Transparent display module and method for manufacturing the same

Abstract

We provide transparent display modules. [Solution] A transparent display module comprising: a transparent substrate having opposing first and second surfaces; a light-emitting diode element provided on the first surface; a first protective layer connected to the first surface and having a light-emitting diode element embedded therein; a wiring structure connected to the second surface; an integrated circuit element provided on a surface of the wiring structure away from the transparent substrate; and a second protective layer connected to the surface of the wiring structure and having an integrated circuit element embedded therein. Thus, with a specific structural arrangement, the transparent display module can have good transparency.

Description

Technical Field

[0001] The present disclosure relates to a display module and a manufacturing method therefor, and in particular, to a transparent display module having good transparency and a manufacturing method therefor.

Background Art

[0002] A conventional display module electrically connects a light-emitting diode element and an integrated circuit element, thereby achieving the effect of controlling light emission of the light-emitting diode element. In the conventional display module, wiring is arranged on a surface of a substrate to form a circuit structure between the light-emitting diode element and the integrated circuit element. However, even when a transparent substrate is used for the display module, the circuit structure blocks light from transmitting through the display module, resulting in poor transparency of the display module. Therefore, the conventional display module is not suitable for applications requiring high transparency, such as glass outer walls and exhibition show windows.

Summary of the Invention

Problem to be Solved by the Invention

[0003] An object of the present disclosure is to provide a display module and a manufacturing method therefor that improve the effect of light transmitting through the transparent display module by means of a specific structural arrangement.

Means for Solving the Problem

[0004] One embodiment of the present disclosure provides a transparent display module comprising: a transparent substrate having a first surface and a second surface facing each other and including a first line structure penetrating from the first surface to the second surface, and a second line structure provided on the first surface; a plurality of light-emitting diode elements provided on the first surface and electrically connected to the first line structure and the second line structure; a first protective layer connected to the first surface and having light-emitting diode elements embedded therein; a wiring structure including a third line structure connected to the second surface and electrically connected to the first line structure such that the transparent substrate is located between the first protective layer and the wiring structure; a plurality of integrated circuit elements provided on a surface of the wiring structure away from the transparent substrate and electrically connected to the third line structure; and a second protective layer connected to the surface of the wiring structure and having integrated circuit elements embedded therein such that the wiring structure is located between the wiring structure and the transparent substrate.

[0005] According to the transparent display module, the first transmission line structure includes a plurality of conductive pads, and the light-emitting diode elements may be electrically connected to the first transmission line structure via the conductive pads.

[0006] According to the transparent display module, the number of conductive pads may be 1 to 4 times the number of light-emitting diode elements.

[0007] According to the transparent display module, the second line structure may be arranged in a mesh-like or linear pattern on the first surface.

[0008] According to the transparent display module, the second line structure may include a plurality of conductors having a width of 10 μm to 100 μm.

[0009] Another embodiment of the present disclosure provides a method for manufacturing a transparent display module, comprising the steps of: forming a first line structure penetrating from the first surface to the second surface and a second line structure provided on the first surface on a transparent substrate having opposing first and second surfaces; forming a wiring structure on the second surface including a third line structure electrically connected to the first line structure; providing a plurality of light-emitting diode elements on the first surface so as to be electrically connected to the first line structure and the second line structure; providing a plurality of integrated circuit elements on a surface of the wiring structure away from the transparent substrate so as to be electrically connected to the third line structure; forming a first protective layer on the first surface, embedding the light-emitting diode elements in the first protective layer, and positioning the transparent substrate between the first protective layer and the wiring structure; and forming a second protective layer on the surface of the wiring structure, positioning the wiring structure between the transparent substrate and the second protective layer, and embedding the integrated circuit elements in the second protective layer to obtain a transparent display module.

[0010] In the method for manufacturing the transparent display module, the first transmission line structure may include a plurality of conductive pads, and the light-emitting diode elements may be electrically connected to the first transmission line structure via the conductive pads.

[0011] In the method for manufacturing the transparent display module, the number of conductive pads may be 1 to 4 times the number of light-emitting diode elements.

[0012] In the method for manufacturing the transparent display module, the second line structure may be arranged in a mesh-like or linear pattern on the first surface.

[0013] In the method for manufacturing the transparent display module, the second line structure may include a plurality of conductors having a width of 10 μm to 100 μm. [Effects of the Invention]

[0014] Accordingly, the transparent display module and its manufacturing method according to this disclosure provide good transparency to the transparent display module by providing a transparent substrate, a first protective layer, a wiring structure, and a second protective layer, and by using the first line structure, the second line structure, and the third line structure to perform electrical arrangement. [Brief explanation of the drawing]

[0015] [Figure 1] This is a schematic top view of a transparent display module according to one embodiment of the present disclosure. [Figure 2] Figure 1 is a schematic cross-sectional view of the transparent display module along line 2-2. [Figure 3] This is a process flowchart of a method for manufacturing a transparent display module according to one embodiment of the present disclosure. [Modes for carrying out the invention]

[0016] The embodiments of this disclosure will be described in more detail below. However, these embodiments may be applications of various concepts of the disclosure and may be specifically implemented within a variety of different specific scopes. Specific embodiments are for illustrative purposes only and are not limited to the scope disclosed.

[0017] Furthermore, in order to simplify the drawings, some conventionally used structures and elements may be shown as simplified schematic diagrams in the drawings, and duplicate elements may be indicated by the same or similar numbers.

[0018] Please refer to Figure 1, a schematic top view of a transparent display module 100 according to one embodiment of the present disclosure, and Figure 2, a schematic cross-sectional view of the transparent display module 100 along line 2-2 of Figure 1. The transparent display module 100 comprises a transparent substrate 110, a plurality of light-emitting diode elements 120, a first protective layer 130, a wiring structure 140, a plurality of integrated circuit elements 150, and a second protective layer 160.

[0019] The transparent substrate 110 has opposing first surface 110a and second surface 110b, and includes a first line structure 111 and a second line structure 112. The first line structure 111 penetrates from the first surface 110a to the second surface 110b, and the second line structure 112 is provided on the first surface 110a. Accordingly, the first line structure 111 and the second line structure 112 can be used to separately transmit signals and currents so as not to interfere with each other, but the present disclosure is not limited thereto.

[0020] In detail, the transparent substrate 110 may be a through glass via (TGV) substrate, which has good light transmittance and is provided with a via hole for disposing the first line structure 111. However, the detailed structure and position of the first line structure 111 can be adjusted as needed, so the present invention does not limit these.

[0021] The second line structure 112 may be arranged in a mesh shape or a linear shape on the first surface 110a, or includes a plurality of conductive wires (not numbered) each having a width of 10 μm to 100 μm. By adjusting the arrangement or the wire width of the second line structure 112, the problem of light blocking caused by the second line structure 112 can be reduced, and further the transparency of the transparent display module 100 can be improved.

[0022] The light emitting diode element 120 is provided on the first surface 110a and is electrically connected to the first line structure 111 and the second line structure 112. By way of example, the first line structure 111 may include a plurality of conductive pads 111a, and the light emitting diode element 120 can be electrically connected to the first line structure 111 via the conductive pads 111a. Further, the number of the conductive pads 111a may be 1 to 4 times the number of the light emitting diode elements 120. Accordingly, the convenience of mounting the light emitting diode element 120 can be improved.

[0023] The first protective layer 130 is connected to the first surface 110a, and the light emitting diode element 120 is embedded therein. The first protective layer 130 may be made of a transparent packaging material so as not to affect the light emitting effect of the light emitting diode element 120 and provide good protection at the same time.

[0024] The wiring structure 140 is connected to the second surface 110b such that the transparent substrate 110 is positioned between the wiring structure 140 and the first protective layer 130, and includes a third line structure 141 electrically connected to the first line structure 111. Specifically, the wiring structure 140 may be a redistribution layer (RDL) structure, and the desired third line structure 141 can be formed by providing a patterned line layer, a via hole, and a dielectric layer, wherein the number and structure of the patterned line layer, via holes, and dielectric layers are determined as needed, and the present disclosure does not limit these.

[0025] The integrated circuit element 150 is disposed on a surface (not labeled) of the wiring structure 140 away from the transparent substrate 110, and is electrically connected to the third line structure 141, and may be a driving integrated circuit element or a control integrated circuit element, but the present disclosure is not limited thereto.

[0026] The second protective layer 160 is connected to said surface of the wiring structure 140 such that the wiring structure 140 is positioned between the second protective layer 160 and the transparent substrate 110, and the integrated circuit element 150 is embedded inside the second protective layer 160. The second protective layer 160 may be made of a transparent packaging material so as not to affect the overall transparency of the transparent display module 100 and provide good protection.

[0027] Please refer to FIG. 3, which is a process flow chart of a method 200 for manufacturing a transparent display module according to an embodiment of the present disclosure. The method 200 for manufacturing a transparent display module comprises step 210, step 220, step 230, step 240, step 250 and step 260.

[0028] Please refer to Figures 1 and 2. In step 210, a first line structure 111 penetrating from the first surface 110a to the second surface 110b, and a second line structure 112 provided on the first surface 110a are formed on a transparent substrate 110 having opposing first surface 110a and second surface 110b. Specifically, the first line structure 111 can be formed using via holes in the transparent substrate 110, and conductive pads 111a can be provided on the first surface 110a for later electrical connection. The second line structure 112 may be manufactured using printing technology and may be arranged in a mesh or linear pattern on the first surface 110a, but the disclosure is not limited to the above process or structure.

[0029] In step 220, a wiring structure 140 is formed on the second surface 110b, including a third line structure 141 that is electrically connected to the first line structure 111. The wiring structure 140 can be formed by repeatedly stacking patterned line layers and dielectric layers, and the number and structure of the patterned line layers and dielectric layers may be determined according to the type of elements that are electrically connected.

[0030] In step 230, the light-emitting diode element 120 is provided on the first surface 110a so as to be electrically connected to the first line structure 111 and the second line structure 112. As a result, the first line structure 111 and the second line structure 112 are used for signal transmission and current transmission, respectively, and mutual interference can be avoided.

[0031] In step 240, the integrated circuit element 150 is placed on a surface of the wiring structure 140 that is away from the transparent substrate 110, so that it is electrically connected to the third line structure 141. Because the integrated circuit element 150 has a large number of pins, placing the integrated circuit element 150 on the wiring structure 140 helps to adjust the third line structure 141 to match the pin distribution of the integrated circuit element 150, thereby completing the electrical connection of the integrated circuit element 150.

[0032] In step 250, a first protective layer 130 is formed on the first surface 110a, a light-emitting diode element 120 is embedded in the first protective layer 130, and the transparent substrate 110 is positioned between the first protective layer 130 and the wiring structure 140. In step 260, a second protective layer 160 is formed on the surface of the wiring structure 140, the wiring structure 140 is positioned between the transparent substrate 110 and the second protective layer 160, and the integrated circuit element 150 is embedded in the second protective layer 160 to obtain the transparent display module 100. Thus, the first protective layer 130 and the second protective layer 160 can provide good protection and may be manufactured from transparent packaging material so as not to affect the overall transparency of the transparent display module 100.

[0033] Of particular note is that the transparent substrate 110, light-emitting diode element 120, first protective layer 130, wiring structure 140, integrated circuit element 150, and second protective layer 160 manufactured by the transparent display module manufacturing method 200 all have the same or similar structure or dimensions as the transparent display module 100 described above, and therefore will not be explained again.

[0034] In summary, the transparent display module and its manufacturing method of the present disclosure provide good transparency by including a transparent substrate, a first protective layer, a wiring structure, and a second protective layer, and by using a first line structure, a second line structure, and a third line structure to perform electrical arrangement. Furthermore, the transparent display module of the present disclosure has a specific structural design, and the transparent display module can be cut and divided as needed to further improve its space utilization rate.

[0035] Although the present disclosure has been disclosed in the embodiments described above, these embodiments are not intended to limit the present disclosure, and any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present disclosure, and the scope of protection of the present disclosure should be based on the claims attached thereto. [Explanation of Symbols]

[0036] 100: Transparent display module 110: Transparent substrate 110a: 1st surface 110b: 2nd surface 111: 1st track structure 111a: Conductive pad 112:Second track structure 120: Light-emitting diode element 130: 1st protective layer 140:Wiring structure 141:Third track structure 150: Integrated Circuit Elements 160:Second protective layer 200: Method for manufacturing transparent display modules 210, 220, 230, 240, 250, 260: Process

Claims

1. A transparent substrate having a first surface and a second surface facing each other, and including a first line structure that penetrates from the first surface to the second surface, and a second line structure provided on the first surface, A plurality of light-emitting diode elements provided on the first surface and electrically connected to the first line structure and the second line structure, A first protective layer connected to the first surface and in which the plurality of light-emitting diode elements are embedded therein, A wiring structure including a third line structure connected to the second surface and electrically connected to the first line structure, such that the transparent substrate is positioned between it and the first protective layer, A plurality of integrated circuit elements are provided on a surface of the wiring structure that is away from the transparent substrate and are electrically connected to the third line structure, A second protective layer is provided, which is connected to the surface of the wiring structure and has the plurality of integrated circuit elements embedded within it, such that the wiring structure is positioned between it and the transparent substrate. A transparent display module including a transparent display module.

2. The transparent display module according to claim 1, wherein the first line structure includes a plurality of conductive pads, and the plurality of light-emitting diode elements are electrically connected to the first line structure via the plurality of conductive pads.

3. The transparent display module according to claim 2, wherein the number of the plurality of conductive pads is one to four times the number of the plurality of light-emitting diode elements.

4. The transparent display module according to claim 1, wherein the second line structure is arranged in a mesh-like or linear pattern on the first surface.

5. The transparent display module according to claim 1, wherein the second line structure includes a plurality of conductors having a width of 10 μm to 100 μm.

6. A step of forming a first line structure penetrating from the first surface to the second surface, and a second line structure provided on the first surface, on a transparent substrate having opposing first and second surfaces, The process of forming a wiring structure on the second surface, including a third line structure that is electrically connected to the first line structure, A step of providing multiple light-emitting diode elements on the first surface so as to be electrically connected to the first line structure and the second line structure, A step of providing multiple integrated circuit elements on a surface of the wiring structure away from the transparent substrate so as to be electrically connected to the third line structure, The steps include forming a first protective layer on the first surface, embedding the plurality of light-emitting diode elements within the first protective layer, and positioning the transparent substrate between the first protective layer and the wiring structure. A step of obtaining a transparent display module by forming a second protective layer on the surface of the wiring structure, positioning the wiring structure between the transparent substrate and the second protective layer, and embedding the plurality of integrated circuit elements within the second protective layer. A method for manufacturing a transparent display module equipped with [the specified feature].

7. The method for manufacturing a transparent display module according to claim 6, wherein the first line structure includes a plurality of conductive pads, and the plurality of light-emitting diode elements are electrically connected to the first line structure via the plurality of conductive pads.

8. The method for manufacturing a transparent display module according to claim 7, wherein the number of the plurality of conductive pads is one to four times the number of the plurality of light-emitting diode elements.

9. The method for manufacturing a transparent display module according to claim 6, wherein the second line structure is arranged in a mesh-like or linear pattern on the first surface.

10. The method for manufacturing a transparent display module according to claim 6, wherein the second line structure includes a plurality of conductors having a width of 10 μm to 100 μm.

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