Inductor element

Abstract

The present invention provides an inductance element having a structure that can reduce the spread of magnetic flux. [Solution] The inductor element 11 comprises a support 13 having a main surface 13a having a first region 13f, a second region 13g, and a third region 13h; an inductor 17 having a first conductive layer portion 18f located above the first region 13f of the first area 13b, a second conductive layer portion 18g located above the second area 13b, and a third conductive layer portion 18h connecting the first conductive layer portion and the second conductive layer portion, wherein the third conductive layer portion includes a conductive layer 18 having a pattern configured to generate inductance, and an inner end electrode 27 located above the first conductive layer portion; and a first resin body 15 including a soft magnetic resin region 20 including a lower soft magnetic resin layer 21 and an upper soft magnetic resin layer 23, and a non-magnetic resin region 22 in contact with at least one of the soft magnetic resin region 20 and the first conductive layer portion 18f in the first region 13f.

Description

Technical Field

[0001] The present disclosure relates to an inductor element.

Background Art

[0002] Patent Document 1 discloses a wafer level package (WLP). Specifically, Patent Document 1 discloses a resin multilayer device, which includes a capacitor and an inductor and / or a balun. The resin multilayer device is used, for example, in a high-frequency circuit of a wireless communication apparatus.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

[0004] [Summary] An inductor is mounted on a support such as a semiconductor substrate to form a semiconductor device. In an integrated semiconductor device including an inductor integrated with a semiconductor element, electrical action from the inductor to the semiconductor element may potentially occur. The electrical action may be caused by the spread of magnetic flux from the inductor. What is required in the integrated semiconductor device is a structure of an inductor element that can reduce the influence of the electrical action.

[0005] What is required is to provide an inductance element having a structure capable of reducing the spread of magnetic flux, and a method of manufacturing the inductance element.

[0006] An inductor element according to a first embodiment of the present disclosure is a support having a main surface including a first area and a second area surrounding the first area, wherein the first area has a first region, a second region surrounding the first region, and a third region surrounding the second region; and an inductor including a conductive layer and an inner end electrode extending over the main surface of the support, wherein the conductive layer has a first conductive layer portion located above the first region of the first area, a second conductive layer portion located above the second area, and a third conductive layer portion connecting the first conductive layer portion and the second conductive layer portion, the third conductive layer portion having a pattern configured to generate inductance; and the inner end electrode is located above the first conductive layer portion and is disposed within the first area of ​​the main surface, both including a non-magnetic resin region and a soft magnetic resin region having an opening for receiving the inner end electrode. A first resin body comprising: a first resin body wherein the soft magnetic resin region has a recess in at least the first region, the non-magnetic resin region is provided in the recess, the soft magnetic resin region includes a lower soft magnetic resin layer and an upper soft magnetic resin layer, the upper soft magnetic resin layer and the lower soft magnetic resin layer are laminated on the third region such that the lower soft magnetic resin layer is provided between the support and the upper soft magnetic resin layer, and the third conductive layer portion extends between the upper soft magnetic resin layer and the lower soft magnetic resin layer on the second region so as to be supported by at least one of the upper soft magnetic resin layer and the lower soft magnetic resin layer; the lower soft magnetic resin layer includes a first insulating resin body and a plurality of first magnetic materials surrounded by the first insulating resin body, and the upper soft magnetic resin layer includes a second insulating resin body and a plurality of second magnetic materials surrounded by the second insulating resin body. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a schematic diagram showing an inductor element according to this embodiment. [Figure 2] Figure 2 is a schematic diagram showing an inductor element according to this embodiment in a cross-section taken along the line II-II in Figure 1. [Figure 3]Figure 3 is a schematic diagram showing the inductor element according to this embodiment. [Figure 4] Figure 4 is a schematic diagram showing the inductor element according to this embodiment in a cross-section taken along the line IV-IV in Figure 3. [Figure 5] Figure 5 is a diagram showing the conductive layer and the first soft magnetic layer of the inductor element in Figure 1 in a cross-section taken along the line II-II in Figure 1. [Figure 6] Figure 6 is a diagram showing the conductive layer and soft magnetic layer of the inductor element in Figure 1 in a cross-section taken along the line II-II in Figure 1. [Figure 7] Figure 7 is a diagram showing the conductive layer and the first soft magnetic layer of the inductor element in Figure 3 in a cross-section taken along the line IV-IV in Figure 5. [Figure 8] Figure 8 is a diagram showing the conductive layer and soft magnetic layer of the inductor element in Figure 3 in a cross-section taken along the line IV-IV in Figure 5. [Figure 9] Figure 9(a) is a plan view showing one element section of an intermediate product in the manufacturing process of an element according to Figure 1. Figure 9(b) is a drawing showing a cross-section of an intermediate product in the manufacturing process. [Figure 10] Figure 10(a) is a plan view showing one element section of an intermediate product in the manufacturing process of an element according to Figure 1. Figure 10(b) is a drawing showing a cross-section of an intermediate product in the manufacturing process. [Figure 11] Figure 11(a) is a plan view showing one element section of an intermediate product in the manufacturing process of an element according to Figure 1. Figure 11(b) is a drawing showing a cross-section of an intermediate product in the manufacturing process. [Figure 12] Figure 12(a) is a plan view showing one element section of an intermediate product in the manufacturing process of an element according to Figure 1. Figure 12(b) is a drawing showing a cross-section of the intermediate product in the manufacturing process. [Figure 13] Figure 13(a) is a plan view showing one element section of an intermediate product in the manufacturing process of an element according to Figure 1. Figure 13(b) is a drawing showing a cross-section of the intermediate product in the manufacturing process. [Figure 14] Figure 14(a) is a plan view showing one element section of an intermediate product in the manufacturing process of an element according to Figure 1. Figure 14(b) is a drawing showing a cross-section of the intermediate product in the manufacturing process. [Figure 15] Figure 15(a) is a plan view showing one element section of an intermediate product in the manufacturing process of an element according to Figure 1. Figure 15(b) is a drawing showing a cross-section of the intermediate product in the manufacturing process. [Figure 16] Figure 16(a) is a plan view showing one element section of an intermediate product in the manufacturing process of an element according to Figure 1. Figure 16(b) is a drawing showing a cross-section of the intermediate product in the manufacturing process. [Figure 17] Figure 17(a) is a plan view showing one element section of an intermediate product in the manufacturing process of an element according to Figure 1. Figure 17(b) is a drawing showing a cross-section of the intermediate product in the manufacturing process. [Figure 18] Figure 18(a) is a plan view showing one element section of an intermediate product in the manufacturing process of an element according to Figure 1. Figure 18(b) is a drawing showing a cross-section of an intermediate product in the manufacturing process. [Figure 19] Figure 19(a) is a plan view showing one element section of an intermediate product in the manufacturing process of an element according to Figure 3. Figure 19(b) is a drawing showing a cross-section of an intermediate product in the manufacturing process. [Figure 20] Figure 20(a) is a plan view showing one element section of an intermediate product in the manufacturing process of an element according to Figure 3. Figure 20(b) is a drawing showing a cross-section of an intermediate product in the manufacturing process. [Figure 21] Figure 21(a) is a plan view showing one element section of an intermediate product in the manufacturing process of an element according to Figure 3. Figure 21(b) is a drawing showing a cross-section of an intermediate product in the manufacturing process. [Figure 22] Figure 22(a) is a plan view showing one element section of an intermediate product in the manufacturing process of an element according to Figure 3. Figure 22(b) is a drawing showing a cross-section of an intermediate product in the manufacturing process. [Figure 23]FIG. 23(a) is a plan view showing one element section of an intermediate product in the manufacturing process of the element according to FIG. 3. FIG. 23(b) is a drawing showing a cross section of the intermediate product in the manufacturing process. [Figure 24] FIG. 24(a) is a plan view showing one element section of an intermediate product in the manufacturing process of the element according to FIG. 3. FIG. 24(b) is a drawing showing a cross section of the intermediate product in the manufacturing process. [Figure 25] FIG. 25(a) is a plan view showing one element section of an intermediate product in the manufacturing process of the element according to FIG. 3. FIG. 25(b) is a drawing showing a cross section of the intermediate product in the manufacturing process. [Figure 26] FIG. 26(a) is a plan view showing one element section of an intermediate product in the manufacturing process of the element according to FIG. 3. FIG. 26(b) is a drawing showing a cross section of the intermediate product in the manufacturing process. [Figure 27] FIG. 27(a) is a plan view showing one element section of an intermediate product in the manufacturing process of the element according to FIG. 3. FIG. 27(b) is a drawing showing a cross section of the intermediate product in the manufacturing process. [Figure 28] FIG. 28(a) is a plan view showing one element section of an intermediate product in the manufacturing process of the element according to FIG. 3. FIG. 28(b) is a drawing showing a cross section of the intermediate product in the manufacturing process.

[0008] [Detailed Description] Hereinafter, respective embodiments for implementing the present disclosure will be described with reference to the drawings. The same or similar parts are denoted by the same or similar reference numerals, and redundant descriptions are omitted.

[0009] FIG. 1 is a drawing schematically showing an inductor element according to the present embodiment. FIG. 2 is a drawing schematically showing the inductor element according to the present embodiment in a cross section taken along line II-II of FIG. 1.

[0010] Figure 3 is a schematic diagram of the inductor element according to this embodiment. In Figure 3, the boundary 16 between the soft magnetic resin region 20 and the non-magnetic resin region 22 is shown by a dashed line. Figure 4 is a diagram showing the conductive layer and the soft magnetic layer of the inductor element of Figure 3 in a cross-section taken along the line IV-IV in Figure 3.

[0011] Referring to Figures 1 and 2, and Figures 3 and 4, the inductor element 11 comprises a support 13, a first resin body 15, and an inductor 17.

[0012] The support 13 has a main surface 13a and a back surface 13d, the back surface 13d being located on the opposite side of the main surface 13a. The main surface 13a has a first area 13b and a second area 13c, the second area 13c surrounding the first area 13b. The first area 13b has a first region 13f, a second region 13g surrounding the first region 13f, and a third region 13h surrounding the second region 13g.

[0013] The inductor 17 is made of a conductor and is located on the main surface 13a of the support 13. The inductor 17 includes a conductive layer 18 and an inner end electrode 27, the conductive layer 18 being provided on the main surface 13a of the support 13. An exemplary conductive layer 18 may include copper.

[0014] Specifically, the conductive layer 18 may have a first conductive layer portion 18f, a second conductive layer portion 18g, and a third conductive layer portion 18h. The first conductive layer portion 18f is located on the first region 13f. The inner end electrode 27 is located on the first conductive layer portion 18f. The second conductive layer portion 18g is located on the second region 13c. The third conductive layer portion 18h connects the first conductive layer portion 18f and the second conductive layer portion 18g.

[0015] The third conductive layer portion 18h has a pattern configured to generate a larger inductance compared to the inductance of a linear conductor. According to the inductor element 11, the inductance is generated by the pattern of the conductive layer 18 to provide, for example, a two-dimensional inductor 17. As shown in Figures 1 and 3, the conductive layer 18 has a first portion 18b located on the first area 13b and a second portion 18c located on the second area 13c. The inductance of the inductor 17 is provided by the inductor main portion 18a of the conductive layer 18. An exemplary inductor main portion 18a has, for example, a two-dimensional spiral shape.

[0016] The first resin body 15 is positioned within the first area 13b of the main surface 13a. The first resin body 15 may include a soft magnetic resin region 20 and a non-magnetic resin region 22. The non-magnetic resin region 22 is provided on the first area 13b. The soft magnetic resin region 20 includes at least a lower soft magnetic resin layer 21 and an upper soft magnetic resin layer 23, and the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 are positioned overlapping in at least a portion of the first area 13b.

[0017] As shown in Figures 2 and 4, the non-magnetic resin region 22 has an opening 22q for receiving the inner end electrode 27, and the soft magnetic resin region 20 has an opening 20q for receiving the inner end electrode 27.

[0018] In the inductor element 11, the inner end electrode 27 is located on the first portion 18b of the conductive layer 18. The exemplary main part 18a of the inductor is located on the lower soft magnetic resin layer 21 and below the upper soft magnetic resin layer 23.

[0019] The non-magnetic resin region 22 can make contact with at least one of the soft magnetic resin region 20 and the first conductive layer portion 18f, specifically with the first conductive layer portion 18f, on the first region 13f.

[0020] The non-magnetic resin region 22 is in contact with the first conductive layer portion 18f in the first region 13f. At least one of the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 is positioned to support the third conductive layer portion 18h on the second region 13g, and the third conductive layer portion 18h extends between the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23. An exemplary third conductive layer portion 18h may be in contact with and supported by the lower soft magnetic resin layer 21, but the disclosure is not limited thereto. The lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 are laminated on the third region 13h such that the lower soft magnetic resin layer 21 is provided between the support 13 and the upper soft magnetic resin layer 23. This lamination allows the soft magnetic resin region 20 to rise above the upper surface of the lower soft magnetic resin layer 21. This raised portion extends over the third region 13h and has a closed shape.

[0021] In this inductor element 11, the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 are laminated on the third region 13h such that the lower soft magnetic resin layer 21 is provided between the support 13 and the upper soft magnetic resin layer 23. This lamination forms a continuous soft magnetic resin region from the lower soft magnetic resin layer 21 to the upper soft magnetic resin layer 23, facilitating magnetic flux confinement.

[0022] Furthermore, the non-magnetic resin region 22 of the first resin body 15 is provided to extend in the first region 13f and contact the first conductive layer portion 18f of the first resin body 15. The non-magnetic resin region 22 reduces the ratio of the volume of the soft magnetic resin region 20 to the volume of the first resin body including the soft magnetic resin region 20 and the non-magnetic resin region 22 on the first area 13c, thereby facilitating magnetic flux confinement.

[0023] Furthermore, the third conductive layer portion 18h extends between the upper soft magnetic resin layer 23 and the lower soft magnetic resin layer 21 so as to be supported by at least one of the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 on the second region 13g, thereby confining the magnetic flux of the inductor element 11.

[0024] In the inductor element 11, the third conductive layer portion 18h extends between the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 so as to be supported by at least one of the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23, and the soft magnetic resin region 20 provides a higher magnetic permeability around the inductor 17 than that of the atmosphere.

[0025] The lower soft magnetic resin layer 21 includes a first insulating resin body 21a and a plurality of first magnetic materials 21b, 21c surrounded by the first insulating resin body 21a, the first magnetic materials 21b, 21c being dispersed by the first insulating resin body 21a. The upper soft magnetic resin layer 23 includes a second insulating resin body 23a and a plurality of second magnetic materials 23b, 23c surrounded by the second insulating resin body 23a, the second magnetic materials 23b, 23c being dispersed by the second insulating resin body 23a. The first magnetic materials 21b, 21c and the second magnetic materials 23b, 23c may contain magnetic materials. Specifically, the first magnetic materials 21b, 21c and the second magnetic materials 23b, 23c may contain magnetic metal elements or magnetic oxides such as ferrite.

[0026] The lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 are in contact with the conductive layer 18 of the inductor 17, while the soft magnetic resin region 20 does not cause a short circuit in the conductive layer 18.

[0027] The insulating resin bodies (21a, 23a) in the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 allow for the dispersion of magnetic material within the resin body, thereby reducing non-uniformity of magnetic permeability in each of the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23. Exemplary magnetic material may include magnetic pieces, magnetic particles, magnetic powder, or magnetic fillers. Furthermore, each of the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 forms insulating regions (21a, 23b) around the inductor 17. In addition, the density of magnetic material (21b, 23b) in each of the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 can be such that a short circuit of the inductor 17 does not occur. A short circuit of the inductor 17 may be caused, for example, by a chain reaction of magnetic material within the soft magnetic layer. The upper limit of the size of the magnetic material (21b, 23b) can be such that a short circuit does not occur in the inductor 17 through the magnetic material in the soft magnetic layer, and can be, for example, 100 micrometers or less. Increasing the thickness of the lower soft magnetic resin layer 21 makes it possible to relax the upper limit of the size of the magnetic material (21b, 23b). However, the disclosure is not limited thereto.

[0028] The insulating resin body (21a, 23a) may consist of a cured resin that can be supplied onto a substrate by, for example, a dispenser, and such a resin may contain a thermosetting agent. If necessary, an ultraviolet curing agent may be included instead of, or in addition to, the thermosetting agent.

[0029] The soft magnetic resin region 20 is provided on the first area 13b of the main surface 13a so as to form an island-shaped resin body. The edges of the soft magnetic resin region 20 and the non-magnetic resin region 22 are monotonically thinned from the inner point to the outer point on a certain reference plane, specifically a reference plane that passes through a line segment connecting an inner point and an outer point of the first area 13b covered by the island-shaped resin body and intersects the main surface 13a.

[0030] The soft magnetic resin region 20 has a height defined in a direction intersecting the main surface 13a. The non-magnetic resin region 22 is provided in the first area 13b between the highest height of the soft magnetic resin region 20 and the main surface 13a to reduce the ratio of the volume of the soft magnetic resin region 20 to the volume of the first resin body 15 around the inductor 17, specifically the first resin body 15 in the first area 13b. With respect to the volume of the first resin body 15, for example, with respect to the entire resin portion provided in the first area 13b between the highest height of the soft magnetic resin region 20 and the main surface 13a, the volume ratio of the soft magnetic resin region 20 to the entire resin portion is reduced by the use of the non-magnetic resin region 22.

[0031] On the other hand, a coating resin, such as a molding resin, is provided in the first area 13b at a height exceeding the maximum height of the soft magnetic resin region 20. Specifically, it is provided on the soft magnetic resin region 20 in the first area 13b and can cover the entire soft magnetic resin region 20. Such a coating resin is provided so as to exceed the maximum height of the soft magnetic resin region 20, while the non-magnetic resin region 22 is provided so as not to exceed the maximum height of the soft magnetic resin region 20. The coating resin body can protect the soft magnetic resin region 20 and the non-magnetic resin region 22. The exemplary coating resin body may comprise the same resin as the non-magnetic resin region 22.

[0032] The first resin body 15 has a thickness that matches the upper surface of the inner end electrode 27 and covers the side surface 27s of the inner end electrode 27. The nonmagnetic resin of the first resin body 15 can be a coating body comprising a coating resin such as epoxy or polyimide. The upper surface of the inner end electrode 27 is not covered by the first resin body 15 and is exposed from the coating resin of the first resin body 15.

[0033] The inductor element 11 may further include an outer end electrode 25, which in this embodiment is located on the second portion 18c of the conductive layer 18 within the second area 13c, as shown in Figures 1 and 3. The outer end electrode 25 is also separated from the first resin body 15. When the outer end electrode 25 is located on the second portion 18c of the conductive layer 18, processing of the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 can be avoided in order to form the outer end electrode 25.

[0034] The inductor element 11 may further comprise a second resin body 29, which is provided in the second area 13c. The second resin body 29 is provided so as to cover the side surface 25s of the outer end electrode 25. The second resin body 29 does not contain a soft magnetic resin. The second resin body 29 may be a coating body comprising a coating resin such as epoxy or polyimide. The upper surface of the outer end electrode 25 is not covered by the second resin body 29 and is exposed from the coating resin of the second resin body 29.

[0035] The inductor element 11 makes it possible to provide the second resin body 29 as a coating resin on the second area 13c of the main surface 13a, while avoiding providing the first resin body 15, which includes the soft magnetic resin region 20, on the second area 13c.

[0036] Referring to Figures 2 and 4, the exemplary inductor element 11 may include connecting electrodes 30, such as solder balls (e.g., AuSn), located at the upper ends of the outer electrode 25 and the inner electrode 27, respectively.

[0037] As shown in Figures 2 and 4, the support 13 may include, for example, a semiconductor region 14a, and may also include an insulating inorganic or organic insulating region 14b located above the semiconductor region 14a. The semiconductor region 14a may be, for example, silicon, silicon carbide, germanium, and silicon germanium. The disclosure is not limited thereto. In this embodiment, the main surface 13a of the support 13 may be provided by the insulating region 14b. The semiconductor region 14a may include, for example, one or more semiconductor devices 14c.

[0038] Referring to Figures 2 and 4, the side surface 27s of the inner end electrode 27 contacts the non-magnetic resin region 22 between the highest point of the soft magnetic resin region 20 and the main surface 13a. The non-magnetic resin region 22 has an opening 22q, and the inner end electrode 27 reaches the conductive layer 18 through the opening 22q. The soft magnetic resin region 20 has an opening 20q, and the inner end electrode 27 reaches the conductive layer 18 through the opening 20q.

[0039] The soft magnetic resin region 20 has a recess in at least the first region 13f. This recess is provided around the internal electrode 27 and is filled with the non-magnetic resin region 22. Referring to Figure 2, the exemplary recess reaches the main surface 13a. Referring to Figure 4, the exemplary recess reaches the lower soft magnetic resin layer 21. These exemplary recesses are formed by protrusions of the upper soft magnetic resin layer 23 relative to the lower soft magnetic resin layer 21, or by protrusions of both the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23.

[0040] Figure 5 is a diagram showing the conductive layer and the lower soft magnetic resin layer of the inductor element according to this embodiment in a cross-section taken along line II-II in Figure 1. Figure 6 is a diagram schematically showing the inductor element according to this embodiment in a cross-section taken along line II-II in Figure 1.

[0041] The inductor element 11 will be explained with reference to Figures 1, 2, 5, and 6.

[0042] At least one of the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 can be spaced apart from the inner end electrode 27. Furthermore, the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 provide a material with a higher magnetic permeability than air around the inductor 17, sandwiching the inductor 17 from both the upper and lower sides.

[0043] In this inductor element 11, the soft magnetic resin region 20 is formed in the second region 13g and the third region 13h so as to be separated from the inner end electrode 27 above the first region 13f, while the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 are not provided in the first region 13f. The conductive layer 18 extends outside the first region 13f and into the soft magnetic resin region 20 of the second region 13g and the third region 13h.

[0044] Specifically, at least a portion of the conductive layer 18 of the inductor 17 is in contact with the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 in the second region 13g. This inductor element 11 strengthens magnetic flux confinement by bringing at least a portion of the conductive layer 18 of the inductor 17 into contact with the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 in the second region 13g.

[0045] The third conductive layer portion 18h, specifically the inductor portion formed in a two-dimensional spiral shape, is in contact with at least one of the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23.

[0046] Furthermore, this inductor element 11 reduces the ratio of the volume of the soft magnetic resin region 20 to the volume of the first resin body 15, which includes the soft magnetic resin region 20 and the non-magnetic resin region 22 above the first area 13b. This reduction in ratio allows for adjustment and / or enhancement of magnetic flux confinement.

[0047] As shown in Figure 2, the inner end electrode 27 has a side surface 27s, and the side surface 27s can be covered by a non-magnetic resin region 22 without being covered by a soft magnetic resin region 20.

[0048] As shown in Figure 6, the soft magnetic resin region 20 has an opening 20q in the first region 13f. Specifically, the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 of the first resin body 15 are provided in a closed shape that surrounds the first region 13f in the second region 13g and the third region 13h, thereby forming a recess of the soft magnetic resin region 20 in the first region 13f.

[0049] The non-magnetic resin region 22 is provided in a recess in the soft magnetic resin region 20 and covers at least a portion of the first conductive layer portion 18f of the conductive layer 18. The non-magnetic resin region 22 is also provided in a recess in the soft magnetic resin region 20 and covers the side surface 27s of the inner end electrode 27. The side surface 27s of the inner end electrode 27 is in close contact with the side surface 23s of the resin region, specifically the non-magnetic resin region 22, at the opening 23h. The non-magnetic resin region 22 has an opening 22q in the first region 13f, and the opening 22q receives the inner end electrode 27.

[0050] The third conductive layer portion 18h extends between the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 so as to be supported by the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 on the second region 13g. The exemplary first conductive layer portion 18f is in contact with the main surface 13a of the support 13 in the first area 13b.

[0051] Figure 7 is a diagram showing the conductive layer and the lower soft magnetic resin layer of the inductor element according to this embodiment in a cross-section taken along the line VI-VI in Figure 3. Figure 8 is a diagram showing the conductive layer and the soft magnetic resin region of the inductor element according to this embodiment in a cross-section taken along the line IV-IV in Figure 3.

[0052] The inductor element 11 will be explained with reference to Figures 3, 4, 7, and 8.

[0053] The lower soft magnetic resin layer 21 is provided on the first region 13f in addition to the second region 13g and the third region 13h. The first conductive layer portion 18f is located on the lower soft magnetic resin layer 21 in the first region 13f of the first area 13b.

[0054] A non-magnetic resin region 22 is provided in the second region 13g between the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23, reducing the ratio of the volume of the soft magnetic resin region 20 to the volume of the first resin body 15 on the first area 13b. This reduction in ratio allows for adjustment of magnetic flux confinement.

[0055] As shown in Figure 8, the upper soft magnetic resin layer 23 has an opening 23h located above the first region 13f, and the inner end electrode 27 passes through the opening 23h of the upper soft magnetic resin layer 23.

[0056] The soft magnetic resin region 20 is provided in a closed shape within the third region 13h, forming recesses in the first region 13f and the second region 13g. Specifically, the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 are laminated (soft magnetic resin laminate) on the third region 13h, and this soft magnetic resin laminate can provide recesses of the soft magnetic resin region 20 in the first region 13f and the second region 13g.

[0057] The recess in the soft magnetic resin region 20 is filled with a non-magnetic resin region 22, which supports the inductor 17. This filling ensures that the inductor 17 is surrounded by a material with a higher permeability than air.

[0058] The upper soft magnetic resin layer 23 extends over the first region 13f and the second region 13g, spaced apart from the lower soft magnetic resin layer 21 in the first region 13f and the second region 13g, so as to cover the recesses of the soft magnetic resin region 20. This extension reaches the side surface 27s of the inner end electrode 27, providing a ceiling that covers the recesses of the lower soft magnetic resin layer 21.

[0059] Furthermore, the non-magnetic resin region 22 is supported in the second region 13g by the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23, and extends along these soft magnetic layers. Specifically, the non-magnetic resin region 22 extends within the recess of the soft magnetic resin region 20 between the upper soft magnetic resin layer 23 and the lower soft magnetic resin layer 21 to reach the side surface 27s of the inner end electrode 27. The soft magnetic resin region 20 has an opening 20q in the first region 13f, and the non-magnetic resin region 22 has an opening 22q in the first region 13f. The openings 20q and 22q receive the inner end electrode 27.

[0060] Accordingly, as shown in Figure 8, the side surface 27s of the inner end electrode 27 has a first side surface portion that contacts the non-magnetic resin region 22 in the direction from the lower soft magnetic resin layer 21 to the upper soft magnetic resin layer 23, and a second side surface portion that contacts the upper soft magnetic resin layer 23.

[0061] At least a portion of the conductive layer 18 of the inductor 17 is spaced apart in the second region 13g from one of the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 of the first resin body 15, for example from the upper soft magnetic resin layer 23, thereby providing a soft magnetic gap between the first resin body 15 and the conductive layer 18.

[0062] The soft magnetic void (the void between the soft magnetic resin region 20 and the conductive layer 18) is filled with a non-magnetic resin region 22, which supports the inductor 17. Due to this filling, the inductor 17 is surrounded by a material with a magnetic permeability greater than that of air.

[0063] According to this inductor element 11, filling the soft magnetic gap with the non-magnetic resin region 22 reduces the ratio of the volume of the soft magnetic resin region 20 to the volume of the first resin body 15 on the first area 13b.

[0064] Figures 5 and 7 depict the conductive layer 18 and the lower soft magnetic resin layer 21 provided on the support 13 for ease of understanding. The lower soft magnetic resin layer 21 includes a base portion 22a and a central portion 22b located inside the base portion 22a in the first area 13b of the main surface 13a. The base portion 22a is inclined compared to the upper surface 22c of the central portion 22b, thereby allowing the thickness of the lower soft magnetic resin layer 21 to gradually decrease at the base portion 22a. The base portion 22a has a side surface 22s that slopes smoothly with respect to the upper surface 22c of the central portion 22b adjacent to the boundary between the base portion 22a and the central portion 22b. In order to position the lower soft magnetic resin layer 21 within the first area 13b, the change in the thickness of the lower soft magnetic resin layer 21 is caused at the base portion 22a. The upper surface 22c of the central portion 22b is substantially flatter than the side surface 22s of the base portion 22a.

[0065] In the cross-sections shown in Figures 5 and 7, the size of the main surface 13a inside the boundary between the base portion 22a and the central portion 22b can be five times or more, or ten times or more, than the size of the base portion 22a extending outward from the central portion 22b along the main surface 13a. With such a size ratio, the central portion 22b is provided with a size suitable for arranging the conductive layer 18 of the inductor element 11.

[0066] Figures 6 and 8 depict the conductive layer 18, the lower soft magnetic resin layer 21, the upper soft magnetic resin layer 23, and the inner end electrode 27 provided on the support 13 for ease of understanding. The upper soft magnetic resin layer 23 includes a base portion 24a and a central portion 24b surrounded by the base portion 24a in the first area 13b of the main surface 13a. The base portion 24a is inclined compared to the upper surface 24c of the central portion 24b, which allows the thickness of the upper soft magnetic resin layer 23 to gradually decrease at the base portion 24a. The side surface 24s of the base portion 24a is smoothly inclined relative to the upper surface 24c of the central portion 24b, and the change in the thickness of the upper soft magnetic resin layer 23 is caused at the base portion 24a in order to position the upper soft magnetic resin layer 23 within the first area 13b. The upper surface 24c of the central portion 24b is substantially flatter than the side surface 24s of the base portion 24a.

[0067] In the cross-sections shown in Figures 6 and 8, the size of the upper surface 22c of the central portion 22b can be five times or more, or ten times or more, than the size of the lower edge portion 24a that extends from the central portion 24b along the surface of the lower soft magnetic resin layer 21. With such a size ratio, the central portion 24b is provided with a size suitable for covering the conductive layer 18 of the inductor element 11.

[0068] The openings in the soft magnetic resin region 20 and the non-magnetic resin region 22 reach the first portion 18b of the conductive layer 18. Also, the opening 23h of the upper soft magnetic resin layer 23 is located on the first portion 18b of the conductive layer 18, as shown in Figure 8. The inner end electrode 27 extends through the opening 23h of the upper soft magnetic resin layer 23 to reach the conductive layer 18, such that the upper soft magnetic resin layer 23 covers a portion of the side surface 27s of the inner end electrode 27. Specifically, when the upper soft magnetic resin layer 23 is formed after the formation of the inner end electrode 27, the opening 23h of the upper soft magnetic resin layer 23 is shaped to match the shape of the inner end electrode 27. Therefore, the size of the opening 23h is matched to the cross-sectional shape of the inner end electrode 27, and the lower portion of the side surface 27s of the inner end electrode 27 is in close contact with the side surface 23s of the resin region (20, 22) at the opening 23h. The upper portion of the side surface 27s of the inner end electrode 27 is not covered by the upper soft magnetic resin layer 23. According to the inductor element 11, the inner end electrode 27 is electrically connected to the conductive layer 18 through the opening 23h of the upper soft magnetic resin layer 23.

[0069] On the other hand, since the outer end electrode 25 is separated from the first resin body 15, the outer end electrode 25 can be formed without processing the first resin body 15.

[0070] Referring to Figures 5 to 8, in this embodiment, the main inductor portion 18a of the conductive layer 18 can be positioned within the upper surface 22c of the central portion 22b. The lower portion 22a has a side surface 22s, and the side surface 22s does not include a steep step exceeding the thickness of the conductive layer 18, such as a sheer cliff shape. Furthermore, the first magnetic materials 21b and 21c within the lower soft magnetic resin layer 21 are preferably covered by the first insulating resin material 21a without substantially appearing on the upper surface of the lower soft magnetic resin layer 21.

[0071] The conductive layer 18 further comprises a third portion 18d located at the boundary between the first area 13b and the second area 13c, the third portion 18d crossing the boundary between the first area 13b and the second area 13c and connecting the first portion 18b and the second portion 18c.

[0072] In the inductor element 11, the combination of the spiral-shaped conductive layer 18 and the lower soft magnetic resin layer 21 and upper soft magnetic resin layer 23 sandwiching the main part of the inductor 18a can provide a large inductance and magnetic flux confinement.

[0073] The outer end electrode 25 and the inner end electrode 27 are connected to the outer end 20b and the inner end 20a, respectively. In this embodiment, the main part of the inductor 18a has a spiral shape, and the conductive layer 18 extends from the inner end 20a of the spiral shape in either a clockwise or counterclockwise direction, surrounding the inner end 20a. The main part of the inductor 18a has a plurality of circumferential portions that encircle the inner end 20a, for example, a shape that makes one or more turns around the inner end electrode 27. The plurality of circumferential portions in the conductive layer 18 have the innermost inner portion and the outermost outer portion of the spiral shape. At least one of the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 is located between the circumferential portions and contributes to magnetic flux confinement. The conductive layer 18 has one or more intermediate circumferential portions between the inner portion and the outer portion.

[0074] The inductor element 11 according to this embodiment can be manufactured using the following exemplary method.

[0075] Figures 9(a) to 20(b) are diagrams illustrating the main steps in the method for fabricating an inductor element according to this embodiment. In the following description, although a wafer-sized substrate is used for the fabrication of the inductor element 11 instead of a support 13, the support will be referred to as "13" for simplicity. Accordingly, each of Figures 9(a) to 20(b) shows a single element section. Each of Figures 9(a) to 20(b) shows a plan view in the exemplary fabrication process of the element according to Figures 1 and 2, and each of Figures 9(b) to 20(b) shows a cross-sectional view in the exemplary fabrication process of the element according to Figures 1 and 2.

[0076] Referring to Figures 9(a) and 9(b), a substrate having the size of a wafer is prepared (in the following description, it will be referred to as "support 13" for ease of understanding). Similar to the description of support 13, support 13 includes a main surface 13a, which has a first area 13b and a second area 13c. After preparation, a lower soft magnetic resin layer 21 is formed on the first area 13b of support 13. The formation of the lower soft magnetic resin layer 21 follows the procedure below.

[0077] First, an uncured first soft magnetic resin liquid 31 for the lower soft magnetic resin layer 21 is prepared, and the first soft magnetic resin liquid 31 is placed within the first area 13b of the support 13. This placement can be achieved by various methods, such as dropping, printing, or coating the first soft magnetic resin liquid 31 within the first area 13b, for example, following arrow ARW1. In this embodiment, the first soft magnetic resin liquid 31 is placed within the first area 13b using a dispenser 33a. The first soft magnetic resin liquid 31 is placed within the first area 13b along the boundary between the first area 13b and the second area 13c, and has an opening 31h in the center of the first area 13b. The first soft magnetic resin liquid 31 forms a closed raised region, which has a flat surface 31s.

[0078] Referring to Figures 10(a) and 10(b), the first soft magnetic resin liquid 31 is placed in the first area 13b, and then the soft magnetic resin liquid 31 is cured to obtain the lower soft magnetic resin layer 21. In this embodiment, heat treatment is used for curing. Specifically, the support 13 containing the first soft magnetic resin liquid 31 is placed in a heat treatment apparatus 33b (e.g., a bake apparatus), and the lower soft magnetic resin layer 21 is generated from the first soft magnetic resin liquid 31 by heat treatment.

[0079] Referring to Figures 11(a) and 11(b), after forming the lower soft magnetic resin layer 21, a conductive layer 18 having a pattern for the inductor 17 is formed. The conductive layer 18 has a first portion 18b located on the first area 13b of the support 13 and a second portion 18c of the support 13 located on the second area 13c. The conductive layer 18 also extends across the boundary between the first area 13b and the second area 13c. Patterning of the conductive layer 18 is performed, for example, by deposition of a conductive film and pattern formation. Deposition of the conductive film is performed, for example, by depositing a metal, such as titanium, by sputtering. Pattern formation can be performed, for example, by photolithography and etching, or by using the lift-off method. The main inductor portion 18a of the conductive layer 18 (see Figures 1 and 3) is formed on the closed-shaped lower soft magnetic resin layer 21.

[0080] Referring to Figures 12(a) and 12(b), in this embodiment, an outer electrode 25 and an inner electrode 27 are formed on the conductive layer 18. While the outer electrode 25 and the inner electrode 27 can be formed separately in their respective processes, here they are formed together in a shared process. The outer electrode 25 and the inner electrode 27 are formed on the first portion 18b and the second portion 18b of the conductive layer 18, respectively. The formation of the outer electrode 25 and the inner electrode 27 is carried out, for example, by electroplating. Specifically, a seed layer SD is formed on the entire surface of the support 13, and then a resist film having patterns for the outer electrode 25 and the inner electrode 27 is formed. The support 13 and the resist film are immersed in an electroplating solution, and metal deposition is induced while an electric current is passed through them. In this embodiment, copper posts PT are formed by electroplating.

[0081] Referring to Figures 13(a) and 13(b), after forming the outer end electrode 25 and the inner end electrode 27, the upper soft magnetic resin layer 23 is formed in the first area 13b of the support 13. The formation of the upper soft magnetic resin layer 23 follows the procedure below.

[0082] First, an uncured first soft magnetic resin liquid 35 is prepared for the upper soft magnetic resin layer 23, and the second soft magnetic resin liquid 35 is placed within the first area 13b of the support 13. This placement can be achieved by various methods, such as dropping, printing, or coating the second soft magnetic resin liquid 35 within the first area 13b. In this embodiment, the second soft magnetic resin liquid 35 is formed using a dispenser 33c along arrow ARW2. The second soft magnetic resin liquid 35 is placed within the first area 13b, avoiding the central part of the first area 13b. The second soft magnetic resin liquid 35 is formed in a closed shape on the lower soft magnetic resin layer 21 so as to cover the main inductor portion 18a of the conductive layer 18 (see Figures 1 and 3).

[0083] Referring to Figures 14(a) and 14(b), the second soft magnetic resin liquid 35 is placed in the first area 13b, and then the second soft magnetic resin liquid 35 is cured to obtain the upper soft magnetic resin layer 23. In this embodiment, heat treatment is used for curing. Specifically, the support 13 containing the second soft magnetic resin liquid 35 is placed in a heat treatment apparatus 33d (e.g., a bake apparatus), and the upper soft magnetic resin layer 23 is generated from the second soft magnetic resin liquid 35 by heat treatment.

[0084] Referring to Figures 15(a) and 15(b), after forming the soft magnetic resin region 20, a non-magnetic resin region 22 is formed in the first area 13b of the support 13. Specifically, the non-magnetic resin region 22 is formed by forming a thick sealing film 37 over the entire surface, specifically in the first area 13b and the second area 13c. The sealing film 37 can be, for example, an epoxy resin. The sealing film 37 can be formed, for example, by spin coating. The sealing film 37 is cured by heat treatment. In the following description, the cured sealing film will be denoted by the reference numeral "37". The thick sealing film 37 has a thickness such that it embeds the outer end electrode 25 and the inner end electrode 27.

[0085] Referring to Figures 16(a) and 16(b), the thick sealing film 37 is polished to expose the upper ends of the outer electrode 25 and the inner electrode 27. Polishing transforms the thick sealing film 37 into a sealant 39. An exemplary sealant 39 may have a thickness of, for example, about 300 micrometers or less. The lower soft magnetic resin layer 21 may have a thickness of, for example, about 100 micrometers or less. The upper soft magnetic resin layer 23 may have a thickness of, for example, about 100 micrometers or less. The lower soft magnetic resin layer 21 may also have a thickness of, for example, about 40 micrometers or more. The upper soft magnetic resin layer 23 may also have a thickness of, for example, about 40 micrometers or more. The upper soft magnetic resin layer 23 allows the inductor to be separated from the sealant 39.

[0086] Referring to Figures 17(a) and 17(b), after forming the sealant 39, electrodes 41 are formed on the exposed upper ends of the outer end electrode 25 and the inner end electrode 27. The electrodes 41 may include, for example, solder balls.

[0087] Referring to Figures 18(a) and 18(b), after forming the sealant 39, the back surface of the support 13 (substrate) is polished to provide the support 13 with the desired thickness. The sides of the outer end electrode 25 and the inner end electrode 27 are covered by the sealant 39. The wafer used in manufacturing can have a thickness of, for example, about 700 micrometers. The support 13 can have a thickness of, for example, about 200 micrometers or less.

[0088] According to this manufacturing method, at the wafer level, multiple intermediate products including the support 13 are arranged to form a two-dimensional array. In each element compartment of the intermediate product, the lower soft magnetic resin layer 21 is formed in the first area 13b, followed by the formation of the conductive layer 18 of the inductor 17, and then the upper soft magnetic resin layer 23 is formed in the first area 13b after the conductive layer 18 of the inductor 17 has been formed. At least the main part 18a of the inductor of the conductive layer 18 is provided between the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23. The structure of the element compartment makes it possible to reduce the volume ratio of the soft magnetic resin region 20 to the total volume of the soft magnetic resin region 20 and the non-magnetic resin region 22 in the first resin body 15. Adding the non-magnetic resin region 22 makes it possible to reduce the area where the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23 are provided compared to the main surface 13a of the first area 13b.

[0089] Furthermore, the outer end electrode 25 is separated from the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23. The outer end electrode 25 is formed without processing the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23. According to this manufacturing method, the inner end electrode 27 is formed without processing the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23.

[0090] Figures 19(a) to 30(b) are diagrams showing the main steps in the method for manufacturing an inductor element according to this embodiment. In the following description, although a wafer-sized substrate is used for manufacturing the inductor element 11 instead of the support 13, the support 13 will be used for simplicity. Therefore, each of Figures 19(a) to 30(b) shows a single element section. Each of Figures 19(a) to 30(a) shows a plan view of the manufacturing process of the element according to Figure 1(a), and each of Figures 19(b) to 30(b) shows a cross-sectional view of the manufacturing process of the element according to Figure 1(b).

[0091] Referring to Figures 19(a) and 19(b), a support 13 (substrate) including a main surface 13a is prepared. The main surface 13a has a first area 13b and a second area. After preparation, a lower soft magnetic resin layer 21 is formed on the first area 13b of the support 13. The formation of the lower soft magnetic resin layer 21 follows the procedure below.

[0092] First, an uncured first soft magnetic resin liquid 31 is prepared for the lower soft magnetic resin layer 21, and the first soft magnetic resin liquid 31 is placed within the first area 13b of the support 13. This placement can be achieved by various methods, such as dropping, printing, or coating the first soft magnetic resin liquid 31 within the first area 13b. In this embodiment, the first soft magnetic resin liquid 31 is placed over the entire first area 13b using a dispenser 33a. The first soft magnetic resin liquid 31 forms a single connected region, which has a flat surface 31s. The central portion of the surface 31s is flat.

[0093] Referring to Figures 20(a) and 20(b), the first soft magnetic resin liquid 31 is placed in the first area 13b, and then the first soft magnetic resin liquid 31 is cured to obtain the lower soft magnetic resin layer 21. In this embodiment, heat treatment is used for curing. Specifically, the support 13 containing the first soft magnetic resin liquid 31 is placed in a heat treatment apparatus 33b (e.g., a bake apparatus), and the lower soft magnetic resin layer 21 is generated from the first soft magnetic resin liquid 31 by heat treatment.

[0094] Referring to Figures 21(a) and 21(b), after forming the lower soft magnetic resin layer 21, a conductive layer 18 having a pattern for the inductor 17 is formed. The conductive layer 18 has a first portion 18b located on the first area 13b of the support 13 and a second portion 18c of the support 13 located on the second area 13c. The conductive layer 18 also extends across the boundary between the first area 13b and the second area 13c. Patterning of the conductive layer 18 is performed, for example, by deposition of a conductive film and pattern formation. Deposition of the conductive film is performed, for example, by depositing a metal, such as titanium, by sputtering. Pattern formation can be performed, for example, by photolithography and etching, or by using the lift-off method. The main inductor portion 18a of the conductive layer 18 (see Figures 1 and 3) is formed on the closed-shaped lower soft magnetic resin layer 21.

[0095] Referring to Figures 22(a) and 22(b), in this embodiment, an outer electrode 25 and an inner electrode 27 are formed on the conductive layer 18. Although the outer electrode 25 and the inner electrode 27 can be formed separately in their respective processes, here they are formed together in a common process. The outer electrode 25 and the inner electrode 27 can be manufactured by separate processes, the disclosure is not limited thereto. Furthermore, the formation of the outer electrode 25 and the inner electrode 27 is carried out, for example, by electroplating, as already described. The disclosure is not limited thereto. In this embodiment, copper posts PT are formed by electroplating. The outer electrode 25 and the inner electrode 27 are formed on the first portion 18b and the second portion 18b of the conductive layer 18, respectively.

[0096] Referring to Figures 23(a) and 23(b), after forming the outer end electrode 25 and the inner end electrode 27, the upper soft magnetic resin layer 23 is formed in the first area 13b of the support 13. In this embodiment, the upper soft magnetic resin layer 23 is formed after the formation of the outer end electrode 25 and the inner end electrode 27. However, the disclosure is not limited thereto. The formation of the upper soft magnetic resin layer 23 follows the procedure described below.

[0097] First, an uncured first soft magnetic resin liquid 35 is prepared for the upper soft magnetic resin layer 23, and the second soft magnetic resin liquid 35 is placed within the first area 13b of the support 13. This placement can be achieved by various methods, such as dropping, printing, or coating the second soft magnetic resin liquid 35 within the first area 13b. In this embodiment, the second soft magnetic resin liquid 35 is placed within the first area 13b using a dispenser 33c. Specifically, the second soft magnetic resin liquid 35 is formed along the boundary between the first area 13b and the second area 13c. The formed second soft magnetic resin liquid 35 is placed so as to avoid the main inductor portion 18a of the conductive layer 18 (see Figures 1 and 3), or it can be formed on the lower soft magnetic resin layer 21 so as not to cover the entire main inductor portion 18a. In the example, the second soft magnetic resin liquid 35 is formed on the lower soft magnetic resin layer 21 so as not to cover the main inductor portion 18a.

[0098] Referring to Figures 24(a) and 24(b), the second soft magnetic resin liquid 35 is placed in the first area 13b, and then the second soft magnetic resin liquid 35 is cured to obtain a part of the upper soft magnetic resin layer 23. In this embodiment, heat treatment is used for curing. Specifically, the support 13 containing the second soft magnetic resin liquid 35 is placed in a heat treatment apparatus 33d (e.g., a bake apparatus), and a part of the upper soft magnetic resin layer 23 is generated from the second soft magnetic resin liquid 35 by heat treatment. This part (a part of the upper soft magnetic resin layer 23) extends along the outer edge of the lower soft magnetic resin layer 21, forming a closed (rib-like) soft magnetic resin region (23f) that rises from the upper surface of the lower soft magnetic resin layer 21. The raised soft magnetic resin region (23f) forms a depression (23d) inside it.

[0099] Referring to Figures 25(a) and 25(b), a portion (23d) of the upper soft magnetic resin layer 23 is placed in the first area 13b, and then the non-magnetic resin liquid 34 is placed. The non-magnetic resin liquid 36 is provided into the depression (23d) of the raised soft magnetic resin region (23f). Providing a predetermined amount of non-magnetic resin liquid 34 prevents it from overflowing from the depression. After providing the non-magnetic resin liquid 34, the non-magnetic resin liquid 34 is cured to obtain the non-magnetic resin region 22. In this embodiment, heat treatment is used for curing. Specifically, the support 13 containing the non-magnetic resin liquid 36 is placed in a heat treatment apparatus 33d (e.g., a bake apparatus), and the non-magnetic resin region 22 is generated from the non-magnetic resin liquid 36 by heat treatment. The non-magnetic resin region 22 is formed in the depression (23d) inside the raised soft magnetic resin region (23f).

[0100] Referring to Figures 26(a) and 26(b), after the non-magnetic resin liquid 36 is cured, the remaining portion (23g) of the upper soft magnetic resin layer 23 is formed in the first area 13b of the support 13. In this embodiment, the remaining portion (23g) of the upper soft magnetic resin layer 23 is formed after the formation of the non-magnetic resin region 22. The formation of the remaining portion (23g) of the upper soft magnetic resin layer 23 follows the procedure below.

[0101] First, an uncured third soft magnetic resin liquid 36 for the upper soft magnetic resin layer 23 is prepared, and the third soft magnetic resin liquid 36 is placed within the first area 13b of the support 13. This placement can be achieved by various methods, such as dropping, printing, or coating the third soft magnetic resin liquid 36 within the first area 13b. In this embodiment, the third soft magnetic resin liquid 36 is placed within the first area 13b using a dispenser 33c. Specifically, the third soft magnetic resin liquid 36 is formed to cover the entire non-magnetic resin region 22 over the entire first area 13b, and also to cover the raised soft magnetic resin region (23f). The formed third soft magnetic resin liquid 36 covers the entire non-magnetic resin region 22 and is formed on the raised soft magnetic resin region (23f). As a result, the non-magnetic resin region 22 is surrounded by the soft magnetic resin region 20 throughout. Furthermore, the third soft magnetic resin liquid 36 can be formed to cover the non-magnetic resin region 22 and the raised soft magnetic resin region (23f).

[0102] Referring to Figures 27(a) and 27(b), the third soft magnetic resin liquid 36 is placed in the first area 13b, and then the third soft magnetic resin liquid 36 is cured to obtain a portion (23g) of the upper soft magnetic resin layer 23. In this embodiment, heat treatment is used for curing. Specifically, the support 13 containing the third soft magnetic resin liquid 36 is placed in a heat treatment apparatus 33d (e.g., a bake apparatus), and a portion (23g) of the upper soft magnetic resin layer 23 is generated from the third soft magnetic resin liquid 36 by heat treatment. This portion (23g) is formed to cover the raised portion (23f) and the non-magnetic resin region 22 that extend along the outer edge of the lower soft magnetic resin layer 21.

[0103] Referring to Figures 28(a) and 28(b), after forming the soft magnetic resin region 20 and the non-magnetic resin region 22, a thick sealing film 37 is formed over the entire surface of the support 13. The sealing film 37 may be, for example, an epoxy resin. The sealing film 37 may be formed, for example, by spin coating. The sealing film 37 is cured by heat treatment. In the following description, the cured sealing film will be denoted by the reference numeral "37". The thick sealing film 37 has a thickness that embeds the outer end electrode 25 and the inner end electrode 27.

[0104] Refer again to Figures 16(a) and 16(b), Figures 17(a) and 17(b), and Figures 18(a) and 18(b). The thick sealing film 37 is polished, as shown in Figures 16(a) and 16(b), to expose the upper ends of the outer electrode 25 and the inner electrode 27. Then, after forming the sealing body 39, as shown in Figures 17(a) and 17(b), electrodes 41 are formed on the exposed upper ends of the outer electrode 25 and the inner electrode 27.

[0105] As shown in Figures 18(a) and 18(b), the back surface of the support 13 (substrate) is polished to provide the support 13 with a desired thickness. The wafer used in manufacturing can have a thickness of, for example, about 700 micrometers. The support 13 can have a thickness of, for example, about 200 micrometers or less.

[0106] According to this manufacturing method, the lower soft magnetic resin layer 21 is formed in the first area 13b, and then the conductive layer 18 of the inductor 17 is formed. After the conductive layer 18 of the inductor 17 is formed, a raised portion (23f) of the upper soft magnetic resin layer 23 is formed along the outer circumference of the main part 18a of the inductor. Next, a non-magnetic resin region 22 is formed inside the raised portion (23f) of the upper soft magnetic resin layer 23 so as to cover the main part 18a of the inductor. After this, the remaining portion (23g) of the upper soft magnetic resin layer 23 is formed so as to cover the portion (23f) of the upper soft magnetic resin layer 23 and the non-magnetic resin region 22. At least the main part 18a of the conductive layer 18 is provided between the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23. On the other hand, the non-magnetic resin region 22 is provided on at least one of the upper and lower sides of the main part 18a of the inductor, contributing to a reduction in the volume of the soft magnetic resin region 20.

[0107] The outer end electrode 25 is separated from the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23. The outer end electrode 25 is formed without processing the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23. According to this manufacturing method, the inner end electrode 27 is formed without processing the lower soft magnetic resin layer 21 and the upper soft magnetic resin layer 23.

[0108] This method is not limited to the exemplary manufacturing procedure described above, and allows for the placement and curing of the second soft magnetic resin liquid 35 and the placement and curing of the non-magnetic resin liquid 36 prior to the formation of the conductive layer 18. The conductive layer 18 can be formed on the non-magnetic resin region 22.

[0109] As described above, this embodiment provides an inductance element having a structure that can adjust magnetic flux confinement, and a method for manufacturing this inductance element. Furthermore, this embodiment provides an inductance element having a structure that can reduce magnetic flux spreading.

[0110] In accordance with this embodiment, the present disclosure has various aspects as shown below.

[0111] The inductor element of the first side of this embodiment is a support having a main surface including a first area and a second area surrounding the first area, wherein the first area has a first region, a second region surrounding the first region, and a third region surrounding the second region; and an inductor including a conductive layer and an inner end electrode extending over the main surface of the support, wherein the conductive layer has a first conductive layer portion located above the first region of the first area, a second conductive layer portion located above the second area, and a third conductive layer portion connecting the first conductive layer portion and the second conductive layer portion, the third conductive layer portion having a pattern configured to generate inductance, and the inner end electrode is located above the first conductive layer portion and is disposed within the first area of ​​the main surface, including a non-magnetic resin region and a soft magnetic resin region having an opening for receiving the inner end electrode. A first resin body comprising: a first resin body wherein the soft magnetic resin region has a recess in at least the first region, the non-magnetic resin region is provided in the recess, the soft magnetic resin region includes a lower soft magnetic resin layer and an upper soft magnetic resin layer, the upper soft magnetic resin layer and the lower soft magnetic resin layer are laminated on the third region such that the lower soft magnetic resin layer is provided between the support and the upper soft magnetic resin layer, and the third conductive layer portion extends between the upper soft magnetic resin layer and the lower soft magnetic resin layer on the second region so as to be supported by at least one of the upper soft magnetic resin layer and the lower soft magnetic resin layer; the lower soft magnetic resin layer includes a first insulating resin body and a plurality of first magnetic materials surrounded by the first insulating resin body, and the upper soft magnetic resin layer includes a second insulating resin body and a plurality of second magnetic materials surrounded by the second insulating resin body.

[0112] This inductor element allows for the control of magnetic flux confinement from the inductor.

[0113] In the inductor element of the second side according to the first side of this embodiment, at least one of the lower soft magnetic resin layer and the upper soft magnetic resin layer can be separated from the inner end electrode.

[0114] According to this inductor element, the distance between at least one of the inner end electrodes of the lower soft magnetic resin layer and the upper soft magnetic resin layer is such that the spread of the magnetic flux can be reduced due to the decrease in soft magnetic resin.

[0115] In the inductor element of the first side or the third side according to the second side of this embodiment, the lower soft magnetic resin layer and the upper soft magnetic resin layer can be located outside the first region.

[0116] In this inductor element, the lower soft magnetic resin layer and the upper soft magnetic resin layer are positioned outside the first region, and the spread of the magnetic flux can be reduced by decreasing the amount of soft magnetic resin.

[0117] In the inductor element of the first side, second side, or fourth side according to the third side of this embodiment, at least a portion of the conductive layer of the inductor can be in contact with the lower soft magnetic resin layer and the upper soft magnetic resin layer in the second and third regions.

[0118] According to this inductor element, the conductive layer of the inductor that is in contact with the lower soft magnetic resin layer and the upper soft magnetic resin layer in the second and third regions enables magnetic flux confinement.

[0119] In the inductor element of this embodiment, the fifth side conforms to any one of the first to fourth sides, and the inner end electrode has a side surface, and the side surface of the inner end electrode can be covered by the non-magnetic resin region without being covered by the upper soft magnetic resin layer.

[0120] According to this inductor element, the non-magnetic resin region covering the side surface of the inner end electrode reduces the amount of resin in the upper soft magnetic resin layer in the first area, enabling magnetic flux confinement.

[0121] In the inductor element of the sixth side according to any one of the first to fifth sides of this embodiment, the third conductive layer portion has an inductor portion having a spiral shape, and the inductor portion of the third conductive layer portion can be in contact with at least one of the lower soft magnetic resin layer and the upper soft magnetic resin layer.

[0122] With this inductor element, at least one of the lower soft magnetic resin layer and the upper soft magnetic resin layer is in contact with the inductor portion, enabling magnetic flux confinement.

[0123] In the inductor element of this embodiment, the seventh side conforming to any one of the first to sixth sides, the lower soft magnetic resin layer and the upper soft magnetic resin layer are provided in a closed shape that surrounds the first region in the second and third regions, thereby forming the recess.

[0124] In this inductor element, the second and third regions, which are closed in shape and surround the first region, reduce the amount of resin in the soft magnetic resin region, enabling magnetic flux confinement.

[0125] In the inductor element of the eighth side according to the seventh side of this embodiment, the non-magnetic resin region is provided in the recess of the soft magnetic resin region and can make contact with the first conductive layer portion in the first region.

[0126] In this inductor element, a non-magnetic resin region is provided in the recess of the soft magnetic resin region so as to make contact with the first conductive layer, reducing the amount of resin in the soft magnetic resin region and enabling the soft magnetic resin region to confine the magnetic flux.

[0127] In the inductor element of the ninth side according to the seventh or eighth side of this embodiment, the non-magnetic resin region can be provided in the recess of the soft magnetic resin region and cover the side surface of the inner end electrode.

[0128] In this inductor element, the non-magnetic resin region covering the side surface of the inner end electrode reduces the amount of resin in the soft magnetic resin region in the first area, allowing the soft magnetic resin region to confine the magnetic flux.

[0129] In the inductor element of this embodiment, the tenth side conforming to any one of the first to ninth sides, the first conductive layer portion of the conductive layer can be in contact with the main surface of the support in the first area.

[0130] In this inductor element, the recess in the soft magnetic resin region is provided such that the first conductive layer portion of the conductive layer contacts the main surface of the support in the first area.

[0131] In the inductor element of the 11th side surface according to the first side surface of this embodiment, the non-magnetic resin region can be provided in the second region between the lower soft magnetic resin layer and the upper soft magnetic resin layer.

[0132] According to this inductor element, providing a non-magnetic resin region in the second region between the lower soft magnetic resin layer and the upper soft magnetic resin layer reduces the amount of resin in the soft magnetic resin region, enabling the soft magnetic resin region to confine the magnetic flux.

[0133] In the inductor element of the first side or the twelfth side according to the eleventh side of this embodiment, the upper soft magnetic resin layer has an opening located above the first region, and the inner end electrode can pass through the opening in the upper soft magnetic resin layer.

[0134] In the inductor element of the first side, eleventh side, or thirteenth side according to the twelfth side of this embodiment, at least a portion of the conductive layer of the inductor is spaced apart in the second region from at least one of the soft magnetic layers of the lower soft magnetic resin layer and the upper soft magnetic resin layer, thereby providing a soft magnetic gap between the soft magnetic layer and the conductive layer.

[0135] According to this inductor element, the soft magnetic air gap reduces the amount of resin in the soft magnetic resin region, allowing the lower and upper soft magnetic resin layers to confine the magnetic flux.

[0136] In the inductor element of the 14th side surface according to the 13th side surface of this embodiment, the non-magnetic resin region can fill the soft magnetic void and make contact with the first conductive layer portion in the first region.

[0137] According to this inductor element, the non-magnetic resin region filling the soft magnetic gap can adjust the confinement of the magnetic flux.

[0138] In the inductor element of the first side surface and the 15th side surface which corresponds to any one of the 11th to 14th sides of this embodiment, the lower soft magnetic resin layer and the upper soft magnetic resin layer are laminated on the third region to form recesses of the soft magnetic resin region in the first and second regions, and the upper soft magnetic resin layer can extend from the laminate onto the first and second regions so as to be spaced apart from the lower soft magnetic resin layer and cover the recesses of the soft magnetic resin region.

[0139] In this inductor element, the recess in the soft magnetic resin region reduces the amount of resin in the soft magnetic resin region, allowing the soft magnetic resin region to confine the magnetic flux. The upper soft magnetic resin layer covering the recess in the soft magnetic resin region also enables magnetic flux confinement.

[0140] In the inductor element of the 16th side according to the 16th side of this embodiment, the stack can have a closed shape.

[0141] According to this inductor element, the closed-shaped stack reduces the amount of resin in the soft magnetic resin region, allowing the soft magnetic resin region to confine the magnetic flux.

[0142] In the inductor element of the first side surface and the 16th side surface which follows any one of the 11th to 15th sides of this embodiment, the inner end electrode has a side surface, and the side surface of the inner end electrode may have a first side surface portion that contacts the non-magnetic resin region in the direction from the lower soft magnetic resin layer to the upper soft magnetic resin layer, and a second side surface portion that contacts the upper soft magnetic resin layer.

[0143] With this inductor element, the upper soft magnetic resin layer reaches the second side portion of the inner end electrode, and the non-magnetic resin region reaches the first side portion of the inner end electrode, reducing the amount of resin in the soft magnetic resin region and enabling the soft magnetic resin region to confine the magnetic flux.

[0144] In the inductor element of the first side surface and the 18th side surface which corresponds to any one of the 11th to 17th sides of this embodiment, the lower soft magnetic resin layer can be provided on the first region, the second region, and the third region.

[0145] In this inductor element, the lower soft magnetic resin layer is provided on the first, second, and third regions, making it possible to confine the magnetic flux from below.

[0146] In the inductor element of the first side surface and the 19th side surface which corresponds to any one of the 11th to 18th sides of this embodiment, the first conductive layer portion can be located on the lower soft magnetic resin layer in the first region of the first area.

[0147] According to this inductor element, providing the first conductive layer portion of the conductive layer on the lower soft magnetic resin layer in the first region makes it possible to adjust the confinement of the magnetic flux.

[0148] In the inductor element of this embodiment, the 20th side conforming to any one of the first to 19th sides, the inductor element may further include an outer end electrode located on the second conductive layer portion.

[0149] According to this inductor element, the outer electrode above the second conductive layer does not interfere with magnetic flux confinement.

[0150] [Note 1] A method for forming an inductor element, The present invention relates to preparing a substrate including a main surface having a first area and a second area surrounding the first area, wherein the first area has a first region, a second region surrounding the first region, and a third region surrounding the second region. A lower soft magnetic resin layer is formed on at least a portion of the first area of ​​the substrate, The method involves forming a conductive layer after forming the lower soft magnetic resin layer, wherein the conductive layer has a first conductive layer portion located on the first region of the first area, a second conductive layer portion located on the second area, and a third conductive layer portion connecting the first conductive layer portion and the second conductive layer portion, the third conductive layer portion being formed on the lower soft magnetic resin layer in the first and second regions, and the third conductive layer portion having a pattern configured to generate inductance. The inner end electrode is formed on the conductive layer, wherein the inner end electrode is located on the first conductive layer portion. The upper soft magnetic resin layer and the non-magnetic resin layer are formed in the first area of ​​the substrate, wherein the non-magnetic resin layer is in contact with the side surface of the inner end electrode, and the non-magnetic resin layer is in contact with at least one of the upper soft magnetic resin layer, the lower soft magnetic resin layer, and the first conductive layer portion in the first region. Equipped with, The lower soft magnetic resin layer and the upper soft magnetic resin layer are laminated on the third region. The lower soft magnetic resin layer comprises a first insulating resin body and a plurality of first soft magnetic elements surrounded by the first insulating resin body. The upper soft magnetic resin layer includes a second insulating resin body and a plurality of second soft magnetic elements surrounded by the second insulating resin body. A method for fabricating an inductor element.

[0151] [Note 2] Forming a lower soft magnetic resin layer on at least a portion of the first area of ​​the substrate includes forming the lower soft magnetic resin layer on the first region, the second region, and the third region. Forming the upper soft magnetic resin layer and the non-magnetic resin layer in the first area of ​​the substrate includes forming a portion of the upper soft magnetic resin layer in the third region to form the laminate, forming the non-magnetic resin layer inside the laminate, and forming the remainder of the upper soft magnetic resin layer in the first, second, and third regions so as to cover the non-magnetic resin layer. The non-magnetic resin layer and the third conductive layer portion are located between the lower soft magnetic resin layer and the upper soft magnetic resin layer in the second region. A method for manufacturing the inductor element described in Appendix 1.

[0152] [Note 3] Forming a lower soft magnetic resin layer on at least a portion of the first area of ​​the substrate includes forming the lower soft magnetic resin layer on the second and third areas, Forming an upper soft magnetic resin layer and a non-magnetic resin layer in the first area of ​​the substrate includes forming the upper soft magnetic resin layer in the second and third areas, and forming the upper soft magnetic resin layer in the first area so as to cover the lower soft magnetic resin layer. The lower soft magnetic resin layer and the upper soft magnetic resin layer are separated from the inner end electrode. A method for manufacturing the inductor element described in Appendix 1.

[0153] [Note 4] A support having a main surface including a first area and a second area surrounding the first area, wherein the first area has a first region, a second region surrounding the first region, and a third region surrounding the second region, An inductor comprising a conductive layer extending over the main surface of the support and an inner end electrode, wherein the conductive layer has a first conductive layer portion located over the first region of the first area, a second conductive layer portion located over the second area, and a third conductive layer portion connecting the first conductive layer portion and the second conductive layer portion, the third conductive layer portion having a pattern configured to generate inductance, and the inner end electrode located over the first conductive layer portion, A first resin body comprising a non-magnetic resin region and a soft magnetic resin region, both disposed within the first area of ​​the main surface, wherein the soft magnetic resin region is provided in a closed shape within the second and third regions, forming a recess in the first region, the non-magnetic resin region is provided in the recess, the soft magnetic resin region includes a lower soft magnetic resin layer and an upper soft magnetic resin layer, and the third conductive layer portion extends between the upper soft magnetic resin layer and the lower soft magnetic resin layer on the second region, supported by the upper soft magnetic resin layer and the lower soft magnetic resin layer, the first resin body, Equipped with, The lower soft magnetic resin layer includes a first insulating resin body and a plurality of first magnetic materials surrounded by the first insulating resin body. The upper soft magnetic resin layer includes a second insulating resin body and a plurality of second magnetic materials surrounded by the second insulating resin body. Inductor element.

[0154] [Note 5] A support having a main surface including a first area and a second area surrounding the first area, wherein the first area has a first region, a second region surrounding the first region, and a third region surrounding the second region, An inductor comprising a conductive layer extending over the main surface of the support and an inner end electrode, wherein the conductive layer has a first conductive layer portion located over the first region of the first area, a second conductive layer portion located over the second area, and a third conductive layer portion connecting the first conductive layer portion and the second conductive layer portion, the third conductive layer portion having a pattern configured to generate inductance, and the inner end electrode located over the first conductive layer portion, A first resin body comprising a non-magnetic resin region and a soft magnetic resin region, both disposed within the first area of ​​the main surface, wherein the soft magnetic resin region is provided in a closed shape within the third region, forming recesses in the first and second regions, the soft magnetic resin region includes a lower soft magnetic resin layer and an upper soft magnetic resin layer, and the non-magnetic resin region extends within the recess between the upper soft magnetic resin layer and the lower soft magnetic resin layer, the first resin body, Equipped with, The lower soft magnetic resin layer includes a first insulating resin body and a plurality of first magnetic materials surrounded by the first insulating resin body. The upper soft magnetic resin layer includes a second insulating resin body and a plurality of second magnetic materials surrounded by the second insulating resin body. Inductor element.

[0155] This disclosure is not limited to the embodiments described above, and can be implemented with various modifications without departing from the spirit of this disclosure. All such modifications are included in the technical concept of this disclosure. [Explanation of Symbols]

[0156] 11. Inductor element, 13...Support, 13a...principal surface, 13b...Area 1, 13c... Area 2, 13d...back side, 13f...1st area, 13g...Second area, 13h...Third area, 14a... Semiconductor field, 14b...insulating region, 14c... Semiconductor equipment, 15...First resin body, 17. Inductor, 18. Conductive layer, 18a...Main part of the inductor, 18f...first conductive layer part, 18g...Second conductive layer part, 18h...Third conductive layer part, 20...Soft magnetic resin area, 20a...inner end, 20b...outer end, 20q...Aperture, 21...lower soft magnetic resin layer, 22...Non-magnetic resin area, 22q...aperture, 22s...side, 23...Upper soft magnetic resin layer, 23d... indentation, 23f...Raised soft magnetic resin region, 23h...opening, 23s...side, 25...outer electrode, 27...Inner end electrode, 27s, 25s...side 29...Second resin body, 30...connecting electrodes, 31...Soft magnetic resin liquid, 31h...opening, 31s...Surface, 33a, 33c... Dispenser 33b, 33d... Heat treatment equipment 34, 36...Non-magnetic resin liquid 35, 36... Soft magnetic resin liquid 37. Sealing film, 39...Sealing body, 41...electrode, ARW1, ARW2... arrows, PT... Copper post, SD... Seed layer.

Claims

1. A support having a main surface including a first area and a second area surrounding the first area, wherein the first area has a first region, a second region surrounding the first region, and a third region surrounding the second region, An inductor comprising a conductive layer extending over the main surface of the support and an inner end electrode, wherein the conductive layer has a first conductive layer portion located on the first region of the first area, a second conductive layer portion located on the second area, and a third conductive layer portion connecting the first conductive layer portion and the second conductive layer portion, the third conductive layer portion having a pattern configured to generate inductance, and the inner end electrode located on the first conductive layer portion, the inductor and A first resin body, both disposed within the first area of ​​the main surface, includes a non-magnetic resin region and a soft magnetic resin region having openings for receiving the inner end electrodes, wherein the soft magnetic resin region has at least a recess in the first region, the non-magnetic resin region is provided in the recess, the soft magnetic resin region includes a lower soft magnetic resin layer and an upper soft magnetic resin layer, the upper soft magnetic resin layer and the lower soft magnetic resin layer are laminated on the third region such that the lower soft magnetic resin layer is provided between the support and the upper soft magnetic resin layer, and the third conductive layer portion extends between the upper soft magnetic resin layer and the lower soft magnetic resin layer on the second region so as to be supported by at least one of the upper soft magnetic resin layer and the lower soft magnetic resin layer, Equipped with, The lower soft magnetic resin layer comprises a first insulating resin body and a plurality of first magnetic materials surrounded by the first insulating resin body. The upper soft magnetic resin layer includes a second insulating resin body and a plurality of second magnetic materials surrounded by the second insulating resin body. Inductor element.

2. At least one of the lower soft magnetic resin layer and the upper soft magnetic resin layer is separated from the inner end electrode. An inductor element as described in claim 1.

3. The lower soft magnetic resin layer and the upper soft magnetic resin layer are located outside the first region. An inductor element as described in claim 1.

4. At least a portion of the conductive layer of the inductor is in contact with the lower soft magnetic resin layer and the upper soft magnetic resin layer in the second and third regions. An inductor element as described in claim 1.

5. The inner end electrode has a side surface, The side surface of the inner end electrode is not covered by the upper soft magnetic resin layer, but is covered by the non-magnetic resin region. An inductor element as described in claim 1.

6. The third conductive layer portion has an inductor portion having a spiral shape, The inductor portion of the third conductive layer is in contact with at least one of the lower soft magnetic resin layer and the upper soft magnetic resin layer. An inductor element as described in claim 1.

7. The lower soft magnetic resin layer and the upper soft magnetic resin layer are provided in a closed shape that surrounds the first region in the second and third regions, thereby forming the recess. An inductor element as described in claim 1.

8. The non-magnetic resin region is provided in the recess of the soft magnetic resin region and is in contact with the first conductive layer portion in the first region. The inductor element described in claim 7.

9. The non-magnetic resin region is provided in the recess and covers the side surface of the inner end electrode. The inductor element described in claim 7.

10. The first conductive layer portion of the conductive layer is in contact with the main surface of the support in the first area. An inductor element as described in claim 1.

11. The non-magnetic resin region is provided in the second region between the lower soft magnetic resin layer and the upper soft magnetic resin layer. An inductor element as described in claim 1.

12. The upper soft magnetic resin layer has an opening located above the first region, The inner end electrode passes through the opening in the upper soft magnetic resin layer. An inductor element as described in claim 1.

13. At least a portion of the conductive layer of the inductor is spaced apart in the second region from at least one of the soft magnetic layers of the lower soft magnetic resin layer and the upper soft magnetic resin layer, providing a soft magnetic gap between the soft magnetic layer and the conductive layer. An inductor element as described in claim 1.

14. The non-magnetic resin region fills the soft magnetic void and contacts the first conductive layer portion in the first region. The inductor element according to claim 13.

15. The lower soft magnetic resin layer and the upper soft magnetic resin layer are laminated on the third region to form the recesses in the first and second regions, and the upper soft magnetic resin layer extends from the laminate onto the first and second regions so as to be spaced apart from the lower soft magnetic resin layer and to cover the recesses in the soft magnetic resin region. An inductor element as described in claim 1.

16. The aforementioned laminate has a closed shape. An inductor element as described in claim 15.

17. The inner end electrode has a side surface, The side surface of the inner end electrode has a first side surface portion that contacts the non-magnetic resin region in the direction from the lower soft magnetic resin layer to the upper soft magnetic resin layer, and a second side surface portion that contacts the upper soft magnetic resin layer. An inductor element as described in claim 1.

18. The lower soft magnetic resin layer is provided on the first region, the second region, and the third region. An inductor element as described in claim 1.

19. The first conductive layer portion is located on the lower soft magnetic resin layer in the first region of the first area, An inductor element as described in claim 1.

20. The inductor element further comprises an outer end electrode located on the second conductive layer portion. An inductor element as described in any one of claims 1 to 19.

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