Dicing device

Abstract

This invention provides a dicing device that can be made more efficient by stabilizing the series of operations involved in the automatic replacement of the adjustment board. [Solution] The adjustment unit 13 includes an adjustment board 14 for adjusting the blade 12 and an adjustment stage 15 on which the adjustment board 14 is installed, and a cleaning unit 60 for cleaning the adjustment board 14, wherein the cleaning unit 60 cleans the adjustment board 14 before removing it from the adjustment stage.

Description

Technical Field

[0001] The present invention relates to a dicing apparatus provided with a stocker that accommodates a plurality of adjustment boards for adjusting a blade.

Background Art

[0002] The grinding capability of the blade of a dicing apparatus decreases as the workpiece held on a holding table is cut. For this reason, the dicing apparatus performs dressing for grinding the blade with a dressing board to restore the grinding capability of the blade. Further, the dicing apparatus performs truing using the dressing board to adjust the shape of the blade. The dressing board is disposed adjacent to the holding table (Patent Document 1). The dicing apparatus of Patent Document 1 is provided with an accommodating portion that accommodates a plurality of dressing boards (see FIG. 8 and FIG. 9).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] To realize automatic replacement of the dressing board, it is necessary to stabilize the replacement operation. However, during the automatic replacement of the dressing board, if the used dressing board to be replaced is heavily soiled, the dressing board may not be adsorbed by the adsorption pad during replacement and may fall off. In such a case, the replacement operation will be interrupted.

Means for Solving the Problems

[0005] A dicing apparatus that solves the above problems comprises an adjustment unit having an adjustment board for adjusting blades and an adjustment stage on which the adjustment board is installed, and a cleaning unit for cleaning the adjustment board, wherein the cleaning unit cleans the adjustment board before removing it from the adjustment stage. [Effects of the Invention]

[0006] According to the present invention, the efficiency of the automatic replacement of the adjustment board can be improved by stabilizing the series of operations. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a schematic diagram showing the configuration of a dicing apparatus in an embodiment. [Figure 2] Figure 2 is a perspective view of the storage unit in the embodiment. [Figure 3] Figure 3 is a perspective view showing the relationship between the stocker and the lifting mechanism in the embodiment. [Figure 4] Figure 4 is a perspective view showing the relationship between the stocker and the lifting mechanism in the embodiment. [Figure 5] Figure 5 is a perspective view showing the relationship between the storage mechanism, the transport mechanism, and the loading mechanism in the embodiment. [Figure 6] Figure 6 is a schematic diagram showing the relationship between the transport table and the shutter at the loading position in the embodiment. [Figure 7] Figure 7 is a schematic diagram showing the relationship between the transport table and the shutter at the transport position in the embodiment. [Figure 8] Figure 8 is a perspective view showing the exchange mechanism in an embodiment. [Figure 9] Figure 9 is a schematic diagram showing the relationship between the moving unit and the cleaning unit in the embodiment. [Figure 10] Figure 10 is a schematic diagram showing an example in which a brush is provided in the cleaning section of the embodiment. [Figure 11]Figure 11 is a flowchart illustrating the operation of transporting the adjustment board of the stocker to the transport table at the loading position in the embodiment. [Figure 12] Figure 12 is a flowchart illustrating the operation in the embodiment for transporting unused adjustment boards from the stocker to the transport table at the loading position, and for retrieving used adjustment boards from the adjustment stage. [Figure 13] Figure 13 is a flowchart illustrating the operation of transporting an unused adjustment board from the transport table to the moving section in the embodiment. [Figure 14] Figure 14 is a flowchart illustrating the operation in this embodiment, which involves transporting the adjustment board of the transport table to the moving section and collecting the used adjustment board. [Figure 15] Figure 15 is a schematic diagram showing the state in which the transport table is in the loading position in the embodiment. [Figure 16] Figure 16 is a schematic diagram showing the state in which the transport table is in a temporary standby position in the embodiment. [Figure 17] Figure 17 is a schematic diagram showing the state in which the transport table is in the transport position in the embodiment. [Figure 18] Figure 18 is a schematic diagram showing the state in which the transport table is in the transport position and rotated in the embodiment. [Figure 19] Figure 19 is a schematic diagram showing the state in which the replacement pad picks up the adjustment board from the transport table in an embodiment. [Figure 20] Figure 20 is a schematic diagram showing the state in which the replacement pad has attracted the adjustment board from the transport table in the embodiment. [Figure 21] Figure 21 is a schematic diagram showing the state in which the replacement pad is placed on the adjustment stage of the movable part in the embodiment. [Figure 22] Figure 22 is a schematic diagram showing the state in which the replacement pad is placed on the adjustment stage of the movable part in the embodiment. [Figure 23]FIG. 23 is a schematic diagram illustrating a state in which the transport table in the embodiment is at the transport position and is in a rotated state. DETAILED DESCRIPTION OF EMBODIMENTS

[0008] An embodiment of a dicing apparatus will be described with reference to FIG. 1 to FIG. 23. As shown in FIG. 1, a dicing apparatus 1 according to the present embodiment includes a processing mechanism 10 for processing a wafer W, a storage mechanism 20, a loading mechanism 30, a transport mechanism 40, an exchange mechanism 50, a cleaning unit 60, a recovery mechanism 70, and a control device 80.

[0009] (Processing Mechanism 10) The processing mechanism 10 is a unit that dices the wafer W. The processing mechanism 10 includes a table 11, blades 12a and 12b (hereinafter also simply referred to as "blades 12"), and adjustment units 13a and 13b (hereinafter also simply referred to as "adjustment units 13").

[0010] The table 11 is a table that supports the wafer W to be diced on the placement surface of its surface. The table 11 holds the wafer W on its horizontal surface. The table 11 is provided with a plurality of suction holes on its surface. The table 11 is configured to hold the wafer W by suctioning the wafer W from the back surface of the wafer W.

[0011] The wafer W is, for example, a silicon carbide wafer formed of silicon carbide (SiC). The wafer W is not limited to one formed of silicon carbide. For example, it may be silicon, sapphire, gallium nitride (GaN), gallium oxide (Ga₂O₃), gallium arsenide (GaAs), or the like.

[0012] Each blade 12 is configured to cut a wafer W held on a table 11. Each blade 12 is an ultra-thin cutting wheel having a ring shape. Each blade 12 is configured to be detachably mounted on a spindle. Each spindle is connected to a blade drive source. Each blade 12 is configured to be rotationally driven by the rotational force generated by each blade drive source.

[0013] Each blade 12 is supported by a Y-axis drive unit and a Z-axis drive unit (not shown). The Z-axis drive unit is located in the Y-axis drive unit, which is separate from the X-carriage movement unit 16. The Z-axis drive unit moves the blades 12 relative to the wafer W held on the table 11 in the Z-axis direction, i.e., the blades 12a and 12b move toward and away from the table 11, respectively. The Y-axis drive unit moves the blades 12 relative to the wafer W held on the table 11 in the Y-axis direction, respectively.

[0014] The adjustment unit 13 is configured to adjust the blade 12. Specifically, the adjustment unit 13 is configured to remove runout from the working surface of the blade 12 and to adjust it to a predetermined shape according to the shape of the wafer W. The adjustment unit 13 is also configured to adjust the amount of abrasive grain protrusion after the blade 12 has been reshaped and to create a cutting edge for blunted abrasive grains. The adjustment unit 13 is, for example, a dressing unit. The adjustment unit 13 is also, for example, a truing unit. The number of adjustment units 13 is equal to the number of blades 12 that can be mounted. For example, even if the processing mechanism 10 can mount two blades 12 and only one blade 12 is mounted, there are still two adjustment units 13.

[0015] The adjustment unit 13a is configured to correspond to the blade 12a. The adjustment unit 13b is configured to correspond to the blade 12b. The adjustment units 13a and 13b include adjustment boards 14a and 14b (hereinafter also simply referred to as "adjustment board 14") and adjustment stages 15a and 15b (hereinafter also simply referred to as "adjustment stage 15").

[0016] The adjustment board 14 is a plate-shaped grinding stone used to adjust the blade 12. The adjustment board 14 is also a porous material used to adjust the blade 12. The adjustment board 14 is, for example, a dressing board. The adjustment board 14 is also, for example, a truing board. The grinding stone of the adjustment board 14 is selected according to its intended use.

[0017] The adjustment stage 15 is a stage on which the adjustment board 14 is placed. The adjustment stage 15 is a board mounting section on which the adjustment board 14 is placed. The adjustment stage 15 has a plurality of suction holes on the mounting surface on which the adjustment board 14 is placed. The adjustment stage 15 is configured to hold the adjustment board 14 by suctioning the back surface of the adjustment board 14.

[0018] The table 11 and adjustment unit 13 are provided on the moving unit 16. The moving unit 16 is, for example, an X-carriage that moves in the X-axis direction. The moving unit 16 includes a table rotation unit that rotates the table 11. The table rotation unit can adjust its relative angle with the blade 12.

[0019] The moving unit 16 moves between the processing position P1 and the replacement position P2. Between the processing position P1 and the replacement position P2 is a replacement standby position P3. The processing position P1 is the position where the blade 12 performs dicing and other processing on the wafer W placed on the table 11. The replacement position P2 is the position where the adjustment board 14 is replaced. The replacement standby position P3 is the position where the moving unit 16 temporarily waits when the adjustment board 14 is replaced. The area between the replacement position P2 and the replacement standby position P3 is the area where the adjustment unit 13 is cleaned. Specifically, a cleaning unit 60 is provided between the replacement position P2 and the replacement standby position P3.

[0020] The moving section 16 has a linear movement path between the processing position P1 and the exchange position P2. A recovery pan 17 is positioned in the area including the movement region of the moving section 16 and its surroundings. The recovery pan 17 is a receiving member for recovering fluids such as cutting water used during wafer dicing, adjustment of the blade 12 in the adjustment section 13, etc. The recovery pan 17 is also a receiving member for recovering water and foreign matter generated when the cleaning section 60 cleans the adjustment section 13.

[0021] The processing mechanism 10, configured as described above, is located in the internal space of the housing 18. The adjustment board 14 used in the adjustment section 13 is housed in a storage mechanism 20 located adjacent to the outside of the housing 18. The movement of the adjustment board 14 between the storage mechanism 20 and the transport mechanism 40 is performed by the loading mechanism 30. The transport mechanism 40 transports the adjustment board 14 between the outer and inner spaces of the housing 18. Then, within the housing 18, the adjustment board 14 is transported to the adjustment section 13 of the moving section 16 by the exchange mechanism 50.

[0022] The housing 18 is provided with an entrance / exit 18a in the side wall through which the transport path 44 passes. The entrance / exit 18a is opened and closed by a shutter 19 that is movable along the side wall of the housing 18. The shutter 19 is, for example, a slide shutter provided on the side wall of the housing 18. The shutter 19 is guided to slide by a guide part provided on the side wall of the housing 18. The shutter 19 is configured to open and close the entrance / exit 18a automatically. For automation, the shutter 19 is opened and closed by a drive unit consisting of a cylinder mechanism, a motor, etc. For example, the shutter 19 is configured to close the entrance / exit 18a when the moving part 16 is at the processing position P1 and processing is being performed to dic the wafer W. For example, the shutter 19 is configured to open the entrance / exit 18a when transporting the adjustment board 14.

[0023] (Full mechanism 20) The storage mechanism 20 is located adjacent to the outside of the housing 18. The storage mechanism 20 houses unused adjustment boards 14 in storage compartments 21a, 21b, 21c, 21d, etc. (hereinafter also simply referred to as "storage compartment 21"). As an example, multiple storage compartments 21 are arranged in two rows along the second axis direction B. Multiple storage compartments 21 are arranged in a matrix (2 rows and 2 columns in this embodiment).

[0024] The number of stockers 21 is not particularly limited and is determined by the number of types of unused adjustment boards 14 that are prepared in advance. Also, adjustment boards 14 of frequently used types (sizes) may be housed in multiple stockers 21. This reduces the frequency with which the administrator has to replace the stockers 21.

[0025] Each of the stockers 21 is configured to hold multiple adjustment boards 14 of the same type. One stocker 21 is configured, for example, to hold multiple unused adjustment boards 14 of the same number. Different stockers 21 hold multiple unused adjustment boards 14 of different types. Therefore, the storage mechanism 20 as a whole holds different types of adjustment boards 14 for each stocker 21. Adjacent stockers 21 hold multiple different types of unused adjustment boards 14.

[0026] Specifically, as shown in Figures 2 to 4, each stocker 21 has a rectangular parallelepiped shape and contains a storage space for adjustment boards 14 inside. In each stocker 21, adjustment boards 14 of the same type are stored in a single row, stacked vertically in the storage space. Each stocker 21 has an opening on its top surface. The opening on the top surface is an outlet 22a for the loading mechanism 30 to pick up and remove the uppermost adjustment board 14. Opposite sides of each stocker 21 are provided with inspection windows 22b in the height direction. This allows the storage mechanism 20 to check and manage the remaining number of adjustment boards 14 by detecting the edges of the adjustment boards 14 exposed through the inspection windows 22b using sensors. In addition, the manager can also check the remaining amount of unused adjustment boards 14 through the inspection windows 22b.

[0027] In each storage container 21, an operating opening 22c is provided on the side adjacent to the side with the inspection window 22b and on the bottom surface. The operating opening 22c is an opening that extends from the upper end to the lower end and further to the bottom surface on one side of the storage container 21. The upper end of the operating opening 22c is connected to the retrieval opening 22a. A lifting mechanism 23 for raising and lowering the multiple adjustment boards 14 housed within is configured to be installed in the operating opening 22c.

[0028] The lifting mechanism 23 comprises a drive unit 23a and a support plate 23b. The drive unit 23a and the support plate 23b are connected by a connecting part 23c. The drive unit 23a is composed of a cylinder mechanism, a motor, a gear mechanism such as a rack and pinion, etc. The drive unit 23a is positioned adjacent to the side surface where the operating opening 22c is provided. The support plate 23b is positioned on the bottom surface of the stocker 21 in the operating opening 22c. The support plate 23b is configured to support the lowest adjustment board 14x from below among the multiple adjustment boards 14 housed in a stacked state.

[0029] The connecting portion 23c is configured to move the side portion of the stocker 21 in the operating opening 22c from the lower end to the upper end. The support plate 23b rises by the thickness of one adjustment board 14 at a time. Among the multiple adjustment boards 14 housed in the stocker 21, the uppermost adjustment board 14y faces the outlet 22a. When the uppermost adjustment board 14y facing the outlet 22a is removed by the loading pad 31 of the loading mechanism 30, the next adjustment board 14 is raised by the lifting mechanism 23 by the thickness of one board. Then, the next adjustment board 14 becomes the uppermost adjustment board 14y and faces the outlet 22a.

[0030] (Loading mechanism 30) As shown in Figures 1 and 5, the loading mechanism 30 comprises a loading pad 31 and a moving mechanism 32. The loading pad 31 is a suction pad that attracts the adjustment board 14. The suction pad is a non-contact type Bernoulli pad, etc. The moving mechanism 32 is configured to move the loading pad 31 in a horizontal first axis direction A and a second axis direction B that intersects the first axis direction A, as well as in the vertical Z axis direction.

[0031] The loading pad 31 is equipped with anti-detachment claws. When the loading pad 31 picks up the adjustment board 14, it engages the anti-detachment claws with the underside of the adjustment board 14. For example, a pair of anti-detachment claws are provided on the suction surface side of the adjustment board 14. This allows the loading pad 31 to engage and support the adjustment board 14 from both sides during transport. The loading pad 31 can prevent the adjustment board 14 from falling off by engaging the anti-detachment claws with the adjustment board 14.

[0032] The moving mechanism 32 is configured to move the loading pad 31 in the first axis direction A and the second axis direction B. The moving mechanism 32 moves the loading pad 31 to an upper position above the stocker 21 which houses the adjustment board 14 of a specified type. The moving mechanism 32 includes, for example, a plurality of first guide rails extending in the first axis direction A, a plurality of second guide rails extending in the second axis direction B, and a drive unit for moving the loading pad 31. The moving mechanism 32 moves the loading pad 31 guided by the first guide rails and the second guide rails. The moving mechanism 32 also includes a lifting drive unit for raising and lowering the loading pad 31. The moving mechanism 32 lowers the loading pad 31 to pick up the uppermost adjustment board 14y. Then, the moving mechanism 32 raises the loading pad 31 and transports it to the transport table 41 of the transport mechanism 40. The moving mechanism 32 lowers the loading pad 31 and places the adjustment board 14 on the transport table 41. The number of loading pads 31 may be one or two.

[0033] (Recovery mechanism 70) As shown in Figures 1 and 5, a recovery mechanism 70 is provided in the area between the storage mechanism 20 and the loading position P5 of the transport mechanism 40. The recovery mechanism 70 recovers the used adjustment board 14. The recovery mechanism 70 comprises a recovery guide 71 and a recovery box 72. The recovery guide 71 has an inclined surface that slopes up and down. The upper part of the inclined surface is located within the movable area of ​​the loading pad 31. The position of the upper part of the inclined surface is set as the recovery position P4 within the movable area of ​​the loading pad 31. The lower part of the inclined surface is connected to the recovery box 72. When the loading pad 31 receives the used adjustment board 14 from the transport mechanism 40, it moves to the recovery position P4. Then, the loading pad 31 stops sucking up the used adjustment board 14. As a result, the used adjustment board 14 is recovered into the recovery box 72 via the recovery guide 71. The collection box 72 may be configured to allow used adjustment boards 14 to fall freely from the lower part of the collection guide 71 for collection, or it may be configured to collect them in an orderly fashion, stacking them on top of each other.

[0034] Used adjustment boards 14 have dressing marks and truing marks formed by dressing and truing. As a result, the surface of used adjustment boards 14 is uneven. Therefore, it is preferable to use a non-contact type suction pad 31 that can adhere even if the surface is uneven.

[0035] (Conveying mechanism 40) As shown in Figure 1, the transport mechanism 40 constitutes a transport path 44 from the loading mechanism 30 to the adjustment section 13 of the movable section 16 at the replacement position P2, where the adjustment board 14 is received. The transport path 44 is a straight passage extending along the first axis A. The transport mechanism 40 includes a transport table 41 and a table moving mechanism 43.

[0036] The transport table 41 is configured to move between a loading position P5, which is outside the housing 18 of the processing mechanism 10, and a transport position P6, which is inside the housing 18. The loading position P5 is defined at one end of the transport path 44. The loading position P5 is the position where an unused adjustment board 14 is loaded by the loading pad 31 of the loading mechanism 30. The transport position P6 is defined at the other end of the transport path 44. The transport position P6 is the position for exchanging an unused adjustment board 14 transported by the transport table 41 with a used adjustment board 14 placed on the movable part 16 at the exchange position P2.

[0037] As shown in Figure 6, the transport table 41 has four mounting sections 42a to 42d (hereinafter also simply referred to as "mounting section 42") on which adjustment boards 14 can be placed, and four adjustment boards 14 can be placed simultaneously. The four mounting sections 42 are arranged, for example, in a 2x2 configuration. Specifically, the adjacent first mounting section 42a and second mounting section 42b are areas on which unused adjustment boards 14 can be placed. The adjacent third mounting section 42c and fourth mounting section 42d are areas on which used adjustment boards 14 can be placed. Each mounting section 42 is equipped with multiple suction holes. Each mounting section 42 is configured to hold the adjustment board 14 by suctioning the back surface of the board.

[0038] In the example shown in Figure 1, the positions of the first mounting section 42a and the fourth mounting section 42d in the first axial direction A are aligned with those of the stockers 21a and 21d. Also, the positions of the second mounting section 42b and the third mounting section 42c in the first axial direction A are aligned with those of the stockers 21b and 21c.

[0039] The transport table 41 is rotatable by the rotation mechanism 46 at the loading position P5. For example, the transport table 41 rotates at intervals of 45° and 180°. Alternatively, the transport table 41 may rotate at 30° intervals.

[0040] At loading position P5, the side closer to the containment mechanism 20 and away from the entrance / exit 18a is the first position P11. The side closer to the containment mechanism 20 and closer to the entrance / exit 18a is the second position P12. The side further away from the containment mechanism 20 and closer to the entrance / exit 18a is the third position P13. The side further away from the containment mechanism 20 and away from the entrance / exit 18a is the fourth position P14.

[0041] Here, the first position P11 and the second position P12 are the positions where unused adjustment boards 14 are loaded by the loading pad 31. The loading pad 31 transports the unused adjustment boards 14 from a predetermined stocker 21 to the first position P11. Then, the unused adjustment boards 14 are placed on the first mounting section 42a. The loading pad 31 also transports the unused adjustment boards 14 from the predetermined stocker 21 to the second position P12. Then, the unused adjustment boards 14 are placed on the second mounting section 42b.

[0042] The first position P11 and the fourth position P14 are aligned with stockers 21a and 21d in the first axial direction A. The second position P12 and the third position P13 are aligned with stockers 21b and 21c in the first axial direction A. This shortens the travel distance of the loading pad 31 and improves transport efficiency.

[0043] Furthermore, the loading pad 31 holds the used adjustment board 14 and transports it to the recovery mechanism 70. For example, as the transport table 41 rotates, the third and fourth mounting sections 42c and 42d on which the used adjustment board 14 is placed are moved to the first position P11 and the second position P12. After this, the loading pad 31 is moved to the recovery position P4, thereby transporting the used adjustment board 14 to the recovery mechanism 70.

[0044] Furthermore, the position in which the adjustment board 14 is attached to and detached from the loading pad 31 is not limited to one position, but may be multiple positions. For example, the attachment and detachment positions of the adjustment board 14 by the loading pad 31 may be the first position P11 and the second position P12, or the third position P13 and the fourth position P14. Also, the attachment and detachment positions of the adjustment board 14 by the loading pad 31 are not particularly limited and may be any of the first position P11 to the fourth position P14.

[0045] The table movement mechanism 43 is configured to move the transport table 41 between a loading position P5 and a transport position P6. The transport path 44 is a straight line between the loading position P5 and the transport position P6. The transport path 44 passes through the entrance / exit 18a of the housing 18. A temporary waiting position P7 is defined between the loading position P5 and the transport position P6. The temporary waiting position P7 may be outside the housing 18, inside the housing 18, or straddle the entrance / exit 18a, but it is near the entrance / exit 18a.

[0046] The table moving mechanism 43 comprises a first moving mechanism 43a and a second moving mechanism 43b. The first moving mechanism 43a is configured to move the transport table 41 between a loading position P5 and a temporary standby position P7. The second moving mechanism 43b is configured to move the transport table 41 between a temporary standby position P7 and a transport position P6. Both the first moving mechanism 43a and the second moving mechanism 43b have guide rails 45 (see Figure 5) that guide the transport table 41. At the temporary standby position P7, the transport table 41 is transferred between the first moving mechanism 43a and the second moving mechanism 43b.

[0047] As shown in Figure 7, the transport table 41 is rotatable by the rotation mechanism 47 at the transport position P6. Here, the X-axis direction in which the moving part 16 moves is oblique to the first axis direction A in which the transport table 41 moves. For example, the X-axis direction is 45° with respect to the first axis direction A. Therefore, for example, the transport table 41 rotates at 45° intervals. The transport table 41 rotates 45° at the transport position P6. As a result, the four mounting parts 42 become parallel to the alignment direction of the two adjustment parts 13.

[0048] Here, the state before the transport table 41 rotates is the reference state (the state in which the mounting section 42 is aligned in the first axis direction A and the second axis direction B, shown by the dashed lines in Figure 8). The state after rotation is the slanted state (shown by the solid lines in Figure 8).

[0049] Furthermore, in the diagonal position at the transport position P6, the sides of the movable unit 16 closer to the two adjustment units 13 are the fifth position P15 and the sixth position P16. The sides further away from the two adjustment units 13 are the seventh position P17 and the eighth position P18. The fifth position P15 and the sixth position P16 of the mounting unit 42 are the positions that overlap with the two adjustment units 13 when the movable unit 16 moves to the exchange position P2. In Figure 8, for the sake of explanation, it is shown shifted in the X-axis direction.

[0050] When the transport table 41 is in an inclined position, for example, the position between the mounting section 42 at the fifth position P15 and the sixth position P16 and the adjustment stage 15 of the two adjustment sections 13 is where the adjustment board 14 is replaced by the replacement mechanism 50.

[0051] For example, if unused adjustment boards 14 are placed on the first mounting section 42a and the second mounting section 42b, the transport table 41 first rotates, moving the first mounting section 42a and the second mounting section 42b to the fifth position P15 and the sixth position P16. After this, the unused adjustment boards 14 are picked up and lifted by the replacement pad 51 (see Figure 1) of the replacement mechanism 50. Also, when replacing a used adjustment board 14 placed on the adjustment stage 15 of the moving section 16, the third mounting section 42c and the fourth mounting section 42d are moved to the fifth position P15 and the sixth position P16. After this, the used and unused adjustment boards 14 are placed by the lowering of the replacement pad 51 (see Figure 1) of the replacement mechanism 50.

[0052] Incidentally, the transport table 41 at transport position P6, whether in the standard position or in the tilted position, overlaps with the two adjustment parts 13 of the moving part 16 that has moved to the exchange position P2. Specifically, in the tilted position of the transport table 41, the fifth position P15 and the sixth position P16 are positions that overlap with the two adjustment parts 13 of the moving part 16 that has moved to the exchange position P2. Therefore, when the transport table 41 is at transport position P6, the moving part 16 cannot be at the exchange position P2. Also, when the moving part 16 is at the exchange position P2, the transport table 41 cannot be at transport position P6. Therefore, with a time delay, the transport table 41 is positioned at transport position P6 and the moving part 16 is positioned at the exchange position P2.

[0053] (exchange mechanism 50) As shown in Figure 8, the replacement mechanism 50 includes a replacement pad 51 and a pad lifting mechanism 52. Figure 9 shows the adjustment section 13 in the state where the movable part 16 is in the replacement position P2.

[0054] The replacement pad 51 is a pad that adsorbs the adjustment board 14. Two replacement pads 51 are provided, corresponding to the two adjustment sections 13, and are arranged side by side in the Y-axis direction. Specifically, the replacement pad 51 is configured to adsorb an unused adjustment board 14. The replacement pad 51 is also configured to adsorb a used adjustment board 14. The used adjustment board 14 has dressing marks and truing marks formed by dressing and truing. Therefore, the surface of the used adjustment board 14 is uneven. For this reason, it is preferable to use a non-contact type adsorption pad such as a Bernoulli pad as the replacement pad 51, which can adsorb even if the surface is uneven.

[0055] The replacement pad 51 is equipped with anti-detachment claws. When the replacement pad 51 attracts the adjustment board 14, it engages the anti-detachment claws with the underside of the adjustment board 14. For example, a pair of anti-detachment claws are provided on the attraction surface side of the adjustment board 14. This allows the replacement pad 51 to engage and support the adjustment board 14 from both sides during transport. The replacement pad 51 can be prevented from falling off by the anti-detachment claws engaging with the adjustment board 14.

[0056] The pad lifting mechanism 52 is provided for each replacement pad 51. Each pad lifting mechanism 52 comprises a drive unit 52a, such as a cylinder mechanism, and a connecting plate 52c provided on a piston 52b extending from the drive unit 52a. The connecting plate 52c is connected to the replacement pad 51. In this embodiment, the replacement pad 51 only moves up and down by the pad lifting mechanism 52 and does not have the function of moving in the X-axis direction and the Y-axis direction.

[0057] The pad lifting mechanism 52 lowers the replacement pad 51, and then picks up the used adjustment board 14 from the two adjustment stages 15 of the movable part 16 at the replacement position P2 onto the replacement pad 51, and then raises the replacement pad 51. After that, the pad lifting mechanism 52 lowers the replacement pad 51 and places the used adjustment board 14 on the third mounting section 42c and the fourth mounting section 42d at the fifth position P15 and the sixth position P16.

[0058] Furthermore, the pad lifting mechanism 52 lowers the replacement pad 51, attaches the unused adjustment board 14 to the replacement pad 51 from the first mounting section 42a and the second mounting section 42b at the fifth position P15 and the sixth position P16, and then raises the replacement pad 51. After that, the pad lifting mechanism 52 lowers the replacement pad 51 and places the unused adjustment board 14 on the two adjustment stages 15 of the movable section 16 at the replacement position P2.

[0059] (Cleaning section 60) As shown in Figure 9, the cleaning unit 60 is, for example, located between the replacement position P2 and the replacement standby position P3.

[0060] The cleaning unit 60 is configured to clean the surface of the adjustment board 14. The cleaning unit 60 is also configured to clean the adjustment stage 15. By using a fluid to clean the surface of the adjustment board 14 and the adjustment stage 15, the cleaning unit 60 cleans the adjustment board 14 and the adjustment stage 15, enabling smooth automatic replacement of the adjustment board 14 using the replacement pad 51. Furthermore, the cleaning unit 60 ensures that unused adjustment boards 14 are reliably placed on the adjustment stage 15. The fluid can be air, water, etc.

[0061] The cleaning unit 60 is, for example, an air curtain 61a. The cleaning unit 60 includes an air nozzle 61 for forming the air curtain 61a. The air nozzle 61 is located between the replacement position P2 and the replacement standby position P3 and is configured to extend in the Y-axis direction.

[0062] Here, in the movement of the movable unit 16 in the X-axis direction, the direction of the processing position P1 is referred to as the upstream side, and the direction of the exchange position P2 is referred to as the downstream side. The downstream side is the opposite side from the side on which the table 11 is positioned. The air nozzle 61 is configured to blow air diagonally toward the downstream side, rather than blowing air perpendicularly to the surface of the adjustment unit 13. This makes it less likely for foreign matter to be blown upstream by the air, thereby suppressing contamination of the table 11 and wafer W.

[0063] Furthermore, the cleaning unit 60 is, for example, a water curtain 62a. The cleaning unit 60 is equipped with a water nozzle 62 for forming the water curtain 62a. The water nozzle 62 is located above the adjustment unit 13 and is configured to extend in the Y-axis direction. The water nozzle 62 is configured to spray water at an angle toward the downstream side, rather than spraying water perpendicularly to the surface of the adjustment unit 13. This makes it less likely for foreign matter to be blown upstream by the water, thereby suppressing contamination of the table 11 and wafer W.

[0064] Even when the air nozzle 61 and the water nozzle 62 are arranged side by side in the X-axis direction, they are provided between the replacement position P2 and the replacement standby position P3. In this embodiment, it is preferable that the air nozzle 61 is positioned on the upstream side and the water nozzle 62 is positioned on the downstream side. For example, when moving the movable part 16 from the adjustment stage 15, which has had the used adjustment board 14 removed, from the replacement position P2 to the replacement standby position P3, the surface of the adjustment stage 15 may be cleaned. In such a case, water droplets that have adhered to the water curtain 62a can be wiped away by the air curtain 61a. This allows for a simple drying process using the air curtain 61a.

[0065] The cleaning unit 60 is configured to clean the surface of the adjustment board 14 before removing it from the adjustment stage 15. For example, the cleaning unit 60 cleans the used adjustment board 14, which is placed on the adjustment stage 15, when it is moved from the replacement waiting position P3 to the replacement position P2.

[0066] Furthermore, the cleaning unit 60 is configured to clean the surface of the adjustment stage 15 after the adjustment board 14 has been removed from the adjustment stage 15. For example, the cleaning unit 60 cleans the surface of the adjustment stage 15 when the movable unit 16, from which the used adjustment board 14 has been removed, moves from the replacement position P2 to the replacement standby position P3. Also, the cleaning unit 60 cleans the surface of the adjustment stage 15 immediately before an unused adjustment board 14 is placed on the adjustment stage 15, and when the movable unit 16 moves from the replacement standby position P3 to the replacement position P2.

[0067] The cleaning unit 60 is configured to select what kind of cleaning treatment to perform depending on the degree of contamination of the adjustment board 14, the degree of contamination of the adjustment stage 15, the type of adjustment board 14, the adjustment conditions of the blade 12 by the adjustment board 14, and whether it is the adjustment board 14 or the adjustment stage 15. In other words, the cleaning unit 60 selects cleaning treatment using a water curtain 62a, cleaning treatment using an air curtain 61a, or cleaning treatment using both a water curtain 62a and an air curtain 61a. Generally, the cleaning capacity is higher with a water curtain 62a than with an air curtain 61a. The cleaning capacity is highest when both an air curtain 61a and a water curtain 62a are used.

[0068] Therefore, if only a mild cleaning treatment is required, the cleaning unit 60 performs the cleaning treatment using the air curtain 61a. If a moderate cleaning treatment is required, the cleaning unit 60 performs the cleaning treatment using the water curtain 62a. If a thorough and heavy cleaning treatment is required, the cleaning unit 60 performs the cleaning treatment using both the water curtain 62a and the air curtain 61a. Even when only a moderate cleaning treatment is required, the cleaning unit 60 may perform the cleaning treatment using both the water curtain 62a and the air curtain 61a. In this way, the efficiency of the cleaning treatment can be improved by switching the cleaning treatment.

[0069] For example, if the grit size of the adjustment board 14 is greater than the threshold, the cleaning unit 60 performs cleaning using both the water curtain 62a and the air curtain 61a because the joints are fine and the adjustment board 14 is difficult to clean. If the grit size of the adjustment board 14 is less than or equal to the threshold, cleaning is performed using either the air curtain 61a or the water curtain 62a.

[0070] For example, if the adjustment board 14 is a truing board, cleaning is performed using both the water curtain 62a and the air curtain 61a. If the adjustment board 14 is a dressing board, cleaning is performed using either the air curtain 61a or the water curtain 62a. This is because truing boards use a larger grit and finer joints than dressing boards.

[0071] For example, if the contamination level of the adjustment board 14 or adjustment stage 15 is mild, cleaning is performed using either the air curtain 61a or the water curtain 62a. If the contamination level of the adjustment board 14 or adjustment stage 15 is moderate or severe, cleaning is performed using both the water curtain 62a and the air curtain 61a.

[0072] Furthermore, the adjustment board 14, which is made of porous material, is held by adsorption on the adjustment stage 15. The longer the adjustment board 14 is held by adsorption on the adjustment stage 15, the more the adjustment stage 15 will suck in processing wastewater mixed with cutting dust, causing clogging and increasing the degree of contamination. Taking these circumstances into consideration, when the continuous use time of the adjustment board 14 exceeds a threshold, the cleaning unit 60 switches the movement speed of the mobile unit 16 from the replacement standby position P3 to the replacement position P2 to a cleaning treatment speed (second speed) that is slower than the standard speed (first speed) so that the cleaning treatment time is extended. Here, the standard speed (first speed) is the speed of the mobile unit 16 when cleaning treatment is performed when the continuous use time of the adjustment board 14 is below the threshold (when contamination is mild), the speed of the mobile unit 16 when cleaning treatment is not performed, etc.

[0073] Furthermore, when the adjustment process of the blade 12 is repeatedly performed on the adjustment board 14, the adjustment unit 13 dries out between adjustment processes. When the processing wastewater containing cutting powder dries, the cutting powder adheres to the adjustment board 14 and the adjustment stage 15, making it difficult to remove the adhered material. Taking these circumstances into consideration, the cleaning unit 60 counts the number of times the environment has switched from a wet environment to a dry environment since the start of use of an unused adjustment board 14. Here, the wet environment is at least one of the following: the environment in which the blade 12 is being adjusted, the environment in which the blade 12 is processing the wafer W, etc. The dry environment is an environment in which the blade 12 is not being adjusted, an environment in which no processing is being performed, an environment in which neither adjustment nor processing is being performed, etc. When the number of times the environment has switched from a wet environment to a dry environment exceeds a threshold, the cleaning unit 60 switches the movement speed of the moving unit 16 from the exchange standby position P3 to the exchange position P2 to a cleaning processing speed (second speed) that is slower than the standard speed (first speed) so that the cleaning processing time is extended.

[0074] Furthermore, the cleaning unit 60 is equipped with a camera 64. For example, the camera 64 is positioned upstream of the air nozzle 61 and the water nozzle 62. The camera 64 images the adjustment board 14 and the adjustment stage 15. The camera 64 is a CCD camera, a CMOS camera, etc. The camera 64 is a digital or analog video camera, a still camera, etc. For example, the camera 64 is a microscope used to confirm and correct the processing position. The cleaning unit 60 determines whether contamination has been removed by the cleaning process by processing the image data captured by the camera 64, such as the image data of the adjustment board 14, the image data of the adjustment stage 15, and the image data of the adjustment board 14 and the adjustment stage 15. Specifically, the cleaning unit 60 holds image data such as the image data of an unused adjustment board 14, the image data of an unused adjustment stage 15, and the image data of an unused adjustment board 14 and an unused adjustment stage 15 as reference data. The cleaning unit 60 compares the reference data with the captured judgment imaging data and determines that the cleaning process has been sufficiently performed if the difference value is below a threshold. The cleaning unit 60 also determines that the cleaning process is insufficient if the difference value is greater than the threshold. Furthermore, the cleaning unit 60 detects the contamination status from the judgment imaging data and determines that the cleaning process has been sufficiently performed if the value indicating the contamination status is below a threshold. The cleaning unit 60 also determines that the cleaning process is insufficient if the value indicating the contamination status is greater than the threshold.

[0075] As shown in Figure 10, the cleaning unit 60 may be configured to include a brush 63 in addition to, or instead of, the air nozzle 61 and water nozzle 62. The brush 63 is also provided between the replacement position P2 and the replacement standby position P3. The brush 63 is raised and lowered by the brush lifting unit 63a. The brush 63 is positioned above the adjustment unit 13. The brush 63 descends and contacts the surface of the adjustment stage 15. The brush 63 then cleans the surface of the adjustment stage 15 by moving the moving unit 16 in the direction of the replacement position P2 or the replacement standby position P3. The brush 63 may also be configured to contact the surface of the adjustment board 14.

[0076] When performing the cleaning treatment with the brush 63, a wet cleaning treatment with the brush 63 can be performed by spraying cleaning water from the water nozzle 62. Alternatively, the cleaning with the brush 63 may be performed by spraying water from the adsorption holes 63b of the adjustment stage 15. For example, the cleaning performance of the brush 63 is higher than that of the air curtain 61a and the water curtain 62a. Therefore, it is preferable to perform the cleaning treatment with the brush 63 when sufficient results cannot be obtained with cleaning using both the water curtain 62a and the air curtain 61a.

[0077] Furthermore, the cleaning unit 60 can soften any deposits adhering to the adjustment stage 15 by using the water curtain 62a, by spraying water from the adsorption holes 63b, or by spraying water from both the water curtain 62a and the adsorption holes 63b, before performing the cleaning treatment with the brush 63. This enhances the effectiveness of the cleaning treatment by the brush 63.

[0078] (Control device 80) The entire dicing apparatus 1 is controlled by a control device 80 (see Figure 1). Specifically, the control device 80 manages and controls each component of the processing mechanism 10, each component of the storage mechanism 20, each component of the loading mechanism 30, each component of the transport mechanism 40, each component of the exchange mechanism 50, each component of the cleaning unit 60, and each component of the recovery mechanism 70.

[0079] For example, the control device 80 is a computer. The control device 80 includes a communication device, an input device, an output device, a memory device, a processor, etc. Note that this hardware configuration is just one example, and it can also be implemented with other hardware.

[0080] Communication devices are interfaces that establish communication paths with other devices and perform data transmission and reception. Communication devices include network interface cards, wireless interfaces, etc. Input devices are devices that accept input of various types of information. Input devices include touch panels, mice, keyboards, etc. Output devices include displays, speakers, etc. that display various types of information. Storage devices store data, programs, etc., for executing various functions of the control device 80. Examples of storage devices include ROM, RAM, hard disks, SSDs, etc.

[0081] A processor controls various processes using programs and data stored in memory. Examples of processors include CPUs and MPUs. A processor loads programs stored in ROM or other memory into RAM and executes various instructions corresponding to various processes. For example, when an application program is launched, the processor executes instructions corresponding to each process.

[0082] A processor is not limited to performing software processing for all the processes it executes. For example, a processor may have dedicated hardware circuits (e.g., application-specific integrated circuits: ASICs) that perform hardware processing for at least some of the processes it executes. That is, a processor can be configured as a circuit including (1) one or more processors that operate according to a computer program (software), (2) one or more dedicated hardware circuits that perform at least some of the various processes, and (3) a combination of (1) and (2). A processor includes a CPU and memory such as RAM and ROM, where memory stores program code or instructions configured to cause the CPU to execute processes. Memory includes any available medium that can be accessed by a general-purpose or dedicated computer.

[0083] (Effect of the embodiment) (The operation of transporting the adjustment board 14 of the stocker 21 to the transport table 41 at loading position P5) Figure 11 is a flowchart illustrating the operation of transporting the adjustment board 14 of the stocker 21 to the transport table 41 at the loading position P5. Note that the adjustment board 14 to be transported here is an unused adjustment board 14. The first and second mounting sections 42a and 42b of the transport table 41 on which the unused adjustment board 14 is placed are in a state where no adjustment board 14 is placed.

[0084] Referring to Figure 1, the loading pad 31 of the loading mechanism 30 moves to a position above a predetermined stocker 21 that houses unused adjustment boards 14 of a specified type (step S1). Next, the loading pad 31 descends and picks up the uppermost adjustment board 14y housed in the stocker 21 (step S2). Then, the loading pad 31 rises (step S3). At this point, the loading pad 31 engages its anti-detachment claws with the picked-up adjustment board 14 to prevent it from falling off the loading pad 31.

[0085] Furthermore, when the top adjustment board 14y facing the outlet 22a of the stocker 21 is removed by the loading pad 31 of the loading mechanism 30, the next adjustment board 14 is raised by one board by the lifting mechanism 23. Then, the next adjustment board 14 becomes the top adjustment board 14y and faces the outlet 22a.

[0086] Here, the transport table 41 of the transport mechanism 40 is located at the loading position P5 on the outside of the housing 18. The loading pad 31 moves above the first position P11 of the transport table 41 (step S4). The loading pad 31 descends and places the adjustment board 14 on the first mounting section 42a and releases the suction (step S5). At this time, before releasing the suction, the loading pad 31 releases the engagement of the anti-detachment claws with respect to the adjustment board 14. After this, the loading pad 31 rises (step S6).

[0087] By the way, in the moving section 16, there are two adjustment sections 13, corresponding to the number of blades 12 that can be mounted, so two adjustment boards 14 can also be placed on the adjustment stage 15. Therefore, when transporting another adjustment board 14, the operation from steps S1 to S6 for loading the adjustment board 14 to be placed on the second mounting section 42b is repeated. Then, the loading pad 31 places the unused adjustment board 14 on the second mounting section 42b.

[0088] (An operation to transport unused adjustment boards 14 from the stocker 21 to the transport table 41 at loading position P5, and to collect used adjustment boards 14.) Figure 13 is a flowchart illustrating the operation of transporting unused adjustment boards 14 from the stocker 21 to the transport table 41 at loading position P5, and collecting used adjustment boards 14. Here, the adjustment boards 14 to be transported are unused adjustment boards 14. The first and second mounting sections 42a and 42b of the transport table 41, on which the unused adjustment boards 14 are placed, are empty. In addition, the third and fourth mounting sections 42c and 42d of the transport table 41 are on which used adjustment boards 14 removed from the two adjustment stages 15 of the moving section 16 are placed.

[0089] The loading pad 31 of the loading mechanism 30 moves to a position above a predetermined stocker 21 that houses unused adjustment boards 14 of a specified type (step S11). The loading pad 31 then descends and picks up the uppermost adjustment board 14y housed in the stocker 21 (step S12). The loading pad 31 then rises (step S13). At this point, the loading pad 31 engages its anti-detachment claws with the picked-up adjustment board 14 to prevent it from falling off the loading pad 31.

[0090] Furthermore, when the top adjustment board 14y facing the outlet 22a of the stocker 21 is removed by the loading pad 31 of the loading mechanism 30, the next adjustment board 14 is raised by one board by the lifting mechanism 23. Then, the next adjustment board 14 becomes the top adjustment board 14y and faces the outlet 22a.

[0091] Here, the transport table 41 of the transport mechanism 40 is located at the loading position P5 on the outside of the housing 18. The loading pad 31 moves above the first position P11 of the transport table 41 (step S14). The loading pad 31 descends and places the adjustment board 14 on the first mounting section 42a and releases the suction (step S15). At this time, before releasing the suction, the loading pad 31 releases the engagement of the anti-drop claws with respect to the adjustment board 14. After this, the loading pad 31 rises (step S16).

[0092] This completes the process of placing the unused adjustment board 14 onto the first mounting section 42a, and the next step is to retrieve the used adjustment board 14. The transport table 41 rotates so that the third mounting section 42c on which the used adjustment board 14 is placed moves to the first position P11 or the second position P12 (step S17). The loading pad 31 descends and picks up the adjustment board 14 (step S18). The surface of the used adjustment board 14 is uneven, but the loading pad 31 is a Bernoulli pad, so it can pick up even a used adjustment board 14. Then the loading pad 31 rises (step S19). The loading pad 31 engages its fall prevention claws with the picked-up adjustment board 14 to prevent it from falling off the loading pad 31. The loading pad 31 moves to the collection position P4 (step S20). The loading pad 31 stops picking up the used adjustment board 14 (step S21). As a result, the used adjustment board 14 is collected into the collection box 72 through the collection guide 71.

[0093] When transporting another adjustment board 14, the operation from steps S11 to S16 is repeated to load the adjustment board 14 to be placed on the second mounting section 42b. At this time, the loading pad 31 places the unused adjustment board 14 on the second mounting section 42b.

[0094] Furthermore, when another used adjustment board 14 is to be recovered, the operation from step S17 to step S21 is repeated. In this case, the transport table 41 rotates so that the fourth mounting section 42d is in the first position P11 or the second position P12. The loading pad 31 then picks up the adjustment board 14 placed on the fourth mounting section 42d and transports the adjustment board 14 to the recovery position P4. As a result, the used adjustment board 14 is recovered into the recovery box 72 via the recovery guide 71.

[0095] (The operation of transporting the unused adjustment board 14 from the transport table 41 to the moving unit 16) Figure 13 is a flowchart illustrating the operation of transporting unused adjustment boards 14 from the transport table 41 to the mobile unit 16. In this diagram, unused adjustment boards 14 are placed on the first and second mounting sections 42a and 42b of the transport table 41. Furthermore, no adjustment boards 14 are placed on the adjustment stage 15 of the mobile unit 16.

[0096] The moving unit 16 is at the processing position P1. On the table 11, the placed wafer W is being processed by the blade 12. While the wafer W is being processed, the shutter 19 closes the entrance 18a of the housing 18. From this state, the processing mechanism 10 stops processing the wafer W by the blade 12 (step S31). Next, the shutter 19 opens the entrance 18a, making it possible for the transport table 41 to pass through the entrance 18a (step S32, see Figure 15).

[0097] Next, the transport table 41 is moved from the loading position P5 to the temporary standby position P7 by the first movement mechanism 43a of the table movement mechanism 43, which is in the direction A1, one of the first axis A directions (step S33, see Figure 16). Subsequently, the transport table 41 is moved from the temporary standby position P7 to the transport position P6 by the second movement mechanism 43b of the table movement mechanism 43, which is in the direction A1 (step S34, see Figure 17). Next, the transport table 41 is rotated 45° in the R1 direction to an oblique position (step S35, see Figure 18). As a result, the first mounting section 42a is located at the fifth position P15, and the second mounting section 42b is located at the sixth position P16. Above the first mounting section 42a and the second mounting section 42b, the replacement pads 51 of the replacement mechanism 50 are positioned opposite each other (see Figure 19).

[0098] Next, the replacement pad 51 descends, attracting the unused adjustment boards 14 placed on the first mounting section 42a and the unused adjustment boards 14 placed on the second mounting section 42b (step S36). The replacement pad 51 moves above the transport table 41 and waits (step S37, see Figure 20). Here, the replacement pad 51 engages its fall prevention claws with the attracted adjustment boards 14 to prevent them from falling off. Next, the transport table 41 rotates in the R2 direction, returning from the oblique position to the reference position before rotation (step S38, see Figure 17). Then, the transport table 41 is moved by the second moving mechanism 43b in the A2 direction, which is the other direction of the first axis A, returning from the transport position P6 to the temporary waiting position P7 (step S39, see Figure 16). As a result, the space below the replacement pad 51 becomes open, allowing the moving section 16 to enter the open space.

[0099] The movable unit 16 is moved from the processing position P1 or the replacement standby position P3 to the replacement position P2 by moving the movable unit 16 in the X1 direction, which is one of the X-axis directions (step S40, see Figure 21). The replacement pad 51 descends and places the unused adjustment board 14 that it is holding onto onto the adjustment stage 15 of the movable unit 16 (step S41). At this time, the replacement pad 51 releases the engagement of the anti-detachment claws with the adjustment board 14 before releasing the suction. Then, the replacement pad 51 rises and waits (step S42, see Figure 22). After this, the movable unit 16 is moved from the replacement position P2 to the replacement standby position P3 by moving in the X2 direction, which is the other of the X-axis directions (step S43).

[0100] The transport table 41 is moved in the A2 direction from the temporary standby position P7 to the loading position P5, which is outside the housing 18, through the inlet / outlet 18a (step S44, see Figure 15). After this, the shutter 19 closes the inlet / outlet 18a in preparation for resuming processing (step S45). Next, the moving unit 16 moves from the exchange standby position P3 to the processing position P1 (step S46). Then, in the processing mechanism 10, processing of the wafer W by the blade 12 is resumed (step S47). The space outside the housing 18 where the stocker 21 is located is isolated from the internal space of the housing 18 when the shutter 19 closes the inlet / outlet 18a. Therefore, it is possible to prevent the adjustment board 14 inside the stocker 21 from being contaminated by foreign matter generated during processing, etc.

[0101] In addition, unused adjustment boards 14 may be placed on only one of the mounting sections 42, either the first mounting section 42a or the second mounting section 42b. Alternatively, the replacement pad 51 may move the adjustment board 14 of the first mounting section 42a to one adjustment stage 15, and then move the adjustment board 14 of the second mounting section 42b to the other adjustment stage 15. In this case, the operations from step S34 to step S43 will be repeated.

[0102] (This operation involves transporting the adjustment board 14 from the transport table 41 to the moving unit 16, and also retrieving the used adjustment board 14 from the adjustment stage 15.) Figure 14 is a flowchart illustrating the operation of transporting the adjustment board 14 from the transport table 41 to the moving unit 16 and retrieving the used adjustment board 14 from the adjustment stage 15. In this diagram, unused adjustment boards 14 are placed on the first and second mounting sections 42a and 42b of the transport table 41. Also, a used adjustment board 14 is placed on the adjustment stage 15 of the moving unit 16.

[0103] The moving unit 16 is at the processing position P1. On the table 11, the placed wafer W is being processed by the blade 12. While the wafer W is being processed, the shutter 19 closes the entrance / exit 18a of the housing 18. From this state, the processing mechanism 10 stops processing the wafer W by the blade 12 (step S51). The moving unit 16 is moved in the X1 direction, moving from the processing position P1 or the exchange standby position P3 to the exchange position P2 (step S52, see Figure 21). At this time, the adjustment unit 13 (adjustment stage 15 and used adjustment board 14 placed on the adjustment stage 15) of the moving unit 16 is cleaned by the cleaning unit 60. Specifically, the cleaning unit 60 cleans the adjustment board 14 and the parts of the adjustment stage 15 that are not covered by the adjustment board 14 (e.g., the sides). Next, the shutter 19 opens the entrance 18a, allowing the transport table 41 to move through the entrance 18a (step S53, see Figure 15).

[0104] Subsequently, the replacement pad 51 descends, attracting the used adjustment boards 14 placed on the first mounting section 42a and the used adjustment boards 14 placed on the second mounting section 42b (step S54). The replacement pad 51 moves above the adjustment stage 15 and waits (step S55, see Figure 20). Here, the replacement pad 51 engages its fall prevention claws with the attracted adjustment boards 14 to prevent them from falling off. The used adjustment boards 14 are cleaned immediately before being attracted to the replacement pad 51, ensuring that they are reliably attracted to the replacement pad 51.

[0105] Next, the shutter 19 closes the inlet / outlet 18a in preparation for the next cleaning process (step S56). Then, the movable part 16 is moved in the X2 direction, moving from the replacement position P2 to the replacement standby position P3 (step S57). At this time, the adjustment stage 15, from which the used adjustment board 14 has been removed, is cleaned by the cleaning unit 60. This removes any foreign matter adhering to the surface of the adjustment stage 15. At this time, the inlet / outlet 18a is closed by the shutter 19. Therefore, it is possible to prevent processing wastewater from splashing outside the housing 18 through the inlet / outlet 18a.

[0106] Once the cleaning process is complete, the shutter 19 reopens the entrance / exit 18a (step S58). Note that the process of the shutter 19 opening the entrance / exit 18a in step S53 may be omitted. This reduces the number of times the shutter 19 opens the entrance / exit 18a.

[0107] The transport table 41 on which the unused adjustment board 14 is placed is moved in the A1 direction by the first movement mechanism 43a of the table movement mechanism 43, moving it from the loading position P5 to the temporary standby position P7 (step S59, see Figure 16). Subsequently, the transport table 41 is moved in the A1 direction by the second movement mechanism 43b of the table movement mechanism 43, moving it from the temporary standby position P7 to the transport position P6 (step S60, see Figure 17). Next, the transport table 41 is rotated (step S61, see Figure 23). As a result, the third mounting section 42c on which the used adjustment board 14 is placed is located at the fifth position P15, and the fourth mounting section 42d is located at the sixth position P16. Above the third mounting section 42c and the fourth mounting section 42d, the replacement pads 51 that hold the used adjustment board 14 are positioned opposite each other (see Figure 20).

[0108] Next, the replacement pad 51 lowers itself, placing the used adjustment board 14 on the third mounting section 42c and the fourth mounting section 42d (step S62). Before releasing the suction, the replacement pad 51 releases the engagement of its fall prevention claws with the adjustment board 14. The transport table 41 now has unused adjustment boards 14 on the first mounting section 42a and the second mounting section 42b, and used adjustment boards 14 on the third mounting section 42c and the fourth mounting section 42d. The replacement pad 51 then moves above the adjustment stage 15 and waits (step S63, see Figure 19).

[0109] Next, the transport table 41 is rotated (step S64, see Figure 18). As a result, the first mounting section 42a is positioned at the fifth position P15, and the second mounting section 42b is positioned at the sixth position P16. Unused adjustment boards 14 are placed on the first mounting section 42a and the second mounting section 42b. Above the first mounting section 42a and the second mounting section 42b, a replacement pad 51 is positioned opposite them (see Figure 19). The replacement pad 51 descends to pick up the unused adjustment boards 14 placed on the first mounting section 42a and the unused adjustment boards 14 placed on the second mounting section 42b (step S65). The replacement pad 51 moves above the transport table 41 and waits (step S66, see Figure 21). Here, the replacement pad 51 prevents itself from falling off by engaging its anti-detachment claws with the suction-applied adjustment board 14.

[0110] Next, the transport table 41 returns from its tilted position to its original position before rotation (step S67, see Figure 17). Then, the transport table 41 is moved in the A2 direction by the second movement mechanism 43b and the first movement mechanism 43a, returning from the transport position P6 to the loading position P5, passing through the temporary standby position P7 (step S68, see Figure 16). As a result, the space below the replacement pad 51 becomes open, allowing the moving part 16 to enter the open space. Then, the shutter 19 closes the entrance / exit 18a (step S69).

[0111] Next, the movable unit 16 is moved in the X1 direction, moving from the replacement standby position P3 to the replacement position P2 (step S70, see Figure 22). At this time, the adjustment stage 15, just before the unused adjustment board 14 is placed on it, is cleaned by the cleaning unit 60. During cleaning, the inlet / outlet 18a is closed by the shutter 19, so that processing wastewater does not splash outside the housing 18. Next, the replacement pad 51 descends and places the unused adjustment board 14, which is being held in suction, onto the adjustment stage 15 of the movable unit 16 (step S71). At this time, before releasing the suction, the replacement pad 51 releases the engagement of its fall prevention claws with the adjustment board 14. Then, the replacement pad 51 rises and waits (step S72, see Figure 22).

[0112] Next, the movable unit 16 is moved in the X2 direction, moving from the exchange position P2 to the exchange standby position P3 (step S73). Then, the movable unit 16 moves from the exchange standby position P3 to the processing position P1 (step S74). Processing of the wafer W by the blade 12 is resumed in the processing mechanism 10 (step S75).

[0113] The used adjustment boards 14 placed on the third mounting section 42c and the fourth mounting section 42d are transported to the recovery mechanism 70 according to the operation of the flowchart in Figure 12 (steps S17 to S21).

[0114] (Effects of the embodiment) According to this embodiment, the following effects can be obtained. (1) The dicing device 1 can, as needed, place the adjustment boards 14 from the stocker 21 onto the adjustment stage 15 of the moving unit 16 via the loading pad 31 of the loading mechanism 30, the transport table 41 of the transport mechanism 40, and the replacement pad 51 of the replacement mechanism 50. When one adjustment board 14 has been removed from the stocker 21, the stocker 21 is raised by the lifting mechanism 23 so that the next adjustment board 14 faces the outlet 22a. In this way, the dicing device 1 can automatically transport the adjustment boards 14 from the stocker 21 to the adjustment stage 15 as needed. By making the replacement of the adjustment boards 14 more efficient in this way, the adjustment process of the blades 12 can be made more efficient.

[0115] The storage mechanism 20, which has multiple stockers 21, is located adjacent to the outside of the housing 18. Therefore, the stockers 21 can be replaced, or the adjustment boards 14 can be replaced or replenished for the stockers 21 at any time. Such replacement work is often done manually, but because the stockers 21 are located outside the housing 18, it can be done during the dicing process. Furthermore, the replacement work can be done even during the dressing or truing process. In other words, such replacement work can be performed without interrupting the dicing, dressing, or truing processes. Therefore, the dicing device 1 can improve the overall processing efficiency of the dicing process by improving the processing efficiency of blade adjustment processes such as dressing and truing.

[0116] Furthermore, the adjustment boards 14 stored in the stocker 21 can be replenished when they run out or are about to run out. (2) The storage mechanism 20 stores multiple adjustment boards 14 of each type in the stocker 21. Therefore, the dicing device 1 can select a suitable type of adjustment board 14 from the adjustment boards 14 prepared in advance in the storage mechanism 20 and place it on the adjustment stage 15. In this way, for example, by performing the adjustment process with an adjustment board 14 of a suitable size for the type of blade 12, the efficiency of the blade 12 adjustment process can be improved.

[0117] (3) Each stocker 21 is configured to accommodate multiple adjustment boards 14 of the same type. The storage mechanism 20 consists of stockers 21, each containing multiple adjustment boards 14 of the same type, arranged in a row. The storage mechanism 20 is replaceable on a stocker-by-stocker basis. Therefore, only the stocker 21 that has run out of adjustment boards 14 needs to be replaced. Until a stocker 21 can be replaced, adjustment boards 14 stored in other stockers 21 can be used as a substitute. This allows the dicing device 1 to improve the efficiency of the blade adjustment process.

[0118] (4) Each of the stockers 21 houses the adjustment boards 14 stacked on top of each other. Therefore, the stored adjustment boards 14 can be positioned so that the bottom adjustment board 14x is lifted by the support plate 23b, and the top adjustment board 14y faces the outlet 22a.

[0119] (5) The transport mechanism 40 moves the transport table 41 on which the adjustment board 14 is placed in the transport path 44 between a loading position P5 where the adjustment board 14 is loaded into the storage mechanism 20 and a transport position P6 for moving the adjustment board 14 to the adjustment stage 15. Here, the loading position P5 is outside the housing 18 of the processing mechanism 10. In contrast, the transport position P6 is inside the housing 18. The dicing device 1, by having the storage mechanism 20 located outside the housing 18, can suppress contamination of unused adjustment boards 14 stored in the stocker 21 during the dicing process and the adjustment process of the adjustment board 14.

[0120] (6) The processing mechanism 10 can move the movable unit 16, which includes the table 11 and the adjustment unit 13, between a processing position P1 for processing the wafer W and a replacement position P2 for replacing the adjustment board 14. This allows the dicing device 1 to separate the position for processing the wafer W from the position for replacing the adjustment board 14. The replacement pad 51 of the replacement mechanism 50 moves the adjustment board 14 between the transport table 41 at the transport position P6 and the adjustment stage 15 of the movable unit 16 at the replacement position P2. The dicing device 1 can bring the transport position P6 and the replacement position P2 closer together.

[0121] (7) The number of replacement pads 51 is the same as the number of blades 12 that can be mounted. This allows the dicing device 1 to perform the replacement of the adjustment board 14 between the adjustment stage 15 and the transport table 41 in one go. As a result, the dicing device 1 can improve the replacement efficiency between the transport table 41 and the adjustment stage 15 of the moving section 16.

[0122] (8) In the processing mechanism 10, the shutter 19 that opens and closes the entrance / exit 18a through which the transport path 44 passes is configured to open the entrance / exit 18a when the adjustment board 14 is being transported and to close the entrance / exit 18a when the wafer W is being processed. Therefore, it is possible to prevent processing wastewater from splashing outside the housing 18 through the entrance / exit 18a.

[0123] Specifically, during dicing, dressing, and truing processes, the inlet / outlet 18a is closed by the shutter 19. This prevents the wastewater generated during these processes from splashing outside the housing 18. Similarly, during the cleaning process, the inlet / outlet 18a is closed by the shutter 19. This prevents the wastewater generated during the cleaning process from splashing outside the housing 18.

[0124] (9) Between the position of the storage mechanism 20 and the loading position P5 of the transport table 41, there is a recovery mechanism 70 for recovering used adjustment boards 14. This allows the loading pad 31 of the loading mechanism 30 to automatically recover used adjustment boards 14 that have been transported to the loading position P5 by the transport table 41 into the recovery mechanism 70.

[0125] (10) By making the transport position P6 of the transport table 41 and the replacement position P2 of the moving part 16 overlap, the replacement pad 51 can be made to move only up and down. (11) The cleaning unit 60 can automatically perform cleaning of the adjustment board 14 and the adjustment stage 15 without interfering with the series of operations for the automatic replacement of the adjustment board 14.

[0126] (12) The cleaning unit 60 cleans the used adjustment board 14 before removing it from the adjustment stage 15 on which the used adjustment board 14 is placed. This ensures that the replacement pad 51 can reliably hold the used adjustment board 14. This reduces the likelihood of interruptions to the replacement operation due to the adjustment board 14 falling off the replacement pad 51.

[0127] (13) The cleaning unit 60 cleans the surface of the adjustment stage 15 after removing the adjustment board 14 from the adjustment stage 15. This reduces the possibility of foreign matter being present between the unused adjustment board 14 and the adjustment stage 15. For example, the adjustment stage 15 is cleaned immediately before placing the unused adjustment board 14 on the adjustment stage 15. This allows the adjustment stage 15 to pick up the unused adjustment board 14 with high accuracy through the suction holes 63b.

[0128] (14) The cleaning unit 60 can clean the adjustment board 14 and adjustment stage 15 without contact by spraying them with a fluid such as air or water. (15) The cleaning unit 60 sprays a fluid such as air or water onto the surface of the adjustment board 14 and the surface of the adjustment stage 15 from an oblique direction toward the downstream side. This prevents foreign matter blown away by the fluid from scattering toward the table 11.

[0129] (16) The cleaning unit 60 cleans the adjustment board 14 under conditions corresponding to the type of adjustment board 14. Specifically, the cleaning unit 60 can select whether to use an air curtain 61a, a water curtain 62a, or a brush 63 to clean the adjustment board 14, depending on the degree of contamination of the adjustment board 14, the degree of contamination of the adjustment stage 15, the type of adjustment board 14, the adjustment conditions of the blade 12 by the adjustment board 14, etc. This allows the cleaning unit 60 to efficiently clean the adjustment board 14 and the adjustment stage 15.

[0130] (17) The cleaning unit 60 is equipped with an air nozzle 61, which allows the adjustment board 14 or adjustment stage 15 to be efficiently cleaned by the air curtain 61a. (18) The cleaning unit 60 is equipped with a water nozzle 62, which allows the adjustment board 14 or adjustment stage 15 to be efficiently cleaned by the water curtain 62a.

[0131] (19) The cleaning unit 60, equipped with an air nozzle 61 and a water nozzle 62, can clean the adjustment board 14 or adjustment stage 15 with the water curtain 62a, and then wipe away any attached water droplets, etc., with the air curtain 61a.

[0132] (20) The cleaning unit 60 can clean the adjustment board 14 or adjustment stage 15 with the brush 63. The cleaning unit 60 can remove foreign matter that cannot be cleaned by the air nozzle 61 and water nozzle 62.

[0133] (21) The cleaning unit 60 can clean the surface of the adjustment stage 15 by spraying water from the adsorption holes 63b of the adjustment stage 15. It can also soften any deposits that have adhered to the adjustment stage 15. The spraying of water from the adsorption holes 63b can be used in combination with the brush 63, and can also be used in combination with the air curtain 61a or the water curtain 62a.

[0134] (modified version) This embodiment can be implemented with the following modifications. This embodiment and the following modifications can be combined with each other to the extent that they do not contradict each other technically.

[0135] (Modified example related to the cleaning unit 60) The cleaning unit 60 may be located at the replacement standby position P3, rather than between the replacement position P2 and the replacement standby position P3.

[0136] Although an example of a dicing apparatus that cleans the board surface of the adjustment board 14 and the adjustment stage 15 has been described, the embodiment is not limited to this, and this embodiment may be a dicing apparatus that cleans only the board surface of the adjustment board 14 or only the adjustment stage 15.

[0137] The cleaning unit 60 may omit one or two of the air nozzle 61, water nozzle 62, and brush 63. That is, the cleaning unit 60 may consist only of the air nozzle 61 and water nozzle 62. Alternatively, it may consist only of the air nozzle 61. Furthermore, it may consist only of the water nozzle 62. The cleaning unit 60 may consist only of the brush 63.

[0138] The cleaning unit 60 may be cleaned by an air curtain 61a and then by a water curtain 62a. When the adjustment board 14 or adjustment stage 15 passes through the cleaning section 60, the speed may be constant. Alternatively, the speed of the moving section 16 may be variable depending on the type of adjustment board 14 and whether it is the adjustment board 14 or the adjustment stage 15.

[0139] • If the cleaning unit 60 uses a water curtain 62a for the cleaning process, the shutter 19 may be configured to close the inlet / outlet 18a. This prevents water droplets from scattering outside the housing 18 through the inlet / outlet 18a.

[0140] The cleaning unit 60 may omit the cleaning process of step S52, the cleaning process of step S57, or the cleaning process of step S70 among the cleaning process of the adjustment stage 15 and the used adjustment board 14 placed on the adjustment stage 15 (step S52 in Figure 15), the cleaning process of the adjustment stage 15 from which the used adjustment board 14 has been removed (step S57 in Figure 15), and the cleaning process of the adjustment stage 15 immediately before an unused adjustment board 14 is placed on it (step S70 in Figure 15). Alternatively, two cleaning processes from steps S52, S57, and S70 may be omitted.

[0141] (Modified example of transporting the adjustment board 14) The transport position P6 of the transport table 41 and the exchange position P2 of the moving part 16 do not have to be in the same position; they may be spaced apart.

[0142] The collected used adjustment boards 14 may be disposed of as is. Alternatively, the collected adjustment boards 14 may be placed on a collection tray using a loading pad 31, cleaned using another device, and then stored in the stocker 21. Furthermore, the dicing device 1 may omit the collection mechanism 70.

[0143] The number of blades 12 in the processing mechanism 10 is not limited to two. If there is only one blade 12 (and therefore only one can be mounted), there will also be only one adjustment unit 13. However, this does not prevent there from being two blades. In this case, the replacement pad 51 may also be one that can hold only one object.

[0144] In the stocker 21, the adjustment boards 14 may be stacked and stored so that they are in direct contact with each other vertically, or they may be stacked and stored with the adjustment boards 14 placed on trays. If the adjustment boards 14 are stacked and stored in the stocker 21 with trays, the storage mechanism 20 should be provided with a pull-out mechanism for pulling the trays out of the stocker 21.

[0145] Different types of adjustment boards 14 may be stored in one stocker 21. In this case, for example, the storage space within the stocker 21 can be divided into multiple spaces. For example, if the storage space is divided into an upper space and a lower space, multiple adjustment boards 14 of different types, such as different grades, can be stacked and stored in the upper and lower spaces. If the storage space is divided into three spaces, an upper space, a middle space, and a lower space, three types of adjustment boards 14 can be stored in one stocker 21. When multiple storage spaces are provided in one stocker 21, at least one space may be used to store used adjustment boards 14. In this way, when multiple types of adjustment boards 14 are stored in the stocker 21, the adjustment boards 14 are pulled out from an opening provided on the side of the stocker 21.

[0146] The direction in which the adjustment boards 14 are stacked and stored in the stocker 21 may be left-right (first axis B) rather than up-down (Z axis). In this case, the adjustment boards 14 are arranged in the left-right direction in an upright position.

[0147] The storage mechanism 20 may have one or more storage containers 21. The adjustment board 14 is not limited to truing boards or dressing boards. In addition to these boards, the adjustment board 14 may also be a wafer for pre-cutting.

[0148] The direction of movement of the moving unit 16 (X-axis direction) may be the same as the direction of movement of the transport table 41 (second axis direction B). Also, the direction of movement of the moving unit 16 (X-axis direction) may be the same as the direction of movement of the transport table 41 (first axis direction A). In this case, the rotation mechanism 47 of the transport table 41 can be omitted.

[0149] (Note) Other technical ideas that can be gleaned from the above embodiments and modifications are described below. (Note 1) An adjustment unit having an adjustment board for adjusting the blade and an adjustment stage on which the adjustment board is installed, The system includes a cleaning unit for cleaning the adjustment board, The cleaning unit cleans the adjustment board. Dicing device.

[0150] (Note 2) An adjustment unit having an adjustment board for adjusting the blade and an adjustment stage on which the adjustment board is installed, The system includes a cleaning unit for cleaning the adjustment board, The cleaning unit cleans the adjustment stage. Dicing device. [Explanation of Symbols]

[0151] P1...Processing position, P2...Exchange position, P3...Exchange standby position, P4...Recovery position, P5...Loading position, P6...Transportation position, P7...Temporary standby position, P11...1st position, P12...2nd position, P13...3rd position, P14...4th position, P15...5th position, P16...6th position, P17...7th position, P18...8th position, W...Wafer, 1...Dicing device, 10...Processing mechanism, 11...Table, 12(12a,12b)...Blade, 13(13a,13b)...Adjustment unit, 14(14a,14b,14x,14y)...Adjustment board, 15(15a,15b)...Adjustment stage, 16...Movement unit, 17...Recovery pan, 18...Housing, 18 a... Entrance / exit, 19... Shutter, 20... Storage mechanism, 21 (21a~21d)... Stocker, 30... Loading mechanism, 31... Loading pad, 32... Movement mechanism, 40... Conveying mechanism, 41... Conveying table, 42 (42~42d)... Mounting section, 43... Table movement mechanism, 43a... First movement mechanism, 43b... Second movement mechanism, 44... Conveying path, 45... Guide rail, 46... Rotation mechanism, 47... Rotation mechanism, 50... Replacement mechanism, 51... Replacement pad, 60... Cleaning section, 61... Air nozzle, 61a... Air curtain, 62... Water nozzle, 62a... Water curtain, 63... Brush, 70... Recovery mechanism, 71... Recovery guide, 72... Recovery box.

Claims

1. An adjustment unit having an adjustment board for adjusting the blade and an adjustment stage on which the adjustment board is installed, The system includes a cleaning unit for cleaning the adjustment board, The cleaning unit cleans the adjustment board before removing it from the adjustment stage. Dicing device.

2. The cleaning unit cleans the adjustment stage after separating the adjustment board from the adjustment stage. The dicing apparatus according to claim 1.

3. The cleaning unit cleans at least the adjustment board by spraying a fluid. The dicing apparatus according to claim 1 or 2.

4. The cleaning unit sprays the fluid at an angle so as to move away from the table on which the wafer is placed, thereby cleaning at least the adjustment board. The dicing apparatus according to claim 3.

5. The cleaning unit performs cleaning treatment according to the conditions. The dicing apparatus according to claim 1 or 2.

6. The fluid is air. The dicing apparatus according to claim 3.

7. The fluid is water. The dicing apparatus according to claim 3.

8. The fluids are air and water. The cleaning unit sprays water and then blows air. The dicing apparatus according to claim 3.

9. The cleaning unit cleans the adjustment stage with a brush. The dicing apparatus according to claim 1 or 2.

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