Wiring boards and optical modules

Abstract

The present invention provides a wiring board capable of efficiently mounting optical devices, and an optical module equipped with the wiring board. [Solution] The wiring board comprises a mounting section on which an optical device is mounted, a base that is open in front of and above the mounting section and surrounds the rear and left and right sides of the mounting section, and a plurality of first electrodes and a plurality of second electrodes located on the upper surface of the base. The upper surface of the base includes a first band-shaped region adjacent to the mounting section and behind the mounting section in a plan view and extending in the left-right direction, and a second band-shaped region adjacent to the mounting section and to the left or right of the mounting section in a plan view and extending in the left-right direction. The plurality of first electrodes are located in the first band-shaped region arranged in the left-right direction, and the plurality of second electrodes are located in the second band-shaped region arranged in the front-back direction.

Description

[Technical Field]

[0001] The present disclosure relates to a wiring board and an optical module. [Background Art]

[0002] Patent Document 1 describes a light source module in which a plurality of semiconductor lasers are housed in a package. [Prior Art Documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Unexamined Patent Publication No. 2017-103271 [Summary of the Invention] [Problem to be Solved by the Invention]

[0004] For a wiring board on which optical devices are mounted, it is desirable to be able to efficiently mount a plurality of optical devices in parallel. An object of the present disclosure is to provide the aforementioned wiring board and an optical module including the aforementioned wiring board. [Means for Solving the Problem]

[0005] The wiring board according to the present disclosure includes: a mounting portion on which an optical device is mounted; a base body that opens the front and upper side of the mounting portion and surrounds the rear and left and right sides of the mounting portion; a plurality of first electrodes and a plurality of second electrodes located on an upper surface of the base body; the upper surface of the base body includes a first strip-shaped region adjacent to the mounting portion behind the mounting portion in a plan view and extending in the left-right direction, and a second strip-shaped region adjacent to the mounting portion on a first lateral side which is the left side or the right side of the mounting portion in a plan view and extending in the left-right direction, the plurality of first electrodes are arranged in the left-right direction and located in the first strip-shaped region, the plurality of second electrodes are arranged in the front-rear direction and located in the second strip-shaped region.​

[0006] The optical module relating to this disclosure is The above wiring board and, The optical device mounted on the aforementioned mounting section, It is equipped with. [Effects of the Invention]

[0007] According to this disclosure, the effect of efficiently mounting multiple optical devices in parallel can be obtained. [Brief explanation of the drawing]

[0008] [Figure 1] A perspective view (A) and an exploded perspective view (B) showing the wiring board of Embodiment 1 according to this disclosure are shown. [Figure 2] This is a plan view showing the upper substrate in Figure 1. [Figure 3] This is a perspective view showing the optical module of Embodiment 1. [Figure 4] This is a perspective view showing a wiring board of Embodiment 2 according to the present disclosure. [Figure 5] This is a perspective view showing a wiring board of Embodiment 3 according to the present disclosure. [Figure 6] This is a perspective view showing a wiring board of Embodiment 4 according to the present disclosure. [Figure 7] This is a perspective view showing a wiring board of Embodiment 5 according to the present disclosure. [Figure 8] This is a perspective view showing a wiring board of Embodiment 6 according to the present disclosure. [Figure 9] This is a perspective view showing the wiring board (A) of Embodiment 7 and the wiring board (B) of Embodiment 8 according to the present disclosure. [Modes for carrying out the invention]

[0009] Each embodiment of this disclosure will be described in detail below with reference to the drawings. In the following description, the direction perpendicular to the first strip-shaped region E1 of the upper substrate 20 will be considered the up-down direction, the direction from the lower substrate 10 toward the upper substrate 20 will be considered the upward direction, and the direction along the first strip-shaped region E1 will be considered the horizontal direction. Furthermore, in the figures, the left, front, and upward directions are indicated by arrows X, Y, and Z, respectively. The directions described in the description may differ from the directions when the wiring board 1 is in use. In the following description, "plan view" means viewing from above, or viewing through from above.

[0010] (Embodiment 1) Figure 1 shows a perspective view (A) and an exploded perspective view (B) of the wiring board 1 of Embodiment 1 according to this disclosure. Figure 2 is a plan view of the upper substrate 20 of Figure 1. Figure 3 is a perspective view of the optical module 100 of Embodiment 1. In Figure 3, the connecting members (e.g., bonding wires) that electrically connect the light-emitting device 31 and the wiring board 1 are not shown. In the above figures and the figures described later, only a few representative components are denoted by reference numerals.

[0011] The wiring board 1 of Embodiment 1 may comprise a lower board 10 and an upper board 20. The optical module 100 of Embodiment 1 may comprise the wiring board 1 and an optical device 30 mounted on the mounting section 11, as shown in Figure 3.

[0012] The lower substrate 10 may have a plate shape having a first surface S1 having a mounting portion 11 and a second surface S2 opposite to the first surface S1. The lower substrate 10 may also be a heat-dissipating material. The material of the lower substrate 10 may be copper (Cu), copper (Cu)-molybdenum (Mo) impregnated material or laminate, aluminum alloy, diamond, carbon-based material, iron, steel, or iron-based alloy. The lower substrate 10 may further be plated with nickel (Ni) and gold (Au) on the first surface S1, the second surface S2, or the entire surface.

[0013] The upper substrate 20 may include a base body 21 that is an insulator, and a plurality of electrodes located on the upper surface of the base body 21 (namely the first electrode 22a, the second electrode 22b (see Fig. 2), the third electrode 22c, and marks 24a, 24b). The upper substrate 20 may include an internal conductor 23 located inside the base body 21. A part of the internal conductor 23 is shown in Fig. 1(A) and Fig. 1(B).

[0014] The base body 21 may be LTCC (Low Temperature Co-fired Ceramics) such as alumina ceramics, aluminum nitride ceramics, mullite ceramics, zirconia ceramics, titania ceramics, forsterite ceramics and glass ceramics, silicone, or molding resin. When the base body 21 is made of ceramics, the base body 21 may be formed by performing forming processing such as cutting on a green sheet which is a ceramic material before firing, then laminating a plurality of said green sheets and performing firing.

[0015] The electrodes (i.e., the first electrode 22a, the second electrode 22b, the third electrode 22c, and the marks 24a, 24b) may be formed of a single material or a material including a plurality of materials selected from tungsten (W), molybdenum (Mo), copper (Cu), copper-tungsten (Cu-W), copper-molybdenum (Cu-Mo), nickel (Ni), gold (Au), aluminum (Al), titanium (Ti), platinum (Pt), and chromium (Cr). More specifically, when the base body 21 is LTCC, the electrodes described above may be formed of a single material or a material including a plurality of materials selected from copper (Cu), titanium (Ti), platinum (Pt), and gold (Au). When the base body 21 is aluminum nitride ceramics, the electrodes described above may be formed of a single material or a material including a plurality of materials selected from tungsten (W) and molybdenum (Mo). When the base body 21 is alumina ceramics, the electrodes described above may be formed of a single material or a material including a plurality of materials selected from tungsten (W), molybdenum (Mo), copper-tungsten (Cu-W), and copper-molybdenum (Cu-Mo). The inner conductor 23 may also be formed of the same material as the electrodes described above. However, when the base body 21 is aluminum nitride ceramics, the electrodes located on the surface of the base body 21 may be formed of a single material or a material including a plurality of materials selected from titanium (Ti), platinum (Pt), gold (Au), chromium (Cr), and nickel (Ni). When the base body 21 is aluminum nitride ceramics, the inner conductor 23 may be formed of a single material or a material including a plurality of materials selected from tungsten (W) and molybdenum (Mo). The electrodes described above may be plated on the surface with one or more materials selected from nickel (Ni), gold (Au), titanium (Ti), platinum (Pt), and chromium (Cr).

[0016] The electrodes (i.e., the first electrode 22a, the second electrode 22b, the third electrode 22c, and marks 24a and 24b) may be constructed by forming a conductive paste film on the surface green sheet before firing and firing it simultaneously with the green sheet. Furthermore, the electrodes may be plated after firing. In addition, the internal conductor 23 may be a combination of one or both of the following: a film-shaped conductor formed by forming a conductive paste film on the inner layer green sheet and firing it simultaneously with the green sheet, and a via conductor formed by forming a conductive paste so as to penetrate the green sheet vertically and vertically and firing it simultaneously with the green sheet. If the substrate 21 is silicone or molded resin, the electrodes and internal conductor 23 may be copper leads, and the upper substrate 20 may be constructed by molding silicone or resin so as to embed a portion of the copper leads.

[0017] The lower substrate 10 and the upper substrate 20 may be joined via a bonding material. The bonding material may be an adhesive resin, solder, or a molten metal material such as brazing material. The lower substrate 10 and the upper substrate 20 may be joined by the activated metal method. In the joined state, the lower substrate 10 may be configured to be longer in front of the upper substrate 20.

[0018] The mounting portion 11 is a rectangular planar area, but in plan view, it may have a shape in which one or both of the rectangle's perimeter are rounded and / or uneven, or it may be an area that includes unevenness in the vertical direction. The base body 21 of the upper substrate 20 may be open in front of the mounting portion 11 (specifically, the front in plan view) and above, and may surround the rear (specifically, the rear in plan view), left, and right sides of the mounting portion 11.

[0019] As shown in Figure 2, the upper surface of the upper substrate 20 may include a first strip-shaped region E1 that, in a plan view, is adjacent to the mounting portion 11 behind the mounting portion 11 and extends in the left-right direction, and a second strip-shaped region E2 that, in a plan view, is adjacent to the mounting portion 11 to the left (corresponding to the first horizontal direction) of the mounting portion 11 and extends in the front-rear direction. The first strip-shaped region E1 may be longer in the left-right direction than in the front-rear direction. The second strip-shaped region E2 may be longer in the front-rear direction than in the left-right direction. The first strip-shaped region E1 and the second strip-shaped region E2 may be located at the same height and be continuous.

[0020] The upper surface of the upper substrate 20 may further include a first region E3 that extends behind the first strip-shaped region E1 and to the left of the second strip-shaped region E2 in a plan view. The upper surface of the upper substrate 20 may further include a second region E4 which is the upper surface of the portion of the base body 21 that surrounds the mounting portion 11 from the right. The first region E3 and the second region E4 may be located at the same height and be continuous.

[0021] The upper substrate 20 may have a plurality of first electrodes 22a, a plurality of second electrodes 22b, and a plurality of third electrodes 22c located on the upper surface of the base body 21. The plurality of first electrodes 22a may be arranged side by side in the left-right direction in the first strip-shaped region E1. The plurality of second electrodes 22b may be arranged side by side in the front-back direction in the second strip-shaped region E2. The plurality of third electrodes 22c may be located in the first region E3. Although not shown, a portion of the plurality of third electrodes 22c may be located in the second region E4.

[0022] The multiple first electrodes 22a may be electrodes electrically connected to multiple light-emitting devices 31 (see Figure 3) included in the optical device 30. The multiple first electrodes 22a and the internal conductors 23 connected to the first electrodes 22a may be configured to transmit high-frequency signals.

[0023] The multiple second electrodes 22b may be electrodes electrically connected to an electrical device 32 (see Figure 3) included in the optical device 30.

[0024] Each of the multiple third electrodes 22c may be electrically connected to any of the multiple first electrodes 22a and the multiple second electrodes 22b via the internal conductor 23. Any of the multiple third electrodes 22c may be used for input of a signal or power supply voltage from outside the optical module 100. Any of the multiple third electrodes 22c may be used for outputting a signal or voltage from the optical module 100 to the outside.

[0025] As shown in Figure 3, the optical device 30 may have a plurality of light-emitting devices 31 and an electrical device 32. The light-emitting device 31 corresponds to an example of an optical device according to this disclosure. The light-emitting device 31 may have a light-emitting element such as a semiconductor laser and a monitoring element (e.g., PD: photodiode) for monitoring the laser output. Each light-emitting device 31 may be configured in which the light-emitting element and the monitoring element are mounted on a substrate called a submount. Electrical components such as capacitors and resistors may be mounted on the submount. The plurality of light-emitting devices 31 may be arranged in a left-right direction with the direction of light emission facing forward. The electrical device 32 may be a cooling device including a Peltier element. The plurality of light-emitting devices 31 may be mounted on the electrical device 32, and the electrical device 32 may be configured to conduct heat from the plurality of light-emitting devices 31 to the lower substrate 10. The electrical device 32 may be configured to receive power from an external source via a second electrode 22b and be driven by said power. Alternatively, the electrical device 32 may be a device having a temperature sensor such as a thermistor. In this configuration, the electrical device 32 may output a detection signal to the outside via the second electrode 22b.

[0026] The light-emitting device 31 of the optical device 30 may be replaced with a light-receiving device that includes a light-receiving element such as a PD. In this configuration, the light-receiving device corresponds to an example of the optical device according to this disclosure. In this configuration, the light-receiving devices may be arranged in the left-right direction with their light-receiving direction facing forward to capture light incident in the front-back direction. If the light-receiving device is configured to guide light to the light-receiving element via an optical component such as a mirror, the above-mentioned light-receiving direction means the direction in which light is incident on the optical component.

[0027] According to the above configuration of the wiring board 1, the first strip-shaped region E1 is located adjacent to the multiple light-emitting devices 31. Therefore, the electrical connection between the multiple first electrodes 22a of the first strip-shaped region E1 and the multiple light-emitting devices 31 can be efficiently performed. That is, when connecting by wire bonding, the light-emitting devices 31 and the first electrodes 22a can be connected via short wires. Furthermore, the electrical connection with the electrical device 32 can be made via the second electrode 22b of the second strip-shaped region E2. Therefore, the structure for electrically connecting with the electrical device 32 is less likely to interfere with the structure for electrically connecting with the multiple light-emitting devices 31. Moreover, since the second electrode 22b is located in a region separate from the region where the multiple first electrodes 22a are located, the second electrode 22b is less likely to affect the layout of the multiple first electrodes 22a. Therefore, the degree of freedom in the layout of the multiple first electrodes 22a is improved, and a more efficient connection between the multiple light-emitting devices 31 and the first electrodes 22a can be achieved. Since the wire connecting the light-emitting device 31 and the first electrode 22a can be shortened, the transmission characteristics of high-frequency signals can be improved.

[0028] Furthermore, due to the shape of the base body 21 described above, the base body 21 surrounds the optical device 30 mounted on the mounting section 11 from the rear and left and right sides, so that the base body 21 protects the optical device 30 when assembling the optical module 100 into a unit. Therefore, the risk of any object hitting the optical device 30 can be reduced.

[0029] Furthermore, the above-described shape of the substrate 21 allows the height of the optical module 100 to be approximately the same as, or slightly larger than, the height of the optical device 30. Therefore, the height of the optical module 100 can be reduced.

[0030] <Details of wiring board 1> The upper surface of the upper substrate 20 may have a stepped portion F1 between the first strip-shaped region E1 and the second strip-shaped region E2 and the first region E3 (see also Figure 2). Furthermore, the first strip-shaped region E1 and the second strip-shaped region E2 may be lower than the first region E3. The second region E4 (see also Figure 2) may be located at the same height as the first region E3.

[0031] With this configuration, the height of the multiple first electrodes 22a can be adjusted by the stepped portion F1 during the design phase. Therefore, the first electrodes 22a can be positioned at a height that allows for efficient connection, for example, by making the electrodes of the light-emitting device 31 and the first electrodes 22a the same height. Furthermore, the stepped portion F1 makes it possible to position part or all of the wire connecting the light-emitting device 31 and the first electrodes 22a lower than the first region E3 and the second region E4. Therefore, the base body 21 guards the wire by surrounding it on the left, right, and rear. Thus, when assembling the optical module 100 into a unit, the risk of any object hitting the wire can be reduced.

[0032] Mark 24a may be located in one or both of the first strip-shaped region E1 and the second strip-shaped region E2. Mark 24b may be located in one or both of the first region E3 and the second region E4. Marks 24a and 24b may have shapes that allow identification of the location, such as a cross or a dot, and may function as alignment marks. If the upper substrate 20 has a laminated structure and a stepped portion F1, errors may occur in the relative positional relationship between the layer having the first strip-shaped region E1 and the second strip-shaped region E2 and the layer having the first region E3 and the second region E4, due to differences in shrinkage during firing.

[0033] However, mark 24a is located in the layer of the first band-shaped region E1. Therefore, the error in the relative positional relationship between mark 24a and the first electrode 22a and the second electrode 22b is small. Consequently, for example, when mounting the optical device 30, mark 24a can be used as an alignment mark to mount the optical device 30 in alignment with multiple first electrodes 22a. Thus, the efficiency of the connection between the optical device 30 and multiple first electrodes 22a can be improved. Furthermore, since the wire can be shortened due to the improved efficiency, the transmission characteristics of high-frequency signals can be improved.

[0034] Furthermore, mark 24b is located in the layer of the third electrode 22c. Therefore, the error in the relative positional relationship between mark 24b and the third electrode 22c is small. Thus, by using mark 24b as an alignment mark, the optical module 100 can be incorporated into the unit in accordance with the configuration for connection to the third electrode 22c.

[0035] Castellations 28 may be located on the side surface of the upper substrate 20. Two castellations 28 may be located at the front and left end and the front and right end of the base body 21, respectively. The castellations 28 have a configuration in which a rounded recess extends in the vertical direction, and a metallized conductor may be located on the inner surface of the recess. By utilizing the castellations 28, the optical module 100 can be easily joined to the unit substrate by solder or the like.

[0036] (Embodiments 2-8) Next, the wiring boards 1A to 1G of Embodiments 2 to 8 according to this disclosure will be described. Figures 4 to 9(B) are perspective views showing the wiring boards 1A to 1G of Embodiments 2 to 8. The wiring boards 1A to 1G of Embodiments 2 to 8, and the optical modules 100B to 100D, 100F, and 100G of Embodiments 3 to 5, 7, and 8 have some structural differences from the other embodiments, while many other structural differences are the same as the other embodiments. Similar structures are denoted by the same reference numerals and their descriptions are omitted.

[0037] As shown in the wiring board 1A of Figure 4, the front end of the lower board 10 may be at the same position as the front end of the upper board 20 in the front-to-back direction. This configuration makes it possible to realize an optical module 100 with small dimensions in the front-to-back direction.

[0038] As shown in the wiring board 1B of Figure 5, the base body 21 may have a stepped portion F11 where the rear upper surface is lower. Furthermore, the base body 21 may have a stepped portion F12 where the rear lower surface is higher. The third electrode 22c may be located on a lower surface in the first region E3. This lower surface may be a surface on the same level as the first and second strip-shaped regions E1 and E2. Furthermore, the base body 21 may have corners G1 and G2 at its rear and right ends and rear and left ends, including chamfers or castellations. The corners G1 and G2 may have an obtuse or rounded shape when viewed in plan. The corners G1 and G2 may also have an obtuse or rounded shape when viewed horizontally. With this configuration, when connecting the third electrode 22c to an external electrode, snagging of the corners G1 and G2 is reduced, making it possible to easily connect the third electrode 22c.

[0039] As shown in the wiring board 1C of Figure 6, the base body 21 may have a fitting recess 211 at its bottom into which the lower board 10 fits or loosely fits. The lowest surface of the base body 21 may be flush with the bottom surface of the lower board 10, or it may be at a height close to the bottom surface of the lower board 10. This configuration allows for easy alignment when joining the lower board 10 and the upper board 20.

[0040] The bottom surface of the lower substrate 10 may be located below the lowest surface of the base body 21. With this configuration, when a heat sink or other heat dissipation material is brought into contact with the lower substrate 10, which receives heat from the light-emitting device 31, it is easier to bring the heat sink into contact with the lower substrate 10.

[0041] As shown in the wiring board 1D of Figure 7, the first strip-shaped region E1 and the second strip-shaped region E2 may be located at the same height as the first region E3 and the second region E4. Alternatively, although not shown, the first strip-shaped region E1 and the second strip-shaped region E2 may be located higher than the first region E3 and the second region E4, separated by a stepped portion. In this configuration, the function of the stepped portion F1 in Embodiment 1 is not achieved, but the other functions of Embodiment 1 are achieved in the same way.

[0042] As shown in the wiring board 1E of Figure 8, the upper board 20 may have a second mounting section 212 for electronic components. In this embodiment 6, the mounting section 11 of the lower board 10 is referred to as the first mounting section 11.

[0043] The second mounting section 212 may be located on the upper part of the base body 21 and behind the first strip-shaped region E1. The second mounting section 212 may contain a plurality of fourth electrodes 22d and a plurality of fifth electrodes 22e that are electrically connected to the electronic component. Furthermore, the second mounting section 212 may contain a stepped section F21 that brings the height of the fifth electrode 22e closer to that of the electronic component. Furthermore, the second mounting section 212 may contain a cavity (i.e., recess) F22 into which the electronic component is loosely fitted. The above-mentioned electronic component may be a light-receiving device including a light-receiving element. The electronic component may be configured to be flip-chip mountable, in which case the stepped section F21 may be omitted, and the fourth electrode 22d may be configured for flip-chip mounting.

[0044] In the wiring board 1E of Embodiment 6, the devices mounted on the first mounting section 11 and the second mounting section 212 are not limited to the above example. For example, a light receiving device may be mounted on the first mounting section 11, and a light emitting device may be mounted on the second mounting section 212. In this configuration, the light-emitting element included in the light-emitting device is a VCSEL (Vertical Cavity Surface Emitting Laser), and the device may be configured so that the light emitted from the light-emitting element is sent forward via optical components.

[0045] As shown in the wiring board 1F of Figure 9(A), the upper surface of the upper board 20 may have a third mounting section 213 on which circuits are mounted. The third mounting section 213 may be located in the first region E3 on the upper surface of the upper board 20. The circuits mounted on the third mounting section 213 may include a power supply circuit (e.g., a power supply IC (Integrated Circuit)) 51 that outputs the power supply voltage of the optical device 30, a signal processing circuit 52 that performs signal processing on the high-frequency optical signal emitted from the light-emitting device 31, and a drive circuit 53 that receives a signal from the signal processing circuit and drives the light-emitting device 31. Furthermore, constant circuits for controlling each of the above circuits, passive components for adjustment, etc. may be mounted on the third mounting section 213.

[0046] In the third mounting section 213, high-speed operating circuits such as the signal processing circuit 52 and the drive circuit 53 may be located in front of circuits that do not require high-speed operation, such as the power supply circuit 51. This configuration allows for a shorter transmission path for high-frequency signals. Electrodes electrically connected to each circuit may be located in the third mounting section 213. Inside the base body 21, internal conductors may be located to electrically connect the electrodes of the third mounting section 213 with the electrodes of the first electrode 22a, the second electrode 22b, and the third electrode 22c.

[0047] As shown in the wiring board 1G of Figure 9(B), a cavity F31 is located on the upper surface of the upper board 20, and the aforementioned third mounting section 213 may be located inside the cavity F31. This configuration makes it possible to reduce the height of the optical module 100G.

[0048] The embodiments of this disclosure have been described above. However, the wiring board and optical module of this disclosure are not limited to the embodiments described above. For example, in the above embodiments, an example was shown in which the second strip-shaped region E2 is located to the left of the mounting portion 11, but the second strip-shaped region E2 may be located to the right of the mounting portion 11. Also, as mentioned above, the multiple optical devices of this disclosure may be multiple light-emitting devices or multiple light-receiving devices.

[0049] Furthermore, the above embodiment shows a structural example in which the opposite side of the second strip-shaped region E2 (i.e., the opposite side of the mounting portion 11) is asymmetrical with respect to the side having the second strip-shaped region E2. That is, if a third strip-shaped region extending in the front-to-back direction is set on the upper surface of the substrate 21 adjacent to the mounting portion 11 on the opposite side of the first lateral direction (for example, to the right), then the plurality of electrodes arranged in the front-to-back direction are not located in the third strip-shaped region, and the height of the third strip-shaped region is different from that of the first strip-shaped region E1 and the second strip-shaped region E2. However, the wiring board of this disclosure may also have a structure symmetrical with respect to the second strip-shaped region E2 on the opposite side of the second strip-shaped region E2. That is, the wiring board may have a plurality of sixth electrodes located on the upper surface of the substrate, and the plurality of sixth electrodes may be electrodes electrically connected to an electrical device having functions other than light emission and light reception. And the plurality of sixth electrodes may be arranged in the front-to-back direction in the third strip-shaped region. Furthermore, if the first and second strip-shaped regions E1 and E2 are located one step lower than the uppermost surface of the base 21, the third strip-shaped region may similarly be located one step lower. Other details shown in the embodiments can be modified as appropriate without departing from the spirit of the invention.

[0050] The following describes one embodiment of this disclosure. In one embodiment, (1) The wiring board is The mounting section on which the optical device is mounted, A base that leaves the front and top of the mounting section open and surrounds the rear and left and right sides of the mounting section, A plurality of first electrodes and a plurality of second electrodes located on the upper surface of the substrate, Equipped with, The upper surface of the base body includes a first band-shaped region adjacent to the mounting portion and behind the mounting portion in a plan view, and extending in the left-right direction, and a second band-shaped region adjacent to the mounting portion and to the left or right of the mounting portion in a plan view, The plurality of first electrodes are arranged in the left-right direction and located in the first band-shaped region, The plurality of second electrodes are arranged in the front-to-back direction and located in the second band-shaped region.

[0051] (2) The wiring board described in (1) above is The aforementioned mounting section is equipped with a plurality of optical devices having the function of emitting or receiving light, and an optical device having an electrical device having a function other than emitting and receiving light. The plurality of first electrodes electrically connected to the plurality of optical devices are located in the first strip-shaped region, The plurality of second electrodes, which are electrically connected to the electrical device, are located in the second band-shaped region.

[0052] (3) The wiring board described in (1) or (2) above is The upper surface of the substrate includes a first region that extends further to the rear of the first band-shaped region and to the first lateral direction of the second band-shaped region. The substrate has a stepped portion between the first strip-shaped region and the second strip-shaped region and the first region. The first and second band-shaped regions are lower than the first region.

[0053] (4) The wiring board described in (3) above is The device further comprises marks located in the first or second strip-shaped region.

[0054] In one embodiment, (5) The optical module is One of the above wiring boards (1) to (4), The optical device mounted on the aforementioned mounting section, It is equipped with. [Explanation of symbols]

[0055] 1. 1A~1G Wiring board 10 Lower circuit board 11 Mounting section 20 Upper circuit board 21 Base 22a 1st electrode 22b 2nd electrode 22c 3rd electrode 23 Internal conductor 24a, 24b marks 30 Optical Devices 31 Light-emitting device 32 Electrical equipment 100, 100B~100D, 100F, 100G Optical Modules E1 First zone region E2 Second Zone Region E3 1st area E4 2nd area F1, F11, F21 Stepped section

Claims

1. The mounting section on which the optical device is mounted, A base that leaves the front and top of the mounting section open and surrounds the rear and left and right sides of the mounting section, A plurality of first electrodes and a plurality of second electrodes located on the upper surface of the substrate, Equipped with, The upper surface of the base body includes a first band-shaped region adjacent to the mounting portion and behind the mounting portion in a plan view, and extending in the left-right direction, and a second band-shaped region adjacent to the mounting portion and to the left or right of the mounting portion in a plan view, The plurality of first electrodes are arranged in the left-right direction and located in the first strip-shaped region, The plurality of second electrodes are arranged in the front-to-back direction and located in the second band-shaped region. Wiring board.

2. The aforementioned mounting section is equipped with a plurality of optical devices having the function of emitting or receiving light, and an optical device having an electrical device having a function other than emitting and receiving light. The plurality of first electrodes electrically connected to the plurality of optical devices are located in the first strip-shaped region, The plurality of second electrodes electrically connected to the electrical device are located in the second strip-shaped region. A wiring board according to claim 1.

3. The upper surface of the substrate includes a first region that extends further to the rear of the first band-shaped region and to the first lateral direction of the second band-shaped region. The substrate has a stepped portion between the first strip-shaped region and the second strip-shaped region and the first region. The first and second band-shaped regions are lower than the first region. A wiring board according to claim 1.

4. The invention further comprises a mark located in the first or second strip-shaped region. The wiring board according to claim 3.

5. A wiring board according to claim 1, The optical device mounted on the aforementioned mounting section, An optical module equipped with [the following features].

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