Apparatus for manufacturing resin compositions and method for manufacturing resin compositions

Abstract

This method produces resin compositions with excellent shape flexibility and thermal conductivity. [Solution] A particle-containing resin containing particles that orient themselves upon application of voltage is supplied to a mold shaped like a three-dimensional object. An electric field is applied to the particle-containing resin supplied to the mold, and a curing treatment is performed on the particle-containing resin supplied to the mold for curing.

Description

Technical Field

[0001] The present disclosure relates to an apparatus for producing a resin composition and a method for producing a resin composition. Background Art

[0002] In recent years, highly integrated semiconductor devices, power devices and the like handle large currents and high voltages, resulting in large heat generation, and improvement of heat dissipation performance has become an issue. Accordingly, heat transfer members for filling gaps between heating elements such as semiconductor devices and heat sinks to improve thermal conductivity have attracted attention. As heat transfer members, thermally conductive sheets and the like are known, which are formed by blending high thermal conductivity particles (fillers) such as alumina, boron nitride, and aluminum nitride into a resin such as silicone, and molding the mixture into a sheet shape. Prior Art Documents Patent Documents

[0003] Patent Document 1 International Publication No. 2024 / 219383 Summary of Invention Problems to be Solved by the Invention

[0004] Since the shapes of application targets such as heating elements vary, there is a problem that sheet-shaped heat transfer members cannot achieve sufficient adhesion, and thermal conductivity is impaired.

[0005] A main object of the present disclosure is to produce a resin composition with excellent compatibility with an application target. Means for Solving the Problems

[0006] An apparatus for producing a resin composition according to an embodiment of the present invention comprises: a mold that reproduces the three-dimensional shape of the outer profile of an application target; and a resin supply unit that supplies a particle-containing resin containing particles that are oriented by application of an electric field to the mold. An electric field application unit that applies an electric field along a predetermined direction to the particle-containing resin supplied to the mold, The system includes a curing unit that performs a curing treatment on the particle-containing resin supplied to the mold. [Effects of the Invention]

[0007] According to embodiments of the present invention, a resin composition with excellent compatibility with the target object can be manufactured. [Brief explanation of the drawing]

[0008] [Figure 1] A cross-sectional view showing an example of use of a resin composition manufactured using the resin composition manufacturing apparatus according to Embodiment 1. [Figure 2] A perspective view showing an example of resin composition use, with the cooling components in Figure 1 omitted. [Figure 3] A schematic cross-sectional view of a mold used in the manufacturing apparatus for the resin composition according to Embodiment 1. [Figure 4] A schematic diagram showing the configuration of a manufacturing apparatus for a resin composition according to Embodiment 1. [Figure 5] A flowchart showing the operation process of the resin composition manufacturing apparatus according to Embodiment 1. [Figure 6] A schematic diagram showing an example of operation of a resin composition manufacturing apparatus according to Embodiment 1. [Figure 7] A schematic diagram showing an example of operation of a resin composition manufacturing apparatus according to Embodiment 1. [Figure 8] A schematic diagram showing the configuration of a manufacturing apparatus for a resin composition according to Embodiment 2. [Figure 9] A flowchart showing the operation process of the resin composition manufacturing apparatus according to Embodiment 2. [Figure 10] A schematic diagram showing an example of operation of a resin composition manufacturing apparatus according to Embodiment 2. [Figure 11] A schematic diagram showing an example of operation of a resin composition manufacturing apparatus according to Embodiment 2. [Figure 12] Front view of the manufacturing apparatus for the resin composition according to Embodiment 3. [Figure 13]A side view of the apparatus for producing a resin composition according to Embodiment 3. [Figure 14] A block diagram showing an example of the functional configuration of the apparatus for producing a resin composition according to Embodiment 3. [Figure 15] A front view and a side view showing the operation of the apparatus for producing a resin composition according to Embodiment 3. [Figure 16] A front view and a side view showing the operation of the apparatus for producing a resin composition according to Embodiment 3. [Figure 17] A front view and a side view showing the operation of the apparatus for producing a resin composition according to Embodiment 3. [Figure 18] A front view and a side view showing the operation of the apparatus for producing a resin composition according to Embodiment 3. [Figure 19] A front view and a side view showing the operation of the apparatus for producing a resin composition according to Embodiment 3. [Figure 20] A front view and a side view showing the operation of the apparatus for producing a resin composition according to Embodiment 3. [Figure 21] A front view and a side view showing the operation of the apparatus for producing a resin composition according to Embodiment 3. [Modes for Carrying Out the Invention]

[0009] Hereinafter, embodiments will be described with reference to the drawings. In the following description of the embodiments and the drawings, components denoted by the same reference numerals represent the same or corresponding parts.

[0010] Embodiment 1. Figure 1 is a cross-sectional view showing an example of use of the resin composition 40 produced by the apparatus 100 for producing a resin composition of the present embodiment. Figure 1 shows an example in which a heating element 2 connected on a substrate 1 and a cooling component 3 are connected with a resin composition 40. The heating element 2 is, for example, a heat-generating component such as a semiconductor device or a power device. The cooling component 3 is, for example, a heat sink. The cooling component 3 is a heat radiator that dissipates heat from the heating element 2. The resin composition 40 is a composition obtained by molding the particle-containing resin 4 using the resin composition manufacturing apparatus 100 of this embodiment. The resin composition 40 has excellent thermal conductivity. The resin composition 40 functions as a heat transfer material between the heating element 2 and the cooling component 3. The three-dimensional shape of the resin composition 40 conforms to the three-dimensional shape of the heating element 2. That is, the resin composition 40 has a portion of the three-dimensional shape that contacts (fits) without gaps to the three-dimensional shape that defines the outer shape of the portion of the heating element 2 to which the heat transfer member is applied. More specifically, the resin composition 40 is roughly a rectangular parallelepiped in the shape of a plate, and the surface applied to the heating element 2 has a concave three-dimensional shape corresponding to the three-dimensional shape of the heating element 2. Note that the heating element 2 is an example of an object to which it is applied. In this embodiment and subsequent embodiments, an example of manufacturing a resin composition 40 to be applied to the heating element 2 will be described. However, a resin composition 40 to be applied to an object other than the heating element 2 may also be manufactured. In this case as well, the resin composition 40 is molded to conform to the three-dimensional shape of the object to be applied.

[0011] The particle-containing resin 4, which is a component material of the resin composition 40, is a mixture of thermally conductive particles such as alumina, boron nitride, aluminum nitride, and diamond in a base resin such as silicone, acrylic, epoxy, or urethane. The resin has a viscosity of approximately 0.01 to 10 Pa·s when supplied to mold 5, which will be described later. Preferably, it is in the range of 0.5 to 3 Pa·s. In other words, the particle-containing resin 4 is initially liquid. The particle size (length) of the included particles is approximately 10 to 100 μm. The reason for specifying length is that a shape with varying lengths is considered to be more easily oriented by an electric field than a perfectly spherical shape. However, this does not exclude spherical particles. Since the heat transfer efficiency of the resin composition 40 is thought to improve as its thickness decreases, it is preferable to make the thickness of the resin composition 40 between the surface of the heating element 2 facing the cooling component 3 (the upper surface of the heating element 2 in Figure 1) and the cooling component 3 (the thickness of the applied portion) as thin as possible. On the other hand, as the thickness of the applied portion of the resin composition 40 decreases, its flexibility in the compression direction decreases and it becomes more difficult to conform to the surface (adhesion decreases), making it difficult to absorb the difference in flatness between the surface of the heating element 2 and the surface of the cooling component 3. For this reason, it is preferable to adjust the thickness of the applied portion of the resin composition 40, taking into account the heat transfer efficiency and adhesion required for the object to which it is applied.

[0012] By applying an electric field to the particle-containing resin 4, the particles can be aligned (oriented) in a direction along the electric field within the resin. By curing the particle-containing resin 4 in this state, a resin composition 40 is formed. The cured particle-containing resin 4, i.e., the resin composition 40, is a solid. In this embodiment, the resin that forms the base material of the particle-containing resin 4 is assumed to be a thermosetting resin. However, the base material resin may also be photocurable. If the base material resin is photocurable, a photocuring treatment is performed instead of the thermosetting treatment described later.

[0013] Figure 2 is a perspective view showing the state in which the resin composition 40 has been applied to the heating element 2 mounted on the substrate 1. As shown in Figure 2, the resin composition 40 is arranged to cover the sides and top surface of the heating element 2.

[0014] ***Outline configuration of the manufacturing equipment and manufacturing method (1)*** Next, the schematic configuration and manufacturing method of a resin composition manufacturing apparatus, which is a first embodiment for manufacturing the resin composition 40, will be described.

[0015] Figure 3 shows a cross-section of the mold 5 for molding the particle-containing resin 4. Model 5 is modeled after the three-dimensional shape of the resin composition 40. Type 5 is divided into the first type (lower type) 51 and the second type (upper type) 52. The first mold 51 is shaped to match the outer surface of the resin composition 40. In other words, the first mold 51 is a mold that is the same size as the top surface of the rectangle of the resin composition 40 and has recesses that are the same depth as the height of the sides. The second mold 52 is shaped to match the three-dimensional form of the heating element 2. In other words, the second mold 52 has a convex portion that has the same shape as the outer surface of the portion of the heating element 2 that is exposed above the upper surface of the substrate 1, as shown in Figure 2. Therefore, the shape of the surface of the resin composition 40 facing the heating element 2 matches the three-dimensional form of the heating element 2. Since the heating element 2 shown in Figure 1 has a convex three-dimensional form, the second mold 52 in Figure 3 also has a convex three-dimensional form. If the heating element 2 had a concave three-dimensional form, the second mold 52 would have a concave three-dimensional form. Therefore, by combining the first mold 51 and the second mold 52, a molding space with the same shape as the resin composition 40 is formed inside the mold 5. In other words, the second mold 52 works in cooperation with the first mold 51 to mold the particle-containing resin supplied to the first mold 51. The first type 51 corresponds to the first part of the type. The second type 52 corresponds to the second part of the type. In the following, when there is no need to distinguish between the first type 51 and the second type 52, both will be collectively referred to as type 5. Type 5 is made using an insulating material. Type 5 is made from materials such as polyester, polycarbonate, or polytetrafluoroethylene.

[0016] Figure 4 shows a schematic configuration of the resin composition manufacturing apparatus 100.

[0017] In Figure 4, type 5 (the first type 51 and the second type 52) is the same as that shown in Figure 3. Type 5 is positioned with its lower side, i.e., the side facing the first type 51, resting on the electrode plate 61. The electrode plate 61 is fixedly positioned on the heater plate 71. The heater plate 71 is fixedly positioned on a base (not shown). On the upper side of mold 5, that is, on the side of the second mold 52, the electrode plate 62 and the heater plate 72 are arranged so as to be able to move vertically toward and away from each other. In other words, the heater plate 72 is supported so as to be able to move up and down by a lifting device (not shown). The electrode plate 62 is fixed to the lower side (mold 5 side) of the heater plate 72. As a result, the electrode plate 62 and the heater plate 72 are able to move up and down between the standby position shown by the dashed line and the contact position with mold 5 (processing position) shown by the solid line by the lifting device (not shown). In type 5, the electrode plate 62 and heater plate 72 are moved to the processing position and are sandwiched between the electrode plate 61 and electrode plate 62 and the heater plate 71 and heater plate 72. A pair of holders 8 are positioned so as to sandwich the mold 5, which is placed on the electrode plate 61. The holders 8 are configured to be movable in directions toward and toward each other, and by moving toward each other, they can hold the mold 5 by sandwiching it from both sides. The holders 8 perform the functions of restricting the position of the mold 5 relative to the electrode plate 61 and positioning the mold 5. Therefore, although the pair of holders 8 are shown in the direction along the plane of the paper in Figure 4, the pair of holders 8 may also be arranged in the direction perpendicular to the plane of the paper. In this way, the mold 5 can be restricted and positioned from four directions.

[0018] A power supply for electrode plates (not shown) is connected to electrode plates 61 and 62. This power supply is configured to apply a predetermined voltage between electrode plate 61 and electrode plate 62. A power supply for the heater plates (not shown) is connected to the heater plates 71 and 72. This power supply is configured to supply a predetermined amount of power to the heater plates 71 and 72. For example, sheathed heaters can be used as the heater plates 71 and 72. However, the type of heater plates 71 and 72 is not limited as long as they can apply the heat necessary for curing the particle-containing resin 4. A nozzle 9 is positioned to the side of the electrode plate 61. The nozzle 9 is a needle nozzle that supplies the particle-containing resin 4 to the first mold 51. The nozzle 9 is movable in the left-right direction in Figure 4 by a moving device (not shown). Figure 4 shows the nozzle 9 in a standby position on the left side of the electrode plate 61. The nozzle 9 is capable of moving horizontally from this standby position to near the center of the electrode plate 61.

[0019] Furthermore, the resin composition manufacturing apparatus 100 may also include a mold 5 transport unit 10 (see Figure 6(e)) and a control device, in addition to the mechanism shown in Figure 4. The transport unit 10 holds the mold 5 and places the mold 5 onto the electrode plate 61 and removes the mold 5 from the electrode plate 61. For example, the transport unit can be configured to individually hold and transport the first mold 51 and the second mold 52, or to integrally hold and transport the first mold 51 and the second mold 52. The control device controls the amount of particle-containing resin 4 discharged from the nozzle 9, the voltage applied to the electrode plate 61 and electrode plate 62, the temperature of the heater plate 71 and heater plate 72, the processing time for each process, the operation of the transport unit, and the like.

[0020] ******Manufacturing process of resin composition 40*** Figure 5 is a flowchart showing the manufacturing process of the resin composition 40. Figures 6 and 7 show examples of operations in each manufacturing process of the resin composition 40. The manufacturing process of the resin composition 40 will now be explained following the flowchart in Figure 5, with reference to Figures 6 and 7.

[0021] As shown in Figure 6(a), the first mold 51 is placed on the electrode plate 61 by a transport unit 10 (not shown) (step S101). Note that Figure 6(a) shows the state in which the first mold 51 has been placed by the transport unit 10, and the transport unit 10 is not shown.

[0022] Furthermore, the holder 8 fixes the position of the first mold 51 on the electrode plate 61 (step S102).

[0023] Next, as shown in Figure 6(b), the nozzle 9 is moved from the standby position to the center of the electrode plate 61, that is, to the discharge position on the first mold 51 placed on the electrode plate 61. At this position, a predetermined amount of particle-containing resin 4 is discharged from the nozzle 9 into the first mold 51, supplying the particle-containing resin 4 to the first mold 51 (step S103). Here, the predetermined amount of particle-containing resin 4 is the amount of particle-containing resin 4 that just fills the molding space of the particle-containing resin 4 formed by the first mold 51 and the second mold 52. The predetermined amount can be calculated by a control device or the like based on the design information of the mold 5, for example. Alternatively, three-dimensional information of the first mold 51 and the second mold 52 can be obtained using a 3D scanner or the like, and the volume of the molding space can be calculated based on the results to determine the predetermined amount. After dispensing is complete, return the nozzle 9 to the standby position shown by the dashed line in Figure 6(b).

[0024] Next, the transport unit 10 places the second mold 52 on top of the first mold 51, as shown in Figure 6(c) (step S104).

[0025] Next, as shown in Figure 6(d), the electrode plate 62 and heater plate 72 are lowered by a lifting device (not shown), and the electrode plate 62 is brought into contact with the upper part of the second mold 52. This sandwiches the mold 5 between the electrode plate 61 and the electrode plate 62. Then, a voltage is applied between the electrode plate 61 and the electrode plate 62, applying an electric field to the particle-containing resin 4, and the thermally conductive particles contained in the particle-containing resin 4 are oriented (aligned) by the electric field (step S105). The optimal applied voltage and processing time vary depending on the composition of the particle-containing resin 4, the distance between electrode plates 61 and 62, and the material of the mold 5. Therefore, it is advisable to pre-store the voltage and processing time corresponding to the type of mold 5 in the control device's memory and switch between them accordingly. For example, the control device applies a voltage of 3 to 10 kV for 10 to 60 minutes.

[0026] After a predetermined time has elapsed, heating is started by heater plates 71 and 72 while maintaining the voltage applied to electrode plates 61 and 62, thereby curing the particle-containing resin 4 (step S106). For example, if the resin that forms the base material of the particle-containing resin 4 is thermosetting silicone, the particle-containing resin 4 is cured by heating it at 80-100 degrees Celsius for 10-30 minutes.

[0027] Here, the particle-containing resin 4 is heated while maintaining the voltage applied to electrode plates 61 and 62. However, the particle-containing resin 4 may also be heated after stopping the voltage application. However, if stopping the voltage application could disrupt the orientation of the particles before the particle-containing resin 4 hardens, it is preferable to heat the particle-containing resin 4 while maintaining the voltage application. Furthermore, the application of voltage to electrode plates 61 and 62 may be continued until heating is complete, or it may be stopped at the time when the particle-containing resin 4 hardens to the point where the particles stop moving, if that time is known. The time it takes for the particle-containing resin 4 to harden can be obtained through experiments, etc. Note that the application of the electric field and heating are stopped when a predetermined heating time has elapsed.

[0028] Next, the electrode plate 62 and heater plate 72 are moved to the retracted position by the lifting device, and then the holder 8 is released as shown in Figure 6(e). The transport unit 10 then holds the second mold 52 and moves the mold 5 to another location (the position for removing the resin composition 40). In this case, even if only the second mold 52 is held, the first mold 51 and the resin composition 40 remain attached to the second mold 52 due to their adhesion to the resin composition 40. At the point where the resin composition 40 is removed, as shown in Figure 7(f), the first mold 51 is held by a holding unit 20 different from the transport unit 10. In this state, the transport unit 10 and the holding unit 20 are inverted together to the upper limit, and the mold 5 is inverted upside down (step S107).

[0029] Next, as shown in Figure 7(g), with the first mold 51 and the second mold 52 each held by the transport unit 10 and the holding unit 20, the holding unit 20 is moved away from the transport unit 10, separating the second mold 52 from the first mold 51. At this time, since the contact area between the first mold 51 and the resin composition 40 is larger than the contact area between the second mold 52 and the resin composition 40, the resin composition 40 remains on the first mold 51 and is removed from the second mold 52. Furthermore, as shown in Figure 7(h), the transport unit 10 moves the first mold 51 onto the substrate 1 on which the heating element 2 is placed, presses the resin composition 40 onto the heating element 2 to attach it (step S108), and removes the first mold 51. At this time, the resin composition 40 can be attached to the heating element 2 by its own adhesion force (e.g., self-adhesion).

[0030] ***Explanation of the effects of the embodiment*** According to the embodiment described above, since the thermally conductive particles are oriented (aligned) in the thickness direction within the resin, heat conduction paths can be efficiently formed within the resin composition 40. Furthermore, since the particle-containing resin 4 is supplied to a mold that conforms to the outer shape of the heating element 2, the molded resin composition 40 can be well fitted to the outer shape of the heating element 2. As a result, heat can be efficiently exchanged between the resin composition 40 and the heating element 2, making it possible to manufacture a resin composition 40 with excellent thermal conductivity. In the embodiment described above, the first mold 51 and the second mold 52 were transported individually. That is, the first mold 51 was transported onto the electrode plate 61, and then the second mold 52 was transported onto the first mold 51. However, the invention is not limited to this, and the first mold 51 and the second mold 52 may be transported together onto the electrode plate 61. In this case, it is preferable to provide a suction holding part for the second mold 52 on the electrode plate 61. Then, with the first mold 51 held by the holder 8, the second mold 52 is suction-held by the electrode plate 61 to separate it from the first mold 51, and after the particle-containing resin 4 is supplied to the first mold 51, the second mold 52 is returned onto the first mold 51. Furthermore, when placing the second mold on top of the first mold 51, if there is a possibility of a positional misalignment exceeding the allowable range occurring between the first mold 51 and the second mold 52, it is advisable to provide an information acquisition unit (not shown) that acquires information such as the position of the first mold 51. The information acquisition unit can be configured using an imaging camera or a distance sensor. When using an imaging camera, for example, the positional misalignment of the first mold 51 relative to the electrode plate 61 can be calculated based on an image taken from above of the first mold 51 placed on the electrode plate 61. When using a distance sensor, for example, the positional misalignment of the first mold 51 relative to the electrode plate 61 can be calculated by measuring the distance to the side of the first mold 51 placed on the electrode plate 61 at one side and at the side perpendicular to that side.

[0031] Embodiment 2. In this embodiment, a schematic configuration of a manufacturing apparatus and a manufacturing method (2) different from those in Embodiment 1 will be described. This embodiment will primarily describe the differences from Embodiment 1. Matters not described below are the same as in Embodiment 1.

[0032] ***Outline configuration of the manufacturing equipment and manufacturing method (2)*** Figure 8 shows the mechanism for realizing this embodiment.

[0033] In this embodiment, as shown in Figure 8, an electrode plate 62 and a mold sheet 12 are used instead of the first mold 51 and second mold 52 used in Embodiment 1. In other words, in Figure 8, the electrode plate 62 also serves as the first mold 51 (first part) that molds the outer shape of the resin composition. This embodiment differs from Embodiment 1 in that it is equipped with a release film 11 to prevent the particle-containing resin 4 from adhering to the electrode plate 62, which is part of the mold 5. Therefore, it can be said that the electrode plate 62 functions as the first mold 51 together with the release film 11. Therefore, the electrode plate 62, the release film 11, and the mold sheet 12 form the three-dimensional shape of the heating element 2. However, the electrode plate 62 (release film 11) differs from the first mold 51 in that it does not have side wall portions that define the side surfaces of the outer shape of the resin composition 40 to be molded.

[0034] The mold sheet 12 is a component corresponding to the second mold 52 (second part), but differs from the second mold 52 in that it molds the three-dimensional shape of multiple heating elements 2. In other words, the mold sheet 12 has multiple protrusions arranged in a matrix that mold the three-dimensional shape of the heating elements 2. The template sheet 12 shown in Figure 8 is an example in which a total of nine protrusions are arranged in a 3x3 grid: three in the direction aligned with the plane of the paper in Figure 8 and three in the depth direction of Figure 8. However, the template sheet 12 may contain more than nine three-dimensional shapes.

[0035] Furthermore, the nozzle 9 of this embodiment differs from the nozzle 9 of Embodiment 1 in that it is a slit nozzle. The nozzle 9 of this embodiment is configured to be movable along the mold sheet 12, which is placed on the electrode plate 61, by a moving device (not shown). The length of the slit of the nozzle 9 is slightly shorter than the length of the mold sheet 12 in the width direction (the direction perpendicular to the plane of the paper in Figure 10).

[0036] ******Manufacturing process of resin composition 40*** Figure 9 is a flowchart showing the manufacturing process of the resin composition according to this embodiment. Figures 10 and 11 show examples of operations in each manufacturing process of the resin composition 40. The following explanation will follow the flowchart in Figure 9, with reference to Figures 10 and 11.

[0037] As shown in Figure 10(a), a mold sheet 12, on which multiple molds of the same shape as the heating element 2 are arranged, is placed on the electrode plate 61 (step S201). If the same resin composition 40 is to be manufactured continuously, the mold sheet 12 may be fixed to the electrode plate 61 in advance.

[0038] Next, as shown in Figure 10(b), the nozzle 9 is moved along the mold sheet 12 by a moving device (not shown) from one end of the mold sheet 12 (the left end in Figure 10) to the other end (the right end in Figure 10), discharging the particle-containing resin 4 and applying the particle-containing resin 4 to the mold sheet 12 in a planar manner of a predetermined thickness (step S202). After dispensing is complete, the nozzle 9 is returned to the standby position shown by the dashed line in Figure 10(b).

[0039] Next, as shown in Figure 10(c), the electrode plate 62 and heater plate 72 are lowered until the lower surface of the release film 11 and the upper surface of the mold sheet 12 (the upper surface of the protrusions on the mold sheet 12) are at a predetermined distance apart (step S203). As a result, the particle-containing resin 4 applied to the mold sheet 12 is compressed to the desired thickness and spreads across the entire surface of the mold sheet 12 (step S204). That is, the coating thickness and area of ​​the particle-containing resin 4 applied by the nozzle 9 are set to such a thickness and size that the particle-containing resin 4 spreads across the entire surface of the mold sheet 12 to the desired thickness when compressed by the release film 11 (electrode plate 62). Before the above processing, the release film 11 is held by the electrode plate 62, for example by suction.

[0040] In this state, a voltage is applied to electrode plates 61 and 62, causing the thermally conductive particles contained in the particle-containing resin 4 to be oriented (aligned) by the electric field (step S205). Furthermore, after a predetermined time has elapsed, heating is started by heater plates 71 and 72 while maintaining the applied voltage, thereby curing the particle-containing resin 4 (step S206). The application of the electric field and heating are stopped when the predetermined heating time has elapsed.

[0041] Next, the electrode plate 61 and heater plate 71, and the electrode plate 62 and heater plate 72 are moved to their respective retracted positions, and then, as shown in Figure 11(d), the resin composition 40 sandwiched between the mold sheet 12 and the release film 11 is obtained. That is, when the electrode plate 62 is moved to the retracted position, the release film 11 is released by the electrode plate 62. Then, as shown in Figure 11(e), the mold sheet 12 is removed from the release film 11 and the resin composition 40 (step S207). This removal can be done, for example, by holding the release film 11 and the mold sheet 12 with separate holders and moving them apart from each other. As shown in Figure 11(e), the surface of the resin composition 40 facing the heating element 2 has multiple shapes (nine in this embodiment) that match the three-dimensional shape of the heating element 2.

[0042] Next, as shown in Figure 11(f), the release film 11 and the resin composition 40 are inverted, and the resin composition 40 is further divided into individual pieces using a cutter (not shown) (step S208). Specifically, the resin composition 40 is cut at the cutting position 1110 in Figure 11(f) to divide the resin composition 40 into individual pieces. Then, as shown in Figure 11(g), the individualized resin composition 40 is attached to the heating element 2 (step S208). The release film 11 can be removed from the resin composition 40 before attaching the individualized resin composition 40 to the heating element 2, or it can be removed from the resin composition 40 after attaching the heating element 2.

[0043] ***Explanation of the effects of the embodiment*** In this embodiment, as in Embodiment 1, heat conduction paths can be efficiently formed within the resin composition 40. Furthermore, the molded resin composition 40 can be well fitted to the outer shape of the heating element 2, making it possible to manufacture a resin composition 40 with excellent thermal conductivity.

[0044] Furthermore, in this embodiment, since the mold sheet 12 is provided with the three-dimensional shapes of multiple (9) heating elements 2, multiple resin compositions 40 corresponding to the three-dimensional shapes of the heating elements 2 can be obtained in a single molding operation (steps S201 to S208 in Figure 9).

[0045] Embodiment 3. In this embodiment, a resin composition manufacturing apparatus 100, which is a more specific embodiment of the above-described embodiment 2, will be explained with reference to Figures 12 to 14. Note that the following descriptions may omit explanations of configurations similar to those in Embodiment 1 and Embodiment 2.

[0046] ***Explanation of the structure*** Figure 12 is a front view of the resin composition manufacturing apparatus 100 according to this embodiment. Figure 13 is a side view of the resin composition manufacturing apparatus 100 according to this embodiment. Figure 13 is a view of the resin composition manufacturing apparatus 100 of Figure 12 from the direction of the arrow. Figure 14 is a block diagram showing an example of the functional configuration of the resin composition manufacturing apparatus 100 according to this embodiment.

[0047] The release film 11 shown in Figures 12 and 13 corresponds to the release film 11 shown in Figure 8. The mold sheet 12 shown in Figures 12 and 13 corresponds to the mold sheet 12 shown in Figure 8.

[0048] As shown in Figures 12 to 14, the resin composition manufacturing apparatus 100 comprises a base 110, an upper unit 300 having an upper electrode plate 102, a lower unit 400 having a lower electrode plate 103, a release film supply unit 111, a resin coating unit 113, a transport unit 116, and a control device 101. The upper unit 300 is mounted on the base 110 via a frame (not shown) such that the upper electrode plate 102 faces downward. The lower unit 400 is mounted on the base 110 such that the lower electrode plate 103 faces the upper electrode plate 102. The release film supply unit 111 is mounted on the base 110 near the lower unit 400. The resin coating unit 113 is mounted on the base 110 so as to be movable between a position between the release film supply unit 111 and the lower unit 400, and a position on the lower unit 400 opposite to the release film supply unit 111. The transport unit 116 is mounted so as to be movable between the lower unit 400 and the discharge position outside the manufacturing apparatus 100. The control device 101 comprehensively controls each of the above parts. The configuration of each part will be described below.

[0049] The upper unit 300 includes, in addition to the upper electrode plate 102, an upper heater plate 105, an upper unit base 108, and a resin chuck unit 109. The upper electrode plate 102 is a flat plate-shaped member that, in plan view, is the same size and shape as the mold sheet 12, and its upper surface is fixed and supported to the lower surface of the upper heater plate 105. The upper electrode plate 102 is connected to the electrode plate power supply 104 shown in Figure 14. The upper electrode plate 102 is the member corresponding to the electrode plate 62 in Figure 8.

[0050] The upper heater plate 105 is a component that, in a plan view, is of the same size and shape as the upper electrode plate 102, and its upper surface is fixed and supported to the lower surface of the upper unit base 108. The upper heater plate 105 is equipped with a heat source such as a sheathed heater inside and is connected to the heater plate power supply 107 shown in Figure 14.

[0051] The upper unit base 108 is a block-shaped member that, in plan view, is the same size and shape as the upper heater plate 105, and is supported so as to be able to move up and down by a lifting device (not shown) supported by a frame (not shown). This allows the upper electrode plate 102 and the upper heater plate 105 to move toward and away from the lower unit 400.

[0052] The resin chuck unit 109 is a component that grips the molded resin composition 40 at four locations in Figure 12: front, back, left, and right. In other words, the same resin chuck unit 109 is placed at a total of four locations on the upper unit base 108: two locations shown in Figure 12 and two locations shown in Figure 13. Each resin chuck unit 109 comprises a lifting section 109a, a horizontal movement section 109b, and a chuck section 109c. The lifting section 109a is provided on the side of the upper unit base 108 and supports the horizontal movement section 109b so that it can move up and down. The horizontal movement section 109b supports the chuck section 109c so that it can move in the horizontal direction. The direction of movement by the horizontal movement section 109b is the direction in which the chuck sections 109c located on the left and right sides of the upper unit 300 in Figure 12 move closer together and further apart. The chuck section 109c is a gripping mechanism equipped with gripping claws that can open and close in the vertical direction.

[0053] The lower unit 400 includes, in addition to the lower electrode plate 103, a mold sheet 12, a lower heater plate 106, a push-up unit 114, and a cutting unit 115. The mold sheet 12 is fixed and supported on the upper surface of the lower electrode plate 103. The lower electrode plate 103 is a flat plate-shaped member that, in plan view, has the same size and shape as the mold sheet 12 (having the same support area), and its lower surface is fixed and supported on the upper surface of the lower heater plate 106. The lower electrode plate 103 is connected to the electrode plate power supply 104 shown in Figure 14. The lower electrode plate 103 is the member corresponding to the electrode plate 61 in Figure 8. The lower heater plate 106 is a component that, in a plan view, is of the same size and shape as the lower electrode plate 103, and is supported by fixing its lower surface to the upper surface of the base 110. The lower heater plate 106 is equipped with a heat source such as a sheathed heater inside and is connected to the heater plate power supply 107 shown in Figure 14.

[0054] The push-up unit 114 is a component that peels the resin composition 40 molded on the mold sheet 12 of the lower unit 400 from the mold sheet 12. Four push-up units 114 are arranged in a row at equal intervals in a direction perpendicular to the plane of the paper at two locations at both ends of the lower unit 400 shown in Figure 12. More specifically, the push-up units 114 are positioned in the lower unit 400 shown in Figure 13, corresponding to positions outside the three protrusions of the mold sheet 12 and positions between the protrusions. Each push-up unit 114 includes a push-up pin 114a and a drive unit 114b that operates the push-up pin 114a. The push-up pin 114a is provided penetrating the lower unit base 110, the lower heater plate 106, the lower electrode plate 103, and the mold sheet 12. In other words, the push-up pin 114a is inserted through a through-hole that is just the right size to fit the push-up pin 114a, which penetrates the lower unit base 110, the lower heater plate 106, the lower electrode plate 103, and the mold sheet 12. The drive unit 114b is positioned in a hole provided in the base 110 directly below the through-hole.

[0055] The cutting unit 115 is a component that cuts the release film 11 supplied onto the lower unit 400 along a direction perpendicular to the supply (conveyance) direction of the release film 11. The cutting unit 115 is positioned on both sides of the lower unit 400 shown in Figure 12, close to the lower unit 400. The cutting unit 115 is provided to be movable along the lower unit 400. That is, the cutting unit 115 is provided to be movable from one end to the other of the lower unit 40 in the direction along the plane of the paper in Figure 13. The cutting unit 115 is also provided to be vertically movable. That is, the cutting unit 115 is provided to be vertically movable between a lowered position (standby position) in which it does not contact the release film 11 supplied onto the lower unit 400, and a cutting position that rises from the standby position and is capable of contacting and cutting the release film 11.

[0056] The release film supply unit 111 is a component that supplies the release film 11 onto the lower unit 400. More specifically, the release film supply unit 111 comprises a roll of release film 11, a feed roller 150 for feeding the release film 11, and a release film chuck 112. As shown in Figure 13, the release film chucks 112 are arranged to face each other in the width direction of the release film 11 (the direction along the plane of the paper in Figure 13). This allows both ends of the release film 11 in the width direction to be held by a pair of release film chucks 112. Two pairs of release film chucks 112 are arranged side by side in the direction in which the release film 11 is supplied (hereinafter referred to as the "supply direction"). These release film chucks 112 are arranged to be independently movable and vertically movable on the base 110 along the supply direction of the release film 11 for each pair. The release film 11 can be pulled out by the cooperation of the feed roller 150 and the release film chuck 112 and supplied onto the mold sheet 12 of the lower unit 400.

[0057] Here, of the two sets of release film chucks 112, the set located on the left side in Figure 12 is referred to as the left chuck unit. The set located on the right side in Figure 12 is referred to as the right chuck unit.

[0058] The resin coating unit 113 is a so-called slit coater, which coats a particle-containing resin 4 onto the mold sheet 12 on the lower unit 400. The resin coating unit 113 is equipped with a nozzle 9 and a moving device 113a. The nozzle 9 is a slit nozzle, similar to that in Embodiment 2. The length of the slit in the nozzle 9 is slightly shorter than the length of the mold sheet 12 in the width direction (the direction perpendicular to the plane of the paper in Figure 12). A resin supply unit (not shown) is connected to the nozzle 9 to supply the particle-containing resin 4, and is configured to supply the particle-containing resin 4 at a preset discharge rate. The moving device 113a moves the nozzle 9 along the supply direction of the release film 11 on the mold sheet 12 on the lower unit 400. The moving device 113a is equipped with a pair of support parts that support both ends of the nozzle 9 and a pair of moving tables that movably support the pair of support parts. The pair of support parts support the nozzle 9 so that it can be raised and lowered. A pair of movable platforms are positioned on the base 110 of the lower unit so as to sandwich the lower unit 400 in the width direction, and a pair of support parts (nozzles 9) are configured to be movable between the standby position on the left side of the lower unit 400 shown in Figure 12 and the right end of the lower unit 400.

[0059] The transport unit 116 is a so-called horizontal articulated robot. The transport unit 116 is equipped with a hand 1160 for holding the transported object. The transport unit 116 is configured so that the hand 1160 can move between a position on the lower unit 400 and an output position outside the manufacturing device 100.

[0060] As shown in Figure 14, the control device 101 controls the entire resin composition manufacturing apparatus 100. Specifically, the control device 101 controls the supply of particle-containing resin 4 to the mold sheet 12, the application of an electric field to the particle-containing resin 4, the curing treatment of the particle-containing resin 4, the peeling of the resin composition 40 from the mold sheet 12, and the unloading of the molded resin composition 40. In other words, the control device 101 controls each part to execute the resin supply process, the electric field application process, the curing process, and the peeling process.

[0061] ***Explanation of operation*** Next, an example of the operation of the resin composition manufacturing apparatus 100 according to this embodiment will be described with reference to Figures 15 to 21.

[0062] In manufacturing the resin composition 40, as shown in Figure 15, a mold sheet 12 corresponding to the resin composition 40 to be manufactured is set in the lower unit. The mold sheet 12 is set, for example, by a worker manually. In this state, the upper unit 300 is in a standby position spaced apart from the lower unit 400. The release film chuck 112 of the release film supply unit 111 is in a standby position near the roll. The resin coating unit 113 is also in a standby position.

[0063] In this state, first, as shown in Figure 16, the control device 101 moves the nozzle 9 of the resin coating unit 113 from the standby position to the coating start position indicated by the dashed line. After positioning the resin coating unit 113 at the coating start position, the control device 101 lowers the nozzle 9 to the coating height. The control device 101 discharges the particle-containing resin 4 from the nozzle 9 onto the mold sheet 12 while moving the nozzle 9 towards the coating completion position indicated by the solid line at a preset speed. After moving the nozzle 9 to the coating completion position indicated by the solid line, the control device 101 stops the discharge of the particle-containing resin 4 from the nozzle 9 and stops the movement of the nozzle 9. After this, the control device 101 raises the nozzle 9 to the standby height and moves the nozzle 9 to the standby position. As a result, an amount of particle-containing resin 4 is applied to the mold sheet 12 in such a way that it spreads just enough to cover the entire surface of the mold sheet 12 when it is compressed to a predetermined thickness, as shown by the dashed line in Figure 13. This resin coating unit 113 and control device 101 correspond to the resin supply unit. Furthermore, this resin coating operation corresponds to the resin supply process.

[0064] Next, as shown in Figure 17, the control device 101 controls the release film supply unit 111 to supply the release film 11 onto the mold sheet 12 of the lower unit 400. That is, the control device 101 moves the right chuck unit, which is in the standby position shown in Figure 16 with the leading edge of the release film 11 chucked, to the pull-out position shown on the right side of the lower unit 40 in Figure 17. At this time, the control device 101 uses the feed roller 150 to feed the release film 11 from the roll in accordance with the movement of the right chuck unit. Furthermore, the control device 101 moves the left chuck unit to the left holding position of the lower unit 40 while the right chuck unit is moving to the pull-out position. Then, the control device 101 causes the left chuck unit to chuck the release film 11 at this position. The release film supply unit 111 and the control device 101 correspond to the release film supply section. The operation of supplying the release film corresponds to the release film supply process.

[0065] Next, as shown in Figure 18, the control device 101 controls the lifting device (not shown) of the upper unit 300 to lower the upper unit to a preset height position (molding position). During this descent of the upper unit 300, the lower surface of the upper electrode plate 102 comes into contact with the release film 11, causing the release film 11 to be pressed down and come into contact with the particle-containing resin 4. Furthermore, the particle-containing resin 4 is compressed until it reaches a predetermined thickness. This descent of the upper unit 300 molds the particle-containing resin 4 into the desired shape. At this time, the control device 101 lowers the chuck in accordance with the release film 11 being pressed down by the upper unit 300.

[0066] In this state, the control device 101 controls the electrode plate power supply 104 to apply a voltage between the upper electrode plate 102 and the lower electrode plate 103 for a preset time. This application of voltage generates an electric field between the upper electrode plate 102 and the lower electrode plate 103 along the opposing direction of plates 102 and 103, and this electric field is applied to the particle-containing resin 4. The thermally conductive particles in the particle-containing resin 4 are oriented (aligned) in the direction along the electric field due to the application of this electric field. The upper electrode plate 102, the lower electrode plate 103, the electrode plate power supply 104, and the control device 101 correspond to the electric field application section. Furthermore, the operation of applying this electric field corresponds to the electric field application process. In this embodiment, the preset time is the sum of the time required to orient (align) the thermally conductive particles in the particle-containing resin 4 with the electric field generated by the application of voltage, and the time required for the curing of the particle-containing resin 4, which will be described later.

[0067] Once the time required for orientation has elapsed, the control device 101 controls the heater plate power supply 107 to supply power to the upper heater plate 105 and the lower heater plate 106. As a result, the heat sources (not shown) of the upper heater plate 105 and the lower heater plate 106 generate heat, and the upper heater plate 105 and the lower heater plate 106 are heated. The heat from the upper heater plate 105 and the lower heater plate 106 is transferred to the particle-containing resin 4 via the upper electrode plate 102 and the lower electrode plate 103, heating the particle-containing resin 4. This heating hardens the particle-containing resin 4. In other words, the control device 101 controls the heater plate power supply 107 to heat-cure the particle-containing resin 4 based on preset resin curing conditions. Resin curing conditions include heating temperature and heating time. The control device 101 can set resin curing conditions according to the type of resin of the particle-containing resin 4. The upper heater plate 105, lower heater plate 106, heater plate power supply 107, and control device 101 in this configuration correspond to the curing process. Furthermore, the operation of heating the particle-containing resin 4 corresponds to the curing process. As a result, the molded particle-containing resin 4 is cured, and the resin composition 40 is formed.

[0068] After the curing process is complete, as shown in Figure 19, the control device 101 raises the cutting unit 115, which is in the standby position indicated by the dashed line in Figure 19(b), to the cutting position. The control device 101 moves the cutting unit 115 from the standby position to the cutting completion position indicated by the solid line in Figure 19(b) to cut the release film 11 in the width direction (in Figure 19(a), the cutting unit 115 is moved from the back of the paper towards the front). After the release film 11 is cut, the control device 101 lowers the cutting unit 115 to its original height and returns the cutting unit 115 to the standby position.

[0069] After this, the control device 101 raises the upper unit 300 to the transfer position, as shown in Figure 20, and performs the following operations sequentially during this process. The transfer position is the height position for transferring the resin composition 40 to the hand 1160 of the transport unit 116, and is located between the molding position and the standby position. In other words, the control device 101 raises the upper unit 300 to a height between it and the transfer position. Specifically, the control device 101 raises the upper unit 300 to a height where it does not collide with the resin composition 40 when the push-up pin 114a pushes up the resin composition 40, and where the pushed-up resin composition 40 can be grasped by the resin chuck unit 109. Next, the control device 101 raises the push-up pin 114a to push up (lift) the left and right ends of the resin composition 40 (both ends in the direction along the supply direction), causing the resin composition 40 to peel off from the lower unit 400 (lower electrode plate 103). In this state, the control device 101 lowers the resin chuck unit 109 to a gripping position that grips the resin composition 40. Then, the control device 101 moves the resin chuck unit 109 toward the resin composition 40, causing the resin chuck unit 109 to grip the resin composition 40 that has been peeled off from the lower unit 400 and the ends of the release film 11. As shown in Figure 11(e), the release film 11 remains on the resin composition 40 until it is removed. In the following explanation, for the sake of simplicity, the release film 11 remaining on the resin composition 40 will not be mentioned, but it will be assumed that the release film 11 remains on the resin composition 40 until it is removed.

[0070] Next, the control device 101 raises the upper unit 300 to the transfer position (the position of the upper unit 300 shown in Figure 20) while maintaining the grip by the resin chuck unit 109. Due to its flexibility, the molded resin composition 40 may remain attached to the mold sheet 12 even when pushed up by the push-up pin 114a. As described above, the central portion of the resin composition 40 can be peeled off the mold sheet 12 by raising the upper unit (resin chuck unit 109). The push-up unit 114, resin chuck unit 109, and control device 101 correspond to the resin peeling section. Furthermore, the operation of peeling off this resin composition 40 corresponds to the resin peeling process.

[0071] Next, as shown in Figure 21, the control device 101 inserts the hand 1160 of the transport unit 116 between the resin composition 40 positioned at the transfer position and the mold sheet 12 of the lower unit. Then, the control device 101 raises the hand 1160 and brings it into contact with the lower surface of the resin composition 40. In this state, the control device 101 causes the resin chuck unit 109 to release its grip on the resin composition 40 and moves the resin chuck unit 109 away from the resin composition 40. After that, the control device 101 returns the upper unit 300 to the standby position. Furthermore, the control device 101 causes the transport unit 116 to transport the resin composition 40 to the discharge position. After this, the control device 101 returns the resin composition manufacturing apparatus 100 to the state before the particle-containing resin 4 was applied (the state shown in Figure 15). Specifically, the control device 101 moves the right chuck unit and the left chuck unit of the release film chuck 112 to the standby position shown in Figure 15. At this time, the right chuck unit is gripping the cut end of the release film 11 that has been cut by the cutting unit 115. Then, at the pull-out position shown in Figure 21(a), the control device 101 releases the grip of the right chuck unit and discards the gripped cut end of the release film 11 to the waste section (not shown) as indicated by the arrow in Figure 21. In this embodiment, the waste section is located directly below the cut end of the release film 11 held by the right chuck unit at the pull-out position. The waste section is, for example, a collection box. Furthermore, the control device 101 moves the left chuck unit back to its original standby position while still chucking the release film 11. At this time, the control device 101 controls the feed roller 150 to reverse the feed of the release film 11 and the roll of the release film 11 to rewind the amount of release film that has been returned.

[0072] Furthermore, at the destination where the resin composition 40 is shipped, the resin composition 40 is separated into individual pieces as shown in Figure 11(f), and then, as shown in Figure 11(g), the separated resin composition 40 is attached to the heating element 2 and the release film 11 is removed.

[0073] ***Explanation of the effects of the embodiment*** In this embodiment as well, the same effects and advantages as in embodiments 1 and 2 can be obtained.

[0074] While embodiments 1 to 3 have been described above, these are merely examples and are not intended to limit the scope of the invention. The invention can be implemented in various other forms, and various omissions, substitutions, combinations, and modifications are permitted without departing from the spirit of the invention. These embodiments and their variations are included within the scope and spirit of the invention, as well as within the claims.

[0075] For example, two or more of the embodiments 1 to 3 may be combined and implemented. Alternatively, one of these embodiments may be partially implemented. Alternatively, two or more of these embodiments may be partially combined and implemented. Furthermore, the configurations and procedures described in these embodiments may be modified as needed.

[0076] For example, in the above embodiment, the curing section was described as comprising a pair of heater plates 71 and 72, 105 and 106. However, the curing section does not necessarily need to be a pair, as it only needs to be able to cure the particle-containing resin. For example, there may be just one heater plate, or there may be three or more.

[0077] Furthermore, in the above embodiment, it was explained that the second mold 52, which is located above the first mold 51 located below it in mold 5, moves up and down to move toward and away from the first mold 51. However, the first mold 51 may move toward and away from the second mold 52, or the first mold 51 and the second mold 52 may move toward and away from each other. In short, it is sufficient that the first mold 51 and the second mold 52 can move toward and away from each other relative to each other.

[0078] Furthermore, in embodiments 2 and 3, the release film 11 was described as being supplied between the electrode plate 62 (upper electrode plate 102) and the particle-containing resin 4. However, the release film 11 is provided to prevent the particle-containing resin 4 from adhering to the electrode plate 62 (upper electrode plate 102) and to make it easier to peel off the cured resin composition 40 from the electrode plate 62 (upper electrode plate 102). Therefore, the release film 11 may be omitted by forming the electrode plate 62 (upper electrode plate 102) from a material to which the particle-containing resin 4 does not easily adhere, or by applying a surface treatment to which the particle-containing resin 4 does not easily adhere. Furthermore, although the explanation described an example where the target object is a heat-generating element 2, and the heat-generating element 2 is a heat-generating component such as a semiconductor device or a power device, the explanation is not limited to these. For example, the target object may receive heat from other components via the resin composition 40. In addition, the heat-generating element 2 may generate heat through its own operation, etc., but it may also be a component that becomes heated by receiving heat from other components, etc. Furthermore, although the example described shows the resin composition 40 being attached to the heating element 2 by its own adhesive force, it may also be attached via an adhesive member. In this case, it is preferable to provide an adhesive unit. The adhesive unit can be configured to supply the adhesive member to at least one of the resin composition 40 and the heating element 2. As the adhesive member, adhesives, double-sided tape, etc., can be used. [Explanation of Symbols]

[0079] 1 Substrate, 2 Heating element, 3 Cooling component, 4 Particle-containing resin, 5 Mold, 8 Holder, 9 Nozzle, 10 Transfer unit, 11 Release film, 12 Mold sheet, 20 Holding unit, 40 Resin composition, 51 First mold, 52 Second mold, 61 Electrode plate, 62 Electrode plate, 71 Heater plate, 72 Heater plate, 100 Resin composition manufacturing apparatus, 101 Control device, 102 Upper electrode plate, 103 Lower electrode plate, 104 Power supply for electrode plate, 105 Upper heater plate, 106 Lower heater plate, 107 Power supply for heater plate, 108 Upper unit base, 109 Resin chuck unit, 110 Lower unit base, 111 Release film supply unit, 112 Release film chuck, 113 Resin coating unit, 114 Push-up unit, 115 Cutting unit, 116 conveying unit, 150 feed roller, 300 upper unit, 400 lower unit, 1160 hand.

Claims

1. A mold that replicates the three-dimensional shape of the object to be applied, A resin supply unit that supplies a particle-containing resin containing particles that are oriented by the application of an electric field to the mold, An electric field application unit that applies an electric field along a predetermined direction to the particle-containing resin supplied to the mold, A resin composition manufacturing apparatus having a curing section that performs a curing treatment on the particle-containing resin supplied to the mold.

2. The particle-containing resin is composed of thermally conductive particles, The aforementioned applicable object is, An apparatus for producing the resin composition according to claim 1, which is a heating element.

3. The mold comprises a first portion located on the lower side that receives the particle-containing resin supplied by the resin supply unit, and a second portion located above the first portion that, in cooperation with the first portion, molds the particle-containing resin supplied to the first portion. The electric field application section comprises a first electrode plate and a second electrode plate arranged opposite to each other via the first portion and the second portion, The device further includes a lifting device that moves the first part and the set of the first electrode plate and the second part and the set of the second electrode plate relative to each other in a direction toward and toward each other. The resin supply unit comprises a nozzle for discharging the particle-containing resin, and a moving device for moving the nozzle between the first part and the second part which are separated by the lifting device, as described in claim 1.

4. The apparatus for manufacturing a resin composition according to claim 3, wherein the second electrode plate also serves as the second part of the mold.

5. The system further includes a release film supply unit that supplies a release film at a position opposite to the second electrode plate between the first part and the first electrode plate set up in a separated state by the lifting device and the second part and the second electrode plate set, The apparatus for manufacturing a resin composition according to claim 3 or 4, wherein the release film supply unit comprises a roll on which the release film is wound, a first release film chuck for pulling the release film from the roll and positioning and holding the release film in a position opposite to the second electrode plate, and a second release film chuck for holding the release film held by the first release film chuck in a position opposite to the first release film chuck, with the second electrode plate in between.

6. The apparatus for manufacturing a resin composition according to claim 5, further comprising a cutting section for cutting the release film at a position between the first release film chuck and the second electrode plate, and at a position between the second electrode plate and the second release film chuck.

7. An apparatus for manufacturing a resin composition according to claim 6, further comprising: a push-up pin for peeling off a particle-containing resin molded and hardened on the first portion from the first portion at least at its end; and a resin chuck for gripping the hardened particle-containing resin peeled off by the push-up pin at its peeled end and peeling the hardened particle-containing resin from the first portion.

8. The particle-containing resin is at least one of a thermosetting particle-containing resin that is heat-cured and a photocurable particle-containing resin that is photocured. The curing treatment section is An apparatus for producing a resin composition according to claim 1, wherein if the particle-containing resin is the thermosetting particle-containing resin, a thermosetting treatment is performed as the curing treatment, and if the particle-containing resin is the photocurable particle-containing resin, a photocuring treatment is performed as the curing treatment.

9. A resin supply process in which a particle-containing resin containing particles that are oriented by the application of an electric field is supplied to a mold that is shaped to match the three-dimensional external form of the object to be applied, An electric field application step of applying an electric field along a predetermined direction to the particle-containing resin supplied to the mold, A method for producing a resin composition, comprising a curing step of performing a curing treatment on the particle-containing resin supplied to the mold.

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