Information processing system, control device, molding machine, information processing method and program

Abstract

This facilitates molding using resins whose physical properties are unknown, at least to some extent. [Solution] An information processing system for molding conditions of a molding machine that melts and molds resin, comprising at least one processor capable of referencing a storage device in which the type of resin, the physical properties of the resin, and the molding conditions are stored in association, wherein the at least one processor performs the steps of: estimating the physical properties of a target resin whose physical properties are at least partially unknown; and obtaining molding conditions for a resin with physical properties similar to the estimated physical properties according to predetermined criteria by referring to the storage device.

Description

[[Technical Field]]

[0001] The present invention relates to an information processing system, a control device, a molding machine, an information processing method, and a program. [[Background Art]]

[0002] Conventionally, various methods for melting and molding resin have been used. One example thereof is injection molding of resin into a mold to produce a molded article (see, for example, Patent Document 1). In recent years, from the perspective of environmental protection, the use of recycled plastic has been desired in resin molding. [[Prior Art Literature]] [[Patent Literature]]

[0003] [[Patent Document 1]] Japanese Unexamined Patent Publication No. 2004-209814 [[Summary of the Invention]] [[Problem to be Solved by the Invention]]

[0004] Due to differences in the products that recycled plastics are sourced from and their service periods, the moldability of recycled plastics varies between different lots, except for some premium grades. Lower-grade recycled plastics also have varying moldability even within the same lot. Hitherto, molding engineers have accumulated molding knowledge and experience regarding specific resins (such as polypropylene or polystyrene), and have determined molding conditions for a resin to be molded based on such accumulated knowledge. However, when the variation in resin moldability increases, it becomes difficult to determine the molding conditions for the resin to be molded based on past experience. Therefore, it is desirable to provide a reference index for molding engineers when they intend to perform molding using a resin whose physical properties are at least partially unknown (such as recycled plastic).

[0005] The present invention has been made in view of the above problems, and aims to provide an information processing system, control device, molding machine, information processing method, and program that facilitate molding using resins whose physical properties are at least partially unknown. [Means for solving the problem]

[0006] An information processing system according to a first aspect of the present invention is an information processing system for molding conditions of a molding machine that melts and molds resin, The system includes at least one processor capable of referencing a memory device in which the type of resin, the physical properties of the resin, and the molding conditions are stored in association, and the at least one processor includes a procedure for estimating the physical properties of a target resin whose physical properties are at least partially unknown. The procedure involves referring to the storage device and obtaining molding conditions for a resin with properties similar to the estimated properties according to predetermined criteria.

[0007] With this configuration, even if the resin has some unknown physical properties, molding conditions for a resin with similar physical properties can be obtained according to predetermined standards. Since these molding conditions for a resin with similar physical properties can be used for molding, the molding process can be made easier.

[0008] An information processing system according to a second aspect of the present invention is an information processing system according to a first aspect, The physical properties of the resin stored in the memory device and the estimated physical properties include information regarding the viscosity of the resin, and / or a combination of the pressure of the resin, the volume of the resin, and the temperature of the resin. In the procedure for estimating the aforementioned physical properties, the processor estimates information regarding the viscosity of the resin, and / or a combination of the pressure of the resin, the volume of the resin, and the temperature of the resin as the physical properties of the target resin. In the procedure for obtaining the molding conditions, the processor refers to the memory device to obtain information about the estimated resin viscosity and / or molding conditions for a resin with similar physical properties to a combination of resin pressure, resin volume, and resin temperature, according to a predetermined standard.

[0009] With this configuration, even if at least some of the physical properties of a resin are unknown, information regarding the resin viscosity, and / or a combination of the resin pressure, resin volume, and resin temperature can be estimated as physical properties. Molding conditions for a resin with similar physical properties can be obtained according to predetermined criteria, and these molding conditions for a resin with similar physical properties can be used for molding, thereby facilitating the molding process.

[0010] An information processing system according to a third aspect of the present invention is an information processing system according to a second aspect, The information relating to the resin viscosity is at least one viscosity model parameter determined using multiple resin viscosities under multiple measurement conditions and corresponding multiple shear rates. The aforementioned measurement conditions are determined by a combination of one or more physical quantities selected from the resin temperature, resin pressure, and shear rate. In the procedure for estimating the physical properties, the processor determines multiple resin viscosities using the difference between the pressure at multiple time points obtained by a pressure sensor placed in the nozzle, cylinder, or mold of the molding machine and the corresponding injection pressure at multiple time points, and estimates at least one viscosity model parameter determined using the multiple resin viscosities and the corresponding multiple shear rates as information regarding the resin viscosity. The physical properties of the resin stored in the memory device include at least one viscosity model parameter, In the procedure for acquiring the molding conditions, the processor refers to the storage device and acquires molding conditions for a resin having a group of viscosity parameters similar to the group of viscosity parameters estimated for the target resin, according to a predetermined standard.

[0011] This configuration allows for the estimation of resin viscosity information using the difference between the pressure at multiple time points and the corresponding injection pressure at those multiple time points.

[0012] An information processing system according to a fourth aspect of the present invention is an information processing system according to a third aspect, The pressures at a plurality of times, which are used when estimating the information related to said resin viscosity, are obtained from data obtained by cutting out time-series data of pressure acquired by said pressure sensor for each molding cycle.

[0013] According to this configuration, the pressures at a plurality of times are obtained from data obtained by cutting out time-series data of pressure acquired by the pressure sensor for each molding cycle.

[0014] An information processing system according to a fifth aspect of the present invention is the information processing system according to the second aspect, wherein said information related to resin viscosity is one or more resin viscosities under one or more measurement conditions, said measurement conditions are determined by a combination of one or more physical quantities selected from among resin temperature, resin pressure, and shear rate, in the procedure for estimating said physical properties, said processor estimates, as information related to resin viscosity, one or more resin viscosities corresponding to one or more measurement conditions by using a difference between a resin pressure acquired by a pressure sensor disposed in a nozzle, a cylinder, or a mold of a molding machine and an injection pressure.

[0015] According to this configuration, information related to resin viscosity can be estimated by using the difference between the resin pressure and the injection pressure.

[0016] An information processing system according to a sixth aspect of the present invention is the information processing system according to any one of the first to fifth aspects, wherein said at least one processor executes a procedure for outputting information for presenting said acquired molding conditions.

[0017] According to this configuration, even for a resin of which at least some physical properties are unknown, by presenting molding conditions for a resin with similar moldability, a technician can use this as a reference when determining molding conditions. Accordingly, molding using a resin of which at least some physical properties are unknown can be facilitated.

[0018] An information processing system according to a seventh aspect of the present invention is the information processing system according to any one of the first to fifth aspects, executing a procedure of determining molding conditions for the target resin using the obtained molding conditions.

[0019] According to this configuration, molding conditions can be automatically determined even for a target resin whose physical properties are unknown in at least a part. Therefore, molding using a resin whose physical properties are unknown in at least a part can be facilitated.

[0020] An information processing system according to an eighth aspect of the present invention is the information processing system according to any one of the first to seventh aspects, wherein the at least one processor: determines a viscosity parameter group as an estimation target parameter group based on time-series data of pressure and temperature respectively under conditions determined by combinations of a plurality of temperatures and a plurality of injection speeds for the target resin.

[0021] According to this configuration, the viscosity parameter group for the target resin can be determined as the estimation target parameter group, and the viscosity of the target resin can be predicted.

[0022] An information processing system according to a ninth aspect of the present invention is the information processing system according to the eighth aspect, wherein the at least one processor: determines the viscosity of the target resin based on a temperature and / or injection speed input by a user and the estimation target parameter group, and outputs information for presenting the viscosity of the target resin.

[0023] According to this configuration, the viscosity of the target resin can be presented, so the viscosity of the target resin can be grasped.

[0024] An information processing system according to a tenth aspect of the present invention is the information processing system according to the eighth or ninth aspect, wherein the at least one processor: By comparing multiple viscosity parameter sets stored in the memory device, a set of viscosity parameters similar to those determined by a predetermined criterion is obtained as the comparison parameter set. Based on the estimated target parameter group and the comparison target parameter group, the system outputs information to present the viscosity of the target resin and the viscosity of the comparison resin in a comparable manner, and / or information to present a graph comparing the viscosity of the target resin and the comparison resin.

[0025] With this configuration, the viscosity of the target resin and the viscosity of the comparison resin are presented in a comparable manner, or further / or a graph for comparing the viscosities of the target resin and the comparison resin is presented, making it easy to compare the target resin and the comparison resin.

[0026] An information processing system according to the 11th aspect of the present invention is an information processing system according to any 8th to 10th aspect, wherein at least one processor is By comparing multiple viscosity parameter sets stored in the memory device, a set of viscosity parameters similar to those determined by a predetermined criterion is obtained as the comparison parameter set. The determined set of estimated parameters is applied to a predetermined calculation method to determine the allowable range of temperature and / or injection speed within which the viscosity falls within the allowable variation range specified by the user, based on the viscosity of the comparison resin, and information is output to present the determined allowable range of temperature and / or injection speed.

[0027] This configuration allows the user to easily understand the acceptable range of temperature and / or injection speed.

[0028] An information processing system according to the twelfth aspect of the present invention is an information processing system according to any eighth to tenth aspect, wherein at least one processor is The determined set of estimated parameters is applied to a predetermined calculation method to determine the permissible range of temperature and / or injection speed within which the viscosity falls within the permissible variation range specified by the user, based on the viscosity specified by the user. Information is then output to present the determined permissible range of temperature and / or injection speed.

[0029] This configuration allows the user to easily understand the acceptable range of temperature and / or injection speed.

[0030] A control device according to a thirteenth aspect of the present invention is: A control device for controlling a molding machine that melts and molds resin, The system includes at least one processor capable of referencing a storage device in which the type of resin, the physical properties of the resin, and the molding conditions are stored in association, The at least one processor is A procedure for estimating the physical properties of a target resin whose physical properties are at least partially unknown, A procedure for obtaining molding conditions for a resin with physical properties similar to the estimated physical properties according to predetermined standards by referring to the storage device, Execute this.

[0031] With this configuration, even if the resin has some unknown physical properties, molding conditions for a resin with similar physical properties can be obtained according to predetermined standards. Since these molding conditions for a resin with similar physical properties can be used for molding, the molding process can be made easier.

[0032] A molding machine according to the 14th aspect of the present invention is a molding machine that melts and molds resin, and has a control device according to the 13th aspect.

[0033] An information processing method according to a 15th aspect of the present invention is an information processing method performed by an information processing system that can refer to a storage device in which the type of resin, the physical properties of the resin, and the molding conditions are stored in association with each other, The estimation method is a procedure for estimating the physical properties of a target resin whose physical properties are at least partially unknown, The acquisition means includes a procedure for obtaining molding conditions for a resin with physical properties similar to the estimated physical properties according to a predetermined standard by referring to the storage device, It holds.

[0034] A program according to a sixteenth aspect of the present invention is provided for a computer that can access a storage device in which the type of resin, the physical properties of the resin, and the molding conditions are stored in association. A procedure for estimating the physical properties of a target resin whose physical properties are at least partially unknown. A procedure for obtaining molding conditions for a resin with physical properties similar to the estimated physical properties according to predetermined standards, by referring to the storage device, This is a program to execute [the command / action].

[0035] With this configuration, even if the resin has some unknown physical properties, molding conditions for a resin with similar physical properties can be obtained according to predetermined standards. Since these molding conditions for a resin with similar physical properties can be used for molding, the molding process can be made easier. [Effects of the Invention]

[0036] According to one aspect of the present invention, even if the physical properties of a resin are unknown to some extent, molding conditions for a resin with similar physical properties can be obtained according to predetermined criteria. Since these molding conditions for a resin with similar physical properties can be used for molding, the molding process can be facilitated. [Brief explanation of the drawing]

[0037] [Figure 1] This is a schematic diagram of the molding machine in this embodiment. [Figure 2] This is a block diagram showing the schematic configuration of an information processing system. [Figure 3] This is an example of a database table stored in a storage device. [Figure 4] This is an example of a data upload screen in the embodiment. [Figure 5]This is an example of a screen showing the results of determining the viscosity parameter group in the example. [Figure 6] This is an example of a screen showing the predicted viscosity in the example. [Modes for carrying out the invention]

[0038] The following descriptions of each embodiment will be made with reference to the drawings. However, unnecessarily detailed explanations may be omitted. For example, detailed explanations of already well-known matters and redundant explanations of substantially identical configurations may be omitted. This is to avoid the following explanation becoming unnecessarily verbose and to facilitate understanding for those skilled in the art.

[0039] Figure 1 is a schematic diagram of the molding machine in this embodiment. The molding machine 1 in this embodiment is a machine that melts and molds resin, and as an example, it is an injection molding machine that makes various plastic products by pouring molten resin (plastic) into a mold, cooling and solidifying it, and then removing it. The molding machine 1 has an injection unit 10 for melting the resin material with heat and injecting it into the mold, a clamping unit 20 for opening and closing the mold 21, a bed 30 that supports the injection unit 10 and the clamping unit 20, and a control device 4 for controlling the clamping unit 20 and the injection unit 10 according to the molding conditions. The molding conditions include, for example, the injection speed when injecting the resin into the mold, the VP switching position which is the tip position of the screw 13 that switches from speed control to pressure control, the holding pressure in injection molding, the holding pressure time which is the time for applying the holding pressure in injection molding, the metering position, and the resin temperature which is the temperature of the molten resin. Here, the holding pressure is the pressure applied to the gate after the entire cavity has been filled with molten resin, until the gate solidifies at a constant pressure to prevent the resin from flowing back out. The metering position is the position where the screw 13 meters the volume of resin required for injection molding (specifically, for example, the tip position of the screw 13 after metering the resin for one shot).

[0040] As shown in Figure 1, the injection unit 10 includes a cylinder 11, a hopper 12, a screw 13, a nozzle 16, a heater (not shown), a drive unit 17, etc. The cylinder 11 is, for example, mounted to be movable in the axial direction relative to the bed 30. The hopper 12 is the input port for pellets (molding material in granular form) and is in communication with the cylinder 11. The screw 13 is located inside the cylinder 11 and is mounted to be rotatable and movable in the axial direction. The nozzle 16 is the injection part located at the tip of the cylinder 11 and supplies the resin molten inside the cylinder 11 to the cavity of the mold 21 by the axial movement of the screw 13. The drive unit 17 is, for example, a motor and moves the screw 13 in the axial direction.

[0041] The mold clamping unit 20 performs the opening and closing operation of the installed mold 21, and when the mold 21 is clamped, it prevents the mold 21 from opening due to the pressure of the molten resin injected into the cavity (molded product part) of the mold 21.

[0042] As shown in Figure 1, the molding machine 1 is equipped with a nozzle pressure sensor 31 for detecting the resin pressure in the nozzle 16 (hereinafter also referred to as nozzle resin pressure) and a nozzle resin temperature sensor 32 for detecting the resin temperature in the nozzle 16 (hereinafter also referred to as nozzle resin temperature). The molding machine 1 also has a load cell 33, which is an example of a pressure sensor for detecting injection pressure, installed on the end side of the screw 13.

[0043] The nozzle pressure sensor 31 sends the detected nozzle resin pressure data to the control device 4 via the instrumentation amplifier 2a, A / D converter 3a, etc., which serve as data acquisition units. Similarly, the nozzle resin temperature sensor 32 sends the detected nozzle resin temperature data to the control device 4 via the instrumentation amplifier 2b, A / D converter 3b, etc., which act as data acquisition units. Similarly, the load cell 33 sends the detected injection pressure data to the control device 4 via the instrumentation amplifier 2c, A / D converter 3c, etc., which act as data acquisition units.

[0044] The molding system 100 according to this embodiment includes, in addition to the molding machine 1 described above, an information processing system 5 connected to the control device 4 via a communication network CN, and a display device 6 connected to the output of the information processing system 5. The display device 6 displays based on the video signal output from the information processing system 5. Nozzle resin pressure data, nozzle resin temperature data, and injection pressure data are transmitted from the control device 4 to the information processing system 5. As a result, the information processing system 5 acquires the nozzle resin pressure data, nozzle resin temperature data, and injection pressure data. The information processing system 5 is an example of an information processing system for the molding conditions of a molding machine that melts and molds resin.

[0045] Figure 2 is a block diagram illustrating the schematic configuration of an information processing system. As shown in Figure 2, the information processing system 5 comprises an input interface 51, a communication module 52, a storage device 53, memory 54, an output interface 55, and a processor 56. Note that there may be more than one processor 56, and the information processing system 5 only needs to have at least one processor. The input interface 51 receives data from, for example, a user or an external device of the information processing system 5. The communication module 52 communicates with the control device 4, for example, by wire or wireless connection. Memory 54 temporarily stores information. The output interface 55 outputs a video signal to the display device 6, for example.

[0046] The storage device 53 stores a program that the processor 56 reads and executes. The storage device 53 also stores the type of resin, the physical properties of the resin, and the molding conditions in association with each other. Figure 3 is an example of a database table stored in the storage device. In table T1 of Figure 3, records of combinations of resin type, resin physical properties, and molding conditions are stored. Here, the resin physical properties include, as an example, at least one viscosity model parameter, and preferably multiple viscosity model parameters.

[0047] Returning to Figure 2, the processor 56 performs the following steps: estimate the physical properties of a target resin whose physical properties are at least partially unknown (for example, physical properties that affect molding); and refer to the storage device 53 to obtain molding conditions for a resin with physical properties similar to the estimated physical properties according to predetermined criteria.

[0048] In one embodiment, the physical properties of the resin stored in the memory device 53 and the estimated physical properties (e.g., properties affecting molding) include, for example, information regarding the viscosity of the resin and / or "a combination of the pressure of the resin, the volume of the resin, and the temperature of the resin." In this case, in the procedure for estimating the physical properties, the processor 56 may estimate information regarding resin viscosity as the physical properties of the target resin. Alternatively, the processor 56 may estimate a combination of resin pressure, resin volume, and resin temperature as the physical properties of the target resin. Then, in the procedure for obtaining the molding conditions, the processor 56 may refer to the storage device 53 and obtain molding conditions for a resin with similar physical properties (specifically, information regarding resin viscosity) to the estimated information regarding resin viscosity, according to a predetermined standard. Alternatively, the processor 56 may obtain molding conditions for a resin with similar physical properties (specifically, a combination of resin pressure, resin volume, and resin temperature) to a combination of resin pressure, resin volume, and resin temperature, according to a predetermined standard. As a result, even if at least some of the physical properties of a resin are unknown, molding conditions for a resin with similar physical properties can be obtained according to a predetermined standard, and these molding conditions for a resin with similar physical properties can be used for molding, thereby facilitating the molding process.

[0049] In one embodiment, the processor 56 performs a procedure to output information for presenting the acquired molding conditions (e.g., display or audio output). As a result, the molding conditions are presented, for example, by displaying this information on the display device 6. With this configuration, even if the resin has at least some unknown physical properties, the molding conditions of a resin with similar moldability are presented, which can be used as a reference when determining the molding conditions. Therefore, it is possible to facilitate molding using a resin with at least some unknown physical properties.

[0050] In one embodiment, the processor 56 performs a procedure to determine the molding conditions of the target resin using the acquired molding conditions. Specifically, the processor 56 may determine the acquired molding conditions as the molding conditions of the target resin, or it may determine the molding conditions of the target resin according to predetermined rules for the acquired molding conditions. As a specific example, if the processor 56 acquires multiple molding conditions with similar physical properties according to predetermined criteria, it may determine the molding conditions of the target resin by averaging the multiple molding conditions. This makes it possible to automatically determine the molding conditions even if the target resin has at least some unknown physical properties. Therefore, it is possible to facilitate molding using a resin with at least some unknown physical properties. In this case, the control device 4 may, for example, control the molding machine 1 according to the determined molding conditions.

[0051] In one embodiment, the information relating to the resin viscosity is at least one viscosity model parameter determined using a plurality of resin viscosities and corresponding plurality of shear rates under a plurality of measurement conditions, wherein the measurement conditions are determined by a combination of one or more physical quantities selected from the resin temperature, resin pressure, and shear rate. In this case, for example, the processor 56, in the procedure for estimating the physical properties, determines a plurality of resin viscosities based on the difference between the pressure at multiple time points and the corresponding injection pressure at multiple time points, obtained by a pressure sensor (e.g., nozzle pressure sensor 31) located in the nozzle 16, cylinder 11, or mold 21 of the molding machine 1, and estimates at least one viscosity model parameter determined using the plurality of resin viscosities and the corresponding plurality of shear rates as information regarding the resin viscosity. This allows us to estimate at least one viscosity model parameter as information about resin viscosity by using the difference between the pressure at multiple time points and the corresponding injection pressure at multiple time points.

[0052] Here, the pressure at multiple time points used to estimate the resin viscosity may be obtained from time-series data of the pressure acquired by the pressure sensor (e.g., nozzle pressure sensor 31) extracted for each molding cycle.

[0053] In another embodiment, the information relating to the resin viscosity may be one or more resin viscosities under one or more measurement conditions, the measurement conditions being determined by a combination of one or more physical quantities selected from the resin temperature, resin pressure, and shear rate. In this case, for example, the processor 56 may, in the procedure for estimating the physical properties, use the difference between the resin pressure and the injection pressure obtained by a pressure sensor (e.g., nozzle pressure sensor 31) located in the nozzle 16, cylinder 11, or mold 21 of the molding machine 1 to estimate one or more resin viscosities corresponding to one or more measurement conditions as information regarding the resin viscosity. This allows us to estimate information about the resin viscosity using the difference between the resin pressure and the injection pressure.

[0054] <Specific example of viscosity model parameter estimation process> Next, we will explain a specific example of the process for estimating viscosity model parameters. (Step S1) The processor 56 calculates a conversion value for resin viscosity from the difference between the nozzle resin pressure and the injection pressure, for example, according to the following formula.

[0055]

number

[0056] Here, η is the resin viscosity (Pa·S), ΔP is the difference between the nozzle resin pressure and the injection pressure, B is the flow path width of the cylinder 11, H is the flow path height of the cylinder 11, L is the distance between the pressure sensors (for example, the distance between the nozzle pressure sensor 31 and the load cell 33), and Q is the resin flow rate. The resin flow rate Q may be detected by, for example, a flow sensor.

[0057] (Step S2) The processor 56 calculates a converted value of the shear rate using the resin flow rate Q, for example, according to the following formula. Note that the resin flow rate Q may be converted by another method.

[0058]

number

[0059] Here,

number

[0060] (Step S3) The processor 56 calculates, for example, the parameters of the Cross-WLF model during molding (e.g., during continuous molding) as viscosity model parameters. As a result, since the resin viscosity and shear rate fluctuate during molding, the parameters of the Cross-WLF model for multiple resin viscosities and corresponding multiple shear rates are calculated as viscosity model parameters.

[0061] In the Cross-WLF model, the resin viscosity η is expressed by the following equation.

[0062]

number

[0063] Here, τ * n is the critical stress level at the transition point to low viscosity due to shear, determined by curve fitting, and is one of the viscosity model parameters. n is the power law exponent at high shear rates, determined by curve fitting, and may also be one of the viscosity model parameters. Here, η0 in the denominator of the above equation is zero shear viscosity, and is expressed by the following equation.

[0064]

number

[0065] Here, T is the temperature (K). * This is the glass transition temperature, determined by curve fitting, and can also be used as one of the viscosity model parameters. D1 and A1 are data fitting coefficients and may also be considered as one of the viscosity model parameters. Here, the coefficient A2 varies with pressure p and is expressed by the following equation.

[0066]

number

[0067] Here,

number

[0068] Glass transition temperature T * It varies with pressure p and is calculated using the following formula.

[0069]

number

[0070] Here, D2 is a data fitting coefficient and may also be one of the viscosity model parameters.

[0071] The information regarding the resin viscosity estimated here includes, for example, viscosity model parameters D1 and A 1、 τ * 、 n, D2, D3,

number

[0072] Here, if the physical properties of the resin stored in the memory device 53 include at least one viscosity model parameter, the processor 56 refers to the memory device 53 and obtains molding conditions for a resin having a set of viscosity parameters similar to the set of viscosity parameters estimated for the target resin, according to a predetermined criterion. Specifically, for example, the processor 56 may refer to the memory device 53 and compare a vector composed of at least one viscosity model parameter (for example, a vector with the above seven parameters as elements) between the target resin and the resin types stored in table T1 of the memory device 53, and obtain the molding conditions for a resin type that is close according to a predetermined criterion (for example, Euclidean distance, Mahalanobis distance, etc.). Here, being close according to a predetermined criterion is an example of being similar according to a predetermined criterion, but being close according to a predetermined criterion may mean, for example, that the Euclidean distance between the vectors is less than or equal to a predetermined threshold, or that the Euclidean distance between the vectors is the shortest, or that the Euclidean distance between the vectors is the shortest among those whose Euclidean distance is less than or equal to a predetermined threshold. Furthermore, "close" according to this predetermined criterion may mean that the Mahalanobis distance between vectors is below a predetermined threshold, or it may mean that the Mahalanobis distance between vectors is the shortest, or it may mean that among the Mahalanobis distances below the predetermined threshold, the Mahalanobis distance between vectors is the shortest. This makes it possible to obtain molding conditions for a resin having a viscosity parameter group similar to the viscosity parameter group estimated for the target resin, according to a predetermined criterion.

[0073] As described above, the information processing system according to this embodiment is an information processing system for molding conditions of a molding machine that melts and molds resin, and includes a processor 56 as at least one processor that can refer to a storage device in which the type of resin, the physical properties of the resin, and the molding conditions are stored in association. The processor 56 performs a procedure for estimating the physical properties of a target resin whose physical properties are at least partially unknown, and a procedure for obtaining molding conditions for a resin with physical properties similar to the estimated physical properties according to a predetermined standard by referring to the storage device 53.

[0074] With this configuration, even if the resin has some unknown physical properties, molding conditions for a resin with similar physical properties can be obtained according to predetermined standards. Since these molding conditions for a resin with similar physical properties can be used for molding, the molding process can be made easier.

[0075] In another embodiment described above, the processor 56 may, for example, estimate one or more resin viscosities corresponding to one or more measurement conditions as information regarding the resin viscosity according to the formula in Equation 1 above. As a specific example, the processor 56 may, for example, apply the difference ΔP between the injection pressure and the nozzle resin pressure at one or more time points to the formula in Equation 1 above to calculate the resin viscosity at one or more time points as information regarding the resin viscosity. In other embodiments, the physical properties of the resin stored in the memory device 53 and the estimated physical properties (for example, physical properties that affect molding) may include, for example, information regarding the viscosity of the resin, a combination of the pressure of the resin, the volume of the resin, and the temperature of the resin, specific heat, and thermal conductivity.

[0076] <Variation> In this embodiment, the information processing system 5 performs a procedure to estimate the physical properties of a target resin whose physical properties are at least partially unknown, and a procedure to obtain molding conditions for a resin with physical properties similar to the estimated physical properties according to predetermined criteria by referring to the storage device, but is not limited to this. The control device 4 may also perform these procedures of the information processing system 5. In one embodiment, the control device 4 may perform a procedure to output information for presenting the acquired molding conditions. In another embodiment, the control device 4 may perform a procedure to determine the molding conditions of the target resin using the acquired molding conditions. In this case, the control device 4 may control the molding machine 1 according to the determined molding conditions.

[0077] <Examples> Next, one embodiment of the example will be described. In this embodiment, the viscosity of a new lot is calculated using pressure and temperature waveform data obtained from the in-mold sensor and the molding machine 1, thereby addressing variations between lots and between purges. Time-series data of pressure and temperature are collected from multiple shots (for example, a total of 9 shots with 3 different temperatures and 3 different injection velocities) or a purge operation. The processor 56 calculates the shear rate for each of the multiple shots according to the following formula.

[0078]

number

[0079] Here, v is the ejection velocity, D screw d is the diameter of the screw, nozzle This is the diameter of the nozzle. The processor 56 calculates viscosity at various shear rates and temperatures. Specifically, it measures the pressure loss ΔP at a known pressure measurement distance L within a slit die (flow between parallel plates). Here, the shape of the slit die is given by width W, gap (gap height) H, length (pressure measurement distance) L, and volumetric flow rate Q. The processor calculates viscosity η by substituting the measured pressure loss ΔP into the following fluid dynamics equation, for example.

[0080]

number

[0081] For example, processor 56 determines the seven viscosity parameters of the Cross-WLF model using a global optimization method. Here, global optimization methods include Differential Evolution and Simulated Annealing.

[0082] Figures 4 to 6 illustrate an example of the screen displayed on the display device 6 in the embodiment. Figure 4 shows an example of the data upload screen in the embodiment. In screen G1 of Figure 4, radio buttons R1 are displayed, allowing the user to choose whether to select the viscosity parameters of the target resin (e.g., a new lot) from the uploaded data or to manually input the viscosity parameters. In addition, a screen area R2 is set on screen G1 where the uploaded data can be dragged and dropped, and time-series data of pressure and temperature can be uploaded.

[0083] Figure 5 shows an example of a screen displaying the results of determining viscosity parameters in an example. Screen G2 in Figure 5 shows the viscosity parameters calculated by Differential Evolution and the viscosity parameters calculated by Simulated Annealing. The RMSE (Root Mean Squared Error) and RMSLE (Root Mean Squared Logarithmic Error) for each are also shown. Here, RMSLE is an index that calculates the RMSE (Root Mean Squared Error) after logarithmically transforming the predicted value and the actual value. The optimal set of viscosity parameters used for prediction is also displayed.

[0084] To generate screen G2 in Figure 5, the processor 56, for example, calculates the error between the model values ​​and the measured values ​​of the Cross-WLF model using differential evolution and simulated annealing. Then, the processor 56 selects the solution with the smaller RMSLE (Root Mean Squared Logarithmic Error) as the optimal solution, and determines the viscosity parameter set of that optimal solution (specifically, for example, the seven viscosity parameters mentioned above) as the viscosity parameter set of the Cross-WLF model.

[0085] Thus, the processor 56 may determine a set of viscosity parameters as a set of estimated parameters based on time-series data of pressure and temperature under conditions determined by multiple combinations of temperature and injection speed for the target resin. With this configuration, a set of viscosity parameters can be determined as a set of estimated parameters for the target resin, and the viscosity of the target resin can be predicted.

[0086] Figure 6 shows an example of a screen displaying predicted viscosity values ​​in an embodiment. In screen G3 of Figure 6, the injection speed specified by the user is displayed in screen area R31. Also in screen G3, the viscosity of a comparison resin (e.g., the nearest known lot) is displayed in screen area R32. Also in screen G3, the predicted viscosity of the target resin (e.g., a new polymer lot) is displayed in screen area R33.

[0087] Furthermore, on screen G3, the graph displays curve C31 showing the relationship between the shear rate and viscosity of a comparison resin (e.g., the nearest known lot), and curve C32 showing the relationship between the shear rate and viscosity of the target resin. Also on screen G3, a screen area R34 is displayed that shows the identification information of the nearest known lot. Additionally, on screen G3, a box R35 for setting the temperature and a box R36 for setting the injection speed R36 are displayed.

[0088] Here, the processor 56 may, for example, compare with multiple sets of viscosity parameters stored in the memory device 53 and obtain a set of viscosity parameters that are similar according to a predetermined criterion as the set of comparison parameters. Specifically, the processor 56 may, for example, identify the comparison resin (e.g., a known polymer lot) that is closest to the target resin (e.g., a new polymer lot) in the manifold space within the database of the memory device 53. Specifically, the processor 56 may, for example, calculate the distance between the seven viscosity parameters of the target resin as a seven-dimensional vector and each of the seven viscosity parameters of each known resin stored in the database, and determine the known resin corresponding to the seven-dimensional vector with the closest distance as the comparison resin.

[0089] The processor 56 may also output information for displaying the viscosity-shear rate curves (e.g., curve C31 and curve C32) of both lots as plots. The processor 56 may also calculate the viscosity corresponding to the changed temperature and / or injection speed according to equation 4, for example. Here, if the temperature and / or injection speed are specified or changed by the user, the processor 56 applies the seven viscosity parameters described above to the Cross-WLF model to determine a predicted viscosity at the temperature and / or injection speed (or shear speed) specified or changed by the user. Specifically, the processor 56 may, for example, apply the injection speed to equation 10 to determine the shear speed, and then apply this shear speed to equation 4 to calculate a predicted viscosity. The processor 56 may then update the display with the calculated predicted viscosity.

[0090] Furthermore, if the temperature and / or injection speed are specified or changed by the user, the processor 56 may calculate the viscosity at each shear rate for both lots according to Equation 4 and update the viscosity-shear rate curve with the calculated viscosity. This updates the viscosity-shear rate curve in real time.

[0091] Thus, the processor 56 may, for example, determine the viscosity of the target resin based on the temperature and / or injection speed input by the user and the estimated target parameter group, and output information to present the viscosity of the target resin. With this configuration, the viscosity of the target resin can be presented, and the viscosity of the target resin can be understood. In this case, the processor 56 may, for example, output information to present the viscosity of the target resin and the viscosity of the comparison resin in a comparable manner, and / or information to present a graph for comparing the viscosity of the target resin and the comparison resin, based on the estimated target parameter group and the comparison target parameter group. With this configuration, the viscosity of the target resin and the viscosity of the comparison resin are presented in a comparable manner, or further / or a graph for comparing the viscosity of the target resin and the comparison resin is presented, so that the target resin and the comparison resin can be easily compared.

[0092] Furthermore, on screen G3, a slider R37 for setting the allowable variation range is displayed. Once this allowable variation range is set, the processor 56 calculates the lower and upper limits of the target resin temperature and the lower and upper limits of the injection temperature so that the viscosity falls within the allowable variation range (e.g., 10%) based on the viscosity of the comparison resin, and displays these values ​​in screen area R38. Also in screen area R38, the processor 56 calculates and displays the median temperature of the target resin and the median injection temperature when the viscosity falls within the allowable variation range (e.g., 10%) based on the viscosity of the comparison resin.

[0093] Thus, the processor 56 may, for example, apply the determined estimated parameter set to a predetermined calculation method (e.g., formula 4) to determine the allowable range of temperature and / or injection speed in which the viscosity falls within the allowable variation range specified by the user, based on the viscosity of the comparison resin, and output information to present the determined allowable range of temperature and / or injection speed. With this configuration, the user can easily grasp the allowable range of temperature and / or injection speed.

[0094] Here, the viscosity is set to fall within the allowable variation range specified by the user, based on the "viscosity of the comparison resin," but this is not the only option. The reference point may be the "viscosity specified by the user" instead of the "viscosity of the comparison resin." In this case, the processor 56 may, for example, apply the determined estimated target parameter group to a predetermined calculation method (e.g., formula 4) to determine the allowable range of temperature and / or injection speed in which the viscosity falls within the allowable variation range specified by the user, based on the viscosity specified by the user, and output information to present the determined allowable range of temperature and / or injection speed. With this configuration, the user can easily grasp the allowable range of temperature and / or injection speed.

[0095] Furthermore, at least a part of the information processing system 5 described in the above-described embodiment may be configured as hardware or as software. In the case of software configuration, a program that implements at least a part of the functions of the information processing system 5 may be stored on a computer-readable recording medium and loaded and executed by a computer. The recording medium is not limited to removable ones such as magnetic disks or optical disks, but may also be a fixed recording medium such as a hard disk drive or memory.

[0096] Furthermore, a program that implements at least some of the functions of the information processing system 5 may be distributed via communication lines such as the Internet (including wireless communication). In addition, the program may be encrypted, modulated, or compressed and distributed via wired or wireless lines such as the Internet, or stored on a recording medium.

[0097] Furthermore, the information processing system 5 may be made to function using one or more information devices. When multiple information devices are used, at least one of them may be a computer, and the computer may execute a predetermined program to realize the function of at least one means of the information processing system 5.

[0098] Furthermore, in the invention of a method, all steps may be automatically controlled by a computer. Alternatively, each step may be performed by a computer while the progress between steps is controlled manually. Furthermore, at least a portion of all steps may be performed manually.

[0099] As described above, the present invention is not limited to the embodiments described above, and the components can be modified and implemented in practice without departing from the spirit of the invention. Furthermore, various inventions can be formed by appropriately combining the multiple components disclosed in the above embodiments. For example, some components may be deleted from all the components shown in the embodiments. Moreover, components from different embodiments may be appropriately combined. [Explanation of Symbols]

[0100] 1 Molding machine 10 Injection Units 100 Molding Systems 11 cylinders 12 Hoppers 13. Screw 16 nozzles 17 Drive unit 100 Molding Systems 20-type clamping unit 21 molds 2a, 2b, 2c Instrumentation Amplifiers 3a, 3b, 3c A / D converters 31 Nozzle pressure sensor 32. Resin temperature sensor for nozzles 33 load cells 4. Control device 5. Information Processing Systems 51 Input Interfaces 52 Communication Module 53 Storage device 54 memory 55 Output Interfaces 56 processors 6 Display device

Claims

1. A system for processing information regarding the molding conditions of a molding machine that melts and molds resin. The system includes at least one processor capable of referencing a storage device in which the type of resin, the physical properties of the resin, and the molding conditions are stored in association, The at least one processor is A procedure for estimating the physical properties of a target resin whose physical properties are at least partially unknown, A procedure for obtaining molding conditions for a resin with physical properties similar to the estimated physical properties according to predetermined standards by referring to the storage device, An information processing system that performs [this action].

2. The physical properties of the resin stored in the memory device and the estimated physical properties include information regarding the viscosity of the resin, and / or a combination of the pressure of the resin, the volume of the resin, and the temperature of the resin. In the procedure for estimating the aforementioned physical properties, the processor estimates information regarding the viscosity of the resin, and / or a combination of the pressure of the resin, the volume of the resin, and the temperature of the resin as the physical properties of the target resin. In the procedure for obtaining the molding conditions, the processor refers to the memory device and obtains information about the estimated resin viscosity and / or molding conditions for a resin with similar physical properties to the combination of resin pressure, resin volume, and resin temperature, according to a predetermined standard. The information processing system according to claim 1.

3. The information relating to the resin viscosity is at least one viscosity model parameter determined using multiple resin viscosities under multiple measurement conditions and corresponding multiple shear rates. The aforementioned measurement conditions are determined by a combination of one or more physical quantities selected from the resin temperature, resin pressure, and shear rate. In the procedure for estimating the physical properties, the processor determines multiple resin viscosities using the difference between the pressure at multiple time points obtained by a pressure sensor placed in the nozzle, cylinder, or mold of the molding machine and the corresponding injection pressure at multiple time points, and estimates at least one viscosity model parameter determined using the multiple resin viscosities and the corresponding multiple shear rates as information regarding the resin viscosity. The physical properties of the resin stored in the memory device include at least one viscosity model parameter, In the procedure for acquiring the molding conditions, the processor refers to the storage device and acquires molding conditions for a resin having a set of viscosity parameters similar to the set of viscosity parameters estimated for the target resin, according to a predetermined criterion. The information processing system according to claim 2.

4. The pressure data at multiple time points used to estimate the resin viscosity is obtained from time-series data of the pressure acquired by the pressure sensor, extracted for each molding cycle. The information processing system according to claim 3.

5. The information relating to the resin viscosity is the viscosity of one or more resins under one or more measurement conditions. The aforementioned measurement conditions are determined by a combination of one or more physical quantities selected from the resin temperature, resin pressure, and shear rate. In the procedure for estimating the physical properties, the processor uses the difference between the resin pressure and injection pressure obtained by a pressure sensor located in the nozzle, cylinder, or mold of the molding machine to estimate one or more resin viscosities corresponding to one or more measurement conditions as information regarding the resin viscosity. The information processing system according to claim 2.

6. The at least one processor performs a procedure to output information for presenting the acquired molding conditions. The information processing system according to any one of claims 1 to 5.

7. The at least one processor performs a procedure to determine the molding conditions for the target resin using the acquired molding conditions. The information processing system according to any one of claims 1 to 5.

8. The at least one processor is Based on time-series data of pressure and temperature under conditions determined by multiple temperature and injection velocity combinations for the target resin, a set of viscosity parameters is determined as the set of parameters to be estimated. The information processing system according to any one of claims 1 to 5.

9. The at least one processor is Based on the temperature and / or injection speed entered by the user and the estimated target parameters, the viscosity of the target resin is determined, and information for presenting the viscosity of the target resin is output. The information processing system according to claim 8.

10. The at least one processor is By comparing multiple viscosity parameter sets stored in the memory device, a set of viscosity parameters similar to those determined by a predetermined criterion is obtained as the comparison parameter set. Based on the estimated target parameter group and the comparison target parameter group, the system outputs information to present the viscosity of the target resin and the viscosity of the comparison resin in a comparable manner, and / or information to present a graph comparing the viscosity of the target resin and the comparison resin. The information processing system according to claim 8.

11. The at least one processor is By comparing multiple viscosity parameter sets stored in the memory device, a set of viscosity parameters similar to those determined by a predetermined criterion is obtained as the comparison parameter set. The determined set of estimated parameters is applied to a predetermined calculation method to determine the allowable range of temperature and / or injection speed within which the viscosity falls within the allowable variation range specified by the user, based on the viscosity of the comparison resin. Information is then output to present the determined allowable range of temperature and / or injection speed. The information processing system according to claim 8.

12. The at least one processor is The determined set of estimated parameters is applied to a predetermined calculation method to determine the permissible range of temperature and / or injection speed within which the viscosity falls within the permissible variation range specified by the user, based on the viscosity specified by the user. Information is then output to present the determined permissible range of temperature and / or injection speed. The information processing system according to claim 8.

13. A control device for controlling a molding machine that melts and molds resin, The system includes at least one processor capable of referencing a storage device in which the type of resin, the physical properties of the resin, and the molding conditions are stored in association, The at least one processor is A procedure for estimating the physical properties of a target resin whose physical properties are at least partially unknown, A procedure for obtaining molding conditions for a resin with physical properties similar to the estimated physical properties according to predetermined standards by referring to the storage device, A control device that performs this operation.

14. A molding machine that melts and molds resin, A molding machine having the control device described in claim 13.

15. An information processing method performed by an information processing system that can refer to a storage device in which the type of resin, the physical properties of the resin, and the molding conditions are stored in association, The estimation method is a procedure for estimating the physical properties of a target resin whose physical properties are at least partially unknown, The acquisition means includes a procedure for obtaining molding conditions for a resin with physical properties similar to the estimated physical properties according to a predetermined standard by referring to the storage device, An information processing method having

16. A computer that can access a storage device in which the type of resin, the physical properties of the resin, and the molding conditions are stored in association, A procedure for estimating the physical properties of a target resin whose physical properties are at least partially unknown. A procedure for obtaining molding conditions for a resin with physical properties similar to the estimated physical properties according to predetermined standards, by referring to the storage device, A program to execute.

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