Raw material roll for protective film transfer, method for arranging protective film, and method for manufacturing chips

Abstract

This invention provides a protective film transfer roll that can reduce the cost of applying a protective film to a workpiece compared to applying a protective film to a workpiece using the spin coating method. [Solution] A protective film transfer roll is provided, which is constructed by winding a laminate including a sheet and a protective film applied to one side of the sheet, wherein the protective film is in a semi-cured state that can be transferred to the object to be treated.

Description

Technical Field

[0001] The present invention relates to a protective film transfer original roll configured by winding a laminate including a sheet and a protective film applied to one surface of the sheet, a protective film arranging method for arranging a protective film on a workpiece, and a chip manufacturing method for manufacturing a plurality of chips by dividing a workpiece on which a plurality of devices are formed along boundaries of the plurality of devices.

Background Art

[0002] Semiconductor packages including devices such as ICs (Integrated Circuits) are essential components in various electronic devices such as mobile phones and personal computers. This semiconductor package is manufactured through a semiconductor manufacturing process that is roughly divided into a pre-process for forming a plurality of devices each including a large number of circuit elements on a wafer, and a post-process for manufacturing the semiconductor package from the wafer on which the plurality of devices are formed.

[0003] In the post-process, for example, semiconductor packages are manufactured in the following order. First, the wafer is divided along the boundaries of the plurality of devices to manufacture a plurality of dies. Next, the plurality of dies are mounted on a lead frame so that each is connected to an external electrode. Next, the plurality of dies are sealed with a resin to manufacture a semiconductor package substrate. Next, the semiconductor package substrate is divided along the boundaries of the plurality of dies (that is, the boundaries of the plurality of devices) to manufacture a plurality of semiconductor packages.

[0004] Examples of apparatuses used for dividing a workpiece such as a wafer or a semiconductor package substrate include a cutting apparatus and a laser processing apparatus. In this cutting apparatus, for example, the workpiece is divided by causing a rotating annular cutting blade to cut into the workpiece. Further, in the laser processing apparatus, for example, the workpiece is divided by irradiating the workpiece with a laser beam having a wavelength that is absorbed by the material of the workpiece to cause laser ablation.

[0005] However, when a cutting blade is used to cut into a workpiece, burrs (specifically, sharp edges resulting from localized plastic deformation) may form on the workpiece. Also, if laser ablation occurs on the workpiece, debris (specifically, molten parts of the workpiece or solidified molten parts) may scatter and adhere to the workpiece.

[0006] In these cases, the quality of the die or chips such as semiconductor packages manufactured by dividing the workpiece may deteriorate. Taking these points into consideration, it has been proposed to apply a protective film to the workpiece prior to division in order to suppress the formation of burrs or the adhesion of debris (see, for example, Patent Documents 1 and 2). [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2019-36660 [Patent Document 2] Japanese Patent Publication No. 2004-188475 [Overview of the project] [Problems that the invention aims to solve]

[0008] The protective film is generally applied to the workpiece or other object to be processed using the spin coating method. Specifically, when applying a protective film to a workpiece using the spin coating method, first, a liquid protective film agent is dropped onto the workpiece. Next, the workpiece is rotated by applying centrifugal force to spread the protective film agent and cover the entire surface of the workpiece. Then, the protective film agent is dried. As a result, a protective film is applied to the workpiece.

[0009] When a protective film is applied in this manner, a large amount of the protective film material spills off the workpiece as it rotates. This spilled protective film material is often discarded without being reused. Therefore, in this case, it becomes necessary to prepare a much larger amount of protective film material than is ultimately used as a protective film, resulting in high costs.

[0010] In view of this, the present invention aims to provide a protective film transfer roll, a method for applying a protective film, and a method for manufacturing chips that can reduce the cost of applying a protective film to an object to be processed. [Means for solving the problem]

[0011] According to one aspect of the present invention, a protective film transfer roll is provided, which is constructed by winding a laminate including a sheet and a protective film applied to one side of the sheet, wherein the protective film is in a semi-cured state that can be transferred to an object to be treated.

[0012] In addition, in the protective film transfer roll of the present invention, it is preferable that the protective film contains a heat-foaming agent that foams when heated to a predetermined temperature or higher, and / or contains an active energy ray-curable resin or a thermosetting resin.

[0013] According to another aspect of the present invention, a method for providing a protective film on an object to be treated is provided, comprising: applying a liquid protective film agent to one side of a sheet; curing the protective film agent applied to the one side of the sheet into a semi-cured protective film; and transferring the protective film from the sheet to the object to be treated.

[0014] Furthermore, the method for applying the protective film of the present invention preferably further includes bringing the protective film, which has been transferred to the object to be treated, into a fully cured state.

[0015] According to yet another aspect of the present invention, a method for manufacturing chips is provided, which involves dividing a workpiece having a plurality of devices along the boundaries of the plurality of devices to produce a plurality of chips, comprising: preparing a protective film transfer roll formed by winding a laminate including a sheet and a semi-cured protective film applied to one side of the sheet; transferring the protective film from the sheet to the workpiece; and dividing the workpiece into the plurality of chips by processing the workpiece along the boundaries of the plurality of devices from the side on which the protective film is provided.

[0016] A further aspect of the present invention provides a method for manufacturing chips, comprising: applying a liquid protective film agent to one side of a sheet; curing the protective film agent applied to the one side of the sheet into a semi-cured protective film; transferring the protective film from the sheet to the workpiece; and dividing the workpiece into the multiple chips by processing the workpiece along the boundaries of the multiple devices from the side on which the protective film is provided.

[0017] Furthermore, the chip manufacturing method of the present invention preferably further comprises bringing the protective film transferred to the workpiece to a fully cured state before dividing the workpiece into the plurality of chips. In addition, if the protective film contains a heat-foaming agent that foams when heated above a predetermined temperature, the chip manufacturing method of the present invention preferably further comprises removing the protective film from each of the plurality of chips while foaming the protective film remaining on each of the plurality of chips by heating it above the predetermined temperature. [Effects of the Invention]

[0018] In the present invention, by bringing the protective film into a semi-cured state, it is possible to transfer the protective film and dispose it on the workpiece. In this case, compared with the case where the protective film is disposed on the workpiece using a spin coating method, the amount of the raw material for the protective film (protective film agent) that is discarded without being used can be reduced. Therefore, according to the present invention, it is possible to reduce the cost when disposing the protective film on the workpiece. [Brief Description of the Drawings]

[0019] [Figure 1] FIG. 1 is a perspective view schematically showing an example of a raw roll for protective film transfer. [Figure 2] FIG. 2 is a flowchart schematically showing an example of a raw roll preparation method for preparing the raw roll shown in FIG. 1. [Figure 3] FIG. 3 is a flowchart schematically showing an example of a protective film disposing method for disposing a protective film on a workpiece using the raw roll shown in FIG. 1. [Figure 4] FIG. 4(A) is a plan view schematically showing an example of a workpiece on which a protective film is disposed, and FIG. 4(B) is a side view schematically showing the workpiece shown in FIG. 4(A). [Figure 5] FIG. 5 is a side view schematically showing a state in which the transfer step shown in FIG. 3 is performed. [Figure 6] This is a flowchart schematically showing an example of a chip manufacturing method for manufacturing chips from the workpiece shown in FIG. 4(A) and FIG. 4(B). [Figure 7] FIG. 7 is a plan view schematically showing a state in which the dividing step shown in FIG. 6 is performed. [Figure 8] FIG. 8 is a partial cross-sectional side view schematically showing a state in which the protective film disposing method is performed using a transfer apparatus capable of performing not only the transfer step shown in FIG. 3 but also the coating step and the semi-curing step shown in FIG. 2. [Figure 9] FIG. 9 is a flowchart schematically showing another example of the chip manufacturing method for manufacturing chips from the workpiece shown in FIG. 4(A) and FIG. 4(B). [Figure 10] FIG. 10 is a side view schematically showing a state in which the full curing step shown in FIG. 9 is performed. [Figure 11] FIG. 11 is a flowchart schematically showing still another example of the chip manufacturing method for manufacturing chips from the workpiece shown in FIG. 4(A) and FIG. 4(B). [Figure 12] FIG. 12 is a side view schematically showing a state in which the removal step shown in FIG. 11 is performed. [Modes for Carrying Out the Invention]

[0020] Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing an example (original roll 1) of an original roll for protective film transfer. The original roll 1 is configured by winding a rectangular laminate whose length is orders of magnitude larger than its width. The laminate includes, for example, a sheet 1a, a protective film 1b applied to one surface of the sheet 1a, and release paper 1c provided so as to sandwich the protective film 1b together with the sheet 1a.

[0021] The sheet 1a contains, for example, a resin such as polyolefin (PO), polyethylene terephthalate (PET), polyvinyl chloride (PVC), or polystyrene (PS). Note that one surface of the sheet 1a may have an uneven shape so as to improve adhesion to the protective film 1b. For example, one surface of the sheet 1a may have a larger surface roughness than the other surface.

[0022] The protective film 1b contains, for example, a resin that polymerizes and cures by applying energy. Examples of this resin include active energy ray-curable resins that polymerize and cure upon irradiation with active energy rays such as ultraviolet rays, such as urethane acrylate, epoxy acrylate, or acrylic acrylate, or thermosetting resins that polymerize and cure upon heating, such as phenol resin, epoxy resin, melanin resin, or polyester resin. Further, the protective film 1b may contain a water-soluble resin such as polyvinyl alcohol (PVA) instead of or in addition to this resin.

[0023] Furthermore, the protective film 1b may contain a foaming agent that foams when energy is applied. Examples of this foaming agent include a thermal foaming agent that foams when heated to a predetermined temperature or higher, such as a thermal expansion microcapsule, or an active energy ray foaming agent that foams when irradiated with active energy rays.

[0024] The protective film 1b is then in a semi-cured state by being subjected to at least one of heating, active energy ray irradiation, or drying. In this specification, the semi-cured state means the state in which the protective film 1b can be transferred from the sheet 1a to the object to be transferred (hereinafter also referred to as the "object to be treated"). Specifically, the semi-cured state means that the protective film 1b does not fall off the sheet 1a even when the protective film 1b is turned downwards after the release paper 1c is removed, and / or the protective film 1b is not transferred to the object to be treated even when the object to be treated is lightly brought into contact with the protective film 1b, but the protective film 1b is transferred to the object to be treated when the pressing force acting between them exceeds a threshold.

[0025] In other words, in this specification, the semi-cured state means a state that is neither uncured nor fully cured. In this specification, the uncured state is a state in which the protective film 1b is transferred to the workpiece even if the pressing force acting on them is less than the threshold. In this specification, the fully cured state is a state in which the protective film 1b is not transferred to the workpiece no matter how large the pressing force acting on them is. In this specification, the semi-cured state can also be described as a so-called B-stage state.

[0026] The release paper 1c is wound on the raw material roll 1 such that one side is in contact with the protective film 1b and the other side is in contact with the sheet 1a. The release paper 1c is also configured to be easily peeled off from the semi-cured protective film 1b. For example, the release paper 1c has a base layer and a release layer provided on the protective film 1b side of the base layer.

[0027] The base layer contains a resin such as polypropylene (PP), polyethylene (PE), or polyethylene terephthalate (PET). The release layer contains, for example, a silicone-based material such as a fluorine-containing silicone-based material, or a non-silicone-based material. The raw material roll 1 does not necessarily have to contain release paper 1c. In this case, the other side of the sheet 1a may be treated to prevent the protective film 1b from being transferred.

[0028] Figure 2 is a schematic flowchart illustrating an example of a method for preparing the raw material roll 1. In this method, the following steps are performed in order: applying a liquid protective film agent to one side of the sheet 1a (application step S1), curing the protective film agent applied to one side of the sheet 1a into a semi-cured protective film 1b (semi-curing step S2), and winding the laminate containing the sheet 1a and the protective film 1b (winding step S3).

[0029] Figure 3 is a schematic flowchart illustrating an example of a method for applying a protective film to an object to be processed using a raw material roll 1. In this method, first, the raw material roll 1 is prepared (preparation step S10). In preparation step S10, the raw material roll 1, which has been prepared, for example, in accordance with the raw material roll preparation method shown in Figure 2, or which has been transferred from a third party (for example, purchased), is placed in a predetermined position (for example, the feed roller 24a included in the supply section 24 of the transfer device 20 described later (see Figure 5)).

[0030] After performing the preparation step S10, the protective film 1b is partially transferred from the sheet 1a to the workpiece (transfer step S20). Figure 4(A) is a schematic plan view showing an example of a workpiece (workpiece 11) to which the protective film 1b is transferred, and Figure 4(B) is a schematic side view showing the workpiece 11.

[0031] The workpiece 11 has a generally parallel surface 11a and back surface 11b, and is, for example, a wafer made of silicon (Si). Multiple devices 13 are provided on the surface 11a side of the workpiece 11. Each device 13 includes, for example, a semiconductor element for constituting an IC, a semiconductor memory, or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

[0032] Multiple devices 13 are arranged in a matrix. That is, the boundaries between the multiple devices 13 extend in a grid pattern. The linearly extending portions of these boundaries are also called division lines. Furthermore, the outer edges of the workpiece 11 are chamfered. In other words, the side surface 11c of the workpiece 11 is curved so as to be convex outwards.

[0033] There are no restrictions on the material, shape, structure, or size of the workpiece 11. The workpiece 11 may be, for example, a wafer made of a semiconductor other than silicon (e.g., silicon carbide (SiC) or gallium nitride (GaN)). Similarly, there are no restrictions on the type, quantity, shape, structure, size, or arrangement of the multiple devices 13.

[0034] Furthermore, the workpiece 11 may be integrated with the ring frame (not shown) via a support member (not shown) which includes an adhesive layer attached to its back surface 11b. Alternatively, the workpiece 11 may be integrated with the ring frame via a support member which does not include an adhesive layer that is heat-pressed to its back surface 11b.

[0035] Figure 5 is a schematic cross-sectional side view illustrating the transfer step S20. For convenience, in the following explanation, the right side of the page showing Figure 5 will be considered the front side, the left side the rear side, and the upper side the higher side, and the lower side the lower side.

[0036] The transfer step S20 is carried out using a transfer device 20. The transfer device 20 has a chuck table 22 for holding the workpiece 11. The chuck table 22 has, for example, a disc-shaped frame made of ceramics or the like, and a disc-shaped porous plate fixed in a recess formed on the upper surface of the frame.

[0037] Furthermore, a flow path is formed in the frame of the chuck table 22, opening at the bottom surface of the recess, and this flow path is connected to a suction source (not shown) and a fluid supply source (not shown) via a valve (not shown), etc. The suction source includes, for example, an ejector. The fluid supply source includes, for example, a tank for storing high-pressure gas, a filter for removing foreign matter mixed in with the gas supplied from the tank, and a regulator for adjusting the pressure of the gas supplied from the tank.

[0038] Then, with the workpiece 11 placed on the chuck table 22, when the suction source communicating with the flow path formed in the frame is activated, the pressure in this flow path becomes negative. As a result, a suction force acts on the workpiece placed on the chuck table 22 via the porous plate. In other words, the workpiece 11 is held in place on the chuck table 22.

[0039] Furthermore, when the workpiece 11 is held in the chuck table 22, operating the fluid supply source that communicates with the flow path formed in the frame returns the pressure in this flow path to atmospheric pressure. As a result, the suction force acting on the workpiece 11 placed in the chuck table 22 via the porous plate ceases. In other words, the workpiece 11 is simply placed in the chuck table 22.

[0040] Furthermore, the chuck table 22 is connected to a horizontal movement mechanism (not shown). The horizontal movement mechanism includes, for example, a ball screw and a motor connected to this ball screw. When the horizontal movement mechanism is operated, the chuck table 22 moves along the horizontal direction. For example, when the horizontal movement mechanism is operated, the chuck table 22 moves between the loading / unloading position and the transfer position.

[0041] The loading / unloading position is a position on the chuck table 22 that allows for easy loading of the workpiece 11 into and unloading of the workpiece 11 therefrom. The transfer position is a position on the chuck table 22 that allows for the transfer of the protective film 1b from the sheet 1a unwound from the raw material roll 1 to the workpiece 11 held on the chuck table 22.

[0042] Above the chuck table 22 positioned at the transfer location, there is a supply unit 24 for supplying the protective film 1b applied to one side of the sheet 1a, and a transfer unit 26 for transferring the protective film 1b from the sheet 1a to the workpiece 11.

[0043] The supply unit 24 has a feed roller 24a for feeding out a laminate containing a sheet 1a, a protective film 1b, and a release paper 1c from the raw material roll 1. The feed roller 24a is located in front of the chuck table 22, which is positioned at the transfer position in a plan view. A guide roller 24b is provided below the feed roller 24a. The other side of the release paper 1c contained in the laminate fed out from the feed roller 24a comes into contact with the guide roller 24b.

[0044] A release paper collection roller 24c is provided in front of the guide roller 24b for collecting the release paper 1c. The leading edge of the release paper 1c is fixed to the release paper collection roller 24c. When the release paper collection roller 24c is rotated, the release paper 1c moving forward from the guide roller 24b is wound up by the release paper collection roller 24c.

[0045] The transfer section 26 has a guide roller 26a positioned behind the guide roller 24b so as to approach it. The other side of the sheet 1a included in the laminate, which has been fed out from the feed roller 24a, contacts the guide roller 26a. Behind the guide roller 26a, in a plan view, is a guide roller 26b located behind the chuck table 22 positioned at the transfer position. The other side of the sheet 1a, which has been pulled out towards the rear from the guide roller 26a, contacts the guide roller 26b.

[0046] Above the guide roller 26b, a sheet recovery roller 26c is provided for recovering the sheet 1a on which the protective film 1b that was not transferred to the workpiece 11 remains on one side. The leading edge of the sheet 1a is fixed to the sheet recovery roller 26c. When the sheet recovery roller 26c is rotated, the sheet 1a moving upward from the guide roller 26b is wound up by the sheet recovery roller 26c.

[0047] Furthermore, a pressure roller 26d is provided between the two guide rollers 26a and 26b. The pressure roller 26d is connected to a moving mechanism (not shown). The moving mechanism includes, for example, a timing belt and a motor connected to this timing belt. When this moving mechanism is operated, the pressure roller 26d moves in a cyclic manner between a standby position, a transfer start position, and a transfer end position.

[0048] The standby position is the position of the pressing roller 26d that does not contact the sheet 1a (specifically, in a plan view, it is behind the guide roller 26a and in front of the guide roller 26b, and above both). The transfer start position is the position of the pressing roller 26d that allows the protective film 1b to be pressed against the front end of the workpiece 11 held in the chuck table 22 via the sheet 1a. The transfer end position is the position of the pressing roller 26d that allows the protective film 1b to be pressed against the rear end of the workpiece 11 held in the chuck table 22 via the sheet 1a.

[0049] When performing the transfer step S20 in the transfer apparatus 20, first, the chuck table 22 is positioned at the loading / unloading position. Next, the workpiece 11 is loaded onto the chuck table 22 so that its surface 11a faces upward. Then, the workpiece 11 is held in place by the chuck table 22.

[0050] Next, the chuck table 22 is positioned at the transfer position. Then, the pressing roller 26d is moved from the standby position, through the transfer start position and the transfer end position, and back to the standby position. As a result, the protective film 1b is pressed against the workpiece 11 via the circular region contained in the sheet 1a. Consequently, the portion of the protective film 1b applied to that region is transferred to the surface 11a of the workpiece 11.

[0051] Furthermore, when performing the transfer step S20 in the transfer device 20, the portion of the protective film 1b that is applied to a circular area contained in the sheet 1a may be transferred to the surface 11a of the workpiece 11 via the circular area contained in the sheet 1a by moving the chuck table 22 instead of, or in addition to, moving the pressing roller 26d. That is, during this transfer, the chuck table 22 may be moved while the pressing roller 26d is pressing the protective film 1b onto the surface 11a of the workpiece 11 via the sheet 1a.

[0052] Figure 6 is a schematic flowchart illustrating an example of a chip manufacturing method for producing chips from a workpiece 11. In this method, first, the preparation step S10 is performed, and then the protective film 1b is partially transferred from the sheet 1a to the workpiece 11 (transfer step S20'). The transfer step S20' is performed, for example, in the same manner as the transfer step S20 shown in Figure 5.

[0053] After the transfer step S20' is performed, the workpiece 11 is divided into multiple chips (dividing step S30). Figure 7 is a schematic plan view showing the division step S30. Note that the directions indicated by arrow X (X direction) and arrow Y (Y direction) in Figure 7 are mutually orthogonal directions in the horizontal plane, and the direction indicated by arrow Z (Z direction) is a direction perpendicular to the X direction and the Y direction, respectively (vertical direction).

[0054] The splitting step S30 is performed using a cutting device 30. The cutting device 30 has a chuck table 32 for holding the workpiece 11. The chuck table 32 has a structure similar to, for example, the chuck table 22 shown in Figure 5, and is capable of holding the workpiece 11 by applying suction force.

[0055] Furthermore, the chuck table 32 is connected to an X-direction movement mechanism (not shown). The X-direction movement mechanism includes, for example, a ball screw and a motor connected to this ball screw. When the X-direction movement mechanism is operated, the chuck table 32 moves along the X direction.

[0056] In addition, the chuck table 32 is connected to a rotating mechanism (not shown). The rotating mechanism includes, for example, a shaft, a pulley connected to this shaft, and a motor for rotating this pulley. When the rotating mechanism is operated, the chuck table 32 rotates with a rotation axis that passes through its center and is aligned with the Z direction.

[0057] A cutting unit 34 is provided above the chuck table 32. The cutting unit 34 has a spindle 34a that extends along the Y direction. The spindle 34a is housed in a housing 34b, except for its tip. The housing 34b also houses a motor (not shown) connected to the base portion of the spindle 34a, and by operating this motor, the spindle 34a rotates with a straight line along the Y direction as its axis of rotation.

[0058] A cutting blade 34c is mounted at the tip of the spindle 34a. The cutting blade 34c has an annular cutting edge containing a binder made of metal, ceramics, or resin, and abrasive grains made of diamond or the like dispersed in the binder.

[0059] Furthermore, the cutting unit 34 is connected to a Y-direction movement mechanism (not shown) and a Z-direction movement mechanism (not shown). Each of the Y-direction movement mechanism and the Z-direction movement mechanism includes, for example, a ball screw and a motor connected to this ball screw. When the Y-direction movement mechanism is operated, the cutting unit 34 moves along the Y-direction, and when the Z-direction movement mechanism is operated, the cutting unit 34 moves along the Z-direction.

[0060] When performing the splitting step S30 in the cutting device 30, first, the chuck table 32 is moved along the X direction so that it is away from the cutting blade 34c in a plan view. Next, the workpiece 11 is brought onto the chuck table 32 so that the protective film 1b faces upward. Prior to bringing the workpiece 11 onto the chuck table 32, a support member is fixed to the back surface 11b of the workpiece 11. Furthermore, the workpiece 11 may be integrated with the ring frame via this support member.

[0061] Next, the workpiece 11 is held in the chuck table 32 via a support member. Then, the chuck table 32 is rotated so that the planned division line is parallel to the X direction. Next, the cutting unit 34 is moved along the Y direction so that the planned division line is positioned in the X direction when viewed from the cutting blade 34c in a plan view.

[0062] Next, the cutting unit 34 is moved along the Z-direction so that the lower end of the cutting blade 34c is positioned at a height corresponding to the support member. Then, while rotating the spindle 34a together with the cutting blade 34c, the chuck table 32 is moved along the X-direction so that the cutting blade 34c cuts into the protective film 1b and the workpiece 11.

[0063] This divides the workpiece 11 along the planned division lines. Furthermore, the above operation is repeated until the workpiece 11 is divided along all of the boundaries of the multiple devices 13. As a result, multiple chips are manufactured from the workpiece 11.

[0064] In the embodiment described above, the protective film 1b can be transferred and applied to the workpiece 11 by semi-curing it. In this case, compared to the case in which the protective film 1b is applied to the workpiece 11 using the spin coating method, the amount of raw material (protective film agent) for the protective film 1b that is discarded without being used can be reduced. Therefore, according to the embodiment described above, it is possible to reduce the cost of applying the protective film 1b to the workpiece 11.

[0065] The embodiments described above are one aspect of the present invention, and the present invention is not limited to the embodiments described above.

[0066] For example, the raw material roll of the present invention may be wound so that the sheet 1a is on the innermost side, i.e., the release paper 1c is on the outermost side, rather than being wound so that the sheet 1a is on the outermost side, i.e., the release paper 1c is on the innermost side. Also, if the raw material roll of the present invention does not include the release paper 1c, the sheet 1a may be wound so that the side on which the protective film 1b is applied is on the inside, rather than one side being on the inside.

[0067] Furthermore, the method for arranging the protective film of the present invention may also include a transfer step S20 carried out using a transfer device having a different structure from the transfer device 20. For example, such a transfer device can be used to lower the pressure in the space on one side of the sheet 1a than the pressure in the space on the other side, while the protective film 1b applied to one side of the sheet 1a is in close proximity to the surface 11a of the workpiece 11. That is, in the transfer step S20, the protective film 1b may be transferred to the workpiece 11 by pressing the protective film 1b onto the surface 11a of the workpiece 11 via the sheet 1a using the pressure difference between the two spaces.

[0068] Furthermore, the method for applying the protective film of the present invention may be carried out not only using the transfer step S20, but also using a transfer apparatus capable of performing the coating step S1 and the semi-curing step S2.

[0069] Figure 8 is a schematic cross-sectional side view illustrating how a protective film is arranged in an example of such a transfer apparatus (transfer apparatus 2). For convenience, in the following explanation, the right side of the page showing Figure 8 will be considered the front side, the left side the rear side, and the upper side the higher side, and the lower side the lower side.

[0070] The transfer apparatus 2 comprises a coating section 4 for performing the coating step S1, a semi-curing section 6 for performing the semi-curing step S2, and a chuck table 8 and a transfer section 10 for performing the transfer step S20.

[0071] The coating unit 4 has a dispensing roller 4a around which the sheet 1a is wound. When the dispensing roller 4a is rotated, the sheet 1a is dispensed. A guide roller 4b is provided in front of the dispensing roller 4a. One side of the sheet 1a dispensed by rotating the dispensing roller 4a contacts the guide roller 4b.

[0072] A guide roller 4c is provided above the guide roller 4b. One side of the sheet 1a, extending upward from the guide roller 4b, is in contact with the guide roller 4c. Behind the guide roller 4c, a coating roller 4d and a pressure roller 4e are provided, positioned close together vertically. The widths of the coating roller 4d and the pressure roller 4e (lengths in the depth direction on the paper shown in Figure 8) are approximately equal to or greater than the width of the sheet 1a.

[0073] Furthermore, the coating roller 4d and the pressing roller 4e are positioned so that they press against each other, causing slight elastic deformation near the upper end of the coating roller 4d and near the lower end of the pressing roller 4e. In addition, the lower part of the coating roller 4d is located inside the tank 4f, and this tank 4f is filled with a protective film agent L so as to be in contact with at least the lower end of the coating roller 4d.

[0074] The surface of the coating roller 4d may have an uneven shape to improve adhesion with the protective film agent L. When both the coating roller 4d and the pressure roller 4e are rotated, the surface of the coating roller 4d is pressed against one side of the sheet 1a facing backward from the guide roller 4c, and then the sheet 1a is fed out from the coating roller 4d and the pressure roller 4e.

[0075] Here, the protective film agent L scooped up from the tank 4f is attached to the surface of the coating roller 4d. Therefore, when the surface of the coating roller 4d is pressed against one side of the sheet 1a, the protective film agent L is applied to one side of the sheet 1a. In other words, coating step S1 is performed.

[0076] The semi-cured section 6 has a guide roller 6a located above the pressing roller 4e. The other side of the sheet 1a, which is fed out by rotating both the coating roller 4d and the pressing roller 4e, contacts the guide roller 6a. A guide roller 6b is provided in front of the guide roller 6a. The other side of the sheet 1a, which is facing forward from the guide roller 6a, contacts the guide roller 6b.

[0077] Furthermore, a semi-curing unit 6c is provided between the pair of guide rollers 6a and 6b to convert the protective film agent L applied to one side of the sheet 1a into a semi-cured protective film 1b. This semi-curing unit 6c includes, for example, at least one of a heater, an active energy ray irradiator, or a dehumidifier.

[0078] Then, when the semi-curing unit 6c is activated, a portion of the resin contained in the protective film agent L applied to one side of the sheet 1a polymerizes and hardens, and / or its water content decreases, causing the protective film agent L to become a semi-cured protective film 1b. In other words, the semi-curing step S2 is performed.

[0079] The chuck table 8 has a structure similar to the chuck table 22 of the transfer apparatus 20 shown in Figure 5. Specifically, the chuck table 8 includes, for example, a disc-shaped frame made of ceramics or the like, and a disc-shaped porous plate fixed in a recess formed on the upper surface of this frame.

[0080] Furthermore, a flow path is formed in the frame of the chuck table 8, opening at the bottom surface of the recess, and this flow path is connected to a suction source (not shown) and a fluid supply source (not shown) via a valve (not shown), etc. The suction source includes, for example, an ejector. The fluid supply source includes, for example, a tank for storing high-pressure gas, a filter for removing foreign matter mixed in with the gas supplied from the tank, and a regulator for adjusting the pressure of the gas supplied from the tank.

[0081] Then, with the workpiece 11 placed on the chuck table 8, when the suction source communicating with the flow path formed in the frame is activated, the pressure in this flow path becomes negative. As a result, a suction force acts on the workpiece placed on the chuck table 8 through the porous plate. In other words, the workpiece 11 is held in place on the chuck table 8.

[0082] Furthermore, when the workpiece 11 is held in the chuck table 8, operating the fluid supply source that communicates with the flow path formed in the frame returns the pressure in this flow path to atmospheric pressure. As a result, the suction force acting on the workpiece 11 placed in the chuck table 8 via the porous plate ceases. In other words, the workpiece 11 is simply placed on the chuck table 8.

[0083] Furthermore, the chuck table 8 is connected to a horizontal movement mechanism (not shown). The horizontal movement mechanism includes, for example, a ball screw and a motor connected to this ball screw. When the horizontal movement mechanism is operated, the chuck table 8 moves along the horizontal direction. For example, when the horizontal movement mechanism is operated, the chuck table 8 moves between the loading / unloading position and the transfer position.

[0084] The loading / unloading position is a location on the chuck table 8 that allows for easy loading of the workpiece 11 into and unloading of the workpiece 11. The transfer position is a location on the chuck table 8 that allows for the transfer of the protective film 1b from the sheet 1a to the workpiece 11 held on the chuck table 8.

[0085] The transfer section 10 has a structure similar to the transfer section 26 of the transfer device 20 shown in Figure 5. Specifically, the transfer section 10 has a guide roller 10a. The other surface of the sheet 1a extending downward from the guide roller 6b of the semi-cured section 6 is in contact with the guide roller 10a.

[0086] Behind the guide roller 10a, in a plan view, is a guide roller 10b located behind the chuck table 8 positioned at the transfer location. The other side of the sheet 1a, which is pulled out towards the rear from the guide roller 10a, comes into contact with the guide roller 10b.

[0087] Above the guide roller 10b, a sheet recovery roller 10c is provided for recovering the sheet 1a on which the protective film 1b that was not transferred to the workpiece 11 remains on one side. The leading edge of the sheet 1a is fixed to the sheet recovery roller 10c. When the sheet recovery roller 10c is rotated, the sheet 1a moving upward from the guide roller 10b is wound up by the sheet recovery roller 10c.

[0088] Furthermore, a pressure roller 10d is provided between the two guide rollers 10a and 10b. The pressure roller 10d is connected to a moving mechanism (not shown). The moving mechanism includes, for example, a timing belt and a motor connected to this timing belt. When this moving mechanism is operated, the pressure roller 10d moves in a cyclic manner between a standby position, a transfer start position, and a transfer end position.

[0089] The standby position is the position of the pressing roller 10d that does not contact the sheet 1a (specifically, in a plan view, it is behind the guide roller 10a and in front of the guide roller 10b, and above both). The transfer start position is the position of the pressing roller 10d that allows the protective film 1b to be pressed against the front end of the workpiece 11 held in the chuck table 8 via the sheet 1a. The transfer end position is the position of the pressing roller 10d that allows the protective film 1b to be pressed against the rear end of the workpiece 11 held in the chuck table 8 via the sheet 1a.

[0090] Then, in the transfer apparatus 2, the coating section 4 and the semi-curing section 6 are operated in the same manner as the coating step S1 and semi-curing step S2 shown in Figure 2, and the chuck table 8 and the transfer section 10 are operated in the same manner as the transfer step S20 shown in Figure 3, thereby transferring the protective film 1b from the sheet 1a to the workpiece 11.

[0091] Furthermore, when performing the transfer step S20 in the transfer apparatus 2, the portion of the protective film 1b that is applied to a circular area contained in the sheet 1a may be transferred to the surface 11a of the workpiece 11 via the circular area contained in the sheet 1a by moving the chuck table 8 instead of, or in addition to, moving the pressing roller 10d. That is, during this transfer, the chuck table 8 may be moved while the pressing roller 10d is pressing the protective film 1b onto the surface 11a of the workpiece 11 via the sheet 1a.

[0092] Furthermore, the chip manufacturing method of the present invention may also include a splitting step S30 carried out using a cutting device having a different structure from the cutting device 30 or a processing device other than a cutting device. Examples of such processing devices include a laser processing device capable of processing a workpiece by irradiating it with a laser beam having a wavelength absorbed by the material of the workpiece 11. That is, in the splitting step S30, the workpiece 11 may be split into multiple chips by irradiating the workpiece 11 with a laser beam such that laser ablation occurs along the boundaries of the multiple devices 13.

[0093] Furthermore, the chip manufacturing method of the present invention may include a splitting step S30 carried out using two or more processing devices. Examples of such two or more processing devices include a cutting device or laser processing device (splitting point forming device) capable of forming splitting points (e.g., grooves) on the workpiece 11, and a grinding device capable of grinding the workpiece 11. In the splitting step S30, for example, the workpiece 11 may be divided into multiple chips using the splitting point forming device to form the splitting point on the surface 11a side of the workpiece 11, and then the workpiece 11 may be divided into multiple chips using the splitting point as a boundary by grinding the back surface 11b side of the workpiece 11 using the grinding device.

[0094] Furthermore, the chip manufacturing method of the present invention may also include another step in addition to the preparation step S10, transfer step S20', and division step S30 shown in Figure 6. For example, the chip manufacturing method of the present invention may include a complete curing step S40, which brings the protective film 1b to a fully cured state after the transfer step S20 and before the division step S30, as shown in Figure 9.

[0095] Figure 10 is a schematic side view showing the complete curing step S40. The complete curing step S40 is performed using a curing apparatus 40. The curing apparatus 40 has a table 42 for supporting the workpiece 11. A complete curing unit 44 is provided above this table 42.

[0096] The complete curing unit 44 includes, for example, a heater for heating the space below it, an active energy irradiator for irradiating the space below it with active energy rays such as ultraviolet rays, or a dehumidifier for dehumidifying the space below it. The complete curing unit 44 is also connected to a lifting mechanism 46. The lifting mechanism 46 includes, for example, a ball screw and a motor connected to the ball screw. When the lifting mechanism 46 is operated, the complete curing unit 44 moves up and down.

[0097] When performing the complete curing step S40 in the curing apparatus 40, first, the complete curing unit 44 is raised away from the table 42. Next, the workpiece 11 is brought onto the table 42 so that the partially cured protective film 1b faces upwards. Then, the complete curing unit 44 is lowered so that it approaches the protective film 1b. Next, the complete curing unit 44 is operated so that at least one of heating, active energy ray irradiation, or dehumidification is performed on the protective film 1b. As a result, the protective film 1b becomes fully cured.

[0098] The complete curing step S40 may be carried out using a curing apparatus having a different structure from the curing apparatus 40. For example, the complete curing step S40 may be carried out using a curing apparatus comprising a table capable of supporting the workpiece 11, a chamber for defining the space in which the table is located, and a complete curing unit capable of performing at least one of heating, active energy ray irradiation, or dehumidification on this space.

[0099] In addition, if the protective film 1b contains a heat-foaming agent that foams when heated above a predetermined temperature, the chip manufacturing method of the present invention may include, as shown in Figure 11, a removal step S50 in which, after performing the division step S30, the protective film 1b is removed from each of the multiple chips while foaming by heating the workpiece 11 above a predetermined temperature.

[0100] Figure 12 is a schematic side view showing the removal step S50 being carried out. Note that the directions indicated by arrows U (U direction) and V (V direction) in Figure 12 are mutually orthogonal directions in the horizontal plane, and the direction indicated by arrow W (W direction) is a direction perpendicular to the U direction and V direction, respectively (vertical direction).

[0101] The removal step S50 is carried out using a removal device 50. The removal device 50 has a chuck table 52 for holding a plurality of chips 17, each with a protective film 1b remaining on it, via a support member 15. The chuck table 52 has a structure similar to, for example, the chuck table 22 shown in Figure 5, and is capable of holding a plurality of chips 17 via the support member 15 by applying suction force.

[0102] Furthermore, the chuck table 52 is connected to a U-direction movement mechanism (not shown). The U-direction movement mechanism includes, for example, a ball screw and a motor connected to this ball screw. When the U-direction movement mechanism is operated, the chuck table 52 moves along the U-direction so as to pass under the air curtain 54. The air curtain 54 extends along the V-direction for a length greater than the length of the chuck table 52 in the V-direction and is capable of supplying hot air with a temperature above a predetermined temperature at which the thermal foaming agent contained in the protective film 1b foams, directed diagonally downward.

[0103] When performing the removal step S50 in the removal device 50, first, the chuck table 52 is moved along the U direction so as to move it away from the air curtain 54. Next, multiple chips 17 are brought onto the chuck table 52 so that the protective film 1b faces upward. Then, the multiple chips 17 are held on the chuck table 52 via the support member 15.

[0104] Next, while supplying hot air from the air curtain 54, the chuck table 52 is moved along the U-direction so that the multiple chips 17 pass under the air curtain 54. As a result, the protective film 1b is heated above a predetermined temperature, foams up, and blown off from each chip 17. Consequently, the protective film 1b is removed from each of the multiple chips 17.

[0105] The removal step S50 may be carried out using a removal device having a different structure from the removal device 50. For example, the removal step S50 may be carried out using a removal device that, instead of an air curtain 54, is provided with a heater for foaming the protective film 1b and a blower for blowing off the protective film 1b from each tip 17.

[0106] Furthermore, the chip manufacturing method of the present invention may also be a chip manufacturing method in which the preparation step S10, the transfer step S20', the complete curing step S40, the splitting step S30, and the removal step S50 are carried out in order.

[0107] Furthermore, the structures and methods of the embodiments described above can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0108] 1: Raw material roll (1a: sheet, 1b: protective film, 1c: release paper) 2: Transfer device 4: Coating section (4a: Feed roller, 4b, 4c: Guide rollers) (4d: coating roller, 4e: pressure roller, 4f: tank) 6: Semi-cured section (6a, 6b: guide rollers, 6c: semi-cured unit) 8: Chuck Table 10: Transfer section (10a, 10b: Guide rollers, 10c: Sheet retrieval roller) (10d: Pressure roller) 11: Workpiece (11a: front surface, 11b: back surface, 11c: side surface) 13: Devices 15: Support member 17: Tip 20: Transfer device 22: Chuck Table 24: Supply section (24a: Feed roller, 24b: Guide roller) (24c: Release paper collection roller) 26: Transfer section (26a, 26b: Guide rollers, 26c: Sheet retrieval roller) (26d: Pressure roller) 30: Cutting equipment 32: Chuck Table 34: Cutting unit (34a: Spindle, 34b: Housing) (34c: Cutting blade) 40:Curing equipment 42: Chuck Table 44: Fully cured unit 46: Lifting mechanism 50:Removal device 52: Chuck Table 54: Air Curtain

Claims

1. A protective film transfer base roll is formed by winding a laminate including a sheet and a protective film applied to one side of the sheet, The protective film is in a semi-cured state that allows it to be transferred to the object to be treated; this is a raw material roll for transferring protective films.

2. The protective film transfer raw material roll according to claim 1, wherein the protective film contains a heat-foaming agent that foams when heated to a predetermined temperature or higher.

3. The protective film comprises an active energy ray curable resin or a thermosetting resin, as described in claim 1 or 2, for use as a raw material roll for transferring a protective film.

4. A method for providing a protective film on an object to be processed, Applying a liquid protective film agent to one side of the sheet, To make the protective film agent applied to one side of the sheet a semi-cured protective film, Transferring the protective film from the sheet to the object to be treated, A method for arranging a protective film, comprising the following:

5. The method for arranging a protective film according to claim 4, further comprising bringing the protective film transferred to the object to be treated into a fully cured state.

6. A method for manufacturing chips, which involves dividing a workpiece having multiple devices formed on it along the boundaries of the multiple devices to produce multiple chips, The process involves preparing a protective film transfer roll by winding a laminate comprising a sheet and a semi-cured protective film applied to one side of the sheet, Transferring the protective film from the sheet to the workpiece, Dividing the workpiece into multiple chips by processing the workpiece along the boundary of the multiple devices from the side on which the protective film is provided, A method for manufacturing chips, comprising the following features.

7. A method for manufacturing chips, which involves dividing a workpiece having multiple devices formed on it along the boundaries of the multiple devices to produce multiple chips, Applying a liquid protective film agent to one side of the sheet, To make the protective film agent applied to one side of the sheet a semi-cured protective film, Transferring the protective film from the sheet to the workpiece, Dividing the workpiece into multiple chips by processing the workpiece along the boundary of the multiple devices from the side on which the protective film is provided, A method for manufacturing chips, comprising the following features.

8. The method for manufacturing a chip according to claim 6 or 7, further comprising bringing the protective film transferred to the workpiece to a fully cured state before dividing the workpiece into the plurality of chips.

9. The protective film contains a heat-foaming agent that foams when heated above a predetermined temperature. The method for manufacturing a chip according to claim 6 or 7, further comprising removing the protective film from each of the plurality of chips while causing the protective film remaining on each of the plurality of chips to foam by heating it to a predetermined temperature or higher.

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