Adhesive structure, adhesive method, adhesive unit

JP2026165649APending Publication Date: 2026-10-14JAPAN MARINE UNITED CORPORATION
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
JP2025058138
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-31
Publication Date
2026-10-14

Smart Images

  • Figure 2026165649000001_ABST
    Figure 2026165649000001_ABST
Patent Text Reader

Abstract

This invention provides an adhesive structure that allows for improved work efficiency by controlling the thickness of the adhesive layer of structural adhesives. [Solution] A bonding method for bonding a pad 11 with studs 12 erected on it to a bonding surface B using a structural adhesive 13 on its back surface, wherein the back surface of an elastic portion 14 that protrudes outward from the contour of the pad along the bonding surface is attached to the bonding surface with a temporary fixing adhesive 15 that has a shorter curing time than the structural adhesive, and the structural adhesive is solidified while the pad is biased toward the bonding surface by the elastic portion.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to an adhesive structure, an adhesion method, and an adhesion unit.

Background Art

[0002] Structural adhesives are used in a wide range of fields including vehicles, electrical equipment, ships, architecture and civil engineering, and the aerospace industry. According to JIS (Japanese Industrial Standards) K6800, a "structural adhesive" is defined as "a reliable adhesive that can withstand large loads over a long period of time".

[0003] Attachment using structural adhesives has advantages such as eliminating the influence of welding distortion, so it may be used in structures such as ships and construction industries, floating structures for offshore wind power generation, and the like. As shown in Patent Document 1, the present applicant has used this technique for a long time.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] For attachment using structural adhesives, it takes time until the adherends can be held, and it is necessary to hold the adherends with a jig or the like. In Patent Document 1, the holding problem is solved by applying a structural adhesive and an instantaneous adhesive to the same adhesion surface, but since clamping force is not generated by the instantaneous adhesive alone, there is a problem that it is difficult to control the layer thickness of the structural adhesive and the variation in adhesion quality becomes large. To control the adhesive film thickness, it is conceivable to insert a spacer, but this causes a problem that it reduces the adhesion area and thus contributes to a decrease in strength.

[0006] Furthermore, when using instant adhesive for holding or using tape such as masking tape, there was a problem in that no compressive force was generated after holding with the instant adhesive or tape, making it difficult to control the adhesion of the structural adhesive and resulting in unstable adhesive strength.

[0007] This invention has been made in view of the above circumstances and aims to achieve the following objectives. 1. Enables control of the adhesive layer thickness of structural adhesives. 2. Reduce variations in the adhesive strength of structural adhesives. 3. Suppress the decrease in adhesive strength due to a reduction in the bonding area of ​​structural adhesives. [Means for solving the problem]

[0008] (1) A bonding method according to one aspect of the present invention is: A bonding method in which a pad with studs erected on its surface is bonded to a surface using a structural adhesive on the back surface, The back surface of the elastic portion that protrudes outward from the contour of the pad along the surface to be bonded is attached to the surface to be bonded with a temporary fixing adhesive that has a shorter curing time than the structural adhesive. The structural adhesive is solidified while the pad is biased toward the surface to be bonded by the elastic portion. This resolved the above issues. (2) The bonding method of the present invention is as described in (1) above, After the pad is bonded, the elastic part is separated from the pad. It is possible. (3) The bonding method of the present invention, in the above (1), The surface of the elastic part corresponding to the temporary adhesive on the back surface is pressed with an adhesive jig. It is possible. (4) The bonding method of the present invention is as described in (3) above, The adhesive jig is positioned relative to the stud in its axial direction to adjust the biasing state of the pad. It is possible. (5) Another aspect of the present invention is an adhesive structure that is bonded by any of the bonding methods described in (1) to (4) above, The pad having the studs erected on the surface and the structural adhesive provided on the back surface, The elastic portion of the pad protrudes outward from the surface along the surface to be bonded, and the temporary adhesive is provided on the back surface, It has, The pad is biased toward the surface to be bonded by the elastic portion and is bonded to the surface to be bonded. It is possible. (6) The bonding method of the present invention, in the above (5), The elastic portion is either integrated with the pad or detachable from the pad. It is possible. (7) The bonding method of the present invention, in the above (5), The elastic portion comprises a base portion that protrudes outward from the contour of the pad along the surface to be bonded, An elastic adjustment portion extending from the tip of the base portion along the contour of the pad while being spaced apart from the contour of the pad, Having, It is possible. (8) Another aspect of the present invention is an adhesive unit that is bonded by the bonding method described in (3) or (4) above, The pad having the studs erected on the surface and the structural adhesive provided on the back surface, The elastic portion of the pad protrudes outward from the surface along the contour of the surface to be bonded, and the temporary adhesive is provided on the back surface of the elastic portion that biases the pad toward the surface to be bonded, The adhesive jig presses the surface of the elastic part corresponding to the temporary adhesive, Having, It is possible. (9) The adhesive unit of the present invention is as described in (8) above, The elastic portion is either integrated with the pad or detachable from the pad. It is possible. (10) In the above description, the bonding unit of the present invention the bonding jig includes: a leg portion that abuts against the surface of the elastic portion, and a biasing state adjustment portion that is spaced apart from the surface of the pad and is connectable to the stud, . can be achieved.

[0009] In the configuration described in the above (1), the elastic portion is attached to the bonded surface by the temporary fixing adhesive at a position away from the contour of the pad in a top view. Since the temporary fixing adhesive has a shorter curing time than the structural adhesive, the elastic portion can continuously bias the pad toward the bonded surface until the structural adhesive is solidified. At this time, the structural adhesive is pressed in the film thickness direction between the pad and the bonded surface. Thereby, the structural adhesive can be solidified in a state where the film thickness of the structural adhesive is reduced. Moreover, the structural adhesive can be solidified in a state where the film thickness of the structural adhesive is uniform. Accordingly, it is possible to reduce the bonding thickness of the structural adhesive to increase the adhesive force, and improve the bonding strength between the pad and the bonded surface. Furthermore, it is possible to make the film thickness of the structural adhesive uniform between the pad and the bonded surface, thereby stabilizing the bonding quality.

[0010] Here, since the elastic portion is located at a position spaced apart from the contour of the pad in a top view, the bonding area where the layer of the structural adhesive is formed on the pad can be made equal to the area of the pad contour, and there is no need to reduce the bonding area. Thereby, it is possible to maintain the bonding area between the pad and the bonded surface while enabling temporary fixing by the temporary fixing adhesive. The structural adhesive on the pad can be applied and formed on the back surface.

[0011] Here, in the state before being attached to the adherend surface, the adhesive surface of the pad and the surface of the elastic part on which the temporary fixing adhesive is formed may not be on the same plane. In the state before being attached to the adherend surface, the surface of the elastic part on which the temporary fixing adhesive is formed protrudes in the adhesion direction relative to the adhesive surface of the pad. That is, in the state before being attached to the adherend surface, the surface of the elastic part on which the temporary fixing adhesive is formed can be spaced apart in the direction from the front surface toward the back surface in the thickness direction of the pad, relative to the adhesive surface of the pad. Thereby, when attached to the adherend surface, the pad can be urged toward the adherend surface by the elastic part. Moreover, the state in which the pad is urged can be maintained until the structural adhesive solidifies. The elastic part can maintain a constant urging force on the pad until the structural adhesive solidifies.

[0012] Since the pad is urged toward the adherend surface by the elastic part, the adhesive strength can be improved. Since the pad is urged toward the adherend surface by the elastic part, the thickness of the structural adhesive can be made smaller than the thickness of the temporary fixing adhesive, enabling strong adhesion by the structural adhesive. Furthermore, in the state before being attached to the adherend surface, the adhesive surface of the pad and the surface of the elastic part on which the temporary fixing adhesive is formed are arranged on different surfaces, so that when a double-sided tape is used as the temporary fixing adhesive, it is possible to prevent the structural adhesive from entering the bonding surfaces of the double-sided tape and hindering the bonding of the double-sided tape serving as the temporary fixing adhesive.

[0013] In addition, by temporarily fixing the elastic part with the temporary fixing adhesive and urging the pad by the elastic part, there is no need for a worker to hold the pad by pressing it against the adherend surface until the structural adhesive solidifies. Therefore, the workability of the adhesion method for forming the adhesion structure can be improved. Moreover, compared with the case where a worker holds the pad, the pad and the adherend surface can be stably held until the structural adhesive solidifies, so that the uniformity of the adhesive thickness can be improved.

[0014] Furthermore, by adjusting the distance from the temporary fixing position using temporary adhesive along the elastic part to the pad, it is possible to adjust the biasing force that biases the pad toward the bonding surface. Similarly, by adjusting the elasticity of the elastic part, it is possible to adjust the biasing force that biases the pad toward the bonding surface. Here, adjustments to the elasticity of the elastic part include adjusting the width dimension of the elastic part, adjusting the thickness of the elastic part, and adjusting the Young's modulus by changing the material of the elastic part. This makes it possible to control the thickness of the structural adhesive to achieve high adhesive strength with a thin layer, or to allow deformation with a large adhesive thickness so that the structural adhesive can follow the deformation.

[0015] In the configuration described in (2) above, the elastic part can be separated from the pad, forming a structure in which only the pad and stud remain on the adhesive surface. In this case, the elastic part can be reused for bonding other pads. In addition, the area on which the adhesive structure adheres to the adhesive surface can be reduced. Furthermore, if the elastic part is not separated from the pad, the temporary adhesive applied to the bonding surface of the elastic part can also be used to increase the adhesive strength between the pad and the bonding surface. In this case, the work of separating the elastic part becomes unnecessary, improving work efficiency.

[0016] Alternatively, it is possible to make the elastic part separable from the pad, but to use the adhesive structure without removing it after the pad is bonded. Even in this case, a strong adhesive structure can be provided by bonding the elastic part to the surface with a temporary adhesive, and by maintaining a state in which the pad is biased toward the surface by the elastic part.

[0017] In the configuration described in (3) above, the adhesive strength of the elastic part by the temporary adhesive can be improved by pressing the portion of the elastic part on the back surface where the layer of temporary adhesive is formed with an adhesive jig. Furthermore, by improving the adhesive strength of the temporary adhesive and pressing the elastic part against the surface to be bonded with the adhesive jig, the biasing force is reliably applied to the pad in the elastic part that biases the pad, and the balance of the biasing force on the pad is improved, making it possible to control the thickness of the structural adhesive more precisely. The adhesive jig is separated from the bonded structure and removed after the structural adhesive has hardened. In other words, the adhesive jig is only in contact with the elastic part and is not actually bonded to it.

[0018] In the configuration described in (4) above, by setting the position of the adhesive jig in the direction of the studs protruding from the surface of the pad in the thickness direction of the pad, it becomes possible to set the relative positions of the adhesive surface of the pad and the surface on which the temporary fixing adhesive of the elastic part is formed, which were on different sides in that direction before being attached to the surface to be bonded. This makes it possible to control the magnitude of the biasing force on the pad by the elastic part when it is attached to the surface to be bonded. Therefore, it becomes possible to control the sum of the forces applied to the pad until the structural adhesive hardens, and to set the thickness of the hardened structural adhesive, i.e., the adhesive pressure, to a predetermined value. By controlling the thickness of the adhesive layer, the quality of the adhesive layer can be standardized.

[0019] There is no need to insert foreign materials such as intermediary materials to control the thickness of the adhesive layer. This allows for easy control of increasing or decreasing the thickness of the adhesive layer while eliminating the influence of foreign materials on the adhesive strength. Furthermore, it prevents a reduction in the surface area of ​​the adhesive bond due to foreign materials such as intermediary materials, thus avoiding a decrease in strength.

[0020] The adhesive jig can be easily separated from the stud after the structural adhesive has hardened. The adhesive jig can be connected and secured to the threaded stud, like a bolt, using a corresponding nut. This makes it easy to set the relative position between the adhesive surface of the pad and the surface on which the temporary adhesive for the elastic part has been applied.

[0021] In the configuration described in (5) above, before bonding, the elastic part is curved back relative to the pad, and the surface of the structural adhesive on the pad and the surface of the temporary fixing adhesive on the elastic part, which were in different positions, are positioned on the same plane when the pad is pressed by the elastic part and bonded. Because the elastic part is bonded before the pad, a biasing force is generated on the pad. This biasing force acts at a constant rate until the structural adhesive hardens, causing a compressive force to act on the structural adhesive, thinning the adhesive layer and stabilizing the adhesive strength. As a result, it becomes easy to control the thickness of the adhesive layer, which was previously difficult without a worker holding it, and the adhesive layer thickness and adhesive strength can be controlled to a predetermined state, thereby stabilizing the quality of strength and bonding.

[0022] The back of the pad and the surface to be bonded are approximately parallel. The pad and stud are made of metal. The stud may have threads. The structural adhesive is either thicker or thinner than the temporary adhesive. The bonded structure can be used to fix tanks and motors onto a deck, or to fix wiring shelves, control panels, wiring fixtures, etc., to a wall.

[0023] In the configuration described in (6) above, the elastic part can be removed from the pad. The elastic part may be continuous, surrounding the stud like a washer. In this case, the elastic part may be removed from the pad after the structural adhesive has hardened. The elastic part may cover the entire surface of the pad. In this case, the elastic part can be used to increase the adhesive strength of the adhesive structure without being removed from the pad. When other objects are fixed to the stud with nuts or the like after bonding, the contact area between the other object and the pad or the elastic part covering the entire surface of the pad can be increased, and they can be brought into contact on the same plane. This prevents rattling between the other object and the pad.

[0024] Furthermore, the elastic portion can be reused to bond other pads. The elastic portion can have a small surface area and width relative to the pad surface. In this case, the weight of the elastic portion can be reduced, and storage space for the removed elastic portion can be saved. In this case, the weight of the elastic portion can also be reduced by forming it from resin or the like. The pad and the elastic part can be integrated. In this case, the elastic part can be attached to the peripheral edge of the pad surface by welding or other means. In this case, it is not necessary to remove the elastic part from the pad after the structural adhesive has hardened. By omitting the assembly process of the elastic part to the pad, work efficiency can be improved.

[0025] In the configuration described in (7) above, since the elastic adjustment part is bent relative to the base, the overall area required when bonding the pad can be reduced. At the same time, the biasing force of the elastic part can be appropriately reduced, allowing the thickness of the structural adhesive pressed by the elastic part to be set to a suitable thickness. Furthermore, by simply forming a layer of structural adhesive on the pad and a layer of temporary adhesive on the elastic part, the work process can be carried out by placing it in a predetermined position on the surface to be bonded and applying initial pressure. As a result, the controllability of the work process when bonding adhesive structures can be improved, the work time can be shortened, and the difficulty of the process can be reduced.

[0026] Furthermore, the overall area required for bonding the pad can be made compact, while simultaneously increasing the distance from the pad in the elastic section to the point where it is fixed to the bonded surface by the temporary adhesive, thereby adjusting the required biasing force. The elastic section can be adjusted by narrowing its width, such as by making it rectangular or cut out. The biasing force of the elastic section can be adjusted by making the plate thickness thinner or by forming it with a material that has a low Young's modulus and elastic modulus.

[0027] In the configuration described in (8) above, the bonding unit allows for controllable bonding layer thickness, thereby facilitating the bonding process. By adjusting the position of the bonding jig relative to the stud, the positions of the structural adhesive surface of the pad and the temporary adhesive surface of the elastic part are set in the pad thickness direction. A layer of structural adhesive is formed on the pad, a layer of temporary adhesive is formed on the elastic part, and then the bonding process can be performed simply by placing the bonding unit at a predetermined position on the surface to be bonded and applying pressure only initially.

[0028] In the configuration described in (9) above, the elastic part integrated with the pad eliminates the need to remove the elastic part. The elastic part that can be separated from the pad can be removed and reused, or it can be left in place. The bonding jig is reusable.

[0029] In the configuration described in (10) above, the bonding jig can be adjusted prior to the bonding work, in the axial direction of the stud parallel to the thickness direction of the pad, to the position of the tip of the leg that contacts the elastic part and the position of the biasing state adjustment part that can be connected to the stud without contacting the pad. This adjustment is a biasing state adjustment process that adjusts the biasing force applied to the pad by the elastic part. After the biasing state adjustment process is completed, a layer of structural adhesive is formed on the pad, and a layer of temporary adhesive is formed on the elastic part, thereby reducing the number of steps in the bonding process and improving work efficiency. At the same time, the biasing force at which the elastic part presses against the structural adhesive is predetermined by the biasing state adjustment process, and the thickness of the structural adhesive can be formed to be within a predetermined range.

[0030] As part of the biasing state adjustment process, by simply setting the fastening position of the biasing state adjustment part, which is a nut, on the threaded stud, the positions of the tip of the leg that abuts the elastic part and the biasing state adjustment part that can be connected to the stud without contacting the pad can be easily set in the axial direction of the stud. This makes it possible to shorten on-site bonding work while achieving a predetermined bonding strength by pre-setting the adhesive layer thickness.

[0031] Furthermore, the position where the leg portion contacts the surface of the elastic portion does not need to coincide with the area where the temporary adhesive is formed on the back surface of the elastic portion, as long as the elastic portion can be pressed until the temporary adhesive adheres and solidifies on the non-adhered surface. Also, the position where the leg portion contacts the surface of the elastic portion is not particularly limited, as long as the position of the surface of the structural adhesive on the pad and the surface of the temporary adhesive on the elastic portion in the pad thickness direction can be set while the structural adhesive is solidifying.

[0032] Furthermore, the fastening position of the biasing adjustment part, which is a nut, can be reset or changed while the structural adhesive is still curing. This makes it easy to adjust the thickness of the structural adhesive. This makes it easy to manufacture adhesive structures that can be deformed to relieve the load on the pad or stud by increasing the adhesive thickness, or adhesive structures that are firmly bonded by increasing the adhesive strength by decreasing the adhesive thickness. [Effects of the Invention]

[0033] According to the present invention, it is possible to easily realize an adhesive structure that allows control of the adhesive layer thickness of structural adhesives, reduces variations in the adhesive strength of structural adhesives, and suppresses the decrease in adhesive strength due to a reduction in the adhesive area of ​​structural adhesives. [Brief explanation of the drawing]

[0034] [Figure 1] This is a schematic side view showing a first embodiment of the adhesive structure and adhesive method according to the present invention. [Figure 2]This is a schematic top view showing a first embodiment of the adhesive structure according to the present invention. [Figure 3] This is a schematic side view showing the bonding method according to the present invention and a first embodiment of the bonding method. [Figure 4] This is a schematic top view showing another example of the first embodiment of the adhesive structure according to the present invention. [Figure 5] This is a schematic top view showing another example of the first embodiment of the adhesive structure according to the present invention. [Figure 6] This is a schematic top view showing another example of the first embodiment of the adhesive structure according to the present invention. [Figure 7] This is a schematic top view showing another example of the first embodiment of the adhesive structure according to the present invention. [Figure 8] This is a schematic top view showing another example of the first embodiment of the adhesive structure according to the present invention. [Figure 9] This is a schematic top view showing another example of the first embodiment of the adhesive structure according to the present invention. [Figure 10] This is a schematic top view showing another example of the first embodiment of the adhesive structure according to the present invention. [Figure 11] This is a schematic top view showing another example of the first embodiment of the adhesive structure according to the present invention. [Figure 12] This is a schematic side view showing a second embodiment of the adhesive structure and adhesive method according to the present invention. [Figure 13] This is a schematic top view showing a second embodiment of the adhesive structure according to the present invention. [Figure 14] This is a schematic top view showing another example of a second embodiment of the adhesive structure according to the present invention. [Figure 15] This is a schematic top view showing another example of a second embodiment of the adhesive structure according to the present invention. [Figure 16] This is a schematic top view showing another example of a second embodiment of the adhesive structure according to the present invention. [Figure 17] This is a schematic side view showing a third embodiment of the adhesive structure and adhesive method according to the present invention. [Figure 18] This is a schematic top view showing a third embodiment of the adhesive structure according to the present invention. [Figure 19]This is a schematic top view showing another example of a third embodiment of the adhesive structure according to the present invention. [Figure 20] This is a schematic side view showing a fourth embodiment of the adhesive structure, adhesive jig, and adhesive method according to the present invention. [Figure 21] This is a schematic side view showing a fifth embodiment of the adhesive unit and adhesive method according to the present invention. [Figure 22] This is a schematic side view showing a fifth embodiment of the adhesive unit and adhesive method according to the present invention. [Modes for carrying out the invention]

[0035] Hereinafter, a first embodiment of the adhesive structure and adhesive method according to the present invention will be described with reference to the drawings. Figure 1 is a schematic side view showing the adhesive structure and adhesive method in this embodiment. Figure 2 is a schematic top view showing the adhesive structure in this embodiment. In the figures, reference numeral 10 denotes the adhesive structure. In the following figures, the directions indicated by XYZ represent three mutually orthogonal directions. The dimensions, materials, and other specific numerical values ​​shown in this embodiment are merely illustrative examples to facilitate understanding of the invention and do not limit the present invention unless otherwise specified. Furthermore, elements not directly related to the description may be omitted from the illustrations in this specification.

[0036] As shown in Figures 1 and 2, the adhesive structure 10 according to this embodiment is bonded to the part to be bonded (adhesive surface) B, and can be used to fix and attach objects such as tanks, motors, wiring shelves, control panels, and wiring fixtures to the part to be bonded (adhesive surface) B. The objects to which the adhesive structure 10 is attached include, but are not limited to, outfitting items such as receptacles, lighting fixtures, wire supports, and equipment mounting bases. Furthermore, the part to be bonded (adhered surface) B is an exposed surface that forms a flat surface, such as the floor, wall, or ceiling of a ship. The part to be bonded B may also be the frame of an offshore wind power generation mechanism or a land-based building. The adhesive surface B extends along the XY plane.

[0037] The adhesive structure 10 comprises a pad 11, a stud 12, an elastic part 14, a structural adhesive 13, and a temporary fixing adhesive 15. In the adhesive structure 10, the back surface 11b of the pad 11 is bonded to the part to be bonded B. When the pad 11 is bonded, the stud 12 is erected from the part to be bonded B. With the pad 11 bonded, the stud 12 protrudes in a direction intersecting the bonded surface B.

[0038] The pad 11 and the stud 12 can both be made of metal. The pad 11 and the stud 12 can be formed as a single unit. The pad 11 and the stud 12 may be formed separately and then connected to each other. The stud 12 is erected on the surface 11a of the pad 11. The axial directions of the surface 11a of the pad 11 and the stud 12 intersect. The axial directions of the surface 11a of the pad 11 and the stud 12 may be perpendicular. The contour shape of the pad 11 when viewed from above is set as appropriate. The contour shape of the pad 11 when viewed from above can be set as appropriate according to the mounting condition of the object to be attached. The contour area of ​​the pad 11 when viewed from above can be set as appropriate according to mounting conditions such as the weight of the object to be attached.

[0039] The stud 12 is columnar. The stud 12 is cylindrical. The stud 12 has an axis that is approximately straight. The stud 12 has an axis that is aligned with the Z direction. The stud 12 may also be columnar with a curved axis. The shape of the stud 12 can be appropriately set according to the mounting condition of the object to be attached. The stud 12 is erected at approximately the center of the surface 11a of the pad 11. One stud 12 is erected on the surface 11a of the pad 11. Multiple studs 12 may be erected on the surface 11a of the pad 11.

[0040] The diameter of the stud 12, when viewed from above, is smaller than the contour of the pad 11. The diameter of the stud 12 is nearly uniform in the axial direction. The diameter of the stud 12 can also vary in proportion to the distance from the pad. Threads may be formed on the outer surface of the stud 12. The stud 12 may be formed in the shape of a bolt. A corresponding nut can be screwed onto the bolt-shaped stud 12 to attach the object to be attached to the part to be bonded B. The stud 12 may not have threads formed on it. The stud 12 may have a portion with threads formed in the axial direction and a portion without threads.

[0041] The structural adhesive 13 is formed on the back surface 11b of the pad 11. The structural adhesive 13 is formed in layers along the back surface 11b of the pad 11. The structural adhesive 13 is formed over the entire back surface 11b of the pad 11. The structural adhesive 13 may also be applied to the back surface 11b of the pad 11. The structural adhesive 13 is, for example, a second-generation acrylic structural adhesive suitable for bonding metals. The structural adhesive 13 can be appropriately selected depending on the materials of the bonding structure 10 and the bonding surface B. Furthermore, if the bonding structure 10 is a ship fitting, it is preferable that the structural adhesive 13 is a room-temperature curing type.

[0042] Since the structural adhesive 13 is a component that holds the bonded structure 10 after curing, it must have a strength sufficient to support at least the weight of the bonded structure 10. Therefore, the application area of ​​the structural adhesive 13 is calculated based on the weight of the bonded structure 10. Furthermore, the adhesive strength of the structural adhesive 13 is calculated based on the weight of the bonded structure 10 and the object to be attached, or the load applied to the bonded structure 10.

[0043] The temporary adhesive 15 is, for example, an instant adhesive mainly composed of cyanoacrylate. The temporary adhesive 15 is formed on the back surface of the elastic part 14, as will be described later. The temporary adhesive 15 is formed on a portion of the back surface of the elastic part 14. The temporary adhesive 15 can be appropriately selected depending on the materials of the elastic part 14 and the surface B to be bonded. The temporary adhesive 15 may also be double-sided tape depending on the materials of the elastic part 14 and the surface B to be bonded.

[0044] The temporary adhesive 15 only needs to have sufficient strength to hold the bonded structure 10 in place so that it does not displace until the structural adhesive 13 hardens. The temporary adhesive 15 does not need to be as strong as the structural adhesive 13 can hold the bonded structure 10. The temporary adhesive 15 needs to have a shorter curing time than the structural adhesive 13. This also applies when the temporary adhesive 15 is double-sided tape.

[0045] The elastic portion 14 has its back surface in contact with the surface 11a of the pad 11. The elastic portion 14 extends along the surface 11a of the pad 11. The elastic portion 14 protrudes outward from the contour of the pad 11 along the surface 11a of the pad 11. Two elastic portions 14 are formed so as to protrude in opposite directions in the X direction relative to the contour of the pad 11. The elastic portion 14 is a plate. The thickness of the elastic portion 14 is less than the thickness of the pad 11. The elastic portion 14 is almost flat. When the pad 11 is placed on the surface to be bonded B, the elastic portion 14 is spaced apart from the surface to be bonded B in the Z direction.

[0046] The elastic portion 14 may bend in the Z direction from which the stud 12 protrudes as it moves outward from the contour of the pad 11. The elastic portion 14 is not limited to this shape as long as it is shaped to allow the pad 11 to be pressed against the surface B when the temporary adhesive 15 is bonded to the surface B, as will be described later. The elastic portion 14 is formed from an elastic material. The elastic portion 14 can be made of metal, like the pad 11 and the stud 12. Alternatively, the elastic portion 14 can be made of resin. The elastic portion 14 has a base portion 14a, an elastic adjustment portion 14b, and a connecting portion 14c.

[0047] The base portion 14a protrudes outward from the contour of the pad 11. The elastic adjustment portion 14b is connected to the tip of the base portion 14a. The elastic adjustment portion 14b is connected to the end of the base portion 14a that is spaced apart from the contour of the pad 11.

[0048] The elastic adjustment portion 14b is formed along the contour of the pad 11 when viewed from above. The elastic adjustment portion 14b is spaced apart from the contour of the pad 11. The length of the elastic adjustment portion 14b extending from the base portion 14a is smaller than the contour diameter dimension of the pad 11 when viewed from above. The width dimension of the elastic adjustment portion 14b is set to be smaller than that of the base portion 14a. Here, the width dimension of the elastic adjustment portion 14b refers to the dimension in a direction intersecting the direction in which the elastic adjustment portion 14b extends from the base portion 14a.

[0049] The elastic adjustment portion 14b is formed by applying temporary adhesive 15 to the tip that is furthest from the base portion 14a. Before bonding, the back surface of the elastic adjustment portion 14b is in the same Z-direction position as the surface 11a of the pad 11. Before bonding, the back surface of the elastic adjustment portion 14b is flush with the surface 11a of the pad 11.

[0050] In contrast, when the temporary adhesive 15 is bonded to the surface B, the elastic adjustment part 14b moves closer to the surface B in the Z direction, corresponding to the thickness of the pad 11. When the temporary adhesive 15 is bonded to the non-bonding surface B, the elastic adjustment part 14b is in the same Z-direction position as the back surface 11b of the pad 11. In other words, the application position of the temporary adhesive 15 on the elastic adjustment part 14b is closer to the surface B than the base part 14a. The elastic adjustment part 14b is inclined so as to move away from the surface B from the tip where the temporary adhesive 15 is applied towards the base part 14a. This inclination of the elastic adjustment part 14b allows the elastic part 14 to bias the pad 11 toward the surface B.

[0051] The connecting portion 14c contacts the surface 11a of the pad 11. The connecting portion 14c contacts the area near the center of the contour of the surface 11a of the pad 11 when viewed from above. The area of ​​the connecting portion 14c when viewed from above is smaller than the surface 11a of the pad 11. The connecting portion 14c has a through hole near its center through which the stud 12 passes. The area near its center of the connecting portion 14c is where the stud 12 connects to the pad 11. The connecting portion 14c surrounds the stud 12 when viewed from above. The stud 12 may be used as an elastic member corresponding to a washer around the stud 12. In this case, a notch may be formed extending radially outward from the through hole of the stud 12.

[0052] The connecting portion 14c covers the entire length of the contour of the pad 11 in the radial direction when viewed from above. In other words, the extending ends of the connecting portion 14c extend so as to connect the contour lines of the pad 11 when viewed from above. The connecting portion 14c connects the contour of the pad 11 in the radial direction along a straight line passing through the center of the pad 11.

[0053] Base portions 14a are connected to both ends of the connecting portion 14c. The connecting portion 14c connects the two base portions 14a that protrude outward from the contour of the pad 11. The width dimension of the connecting portion 14c is approximately equal to its entire length, except around the stud 12. Here, the width dimension of the connecting portion 14c is the dimension that intersects with the direction connecting the two base portions 14a. In other words, the width dimension of the connecting portion 14c is the length in the direction that intersects with the diameter dimension connecting the contours of the pad 11.

[0054] The elastic portion 14 has two base portions 14a at both ends of the connecting portion 14c, and elastic adjustment portions 14b connected to each base portion 14a. The base portion 14a, the elastic adjustment portion 14b, and the connecting portion 14c are formed as a single unit. The base portion 14a, the elastic adjustment portion 14b, and the connecting portion 14c are a single plate. The base portion 14a, the elastic adjustment portion 14b, and the connecting portion 14c are all formed to have equal thickness. However, the thickness of the base portion 14a, the elastic adjustment portion 14b, and the connecting portion 14c may not be uniform. In particular, it is preferable to set the thickness of the elastic adjustment portion 14b in order to control the biasing force.

[0055] In this embodiment, the contour of the pad 11 is a rectangle with rounded corners. Furthermore, the connecting portion 14c of the elastic portion 14 is formed to mimic the diagonal of the rectangular contour of the pad 11, running from the upper left to the lower right in Figure 2. As a result, when the elastic portion 14 biases the pad 11, the entire surface of the pad 11 is biased toward the surface to be bonded B.

[0056] One elastic portion 14 is located below the right side of the rectangular pad 11 contour shape. The elastic adjustment portion 14b of the one elastic portion 14 extends upward from the lower right side along the rectangular pad 11 contour shape. The other elastic portion 14 is located above the left side of the rectangular pad 11 contour shape. The elastic adjustment portion 14b of the other elastic portion 14 extends downward from the upper left side along the rectangular pad 11 contour shape. The two elastic parts 14 have a shape that is point-symmetrical with respect to the center of the pad 11 when viewed from above.

[0057] This arrangement is just one example; the elastic part 14 can have other shapes as long as it is possible to generate the necessary biasing force on the pad 11. The elastic part 14 is not connected to the pad 11. The stud 12 is simply inserted into the through hole of the connecting part 14c.

[0058] Next, the connection method in this embodiment will be described.

[0059] Figure 3 is a schematic side view showing the connection method in this embodiment. In this embodiment, the connection method first involves assembling the elastic part 14 to the pad 11 as an assembly step, as shown in Figure 1. At this time, the stud 12 is inserted into the through hole of the connecting part 14c, and the back surface of the connecting part 14c is brought into contact with the surface 11a of the pad 11. At this time, the elastic part 14 and the pad 11 are not glued or otherwise attached, but are only assembled together.

[0060] Next, in the adhesive application process, structural adhesive 13 is applied to the entire surface of the back surface 11b of the pad 11, and temporary adhesive 15 is applied to the tip position of the back surface of the elastic part 14. At this time, the structural adhesive 13 is applied to the entire surface of the back surface 11b of the pad 11. The temporary adhesive 15 is applied only to the tip position of the back surface of the elastic adjustment part 14b. By setting the application area of ​​the temporary adhesive 15, the length from the tip to the base 14a of the elastic adjustment part 14b is set. This sets the inclination angle from the tip to the base 14a of the elastic adjustment part 14b within a predetermined range, thereby setting the biasing force of the elastic part 14.

[0061] Next, the adhesive structure 10 is brought into contact with a predetermined position on the surface B to be bonded. At this time, the pad 11 and the surface B to be bonded are made parallel, and the entire surface of the structural adhesive 13 is brought into contact with the surface B to be bonded. In this state, the elastic adjustment part 14b is parallel to the non-bonded surface B. Also, the temporary fixing adhesive 15 is spaced apart from the surface B to be bonded in the Z direction.

[0062] Furthermore, as a biasing force generation step, as shown in Figure 3, the tip of the elastic adjustment part 14b is pressed to bring the temporary adhesive 15 into contact with the surface to be bonded B. In this state, the tip of the elastic adjustment part 14b is pressed laterally to maintain the state in which the temporary adhesive 15 is in contact with the surface to be bonded B. The elastic adjustment part 14b is kept in an inclined state such that the distance from the surface to be bonded B increases from the tip towards the base 14a. This pressing state is maintained until the temporary adhesive 15 has finished solidifying.

[0063] Once the temporary adhesive 15 has solidified, as shown in Figure 3, the tip of the elastic adjustment part 14b is bonded to the surface to be bonded B, and the elastic adjustment part 14b tilts from its tip toward the base 14a so that the distance from the surface to be bonded B increases. As a result, a biasing force is generated in the elastic part 14 that biases the pad 11 toward the surface to be bonded B. Once the temporary adhesive 15 has solidified, the bonded structure 10 is temporarily fixed to the surface to be bonded B. The biasing force generation process is the temporary fixing process.

[0064] Next, in the pressing and solidification process, the pad 11, which is biased toward the bonding surface B by the biasing force of the elastic part 14, presses against the structural adhesive 13. The entire surface of the structural adhesive 13 is pressed uniformly. As a result, the thickness of the structural adhesive 13 sandwiched between the bonding surface B and the back surface 11b of the pad 11 decreases. The thickness of the structural adhesive 13 decreases uniformly across the entire surface. The biasing force of the pad 11 in the pressing and solidification process is maintained until the solidification of the structural adhesive 13 is complete.

[0065] The press-solidification process needs to be maintained until the structural adhesive 13 has solidified completely. However, since the elastic part 14 is attached to the bonding surface B by the temporary fixing adhesive 15, this press-solidification process can be easily sustained even without the worker pressing the tip of the elastic adjustment part 14b. Therefore, the worker can perform other tasks. The pressing and solidification process ends when the structural adhesive 13 has solidified.

[0066] If the elastic part 14 is to be used as an adhesive structure 10 without being removed, the bonding process is now complete. Furthermore, if necessary, the object to be attached is attached to the stud 12.

[0067] When removing the elastic part 14 for use, a light impact is applied to the tip of the elastic adjustment part 14b to peel the temporary adhesive 15 from the bonding surface B. Furthermore, the elastic part 14 is moved in the Z direction from the pad 11 to remove the stud 12 from the through hole in the connecting part 14c. This removes the elastic part 14 and completes the bonding process. If necessary, the object to be attached is then attached to the stud 12. The elastic portion 14 can be reused to bond other pads 11 to the bonding surface B.

[0068] In this embodiment, the structural adhesive 13 can be solidified while the pad 11 is biased by the elastic portion 14, which is temporarily fixed at an angle. This eliminates the need for a worker to be attached to the surface, improving work efficiency. Furthermore, the entire surface of the structural adhesive 13 can be uniformly thinned. This increases the adhesive strength of the structural adhesive 13, thereby improving the adhesive strength. When viewed from above, the elastic adjustment portion 14b is formed along the contour of the pad 11, so that the area required for bonding the adhesive structure 10 does not become too large. In the biasing force generation process, which is a temporary fixing process, the biasing force on the pad 11 can be controlled by adjusting the inclination angle of the elastic adjustment part 14b, thereby controlling the film thickness of the structural adhesive 13 after solidification.

[0069] In this embodiment, the pad 11 is given the shape of a rectangle with rounded corners, and elastic portions 14 are formed in two places, and it is temporarily fixed with temporary fixing adhesive 15 at these two places. However, other shapes are also possible.

[0070] Figures 4 to 12 are schematic top views showing modified examples of the connection structure in this embodiment. In this embodiment, as shown in Figure 4, the two elastic parts 14 each have one base 14a, and furthermore, two elastic adjustment parts 14b are connected to one base 14a. The left and right elastic parts 14 are both located in the middle of the vertical side of the rectangular pad 11 contour shape. The connecting part 14c is oriented in the X direction. The length of the elastic adjustment part 14b that sets the biasing force is shorter than that of the configuration shown in Figure 2. In addition, two temporary fixing adhesives 15 are provided for one base 14a. In other words, the adhesive structure 10 can be temporarily fixed by four temporary fixing adhesives 15.

[0071] Therefore, in the configuration shown in Figure 4, if the plate thickness of the elastic part 14 is the same, the biasing force will be greater than in the configuration shown in Figure 2. To make the biasing force of the elastic part 14 about the same as in the configuration shown in Figure 2, methods such as reducing the plate thickness of the elastic adjustment part 14b, reducing the width dimension of the elastic adjustment part 14b, or shifting the temporary fixing adhesive 15 further to the tip of the elastic adjustment part 14b can be employed.

[0072] In this embodiment, as shown in Figure 5, the contour of the pad 11 can also be circular. In this example, the shape of the elastic portion 14 is the same as in the example shown in Figure 5, and has four temporary adhesives 15.

[0073] In this embodiment, as shown in Figure 6, the contour of the pad 11 can also be circular. In this example, the shape of the elastic portion 14 is the same as in the example shown in Figure 2, and has two temporary adhesives 15.

[0074] In this embodiment, as shown in Figure 7, the contour of the pad 11 can also be circular. In this example, the shape of the elastic part 14 is the same as in the examples shown in Figures 2 and 6, having two temporary adhesives 15. However, in this example, the elastic part from the base 14a to the elastic adjustment part 14b is formed in a straight line. When there are no other structures around where the adhesive structure 10 is to be bonded, or when there are no steps or other irregularities around the surface B to be bonded, such a straight type elastic part 14 can also be used. The straight type elastic part 14 makes it easy to continue reusing the pad 11 regardless of its size, even when performing multi-stage work in which pads 11 with contours of different diameters are bonded in sequence.

[0075] In this embodiment, as shown in Figure 8, the elastic portion 14 has a connecting portion 14c with a contour substantially the same as that of the pad 11, and also has four temporary fixing adhesives 15, similar to the example shown in Figure 4. In this example, the connecting portion 14c covers the entire surface 11a of the pad 11. In this example, the connecting portion 14c is in contact with the entire surface 11a of the pad 11. As a result, when the object to be attached is attached to the pad 11, the entire surface of the connecting portion 14c is in contact with the entire surface of the pad 11, and the object to be attached is in contact with the entire surface of the connecting portion 14c, so that the frictional force between them is not reduced. In this example, the object to be attached is installed without removing the elastic part 14.

[0076] In this embodiment, as shown in Figure 9, the elastic portion 14 has a connecting portion 14c with a contour substantially the same as that of the pad 11, and also has two temporary fixing adhesives 15, similar to the example shown in Figure 2.

[0077] In this embodiment, as shown in Figure 10, the pad 11 has a circular contour, and the elastic portion 14 has a connecting portion 14c with a contour substantially the same as that of the pad 11, and, similar to the example shown in Figure 4, it has four temporary fixing adhesives 15.

[0078] In this embodiment, as shown in Figure 11, the pad 11 has a circular contour, and the elastic portion 14 has a connecting portion 14c with a contour substantially the same as that of the pad 11, and, similar to the example shown in Figure 2, it has two temporary fixing adhesives 15.

[0079] Each of these modified examples can achieve the same effects as the embodiments described above.

[0080] A second embodiment of the adhesive structure according to the present invention will be described below with reference to the drawings. Figure 12 is a schematic side view showing the adhesive structure in this embodiment. Figure 13 is a schematic top view showing the adhesive structure in this embodiment. In this embodiment, the difference from the first embodiment described above is in the elastic part, and other components corresponding to the first embodiment described above are denoted by the same reference numerals and their descriptions are omitted.

[0081] In this embodiment, as shown in Figures 12 and 13, the adhesive structure 10 has an elastic portion 14 connected to the pad 11 and does not separate even after the structural adhesive 13 has solidified. The elastic portion 14 may also be welded to the pad 11. The elastic portion 14 has a connecting portion 14e that connects to the surface 11a of the pad 11. The shape of the base portion 14a and the elastic adjustment portion 14b of the elastic portion 14, as viewed from above, is the same as in the first embodiment described above. In this embodiment, the connecting portion 14e is connected to the edge of the pad 11. The connecting portion 14e does not extend to a position close to the stud 12 in the X direction. The connecting portion 14e does not come into contact with the stud 12.

[0082] In this embodiment, the adhesive structure 10 can be used or the object to be attached can be fixed in place immediately after the structural adhesive 13 has solidified. Since there is no need to remove the elastic part 14, work efficiency can be improved.

[0083] In this embodiment, the same effects as those of the above-described embodiment can be achieved.

[0084] Figures 14 to 16 are schematic top views showing modified examples of the connection structure in this embodiment. In this embodiment, as shown in Figure 14, there are four temporary adhesives 15, similar to the example shown in Figure 4. As shown in Figure 15, the pad 11 contour can be circular, and there are four temporary adhesives 15. Furthermore, as shown in Figure 16, the pad 11 contour can be circular, and there are two temporary adhesives 15, similar to the example shown in Figure 2.

[0085] Each modified example can achieve the same effects as the embodiments described above.

[0086] A third embodiment of the adhesive structure according to the present invention will be described below with reference to the drawings. Figure 17 is a schematic side view showing the adhesive structure in this embodiment. Figure 18 is a schematic top view showing the adhesive structure in this embodiment. In this embodiment, the difference from the first and second embodiments described above is in the elastic part, and other components corresponding to the first and second embodiments described above are denoted by the same reference numerals and their descriptions are omitted.

[0087] In this embodiment, as shown in Figures 17 and 18, the elastic portion 14 and the pad 11 are integrated into a single unit. In other words, a single plate material serves as both the elastic portion 14 and the pad 11. Furthermore, the portion corresponding to the elastic portion 14 is spaced further away from the adhesive surface B in the Z direction than the pad 11. The portion corresponding to the elastic portion 14 may be curved in the Z direction in which the stud 12 protrudes as it moves outward from the contour of the pad 11.

[0088] Furthermore, a recess 14f is formed at the boundary between the elastic portion 14 and the pad 11. The recess 14f is formed along a straight line in the Y direction. Both ends of the recess 14f in the Y direction reach the contour of the pad 11. The recess 14f along the Y direction forms the contour of the pad 11, and the recess 14f itself is formed to reduce the plate thickness of the elastic portion 14. In other words, the recess 14f adjusts the magnitude of the biasing force of the elastic portion 14 so that the clamping force pressing the pad 11 does not become too large.

[0089] In this embodiment, the elastic portion 14 and the pad 11 are formed from a single rectangular plate. The temporary fixing adhesive 15 is applied to the four corners of this rectangular plate. The temporary fixing adhesive 15 is formed on the elastic adjustment portion 14g. The elastic adjustment portion 14g can also be described as corresponding to the elastic adjustment portion 14b connected to the contour of the pad 11 in the first embodiment.

[0090] In this embodiment, the elastic adjustment portion 14g before bonding is folded inward from the recess 14f and is spaced apart from the bonding surface B in the Z direction relative to the pad 11. The elastic adjustment portion 14g after bonding may be slightly bent from the recess 14f, but it is flush with the pad 11, that is, spaced apart from the bonding surface B by the same distance as the pad 11 in the Z direction. By setting the depth dimension of the recess 14f, a biasing force within a predetermined range can be applied to the pad 11 due to the change in angle of the elastic adjustment part 14g before and after bonding.

[0091] In this embodiment, the same effects as those of the above-described embodiment can be achieved. Furthermore, in this embodiment, since the elastic part 14 and the pad 11 are integrated, there is no need to assemble and disassemble the elastic part 14, which reduces working time and improves work efficiency. In addition, the number of parts can be reduced.

[0092] Figure 19 is a schematic top view showing a modified example of the connection structure in this embodiment. In this embodiment, the recess 14f can be formed to be deeper and have other portions. Furthermore, the recess 14f can be deeper than the thickness of the pad 11, that is, notches 14h can be formed along the recess 14f at both ends in the Y direction of the recess 14f. This allows both the width and thickness dimensions of the elastic part 14 to be reduced, thereby reducing the biasing force of the elastic part 14.

[0093] In this modified example, the same effects as those of the above-described embodiment can be achieved.

[0094] A fourth embodiment of the adhesive structure according to the present invention will be described below with reference to the drawings. Figure 20 is a schematic side view showing the adhesive structure in this embodiment. The only difference in this embodiment from the first to third embodiments described above is the adhesive jig; other components corresponding to the first to third embodiments described above are denoted by the same reference numerals and their descriptions are omitted.

[0095] In this embodiment, the adhesive structure 10 is bonded to the surface B to be bonded using the adhesive jig 20. As shown in Figure 20, the bonding jig 20 has a leg portion 21 and a bridge portion 22.

[0096] The tip of each leg portion 21 abuts against the elastic portion 14, pressing against the temporary adhesive 15 on the elastic portion 14. The base end of each leg portion 21 is connected to the bridge portion 22. The number of legs 21 connected to the bridge portion 22 is set to correspond to the number of temporary adhesive 15 particles formed on the elastic portion 14. The tip of each leg portion 21 only needs to be able to press against the temporary adhesive 15 together with the elastic portion 14, and there are no restrictions on its contour, such as having the same contour shape as the area where the temporary adhesive 15 is formed. The tips of multiple leg portions 21 must coincide with the same plane parallel to the surface B to be bonded. The lengths of the legs 21 in the Z direction are all equal. With the tips of the legs 21 in contact with the elastic portion 14, the bridge portion 22 extends parallel to the surface to be bonded B. In this state, the bridge portion 22 is spaced apart from the surface to be bonded B in the Z direction.

[0097] In this embodiment, during the biasing force generation process, the adhesive jig 20 is brought into contact with the elastic portion 14 to press down on each temporary adhesive 15. At this time, by simply pressing down on the bridge portion 22, multiple leg portions 21 can simultaneously and reliably press down on each temporary adhesive 15. This improves the ease of operation.

[0098] In this embodiment, the same effects as those of the above-described embodiment can be achieved.

[0099] A fifth embodiment of the adhesive structure according to the present invention will be described below with reference to the drawings. Figure 21 is a schematic side view showing the adhesive unit and adhesive method in this embodiment. Figure 22 is a schematic side view showing the adhesive unit and adhesive method in this embodiment. In this embodiment, the difference from the fourth embodiment described above is in the adhesive jig, and other components corresponding to the fourth embodiment described above are denoted by the same reference numerals and their descriptions are omitted.

[0100] In this embodiment, as shown in Figure 21, the adhesive structure 10 and the adhesive jig 20 constitute the adhesive unit 30. Furthermore, the bonding jig 20 has a through hole in the bridge portion 22 through which the stud 12 passes. The bonding jig 20 also has a nut 23. The stud 12 has threads cut on its outer circumference. The bridge portion 22 and the nut 23 constitute the biasing state adjustment section. The leg portion 21 is set to have a length in the Z direction such that the stud 12 protrudes from the through hole of the bridge portion 22 when its tip is in contact with the elastic portion 14.

[0101] In the bonding method of this embodiment, as shown in Figure 21, the bonding structure 10 and the bonding jig 20 are assembled as a bonding unit 30 in the assembly process before bonding. At this time, the position of the leg portion 21 in the XY plane is set so that all of the temporary fixing adhesive 15 can be pressed. Simultaneously, the stud 12 protrudes from the through hole of the bridge portion 22. Furthermore, the nut 23 is screwed onto the stud 12.

[0102] At the same time, by setting the Z-direction position of the nut 23 relative to the stud 12, the relationship between the Z-direction separation distance along the stud 12 from the bridge portion 22 to the pad 11 and the Z-direction length of the leg portion 21, which is a specified value, is set to fall within a predetermined range as the Z-position relationship. For example, in terms of Z-positional relationship, the temporary adhesive 15 solidified on the back surface of the elastic part 14 and the structural adhesive 13 solidified on the back surface 11b of the pad 11 can be formed along the same plane. In this case, the elastic part 14 cannot apply a biasing force to the pad 11, or the biasing force is extremely weak, which is undesirable.

[0103] The Z-position relationship is set by increasing the Z-direction distance from the bridge portion 22 to the pad 11 compared to the Z-position relationship in this state. This increases the curvature of the elastic portion 14, meaning that the structural adhesive 13 can be solidified in a state where the elastic portion 14 can apply a biasing force to the pad 11. Furthermore, by setting the Z-position relationship, the Z-direction position of the temporary fixing adhesive 15 and the structural adhesive 13, that is, the thickness of the structural adhesive 13, i.e., the adhesive layer thickness in the adhesive structure 10, can be increased or decreased.

[0104] The bonding unit 30 can also be stored with the Z-axis position set. The Z-axis position can be set before arriving at the bonding site. With the Z-position relationship set, the temporary fixing adhesive 15 and the structural adhesive 13 can be applied and formed.

[0105] In the biasing force generation process, the leg portion 21 sandwiches the elastic portion 14 and presses the temporary fixing adhesive 15, ensuring secure temporary fixing. Furthermore, the Z-axis position can be easily set and adjusted by changing the fastening position of the nut 23. Moreover, the adjusted Z-axis position can be easily maintained throughout the solidification process.

[0106] For example, if the strength of the structural adhesive 13 is increased by reducing its film thickness, the distance in the Z-direction from the bridge portion 22 to the pad 11 can be increased by adjusting the position of the nuts 23 fastening to the studs 12, compared to the Z-direction length of the leg portion 21. Alternatively, the thickness of the structural adhesive 13 can be increased to allow it to follow the deformation, taking into account the load applied to the adhesive structure 10.

[0107] This makes it easy to form an adhesive structure 10 in which the structural adhesive 13 has solidified to a predetermined thickness, as shown in Figure 22.

[0108] In this embodiment, the same effects as those of the above-described embodiment can be achieved.

[0109] Furthermore, in the present invention, it is also possible to individually select and combine each of the configurations in the above-described embodiments. [Explanation of symbols]

[0110] 10...Adhesive structure 11…Pad 12… Stud 13… Structural adhesives 14a...Base 14b, 14g... Elasticity adjustment section 14c, 14e… Connection part 14f…recess 14h... Notch 15…Temporary adhesive 20…Adhesive jig 21...legs 22...Bridge section 23...Nut (bias adjustment part)

Claims

1. A bonding method in which a pad with studs erected on its surface is bonded to a surface using a structural adhesive on the back surface, The back surface of the elastic portion that protrudes outward from the contour of the pad along the surface to be bonded is attached to the surface to be bonded with a temporary fixing adhesive that has a shorter curing time than the structural adhesive. The structural adhesive is solidified while the pad is biased toward the surface to be bonded by the elastic portion. Adhesion method.

2. After the pad is bonded, the elastic part is separated from the pad. The bonding method according to claim 1.

3. The surface of the elastic part corresponding to the temporary adhesive on the back surface is pressed with an adhesive jig. The bonding method according to claim 1.

4. The adhesive jig is positioned relative to the stud in its axial direction to adjust the biasing state of the pad. The bonding method according to claim 3.

5. An adhesive structure bonded by the bonding method described in any one of claims 1 to 4, The pad having the studs erected on the surface and the structural adhesive provided on the back surface, The elastic portion of the pad protrudes outward from the surface along the surface to be bonded, and the temporary adhesive is provided on the back surface, It has, The pad is biased toward the surface to be bonded by the elastic portion and is bonded to the surface to be bonded. Adhesive structure.

6. The elastic portion is either integrated with the pad or detachable from the pad. The adhesive structure according to claim 5.

7. The elastic portion comprises a base portion that protrudes outward from the contour of the pad along the surface to be bonded, An elastic adjustment portion extending from the tip of the base portion along the contour of the pad while being spaced apart from the contour of the pad, Having, The adhesive structure according to claim 5.

8. An adhesive unit bonded by the bonding method described in claim 3 or 4, The pad having the studs erected on the surface and the structural adhesive provided on the back surface, The elastic portion of the pad protrudes outward from the surface along the contour of the surface to be bonded, and the temporary adhesive is provided on the back surface of the elastic portion that biases the pad toward the surface to be bonded, The adhesive jig presses the surface of the elastic part corresponding to the temporary adhesive, Having, Adhesive unit.

9. The elastic portion is either integrated with the pad or detachable from the pad. The adhesive unit according to claim 8.

10. The aforementioned adhesive jig is The leg portion that contacts the surface of the elastic portion, A biasing state adjustment unit that is spaced apart from the surface of the pad and can be connected to the stud, Having, The adhesive unit according to claim 8.

Citation Information

Patent Citations

  • Structure bonding method and bonding structure

    JP7320399B2