Packaging containers and packaging bodies

Abstract

The objective is to provide a packaging container that can suppress contact between the terminals of a semiconductor device and the inner wall of the packaging container, thereby suppressing the occurrence of defects in the semiconductor device, even when force is applied to the packaging container containing a semiconductor device, which has a resin part containing a semiconductor element and terminals that are exposed from the surface of the resin part and whose tip is positioned higher than the upper surface of the resin part. [Solution] The packaging container according to the present disclosure is a packaging container for a semiconductor device comprising a resin part containing a semiconductor element and a terminal that is exposed from the surface of the resin part and whose tip is located above the position of the upper surface of the resin part, wherein when the semiconductor device is housed in the packaging container, the position of a first upper surface located above the upper surface of the resin part on the upper surface of the outer wall of the packaging container is located above the position of the tip of the terminal.

Description

[Technical Field]

[0001] The present disclosure relates to a packaging container and a packaged body. [Background Art]

[0002] Conventionally, there has been a semiconductor device which is a transfer mold type power module including a resin portion containing a semiconductor element, and a terminal exposed from the surface of the resin portion and having a tip portion positioned higher than the upper surface of the resin portion.

[0003] Conventionally, a tubular packaging container is sometimes used as a packaging container for packaging the above-described semiconductor device (see, for example, Patent Document 1). The tubular packaging container has a recess formed along the outer shape of the above-described semiconductor device.

[0004] Conventionally, the above-described tubular packaging container is sometimes housed in a deaeration packaging bag and subjected to deaeration packaging. [Prior Art Documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2-148982 [Summary of the Invention] [Problem to be Solved by the Invention]

[0006] For example, when a packaging container is subjected to deaeration packaging, a force acts on the packaging container, which may cause stress. Since a tubular packaging container has a recess, stress locally increases at the recess, causing deformation of the packaging container. The deformation of the packaging container brings the terminals of the semiconductor device into contact with the inner wall of the packaging container, resulting in the problem that defects such as chipping and scratches occur on the terminals of the semiconductor device.

[0007] This disclosure is made to solve the above-mentioned problems and aims to provide a packaging container that can suppress contact between the terminals of a semiconductor device and the inner wall of the packaging container, even when a force is applied to the packaging container containing a semiconductor device which has a resin part containing a semiconductor element and terminals that are exposed from the surface of the resin part and whose tip is positioned higher than the upper surface of the resin part, thereby suppressing the occurrence of defects in the semiconductor device. [Means for solving the problem]

[0008] The packaging container relating to this disclosure is a packaging container for a semiconductor device comprising a resin part containing a semiconductor element and a terminal that is exposed from the surface of the resin part and whose tip is located above the position of the upper surface of the resin part, wherein when the semiconductor device is housed in the packaging container, the position of a first upper surface located above the upper surface of the resin part on the upper surface of the outer wall of the packaging container is located above the position of the tip of the terminal. [Effects of the Invention]

[0009] According to the packaging container of this disclosure, even when a force is applied to the packaging container containing a semiconductor device which has a resin part containing a semiconductor element and terminals that are exposed from the surface of the resin part and whose tip is positioned higher than the upper surface of the resin part, it is possible to provide a packaging container that can suppress contact between the terminals of the semiconductor device and the inner wall of the packaging container, thereby suppressing the occurrence of defects in the semiconductor device. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic perspective view of a semiconductor device packaged in a packaging container, as part of the packaging according to Embodiment 1. [Figure 2] This is a schematic perspective view of the packaging container among the packaging bodies according to Embodiment 1. [Figure 3] This is a schematic plan view of the packaging according to Embodiment 1. [Figure 4] This is a schematic cross-sectional view of the packaging according to Embodiment 1. [Figure 5] This is a schematic side view of the packaging according to Embodiment 1. [Figure 6] This is a schematic side view of the packaging according to Embodiment 1. [Figure 7] This is a schematic side view of the packaging according to Embodiment 1. [Figure 8] This is a schematic perspective view showing a specific example of the configuration of the packaging body according to Embodiment 1. [Figure 9] This is a schematic cross-sectional view of a conventional packaging material. [Figure 10] This is a schematic cross-sectional view of a packaging body according to a modified example 1 of Embodiment 1. [Figure 11] This is a schematic cross-sectional view of a packaging body according to a modified example 2 of Embodiment 1. [Figure 12] This is a schematic plan view of the packaging body according to Embodiment 2. [Figure 13] This is a schematic cross-sectional view of the packaging according to Embodiment 2. [Figure 14] This is a schematic cross-sectional view of the packaging according to Embodiment 2. [Modes for carrying out the invention]

[0011] <Introduction> One side of the packaging is referred to as "top" and the other side as "bottom" in the direction parallel to the depth direction of the packaging. Of the two main surfaces of the component, one surface is referred to as the top surface and the other surface as the bottom surface. The directions of "top" and "bottom" are not limited to the direction of gravity or the direction in which the packaging is mounted.

[0012] Furthermore, for the sake of explanation, in the following, the width direction of the packaging will be described as the X-axis direction, the depth direction of the packaging that intersects the X-axis direction will be described as the Y-axis direction, and the thickness direction or height direction of the packaging, that is, the direction normal to the XY plane, will be described as the Z-axis direction.

[0013] Furthermore, the drawings are schematic representations, and the relative sizes and positions of images shown in different drawings are not necessarily accurately depicted and may be modified as appropriate. In the following explanation, similar components are denoted by the same reference numerals, and their names and functions are also the same. Therefore, detailed explanations of these components may be omitted.

[0014] Embodiment 1. Embodiment 1 will be described below with reference to the drawings. Fig. 1 is a schematic perspective view of a semiconductor device 10 packed in a packing container 100 in a packing body 1000 according to Embodiment 1. Fig. 2 is a schematic perspective view of the packing container 100 in the packing body 1000 according to Embodiment 1. Fig. 3 is a schematic plan view of the packing body 1000 according to Embodiment 1. In Fig. 3, a tip end portion 125 of a protruding portion 124 provided on the packing container 100 is indicated by a dotted line. Fig. 4 is a schematic cross-sectional view of the packing body 1000 according to Embodiment 1. Fig. 4 shows a cross-section taken along the alternate long and short dash line A-A shown in Fig. 3. Figs. 5 to 7 are schematic side views of the packing body 1000 according to Embodiment 1. The schematic side view shown in Fig. 5 is a view when the packing body 1000 is viewed from the negative X-axis side (direction a). The schematic side view shown in Fig. 6 is a view when the packing body 1000 is viewed from the positive X-axis side (direction b). The schematic side view shown in Fig. 7 is a view when the packing body 1000 is viewed from the negative Y-axis side (direction c). A schematic side view when the packing body 1000 is viewed from the positive Y-axis side (direction d) is the same as Fig. 7, and therefore is omitted. Fig. 8 is a schematic perspective view showing a specific configuration example of the packing body 1000 according to Embodiment 1. The packing body 1000 shown in Figs. 3 to 8 shows a state where the semiconductor device 10 is accommodated in the packing container 100. More specifically, the packing body 1000 shown in Figs. 3 to 8 shows a state where a lid body 120 is attached to a container body 110.

[0015] The configurations of the packing body 1000, the packing container 100, and the semiconductor device 10 will be described with reference to Figs. 1 to 8. As shown in Figs. 3 and 4, the packing body 1000 includes the packing container 100 and the semiconductor device 10 packed in the packing container 100. In the packing body 1000 of the present embodiment, one semiconductor device 10 is accommodated in the packing container 100.

[0016] First, the semiconductor device 10, which is packaged in the packaging container 100, will be described using Figures 1, 3, and 4. The semiconductor device 10 includes a resin part 11 and terminals 12. The semiconductor device 10 can be any power module, for example, a transfer-molded power module (T-PM: Trans-Ansfer-molded Power Module) such as a DIP (DuAl Inline Packaging). The height of the semiconductor device 10 (h1+t in Figure 4) is, for example, 20 mm or more.

[0017] The resin part 11 contains a semiconductor element (not shown) and is provided to cover the semiconductor element. The resin part 11 has an upper surface 11a and a lower surface 11b. The resin part 11 is composed of at least one of a resin case material or a sealing resin. In this embodiment, the resin part 11 is composed only of sealing resin. Also, as shown in Figure 4, the resin part 11 may have a first recess 11c at the end of the lower surface 11b. The first recess 11c is provided on the outer circumference of the lower surface 11b of the semiconductor device 10.

[0018] The semiconductor device may be made of Si, but it is preferable that it be made of a wide-bandgap semiconductor such as SiC, GAN, or GA2O3. The type of semiconductor device is not particularly limited, but it may be a switching element such as an IGBT (Insulated Gate BipolAr TrAnsistor) or MOSFET (MetAl Oxide Semiconductor Field Effect TrAnsistor), or a freewheeling element such as a diode. Furthermore, if both a switching element and a freewheeling element are provided, it is preferable that both be made of a wide-bandgap semiconductor, but one of them may be a wide-bandgap semiconductor. Also, the number of semiconductor devices is not limited to one, but may be two or more.

[0019] Terminal 12 is provided such that one end (not shown) is electrically connected to a semiconductor element, and the other end, tip portion 12a, is exposed from the surface of the resin portion 11. Terminal 12 is provided so as to extend in the height direction (Z-axis direction) from the surface of the resin portion 11. As shown in Figure 4, terminal 12 may be provided so as to be exposed horizontally from the side of the resin portion 11 and bent in an L-shape to extend in the height direction (Z-axis direction), or it may be provided so as to be exposed vertically from the top surface of the resin portion 11 and extend in the height direction (Z-axis direction). As shown in Figure 4, the position of the tip portion 12a of terminal 12 is located above the position of the top surface 11a of the resin portion 11. In this embodiment, as shown in Figure 4, the height h1 from the top surface 11a of the resin portion 11 to the tip portion 12a of terminal 12 may be, for example, greater than or equal to the thickness t of the resin portion 11 or greater than or equal to the thickness t × 2 of the resin portion 11. The height h1 is, for example, 5 mm or more.

[0020] The semiconductor device 10 of this embodiment is configured as described above.

[0021] Next, we will describe the packaging container 100 in which the semiconductor device 10 is packaged, using Figures 2 to 7.

[0022] The packaging container 100 comprises an inner wall 101 provided on the inside of the packaging container 100 and an outer wall 102 provided on the outside of the packaging container 100.

[0023] As shown in Figure 4, when the semiconductor device 10 is housed in the packaging container 100, the position of the first upper surface 104, located above the upper surface 11a of the resin part 11 of the semiconductor device 10, on the upper surface 103 of the outer wall 102 of the packaging container 100, is positioned above the position of the tip 12a of the terminal 12. The shape of the outer wall 102 shown in Figure 2 is arbitrary, as long as it is a shape that allows the position of the first upper surface 104, located above the upper surface 11a of the resin part 11 of the semiconductor device 10, on the upper surface 103 of the outer wall 102 of the packaging container 100, to be positioned above the position of the tip 12a of the terminal 12, as described above. For example, as shown in Figure 2, the shape of the outer wall 102 may be a rectangular parallelepiped or a sphere. The first upper surface 104 may be a different surface from the other surfaces that make up the upper surface 103 of the outer wall 102 of the packaging container 100, but as shown in Figure 4, the first upper surface 104 may be the same surface as the other surfaces that make up the upper surface 103 of the outer wall 102 of the packaging container 100.

[0024] Furthermore, as shown in Figures 3 and 4, the packaging container 100 has a projection 124 that protrudes from the inner wall 101 of the packaging container 100 toward the upper surface 11a of the resin part 11 of the semiconductor device 10, and it is desirable that the tip 125 of the projection 124 contacts the upper surface 11a of the resin part 11 of the semiconductor device 10 when the semiconductor device 10 is housed in the packaging container 100. It is also desirable that the tip 125 of the projection 124 contacts the center of the upper surface 11a of the resin part 11 of the semiconductor device 10, as shown in Figures 3 and 4. It is also desirable that the contact area between the tip 125 of the projection 124 and the upper surface 11a of the resin part 11 be large. Additionally, as shown in Figure 4, the side surface 126 of the projection 124 may have a taper. Furthermore, as shown in Figure 4, the taper may be provided so as to narrow from the inner wall 101 of the packaging container 100 toward the upper surface 11a of the resin part 11 of the semiconductor device 10, but it is preferable that the taper be provided so as to widen from the inner wall 101 of the packaging container 100 toward the upper surface 11a of the resin part 11 of the semiconductor device 10.As shown in Figures 3 and 4, the tip 125 of the protrusion 124 is in contact with a part of the upper surface 11a of the resin part 11 of the semiconductor device 10, but the tip 125 of the protrusion 124 may be in contact with the entire upper surface 11a of the resin part 11 of the semiconductor device 10.Also, as shown in Figures 3 and 4, there is one protrusion 124, but there may be multiple protrusions, and the tip 125 of each of the multiple protrusions 124 may be in contact with the upper surface 11a of the resin part 11 of the semiconductor device 10.

[0025] Furthermore, as shown in Figure 4, the inner wall 101 of the packaging container 100 is provided with a gap a between it and the tip 12a of the terminal 12. The gap a is, for example, 1 mm or more.

[0026] Furthermore, as shown in Figure 4, a portion of the inner wall 101 of the packaging container 100 contacts the lower surface 11b of the resin portion 11 of the semiconductor device 10. As shown in Figure 4, a portion of the inner wall 101 of the packaging container 100 may be provided with a gap b between it and the lower surface 11b of the resin portion 11 of the semiconductor device 10, or it may be provided without a gap b. The gap b is, for example, 1 mm or more. Also, as shown in Figure 4, if the resin portion 11 of the semiconductor device 10 has a first recess 11c on its lower surface 11b, it is desirable that a portion of the inner wall 101 of the packaging container 100 contacts the first recess 11c of the resin portion 11 so as to engage with it.

[0027] Furthermore, it is desirable that the packaging container 100 be made of conductive foamed polypropylene. The packaging container 100 may also be molded by injection molding or by vacuum forming.

[0028] Here, a specific example of the configuration of the packaging container 100 in which the semiconductor device 10 is packaged will be described. The packaging container 100 in this embodiment consists of a housing 110 and a lid 120. The inner wall 101 and outer wall 102 of the packaging container 100 in this embodiment are composed of the housing 110 and the lid 120.

[0029] The housing 110 has an upper surface 111 and a lower surface 112, and the upper surface 111 has a housing portion 113 in which the semiconductor device 10 is housed. As shown in Figure 4, the upper surface 114 of the housing portion 113 is in contact with the lower surface 11b of the resin portion 11. As shown in Figure 4, a part of the upper surface 114 of the housing portion 113 may be provided with a gap b between it and the lower surface 11b of the resin portion 11, or it may be provided without a gap b. In other words, as shown in Figure 4, the housing portion 113 may be provided in a concave shape, or it may be flat. Furthermore, as described above, if the resin portion 11 has a first recess 11c on its lower surface 11b, it is desirable that the upper surface 114 of the housing portion 113 be in contact with the first recess 11c of the resin portion 11 so as to engage with it. The housing 110 also has a wall portion 115 on the outer circumference of the upper surface 111. As shown in Figure 4, the wall portion 115 extends from the upper surface 111 of the container 110 in the height direction (Z-axis direction). The wall portion 115 constitutes a part of the inner wall 101 and outer wall 102 of the packaging container 100. In this embodiment, the wall portion 115 is provided integrally with the container 110, but it may also be provided integrally with the lid 120, or the container 110, lid 120, and wall portion 115 may each be provided as separate components.

[0030] The cover 120 is detachably attached to the housing 110. The cover 120 has an upper surface 121 and a lower surface 123. When the semiconductor device 10 is housed in the housing 113 and the cover 120 is attached to the housing 110, the position of the first upper surface 122 of the cover 121, which is located above the upper surface 11a of the resin part 11 of the semiconductor device 10, is above the position of the tip 12a of the terminal 12. The cover 120 also has a projection 124 that protrudes from the lower surface 123 toward the upper surface 11a of the resin part 11 of the semiconductor device 10. As shown in Figures 3 and 4, the tip 125 of the projection 124 contacts the upper surface 11a of the resin part 11. As shown in Figures 3 and 4, it is desirable that the tip 125 of the projection 124 of the cover 120 contacts the center of the upper surface 11a of the resin part 11 of the semiconductor device 10. As shown in Figure 4, the lower surface 123 of the lid 120 is provided with a gap a between it and the tip 12a of the terminal 12. Also, as shown in Figure 4, the side surface 126 of the protrusion 124 may have a taper. Also, as shown in Figure 4, the taper may be provided so as to narrow from the lower surface 123 of the lid 120 toward the upper surface 11a of the resin part 11, or the taper may be provided so as to widen from the lower surface 123 of the lid 120 toward the upper surface 11a of the resin part 11. As shown in Figures 3 and 4, the tip 125 of the protrusion 124 is in contact with a part of the upper surface 11a of the resin part 11, but the tip 125 of the protrusion 124 may be in contact with the entire upper surface 11a of the resin part 11. Also, as shown in Figures 3 and 4, there is one protrusion 124, but there may be multiple protrusions, and the tip 125 of each of the multiple protrusions 124 may be in contact with the upper surface 11a of the resin part 11.

[0031] Furthermore, as shown in Figures 5-7, the outer wall 102 of the packaging container 100 in this embodiment is composed of a housing 110 and a lid 120. As shown in Figures 5 and 6, in a side view, it is desirable that the shape of the boundary line 105 between the housing 110 and the lid 120 constituting the outer wall 102 of the packaging container 100 be uneven, but as shown in Figure 7, in a side view, the shape of the boundary line 105(105C) between the housing 110 and the lid 120 constituting the outer wall 102 of the packaging container 100 may be flat. In addition, as shown in Figures 5 and 6, in a side view, it is desirable that the shape of the first boundary line 105A between the housing 110 and the lid 120 constituting the first outer wall 102A of the packaging container 100 is different from the shape of the second boundary line 105B between the housing 110 and the lid 120 constituting the second outer wall 102B which is provided opposite the first outer wall 102A. For example, as shown in Figures 5 and 6, the shapes of the first boundary line 105A and the second boundary line 105B may be made different by changing the number of bumps and indentations between them.

[0032] Next, a specific example of the configuration of the packaging 1000 will be explained using Figure 8.

[0033] As shown in Figure 8, the packaging body 1000 may further include packaging material 1100. The packaging material 1100 contains the packaging container 100. As shown in Figure 8, the packaging material 1100 may contain two packaging containers 100 stacked on top of each other, one packaging container 100, or three or more packaging containers 100 stacked on top of each other. The packaging material 1100 may be, for example, an aluminum bag or a laminated bag. The packaging container 100 may be contained in the packaging material 1100 under vacuum. In other words, the packaging container 100 may be vacuum-packed in the packaging material 1100. For example, the packaging container 100 may be wrapped in an aluminum bag, and the air inside the aluminum bag may be removed using a vacuum device to create a vacuum inside the aluminum bag before packaging the packaging container 100. The vacuum state described above can also be achieved by nitrogen purging. In the case of nitrogen purging, the inside of the aluminum bag is made vacuum using a degassing device, and then nitrogen is sealed inside the aluminum bag.

[0034] As described above, the semiconductor device 10, packaging container 100, and packaging body 1000 of this embodiment are configured as described above. As described above, the packaging container 100 of this embodiment is a packaging container for packaging a semiconductor device 10 which has a resin part 11 that contains a semiconductor element and a terminal 12 that is exposed from the surface of the resin part 11 and whose tip portion 12a is located above the position of the upper surface 11a of the resin part 11. When the semiconductor device 10 is housed in the packaging container 100, the position of the first upper surface 104 of the upper surface 103 of the outer wall 102 of the packaging container 100, which is located above the upper surface 11a of the resin part 11, is located above the position of the tip portion 12a of the terminal 12. With the above configuration, even if a force is applied to the packaging container which houses the semiconductor device which has a resin part that contains a semiconductor element and a terminal that is exposed from the surface of the resin part and whose tip is located higher than the upper surface of the resin part, contact between the terminal of the semiconductor device and the inner wall of the packaging container can be suppressed, thereby suppressing the occurrence of defects in the semiconductor device. The reason for this will be explained below.

[0035] First, for comparison with the packaging container 100 and packaging body 1000 in this embodiment, a conventional packaging container 100z and packaging body 1000z are shown in Figure 9 as comparative examples. As shown in Figure 9, in the conventional packaging container 100z, a semiconductor device 10 having a resin part 11 containing a semiconductor element and a terminal 12 that is exposed from the surface of the resin part 11 and whose tip portion 12a is located above the position of the upper surface 11a of the resin part 11 is housed in a tubular packaging container 100z having a recess 106 formed along the outer shape of the semiconductor device 10. In other words, in the conventional packaging container 100z, as shown in Figure 9, the position of the first upper surface 104 located above the upper surface 11a of the resin part 11 on the upper surface 103 of the outer wall 102 of the packaging container 100z is located below the position of the tip portion 12a of the terminal 12. Also, as shown in Figure 9, the terminal 12 portion of the semiconductor device 10 is housed inside the left part 107 and the right part 108 located on either side of the recess 106.

[0036] A packing container can be subjected to forces, which can generate stress. For example, as shown in Figure 8, when a packing container is degassed, vacuum pressure acts on the packing container, generating stress. As described above, the tubular packing container 100z has a recess 106 formed along the outer shape of the semiconductor device 10, so stress increases locally in the recess 106, causing the packing container 100z to deform. For example, when vacuum pressure acts on the packing container and stress is generated, the left part 107 and the right part 108 of the packing container 100z deform in a direction that brings them closer together. As described above, in the conventional packing container 100z, the position of the first upper surface 104 is located below the position of the tip 12a of the terminal 12, so the deformation of the packing container 100z causes the terminal 12 of the semiconductor device 10 to come into contact with the inner wall 101 of the packing container 100z. As a result, there was a problem of defects such as chipping and scratches occurring on the terminal of the semiconductor device.

[0037] In contrast, in the packaging container 100 of this embodiment, when the semiconductor device 10 is housed in the packaging container 100, the position of the first upper surface 104, located above the upper surface 11a of the resin part 11 on the upper surface 103 of the outer wall 102 of the packaging container 100, is higher than the position of the tip 12a of the terminal 12. In other words, the position of the first upper surface 104 of the packaging container 100 of this embodiment is higher than the position of the first upper surface 104 of the conventional packaging container 100z. Therefore, compared to the conventional packaging container 100z, the packaging container 100 of this embodiment can suppress contact between the terminals of the semiconductor device and the inner wall of the packaging container even when force is applied to the packaging container, thereby suppressing the occurrence of defects in the semiconductor device.

[0038] Furthermore, as described above, the packaging container 100 has a protruding portion 124 that extends from the inner wall 101 toward the upper surface 11a of the resin portion 11, and it is desirable that the tip portion 125 of the protruding portion 124 contacts the upper surface 11a of the resin portion 11 when the semiconductor device 10 is housed in the packaging container 100. By doing so, the tip portion 125 can function as a support column, thereby improving the overall rigidity of the packaging container. Therefore, when force is applied to the packaging container, contact between the terminals of the semiconductor device and the inner wall of the packaging container can be further suppressed, and the occurrence of defects in the semiconductor device can be further suppressed. In addition, since the resin portion 11 of the semiconductor device 10 can be fixed by being sandwiched from above and below, the position of the semiconductor device is restricted, and when the packaging container is dropped or shaken during transportation of the packaging container, contact between the terminals of the semiconductor device and the inner wall of the packaging container can be suppressed, thereby suppressing the occurrence of defects in the semiconductor device.

[0039] Furthermore, as mentioned above, it is desirable for the contact area between the tip 125 of the protrusion 124 and the upper surface 11a of the resin part 11 to be large. Doing so can further improve the rigidity of the entire packaging container. In addition, because the position of the semiconductor device is more restricted, contact between the terminals of the semiconductor device and the inner wall of the packaging container can be further suppressed when the packaging container is dropped or shaken during transportation, etc., thereby further suppressing the occurrence of defects in the semiconductor device.

[0040] Furthermore, as described above, it is desirable that the tip 125 of the protrusion 124 contacts the center of the upper surface 11a of the resin part 11 of the semiconductor device 10. By doing so, the distance between the terminal 12 and the protrusion 124 can be increased, further suppressing contact between the terminal of the semiconductor device and the inner wall of the packaging container when the packaging container is dropped or shaken during transportation, and further suppressing the occurrence of defects in the semiconductor device.

[0041] Furthermore, as described above, the side surface 126 of the protrusion 124 has a taper, and it is desirable that the taper widens from the inner wall 101 of the packaging container 100 toward the upper surface 11a of the resin part 11. When the packaging container is dropped or shakes occur in the packaging container 100 during transport, the amplitude of the vibration of the terminal 12 of the semiconductor device 10 is greater on the tip 12a side than on the base side. By providing the taper described above, contact between the terminal of the semiconductor device and the inner wall of the packaging container can be further suppressed when the packaging container is shaken, thereby further suppressing the occurrence of defects in the semiconductor device. Moreover, the contact area between the tip 125 of the protrusion 124 and the upper surface 11a of the resin part 11 can be increased, so when the packaging container is dropped or shakes occur in the packaging container during transport, contact between the terminal of the semiconductor device and the inner wall of the packaging container can be further suppressed, thereby further suppressing the occurrence of defects in the semiconductor device.

[0042] Furthermore, as described above, a portion of the inner wall 101 of the packaging container 100 may be provided with a gap b between it and the lower surface 11b of the resin part 11 of the semiconductor device 10. For example, a heat-dissipating metal plate may be provided on a portion of the lower surface 11b of the resin part 11 of the semiconductor device 10. In that case, by providing at least the portion of the inner wall 101 facing the position where the metal plate is provided with a gap b between it and the lower surface 11b of the resin part 11 of the semiconductor device 10, it is possible to prevent contact between the portion of the resin part 11 where the metal plate is located and the inner wall 101 of the packaging container 100. This makes it possible to suppress contamination of the metal plate by foreign matter adhering to it. The metal plate may be made of any metal capable of dissipating heat, and may be made of an SN substrate having a Cu pattern, for example.

[0043] Furthermore, as described above, if the resin part 11 of the semiconductor device 10 has a first recess 11c on its lower surface 11b, it is desirable that a part of the inner wall 101 of the packaging container 100 be in contact with the first recess 11c of the resin part 11 so as to engage with it. By doing so, the position of the semiconductor device is more restricted, which further suppresses contact between the terminals of the semiconductor device and the inner wall of the packaging container when the packaging container is dropped or shaken during transportation, and further suppresses the occurrence of defects in the semiconductor device.

[0044] Furthermore, as mentioned above, it is desirable that the packaging container 100 be made of conductive foamed polypropylene. This improves the overall rigidity of the packaging container, thereby further suppressing contact between the terminals of the semiconductor device and the inner wall of the packaging container when force is applied to the packaging container, and thus further suppressing the occurrence of defects in the semiconductor device. In addition, it improves the impact resistance of the packaging container, thereby suppressing the impact that occurs on the semiconductor device housed in the packaging container due to dropping the packaging container, and thus further suppressing the occurrence of defects in the semiconductor device.

[0045] Furthermore, as mentioned above, it is desirable that the semiconductor elements of the semiconductor device 10 be composed of wide-bandgap semiconductors. Semiconductor elements composed of wide-bandgap semiconductors have high voltage resistance and high allowable current density, making it possible to miniaturize the semiconductor elements. By using miniaturized semiconductor elements, it is possible to miniaturize the semiconductor device having the semiconductor elements. In addition, the heat resistance of the semiconductor device is also improved, making it possible to miniaturize the heat dissipation fins of the heat sink and to use air cooling for the water cooling section, thus enabling further miniaturization of the semiconductor device. In other words, because the semiconductor device can be miniaturized, the packaging container in which the semiconductor device is packaged can also be miniaturized.

[0046] Furthermore, in the packaging container 100 of this embodiment, as described above, it is desirable that the shape of the boundary line 105 between the containment body 110 and the lid 120, which constitute the outer wall 102 of the packaging container 100, be uneven when viewed from the side. This prevents the containment body and the lid from shifting due to vibration when the packaging container is dropped or shaken during transport.

[0047] Furthermore, in the packaging container 100 of this embodiment, as described above, it is desirable that, in a side view, the shape of the first boundary line 105A between the housing 110 and the lid 120, which constitute the first outer wall 102A of the packaging container 100, is different from the shape of the second boundary line 105B between the housing 110 and the lid 120, which constitutes the second outer wall 102B, which is provided opposite the first outer wall 102A. By doing so, when attaching the lid 120 to the housing 110, the lid 120 can be attached to the housing 110 in the correct orientation, and the lid can be prevented from coming into contact with the terminals of the semiconductor device.

[0048] Furthermore, as described above, the packaging body 1000 may further include packaging material 1100. By housing the packaging container 100 in the packaging material 1100, the intrusion of foreign matter into the packaging container can be suppressed and the packaging container can be protected. The packaging container 100 may also be housed in the packaging material 1100 under vacuum. By housing the packaging container 100 in the packaging material 1100 under vacuum, the packaging container can be protected from moisture and oxidation.

[0049] Next, a modified example of Embodiment 1 will be described using Figures 10 and 11. First, Modification 1 will be described using Figure 10. Figure 10 is a schematic cross-sectional view of the packaging body 2000 according to Modification 1. Note that Figure 10 shows the cross-section along the dashed line A-A shown in Figure 3. Note that in Figure 10, the wall portion 115 shown in Figure 4 is omitted.

[0050] As shown in Figure 10, the resin part 11 of the semiconductor device 20 in the packaging body 2000 according to Modified Example 1 has a protrusion 13a on its lower surface 11b. When the resin part 11 has a protrusion 13a on its lower surface 11b, it is desirable that a part of the inner wall 101 of the packaging container 200 be provided at a distance from the protrusion 13a. By doing so, it is possible to suppress defects such as scratches on the protrusion 13a, bending of the protrusion 13a, or damage to the protrusion 13a when the packaging container is dropped or shaken during transportation of the packaging container.

[0051] As shown in Figure 10, the semiconductor device 20 is equipped with a heat sink 13 on the lower surface 11b of the resin part 11, and the protrusion 13a may be a fin 13a of the heat sink 13.

[0052] Next, a modified example 2 will be described using Figure 11. Figure 11 is a schematic cross-sectional view of the packaging 3000 according to modified example 2. Figure 11 shows the cross-section along the dashed line A-A shown in Figure 3. Note that in Figure 11, the wall portion 115 shown in Figure 4 is omitted.

[0053] As shown in Figure 11, the resin part 11 of the semiconductor device 30 in the modified packaging 3000 has a second recess 11d on its upper surface 11a. When the resin part 11 has a second recess 11d on its upper surface 11a, it is desirable that the tip 125 of the protruding part 124 of the packaging container 300 be in contact with the bottom surface of the second recess 11d. By doing so, the position of the semiconductor device is more restricted, so that when the packaging container is dropped or shaken during transportation, contact between the terminals of the semiconductor device and the inner wall of the packaging container is suppressed, thereby suppressing the occurrence of defects in the semiconductor device.

[0054] As shown in Figure 11, the tip 125 of the protrusion 124 may be positioned to conform to the shape of the second recess 11d and to contact the bottom and side surfaces of the second recess 11d. This further restricts the position of the semiconductor device, thereby preventing contact between the terminals of the semiconductor device and the inner wall of the packaging container when the packaging container is dropped or shaken during transport, and thus suppressing the occurrence of defects in the semiconductor device.

[0055] Embodiment 2. The packaging 4000 according to Embodiment 2 will be described with reference to Figures 12 to 14. Figure 12 is a schematic plan view of the packaging 4000 according to Embodiment 2. Figures 13 and 14 are schematic cross-sectional views of the packaging 4000 according to Embodiment 2. Figure 13 shows a cross-section along the dashed line A1-A2 shown in Figure 12. Figure 14 shows a cross-section along the dashed line A3-A4 shown in Figure 12. Figures 12 to 14 show the state when the semiconductor device 10 is housed in the packaging container 400. More specifically, the packaging 4000 shown in Figures 12 to 14 shows the state when the lid 120 is attached to the housing 110. In Figure 12, the tip 125 of the protruding portion 124 is shown by a dotted line.

[0056] In the second embodiment, the packaging 4000 differs from the first embodiment in that, as shown in Figures 12-14, a plurality of semiconductor devices 10 are housed in the packaging container 400. Furthermore, in the second embodiment, the packaging 4000 is assumed to consist of a housing 110 and a lid 120 that is detachably attached to the housing; however, the housing 110 and the lid 120 may be provided integrally.

[0057] As shown in Figures 12-14, the packaging container 400 of the second embodiment has a housing 110 that has multiple housing sections 113 in a plan view. Multiple semiconductor devices 10 are housed one in each housing section 113. For example, as shown in Figure 12, the housing 110 may have 3 x 3 = 9 housing sections 113 arranged in a grid in a plan view, and the arrangement and number of housing sections 113 are arbitrary. For example, the housing 110 may have 2 to 40 housing sections 113. Also, as shown in Figures 12-14, the packaging container 400 of the second embodiment has a lid 120 that has multiple protrusions 124, and the tip 125 of each protrusion 124 contacts the upper surface 11a of the resin section 11 of each semiconductor device 10.

[0058] Furthermore, as shown in Figure 13, in a cross-sectional view, it is desirable that no partition connecting the housing 110 and the lid 120 is provided between the first semiconductor device 10A housed in the first housing section 113A and the second semiconductor device 30 housed in the second housing section 113B adjacent to the first housing section 113A. In other words, in a cross-sectional view, it is desirable that at least a portion of the space between the first semiconductor device 10A housed in the first housing section 113A and the second semiconductor device 10B housed in the second housing section 113B adjacent to the first housing section 113A is in communication.

[0059] As described above, the packaging container 400 and packaging body 4000 of Embodiment 2 are configured. As described above, the packaging container 400 of Embodiment 2 is a packaging container for packaging a semiconductor device 10 which has a resin part 11 that contains a semiconductor element and a terminal 12 that is exposed from the surface of the resin part 11 and whose tip portion 12a is located above the position of the upper surface 11a of the resin part 11. When multiple semiconductor devices 10 are housed in the packaging container 400, the position of the first upper surface 104 of the upper surface 103 of the outer wall 102 of the packaging container 400, which is located above the upper surface 11a of the resin part 11 of each of the multiple semiconductor devices 10, is located above the position of the tip portion 12a of the terminal 12 of each of the multiple semiconductor devices 10. With the above configuration, even if a force is applied to the packaging container which houses multiple semiconductor devices, which have a resin part that contains a semiconductor element and a terminal that is exposed from the surface of the resin part and whose tip is located higher than the upper surface of the resin part, contact between the terminals of each of the multiple semiconductor devices and the inner wall of the packaging container can be suppressed, and the occurrence of defects in each of the multiple semiconductor devices can be suppressed.

[0060] Furthermore, as described above, the packaging container 400 has multiple protrusions 124 that project from the inner wall 101 toward the upper surface 11a of each resin part 11 of the multiple semiconductor devices 10, and it is desirable that when the semiconductor devices 10 are housed in the packaging container 400, the tip 125 of each protrusion 124 contacts the upper surface 11a of each resin part 11 of the multiple semiconductor devices 10. By doing so, the tip 125 of each protrusion 124 can function as a support column, thereby improving the overall rigidity of the packaging container. Therefore, when force is applied to the packaging container, contact between the terminals of the semiconductor devices and the inner wall of the packaging container can be further suppressed, and the occurrence of defects in the semiconductor devices can be further suppressed. In addition, since the resin parts 11 of each of the multiple semiconductor devices 10 can be fixed by being sandwiched from above and below, the position of each of the multiple semiconductor devices is restricted, and when the packaging container is dropped or shaken during transportation of the packaging container, contact between the terminals of each of the multiple semiconductor devices and the inner wall of the packaging container can be suppressed, thereby suppressing the occurrence of defects in each of the multiple semiconductor devices.

[0061] Furthermore, in conventional packaging containers, a semiconductor device 10, which has a resin part 11 containing a semiconductor element and a terminal 12 that is exposed from the surface of the resin part 11 and whose tip 12a is located above the position of the upper surface 11a of the resin part 11, is housed in a tubular packaging container 100z as shown in Figure 9. A predetermined number of semiconductor devices are stored in one tubular packaging container 100z in a continuous line in the X-axis direction in Figure 9. As a result, there was a possibility that the semiconductor devices would rub against each other if the packaging container was dropped or shaken during transportation. Consequently, there was a problem of defects such as chipping and scratches occurring in the resin part of the semiconductor device.

[0062] Therefore, as described above, in a plan view, the housing 110 has a plurality of housing sections 113, and a plurality of semiconductor devices 10 are housed in each housing section 113. The packaging container 400 has a plurality of protrusions 124 that project from the inner wall 101 toward the upper surface 11a of each resin part 11 of the plurality of semiconductor devices 10. When the semiconductor devices 10 are housed in the packaging container 400, it is desirable that the tip 125 of each protrusion 124 contacts the upper surface 11a of each resin part 11 of the plurality of semiconductor devices 10. By doing so, the resin parts 11 of each of the plurality of semiconductor devices 10 can be fixed by being sandwiched from above and below, thereby restricting the position of each of the plurality of semiconductor devices. When the packaging container is dropped or shaken during transportation of the packaging container, it is possible to suppress friction between the semiconductor devices and suppress the occurrence of defects in each of the plurality of semiconductor devices.

[0063] Furthermore, as described above, in a cross-sectional view, it is desirable that at least a portion of the space between the first semiconductor device 10A housed in the first housing section 113A and the second semiconductor device 10B housed in the second housing section 113B adjacent to the first housing section 113A is in communication. Since the tip 125 of the protrusion 124 provided on the lid 120 contacts the upper surface 11a of the resin section 11, the tip 125 can function as a support. In other words, the rigidity of the entire packaging container can be maintained even without providing a partition connecting the housing 110 and the lid 120, and deformation of the packaging container during degassing can be suppressed, for example. Therefore, even when force is applied to the packaging container, contact between the terminals of the semiconductor device and the inner wall of the packaging container can be suppressed, and the occurrence of defects in the semiconductor device can be suppressed. Furthermore, by adopting the configuration without the partition described above, the distance between the first housing section 113A and the second housing section 113B can be reduced, and the packaging container can be made smaller.

[0064] The configurations shown in the embodiments described above are merely examples of the content of this disclosure and can be combined with other known technologies. Furthermore, the embodiments can be combined with each other, as well as with each other, and variations can be combined. Additionally, parts of the configuration can be omitted or modified without departing from the gist of this disclosure.

[0065] The various aspects of this disclosure are summarized below as an appendix. (Note 1) A packaging container for a semiconductor device comprising a resin part containing a semiconductor element and a terminal exposed from the surface of the resin part, the tip of which is located above the position of the upper surface of the resin part, A packaging container in which, when the semiconductor device is housed in the packaging container, the position of the first upper surface located above the upper surface of the resin portion on the upper surface of the outer wall of the packaging container is located above the position of the tip of the terminal. (Note 2) The packaging container has a protrusion that extends from the inner wall of the packaging container toward the upper surface of the resin part, The packaging container according to Appendix 1, wherein when the semiconductor device is housed in the packaging container, the tip of the protruding portion comes into contact with the upper surface of the resin portion. (Note 3) The tip of the protruding portion is in contact with the center of the upper surface of the resin portion, as described in Appendix 2 of the packaging container. (Note 4) The side surface of the aforementioned protrusion has a taper, The packaging container according to Appendix 2 or Appendix 3, wherein the taper is provided such that it widens from the inner wall of the packaging container toward the upper surface of the resin part. (Note 5) The resin part has a recess on its upper surface, The tip of the protruding portion is in contact with the bottom surface of the recess, the packaging container according to any one of the appendices 2 to 4. (Note 6) The packaging container described in any one of the appendices 1 to 5, wherein the inner wall of the packaging container is provided at a distance from the tip of the terminal. (Note 7) A packaging container according to any one of the appendices 1 to 6, wherein a portion of the inner wall of the packaging container is provided at a distance from the lower surface of the resin part. (Note 8) The aforementioned resin part has a protrusion on its lower surface, The packaging container described in Appendix 7, wherein a portion of the inner wall of the packaging container is provided at a distance from the protrusion. (Note 9) The semiconductor device further includes a heat sink on the lower surface of the resin part. The packaging container described in Appendix 8, wherein the protrusions are fins of the heat sink. (Note 10) The resin part has a recess on its lower surface, A packaging container according to any one of the appendices 1 to 9, wherein a portion of the inner wall of the packaging container contacts the recess so as to engage with it. (Note 11) The packaging container is a packaging container according to any one of the items 1 to 10, made of conductive foamed polypropylene. (Note 12) The aforementioned semiconductor element is a wide-bandgap semiconductor, and the packaging container is as described in any one of the items from Appendix 1 to Appendix 11. (Note 13) The aforementioned packaging container is An enclosure having a housing portion on its upper surface in which the semiconductor device is housed, It consists of a lid that is detachably attached to the aforementioned housing, A packaging container according to any one of the appendices 1 to 12, wherein when the semiconductor device is housed in the housing and the lid is attached to the housing, the position of the first upper surface of the lid, which is located above the upper surface of the resin portion, is located above the position of the tip of the terminal. (Note 14) The outer wall of the packaging container is composed of the container and the lid. In a side view, the shape of the boundary line between the housing and the lid that constitute the outer wall is uneven, as described in Appendix 13. (Note 15) The outer wall of the packaging container is composed of the container and the lid. The packaging container according to Appendix 13 or Appendix 14, wherein, in a side view, the shape of the first boundary line between the housing and the lid that constitutes the first outer wall is different from the shape of the second boundary line between the housing and the lid that constitutes the second outer wall provided opposite the first outer wall. (Note 16) In a plan view, the housing has a plurality of housing sections, A packaging container according to any one of the appendices 13 to 15, wherein a plurality of the aforementioned semiconductor devices are housed in their respective housing sections. (Note 17) The packaging container according to Appendix 16, wherein, in a cross-sectional view, at least a portion of the housing is in communication between a first semiconductor device housed in a first housing and a second semiconductor device housed in a second housing adjacent to the first housing. (Note 18) A packaging container as described in any one of the items from Appendix 1 to Appendix 17, A packaging body comprising the semiconductor device packaged in the aforementioned packaging container. (Note 19) The packaging body according to Appendix 18, further comprising packaging material in which the aforementioned packaging container is contained. (Note 20) The packaging container is the packaging body described in Appendix 19, which is housed in the packaging material under vacuum. [Explanation of Symbols]

[0066] 10 20 30 Semiconductor device, 10A First semiconductor device, 10B Second semiconductor device, 11 Resin part, 11a Top surface, 11b Bottom surface, 11c First recess, 11d Second recess, 12 Terminal, 12a Tip, 13 Heat sink, 13a Protrusion, 100 200 300 400 Packaging container, 101 Inner wall, 102 Outer wall, 102A First outer wall, 102B Second outer wall, 103 Top surface, 104 First top surface, 105 Boundary line, 105A First boundary line, 105B Second boundary line, 110 Housing, 111 Top surface, 112 Bottom surface, 113 Housing section, 113A First housing section, 113B Second housing section, 114 Top surface, 120 Cover, 121 Top surface, 122 First top surface, 123 Bottom surface, 124 Protruding part, 125 Tip, 126 Side, 1000 2000 3000 4000 Packaging body, 1100 Packaging material

Claims

1. A packaging container for a semiconductor device comprising a resin part containing a semiconductor element and a terminal exposed from the surface of the resin part, the tip of which is located above the position of the upper surface of the resin part, A packaging container in which, when the semiconductor device is housed in the packaging container, the position of the first upper surface located above the upper surface of the resin portion on the upper surface of the outer wall of the packaging container is located above the position of the tip of the terminal.

2. The packaging container has a protrusion that extends from the inner wall of the packaging container toward the upper surface of the resin part, The packaging container according to claim 1, wherein when the semiconductor device is housed in the packaging container, the tip of the protruding portion comes into contact with the upper surface of the resin portion.

3. The packaging container according to claim 2, wherein the tip of the protruding portion is in contact with the center of the upper surface of the resin portion.

4. The side surface of the aforementioned protrusion has a taper, The packaging container according to claim 2, wherein the taper is provided such that it widens from the inner wall of the packaging container toward the upper surface of the resin part.

5. The resin part has a recess on its upper surface, The packaging container according to claim 2, wherein the tip of the protruding portion is in contact with the bottom surface of the recess.

6. The packaging container according to claim 1, wherein the inner wall of the packaging container is provided at a distance from the tip of the terminal.

7. The packaging container according to claim 1, wherein a portion of the inner wall of the packaging container is provided at a distance from the lower surface of the resin part.

8. The aforementioned resin part has a protrusion on its lower surface, The packaging container according to claim 7, wherein a portion of the inner wall of the packaging container is provided at a distance from the protrusion.

9. The semiconductor device further includes a heat sink on the lower surface of the resin part. The packaging container according to claim 8, wherein the protrusions are fins of the heat sink.

10. The resin part has a recess on its lower surface, The packaging container according to claim 1, wherein a portion of the inner wall of the packaging container contacts the recess so as to engage with it.

11. The packaging container according to claim 1, wherein the packaging container is made of conductive foamed polypropylene.

12. The packaging container according to claim 1, wherein the semiconductor element is a wide-bandgap semiconductor.

13. The aforementioned packaging container is An enclosure having a housing portion on its upper surface in which the semiconductor device is housed, It consists of a lid that is detachably attached to the aforementioned housing, The packaging container according to claim 1, wherein when the semiconductor device is housed in the housing and the lid is attached to the housing, the position of the first upper surface of the lid, which is located above the upper surface of the resin portion, is located above the position of the tip of the terminal.

14. The outer wall of the packaging container is composed of the container and the lid. The packaging container according to claim 13, wherein, in a side view, the shape of the boundary line between the housing and the lid that constitute the outer wall is uneven.

15. The outer wall of the packaging container is composed of the container and the lid. The packaging container according to claim 13, wherein, in a side view, the shape of the first boundary line between the housing and the lid that constitutes the first outer wall is different from the shape of the second boundary line between the housing and the lid that constitutes the second outer wall provided opposite to the first outer wall.

16. In a plan view, the housing has a plurality of housing sections, The packaging container according to claim 13, wherein a plurality of the semiconductor devices are housed in their respective housing sections.

17. The packaging container according to claim 16, wherein, in a cross-sectional view, at least a portion of the housing is in communication between a first semiconductor device housed in a first housing and a second semiconductor device housed in a second housing adjacent to the first housing.

18. A packaging container according to any one of claims 1 to 17, A packaging body comprising the semiconductor device packaged in the aforementioned packaging container.

19. The packaging body according to claim 18, further comprising a packaging material in which the aforementioned packaging container is housed.

20. The packaging body according to claim 19, wherein the packaging container is housed in the packaging material under a vacuum.

Images