Molding apparatus and planarization method

Abstract

This reduces the possibility of excessive load being applied to the flattening component, thereby improving the quality of the fabricated object. [Solution] A molding apparatus for additively manufacturing a molded layer formed by a molding process that repeats a plurality of steps including a liquid discharge step and a flattening step multiple times comprises: a drive unit that drives a flattening member to perform a flattening operation on the liquid discharged in the discharge step; a detection unit that detects the load on which the drive unit drives the flattening member; a control unit that controls the drive unit so that the flattening member performs a flattening operation in the flattening step; and a setting unit that sets the number of times the flattening operation is performed in the flattening step based on the load detected by the detection unit in the flattening step.

Description

Technical Field

[0001] The present specification discloses a modeling apparatus and a planarization method.

Background Art

[0002] Conventionally, when forming a modeling layer by discharging a liquid material such as resin ink, a modeling apparatus that planarizes the modeling layer before curing has been proposed. For example, Patent Document 1 describes that during a predetermined number of discharge operations, the surface of the modeling layer is caused to adhere to the surface of a planarization member such as a roller and scraped up, thereby uniformizing the height of the modeling layer to achieve planarization.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0004] By the way, when planarization is performed by the planarization member, due to factors such as variations in the viscosity of the resin ink and the temperature of the planarization member, adhesion of the resin ink to the surface of the planarization member may become insufficient, and the resin ink may cure in a state where there are portions where the height of the modeling layer is excessive. In such a case, when planarization is performed next time, the portion cured while maintaining the excessive height of the modeling layer interferes with the planarization member, which may cause an excessive load to act on the planarization member or result in modeling defects.

[0005] The main object of the present disclosure is to reduce the possibility of an excessive load acting on the planarization member and improve the quality of a modeled article.

Means for Solving the Problem

[0006] The present disclosure adopts the following means to achieve the above-mentioned main object.

[0007] The molding apparatus disclosed herein is A molding apparatus for additively manufacturing a molded layer formed by repeating a molding process that includes a liquid extrusion process and a planarization process multiple times, A drive unit drives a flattening member to perform a flattening operation on the liquid discharged in the discharge step, The drive unit includes a detection unit that detects the load on which the flattening member is driven, A control unit controls the drive unit so that the flattening member performs the flattening operation in the flattening step, A setting unit sets the number of times the flattening operation is performed in the flattening process based on the load detected by the detection unit in the flattening process, The gist of it is that it is equipped with the following features.

[0008] In the molding apparatus of this disclosure, the drive unit is controlled so that the flattening member performs a flattening operation during the flattening process. Furthermore, the number of flattening operations performed during the flattening process is set based on the load detected by the detection unit during the flattening process. This reflects the load on the drive unit in setting the number of flattening operations, making it possible to set the number of flattening operations in a way that suppresses excessive load, and as a result, the flattening accuracy can be stabilized. Therefore, the possibility of excessive load acting on the flattening member can be reduced, and the quality of the molded object can be improved. In addition, damage and deterioration of the flattening member can be suppressed, and the lifespan of the flattening member can be extended. [Brief explanation of the drawing]

[0009] [Figure 1] A schematic diagram showing the general configuration of the production system 1, including the molding device 10. [Figure 2] A block diagram showing the general configuration of the molding device 10 and the control device 90. [Figure 3] An explanatory diagram showing an example of the 3D printing process. [Figure 4] A flowchart illustrating an example of a planarization layered fabrication process. [Figure 5] An explanatory diagram showing an example of the planarization layer fabrication process. [Figure 6] An explanatory diagram showing an example of the planarization layer fabrication process. [Figure 7] A flowchart showing an example of the process for setting the number of flattening iterations. [Figure 8] An explanatory diagram showing an example of the relationship between the number of flattening steps, the load L, and the number of flattening steps N. [Modes for carrying out the invention]

[0010] Embodiments of this disclosure will be described with reference to the drawings. Figure 1 is a schematic diagram showing the configuration of a production system 1 including a molding apparatus 10. Figure 2 is a schematic block diagram showing the configuration of the molding apparatus 10 and a control device 90. In this embodiment, the left-right direction (X-axis), front-back direction (Y-axis), and up-down direction (Z-axis) are as shown in Figure 1.

[0011] Production system 1 includes, for example, a three-dimensional molding device (hereinafter referred to as "molding device") 10 that molds objects including substrates, wiring, electrodes, etc., on a rectangular plate-shaped pallet 5, a mounting device 80 that mounts electronic components (hereinafter referred to as "components") onto the molded objects on the pallet 5, and a management device 90 that manages production system 1. Production system 1 may have two or more mounting devices 80, or it may have only a molding device 10 without any mounting devices 80. A removable film is attached to the top surface of the pallet 5, and by replacing this film, it is possible to mold the next object. The molding apparatus 10 comprises a control unit 20, a storage unit 22, a communication unit 24, an operation panel 26, a first ejection unit 30, a flattening unit 35, a second ejection unit 40, a transport unit 50, a UV irradiation unit 55, a top heating unit 57, a press heating unit 59, a stage unit 60, a first transfer unit 70, and a second transfer unit 75. All components except the operation panel 26 are housed within the housing 12 of the molding apparatus 10.

[0012] The control unit 20 is configured as a microprocessor centered on a CPU 20a and includes a ROM 20b for storing processing programs, a RAM 20c used as a work area, a timer 20d for performing timing processing, and controls the entire molding device 10. The storage unit 22 is configured, for example, as an HDD or SSD and stores molding job information 22a, which includes molding information such as the shape and size of the molded object (3D object), and wiring information such as wiring patterns and the position and size of electrodes. The communication unit 24 is an interface used when communicating with each device of the production system 1, such as the mounting device 80 and the management device 90. The control unit 20 exchanges information with each device of the production system 1 via the communication unit 24. The operation panel 26 is a touch panel display located on the upper front of the housing 12 and displays various information to the operator and accepts various operations from the operator.

[0013] The first ejection unit 30 includes a first inkjet head 31 and a second inkjet head 32 that eject liquid materials using an inkjet method, and an X-axis moving unit 33. The first inkjet head 31 ejects resin ink for the formation of a substrate. The resin ink is a liquid material such as a liquid curable resin (e.g., UV curable resin, thermosetting resin, two-component mixed curable resin, etc.), a thermoplastic resin, or a slurry obtained by mixing inorganic solids with a solvent. The second inkjet head 32 ejects conductive metal ink in which metal particles, such as silver, are dispersed in a solvent for the formation of wiring (conductors). The X-axis moving unit 33 includes a guide rail provided in the X-axis direction on the front of a gate-shaped frame, and two sliders on which each inkjet head 31 and 32 are respectively arranged. The X-axis moving unit 33 moves (scans) each inkjet head 31 and 32 in the X-axis direction by moving each slider along the guide rail.

[0014] The flattening unit 35 comprises a roller 36 (flattening member) for flattening liquid on the pallet 5, a motor 37 for rotating the roller 36, a torque sensor 38 for detecting the rotational torque output from the motor 37, and a roller lifting unit 39, and is disposed on the rear surface of the frame of the X-axis moving unit 33. The roller lifting unit 39 is configured to raise and lower the roller 36, for example by a cylinder, and raises and lowers the roller 36 in the Z-axis direction between an upper standby position and a lower flattening position (working position). The flattening unit 35 flattens the surface by, for example, applying resin ink discharged onto the pallet 5 to the roller 36 and leveling it while the pallet 5 moves relative to it in the Y-axis direction. The flattening member is a cylindrical roller 36, but a flat blade or the like may also be used.

[0015] The second dispensing unit 40 includes a first dispensing head 41, a second dispensing head 42, and a third dispensing head 43 that dispense and apply liquid in a dispenser manner, an X-axis moving unit 44, a lifting unit 45, and a height measuring unit 46. The first dispensing head 41, the second dispensing head 42, and the third dispensing head 43 are collectively referred to simply as "dispensing heads." Each dispensing head includes a cylindrical syringe for containing liquid and a needle that extends coaxially from the lower end of the syringe and dispenses the liquid from the discharge port due to pressure applied to the syringe. The lifting unit 45 moves the dispensing head in the Z-axis direction to lower it to the dispensing position or raise it to the standby position.

[0016] The first dispense head 41 and the second dispense head 42 discharge and apply a conductive paste for electrode molding as a liquid material. The conductive paste is, for example, a liquid resin in which a conductive material having conductivity is dispersed. As the conductive paste, for example, one in which particles of a metal such as silver are dispersed in a resin cured by heating is used. In the present embodiment, the first dispense head 41 discharges the conductive paste onto a wiring or the like to form bumps (bump electrodes) that are electrically conductive with terminals of a component. In addition, the second dispense head 42 forms a hole electrode by discharging the conductive paste into, for example, a through hole penetrating vertically through a part (one layer) of a base material and the peripheral edge thereof. The third dispense head 43 discharges and applies underfill for component sealing as a liquid material. The underfill is, for example, a resin paste such as a thermosetting resin. The thermosetting resin is, for example, an insulating liquid resin. In the present embodiment, the third dispense head 43 discharges the underfill toward, for example, the center of a mounting position before mounting the component. Further, after mounting the component, the third dispense head 43 discharges and fills the underfill so as to seal the periphery of the mounted component, for example. Note that the liquid material discharged after mounting the component may be made of a material different from the underfill discharged by the third dispense head 43. Further, the second discharge unit 40 may be provided with another dispense head for discharging the liquid material. The X-axis moving part 44 includes a guide rail provided in the X-axis direction on the front surface of the portal frame, and a slider on which each of the dispense heads 41, 42, 43 is disposed. The X-axis moving part 44 moves (scans) each of the dispense heads 41, 42, 43 in the X-axis direction by moving the slider.

[0017] The height measuring unit 46 is configured as a sensor that obtains the height (top surface height) of an object on the basis of the position when the object rising in the Z-axis direction comes into contact with the unit in a state where the lower measuring probe is advanced downward. The height measuring unit 46 measures the height of the pallet 5, the height of a shaped article on the pallet 5, and the like as the height of the object. Although not shown in the drawings, the stage unit 60 includes a reference member provided such that the top surface thereof is at a reference height. The height measuring unit 46 measures the height of the object on the basis of the difference between a measurement value obtained by measuring the top surface of the reference member and a measurement value obtained by measuring the top surface of the object, and the reference height.

[0018] The conveyance unit 50 includes a belt conveyor 52 that conveys the pallet 5 along the X-axis direction. The conveyance unit 50, driven by the belt conveyor 52, conveys, in the X-axis direction, the pallet 5 carried into the mounting apparatus 80 and the pallet 5 carried out from the mounting apparatus 80.

[0019] The UV irradiation unit 55 includes a UV lamp such as a mercury lamp, a metal halide lamp, or a UV-LED, for example, and cures the ultraviolet curable resin discharged from the first inkjet head 31 by irradiating the resin with UV light. The top surface heating unit 57 includes an infrared heater such as a halogen heater, a ceramic heater, or a carbon heater, for example, and heats and cures the metal ink discharged from the second inkjet head 32. A shaped article is stacked and formed on the pallet 5 by, for example, repeating the forming of a base material and the forming of wiring a plurality of times. The press heating unit 59 includes a flat metal plate, a heater that heats the flat plate, and an elevating unit capable of applying pressure such that the pallet 5 is elevated and pressed against the flat plate from below. The press heating unit 59 cures the conductive paste and underfill by heating the flat plate while pressing the pallet 5 carrying the shaped article before component mounting or the shaped article after component mounting against the flat plate.

[0020] The stage unit 60 comprises a stage 61 formed in a rectangular shape when viewed from above, a stage lifting unit 62, and a Y-axis moving unit 64. The stage 61 has a pallet 5 placed on its top surface and also holds the placed pallet 5. The stage lifting unit 62 moves the stage 61 in the Z-axis direction, thereby raising and lowering the stage 61 and the pallet 5 placed on the stage 61. The Y-axis moving unit 64 is equipped with a slider that can move along a guide rail 11, which is arranged in the center of the lower part of the molding apparatus 10 and extends from the front to the back in the Y-axis direction. The stage lifting unit 62 is mounted on the slider. The Y-axis moving unit 64 moves the stage 61 and the pallet 5 placed on the stage 61 in the Y-axis direction by moving the stage lifting unit 62 in the Y-axis direction by moving the slider. The gate-shaped frames of the X-axis moving units 33 and 44 in the first discharge unit 30 and the second discharge unit 40 are arranged to straddle the guide rail 11. The stage 61 moves in the Y-axis direction to the processing positions below the first discharge unit 30, the flattening unit 35, the second discharge unit 40, the UV irradiation unit 55, and the top heating unit 57. The stage 61 also moves to positions where the pallet 5 is handed over to the transport unit 50, to positions where the pallet 5 is handed over to the press heating unit 59, and to positions where the pallet 5 is attached and detached by an operator.

[0021] The first transfer unit 70 transfers the pallet 5, which is to be passed between the transport unit 50 and the stage unit 60, in the X-axis direction, and comprises a pusher lifting unit 71 and an X-axis moving unit 72. The pusher lifting unit 71 raises and lowers a pusher (not shown) in the Z-axis direction, for example by a cylinder, between an upper position that does not interfere with the pallet 5 and a lower position that can contact the side surface of the pallet 5. The X-axis moving unit 72 comprises a gate-shaped frame that straddles the guide rail 11, a guide rail provided along the X-axis direction, and a slider that is movable along the guide rail and on which the pusher lifting unit 71 is disposed, and moves the pusher lifting unit 71 in the X-axis direction. In this embodiment, the frame and guide rail of the X-axis moving unit 72 are shared with the frame and guide rail of the X-axis moving unit 44 described above, and the slider of the X-axis moving unit 72 is provided separately from the slider of the X-axis moving unit 44. The second transfer unit 75 transfers the pallet 5, which is to be exchanged between the press heating unit 59 and the stage unit 60, in the X-axis direction. The second transfer unit 75, like the first transfer unit 70, includes a pusher lifting unit 76 that raises and lowers the pusher in the Z-axis direction and an X-axis moving unit 77 that moves the pusher lifting unit 76 in the X-axis direction, so its description is omitted.

[0022] As shown in Figure 1, the mounting device 80 includes a transport unit 81, a parts supply unit 82, a mounting head 83, an XY axis moving unit 85, a parts camera 86, a nozzle stocker 87, and an operation panel 88.

[0023] The transport unit 81 is equipped with a belt conveyor that transports the pallets 5 along the X-axis direction, transporting the pallets 5 to be loaded into the molding device 10 and the pallets 5 that have been unloaded from the molding device 10. The parts supply unit 82 is, for example, a tape feeder equipped with a reel containing parts on tape at predetermined intervals. Multiple tape feeders are detachably mounted on the front side of the mounting device 80. The mounting head 83 is equipped with one or more nozzles that pick up parts and a nozzle lifting unit that raises and lowers the nozzles in the Z-axis direction, and mounts the parts picked up by the nozzles to predetermined positions on the pallets 5. The XY axis movement unit 85 is equipped with a Y-axis guide rail and a Y-axis slider that moves along the Y-axis guide rail, and an X-axis guide rail provided on the Y-axis slider and an X-axis slider that moves along the X-axis guide rail and on which the mounting head 83 is arranged. The XY axis movement unit 85 moves the mounting head 83 in the XY direction by moving the Y-axis slider and the X-axis slider. The parts camera 86 has an imaging range above it and captures images of parts attracted to the nozzle of the mounting head 83 from below to generate an image. The nozzle stocker 87 is configured to accommodate multiple types of nozzles of different sizes and shapes. Nozzles stored in the nozzle stocker 87 can be automatically attached to and detached from the mounting head 83. The operation panel 88 is configured as a touch panel display and displays various information to the operator and accepts various operations from the operator.

[0024] The management device 90 comprises a control unit 91, a storage unit 92, a communication unit 94, a display unit 95, and an input unit 96. The control unit 91 is configured as a microprocessor centered on a CPU and controls the entire management device 90. The storage unit 92 is configured, for example, as an HDD or SSD and stores molding job information 92a and mounting job information 92b. The molding job information 92a includes information similar to the molding job information 22a described above. The mounting job information 92b includes information such as the part name, mounting position, size, and mounting order of the parts to be mounted. The communication unit 94 is an interface used when communicating with each device of the production system 1, such as the molding device 10 and the mounting device 80. Based on requests from the molding device 10 and the mounting device 80, the control unit 91 sets the molding job information 92a and mounting job information 92b and transmits them via the communication unit 94. The display unit 95 is a display that displays images. The input unit 96 includes a keyboard, mouse, and other devices that receive input from workers and managers.

[0025] Next, the molding process of the molding apparatus 10 configured in this way will be described. Figure 3 is an explanatory diagram showing an example of the outline of the molding process. In this embodiment, the single substrate layer (hereinafter referred to as the molding layer M) formed by resin ink ejected from the first inkjet head 31 consists of a flattening layer that is flattened by a roller 36 and a smooth layer that is not flattened. The flattening layer and the smooth layer are formed to a predetermined thickness, such as several tens of micrometers. The molding process includes flattening layer molding, smooth layer molding, and circuit molding.

[0026] The planarization layer fabrication process includes an ejection step (Figure 3(1)) in which resin ink is ejected from the first inkjet head 31, a planarization step (Figure 3(2)) in which the ejected resin ink is flattened by a roller 36, and a curing step (Figure 3(3)) in which the flattened resin ink is cured by UV light irradiated from a UV irradiation unit 55. In the planarization layer fabrication process, one planarization layer (fabricated layer M) is fabricated by repeating the ejection step, the planarization step, and the curing step multiple times (for example, a predetermined number of times K, about 30 times).

[0027] The smooth layer manufacturing process includes an ejection step (Figure 3(4)) in which resin ink is ejected from the first inkjet head 31, and a curing step (Figure 3(4)) in which the ejected resin ink is cured with UV light irradiated from the UV irradiation unit 55. In the smooth layer manufacturing process, one smooth layer (manufactured layer M) is manufactured by repeating the ejection step and the curing step multiple times (for example, a predetermined number of times K of about 30 times). The predetermined number of times K for the planarization layer manufacturing process and the smooth layer manufacturing process are the same, but they may be different.

[0028] The circuit fabrication process includes an ejection step (Figure 3(6)) in which metallic ink is ejected from the second inkjet head 32, and a curing step (Figure 3(7)) in which the ejected metallic ink is heated and cured by the upper heating unit 57. In the circuit fabrication process, the circuit C (wiring) is fabricated by repeating the ejection step and the curing step multiple times (for example, a predetermined number of times of about 80 times).

[0029] Next, the planar layer formation process will be explained further. Figure 4 is a flowchart of an example of the planar layer formation process. Figures 5 and 6 are explanatory diagrams showing an example of the overview of the planar layer formation process. In the planar layer formation process, the control unit 20 first sets an initial value for the number of planarization operations N, which is the number of times the roller 36 performs the planarization operation in the planarization process (S100). The initial value is predetermined to a number of times, such as 5, but it may also be determined by the operator or other person.

[0030] Next, the control unit 20 measures the height of the upper surface of the object from which the resin ink is ejected using the height measuring unit 46 and sets the gaps for the ejection process, the flattening process, and the curing process, respectively (S110). The height of the upper surface of the object from which the resin ink is ejected corresponds, for example, to the height of the upper surface of the build layer M formed on the pallet 5. In addition, if a predetermined mark is to be formed in an area outside the build area of ​​the build layer M, with the same thickness (height) as the build layer M, the height of the upper surface of the mark may be measured. If the build layer M is not formed on the pallet 5, the height of the upper surface of the pallet 5 may be measured to set the gap. The control unit 20 adds a predetermined margin and a fixed value for the ejection process to the measured upper surface height to set the gap for the ejection process between the first inkjet head 31 and the build layer M. The control unit 20 also adds a predetermined margin and a fixed value for the flattening process to the measured upper surface height to set the gap for the flattening process between the roller 36 at the flattening position and the build layer M. Furthermore, the control unit 20 adds a predetermined margin and a fixed value for the curing process to the measured upper surface height to set the gap for the curing process between the UV irradiation unit 55 and the molded layer M.

[0031] Next, the control unit 20 controls the stage lifting unit 62 to adjust the gap for the ejection process and executes an ejection process in which resin ink is ejected from the first inkjet head 31 (S120, Figure 3(1)). As shown in Figures 5(1) and 6(1), the first inkjet head 31 is moved relative to the pallet 5 and resin ink R is ejected onto the film F on the pallet 5. If there is already a molded layer M, the resin ink R is ejected onto that molded layer M. When the ejection process is completed, the control unit 20 controls the stage lifting unit 62 to adjust the gap for the flattening process and executes a flattening process in which the roller 36 performs a flattening operation for N flattening cycles (S130, Figure 3(2)). As shown in Figures 5(2) and 6(2), the roller 36 is moved relative to the pallet 5 and the roller 36 is rotated by the drive of the motor 37 to adhere the resin ink R to the roller 36, thereby flattening the surface of the ejected resin ink R. The number of flattening cycles N is the number of relative movements required to cause the roller 36 to perform the flattening operation. In the flattening process, variations in the viscosity of the resin ink R and variations in the temperature of the roller 36 may result in insufficient adhesion of the resin ink R to the roller 36, preventing the desired flattening height from being achieved. Figure 5(2) shows the state where the material has been properly flattened to the desired flattening height (dotted line). On the other hand, Figure 6(2) shows the state where the material has not been flattened to the desired flattening height (dotted line), resulting in areas where the height is partially higher.

[0032] When the planarization process is completed, the control unit 20 stores the rotational torque of the motor 37 detected by the torque sensor 38 during the planarization operation as the load L of the motor 37 in the RAM 20c or storage unit 22 (S140). Next, the control unit 20 controls the stage lifting unit 62 to adjust it to a gap for the curing process and then performs a curing process by irradiating UV light from the UV irradiation unit 55 to cure the resin ink R (S150). As shown in Figures 5(3) and 6(3), the resin ink R is cured at the planarization height. Therefore, in Figure 6(3), the resin ink R is cured with some areas remaining at a higher height. When the curing process is completed, the control unit 20 determines whether the molding of one layer M has been completed (S160), and if it determines that it has not been completed, it returns to S120 and repeats the process. As described above, one layer M is formed by repeating the extrusion process, the planarization process, and the curing process multiple times (a predetermined number of times K). Therefore, in S160, the control unit 20 determines whether the number of executions of S120 to S150 has reached the predetermined number of times K. As shown in Figure 6(3), if curing occurs with some parts being higher than the actual height, these higher parts may interfere with the roller 36 during the planarization process after the next extrusion process, which may increase the load L on the motor 37 or result in molding defects (failure to flatten).

[0033] When the control unit 20 determines in S160 that the fabrication of one layer M is complete, it determines whether or not there is fabrication of the next layer (S170). If it determines that there is fabrication of the next layer, it performs the planarization count setting process (S180) and then returns to S110 to repeat the process. That is, the control unit 20 measures the top surface height of the fabricated layer M, sets the gap again, and then repeatedly performs the extrusion process, planarization process, and curing process. On the other hand, if the control unit 20 determines that there is no fabrication of the next layer, it terminates this process. The planarization count setting process in S180 will be explained below based on the flowchart in Figure 7.

[0034] In the planarization cycle setting process shown in Figure 7 (S180), the control unit 20 calculates the average load La, which is the average value of the load L detected in the planarization process, i.e., the load L stored in S140 of the planarization layer fabrication process (S200). Next, the control unit 20 compares the average load La with the reference load Lb (S210) and determines whether the average load La exceeds the reference load Lb (S220). The reference load Lb is the average value of the load L when the planarization operation is performed appropriately at the desired planarization height, as shown in Figure 5 (2), and can be one that has been measured in advance through experiments or other means.

[0035] When the control unit 20 determines that the average load La exceeds the reference load Lb, it sets the next number of flattening steps N by adding a predetermined additional number α to the number of flattening steps N in the previous flattening step (S230), and terminates this process. The number of flattening steps N in the previous flattening step corresponds to the initial value if the previous flattening step was the first flattening step, and to the number of flattening steps N (previous setting value) set in the previous flattening step setting process otherwise. Furthermore, when the control unit 20 determines in S220 that the average load La does not exceed the reference load Lb, that is, the average load La is less than or equal to the reference load Lb, it sets the previous number of flattening steps N as the next number of flattening steps N, that is, maintains the number of flattening steps N (S240), and terminates this process.

[0036] Figure 8 is an explanatory diagram illustrating an example of the relationship between the number of planarization steps, the load L, and the number of planarization steps N. In Figure 8, the horizontal axis represents the number of planarization steps during the fabrication of one layer M, the left vertical axis represents the load L of the motor 37, and the right vertical axis represents the number of planarization steps N. In this example, the initial value of the number of planarization steps N is set to 5, and the additional number of steps α is also set to 5. As shown in the figure, since the average load La in the first planarization step is higher than the reference load Lb, the number of planarization steps N in the second planarization step is set to 10, which is the initial value of 5 plus the additional number of steps α. Although the average load La in the second planarization step is lower than in the first step, it is still higher than the reference load Lb, so the number of planarization steps N in the third planarization step is set to 15, which is the 10 from the number of planarization steps N in the second planarization step plus the additional number of steps α. Although the average load La in the third flattening process is lower than in the second, it is still higher than the reference load Lb. Therefore, the number of flattening steps N in the fourth flattening process is set to 20, which is the sum of the 15 flattening steps N in the second flattening process plus an additional 5 steps α.

[0037] By repeating the flattening count setting process in this way, the flattening count N increases by an additional α, promoting the flattening of the resin ink R, and thus the load L on the roller 36 (motor 37) during the flattening operation gradually decreases. In the example shown in Figure 8, the average load La in the 7th flattening step is lower than the reference load Lb. Therefore, the flattening count N of 35 in the 7th flattening step is set as the flattening count N in the 8th flattening step. From there onward, the average load La remains lower than the reference load Lb, so the flattening count N is maintained at 35. Figure 8 illustrates up to the 15th flattening step, but since the predetermined number of steps K is, for example, around 30, the flattening count setting process is performed similarly until the predetermined number of steps K of flattening are completed. In the flattening steps from the 15th step onward, if the average load La remains below the reference load Lb, the flattening count N is maintained at a value of 35, and if the average load La exceeds the reference load Lb, the flattening count N is increased by an additional α. Thus, in this embodiment, by monitoring the load L of the roller 36 (motor 37) during the flattening operation and setting the number of flattening cycles N, it is possible to converge to an appropriate load L (reference load Lb).

[0038] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. In this embodiment, the roller 36 corresponds to an example of a flattening member, the motor 37 corresponds to an example of a drive unit, the torque sensor 38 corresponds to an example of a detection unit, the control unit 20 that executes S130 of the flattening layer formation process corresponds to an example of a control unit, and the control unit 20 that executes S180 (flattening count setting process) of the flattening layer formation process corresponds to an example of a setting unit. The height measuring unit 46 corresponds to an example of a measuring unit, and the stage lifting unit 62 corresponds to an example of an adjustment unit. In this embodiment, an example of the flattening method of the present disclosure is also clarified by explaining the operation of the molding apparatus 10.

[0039] The molding apparatus 10 of the embodiment described above controls the motor 37 so that the roller 36 performs a flattening operation for a number of flattening cycles N during the flattening process. Furthermore, the number of flattening cycles N is set based on the load L of the motor 37 detected by the torque sensor 38 during the flattening process. As a result, the load L of the motor 37 is reflected in the setting of the number of flattening cycles N, making it possible to set the number of flattening cycles N in a way that suppresses excessive load L, and consequently stabilizing the flattening accuracy. Therefore, the possibility of excessive load L acting on the roller 36 can be reduced, and the quality of the molded object can be improved. In addition, damage and deterioration of the roller 36 can be suppressed, and the service life of the roller 36 can be extended.

[0040] Furthermore, the control unit 20 controls the motor 37 to perform the flattening operation with the same number of flattening cycles N in the multiple flattening cycles during the molding process. The control unit 20 sets the number of flattening cycles N in the multiple flattening cycles during the molding process of the next molding layer M based on the load L in the multiple flattening cycles during the molding process of the previous molding layer M. Therefore, the load L of the motor 37 when molding the previous molding layer M can be appropriately reflected in the setting of the number of flattening cycles N when molding the next molding layer M.

[0041] Furthermore, the control unit 20 sets the number of flattening steps N in the multiple flattening steps of the next build layer M based on the average load La of the load L detected in each of the multiple flattening steps in the build layer M of the previous build layer M. This suppresses variations in the detected load L and allows the load L of the motor 37 to be appropriately reflected in the setting of the number of flattening steps N.

[0042] Furthermore, the control unit 20 controls the stage lifting unit 62 during the molding process so that the gap for the planarization process is kept constant and multiple planarization processes are performed. This eliminates the influence of changes in the gap for the planarization process and allows the load L of the motor 37 to be appropriately reflected in the setting of the number of planarization cycles N.

[0043] Furthermore, the control unit 20 sets the number of flattening cycles N to be greater than the number of flattening cycles N in the previous flattening cycle if the average load La in the flattening process is higher than the reference load Lb. By increasing the number of flattening cycles N and promoting flattening, the interference between the roller 36 and the molded layer M (areas where the resin ink R is partially high) is reduced, thereby improving the flattening accuracy.

[0044] Furthermore, the control unit 20, when the average load La in the planarization process is higher than the reference load Lb, repeatedly performs the process of setting the next number of planarization steps N by adding a predetermined number of additional steps α to the number of planarization steps N in that planarization process, until the average load La becomes the reference load Lb. In this way, the number of planarization steps N can be increased stepwise by an additional step α, thereby preventing an excessive increase in the number of planarization steps N while reducing interference between the roller 36 and the molded layer M and improving the planarization accuracy.

[0045] Furthermore, if the average load La in the planarization process falls below the reference load Lb, the control unit 20 sets the number of planarization cycles N in that planarization process to the number of planarization cycles N in the remaining planarization processes until the molding process including that planarization process is completed. This allows the optimal number of planarization cycles N when the load reaches the reference load Lb to be maintained, thereby preventing the load L of the motor 37 from rising again and stabilizing the planarization operation.

[0046] It goes without saying that this disclosure is not limited in any way to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of this disclosure.

[0047] In this embodiment, the control unit 20 maintained the number of flattening steps N in the flattening step when the average load La in the flattening step fell below the reference load Lb, but is not limited to this. For example, the control unit 20 may reduce the number of flattening steps N based on the load L in the flattening step after the average load La fell below the reference load Lb. In this case, the control unit 20 may reduce the number of flattening steps N by a predetermined reduction number that is smaller than a predetermined additional number α. The control unit 20 may also reduce the number of flattening steps N when the average load La falls below the reference load Lb for a predetermined number of consecutive steps, i.e., when it is determined that the load is stable at a low load L. Alternatively, the control unit 20 may maintain the number of flattening steps N when the average load La falls below the reference load Lb, but increase or decrease the number of flattening steps N so that the average load La approximately matches the reference load Lb.

[0048] In this embodiment, the control unit 20 increased the number of leveling operations N by adding the same additional number α each time. However, it is not limited to this, and the number of leveling operations N may be increased by adding different additional numbers. For example, the control unit 20 may increase the number of leveling operations N by adding a larger value of additional number α the higher the detected load L (average load La) is compared to the reference load Lb. Alternatively, the control unit 20 may increase the number of leveling operations N by adding an integer number obtained by multiplying the previous number of leveling operations N by a predetermined percentage.

[0049] In this embodiment, the control unit 20 increased the number of flattening cycles N when the average load La was higher than the reference load Lb, but it is not limited to this. The number of flattening cycles N may also be increased when the average load La is higher than the reference load Lb for a predetermined number of consecutive flattening steps.

[0050] In this embodiment, the rotational torque of the motor 37 detected by the torque sensor 38 was used as the load L, but it is not limited to this, and other physical quantities related to the load L, such as the rotational speed or current value of the motor 37, may be used. Furthermore, in addition to monitoring the load L of the motor 37, the load of the motor of the slider in the Y-axis moving unit 64 that moves the stage 61 in the Y-axis direction, which moves the roller 36 horizontally relative to it in the planarization process, may also be monitored.

[0051] In this embodiment, the control unit 20 uses the average load La of the detected load L, but is not limited to this; it may also use the median value of the load L or the maximum value of the load L. Furthermore, the reference load Lb may be appropriately determined according to the value of the load L used.

[0052] In this embodiment, the planarization layer fabrication process includes an extrusion process, a planarization process, and a curing process. However, it is sufficient to include only the extrusion process and the planarization process, and it is not necessary to include a curing process involving irradiation with UV light from the UV irradiation unit 55 or a curing process involving heating. Furthermore, the fabrication process includes a planarization layer fabrication process, a smooth layer fabrication process, and a circuit fabrication process. However, it is sufficient to include at least the planarization layer fabrication process.

[0053] In this embodiment, the planarization operation was performed with the same number of planarization steps N in the multiple planarization steps during the fabrication process of a single layer M. However, the embodiment is not limited to this, and the planarization operation may be performed with different number of planarization steps N. For example, the control unit 20 may perform a planarization step setting process each time the planarization step is performed in the fabrication process, or each time it is performed a predetermined number of times, to set the number of planarization steps N for subsequent planarization steps. For example, if the control unit 20 performs the planarization step setting process each time the planarization step is performed in the fabrication process, the planarization step setting process in S180 should be performed when returning from S160 to S120.

[0054] In this embodiment, the gap for the planarization process was kept constant during the multiple planarization steps in the molding process of a single layer M. However, the invention is not limited to this, and the gap for the planarization process may be varied. For example, the control unit 20 may change the gap for the planarization process based on the detected load L. That is, the control unit 20 may change both the number of planarization steps N and the gap for the planarization process based on the detected load L. By doing so, the possibility of an excessive load L acting on the roller 36 (motor 37) can be further reduced, and the quality of the molded object can be further improved.

[0055] Here, the flattening method of this disclosure is A flattening method in a molding apparatus that additively manufactures a molded layer by repeating a plurality of steps, including a liquid discharge step and a flattening step, multiple times, comprising: a drive unit that drives a flattening member to perform a flattening operation on a discharged liquid; and a detection unit that detects the load on which the drive unit drives the flattening member, the apparatus (a) A step of controlling the drive unit so that the flattening member performs the flattening operation in the flattening step, (b) A step of setting the number of times the flattening operation is performed in the flattening step based on the load detected by the detection unit in the flattening step, The gist of this is that it includes the following:

[0056] The planarization method of this disclosure, like the molding apparatus of this disclosure described above, can improve the quality of the molded object by reducing the possibility of excessive load being applied to the planarization member. In this planarization method, various embodiments of the molding apparatus of this disclosure may be adopted, or configurations and steps that realize each function of the molding apparatus may be added.

[0057] This specification also discloses technical concepts that change the "forming apparatus described in claim 1 or 2" in the original claim 5 to "forming apparatus described in any one of claims 1 to 4", technical concepts that change the "forming apparatus described in claim 1 or 2" in the original claim 6 to "forming apparatus described in any one of claims 1 to 5", and technical concepts that change the "forming apparatus described in claim 1 or 2" in the original claim 8 to "forming apparatus described in any one of claims 1 to 7". [Industrial applicability]

[0058] This disclosure is applicable to the technical field of creating objects by a molding process that includes a planarization step. [Explanation of Symbols]

[0059] 1 Production system, 5 Pallets, 10 3D printing device, 11 Y-axis rail, 12 Housing, 20 Control unit, 20a CPU, 20b ROM, 20c RAM, 20d Timer, 22 Storage unit, 22a, 92a Printing job information, 24 Communication unit, 26, 88 Operation panel, 30 First ejection unit, 31 First inkjet head, 32 Second inkjet head, 33, 44 X-axis movement unit, 35 Flattening unit, 36 Roller, 37 Motor, 38 Torque sensor, 39 Roller lifting unit, 40 Second ejection unit, 41 First dispensing head, 42 Second dispensing head, 43 Third dispensing head, 45 Lifting unit, 46 Height measuring unit, 50 Conveying unit, 52 Belt conveyor, 55 UV irradiation unit, 57 Top heating unit, 59 Press heating unit, 60 Stage unit, 61 Stage, 62 Stage lifting unit, 64 Y-axis movement unit, 70 First transfer unit, 71, 76 Pusher lifting unit, 72, 77 X-axis movement unit, 75 Second transfer unit, 80 Mounting device, 81 Transport unit, 82 Parts supply unit, 83 Mounting head, 85 XY-axis movement unit, 86 Parts camera, 87 Nozzle stocker, 90 Management device, 91 Control unit, 92 Storage unit, 92b Mounting job information, 94 Communication unit, 95 Display unit, 96 Input unit, C Circuit, F Film, R Resin ink, M Molding layer.

Claims

1. A molding apparatus for additively manufacturing a molded layer formed by repeating a molding process that includes a liquid extrusion process and a planarization process multiple times, A drive unit drives a flattening member to perform a flattening operation on the liquid discharged in the discharge step, The drive unit includes a detection unit that detects the load on which the flattening member is driven, A control unit controls the drive unit so that the flattening member performs the flattening operation in the flattening step, A setting unit sets the number of times the flattening operation is performed in the flattening process based on the load detected by the detection unit in the flattening process, A molding device equipped with the following features.

2. The control unit controls the drive unit so that the planarization operation is performed with the same number of planarization steps in the multiple planarization steps in the molding process. The setting unit sets the number of flattening steps in the multiple flattening steps in the next molding process of the molding layer based on the load detected by the detection unit in the multiple flattening steps in the previous molding process of the molding layer. The molding apparatus according to claim 1.

3. The setting unit sets the number of flattening steps in the next flattening step in the next flattening step in the flattening step of the previous flattening step of the The molding apparatus according to claim 2.

4. A measuring unit for measuring the height of the molded layer, It includes an adjustment unit for adjusting the height gap between the molded layer and the flattening member, The control unit controls the adjustment unit so that the flattening process is performed multiple times with the gap kept constant during the molding process. The molding apparatus according to claim 2 or 3.

5. The setting unit sets the next number of flattening steps to be greater than the number of flattening steps in the flattening step if the load detected by the detection unit in the flattening step is higher than the reference load. The molding apparatus according to claim 1 or 2.

6. The setting unit, when the load detected by the detection unit in the flattening step is higher than the reference load, repeats the process of setting the next number of flattening steps by adding a predetermined number of additional steps to the number of flattening steps in the flattening step, until the load detected by the detection unit becomes less than or equal to the reference load. The molding apparatus according to claim 1 or 2.

7. The setting unit, when the load detected by the detection unit in the planarization step becomes the reference load, sets the number of planarization steps in the planarization step to the number of planarization steps in the remaining planarization steps until the molding process including the planarization step is completed. The molding apparatus according to claim 6.

8. The plurality of steps include a curing step for curing the liquid that has been discharged in the discharge step and flattened in the flattening step. The molding apparatus according to claim 1 or 2.

9. A flattening method in a molding apparatus that additively manufactures a molded layer by repeating a plurality of steps, including a liquid discharge step and a flattening step, multiple times, comprising: a drive unit that drives a flattening member to perform a flattening operation on a discharged liquid; and a detection unit that detects the load on which the drive unit drives the flattening member, the apparatus (a) A step of controlling the drive unit so that the flattening member performs the flattening operation in the flattening step, (b) A step of setting the number of times the flattening operation is performed in the flattening step based on the load detected by the detection unit in the flattening step, A planarization method including the following.

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