Liquid-filled mount

JP2026165311APending Publication Date: 2026-10-14FUKOKU CO LTD
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Patent Information

Application Number
JP2025057638
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-31
Publication Date
2026-10-14

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  • Figure 2026165311000001_ABST
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Abstract

We provide a liquid-filled mount that does not break even when a load is applied. [Solution] The liquid-filled mount comprises a cylindrical support member having a cylindrical support member body and a support member flange extending outward from the upper part of the support member body, a cup-shaped case having a case body disposed on the outer circumference side of the cylindrical support member, a case flange extending outward from the upper part of the case body and disposed on the lower surface of the support member flange, and a case bottom that houses the damping fluid and damping plate and closes the lower end of the case body, an upper stopper that protrudes upward so as to be able to contact the upper member is provided on the upper surface of the support member flange of the cylindrical support member, a lower stopper that protrudes downward so as to be able to contact the damping plate is provided on the lower end of the support member body of the cylindrical support member, the support member flange of the cylindrical support member is made thicker than the case flange, and the support member body of the cylindrical support member is made thicker than the case body.
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Citation Information

Patent Citations

  • Liquid sealing type mount

    JP1998026172A