Method for disassembling an object, disassembly apparatus, and object disassembly system

Abstract

To provide a method for efficiently disassembling objects such as joining members. [Solution] The method for disassembling the object OB is a method for disassembling the object OB using a disassembly device 100 that generates ultrasonic waves, wherein a focal point 301 is formed on the object OB side using the concave surface 10a of the disassembly device 100, and the components of the target area of ​​the object OB are disassembled in a high sound pressure region 300 including the focal point 301 and the vicinity of the focal point 301.

Description

[Technical Field]

[0001] The present invention relates to a method for disassembling an object, a disassembly apparatus, and an object disassembly system for disassembling joint members and the like. [Background technology]

[0002] In a laminate in which a surface material is laminated to a base material via an adhesive layer, a method for peeling off a surface material is known, which involves bringing a tool horn into contact with the surface material and applying ultrasonic vibrations through the tool horn to break the adhesive layer or reduce the adhesive strength, thereby separating the surface material from the base material (see Patent Document 1).

[0003] The method described in Patent Document 1 has the problem that peeling is difficult if the adhesive strength of the adhesive is strong. In addition, depending on the material of the surface material, the destruction of the adhesive layer may be insufficient, and there are limitations on the types of laminates that can be processed. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2005-282165 [Overview of the project]

[0005] The present invention has been made in view of the above-mentioned background art, and aims to provide a method for disassembling objects such as joining members, a disassembly apparatus, and an object disassembly system for efficiently disassembling objects.

[0006] A method for disassembling an object according to one embodiment for achieving the above objective is a method for disassembling an object using a disassembly device that generates ultrasonic waves, wherein a focal point is formed on the object side using the concave surface of the disassembly device, and the components of the target area of ​​the object are disassembled in a high sound pressure region including the focal point and the vicinity of the focal point.

[0007] A disassembly apparatus according to one embodiment for achieving the above objective comprises a piezoelectric element, a support member for supporting the piezoelectric element, and an element control device for controlling the operation of the piezoelectric element. The piezoelectric element is arranged on a first surface of the support member, and the object to be worked on is positioned opposite a second surface on the opposite side of the first surface. The first surface has a support surface corresponding to the surface shape of the piezoelectric element, and the piezoelectric element has a concave surface that forms a high sound pressure region including a focal point and the vicinity of the focal point on the object side, and is fixed so as to be in substantial contact with the support surface.

[0008] A decomposition system for an object according to one embodiment for achieving the above objective comprises the decomposition device described above, a stage device for moving the decomposition device, and a calculation device having a position determination unit that determines the effective operating area for decomposing the object from the high sound pressure area formed by the decomposition device and determines the arrangement of the decomposition device and the object. [Brief explanation of the drawing]

[0009] [Figure 1] (A) is a side cross-sectional view illustrating the outline of the disassembly apparatus in the first embodiment, and (B) is a cross-sectional view AA of the disassembly apparatus shown in (A). [Figure 2] (A) and (B) are side and top views illustrating the high sound pressure region formed by the decomposition device. [Figure 3] This is a lateral cross-sectional view illustrating a modified example of the disassembly device. [Figure 4] Figures (A) to (C) illustrate the effects of the frequency and focus-forming structure of the decomposition device on the sound pressure distribution. [Figure 5] (A) and (B) are diagrams illustrating the simulation results of the disassembly device. [Figure 6] Figure 1 illustrates an example of disassembling an object using the disassembly apparatus shown. [Figure 7] This figure illustrates another example of disassembling an object using a disassembly device. [Figure 8] This figure illustrates another example of disassembling an object using a disassembly device. [Figure 9]It is a side cross-sectional view illustrating the disassembly apparatus according to the second embodiment. [Figure 10] It is a side cross-sectional view illustrating a modification of the disassembly apparatus shown in FIG. 6. [Figure 11] It is a conceptual diagram illustrating the object disassembly system according to the third embodiment. [Figure 12] It is a diagram illustrating the movement path of the disassembly apparatus. [Figure 13] It is a flowchart illustrating the object disassembly method. [Figure 14] It is a diagram illustrating an example of object disassembly performed by the disassembly apparatus shown in FIG. 11. [Figure 15] It is a conceptual diagram illustrating the object disassembly system according to the fourth embodiment. [Figure 16] It is a diagram illustrating a modification of the disassembly apparatus. [Modes for Carrying Out the Invention]

[0010] [First Embodiment] Hereinafter, the disassembly apparatus and the object disassembly method according to the first embodiment of the present invention will be described with reference to the drawings.

[0011] As shown in FIGS. 1(A) and 1(B), the disassembly apparatus 100 includes a piezoelectric element 10, a support member 20, a holder member 30, and an element control device 40. In FIG. 1(A) and the like, x, y, z represent the orthogonal coordinate system of the disassembly apparatus 100. The disassembly apparatus 100 is an apparatus that utilizes the principle of a High Intensity Focused Ultrasound (HIFU) device. The HIFU device focuses ultrasound waves at a focal point 301, and disassembles the object OB through the effect of the high pressure difference at and around the focal point 301, and the high energy generated thereby.

[0012] The piezoelectric element 10 is an element that generates ultrasonic waves. The piezoelectric element 10 has a concave curved surface relative to the object OB, that is, a concave surface 10a on the object OB side. The curved surface or concave surface 10a is a shape that focuses ultrasonic waves at the focal point 301 by lens function, and can be, for example, a sphere, an ellipsoid, a parabolic surface, etc. In particular, making the curved surface spherical improves energy efficiency. The focal point 301 of the decomposition device 100 is, for example, the center of a virtual sphere containing the curved surface. That is, for example, if the concave surface 10a of the piezoelectric element 10 is spherical, the position of the focal point 301 is on the central axis CO of the piezoelectric element 10, and is located at a distance equal to the radius of curvature from the concave surface 10a. The position of the focal point 301 can be appropriately changed depending on the shape of the curved surface or concave surface 10a.

[0013] The piezoelectric element 10 forms a high-sound-pressure region 300 on the object OB side, including a focal point 301 and the vicinity of the focal point 301. The high-sound-pressure region 300 is a region where the sound pressure is relatively high due to the convergence of ultrasonic waves at and near the focal point 301. The focal point 301 has an elliptical or circular shape. The shape of the focal point 301 depends on the curved shape and frequency of the piezoelectric element 10. Figures 2(A) and 2(B) of the piezoelectric element 10 show examples where the focal point 301 and the high-sound-pressure region 300 are elliptical. The size of the focal point 301 and the high-sound-pressure region 300 can be adjusted by the frequency of the piezoelectric element 10.

[0014] Returning to Figure 1(A), the piezoelectric element 10 is fixed so as to be in substantial contact with the support surface 20a of the support member 20. In this embodiment, the piezoelectric element 10 is fixed to the support member 20 by adhesive AS. In other words, an adhesive layer 14 is interposed between the piezoelectric element 10 and the support surface 20a of the support member 20.

[0015] The piezoelectric element 10 comprises a piezoelectric member 11, a first electrode 12, and a second electrode 13. The piezoelectric element 10 has a structure in which the piezoelectric member 11 is sandwiched between the two electrodes 12 and 13. Specifically, the first electrode 12 is positioned on the side of the piezoelectric member 11 opposite to the object OB. The second electrode 13 is positioned on the side of the piezoelectric member 11 opposite to the first electrode 12 and on the side facing the object OB. In other words, the first electrode 12 and the second electrode 13 are positioned on the upper and lower surfaces of the piezoelectric member 11, respectively. The piezoelectric member 11 is formed of, for example, a ceramic piezoelectric material. Existing ceramic piezoelectric materials can be used. Examples of ceramic piezoelectric materials include PZT (lead zirconate titanate) and BaTiO3 (barium titanate). In addition, other piezoelectric materials can be used as appropriate for the piezoelectric member 11.

[0016] The support member 20 is a member that supports the piezoelectric element 10. The support member 20 has a first surface 21 and a second surface 22 facing the first surface 21. The piezoelectric element 10 is placed on the first surface 21. The first surface 21 has a support surface 20a that corresponds to the surface shape of the piezoelectric element 10. The object OB is placed at the position opposite the second surface 22. When the second surface 22 is in contact with the object OB, it is desirable that it corresponds to the surface shape of the object OB. In the illustrated example, the second surface 22 is a plane or substantially a plane.

[0017] The support member 20 is made of a metal such as aluminum or stainless steel. It is preferable that the support member 20 be made of the material being disassembled, or a material having an acoustic impedance similar to that of the material being disassembled, in order to disassemble or take apart the object OB.

[0018] The holder member 30 is a member that surrounds the piezoelectric element 10. The holder member 30 has a function of preventing electric shock. The holder member 30 has a cylindrical shape. An SMA (Sub-Miniature version A) connector 50 is attached to the side of the holder member 30. The SMA connector 50 connects the wiring 15 and 16 of the electrodes 12 and 13 of the piezoelectric element 10, and connects the piezoelectric element 10 to the element control device 40. Wiring 16 may also be used as ground. The holder member 30 is made of a metal such as aluminum or stainless steel.

[0019] The element control device 40 controls the operation of the piezoelectric element 10. The element control device 40 includes a function generator 41 and a power amplifier 42, etc. The function generator 41 is a signal generator that generates an AC voltage signal with an arbitrary frequency and waveform. The power amplifier 42 amplifies the output of the function generator 41 and outputs it to the piezoelectric element 10. The function generator 41 and the power amplifier 42 may be separate devices or an integrated device.

[0020] As previously described, the size of the ultrasonic focal point 301 and the high-sound-pressure region 300 formed by the decomposition device 100 are determined by the ultrasonic frequency. The energy at the focal point 301 is determined by the frequency and the voltage applied to the piezoelectric element 10. Increasing the ultrasonic frequency narrows the focal point 301, which is energetically advantageous. The decomposition device 100 adjusts the voltage by calculating backward from the stress generated by the piezoelectric element 10. In the decomposition process, the upper limit of the voltage is the limit voltage of the device, but it is preferable that it be below the voltage that can peel off the adhesive with the greatest tensile shear adhesive strength (specifically, 40 MPa).

[0021] The object OB is a joint member 200 that includes multiple target members (members to be bonded) 201, 202 bonded together via a resin adhesive portion 203. The decomposition device 100 decomposes the resin adhesive portion 203 within the target area to be decomposed. Specifically, the polymer chains of the resin constituting the resin adhesive portion 203 are cut by ultrasonic energy, resulting in the decomposition of the resin adhesive portion 203. The second surface 22 of the support member 20 contacts the surface of the nearest target member 205 on the second surface 22 side of the multiple target members 201, 202. The nearest target member 205 is a metal member, a resin member, etc. Note that the target area of ​​the object OB does not have to be at the position of the focal point 301, as long as it can be decomposed within the high sound pressure region 300. By adjusting the position of the object OB, the area over which the ultrasonic waves hit the object OB in the high sound pressure region 300 can be adjusted.

[0022] The adhesive used in the resin bonding portion 203 is a material that does not easily separate during use of the object OB, but can be separated by the application of special energy. The adhesive is, for example, a highly reliable crosslinked polymer with high strength and durability. If the polymer material is such that the constituent molecules (monomers) are linked and bound to each other, like a highly reliable crosslinked polymer, the main chain can be cut by changes in density and rarefaction of ultrasound alone, without relying on cavitation. In other words, if a strain occurs that the polymer chain cannot withstand, the polymer chain will be cut. For example, in water, when the frequency is relatively high at 1 MHz, the polymer chain is subdivided into pieces of about 1.5 mm.

[0023] If there is a difference in acoustic impedance between the target component 201 and the resin adhesive portion 203, transmission and reflection will occur repeatedly at these joints. Since ultrasonic waves are constantly generated from the piezoelectric element 10, acoustic energy will consequently concentrate at the joint.

[0024] Furthermore, the target object OB only needs to contain a resin material that can be decomposed by ultrasound in the high sound pressure region 300. Therefore, in addition to the decomposition or dismantling of the joint member 200, the decomposition device 100 can be used for the dismantling of products such as electronic circuit boards, solar cells and their components, solar modules (panels), or more specifically, their cells, car bodies and in-vehicle parts, as well as for further dismantling and separation of dismantled items using existing dismantling technologies, and for the dismantling of the resin material itself. The decomposition device 100 can also be used for the dismantling of fiber-reinforced plastic (FRP) products such as glass fiber reinforced plastics (GFRP), carbon fiber reinforced plastics (CFRP), and aramid fiber reinforced plastics (AFRP).

[0025] An example of dismantling or dismantling of the target object OB is the dismantling of a resin plate. In the dismantling of a resin plate, the resin adhesive attached to the resin plate is dismantled. The material of the resin plate is, for example, PMMA, PP, etc. The resin adhesive is, for example, a high-reliability adhesive, specifically 3M's Scotch-Weld DP125 (epoxy structural adhesive). The tensile shear adhesive strength of DP125 is 16.7 MPa.

[0026] Another example of disassembly or dismantling of the object OB is the dismantling of a joint. In the dismantling of a joint, two aluminum plates joined with a resin adhesive are separated by dismantling the resin adhesive. The resin adhesive is, for example, a high-reliability adhesive, specifically 3M's Scotch-Weld DP420 (structural adhesive), Scotch-Weld EC-9323 B / A (aerospace application), etc. The tensile shear adhesive strength of DP420 is 29.4 MPa. The tensile shear adhesive strength of EC-9323 is 40 MPa.

[0027] The operation of the disassembly device 100 will be described below.

[0028] As a preliminary step, the object OB is set in the disassembly device 100. Specifically, the disassembly device 100 is supported using a gripping member (not shown), and the object OB is placed in a suitable location on, for example, a metal stage. At this time, the nearest target member 205 of the object OB is positioned facing the support member 20 of the disassembly device 100 and in contact with the second surface 22 of the support member 20. The disassembly device 100 and the object OB are moved relative to each other by moving either the gripping member and / or the stage. By, for example, providing a spring in the gripping member, the disassembly device 100 or the object OB can be moved relatively smoothly in the x or y direction while the second surface 22 and the object OB remain in contact. Alternatively, the support member 20 and the object OB may be separated and moved, and then the support member 20 and the object OB may be brought into contact again to perform the disassembly process. Alternatively, the method for setting the object OB may involve supporting the object OB with a gripping member and fixing the disassembly device 100 to a base, stage, or the like.

[0029] The object OB is positioned such that its target area (area to be processed) is located within the high sound pressure area 300 of the decomposition device 100. In the illustrated example, the resin adhesive portion 203 included in the target area of ​​object OB is positioned within the high sound pressure area 300. The high sound pressure area 300 is determined by simulation or prior testing. Subsequently, a voltage is applied to the piezoelectric element 10 to generate ultrasonic waves. The decomposition device 100 forms a high sound pressure area 300 including a focal point 301 at a predetermined position on the ultrasonic emission side by the lens function, specifically the curved or concave surface 10a of the piezoelectric element 10. The piezoelectric element 10 decomposes the components of the target area of ​​object OB, specifically the resin adhesive portion 203, within the high sound pressure area 300. This causes fracture or a decrease in adhesive strength in the resin adhesive portion 203, allowing the object OB to be decomposed.

[0030] In the above, when determining the arrangement of the decomposition device 100 and the object OB, an effective operating region 302 that decomposes the object OB from the high sound pressure region 300 may be set (see Figures 2(A) and 2(B)). As shown in Figure 2(A), etc., the effective operating region 302 is a region that has enough energy to decompose the structure of the target area of ​​the object OB, and is set within the range of the high sound pressure region 300. The effective operating region 302 varies depending on the focal sound pressure of the decomposition device 100 and the material of the object OB.

[0031] As shown in Figure 3, an acoustic matching layer 60 may be provided between the interface of the support member 20 of the decomposition device 100 and the interface of the object OB to promote the transmission of ultrasonic waves to the object OB. This reduces the decrease in transmittance even when the acoustic impedances at the interface of the two materials are significantly different. For example, if there is a large difference between the acoustic impedance of the support member 20 and the acoustic impedance of the object OB, it is preferable to provide an acoustic matching layer 60. It is also preferable to provide an acoustic matching layer 60 when the decomposition process is performed in a liquid. Here, the overall transmittance may decrease if a liquid is interposed between the support member 20 and the object OB, but in a broad sense, the liquid is also included in the acoustic matching layer 60. That is, the acoustic matching layer 60 takes into account the acoustic impedance of the support member 20, the object OB, and the substances present from the support member 20 to the object OB. For example, the acoustic matching layer 60 can be made of resin, metal, liquid, etc. The liquid is not limited to water; oil, etc., can also be used. When the acoustic matching layer 60 includes liquid, it is not limited to filling the space between the support member 20 and the object OB with liquid; the support member 20 and the object OB may also be submerged in the liquid.

[0032] The acoustic impedance of the acoustic matching layer 60 is preferably an intermediate value between the acoustic impedances of materials adjacent to the interface of the acoustic matching layer 60. The acoustic matching layer 60 may be a layer of multiple members. The acoustic matching layer 60 may be located on the support member 20 side or on the object OB side.

[0033] Generally, the transmission rate T of ultrasound between material 1 and material 2 is calculated using the following formula. T = 4Z1Z2 / (Z1 + Z2) 2 however, Z1: Acoustic impedance of material 1 Z2: Acoustic impedance of material 2

[0034] Acoustic impedance Z (unit: MN·s / m) 3 ) is calculated using the following formula. Z=ρC however, ρ: density of a substance C: Speed ​​of sound in a substance

[0035] For example, if the support member 20 is made of aluminum, and the object OB is also made of aluminum, and the surface of the object OB is rough and cannot come into contact with the support member 20, then water or oil is interposed. When water is interposed between the support member 20 and the object OB, the overall transmittance T from the support member 20 to the object OB is approximately 8%. Here, the acoustic impedance of water is 1.48 (MN·s / m). 3 ) and the acoustic impedance of aluminum is 17.3 (MN·s / m 3 )

[0036] Furthermore, when an acoustic matching layer 60 consisting of polymethyl methacrylate (PMMA), which is an acrylic resin, and water is provided on the second surface 22 of the support member 20, the overall transmittance T from the support member 20 to the object OB is approximately 13%. Here, the acoustic impedance of PMMA is 3.2 (MN·s / m). 3 )

[0037] As described above, by providing an appropriate acoustic matching layer 60 between the support member 20 and the object OB, the transmittance T can be increased.

[0038] The disassembly apparatus 100 described above comprises a piezoelectric element 10, a support member 20 that supports the piezoelectric element 10, and an element control device 40 that controls the operation of the piezoelectric element 10. The piezoelectric element 10 is positioned on the first surface 21 of the support member 20, and the object OB is positioned opposite the second surface 22 on the opposite side of the first surface 21. The first surface 21 has a support surface 20a corresponding to the surface shape of the piezoelectric element 10. The piezoelectric element 10 has a concave surface 10a that forms a focal point 301 and a high sound pressure region 300 including the vicinity of the focal point 301 on the object OB side, and is fixed so as to be in substantial contact with the support surface 20a.

[0039] Furthermore, the method for disassembling the object OB described above is a method for disassembling the object OB using a disassembly device 100 that generates ultrasonic waves, wherein a focal point 301 is formed on the object OB side using the concave surface 10a of the disassembly device 100, and the components of the target area of ​​the object OB are disassembled in the high sound pressure region 300 including the focal point 301 and the vicinity of the focal point 301.

[0040] In the above-described disassembly device 100 and disassembly method, the disassembly device 100 forms a high-sound-pressure region 300 including the focal point 301, thereby concentrating high energy at the focal point. This allows for efficient disassembly of the object OB even if a strong adhesive is used on the object OB. Furthermore, it can widely accommodate the disassembly process of objects OB made of various materials.

[0041] (Example 1) The following describes an example of the disassembly apparatus 100 of this embodiment.

[0042] Figures 4(A) to 4(C) illustrate the effect of the frequency of the decomposition device 100 and the focal-forming structure of the decomposition device 100 (specifically, the curved surface of the piezoelectric element 10) on the sound pressure distribution when the sound pressure emitted by the piezoelectric element 10 is 0.1 MPa. Figures 4(A) to 4(C) show the simulation results of the sound pressure distribution when a 0.1 MPa sound wave is generated from the lower arc portion (corresponding to the curved surface of the piezoelectric element 10). The arrow VX in the figure indicates the direction of sound wave propagation. Also, in the figure, positive pressure (≒compressive stress) and negative pressure (≒tensile stress) appear alternately in the sound pressure distribution, and the shades indicate the difference in their magnitudes. Figure 4(A) shows the simulation results when the frequency of the decomposition device 100, specifically the frequency of the piezoelectric element 10, is 0.5 MHz. Figure 4(B) shows the simulation results when the frequency of the piezoelectric element 10 is 1 MHz. Figure 4(C) shows the simulation results when the frequency of the piezoelectric element 10 is set to 2 MHz. The sound pressure emitted by the piezoelectric element 10 is the initial sound pressure output when the power of the decomposition device 100 is turned on, and is called the output sound pressure.

[0043] As shown in Figure 4(A), when the frequency of the piezoelectric element 10 is 0.5 MHz, a high sound pressure region 300 is generated at and near the focal point 301. In Figure 4(A), the sound pressure at the focal point 301 is approximately 0.8 MPa. Here, the frequency of a typical washing machine is 40 kHz, in which case the sound pressure at the focal point 301 is 0.1 MPa. That is, both the sound pressure emitted by the piezoelectric element 10 and the sound pressure at the focal point 301 are 0.1 MPa, which is equal to the output sound pressure, so it can be considered that a focal point 301 is not formed. In contrast, as the frequency increases, a focal point 301 can be formed, and as shown in Figure 4(A), when the frequency is 0.5 MHz, the sound pressure at the focal point is 8 times the output sound pressure. Similarly for Figures 4(B) and 4(C), when the frequency is 1 MHz, the sound pressure at the focal point 301 is approximately 15 times the output sound pressure, and when the frequency is 2 MHz, the sound pressure at the focal point 301 is approximately 25 times the output sound pressure.

[0044] As described above, increasing the frequency of the piezoelectric element 10 raises the sound pressure at the focal point 301 and narrows the range of the high sound pressure region 300. The frequency of the piezoelectric element 10 can be appropriately set according to the material of the target region of the object OB.

[0045] (Example 2) Figures 5(A) and 5(B) are diagrams illustrating simulation results of irradiating the object OB (aluminum) with ultrasonic waves from the decomposition apparatus 100. Specifically, Figures 5(A) and 5(B) are a plan view and a partially enlarged perspective view showing the sound pressure distribution of the ultrasonic waves generated from the decomposition apparatus 100. These simulation images are obtained 3.8×10 -6 seconds after the ultrasonic waves are generated, showing the state of sound pressure. The plus sign (+) in the figure indicates positive pressure, and the minus sign (-) indicates negative pressure. The frequency of the piezoelectric element 10 is 1 MHz. As shown in Figures 5(A) and 5(B), the focal point 301 is formed by the lens function of the decomposition apparatus 100, and the focal sound pressure is approximately 3 times the output sound pressure.

[0046] (Example 3) Figure 6 is a diagram showing a dismantled object of an acrylic (polymethyl methacrylate) plate. Using the decomposition apparatus 100, a single point of ultrasonic waves was irradiated from one surface of the acrylic plate as the object OB. The decomposition treatment was performed in air by pressing the acrylic plate against the second surface 22 of the support member 20 for close contact. The target region of the object OB to be decomposed was set to the inside of the acrylic plate. While shifting the irradiation position, the applied voltage to the piezoelectric element 10 (specifically, the input voltage to the function generator 41 applied to the device) was changed to irradiate the ultrasonic waves. The element control device 40 sets the input voltage to the function generator 41 to 0.5 V p-p , 0.4 V p-p , 0.3 V p-p , 0.2 V p-p , 0.1 V p-p to generate a sine wave, which was amplified by the power amplifier 42 at a gain of +55 dB and applied to the piezoelectric element 10. That is, the input voltages to the function generator 41 of 0.5 V p-p , 0.4 V p-p , 0.3 V p-p , 0.2 V p-p , 0.1 Vp-p The voltages are amplified via the power amplifier 42, resulting in the applied voltages to each piezoelectric element 10 being 281V. p-p , 225V p-p , 169V p-p , 112V p-p , 56V p-p The piezoelectric element 10 has a frequency of 1 MHz. The irradiation time at one location was set to approximately 5 seconds. As shown in Figure 6, the input voltage to the function generator 41 is 0.3V. p-p From the above, it can be seen that the acrylic sheet undergoes disassembly that results in the formation of air bubbles.

[0047] (Example 4) Figure 7 shows the disassembled adhesive curing material. The adhesive curing material is made by curing the adhesive to form a rectangular parallelepiped shape similar to that of an acrylic sheet. The adhesive used was Scotch-Weld EC-9323 (3M), an adhesive used for aerospace applications. Using the disassembly device 100, ultrasonic waves were irradiated from one side of the adhesive curing material, which was the target object OB, at a single point. The disassembly process was carried out in air by pressing the adhesive curing material against the second surface 22 of the support member 20 to ensure close contact. The target area of ​​the target object OB to be disassembled was the interior of the adhesive curing material. Ultrasonic waves were irradiated by changing the applied voltage of the piezoelectric element 10 while shifting the irradiation position. The element control device 40 set the input voltage to the function generator 41 to 0.5V. p-p , 0.4V p-p , 0.3V p-p , 0.2V p-p , 0.1V p-p A sine wave was generated and amplified by the power amplifier 42 with a gain of +55dB before being applied to the piezoelectric element 10. The frequency of the piezoelectric element 10 was 1MHz. The irradiation time at one location was approximately 5 seconds. As shown in Figure 7, the input voltage to the function generator 41 was 0.3V. p-p The above indicates that cracks occur within the cured adhesive material, leading to decomposition.

[0048] (Example 5) Figure 8 shows the disassembled solar module (panel). Using the disassembly device 100, ultrasonic waves were irradiated from one side of the solar module, specifically the back surface (backsheet), which was the target object OB. The disassembly process was performed in air. The target area of ​​the object OB to be disassembled was the adhesive layer of the solar module. The element control device 40 supplied an input voltage of 0.5V to the function generator 41. p-p A sine wave was generated and amplified by the power amplifier 42 with a gain of +55 dB before being applied to the piezoelectric element 10. The frequency of the piezoelectric element 10 was 1 MHz. The decomposition device 100 moved linearly while irradiating with ultrasonic waves, with a movement speed of approximately 1 mm per second. As shown in Figure 8, it can be seen that bubbles were generated inside the solar module and that delamination was occurring internally.

[0049] [Second Embodiment] The disassembly apparatus of the second embodiment will now be described. Note that the disassembly apparatus of the second embodiment is a partial modification of the disassembly apparatus of the first embodiment, and the parts common to both the first embodiment and the second embodiment will not be described.

[0050] As shown in Figure 9, the disassembly device 100 comprises a piezoelectric element 10, a support member 20, a holder member 30, and an element control device 40.

[0051] In this embodiment, the piezoelectric element 10 is fixed by mechanical restraint, similar to a bolted Langevin-type vibrator. Specifically, the piezoelectric element 10 is fixed to the support member 20 by a pressing member 70, rather than by adhesive. That is, the piezoelectric element 10 has ring-shaped piezoelectric members 11 and 17, and the piezoelectric members 11 and 17 are fixed to the support member 20 by the pressing member 70, specifically by a fixing member 73. By appropriately adjusting the clamping pressure of the fixing member 73 so that compressive stress is constantly applied to the piezoelectric members 11 and 17, a larger vibration amplitude can be obtained than that of an adhesive-type vibrator.

[0052] The piezoelectric element 10 has two piezoelectric members 11 and 17, a first electrode 12, and a second electrode 13. The piezoelectric element 10 has a structure in which the piezoelectric member 11 is sandwiched between the two electrodes 12 and 13, and another piezoelectric member 17 is placed outside the first electrode 12. The outer piezoelectric member 17 is provided for insulating purposes.

[0053] The pressing member 70 includes an adapter 71, a cushioning member 72, and a fixing member 73. The adapter 71 and cushioning member 72 may be omitted as appropriate. The adapter 71 and cushioning member 72 are components for stabilizing the tightening by the fixing member 73. The cushioning member 72 is, for example, a washer. The fixing member 73 is, for example, a bolt 73a. One surface 71a of the adapter 71 facing the piezoelectric element 10 has a shape that is the inverse of the surface shape of the piezoelectric element 10, i.e., a concave shape. The other surface 71b of the adapter 71 is flat or substantially flat. The adapter 71 has a hole 71c at a position corresponding to the hole 11a formed in the piezoelectric element 10. The support member 20 is provided with a screw hole 21a at a position corresponding to the hole 11a. The piezoelectric element 10 can be fixed to the support member 20 by inserting the bolt 73a into the holes 11a and 71c and screwing the bolt 73a into the screw hole 21a.

[0054] Note that other structures may be used to fix the piezoelectric element 10 to the support member 20. For example, as shown in Figure 10, the support member 20 may be provided with a threaded portion 21b that protrudes from the support surface 20a. In this case, the fixing member 73 is, for example, a nut 73b.

[0055] [Third Embodiment] The object disassembly system and object disassembly method of the third embodiment will be described below. Note that the object disassembly system of the third embodiment uses the disassembly apparatus of the first or second embodiment, and the parts common to the disassembly apparatus of the first embodiment, etc. will not be explained.

[0056] The object disassembly system equipped with a disassembly device will be described below, with reference to the drawings.

[0057] As shown in Figure 11, the object disintegration system 400 includes a disintegration device 100, a stage device 500, and a control device 600. In Figure 11, x, y, and z are the Cartesian coordinate system of the disintegration device 100, and X, Y, and Z are the Cartesian coordinate system of the stage device 500. In this embodiment, an example of disintegrating an object OB underwater is shown, and both the disintegration device 100 and the object OB are movable in three dimensions. The object OB is placed at the bottom of a water tank 700 filled with water. The object disintegration system 400 irradiates the object OB with ultrasound while moving the disintegration device 100 and the object OB relative to each other in three dimensions. By disintegrating the object OB underwater, heat generation during the disintegration process can be suppressed.

[0058] The disassembly apparatus 100 is the disassembly apparatus 100 shown in the first or second embodiment. The element control device 40 of the disassembly apparatus 100 operates under the control of the control device 600, which will be described later.

[0059] The stage device 500 is a three-dimensional drive device for moving the disassembly device 100 or the object OB. The stage device 500 includes a device support member 510, an object support member 520, a lifting drive device 530, and a travel drive device 540. The lifting drive device 530, the travel drive device 540, and the trolley 511 (described later) are drive devices 501 that drive the stage device 500.

[0060] The device support member 510 includes a trolley 511, a girder 512, and a support column 513. The trolley 511 is a member that moves along the girder 512, for example, in the Y direction or in the left-right direction of the paper plane, and is attached to the girder 512. The trolley 511 grips the holder member 30 so that the support member 20 of the disassembly device 100 faces the object OB side. The girder 512 is a member that supports the trolley 511. Both ends of the girder 512 are supported by a pair of support columns 513. Each of the pair of support columns 513 is provided with a lifting drive device 530. This allows the girder 512 to move up and down in the Z direction or in the up-down direction of the paper plane. The support columns 513 are fixed to a base 550.

[0061] The object support member 520 has a movable support base 521 and rails 522. The movable support base 521 supports the water tank 700 containing the object OB or the object OB. The movable support base 521 has a pair of rail grooves 521a at both lower ends. The rail grooves 521a extend in the X direction or the depth direction of the paper and into which the rails 522 are fitted. The rails 522 are a pair of members that move the movable support base 521 in the X direction. The rails 522 are fixed to the base 550. A travel drive device 540 is provided in each of the pair of rail grooves 521a of the movable support base 521. As a result, the movable support base 521 is movable in the X direction.

[0062] The lifting drive unit 530 moves the disassembly device 100 in the Z direction under the control of the control device 600. The trolley 511 moves the disassembly device 100 in the Y direction under the control of the control device 600. The traveling drive unit 540 moves the object OB in the X direction under the control of the control device 600. As a result, the disassembly device 100 and the object OB are able to move in three dimensions relative to each other.

[0063] The control device 600 controls the operation of the disassembly device 100 and the stage device 500. The control device 600 includes an arithmetic unit 610, a memory device 620, and an input / output device 630.

[0064] The arithmetic unit 610 comprehensively controls the components of the disassembly unit 100 and the stage unit 500. The arithmetic unit 610 reads and executes a control program from the storage device 620 and performs various data processing to control the operation of the disassembly unit 100 and the stage unit 500. The arithmetic unit 610 includes, for example, a CPU (Central Processing Unit) or MPU (Micro Processing Unit) that has various functions such as data storage, input / output, and calculation. By reading and executing the control program, the arithmetic unit 610 works in cooperation with the storage device 620 shown in Figure 1 to realize the position determination unit 611, the path determination unit 612, etc. of the arithmetic unit 610, which will be described later.

[0065] The calculation unit 610 includes a position determination unit 611 and a path determination unit 612. The calculation unit 610 creates processing data by taking into account the position of the high sound pressure area 300 from an image corresponding to the area to be decomposed or the ultrasonic irradiation area of ​​the object OB. The image displays the area to be decomposed in a plan view of the object OB. Image processing is performed when creating the processing data. For example, image processing software or AI (artificial intelligence) can be used for image processing. Specifically, image data is converted into G code as processing data. Inkscape or Gcodetools can be used as image processing software. Note that using an image is not mandatory, and the area to be decomposed may be set in the object OB.

[0066] The position determination unit 611 determines the effective operating region 302 (see Figures 2(A) and 2(B)) for disassembling the object OB from the high sound pressure region 300 formed by the disassembly device 100, and determines the arrangement of the disassembly device 100 and the object OB. At this time, the arrangement of the disassembly device 100 and the object OB is determined so that the effective operating region 302 corresponds to the target region of the object OB.

[0067] The path determination unit 612 determines the movement path of the disassembly device 100 from the positioning information of the disassembly device 100 and the object OB obtained by the position determination unit 611. The path determination unit 612 also determines the movement path based on the processing data. The movement path may be two-dimensional information including X and Y coordinates, or three-dimensional information including X, Y, and Z coordinates.

[0068] The input / output device 630 receives information for the arithmetic unit 610 to perform processing, and outputs the results of the processing performed by the arithmetic unit 610. The input / output device 630 may include various input and output devices, such as a keyboard, mouse, microphone, display, speaker, touch panel, etc. The input / output device 630 may be detachably connected or may be omitted.

[0069] The storage device 620 stores information and programs necessary for the operation of the disassembly device 100 and the stage device 500. The storage device 620 also stores various parameters and setting information for the disassembly process.

[0070] Figure 12 illustrates the movement path PA of the disassembly device 100. In Figure 12, the solid line represents the disassembly processing path PA1 of the disassembly device 100, and the dashed line represents the non-processing path PA2 of the disassembly device 100. As shown in Figure 12, in the disassembly target area 800 or the ultrasonic irradiation area of ​​the object OB, the disassembly device 100 or the object OB is scanned at low speed along the disassembly processing path PA1 by the stage device 500 while ultrasonic waves are being generated. In areas of the object OB other than the disassembly target area 800, the disassembly device 100 or the object OB is scanned at high speed along the non-processing path PA2 by the stage device 500 without generating ultrasonic waves. The scanning speed of the stage device 500 can be changed as appropriate.

[0071] The following describes an example of a method for disassembling the object OB using the disassembly device 100, with reference to Figures 11 and 13, etc. The high sound pressure region 300 of the disassembly device 100 and the target region of the object OB shown in Figure 11 are pre-stored in the memory device 620 of the control device 600.

[0072] As a preliminary step, the object OB is set on the disassembly device 100 shown in Figure 11. Specifically, the disassembly device 100 is attached to the device support member 510 of the stage device 500. The object OB is then placed in the appropriate position on the object support member 520. The disassembly device 100 and the object OB are aligned to set the initial position.

[0073] First, as shown in Figure 13, various parameters necessary for the disassembly process are input to the control device 600 (step S11). Specifically, the parameters include data such as the focal position of the disassembly device 100, the high sound pressure region 300, and the target region of the object OB. Specifically, the resin adhesive portion 203 of the object OB is used as the target region. The parameters related to the disassembly device 100 may be automatically set by selecting the frequency of the disassembly device 100, etc.

[0074] Next, the arithmetic unit 610 of the control device 600, acting as a position determination unit 611, determines the effective operating region 302 from the high sound pressure region 300 (step S12).

[0075] Next, the arithmetic unit 610, acting as a position determination unit 611, determines the arrangement of the disassembly device 100 and the object OB (step S13). The arrangement is such that the target area of ​​the object OB is located in the effective operating area 302.

[0076] Next, the arithmetic unit 610 performs image processing (step S14). Specifically, the arithmetic unit 610 creates processing data by taking into account the position of the high sound pressure region 300 from the image corresponding to the ultrasonic irradiation region of the object OB. Note that step S14 may be performed before step S12.

[0077] Next, the calculation unit 610, acting as a path determination unit 612, determines the movement path PA of the disassembly device 100 from the arrangement information between the disassembly device 100 and the object OB obtained in step S13 (step S15). At this time, the calculation unit 610, acting as a path determination unit 612, determines the movement path PA based on the processing data obtained in step S14.

[0078] Subsequently, the control device 600 operates the drive unit 501 of the stage device 500 to move the disassembly device 100 or the object OB from its initial position to the starting position of the movement path PA (step S16). At this time, the disassembly device 100 or the object OB is moved to the positional relationship obtained in step S13.

[0079] The control device 600 operates the drive unit 501 of the stage device 500 to move the disassembly device 100 or the object OB along the movement path PA (step S17).

[0080] If the movement path PA is within the area to be disassembled 800 (Y in step S18), the control device 600 performs ultrasonic irradiation and scanning (step S19). Specifically, the control device 600 operates the drive unit 501 of the stage device 500 to move the disassembly device 100 or the object OB, while operating the element control device 40 to apply voltage to the piezoelectric element 10 and generate ultrasonic waves. As a result, the disassembly device 100 disassembles the components of the target area of ​​the object OB, specifically the resin adhesive part 203, in the high sound pressure area 300.

[0081] If the movement path PA is in an area other than the disassembly target area 800 (N in step S18), the control device 600 operates the drive unit 501 of the stage device 500 to move the disassembly device 100 or the object OB to the disassembly target area 800 (step S21).

[0082] After step S19, if processing in the area to be decomposed 800 is completed (Y in step S22), check whether processing in all areas to be decomposed 800 is completed (step S23). If processing in the areas to be decomposed 800 is not completed (N in step S22), continue with the process in step S19.

[0083] When processing is completed in all areas 800 to be disassembled (Y in step S23), the control device 600 terminates the disassembly process.

[0084] If there is still a disassembly target area 800 remaining (N in step S23), the control device 600 operates the drive unit 501 of the stage device 500 to move the disassembly device 100 or the object OB to the next disassembly target area 800 (step S24), and performs the process in step S19.

[0085] (Example 6) Figure 14 shows the disassembled polypropylene (PP) board. Using the disassembly device 100, ultrasonic waves were irradiated from one side of the polypropylene board, which was the target object OB. The disassembly process was carried out in air by pressing the polypropylene board against the second surface 22 of the support member 20 to ensure close contact. The target area of ​​the target object OB to be disassembled was the interior of the polypropylene board. The element control device 40 set the input voltage to the function generator 41 to 0.3V. p-p A sine wave was generated and amplified by the power amplifier 42 with a gain of +55 dB before being applied to the piezoelectric element 10. The frequency of the piezoelectric element 10 was 1 MHz. The disassembly device 100 moved along a predetermined movement path PA set by the program, irradiating ultrasonic waves along the disassembly processing path PA1, with a movement speed of 1 mm per second during ultrasonic irradiation. As shown in Figure 14, it can be seen that the part of the polypropylene plate corresponding to the disassembly processing path PA1 has been disassembled.

[0086] [Fourth Embodiment] The object disassembly system, etc., of the fourth embodiment will be described below. Note that the object disassembly system, etc., of the fourth embodiment is a partial modification of the object disassembly system, etc., of the third embodiment, and the parts that are common to the object disassembly system, etc., of the third embodiment will not be explained.

[0087] As shown in Figure 15, the object disintegration system 400 includes a disintegration device 100, a stage device 500, and a control device 600. In this embodiment, an example is shown in which the object OB is disintegrated underwater, and only the object OB is movable in three dimensions. The disintegration device 100 is fixed to the bottom of a water tank 700 filled with water. The object disintegration system 400 irradiates the object OB with ultrasound while moving the disintegration device 100 and the object OB relative to each other in three dimensions.

[0088] The disassembly apparatus 100 is the disassembly apparatus 100 shown in the first or second embodiment. The element control device 40 of the disassembly apparatus 100 operates under the control of the control device 600.

[0089] The stage device 500 is a three-dimensional drive device for moving the object OB. The stage device 500 includes a device support member 510, an object support member 520, a telescopic arm 560, and a travel drive device 540. The telescopic arm 560, the travel drive device 540, and the trolley 525 (described later) constitute a drive device 501 that drives the stage device 500.

[0090] The device support member 510 has a fixed base 515. The disassembly device 100 is fixed on the fixed base 515 such that the support member 20 is positioned on the object OB side.

[0091] The object support member 520 includes a trolley 525, a girder 526, and a rail 522. The trolley 525 is a member that moves along the girder 526, for example, in the Y direction or in the left-right direction of the plane of the paper, and is attached to the girder 526. The trolley 525 is equipped with a gripper 527 via an extendable arm 560. The gripper 527 grips the object OB. The extendable arm 560 allows the gripper 527 and the object OB to move up and down in the Z direction or in the up-down direction of the plane of the paper. The girder 526 is a member that supports the trolley 525. The girder 526 has a pair of rail grooves 526a at both lower ends. The rail grooves 526a extend in the X direction or in the depth direction of the plane of the paper and fit the rail 522. The rail 522 is a pair of members that move the girder 526 in the X direction. The rail 522 is fixed at a position higher than the water tank 700 and the device support member 510. A pair of rail grooves 526a of the girder 526 are each provided with a travel drive device 540. This allows the girder 526 to move in the X direction.

[0092] The telescopic arm 560 moves the object OB in the Z direction under the control of the control device 600. The trolley 525 moves the object OB in the Y direction under the control of the control device 600. The travel drive device 540 moves the object OB in the X direction under the control of the control device 600. As a result, the object OB is capable of three-dimensional movement.

[0093] 〔others〕 Although the present invention has been described in reference to the embodiments described above, the present invention is not limited to the embodiments described above.

[0094] As shown in Figure 16, the decomposition device 100 may have a reflective member 80 positioned on the opposite side of the object OB from the piezoelectric element 10. In the illustrated example, the surface of the piezoelectric element 10 facing the object OB is flat, not curved. The reflective member 80 is a reflective mirror 81 with a concave surface on the object OB side. The piezoelectric element 10 may have a curved or concave surface. In this case, if the focal position of the piezoelectric element 10 and the focal position of the reflective mirror 81 are aligned, higher energy can be concentrated. The reflective member 80 is not limited to the reflective mirror 81 shown in the illustration; it may also be a piezoelectric element with a concave surface on the object OB side. In the example in Figure 16, the decomposition process is performed in a liquid such as water, and the acoustic matching layer 60 is designed to take liquid into consideration.

[0095] In the above embodiment, the support member 20 and the holder member 30 may be omitted as appropriate. In this case, a substance having a difference in acoustic impedance from the piezoelectric element 10 (for example, a liquid metal containing gallium or indium) may be sealed in the space formed by the concave surface 10a to the extent that the lens function of the piezoelectric element 10 is maintained. Alternatively, without providing a curved surface on the support member 20, a substance having a difference in acoustic impedance from the piezoelectric element 10 may be sealed in the space between the piezoelectric element 10 and the support member 20 to the extent that the lens function of the piezoelectric element 10 is maintained.

[0096] In the above embodiment, the disassembly device 100 can be used for destroying or welding the target object OB. Furthermore, even if the piezoelectric element 10 is planar and does not form a focal point 301, if it is a resin joint, the disassembly process can be performed by the strength of the resin adhesive portion 203.

[0097] In the above embodiment, the stage device 500 is shown as being driven in three dimensions, but it may also be driven in two dimensions or in one dimension, such as by rollers or a belt conveyor. Furthermore, the disassembly process may be performed with both the disassembly device 100 and the object OB fixed in place. If adjustment in the Z direction is not performed by the stage device 500, etc., a separate member for height adjustment may be provided.

[0098] In the above embodiment, the decomposition device 100 may perform the decomposition process not only in liquid but also in air.

[0099] In the above embodiment, the disassembly device 100 can be used to separate components that were bonded together with adhesive. Furthermore, the disassembly device 100 can be used to remove or easily remove components that were embedded in the adhesive.

[0100] In the above embodiment, the position and depth of the focal point 301 and the high sound pressure region 300 may be changed manually or automatically. Methods of changing them include, for example, changing the relative position of the decomposition device 100 with respect to the object OB, using or removing an acoustic lens, changing the radius of curvature of the concave surface 10a, or, if there are multiple piezoelectric elements 10, changing their arrangement, angle, and curvature.

[0101] In the above embodiment, the object disassembly system 400 may be used in combination with a monitoring device that acquires information such as images from a camera capturing the target area and lasers irradiated onto the target area, and determines whether the disassembly was performed correctly.

[0102] In the above embodiment, the setting of parameters for setting (determining) the movement path PA, setting (controlling) the operation of the piezoelectric element 10, and setting the position and depth of the high sound pressure region 300 may be done manually, automatically, or both.

[0103] The operation settings for the piezoelectric element 10 may include setting the voltage applied to the piezoelectric element 10, setting the waveform of the applied voltage, setting the frequency, etc.

[0104] Furthermore, these parameters may all be set in advance, set sequentially, or set sequentially only for specific parameters that need to be set in advance. These parameters may also be set to be automatically determined based on the disassembly device 100, the type, size, and specifications of the object OB, and other information related to the object OB.

[0105] The parameters for controlling the operation of the piezoelectric element 10 and setting the position and depth of the high sound pressure region 300 may be set by sequentially changing them manually, automatically, or both, depending on the object OB and target region, and finding the optimal settings by providing feedback on the decomposition status, and this process may be repeated according to the position. This may also be done using information from the monitoring device described above. [Explanation of Symbols]

[0106] 10...Piezoelectric element, 10a...Concave surface, 11,17...Piezoelectric component, 12,13...Electrode, 14...Adhesive layer, 20...Support member, 20a...Support surface, 30...Holder member, 40...Element control device, 50...SMA connector, 60...Acoustic matching layer, 70...Pressing member, 71...Adapter, 72...Cushioning member, 73...Fixing member, 80...Reflective member, 100...Disassembly device, 200...Joining member, 203...Resin adhesive part, 300...High sound pressure Area, 301…Focus, 302…Effective area of ​​action, 400…Object decomposition system, 500…Stage device, 501…Drive device, 510…Device support member, 520…Object support member, 600…Control device, 610…Calculation unit, 611…Position determination unit, 612…Path determination unit, 620…Memory device, 630…Input / output device, 700…Water tank, 800…Decomposition target area, CO…Central axis, OB…Object, PA…Movement path

Claims

1. A method for disassembling an object using a disassembly device that generates ultrasonic waves, The concave surface of the disassembly device is used to form a focal point on the object side, and the components of the target area of ​​the object are disassembled in a high sound pressure region including the focal point and the vicinity of the focal point. Method for disassembling an object.

2. The disassembly device includes a piezoelectric element having the concave surface on the object side. A method for disassembling an object as described in claim 1.

3. The disassembly apparatus further comprises a support member for supporting the piezoelectric element, The piezoelectric element is arranged on the first surface of the support member. The object is positioned opposite the second surface on the opposite side of the first surface, The first surface has a support surface corresponding to the surface shape of the piezoelectric element. A method for disassembling an object as described in claim 2.

4. An acoustic matching layer is placed between the interface of the decomposition device and the interface of the object to facilitate the transmission of the ultrasonic waves to the object. A method for disassembling an object as described in claim 1.

5. The disassembly device adjusts the voltage by calculating inversely from the stress generated by the piezoelectric element. A method for disassembling an object as described in claim 2.

6. The effective operating region for decomposing the object is determined from the aforementioned high sound pressure region, Based on the effective operating area, the arrangement of the disassembly device and the object is determined. Move either the disassembly device or the object to achieve the aforementioned arrangement. A method for disassembling an object as described in claim 1.

7. The movement path of the disassembly device is determined from the arrangement information of the disassembly device and the object. A method for disassembling an object as described in claim 6.

8. Processing data is created by taking into account the high sound pressure region from the image corresponding to the ultrasonic irradiation region of the object. The movement path is determined based on the processing data. A method for disassembling an object as described in claim 7.

9. The object is a joint member that includes a plurality of object members bonded together via a resin adhesive portion, The disassembly device disassembles the resin adhesive portion within the target region. A method for disassembling an object as described in claim 1.

10. The object is a joint member that includes a plurality of object members bonded together via a resin adhesive portion, The second surface contacts the surface of the nearest target member among the plurality of target members on the side of the second surface, The nearest target member is a metal member. A method for disassembling the object described in claim 3.

11. Piezoelectric element and A support member that supports the piezoelectric element, An element control device for controlling the operation of the piezoelectric element, Equipped with, The piezoelectric element is arranged on the first surface of the support member. The object is positioned opposite the second surface on the opposite side of the first surface, The first surface has a support surface corresponding to the surface shape of the piezoelectric element, The piezoelectric element has a concave surface that forms a high sound pressure region including a focal point and the vicinity of the focal point on the object side, and is fixed so as to be substantially in contact with the support surface. Decomposition equipment.

12. The piezoelectric element is fixed to the support member by adhesive. The disassembly apparatus according to claim 11.

13. The piezoelectric element has a ring-shaped piezoelectric member, The piezoelectric member is fixed to the support member by a fixing member. The disassembly apparatus according to claim 11.

14. The disassembly device according to claim 11, A stage device for moving the aforementioned disassembly device, A calculation device having a position determination unit that determines the effective operating region for disassembling an object from the high sound pressure region formed by the disassembly device and determines the arrangement of the disassembly device and the object, A decomposition system for objects equipped with the following features.

15. The stage device has a drive device for driving the stage device, The calculation device includes a path determination unit that determines the movement path of the disassembly device from the arrangement information of the disassembly device and the object obtained by the position determination unit. The object decomposition system according to claim 14.

Images