Simulation program, recording medium, and information processing device

Abstract

The present invention provides a simulation program, recording medium, and information processing device that can further improve the accuracy of analysis. [Solution] The simulation program of this disclosure causes the computer to perform a magnetic field analysis based on the current flowing through the heating coil used in high-frequency heat treatment to calculate the heat generated by the heating coil and the Lorentz force generated in the heating coil. The simulation program causes the computer to perform a thermal fluid analysis based on information about the cooling water flowing through the heating coil and the heat generated from the magnetic field analysis to calculate temperature information about the temperature of the heating coil. The computer is then instructed to perform a structural analysis based on information about the Lorentz force and the temperature information to calculate the stress applied to the heating coil and / or the deformation of the heating coil.

Description

Technical Field

[0001] The present invention relates to a simulation program, a recording medium, and an information processing apparatus.

Background Art

[0002] When manufacturing automotive parts, construction components and the like, heat treatment such as quenching is performed after part molding for the purpose of improving fatigue strength and surface wear resistance. High-frequency heat treatment is one type of heat treatment method that features capabilities for short-time heating and in-line processing, and has excellent reproducibility of heat treatment quality.

[0003] In high-frequency heat treatment, a workpiece is heated by passing a high-frequency current through a heating coil. At this time, stress is generated in the heating coil due to temperature changes and electromagnetic forces during heating, which deforms the heating coil. Although this stress is minute and the deformation is also slight, repeated high-frequency heat treatment may cause cracks to originate from the stress concentration portions, propagate, and lead to early damage and fracture.

[0004] Simulation techniques for predicting the deformation and stress of heating coils are known. By designing a heating coil using this technique, it becomes possible to design a heating coil that reduces stress and deformation, and to prevent early damage and fracture of the heating coil.

Prior Art Documents

Non-Patent Documents

[0005]

Non-Patent Document 1

Summary of Invention

Problems to be Solved by the Invention

[0006] However, the deformation analysis results of the heating coil obtained using the above-mentioned simulation technology may differ from the actual deformation results. Therefore, further improvements in simulation technology are required.

[0007] In view of the above points, the present invention aims to provide a simulation program, a recording medium, and an information processing device that can further improve the accuracy of analysis. [Means for solving the problem]

[0008] The simulation program of this disclosure causes a computer to perform a magnetic field analysis based on the current flowing through a heating coil used in high-frequency heat treatment to calculate the heat generated by the heating coil and the Lorentz force generated in the heating coil. The simulation program causes a computer to perform a thermal fluid analysis based on information about the cooling water flowing through the heating coil and the information about the heat generated from the magnetic field analysis to calculate temperature information about the temperature of the heating coil. The computer is then instructed to perform a structural analysis based on the information about the Lorentz force and the temperature information to calculate the stress applied to the heating coil and / or the deformation of the heating coil. [Effects of the Invention]

[0009] According to the present invention, a simulation program, a recording medium, and an information processing device are provided that can further improve the accuracy of analysis. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 shows an example of a heating coil according to an embodiment. [Figure 2] Figure 2 shows an example of a process performed by the simulation device according to this embodiment. [Figure 3] Figure 3 is a block diagram showing an example configuration of a simulation device according to the embodiment. [Figure 4]Figure 4 shows an example of the flow of the analysis process according to the embodiment. [Figure 5] Figure 5 shows an example of a heating coil used in the simulation according to the embodiment. [Figure 6] Figure 6 shows an example of heat generation data, which is the result of the magnetic field analysis process according to the embodiment. [Figure 7] Figure 7 is an enlarged view of region R1 in Figure 6. [Figure 8] Figure 8 shows an example of Lorentz force data, which is the result of the magnetic field analysis processing according to the embodiment. [Figure 9] Figure 9 is an enlarged view of region R2 in Figure 8. [Figure 10] Figure 10 shows an example of cooling water flow velocity data, which is the result of the thermal fluid analysis process according to the embodiment. [Figure 11] Figure 11 shows an example of heat transfer coefficient data for the inner wall of a heating coil, which is the result of the thermal fluid analysis process according to the embodiment. [Figure 12] Figure 12 shows an example of the temperature data of a heating coil, which is the result of the thermal fluid analysis process according to the embodiment. [Figure 13] Figure 13 shows an example of cooling water temperature data, which is the result of the thermal fluid analysis process according to the embodiment. [Figure 14] Figure 14 shows an example of deformation data of a heating coil, which is the result of the structural analysis process according to the embodiment. [Figure 15] Figure 15 shows an example of deformation data of a heating coil, which is the result of the structural analysis process according to the embodiment. [Figure 16] Figure 16 shows an example of von Mises stress data for a heating coil, which is the result of structural analysis processing according to the embodiment. [Figure 17] Figure 17 shows an example of von Mises stress data for a heating coil, which is the result of the structural analysis process according to the embodiment. [Modes for carrying out the invention]

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0012] <1. Introduction> Figure 1 is a diagram illustrating an example of the heating coil 1 according to the embodiment. As shown in Figure 1, the heating coil 1 according to the present embodiment includes a first coil 11 and a second coil 12. In addition, the interior of the heating coil 1 is hollow, and cooling water flows through this hollow interior. In Figure 1, the flow of the cooling water is indicated by arrows.

[0013] As shown in Figure 1, the flow of cooling water through the heating coil 1 cools the heating coil 1 and suppresses heat generation.

[0014] Accordingly, the present embodiment provides a simulation apparatus that performs a simulation in consideration of the cooling of the heating coil 1 by the cooling water.

[0015] Figure 2 is a diagram illustrating an example of processing executed by the simulation apparatus according to the embodiment. As shown in Figure 2, for example, the simulation apparatus according to the present embodiment executes a magnetic field analysis process, a thermal analysis process, a thermal fluid analysis process, and a structural analysis process. The simulation apparatus executes the magnetic field analysis process, the thermal fluid analysis process, and the structural analysis process, for example, by executing a program stored in the apparatus.

[0016] As the magnetic field analysis process, the simulation apparatus performs magnetic field analysis based on the current flowing through the heating coil 1 used for high-frequency heat treatment, and calculates heat generation of the heating coil 1 and the Lorentz force generated in the heating coil 1.

[0017] The simulation device performs thermal fluid analysis based on information about the cooling water and information about the heat generated by the heating coil 1 calculated by magnetic field analysis, and calculates temperature information (temperature in Figure 2) related to the temperature of the heating coil 1. For example, the simulation device calculates the heat transfer coefficient of the inner wall of the heating coil 1 by thermal fluid analysis based on the temperature, flow path, flow velocity, etc. of the cooling water. The simulation device calculates the temperature of the heating coil 1 during the cooling process, in other words, the temperature of the heating coil 1 through which the cooling water flows, based on the heat transfer coefficient of the inner wall of the heating coil 1, the heat generated by the heating coil 1, the thermal conductivity, specific heat, etc.

[0018] The simulation device performs a structural analysis based on the Lorentz force and temperature to calculate the stress applied to the heating coil 1 and / or the deformation of the heating coil 1. Alternatively, the simulation device may calculate the stress applied to the heating coil 1 and / or the deformation of the heating coil 1 based on the temperature of the heating coil 1 during the cooling process and the Lorentz force. In this case, the simulation device calculates information indicating the temperature of the heating coil 1 during the cooling process as temperature information related to the heating coil 1 in the thermal fluid analysis process.

[0019] As described above, the simulation device according to this embodiment can perform a simulation of the stress and / or deformation generated in the heating coil 1, taking into account the cooling of the heating coil 1 by cooling water, by performing thermal fluid analysis. As a result, the simulation device can simulate the stress and deformation generated in the heating coil 1 with higher accuracy.

[0020] In this example, the simulation device according to this embodiment is assumed to simulate the heating coil 1 shown in Figure 1. However, the heating coil simulated by the simulation device according to this embodiment is not limited to the heating coil 1 shown in Figure 1. The simulation device according to this embodiment can simulate heating coils of various shapes and / or cooling paths.

[0021] <2. Example of Simulation System Configuration> Figure 3 is a block diagram showing an example configuration of a simulation device 100 according to an embodiment. The simulation device 100 is an information processing device that performs, for example, a simulation of the stress and deformation of a heating coil 1. As shown in Figure 3, the simulation device 100 includes an input / output unit 110, a calculation unit 120, and a storage unit 130.

[0022] (I / O section 110) The input / output unit 110 accepts data input from an external source and outputs data to an external source. The input / output unit 110 may also be a communication unit that communicates with an external device (not shown). The input / output unit 110 may also have the function of connecting to a keyboard, mouse, display device, etc., and exchanging data with these devices.

[0023] (Storage unit 130) The storage unit 130 is composed of, for example, an SSD (Solid State Drive) or an HDD (Hard Disk Drive). The storage unit 130 functions as a storage means for the simulation device 100.

[0024] The memory unit 130 stores various programs that the simulation device 100 executes. Examples of these programs include analysis programs. Analysis programs may include, for example, magnetic field analysis programs, thermal fluid analysis programs, and structural analysis programs.

[0025] (Computation unit 120) The arithmetic unit 120 functions as a control unit that controls the entire simulation device 100. The arithmetic unit 120 is composed of, for example, a CPU (Central Processing Unit). The arithmetic unit 120 may also be composed of a GPU (Graphics Processing Unit), a DSP (Digital Signal Processor), an LSI (Large Scale Integration), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), and the like.

[0026] The calculation unit 120 functions as one of the units described later by executing the program stored in the storage unit 130. The calculation unit 120 shown in Figure 3 includes a magnetic field analysis unit 121, a thermal fluid analysis unit 122, and a structural analysis unit 123.

[0027] (Magnetic field analysis department 121) The magnetic field analysis unit 121 analyzes the magnetic field generated in the heating coil 1 when a high-frequency current is passed through it. Based on the magnetic field analysis results, the magnetic field analysis unit 121 generates heat generation data (e.g., heat generation density data) and Lorentz force data (e.g., Lorentz force density data) related to the heat generated in the heating coil 1.

[0028] The magnetic field analysis unit 121 passes the generated heat generation data to the thermal fluid analysis unit 122. The magnetic field analysis unit 121 also passes the generated Lorentz force data to the structural analysis unit 123.

[0029] (Thermal Fluid Analysis Department 122) The thermal fluid analysis unit 122 includes, for example, a thermal analysis unit 1221 that performs thermal analysis and a fluid analysis unit 1222 that performs fluid analysis. The thermal fluid analysis unit 122 generates thermal penetration coefficient data related to the heat transfer coefficient of the inner wall of the heating coil 1 based on the temperature of the cooling water flowing through the heating coil 1, the thermal conductivity of the heating coil 1, specific heat, etc., through thermal fluid analysis. The thermal fluid analysis unit 122 generates temperature data related to the temperature generated in the heating coil 1 through thermal analysis, based on the heat generation data analyzed by the magnetic field analysis unit 121 and the thermal penetration coefficient of the inner wall of the heating coil 1.

[0030] The thermal fluid analysis unit 122 passes the generated temperature data to the structural analysis unit 123.

[0031] (Structural Analysis Department 123) The structural analysis unit 123 performs structural analysis using Lorentz force data and temperature data to analyze the stress and deformation generated in the heating coil 1. For example, the structural analysis unit 123 calculates the stress and deformation of the heating coil 1 from the changes in thermal strain, elastic strain, plastic strain, Lorentz force, etc., generated in the heating coil 1.

[0032] The structural analysis unit 123, for example, presents the calculation results of the deformation of the heating coil 1 to the user via the input / output unit 110.

[0033] <3. Example of analysis processing> Figure 4 shows an example of the flow of the analysis process according to the embodiment. The analysis process shown in Figure 4 is performed, for example, by the simulation device 100.

[0034] As shown in Figure 4, the simulation device 100 first performs magnetic field analysis processing (step S101).

[0035] The magnetic field analysis process is performed, for example, by the magnetic field analysis unit 121 of the simulation device 100. The magnetic field analysis unit 121 analyzes the magnetic field when a high-frequency current flows through the heating coil 1, based on, for example, the shape of the heating coil 1. The magnetic field analysis unit 121 calculates information regarding the heat generation of the heating coil 1 (e.g., heat generation data) as a result of the magnetic field analysis. The magnetic field analysis unit 121 also calculates information regarding the Lorentz force generated in the heating coil 1 (e.g., Lorentz force data) as a result of the magnetic field analysis.

[0036] Next, the simulation device 100 performs thermal fluid analysis processing (step S102).

[0037] The thermal fluid analysis process is performed, for example, by the thermal fluid analysis unit 122 of the simulation device 100. The thermal fluid analysis unit 122 calculates the flow velocity of the cooling water and the heat transfer coefficient of the inner wall of the heating coil 1 based on, for example, the flow path of the cooling water in the heating coil 1, the temperature of the cooling water, and the amount of cooling water flowing into and out of the heating coil 1. As a result of the thermal fluid analysis, the thermal fluid analysis unit 122 calculates information regarding the heat transfer coefficient of the inner wall of the heating coil 1 (for example, first heat transfer coefficient data).

[0038] Furthermore, the thermal fluid analysis unit 122 calculates the temperature of the heating coil 1 and the temperature of the cooling water during the cooling process, based on, for example, information on the heat generation, thermal conductivity, and specific heat of the heating coil 1 calculated by the magnetic field analysis process, information on the thermal conductivity of the cooling water, and the heat transfer coefficient of the inner wall of the heating coil 1. The heat transfer coefficient of the inner wall of the heating coil 1 may be calculated based on, for example, the material and shape of the heating coil 1.

[0039] The thermal fluid analysis unit 122 calculates, for example, the temperature of the heating coil 1 during the process in which the heat generated in the heating coil 1 by the magnetic field is cooled by the cooling water. The thermal fluid analysis unit 122 also calculates the temperature of the cooling water during the process of cooling the heat generated in the heating coil 1.

[0040] The thermal fluid analysis unit 122 calculates the temperature generated in the heating coil 1 based on the calculated temperature of the heating coil 1, etc. The thermal fluid analysis unit 122 passes information regarding the calculated temperature (e.g., temperature data) to the structural analysis unit 123.

[0041] In this example, the thermal fluid analysis unit 122 performs fluid analysis and thermal analysis separately, but it is also possible to perform the fluid analysis and thermal analysis together. In this case, the thermal fluid analysis unit 122 calculates the temperature generated in the heating coil 1 based on information about the cooling water (e.g., information about the flow path, temperature, and inflow / outflow rates, etc.) and information about the heating coil 1 (e.g., information about heat generation data, thermal conductivity, specific heat, and heat transfer coefficient, etc.).

[0042] Next, the simulation device 100 performs structural analysis processing (step S103).

[0043] Structural analysis processing is performed, for example, in the structural analysis unit 123 of the simulation device 100. The structural analysis unit 123 calculates the stress and deformation generated in the heating coil 1 based on the temperature calculated by the thermal fluid processing and the Lorentz force calculated by the magnetic field analysis processing as part of the structural analysis.

[0044] Furthermore, the structural analysis unit 123 determines stress and deformation from thermal strain, elastic strain, plastic strain, Lorentz force, etc. This allows the structural analysis unit 123 to predict stress and deformation at any point in the heating coil 1. Note that the amount of deformation and stress values ​​will vary depending, for example, on the material and shape of the heating coil 1.

[0045] Next, the simulation device 100 determines whether or not it has performed the desired number of processes (step S104). For example, the simulation device 100 determines whether or not it has repeated the processes in steps S101 to S103 a number of times specified by the user.

[0046] If the desired number of processes have not been performed (step S104; No), the simulation device 100 returns to step S101 and performs the magnetic field analysis process.

[0047] On the other hand, if the desired number of processing steps have been performed (step S104; Yes), the simulation device 100 presents the results of the processing steps S101 to S103 to the user (step S105) and terminates the processing.

[0048] For example, while heating is being performed by high-frequency heat treatment, current continues to flow through the heating coil 1. The simulation device 100 can predict the stress and deformation that occur while current is flowing through the heating coil 1 by repeatedly executing the processes in steps S101 to S103.

[0049] Furthermore, the heating coil 1 can be used for repeated high-frequency heat treatment. For example, the simulation device 100 can predict the stress and deformation applied to the heating coil 1 when used for repeated high-frequency heat treatment by performing the repeated steps S101 to S103.

[0050] In this example, the simulation device 100 terminates the analysis process when it has performed a predetermined number of operations, for example, by the user. However, the termination condition for the analysis process is not limited to the number of repetitions of the operation.

[0051] For example, the simulation device 100 may repeatedly execute steps S101 to S103 until the stress value calculated in the structural analysis process exceeds the elastic range or an arbitrary value.

[0052] <4. Simulation Example> Next, an example of a simulation performed using the simulation apparatus 100 according to this embodiment will be described using Figures 5 to 17.

[0053] This section describes the case where the simulation device 100 performs a simulation of the heating coil 1 shown in Figure 5. Figure 5 is a diagram showing an example of the heating coil 1 used in the simulation according to this embodiment. Note that the shape of the heating coil 1 shown in Figure 5 is the same as that in Figure 1.

[0054] Furthermore, the heating coil 1 used in the simulation has a width of 80 mm, a height of 62 mm, and a length of 130.5 mm. Heating coil 1 is a 2-turn coil, and the distance between the first coil 11 and the second coil 12 (distance between turns) is 8.0 mm. The diameter (outer diameter of turns) of the first coil 11 and the second coil 12 is 8.0 mm, and the thickness is 1.0 mm.

[0055] Furthermore, although current flows through the heating coil 1 in the direction indicated by the arrow in Figure 5, the direction may differ between the first coil 11 and the second coil 12.

[0056] First, the simulation device 100 performs a magnetic field analysis of the heating coil 1 shown in Figure 5.

[0057] The results of the magnetic field analysis processing according to this embodiment will be explained using Figures 6 to 9. Figure 6 is a diagram showing an example of heat generation data, which is the result of the magnetic field analysis processing according to this embodiment. Figure 7 is a magnified view of region R1 in Figure 6. Figure 8 is a diagram showing an example of Lorentz force data, which is the result of the magnetic field analysis processing according to this embodiment. Figure 9 is a magnified view of region R2 in Figure 8.

[0058] Here, the simulation device 100 performs a magnetic field analysis of the heating coil 1 (see Figure 5), which is a two-turn coil. For example, the simulation device 100 performs the magnetic field analysis using the following conditions: the material of the heating coil 1 is copper or a copper alloy, the frequency of the high-frequency current flowing through the heating coil 1 is 25 kHz, and the heating time is 2.0 seconds.

[0059] Based on the magnetic field analysis, the simulation device 100 generates heat generation data, for example, as shown in Figures 6 and 7. This heat generation data indicates the heat generated by the heating coil 1 (coil heating) when a high-frequency current is passed through it.

[0060] Furthermore, based on the magnetic field analysis, the simulation device 100 generates Lorentz force data, for example, as shown in Figures 8 and 9. This Lorentz force data indicates the Lorentz force generated in the heating coil 1 when a high-frequency current is passed through it. As shown in Figure 9, when current flows in the same direction in the first coil 11 and the second coil 12 of the heating coil 1, Lorentz forces are generated in directions opposite to each other.

[0061] Next, the simulation device 100 performs a thermal fluid analysis of the heating coil 1 shown in Figure 5.

[0062] The results of the thermal fluid analysis process according to this embodiment will be explained using Figures 10 to 13. Figure 10 is a diagram showing an example of cooling water flow velocity data, which is the result of the thermal fluid analysis process according to this embodiment. Figure 11 is a diagram showing an example of heat transfer coefficient data of the inner wall of the heating coil 1, which is the result of the thermal fluid analysis process according to this embodiment. Figure 12 is a diagram showing an example of temperature data of the heating coil 1, which is the result of the thermal fluid analysis process according to this embodiment. Figure 13 is a diagram showing an example of cooling water temperature data, which is the result of the thermal fluid analysis process according to this embodiment.

[0063] Here, the simulation device 100 performs a thermal fluid analysis of a heating coil 1 (see Figure 5), which is a two-turn coil. For example, similar to the magnetic field analysis, the material of the heating coil 1 is assumed to be copper or a copper alloy. The simulation device 100 also calculates the temperature of the heating coil 1 using the heat generation density (heat generation data) obtained from the magnetic field analysis. The heating time in this simulation is assumed to be 2.0 seconds. The flow rate of the cooling water is assumed to be 10 L / min (flow velocity 5.9 m / s), and the temperature of the cooling water (cooling water temperature) is assumed to be 20°C. The simulation device 100 performs the thermal fluid analysis under these thermal fluid analysis conditions.

[0064] As a result of the thermal fluid analysis, the simulation device 100 generates cooling water velocity data, for example, as shown in Figure 10. As shown in Figure 10, the thermal fluid analysis reveals that the cooling water velocity is slow and turbulence is occurring at the corners of the heating coil 1 (for example, the areas indicated by regions R11 and R12). Also, the cooling water velocity is fast at the locations indicated by the arrows in Figure 10.

[0065] Furthermore, as a result of the thermal fluid analysis, the simulation device 100 generates heat transfer coefficient data for the inner wall of the heating coil 1, for example, as shown in Figure 11. As shown in Figures 10 and 11, the heat transfer coefficient is higher where the cooling water flow velocity is high.

[0066] Furthermore, as a result of the thermal fluid analysis, the simulation device 100 generates temperature data for the heating coil 1 (hereinafter also simply referred to as coil temperature data), for example, as shown in Figure 12. In the example in Figure 12, the temperature distribution of the heating coil 1 at the end of heating is shown, and the maximum temperature of the heating coil 1 is 126.4°C.

[0067] Furthermore, as a result of the thermal fluid analysis, the simulation device 100 generates cooling water temperature data (hereinafter also simply referred to as water temperature data), such as that shown in Figure 13. In the example in Figure 13, the temperature distribution of the cooling water at the end of heating is shown. Here, the inlet water temperature (Tin) of the cooling water is 20.0°C, the outlet water temperature (Tout) is 24.6°C, and the temperature difference (ΔT) is 4.6°C (ΔT = Tout - Tin = 4.6°C).

[0068] Next, the simulation device 100 performs a structural analysis of the heating coil 1 shown in Figure 5.

[0069] Figures 14 to 17 will be used to explain the results of the magnetic field analysis processing according to this embodiment. Figures 14 and 15 show examples of deformation data of the heating coil 1, which are the results of the structural analysis processing according to this embodiment. Figure 14 shows an example of deformation data of the heating coil 1 in an oblique view, and Figure 15 shows an example of deformation data on the side of the heating coil 1. Figures 16 and 17 show examples of von Mises stress data of the heating coil 1, which are the results of the structural analysis processing according to this embodiment. Figure 16 shows an example of von Mises stress data of the heating coil 1 in an oblique view, and Figure 17 shows an example of von Mises stress data on the side of the heating coil 1.

[0070] Here, the simulation device 100 performs a structural analysis of a heating coil 1 (see Figure 5), which is a two-turn coil. For example, similar to the magnetic field analysis, the material of the heating coil 1 is assumed to be copper or a copper alloy. The distance between the first coil 11 and the second coil 12 of the heating coil 1 (distance between turns) is 8.0 mm. The diameter (outer diameter of turns) of the first coil 11 and the second coil 12 is 8.0 mm, and the thickness is 1.0 mm.

[0071] Under these analysis conditions, the simulation device 100 performs structural analysis using the Lorentz force (Lorentz force data) obtained from magnetic field analysis and the temperature distribution of the heating coil 1 (coil temperature data) obtained from thermal fluid analysis as the loads applied to the heating coil 1.

[0072] As a result of the structural analysis, the simulation device 100 generates deformation data for the heating coil 1, for example, as shown in Figures 14 and 15. Note that in Figures 14 and 15, the deformation amount is shown magnified 20 times. As shown in Figures 14 and 15, the displacement of the upper turn coil (first coil 11) of the heating coil 1 is 0.12 mm. In addition, the distance between turns is 7.76 mm, and the simulation result shows that the distance between turns narrows.

[0073] Furthermore, based on the structural analysis, the simulation device 100 generates von Mises stress distribution data for the heating coil 1, as shown in Figures 16 and 17. Note that in Figures 16 and 17, the deformation is magnified 20 times. The maximum stress applied to the heating coil 1 is 74 MPa.

[0074] The simulation results shown here are just examples, and the simulation device 100 may calculate simulation results other than those shown here. For example, the simulation device 100 may calculate information indicating temperature (e.g., temperature data), information indicating deformation amount and stress value, etc.

[0075] As described above, the simulation device 100 according to this embodiment predicts the temperature of the heating coil 1 by performing a thermal fluid analysis using information on the heat generated by the heating coil 1 and the cooling water flowing through the heating coil 1. By performing a thermal fluid analysis in this way, the simulation device 100 can predict the temperature of the heating coil 1 with higher accuracy.

[0076] Furthermore, the simulation device 100 can predict the stress generated in the heating coil 1 and the deformation of the heating coil 1 with even greater accuracy by performing structural analysis based on the temperature of the heating coil 1, which has been predicted with high accuracy.

[0077] <5. Summary> The embodiments described above are examples that embody the present invention, and the present invention is not limited to these embodiments. For example, the present invention also includes the addition, deletion, or modification of some components in the embodiments described above.

[0078] The present invention includes the following embodiments. (1) A step of performing a magnetic field analysis based on the current flowing through the heating coil used for high-frequency induction hardening to calculate the heat generated by the heating coil and the Lorentz force generated in the heating coil, A step of calculating temperature information regarding the temperature of the heating coil by performing a thermal fluid analysis based on information regarding the cooling water flowing through the heating coil and the information regarding the heat generation calculated from the magnetic field analysis, A step of performing a structural analysis based on the Lorentz force information and the temperature information to calculate the stress applied to the heating coil and / or the deformation of the heating coil, A simulation program that causes a computer to execute a simulation. (2) The simulation program according to (1), wherein the computer performs the step of calculating the stress and / or deformation of the heating coil based on at least one of the changes in thermal strain, elastic strain, plastic strain, and Lorentz force. (3) The simulation program according to (1) or (2), wherein the temperature information is information indicating the temperature of the heating coil during the cooling process by the cooling water. (4) A simulation program according to any one of (1) to (3) that causes a computer to perform the step of calculating the temperature of the heating coil during the cooling process by the cooling water, according to the heat generated by the heating coil, the temperature of the cooling water, the flow path, the flow velocity, and the heat transfer coefficient of the inner wall of the heating coil. (5) On the computer, A procedure for performing a magnetic field analysis based on the current flowing through a heating coil used in high-frequency heat treatment to calculate the heat generated by the heating coil and the Lorentz force generated in the heating coil, A procedure for calculating temperature information relating to the temperature of the heating coil by performing a thermal fluid analysis based on information relating to the cooling water flowing through the heating coil and the information relating to the heat generation calculated from the magnetic field analysis, A procedure for performing a structural analysis based on the Lorentz force information and the temperature information to calculate the stress applied to the heating coil and / or the deformation of the heating coil, A computer-readable recording medium containing a program to execute a program. (6) Based on the current flowing through the heating coil used in high-frequency induction hardening, a magnetic field analysis is performed to calculate the heat generated by the heating coil and the Lorentz force generated in the heating coil. Based on information regarding the cooling water flowing through the heating coil and the information regarding the heat generation calculated from the magnetic field analysis, a thermal fluid analysis is performed to calculate temperature information regarding the temperature of the heating coil. A calculation unit performs a structural analysis based on the Lorentz force information and the temperature information to calculate the stress applied to the heating coil and / or the deformation of the heating coil. An information processing device equipped with the following features. [Explanation of Symbols]

[0079] 1. Heating coil 100 Simulation devices 110 Input / output section 120 Arithmetic section 121 Magnetic Field Analysis Department 122 Thermofluid Analysis Department 123 Structural Analysis Department 130 Storage section

Claims

1. A step of performing a magnetic field analysis based on the current flowing through the heating coil used for high-frequency induction hardening to calculate the heat generated by the heating coil and the Lorentz force generated in the heating coil, A step of calculating temperature information regarding the temperature of the heating coil by performing a thermal fluid analysis based on information regarding the cooling water flowing through the heating coil and the information regarding the heat generation calculated from the magnetic field analysis, A step of performing a structural analysis based on the Lorentz force information and the temperature information to calculate the stress applied to the heating coil and / or the deformation of the heating coil, A simulation program that causes a computer to execute a simulation.

2. The simulation program according to claim 1, wherein the computer is instructed to perform the step of calculating the stress and / or deformation of the heating coil based on at least one of the change in thermal strain, elastic strain, plastic strain, and Lorentz force.

3. The simulation program according to claim 1, wherein the temperature information is information indicating the temperature of the heating coil during the cooling process by the cooling water.

4. The simulation program according to claim 1, which causes a computer to perform the step of calculating the temperature of the heating coil during the cooling process by the cooling water, according to the heat generated by the heating coil, the temperature of the cooling water, the flow path, the flow velocity, and the heat transfer coefficient of the inner wall of the heating coil.

5. On the computer, A procedure for performing a magnetic field analysis based on the current flowing through a heating coil used in high-frequency heat treatment to calculate the heat generated by the heating coil and the Lorentz force generated in the heating coil, A procedure for calculating temperature information relating to the temperature of the heating coil by performing a thermal fluid analysis based on information relating to the cooling water flowing through the heating coil and the information relating to the heat generation calculated from the magnetic field analysis, A procedure for performing a structural analysis based on the Lorentz force information and the temperature information to calculate the stress applied to the heating coil and / or the deformation of the heating coil, A computer-readable recording medium containing a program to execute a program.

6. Based on the current flowing through the heating coil used in high-frequency induction hardening, a magnetic field analysis is performed to calculate the heat generated by the heating coil and the Lorentz force generated in the heating coil. Based on information regarding the cooling water flowing through the heating coil and the information regarding the heat generation calculated from the magnetic field analysis, a thermal fluid analysis is performed to calculate temperature information regarding the temperature of the heating coil. A calculation unit performs a structural analysis based on the Lorentz force information and the temperature information to calculate the stress applied to the heating coil and / or the deformation of the heating coil. An information processing device equipped with the following features.

Images