided on the circuit board 500.

[0055] <<A.3 Configuration of Drive Signal Generation Circuit 40>> An example of the configuration of the drive signal generation circuit 40 provided in the drive signal generation unit 4 will be described below with reference to FIG. 4.

[0056] FIG. 4 is a block diagram illustrating an example of the circuit configuration of the drive signal generation circuit 40.

[0057] As shown in Figure 4, the drive signal generation circuit 40 is a Class D amplifier circuit that comprises an integrated circuit 41, an amplification circuit 43, a smoothing circuit 44, a pull-up circuit 45, a filter circuit 46, and an aluminum electrolytic capacitor Cd, and generates a drive signal Com based on a waveform specification signal dCom.

[0058] The integrated circuit 41 is, for example, a Large Scale Integration (LSI) and generates gate signals SGH and SGL based on a waveform specification signal dCom supplied to terminal tIN via node nIN. The integrated circuit 41 includes an analog conversion circuit 412, a subtractor 414, an adder 416, an attenuator 418, an integral attenuator 422, a comparator 424, and a gate driver 426.

[0059] The analog conversion circuit 412 is a DAC (digital to analog converter) that converts the digital waveform specification signal dCom into an analog signal Aa. The voltage amplitude of signal Aa is, for example, about 0 to 2 volts, and the drive signal Com is obtained by amplifying this voltage by about 20 times. In other words, signal Aa is the signal before amplification of the drive signal Com. The integrating attenuator 422 outputs a signal Ax obtained by attenuating the signal SN1 input to terminal t1 (described later) and then integrating it. The subtractor 414 outputs a signal Ab, which represents the potential obtained by subtracting the potential of signal Aa from the potential of signal Ax. The attenuator 418 outputs a signal Ay, which is the signal SN2 input to terminal t2 (described later) with its high-frequency components attenuated. The adder 416 outputs a signal As, which represents the potential obtained by adding the potentials of signal Ab and signal Ay. Comparator 424 outputs a modulated signal Ms obtained by pulse-modulating signal As. Specifically, comparator 424 outputs a modulated signal Ms that becomes high level when signal As's voltage rises above threshold voltage Vth1, and low level when signal As's voltage falls below threshold voltage Vth2. The threshold voltages Vth1 and Vth2 are set to the relationship 'Vth1 > Vth2'.

[0060] The power supply voltage for the circuit from the analog conversion circuit 412 to the comparator 424 is a low voltage, such as 3.3 volts. In contrast, the drive signal Com has a large amplitude, sometimes exceeding 40 volts. Therefore, the integrating attenuator 422 attenuates the signal SN1, which has an amplitude corresponding to the drive signal Com, to match the amplitude range of the signal Ax to the amplitude range of the signal in the circuit from the analog conversion circuit 412 to the comparator 424. Furthermore, although a digital signal is used as an example to describe the waveform specification signal dCom in this embodiment, the waveform specification signal dCom can be any signal that defines the target value for generating the drive signal Com. For example, an analog signal Aa may be used as the waveform specification signal dCom. If signal Aa is the waveform specification signal dCom, the integrated circuit 41 may be configured without including the analog conversion circuit 412.

[0061] The gate driver 426 outputs a gate signal SGH, which is obtained by converting the modulated signal Ms to a specific amplitude, to node nH via terminal tH. The gate driver 426 also outputs a gate signal SGL, which is obtained by converting the inverted logic level of the modulated signal Ms to a specific amplitude, to node nL via terminal tL.

[0062] The amplification circuit 43 includes, for example, transistors TrH and TrL, and generates an amplified signal Az, which is a signal obtained by amplifying the modulated signal Ms, based on the gate signals SGH and SGL output from the integrated circuit 41. In this embodiment, as an example, it is assumed that transistors TrH and TrL are field-effect transistors. More specifically, in this embodiment, it is assumed that N-channel type metal-oxide-semiconductor field-effect transistors (MOSFETs) are used as transistors TrH and TrL.

[0063] The gate signal SGH, output from gate driver 426 to terminal tH, is input to the gate gate gt of transistor TrH via node nH and resistor RGH. Similarly, the gate signal SGL, output from gate driver 426 to terminal tL, is input to the gate gate gt of transistor TrL via node nL and resistor RGL. The logic levels of gate signals SGH and SGL are mutually exclusive. Here, "mutually exclusive" means that the signal level of gate signal SGH supplied to the gate gate gt of transistor TrH and the signal level of gate signal SGL supplied to the gate gate gt of transistor TrL can never be high at the same time; in other words, transistors TrH and TrL can never be turned on at the same time. Transistor TrH turns on when the potential of its gate gate gt is high, and turns off when the potential of its gate gate gt is low. The transistor TrL turns on when the potential of its gate electrode gt is high, and turns off when the potential of its gate electrode gt is low.

[0064] The drain electrode dt of transistor TrH is electrically connected to node nV, which is set to the high-potential power supply potential VHV, and the source electrode st is electrically connected to node nD. Similarly, the source electrode st of transistor TrL is electrically connected to node nG, which is set to ground potential, and the drain electrode dt is electrically connected to node nD. Alternatively, the source electrode of transistor TrL may be electrically connected to the power supply line LD, which is set to potential VBS.

[0065] As described above, transistor TrH turns on when the gate signal SGH supplied to the gate electrode gt is high level and turns off when it is low level. Transistor TrL turns on when the gate signal SGL supplied to the gate electrode gt is high level and turns off when it is low level. Therefore, the node nD that electrically connects the source electrode st of transistor TrH and the drain electrode dt of transistor TrL outputs an amplified signal Az, which is the modulated signal Ms amplified.

[0066] An aluminum electrolytic capacitor Cd is connected to node nV, to which the power supply potential VHV is supplied. One end of the aluminum electrolytic capacitor Cd is electrically connected to node nV, and the other end is electrically connected to node nG, which is set to ground potential. In this embodiment, the electrolytic capacitor Cd is, for example, a large-capacity aluminum electrolytic capacitor, which suppresses potential fluctuations at node nV and stabilizes the power supply potential VHV.

[0067] The smoothing circuit 44 is an LPF (Low Pass Filter) that smooths the amplified signal Az to generate the drive signal Com. The smoothing circuit 44 comprises an inductor L0 and a capacitor C0. One end of the inductor L0 is electrically connected to node nD, and the other end is electrically connected to node nX. One end of the capacitor C0 is electrically connected to node nX, and the other end is electrically connected to node nG, which is set to ground potential.

[0068] The pull-up circuit 45 feeds back the signal SN1, which is the drive signal Com output to node nX, to terminal t1. The pull-up circuit 45 includes a resistor R1, one end of which is electrically connected to node nX and the other end of which is electrically connected to terminal t1, and a resistor R2, one end of which is electrically connected to terminal t1 and the other end of which is electrically connected to node nV, which is set to the power supply potential VHV.

[0069] The filter circuit 46 is a Band Pass Filter (BPF) and feeds back a signal SN2, which is obtained by cutting the DC component from the frequency components of a predetermined band of the drive signal Com, to terminal t2. The filter circuit 46 comprises a resistor R3, a capacitor C1 with one end electrically connected to node nX and the other end electrically connected to one end of resistor R3, a resistor R4 with one end electrically connected to one end of resistor R3 and the other end electrically connected to node nG which is set to ground potential, a capacitor C2 with one end electrically connected to the other end of resistor R3 and the other end electrically connected to node nG which is set to ground potential, and a capacitor C3 with one end electrically connected to the other end of resistor R3 and the other end electrically connected to terminal t2. Of these, capacitor C1 and resistor R4 function as a High Pass Filter (HPF) that allows high-frequency components of the drive signal Com above the cutoff frequency to pass through. Furthermore, resistor R3 and capacitor C2 function as an LPF (Low Pass Filter) that allows low-frequency components of the drive signal Com below the cutoff frequency to pass through. In this embodiment, the cutoff frequency of the HPF is set lower than the cutoff frequency of the LPF in the filter circuit 46. Therefore, the filter circuit 46 allows frequency components of the drive signal Com that are above the cutoff frequency of the HPF and below the cutoff frequency of the LPF to pass through. In addition, because the filter circuit 46 is equipped with capacitor C3, the signal from which the DC component has been removed from the predetermined frequency component signal of the drive signal Com that has passed through the HPF and LPF is fed back to terminal t2.

[0070] As described above, the drive signal generation circuit 40 generates the drive signal Com by smoothing the amplified signal Az at the node nD with the smoothing circuit 44. The drive signal Com is integrated and subtracted by the integration attenuator 422, and then fed back to the subtractor 414. Accordingly, self-excited oscillation occurs at a frequency determined by the delay in the smoothing circuit 44, the delay in the integration attenuator 422, and the transfer function of the feedback. However, since the delay amount of the feedback path via the terminal t1 is large, the self-excited oscillation frequency cannot be increased to an extent sufficient to ensure sufficient accuracy of the waveform of the drive signal Com with only feedback via the terminal t1. In contrast, in the present embodiment, a path for feeding back the high-frequency component of the drive signal Com via the terminal t2 is provided separately from the path via the terminal t1, so that the feedback delay in the entire drive signal generation circuit 40 can be reduced. That is, in the present embodiment, the frequency of the signal As obtained by adding the signal Ay, which is a high-frequency component of the drive signal Com, to the signal Ab can be increased compared to the case where no path via the terminal t2 exists, so it is possible to sufficiently ensure the accuracy of the drive signal Com.

[0071] <<A.4 Configuration of Drive Control Unit 5>> Hereinafter, the configuration of the drive control unit 5 will be described with reference to FIGS. 5 to 9.

[0072] FIG. 5 is a perspective view illustrating an example of the configuration of the drive control unit 5.

[0073] As illustrated in FIG. 5, the drive control unit 5 includes a circuit board 500, and the print control unit 2, the drive signal generation unit 4, and the fan FN provided on the circuit board 500. More specifically, the drive control unit 5 includes the circuit board 500, and among an upper side surface 5001 and a lower side surface 5002 of the circuit board 500, the print control circuit 21, the storage circuit 22, the integrated circuit 41, the amplifier circuit 43, the smoothing circuit 44, the aluminum electrolytic capacitor Cd, and the fan FN provided on the upper side surface 5001. Note that in FIG. 5, illustration of some electronic components in the drive signal generation circuit 40 is omitted.

[0074] In this embodiment, we assume, as an example, that the circuit board 500 extends in a plane that extends in the X1 and Y1 directions and whose normal direction is the Z1 direction. Here, the Y1 direction is perpendicular to the X1 direction, and the Z1 direction is perpendicular to both the X1 and Y1 directions. Furthermore, in the following, the X1 direction and the X2 direction opposite to the X1 direction will be referred to as the X-axis direction, the Y1 direction and the Y2 direction opposite to the Y1 direction will be referred to as the Y-axis direction, and the Z1 direction and the Z2 direction opposite to the Z1 direction will be referred to as the Z-axis direction. In this embodiment, as an example, we will explain the case in which the X-axis direction, Y-axis direction, and Z-axis direction are perpendicular to each other. However, the present invention is not limited to this embodiment. The X-axis direction, Y-axis direction, and Z-axis direction only need to intersect with each other.

[0075] Furthermore, in this embodiment, it is assumed that the upper surface 5001 is a surface facing the Z1 direction, and the lower surface 5002 is a surface facing the Z2 direction, opposite to the upper surface 5001.

[0076] As shown in Figure 5, the circuit board 500 is divided into a digital drive region Ar1 and an analog drive region Ar2.

[0077] The digital drive region Ar1 is the region through which digital signals flow in the wiring and electronic components arranged in the digital drive region Ar1. In this embodiment, it is assumed that the printing control circuit 21, the memory circuit 22, the integrated circuit 41, and the fan FN are arranged in the digital drive region Ar1. The analog drive region Ar2 is the region through which analog signals flow in the wiring and electronic circuits located in the analog drive region Ar2. In this embodiment, it is assumed that an amplification circuit 43, a smoothing circuit 44, and an aluminum electrolytic capacitor Cd are arranged in the analog drive region Ar2. In this embodiment, the fan FN is described as being located in the digital drive region Ar1, but the present invention is not limited to this embodiment. The fan FN may also be located in the analog drive region Ar2. Furthermore, although this embodiment illustrates the case where the boundary B0 between the digital drive region Ar1 and the analog drive region Ar2 is a straight line, the shape of the boundary B0 is arbitrary.

[0078] As described above, in this embodiment, the digital signals such as the waveform specification signal dCom and the specification signal SI flowing through the printing device 1 are small amplitude signals of about 3.3 volts. In contrast, the analog signals such as the drive signal Com flowing through the printing device 1 are large amplitude signals of about 40 volts. Therefore, in this embodiment, a higher voltage is applied to the analog drive region Ar2 compared to the digital drive region Ar1.

[0079] Figure 6 is a plan view showing an example of the configuration of the drive control unit 5. Specifically, Figure 6 is a plan view showing an example of the configuration of the drive control unit 5 when the circuit board 500 is viewed from the Z1 direction to the Z2 direction.

[0080] As shown in Figure 6, the circuit board 500 is divided into an outer region AG and an inner region AN.

[0081] The outer peripheral region AG is the region between the outer peripheral EG of the circuit board 500 and a virtual boundary line BG provided at a predetermined distance from the outer peripheral EG. Specifically, the outer peripheral region AG includes the outer peripheral region AGy between the outer peripheral EGy defining the Y1 edge of the circuit board 500 and the virtual boundary line BGy provided at a predetermined distance from the outer peripheral EGy, and the outer peripheral region AGx between the outer peripheral EGx defining the X1 edge of the circuit board 500 and the virtual boundary line BGx provided at a predetermined distance from the outer peripheral EGy. In this embodiment, a flexible printed circuit board FP is provided in the outer peripheral region AGy. The flexible printed circuit board FP is a board on which wiring for supplying a drive signal Com from the circuit board 500 to the head unit 3 is provided. Furthermore, in the following, the region where the outer peripheral region AGx and the outer peripheral region AGy overlap will be referred to as the edge region AGxy. The edge region AGxy is the region that includes the intersection of the outer peripheral EGx and the outer peripheral EGy, that is, the vertices of the circuit board 500.

[0082] The internal region AN is a region where the distance from the outer periphery EG is greater than or equal to a predetermined distance. In this embodiment, it is assumed that various electronic components such as an integrated circuit 41, an amplification circuit 43, and a smoothing circuit 44 are provided in the internal region AN.

[0083] As shown in Figure 6, the circuit board 500 is provided with a signal through-hole HLc, a reference through-hole HLb, a standard inspection through-hole HLk1, and a high-precision inspection through-hole HLk2.

[0084] A signal through-hole HLc consists of a through-hole that penetrates the circuit board 500 in the Z-axis direction and wiring inserted through the through-hole. A drive signal Com is supplied to the signal through-hole HLc. In this embodiment, the signal through-hole HLc is located in the internal region AN. However, the signal through-hole HLc may be located in the outer peripheral region AG.

[0085] The reference through-hole HLb consists of a through-hole that penetrates the circuit board 500 in the Z-axis direction and wiring inserted through the through-hole. The reference through-hole HLb is set to ground potential. In this embodiment, the reference through-hole HLb is located in the internal region AN. However, the reference through-hole HLb may be located in the outer peripheral region AG.

[0086] The standard inspection through-hole HLk1 consists of a through-hole that penetrates the circuit board 500 in the Z-axis direction and wiring inserted through the through-hole. When the printing device 1 is in use, for example, during the printing process, no signal is supplied to the standard inspection through-hole HLk1, and it becomes, for example, electrically independent of other conductors and floats. When the circuit board 500 is inspected by the inspection device 82, an inspection signal is supplied to the standard inspection through-hole HLk1. Here, the inspection signal is a signal that has a potential different from the ground potential.

[0087] In this embodiment, the standard inspection through-hole HLk1 is located in the end region AGxy. However, the present invention is not limited to this embodiment. The standard inspection through-hole HLk1 may also be located in the outer peripheral region AG other than the end region AGxy, or in the inner region AN. Furthermore, in this embodiment, the standard inspection through-hole HLk1 is located in the analog drive region Ar2. However, the present invention is not limited to this embodiment. The standard inspection through-hole HLk1 may also be located in the digital drive region Ar1. Furthermore, in this embodiment, the distance LK1 between the standard inspection through-hole HLk1 and the reference through-hole HLb is shorter than the distance Lbc between the signal through-hole HLc and the reference through-hole HLb.

[0088] The through-hole HLk2 for strict inspection consists of a through-hole that penetrates the circuit board 500 in the Z-axis direction and wiring inserted through the through-hole. When the printing device 1 is in use, for example, during the execution of the printing process, no signal is supplied to the through-hole HLk2 for strict inspection, and it is in a floating state, for example. When the circuit board 500 is inspected by the inspection device 82, an inspection signal is supplied to the through-hole HLk2 for strict inspection.

[0089] In this embodiment, the through-hole HLk2 for precise inspection is located in the end region AGxy. However, the present invention is not limited to this embodiment. The through-hole HLk2 for precise inspection may also be located in the outer peripheral region AG other than the end region AGxy, or in the internal region AN. Furthermore, in this embodiment, the through-hole HLk2 for strict inspection is located in the analog drive region Ar2. However, the present invention is not limited to this embodiment. The through-hole HLk2 for strict inspection may also be located in the digital drive region Ar1. Furthermore, in this embodiment, the distance LK2 between the through-hole HLk2 for strict inspection and the reference through-hole HLb is shorter than the distance LK1 between the through-hole HLk1 for standard inspection and the reference through-hole HLb.

[0090] Figure 7 is a cross-sectional view showing an example of the configuration of the circuit board 500. Specifically, Figure 7 is a cross-sectional view of the circuit board 500 cut in the direction of Z1 such that when the circuit board 500 is viewed in the Z1 direction, it includes a broken line passing through the signal through-hole HLc, the reference through-hole HLb, and the standard test through-hole HLk1.

[0091] As shown in Figure 7, the circuit board 500 is a multilayer substrate consisting of multiple layers, including a surface layer 501, a wiring layer 502, an insulating layer 503, a wiring layer 504, an insulating layer 505, a wiring layer 506, and a surface layer 507, between the upper surface 5001 and the lower surface 5002.

[0092] The surface layer 501 is a layer including the upper surface 5001 and is composed of wiring 501L (not shown) and resist 501R. The wiring 501L is made of a conductive material such as copper or aluminum. The resist 501R is made of an insulating resin such as epoxy resin. The wiring layer 502 is provided between the surface layer 501 and the lower surface 5002, and consists of wiring 502L and an insulating part 502R. The wiring 502L is made of a conductive material such as copper or aluminum. The insulating part 502R is made of an insulating resin such as epoxy resin. The insulating layer 503 is provided between the wiring layer 502 and the lower surface 5002 and is composed of glass fibers GF and insulating resin PL. The glass fibers GF are fibrous glass arranged to extend along a plane normalized to the Z-axis direction. The insulating resin PL is an insulating resin such as epoxy resin.

[0093] The wiring layer 504 is provided between the insulating layer 503 and the lower surface 5002, and consists of wiring 504L and an insulating part 504R. The wiring 504L is made of a conductive material such as copper or aluminum. The insulating part 504R is made of an insulating resin such as epoxy resin. The insulating layer 505 is provided between the wiring layer 504 and the lower surface 5002, and is composed of glass fiber GF and insulating resin PL. The wiring layer 506 is provided between the insulating layer 505 and the lower surface 5002, and consists of wiring 506L and an insulating portion 506R. The wiring 506L is made of a conductive material such as copper or aluminum. The insulating portion 506R is made of an insulating resin such as epoxy resin. The surface layer 507 is a layer including the lower surface 5002 and is composed of wiring 507L (not shown) and resist 507R. The wiring 507L is made of a conductive material such as copper or aluminum. The resist 507R is made of an insulating resin such as epoxy resin.

[0094] As shown in Figure 7, the signal through-hole HLc, the reference through-hole HLb, the standard inspection through-hole HLk1, and the high-precision inspection through-hole HLk2 are provided so as to penetrate the circuit board 500 in the Z-axis direction (high-precision inspection through-hole HLk2 is not shown in Figure 7).

[0095] Incidentally, one of the factors contributing to the degradation of the circuit board 500 is the presence of dendrites, which are ions deposited from the metal contained in the circuit board 500 that propagate in a resinous manner. In particular, in the case of a circuit board 500, which is provided with glass fibers GF, the dendrites propagate along the glass fibers GF. As the dendrites propagate, two conductors that are spaced apart from each other, such as two through-holes, become electrically connected by the dendrites, causing a short circuit.

[0096] Generally, as the voltage applied to a dendrite increases, the dendrite's propagation speed also increases. For this reason, dendrites propagate more easily in the analog drive region Ar2 than in the digital drive region Ar1.

[0097] Furthermore, as the humidity of the environment in which the dendrites exist increases, the rate at which the dendrites move also increases. For this reason, the dendrites move quickly in the printing apparatus 1 equipped with a head unit 3 that ejects ink. In particular, the dendrites move faster in the outer peripheral region AG, which is more susceptible to the effects of ink mist, than in the inner region AN, which is less susceptible to the effects of ink mist floating inside the printing apparatus 1.

[0098] Furthermore, if the voltage applied to each part of the circuit board 500 is uniform, and the humidity in each part is also uniform, then dendrites will occur uniformly throughout the circuit board 500. And if the voltage applied to each part of the circuit board 500 is uniform, and the humidity in each part is also uniform, then the degree of dendrite progression will also be similar throughout the circuit board 500. Therefore, by checking for the presence or absence of a short circuit between the standard inspection through-hole HLk1 and the reference through-hole HLb, and between the rigorous inspection through-hole HLk2 and the reference through-hole HLb, it becomes possible to estimate the progress of dendrites between the signal through-hole HLc and the reference through-hole HLb.

[0099] Figure 8 is a schematic diagram showing the dendrite progression between the standard inspection through-hole HLk1 and the reference through-hole HLb. Figure 9 is a schematic diagram showing the dendrite progression between the signal through-hole HLc and the reference through-hole HLb.

[0100] As shown in Figure 8, at time T1 after product shipment from the printing device 1, the dendrite DN has progressed from the standard inspection through-hole HLk1 toward the reference through-hole HLb. However, at time T1, the length of the dendrite DN is shorter than the distance LK1, and the standard inspection through-hole HLk1 and the reference through-hole HLb remain in an isolated state. In this embodiment, the inspection device 82 checks whether or not current flows between the standard inspection through-hole HLk1 and the reference through-hole HLb by applying a voltage between them. The inspection device 82 also checks whether or not current flows between the strict inspection through-hole HLk2 and the reference through-hole HLb by applying a voltage between them. In the example shown in Figure 8, at time T1, even if the inspection device 82 applies a voltage between the standard inspection through-hole HLk1 and the reference through-hole HLb, no current flows between the standard inspection through-hole HLk1 and the reference through-hole HLb.

[0101] Subsequently, at time T2, the length of the dendrite DN becomes greater than or equal to the distance LK1, and the standard inspection through-hole HLk1 and the reference through-hole HLb become short-circuited. Therefore, at time T2, when the inspection device 82 applies a voltage between the standard inspection through-hole HLk1 and the reference through-hole HLb, a current flows between the standard inspection through-hole HLk1 and the reference through-hole HLb.

[0102] As shown in Figure 9, at time T1, the dendrite DN has progressed from the signal through-hole HLc towards the reference through-hole HLb. However, at time T1, the length of the dendrite DN is shorter than the distance LK1. Since the distance Lbc is longer than the distance LK1, at time T1, the length of the dendrite DN is shorter than the distance Lbc. Therefore, at time T1, if no current flows between the standard inspection through-hole HLk1 and the reference through-hole HLb even when the inspection device 82 applies a voltage between the standard inspection through-hole HLk1 and the reference through-hole HLb, it can be inferred that the signal through-hole HLc and the reference through-hole HLb are also in an isolated state.

[0103] Subsequently, at time T2, if the length of the dendrite DN becomes greater than or equal to the distance LK1, and the standard inspection through-hole HLk1 and the reference through-hole HLb are short-circuited, then the distance Lbc is longer than the distance LK1, and therefore the length of the dendrite DN is likely to be less than the distance Lbc. However, since the rate of dendrite DN propagation involves a probabilistic element, at time T2, if the standard inspection through-hole HLk1 and the reference through-hole HLb are short-circuited, there is also a possibility that the length of the dendrite DN is greater than or equal to the distance Lbc. Therefore, in this embodiment, at time T2, if the inspection device 82 applies a voltage between the standard inspection through-hole HLk1 and the reference through-hole HLb, and current flows between the standard inspection through-hole HLk1 and the reference through-hole HLb, then it is considered that the signal through-hole HLc and the reference through-hole HLb may also be short-circuited.

[0104] Note that the distance LK2 is longer than the distance LK1. Therefore, in the present embodiment, at time T2, even if the inspection device 82 applies a voltage between the strict inspection through-hole HLk2 and the reference through-hole HLb and a current flows between the strict inspection through-hole HLk2 and the reference through-hole HLb, if a voltage is applied between the standard inspection through-hole HLk1 and the reference through-hole HLb and no current flows between the standard inspection through-hole HLk1 and the reference through-hole HLb, the signal through-hole HLc and the reference through-hole HLb are also considered to be in an insulated state.

[0105] <<A.5. Manufacturing Management Process>> Hereinafter, the operation of the management server 9 when the manufacturing management process is executed will be described with reference to FIGS. 10 to 13.

[0106] FIGS. 10 to 13 are flowcharts showing an example of the operation of the management server 9 when the management server 9 executes the manufacturing management process. The flowcharts shown in FIGS. 10 to 13 are executed when a used printing apparatus 1x is reconditioned to manufacture a new printing apparatus 1y.

[0107] As shown in FIG. 10, when the manufacturing management process is started and the data acquisition device 81 acquires energization time information DC from the used printing apparatus 1x, the information acquisition unit 911 acquires the energization time information DC from the data acquisition device 81 (S101). Note that in step S101, the information acquisition unit 911 may acquire the energization time information DC directly from the used printing apparatus 1x.

[0108] Next, the replacement necessity determination unit 912 determines whether or not the energization time TC indicated by the energization time information DC is equal to or less than a threshold value TthC (S103).

[0109] If the result of the determination in step S103 is affirmative, the replacement necessity determination unit 912 determines that there is no need to replace the aluminum electrolytic capacitor Cd, and sets the value "1" representing that there is no need to replace the aluminum electrolytic capacitor Cd for the capacitor reuse flag FC (S105). Then, the reuse determination unit 913 calculates the remaining capacitor warranty period TzC by subtracting the energizing time TC indicated by the energizing time information DC obtained in step S101 from the capacitor warranty period TmC indicated by the capacitor warranty period information DmC (S107). After storing the calculated remaining capacitor warranty period information DzC, which represents the remaining capacitor warranty period TzC, in the storage device 92, the process proceeds to step S121.

[0110] If the result of the determination in step S103 is negative, the replacement necessity determination unit 912 determines that the aluminum electrolytic capacitor Cd needs to be replaced and sets the capacitor reuse flag FC to the value "0" which indicates that the aluminum electrolytic capacitor Cd needs to be replaced (S109). Then, the reuse determination unit 913 sets the capacitor quality guarantee period TmC indicated by the capacitor quality guarantee period information DmC as the capacitor remaining guarantee period TzC (S111), stores the capacitor remaining guarantee period information DzC indicating the capacitor remaining guarantee period TzC in the storage device 92, and proceeds to step S121.

[0111] Subsequently, the information acquisition unit 911 acquires the print time information DF from the data acquisition device 81 (S121). In step S121, the information acquisition unit 911 may also acquire the print time information DF directly from the used printing device 1x.

[0112] Next, the replacement necessity determination unit 912 determines whether the printing time TF indicated by the printing time information DF is less than or equal to the threshold TthF (S123).

[0113] If the result of the determination in step S123 is positive, the replacement necessity determination unit 912 determines that there is no need to replace the fan FN and sets the fan reuse flag FF to the value "1" which indicates that there is no need to replace the fan FN (S125). Then, the reuse determination unit 913 calculates the remaining fan warranty period TzF by subtracting the printing time TF indicated by the printing time information DF obtained in step S121 from the fan warranty period TmF indicated by the fan warranty period information DmF (S127), stores the fan remaining warranty period information DzF indicating the calculated remaining fan warranty period TzF in the storage device 92, and proceeds to step S141.

[0114] If the result of the determination in step S123 is negative, the replacement necessity determination unit 912 determines that the fan FN needs to be replaced and sets the fan reuse flag FF to the value "0" which indicates that the fan FN needs to be replaced (S129). Then, the reuse determination unit 913 sets the fan quality guarantee period TmF indicated by the fan quality guarantee period information DmF as the remaining fan guarantee period TzF (S131), stores the remaining fan guarantee period information DzF indicating the remaining fan guarantee period TzF in the storage device 92, and proceeds to step S141.

[0115] Subsequently, the replacement necessity determination unit 912 determines whether the printing time TF indicated by the printing time information DF is less than or equal to the threshold TthH (S141).

[0116] If the result of the determination in step S141 is positive, the replacement necessity determination unit 912 determines that there is no need to replace the head unit 3 and sets the head reuse flag FH to the value "1" which indicates that there is no need to replace the head unit 3 (S143). Then, the reuse determination unit 913 calculates the remaining head warranty period TzH by subtracting the printing time TF indicated by the printing time information DF obtained in step S121 from the head warranty period TmH indicated by the head warranty period information DmH (S145), stores the head remaining warranty period information DzH indicating the calculated head remaining warranty period TzH in the storage device 92, and proceeds to step S151.

[0117] If the result of the determination in step S141 is negative, the replacement necessity determination unit 912 determines that the head unit 3 needs to be replaced and sets the head reuse flag FH to the value "0" which indicates that the head unit 3 needs to be replaced (S147). Then, the reuse determination unit 913 sets the head quality guarantee period TmH indicated by the head quality guarantee period information DmH as the head remaining guarantee period TzH (S149), stores the head remaining guarantee period information DzH indicating the head remaining guarantee period TzH in the storage device 92, and proceeds to step S151.

[0118] As shown in Figure 11, the information acquisition unit 911 acquires standard inspection result information DK1 from the inspection device 82 (S151).

[0119] Next, the replacement necessity determination unit 912 determines whether the value indicated by the standard inspection result information DK1 is "1", which indicates that the circuit board 500 meets the standard quality criteria (S153). Furthermore, as a standard board inspection, the inspection device 82 applies a voltage between the standard inspection through-hole HLk1 and the reference through-hole HLb of the circuit board 500 equipped with the used printing device 1x. If no current flows between the standard inspection through-hole HLk1 and the reference through-hole HLb, and the standard inspection through-hole HLk1 and the reference through-hole HLb are deemed to be in an insulated state, the device sets a value of "1" in the standard inspection result information DK1 to indicate that the circuit board 500 meets the standard quality criteria. On the other hand, as a standard board inspection, the inspection device 82 applies a voltage between the standard inspection through-hole HLk1 and the reference through-hole HLb of the circuit board 500 equipped with the used printing device 1x. If a current flows between the standard inspection through-hole HLk1 and the reference through-hole HLb, and there is a possibility that the standard inspection through-hole HLk1 and the reference through-hole HLb are short-circuited, the device sets a value of "0" in the standard inspection result information DK1 to indicate that the circuit board 500 does not meet the standard quality criteria.

[0120] If the result of the determination in step S133 is negative, the replacement necessity determination unit 912 determines that the circuit board 500 needs to be replaced and sets the board reuse flag FK to the value "0" which indicates that the circuit board 500 needs to be replaced (S155). Then, the reuse determination unit 913 sets the substrate quality guarantee period TmK indicated by the substrate quality guarantee period information DmK as the remaining substrate guarantee period TzK (S157), stores the substrate remaining guarantee period information DzK indicating the said remaining substrate guarantee period TzK in the storage device 92, and proceeds to step S171.

[0121] If the result of the determination in step S153 is positive, the replacement necessity determination unit 912 determines that there is no need to replace the circuit board 500 and sets the board reuse flag FK to the value "1" which indicates that there is no need to replace the circuit board 500 (S159).

[0122] Next, the information acquisition unit 911 acquires the precise inspection result information DK2 from the inspection device 82 (S161).

[0123] Then, the replacement necessity determination unit 912 determines whether the value indicated by the strict inspection result information DK2 is "1", which indicates that the circuit board 500 meets the strict quality standards (S163). Furthermore, as part of a rigorous board inspection, the inspection device 82 applies a voltage between the rigorous inspection through-hole HLk2 and the reference through-hole HLb of the circuit board 500 equipped with the used printing device 1x. If no current flows between the rigorous inspection through-hole HLk2 and the reference through-hole HLb, and the rigorous inspection through-hole HLk2 and the reference through-hole HLb are deemed to be in an insulated state, the device sets a value of "1" in the rigorous inspection result information DK2 to indicate that the circuit board 500 meets the rigorous quality standards. On the other hand, as part of a strict board inspection, the inspection device 82 applies a voltage between the strict inspection through-hole HLk2 and the reference through-hole HLb of the circuit board 500 equipped with the used printing device 1x. If a current flows between the strict inspection through-hole HLk2 and the reference through-hole HLb, and there is a possibility that the strict inspection through-hole HLk2 and the reference through-hole HLb are short-circuited, the inspection device 82 sets a value of "0" in the strict inspection result information DK2 to indicate that the circuit board 500 does not meet the strict quality standards.

[0124] If the result of the determination in step S163 is positive, the reuse determination unit 913 sets the remaining substrate warranty period TzK indicated by the remaining substrate warranty period information DzK to period TzK1 (S165), and proceeds to step S171. If the result of the determination in step S163 is negative, the reuse determination unit 913 sets the remaining substrate warranty period TzK indicated by the remaining substrate warranty period information DzK to period TzK2 (S167), and proceeds to step S171. Here, periods TzK1 and TzK2 are periods that satisfy "TmK > TzK1 > TzK2 > 0". That is, period TzK1 is shorter than the substrate quality assurance period TmK and longer than period TzK2. Also, period TzK2 is shorter than period TzK1 and longer than "0".

[0125] As shown in Figure 12, the reuse determination unit 913 determines whether the substrate reuse flag FK indicates a value of "1" which indicates that there is no need to replace the circuit board 500 (S171).

[0126] If the result of the determination in step S171 is negative, the reuse decision unit 913 generates board reuse instruction information DG1 that instructs the replacement of the circuit board 500 (S173), and proceeds to step S197. If the result of the determination in step S171 is positive, the reuse determination unit 913 determines whether the capacitor reuse flag FC indicates a value of "1" which indicates that there is no need to replace the aluminum electrolytic capacitor Cd (S175).

[0127] If the result of the determination in step S175 is positive, the reuse determination unit 913 determines whether the fan reuse flag FF indicates a value of "1" which indicates that there is no need to replace the fan FN (S177).

[0128] If the result of the determination in step S177 is positive, the reuse decision unit 913 generates board reuse instruction information DG1 which instructs the reuse of the circuit board 500, the aluminum electrolytic capacitor Cd, and the fan FN (S179), and proceeds to step S197. If the result of the determination in step S177 is negative, the reuse decision unit 913 generates board reuse instruction information DG1 which instructs the reuse of the circuit board 500 and the aluminum electrolytic capacitor Cd after replacing the fan FN (S181), and proceeds to step S197.

[0129] If the result of the determination in step S175 is negative, the reuse determination unit 913 determines whether the fan reuse flag FF indicates a value of "1" which indicates that there is no need to replace the fan FN (S191).

[0130] If the result of the determination in step S191 is positive, the reuse decision unit 913 generates board reuse instruction information DG1 which instructs the reuse of the circuit board 500 and the fan FN after replacing the aluminum electrolytic capacitor Cd (S193), and proceeds to step S197. If the result of the determination in step S191 is negative, the reuse decision unit 913 generates board reuse instruction information DG1 that instructs the replacement of the circuit board 500 (S195), and proceeds to step S197.

[0131] Subsequently, the reuse decision unit 913 supplies the substrate reuse instruction information DG1 to the instruction device 83, causing the instruction device 83 to display a screen showing the substrate reuse instruction information DG1 (S197), and the process proceeds to step S201.

[0132] As shown in Figure 13, the reuse determination unit 913 determines whether the head reuse flag FH indicates a value of "1" which indicates that there is no need to replace the head unit 3 (S201).

[0133] If the result of the determination in step S201 is positive, the reuse decision unit 913 generates head reuse instruction information DG2 that instructs the reuse of the head unit 3 (S203), and proceeds to step S207. If the result of the determination in step S201 is negative, the reuse decision unit 913 generates head reuse instruction information DG2 that instructs the replacement of the head unit 3 (S205), and proceeds to step S207.

[0134] Subsequently, the reuse decision unit 913 supplies the head reuse instruction information DG2 to the instruction device 83, causing the instruction device 83 to display a screen showing the head reuse instruction information DG2 (S207).

[0135] Then, the reuse decision unit 913 determines whether or not to reuse the circuit board 500 when refurbishing the used printing device 1x to manufacture a new printing device 1y (S209). If the result of the determination in step S209 is positive, the reuse determination unit 913 notifies the new printing device 1y via the instruction device 83 of the capacitor remaining warranty period information DzC indicating the capacitor remaining warranty period TzC, the fan remaining warranty period information DzF indicating the fan remaining warranty period TzF, and the substrate remaining warranty period information DzK indicating the substrate remaining warranty period TzK (S211). Alternatively, in step S211, the reuse determination unit 913 may directly supply the capacitor remaining warranty period information DzC, the fan remaining warranty period information DzF, and the substrate remaining warranty period information DzK to the new printing device 1y. If the result of the determination in step S209 is negative, the reuse determination unit 913 proceeds to step S213.

[0136] Furthermore, the reuse decision unit 913 determines whether or not to reuse the head unit 3 when refurbishing a used printing device 1x to manufacture a new printing device 1y (S213). If the determination result in step S213 is affirmative, the reuse determining unit 913 notifies head remaining warranty period information DzH indicating the head remaining warranty period TzH to the new printing apparatus 1y via the instruction device 83 (S215), and terminates the manufacturing management process shown in the flowcharts of FIGS. 10 to 13. Note that the reuse determining unit 913 may directly supply the head remaining warranty period information DzH to the new printing apparatus 1y in step S215. If the determination result in step S213 is negative, the reuse determining unit 913 terminates the manufacturing management process shown in the flowcharts of FIGS. 10 to 13.

[0137] <<A.6.Summary of the First Embodiment>> As described above, according to the present embodiment, the suitability for reuse is determined using individual determination criteria respectively corresponding to the aluminum electrolytic capacitor Cd, the fan FN, the circuit board 500, and the head unit 3. Therefore, according to the present embodiment, compared to a mode in which the suitability for reuse of a plurality of components is determined using a common determination criterion, it is possible to accurately determine the suitability for reuse of each component.

[0138] Further, according to the present embodiment, the manufacturing management system Sys determines whether the circuit board 500 can be reused based on standard inspection result information DK1, which is the result of a standard board inspection for the used printing apparatus 1x, in addition to energization time information DC and printing time information DF acquired from the used printing apparatus 1x. Therefore, according to the present embodiment, compared to a mode in which the standard board inspection is not performed, it is possible to accurately determine the degree of deterioration of the circuit board 500, and thus it is possible to accurately determine the suitability for reuse of the circuit board 500.

[0139] Further, according to the present embodiment, the manufacturing management system Sys performs a strict board inspection on the used printing apparatus 1x in addition to the standard board inspection. Therefore, according to the present embodiment, compared to a mode in which the strict board inspection is not performed, it is possible to accurately determine the degree of deterioration of the circuit board 500 in multiple stages, and thus it is possible to accurately estimate the remaining warranty period of the circuit board 500 in multiple stages.

[0140] <<B. Modifications>> Each of the above embodiments can be modified in various ways. Specific modification examples are illustrated below. Any two or more embodiments arbitrarily selected from the following examples can be appropriately combined within a range not mutually inconsistent. In the modification examples illustrated below, for elements whose actions and functions are equivalent to those in the embodiments, the reference numerals referred to in the above description are reused, and detailed description of each element is omitted as appropriate.

[0141] <<Modification 1>> In the above-described embodiment, when a used printing apparatus 1x is refurbished to manufacture a new printing apparatus 1y, the case where the aluminum electrolytic capacitor Cd or the fan FN provided on the circuit board 500 is replaced as necessary has been illustrated and described. However, the present invention is not limited to such an embodiment. When a used printing apparatus 1x is refurbished to manufacture a new printing apparatus 1y, reuse or replacement may be performed in units of the circuit board 500, and replacement in units of various components such as the aluminum electrolytic capacitor Cd or the fan FN provided on the circuit board 500 may not be performed.

[0142] FIG. 14 is a flowchart showing an example of the operation of the management server 9 when the management server 9 executes the manufacturing management process according to the present modification. The manufacturing management process according to the present modification differs from the manufacturing management process according to the embodiment in that the processing of steps S303 to S311 shown in FIG. 14 is executed instead of the processing of steps S171 to S197 shown in FIG. 12 among the flowcharts shown in FIGS. 10 to 13. Therefore, in the present modification, detailed description of the processing of steps S101 to S167 shown in FIGS. 10 and 11 and the processing of steps S201 to S215 shown in FIG. 13 is omitted.

[0143] As shown in FIG. 14, when the manufacturing management process is started in the management server 9 and the processing of steps S101 to S167 shown in FIGS. 10 and 11 is executed, a reuse determining unit 913 determines whether or not a board reuse flag FK indicates a value "1" representing that there is no need to replace the circuit board 500 (S301).

[0144] If the result of the determination in step S301 is positive, the reuse determination unit 913 determines whether the capacitor reuse flag FC indicates a value of "1" which indicates that there is no need to replace the aluminum electrolytic capacitor Cd (S303). If the result of the determination in step S303 is positive, the reuse determination unit 913 determines whether the fan reuse flag FF indicates a value of "1" which indicates that there is no need to replace the fan FN (S305).

[0145] If the result of the determination in step S305 is positive, the reuse decision unit 913 generates board reuse instruction information DG1 which instructs the reuse of the circuit board 500, the aluminum electrolytic capacitor Cd, and the fan FN (S307), and proceeds to step S311. If the result of the determination in step S301 is negative, if the result of the determination in step S303 is negative, or if the result of the determination in step S305 is negative, the reuse determination unit 913 generates board reuse instruction information DG1 that instructs the replacement of the circuit board 500 (S309), and proceeds to step S311.

[0146] Subsequently, the reuse decision unit 913 supplies the substrate reuse instruction information DG1 to the instruction device 83, causing the instruction device 83 to display a screen showing the substrate reuse instruction information DG1 (S311), and the process proceeds to step S201 shown in Figure 13.

[0147] Thus, according to this modified example, when a used printing device 1x is refurbished to manufacture a new printing device 1y, the circuit board 500 is reused or replaced at the unit level, and individual components are not replaced. Therefore, compared to a method in which replacement work is carried out on individual components provided on the circuit board 500, the effort required to manufacture the new printing device 1y can be reduced.

[0148] <<Modification 2>> In the embodiments and modification 1 described above, the printing device 1 was used as an example of the electronic device to be refurbished, but the present invention is not limited to such embodiments. Any electronic device other than the printing device 1 can be used as the electronic device to be refurbished, such as a smartphone, digital camera, or projector.

[0149] Figure 15 is a functional block diagram showing an example of the configuration of projector 1B.

[0150] As shown in Figure 15, the projector 1B is supplied with video data Vd from a host computer such as a personal computer or digital camera, which indicates the image that the projector 1B should project. The projector 1B projects the image indicated by the video data Vd supplied from the host computer to the outside using the display unit 3B.

[0151] As shown in Figure 15, the projector 1B includes a display control unit 5B that generates a display control signal Ctr based on video data Vd, and a display unit 3B that projects the image indicated by the video data Vd based on the display control signal Ctr.

[0152] The display control unit 5B includes a display control circuit 51 that generates a display control signal Ctr based on video data Vd, and a storage circuit 52 that stores various information such as the control program for the projector 1B. The memory circuit 52 stores display time information DB and power-on time information DC. Power-on time information DC is information indicating the power-on time TC for the projector 1B. Display time information DB is information indicating the display time TB, which is the time the display unit 3B projects an image. Hereinafter, the circuit including the display control circuit 51 and the memory circuit 52 will be referred to as the drive control circuit 50B.

[0153] Figure 16 is a perspective view showing an example of the configuration of the display control unit 5B.

[0154] As shown in Figure 16, the display control unit 5B comprises a circuit board 500B and a display control circuit 51, a memory circuit 52, an aluminum electrolytic capacitor Cd, and a fan FN, all of which are provided on the circuit board 500B. In this modified example, the display control circuit 51, the memory circuit 52, and the fan FN are provided in the digital drive region Ar1, and the aluminum electrolytic capacitor Cd is provided in the analog drive region Ar2. Furthermore, circuit board 500B, like circuit board 500, is provided with signal through-holes HLc, reference through-holes HLb, standard inspection through-holes HLk1, and strict inspection through-holes HLk2.

[0155] In this modified example, the manufacturing management system Sys comprises a management server 9, a data acquisition device 81, an inspection device 82, and an instruction device 83, similar to the embodiment. The data acquisition device 81 acquires power-on time information DC and display time information DB from the projector 1B. The inspection device 82 inspects the circuit board 500B equipped with the projector 1B and outputs standard inspection result information DK1 and precise inspection result information DK2 indicating the inspection result. The management server 9 executes a manufacturing management process that generates board reuse instruction information DG1 and display unit reuse instruction information DG3 based on the power-on time information DC, display time information DB, standard inspection result information DK1, and strict inspection result information DK2. Here, the display unit reuse instruction information DG3 is information that instructs the worker US manufacturing the new projector 1B whether or not to reuse the display unit 3B that is equipped in the used projector 1B when a used projector 1B is refurbished to manufacture a new projector 1B. Note that the manufacturing management process according to this modified example is the same as the manufacturing management process according to the embodiment, except that display time information DB is used instead of print time information DF, and display unit reuse instruction information DG3 is generated instead of head reuse instruction information DG2. Based on the circuit board reuse instruction information DG1 and the display unit reuse instruction information DG3, the instruction device 83 displays a screen showing information indicating reusable parts from the used projector 1B to the worker US who is refurbishing the used projector 1B to manufacture a new projector 1B.

[0156] As described above, according to this modified version, the suitability of reusing parts is determined using individual criteria corresponding to each of the aluminum electrolytic capacitor Cd, fan FN, circuit board 500B, and display unit 3B. Therefore, according to this modified version, it is possible to accurately determine the suitability of reusing each individual part compared to a method in which the suitability of reusing multiple parts is determined using common criteria.

[0157] Furthermore, according to this modified version, the manufacturing management system Sys determines whether the circuit board 500B can be reused based on the standard inspection result information DK1, which is the result of a standard board inspection on the used projector 1B, in addition to the power-on time information DC and display time information DB obtained from the used projector 1B. Therefore, according to this modified version, compared to the configuration in which the standard board inspection is not performed, it becomes possible to determine the degree of deterioration of the circuit board 500B with greater accuracy, and to accurately determine whether the circuit board 500B can be reused.

[0158] Furthermore, according to this modified version, the manufacturing management system Sys performs a rigorous circuit board inspection on used projectors 1B in addition to the standard circuit board inspection. Therefore, according to this modified version, compared to the configuration in which the rigorous circuit board inspection is not performed, it becomes possible to accurately determine the degree of deterioration of the circuit board 500B and to accurately estimate the remaining warranty period of the circuit board 500B.

[0159] <<Modification 3>> In the embodiments and modification 1 described above, an example was given in which the drive control unit 5 is provided separately from the head unit 3. However, the present invention is not limited to this embodiment. Part or all of the drive control unit 5 may be mounted on the head unit 3.

[0160] <<C. Supplementary Notes>> Aspects related to the above description are additionally described below. To facilitate understanding of each aspect, reference signs of the drawings are added in parentheses for convenience hereinafter; however, this is not intended to limit the present invention to the illustrated aspects.

[0161] <<C.1. Supplementary Note 1>> Hereinafter, the production management system Sys according to Supplementary Note 1 will be described. In the following description, the circuit board (500) provided in a used printing apparatus (1x) may be referred to as a used circuit board (500x), the aluminum electrolytic capacitor (Cd) provided in the used printing apparatus (1x) may be referred to as a used aluminum electrolytic capacitor (Cdx), the fan (FN) provided in the used printing apparatus (1x) may be referred to as a used fan (FNx), the drive control unit (5) provided in the used printing apparatus (1x) may be referred to as a used drive control unit (5x), and the head unit (3) provided in the used printing apparatus (1x) may be referred to as a used head unit (3x). Further, in the following description, the circuit board (500) provided in a new printing apparatus (1y) may be referred to as a new circuit board (500y), the aluminum electrolytic capacitor (Cd) provided in the new printing apparatus (1y) may be referred to as a new aluminum electrolytic capacitor (Cdy), the fan (FN) provided in the new printing apparatus (1y) may be referred to as a new fan (FNy), the drive control unit (5) provided in the new printing apparatus (1y) may be referred to as a new drive control unit (5y), and the head unit (3) provided in the new printing apparatus (1y) may be referred to as a new head unit (3y).

[0162] <<Supplementary Note 1-1>> The manufacturing management system Sys relating to Appendix 1-1 is a manufacturing management system Sys for a new printing apparatus 1y comprising a new circuit board 500y, a new aluminum electrolytic capacitor Cdy provided on the new circuit board 500y, a new drive control unit 5y equipped with a new fan FNy provided on the new circuit board 500y, and a new head unit 3y controlled by the new drive control unit 5y, wherein the system also comprises a used circuit board 500x, a used aluminum electrolytic capacitor Cdx provided on the used circuit board 500x having the same function as the new aluminum electrolytic capacitor Cdy, and a used circuit board 500x. Information acquisition unit 911 acquires power-on time information DC indicating the power-on time TC of the used printing device 1x and printing time information DF indicating the printing time TF of the used head unit 3x from a used printing device 1x comprising: a used fan FNx provided on a circuit board 500x and having the same function as a new fan FNy; a used drive control unit 5x having the same function as a new drive control unit 5y; and a used head unit 3x controlled by the used drive control unit 5x and having the same function as a new head unit 3y; and a threshold Tth related to the power-on time TC of the used printing device 1x; and A replacement necessity determination unit 912 determines whether to replace a used aluminum electrolytic capacitor Cdx using C and energizing time information DC, and determines whether to replace a used fan FNx using a threshold TthF related to the printing time TF of the used printing device 1x and printing time information DF. If the replacement necessity determination unit 912 determines that there is no need to replace the used aluminum electrolytic capacitor Cdx and that there is no need to replace the used fan FNx, then the used drive control unit 5x equipped in the used printing device 1x is adopted as a new drive control unit 5y, thereby replacing the used printing device 1x If it is decided to manufacture a new printing device 1y with a shorter quality guarantee period than the quality guarantee period at the time of shipment, and the replacement necessity determination unit 912 determines that the used aluminum electrolytic capacitor Cdx needs to be replaced and that the used fan FNx does not need to be replaced, if it is decided to manufacture a new printing device 1y without using the used drive control unit 5x equipped in the used printing device 1x, and the replacement necessity determination unit 912 determines that the used aluminum electrolytic capacitor Cdx does not need to be replaced and that the used fan FNx needs to be replaced,It is characterized by comprising a reuse decision unit 913 that decides whether to manufacture a new printing device 1y without using the used drive control unit 5x that is equipped in the used printing device 1x. In addition, in Appendix 1, the new printing device 1y is an example of "electronic equipment," the new circuit board 500y is an example of "first circuit board," the new aluminum electrolytic capacitor Cdy is an example of "first component," the new fan FNy is an example of "second component," the new drive control unit 5y is an example of "first control unit," the new head unit 3y is an example of "first drive unit," the used printing device 1x is an example of "other electronic equipment," the used circuit board 500x is an example of "second circuit board," and the used aluminum electrolytic capacitor Cdx is an example of "third component." The first example of a "part" is the used fan FNx, the second example of the used drive control unit 5x is the used drive control unit, the second example of the used head unit 3x is the used drive unit, the information acquisition unit 911 is the information acquisition unit, the replacement necessity determination unit 912 is the replacement determination unit, the reuse determination unit 913 is the reuse determination unit, the energizing time information DC is the first example of the information, the printing time information DF is the second example of the information, the threshold TthC is the first example of the criteria, and the threshold TthF is the second example of the criteria.

[0163] According to Appendix 1-1, the suitability of reusing a used aluminum electrolytic capacitor Cdx and a used fan FNx is determined using threshold values ​​TthC and TthF, which are individual judgment criteria corresponding to each component. Therefore, according to Appendix 1-1, it is possible to accurately determine the suitability of reusing each component compared to a method in which the suitability of reusing multiple components is determined using common judgment criteria.

[0164] <<Note 1-2>> The manufacturing management system Sys relating to Appendix 1-2 is a manufacturing management system Sys for a new printing apparatus 1y comprising a new circuit board 500y, a new aluminum electrolytic capacitor Cdy provided on the new circuit board 500y, a new drive control unit 5y equipped with a new fan FNy provided on the new circuit board 500y, and a new head unit 3y controlled by the new drive control unit 5y, wherein the system also comprises a used circuit board 500x, a used aluminum electrolytic capacitor Cdx provided on the used circuit board 500x having the same function as the new aluminum electrolytic capacitor Cdy, Information acquisition unit 911 acquires power-on time information DC indicating the power-on time TC of the used printing device 1x, and printing time information DF indicating the printing time TF of the used head unit 3x from a used printing device 1x comprising: a used fan FNx provided on a used circuit board 500x and having the same function as a new fan FNy; a used drive control unit 5x having the same function as a new drive control unit 5y; and a used head unit 3x controlled by the used drive control unit 5x and having the same function as a new head unit 3y; and information acquisition unit 911 acquires power-on time information DC indicating the power-on time TC of the used printing device 1x, and printing time information DF indicating the printing time TF of the used head unit 3x, and information acquisition unit 911 acquires power-on time information DC indicating the power-on time TC of the used printing device 1x A replacement necessity determination unit 912 determines whether it is necessary to replace a used aluminum electrolytic capacitor Cdx using a threshold TthC and energizing time information DC, and determines whether it is necessary to replace a used fan FNx using a threshold TthF related to the printing time TF of the used printing device 1x and printing time information DF. If the replacement necessity determination unit 912 determines that it is not necessary to replace the used aluminum electrolytic capacitor Cdx and that it is not necessary to replace the used fan FNx, then the used drive control unit 5x equipped in the used printing device 1x is adopted as a new drive control unit 5y. If it is decided to manufacture a new printing device 1y with a shorter quality guarantee period than the quality guarantee period of the used printing device 1x at the time of shipment, and the replacement necessity determination unit 912 determines that the used aluminum electrolytic capacitor Cdx needs to be replaced, and that the used fan FNx does not need to be replaced, then the used aluminum electrolytic capacitor Cdx is removed from the used circuit board 500x, a new aluminum electrolytic capacitor Cdy is newly placed on the used circuit board 500x, and the used fan FNx on the used circuit board 500x is adopted as the new fan FNy,The invention is characterized by comprising a reuse determination unit 913 that determines to manufacture a new printing device 1y with a shorter quality guarantee period than the quality guarantee period at the time of shipment of the used printing device 1x, by adopting the used circuit board 500x, after a new aluminum electrolytic capacitor Cdy has been installed, as a new circuit board 500y.

[0165] <<Appendix 1-3>> The manufacturing management system Sys relating to Appendix 1-3 is a manufacturing management system Sys for a new printing apparatus 1y comprising a new circuit board 500y, a new aluminum electrolytic capacitor Cdy provided on the new circuit board 500y, a new drive control unit 5y equipped with a new fan FNy provided on the new circuit board 500y, and a new head unit 3y controlled by the new drive control unit 5y, wherein the system also comprises a used circuit board 500x, a used aluminum electrolytic capacitor Cdx provided on the used circuit board 500x having the same function as the new aluminum electrolytic capacitor Cdy, Information acquisition unit 911 acquires power-on time information DC indicating the power-on time TC of the used printing device 1x, and printing time information DF indicating the printing time TF of the used head unit 3x from a used printing device 1x comprising: a used fan FNx provided on a used circuit board 500x and having the same function as a new fan FNy; a used drive control unit 5x having the same function as a new drive control unit 5y; and a used head unit 3x controlled by the used drive control unit 5x and having the same function as a new head unit 3y; and information acquisition unit 911 acquires power-on time information DC indicating the power-on time TC of the used printing device 1x, and printing time information DF indicating the printing time TF of the used head unit 3x, and information acquisition unit 911 acquires power-on time information DC indicating the power-on time TC of the used printing device 1x A replacement necessity determination unit 912 determines whether it is necessary to replace a used aluminum electrolytic capacitor Cdx using a threshold TthC and energizing time information DC, and determines whether it is necessary to replace a used fan FNx using a threshold TthF related to the printing time TF of the used printing device 1x and printing time information DF. If the replacement necessity determination unit 912 determines that it is not necessary to replace the used aluminum electrolytic capacitor Cdx and that it is not necessary to replace the used fan FNx, then the used drive control unit 5x equipped in the used printing device 1x is adopted as a new drive control unit 5y. If it is decided to manufacture a new printing device 1y with a shorter quality guarantee period than the quality guarantee period of the used printing device 1x at the time of shipment, and the replacement necessity determination unit 912 determines that there is no need to replace the used aluminum electrolytic capacitor Cdx, but determines that there is a need to replace the used fan FNx, the used fan FNx is removed from the used circuit board 500x, a new fan FNy is newly installed on the used circuit board 500x, and the used aluminum electrolytic capacitor Cdx on the used circuit board 500x is adopted as the new aluminum electrolytic capacitor Cdy,The invention is characterized by comprising a reuse decision unit 913 that decides to manufacture a new printing device 1y with a shorter quality guarantee period than the quality guarantee period at the time of shipment of the used printing device 1x, by adopting the used circuit board 500x, after the new fan FNy has been installed, as a new circuit board 500y.

[0166] <<Notes 1-4>> The manufacturing management system Sys relating to Appendix 1-4 is the manufacturing management system Sys relating to Appendix 1-1 to Appendix 1-3, characterized in that the reuse determination unit 913 determines, using a threshold TthC, that a used aluminum electrolytic capacitor Cdx needs to be replaced, and using a threshold TthF, that a used fan FNx needs to be replaced, and then decides to manufacture a new printing device 1y without using the used drive control unit 5x provided in the used printing device 1x.

[0167] <<Appendix 1-5>> The manufacturing management system Sys relating to Appendix 1-5 is the manufacturing management system Sys relating to Appendix 1-1 to Appendix 1-4, characterized in that the reuse decision unit 913 decides to manufacture a new printing device 1y without using the used drive control unit 5x provided in the used printing device 1x if the used circuit board 500x is contaminated or damaged.

[0168] <<Appendix 1-6>> The manufacturing management system Sys relating to Appendix 1-6 is the manufacturing management system Sys relating to Appendix 1-1 to Appendix 1-5, and is characterized in that it includes an inspection device 82 for inspecting the internal wiring of a used circuit board 500x, and the reuse decision unit 913 decides to manufacture a new printing device 1y without using the used drive control unit 5x equipped in the used printing device 1x if the standard inspection result information DK1 indicating the inspection result by the inspection device 82 indicates that there is a certain or greater possibility that the internal wiring of the used circuit board 500x is damaged. Note 1: In addition, the inspection device 82 is an example of an "inspection unit".

[0169] <<C.2. Supplementary Note 2>> Hereinafter, the printing apparatus 1 according to Supplementary Note 2 will be described.

[0170] <<Supplementary Note 2-1>> The printing apparatus 1 according to Supplementary Note 2-1 is a printing apparatus 1 comprising a circuit board 500, comprising: a signal through-hole HLc to which a drive signal Com for driving the printing apparatus 1 is supplied; a reference through-hole HLb set to a ground potential; and a standard inspection through-hole HLk1 to which no signal is supplied when the printing apparatus 1 is in use, wherein a distance LK1 between the reference through-hole HLb and the standard inspection through-hole HLk1 is shorter than a distance Lbc between the reference through-hole HLb and the signal through-hole HLc. In Supplementary Note 2, the printing apparatus 1 is an example of "electronic equipment", the standard inspection through-hole HLk1 is an example of "first inspection through-hole", the drive signal Com is an example of "electrical signal", and the ground potential is an example of "reference potential".

[0171] According to Supplementary Note 2-1 and the present modification, the standard inspection through-hole HLk1, which is closer to the reference through-hole HLb than the signal through-hole HLc is, is arranged on the circuit board 500. Therefore, when the circuit board 500 is reused, it becomes possible to inspect the progress degree of dendrites DN on the circuit board 500.

[0172] <<Supplementary Note 2-2>> The printing apparatus 1 according to Supplementary Note 2-2 is the printing apparatus 1 according to Supplementary Note 2-1, wherein the circuit board 500 includes a digital drive area Ar1 through which a digital signal flows and an analog drive area Ar2 through which an analog signal flows, and the reference through-hole HLb and the standard inspection through-hole HLk1 are arranged in the analog drive area Ar2. In Supplementary Note 2, the digital signal is an example of "a signal of a first voltage", the analog signal is an example of "a signal of a second voltage", the digital drive area Ar1 is an example of "a first area", and the analog drive area Ar2 is an example of "a second area".

[0173] <<Note 2-3>> The printing apparatus 1 relating to Appendix 2-3 is the printing apparatus 1 relating to Appendix 2-1 or Appendix 2-2, characterized in that the circuit board 500 includes an outer peripheral region AG including the outer peripheral EG of the circuit board 500, and the standard inspection through-hole HLk1 is arranged in the outer peripheral region AG.

[0174] <<Note 2-4>> The printing apparatus 1 described in Appendix 2-4 is the printing apparatus 1 described in Appendix 2-1 to Appendix 2-3, characterized in that the circuit board 500 has a polygonal shape, and the standard inspection through-hole HLk1 is arranged in the edge region AGxy including the vertices of the circuit board 500.

[0175] <<Note 2-5>> The printing apparatus 1 relating to Appendix 2-5 is the printing apparatus 1 relating to Appendix 2-1 to Appendix 2-4, and is characterized in that it includes a through-hole HLk2 for strict inspection to which no signal is supplied when the printing apparatus 1 is in use, and the distance LK2 between the reference through-hole HLb and the through-hole HLk2 for strict inspection is shorter than the distance LK1 between the reference through-hole HLb and the standard inspection through-hole HLk1. Note 2 states that the through-hole HLk2 for strict inspection is an example of a "second inspection through-hole".

[0176] According to Appendix 2-5, in addition to the standard board inspection that confirms continuity between the reference through-hole HLb and the standard inspection through-hole HLk1, a rigorous board inspection that confirms continuity between the reference through-hole HLb and the rigorous inspection through-hole HLk2 can be performed. Compared to the configuration in which rigorous board inspection cannot be performed, it becomes possible to accurately determine the degree of deterioration of the circuit board 500 in multiple stages, and to accurately estimate the remaining warranty period of the circuit board 500 in multiple stages. [Explanation of Symbols]

[0177] 1…Printing device, 2…Printing control unit, 3…Head unit, 4…Drive signal generation unit, 5…Drive control unit, 6…Transport unit, 9…Management server, 81…Data acquisition device, 82…Inspection device, 83…Indicator device, 500…Circuit board, 911…Information acquisition unit, 912…Replacement necessity determination unit, 913…Reuse determination unit, Cd…Aluminum electrolytic capacitor, FN…Fan, GF…Glass fiber, HLb…Reference through-hole, HLc…Signal through-hole, HLk1…Standard inspection through-hole, HLk2…Precise inspection through-hole.

Claims

1. A first circuit board, a first control unit comprising a first component provided on the first circuit board and a second component provided on the first circuit board, A first drive unit controlled by the first control unit, A method for manufacturing an electronic device comprising, A second control unit comprising a second circuit board, a third component having the same function as the first component and provided on the second circuit board, and a fourth component having the same function as the second component and provided on the second circuit board, and having the same function as the first control unit, A second drive unit controlled by the second control unit and having the same function as the first drive unit, In other electronic devices equipped with, The third component is determined not to require replacement using the first criterion based on the power-on time of the other electronic equipment, and If the fourth component is determined not to require replacement using a second criterion based on the operating time of the second drive unit, By adopting the second control unit provided by the other electronic device as the first control unit, The electronic device is manufactured with a shorter quality assurance period than the aforementioned other electronic devices. The third component is determined to need replacement using the first criterion, and If the fourth component is determined not to require replacement using the second criterion, The electronic device is manufactured without using the second control unit provided in the other electronic device. The third component is determined not to require replacement using the first criterion, and If the fourth component is determined to need replacement using the second criterion, To manufacture the electronic device without using the second control unit provided in the other electronic device, A method for manufacturing electronic equipment, characterized by the following features.

2. A first circuit board, a first control unit comprising a first component provided on the first circuit board and a second component provided on the first circuit board, A first drive unit controlled by the first control unit, A method for manufacturing an electronic device comprising, A second control unit comprising a second circuit board, a third component having the same function as the first component and provided on the second circuit board, and a fourth component having the same function as the second component and provided on the second circuit board, and having the same function as the first control unit, A second drive unit controlled by the second control unit and having the same function as the first drive unit, In other electronic devices equipped with, The third component is determined not to require replacement using the first criterion based on the power-on time of the other electronic equipment, and If the fourth component is determined not to require replacement using a second criterion based on the operating time of the second drive unit, By adopting the second control unit provided by the other electronic device as the first control unit, The electronic device is manufactured with a shorter quality assurance period than the aforementioned other electronic devices. The third component is determined to need replacement using the first criterion, and If the fourth component is determined not to require replacement using the second criterion, After removing the third component from the second circuit board, the first component is newly placed on the second circuit board. The fourth component provided in the second circuit board is adopted as the second component, By adopting the second control unit after the first component has been placed as the first control unit, The manufacturer of the aforementioned electronic device, which has a shorter quality guarantee period than the aforementioned other electronic devices. A method for manufacturing electronic equipment, characterized by the following features.

3. A first circuit board, a first control unit comprising a first component provided on the first circuit board and a second component provided on the first circuit board, A first drive unit controlled by the first control unit, A method for manufacturing an electronic device comprising, A second control unit comprising a second circuit board, a third component having the same function as the first component and provided on the second circuit board, and a fourth component having the same function as the second component and provided on the second circuit board, and having the same function as the first control unit, A second drive unit controlled by the second control unit and having the same function as the first drive unit, In other electronic devices equipped with, The third component is determined not to require replacement using the first criterion based on the power-on time of the other electronic equipment, and If the fourth component is determined not to require replacement using a second criterion based on the operating time of the second drive unit, By adopting the second control unit provided by the other electronic device as the first control unit, The electronic device is manufactured with a shorter quality assurance period than the aforementioned other electronic devices. The third component is determined not to require replacement using the first criterion, and If the fourth component is determined to need replacement using the second criterion, After removing the fourth component from the second circuit board, the second component is newly placed on the second circuit board. The third component provided in the second circuit board is adopted as the first component, By adopting the second control unit after the second component has been placed as the first control unit, The manufacturer of the aforementioned electronic device, which has a shorter quality guarantee period than the aforementioned other electronic devices. A method for manufacturing electronic equipment, characterized by the following features.

4. The third component is determined to need replacement using the first criterion, and If the fourth component is determined to need replacement using the second criterion, To manufacture the electronic device without using the second control unit provided in the other electronic device, A method for manufacturing an electronic device according to any one of claims 1 to 3, characterized in that

5. If the second circuit board is damaged or contaminated, To manufacture the electronic device without using the second control unit provided in the other electronic device, A method for manufacturing an electronic device according to claim 1, characterized in that

6. If there is a certain level of probability that the internal wiring of the second circuit board is damaged, To manufacture the electronic device without using the second control unit provided in the other electronic device, A method for manufacturing an electronic device according to claim 1, characterized in that

7. The first and third components are aluminum electrolytic capacitors. A method for manufacturing an electronic device according to claim 1, characterized in that

8. The second and fourth parts are fans. A method for manufacturing an electronic device according to claim 1, characterized in that

9. A first circuit board, a first control unit comprising a first component provided on the first circuit board and a second component provided on the first circuit board, A first drive unit controlled by the first control unit, A manufacturing management system for electronic devices, comprising: A second control unit comprising a second circuit board, a third component having the same function as the first component and provided on the second circuit board, and a fourth component having the same function as the second component and provided on the second circuit board, and having the same function as the first control unit, A second drive unit controlled by the second control unit and having the same function as the first drive unit, From other electronic devices equipped with, First information indicating the power-on time of the other electronic device, An acquisition unit that acquires second information indicating the driving time of the second drive unit, Using the first criterion based on the power-on time of the other electronic device and the first information, the necessity of replacing the third component is determined. A determination unit that determines the necessity of replacing the fourth component using a second criterion based on the operating time of the second drive unit and the second information, The aforementioned determination unit, It was determined that there was no need to replace the third part, and If it is determined that there is no need to replace the fourth component, By adopting the second control unit provided by the other electronic device as the first control unit, It was decided to manufacture the aforementioned electronic device with a shorter quality guarantee period than the aforementioned other electronic devices, The aforementioned determination unit, It was determined that the aforementioned third component needed to be replaced, If it is determined that there is no need to replace the fourth component, It was decided to manufacture the electronic device without using the second control unit provided in the other electronic device, The aforementioned determination unit, It was determined that there was no need to replace the third part, and If it is determined that the fourth component needs to be replaced, A decision unit that decides to manufacture the electronic device without using the second control unit provided in the other electronic device, Equipped with, A manufacturing management system characterized by the following features.

10. A first circuit board, a first control unit comprising a first component provided on the first circuit board and a second component provided on the first circuit board, A first drive unit controlled by the first control unit, A manufacturing management system for electronic devices, comprising: A second control unit comprising a second circuit board, a third component having the same function as the first component and provided on the second circuit board, and a fourth component having the same function as the second component and provided on the second circuit board, and having the same function as the first control unit, A second drive unit controlled by the second control unit and having the same function as the first drive unit, From other electronic devices equipped with, First information indicating the power-on time of the other electronic device, An acquisition unit that acquires second information indicating the driving time of the second drive unit, Using the first criterion based on the power-on time of the other electronic device and the first information, the necessity of replacing the third component is determined. A determination unit that determines the necessity of replacing the fourth component using a second criterion based on the operating time of the second drive unit and the second information, The aforementioned determination unit, It was determined that there was no need to replace the third part, and If it is determined that there is no need to replace the fourth component, By adopting the second control unit provided by the other electronic device as the first control unit, It was decided to manufacture the aforementioned electronic device with a shorter quality guarantee period than the aforementioned other electronic devices, The aforementioned determination unit, It was determined that the aforementioned third component needed to be replaced, If it is determined that there is no need to replace the fourth component, After removing the third component from the second circuit board, the first component is newly placed on the second circuit board. The fourth component provided in the second circuit board is adopted as the second component, By adopting the second control unit after the first component has been placed as the first control unit, A decision unit that decides to manufacture the electronic device for which the quality assurance period is set shorter than that of the other electronic devices, Equipped with, A manufacturing management system characterized by the following features.

11. A first circuit board, a first control unit comprising a first component provided on the first circuit board and a second component provided on the first circuit board, A first drive unit controlled by the first control unit, A manufacturing management system for electronic devices, comprising: A second control unit comprising a second circuit board, a third component having the same function as the first component and provided on the second circuit board, and a fourth component having the same function as the second component and provided on the second circuit board, and having the same function as the first control unit, A second drive unit controlled by the second control unit and having the same function as the first drive unit, From other electronic devices equipped with, First information indicating the power-on time of the other electronic device, An acquisition unit that acquires second information indicating the driving time of the second drive unit, Using the first criterion based on the power-on time of the other electronic device and the first information, the necessity of replacing the third component is determined. A determination unit that determines the necessity of replacing the fourth component using a second criterion based on the operating time of the second drive unit and the second information, The aforementioned determination unit, It was determined that there was no need to replace the third part, and If it is determined that there is no need to replace the fourth component, By adopting the second control unit provided by the other electronic device as the first control unit, It was decided to manufacture the aforementioned electronic device with a shorter quality guarantee period than the aforementioned other electronic devices, The aforementioned determination unit, It was determined that there was no need to replace the third part, and If it is determined that the fourth component needs to be replaced, After removing the fourth component from the second circuit board, the second component is newly placed on the second circuit board. The third component provided in the second circuit board is adopted as the first component, By adopting the second control unit after the second component has been placed as the first control unit, A decision unit that decides to manufacture the electronic device for which the quality assurance period is set shorter than that of the other electronic devices, Equipped with, A manufacturing management system characterized by the following features.

12. The aforementioned determination unit, The determination unit determines, using the first criterion, that the third component needs to be replaced, and If the determination unit determines, using the second criterion, that the fourth component needs to be replaced, It is decided to manufacture the electronic device without using the second control unit provided in the other electronic device. A manufacturing management system according to any one of claims 9 to 11, characterized in that

13. The aforementioned determination unit, If the second circuit board is damaged or contaminated, It is decided to manufacture the electronic device without using the second control unit provided in the other electronic device. A manufacturing management system according to claim 9, characterized in that it is the same as described in claim 9.

14. The second circuit board is equipped with an inspection unit for inspecting the internal wiring, The aforementioned determination unit, If the inspection results from the inspection unit indicate that there is a certain level of possibility that the internal wiring of the second circuit board is damaged, It is decided to manufacture the electronic device without using the second control unit provided in the other electronic device. A manufacturing management system according to claim 9, characterized in that it is the same as described in claim 9.

15. The first and third components are aluminum electrolytic capacitors. A manufacturing management system according to claim 9, characterized in that it is the same as described in claim 9.

16. The second and fourth parts are fans. A manufacturing management system according to claim 9, characterized in that it is the same as described in claim 9.

Images