Method for fixing a workpiece, method for processing a workpiece, and method for manufacturing a chip.

Abstract

The sheet-like resin can be easily attached to one of the uneven surfaces of the workpiece. [Solution] A method for fixing a workpiece having irregularities on at least one surface, comprising: a powdered resin placement step 101 of placing powdered resin on one surface; a sheet-like resin placement step 102 of placing sheet-like resin on the other surface; and a sheet-like resin adhesion step 103 of heating the sheet-like resin and the powdered resin to adhere the workpiece to the sheet-like resin.

Description

[Technical Field]

[0001] The present invention relates to a method for fixing a workpiece, a method for processing a workpiece, and a method for manufacturing a chip. [Background Art]

[0002] A silicon wafer (hereinafter simply referred to as a workpiece) having a plurality of devices such as ICs (Integrated Circuits) and LSIs (Large-Scale Integration) formed on a surface thereof is ground on the back surface to have a predetermined thickness, and then divided into individual devices by a cutting device, and used in electrical equipment such as mobile phones and personal computers.

[0003] When dividing a workpiece into individual devices with a cutting device, an adhesive tape or a thermocompression-bonded sheet (sheet-shaped resin with no adhesive layer) is disposed in the opening of an annular ring frame (metal) and integrated.

[0004] The workpiece is attached to the adhesive tape of a holding unit, stored in a predetermined cassette, transported, placed on a cassette mounting table or the like of a cutting device, and subjected to processing (see, for example, Patent Document 1). [Prior Art Literature] [Patent Literature]

[0005] [Patent Document 1] Japanese Unexamined Patent Publication No. 10-242083 [Summary of the Invention] [Problems to be Solved by the Invention]

[0006] Here, among workpieces other than silicon wafers, there exist workpieces having irregularities on one surface. However, when a sheet-shaped resin is attached to the surface of this type of workpiece, there is a problem that the attachment is difficult.

[0007] The present invention has been made in view of the above problems, and aims to provide a method for fixing a workpiece, a method for processing a workpiece, and a method for manufacturing a chip, which enable easy attachment of a sheet-like resin to one of the uneven surfaces of the workpiece. [Means for solving the problem]

[0008] To solve the above-mentioned problems and achieve the objective, the present invention provides a method for fixing a workpiece having irregularities on at least one surface, comprising: a powdered resin placement step of placing a powdered resin on the one surface; a sheet-like resin placement step of placing a sheet-like resin on the one surface; and a sheet-like resin bonding step of heating the sheet-like resin and the powdered resin to bond the workpiece to the sheet-like resin.

[0009] In the method for fixing the workpiece, the powdered resin and the sheet-like resin do not necessarily have to contain an adhesive layer.

[0010] In the method for fixing the workpiece, the powdered resin may be a resin with a melting point equal to or lower than that of the sheet-like resin.

[0011] The present invention relates to a method for processing a workpiece in which a sheet-like resin is attached to at least one surface of the workpiece by the method for fixing the workpiece, and is characterized by comprising: a holding step of holding the side of the workpiece to which the sheet-like resin is attached to a holding table of a processing device; a processing step of processing the workpiece with a processing tool mounted on a processing unit of the processing device; and a removal step of removing the powdered resin together with the sheet-like resin from the workpiece after the processing step.

[0012] In the aforementioned method for processing a workpiece, the processing tool is a cutting wheel, and the workpiece may be divided into predetermined sizes.

[0013] In the aforementioned method for processing a workpiece, the processing tool is a grinding wheel, and the other surface of the workpiece may be flattened or the workpiece may be thinned to a predetermined thickness.

[0014] The present invention relates to a method for manufacturing a chip, which involves manufacturing a chip by dividing a workpiece having irregularities on at least one surface along a planned division line, and comprises: a powdered resin distribution step of distributing powdered resin on the one surface; a sheet-like resin distribution step of distributing sheet-like resin on the one surface; a sheet-like resin bonding step of heating the sheet-like resin and the powdered resin to bond the workpiece to the sheet-like resin; a holding step of holding the side of the workpiece to which the sheet-like resin is bonded on a holding table of a processing device; a division step of dividing the workpiece into chips using a processing tool mounted on a processing unit of the processing device; and a removal step of removing the powdered resin from the workpiece together with the sheet-like resin after the division step. [Effects of the Invention]

[0015] The present invention has the effect of easily adhering a sheet-like resin to one of the uneven surfaces of a workpiece.

[0016] Furthermore, as a secondary effect, the present invention also provides the benefit of GluFree (powdered resin) removing dirt, residue, and foreign matter from the back surface. [Brief explanation of the drawing]

[0017] [Figure 1] Figure 1 is a schematic perspective view showing the workpiece to be processed in the workpiece fixing method according to Embodiment 1. [Figure 2] Figure 2 is a schematic cross-sectional view of the workpiece shown in Figure 1. [Figure 3] Figure 3 is a flowchart showing the flow of the workpiece fixing method according to Embodiment 1. [Figure 4] Figure 4 is a schematic perspective view showing the powder resin dispensing step of the workpiece fixing method shown in Figure 3. [Figure 5] FIG. 5 is a perspective view schematically illustrating the sheet-shaped resin arranging step of the method for fixing a workpiece shown in FIG. 3. [Figure 6] FIG. 6 is a perspective view schematically illustrating the workpiece after the sheet-shaped resin arranging step of the method for fixing a workpiece shown in FIG. 3. [Figure 7] FIG. 7 is a perspective view schematically illustrating the sheet-shaped resin attaching step of the method for fixing a workpiece shown in FIG. 3. [Figure 8] FIG. 8 is a cross-sectional view schematically illustrating the workpiece after the sheet-shaped resin attaching step of the method for fixing a workpiece shown in FIG. 3. [Figure 9] FIG. 9 is a flowchart showing the flow of the method for processing a workpiece according to Embodiment 1. [Figure 10] FIG. 10 is a perspective view schematically illustrating the holding step of the method for processing a workpiece shown in FIG. 9. [Figure 11] FIG. 11 is a perspective view schematically illustrating the processing step of the method for processing a workpiece shown in FIG. 9. [Figure 12] FIG. 12 is a side view schematically illustrating a modification of the processing step of the method for processing a workpiece shown in FIG. 11. [Figure 13] FIG. 13 is a cross-sectional view schematically illustrating the removing step of the method for processing a workpiece shown in FIG. 9. [Figure 14] FIG. 14 is a cross-sectional view schematically illustrating a modification of the removing step of the method for processing a workpiece shown in FIG. 13. [Figure 15] FIG. 15 is a perspective view schematically illustrating a workpiece to be processed in the method for manufacturing a chip according to Embodiment 1. [Figure 16] FIG. 16 is a flowchart showing the flow of the method for manufacturing a chip according to Embodiment 1. DESCRIPTION OF EMBODIMENTS

[0018] Embodiments for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by those skilled in the art, and those that are substantially the same. In addition, the components described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the components can be made without departing from the spirit of the present invention.

[0019] [Embodiment 1] A method for fixing a workpiece according to Embodiment 1 of the present invention will be described with reference to the drawings. Figure 1 is a schematic perspective view showing the workpiece to be processed by the method for fixing a workpiece according to Embodiment 1. Figure 2 is a schematic cross-sectional view showing the workpiece shown in Figure 1.

[0020] (Workpiece) The method for fixing a workpiece according to Embodiment 1 is the method for fixing the workpiece 1 shown in Figures 1 and 2. The workpiece 1 to be processed by the method for fixing a workpiece according to Embodiment 1 is a wafer such as a disc-shaped semiconductor wafer or optical device wafer, which has a substrate made of silicon, sapphire, gallium, SiC, etc.

[0021] In Embodiment 1, the workpiece 1 is a so-called azu-sliced ​​wafer formed into a disc shape by cutting a cylindrical ingot to a predetermined thickness using a wire saw or the like. As shown in Figure 2, the workpiece 1 has a surface 2 on at least one side 2 that is uneven 10 consisting of a plurality of recesses 11 and protrusions 12. In Embodiment 1, the surface roughness Ra (average roughness) of one side 2 of the workpiece 1 is 10 μm or more and 200 μm or less. In this invention, the workpiece 1 is not limited to an azu-sliced ​​wafer as long as one side 2 has an uneven surface 10. Note that in Figure 2, the uneven surface 10 of one side 2 of the workpiece 1 is exaggerated and shown to be larger than it actually is.

[0022] (Method of securing the workpiece) Figure 3 is a flowchart showing the flow of the workpiece fixing method according to Embodiment 1. As shown in Figure 3, the workpiece fixing method according to Embodiment 1 includes a powder resin placement step 101, a sheet resin placement step 102, and a sheet resin adhesion step 103.

[0023] (Powdered resin dispensing step) Figure 4 is a schematic perspective view showing the powdered resin application step of the workpiece fixing method shown in Figure 3. The powdered resin application step 101 is a step of applying powdered resin 20 to one surface 2 of the workpiece 1.

[0024] In Embodiment 1, in the powdered resin placement step 101, as shown in Figure 4, the powdered resin 20 is placed over the entire surface 2 of one of the workpieces 1. In Embodiment 1, the powdered resin 20 is formed as a powder with an average particle size of 10 μm or more and 50 μm or less. In Embodiment 1, the powdered resin 20 includes a thermoplastic resin such as a polyolefin-based resin compound or a polyester-based resin compound. In Embodiment 1, the powdered resin 20 mainly penetrates into the recess 11 on one of the surfaces 2.

[0025] (Sheet-like resin arrangement step) Figure 5 is a schematic perspective view showing the sheet-like resin placement step of the workpiece fixing method shown in Figure 3. Figure 6 is a schematic perspective view showing the workpiece after the sheet-like resin placement step of the workpiece fixing method shown in Figure 3. The sheet-like resin placement step 102 is a step of placing a sheet-like resin 30 on one surface 2 of the workpiece 1.

[0026] In Embodiment 1, in the sheet-like resin placement step 102, as shown in Figure 5, the sheet-like resin 30 is placed over the entire surface 2 of one of the workpieces 1 on which the powdered resin 20 is placed. In Embodiment 1, the sheet-like resin 30 does not contain an adhesive layer, has a constant thickness, and is formed in the shape of a disc with an outer diameter larger than the outer diameter of the workpiece 1.

[0027] In Embodiment 1, the sheet-like resin 30 includes a thermoplastic resin such as a polyolefin-based resin compound or a polyester-based resin compound. That is, in Embodiment 1, the sheet-like resin 30 is made of the same material as the powdered resin 20, but in the present invention, it does not have to be made of the same material as the powdered resin 20. In Embodiment 1, as shown in Figure 6, the sheet-like resin 30 is disposed on one of the surfaces 2 on which the powdered resin is disposed in the central part.

[0028] In Embodiment 1, the thermoplastic resins constituting the powdered resin 20 and the sheet-like resin 30 are specifically acrylic resin, methacrylic resin, vinyl resin, polyacetal, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, polyolefins such as polyethylene, polypropylene, poly(4-methyl-1-pentene), and poly(1-butene), polyesters such as polyethylene terephthalate and polybutylene terephthalate, polyamides such as nylon-6, nylon-66, and polymetaxylene adipamide, polyacrylate, polymethacrylate, polyvinyl chloride, and polyetherimide. Examples include one or more selected from polyacrylonitrile, polycarbonate, polystyrene, polysulfone, polyethersulfone, polyphenylene, etherpolybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, thermoplastic polyurethane resin, phenoxy resin, polyamideimide resin, fluororesin, ethylene-unsaturated carboxylic acid copolymer resin, ethylene-vinyl acetate copolymer resin, ionomer, ethylene-vinyl acetate-maleic anhydride ternary copolymer resin, ethylene-vinyl acetate copolymer saponified resin, and ethylene-vinyl alcohol copolymer resin.

[0029] Examples of unsaturated carboxylic acids constituting the above-mentioned ethylene-unsaturated carboxylic acid copolymer include acrylic acid, methacrylic acid, maleic acid, itaconic acid, monomethyl maleate, monoethyl maleate, maleic anhydride, and itaconic anhydride. Here, the term ethylene-unsaturated carboxylic acid copolymer includes not only binary copolymers of ethylene and unsaturated carboxylic acids, but also polypolymers in which other monomers are copolymerized. Examples of other monomers that may be copolymerized in the ethylene-unsaturated carboxylic acid copolymer include vinyl esters such as vinyl acetate and vinyl propionate, and unsaturated carboxylic acid esters such as methyl acrylate, ethyl acrylate, isobutyl acrylate, n-butyl acrylate, methyl methacrylate, isobutyl methacrylate, dimethyl maleate, and diethyl maleate.

[0030] Furthermore, in Embodiment 1, the powdered resin 20 and the sheet-like resin 30 are thermoplastic resins with the same melting point among the thermoplastic resins mentioned above, that is, in Embodiment 1, they are composed of thermoplastic resins of the same material. In addition, in the present invention, the powdered resin 20 may be composed of a thermoplastic resin with a lower melting point than the sheet-like resin 30. Thus, in the present invention, it is sufficient that the melting point of the powdered resin 20 is less than or equal to the melting point of the sheet-like resin 30, that is, the powdered resin 20 may be a resin with a melting point equal to or less than that of the sheet-like resin 30.

[0031] (Sheet-like resin adhesion step) Figure 7 is a schematic perspective view showing the sheet-like resin bonding step of the workpiece fixing method shown in Figure 3. Figure 8 is a schematic cross-sectional view showing the workpiece after the sheet-like resin bonding step of the workpiece fixing method shown in Figure 3. The sheet-like resin bonding step 103 is a step in which the sheet-like resin 30 and the powdered resin 20 are heated to bond the workpiece 1 to the sheet-like resin.

[0032] In Embodiment 1, in the sheet-like resin bonding step 103, the powdered resin 20 and the sheet-like resin 30 on one surface 2 of the workpiece 1 are heated and softened. In Embodiment 1, in the sheet-like resin bonding step 103, as shown in Figure 7, hot air 41 is blown from a spray nozzle 40 onto the sheet-like resin 30 on the entire surface of one surface 2 of the workpiece 1, heating the resins 20 and 30 until they soften without melting.

[0033] Then, in Embodiment 1, in the sheet-like resin bonding step 103, as shown in Figure 8, the softened powdered resin 20 adheres closely to the inner surface of the recess 11 of the uneven surface 10 on one of the surfaces 2. In Embodiment 1, in the sheet-like resin bonding step 103, the softened powdered resin 20 adheres closely to the softened sheet-like resin 30, bonding the resins 20 and 30 to one of the surfaces 2 of the workpiece 1, and also bonding the resins 20 and 30 closely to each other. In Embodiment 1, in the sheet-like resin bonding step 103, the heat of the softened resins 20 and 30 is cooled, and these resins 20 and 30 are cured.

[0034] In the present invention, in the sheet-like resin bonding step 103, the softened sheet-like resin 30 may be pressed toward one surface 2 with a flat plate-shaped member to heat-press the resin 20, 30 toward one surface 2. Furthermore, in the present invention, the means for heating the sheet-like resin 30 is not limited to those described in Embodiment 1 above. For example, it may be heated by irradiating it with infrared rays from an infrared heater, or by bringing a heated heat source close to the sheet-like resin 30 to heat it, or by placing the workpiece 1 on a table with a built-in heat source and indirectly or directly heating the resin 20, 30 through the workpiece 1.

[0035] In the workpiece fixing method according to Embodiment 1 described above, before the sheet-like resin placement step 102 in which a sheet-like resin 30 is placed on one surface 2 having irregularities 10, a powdered resin 20 is placed on one surface 2 in the powdered resin placement step 101, and the resins 20 and 30 are heated in the sheet-like resin bonding step 103. As a result, in the workpiece processing method according to Embodiment 1, the softened powdered resin 20 between one surface 2 and the sheet-like resin 30 adheres closely to the inner surface of the recesses 11 of the irregularities 10, and the softened sheet-like resin 30 adheres closely to the powdered resin 20.

[0036] As a result, the method for fixing a workpiece according to Embodiment 1 has the effect of easily attaching a sheet-like resin 30 to one of the uneven surfaces 2 of the workpiece 1.

[0037] Furthermore, in the method for fixing a workpiece according to Embodiment 1, since the melting point of the powdered resin 20 is less than or equal to the melting point of the sheet-like resin 30, when the resins 20 and 30 are heated in the sheet-like resin bonding step 103, the powdered resin 20 softens when the sheet-like resin 30 softens, allowing the resins 20 and 30 to be tightly bonded to each other. As a result, in the method for fixing a workpiece according to Embodiment 1, when the resins 20 and 30 are peeled off from the workpiece 1, the powdered resin 20 can be peeled off together with the sheet-like resin 30, and the residue of the powdered resin 20 on one side 2 of the workpiece 1 can be suppressed.

[0038] (Processing method of workpiece) Next, a method for processing a workpiece according to Embodiment 1 will be described. Figure 9 is a flowchart showing the flow of the method for processing a workpiece according to Embodiment 1. The method for processing a workpiece according to Embodiment 1 is a method for processing a workpiece 1 in which a sheet-like resin 30 is attached to at least one surface 2 by the workpiece fixing method described above. As shown in Figure 9, the method for processing a workpiece according to Embodiment 1 includes a holding step 201, a processing step 202, and a removal step 203.

[0039] (Holding step) Figure 10 is a schematic perspective view showing the holding step of the workpiece processing method shown in Figure 9. The holding step 201 is the step of holding the side of the workpiece 1 to which the sheet-like resin 30 is attached on the holding table 51 of the processing device 50.

[0040] In Embodiment 1, during the holding step 201, the processing device 50 places one side 2 of the workpiece 1, to which the sheet-like resin 30 is attached, onto the holding surface of the holding table 51, as shown in Figure 10. In Embodiment 1, during the holding step 201, the processing device 50 uses suction to hold one side 2 of the workpiece 1 via the sheet-like resin 30 on the holding surface of the holding table 51.

[0041] (Processing step) Figure 11 is a schematic perspective view showing the processing steps of the workpiece processing method shown in Figure 9. Figure 12 is a schematic side view showing a modified example of the processing steps of the workpiece processing method shown in Figure 11. Processing step 202 is the step of processing the workpiece 1 with a processing tool mounted on the processing unit of the processing device 50.

[0042] In Embodiment 1, in processing step 202, the processing device 50 (hereinafter referred to as reference numeral 50-1), which is a cutting device, cuts into the workpiece 1 held on the holding table 51 from the other side 3 of the back side of one side 2, using the cutting edge 54 (corresponding to a processing tool) of the cutting blade 53, which is a cutting wheel, rotated around its axis by the spindle of the cutting unit 52, which is a processing unit, as shown in Figure 11. In Embodiment 1, in processing step 202, the processing device 50-1 cuts into the workpiece 1 with the cutting edge 54 of the cutting blade 53 while moving the cutting blade 53 and the holding table 51 relative to each other, thereby dividing the workpiece 1 into predetermined sizes.

[0043] Furthermore, in the present invention, in the processing step 202, the processing device 50 (hereinafter referred to as reference numeral 50-2), which is a grinding device, may rotate the holding table 51 that holds the workpiece 1 around its axis, as shown in Figure 12, and bring the grinding wheel 57 (corresponding to a processing tool) of the grinding wheel 56, which is rotated around its axis by the spindle of the grinding unit 55, which is a processing unit, into contact with the other surface 3 of the workpiece 1. In this case, in the processing step 202, the processing device 50-2 brings the grinding unit 55 closer to the holding table 51 and grinds the other surface 3 with the grinding wheel 57 to flatten the other surface 3 of the workpiece 1 and thin the workpiece 1 to a predetermined thickness.

[0044] (Removal step) Figure 13 is a schematic cross-sectional view showing the removal step of the workpiece processing method shown in Figure 9. Figure 14 is a schematic cross-sectional view showing a modified example of the removal step of the workpiece processing method shown in Figure 13. Note that Figures 13 and 14 omit the irregularities 10 on one surface 2 of the workpiece 1 and the powdered resin 20.

[0045] The removal step 203 is a step in which, after the processing step 202, the powdered resin 20 is removed from the workpiece 1 together with the sheet-like resin 30. In Embodiment 1, in the removal step 203, if the processing device 50-1 divides the workpiece 1 into predetermined sizes in the processing step 202, as shown in Figure 13, a well-known picker 60 holds the other side 3 of the divided workpiece 1 against the lower surface 61 by suction, and peels off each divided workpiece 1 from the resin 20 and 30.

[0046] Furthermore, in Embodiment 1, in the removal step 203, if the processing device 50-2 has ground the workpiece 1 in the processing step 202, the well-known gripping unit 70 grips one end of the sheet-like resin 30, as shown in Figure 14. In Embodiment 1, in the removal step 203, if the processing device 50-2 has ground the workpiece 1 in the processing step 202, the gripping unit 70 is moved along one surface 2 of the workpiece 1 so as to pass over the center of the workpiece 1 toward the other end, and the resins 20 and 30 are peeled off from the workpiece 1 sequentially from one end of the sheet-like resin 30.

[0047] (Method of manufacturing chips) Figure 15 is a schematic perspective view showing the workpiece to be processed in the chip manufacturing method according to Embodiment 1. Figure 16 is a flowchart showing the flow of the chip manufacturing method according to Embodiment 1. The chip manufacturing method according to Embodiment 1 is a method of manufacturing multiple chips 9 by dividing the workpiece 1-1 shown in Figure 15 into individual chips 9.

[0048] The workpiece 1-1 shown in Figure 15, which is the target of the chip manufacturing method according to Embodiment 1, is a wafer such as a disc-shaped semiconductor wafer with silicon or the like as the substrate 4. As shown in Figure 15, the workpiece 1-1 has a plurality of grid-like division lines 5 set on one surface 2, and devices 6 are formed in the regions partitioned by the plurality of grid-like division lines 5 on one surface 2.

[0049] Device 6 is, for example, an integrated circuit such as an IC (Integrated Circuit) or LSI (Large Scale Integration), or various types of memory (semiconductor memory device). In Embodiment 1, device 6 also includes conductive spherical bumps 7 connected to electrodes of a wiring layer, etc. The bumps 205 protrude from one surface 2, and the workpiece 1-1 has irregularities 10 formed on one surface 2.

[0050] In Embodiment 1, the bump 7 is formed in a hemispherical shape, for example. However, in the present invention, the shape of the bump 7 is not limited to a hemispherical shape, and may be, for example, pillar-shaped. In Embodiment 1, the width of the bump 7 is about 60 μm, and the height of the bump 7 from one surface 2 is about 60 μm.

[0051] The workpiece 1-1 is divided into individual chips 9 along the division line 5. Each chip 9 includes a portion of the substrate 4 and a device 6. In Embodiment 1, the workpiece 1-1 is divided into chips 9, each having a bump 7, which are mounted on the substrate using a mounting technique called flip-chip bonding.

[0052] The chip manufacturing method according to Embodiment 1 is a method for manufacturing chips 9 by dividing a workpiece 1-1 along a planned division line 5. As shown in Figure 16, the chip manufacturing method comprises a powder resin placement step 101, a sheet resin placement step 102, a sheet resin adhesion step 103, a holding step 201, a processing step 202, and a removal step 203. Note that in Figure 16, the same reference numerals are used for parts that are the same as those used for the workpiece fixing method and workpiece processing method described above, and their explanation is omitted.

[0053] The processing step 202 of the chip manufacturing method according to Embodiment 1 is a division step in which the workpiece 1-1 is divided into chips 9 by the cutting edge 54 of the cutting blade 53 mounted on the cutting unit 52 of the processing device 50-1. In the processing step 202 of the chip manufacturing method according to Embodiment 1, the processing device 50-1 moves the workpiece 1-1 held on the holding table 51 and the cutting blade 53 relative to each other along the division line 5, causing the cutting edge 54 of the cutting blade 53 to cut into the division line 5, thereby dividing the workpiece 1-1 into individual chips 9.

[0054] The method for processing a workpiece and manufacturing a chip according to Embodiment 1 processes a workpiece 1 to which a sheet-like resin 30 has been attached by the workpiece fixing method described above. Therefore, similar to the workpiece fixing method, it has the effect of easily attaching the sheet-like resin 30 to one of the uneven surfaces 2 of the workpiece 1.

[0055] Furthermore, the processing method for the workpiece and the method for manufacturing the chip according to Embodiment 1 also has the secondary effect of GluFree (powdered resin 20) removing dirt, debris from the other surface 3, and foreign matter.

[0056] It should be noted that the present invention is not limited to the above embodiments. That is, it can be implemented with various modifications without departing from the core of the present invention. In the processing step 202, which is the division step of the chip manufacturing method according to Embodiment 1, the workpiece 1-1 is divided into individual chips 9 by so-called cutting. However, in the present invention, in the processing step 202, which is the division step, the workpiece 1-1 may be divided into individual chips 9 by so-called ablation processing, which involves irradiating the workpiece 1-1 with a laser beam of an absorbing wavelength, or a modified layer may be formed by irradiating the workpiece 1-1 with a laser beam of a penetrating wavelength, and the workpiece 1-1 may be divided into individual chips 9 starting from the modified layer. [Explanation of Symbols]

[0057] 1,1-1 Workpiece 2 One side 3 The other side 9 chips 10 Unevenness 20 Powdered resin 30 Sheet-shaped resin 50,50-1,50-2 Processing equipment 51 Holding Table 52 Cutting Unit (Processing Unit) 54 Cutting blades (machining tools, cutting wheels) 55 Grinding Unit (Processing Unit) 57 Grinding wheels (machining tools) 101 Step for distributing powdered resin 102 Sheet-like resin placement step 103 Sheet-type resin adhesion step 201 Holding step 202 Machining Step (Dividing Step) 203 Removal Step

Claims

1. A method for fixing a workpiece having irregularities on at least one surface, A powdered resin placement step in which powdered resin is placed on one of the surfaces, A sheet-like resin arrangement step in which a sheet-like resin is arranged on one of the surfaces, A sheet-like resin bonding step involves heating the sheet-like resin and the powdered resin to bond the workpiece and the sheet-like resin, A method for fixing a workpiece, comprising the components mentioned above.

2. The method for fixing a workpiece according to claim 1, wherein the sheet-like resin does not contain an adhesive layer.

3. The method for fixing a workpiece according to claim 1, wherein the powdered resin is a resin with a melting point equal to or less than that of the sheet-like resin.

4. A method for processing a workpiece in which a sheet-like resin is attached to at least one surface by a method for fixing the workpiece described in any one of claims 1 to 3, A holding step of holding the side of the workpiece to which the sheet-like resin is attached to the holding table of the processing device, A processing step of processing the workpiece with a processing tool attached to the processing unit of the processing apparatus, After the processing step, a removal step is performed to remove the powdered resin together with the sheet-like resin from the workpiece. A method for processing a workpiece that includes the components mentioned above.

5. The method for processing a workpiece according to claim 4, wherein the processing tool is a cutting wheel, and the workpiece is divided into predetermined sizes.

6. The processing tool is a grinding wheel, and the method for processing a workpiece according to claim 4, wherein the other surface of the workpiece is flattened or the workpiece is thinned to a predetermined thickness.

7. A method for manufacturing chips, which involves dividing a workpiece having irregularities on at least one surface along a planned division line to produce chips, A powdered resin placement step in which powdered resin is placed on one of the surfaces, A sheet-like resin arrangement step in which a sheet-like resin is arranged on one of the surfaces, A sheet-like resin bonding step involves heating the sheet-like resin and the powdered resin to bond the workpiece and the sheet-like resin, A holding step of holding the side of the workpiece to which the sheet-like resin is attached to the holding table of the processing device, A division step in which the workpiece is divided into chips by a machining tool mounted on the machining unit of the machining apparatus, After the dividing step, a removal step is performed to remove the powdered resin together with the sheet-like resin from the workpiece. A method for manufacturing a chip that includes and comprises these components.

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