Dipole antenna unit and antenna device

Abstract

Good half-width angle characteristics and VSWR characteristics are obtained. [Solution] The antenna unit 10 comprises a radiating element substrate 20 having a pair of radiating elements 21A, 22A and a pair of radiating elements 21B, 22B, which are provided at symmetrical positions on either side of a predetermined central position, and a power supply unit 30 that supplies power to the radiating elements 21A, 21B, 22A, and 22B by electromagnetic coupling. Each of the radiating elements 21A, 21B, 22A, and 22B is provided with a notch C at a corner adjacent to an adjacent radiating element and is also provided with a directivity adjustment pin 23.

Description

Technical Field

[0001] The present invention relates to a dipole antenna unit and an antenna apparatus.

Background Art

[0002] Conventionally, a polarization diversity array antenna apparatus is disclosed that corrects polarization plane distortion by reducing the difference between the vertical polarization component and the horizontal polarization component using an adjustment conductor portion provided on the element conductor of a first dipole antenna element for +45-degree polarization and an adjustment conductor portion provided on the element conductor of a second dipole antenna element for -45-degree polarization (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of Invention

Problems to be Solved by the Invention

[0004] In the antenna apparatus disclosed in Patent Document 1, when it is desired to design the half-power angle of the dipole antenna to be wide, for example, adjusting the distance between the dipole antenna element and the metal conductor plate provided with the feed circuit, or adjusting the dimensions of the antenna element can be considered. However, with only these methods, when the half-power angle is 100 degrees or more, the VSWR (Voltage Standing Wave Ratio) characteristic deteriorates, and it is difficult to obtain favorable half-power angle characteristics and VSWR characteristics.

[0005] The present invention has been made in view of such problems, and an object thereof is to obtain favorable half-power angle characteristics and VSWR characteristics.

Means for Solving the Problems

[0006] To solve the above problems, a dipole antenna unit according to the present invention is A radiating element substrate comprising multiple pairs of radiating elements positioned symmetrically with respect to a predetermined central position, A power supply unit that supplies power to the radiating element by electromagnetic coupling, A dipole antenna unit comprising, Each of the aforementioned radiating elements has a notch provided at the corner adjacent to an adjacent radiating element. At least one of the multiple pairs of radiating elements is provided with an adjustment pin for adjusting its directivity. It is characterized by the following: [Effects of the Invention]

[0007] According to the present invention, good half-angle power characteristics and VSWR characteristics can be obtained. [Brief explanation of the drawing]

[0008] [Figure 1] This is a perspective view showing the antenna device of this embodiment. [Figure 2] This is a disassembled perspective view of the antenna unit. [Figure 3] This is a plan view of the antenna unit. [Figure 4] (a) is a front view of the first riser board, and (b) is a rear view of the first riser board. [Figure 5] (a) is a front view of the second riser board, and (b) is a rear view of the second riser board. [Figure 6] This is a perspective view of the power supply unit. [Figure 7] This is a plan view of the power supply circuit board. [Figure 8] This graph shows the relationship between the length of the directivity adjustment pin and the half-power angle when the design frequency f is 4.75 GHz. [Figure 9] This graph shows the relationship between the spacing of radiating elements and the return loss when the design frequency f is 4.75 GHz. [Figure 10]This is a graph showing the relationship between notch dimensions (cut dimensions) and return loss when the design frequency f is 4.75 GHz. [Figure 11] This is a perspective view showing an antenna apparatus with an adjustment plate disposed therein. [Figure 12] (a) is a graph showing the directivity of the antenna apparatus when no adjustment plate is disposed, and (b) is a graph showing the directivity of the antenna apparatus when the adjustment plate is disposed. [Figure 13] (a) is a front view showing an antenna unit of a modified example, and (b) is a rear view showing the antenna unit. [Figure 14] (a) is a left side view showing the antenna unit of the modified example, and (b) is a right side view showing the antenna unit. [Figure 15] This is a top view showing the antenna unit of the modified example. [Figure 16] This is a perspective view showing an antenna apparatus of a modified example. [Figure 17] (a) is a graph showing the directivity of the antenna apparatus when no adjustment unit is disposed, (b) is a graph showing the directivity of the antenna apparatus when the adjustment unit with a height of 8 mm is disposed, and (c) is a graph showing the directivity of the antenna apparatus when the adjustment unit with a height of 10 mm is disposed. [Figure 18] This is a graph showing the relationship between the height of the adjustment unit and the half-power angle when the design frequency f is 4.75 GHz. [Figure 19] This is a perspective view showing an antenna apparatus of a modified example. [Figure 20] This is a graph showing the relationship between the width of the isolation improvement line and the isolation when the design frequency f is 4.75 GHz. [Modes for Carrying Out the Invention]

[0009] Hereinafter, embodiments of the present invention will be described in detail in order based on the drawings. However, the present invention is not limited to the illustrated examples.

[0010] [Configuration of Antenna Apparatus] Figure 1 is a perspective view showing the antenna device 1 of this embodiment. As shown in Figure 1, the antenna device 1 comprises two dipole antenna units (hereinafter abbreviated as antenna units) 10 and a power supply circuit board 40. Each antenna unit 10 is arranged on the power supply circuit board 40 at a predetermined distance apart.

[0011] The antenna device 1 in this embodiment is an antenna device for a base station that constructs a local 5G network area. The antenna device 1 may be any base station antenna device used in a mobile communication system, etc., and may also be an antenna device for a base station that constructs a network area other than local 5G.

[0012] In addition, while the antenna device 1 uses a shared radiating element substrate 20 (described later) for each antenna unit 10, each antenna unit 10 may use its own separate radiating element substrate. Furthermore, the number of antenna units 10 constituting the antenna device 1 is not limited to two; it may be three or more, or even just one.

[0013] [Antenna Unit Configuration] Figure 2 is an exploded perspective view of the antenna unit 10. As shown in Figure 2, the antenna unit 10 comprises a radiating element substrate 20 and a power supply unit 30, and on the power supply circuit board 40 They are arranged in this manner. Note that, for the sake of explanation, the antenna unit 10 shown in Figure 2 is shown with a radiating element board 20 that corresponds to the antenna unit 10, but in reality, the radiating element board 20 shown in Figure 1 is provided (the same applies to the power supply circuit board 40).

[0014] The radiating element substrate 20 comprises a pair of radiating elements 21A and 22A, and a pair of radiating elements 21B and 22B, which are provided at symmetrical positions with respect to a predetermined central position (not shown). The radiating element substrate 20 also comprises four directional adjustment pins 23.

[0015] Figure 3 is a plan view of the antenna unit 10. As shown in Figure 3, each radiating element 21A, 21B, 22A, and 22B is provided radially from a predetermined central position (not shown) on the radiating element substrate 20. In other words, each radiating element 21A, 21B, 22A, and 22B is provided in the regions of the first, second, third, and fourth quadrants when the radiating element substrate 20 is considered as a coordinate plane. Each radiating element 21A, 21B, 22A, and 22B is made of metal foil (for example, copper foil) and is formed on the radiating element substrate 20 by a so-called printed circuit board method.

[0016] Each radiating element 21A, 21B, 22A, and 22B has a congruent shape (approximately square), and a notch C is provided at the corners adjacent to adjacent radiating elements. Specifically, as shown in Figure 3, notches C are provided at each of the corners 21A1 and 21A2 of radiating element 21A. Also, notches C are provided at each of the corners 21B1 and 21B2 of radiating element 21B. Also, notches C are provided at each of the corners 22A1 and 22A2 of radiating element 22A. Also, notches C are provided at each of the corners 22B1 and 22B2 of radiating element 22B. The dimensions (cut dimensions) of these notches C are preferably in the range of 0.033λ to 0.072λ in order to obtain good VSWR characteristics. Here, the dimension of the notch C refers to the length of the notched side (chamfer dimension) of the radiating element.

[0017] Each radiating element 21A, 21B, 22A, and 22B is provided with a conductive portion 24 at the corner 21A3, 21B3, 22A3, and 22B3 furthest from the aforementioned center position, through which a directivity adjustment pin 23 is connected. The conductive portion 24 is approximately circular in shape. Furthermore, each radiating element 21A, 21B, 22A, and 22B is spaced apart by a predetermined width W from adjacent radiating elements. It is desirable that this spacing width W be in the range of 0.015λ to 0.038λ in order to obtain good VSWR characteristics.

[0018] Here, a pair of non-adjacent radiating elements 21A, 21B, 22A, and 22B constitute an antenna element for one dipole antenna. In addition, a pair of radiating elements 21B, 22B, separate from the pair of radiating elements 21A, 22A, constitute an antenna element for a dipole antenna other than the one described above.

[0019] As shown in Figure 2, the radiating element substrate 20 has insertion openings 25, 25 drilled in the region where a pair of radiating elements 21A, 22A are formed. The insertion openings 25, 25 are for inserting the first upper protrusions 31A, 31A provided on the first rising substrate 30A, which will be described later. The radiating element substrate 20 also has insertion openings 26, 26 drilled in the region where a pair of radiating elements 21B, 22B are formed. The insertion openings 26, 26 are for inserting the second upper protrusions 31B, 31B provided on the second rising substrate 30B, which will be described later. The radiating element substrate 20 also has insertion holes 27 drilled in the region where each conductive portion 24 is formed. The insertion holes 27 are for inserting the directional adjustment pins 23.

[0020] The directional adjustment pin 23 is a pin used to adjust the directional properties of the antenna unit 10. The directional adjustment pins 23 are, for example, headed pins, but they may also be headless pins. The material of the directional adjustment pins 23 is, for example, brass. The length of the directional adjustment pins 23 is preferably in the range of 0.073λ to 0.21λ in order to obtain good half-angle characteristics. Each directional adjustment pin 23 is electrically connected to the corresponding radiating elements 21A, 21B, 22A, and 22B via the conductive portion 24 by soldering or by press-fitting into the insertion hole 27.

[0021] As shown in Figure 2, the power supply unit 30 comprises a first riser board 30A and a second riser board 30B. The first riser board 30A is a board for supplying power to a pair of radiating elements 21A and 22A by electromagnetic coupling. On the other hand, the second riser board 30B is a board for supplying power to a pair of radiating elements 21B and 22B by electromagnetic coupling. The first riser board 30A and the second riser board 30B are assembled together and integrated (see Figure 6) and erected between the radiating element board 20 and the power supply circuit board 40.

[0022] The first riser board 30A has first upper protrusions 31A, 31A at two predetermined locations on its upper end. The first upper protrusions 31A, 31A are inserted into the aforementioned insertion openings 25, 25 from the lower side of the radiating element board 20. The first riser board 30A also has first lower protrusions 32A, 32A at two predetermined locations on its lower end. The first lower protrusions 32A, 32A are inserted into the respective insertion openings 41A, 41A (described later) from the upper side of the power supply circuit board 40.

[0023] The second riser board 30B has two predetermined upper protrusions 31B, 31B at its upper end. The second upper protrusions 31B, 31B are inserted into the aforementioned insertion slots 26, 26 from the lower side of the radiating element board 20. The second riser board 30B also has two predetermined lower protrusions 32B, 32B at its lower end. The second lower protrusions 32B, 32B are inserted into the respective insertion slots 41B, 41B (described later) from the upper side of the power supply circuit board 40.

[0024] Figure 4(a) is a front view of the first riser substrate 30A. As shown in Figure 4(a), the first riser substrate 30A has first ground portions 33A on both the left and right sides of one surface, with a first non-conductive portion 34A in between. In other words, the first ground portions 33A are provided in a separated state. The first ground portions 33A are made of metal foil (for example, copper foil) and are formed on the aforementioned surface by a so-called printed circuit board method. The first ground portions 33A also extend to the surfaces of the first upper protrusions 31A, 31A and the first lower protrusions 32A, 32A (the aforementioned surface). On the other hand, the first ground portion 33A (metal foil) is not formed on the first non-conductive portion 34A. This first non-conductive portion 34A is provided to prevent the second power supply line 36B (described later), which is provided on the second riser board 30B, from coming into contact with the first ground portion 33A when the power supply unit 30 is assembled. In addition, the first riser board 30A has a first slit 35A formed from the lower end upward in the region of the first non-conductive portion 34A.

[0025] Figure 4(b) is a rear view of the first riser board 30A. As shown in Figure 4(b), the first riser board 30A has a first power supply line 36A on the other side, that is, on the side opposite to the side on which the first ground portions 33A, 33A are provided. The first power supply line 36A is formed to extend upward from the lower end of the first lower protrusion 32A on one side (right side), then bend to the left, cross the first slit 35A, and then fold back downward. The first power supply line 36A is made of metal foil (for example, copper foil) and is formed on the other side by so-called printed circuit board wiring.

[0026] Figure 5(a) is a front view of the second riser board 30B. As shown in Figure 5(a), the second The riser board 30B has a second ground portion 33B on both the left and right sides of one of its surfaces, with a second non-conductive portion 34B in between. In other words, the second ground portions 33B are provided in a separated state. The second ground portion 33B is made of metal foil (for example, copper foil) and is formed on the aforementioned surface by a so-called printed circuit board method. The second ground portion 33B also extends to the surface of the second upper protrusions 31B, 31B and the second lower protrusions 32B, 32B (the aforementioned surface). On the other hand, the second ground portion 33B (metal foil) is not formed on the second non-conductive portion 34B. This second non-conductive portion 34B is provided to prevent the first power supply line 36A provided on the first riser board 30A from coming into contact with the second ground portion 33B when the power supply unit 30 is assembled. Furthermore, the second rising substrate 30B has a second slit 35B formed from the upper end downward in the region of the second non-conductive portion 34B.

[0027] Figure 5(b) is a rear view of the second riser board 30B. As shown in Figure 5(b), the second riser board 30B has a second power supply line 36B on the other side, that is, on the side opposite to the side on which the second ground portions 33B, 33B are provided. The second power supply line 36B is formed to extend upward from the lower end of the second lower protrusion 32B on one side (left side), then bend to the right, pass under the second slit 35B, and then fold back downward. Therefore, the arrangement is such that the first power supply line 36A and the second power supply line 36B do not come into contact when the power supply unit 30 is assembled (see Figure 6). The second power supply line 36B is made of metal foil (for example, copper foil) and is formed on the other side by so-called printed circuit board wiring.

[0028] As shown in Figure 2, the power supply unit 30 is assembled in a cross shape in plan view, that is, so that the faces of the first and second rising boards 30A and 30B are perpendicular to each other, by inserting the first slit 35A provided on the first rising board 30A into the second rising board 30B, and inserting the second slit 35B provided on the second rising board 30B into the first rising board 30A. The power supply unit 30 is also assembled to the radiating element board 20 by inserting the first upper protrusions 31A, 31A provided on the first rising board 30A into the insertion openings 25, 25 of the radiating element board 20, and inserting the second upper protrusions 31B, 31B provided on the second rising board 30B into the insertion openings 26, 26 of the radiating element board 20. Then, by soldering the first upper protrusions 31A, 31A inserted into the sockets 25, 25, and the second upper protrusions 31B, 31B inserted into the sockets 26, 26, the pair of radiating elements 21A, 22A provided on the radiating element substrate 20 are electrically connected to the first ground portion 33A, 33A, and the pair of radiating elements 21B, 22B are electrically connected to the second ground portion 33B, 33B. This forms the antenna unit 10.

[0029] As shown in Figure 1, the antenna unit 10 formed as described above is erected on the power supply circuit board 40. Specifically, as shown in Figure 2, the antenna unit 10 is erected on the power supply circuit board 40 by inserting the first lower protrusions 32A, 32A provided on the first rising board 30A into the sockets 41A, 41A of the power supply circuit board 40, and by inserting the second lower protrusions 32B, 32B provided on the second rising board 30B into the sockets 41B, 41B of the power supply circuit board 40.

[0030] Figure 7 is a plan view of the power supply circuit board 40. As shown in Figure 7, the power supply circuit board 40 is provided with the aforementioned sockets 41A, 41A and sockets 41B, 41B. Furthermore, on the upper side of the power supply circuit board 40, i.e., the side where the antenna unit 10 is placed, a first non-conductive portion 42A is provided in a predetermined area adjacent to one of the sockets 41A. Here, the first lower protrusion 32A on the side where the first power supply line 36A is provided (the right-side first lower protrusion 32A shown in Figure 4(b)) This is a socket for inserting the first non-conductive portion 42A. This first non-conductive portion 42A is provided to prevent the first power supply line 36A from short-circuiting to the ground portion 43 of the power supply circuit board 40. Similarly, the power supply circuit board 40 has a second non-conductive portion 42B in a predetermined area on its upper side adjacent to one of the sockets 41B. Here, the above-mentioned socket 41B is a socket for inserting the second lower protrusion 32B (the left second lower protrusion 32B shown in Figure 5(b)) on the side where the second power supply line 36B is provided. This second non-conductive portion 42B is provided to prevent the second power supply line 36B from short-circuiting to the ground portion 43 of the power supply circuit board 40. Furthermore, the power supply circuit board 40 has a ground portion 43 in the area on its upper side excluding the above-mentioned first non-conductive portion 42A and second non-conductive portion 42B. The ground section 43 is made of metal foil (for example, copper foil) and is formed by a so-called printed circuit board method.

[0031] The antenna unit 10 is electrically connected to the ground portion 43 of the power supply circuit board 40 by soldering the first lower protrusions 32A, 32A, which are inserted into the sockets 41A, 41A of the power supply circuit board 40, and the second lower protrusions 32B, 32B, which are inserted into the sockets 41B, 41B of the power supply circuit board 40. At this time, the power supply line 36A provided on the first power supply board 30A is electrically connected to the power supply circuit (not shown) provided on the lower side of the power supply circuit board 40. In addition, the second power supply line 36B provided on the second power supply board 30B is electrically connected to the power supply circuit (not shown) provided on the lower side of the power supply circuit board 40.

[0032] [Electrical characteristics of antenna equipment] Figure 8 is a graph showing the relationship between the length of the directivity adjustment pin 23 and the half-power angle when the design frequency f is 4.75 GHz. Figure 8 shows the half-power angle when the length of the directivity adjustment pin 23 is varied from 1 mm to 15 mm. The half-power angle shows good characteristics (100 degrees or more) when the length of the directivity adjustment pin 23 is between 4.61 m and 13.28 mm. Here, if we assume that the free-space wavelength of 4.75 GHz is λ (= 63.16 mm), then the above 4.61 mm can be expressed as 0.073λ, and 13.28 mm can be expressed as 0.21λ. In other words, in antenna device 1, as shown in Figure 8, by setting the length of the directional adjustment pin 23 provided on each antenna unit 10 to the range of 0.073λ to 0.21λ, the half-angle power characteristics can be made to a good state (100 degrees or more).

[0033] Figure 9 is a graph showing the relationship between the spacing between radiating elements and the return loss when the design frequency f is 4.75 GHz. In Figure 9, the return loss is shown when the spacing width W (see Figure 3) between adjacent radiating elements is changed from 0.4 mm to 4.0 mm for each radiating element 21A, 21B, 22A, and 22B. The return loss decreases to -10 dB when the spacing width W between adjacent radiating elements is 0.92 mm. After that, as the spacing width W between adjacent radiating elements is increased to 2.4 mm, the return loss continues to decrease to -29.45 dB. Here, if the free-space wavelength at 4.75 GHz is λ (= 63.16 mm), then 0.92 mm can be expressed as 0.015λ and 2.4 mm can be expressed as 0.038λ. In other words, in antenna device 1, as shown in Figure 9, by setting the spacing W between adjacent radiating elements 21A, 21B, 22A, and 22B to a range of 0.015λ to 0.038λ, the return loss can be kept in a good state (-10dB or less). Therefore, by setting the spacing W between adjacent radiating elements 21A, 21B, 22A, and 22B to a range of 0.015λ to 0.038λ, the VSWR characteristics can also be kept in a good state.

[0034] Figure 10 shows the dimensions of the notch C (cut dimensions) when the design frequency f is 4.75 GHz. This graph shows the relationship between the radiant output and the return loss. Figure 10 shows the return loss when the dimensions of the notches C (see Figure 3) formed on each radiating element 21A, 21B, 22A, and 22B are changed from 0.5 mm to 6.0 mm. The return loss shows good characteristics (-10 dB or less) when the dimensions of the notches C (cut dimensions) are between 2.06 mm and 4.57 mm. Here, if the free-space wavelength of 4.75 GHz is λ (= 63.16 mm), then 2.06 mm is expressed as 0.033λ and 4.57 mm is expressed as 0.072λ. In other words, in antenna device 1, as shown in Figure 10, the return loss can be kept in a good state (-10 dB or less) by setting the dimensions of the notches C formed on each radiating element 21A, 21B, 22A, and 22B in the range of 0.033λ to 0.072λ. Therefore, by setting the dimensions of the notches C formed in each radiating element 21A, 21B, 22A, and 22B to the range of 0.033λ to 0.072λ, the VSWR characteristics can also be improved.

[0035] As described above, the antenna unit 10 comprises a radiating element substrate 20 having a pair of radiating elements 21A, 22A and a pair of radiating elements 21B, 22B, which are provided at symmetrical positions with respect to a predetermined central position, and a power supply unit 30 that supplies power to the radiating elements 21A, 21B, 22A, and 22B by electromagnetic coupling. Each of the radiating elements 21A, 21B, 22A, and 22B is provided with a notch C at a corner adjacent to an adjacent radiating element, and is also provided with a directivity adjustment pin 23. Therefore, with the antenna unit 10, each of the radiating elements 21A, 21B, 22A, and 22B is provided with a notch C and a directivity adjustment pin 23, so that good half-power angle characteristics and VSWR characteristics can be obtained.

[0036] Although the present invention has been specifically described above based on embodiments, the present invention is not limited to the above embodiments and can be modified without departing from its spirit. For example, as shown in Figure 11, the antenna device 1 may have adjustment plates 50, 50 for adjusting directivity at both ends along the arrangement direction of each dipole antenna unit 10, that is, along the longitudinal direction of the radiating element substrate 20. Here, Figure 12(a) shows the directivity of the antenna device 1 when the adjustment plates 50, 50 are not arranged. On the other hand, Figure 12(b) shows the directivity of the antenna device 1 when the adjustment plates 50, 50 are arranged. Note that each adjustment plate 50 of the antenna device 1 whose directivity is shown in Figure 12(b) has a width of 70.5 mm, a height of 7.5 mm, and a spacing of 30 mm between the adjustment plates 50. Also, the length of the directivity adjustment pin 23 of the antenna device 1 whose directivity is shown in Figures 12(a) and 12(b) is 10 mm (0.158 λ). The breakdown of this length is a head thickness of 1.2 mm, a substrate thickness of 0.8 mm, and an exposed length of 8 mm. Furthermore, the spacing between adjacent radiating elements 21A, 21B, 22A, and 22B is assumed to be 2 mm (0.032 λ). Also, the dimensions of the notches C formed in each radiating element 21A, 21B, 22A, and 22B are assumed to be 3 mm (0.047 λ). As shown in Figures 12(a) and 12(b), the half-angle maximum (FWHM) is 110.8 deg when the adjustment plates 50, 50 are not placed, while the FWHM is 123.9 deg when the adjustment plates 50, 50 are placed. In other words, by placing the adjustment plates 50, 50, the FWHM can be increased by 13.1 deg.

[0037] Furthermore, in the above embodiment, notches C were formed in two locations on each radiating element 21A, 21B, 22A, and 22B, i.e., a total of eight notches C were formed. However, for example, notches C may be formed in one location on each radiating element 21A, 21B, 22A, and 22B, or notches C may be formed in multiple locations other than the eight locations.

[0038] Furthermore, in the above embodiment, the antenna unit 10 is configured to have four directional adjustment pins 23 for each radiating element 21A, 21B, 22A, and 22B, but it may also be configured to have at least one directional adjustment pin 23. In other words, the antenna unit 10 may have at least one directional adjustment pin 23 for each radiating element 21A, 21B, 22A, and 22B. It may be provided that such a feature be included.

[0039] Furthermore, in the above embodiment, the antenna unit 10 is configured to have four directional adjustment pins 23. However, as an alternative to each directional adjustment pin 23, two directional adjustment elements (first adjustment elements) 37A may be provided on the first riser board 130A (described later), and two directional adjustment elements (first adjustment elements) 37B may be provided on the second riser board 130B (described later). Below, a modified antenna unit 110 in which directional adjustment elements 37A and 37B are provided will be described with reference to Figures 13 to 15. Figure 13(a) is a front view showing the modified antenna unit 110, and Figure 13(b) is a rear view showing the antenna unit 110. Figure 14(a) is a left side view showing the modified antenna unit 110, and Figure 14(b) is a right side view showing the antenna unit 110. Figure 15 is a top view showing the modified antenna unit 110. In addition, parts having the same configuration as the antenna unit 10 described in the above embodiment are denoted by the same reference numerals and their descriptions are omitted, while mainly the different parts will be described.

[0040] As shown in Figure 13(a), the first riser board 130A of the antenna unit 110 is wider than the first riser board 30A of the antenna unit 10 (see Figure 4) because it is equipped with a directional adjustment element 37A. The directional adjustment element 37A is provided on the board surface of the first riser board 130A on the side where the first ground portion 33A is provided. The directional adjustment element 37A is provided at the left end and the right end of the board surface, respectively, isolated from the first ground portion 33A. In addition, the first riser board 130A is provided with first upper protrusions 31A at four predetermined locations on its upper end. The directional adjustment element 37A described above extends from two of these first upper protrusions 31A, one at the left end and one at the right end. The directional adjustment element 37A is made of metal foil (for example, copper foil) and is formed on the substrate surface, that is, the substrate surface on which the first ground portion 33A is provided, by a so-called printed circuit board method. The first rising substrate 130A is assembled to the radiating element substrate 120 by inserting each of the first upper protrusions 31A into insertion openings (not shown) drilled at predetermined positions on the radiating element substrate 120, as shown in Figure 15. In this modified example, the radiating element substrate 120 has the above-mentioned insertion openings drilled at positions corresponding to the insertion holes 27 of the radiating element substrate 20 (see Figure 2) in the above embodiment. The first upper protrusions 31A, provided at the left end and right end of the first upper protrusions 31A described above, are inserted into these insertion openings.

[0041] As shown in Figure 14(a), the second riser board 130B of the antenna unit 110 is wider than the second riser board 30B of the antenna unit 10 (see Figure 5) because it is equipped with a directional adjustment element 37B. The directional adjustment element 37B is provided on the substrate surface of the second riser board 130B on the side where the second ground portion 33B is provided. The directional adjustment element 37B is provided at the left end and the right end of the substrate surface, respectively, isolated from the second ground portion 33B. The directional adjustment element 37B is made of metal foil (for example, copper foil) and is formed on the substrate surface, i.e., the substrate surface on the side where the second ground portion 33B is provided, by a so-called printed circuit board method. In addition, the second riser board 130B is provided with second upper protrusions 31B at four predetermined locations on its upper end. Furthermore, as shown in Figure 15, the second riser substrate 130B is assembled to the radiating element substrate 120 by inserting each of the second upper protrusions 31B into insertion openings (not shown) drilled at predetermined positions on the radiating element substrate 120. In this modified example, the radiating element substrate 120 has the above-mentioned insertion openings drilled at positions corresponding to the insertion holes 27 of the radiating element substrate 20 (see Figure 2) in the above embodiment. The second upper protrusions 31B, provided at the left and right ends of the above-mentioned second upper protrusions 31B, are inserted into these insertion openings.

[0042] Furthermore, in the above embodiment, adjustment plates are provided at both ends along the arrangement direction of each antenna unit 10. While the configuration of the 50,50 (see Figure 11) has been described, as an alternative to the adjustment plates 50,50, an adjustment unit (second adjustment element) 38A may be provided on the first riser substrate 130A and an adjustment unit (second adjustment element) 38B may be provided on the second riser substrate 130B.

[0043] As shown in Figure 13(a), the adjustment section 38A is provided on the substrate surface of the first riser substrate 130A on the side where the first ground section 33A is provided. The adjustment section 38A extends from the left end and the right end of the substrate surface toward the side where the first riser substrate 130A is connected to the power supply circuit board 40 toward the side where it is connected to the radiating element substrate 120. In other words, the adjustment section 38A is provided below the directional adjustment element 37A described above. Furthermore, the adjustment section 38A is provided in a state where it is connected to the first ground section 33A. That is, the adjustment section 38A, like the first ground section 33A, is made of metal foil (for example, copper foil) and is formed on the substrate surface, i.e., the substrate surface on the side where the first ground section 33A is provided, by so-called printed circuit board technology.

[0044] As shown in Figure 14(a), the adjustment section 38B is provided on the substrate surface of the second riser substrate 130B on the side where the second ground section 33B is provided. The adjustment section 38B extends from the left end and the right end of the substrate surface toward the side where it is connected to the power supply circuit board 40 of the second riser substrate 130B toward the side where it is connected to the radiating element substrate 120. In other words, the adjustment section 38B is provided below the directional adjustment element 37B described above. Furthermore, the adjustment section 38B is provided in a state where it is connected to the second ground section 33B. That is, the adjustment section 38B, like the second ground section 33B, is made of metal foil (for example, copper foil) and is formed on the substrate surface, i.e., the substrate surface on the side where the second ground section 33B is provided, by so-called printed circuit board technology.

[0045] Figure 16 is a perspective view showing a modified antenna device 1A in which two of the above-described antenna units 110 are arranged. As shown in Figure 16, in the modified antenna device 1A, the radiating element substrate 120 is a shared substrate for each antenna unit 110, similar to the antenna device 1 of the above embodiment (see Figure 1), but separate radiating element substrates may be used for each antenna unit 110.

[0046] Here, Figure 17(a) shows the directivity of the antenna device when the adjustment units 38A (see Figure 13(a)) and 38B (see Figure 14(a)) are not installed. Figure 17(b) shows the directivity of the antenna device 1A when the adjustment units 38A and 38B, with a height of 8 mm, are installed. Figure 17(c) shows the directivity of the antenna device 1A when the adjustment units 38A and 38B, with a height of 10 mm, are installed. Here, the height of the adjustment unit 38A corresponds to the length of the adjustment unit 38A in the extension direction (longitudinal direction). Similarly, the height of the adjustment unit 38B corresponds to the length of the adjustment unit 38B in the extension direction (longitudinal direction). As shown in Figure 17(a), when the adjustment units 38A and 38B are not installed, the half-width angle was 103.6 deg and the maximum gain was 8.1 dBi. Furthermore, the average gain in the ±90deg direction was -2.35dBi. In contrast, as shown in Figure 17(b), when adjustment units 38A and 38B with a height of 8mm are installed, the half-angle maximum is 132.2deg, which is an increase of approximately 29deg compared to when adjustment units 38A and 38B are not installed. Furthermore, when adjustment units 38A and 38B with a height of 8mm are installed, the average gain in the ±90deg direction was -0.17dBi. Furthermore, as shown in Figure 17(c), when adjustment units 38A and 38B with a height of 10mm are installed, that is, when each adjustment unit 38A is connected to a directional adjustment element 37 facing each other in the vertical direction, and each adjustment unit 38B is connected to a directional adjustment element 37B facing each other in the vertical direction, the half-angle maximum was 70.9deg. Furthermore, when adjustment units 38A and 38B with a height of 10 mm were installed, the maximum gain was 8.4 dBi. Also, the average gain in the ±90 degree direction was -0.96 dBi. In other words, when adjustment units 38A and 38B with a height of 10 mm were installed, the maximum gain was 8.4 dBi. When adjustment unit 38B is installed, the maximum gain is almost the same as when adjustment units 38A and 38B are not installed, but the gain in the ±90deg direction increases by approximately 1.5dB, and the radiation pattern becomes closer to a rectangular shape overall. This shape can be used as a communication antenna that is less susceptible to the influence of the antenna's sides.

[0047] Figure 18 is a graph showing the relationship between the height of the adjustment unit 38A and adjustment unit 38B and the half-power angle when the design frequency f is 4.75 GHz. Figure 18 shows the half-power angle when the height of the adjustment unit 38A and adjustment unit 38B is varied from 0 mm to 10 mm. The half-power angle shows good characteristics (increase angle of 10 degrees or more) when the height of the adjustment unit 38A and adjustment unit 38B is between 6.37 mm and 8.27 mm. This increase angle is the increase angle of the half-power angle when the adjustment unit 38A and adjustment unit 38B are not installed, i.e., when the height of the adjustment unit 38A and adjustment unit 38B is 0 mm (103.6 degrees; see Figure 18(a)). Therefore, good characteristics are shown when the half-power angle is 113.6 degrees or more. Here, if the free-space wavelength at 4.75 GHz is λ (= 63.16 mm), then the above 6.37 mm can be expressed as 0.101λ, and 8.27 mm can be expressed as 0.131λ. In other words, in the modified antenna device 1A, as shown in Figure 18, by setting the height of the adjustment section 38A and adjustment section 38B provided on each antenna unit 110 to the range of 0.101λ to 0.131λ, the half-angle power characteristics can be made to a good state.

[0048] As shown in Figure 19, the modified antenna device 1A may also be provided with isolation improvement lines (isolation improvement elements) 128 between adjacent antenna units 110, 110 to improve isolation. Figure 20 is a graph showing the relationship between the width of the isolation improvement line 128 and the isolation [dB] when the design frequency f is 4.75 GHz. Here, the width of the isolation improvement line 128 refers to the width in the direction in which adjacent dipole antenna units constituting the antenna device 1A face each other. Figure 20 shows the isolation [dB] when the width of the isolation improvement line 128 is changed from 0 mm to 3.5 mm. The isolation [dB] shows good characteristics (improvement amount of 5 dB or more) when the width of the isolation improvement line 128 is 0.24 mm or more. This improvement amount is the improvement amount when the isolation improvement line 128 is not provided, i.e., when the width of the isolation improvement line 128 is 0 mm (-20.7 dB) as a reference. Therefore, good characteristics are observed when the isolation is -25.7 dB or less. Here, if the free-space wavelength at 4.75 GHz is λ (= 63.16 mm), then the above 0.24 mm can be expressed as 0.004 λ. In other words, in the modified antenna device 1A, as shown in Figure 20, the isolation characteristics can be improved by making the width of the isolation improvement line 128 0.004 λ or more.

[0049] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of the present invention is indicated by the claims rather than by the foregoing description, and all modifications within the meaning and scope equivalent to the claims are intended to be included. [Explanation of symbols]

[0050] 1. Antenna equipment 10 Antenna Units 20 Radiation element substrate 21A Radiation element 21B Radiation element 22A Radiation 22B Radiation element 23 Directional adjustment pins 30 Power supply unit 30A First riser board 31A First upper convex portion 32A First lower protrusion 33A First Ground Section 34A First non-conductive section 35A First slit 36A First power supply line 30B Second rise board 31B Second upper convex portion 32B Second lower convex portion 33B Second Ground Section 34B Second non-conductive section 35B Second slit 36B Second power supply line 40 Power supply circuit board 41A socket 41B Outlet 42A First non-conductive section 42B Second non-conductive section 43. Grounds Department

Claims

1. A radiating element substrate comprising multiple pairs of radiating elements positioned symmetrically with respect to a predetermined central position, A power supply unit that supplies power to the radiating element by electromagnetic coupling, A dipole antenna unit comprising, Each of the aforementioned radiating elements has a notch provided at the corner adjacent to an adjacent radiating element. At least one of the multiple pairs of radiating elements is provided with an adjustment pin for adjusting its directivity. A dipole antenna unit characterized by the following features.

2. The length of the adjustment pin is in the range of 0.073λ to 0.21λ. The dipole antenna unit according to feature 1.

3. The dimensions of the notch are in the range of 0.033λ to 0.072λ. The dipole antenna unit according to feature 1.

4. Each of the aforementioned radiating elements is provided with a gap between it and adjacent radiating elements. The width of the aforementioned interval is in the range of 0.015λ to 0.038λ. The dipole antenna unit according to feature 1.

5. The aforementioned radiating element substrate comprises two sets of the aforementioned pair of radiating elements. The aforementioned power supply unit is The system comprises a first riser board and a second riser board erected between the radiating element board and the power supply circuit board equipped with a power supply circuit, The first slit provided in the first riser board is inserted into the second riser board, and the second slit provided in the second riser board is inserted into the first riser board, thereby assembling the first riser board and the second riser board so that they are perpendicular to each other. One of the two pairs of radiating elements is electrically connected to a first ground portion provided on one side of the first riser substrate. The other pair of radiating elements is electrically connected to the second ground portion provided on one side of the second riser substrate. The dipole antenna unit according to feature 1.

6. The first riser board has a first power supply line on the side opposite to the side on which the first ground portion is provided. The second riser board has a second power supply line on the side opposite to the side on which the second ground portion is provided. The first riser board is provided with a first non-conductive portion that prevents the second power supply line from being connected to the first ground portion when the power supply unit is assembled. The second riser board is provided with a second non-conductive portion that prevents the first power supply line from being connected to the second ground portion when the power supply unit is assembled. The dipole antenna unit according to claim 5.

7. A radiating element substrate comprising multiple pairs of radiating elements positioned symmetrically with respect to a predetermined central position, A power supply unit that supplies power to the radiating element by electromagnetic coupling, A dipole antenna unit comprising, Each of the aforementioned radiating elements has a notch provided at the corner adjacent to an adjacent radiating element. The power supply unit includes a riser board erected between the radiating element substrate and the power supply circuit board which includes the power supply circuit, The aforementioned riser substrate is provided with an adjustment element for adjusting the directivity. A dipole antenna unit characterized by the following features.

8. The riser board has a first adjustment element as the adjustment element on the side connected to the radiating element board, and a second adjustment element as the adjustment element on the side connected to the power supply circuit board. The dipole antenna unit according to feature 7.

9. The second adjustment element is, The riser board extends from the side connected to the power supply circuit board toward the side connected to the radiating element board, The length in the extension direction is in the range of 0.101λ to 0.131λ. The dipole antenna unit according to claim 8.

10. A dipole antenna unit according to any one of claims 1 to 6, A power supply circuit board equipped with a power supply circuit, Equipped with, Multiple dipole antenna units are arranged on the aforementioned power supply circuit board. An antenna device characterized by the following features.

11. Adjustment plates for adjusting directivity are provided at both ends of the aforementioned multiple dipole antenna units along the direction of arrangement. The antenna device according to feature 10.

12. A dipole antenna unit according to any one of claims 7 to 9, A power supply circuit board equipped with a power supply circuit, Equipped with, Multiple dipole antenna units are arranged on the aforementioned power supply circuit board. An antenna device characterized by the following features.

13. Each of the multiple dipole antenna units has a radiating element substrate that is made up of a single substrate shared by all of them. The radiating element substrate is provided with isolation-improving elements to improve isolation between adjacent dipole antenna units. The antenna device according to feature 12.

14. The isolation improvement element has a width of 0.004λ or more in the direction in which the adjacent dipole antenna units face each other. The antenna device according to feature 13.

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