Composition, sheet-like material, laminate, method for manufacturing the composition, and method for manufacturing electronic components.

Abstract

To provide a composition having plasticity suitable for forming a sheet-like material despite its low environmental load. [Solution] A composition comprising an inorganic powder, a binder resin, and a plasticizer, wherein the plasticizer comprises a compound having a structure represented by the following general formula (1). [Chemical Formula 1] JPEG2026148014000012.jpg30156 (In general formula (1), R 1 is a hydrogen atom or a hydrocarbon group having 1 to 2 carbon atoms. R 2 is an alkylene group having 1 to 6 carbon atoms. R 3 is a hydrogen atom or a hydrocarbon group having 1 to 2 carbon atoms. R 4 is an alkylene group having 1 to 6 carbon atoms. R 5 is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms. R 6 is a hydrogen atom, a methyl group, an ethyl group or a hydroxy group. m is an integer of 0 to 8. When m is 2 or more, a plurality of R 3 and R 4 may each be the same, or may be partially or entirely different.)

Description

Technical Field

[0001] The present invention relates to a composition, a sheet-like material, a laminate, a method for producing a composition, and a method for producing an electronic component. Background Art

[0002] Generally, a ceramic green sheet for a multilayer ceramic electronic component is produced by forming a slurry obtained by mixing ceramic particles and a binder resin into a sheet shape. As the binder resin, for example, vinyl acetate resin is used.

[0003] A plasticizer is added to the slurry for the purpose of improving moldability when forming the slurry into a sheet, and for improving adhesion when laminating the formed sheet-like materials. Adding a plasticizer lowers the glass transition temperature (Tg) of the binder resin and improves the plasticity of the slurry. As such a plasticizer, phthalic acid esters have been used.

[0004] Patent Document 1 discloses a ceramic green sheet characterized by containing ceramic powder, a binder resin, a plasticizer added in a proportion exceeding the saturated amount with respect to the binder resin, and a solvent, and discloses the use of a phthalic acid ester as the plasticizer. Prior Art Documents Patent Documents

[0005] Patent Document 1 Japanese Patent Laid-Open No. 2002-179925 Summary of Invention Problems to be Solved by the Invention

[0006] In recent years, there have been concerns about the impact of phthalate esters on human health, and they are regulated, for example, by the revised RoHS (RoHS2) directive. That is, the ceramic green sheet described in Patent Document 1 uses a phthalate ester as a plasticizer, and thus has the problem of high environmental load.

[0007] The present invention has been made to solve the above problems, and an object of the present invention is to provide a composition having plasticity suitable for forming a sheet-shaped product despite its low environmental load. Furthermore, an object of the present invention is to provide a sheet-shaped product and a laminated body including the above composition. Another object of the present invention is to provide a method for producing a composition using a plasticizer suitable for forming a sheet-shaped product despite its low environmental load, and a method for producing an electronic component using the above plasticizer. [Means for Solving the Problems]

[0008] The composition of the present invention comprises an inorganic powder, a binder resin, and a plasticizer, wherein the plasticizer includes a compound having a structure represented by the following general formula (1).

[0009]

Chemical Formula

[0010] The sheet-shaped article of the present invention comprises the composition of the present invention.

[0011] The laminate of the present invention is formed by laminating a plurality of the sheet-shaped articles of the present invention.

[0012] The method for producing the composition of the present invention comprises: a pulverization step of pulverizing an inorganic material to obtain an inorganic powder; and a mixing step of mixing the inorganic powder, a binder resin and a plasticizer, wherein the plasticizer comprises a compound having a structure represented by the following general formula (1).

[0013]

Chemical Formula

[0014] The method for producing an electronic component of the present invention comprises: a step of mixing an inorganic powder, a binder resin and a plasticizer to prepare a slurry; a step of forming the slurry into a sheet to produce a sheet-shaped article; a step of laminating the sheet-shaped articles to produce a laminate; and a step of firing the laminate to obtain a fired body, wherein the plasticizer comprises a compound having a structure represented by the following general formula (1).

[0015]

Chemical Formula

[0016] According to the present invention, it is possible to provide a composition that has plasticity suitable for forming sheet-like materials despite having a low environmental impact. Furthermore, according to the present invention, it is possible to provide a sheet-like material and a laminate containing the above composition. In addition, according to the present invention, it is possible to provide a method for producing a composition using a plasticizer suitable for forming sheet-like materials despite having a low environmental impact, and a method for producing an electronic component using the above plasticizer. [Brief explanation of the drawing]

[0017] [Figure 1] Figure 1 is a graph of the loss coefficient (tanδ) of dynamic viscoelasticity measurement in one embodiment of the present invention. [Figure 2] Figure 2 is a graph of the loss coefficient (tanδ) for dynamic viscoelasticity measurement in another embodiment of the present invention. [Modes for carrying out the invention]

[0018] The following describes the composition, sheet-like material, laminate, method for manufacturing the composition, and method for manufacturing electronic components of the present invention. However, the present invention is not limited to the following embodiments and can be modified and applied as appropriate without altering the essence of the invention. Combining two or more of the individual preferred configurations of the present invention described in the following embodiments also constitutes the present invention.

[0019] Furthermore, the embodiments shown below are illustrative, and it goes without saying that partial substitutions or combinations of the configurations shown in the embodiments are possible at will.

[0020] The composition of the present invention comprises an inorganic powder, a binder resin, and a plasticizer, wherein the plasticizer comprises a compound having a structure represented by the following general formula (1).

[0021] [ka] (In general formula (1), R 1 R is a hydrogen atom or a hydrocarbon group having 1 to 2 carbon atoms. 2 R is an alkylene group having 1 to 6 carbon atoms. 3 R is a hydrogen atom or a hydrocarbon group having 1 to 2 carbon atoms. 4 R is an alkylene group having 1 to 6 carbon atoms. 5 R is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms. 6 R is a hydrogen atom, a methyl group, an ethyl group, or a hydroxyl group. m is an integer from 0 to 8. When m is 2 or greater, there are multiple R 3 and R 4 They may be the same, or they may be different in some or all ways.

[0022] A plasticizer containing a compound having the structure represented by the above general formula (1) can sufficiently improve the plasticity of a composition containing inorganic powder and a binder resin. Therefore, when using the composition of the present invention, sheet-like materials can be suitably formed.

[0023] The principle by which the plasticity of the composition can be sufficiently improved in this way can be thought to be as follows. Binder resins are generally composed of molecules that have polar groups. The ether bond (-COC-) and any optional hydroxyl group portion (polar part) (-OH) of the structure represented by the general formula (1) above tend to orient towards the polar groups of the molecules constituting the binder resin, allowing the plasticizer to easily penetrate between the molecules constituting the binder resin. This can block the orientation of the polar groups of the molecules constituting the binder resin, widening the spacing between the molecular chains constituting the binder resin and facilitating the movement of the molecular chains. This principle allows for a reduction in the Tg of the binder resin, thereby improving the plasticity of the composition.

[0024] The components of the present invention will be described in detail below.

[0025] (Inorganic powder) In the composition of the present invention, the inorganic powder is a ceramic powder composite. In this case, a sheet-like material such as a ceramic green sheet can be produced by molding the composition of the present invention into a sheet-like material.

[0026] In the composition of the present invention, the inorganic powder preferably contains at least one selected from the group consisting of zirconia, thian, alumina, barium titanate, ferrite, lead zirconate titanate, zinc oxide, metallic magnetic particles, glass, and glass ceramics. These materials are suitable for manufacturing chip-type multilayer electronic components using the compositions of the present invention.

[0027] In the composition of the present invention, the size of the inorganic powder is not particularly limited, but it is preferable that the average particle diameter is 0.01 μm or more and 50 μm or less.

[0028] In the composition of the present invention, the inorganic powder content is preferably 65% ​​by weight or more and 96% by weight or less, and more preferably 74% by weight or more and 95% by weight or less. As will be described in more detail later, the composition of the present invention is used to produce a sheet-like material. This sheet-like material is laminated and fired to become the base material for a chip-type multilayer electronic component. When the inorganic powder content falls within the above range, the resulting material will have a suitable density and strength for functioning as part of a chip-type multilayer electronic component.

[0029] (Binder resin) In the composition of the present invention, the binder resin preferably contains at least one selected from the group consisting of polyvinyl acetate, polyvinyl butyral, polyvinyl alcohol, acrylic, urethane, polyvinylpyrrolidone, polyethylene glycol, ethylene-vinyl acetate copolymer, and cellulose ether, and more preferably contains polyvinyl acetate. These binder resins are suitable for molding the compositions of the present invention into predetermined shapes because they can bond inorganic powders together.

[0030] In particular, when the binder resin is polyvinyl acetate, the ether bond and any hydroxyl group portion (polar part) of the structure represented by the general formula (1) above tend to orient towards the acetyloxy group of the molecules constituting polyvinyl acetate, allowing the plasticizer to easily penetrate between the molecules constituting polyvinyl acetate. This can block the orientation of the acetyloxy groups of the molecules constituting polyvinyl acetate, widening the spacing between the molecular chains constituting polyvinyl acetate and facilitating the movement of the molecular chains. Therefore, the Tg of polyvinyl acetate can be lowered, improving the plasticity of the composition.

[0031] In the composition of the present invention, the binder resin is preferably included in an emulsion state. In this case, the inorganic powder in the composition of the present invention does not concentrate in some areas and is easily dispersed.

[0032] The composition of the present invention preferably contains 5 to 50 parts by weight of a binder resin per 100 parts by weight of inorganic powder, more preferably 5 to 30 parts by weight, and even more preferably 10 to 20 parts by weight. If the amount of binder resin is less than 5 parts by weight per 100 parts by weight of inorganic powder, the low amount of binder resin makes it difficult to adequately bond the inorganic powders together. As a result, when the composition is molded into a predetermined shape, the molded product becomes prone to breakage. If the amount of binder resin exceeds 50 parts by weight relative to 100 parts by weight of inorganic powder, the amount of inorganic powder becomes relatively small. This leads to larger dimensional changes during firing and increased stress due to shrinkage, making cracks more likely to occur.

[0033] (Plasticizer) In general formula (1), R 1 R is a hydrogen atom or a hydrocarbon group having 1 to 2 carbon atoms. 1 Specific examples of hydrocarbon groups having 1 to 2 carbon atoms include alkylene groups and alkenyl groups, as well as methyl groups, ethyl groups, ethylene groups, and ethynyl groups. 1 R is preferably a hydrogen atom. 1 When the atom is a hydrogen atom, the steric hindrance of compounds having the structure represented by general formula (1) is small, and they tend to orient themselves toward the polar groups of vinyl acetate resin.

[0034] R 2 R may be a linear or branched alkylene group having 1 to 6 carbon atoms. 2 Specific examples include methylene groups, ethylene groups, propylene groups, isopropylene groups, butylene groups, pentylene groups, etc. 2 It is preferable that it is a methylene group or an ethylene group. 2 When the group is a methylene group or an ethylene group, the steric hindrance of compounds having the structure represented by general formula (1) is small, and they tend to orient themselves toward the polar groups of vinyl acetate resin.

[0035] R 3 R is a hydrogen atom or a hydrocarbon group having 1 to 2 carbon atoms. 3A specific example of a hydrocarbon group with 1 to 2 carbon atoms is R 1 Examples include those exemplified in [reference]. 3 R is preferably a hydrogen atom. 3 When the atom is a hydrogen atom, the steric hindrance of compounds having the structure represented by general formula (1) is small, and they tend to orient themselves toward the polar groups of vinyl acetate resin.

[0036] R 4 R may be a linear or branched alkylene group having 1 to 6 carbon atoms. 4 A concrete example is R 2 Examples include those exemplified in [reference]. 4 It is preferable that it is a methylene group or an ethylene group. 4 When the group is a methylene group or an ethylene group, the steric hindrance of compounds having the structure represented by general formula (1) is small, and they tend to orient themselves toward the polar groups of vinyl acetate resin.

[0037] R 5 R is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms. 5 R may be a linear or branched hydrocarbon group having 1 to 12 carbon atoms, such as a linear or branched alkylene group, a linear or branched alkenyl group, or a linear or branched alkynyl group. 5 Specific examples of hydrocarbon groups having 1 to 12 carbon atoms include methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, octyl group, dodecyl group, vinyl group, propenyl group, isopropenyl group, butenyl group, isobutenyl group, ethynyl group, n-propynyl group, n-butynyl group, etc. Because the terminal end of a compound having the structure represented by general formula (1) is a highly polar hydroxyl group, the effect of the polar portion is increased, and it is easier to orient towards the polar group of vinyl acetate resin, R 5 It is preferable that it be a hydrogen atom.

[0038] R 6 R is a hydrogen atom, a methyl group, an ethyl group, or a hydroxyl group. 6 The position of R is not particularly limited. 6It is preferable that it be a hydrogen atom.

[0039] m is an integer between 0 and 8. Preferably, m is an integer between 0 and 2. When m is greater than 8, the compound molecules become bulkier, making it difficult for them to penetrate between the molecules of binder resins such as vinyl acetate. At the same time, the proportion of nonpolar carbon skeleton portions increases, weakening the overall polarity of the compound and worsening its compatibility with the binder resin. When m is in the range of 0 to 2, the appropriate balance between polarity and compact shape allows the compound to function uniformly and efficiently within the molecules of the binder resin, enabling it to exhibit superior performance as a plasticizer.

[0040] In the compositions of the present invention, the compound having the structure represented by general formula (1) is preferably an alkylene glycol monophenyl ether having 1 to 3 alkylene oxide units and 2 to 4 carbon atoms, and more preferably ethylene glycol monophenyl ether, propylene glycol monophenyl ether, diethylene glycol monophenyl ether, and triethylene glycol monophenyl ether.

[0041] The plasticizer preferably contains at least one selected from the group consisting of ethylene glycol monophenyl ether, propylene glycol monophenyl ether, diethylene glycol monophenyl ether, and triethylene glycol monophenyl ether. More preferably, the plasticizer contains ethylene glycol monophenyl ether. The plasticizer may contain one or more types.

[0042] The composition of the present invention preferably contains 0.01 parts by weight or more and 10 parts by weight or less of a plasticizer per 100 parts by weight of inorganic powder, and more preferably 0.1 parts by weight or more and 5 parts by weight or less. If the amount of plasticizer is less than 0.01 parts by weight per 100 parts by weight of inorganic powder, the Tg of the binder resin will not decrease sufficiently. When the amount of plasticizer exceeds 10 parts by weight per 100 parts by weight of inorganic powder, the effect of lowering the Tg of the binder resin approaches its upper limit, making it uneconomical.

[0043] (solvent) The composition of the present invention may further contain a solvent. Examples of solvents include diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, texanol, eugenol, terpineol, dihydroterpineol, benzyl alcohol, ethanol, isophorone, methyl ethyl ketone, and diethyl ketone. These solvents are useful in uniformly mixing the inorganic powder, binder resin, and plasticizer in the composition of the present invention.

[0044] In the composition of the present invention, the solvent content is preferably 0.05% by weight or more and 20% by weight or less.

[0045] (Other additives) The composition of the present invention may also contain other additives such as dispersants, defoamers, and wetting agents. Examples of dispersants include ammonium polycarboxylates and maleic anhydride-styrene copolymers. Examples of antifoaming agents include polyalkylene glycol, dimethylpolysiloxane, and octadecanol. Examples of humectants include polyalkylene glycol and polyglycerin.

[0046] (Regarding the proportions of each component) In the composition of the present invention, it is preferable that the amount of binder resin is 5 parts by weight or more and 50 parts by weight or less, and the amount of plasticizer is 0.01 parts by weight or more and 10 parts by weight or less, per 100 parts by weight of inorganic powder. When the composition of the present invention contains inorganic powder, binder resin, and plasticizer in such proportions, the binder resin and plasticizer are less likely to separate and become uniform. Furthermore, since the elastic modulus of the sheet material is sufficiently reduced, when the composition of the present invention is formed into a sheet and the sheet material is laminated, the sheet material adheres to each other easily. The composition of the present invention more preferably contains 10 to 20 parts by weight of a binder resin and 0.1 to 5 parts by weight of a plasticizer per 100 parts by weight of inorganic powder.

[0047] The ratio of the plasticizer content (parts by weight) to the binder resin content (parts by weight) in the composition (binder resin content (parts by weight) / plasticizer content (parts by weight)) is preferably, for example, 0.17 or more and 5000 or less, more preferably 1.0 or more and 1000 or less, and even more preferably 1.25 or more and 500 or less.

[0048] Next, a method for producing the composition of the present invention will be described. The method for producing the composition of the present invention comprises a grinding step of grinding an inorganic material to obtain an inorganic powder, and a mixing step of mixing the inorganic powder, a binder resin, and a plasticizer, wherein the plasticizer includes a compound having the structure represented by the general formula (1) above.

[0049] The inorganic powder, binder resin, and plasticizer used in the method for producing the composition of the present invention are the same as those contained in the composition of the present invention described above. The compound having the structure represented by the general formula (1) is not a phthalate ester. Therefore, the method for producing the composition of the present invention has a low environmental impact.

[0050] Furthermore, by using a plasticizer containing a compound having the structure represented by the above general formula (1), the plasticity of the manufactured composition can be sufficiently improved.

[0051] In the above grinding process, inorganic materials can be ground using methods such as ball mills, jet mills, and agitator mills.

[0052] In the above mixing step, it is preferable to mix the inorganic powder, the binder resin, and the plasticizer such that, per 100 parts by weight of the inorganic powder, the binder resin is 5 parts by weight or more and 50 parts by weight or less, and the plasticizer is 0.01 parts by weight or more and 10 parts by weight or less. Furthermore, in the above mixing step, it is more preferable to mix the inorganic powder, the binder resin, and the plasticizer such that, per 100 parts by weight of the inorganic powder, the binder resin is 10 parts by weight or more and 20 parts by weight or less, and the plasticizer is 0.1 parts by weight or more and 5 parts by weight or less. When a composition manufactured in such proportions contains inorganic powder, a binder resin, and a plasticizer, the binder resin and plasticizer are less likely to separate and become more uniform. Furthermore, because the elastic modulus of the sheet material is sufficiently reduced, when the composition of the present invention is formed into a sheet and the sheet material is laminated, the sheets adhere to each other more easily. In the mixing process, the mixing method is not particularly limited, and stirring can be done using a known stirrer.

[0053] Using the composition of the present invention, for example, a sheet-like material can be produced, multiple sheets of this material can be stacked to obtain a laminate, and the laminate can be fired to produce an electronic component using the resulting fired body. A sheet-like material using the composition of the present invention and a laminate obtained by stacking such sheets are also embodiments of the present invention.

[0054] Next, a method for manufacturing electronic components using the composition of the present invention will be described. The present invention provides a method for manufacturing an electronic component, comprising the steps of: preparing a slurry by mixing inorganic powder, a binder resin, and a plasticizer; producing a sheet-like material by molding the slurry into a sheet; producing a laminate by stacking the sheet-like materials; and obtaining a fired body by firing the laminate, wherein the plasticizer includes a compound having the structure represented by the general formula (1).

[0055] The step of preparing a slurry by mixing inorganic powder, a binder resin, and a plasticizer can be carried out in the same manner as the mixing step in the method for producing the composition of the present invention, except that the resulting mixture is in slurry form.

[0056] Next, a step is performed to produce a sheet-like material by forming the slurry into a sheet. The method for forming the slurry into a sheet is not particularly limited, but for example, a method using a bar coater or printing on a base film (e.g., polyethylene terephthalate (PET) film) can be employed. After forming the slurry into a sheet, it can be dried to produce the sheet-like material.

[0057] After forming the sheet-like material, vias may be formed on the sheet-like material as needed, or a conductive paste may be placed on the sheet-like material. The vias and conductive paste can be made from conventionally known materials, and conventionally known methods can be used for their formation and placement.

[0058] Next, a process is carried out to create a laminate by stacking sheet-like materials. Multiple sheet-like materials are prepared and stacked to create a laminate. The laminate may be compressed as needed. Such a laminate is also called a mother block, and the mother block may be cut into a predetermined shape to form chip-like materials. Furthermore, the edges of the chip-like materials may be given a rounded chamfer as needed. Both the mother block and the chip-like materials are included in the laminate of the present invention.

[0059] Next, the laminate obtained in this manner is fired to obtain a fired body. External electrodes or the like may be formed on the fired body as needed.

[0060] The electronic components of the present invention can be manufactured using this method. Examples of electronic components include multilayer ceramic electronic components such as ceramic capacitors, ceramic inductors, and ceramic varistors. [Examples]

[0061] The following are examples that more specifically disclose the compositions and other components of the present invention. However, the present invention is not limited to the following examples.

[0062] (Examples) A mixture of ferrite, 50 parts by weight of pure water, 0.5 parts by weight of ammonium polycarboxylate (dispersant) per 100 parts by weight of ferrite, and ferrite was prepared by grinding the mixture using a ball mill to produce ferrite powder (inorganic powder).

[0063] Next, ferrite powder, polyvinyl acetate (binder resin), and ethylene glycol monophenyl ether (plasticizer) were mixed in the proportions shown in Table 1 to prepare a slurry-like composition according to the example.

[0064] Next, the composition according to the example was degassed, and then coated onto a PET film in a sheet-like manner and dried with hot air to produce a sheet-like material (thickness: approximately 50 μm) according to the example.

[0065] (Comparative example) Ferrite powder was prepared in the same manner as in the examples, and the ferrite powder, polyvinyl acetate (binder resin), and dibutyl phthalate (plasticizer) were mixed in the proportions shown in Table 1 to prepare a slurry-like composition according to the comparative example. Next, a sheet-like material (thickness: approximately 50 μm) relating to the comparative example was prepared using the composition relating to the comparative example in the same manner as in the example.

[0066] (Dynamic viscoelasticity measurement and Tg calculation) Multiple sheet-like materials were prepared according to the examples and comparative examples, with the blending ratios of polyvinyl acetate and plasticizer to ferrite powder as shown in Table 1. Next, the sheet-like materials according to the examples and comparative examples were pressed together to create a laminate with a thickness of 500 μm. Next, the laminates according to the examples and comparative examples were cut to a width × length = 10 mm × 50 mm to be used as test samples. Next, dynamic viscoelasticity measurements were performed using test samples from the examples and comparative examples. Dynamic viscoelasticity measurements were performed using a viscoelasticity measuring device (model name: DMA7000, manufacturer: Hitachi High-Tech Science Co., Ltd.) within a measurement temperature range of -30 to 100°C. Based on the results of dynamic viscoelasticity measurements, the Tg of the binder resin contained in the compositions of the examples and comparative examples was calculated. The results are shown in Table 1.

[0067] [Table 1]

[0068] As shown in Table 1, it was found that when ethylene glycol monophenyl ether was used as a plasticizer, the Tg of polyvinyl acetate contained in the composition decreased to the same extent as when dibutyl phthalate was used as a plasticizer.

[0069] (Evaluation of separability) The loss coefficient (tanδ) was determined from the dynamic viscoelasticity of the sheet-like material according to the above example and the sheet-like material according to the above comparative example, as measured above, and the graph was checked to see if the peaks were separated. If the peaks are separated, it means that polyvinyl acetate and ethylene glycol monophenyl ether are separated in that composition. The evaluation criteria are as follows. The results are shown in Table 2. A1: The peaks are not separated, indicating that the binder resin and plasticizer are not separated. A2: The peaks are separated, indicating that the binder resin and plasticizer are separated.

[0070] [Table 2]

[0071] As a representative example of a case where the peaks are not separated, Figure 1 shows the graph of the loss coefficient (tanδ) of the dynamic viscoelasticity measurement for an example using 15.85 wt% polyvinyl acetate and 0.16 wt% ethylene glycol monophenyl ether. As a representative example of a case where the peaks are separated, Figure 2 shows the graph of the loss coefficient (tanδ) of the dynamic viscoelasticity measurement for an example using 8 wt% polyvinyl acetate and 8 wt% ethylene glycol monophenyl ether. Figure 1 is a graph of the loss coefficient (tanδ) of dynamic viscoelasticity measurement in one embodiment of the present invention. Figure 2 is a graph of the loss coefficient (tanδ) for dynamic viscoelasticity measurement in another embodiment of the present invention.

[0072] In the graph in Figure 2, two peaks are visible, one around -23°C and another around 65°C. In the composition, the presence of ethylene glycol monophenyl ether facilitates the orientation of the ether bonds of the ethylene glycol monophenyl ether to the acetyloxy groups of the molecules constituting polyvinyl acetate, widening the spacing between the molecular chains constituting polyvinyl acetate and facilitating the movement of these chains. This is thought to lower the Tg of polyvinyl acetate. However, if the proportion of ethylene glycol monophenyl ether becomes too high, it is thought that polyvinyl acetate molecules will tend to aggregate in some areas, forming aggregates. When such aggregates form, the peaks are thought to separate, as shown in Figure 2. Since the strength of sheet-like materials and laminates tends to decrease when aggregates form, it is preferable to avoid such aggregates.

[0073] In the evaluation of separation properties, the composition according to the example with an evaluation of A1 shows no separation between the binder resin and the plasticizer, and the plasticizer acts effectively to adjust the elastic modulus and glass transition temperature of the composition. In the evaluation of separation properties, the composition of the example with an evaluation of A2 shows separation of the binder resin and the plasticizer. Therefore, even if the amount of plasticizer added is increased, it is difficult to obtain an effect commensurate with the amount added.

[0074] (Measurement and evaluation of elastic modulus) Multiple sheet-like materials were prepared according to the examples and comparative examples (without plasticizer) for which the blending ratio of polyvinyl acetate and plasticizer to ferrite powder was as shown in Table 1. Next, the sheet-like materials according to the examples and comparative examples were pressed together to create a laminate with a thickness of 500 μm. Next, the laminates according to the examples and comparative examples were cut to a width of 5 mm to be used as test samples. Next, tensile strength tests were performed using the test samples from the examples and comparative examples, and the modulus of elasticity was determined from the stress-strain curves. The tensile strength test was performed using a tensile testing machine (model name: SL-6002, manufacturer: Imada Seisakusho) at a measurement temperature of 70°C. The percentage decrease in the elastic modulus of the test sample of the example was calculated and evaluated compared to the elastic modulus of the test sample of the comparative example, which did not contain plasticizers. The evaluation criteria are as follows. The results are shown in Table 3. B1: The decrease in elastic modulus is 10% or more compared to the case without the addition of a plasticizer. B2: The decrease in elastic modulus is less than 10% compared to the case without the addition of plasticizers.

[0075] [Table 3]

[0076] In the evaluation of elastic modulus, the sheet material according to the example with an evaluation of B1 has an elastic modulus that is 10% or more lower compared to the case without plasticizer, making it easier for the sheet materials to adhere to each other and suitable for the manufacture of electronic components. In the evaluation of elastic modulus, the sheet material according to the example with an evaluation of B2 shows a decrease in elastic modulus of less than 10% compared to the case without plasticizer addition, and therefore has a high elastic modulus. As a result, the sheet materials are difficult to bond to each other and are difficult to process in the manufacture of electronic components.

[0077] In the evaluation of separability and elastic modulus, examples that simultaneously satisfy "A1" and "B1" can be evaluated as "Excellent," examples that simultaneously satisfy "A1" and "B2" can be evaluated as "Good," and examples that simultaneously satisfy "A2" and "B1" can be evaluated as "Available." This evaluation is shown in Table 4.

[0078] [Table 4]

[0079] As shown in Table 4, it was found that by adjusting the ratio of polyvinyl acetate to ethylene glycol monophenyl ether, the separability of the plasticizer in the composition can be adjusted, and the elastic modulus of the sheet material can be lowered, making the sheet material easier to adhere.

Claims

1. It contains inorganic powder, a binder resin, and a plasticizer. The plasticizer is a composition comprising a compound having a structure represented by the following general formula (1). 【Chemistry 1】 (In general formula (1), R １ R is a hydrogen atom or a hydrocarbon group having 1 to 2 carbon atoms. ２ R is an alkylene group having 1 to 6 carbon atoms. ３ R is a hydrogen atom or a hydrocarbon group having 1 to 2 carbon atoms. ４ R is an alkylene group having 1 to 6 carbon atoms. ５ R is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms. ６ R is a hydrogen atom, a methyl group, an ethyl group, or a hydroxyl group. m is an integer from 0 to 8. When m is 2 or greater, multiple R ３ and R ４ These may be the same, or they may be different in some or all ways.

2. The composition according to claim 1, comprising an alkylene glycol monophenyl ether having 2 to 4 carbon atoms and 1 to 3 alkylene oxide units.

3. The composition according to claim 1 or 2, comprising at least one plasticizer selected from the group consisting of ethylene glycol monophenyl ether, propylene glycol monophenyl ether, diethylene glycol monophenyl ether, and triethylene glycol monophenyl ether.

4. The composition according to any one of claims 1 to 3, further comprising a solvent.

5. The composition according to any one of claims 1 to 4, wherein the binder resin comprises at least one selected from the group consisting of polyvinyl acetate, polyvinyl butyral, polyvinyl alcohol, acrylic, urethane, polyvinylpyrrolidone, polyethylene glycol, ethylene-vinyl acetate copolymer, and cellulose ether.

6. The inorganic powder is the composition according to any one of claims 1 to 5, comprising ceramic powder.

7. The composition according to any one of claims 1 to 6, wherein the inorganic powder comprises at least one selected from the group consisting of zirconia, thian, alumina, barium titanate, ferrite, lead zirconate titanate, zinc oxide, metallic magnetic particles, glass, and glass ceramics.

8. The composition according to any one of claims 1 to 7, wherein the amount of the binder resin is 5 parts by weight or more and 50 parts by weight or less per 100 parts by weight of the inorganic powder, and the amount of the plasticizer is 0.01 parts by weight or more and 10 parts by weight or less.

9. The composition according to any one of claims 1 to 8, wherein the amount of the binder resin is 10 parts by weight or more and 20 parts by weight or less per 100 parts by weight of the inorganic powder, and the amount of the plasticizer is 0.1 parts by weight or more and 5 parts by weight or less.

10. A sheet-like material comprising the composition according to any one of claims 1 to 9.

11. A laminate formed by stacking multiple sheet-like materials according to claim 10.

12. A grinding process that crushes inorganic materials to produce inorganic powder, The process includes a mixing step of mixing the inorganic powder, a binder resin, and a plasticizer, A method for producing a composition containing a compound having a structure represented by the following general formula (1) as the plasticizer. 【Chemistry 2】 (In general formula (1), R １ is a hydrogen atom or a hydrocarbon group having 1 to 2 carbon atoms. R ２ is an alkylene group having 1 to 6 carbon atoms. R ３ is a hydrogen atom or a hydrocarbon group having 1 to 2 carbon atoms. R ４ is an alkylene group having 1 to 6 carbon atoms. R ５ is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms. R ６ is a hydrogen atom, a methyl group, an ethyl group or a hydroxy group. m is an integer of 0 to 8. When m is 2 or more, a plurality of R ３ and R ４ may each be the same, or may be partially or entirely different.)

13. A method for producing the composition according to claim 12, wherein in the mixing step, the inorganic powder, the binder resin, and the plasticizer are mixed such that the amount of the inorganic powder is 100 parts by weight, the amount of the binder resin is 5 parts by weight or more and 50 parts by weight or less, and the amount of the plasticizer is 0.01 parts by weight or more and 10 parts by weight or less.

14. A step of preparing a slurry by mixing inorganic powder, a binder resin, and a plasticizer, A step of producing a sheet-like material by forming the slurry into a sheet, The process of stacking the aforementioned sheet-like materials to produce a laminate, The process includes firing the laminate to obtain a fired body, A method for manufacturing electronic components, comprising a plasticizer having a compound having a structure represented by the following general formula (1). 【Transformation 3】 (In general formula (1), R １ R is a hydrogen atom or a hydrocarbon group having 1 to 2 carbon atoms. ２ R is an alkylene group having 1 to 6 carbon atoms. ３ R is a hydrogen atom or a hydrocarbon group having 1 to 2 carbon atoms. ４ R is an alkylene group having 1 to 6 carbon atoms. ５ R is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms. ６ R is a hydrogen atom, a methyl group, an ethyl group, or a hydroxyl group. m is an integer from 0 to 8. When m is 2 or greater, multiple R ３ and R ４ These may be the same, or they may be different in some or all ways.

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