Film winding body, method for manufacturing a film winding body, and method for manufacturing a connecting structure

Abstract

The present invention provides a film winding body that can suppress film lifting, a method for manufacturing a film winding body, and a method for manufacturing a connecting structure. [Solution] The film winding body comprises a long first film 21, a plurality of individual pieces 10A to 10G made of connecting film provided at intervals of 0.1 mm to 1.0 mm in the longitudinal direction of the first film 21, and a second film covering the individual pieces 10A to 10G. The first film 21, the connecting film, and the second film are laminated in this order and wound together to form the structure.

Description

Technical Field

[0001] The present technology relates to a film roll body around which a connection film such as an anisotropic conductive film (ACF: Anisotropic Conductive Film), a conductive film, and an adhesive film (NCF: Non Conductive Film) is wound, a method for manufacturing the film roll body, and a method for manufacturing a connection structure.

Background Art

[0002] Patent Document 1 proposes, for example, performing connection using individual pieces obtained by processing a connection film into a predetermined shape in conformity with a substrate shape, a terminal array, or the like. For example, some camera modules have a recess at the central portion of, for example, a ceramic substrate for housing an image sensor, and a terminal array formed on the peripheral edge of the recess. In this case, for example, an individual piece of a predetermined shape that avoids the central recess is installed.

[0003] The individual pieces of the connection film are, for example, arranged in the longitudinal direction of a long base film, further covered with a cover film, and wound around a reel in a state of being sandwiched between the base film and the cover film. However, since there are gaps between the individual pieces sandwiched between the base film and the cover film, for example, in a guide roll of equipment such as a rewinder, film lifting in which the base film or the cover film floats may occur.

[0004] FIG. 12 is a diagram for explaining film lifting, where FIG. 12(A) shows a case where the cover film side is guided by a guide roll, and FIG. 12(B) shows a case where the cover film is pushed in. As shown in FIG. 12(A) and FIG. 12(B), when a film structure in which an individual piece 100 is arranged between a base film 101 and a cover film 102 is conveyed and the cover film 102 side is guided by a guide roll 103, the cover film 102 in the void portion 104 where the individual piece 100 is not present may be pushed in by the thickness of the individual piece 100. In this case, the cover film 102 may peel off from the individual piece 100 or the like, and film lifting may occur.

[0005] Furthermore, in the laminated section within the reel around which the film is wound, the base film or cover film in areas where no individual pieces are present may be pressed in by the thickness of the individual pieces. For example, when unwinding individual pieces from the reel, film lifting may occur. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2020-198422 [Overview of the project] [Problems that the invention aims to solve]

[0007] This technology was proposed in view of the conventional situation described above, and provides a film winding body that can suppress film lifting, a method for manufacturing the film winding body, and a method for manufacturing a connecting structure. [Means for solving the problem]

[0008] As a result of diligent research, the inventors have discovered that the above objective can be achieved by the following film winding assembly, method for manufacturing the film winding assembly, and method for manufacturing the connecting structure, and have completed this technology.

[0009] [1] The first long film, Multiple pieces are provided in the longitudinal direction of the first film at intervals of 0.1 mm to 1.0 mm, and each piece is made of a connecting film. A second film covering the aforementioned individual piece and A film winding body comprising the first film, the connecting film, and the second film, which are laminated and wound in this order. [2] The film winding body according to [1], wherein a plurality of the aforementioned pieces are provided in the longitudinal direction of the first film at intervals of 0.1 mm or more and 0.5 mm or less. [3] The film winding body according to [1] or [2], wherein the distance between the short end of the first film and the individual piece is 0.1 mm or more. [4] The first film is further provided with dummy films between its longitudinal segments, The film winding body according to [1], wherein the distance between the individual pieces and the dummy film is 0.1 mm or more and 1 mm or less. [5] The film winding body according to [4], wherein the length of the dummy film in the longitudinal direction of the first film is 0.1 mm or more. [6] The film winding body according to [4] or [5], wherein the dummy film is composed of the same binder as the connecting film. [7] The aforementioned piece has an opening, The film winding body according to any one of the following [1] to [3], wherein the first film has a through hole in the opening, and the shape of the through hole is 0.1 mm or more smaller than the shape of the opening. [8] The first long film, Multiple pieces are provided in the longitudinal direction of the first film at intervals of 0.1 mm to 1 mm, and each piece is made of a connecting film. A second film covering the aforementioned individual piece and A method for manufacturing a film winding body, comprising winding a film structure in which the first film, the connecting film, and the second film are laminated in this order onto a winding core. [9] The first long film, Multiple pieces are provided in the longitudinal direction of the first film at intervals of 0.1 mm to 1 mm, and each piece is made of a connecting film. A second film covering the aforementioned individual piece and The film winding assembly comprises the first film, the connecting film, and the second film, which are laminated and wound in this order, from which the individual pieces are attached to the substrate. A method for manufacturing a connection structure, the method comprising mounting an electronic component on the individual piece, and electrically connecting the terminal array of the substrate and the terminal array of the electronic component via the individual piece. Advantageous Effects of the Invention

[0010] According to the present technology, film lifting can be suppressed. Brief Description of the Drawings

[0011] [Figure 1] FIG. 1 is a plan view illustrating an example of individual pieces formed on a first film. [Figure 2] FIG. 2 is a plan view for explaining a first example of the arrangement of individual pieces with respect to the first film of a film structure. [Figure 3] FIG. 3 is a perspective view schematically illustrating a film roll body. [Figure 4] FIG. 4(A) is a plan view for explaining an example of a film structure in which individual pieces each having an opening where the first film is exposed are arranged, and FIG. 4(B) is a partial cross-sectional view schematically illustrating a laminated section cut along line f1-f1' in the film roll body obtained by winding the film structure shown in FIG. 4(A). [Figure 5] FIG. 5(A) is a plan view for explaining an example of a film structure in which individual pieces each having an opening penetrating through the first film are arranged, and FIG. 5(B) is a partial cross-sectional view schematically illustrating a laminated section cut along line f2-f2' in the film roll body obtained by winding the film structure shown in FIG. 5(A). [Figure 6] FIG. 6 is a plan view for explaining a second example of the arrangement of individual pieces with respect to the first film of a film structure. [Figure 7] FIG. 7 is a plan view for explaining a third example of the arrangement of individual pieces with respect to the first film of a film structure. [Figure 8] FIG. 8 is a plan view for explaining a fourth example of the arrangement of individual pieces with respect to the first film of a film structure. [Figure 9] FIG. 9 is a plan view for explaining a fifth example of the arrangement of individual pieces with respect to the first film of a film structure. [Figure 10] Figure 10 is a plan view illustrating a sixth example of the arrangement of individual pieces relative to the first film of the film structure. [Figure 11] Figure 11(A) is a perspective view showing an example of a circuit board with components mounted on it, and Figure 11(B) is a schematic perspective view showing individual pieces attached to a circuit board with components mounted on it. [Figure 12] Figure 12 is a diagram illustrating film lifting; Figure 12(A) shows the case where the cover film is guided by a guide roll, and Figure 12(B) shows the case where the cover film is pressed down. [Modes for carrying out the invention]

[0012] The embodiments of this technology will be described in detail below with reference to the drawings, in the following order. 1. Film winding unit 2. Method for manufacturing a film winding assembly 3. Method for manufacturing the connecting structure 4. First experimental example 5. Second experimental example

[0013] <1. Film winding device> A film winding body according to one embodiment of this technology comprises a long first film, a plurality of individual pieces (hereinafter also referred to as "individual pieces") made of connecting film and provided at predetermined intervals in the longitudinal direction of the first film, and a second film covering the individual pieces, and is constructed by laminating the first film, connecting film and second film in this order and winding them.

[0014] By providing multiple individual pieces at intervals of 0.1 mm to 1 mm in the longitudinal direction of the first film, it is possible to prevent the first or second film from being pressed between the individual pieces by the thickness of the individual pieces, for example, in the guide roll of equipment such as a rewinding machine. Also, for example, it is possible to prevent the first or second film from being pressed between the individual pieces by the thickness of the individual pieces in the laminated section within a reel on which the film is wound. This makes it possible to suppress the occurrence of film lifting.

[0015] The first and second films are, for example, called a base film and a cover film, respectively, and support a plurality of individual pieces. Examples of the first and second films include PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), and PTFE (Polytetrafluoroethylene). Furthermore, it is preferable to use first and second films in which at least the surface facing the individual pieces has been peeled off with, for example, a silicone resin.

[0016] The thicknesses of the first and second films are not particularly limited. From the viewpoint of peelability, the lower limit of the thickness of the first and second films may be, for example, 5 μm or more, preferably 10 μm or more, and more preferably 20 μm or more. The upper limit of the thickness of the base film is preferably 200 μm or less, more preferably 100 μm or less, and even more preferably 75 μm or less, and may be 50 μm or less, because if it is too thick, there is a concern that excessive pressure will be applied to the connecting film. Furthermore, the first film may be thicker than the second film.

[0017] Furthermore, the widths of the first and second films are not particularly limited. The lower limit of the widths of the first and second films is not particularly limited from the standpoint of winding, but as an example, it should be 0.5 mm or more, preferably 1 mm or more, more preferably 2 mm or more, and even more preferably 4 mm or more. The upper limit of the widths of the first and second films is preferably 500 mm or less, more preferably 250 mm or less, and even more preferably 120 mm or less, because if they are too large, there is a concern that they will be difficult to carry and handle.

[0018] There are no particular restrictions on the connecting film, and examples include anisotropic conductive film (ACF), conductive film containing conductive particles in the adhesive, adhesive film (NCF), and solder-containing film containing solder particles. There are also no particular restrictions on the curing type of the binder of the connecting film, and examples include thermosetting type, photocuring type, and photothermal combined curing type. For example, the polymerization initiator may be a known anionic curing agent or a cationic curing agent. Also, for example, the curable resin may be an epoxy resin. Furthermore, the connecting film may be a hot-melt type using a thermoplastic resin.

[0019] The following explanation will use a thermal radical polymerization type curable resin containing a film-forming resin, an elastomer, a (meth)acrylic monomer, a polymerization initiator, and a silane coupling agent as a specific example of a binder. Note that (meth)acrylic monomer includes both acrylic monomer and methacrylic monomer.

[0020] There are no particular restrictions on the film-forming resin, and examples include phenoxy resin, unsaturated polyester resin, saturated polyester resin, urethane resin, butadiene resin, polyimide resin, polyamide resin, and polyolefin resin. The film-forming resin may be used alone or in combination of two or more types. Among these, phenoxy resin is particularly preferred in terms of film-forming properties, processability, and connection reliability. Phenoxy resin is a resin synthesized from bisphenol A and epichlorohydrin, and may be synthesized as appropriate or commercially available. There are no particular restrictions on the content of the film-forming resin, but for example, 10% to 60% by mass is preferred.

[0021] There are no particular restrictions on the elastomer used; examples include polyurethane resin (polyurethane-based elastomer), acrylic rubber, silicone rubber, and butadiene rubber.

[0022] There are no particular restrictions on the (meth)acrylic monomer; for example, it may be a monofunctional (meth)acrylic monomer or a bifunctional or polyfunctional (meth)acrylic monomer. From the viewpoint of stress relaxation of the polymer, it is preferable that 80% by mass or more of the (meth)acrylic monomer in the insulating binder is a monofunctional (meth)acrylic monomer.

[0023] Furthermore, from the viewpoint of adhesion, the monofunctional (meth)acrylic monomer preferably contains a carboxylic acid. The molecular weight of the monofunctional (meth)acrylic monomer containing a carboxylic acid is preferably 100 to 500, and more preferably 200 to 350. The content of the monofunctional (meth)acrylic monomer containing a carboxylic acid in the insulating binder is preferably 3% to 20% by mass, and more preferably 5% to 10% by mass.

[0024] The polymerization initiator is not particularly limited as long as it can cure the (meth)acrylic monomer at a predetermined temperature during thermocompression bonding, and examples include organic peroxides. Examples of organic peroxides include lauroyl peroxide, butyl peroxide, benzyl peroxide, dilauroyl peroxide, dibutyl peroxide, peroxydicarbonate, and benzoyl peroxide. These may be used individually or in combination of two or more. The content of the polymerization initiator in the insulating binder is not particularly limited, but is preferably, for example, 0.5% to 15% by mass.

[0025] There are no particular restrictions on the silane coupling agent, and examples include epoxy-based silane coupling agents, acrylic-based silane coupling agents, thiol-based silane coupling agents, and amine-based silane coupling agents. There are no particular restrictions on the content of the silane coupling agent in the insulating binder, but it is preferably, for example, 0.1% to 5.0% by mass.

[0026] When the binder of the connecting film contains conductive particles such as metal particles, resin core metal-coated particles, or solder particles, each piece may have a region containing conductive particles and a region not containing conductive particles. Furthermore, each piece may be a single layer or laminated in multiple layers. In the case of a configuration of two or more layers, it may be a configuration of two or more layers containing conductive particles and two or more layers not containing conductive particles, or two or more layers not containing conductive particles.

[0027] The thickness of each piece is not particularly limited. If it is too thin, the base material is easily damaged during processing, so the lower limit of the thickness of each piece is preferably 1 μm or more, more preferably 3 μm or more, and even more preferably 4 μm or more. If it is too thick, it becomes difficult to remove the window frame portion during processing, so the upper limit of the thickness of each piece is preferably 50 μm or less, more preferably 20 μm or less, and even more preferably 10 μm or less.

[0028] The thickness of each piece can be measured using a known micrometer or digital thickness gauge (e.g., with a minimum display of 0.0001 mm). However, if conductive particles are present, and the thickness of the piece is thinner than the particle diameter of the conductive particles, a contact-type thickness gauge is unsuitable, and it is preferable to use a laser displacement meter (e.g., a spectral interference displacement type). Here, the thickness of the piece refers only to the thickness of the binder resin layer and does not include the particle diameter of the conductive particles.

[0029] The longitudinal dimension of each piece is preferably 0.1 mm or more, more preferably 0.5 mm or more, even more preferably 1.0 mm or more, preferably 100 mm or less, more preferably 30 mm or less, and even more preferably 10 mm or less. The short-side dimension of each piece is preferably 0.1 mm or more, more preferably 0.5 mm or more, even more preferably 1.0 mm or more, preferably 100 mm or less, more preferably 30 mm or less, and even more preferably 10 mm or less.

[0030] The pitch of the individual pieces repeatedly arranged in the longitudinal direction of the first film is preferably 0.2 mm or more, more preferably 0.5 mm or more, even more preferably 1.0 mm or more, preferably 101 mm or less, more preferably 30 mm or less, and even more preferably 10 mm or less. The gaps between the individual pieces arranged in the longitudinal direction of the first film are preferably 0.1 mm or more, more preferably 0.2 mm or more, even more preferably 0.3 mm or more, preferably 1.0 mm or less, more preferably 0.8 mm or less, and even more preferably 0.6 mm or less.

[0031] The shape of the individual pieces is not particularly limited and may be, for example, rectangular, curved, circular, polygonal (hexagonal, octagonal, dodecagonal, etc.), U-shaped, or curved (U-shape, C-shape, cylindrical, etc.). The polygonal shapes may be regular polygons. Furthermore, the individual pieces may be combinations of different shapes. Also, the shape of the individual pieces may be a mixture of straight lines and curves. Furthermore, the shape of the individual pieces may be the same as the shape of the mounting surface of the electronic component.

[0032] Furthermore, the corners of the individual pieces may be chamfered. Alternatively, the individual pieces may have a partially missing shape. For example, the corners of a rectangle may be missing, making the individual piece a cross shape or similar. For example, if the unit area in which individual pieces are repeatedly arranged along the longitudinal direction of a long first film is rectangular, the corners of the rectangular connecting film may be chamfered in a straight line to create non-adhesive parts, and the individual pieces that are adhesive parts may be octagonal. Alternatively, for example, each corner of a square or rectangular connecting film can be chamfered in a straight line to create an octagon, or the corners of a square or rectangular connecting film can be missing to create a cross shape. This allows the individual pieces to be octagonal or cross-shaped.

[0033] Furthermore, chamfering and cutting processes are not limited to straight lines; they may also be curved or a mixture of straight and curved shapes. Octagonal and cross-shaped pieces are just examples; only a portion of the piece may be chamfered or cut. The piece may also have an opening where a portion of the surface has been removed (extracted). Again, the shape of the piece is not limited to straight lines; it may be curved or a mixture of straight and curved shapes. In this case, the film structure may have only the connecting film removed, or both the connecting film and the base material removed. This helps prevent contamination by avoiding unnecessary contact of resin with other parts when assembling together. The more precise and smaller the piece, the more preferable it is to have a chamfered or cut (extracted) shape. The piece may also be a printed shape.

[0034] Figure 1 is a plan view showing an example of an individual piece formed on a first film. As shown in Figure 1, the individual piece 10 has, for example, an opening 11 that surrounds a component on a substrate on which a component is mounted. The opening 11 may be formed by removing the connecting film and the first film 21 by a full cut, and a through hole 21A may be formed in the first film 21. Alternatively, the opening 11 may be formed by removing the connecting film by a half cut, exposing the first film 21.

[0035] When a through-hole 21A is formed in the first film 21, it is preferable that the size of the through-hole 21A is 0.1 mm or more smaller than the size of the opening 11. That is, it is preferable that the exposed distance D of the first film 21 from the edge of the opening 11 to the through-hole 21A of the first film 21 is 0.1 mm or more. Furthermore, the upper limit of the distance D is preferably 1.0 mm or less, more preferably 0.5 mm or less, and even more preferably 0.3 mm or less. Because the first film 21 has a through-hole 21A, for example, individual pieces 10 can be laminated by aligning a component with the through-hole 21A.

[0036] By removing 0.1 mm or more of the connecting film around the through-hole 21A of the first film 21, and exposing 0.1 mm or more of the first film 21 on the inside of the opening 11, for example, it is possible to suppress the resin of the connecting film of the lower layer individual pieces from being pushed out and overflowing from the through-hole 21A, and the connecting film of the opening 11 from coming into contact with the second film and becoming fixed between the layers.

[0037] Figure 2 is a plan view illustrating a first example of the arrangement of individual pieces in a film structure relative to a first film. As shown in Figure 2, the film structure shown as the first example comprises a long first film 21 and a plurality of individual pieces 10A to 10G made of connecting film, which are provided at predetermined intervals in the longitudinal direction of the first film 21.

[0038] The longitudinal spacing (air gap distance between individual pieces) S of the first film 21 of individual pieces 10A to 10G is preferably 0.1 mm or more and 1.0 mm or less, more preferably 0.1 mm or more and 0.5 mm or less, and even more preferably 0.1 mm or more and 0.5 mm or less.

[0039] The lower limit of the ratio of the lengthwise dimension of the void to the lengthwise dimension of the individual piece is preferably 0 or more, and the upper limit of the ratio of the lengthwise dimension of the void to the lengthwise dimension of the individual piece is preferably 10 or less, more preferably 8 or less, and even more preferably 6 or less. Furthermore, the lower limit of the ratio of the short-axis dimension of the void to the short-axis dimension of the individual piece is preferably 0 or more, and the upper limit of the short-axis ratio of the short-axis dimension of the void to the short-axis dimension of the individual piece is preferably 40 or less, more preferably 30 or less, and even more preferably 20 or less.

[0040] This prevents the first or second film between individual segments from being pressed in by the thickness of each segment in the guide rolls of equipment such as rewinding machines, thereby suppressing film lifting. It also prevents the first or second film between individual segments from being pressed in by the thickness of each segment in the laminated section of a reel around which the film is wound, thereby suppressing film lifting. Furthermore, it can suppress winding misalignment caused by tension when unwinding individual segments from the reel. In addition, it allows for stable installation of the cover film as the second film.

[0041] The lower limit of the distances D1 and D2 between the short-side end of the first film 21 and the individual pieces 10A to 10G is preferably 0.1 mm or more, more preferably 0.3 mm or more, and even more preferably 0.5 mm or more. This prevents the connecting film of the individual pieces 10A to 10G from protruding due to winding tightness in the laminated section within the reel around which the film is wound. Furthermore, the upper limit of the distances D1 and D2 between the short-side end of the first film 21 and the individual pieces 10A to 10G is preferably 2.0 mm or less from a cost viewpoint.

[0042] [Film reel packaging] Figure 3 is a schematic perspective view of a film winding assembly. As shown in Figure 3, the film winding assembly is constructed by winding the aforementioned film structure onto a winding core 25. The winding core 25 has a shaft hole into which a rotating shaft for rotating the reel is inserted, and the film structure is wound around the shaft by connecting one end of the film structure in the longitudinal direction to the shaft hole. The winding core 25 may also be equipped with flanges (side plates). The length of the film structure wound onto the film winding assembly is not particularly limited, but the lower limit of the length is 5m or more, 10m or more, or 50m or more, and the upper limit of the length is preferably 5000m or less, 3000m or less, or 1000m or less.

[0043] Figure 4(A) is a plan view illustrating an example of a film structure in which individual pieces having openings where the first film is exposed are arranged, and Figure 4(B) is a schematic partial cross-sectional view showing the laminated portion cut at f1-f1' in a film winding body around which the film structure shown in Figure 4(A) is wound. As shown in Figures 4(A) and 4(B), when the first film 21 is exposed by half-cutting to form an opening 11, there are gaps 12A between the individual pieces 10 and gaps 12B in the opening 11 in the f1-f1' cross-section of the laminated portion around which the film structure is wound.

[0044] As shown in Figures 4(A) and 4(B), when winding a film structure in which multiple individual pieces 10 are arranged in the longitudinal direction of the first film 21 onto a winding core 25, using the second film 22 makes it possible to suppress the imprinting of the shape of the individual pieces 10 and the shape of the openings 11 caused by the gaps 12A and 12B onto the individual pieces 10 on the upper and lower layers.

[0045] Furthermore, Figure 5(A) is a plan view illustrating an example of a film structure in which individual pieces having openings through which the first film penetrates are arranged, and Figure 5(B) is a schematic partial cross-sectional view showing the laminated portion cut at f2-f2' in a film winding body around which the film structure shown in Figure 5(A) is wound. As shown in Figures 5(A) and 5(B), when the opening 11 is formed by fully cutting through the first film 21, in addition to the voids 12A between the individual pieces 10 and the voids 12B of the opening 11, there is also a void 12C of the through hole 21A in the f2-f2' cross-section of the laminated portion around which the film structure is wound.

[0046] As shown in Figures 5(A) and 5(B), when winding a film structure in which multiple individual pieces are arranged in the longitudinal direction of the first film 21 onto a core, using the second film 22 makes it possible to suppress the imprinting of the shape of the individual pieces 10 and the shape of the opening 11 due to the gaps 12A and 12B onto the individual pieces 10 on the upper and lower layers. Furthermore, by using the second film 22, it is possible to prevent the connecting film of the lower layer individual piece 10 from protruding and becoming fixed through the gap 12C of the through hole 21A, thereby preventing blocking.

[0047] [Example of individual piece arrangement] Next, other examples of the arrangement of individual segments of the film structure relative to the first film will be described. Note that components identical to those in the first example are denoted by the same reference numerals, and their descriptions are omitted.

[0048] Figure 6 is a plan view illustrating a second example of the arrangement of individual pieces relative to the first film of the film structure. As shown in Figure 6, the film structure may include dummy films 31A to 31E to prevent the first or second film from being pressed between the individual pieces by the thickness of the individual pieces.

[0049] The dummy films 31A to 31E are provided between the longitudinal segments 10A to 10C of the first film, and in at least a portion of the short-side of the first film 21. For example, the dummy films may be provided at both ends of the short-side of the first film 21, at one end of the short-side of the first film 21, continuously across multiple segments in the longitudinal direction of the first film 21, or between segments in the longitudinal direction of the first film 21. This prevents the first or second film between segments from being pushed in by the thickness of the segment in a guide roll of equipment such as a rewinding machine, thereby suppressing the occurrence of film lifting.

[0050] The dummy films 31A to 31E may be made of different materials than the individual pieces 10A to 10C, and may be peelable or fixed to the first film 21. From the viewpoint of processability, it is preferable that the dummy films 31A to 31E are made of the same binder as the connecting film used for the individual pieces 10A to 10C. The dummy films may also be formed in the same process as (or before / after) the formation of the individual pieces. Furthermore, it is preferable that the thickness of the dummy films 31A to 31E is the same as the thickness of the individual pieces 10A to 10C. Forming dummy films with the same binder and thickness as the individual pieces in the same process as (or before / after) the individual pieces may be preferable from the viewpoint of contamination and cost. Also, forming dummy films in the same process as (or before / after) the individual pieces may be reasonable from the viewpoint of preventing defects and reducing waste, even if the entire film includes parts (dummy films) that are not used for connecting, when considering the unit of the film wound into a roll. Furthermore, the shape of the dummy film is not particularly limited and can be appropriately selected to match the shape of individual pieces. For example, in the guide roll of equipment such as a rewinding machine, the first or second film can be prevented from being pushed in by providing a dummy film in the area where it is likely to be pushed in. In this case, considering the simplicity of the process, it is presumed that the shape of the dummy film is often preferable to be rectangular, as it exists in part of a long film.

[0051] As shown in Figure 6, the film structure shown as the second example comprises a long first film 21, a plurality of individual pieces 10A to 10E provided in the longitudinal direction of the first film 21, and dummy films 31A to 31E provided between the individual pieces in the longitudinal direction of the first film 21.

[0052] The dummy films 31A to 31E are positioned to overlap the individual pieces 10A to 10E and the first film 21 in the longitudinal direction, and have, for example, a rectangular shape. The lower limit of the size of the dummy films 31A to 31E is preferably 0.1 mm or more, more preferably 0.5 mm or more, and even more preferably 1.0 mm or more. This allows the first film or the second film to be held in place, thereby preventing the first film or the second film from peeling off. Furthermore, the upper limit of the size of the dummy films 31A to 31E is preferably 2.0 mm or less from a cost viewpoint.

[0053] The lower limit of the distance D3 between individual pieces 10A to 10E and dummy films 31A to 31E in the longitudinal direction of the first film 21 is preferably 0.1 mm or more. The upper limit of the distance D3 between individual pieces 10A to 10E and dummy films 31A to 31E in the longitudinal direction of the first film 21 is preferably 1.0 mm or less, more preferably 0.5 mm or less, and even more preferably 0.3 mm or less. The lower limit of the ratio of distance D to the thickness of individual pieces is preferably 2 or more, and the upper limit of the ratio of distance D to the thickness of individual pieces is preferably 1000 or less, more preferably 500 or less, and even more preferably 300 or less. This prevents, for example, the individual pieces 10A to 10E and dummy films 31A to 31E from sticking together in the laminated portion within the reel around which the film is wound, and also prevents the first or second film between the individual pieces from being pushed in by the thickness of the individual pieces, thereby suppressing the occurrence of film lifting. In particular, in individual pieces having an opening, by arranging the dummy films 31A to 31E in a position that overlaps with the opening and the longitudinal direction of the first film 21, the gap in the longitudinal direction of the first film 21 can be reduced, and the occurrence of film lifting can be suppressed.

[0054] Furthermore, it is preferable that the exposed width D4 at one end and the exposed width D5 at the other end of the first film 21 are the same as the exposed width D1 at one end and the exposed width D2 at the other end of the first example.

[0055] Figure 7 is a plan view illustrating a third example of the arrangement of individual pieces relative to the first film of a film structure. As shown in Figure 7, the film structure shown as the third example comprises a long first film 21, a plurality of individual pieces 10A to 10E provided in the longitudinal direction of the first film 21, and dummy films 32A and 32B provided at both ends in the width direction of the first film 21.

[0056] The dummy films 32A and 32B are provided at both ends in the width direction of the first film 21 and have a long linear shape that is continuously provided over a plurality of individual pieces 10A to 10C in the longitudinal direction of the first film 21. By providing the dummy films 32A and 32B, for example, in the guide roll of equipment such as a rewinding machine, it is possible to prevent the first or second film between individual pieces from being pushed in by the thickness of the individual pieces, thereby suppressing the occurrence of film lifting. Also, for example, in the laminated section inside a reel around which the film is wound, it is possible to prevent the first or second film between individual pieces from being pushed in by the thickness of the individual pieces, thereby suppressing the occurrence of film lifting. Furthermore, for example, it is possible to suppress winding misalignment caused by tension when unwinding individual pieces from the reel. In addition, the cover film as the second film can be stably installed. In the film structure shown as the third example, the dummy film may be provided at only one end in the width direction of the first film 21.

[0057] The lower limit of the widths DA and DB of the dummy films 32A and 32B is preferably 0.1 mm or more, more preferably 0.5 mm or more, and even more preferably 1.0 mm or more. This allows the first film or the second film to be held in place, thereby preventing the first film or the second film from peeling off. Furthermore, from a cost viewpoint, the upper limit of the widths DA and DB of the dummy films 32A and 32B is preferably 2.0 mm or less.

[0058] The lower limit of the distance D6 between individual pieces 10A to 10E and dummy films 32A and 32B is preferably 0.1 mm or more, more preferably 0.3 mm or more, and even more preferably 0.5 mm or more. This prevents the individual pieces 10A to 10E and dummy films 32A and 32B from sticking together, for example, in the laminated portion within a reel around which the film is wound. Furthermore, the upper limit of the distance D6 between individual pieces 10A to 10E and dummy films 32A and 32B is preferably 2.0 mm or less from a cost viewpoint.

[0059] Figure 8 is a plan view illustrating a fourth example of the arrangement of individual pieces relative to the first film of a film structure. As shown in Figure 8, the film structure shown as the fourth example comprises a long first film 21, a plurality of individual pieces 10A to 10E provided in the longitudinal direction of the first film 21, and a long linear dummy film 33 continuously provided across the plurality of individual pieces 10A to 10C in the longitudinal direction of the first film 21.

[0060] The dummy film 33 may be positioned with the end of the first film 21 exposed. In this case, the lower limit of the exposed width D7 of the end of the first film 21 is preferably 0.1 mm or more, more preferably 0.3 mm or more, and even more preferably 0.5 mm or more. This prevents the dummy film 33 from protruding due to winding tightness in the laminated portion within the reel around which the film is wound. Furthermore, from a cost viewpoint, the upper limit of the exposed width D7 of the end of the first film 21 is preferably 2.0 mm or less. The width of the dummy film 33 is the same as in the third example, the distance between the individual pieces 10A to 10E and the dummy film 33 is the same as the distance D6 in the third example, and the exposed width D8 of the other end of the first film 21 is preferably the same as the distance D2 in the first example.

[0061] Figure 9 is a plan view illustrating a fifth example of the arrangement of individual pieces relative to the first film of a film structure. As shown in Figure 9, the film structure shown as the fifth example comprises a long first film 21, a plurality of individual pieces 10A to 10C provided in the longitudinal direction of the first film 21, and dummy films 34A and 34B provided at both ends in the width direction of the first film 21. The film structure shown as the fifth example is arranged with the individual pieces 10A to 10E rotated by 90° compared to the fourth example.

[0062] The widths of the dummy films 34A and 34B are the same as the widths DA and DB in the fourth example, and the distance between the individual pieces 10A to 10E and the dummy films 34A and 34B is the same as D6 in the fourth example. By providing the dummy films 34A and 34B, the same effect as in the fourth example can be obtained. In the film structure shown as the fifth example, the dummy film may be provided at only one end of the first film 21 in the width direction.

[0063] Figure 10 is a plan view illustrating a sixth example of the arrangement of individual pieces relative to the first film of a film structure. As shown in Figure 10, the film structure shown as the sixth example comprises a long first film 21, a plurality of individual pieces 10A to 10C provided in the longitudinal direction of the first film 21, and dummy films 35A, 35AA, 35B, and 35BB provided at both ends in the width direction of the first film 21.

[0064] The dummy films 35A, 35AA, 35B, and 35BB are provided between the longitudinal segments of the first film 21, and are, for example, rectangular in shape. The widths of the dummy films 35A, 35AA, 35B, and 35BB are preferably the same as the widths DA and DB of the fourth example.

[0065] The length L of the dummy films 35A, 35AA, 35B, and 35BB is preferably greater than or equal to the distance between individual segments in the longitudinal direction of the first film 21. This prevents the first or second film from being pressed between segments by the thickness of the segments, thereby suppressing the occurrence of film lifting.

[0066] Furthermore, by keeping the distance between individual pieces 10A to 10C and dummy films 35A, 35AA, 35B, and 35BB the same as in the first example, it is possible to prevent the individual pieces 10A to 10C and dummy films 35A, 35AA, 35B, and 35BB from sticking together, for example, in the laminated section within the reel around which the film is wound. In the film structure shown as the second example, the dummy films 35A, 35AA, 35B, and 35BB may be provided at only one end of the first film 21 in the width direction.

[0067] <2. Manufacturing method of film winding assembly> A method for manufacturing a film winding according to one embodiment of this technology comprises a long first film, a plurality of individual pieces made of connecting film provided at predetermined intervals in the longitudinal direction of the first film, and a second film covering the individual pieces, and the first film, connecting film and second film are laminated in this order and the film structure is wound around a winding core.

[0068] In a film winding assembly, the film structure is wound around a core so that the first film is on the outside or inside. A method for manufacturing such a film winding assembly includes a forming step of processing a film roll comprising a long roll of raw material first film and a connecting film formed on the raw material first film; an attachment step of attaching raw material second film to the processed film roll; and a winding step of cutting the film roll to a predetermined width to form a film structure, joining these film structures together, and winding them onto a core.

[0069] In the forming process, multiple individual pieces are formed at predetermined intervals along the longitudinal direction of the first film roll. Here, if the dummy film is made of the same binder as the connecting film for the individual pieces, the individual pieces and the dummy film may be formed simultaneously. Alternatively, the dummy film may be formed at least between the individual pieces along the longitudinal direction of the first film roll. In the forming process, individual pieces of a desired shape are formed in unit areas of the film roll by slitting, half-cutting, punching, punch press processing, etc. Alternatively, the individual pieces and dummy film may be formed by printing. Either or both of the individual pieces and dummy film formed on another first film may be transferred. Furthermore, when the forming process is performed by processing, for example, when processing the individual pieces shown in Figure 1, they can be obtained by half-cutting in the shape of the opening 11, full-cutting in the shape of the through hole 12, and punching the connecting film.

[0070] The depth of the half-cut is preferably between 10% and 95% of the thickness of the base material. When the half-cut is deep, if it is made into a reel, the resin of the protruding connecting film will enter the half-cut portion, which can suppress overflow and adhesion between the layers of the connecting film.

[0071] <3. Manufacturing method of connecting structure> A method for manufacturing a connecting structure according to one embodiment of this technology comprises a long first film, a plurality of individual pieces made of connecting film provided at predetermined intervals in the longitudinal direction of the first film, and a second film covering the individual pieces, wherein the first film, connecting film and second film are laminated in this order, and the individual pieces are attached to a substrate from a film winding body, electronic components are mounted on the individual pieces, and the terminal rows of the substrate and the terminal rows of the electronic components are electrically connected via the individual pieces.

[0072] A method for manufacturing a connecting structure using individual pieces having openings will be described below with reference to Figures 11(A) and 11(B). Figure 11(A) is a perspective view showing an example of a substrate on which components are mounted, and Figure 11(B) is a schematic perspective view showing the individual pieces attached to the substrate on which components are mounted.

[0073] As shown in Figure 11(A), the substrate 40 has components 41 mounted on it and a terminal row 42 around the components 41. Examples of substrates 40 include ceramic substrates, rigid substrates, flexible printed circuits (FPCs), glass substrates, plastic substrates, and resin multilayer substrates, and examples of components 41 include image sensors, integrated circuit (IC) modules, and IC chips. In functional modules such as camera modules, ceramic substrates are sometimes used from the viewpoint of excellent electrical and thermal insulation properties. Ceramic substrates are used for miniaturization (e.g., 1 cm). 2 It has advantages such as excellent dimensional stability in the following areas.

[0074] Next, as shown in Figure 11(B), the individual pieces 43 are attached by aligning the opening with the component 41. For example, the individual pieces are attached to the substrate 40 on the stage by pressing from the base film side using an attachment device. This positions the component 41 in the opening and surrounds the component 41 with the connecting film of the individual pieces 43. The base film to which the individual pieces have been transferred is then wound up.

[0075] Next, the terminal row 42 of the substrate 40 and the terminals of the electronic component are connected via the individual pieces 43. For example, pressure is applied to the substrate and the terminal row of the electronic component with a crimping tool via a cushioning material. Depending on the curing type of the connecting film of the individual pieces, heating, light irradiation, etc., are performed to cure the individual pieces. This allows a connected structure to be obtained. Examples of electronic components include ceramic substrates, rigid substrates, flexible printed circuits (FPCs), glass substrates, plastic substrates, and resin multilayer substrates.

[0076] According to this method of manufacturing the connecting structure, full lamination can be performed across the entire substrate while avoiding components, stabilizing the temporary fixation to components connected to the substrate and improving the adhesive strength of the connecting structure.

[0077] This technology also includes the connection structure obtained in this manner. Specifically, the connection structure according to this embodiment comprises a substrate on which components are mounted and an electronic component, and is constructed by connecting the terminals of the substrate and the terminals of the electronic component using individual pieces of a connecting film having openings surrounding the component. [Examples]

[0078] <5. First Experimental Example> The first experimental example of this technology is described below. In the first experimental example, a film winding assembly was prepared with individual pieces of anisotropic conductive film, and the adhesion between layers was evaluated.

[0079] [Fabrication of anisotropic conductive films] Five parts by mass of resin core conductive particles with an average particle size of 20 μm (Ni (undercoat) / Au (surface) plating, resin core) and 95 parts by mass of an insulating binder consisting of the following components were placed in a planetary stirring device (product name: Awatori Rentaro, manufactured by THINKY Co., Ltd.) and stirred for 1 minute to prepare an anisotropic conductive adhesive composition. The anisotropic conductive adhesive composition was then applied to a 50 μm thick PET film and dried in an 80°C oven for 5 minutes to form an adhesive layer on the PET film, creating an anisotropic conductive film with a width of 6.0 mm and a thickness of 25 μm. The ratio of conductive particles to insulating binder was adjusted so that five or more particles were captured after connection.

[0080] The insulating binder was a mixed solution of ethyl acetate and toluene containing 47 parts by mass of phenoxy resin (product name: YP-50, manufactured by Shin-Nippon Chemical Epoxy Manufacturing Co., Ltd.), 3 parts by mass of monofunctional monomer (product name: M-5300, manufactured by Toagosei Co., Ltd.), 25 parts by mass of urethane resin (product name: UR-1400, manufactured by Toyobo Industries Ltd.), 15 parts by mass of rubber component (product name: SG80H, manufactured by Nagase ChemteX Corporation), 2 parts by mass of silane coupling agent (product name: A-187, manufactured by Momentive Performance Materials Japan), and 3 parts by mass of organic peroxide (product name: Niper BW, manufactured by NOF Corporation), with a solid content of 50% by mass.

[0081] [Preparation of individual pieces] A film structure was fabricated by punching out the base material and anisotropic conductive film to achieve a shape similar to that shown in Figure 1, and then forming openings and through holes.

[0082] [Manufacturing of film winding cases] A double-flange type reel component having a core and flange with a diameter of 85 mm was used, and the aforementioned film structure was wound onto the core under a winding tension of 20 g to produce a film winding assembly.

[0083] [Evaluation of interlayer bonding] A film winding assembly was set up, a static load of 50g was applied to the leading edge of the film structure, and it was left in a 35°C oven for 5 hours (see, for example, Japanese Patent Publication No. 2017-137188). Then, the film structure was pulled out from the film winding assembly, and the amount of insulating binder that protruded from the through-holes was observed and the number of occurrences was counted. A: Occurrence count 0-3 B: Occurrence frequency 4-10 C: Occurrence count is 11 or more

[0084] <Experimental Example 11> As shown in Figure 1, a film structure was fabricated by creating individual segments in which the first film was exposed at a distance D from the edge of the opening to the through-hole of the first film, which was 0.06 mm, and a film winding assembly was constructed. Table 1 shows the evaluation of the interlayer adhesion of the film winding assembly.

[0085] <Experimental Example 12> As shown in Figure 1, a film structure was fabricated in which individual segments were formed with an exposed distance D of 0.08 mm from the edge of the opening to the through-hole of the first film, and a film winding assembly was constructed. Table 1 shows the evaluation of interlayer adhesion of the film winding assembly.

[0086] <Experimental Example 13> As shown in Figure 1, a film structure was fabricated in which individual segments were formed with an exposed distance D of 0.10 mm from the edge of the opening to the through-hole of the first film, and a film winding assembly was constructed. Table 1 shows the evaluation of interlayer adhesion of the film winding assembly.

[0087] <Experimental Example 14> As shown in Figure 1, a film structure was fabricated by creating individual segments in which the first film was exposed at a distance D from the edge of the opening to the through-hole of the first film, which was 0.12 mm, and a film winding assembly was constructed. Table 1 shows the evaluation of the interlayer adhesion of the film winding assembly.

[0088] [Table 1]

[0089] As shown in Table 1, it was found that by setting the exposed distance D of the first film from the edge of the opening to the through-hole of the first film to 1.0 mm or more, the occurrence of interlayer adhesion, where the connecting film of the upper or lower layer piece and the connecting film around the opening adhere to each other through the void of the through-hole, can be suppressed.

[0090] <5. Second experimental example> The following describes a second experimental example of this technology. In the second experimental example, a film winding assembly was prepared with individual pieces of anisotropic conductive film, and the film lifting and adhesion of adjacent pieces were evaluated.

[0091] The same anisotropic conductive film used in the first experimental example was employed.

[0092] [Preparation of individual pieces] The substrate and anisotropic conductive film were punched out to achieve a shape similar to that shown in Figure 2, and openings and through-holes were further formed. In addition, a 12 μm thick PET film was used as a cover film, creating a film structure with a width of 6.0 mm.

[0093] [Manufacturing of film winding cases] A double-flange type reel component having a core and flange with a diameter of 85 mm was used, and with the cover film facing inward, the aforementioned film structure was wound onto the core under a winding tension of 20 g to create a film winding assembly.

[0094] [Evaluation of film floats] The film structure was pulled out from the aforementioned film winding at a pulling force of 70g and a pulling speed of 500mm / sec, in increments of a few centimeters over 5 hours, guided by a guide roll on the cover film side. The film structure was then observed, and the number of times film lifting occurred, where the base film or cover film separated from individual pieces, was counted. A: Occurrence count 0-3 B: Occurrence count: 4 or more

[0095] Furthermore, the film structure was observed, and the number of times individual fragments adhered together was counted. A: Occurrence count 0-3 B: Occurrence count: 4 or more

[0096] <Experimental Example 21> As shown in Figure 2, a film structure was fabricated with a gap distance S between individual segments in the longitudinal direction of the first film of 0.05 mm, and a film winding assembly was constructed. Table 2 shows the evaluation of film lifting and adhesion of adjacent segments in the film winding assembly.

[0097] <Experimental Example 22> As shown in Figure 2, a film structure was fabricated with a gap distance S between individual segments in the longitudinal direction of the first film of 0.10 mm, and a film winding assembly was constructed. Table 2 shows the evaluation of film lifting and adhesion of adjacent segments in the film winding assembly.

[0098] <Experimental Example 23> As shown in Figure 2, a film structure was fabricated with a gap distance S between individual segments in the longitudinal direction of the first film of 0.50 mm, and a film winding assembly was constructed. Table 2 shows the evaluation of film lifting and adhesion of adjacent segments in the film winding assembly.

[0099] <Experimental Example 24> As shown in Figure 2, a film structure was fabricated with a gap distance S between individual segments in the longitudinal direction of the first film set to 1.00 mm, and a film winding assembly was constructed. Table 2 shows the evaluation of film lifting and adhesion of adjacent segments in the film winding assembly.

[0100] <Experimental Example 25> As shown in Figure 2, a film structure was fabricated with a gap distance S between individual segments in the longitudinal direction of the first film set to 1.20 mm, and a film winding assembly was constructed. Table 2 shows the evaluation of film lifting and adhesion of adjacent segments in the film winding assembly.

[0101] [Table 2]

[0102] As shown in Table 2, it was found that by setting the gap distance S between individual pieces in the longitudinal direction of the first film to 0.1 mm or more and 1.0 mm or less, the occurrence of film lifting, where the base film or cover film separates from the individual pieces, and the occurrence of piece sticking, where adjacent pieces stick together, can be suppressed. [Explanation of Symbols]

[0103] 10 individual pieces, 10A~10G individual pieces, 11 opening, 12A~12C gap, 21 first film, 21A through hole, 22 second film, 25 core, 31A~31E dummy film, 32A,32B dummy film, 33 dummy film, 34A,34B dummy film, 35A,35AA,35B,35BB dummy film, 40 substrate, 41 component, 42 terminal row, 43 individual pieces, 100 individual pieces, 101 base film, 102 base film, 103 guide roll

Claims

1. The first long film, Multiple pieces are provided in the longitudinal direction of the first film at intervals of 0.1 mm to 1.0 mm, and each piece is made of a connecting film. A second film covering the aforementioned individual piece and A film winding body comprising the first film, the connecting film, and the second film, which are laminated and wound in this order.

2. The film winding body according to claim 1, wherein a plurality of the aforementioned pieces are provided at intervals of 0.1 mm or more and 0.5 mm or less in the longitudinal direction of the first film.

3. The film winding body according to claim 1 or 2, wherein the distance between the short end of the first film and the individual piece is 0.1 mm or more.

4. The first film is further provided with dummy films between its longitudinal segments, The film winding body according to claim 1, wherein the distance between the individual pieces and the dummy film is 0.1 mm or more and 1 mm or less.

5. The film winding body according to claim 4, wherein the length of the dummy film in the longitudinal direction of the first film is 0.1 mm or more.

6. The film winding body according to claim 4 or 5, wherein the dummy film is composed of the same binder as the connecting film.

7. The aforementioned piece has an opening, The film winding body according to any one of claims 1 to 3, wherein the first film has a through hole in the opening, and the shape of the through hole is 0.1 mm or more smaller than the shape of the opening.

8. The first long film, Multiple pieces are provided in the longitudinal direction of the first film at intervals of 0.1 mm to 1 mm, and each piece is made of a connecting film. A second film covering the aforementioned individual piece and A method for manufacturing a film winding body, comprising winding a film structure in which the first film, the connecting film, and the second film are laminated in this order onto a winding core.

9. The first long film, Multiple pieces are provided in the longitudinal direction of the first film at intervals of 0.1 mm to 1 mm, and each piece is made of a connecting film. A second film covering the aforementioned individual piece and The film winding assembly comprises the first film, the connecting film, and the second film, which are laminated and wound in this order, from which the individual pieces are attached to the substrate. A method for manufacturing a connection structure in which an electronic component is mounted on the aforementioned piece, and the terminal row of the substrate and the terminal row of the electronic component are electrically connected via the aforementioned piece.

Images