electronic machinery

Abstract

To provide electronic devices with excellent portability. Or, to provide electronic devices with excellent overview. To provide electronic devices equipped with new input methods. [Solution] A configuration comprising a flexible display panel and two supports that support it. The two supports are connected by a connector. The display panel is fixed to one of the supports. It is fixed, and the other support is supported without being fixed, so as to slide in one direction. It is designed to do so. Furthermore, when the display panel slides, a detection device is provided that can detect the amount of displacement. Add a step.

Description

[Technical Field]

[0001] One aspect of the present invention relates to a display device, or to an electronic device equipped with a display device. In particular, relating to a flexible display device, or an electronic device equipped with a flexible display device. Regarding equipment.

[0002] Furthermore, one aspect of the present invention is not limited to the above-mentioned technical field. One aspect of the present invention relates to a product, method, or method of manufacture. Another aspect of the present invention relates to a process, machine , relating to manufacture or composition of matter. More specifically, one aspect of the technical field of the present invention disclosed herein is semiconductor equipment, Display devices, light-emitting devices, energy storage devices, memory devices, electronic devices, lighting devices, input devices, input / output devices Examples include their driving methods or their manufacturing methods.

[0003] In this specification, a semiconductor device is defined as a device that can function by utilizing semiconductor properties. This refers to all types of devices, including semiconductor elements such as transistors, semiconductor circuits, computing devices, and memory devices. The device is a form of semiconductor device. Examples include imaging devices, display devices, liquid crystal display devices, light-emitting devices, and electric devices. Optical devices, power generation devices (including thin-film solar cells, organic thin-film solar cells, etc.), and electronic equipment are subject to the following regulations: It may have a semiconductor device. [Background technology]

[0004] In recent years, display devices have been expected to have applications in a variety of fields, and their use is becoming increasingly diverse. For example, display devices used in portable electronic devices are thin and lightweight. They are required to be durable and resistant to damage, among other things. Furthermore, there is a demand for new and unprecedented applications. It is.

[0005] Furthermore, Patent Document 1 describes a film substrate on which a switching element such as a transistor and Flexible action with EL (Electro-Luminescence) element A dual-matrix type light-emitting device is disclosed. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2003-174153 [Overview of the project] [Problems that the invention aims to solve]

[0007] In recent years, the amount of information that can be displayed has increased by enlarging the display area of ​​the display device, and the list of displayed items has been expanded. Improvements to performance are being considered. On the other hand, for mobile device applications, the display area is being enlarged. This reduces portability. Achieving both improvement and high portability simultaneously proved difficult.

[0008] Furthermore, it is desirable that the display panel be equipped with input means as a user interface. For example, a display that adds a function to input by touching the screen with a finger or stylus. There is a device (touch panel).

[0009] One aspect of the present invention aims to provide an electronic device with excellent portability. One of the challenges is to provide electronic devices that offer excellent visibility. Alternatively, electronic devices that are less prone to damage. One of the objectives is to provide equipment, or to provide electronic equipment equipped with new input means. One of the tasks is to do the following.

[0010] Alternatively, one aspect of the present invention has an object to reduce the thickness of an electronic device. Or, an electr onic device is an object to reduce the weight of an electronic device. Alternatively, an object of one aspect of the present invention is to provide a novel electronic device .

[0011] Note that the description of these problems does not prevent the existence of other problems. One embodiment of the present invention is not required to solve all of these problems. Furthermore, other problems besides the above will be apparent from the description of the specification and the like, and it is possible to extract problems other than the above from the description of the specification and the like , and it is possible to extract other problems from the description of the specification and the like . Means for Solving the Problems

[0012] One embodiment of the present invention includes a first support, a second support, a connection portion, and a display panel , which is an electronic device. The display panel has a function capable of performing display in a folded state. The first support and the second support are connected by the connection portion, and the first support and the second support has a function of relatively rotating through the connection portion. The display panel is attached to the first support has a fixed portion and is supported by the second support so as to be movable in one direction relative to the second support , which is characterized in that.

[0013] Another embodiment of the present invention is an electronic device including a first support, a second support, a connection portion, a display pane l, and a detection unit. The display panel is capable of performing display in a folded state . The first support and the second support are connected by the connection portion, and the connection portion has a function of relatively rotating through the connection portion. The display panel is fixed to the first support Having a portion and being able to move in one direction relative to the second support, supported on the second support When the first support and the second support are held and rotated relative to each other, the relationship between the second support and It has a function that changes relative position. The detection means also determines the relative position between the display panel and the second support. It is characterized by having a function to detect position.

[0014] Furthermore, in the above, the detection means comprises a light-emitting element and a light-receiving element, and the light-emitting element and One of the light-emitting and light-receiving elements is fixedly mounted on the display panel, and the other of the light-emitting and light-receiving elements is The light-receiving element is fixed to a second support and has the function of detecting light emitted from a light-emitting element. It is preferable that it has

[0015] Alternatively, in the above, the detection means comprises a light-emitting element and a light-receiving element, The light-receiving element and the light-emitting element are each fixed to the second support, and the light-emitting element is a display panel It has a function to irradiate light onto a part of it, and the light-receiving element has a function to detect reflected light from the display panel. It is preferable that it has

[0016] Alternatively, in the above, the display panel has a display section and a non-display section, and the display section is the The device has one light-emitting element, and the detection means has a second light-emitting element and a light-receiving element, and the second light-emitting element The child is provided in the non-display section, and the light-receiving element is fixed to the second support, and the light-receiving element Preferably, it has the function of detecting light emitted from the second light-emitting element.

[0017] Furthermore, in the above, the display panel comprises the first support, the connecting part, and the second support, each It is preferable that the position does not overlap with the center position in the thickness direction of each element.

[0018] Furthermore, it is preferable that the above-mentioned connecting portion has an elastic body.

[0019] Furthermore, it is preferable that the above display panel also functions as a touch sensor. Preferably, a touch sensor is provided superimposed on the above-mentioned display panel. [Effects of the Invention]

[0020] According to the present invention, it is possible to provide an electronic device with excellent portability, or an electronic device with excellent overview. We can provide equipment. Or we can provide durable electronic equipment. Or new input methods We can provide electronic devices equipped with multiple stages, or we can provide new electronic devices.

[0021] Furthermore, the description of these effects does not preclude the existence of other effects. One embodiment does not necessarily have to possess all of these effects. Furthermore, other effects may be considered. This will become clear from the description in the specification, drawings, claims, etc., and the specification, drawings It is possible to extract effects other than those mentioned above from the descriptions in the surfaces, claims, etc. [Brief explanation of the drawing]

[0022] [Figure 1] An example of the configuration of an electronic device according to an embodiment. [Figure 2] An example of the configuration of an electronic device according to an embodiment. [Figure 3] An example of the configuration of an electronic device according to an embodiment. [Figure 4] An example of the configuration of an electronic device according to an embodiment. [Figure 5] An example of the configuration of an electronic device according to an embodiment. [Figure 6] An example of the configuration of an electronic device according to an embodiment. [Figure 7] An example of the configuration of an electronic device according to an embodiment. [Figure 8]An example of the configuration of an electronic device according to an embodiment. [Figure 9] An example of the configuration of an electronic device according to an embodiment. [Figure 10] A diagram showing an example of a light-emitting panel according to an embodiment. [Figure 11] A diagram showing an example of a light-emitting panel according to an embodiment. [Figure 12] A diagram illustrating an example of a method for manufacturing a light-emitting panel according to an embodiment. [Figure 13] A diagram illustrating an example of a method for manufacturing a light-emitting panel according to an embodiment. [Figure 14] A diagram showing an example of a touch panel according to an embodiment. [Figure 15] A diagram showing an example of a touch panel according to an embodiment. [Figure 16] A diagram showing an example of a touch panel according to an embodiment. [Figure 17] A diagram showing an example of a touch panel according to an embodiment. [Figure 18] Block diagram and timing chart of the touch sensor. [Figure 19] Circuit diagram of a touch sensor. [Figure 20] An example of the configuration of an electronic device according to an embodiment. [Modes for carrying out the invention]

[0023] Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. Without departing from the spirit and scope of the present invention, its form and details may be modified in various ways. Those skilled in the art will readily understand what is possible. Therefore, the present invention is as shown in the following embodiments. It should not be interpreted as being limited to the contents described herein.

[0024] In the configuration of the invention described below, the same part or part having a similar function is The same reference numerals are used consistently across different drawings, and explanations of their repetition are omitted. When referring to the function of [this], the hatch pattern is the same, and sometimes no specific symbol is assigned.

[0025] In each figure described herein, the size, layer thickness, or area of ​​each component is as follows: It may be exaggerated for clarity. Therefore, it is not necessarily limited to that scale. stomach.

[0026] In this specification, ordinal numbers such as "the first," "the second," etc., are used to avoid confusion of constituent elements. This is added for the purpose of providing a numerical limit, and is not intended to limit the number of items.

[0027] (Embodiment 1) In this embodiment, an example of the configuration of an electronic device according to one aspect of the present invention will be described with reference to the drawings. do.

[0028] An electronic device according to one aspect of the present invention comprises a flexible display panel and two supports that support it. The structure will have a body. The two support members will be connected by a connecting part. By rotating the two enclosures relative to each other, it is possible to fold the electronic device. Therefore, An electronic device according to one aspect of the present invention maintains the display surface of a display panel in a flat state, and the display panel Folding the panel so that the display surface faces inward (inward bend), while folding the panel so that the display surface faces outward. It is possible to fold it in this way.

[0029] An electronic device according to one aspect of the present invention provides a seamless, wide display when the display panel is unfolded. It offers excellent overview in certain areas. Furthermore, when the display panel is folded, it offers excellent portability.

[0030] Here, in an electronic device according to one aspect of the present invention, the display panel is fixed to one of the supports. On the other support, it is supported without being fixed, so as to slide in one direction. It is preferable to provide it there. And when the angle of the two supports is changed, the display panel The configuration involves sliding against an unfixed support, causing the relative positions of the two to change. This configuration is preferable. By changing the angle of the two supports, the display panel When bending a part of the panel, force is applied only in the direction that bends the display panel, and perpendicular to this... The force acting in that direction (i.e., perpendicular to the thickness of the display panel) is effectively eliminated. This becomes possible. In other words, the display panel can be bent by sliding. Because no pulling or compressing force is applied to the display panel during operation, damage to the display panel is minimized. This allows for the creation of highly reliable electronic devices.

[0031] Furthermore, as mentioned above, when the display panel slides, a detection tool can detect the amount of displacement. It is preferable to have a step. The amount of displacement of the display panel depends on the angle of the two supports. Because it changes, detecting this displacement makes it possible to detect the angle between the two supports. Yes. For example, the relative position between the display panel and the support on the side to which the display panel is not fixed. By detecting changes in this relative Changes in position are preferably detected optically. Alternatively, mechanical or electrical detection may be used. A configuration that detects it using energy may also be used.

[0032] In this way, by configuring the two supports to be able to detect the angle, that angle can be detected by electronic devices. It can be used as one input means in this. For example, the angle between two supports This allows for switching the display on the display panel accordingly. When the panel is folded inward, actions such as stopping the display on the display panel will be disabled. It is possible to do so.

[0033] More specifically, it can be configured as follows:

[0034] [Example Configuration] Figure 1(A) shows a schematic perspective view of an electronic device 10 according to one embodiment of the present invention.

[0035] The electronic device 10 includes a support 11a, a support 11b, a connection part 12, and a display panel 13. It has a detection means 14 and

[0036] Support 11a and support 11b are connected via a connecting part 12. Display panel 1 3 is arranged on top of the support 11a, support 11b and connecting part 12. Nel 13 is supported by at least support 11a and support 11b.

[0037] Specifically, the display panel 13 has an area that is fixed to the support 11a. Panel 13 can slide in one direction without being fixed to the support 11b. It is supported by the support 11b in this manner.

[0038] Furthermore, the display panel 13 is flexible. The display panel 13 also has multiple pixels. It has a display area (also called a display region), and an image can be displayed in the display area. A pixel is a display element It is equipped with a child. In the following, the surface of the display panel 13 on which the image is displayed will be referred to as the surface on which the image is displayed. It is sometimes written as "indication surface".

[0039] Supports 11a and 11b can be rotated relative to each other via the connecting portion 12. For example, the support 11a and support 11b are folded via the connecting part 12, or screws It is possible to make modifications such as this. Therefore, the electronic device 10 is the display panel 13 The display surface can be reversibly deformed from a flat state to a curved state.

[0040] Supports 11a and 11b may have rigidity, or the supports themselves may be torsion A member that can deform against bending or curving forces may be used. Support 11a and support 11 b should be made of a material that is at least less flexible than the display panel 13 or the connecting part 12. Furthermore, elastic materials such as hard rubber may be used for its frame. In addition, each housing can be constructed using The materials used include plastics, metals such as aluminum, stainless steel, and titanium alloys. Alloys, silicone rubber, and other types of rubber can be used.

[0041] The connecting portion 12 can preferably be made of a material that is elastically deformable in part or in whole. For example The entire connecting portion 12 is made of an elastic material, or at least the bending portion is made of an elastic material. This can be done. Alternatively, the connecting part 12 may have a hinge with one or more rotational axes. It is also possible to apply the following configuration.

[0042] When an elastically deformable material is used as the connecting part 12, the support 11a and support 11b are relative If no rotational force is applied to the target, the display surface shown in Figure 1(A) remains flat. This is possible. Also, in order to maintain the state shown in Figure 1(C) and Figure 1(E), support 11a It is preferable to have a mechanism for fixing the support 11a and the support 11b. For example, the support 11a and the support The support may have a separate attachment device that allows for mechanical detachment from the body 11b, or it may have a support 11a and support 11b may be equipped with a detachable mechanism. Alternatively, support 11a and support The configuration may also involve fixing 11b using magnetic force.

[0043] Furthermore, if the connection part 12 is configured to have a hinge, see Figure 1(C) and Figure 1(E). Using a hinge that has a mechanism for fixing the relative positions of support 11a and support 11b in this state This is preferable because it eliminates the need for the aforementioned fastening devices and mechanisms. By using a hinge with a base, the display panel 1 can be made as shown in Figure 1(B) and Figure 1(D). The display surface of unit 3 can also be used in a curved state.

[0044] For the connecting portion 12, for example, a material with a lower Young's modulus than the supports 11a and 11b. A material with a Young's modulus higher than that of support 11a and support 11b can be used. Or, even if materials with a similar Young's modulus are used, the thickness of the connecting portion 12 is the same as that of the support 1 A material thinner than 1a and support 11b can also be used to constitute the connecting portion 12. Materials such as plastic, rubber, metal, or alloy can be used. For example Materials such as silicone resin or gel may also be used.

[0045] Figure 1(A) shows the display surface of the display panel 13 in a flat state. By deforming the electronic device 10 so that the display surface of the display panel 13 is bent inward, as shown in Figure It can be reversibly transformed from state 1(B) to state 1(C). Figure 1(C) In this state, the display panel 13 is housed sandwiched between the support 11a and the support 11b. This is the state in which the electronic device 10 is stored. When not in use, or when storing it in a bag, etc., it should be in this state. It can be described as a state.

[0046] Furthermore, the electronic device bends the display surface of the display panel 13 outwards from the state shown in Figure 1(A). By deforming the container 10, it can be reversibly transformed from the state shown in Figure 1(D) to the state shown in Figure 1(E). This can be done. In Figure 1(E), the display surface of the display panel 13 is on the top surface and side of the electronic device 10. It is positioned along the surface and the bottom surface. In the state shown in Figure 1(E), it is shown in Figure 1(A). Because it is smaller than its larger size, it is suitable for use in public places or while traveling. It is suitable for this purpose.

[0047] [Example of cross-sectional configuration] Figure 2(A) is a schematic cross-sectional view of the electronic device 10 at the cross-section X1 shown in Figure 1(A). This is shown. Also, Figure 2(B) is a schematic cross-sectional view of the cross-section X2 shown in Figure 1(B). Furthermore, Figure 2(C) is a schematic cross-sectional view of the cross-section X3 shown in Figure 1(D).

[0048] In Figure 2(A), the display panel 13 consists of a support 11a, a support 11b, and a connecting part. It is arranged along the top surface of each of the 12. Also, the display panel 13 has an FPC (Flexi A FPC (Flexible Printed Circuit) 15 is connected and supported via the FPC 15. It is electrically connected to the circuit board 16 located inside the body 11a. It is electrically connected to the battery 17 located inside the first support 11a. As shown in Figure 2(A), the battery 17 is also provided inside the second support 11b. Good. Although not shown here, the drive of the detection means 14 is controlled inside the support 11b. It may have a circuit board on which ICs, etc., are mounted for the purpose of detection. For example, the ICs may be detection means Even if it has the function of driving 14 and the function of extracting the signal output from detection means 14 good.

[0049] The display panel 13 is supported so as to be fixed to the support 11a. For example, the display panel A portion of 13 may be bonded to the support 11a, or it may be mechanically fixed by fasteners such as screws. It may be stipulated.

[0050] On the other hand, the display panel 13 is supported without being fixed to the support 11b. Specifically, In Figure 2(A), the display panel 13 can slide horizontally relative to the support 11b. It is supported in this way.

[0051] Here, the thickness direction of the display panel 13 (vertical direction in Figure 2(A)), and the display panel 13 Of the directions perpendicular to the curvature direction when it is bent (in Figure 2(A), the direction perpendicular to the plane of the paper), On the one hand, or both, the display panel 13 is designed so that it does not move (shift). It is preferable that 13 is supported by the support 11b.

[0052] As described above, the display panel 13 is fixed to the support 11a and also fixed to the support 11b. It is supported so as not to be affected. Therefore, the support 11a and support 1 are connected via the connecting part 12. When 1b is rotated relative to it, the display panel 13 shifts relative to the support 11b. The stress acting perpendicular to the thickness direction of the display panel 13 is relieved, and the display panel 13 does not break. This can suppress malfunctions such as losses. Therefore, a highly reliable electronic device 10 It can be achieved.

[0053] Figure 2(A) shows an example where the detection means 14 is located on the second support 11b. The detection means 14 has the function of detecting the relative position of the support 11b and the display panel 13. The specific configuration example of the detection means 14 will be described later. Here, in Figure 2(A), The diagram shows a configuration in which the output means 14 is placed on the support 11b, but the position of the detection means 14 is It can be set as appropriate depending on the configuration.

[0054] Figures 2(B) and 2(C) also show enlarged views of a portion of the support 11b. Yes, they are.

[0055] As shown in Figure 2(B), when the display panel 13 is bent so that the display surface faces inward, The end of the display panel 13 on the support 11b side moves outward, so that the display panel 13 and the support The relative position to 11b shifts. On the other hand, as shown in Figure 2(C), the display of display panel 13 When the panel is bent so that the surface faces outward, the end of the display panel 13 on the support 11b side moves inward. As a result, the relative positions of the display panel 13 and the support 11b are shifted.

[0056] In this way, when the display panel 13 is bent, the relationship between the display panel 13 and the support 11b By detecting the relative positional displacement, the values ​​of this displacement are used to determine the relationship between support 11a and support 11b. The relative positional relationship can be calculated. As a result, the shape of the electronic device 10 can be detected. This becomes possible.

[0057] The above is an explanation of the cross-sectional configuration examples.

[0058] [Regarding the displacement of the display panel] The following describes the table that appears when the electronic device 10 is deformed in such a way that the display panel 13 is bent. The amount of relative positional displacement between the display panel 13 and the support 11b will be explained.

[0059] Figure 3(A) is a schematic diagram showing an electronic device according to one embodiment of the present invention. The electronic device is connected by an elastic connector 12 between support 11a and support 11b. It has a configuration in which the support 11a, the connecting part 12, and one side of the support 11b One side is provided with a display panel 13_1, and the other side is provided with a display panel 13_2. Note that in Figure 3(A), display panels 13_1 and 13_2 are on the surface of support 11a. A hatching pattern is applied to indicate that it is fixed to a part of the surface.

[0060] Note that when the connecting part 12 is bent, there are cases where the display surface of the display panel faces inward and cases where it faces outward. To explain both sides simultaneously, we will use an example with two display panels. ru.

[0061] Also, as shown in Figure 3(A), each of the support 11a, support 11b and connecting part 12 Let the thickness be t. Also, let the length of the connection part 12 be length L0. Also, the display panel 13 The ends of _1 and the display panel 13_2 coincide with the ends of the support 11b. Also, Figure 3(A) shows the neutral line of the connection part 12 (also called the neutral line). )12a is shown with a dashed line. Here, in this specification, the neutral line is the line under which stress is applied to the object. In cases where this is not the case, it refers to the line connecting the centers in the thickness direction of the object's cross-section.

[0062] Here, as shown in Figure 3(B), the neutral line 12a of the connection portion 12 is at an angle θ with a radius of curvature r0. Let's consider the case where it is curved only by that much. In this case, since the connecting part 12 is an elastic body, the connecting part 12 Due to the stress generated when it is bent, the portion of the connection part 12 inside the neutral line 12a shrinks. Therefore, the portion of the connection part 12 that is outside the neutral line 12a will extend.

[0063] For simplicity, when the connecting part 12 is curved, the thickness of the connecting part 12 does not change. Furthermore, the neutral line 12a of the connection part 12 always passes through the center of the thickness of the connection part 12, and the connection In a case where the neutral line 12a of section 12 curves with a constant radius of curvature from one end to the other of the connecting section 12 Let's consider the combination.

[0064] In Figure 3(B), the length of the neutral line 12a of the connection part 12 is L0. The radius of curvature r1 on the inner surface and the radius of curvature r2 on the outer surface are as follows: It will look like this.

[0065]

number

[0066] Therefore, the length L1 of the inner surface of the connecting portion 12 in the cross-section shown in Figure 3(B) is, The length L2 of the outer surface is as follows:

[0067]

number

[0068] Here, since the display panel 13_1 is provided in contact with the inner surface of the connection part 12, If the display panel 13_1 does not expand or contract, then the end of the display panel 13_1 will be at the end of the support 11b. A portion of the display panel 13_1 moves relative to the support 11b so that it is shifted outward from the part. Similarly, since the display panel 13_2 is provided in contact with the outer surface of the connection part 12, The end of the display panel 13_2 is offset inward from the end of the support 11b. A portion of 13_2 moves relative to the support 11b. The support 11b of the display panel 13_1 The displacement amount d1 relative to the outer side, and the displacement amount d2 of the display panel 13_2 relative to the support 11b, are If we consider the displacement to be positive, then the following applies.

[0069]

number

[0070] From equation (3), the displacement d1 of display panel 13_1 and the displacement d of display panel 13_2 are obtained. It can be seen that both of the values ​​in 2 depend on the thickness t of the connection part 12 and the angle θ. Assuming that t is constant, by detecting the displacement d1 or displacement d2, the angle θ It is possible to estimate this.

[0071] Furthermore, the magnitude of the displacement d1 of display panel 13_1 and the displacement d2 of display panel 13_2 The greater the distance between display panel 13_1 or display panel 13_2 and the neutral line 12a, the greater the It will become larger. Therefore, the display panel is located at least away from the neutral line 12a. It is preferable that the display panel comprises a support 11a, a connecting part 12, and a second support It is preferable that the body 11b is positioned so as not to overlap with the center position in each thickness direction.

[0072] However, in reality, there may be parts where the thickness of the curved portion of the connection part 12 becomes thinner. In the case where the display surface is bent inward as shown in display panel 13_1 in Figure 3(B), and the display panel When the display surface is bent outward as in 13_2, there is a difference in the absolute value of the displacement, as described above. The displacement may differ from the value. Therefore, the phase between the display panel 13 and the support 11b When calculating the angle θ from the relative displacement, the shape change when the connection part 12 is curved is considered. It is preferable to take this into consideration and make corrections.

[0073] Furthermore, while the example shown here illustrates the case where the connecting portion 12 has a plate-like shape, it is not limited to this. For example, as shown in Figures 4(A) and (B), by making the connecting part 12 having a cavity inside, Wiring 18 can also be provided within the cavity. The wiring 18 supports the support body 11a and The circuit boards, batteries, etc., located inside the body 11b can be electrically connected to each other. Furthermore, as shown in Figures 4(C) and (D), the connecting portion 12 is provided with a bellows structure. This reduces the stress on the connection part 12 when it is bent. Furthermore, as shown in Figures 4(E) and (F), the connection part 12 has a bellows structure with a cavity inside. The configuration may include having a cavity, and the wiring 18 may be provided within the cavity.

[0074] Furthermore, although we have described the case in which an elastic body is used as the connecting part 12, When using a hinge, the relative range of motion of support 11a and support 11b is limited. Therefore, the angle θ can be more precisely determined from the relative displacement between the support 11b and the display panel 13. This is preferable because it can be calculated. In this case, the hinge has a configuration having two or more axes of rotation. This is preferable because it allows for a greater degree of design flexibility.

[0075] The above explains the displacement of the display panel.

[0076] [Example of detection means configuration] As described above, the detection means 14 detects changes in the relative position of the support 11b and the display panel 13. This refers to a mechanism that has a detection function.

[0077] It is preferable that the detection means 14 be configured to optically detect changes in position. If a light-emitting element or a light-receiving element is provided on the support 11b, and the other is provided on the display panel 13 The configuration can be such that both the light-emitting element and the light-receiving element are provided on the support 11b. The system is configured to detect light from the light-emitting element reflected by the display panel 13 using a light-receiving element. It is also possible to provide both the light-emitting element and the light-receiving element on the display panel 13, and the support 11b The system may also be configured to receive the reflected light.

[0078] More specifically, the following configurations can be used.

[0079] [Configuration Example 1] Figure 5(A) shows a schematic cross-sectional view of the region including the detection means 14 of the support 11b.

[0080] The support 11b has a first part 31 that supports the display panel 13, and the display of the display panel 13. The second portion 32 is located on the face side, and the third portion is located on the opposite side from the display face side of the display panel 13. The second part 32 and the third part 33 are exterior members of the support 11b. It may function as intended.

[0081] The detection means 14 includes a plurality of light-receiving elements 21 and a light-emitting element 22.

[0082] In the configuration shown in Figure 5(A), each of the multiple light-receiving elements 21 is located on the second part of the support 11b. 32 is fixedly positioned on the surface facing the display panel 13. The light-emitting element 22 is It is fixedly positioned on the display panel 13. The light-emitting element 22 is located on the second part of the support 11b. Light can be emitted from side 32, or more specifically, from side 21 of the light-receiving element.

[0083] The light emitted by the light-emitting element 22 may be visible light, infrared light, or ultraviolet light. It is acceptable to have one or more peaks in the wavelength range from 300 nm to 3000 nm. Light-emitting elements that emit light can be applied. In particular, infrared light with a wavelength of 750 nm or higher. Using this method eliminates the need to consider light leakage from the support 11b, compared to using visible light or ultraviolet light. It is preferable because its low necessity makes design easier, and it also allows for increased safety.

[0084] The light-emitting element 22 can be, for example, an LED (Light Emitting Diode). Light-emitting elements such as organic EL elements or inorganic EL elements can be applied. In particular, the table If the display panel 13 has light-emitting elements such as organic EL elements in its pixels, then the light-emitting elements are referred to as 22. By using light-emitting elements manufactured in the same process as the pixel, the number of components can be reduced. In that case, the light emitted from the light-emitting element 22 will include visible light.

[0085] The light-receiving element 21 is an element that can receive light emitted from the light-emitting element 22. Child 21 includes, for example, photoelectric conversion elements such as photodiodes and phototransistors. A light-receiving element can be applied. In addition, CCD image sensors, CMOS image sensors, etc. Solid-state image sensors such as dissensors can also be applied.

[0086] Furthermore, as will be described later, it is also possible to provide a light-receiving element 21 on the display panel 13. In particular, the display panel 13 has photoelectric conversion elements such as photodiodes in the display area. In the case of an optical touch panel, the light-receiving element 21 and the photoelectric conversion element are manufactured in the same process. It is preferable to do so.

[0087] Figures 5(B) and 5(C) are schematic perspective views showing the detection means 14 and its main peripheral parts.

[0088] The display panel 13 has a display section 13a and a non-display section 13b. The display section 13a is multiple It is a part that has a number of pixels and can display images, etc. Also, one of the non-display parts 13b A light-emitting element 22 is arranged in the part. The second part 32 of the support 11b is a display panel It is positioned so as to overlap with the hidden portion 13b of 13.

[0089] As shown in Figure 5(B), the light 23 emitted by the light-emitting element 22 is directed towards the display surface side of the display panel 13. It is emitted. At this time, the light receiving element 21 located in the direction of propagation of the light 23 detects the light 23. ru.

[0090] Next, from the state shown in Figure 5(B), the display panel 13 moves to the support in the direction of the arrow shown in Figure 5(C). Assume that it is displaced relative to 11b. At this time, the light-emitting element 22 and the multiple light-receiving elements 21 Because the relative position changes, the light-receiving element 21 is different from the state in Figure 5(B) when it emits light. This will be positioned in the direction of propagation of the light 23 emitted by the optical element 22.

[0091] Note that in Figure 5(B), etc., the direction of light 23 is approximately perpendicular to the surface of the display panel 13. This indicates the orientation, but it is not limited to this and may also move in an oblique direction. For example, highly directional light-emitting elements may be used, or light-emitting elements having an intensity distribution in the direction of propagation may be used. Optical elements may also be used.

[0092] In this way, by comparing the detection intensity of the light 23 received by multiple light-receiving elements 21, This makes it possible to detect the relative positional relationship between the display panel 13 and the support 11b.

[0093] The accuracy of the position detected by the detection means 14 is the phase between the display panel 13 and the support 11b. By arranging multiple light-receiving elements 21 with as little gap as possible in relation to the opposing displacement directions, It can be improved. For example, as shown in Figure 6(A), a vector parallel to the direction of displacement The projections of two adjacent light-receiving elements 21 onto the arrow are arranged so that they overlap. This improves the accuracy of the detected location.

[0094] Furthermore, as shown in Figure 6(B), two adjacent light-receiving elements 21 are arranged with a gap between them. Even in such cases, if the angle dependence of the light 23 from the light-emitting element 22 is known in advance... In this case, the peak position of the detection intensity is calculated from the detection intensity values ​​of multiple light-receiving elements 21. This makes it possible to detect the position of the light-emitting element 22 with high precision.

[0095] In this case, the detection means 14 is a plurality of light-receiving elements 21 on the second part of the support 11b. Although the configuration is such that the element 32 is provided and the light-emitting element 22 is provided on the display panel 13, it is not limited to this configuration. For example, as shown in Figure 7(A), the display panel 13 is provided with multiple light-receiving elements, and the support 11b The second portion 32 may be configured to include a light-emitting element 22.

[0096] Furthermore, as shown in Figure 7(B), the first portion 31 of the support 11b has an opening. The display panel 13 has a light-emitting element 22 on the opposite side from the display surface, and the support 11b The third portion 33 may be configured to include a plurality of light-receiving elements 21.

[0097] Furthermore, as shown in Figure 7(C), there are multiple light-receiving elements on the opposite side of the display surface of the display panel 13. Alternatively, a configuration may be provided in which a light-emitting element 22 is provided on the third portion of the support 11b, with a component 21 provided.

[0098] Also, in Figures 7(B) and 7(C), the opening of the first portion 31 is at least the light-emitting element 22 It is sufficient for the light emitted to be transmitted, and it may also have a light-transmitting component.

[0099] The above is an explanation of Configuration Example 1.

[0100] [Configuration Example 2] The following describes a configuration example that differs in some aspects from the above configuration example 1. Explanations may be omitted for parts that are redundant.

[0101] Figure 8(A) is a schematic perspective view showing the detection means 14 and its main surrounding area.

[0102] On the surface of the second portion 32 of the support 11b facing the display panel 13, there is a light-receiving element 21 and a light-emitting element. The optical elements 22 are arranged in a row.

[0103] As shown in Figure 8(A), the light 23 emitted by the light-emitting element 22 illuminates the non-display area of ​​the display panel 13. A portion of the light is reflected by 13b, and a portion of that reflected light is received by the light-receiving element 21. Display panel As the 13 is displaced relative to the support 11b, the intensity of the light received by the light-receiving element 21 changes. Because this changes, detecting this change allows for the relative position between the display panel 13 and the support 11b. It is possible to detect the amount of displacement.

[0104] In the non-display section 13b of the display panel 13, the part that reflects the light 23 emitted by the light-emitting element 22 Preferably, the panel has parts with different reflectivity. More specifically, the display panel It is sufficient that the material has portions with different reflectivity along a direction perpendicular to the displacement direction of 13. For example, the wiring pattern provided in the non-display section 13b, the drive circuit pattern, etc. can be used. It is also possible to do so.

[0105] Furthermore, a pattern for position detection is provided on the surface or inside the non-display portion 13b of the display panel 13. A separate layer may be formed. For example, when the display panel 13 is displaced, the part with high reflectivity The goal is to create a pattern in which periods and low-frequency sections alternate. These may be formed by printing or other methods, or by forming an uneven shape on the surface of the display panel 13. You may also use [this].

[0106] Figures 8(B) to (E) show the position detection of the non-display portion 13b of the display panel 13. An example of a pattern is shown. Note that the arrows in each figure indicate the displacement direction of the display panel 13. ru.

[0107] Figure 8(A) shows a first region 24 having a first reflectance and a second region having a second reflectance It has a region 25. A striped second region is positioned in a direction substantially parallel to the displacement direction of the display panel 13. It has a pattern in which multiple regions 25 are arranged.

[0108] Here, the difference in reflectance between the first reflectance and the second reflectance is, for example, 5% or more, preferably. It should be 10% or more, more preferably 15% or more. Also, the first reflectance and the second reflectance This means that there is a difference in their reflectance, and the first reflectance may be higher than the second reflectance. It's okay if it's low.

[0109] Furthermore, as shown in Figure 8(C), the striped second region 25 is relative to the displacement direction. They may be arranged diagonally. Also, as shown in Figure 8(D), the second region 25 is grid-like. It may have the shape shown in Figure 8(E). Also, as shown in Figure 8(E), the second region 25 may have a dotted shape. An arrayed pattern is also acceptable.

[0110] Note that here we have shown an example where two parts with different reflectivity are arranged regularly, but 2 The above parts with different reflectances may be arranged regularly. Also, two or more parts with different reflectances The configuration may also consist of parts arranged irregularly.

[0111] Furthermore, the light-receiving element 21 and the light-emitting element 22 are arranged in the second portion 32 of the support 11b. Although the case described above, it is also possible to configure it to be placed in the third part 33. In that case, As illustrated in Configuration Example 1, the first part has an opening that transmits the light emitted by the light-emitting element 22. You should add a 31 division.

[0112] In this way, both the light-receiving element 21 and the light-emitting element 22 are provided on the support 11b, and reflected light is utilized. By configuring the system to detect the relative position between the display panel 13 and the support 11b, the component The score can be reduced. Also, a detection panel is provided in the non-display area 13b of the display panel 13. As a turn, the wiring patterns of the display panel 13 can be utilized, This makes it possible to increase the degree of design freedom.

[0113] The above is an explanation of Configuration Example 2.

[0114] In this embodiment, the configuration includes two support structures, but it is also possible to have three or more support structures. It is also possible to configure it in such a way. The more support structures there are, the more the electronic device can be transformed into various shapes. This makes it possible to broaden the range of applications. Figures 9(A) to (C) show three supports (support 1 This shows an example of the configuration of an electronic device equipped with 1c, 11d, and 11e). Figure 9(A) shows the electronic The device is transformed into the form shown in Figure 9(B) by bending the display panel 13 in two places. Electronic devices can be folded as shown in C).

[0115] Furthermore, if the configuration has three or more supports, the display panel 13 is one of them It is fixed to one support and supported so that it can slide without being fixed to another support. The configuration should be as follows. Also, among the supports that do not support the display panel 13, one or more supports The above-mentioned detection means should be provided in the configuration. That is, the number of supports provided by the electronic device If we let n be the number of support structures, then the configuration should include detection means on 1 to n-1 of those supports. i. The more supports equipped with detection means, the more detailed the detection of the electronic device's form. This is preferable because it makes this possible. Preferably, all supports that do not support the display panel 13 are inspected. It would be good to provide a means of payment.

[0116] Furthermore, an electronic device according to one aspect of the present invention has a support body with various input means, output means, or input / output The configuration can include a power mechanism. For example, in Figure 20, there is an input button 41 and a power button. Tan 42, external connection terminal 43, card slot 44, optical sensor 45, camera 46, light source 47, speaker 48 and microphone 49 are provided on support 11a or support 11b. An example is shown. Also, in Figure 20, a battery is attached to each of the support 11a and support 11b. The TERI 17 is built in. Additionally, the antenna 51 is mounted on a portion of the support 11b.

[0117] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0118] (Embodiment 2) In this embodiment, a light-emitting element applicable to a display panel of an electronic device according to one aspect of the present invention This section describes examples of flannel construction and manufacturing methods.

[0119] [Specific examples] Figure 10(A) shows a plan view of the light-emitting panel, and the dashed line A1-A2 in Figure 10(A) An example of a cross-sectional view is shown in Figure 10(C). The light-emitting panel shown in Specific Example 1 is a color filter. This is a top-emission type light-emitting panel using a specific method. In this embodiment, the light-emitting panel A color matrix, for example, uses three subpixels of red (R), green (G), and blue (B) to represent one color. R (red), G (green), B (blue), W (white), or R (red), G (green), B (blue) A configuration can be applied in which one color is represented by four subpixels of color Y (yellow). There are no limitations; colors other than RGBW may be used, for example, yellow, cyan, magenta It may consist of the following:

[0120] The light-emitting panel shown in Figure 10(A) consists of a light-emitting section 804, a drive circuit section 806, and an FPC (Fle It has a luminescent part 804 and a drive unit 804. The light-emitting elements and transistors included in the circuit section 806 are located on substrate 801, substrate 803, and the sealing layer. It is sealed by 823.

[0121] The light-emitting panel shown in Figure 10(C) consists of a substrate 801, an adhesive layer 811, an insulating layer 813, and multiple Transistor, conductive layer 857, insulating layer 815, insulating layer 817, multiple light-emitting elements, insulating layer 8 21, sealing layer 823, overcoat 849, coloring layer 845, light-shielding layer 847, insulating layer 84 3. It has an adhesive layer 841 and a substrate 803. Sealing layer 823, overcoat 849, and insulation The edge layer 843, the adhesive layer 841, and the substrate 803 transmit visible light.

[0122] The light-emitting part 804 is connected to the substrate 801 via an adhesive layer 811 and an insulating layer 813, and a transistor It has 820 and a light-emitting element 830. The light-emitting element 830 is located on the lower electrode 83 on the insulating layer 817. It comprises 1, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or drain electrode of the transistor 820. Continued. The end of the lower electrode 831 is covered with an insulating layer 821. The lower electrode 831 is visible It is preferable that it reflects light. The upper electrode 835 transmits visible light.

[0123] Furthermore, the light-emitting section 804 has a colored layer 845 that overlaps with the light-emitting element 830 and an insulating layer 821 that overlaps with the light-emitting element 830. It has a light-shielding layer 847 and a colored layer 845 and a light-shielding layer 847. It is covered. The space between the light-emitting element 830 and the overcoat 849 is filled with a sealing layer 823. Yes, they are.

[0124] The insulating layer 815 has the effect of suppressing the diffusion of impurities into the semiconductor that makes up the transistor. In addition, the insulating layer 817 has a planarization function to reduce surface irregularities caused by the transistor. It is preferable to select an insulating layer having [a certain characteristic].

[0125] The drive circuit section 806 transitions onto the substrate 801 via the adhesive layer 811 and the insulating layer 813. It has multiple transistors. In Figure 10(C), among the transistors in the drive circuit section 806, This shows one transistor.

[0126] The insulating layer 813 and the substrate 801 are bonded together by the adhesive layer 811. 843 and substrate 803 are bonded together by adhesive layer 841. Insulating layer 813 and insulating layer If a film with low water permeability is used for 843, impurities such as water will enter the light-emitting element 830 and transistor 820. This is preferable because it can prevent objects from entering and increases the reliability of the light-emitting panel.

[0127] The conductive layer 857 receives external signals (video signals, clock signals, etc.) from the drive circuit section 806. It is electrically connected to an external input terminal that transmits a start signal or reset signal, or an electric potential. This example shows the use of an FPC808 as an external input terminal. This prevents an increase in the number of processes. Therefore, the conductive layer 857 is made of the same material as the electrodes and wiring used in the light-emitting section and the drive circuit section. It is preferable to manufacture it in a process. Here, the conductive layer 857 constitutes the transistor 820. This shows an example of an electrode fabricated using the same material and process as the electrode in question.

[0128] In the light-emitting panel shown in Figure 10(C), the connector 825 is located on the substrate 803. 825 is the substrate 803, adhesive layer 841, insulating layer 843, sealing layer 823, insulating layer 817, and It is connected to the conductive layer 857 through an opening provided in the insulating layer 815. Also, the connecting body 8 25 is connected to FPC808. Connecting to FPC808 and conductive layer 857 via connector 825. They are electrically connected. When the conductive layer 857 and the substrate 803 overlap, an opening is made in the substrate 803. By doing so (or by using a substrate having an opening), the conductive layer 857, the connector 825, and F The PC808 can be electrically connected.

[0129] In specific example 1, an insulating layer 813, a transistor 820, and a light-emitting element are fabricated on a heat-resistant substrate. Substrate 830 is fabricated, the fabricated substrate is peeled off, and an insulating layer 8 is applied to the substrate 801 using the adhesive layer 811. This shows a light-emitting panel that can be fabricated by transposing elements 13, transistor 820, and light-emitting element 830. In addition, in specific example 1, an insulating layer 843 and a colored layer 845 are used on a heat-resistant fabricated substrate. A light-shielding layer 847 is then fabricated, the fabricated substrate is peeled off, and the adhesive layer 841 is used to apply the material to the substrate 803. A light-emitting panel can be manufactured by transposing the insulating layer 843, the colored layer 845, and the light-shielding layer 847. It is showing.

[0130] When using materials with low heat resistance (such as resin) for the substrate, high temperatures are applied to the substrate during the manufacturing process. Because this is difficult, there are limitations on the conditions under which transistors and insulating layers can be fabricated on the substrate. When using a highly permeable material (such as resin) for the substrate, high temperature is applied to create a film with low water permeability. It is preferable to form it. In the manufacturing method of this embodiment, the tra Because it can fabricate transistors and other components, it can be used to create highly reliable transistors and ensure sufficient water permeability by applying high temperatures. A low-quality film can be formed. Then, these are transferred to substrate 801 or substrate 803. This makes it possible to manufacture highly reliable light-emitting panels. Thus, in one aspect of the present invention, This enables the creation of lightweight, thin, and highly reliable light-emitting panels. Details of the manufacturing method will be described later. do.

[0131] Furthermore, a light-emitting element manufactured using the same process as the light-emitting element 830 described above is provided in the non-display section. Therefore, it can be used as the light-emitting element 22 exemplified in Embodiment 1.

[0132] [Specific Example 2] Figure 10(B) shows a plan view of the light-emitting panel, and the dashed line A3-A4 in Figure 10(B) An example of a cross-sectional view therebetween is shown in FIG. 10(D). The light-emitting panel shown in Specific Example 2 is different from that in Specific Example 1 , which is a top-emission light-emitting panel using a color filter method. Only points different from those in Specific Example 1 will be described in detail herein, and descriptions of points common to those in Specific Example 1 will be omitted. , only points different from Specific Example 1 will be described in detail, and descriptions of points common to Specific Example 1 will be omitted.

[0133] The light-emitting panel shown in FIG. 10(D) differs from the light-emitting panel shown in FIG. 10(C) in the following points .

[0134] The light-emitting panel shown in FIG. 10(D) has a spacer 827 on an insulating layer 821. By providing the space r 827, the distance between a substrate 801 and a substrate 803 can be adjusted.

[0135] In addition, in the light-emitting panel shown in FIG. 10(D), the substrate 801 and the substrate 803 have different sizes. A connector 825 is located on an insulating layer 843 and does not overlap with the substrate 803. The connector 825 is connected to a conductive layer 857 through openings provided in the insulating layer 843, a sealing layer 823, an insulating layer 817, and an insulating layer 815 . Since there is no need to provide an opening in the substrate 803, the material of the substrate 803 is not limited.

[0136] Note that a light-emitting element manufactured in the same step as the above-described light-emitting element 830 is provided in a non-display portion , whereby the light-emitting element can be used as the light-emitting element 22 exemplified in Embodiment 1.

[0137] [Specific Example 3] FIG. 11(A) is a plan view of the light-emitting panel, and an example of a cross-sectional view taken along the alternate long and short dash line A5-A6 in FIG. 11(A) is shown in FIG. 11(C). The light-emitting panel shown in Specific Example 3 adopts a separate coating method and is a top-emission light-emitting panel.

[0138] The light-emitting panel shown in Fig. 11(A) includes a light-emitting portion 804, a driver circuit portion 806, and an FPC 808 . The light-emitting element and the transistor included in the light-emitting portion 804 and the driver circuit portion 806 are sealed by a substrate 8 01, a substrate 803, a frame-shaped sealing layer 824, and a sealing layer 823.

[0139] The light-emitting panel shown in Fig. 11(C) includes a substrate 801, an adhesive layer 811, an insulating layer 813, a plurality of transistors, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, an insulating layer 8 21, a sealing layer 823, a frame-shaped sealing layer 824, and a substrate 803. The sealing layer 823 and the substrate 803 transmit visible light.

[0140] It is preferable that the frame-shaped sealing layer 824 has higher gas barrier properties than the sealing layer 823 . This can suppress intrusion of moisture and oxygen from the outside into the light-emitting panel. Therefor e, a highly reliable light-emitting panel can be achieved.

[0141] In Specific Example 3, light emitted from the light-emitting element 830 is extracted from the light-emitting panel through the sealing layer 823 . Therefore, it is preferable that the sealing layer 823 has higher light transmittance than the frame-shaped sealing layer 824 . In addition, it is preferable that the sealing layer 823 has a higher refractive index than the frame-shaped sealing layer 824 . In addition, it is preferable that the sealing layer 823 has smaller volume shrinkage upon curing than the frame-shaped sealing layer 824 .

[0142] The light-emitting portion 804 has a transistor over the substrate 801 with the adhesive layer 811 and the insulating layer 813 interposed therebetween 820 and a light-emitting element 830. The light-emitting element 830 includes a lower electrode 83 1 on the insulating layer 817, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833 The lower electrode 831 is electrically connected to the source electrode or drain electrode of the transistor 820. Continued. The end of the lower electrode 831 is covered with an insulating layer 821. The lower electrode 831 is visible It is preferable that it reflects light. The upper electrode 835 transmits visible light.

[0143] The drive circuit section 806 transitions onto the substrate 801 via the adhesive layer 811 and the insulating layer 813. It has multiple transistors. In Figure 11(C), among the transistors in the drive circuit section 806, This shows one transistor.

[0144] The insulating layer 813 and the substrate 801 are bonded together by the adhesive layer 811. If a film with low water permeability is used, impurities such as water may penetrate the light-emitting element 830 and the transistor 820. This is preferable because it suppresses the ingress of light and increases the reliability of the light-emitting panel.

[0145] The conductive layer 857 has an external input terminal that transmits external signals and potentials to the drive circuit section 806. Connect electrically. Here, we show an example where an FPC808 is provided as an external input terminal. Furthermore, here, the conductive layer 857 is made of the same material as the electrodes that make up the transistor 820. An example of a product manufactured using the same process is shown.

[0146] In the light-emitting panel shown in Figure 11(C), the connector 825 is located on the substrate 803. 825 is an opening provided in the substrate 803, sealing layer 823, insulating layer 817, and insulating layer 815. It is connected to the conductive layer 857 via the opening. Also, the connector 825 is connected to the FPC 808. The FPC 808 and the conductive layer 857 are electrically connected via the connector 825.

[0147] In specific example 3, an insulating layer 813, a transistor 820, and a light-emitting element are fabricated on a heat-resistant substrate. element 830 is manufactured, the manufactured substrate is peeled off, and an adhesive layer 811 is used to transfer the insulating layer 8 13, the transistor 820, and the light-emitting element 830 onto a substrate 801, thereby illustrating a light-emitting panel that can be manufactured. Since transistors and the like can be manufactured over a manufacturing substrate with high heat resistance, application of high temperature allows formation of highly reliable transistors and films with sufficiently low water permeability. Then, by transferring them to the substrate 801, a highly reliable light-emitting panel can be manufactured. Accordingly, according to one embodiment of the present invention, a lightweight or thin and highly reliable light-emitting panel can be achieved. .

[0148] Note that a light-emitting element manufactured in the same step as the above-described light-emitting element 830 is provided in a non-display portion so that it can be used as the light-emitting element 22 exemplified in Embodiment 1.

[0149] [Specific Example 4] FIG. 11B is a plan view of a light-emitting panel, and FIG. 11D shows an example of a cross-sectional view along the dashed-dotted line A7-A8 in FIG. 11B. The light-emitting panel described in Specific Example 4 is a color filter type bottom-emission light-emitting panel.

[0150] The light-emitting panel illustrated in FIG. 11D includes a substrate 801, an adhesive layer 811, an insulating layer 813, a plurality of transistors, a conductive layer 857, an insulating layer 815, a colored layer 845, an insulating layer 817a, an insulating layer 8 17b, a conductive layer 816, a plurality of light-emitting elements, an insulating layer 821, a sealing layer 823, and a substrate 803 . The substrate 801, the adhesive layer 811, the insulating layer 813, the insulating layer 815, the insulating layer 817a, and the insulating layer 817b transmit visible light.

[0151] The light-emitting portion 804 includes a transistor over the substrate 801 with the adhesive layer 811 and the insulating layer 813 interposed therebetween It has 820, a transistor 822, and a light-emitting element 830. The light-emitting element 830 has an insulating layer The lower electrode 831 on 817, the EL layer 833 on the lower electrode 831, and the upper It has a lower electrode 835 and a lower electrode 831 which is the source electrode or of the transistor 820. It is electrically connected to the rain electrode. The end of the lower electrode 831 is covered with an insulating layer 821. The upper electrode 835 preferably reflects visible light. The lower electrode 831 preferably transmits visible light. The position in which the colored layer 845 overlaps the light-emitting element 830 is provided is not particularly limited, for example, If it is placed between the edge layer 817a and the insulating layer 817b, or between the insulating layer 815 and the insulating layer 817a, etc. good.

[0152] The drive circuit section 806 transitions onto the substrate 801 via the adhesive layer 811 and the insulating layer 813. It has multiple transistors. In Figure 11(C), among the transistors in the drive circuit section 806, This shows two transistors.

[0153] The insulating layer 813 and the substrate 801 are bonded together by the adhesive layer 811. If a film with low water permeability is used, water and other insoluble particles will enter the light-emitting element 830 and transistors 820 and 822. This is preferable because it can suppress the intrusion of pure substances and improve the reliability of the light-emitting panel.

[0154] The conductive layer 857 has an external input terminal that transmits external signals and potentials to the drive circuit section 806. Connect electrically. Here, we show an example where an FPC808 is provided as an external input terminal. Furthermore, in this case, the conductive layer 857 was fabricated using the same material and process as the conductive layer 816. Here is an example.

[0155] In specific example 4, an insulating layer 813, a transistor 820, and a light-emitting element are fabricated on a heat-resistant substrate. Sub-substrates 830 etc. are fabricated, the fabricated substrate is peeled off, and an insulating layer is placed on the substrate 801 using the adhesive layer 811. Light-emitting panels can be fabricated by transposing components such as 813, transistor 820, and light-emitting element 830. This indicates that transistors and other components can be fabricated on a highly heat-resistant substrate, thus enabling high-temperature fabrication. This allows for the formation of highly reliable transistors and films with sufficiently low water permeability. By transferring these onto substrate 801, a highly reliable light-emitting panel can be fabricated. Therefore, in one aspect of the present invention, a lightweight or thin and highly reliable light-emitting panel is realized. It can be expressed.

[0156] Furthermore, a light-emitting element manufactured using the same process as the light-emitting element 830 described above is provided in the non-display section. Therefore, it can be used as the light-emitting element 22 exemplified in Embodiment 1.

[0157] [Specific Example 5] Figure 11(E) shows an example of a light-emitting panel different from specific examples 1 to 4.

[0158] The light-emitting panel shown in Figure 11(E) consists of a substrate 801, an adhesive layer 811, an insulating layer 813, and a conductive layer 814, conductive layer 857a, conductive layer 857b, light-emitting element 830, insulating layer 821, sealing layer 82 It has 3 and a substrate 803.

[0159] The conductive layers 857a and 857b function as external connection electrodes for the light-emitting panel. It can be electrically connected to FPCs, etc.

[0160] The light-emitting element 830 has a lower electrode 831, an EL layer 833, and an upper electrode 835. The end of the electrode 831 is covered with an insulating layer 821. The light-emitting element 830 is bottom emitter It is either a top-emission type, a dual-emission type, or a single-type. The electrodes, substrate, insulating layer, etc., are all transparent to visible light. The conductive layer 814 is connected to the lower electrode 831. It is electrically connected to it.

[0161] The substrate that extracts light consists of a hemispherical lens and a microlens array as its light extraction structure. The film may have an uneven surface, such as a light-diffusing film. For example, a resin base The above-mentioned lens or film is placed on a plate, with a refractive index similar to that of the substrate or the lens or film. A light extraction structure can be formed by bonding using an adhesive or the like.

[0162] The conductive layer 814 is not necessarily required, but the voltage drop due to the resistance of the lower electrode 831 It is preferable to provide it because it can suppress downward movement. Also, for the same purpose, the upper electrode 835 and the A conductive layer that is electrically connected is placed on the insulating layer 821, the EL layer 833, or the upper electrode 835, etc. It may be established.

[0163] The conductive layer 814 is made of copper, titanium, tantalum, tungsten, molybdenum, chromium, neodymium Materials selected from aluminum, scandium, nickel, and aluminum, or materials with these as the main components. It can be formed using alloy materials, etc., either as a single layer or in layers. The thickness of the conductive layer 814 is For example, it can be 0.1 μm or more and 3 μm or less, preferably 0.1 μm or more and 0 It is 0.5 μm or less.

[0164] A paste (such as silver paste) is used as the material for the conductive layer that electrically connects to the upper electrode 835. As a result, the metal constituting the conductive layer aggregates into granular form. Therefore, the surface of the conductive layer becomes rough. This configuration has many gaps, making it difficult for the EL layer 833 to completely cover the conductive layer, and the upper electrode This makes it easier to establish an electrical connection between the conductive layer and the material, which is preferable.

[0165] In specific example 5, an insulating layer 813 and a light-emitting element 830, etc., are fabricated on a heat-resistant substrate. The fabricated substrate is peeled off, and an insulating layer 813 and a light-emitting element 83 are placed on the substrate 801 using the adhesive layer 811. This shows a light-emitting panel that can be fabricated by transposing zeros. On a heat-resistant fabrication substrate, By applying high temperature to form a film with sufficiently low water permeability and then transferring it to the substrate 801, reliability This makes it possible to create a light-emitting panel with high performance. As a result, in one aspect of the present invention, it is possible to create a lightweight or thin panel. Furthermore, it enables the creation of highly reliable light-emitting panels.

[0166] Although an example using a light-emitting element as the display element is shown here, the present invention is also described in detail below. The embodiments are not limited to these.

[0167] For example, in this specification, etc., a display element, a display device having a display element or Light-emitting devices, which include display panels, light-emitting elements, and devices having light-emitting elements, can be used in various forms. It can have various elements, such as display elements, display devices, display panels, and light-emitting elements. An example of an element or light-emitting device is an EL (electroluminescent) element (organic material and EL elements containing inorganic materials, organic EL elements, inorganic EL elements), LEDs (white LEDs, red LEDs) D (green LED, blue LED, etc.), transistor (a transistor that emits light according to the current). ), electron emission elements, liquid crystal elements, electronic ink, electrophoretic elements, grating light bulbs (GLV), Plasma Display (PDP), MEMS (Micro-Electro-Mechanical Systems) Display elements using a visual system, digital micromirror devices (DMD), D MS (Digital Micro Shutter), MIRASOL (Registered Trademark), IMOD (I Interference modulation element, shutter-type MEMS display element, light Interferometric MEMS display elements, electrowetting elements, piezoelectric ceramic displays Rays, carbon nanotubes, etc., influence contrast, brightness, and reflection through electromagnetic interactions. Some display media have varying rates, transmittances, etc. One example is a display device using an EL element. Examples include EL displays. This is an example of a display device using an electron-emitting element. This refers to a field emission display (FED) or SED type flat panel display. (SED:Surface-conduction Electron-emitter Examples include liquid crystal displays. Ray (transmissive liquid crystal display, semi-transmissive liquid crystal display, reflective liquid crystal display, Examples include direct-view liquid crystal displays and projection-type liquid crystal displays. Other technologies include electronic ink and electronic powder flow. Examples of display devices using bodies or electrophoretic elements include electronic paper. When realizing a semi-transmissive liquid crystal display or a reflective liquid crystal display, one of the pixel electrodes The part or the whole should function as a reflective electrode. For example, pixel electrodes The electrodes can be made of aluminum, silver, etc., in part or all of the material. In that case, it is also possible to install a memory circuit such as SRAM below the reflective electrode. This further reduces power consumption.

[0168] Furthermore, a light-emitting element manufactured using the same process as the light-emitting element 830 described above is provided in the non-display section. Therefore, it can be used as the light-emitting element 22 exemplified in Embodiment 1.

[0169] [Example of materials] Next, we will describe the materials that can be used for the light-emitting panel. The structure described may be omitted in some cases.

[0170] Materials such as glass, quartz, organic resin, metal, and alloy can be used for the substrate. The substrate on the side that extracts light from the optical element is made of a material that is transparent to the light.

[0171] In particular, it is preferable to use a flexible substrate. For example, an organic resin or a material having a degree of flexibility. Glass, metal, and alloys of varying thicknesses can be used.

[0172] Because organic resins have a lower specific gravity than glass, when organic resins are used as flexible substrates, This method allows for a lighter light-emitting panel compared to using glass, which is preferable.

[0173] It is preferable to use a material with high toughness for the substrate. This provides excellent impact resistance and breakage. This makes it possible to create light-emitting panels that are less prone to damage. For example, even organic resin substrates or thin metal substrates can be used. By using an alloy substrate, it is lighter and less prone to breakage compared to using a glass substrate. This makes it possible to create a low-powered light-emitting panel.

[0174] Metallic and alloy materials have high thermal conductivity and can easily conduct heat throughout the substrate, so light-emitting particles This is preferable as it can suppress the localized temperature rise of the flannel. The substrate thickness is preferably 10 μm to 200 μm, and 20 μm to 50 μm. It is preferable to do so.

[0175] There are no particular limitations on the materials that make up the metal substrate or alloy substrate, but for example, aluminum Metals such as copper, iron, titanium, nickel, or one or more metals selected from these metals. Alloys containing the material can be used. Examples of alloys include aluminum alloy or ste Stainless steel and the like can be suitably used.

[0176] Furthermore, using a material with high thermal emissivity for the substrate can increase the surface temperature of the light-emitting panel. This can suppress damage to the light-emitting panel and reduce its reliability. For example, when the substrate is heated to a metal substrate. Laminated structure of a layer with high emissivity (for example, metal oxides or ceramic materials can be used) It can also be called "construction."

[0177] Examples of materials that are flexible and translucent include polyethylene terephthalate (PE). T), polyester resins such as polyethylene naphthalate (PEN), polyacrylonitrile Polyresin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin Fat, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, Examples include lithstyrene resin, polyamide-imide resin, and polyvinyl chloride resin. In particular, heat It is preferable to use materials with a low expansion coefficient, such as polyamide-imide resin and polyimide. Resins, PET, etc. can be suitably used. In addition, a substrate (pre-filled) in which resin is impregnated into a fibrous material can be used. They use substrates made by mixing inorganic fillers with organic resin to reduce the coefficient of thermal expansion (also called pre-filled substrates). It is also possible.

[0178] As a flexible substrate, the layer using the above material protects the surface of the device from scratches and other damage. Coating layers (e.g., silicon nitride layers) or layers of materials that can distribute pressure (e.g., rough It may be constructed by laminating with a mid-resin layer, etc.

[0179] Flexible substrates can also be used by stacking multiple layers. In particular, a configuration having a glass layer. Therefore, improving barrier properties against water and oxygen will result in a more reliable light-emitting panel. can.

[0180] For example, a flexible group having a glass layer, an adhesive layer, and an organic resin layer laminated from the side closest to the light-emitting element. A plate can be used. The thickness of the glass layer is preferably 20 μm or more and 200 μm or less. The thickness should be between 25 μm and 100 μm. Glass layers of this thickness are not susceptible to water and oxygen. It can simultaneously achieve high barrier properties and flexibility. Also, the thickness of the organic resin layer is 1 The particle size should be 0 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less. By placing the resin layer outside the glass layer, cracks and fractures in the glass layer are suppressed. This can improve mechanical strength. Composite materials of such glass materials and organic resins By applying it to a substrate, it is possible to create an extremely reliable and flexible light-emitting panel. can.

[0181] The adhesive layer and sealing layer can be a photocuring adhesive such as UV-curing type, a reaction-curing adhesive, or a thermosetting type. Various types of curing adhesives, such as adhesives and anaerobic adhesives, can be used. For example, epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, Imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin Examples include EVA (ethylene vinyl acetate) resin, etc. In particular, epoxy resins and other permeable materials. Materials with low moisture content are preferred. A two-component resin may also be used. Adhesive sheets are also available. You may also use the following:

[0182] Furthermore, the above resin may contain a desiccant. For example, an alkaline earth metal oxide (acid Using substances that adsorb moisture by chemical adsorption, such as calcium carbonate or barium oxide. It is possible to remove moisture through physical adsorption, such as with zeolite or silica gel. Adsorbent substances may be used. If a desiccant is included, impurities such as moisture may be absorbed into the functional element. This is preferable because it can suppress intrusion and improve the reliability of the light-emitting panel.

[0183] Furthermore, by mixing fillers or light-scattering materials with a high refractive index into the above resin, a light-emitting element can be created. The light extraction efficiency from these can be improved. For example, titanium dioxide, barium oxide, Zeolite, zirconium, etc., can be used.

[0184] The structure of the transistors in the light-emitting panel is not particularly limited. For example, staggered transistors It can be used as a transistor, or as an inverse staggered transistor. Also, a top gate... Either a bottom-gate or bottom-gate transistor structure may be used. The semiconductor material is not particularly limited; for example, silicon, germanium, silicon carbide, and zinc nitride. Examples include indium, galvanic acid, and galvanic acid. Alternatively, indium, galvanic acid, and galvanic acid are examples of in-Ga-Zn metal oxides. An oxide semiconductor containing at least one of lium and zinc may also be used.

[0185] The crystallinity of semiconductor materials used in transistors is not particularly limited; amorphous semiconductors are also available. Crystalline semiconductors (microcrystalline semiconductors, polycrystalline semiconductors, single-crystal semiconductors, or semiconductors with a crystalline region in part) Any semiconductor (having a region) may be used. If a semiconductor with crystalline properties is used, This is preferable because it suppresses the degradation of the DISTA characteristics.

[0186] Here, transistors used in pixels, driving circuits, and touch sensors (described later) For any semiconductor device, it is preferable to use an oxide semiconductor. In particular, it is preferable to use a silicon It is preferable to use oxide semiconductors with a large band gap than silicon. Using semiconductor materials with a wide hop and low carrier density allows for the transistor's off state. This is preferable because it allows for a reduction in current.

[0187] For example, the above oxide semiconductor may contain at least indium (In) or Preferably, it contains zinc (Zn). More preferably, an In-M-Zn oxide (where M is A) is used. (Denoted by metals such as l, Ti, Ga, Ge, Y, Zr, Sn, La, Ce, or Hf) Contains oxides.

[0188] In particular, the semiconductor layer has multiple crystalline portions, and the c-axis of the crystalline portion is the surface on which the semiconductor layer is formed. , or oriented perpendicular to the upper surface of the semiconductor layer, and without grain boundaries between adjacent crystal portions. It is preferable to use an oxide semiconductor film.

[0189] Such oxide semiconductors do not have grain boundaries, so when the display panel is curved... This suppresses the formation of cracks in the oxide semiconductor film due to stress. Therefore, Such oxide semiconductors are suitable for use in flexible, curved display panels and the like. It is possible to be there.

[0190] By using such materials as semiconductor layers, fluctuations in electrical properties are suppressed, and reliability is improved. High transistors can be achieved.

[0191] Furthermore, its low off-current allows the charge stored in the capacitor via the transistor to be released over a long period of time. It is possible to hold it over time. By applying such transistors to pixels, each It also becomes possible to stop the drive circuit while maintaining the gradation of the image displayed in the display area. As a result, it becomes possible to create electronic devices with extremely reduced power consumption.

[0192] It is preferable to provide an undercoat to stabilize the characteristics of the transistor, etc. Silicon oxide film, silicon nitride film, silicon oxide nitride film, silicon nitride oxide film, etc. It can be fabricated using an insulating film, either as a single layer or in a multilayer configuration. The undercoat is fabricated by sputtering. CVD (Chemical Vapor Deposition) method (Plasma CVD) Methods such as thermal CVD, MOCVD (Metal Organic CVD), and ALD Using methods such as (Atomic Layer Deposition), coating, and printing, the shape can be formed. This can be achieved. Note that the undercoat does not need to be provided if it is not necessary. In each of the above configuration examples, insulation Layer 813 can also serve as the underlayer for the transistor.

[0193] As the light-emitting element, a self-emitting element can be used, and it will light up when current or voltage is applied. This category includes elements whose degree of control is managed. For example, light-emitting diodes (LEDs), organic EL elements, inorganic EL elements, etc., can be used.

[0194] Light-emitting devices include top-emission type, bottom-emission type, and dual-emission type. Either of the above is acceptable. The electrode that extracts light uses a conductive film that transmits visible light. Furthermore, it is preferable to use a conductive film that reflects visible light on the electrode that does not extract light. stomach.

[0195] Examples of conductive films that transmit visible light include indium oxide and indium tin oxide (ITO). Indium zinc oxide, zinc oxide, and gallium are added. It can be formed using zinc oxide with added components, etc. Also, gold, silver, platinum, magnesium Nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, if Examples include metallic materials such as titanium, alloys containing these metallic materials, or nitrides of these metallic materials. For example, titanium nitride can also be used by forming it thinly enough to be translucent. Furthermore, the laminated film of the above materials can be used as a conductive layer. For example, silver and magnesium Using a laminated film of an alloy of ITO is preferable because it can improve conductivity. Alternatively, graphene or other materials may be used.

[0196] Conductive films that reflect visible light include, for example, aluminum, gold, platinum, silver, nickel, and tungsten. Metal materials such as stainless steel, chromium, molybdenum, iron, cobalt, copper, or palladium, Alloys containing these metal materials can be used. In addition, the above metal materials and alloys can be treated with ran It may also contain tannins, neodymium, or germanium. Aluminum alloys such as tan alloys, aluminum-nickel alloys, aluminum-neodymium alloys, etc. Alloys containing nium (aluminum alloys), alloys of silver and copper, alloys of silver, palladium and copper, It can be formed using silver-containing alloys such as silver-magnesium alloys. It can also contain silver and copper. Alloys are preferred because they have high heat resistance. Furthermore, a metal film or gold in contact with the aluminum alloy film is also preferable. By laminating an oxide film, the oxidation of the aluminum alloy film can be suppressed. Examples of materials for the metal oxide film include titanium and titanium oxide. A conductive film that transmits visible light and a film made of a metallic material may be laminated together. For example, silver and ITO Multilayer films of silver and magnesium alloys and ITO can be used.

[0197] The electrodes can be formed using methods such as vapor deposition or sputtering. Shapes are formed using ejection methods such as inkjet, printing methods such as screen printing, or plating methods. It is possible.

[0198] A voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 831 and the upper electrode 835. Then, holes are injected into the EL layer 833 from the anode side and electrons are injected from the cathode side. The electrons and holes recombine in the EL layer 833, and the light-emitting material contained in the EL layer 833 emits light. It shines.

[0199] The EL layer 833 has at least an emissive layer. The EL layer 833 has layers other than the emissive layer, Materials with high hole injection potential, materials with high hole transport potential, hole blocking materials, materials with high electron transport potential Substances with high electron injection properties, or bipolar substances (substances with high electron transport and hole transport properties) It may further have a layer containing substances such as [materials].

[0200] The EL layer 833 can use either low-molecular-weight compounds or high-molecular-weight compounds, It may contain chemical compounds. The layers constituting the EL layer 833 are each deposited by a vapor deposition method (vacuum vapor deposition). It can be formed by methods such as (including adhesive application), transfer, printing, inkjet, and coating. Cut.

[0201] When a white light-emitting element is used as the light-emitting element 830, two types of EL layer 833 are used. It is preferable to have a configuration that includes two or more types of light-emitting materials. For example, each of two or more light-emitting materials By selecting light-emitting materials such that the light is in a complementary color relationship, white light emission can be obtained. For example, they emit light in the following colors: R (red), G (green), B (blue), Y (yellow), O (orange), etc. A light-emitting substance, or a light-emitting substance that exhibits emission containing two or more spectral components of R, G, and B. It is preferable that the substance contains two or more of the substances. Also, the spectrum of light emitted from the light-emitting element 830 The light exhibits two or more peaks within the wavelength range of the visible light region (e.g., 350nm to 750nm). It is preferable to apply a light-emitting element having a peak in the yellow wavelength region. The emission spectrum of this material also contains spectral components in the green and red wavelength regions. This is preferable.

[0202] Preferably, the EL layer 833 includes an emissive layer containing an emissive material that emits one color, and another color It is preferable to have a structure in which a light-emitting layer containing a light-emitting material is laminated with E. Multiple light-emitting layers in the L layer 833 may be stacked in contact with each other, or they may be separated by a separation layer. They may be stacked in this manner. For example, a configuration in which a separation layer is provided between the fluorescent emitting layer and the phosphorescent emitting layer. It can be considered a success.

[0203] The separation layer, for example, is formed in the phosphorescent layer, and the excited state of phosphorescent materials, etc., is transmitted to the fluorescent layer. To prevent energy transfer (especially triplet energy transfer) to optical materials via the Dexter mechanism. It can be provided for this purpose. The separation layer only needs to be about a few nanometers thick. Specifically, 0. 1nm to 20nm, or 1nm to 10nm, or 1nm to 5nm The following applies: The separation layer is made of a single material (preferably a bipolar material) or multiple materials. (Preferably includes hole-transporting materials and electron-transporting materials.)

[0204] The separation layer may be formed using the material contained in the light-emitting layer that is in contact with the separation layer. This makes it easier to fabricate light-emitting devices and reduces the driving voltage. For example, if the phosphorescent layer is In the case where the separation layer consists of a host material, an assist material, and a phosphorescent material (guest material), the separation layer is the It may be formed from a host material and an assist material. In other words, the separation layer is phosphorescent The phosphorescent layer has regions that do not contain material, and the phosphorescent layer has regions that contain phosphorescent material. It becomes possible to deposit the separation layer and the phosphorescent layer with or without the phosphorescent material. This configuration makes it possible to deposit the separation layer and the phosphorescent layer in the same chamber. This allows for a reduction in manufacturing costs.

[0205] Furthermore, the light-emitting element 830 may be a single element having one EL layer, or multiple elements. The EL layer may be a tandem element with a charge generation layer in between.

[0206] The light-emitting element is preferably placed between a pair of insulating films with low water permeability. This further suppresses the intrusion of impurities such as water into the light-emitting element, thereby preventing a decrease in the reliability of the light-emitting device. It can be controlled.

[0207] Examples of insulating films with low water permeability include silicon nitride films and silicon oxynitride films, which contain nitrogen and silicon. Examples include films containing nitrogen and aluminum, such as aluminum nitride films. Silicon oxide films, silicon oxide nitride films, aluminum oxide films, etc., may also be used.

[0208] For example, the amount of water vapor transmitted through a low-permeability insulating film is 1 × 10⁻⁶ -5 [g / m2 ·day] or later Below, preferably 1 × 10 -6 [g / m 2 ·day] More preferably 1 × 10 -7 [ g / m 2 • day] More preferably 1 x 10 -8 [g / m 2 ·day] Below ru.

[0209] It is preferable to use an insulating film with low water permeability for the insulating layer 813 and the insulating layer 843.

[0210] Examples of insulating layer 815 include silicon oxide film, silicon oxide nitride film, and aluminum oxide film. Inorganic insulating films such as um film can be used. Also, insulating layer 817, insulating layer 817a, For example, the insulating layer 817b can be polyimide, acrylic, polyamide, or polyimide. Organic materials such as amides and benzocyclobutene resins can be used. Low dielectric constant materials (low-k materials), etc., can be used. Furthermore, multiple insulating films can be stacked. Each insulating layer may be formed by doing so.

[0211] The insulating layer 821 is formed using an organic insulating material or an inorganic insulating material. Examples include polyimide resin, polyamide resin, acrylic resin, siloxane resin, and epoxy resin. A resin such as phenolic resin can be used. In particular, a photosensitive resin material can be used. It is preferable to form the side walls of the opening into inclined surfaces with a continuous curvature. It seems so.

[0212] The method for forming the insulating layer 821 is not particularly limited, but may include photolithography or sputtering. , vapor deposition method, droplet ejection method (inkjet method, etc.), printing method (screen printing, offset printing) You can use a printer or similar tool.

[0213] Spacer 827 can be formed using inorganic insulating materials, organic insulating materials, metal materials, etc. Yes, it is possible. For example, inorganic insulating materials and organic insulating materials can be used in the insulating layer mentioned above. Various materials can be used. Examples of metallic materials include titanium and aluminum. Yes, it is possible. A configuration in which a spacer 827 containing a conductive material and an upper electrode 835 are electrically connected. This suppresses the potential drop caused by the resistance of the upper electrode 835. Also, spacer 8 27 may have a forward taper shape or a reverse taper shape.

[0214] In a light-emitting panel, which functions as electrodes or wiring for transistors, or as auxiliary electrodes for light-emitting elements, The conductive layer used can be, for example, molybdenum, titanium, chromium, tantalum, tungsten, aluminum. Metallic materials such as aluminum, copper, neodymium, scandium, or alloy materials containing these elements It can be formed as a single layer or in layers. The conductive layer is made of conductive metal oxide. It may also be formed using materials. Examples of conductive metal oxides include indium oxide (In2O3, etc.). ), tin oxide (SnO2, etc.), zinc oxide (ZnO), ITO, indium zinc oxide (I (e.g., n2O3-ZnO) or materials containing silicon oxide are used. It is possible.

[0215] A colored layer is a colored layer that transmits light in a specific wavelength range. For example, light in the red wavelength range... A color filter that transmits red (R) light, and a color filter that transmits green (G) light in the green wavelength range. - By using filters, such as a blue (B) color filter that transmits light in the blue wavelength range. This can be done. Each colored layer can be created using various materials, printing methods, inkjet methods, and photolithography. These are formed at the desired locations using etching methods such as the graphic method.

[0216] The light-shielding layer is placed between adjacent colored layers. The light-shielding layer blocks light from adjacent light-emitting elements. This shields the light and suppresses color mixing between adjacent light-emitting elements. Here, the edges of the colored layer are shielded from light. By providing it so as to overlap with the layers, light leakage can be suppressed. The light-shielding layer is: Materials that block light emission from light-emitting elements can be used, such as metallic materials, pigments, or dyes. A black matrix can be formed using a resin material. The light-shielding layer is the drive circuit section. By placing it in areas other than the light-emitting part, it is possible to suppress unintended light leakage caused by guided light, etc. It is preferable.

[0217] Furthermore, an overcoat may be provided to cover the colored layer and the light-shielding layer. This prevents impurities contained in the colored layer from diffusing into the light-emitting element. The overcoat is made of a material that transmits light from the light-emitting element, such as silicon nitride. Using inorganic insulating films such as films and silicon oxide films, or organic insulating films such as acrylic films and polyimide films This can be done, and a laminated structure of an organic insulating film and an inorganic insulating film may also be used.

[0218] Furthermore, when the sealing layer material is applied on the colored layer and light-shielding layer, the material of the overcoat is used. Therefore, it is preferable to use a material with high wettability for the sealing layer material. For example, overco Examples of materials include oxide conductive films such as ITO films, and metals such as Ag films that are thin enough to be translucent. It is preferable to use a membrane.

[0219] The connecting body is a paste or sheet made by mixing metal particles with a thermosetting resin. By thermocompression bonding, materials exhibiting anisotropic conductivity can be used. As for metal particles, For example, particles made of two or more metals in a layered structure, such as nickel particles coated with gold. It is preferable to have this feature. Alternatively, it is preferable to use a material in which the surface of granular resin is coated with metal. It seems so.

[0220] [Example of manufacturing method] Next, a method for manufacturing a light-emitting panel will be illustrated using Figures 12 and 13. Here, a specific example will be presented. We will explain using the light-emitting panel configuration shown in 1 (Figure 11(C)) as an example.

[0221] First, a release layer 203 is formed on the fabricated substrate 201, and an insulating layer 813 is formed on the release layer 203. Next, multiple transistors, conductive layer 857, insulating layer 815, insulating layer 813 are placed on the insulating layer 813. An edge layer 817, multiple light-emitting elements, and an insulating layer 821 are formed. Note that the conductive layer 857 is exposed. In this manner, insulating layers 821, 817, and 815 are open (Figure 12(A)). ).

[0222] Furthermore, a release layer 207 is formed on the fabricated substrate 205, and an insulating layer 843 is formed on the release layer 207. Next, a light-shielding layer 847, a coloring layer 845, and an overcoat 84 are applied to the insulating layer 843. Forms 9 (Figure 12(B)).

[0223] The fabricated substrates 201 and 205 are a glass substrate, a quartz substrate, and a saffron, respectively. A wire substrate, ceramic substrate, metal substrate, etc., can be used.

[0224] Furthermore, the glass substrate can be, for example, aluminosilicate glass or aluminoborosilicate glass. Glass materials such as barium borosilicate glass can be used. The temperature of the subsequent heat treatment For high degrees, it is best to use materials with a strain point of 730°C or higher. Note that barium oxide ( By including a large amount of BaO, more practical heat-resistant glass can be obtained. In addition, crystallized glass You can use materials like lass.

[0225] When a glass substrate is used for fabrication, a silicon oxide film and an acid film are placed between the fabricated substrate and the release layer. When insulating films such as silicon nitride films, silicon nitride films, and silicon nitride oxide films are formed, glass This is preferable because it prevents contamination from the substrate.

[0226] The release layer 203 and the release layer 207 are tungsten, molybdenum, and titanium, respectively. N, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium Elements selected from iridium, palladium, osmium, iridium, and silicon, including said elements It consists of an alloy material or a compound material containing the element, and is a single layer or a laminated layer. The crystalline structure of the layer containing n may be amorphous, microcrystalline, or polycrystalline.

[0227] The release layer can be formed by sputtering, plasma CVD, coating, printing, etc. The coating method includes spin coating, droplet dispensing, and dispensing.

[0228] If the delamination layer has a single-layer structure, it may consist of a tungsten layer, a molybdenum layer, or tungsten and molybdenum. It is preferable to form a layer containing a mixture of den. Also, tungsten oxide or A layer containing oxidized nitrides, a layer containing molybdenum oxide or oxidized nitrides, or tungsten A layer containing an oxide or oxidized nitride of a mixture of ammonium and molybdenum may be formed. A mixture of tungsten and molybdenum is, for example, an alloy of tungsten and molybdenum. It is correct.

[0229] Furthermore, the release layer is a laminated structure consisting of a tungsten-containing layer and a tungsten oxide-containing layer. When forming the structure, a layer containing tungsten is formed, and an insulating layer formed of oxide is formed on top of it. By forming a film, the interface between the tungsten layer and the insulating film contains tungsten oxide. The formation of a layer may be utilized. Alternatively, the surface of the tungsten-containing layer may be subjected to thermal oxidation treatment. Treatments using oxygen plasma, nitrous oxide (N2O) plasma, ozonated water, etc., which have strong oxidizing properties. A layer containing tungsten oxide may be formed by treatment with a solution or other means. The processing and heat treatment may involve using oxygen, nitrogen, nitrous oxide alone, or a mixture of these gases with other gases. The procedure may be carried out in a gaseous atmosphere. The surface condition of the peeled layer is determined by the plasma treatment or heat treatment described above. By changing this, it is possible to control the adhesion between the release layer and the insulating film that is formed later. be.

[0230] Each insulating layer is formed using methods such as sputtering, plasma CVD, coating, and printing. It is possible to achieve this, for example, by plasma CVD, where the film deposition temperature is 250°C or higher and 400°C or higher. By forming the film at temperatures below ℃, a dense film with very low water permeability can be created.

[0231] Subsequently, the surface of the fabricated substrate 205 on which the colored layer 845 etc. is provided, or the light-emitting element of the fabricated substrate 201 A material that will form a sealing layer 823 is applied to the surface on which the child 230 etc. are provided, and the sealing layer 823 is used The fabricated substrates 201 and 205 are bonded together so that their surfaces face each other (Figure 12( C)).

[0232] Then, the fabricated substrate 201 is peeled off, and the exposed insulating layer 813 and substrate 801 are bonded together with adhesive layer 81 They are bonded together using 1. Also, the fabricated substrate 205 is peeled off, and the exposed insulating layer 843 and the substrate are bonded together. 803 is bonded using the adhesive layer 841. In Figure 13(A), the substrate 803 is the conductive layer. Although the configuration is designed so that it does not overlap with 857, the conductive layer 857 and the substrate 803 may overlap.

[0233] Furthermore, various methods can be used as appropriate for the peeling process. For example, as the peeling layer, If a layer containing a metal oxide film is formed on the side in contact with the delamination layer, the metal oxide film is crystallized. It weakens the material, allowing the peelable layer to be removed from the fabricated substrate. Furthermore, it provides high heat resistance. When an amorphous silicon film containing hydrogen is formed as a release layer between the substrate and the release layer, laser light By removing the amorphous silicon film through irradiation or etching, the peeled layer is removed from the fabricated substrate. It can be peeled off. Furthermore, the peeling layer contains a metal oxide film on the side in contact with the layer to be peeled off. A layer is formed, the metal oxide film is weakened by crystallization, and a portion of the peeled layer is removed with a solution or NF 3. After removal by etching with fluorine gases such as BrF3 and ClF3, the weakened It can be exfoliated in metal oxide films. Furthermore, nitrogen, oxygen, hydrogen, etc. can be used as the exfoliation layer. A film containing (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) The process involves using a laser beam to irradiate the peeled layer and releasing the nitrogen, oxygen, and hydrogen contained within the peeled layer as gases. A method may be used to promote the separation of the layer to be peeled from the substrate. The fabricated substrate is mechanically removed or by using a solution or fluorine gas such as NF3, BrF3, or ClF3. Methods such as etching to remove the material can be used. In this case, it is not necessary to provide a stripping layer. good.

[0234] Furthermore, by combining multiple of the above peeling methods, the peeling process can be performed more easily. In other words, irradiation with laser light, etching of the stripping layer with gas or solution, sharp knife or After mechanically removing the material with a scalpel or similar tool to make it easier to separate the peeled layer from the layer to be peeled, Furthermore, the peeling can also be performed by physical force (such as by machinery).

[0235] Furthermore, by permeating the interface between the release layer and the layer to be released, the layer to be released is removed from the fabricated substrate. Alternatively, you can apply a liquid such as water while peeling.

[0236] Other peeling methods include, if the peeling layer is formed with tungsten, ammonia water and It is preferable to perform the stripping process while etching the stripping layer with a mixed solution of hydrogen peroxide.

[0237] Furthermore, if peeling is possible at the interface between the fabricated substrate and the peel-off layer, a peel-off layer may not be required. For example, glass is used as the fabrication substrate, and polyimide, polyester, and polyimide are placed in contact with the glass. Forms organic resins such as polyolefins, polyamides, polycarbonates, and acrylics, and organic resins Insulating film, transistors, etc. are formed on the oil. In this case, by heating the organic resin, It can be peeled off at the interface between the fabricated substrate and the organic resin. Alternatively, gold can be placed between the fabricated substrate and the organic resin. A metal layer is provided, and by passing an electric current through the metal layer, the metal layer is heated, and at the interface between the metal layer and the organic resin... Peeling may be performed.

[0238] Finally, the insulating layer 843 and the sealing layer 823 are opened to expose the conductive layer 857. (Figure 13(B)). Note that if the substrate 803 overlaps with the conductive layer 857, the conductive layer 85 To expose 7, the substrate 803 and the adhesive layer 841 are also opened (Figure 13(C)). The means are not particularly limited, and include, for example, laser ablation, etching, and ion beam. Sputtering or similar methods can be used. Alternatively, a sharp blade or similar tool can be used on the film on the conductive layer 857. You can also make an incision and peel off a portion of the membrane using physical force.

[0239] Based on the above, a light-emitting panel can be manufactured.

[0240] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0241] (Embodiment 3) In this embodiment, a folding mechanism is applicable to a display panel of an electronic device according to one aspect of the present invention. Examples of flexible touch panel configurations are explained using Figures 14 to 17. For materials that can be used for the layers, refer to Embodiment 2.

[0242] [Configuration Example 1] Figure 14(A) is a top view of the touch panel. Figure 14(B) is the same as Figure 14(A) but with a dashed line. This is a cross-sectional view between A and B and between the dashed line CD. Figure 14(C) is the same as the dashed line in Figure 14(A). This is a cross-sectional view between E and F.

[0243] As shown in Figure 14(A), the touch panel 390 has a display unit 301.

[0244] The display unit 301 includes multiple pixels 302 and multiple imaging pixels 308. This allows for the detection of fingers or other objects touching the display unit 301. This enables the use of the imaging pixels 308. This allows you to configure a touch sensor.

[0245] Pixel 302 comprises multiple sub-pixels (e.g., sub-pixel 302R), and the sub-pixels include light-emitting elements and It is equipped with a pixel circuit that can supply power to drive the light-emitting elements.

[0246] The pixel circuit can supply selection signals and image signals. It is electrically connected to the wiring.

[0247] Furthermore, the touch panel 390 is a scan line drive that can supply selection signals to the pixels 302. Circuit 303g(1) and an image signal line drive circuit that can supply an image signal to the pixel 302. It is equipped with road 303s(1).

[0248] The imaging pixel 308 includes a photoelectric conversion element and an imaging pixel circuit that drives the photoelectric conversion element.

[0249] The imaging pixel circuit has wiring that can supply control signals and power supply potential. It is electrically connected to the available wiring.

[0250] One example of a control signal is selecting the imaging pixel circuit that reads out the recorded imaging signal. A signal that can do this, a signal that can initialize the imaging pixel circuit, and a signal that the imaging pixel circuit detects light Examples include signals that can determine the timing of notification.

[0251] The touch panel 390 can supply control signals to the image pixel 308 as an image pixel drive. It comprises circuit 303g(2) and imaging signal line driving circuit 303s(2) for reading out the imaging signal. .

[0252] As shown in Figure 14(B), the touch panel 390 is located opposite the substrate 510 and the substrate 510. It has a substrate 570.

[0253] Flexible materials can be suitably used for substrates 510 and 570.

[0254] A material with suppressed unintended impurity permeation is suitably used for the substrate 510 and the substrate 570 . For example, the water vapor permeability is 10 -5 g / m 2 ·day or less, preferably 1 0 -6 g / m 2 ·day or less can be suitably used.

[0255] Materials having approximately equal coefficients of linear expansion can be suitably used for the substrate 510 and the substrate 570 . For example, the coefficient of linear expansion is 1×10 -3 / K or less, preferably 5×10 -5 / K or less, more preferab ly 1×10 -5 / K or less can be suitably used.

[0256] The substrate 510 includes a flexible substrate 510b, an insulating layer that prevents unintended impurities from diffusing into the light-emitting element 510a, and an adhesive layer 510c for bonding the flexible substrate 510b and the insulating layer 510a is a stacked laminate.

[0257] The substrate 570 includes a flexible substrate 570b, an insulating layer that prevents unintended impurities from diffusing into the light-emitting element 570a, and an adhesive layer 570c for bonding the flexible substrate 570b and the insulating layer 570a is a laminate.

[0258] For example, polyester, polyolefin, polyamide (nylon, aramid, etc.), poly imide, polycarbonate or acrylic, urethane, epoxy or a resin having a siloxane bond can be used as the material for the adhesive layer.

[0259] The sealing layer 560 bonds the substrate 570 and the substrate 510 together. The sealing layer 560 has a refractive index higher than that of air It has a high refractive index. Also, when light is extracted to the sealing layer 560 side, the sealing layer 560 is light It also serves as a junction layer. The pixel circuit and light-emitting element (for example, the first light-emitting element 350R) are on the substrate 51 It is located between 0 and board 570.

[0260] Pixel 302 has sub-pixels 302R, 302G, and 302B (Figure 14). (C)). In addition, sub-pixel 302R is equipped with a light-emitting module 380R, and sub-pixel 302G is equipped with a light-emitting module. It is equipped with an optical module 380G, and the sub-pixels 302B are equipped with light-emitting modules 380B.

[0261] For example, the sub-pixel 302R powers the first light-emitting element 350R and the first light-emitting element 350R. The pixel circuit includes a transistor 302t that can supply power (Figure 14(B)). Furthermore, the light-emitting module 380R includes the first light-emitting element 350R and optical elements (e.g., colored layer). It is equipped with 367R.

[0262] The light-emitting element 350R has a first lower electrode 351R, an upper electrode 352, and a lower electrode 351R. It has an EL layer 353 between the upper electrodes 352 (Figure 14(C)).

[0263] The EL layer 353 consists of a first EL layer 353a, a second EL layer 353b, and a first EL layer 3 It includes an intermediate layer 354 between 53a and the second EL layer 353b.

[0264] The light-emitting module 380R has a first colored layer 367R on the substrate 570. The colored layer is special Any material that transmits light of a specific wavelength is acceptable, for example, one that exhibits red, green, or blue light. A material that selectively transmits light can be used. Alternatively, the light emitted by the light-emitting element can be left as is. A transparent area may also be provided.

[0265] For example, the light-emitting module 380R consists of a first light-emitting element 350R and a first colored layer 367R It has a sealing layer 360 that is in contact with the surface.

[0266] The first colored layer 367R is located in a position that overlaps with the first light-emitting element 350R. A portion of the light emitted by the optical element 350R is directed to the sealing layer 360, which also serves as an optical junction layer, and the first colored layer. The light passes through 367R and is emitted to the outside of the light-emitting module 380R, as shown by the arrow in the figure. ru.

[0267] The touch panel 390 has a light-shielding layer 367BM on the substrate 570. The light-shielding layer 367BM is It is provided so as to surround the colored layer (for example, the first colored layer 367R).

[0268] The touch panel 390 is equipped with an anti-reflective layer 367p in a position that overlaps the display unit 301. For example, a circular polarizing plate can be used as the anti-radiation layer 367p.

[0269] The touch panel 390 is equipped with an insulating layer 321. The insulating layer 321 is equipped with transistor 302t It covers the pixel circuit. The insulating layer 321 is a layer that flattens the irregularities caused by the pixel circuit. It can be used in this way. In addition, it suppresses the diffusion of impurities into transistors such as transistor 302t. An insulating layer having layers that can be formed can be applied to the insulating layer 321.

[0270] The touch panel 390 has light-emitting elements (for example, the first light-emitting element 350R) on the insulating layer 321. To possess.

[0271] The touch panel 390 has a partition wall 328 that overlaps the end of the first lower electrode 351R, and an insulating layer 3 21 is located on top of it. Also, a spacer 329 controls the distance between substrate 510 and substrate 570, It is located on wall 328.

[0272] The image signal line driving circuit 303s(1) includes a transistor 303t and a capacitor 303c. Furthermore, the drive circuit can be formed on the same substrate using the same process as the pixel circuit. Figure 14 As shown in (B), the transistor 303t has a second gate 304 on the insulating layer 321 It may be so. The second gate 304 is electrically connected to the gate of transistor 303t. They may be, or different potentials may be applied to them. Also, if necessary, The gate 304 of transistor 2 may be provided on transistor 308t, transistor 302t, etc.

[0273] The imaging pixel 308 receives light from the photoelectric conversion element 308p and the light irradiated onto the photoelectric conversion element 308p. It is equipped with an imaging pixel circuit for detection. The imaging pixel circuit also uses a transistor 308t. include.

[0274] For example, a pin-type photodiode can be used as the photoelectric conversion element 308p.

[0275] The touch panel 390 has wiring 311 that can supply signals, and terminal 319 It is provided in wiring 311. It can also supply signals such as image signals and synchronization signals. FPC309(1) is electrically connected to terminal 319. 1) A printed circuit board (PWB) may be attached to it.

[0276] Transistors formed in the same process are referred to as transistor 302t, transistor 303, and This can be applied to transistors such as the 308t transistor. Regarding the transistor configuration... You can refer to Embodiment 2.

[0277] In addition, the gate, source, and drain of the transistor, as well as each component that makes up the touch panel Materials that can be used for wiring and electrodes include aluminum, titanium, chromium, and nickel. Copper, copper, yttrium, zirconium, molybdenum, silver, tantalum, or tungsten A single metal consisting of n, or an alloy with n as the main component, is used as a single-layer or laminated structure. For example, a single-layer structure of an aluminum film containing silicon, or an aluminum film deposited on a titanium film. Layered two-layer structure, two-layer structure with aluminum film laminated on tungsten film, copper-magnesium A two-layer structure in which a copper film is laminated on an aluminum-aluminum alloy film, and a two-layer structure in which a copper film is laminated on a titanium film. Layered structure, two-layer structure with a copper film laminated on a tungsten film, titanium film or titanium nitride film, and An aluminum film or copper film is laminated on top of a titanium film or titanium nitride film, and further on A three-layer structure in which a titanium film or titanium nitride film is formed, a molybdenum film or molybdenum nitride film and An aluminum film or copper film is laminated on top of the molybdenum film or molybdenum nitride film. Furthermore, there are three-layer structures, such as one in which a molybdenum film or molybdenum nitride film is formed on top of the molybdenum film. Transparent conductive materials containing indium oxide, tin oxide, or zinc oxide may also be used. Using copper containing ions is preferable because it improves the controllability of the shape through etching.

[0278] Furthermore, the same process used to manufacture the aforementioned light-emitting element (for example, the first light-emitting element 350R) By providing the optical element in the non-display area, it can be used as the light-emitting element 22 as exemplified in Embodiment 1. This is possible. Furthermore, the image pixel includes the aforementioned photoelectric conversion element 308p and the image pixel circuit. By providing an imaging pixel manufactured in the same process as 308 in the non-display section, as in Embodiment 1, It can be used as the light-receiving element 21 shown.

[0279] [Configuration Example 2] Figures 15(A) and (B) are perspective views of the touch panel 505. For clarity, substitutes have been used. The main components are shown. Figure 16 is a cross-sectional view between the dashed line X1 and X2 shown in Figure 15(A). be.

[0280] The touch panel 505 includes a display unit 501 and a touch sensor 595 (Figure 15(B)). Furthermore, the touch panel 505 has substrates 510, 570, and 590. Substrates 510, 570, and 590 are all flexible.

[0281] The display unit 501 includes a substrate 510, a plurality of pixels on the substrate 510, and a unit that supplies signals to these pixels. It includes multiple wirings 511 that can be connected to the outer periphery of the substrate 510. It is routed to the terminal 519, and a portion of it forms terminal 519. Terminal 519 is FPC509(1 ) and connect electrically.

[0282] The circuit board 590 includes a touch sensor 595 and multiple connections electrically connected to the touch sensor 595. It is equipped with wiring 598. Multiple wirings 598 are routed around the outer periphery of the circuit board 590, and part of them This constitutes a terminal. This terminal is then electrically connected to FPC509(2). In Figure 15(B), for clarity, the touch is located on the back side (back side of the page) of the substrate 590. The electrodes and wiring of sensor 595 are shown with solid lines.

[0283] For example, a capacitive touch sensor can be used as the touch sensor 595. Quantitative methods include surface capacitance and projected capacitance.

[0284] Projected capacitance systems are classified into self-capacitance and mutual-capacitance types, mainly based on differences in their driving methods. There are several advantages. Using a mutual capacitance method is preferable because it enables simultaneous multi-point detection.

[0285] In the following section, Figure 15(B) shows the case where a projected capacitive touch sensor is applied. We will explain using this method.

[0286] Furthermore, various sensors capable of detecting proximity or contact with objects such as fingers are suitable. It can be used.

[0287] The projected capacitive touch sensor 595 has electrodes 591 and 592. 591 is electrically connected to one of the multiple wires 598, and electrode 592 is connected to one of the multiple wires 598 Connect electrically to any of the others.

[0288] As shown in Figures 15(A) and (B), the electrode 592 is arranged in multiple repeating directions. It has a shape in which quadrilaterals are connected at their corners.

[0289] Electrode 591 is quadrilateral and is repeatedly arranged in a direction intersecting the direction in which electrode 592 extends. It is being done.

[0290] The wiring 594 electrically connects the two electrodes 591 that sandwich electrode 592. A shape that minimizes the area of ​​the intersection between pole 592 and wiring 594 is preferable. This reduces the area where electrodes are not provided, thereby reducing unevenness in transmittance. As a result, it is possible to reduce the brightness unevenness of the light transmitted through the touch sensor 595.

[0291] Furthermore, the shapes of electrodes 591 and 592 are not limited to these and can take on various shapes. For example, If multiple electrodes 591 are arranged so that there are as few gaps as possible, electrodes 5 Multiple electrodes 92 can be provided spaced apart so that they do not overlap with electrode 591. i. At this time, between the two adjacent electrodes 592, a dummy electrode electrically insulated from them is placed. Providing electrodes is preferable because it reduces the area of ​​regions with different transmittances.

[0292] The touch sensor 595 includes a substrate 590, electrodes 591 arranged in a staggered pattern on the substrate 590, and electrode 592, electrode 591 and the insulating layer 593 covering electrode 592 and adjacent electrode 591 It is equipped with wiring 594 for electrical connection.

[0293] The adhesive layer 597 is applied to the substrate 590 so that the touch sensor 595 overlaps the display unit 501. It is bonded to board 570.

[0294] Electrodes 591 and 592 are formed using a light-transmitting conductive material. Examples of conductive materials include indium oxide, indium tin oxide, and indium zinc oxide. Conductive oxides such as zinc oxide and zinc oxide with added gallium can be used. Oh, you can also use a film containing graphene. A film containing graphene can be formed into a film shape, for example. The resulting graphene oxide-containing film can be reduced to form a new film. As a reduction method, Examples include methods involving the application of heat.

[0295] After depositing a translucent conductive material onto the substrate 590 by sputtering, Various patterning techniques, such as trisography, are used to remove unwanted parts, and electrode 59 1 and electrode 592 can be formed.

[0296] Furthermore, the materials used for the insulating layer 593 include, for example, resins such as acrylic and epoxy. In addition to resins containing siloxane bonds, silicon oxide, silicon oxide nitride, and aluminum oxide are also used. Inorganic insulating materials such as those mentioned above can also be used.

[0297] Furthermore, an opening reaching electrode 591 is provided in the insulating layer 593, and wiring 594 is adjacent to the electrode. Connect 591 electrically. Translucent conductive material increases the aperture ratio of the touch panel. Therefore, it can be suitably used for wiring 594. Also, electrodes 591 and 59 Materials with higher conductivity than 2 can reduce electrical resistance and are therefore suitable for use in wiring 594. can.

[0298] One electrode 592 extends in one direction, and multiple electrodes 592 are arranged in a stripe pattern. .

[0299] Wiring 594 is provided so as to intersect with electrode 592.

[0300] A pair of electrodes 591 are provided flanking one electrode 592, and the wiring 594 is connected to the pair of electrodes 591 They are electrically connected.

[0301] Furthermore, the multiple electrodes 591 do not necessarily need to be arranged in a direction perpendicular to one electrode 592. Alternatively, they may be arranged to form an angle of less than 90 degrees.

[0302] One of the wires 598 is electrically connected to electrode 591 or electrode 592. The part functions as a terminal. Wiring 598 can be, for example, aluminum, gold, platinum, or silver. Nickel, titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, or paraben. Metallic materials such as zinc, or alloy materials containing such metallic materials, can be used.

[0303] Furthermore, an insulating layer is provided to cover the insulating layer 593 and the wiring 594 to protect the touch sensor 595. It is possible.

[0304] Furthermore, the connection layer 599 electrically connects the wiring 598 and the FPC 509(2).

[0305] The connecting layer 599 can be any anisotropic conductive film (ACF: Anisotropic Conductive film, or anisotropic conductive paste (ACP: Anisotropic Conductive Film) You can use pic (Practical Conductive Paste), etc.

[0306] The adhesive layer 597 is translucent. For example, thermosetting resins or UV-curing resins can be used. This can be done, specifically by having acrylic, urethane, epoxy, or siloxane bonds. Resins such as plastics can be used.

[0307] The display unit 501 comprises multiple pixels arranged in a matrix. The pixels are display elements and It includes a pixel circuit that drives the display element.

[0308] In this embodiment, when an organic EL element that emits white light is applied as a display element, As explained above, display elements are not limited to these.

[0309] For example, an organic EL element with different emission colors can be used so that each sub-pixel emits a different color of light. It may also be applied to each pixel.

[0310] The substrate 510, substrate 570, and sealing layer 560 can be configured in the same way as in Configuration Example 1.

[0311] Each pixel includes a sub-pixel 502R, which in turn includes a light-emitting module 580R.

[0312] The sub-pixel 502R supplies power to the first light-emitting element 550R and the first light-emitting element 550R. It includes a pixel circuit containing a transistor 502t that can perform the following: Also, a light-emitting module 580R comprises a first light-emitting element 550R and an optical element (e.g., a colored layer 567R).

[0313] The light-emitting element 550R has a lower electrode, an upper electrode, and an EL layer between the lower electrode and the upper electrode. .

[0314] The light-emitting module 580R has a first colored layer 567R in the direction from which light is extracted.

[0315] Furthermore, if the sealing layer 560 is provided on the side from which light is extracted, the sealing layer 560 is the first The light-emitting element 550R is in contact with the first colored layer 567R.

[0316] The first colored layer 567R is located in a position that overlaps with the first light-emitting element 550R. A portion of the light emitted by the optical element 550R passes through the first colored layer 567R, as shown by the arrow in the figure. It is emitted to the outside of the directional light-emitting module 580R.

[0317] The display unit 501 has a light-shielding layer 567BM in the direction from which light is emitted. It is provided so as to surround the colored layer (for example, the first colored layer 567R).

[0318] The display unit 501 is provided with an anti-reflective layer 567p in a position that overlaps the pixels. For p, for example, a circular polarizer can be used.

[0319] The display unit 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t. Furthermore, the insulating film 521 is used as a layer to flatten the irregularities caused by the pixel circuit. Furthermore, a laminated film containing a layer that can suppress the diffusion of impurities can be suitable for the insulating film 521. It can be used. This prevents the diffusion of unexpected impurities in transistors such as the 502t. This can suppress the decline in reliability.

[0320] The display unit 501 has a light-emitting element (for example, a first light-emitting element 550R) on the insulating film 521. ru.

[0321] The display unit 501 has a partition wall 528 on the insulating film 521 that overlaps the end of the first lower electrode. Furthermore, a spacer is provided on the partition wall 528 to control the distance between substrate 510 and substrate 570.

[0322] The scan line driving circuit 503g(1) includes a transistor 503t and a capacitor 503c. Oh, the drive circuit can be formed on the same substrate using the same process as the pixel circuit.

[0323] The display unit 501 is equipped with wiring 511 that can supply signals, and terminal 519 is connected to wiring 5 It is located at 11. Furthermore, F can supply signals such as image signals and synchronization signals. PC509(1) is electrically connected to terminal 519.

[0324] Note that a printed circuit board (PWB) may be attached to FPC509(1). stomach.

[0325] The display unit 501 has wiring such as scan lines, signal lines and power lines. Various conductive films as described above It can be used for wiring.

[0326] Furthermore, various transistors can be applied to the display unit 501. Bottom-gate type transistors The configuration when the TA is applied to the display unit 501 is shown in Figures 16(A) and (B).

[0327] For example, a semiconductor layer containing oxide semiconductors, amorphous silicon, etc. is shown in Figure 16(A). This can be applied to the transistors 502t and 503t shown.

[0328] For example, a semiconductor containing polycrystalline silicon crystallized by a process such as laser annealing. The layer is applied to transistors 502t and 503t shown in Figure 16(B). It is possible.

[0329] Furthermore, Figure 16 shows the configuration when a top-gate type transistor is applied to the display unit 501. (C) is illustrated.

[0330] For example, a single-crystal silicon film transposed from a polycrystalline silicon or single-crystal silicon substrate. The semiconductor layer containing the above is shown in Figure 16(C) for transistors 502t and 5 It can be applied to 03t.

[0331] Furthermore, the same process used to manufacture the aforementioned light-emitting element (for example, the first light-emitting element 550R) By providing the optical element in the non-display area, it can be used as the light-emitting element 22 as exemplified in Embodiment 1. It is possible.

[0332] [Configuration Example 3] Figure 17 is a cross-sectional view of the touch panel 505B. The touch panel described in this embodiment The 505B is a display unit that displays the supplied image information on the side where the transistor is located. The features of the configuration include the inclusion of 501 and the fact that the touch sensor is provided on the display unit's circuit board 510 side. This differs from the touch panel 505 in Example 2. Here, we will explain the different configuration in detail, similar to the previous example. Where the configuration can be used, refer to the explanation above.

[0333] The first colored layer 567R is located in a position that overlaps with the first light-emitting element 550R. Also, Figure 17( The light-emitting element 550R shown in A) emits light on the side where the transistor 502t is located. As a result, some of the light emitted by the light-emitting element 550R passes through the first colored layer 567R. The light is emitted to the outside of the light-emitting module 580R in the direction of the arrow shown in the diagram.

[0334] The display unit 501 has a light-shielding layer 567BM in the direction from which light is emitted. It is provided so as to surround the colored layer (for example, the first colored layer 567R).

[0335] The touch sensor 595 is located on the circuit board 510 side of the display unit 501 (Figure 17(A)). ).

[0336] The adhesive layer 597 is located between the substrate 510 and the substrate 590, and connects the display unit 501 and the touch sensor 5 Glue together 95.

[0337] Furthermore, various transistors can be applied to the display unit 501. Bottom-gate type transistors The configuration when the TA is applied to the display unit 501 is shown in Figures 17(A) and (B).

[0338] For example, a semiconductor layer containing oxide semiconductors, amorphous silicon, etc. is shown in Figure 17(A). This can be applied to the transistors 502t and 503t shown.

[0339] For example, a semiconductor layer containing polycrystalline silicon, etc., is used in the transistor 5 shown in Figure 17(B). This can be applied to the 02t and transistor 503t.

[0340] Furthermore, Figure 17 shows the configuration when a top-gate type transistor is applied to the display unit 501. (C) is illustrated.

[0341] For example, a semiconductor layer including polycrystalline silicon or a transferred single-crystal silicon film, as shown in Figure 17. This can be applied to transistors 502t and 503t shown in (C). ru.

[0342] Furthermore, the same process used to manufacture the aforementioned light-emitting element (for example, the first light-emitting element 550R) By providing the optical element in the non-display area, it can be used as the light-emitting element 22 as exemplified in Embodiment 1. It is possible.

[0343] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0344] (Embodiment 4) In this embodiment, a touch is applicable to the display panel of an electronic device according to one aspect of the present invention. An example of a panel driving method will be explained with reference to the drawings.

[0345] [Examples of sensor detection methods] Figure 18(A) is a block diagram showing the configuration of a mutually capacitive touch sensor. (A) shows the pulse voltage output circuit 601 and the current detection circuit 602. See Figure 18. In (A), the electrode 621 to which a pulse voltage is applied and the electrode 622 to which the change in current is detected These are shown as six wires each for X1-X6 and Y1-Y6. Also, Figure 18( A) illustrates the capacitance 603 formed by the superposition of electrodes 121 and 122. They are present. Furthermore, electrodes 121 and 122 may be interchangeable in their function.

[0346] The pulse voltage output circuit 601 is a circuit for sequentially applying pulses to the X1-X6 wiring. Yes. When a pulse voltage is applied to the wiring X1-X6, electrode 1 forms capacitance 603. An electric field is generated between electrode 21 and electrode 122. Due to shielding etc., the electric field generated between these electrodes has a capacitance of 60 By causing a change in the mutual capacitance of 3, proximity or contact of the object to be detected is detected. It is possible.

[0347] The current detection circuit 602 detects changes in the mutual capacitance of capacitor 603 in the wiring of Y1 to Y6. This is a circuit for detecting changes in current. In the wiring of Y1-Y6, proximity of the object to be detected, and If there is no contact, the detected current value does not change, but if the object being detected is nearby or in contact with it... When the mutual capacitance decreases, a change in the current value is detected. This can be done using an integrating circuit or similar method.

[0348] Next, Figure 18(B) shows the input of the mutual capacitive touch sensor shown in Figure 18(A). The timing chart of the output waveform is shown. Figure 18(B) shows the timing of each matrix in one frame period. The system will detect the object to be detected. Also, in Figure 18(B), the case where no object to be detected is detected ( This shows two cases: one where the object to be detected is not touched, and another where the object to be detected is touched. Regarding the wiring of Y1-Y6, the waveforms shown represent the voltage values ​​corresponding to the detected current values. Yes, they are.

[0349] A pulse voltage is applied sequentially to the wiring of X1-X6, and Y1- The waveform changes in the Y6 wiring. If there is no proximity or contact with the detected object, X1-X6 The waveforms of Y1-Y6 change uniformly in response to changes in the voltage of the wiring. Meanwhile, when the object to be detected is nearby... Alternatively, at the point of contact, the current value decreases, and therefore the waveform of the corresponding voltage value also changes. ru.

[0350] In this way, by detecting changes in mutual capacitance, the proximity or contact of the object being detected can be detected. It is possible.

[0351] Furthermore, in Figure 18(A), only capacitance 603 is provided at the wiring intersection as a touch sensor. The configuration of a passive touch sensor was shown, but an active type equipped with a transistor and a capacitor is also shown. It may also be used as a touch sensor. Figure 19 shows one of the sensors included in an active type touch sensor. An example of a signaling circuit is shown.

[0352] The sensor circuit consists of capacitor 603, transistor 611, transistor 612, and transistor It has a transistor 613. When a signal G2 is applied to the gate of transistor 613, the source or A voltage VRES is applied to one of the drains, and the other is connected to one electrode and the transistor with capacitance 603. Electrically connect to the gate of transistor 611. Transistor 611 is either source or drain. One end is electrically connected to either the source or drain of transistor 612, and the other end is connected to a voltage V SS is given. Transistor 612 is given signal G2 at its gate, source or drain The other end of the input is electrically connected to the wiring ML. Voltage VSS is applied to the other electrode of capacitance 603. It can be obtained.

[0353] Next, I will explain the operation of the sensor circuit. First, the signal G2 is transistor 613 When a potential is applied that turns on the transistor, the gate of transistor 611 is connected. A potential corresponding to the voltage VRES is applied to the n. Then, the transistor is used as the signal G2. By applying a potential that turns off 613, the potential at node n is maintained.

[0354] Next, the mutual capacitance of capacitance 603 changes due to the proximity or contact of a detected object such as a finger. Consequently, the potential of node n changes from VRES.

[0355] The read operation applies a potential to signal G1 that turns on transistor 612. The current flowing through transistor 611, that is, the current flowing through wiring ML, is determined by the potential of do n. It changes. By detecting this current, it is possible to detect the proximity or contact of the object being detected. can.

[0356] For transistors 611, 612, and 613, the channel is It is preferable to use a transistor in which an oxide semiconductor is applied to the semiconductor layer formed. By applying such a transistor to transistor 613, the potential of node n This makes it possible to maintain the VRES for a long period of time, and to resupply VRES to node n. This can reduce the frequency of refresh operations.

[0357] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination. [Explanation of Symbols]

[0358] 10 Electronic equipment 11a Support 11b Support 11c Support 11d Support 11e Support 12 Connection part 12a neutral line 13 Display Panel 13_1 Display Panel 13_2 Display Panel 13a Display section 13b Hidden part 14. Detection means 15 FPC 16 Circuit boards 17 Batteries 18 Wiring 21 Photodetector 22 Light-emitting element 23 light 24 areas 25 areas 31 parts 32 parts 33 parts 41 Input Buttons 42 Power button 43 External connection terminals 44 card slots 45 Optical Sensors 46 Cameras 47 Light source 48 speakers 49 Mike 51 Antenna 121 Electrode 122 electrodes 201 Fabricated substrate 203 Exfoliation layer 205 Fabricated substrates 207 Delamination layer 230 light-emitting elements 301 Display section 302 pixels 302B subpixels 302G sub-pixels 302R sub-pixel 302t transistor 303c capacity 303g(1) Scan line drive circuit 303g(2) Image Pixel Driving Circuit 303s(1) Image signal line driving circuit 303s(2) Imaging signal line drive circuit 303t transistor Gate 304 308 image pixels 308p Photoelectric element 308t transistor 309 FPC 311 Wiring 319 terminals 321 Insulating layer 328 Bulkhead 329 Spacer 350R light-emitting element 351R lower electrode 352 Upper electrode 353 EL layer 353a EL layer 353b EL layer 354 Middle Class 360 sealing layer 367BM light shielding layer 367p anti-reflection layer 367R colored layer 380B Light-Emitting Module 380G Light-Emitting Module 380R Light-Emitting Module 390 Touch Panel 501 Display section 502R sub-pixel 502t transistor 503c capacity 503g scan line drive circuit 503t transistor 505 Touch Panel 505B Touch Panel 509 FPC 510 circuit board 510a Insulating layer 510b flexible substrate 510c adhesive layer 511 Wiring 519 terminals 521 Insulating film 528 Bulkhead 550R luminescent element 560 Sealing layer 567BM light shielding layer 567p anti-reflection layer 567R colored layer 570 circuit boards 570a Insulating layer 570b flexible substrate 570c ​​adhesive layer 580R Light-Emitting Module 590 circuit boards 591 Electrode 592 Electrode 593 Insulating layer 594 Wiring 595 Touch Sensor 597 Adhesive layer 598 Wiring 599 Connectivity Layer 601 Pulse voltage output circuit 602 Current detection circuit 603 capacity 611 transistors 612 transistors 613 Transistors 621 Electrode 622 Electrode 801 circuit board 803 circuit board 804 Light-emitting part 806 Drive Circuit Section 808 FPC 811 Adhesive layer 813 Insulating layer 814 Conductive layer 815 Insulating layer 816 Conductive layer 817 Insulating layer 817a Insulating layer 817b Insulating layer 820 transistors 821 Insulating layer 822 transistors 823 Sealing layer 824 Sealing layer 825 Connector 827 Spacer 830 Light-emitting elements 831 Lower electrode 833 EL layer 835 Upper electrode 841 Adhesive layer 843 Insulating layer 845 Colored layer 847 Light blocking layer 849 Overcoat 857 Conductive layer 857a Conductive layer 857b Conductive layer

Claims

1. It has a display panel with a display unit, An electronic device that can be folded with the display surface of the display panel facing inward, In the unfolded state of the display panel, a first support is provided which is positioned on the back side of the display surface and has the function of supporting a part of the display panel, In the unfolded state of the display panel, a second support is provided which is positioned on the back side of the display surface and has the function of supporting another part of the display panel, In the state in which the display panel is unfolded, it has a light-receiving element located on the back side of the display surface, When the display panel is folded, the first support and the second support are arranged to overlap each other. The first support has an opening, In a plan view with the display panel unfolded, the light-receiving element overlaps with the display panel and also overlaps with the opening. The light-receiving element has the function of detecting light transmitted through the opening from the display panel side. The display panel is an electronic device having a function in which the display is controlled in accordance with the light detected by the light-receiving element.

2. It has a display panel with a display unit, An electronic device that can be folded with the display surface of the display panel facing inward, In the unfolded state of the display panel, a first support is provided which is positioned on the back side of the display surface and has the function of supporting a part of the display panel, In the unfolded state of the display panel, a second support is provided which is positioned on the back side of the display surface and has the function of supporting another part of the display panel, In the state in which the display panel is unfolded, a light-receiving element is arranged on the back side of the display surface, In a plan view with the display panel unfolded, it has a hinge that overlaps with at least a portion of the first support and also overlaps with at least a portion of the second support. When the display panel is folded, the first support and the second support are arranged to overlap each other. The first support has an opening, In a plan view with the display panel unfolded, the light-receiving element overlaps with the display panel and also overlaps with the opening. The light-receiving element has the function of detecting light transmitted through the opening from the display panel side. The display panel has a function in which the display is controlled according to the light detected by the light-receiving element. The hinge is an electronic device that has the function of fixing the display panel in a folded state.

3. In claim 1 or 2, An electronic device having a magnet that has the function of fixing the display panel in a folded state.

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