Multilayer electronic components

Abstract

To provide a multilayer electronic component with superior reliability, improved warp resistance, and reduced acoustic noise. [Solution] The stacked electronic component 100 includes a body containing a dielectric layer 111 and internal electrodes 121, 122 arranged alternately with the dielectric layer; external electrodes 131, 132 arranged on the body; bump electrodes 141, 142 arranged below the external electrodes; conductive joints 151, 152 arranged between the external electrodes and the bump electrodes, in direct contact with the external electrodes and the bump electrodes, and containing a plurality of first metal particles and a first resin; and plating layers 161, 162 arranged to cover the outer surfaces of external terminals ET1, ET2 composed of the external electrodes, bump electrodes and conductive joints.

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] Multilayer ceramic capacitors (MLCCs), a type of multilayer electronic component, are important chip components used in industries such as communications, computers, home appliances, and automobiles due to their advantages of being small yet guaranteeing high capacitance. In particular, they are core passive elements used in various electrical, electronic, and information communication devices such as mobile phones, computers, and digital TVs. Furthermore, the use of multilayer ceramic capacitors in automobiles and infotainment systems is increasing the demand for high reliability, high strength characteristics, and miniaturization.

[0003] Because the dielectric layers contained in multilayer ceramic capacitors have piezoelectric and electrostrictive properties, when a DC or AC voltage is applied to the multilayer ceramic capacitor, a piezoelectric phenomenon may occur between the internal electrodes, causing vibrations.

[0004] Such vibrations are transmitted to the printed circuit board on which the multilayer ceramic capacitor is mounted via the external electrodes of the multilayer ceramic capacitor, generating vibration noise. This vibration noise may correspond to an audible frequency range of 20 to 20,000 Hz, which is unpleasant to humans, and such vibration noise that causes discomfort to humans is called acoustic noise.

[0005] Conventionally, methods to reduce acoustic noise have included making the upper and lower covers of the main unit different in thickness, or connecting an interposer containing ceramic material to the bottom of the capacitor, or connecting a metal bump to the bottom of the capacitor.

[0006] In the method of connecting a metal bump to the bottom of a capacitor, it is generally known that the external electrodes and the metal bump are joined with solder mainly composed of Sn, and then the circuit board and electronic components are fixed with general solder. However, this fixing method has the problem of degrading warp resistance. [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Korean Published Patent No. 10-2023-0022782 [Overview of the Initiative] [Problems that the invention aims to solve]

[0008] One of the various objectives of the present invention is to provide a highly reliable stacked electronic component.

[0009] One of the various objectives of the present invention is to provide a stacked electronic component with improved warp resistance.

[0010] One of the various objectives of the present invention is to provide a multilayer electronic component with reduced acoustic noise.

[0011] However, the objectives of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0012] A multilayer electronic component according to an embodiment of the present invention may include: a body including dielectric layers and internal electrodes alternately arranged with the dielectric layers; an external electrode disposed on the body; a bump electrode disposed below the external electrode; a conductive joint portion disposed between the external electrode and the bump electrode, directly in contact with the external electrode and the bump electrode, and including a plurality of first metal particles and a first resin; and a plating layer disposed to cover an outer surface of an external terminal constituted by the external electrode, the bump electrode, and the conductive joint portion. Effects of the Invention

[0013] One of the various effects of the present invention is that the reliability of the multilayer electronic component is improved by connecting the external electrode and the bump portion to the conductive joint portion including the plurality of first metal particles and the first resin.

[0014] One of the various effects of the present invention is that the warpage strength of the multilayer electronic component is improved.

[0015] One of the various effects of the present invention is that acoustic noise of the multilayer electronic component is reduced.

[0016] However, the various and significant advantages and effects of the present invention are not limited to those described above, and can be more easily understood in the process of describing specific embodiments of the present invention. Brief Description of the Drawings

[0017] [Figure 1] It is a perspective view showing a multilayer electronic component according to an embodiment of the present invention. [Figure 2] It is a bottom perspective view of the multilayer electronic component according to Fig. 1. [Figure 3] It is a cross-sectional view taken along line I-I' of Fig. 1. [Figure 4] It is a cross-sectional view taken along line II-II' of Fig. 1. [Figure 5] It is an exploded perspective view showing an exploded body of a multilayer electronic component according to an embodiment of the present invention. [Figure 6] It is an enlarged view of region K1 in FIG. 3. [Figure 7] It is a drawing corresponding to FIG. 3 according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, embodiments of the present invention may be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of elements in the drawings may be scaled up or down (or emphasized or simplified) for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0019] In order to clearly describe the present invention in the drawings, portions unrelated to the description are omitted. The sizes and thicknesses of the illustrated components are shown arbitrarily for convenience of description, and thus the present invention is not necessarily limited to the illustration. Further, components having the same function within the scope of the same idea are described using the same reference numerals. Furthermore, throughout the specification, the phrase that a portion "comprises" a certain component means that unless specifically stated otherwise, it does not exclude other components, but may further comprise other components.

[0020] In the drawings, the X direction can be defined as a first direction or a thickness (T) direction, the Y direction as a second direction or a length (L) direction, and the Z direction as a third direction or a width (W) direction.

[0021] Figure 1 is a perspective view showing a stacked electronic component 100 according to one embodiment of the present invention; Figure 2 is a bottom perspective view of the stacked electronic component according to Figure 1; Figure 3 is a cross-sectional view along the line I-I' in Figure 1; Figure 4 is a cross-sectional view along the line II-II' in Figure 1; Figure 5 is an exploded perspective view showing the body of the stacked electronic component according to one embodiment of the present invention in disassembled form; and Figure 6 is an enlarged view of the K1 region in Figure 3.

[0022] A stacked electronic component 100 according to one embodiment of the present invention will be described below with reference to Figures 1 to 6.

[0023] A stacked electronic component 100 according to one embodiment of the present invention may include a body 110 including a dielectric layer 111 and internal electrodes 121, 122 arranged alternately with the dielectric layer; external electrodes 131, 132 arranged on the body; bump electrodes 141, 142 arranged below the external electrodes; conductive joints 151, 152 arranged between the external electrodes and the bump electrodes, in direct contact with the external electrodes and the bump electrodes, and containing a plurality of first metal particles and a first resin; and plating layers 161, 162 arranged to cover the outer surfaces of external terminals ET1, ET2 composed of the external electrodes, bump electrodes, and conductive joints.

[0024] To reduce acoustic noise, a method is used in which a metal bump is coupled to the bottom of the capacitor.

[0025] Generally, an external electrode with a plated layer and a metal bump with a plated layer are joined using solder primarily composed of Sn. However, this soldering method has the problem of degrading warp resistance.

[0026] Therefore, in this invention, we attempted to improve the warp strength by using a conductive resin instead of solder, which is mainly composed of Sn, to bond the external electrode and the bump electrode.

[0027] However, in order to bond the external electrode and the bump electrode with a conductive resin, a curing process of the resin contained in the conductive resin is necessary. The curing temperature of the resin is similar to the melting point of solder, which is mainly composed of Sn, but the resin must be maintained at the curing temperature for a long time in order to cure it. When bonding an external electrode with a plated layer and a metal bump with a plated layer with a conductive resin, there was a risk that the Sn plated layer would form a large amount of alloy oxide layer during the long curing time, which could degrade the effect of the Sn plated layer in improving mounting characteristics.

[0028] Therefore, in this invention, by bonding an external electrode without a plating layer and a bump electrode without a plating layer with a conductive resin, and forming a plating layer after the curing process of the conductive resin, it is possible to improve both the warpage strength and the mounting characteristics.

[0029] The main body 110 includes a dielectric layer 111 and internal electrodes 121 and 122 arranged alternately with the dielectric layer. The main body 110 may also consist of the dielectric layer 111 and the internal electrodes 121 and 122 stacked alternately.

[0030] There are no particular restrictions on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be hexahedral or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 is not a perfectly straight hexahedron, but can be substantially hexahedral.

[0031] The main body 110 may have a first surface 1 and a second surface 2 facing each other in the thickness direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in the length direction, a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2 and connected to the third surface 3 and the fourth surface 4 and facing each other in the width direction.

[0032] In one embodiment, the main body 110 includes a first-to-third corner connecting the first and third surfaces, a first-to-fourth corner connecting the first and fourth surfaces, a second-to-third corner connecting the second and third surfaces, and a second-to-fourth corner connecting the second and fourth surfaces. The first-to-third corner and the second-to-third corner have a shape that contracts towards the center of the main body in the first direction as they approach the third surface, and the first-to-fourth corner and the second-to-fourth corner can have a shape that contracts towards the center of the main body in the first direction as they approach the fourth surface.

[0033] As margin regions where internal electrodes 121 and 122 are not placed overlap the dielectric layer 111, steps are created due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface with the third, fourth, and fifth surfaces and / or the corners connecting the second surface with the third, fourth, and fifth surfaces may have a form that is contracted toward the center of the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, due to the contraction behavior during the sintering process of the main body, the corners connecting the first surface 1 with the third surface 3, fourth surface 4, fifth surface 5, and sixth surface 6 and / or the corners connecting the second surface 2 with the third surface 3, fourth surface 4, fifth surface 5, and sixth surface 6 may have a form that is contracted toward the center of the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, in order to prevent chipping defects, etc., the corners connecting each surface of the main body 110 can be rounded by performing a separate process, thereby allowing the corners connecting the first surface with the third, fourth, fifth, and sixth surfaces and / or the corners connecting the second surface with the third, fourth, fifth, and sixth surfaces to have a rounded shape.

[0034] The above-mentioned corners may include the 1st-3rd corner connecting the 1st and 3rd faces, the 1st-4th corner connecting the 1st and 4th faces, the 2nd-3rd corner connecting the 2nd and 3rd faces, and the 2nd-4th corner connecting the 2nd and 4th faces. Additionally, the corners may include the 1st-5th corner connecting the 1st and 5th faces, the 1st-6th corner connecting the 1st and 6th faces, the 2nd-5th corner connecting the 2nd and 5th faces, and the 2nd-6th corner connecting the 2nd and 6th faces. The 1st to 6th faces of the main body 110 can be generally flat, and any non-flat areas can be considered corners. Hereinafter, the extension of each face can mean a line extending from the flat portion of each face.

[0035] On the other hand, in order to suppress the step difference caused by the internal electrodes 121 and 122, if the internal electrodes after lamination are cut so that they are exposed on the fifth surface 5 and sixth surface 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, the portions connecting the first surface and the fifth and sixth surfaces, and the portions connecting the second surface and the fifth and sixth surfaces, may not have a contracted form.

[0036] The multiple dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0037] According to one embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate-based materials, lead-composite perovskite-based materials, or strontium titanate-based materials can be used. The barium titanate-based material may include BaTiO3-based ceramic powder, and examples of the ceramic powder include BaTiO3, BaTiO3 in which Ca (calcium), Zr (zirconium), etc. are partially solid-dissolved (BaTiO3). 1-x Ca x )TiO3(0 <x<1)、Ba(Ti 1-y Cay )O3(0<y<1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3(0<x<1, 0<y<1) or Ba(Ti 1-y Zr y )O3(0<y<1), etc.

[0038] In addition, various ceramic additives, organic solvents, binders, dispersants, and the like can be added to raw materials for forming the dielectric layer 111, such as barium titanate (BaTiO3) powder, in accordance with the purpose of the present invention.

[0039] A main body 110 may include a capacitance forming part Ac that is disposed inside the main body 110, includes a first internal electrode 121 and a second internal electrode 122 disposed to face each other with the dielectric layer 111 interposed therebetween to form a capacitance, and cover parts 112 and 113 formed at upper and lower portions in a first direction of the capacitance forming part Ac.

[0040] In addition, the capacitance forming part Ac, which is a part contributing to the capacitance formation of a capacitor, may be formed by repeatedly laminating a plurality of first internal electrodes 121 and second internal electrodes 122 with the dielectric layer 111 interposed therebetween.

[0041] The cover parts 112 and 113 may include an upper cover part 112 disposed at an upper portion in the first direction of the capacitance forming part Ac and a lower cover part 113 disposed at a lower portion in the first direction of the capacitance forming part Ac.

[0042] The upper cover part 112 and the lower cover part 113 can be formed by laminating a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the capacitance forming part Ac respectively in the thickness direction, and can basically play a role of preventing damage to the internal electrodes caused by physical or chemical stress.

[0043] The upper cover part 112 and the lower cover part 113 do not include internal electrodes, and may include the same material as that of the dielectric layer 111.

[0044] In other words, the upper cover portion 112 and the lower cover portion 113 may include a ceramic material, for example, a barium titanate (BaTiO3) based ceramic material.

[0045] Furthermore, margin portions 114 and 115 can be arranged on the side surface of the volume-forming portion Ac.

[0046] The margin portions 114 and 115 may include a first margin portion 114 located on the fifth surface 5 of the main body 110 and a second margin portion 115 located on the sixth surface 6. That is, the margin portions 114 and 115 can be located on both end surfaces in the width direction of the main body 110.

[0047] As shown in Figure 4, the margin portions 114 and 115 can refer to the regions between the interface between both ends of the first internal electrode 121 and the second internal electrode 122 and the body 110 in a cross-section obtained by cutting the body 110 in the width-thickness (WT) direction.

[0048] The margins 114 and 115 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0049] The margin portions 114 and 115 may be formed by applying conductive paste to the ceramic green sheet, except where the margin portions are formed, to form internal electrodes.

[0050] Furthermore, in order to suppress the step caused by the internal electrodes 121 and 122, after cutting the laminated internal electrodes so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, a single dielectric layer or two or more dielectric layers can be laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115.

[0051] The internal electrodes 121 and 122 may be stacked alternately with the dielectric layer 111.

[0052] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are arranged alternately so as to face each other across the dielectric layer 111 that constitutes the main body 110, and can be exposed on the third surface 3 and the fourth surface 4 of the main body 110, respectively.

[0053] Referring to Figure 3, the first internal electrode 121 can be separated from the fourth surface 4 and exposed via the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed via the fourth surface 4. The first external electrode 131 can be placed on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 can be placed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0054] In other words, the first internal electrode 121 is not connected to the second external electrode 132, but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131, but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance apart on the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance apart on the third surface 3.

[0055] In this configuration, the first internal electrode 121 and the second internal electrode 122 can be electrically isolated from each other by the dielectric layer 111 placed in between them.

[0056] The main body 110 can be formed by alternately stacking ceramic green sheets printed with the first internal electrode 121 and ceramic green sheets printed with the second internal electrode 122, and then firing them.

[0057] The materials used to form the internal electrodes 121 and 122 are not particularly limited, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 may include one or more of the following: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0058] Furthermore, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of the following onto a ceramic green sheet: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. The printing method for the conductive paste for internal electrodes can be screen printing or gravure printing, but the present invention is not limited thereto.

[0059] External electrodes 131 and 132 can be placed on the main body 110.

[0060] The external electrodes 131 and 132 may include connection portions CP located on the third and fourth surfaces, and band portions BP extending from the connection portions to a part of the first surface. Referring to Figure 3, the region of the external electrodes 131 and 132 located between the extension line E1 of the first surface and the extension line E2 of the second surface can be designated as the connection portion CP, and the region located below the extension line E1 of the first surface can be designated as the band portion BP.

[0061] On the other hand, the band section BP is not limited to being located on the first surface, and can extend from the connection point to one or more of the second, fifth, and sixth surfaces.

[0062] The external electrodes 131 and 132 may include a first external electrode 131 and a second external electrode 132. The first external electrode 131 can be positioned on the third surface and connected to the first internal electrode 121, and the second external electrode 132 can be positioned on the fourth surface and connected to the second internal electrode 122.

[0063] The bump electrodes 141 and 142 can be positioned below the external electrodes 131 and 132.

[0064] The bump electrodes 141 and 142 can reduce or absorb vibrations transmitted from the substrate to the multilayer electronic component, thereby suppressing acoustic noise.

[0065] The bump electrodes 141 and 142 may include a first bump electrode 141 and a second bump electrode 142. The first bump electrode 141 may be positioned below the first external electrode 131 and electrically connected to the first external electrode 131, and the second bump electrode 142 may be positioned below the second external electrode 132 and electrically connected to the second external electrode 132.

[0066] The conductive junctions 151 and 152 can serve to connect the external electrodes 131 and 132 with the bump electrodes 141 and 142.

[0067] The conductive joints 151 and 152 may contain a plurality of first metal particles and a first resin. This allows them to absorb stress transmitted from the substrate, externally applied stress, etc., thereby improving warpage strength, while also electrically connecting the external electrodes 131 and 132 and the bump electrodes 141 and 142.

[0068] The conductive joints 151 and 152 can be in direct contact with the external electrodes 131 and 132 and the bump electrodes 141 and 142. This can be achieved by first forming the external terminals ET1 and ET2, which consist of the external electrodes 131 and 132, the bump electrodes 141 and 142, and the conductive joints 151 and 152, and then forming the plating layers 161 and 162.

[0069] In one embodiment, a plating layer may not be placed at the interface between the conductive joints 151, 152 and the external electrodes 131, 132, and at the interface between the conductive joints 151, 152 and the bump electrodes 141, 142.

[0070] The conductive joints 151 and 152 may include a first conductive joint 151 and a second conductive joint 152. The first conductive joint 151 can connect the first external electrode 131 and the first bump electrode 141, and the second conductive joint 152 can connect the second external electrode 132 and the second bump electrode 142.

[0071] The first resin contained in the conductive joints 151 and 152 may be an electrically insulating thermosetting resin. In this case, the thermosetting resin may be, for example, an epoxy resin, but the present invention is not limited thereto, and may also be, for example, a bisphenol A resin, a glycol epoxy resin, a novolac epoxy resin, or a derivative thereof, which has a small molecular weight and is liquid at room temperature.

[0072] The first metal particles contained in the conductive joints 151 and 152 are not particularly limited and may include, for example, Cu, Ni, Sn, Pd, Pt, Au, Ag, Pb and / or alloys containing these, and more preferably Cu.

[0073] External terminals ET1 and ET2 may consist of external electrodes 131 and 132, bump electrodes 141 and 142, and conductive junctions 151 and 152. External terminals ET1 and ET2 may include a first external terminal ET1 and a second external terminal ET2. The first external terminal ET1 may consist of a first external electrode 131, a first bump electrode 141, and a first conductive junction 151, and the second external terminal ET2 may consist of a second external electrode 132, a second bump electrode 142, and a second conductive junction 152.

[0074] In one embodiment, the external terminals ET1 and ET2 do not need to contain solder. That is, unlike conventional designs, by not using solder, the external terminals ET1 and ET2 can be composed only of external electrodes 131 and 132, bump electrodes 141 and 142, and conductive joints 151 and 152.

[0075] The plating layers 161 and 162 can be arranged to cover the external terminals ET1 and ET2, which are composed of external electrodes 131 and 132, bump electrodes 141 and 142, and conductive joints 151 and 152. In this case, the plating layers 161 and 162 can be arranged to be in direct contact with the external electrodes 131 and 132 and the bump electrodes 141 and 142. Alternatively, the plating layers 161 and 162 can be arranged to be in direct contact with the conductive joints 151 and 152.

[0076] The plating layers 161 and 162 may include a first plating layer 161 and a second plating layer 162. The first plating layer 161 can cover the first external terminal ET1, and the second plating layer 162 can cover the second external terminal ET2.

[0077] The plating layers 161 and 162 can play a role in improving mounting characteristics.

[0078] In one embodiment, the plating layers 161 and 162 may include a Ni plating layer in contact with the outer surfaces of the external terminals ET1 and ET2, and a Sn plating layer disposed on the Ni plating layer.

[0079] In one embodiment, the external electrodes 131 and 132 may include conductive metal and glass. The external electrodes 131 and 132 may also be fired electrodes formed by dipping the main body 110 into a paste containing conductive metal and glass and then firing it.

[0080] In this case, one or more of the multiple first metal particles contained in the conductive joints 151 and 152 may be arranged to be in direct contact with at least a portion of the conductive metal.

[0081] The conductive metal included in the external electrodes 131 and 132 can be any material with excellent electrical conductivity, and is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys.

[0082] In one embodiment, the external electrodes 131 and 132 may include a second metal particle and a second resin. The external electrodes 131 and 132 may be conductive resin layers formed by dipping the main body 110 into a paste containing the second metal particle and the second resin, and then curing it. Alternatively, the external electrodes 131 and 132 may have a two-layer structure in which the main body 110 is dipped into a paste containing conductive metal and glass, then fired to form a fired electrode, and then dipped into a paste containing the second metal particle and the second resin, and then cured to form a conductive resin layer.

[0083] In this case, one or more of the multiple first metal particles contained in the conductive joints 151 and 152 may be arranged to be in direct contact with one or more of the multiple second metal particles contained in the external electrodes 131 and 132.

[0084] The second resin contained in the external electrodes 131 and 132 may be an electrically insulating thermosetting resin. In this case, the thermosetting resin may be, for example, an epoxy resin, but the present invention is not limited thereto, and may also be, for example, a bisphenol A resin, a glycol epoxy resin, a novolac epoxy resin, or a derivative thereof, which has a small molecular weight and is liquid at room temperature.

[0085] The second metal particles contained in the external electrodes 131 and 132 are not particularly limited and may include, for example, Cu, Ni, Sn, Pd, Pt, Au, Ag, Pb and / or alloys containing these, and more preferably one or more of Cu, Ag, Sn and their alloys.

[0086] In one embodiment, the external electrodes 131, 132 and the bump electrodes 141, 142 do not need to have a plating layer. By bonding the external electrodes 131, 132 and the bump electrodes 141, 142, which do not have a plating layer, to the conductive joints 151, 152, and then forming the plating layers 161, 162 after the hardening process of the conductive joints 151, 152, the warpage strength can be improved while simultaneously improving the mounting characteristics.

[0087] On the other hand, the average thickness Tce of the conductive joints 151 and 152 does not need to be particularly limited. For example, the average thickness Tce of the conductive joints 151 and 152 can be 5 to 20 μm. If the average thickness Tce of the conductive joints 151 and 152 is less than 5 μm, it may not be possible to secure sufficient bonding force between the external electrode and the bump electrode, or the effect of improving warpage strength may be insufficient. If it exceeds 20 μm, the ESR (equivalent series resistance) may increase, and the electrical characteristics may deteriorate.

[0088] The average thickness Tce of the conductive joints 151 and 152 may be measured at a cross-section in the length and thickness directions when the multilayer electronic component is cut through the center in the width direction, or it may be the average of values ​​measured at five points that are equally spaced in the length direction.

[0089] In one embodiment, the main body 110 includes a first and second surface facing each other in the thickness direction, a third and fourth surface facing each other in the length direction, and a fifth and sixth surface facing each other in the width direction. The external electrodes 131 and 132 include a connecting portion CP located on the third and fourth surfaces and a band portion BP extending from the connecting portion to a part of the first surface. The conductive joint portions 151 and 152 can be located below the band portion BP.

[0090] Figure 7 is a drawing corresponding to Figure 3 of a stacked electronic component 100' according to another embodiment.

[0091] Referring to Figure 7, the conductive joints 151' and 152' can be positioned extending between at least a portion of the connection portion CP between the plating layers 161 and 162 and the external electrodes 131 and 132. That is, the first conductive joint 151' can be positioned extending between at least a portion of the connection portion CP between the first plating layer 161 and the first external electrode 131, and the second conductive joint 152' can be positioned extending between at least a portion of the connection portion CP between the second plating layer 162 and the second external electrode 132.

[0092] Furthermore, the conductive joints 151' and 152' may extend between the plating layers 161 and 162 and at least a portion of the sides of the bump electrodes 151 and 152. That is, the first conductive joint 151' may extend between the first plating layer 161 and at least a portion of the sides of the first bump electrode 151, and the second conductive joint 152' may extend between the second plating layer 162 and at least a portion of the sides of the second bump electrode 152.

[0093] The bump electrodes 141 and 142 can be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc. For example, the bump electrodes 141 and 142 can include Cu. More specifically, the bump electrodes 141 and 142 can be substantially made of Cu.

[0094] Although embodiments of the present invention have been described in detail above, the present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims provided. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0095] Furthermore, the expression "one embodiment" as used in this disclosure does not mean that each embodiment is identical to the others, but is provided to highlight and describe the unique and distinct features of each embodiment. However, the present embodiments are not excluded from being realized in combination with features of other embodiments. For example, even if a matter described in one embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description in the other embodiment that contradicts or is inconsistent with that matter.

[0096] The terms used in this disclosure are used solely to describe one embodiment and are not intended to limit the disclosure. Where otherwise, singular expressions include plural expressions unless the context clearly indicates otherwise. [Explanation of symbols]

[0097] 100 Stacked Electronic Components 110 Main Unit 111 Dielectric layer 112, 113 Cover section 114, 115 Margin section 121, 122 Internal electrode 131, 132 External electrode 141, 142 Bump electrodes 151, 152 Conductive joint ET1, ET2 External terminals 161, 162 Plating layer CP connection BP Band Section

Claims

1. A body including a dielectric layer and internal electrodes arranged alternately with the dielectric layer, An external electrode placed on the main body, A bump electrode positioned below the external electrode, Displaced between the external electrode and the bump electrode, in direct contact with the external electrode and the bump electrode, a conductive bonding portion comprising a plurality of first metal particles and a first resin, A multilayer electronic component comprising a plating layer disposed to cover the outer surface of an external terminal composed of the external electrode, bump electrode, and conductive joint.

2. The laminated electronic component according to claim 1, wherein the plating layer is arranged to be in direct contact with the external electrode and the bump electrode.

3. The multilayer electronic component according to claim 1, wherein the external electrode includes a conductive metal and glass.

4. The laminated electronic component according to claim 3, wherein one or more of the plurality of first metal particles are arranged to be in direct contact with at least a portion of the conductive metal.

5. The multilayer electronic component according to claim 1, wherein the external electrode comprises a second metal particle and a second resin.

6. The stacked electronic component according to claim 5, wherein one or more of the plurality of first metal particles are arranged to be in direct contact with one or more of the plurality of second metal particles.

7. The multilayer electronic component according to claim 1, wherein the external electrode and bump electrode do not include a plating layer.

8. The stacked electronic component according to claim 1, wherein the average thickness of the conductive joint is 5 to 20 μm.

9. The main body includes a first and second surface facing each other in the thickness direction, a third and fourth surface facing each other in the length direction, and a fifth and sixth surface facing each other in the width direction. The external electrode includes connecting portions arranged on the third and fourth surfaces, and a band portion extending from the connecting portions to a part of the first surface. The conductive junction is located below the band portion, as described in claim 1.

10. The laminated electronic component according to claim 9, wherein the conductive junction is disposed between at least a portion of the connection between the plating layer and the external electrode.

11. The laminated electronic component according to claim 9, wherein the conductive junction is disposed extending between the plating layer and at least a portion of the side surface of the bump electrode.

12. The stacked electronic component according to any one of claims 1 to 11, wherein the plating layer includes a Ni plating layer in contact with the outer surface of the external terminal and a Sn plating layer disposed on the Ni plating layer.

13. The stacked electronic component according to any one of claims 1 to 11, wherein the bump electrode contains Cu.

14. The stacked electronic component according to any one of claims 1 to 11, wherein the first metal particle comprises Cu.

15. The multilayer electronic component according to any one of claims 1 to 11, wherein the external terminals do not contain solder.

16. A laminated electronic component according to any one of claims 1 to 11, wherein no plating layer is disposed at the interface between the conductive joint and the external electrode and at the interface between the conductive joint and the bump electrode.

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