Wafer storage container cleaning device
Patent Information
- Application Number
- JP2025059809
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2026-10-14
AI Technical Summary
【0008】 本発明の一態様によれば乾燥不良及び洗浄不良の発生を抑制することができるウェーハ収納容器洗浄装置を提供することができる。
Smart Images

Figure 2026166692000001_ABST
Abstract
Description
Technical Field
[0001] Embodiments of the present invention relate to a wafer storage container cleaning apparatus.
Background Art
[0002] As a wafer storage container, a FOUP (Front Opening Unified Pod) is known. The FOUP is used to transfer wafers, on which semiconductor elements are formed through various processing steps (for example, resist coating, exposure and development, etching (film formation), resist stripping, cleaning, etc.), between the processing steps. As an apparatus for cleaning such a FOUP, there is a wafer storage container cleaning apparatus (FOUP cleaning apparatus).
[0003] In such a wafer storage container cleaning apparatus, when cleaning the FOUP, the FOUP is supported and rotated with its opening facing downward. With the FOUP being rotated, a cleaning liquid (chemical liquid or pure water) is discharged from a cleaning liquid nozzle toward the FOUP. Further, in the wafer storage container cleaning apparatus, when drying the FOUP, the FOUP is rotated, and water droplets adhering to the FOUP are scattered by centrifugal force. At this time, in parallel with the rotation of the FOUP, gas (N₂ or CDA (Clean Dry Air)) is blown toward the FOUP from a gas nozzle (blow nozzle). Thereby, the efficiency of drying the FOUP is improved.
Prior Art Documents
Patent Documents
[0004]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0005] However, because the shape of the FOUP is roughly rectangular, the cleaning solution nozzles and gas nozzles are positioned so as not to interfere with the rotating FOUP. When the FOUP rotates relative to these cleaning solution nozzles and gas nozzles, the distance between the outer surface of the FOUP and the nozzles changes constantly, resulting in variations in this distance. This raises concerns about the possibility of inadequate cleaning or drying. The same applies to wafer storage container cleaning equipment that cleans wafer storage containers other than FOUPs (e.g., FOSB (Front Opening Shipping Box)).
[0006] The present invention was made to solve the above-mentioned problems, and its objective is to provide a wafer storage container cleaning apparatus that can suppress the occurrence of poor cleaning and drying. [Means for solving the problem]
[0007] To solve the above-mentioned problems and achieve the objective, a wafer storage container cleaning apparatus according to one aspect of the present invention comprises a storage container body having a storage space for storing wafers and an opening communicating with the storage space, and a door that closes the opening, the storage container body having a support part having a support surface that supports the storage container body with the opening facing downward, an inner nozzle unit provided so as to be located within the storage space of the storage container body supported by the support part and supplying cleaning liquid or gas to the inner surface forming the storage space, and located outside the storage container body supported by the support part The storage container body is provided to supply cleaning liquid or gas to the outer surface of the storage container body, and the inner nozzle unit comprises a plurality of inner nozzles that supply cleaning liquid or gas to the circumferential surface of the inner surface that surrounds the opening, and a first inner moving device that moves the plurality of inner nozzles in a direction perpendicular to the support surface in the support part, and the outer nozzle unit comprises a plurality of outer nozzles that supply cleaning liquid or gas to the outer surface of the storage container body, and a first outer moving device that moves the plurality of outer nozzles in a direction perpendicular to the support surface. [Effects of the Invention]
[0008] According to one aspect of the present invention, a wafer storage container cleaning apparatus can be provided that can suppress the occurrence of drying defects and cleaning defects. [Brief explanation of the drawing]
[0009] [Figure 1] Figure 1 is a plan view showing an example of a schematic configuration of a wafer storage container cleaning apparatus according to an embodiment. [Figure 2] Figure 2 is a schematic side cross-sectional view showing an example of the configuration of the cleaning tank in the wafer storage container cleaning apparatus shown in Figure 1. [Figure 3] Figure 3 is a side view showing the schematic configuration inside the cleaning tank of Figure 2, as seen from one side of the storage container body housed within the cleaning tank. [Figure 4] Figure 4 is a schematic side view showing the operating state inside the cleaning tank shown in Figure 3. [Figure 5] Figure 5 is a side view showing the schematic configuration inside the washing tank of Figure 2, viewed from a side that intersects with one of the sides of the storage container body housed inside the washing tank. [Figure 6] Figure 6 is a schematic side view showing the operating state inside the cleaning tank shown in Figure 5. [Figure 7] Figure 7 is a plan view showing the schematic configuration inside the washing tank shown in Figure 2. [Figure 8] Figure 8 is a plan view showing the configuration of the washing tank in Figure 7, with some parts omitted. [Figure 9] Figure 9 is an enlarged view of the top nozzle unit shown in Figure 7. [Figure 10] Figure 10 is a conceptual diagram illustrating the change in the distance between the nozzle and the storage container body when the storage container body is rotated with the opening facing downwards. [Figure 11] Figure 11 is a conceptual diagram illustrating an example of the change in distance between the nozzle and the storage container body according to the embodiment. [Modes for carrying out the invention]
[0010] Hereinafter, embodiments of the wafer storage container cleaning apparatus disclosed in this application will be described in detail with reference to the attached drawings. In the following embodiments, the case in which the wafer storage container to be cleaned is a FOUP will be described, but the wafer storage container to be cleaned is not limited to this. For example, the wafer storage container to be cleaned may be an FOSB.
[0011] (Embodiment) Figure 1 is a plan view showing an example of the schematic configuration of a wafer storage container cleaning apparatus 1 according to an embodiment. The wafer storage container cleaning apparatus 1 is installed, for example, in a factory that manufactures semiconductor wafers, and cleans a wafer storage container 20 to be cleaned, and dries the cleaned FOUP 20.
[0012] As shown in Figure 1, the FOUP 20 comprises a storage container body (FOUP body) 20a and a door 20b. The FOUP 20 is also referred to as a cassette. The storage container body 20a has a roughly rectangular parallelepiped shape and forms a hexahedral outline. The storage container body 20a has a rectangular opening on one face. This rectangle has two long sides and two short sides. The storage container body 20a also has a storage space for storing semiconductor wafers. The storage space is located inside the opening and communicates with the opening. The door 20b can be detached from and connected to the storage container body 20a, and when connected to the storage container body 20a, it closes the opening. The storage container body 20a is also provided with a flange 20c. The flange 20c is the part that is gripped (held) when the FOUP 20 is transported by an OHT (Overhead Hoist Transport) or robot 3, and is formed in the shape of a rectangular plate.
[0013] The wafer storage container cleaning apparatus 1 comprises a load port 2, a robot 3, a buffer (disassembly / connection stage) 4, a cleaning tank 5, an unload port 6, and a control unit 7.
[0014] The robot 3, disassembly / connection stage 4, cleaning tank 5, and control unit 7 are provided inside the casing 1a of the wafer storage container cleaning apparatus 1. On the other hand, the load port 2 and the unload port 6 are provided across the inside and outside of the casing 1a of the wafer storage container cleaning apparatus 1.
[0015] The load port 2 moves the FOUP 20, which is transported by an OHT and placed on the portion of the load port 2 outside the casing 1a, in the direction indicated by the arrow 2b to carry it into the inside of the casing 1a. The shutter 2a provided at the opening 1b of the casing 1a is open when the FOUP 20 is carried in, and is closed at times other than when the FOUP 20 is carried in.
[0016] The robot 3 transports the FOUP 20 to each part while gripping the flange 20c of the FOUP 20. The robot 3 is a vertical articulated robot, and includes a robot arm 3a and a robot hand 3b. The robot 3 transports the FOUP 20 to each part by extending / contracting or rotationally moving the robot arm 3a in a state where the robot hand 3b grips the flange 20c.
[0017] The disassembly / connection stage 4 disassembles the FOUP 20 into the storage container main body 20a and the door 20b, or connects (attaches) the storage container main body 20a and the door 20b. A latch key 4a is provided on the disassembly / connection stage 4. The disassembly / connection stage 4 rotates the latch key 4a in a state of being inserted into the latch hole provided in the door 20b of the FOUP 20, thereby making it possible to disassemble (separate) the door 20b from the storage container main body 20a of the FOUP 20, or connect the door 20b to the storage container main body 20a. For example, the FOUP 20 carried into the inside of the casing 1a is transported by the robot 3 to the disassembly / connection stage 4. In this case, the disassembly / connection stage 4 disassembles the FOUP 20 into the storage container main body 20a and the door 20b.
[0018] The cleaning tank 5 is a tank for cleaning the FOUP 20. For example, the storage container body 20a and the door 20b are transported separately to the cleaning tank 5 by the robot 3. The cleaning tank 5 then performs cleaning and drying on the storage container body 20a and the door 20b while holding them separately. In other words, the cleaning tank 5 cleans and dries the storage container body 20a and the door 20b while they are separated. Details of the cleaning tank 5 will be described later.
[0019] The unload port 6 moves the FOUP 20, which has been placed inside the casing 1a by the robot 3, in the direction indicated by the arrow 6b, and transports it to the outside of the casing 1a. The FOUP 20, with the door 20b connected to the storage container body 20a in the disassembly / connection stage 4, is transported to the unload port 6 by the robot 3. The shutter 6a provided at the opening 1c of the casing 1a is open when the FOUP 20 is being transported, but is closed at other times.
[0020] The control unit 7 controls the operation of the entire wafer storage container cleaning apparatus 1. For example, the control unit 7 controls the load port 2, robot 3, disassembly / combination stage 4, cleaning tank 5, and unload port 6, thereby operating the load port 2, robot 3, disassembly / combination stage 4, cleaning tank 5, and unload port 6 as described above.
[0021] For example, the control unit 7 includes a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), HDD (Hard Disk Drive), and a communication interface. These are connected via an internal bus.
[0022] The CPU executes various processes while using RAM as a temporary storage area for data used in various operations. ROM and HDD store programs for executing these processes, as well as various databases and tables used when executing these processes. The CPU executes various processes by running the programs stored in ROM and HDD. Furthermore, the CPU executes various processes using the databases and tables stored in ROM and HDD.
[0023] The communication interface is an interface for communicating with the various parts of the wafer storage container cleaning apparatus 1 as described above, as well as for communicating with external devices connected to the wafer storage container cleaning apparatus 1 via a network. For example, the communication interface is a network interface card.
[0024] Next, a cleaning tank 5 according to an embodiment will be described. Figure 2 is a schematic side cross-sectional view showing an example of the configuration of the cleaning tank 5. As shown in Figure 2, for example, the cleaning tank 5 includes a cleaning tank body 5a, a lid 5b, a support 5c, a first drainage receiving section 5d, a second drainage receiving section 5e, a first exhaust pipe 5f, a second exhaust pipe 5g, an outer nozzle unit 5h, and an inner nozzle unit 5i.
[0025] The lid 5b is attached to the upper end of the cleaning tank body 5a via a hinge and opens and closes relative to the opening of the cleaning tank body 5a by the drive of an air cylinder (not shown). On the underside of the lid 5b (the side facing the cleaning tank body 5a), there is a retaining part (retaining mechanism) 5b1 capable of holding the door 20b of the FOUP 20.
[0026] The cleaning tank body 5a is a box-shaped member with an open top, having an opening (body opening) at the top and a cleaning space that communicates with the body opening. The cleaning space is a space located inside the body opening. The storage container body 20a is carried into the cleaning space via the body opening by the robot 3. In this way, the storage container body 20a is carried into the interior of the cleaning tank body 5a. The cleaning tank body 5a then houses the storage container body 20a.
[0027] In this embodiment, when the FOUP 20 is cleaned in the cleaning tank 5, the robot 3 transports the storage container body 20a and the door 20b on the disassembly / connection stage 4 separately to the cleaning tank 5. For example, the robot 3 transports the storage container body 20a into the interior of the cleaning tank body 5a through the opening of the cleaning tank body 5a with the opening of the storage container body 20a facing downwards. As a result, the storage container body 20a is supported on the support surface 5c1 of the support part 5c with the opening of the storage container body 20a facing downwards. The robot 3 also transports the door 20b to the holding part 5b1 so that the outer surface of the door 20b is held by the holding part 5b1 of the lid part 5b. As a result, when the lid part 5b is closed, the inner surface (inner surface) of the door 20b faces downwards.
[0028] When the cleaning and drying of the FOUP 20 is completed in the cleaning tank 5, the robot 3 transports the storage container body 20a and the door 20b separately onto the disassembly / connection stage 4. The disassembly / connection stage 4 then connects the storage container body 20a and the door 20b.
[0029] A support portion 5c is provided in the cleaning space of the cleaning tank body 5a. The support portion 5c is fixed to the bottom 5a1 of the cleaning tank body 5a at a predetermined height from the bottom 5a1. The support portion 5c supports the storage container body 20a that has been brought in. For example, as shown in Figure 2, the support portion 5c is a support base having a support surface 5c1 that supports the storage container body 20a when the opening of the storage container body 20a is facing downwards. In this way, the support surface 5c1 supports the storage container body 20a. The support portion 5c is a rectangular member in plan view. Also, the support surface 5c1 is a plane that is aligned with the horizontal plane. That is, the support surface 5c1 is a plane parallel to the horizontal plane.
[0030] The support section 5c is provided with multiple holes (openings) 5c2 arranged concentrically within the area where the storage container body 20a of the FOUP 20 is placed. The holes 5c2 are provided to allow the drained cleaning liquid (after cleaning the inside of the storage container body 20a) and the gas inside the storage container body 20a (gas in the storage space of the storage container body 20a) to flow to the underside of the support section 5c. The size of the multiple holes 5c2 is set to provide an opening area that allows for sufficient exhaust. The size of the holes 5c2 is determined, for example, by experiment or simulation. However, it is not essential to arrange the multiple holes 51c concentrically or to provide multiple holes 5c2, as long as the required opening area is obtained. Multiple holes 5c2 may be arranged randomly, or a single hole 5c2 may be provided.
[0031] The support portion 5c has a rectangular protrusion 5c3 in plan view that extends downward along its outer circumference. Furthermore, a first drainage receiving portion 5d is provided on the lower side of the support portion 5c to receive the drainage liquid (cleaning liquid after cleaning the inside of the storage container body 20a) discharged from the hole 5c2 of the support portion 5c.
[0032] The first drainage receiving section 5d forms a rectangular groove in plan view and is positioned on the bottom 5a1 of the washing tank body 5a via a support column (not shown). The outer shape of the first drainage receiving section 5d is slightly smaller than the outer shape of the support section 5c (the inner diameter of the rectangular protrusion 5c3). The first drainage receiving section 5d is also provided such that there is a height difference between the upper end of its outer circumference and the lower end of the protrusion 5c3 at the outer circumference of the support section 5c, which is sufficient to allow exhaust gas from the hole 5c2 of the support section 5c to flow through. The bottom (groove bottom) 5d1 of the groove portion of the first drainage receiving section 5d is an inclined surface that gradually slopes downward from the center towards the outer circumference. A drainage pipe 5d2 for discharging the collected drainage to the outside is connected to the outer circumference end, which is the lowest part of the groove bottom 5d1. In the example shown in Figure 2, one drain pipe 5d2 is provided, but two or more drain pipes 5d2 may be provided. Also, the first drain receiving section 5d and the drain pipe 5d2 together may be referred to as the first drain receiving section. That is, the drain pipe 5d2 may be included as an element constituting the first drain receiving section 5d. In Figure 2, the drainage discharged to the outside by the first drain receiving section 5d is shown as drainage (2).
[0033] Furthermore, the inner circumferential end of the first drainage receiving portion 5d is positioned inside the hole 5c2 formed in the support portion 5c, and the outer circumferential end of the first drainage receiving portion 5d is positioned between the outermost periphery of the storage container body 20a, which is supported on the support surface 5c1 with the opening of the storage container body 20a facing downwards, and the outer circumferential end of the support portion 5c. In addition, the first drainage receiving portion 5d is positioned such that a gap is formed between the outer circumferential end of the first drainage receiving portion 5d and the support portion 5c, through which gas flowing from the storage space of the storage container body 20a towards the second exhaust pipe 5g via the hole 5c2 can circulate.
[0034] On the outer circumference of the support portion 5c, there is a partition plate 5j which has a rectangular opening 5j1 (slightly larger than the outer dimensions of the support portion 5c) when viewed from above, surrounding the support portion 5c, and whose outer circumference is in contact with the inner wall surface of the cleaning tank body 5a. This partition plate 5j is provided so that its upper surface is at the same height as the upper surface of the support portion 5c. Such a partition plate 5j divides the inside of the cleaning tank body 5a into a space above the support portion 5c and a space below it. Specifically, the partition plate 5j divides the cleaning space inside the cleaning tank body 5a into a cleaning space above the support portion 5c and a cleaning space below it. Here, the aforementioned hole 5c2 connects the upper cleaning space and the lower cleaning space.
[0035] The partition plate 5j has a gap 5k between the opening 5j1 and the outer circumference of the support portion 5c. This gap 5k functions as a drainage channel that allows the drained liquid, which is the cleaning solution after cleaning the outside of the storage container body 20a of the FOUP 20, to flow into the space below the partition plate 5j (the bottom 5a1 of the cleaning tank body 5a). In this embodiment, the upper space and the lower space are exhausted separately. For this reason, it is preferable that the gap 5k be small.
[0036] A second drainage receiving section 5e is provided in the space below the partition plate 5j. The second drainage receiving section 5e is composed of the bottom 5a1 of the washing tank body 5a and the drainage pipe 5e1. That is, the second drainage receiving section 5e comprises the bottom 5a1 and the drainage pipe 5e1. The bottom 5a1 mainly receives the drainage liquid, which is the washing liquid after washing the outside of the storage container body 20a of the FOUP 20. The drainage pipe 5e1 is provided on the bottom 5a1. The drainage pipe 5e1 discharges the drainage liquid received on the bottom 5a1 to the outside. In Figure 2, the drainage liquid discharged to the outside by the second drainage receiving section 5e is shown as drainage liquid (1). In the example in Figure 2, a case where one drainage pipe 5e1 is provided is shown, but two or more drainage pipes 5e1 may be provided.
[0037] Two exhaust pipes (a first exhaust pipe 5f and a second exhaust pipe 5g) are connected to the side wall of the cleaning tank body 5a to exhaust air from inside the cleaning tank body 5a. The first exhaust pipe 5f is connected to the side wall above the partition plate 5j and mainly exhausts the space above the partition plate 5j and the support part 5c. This exhaust removes water vapor generated by cleaning the outside of the FOUP 20 storage container body 20a. In Figure 2, the exhaust by the first exhaust pipe 5f is indicated as exhaust (1). The first exhaust pipe 5f is connected to an adjustment device, such as a pump (not shown), which adjusts the amount of exhaust. Here, "water vapor" is not limited to vaporized water or cleaning liquid, but is a general term for fine particles that are generated by cleaning, float in the space, and do not want to adhere to the FOUP 20, such as mist of water or cleaning liquid, or mist containing particles.
[0038] The second exhaust pipe 5g is connected to the side wall below the partition plate 5j and primarily exhausts the space below the partition plate 5j and the support part 5c. This exhaust removes water vapor generated by cleaning the inside of the storage container body 20a of the FOUP 20. In this embodiment, the second exhaust pipe 5g is configured to exhaust at least the storage space formed by the inside of the storage container body 20a by exhausting the space below the partition plate 5j and the support part 5c. In Figure 2, the exhaust by the second exhaust pipe 5g is indicated as exhaust (2). The second exhaust pipe 5g is connected to an adjustment device, such as a pump (not shown), which adjusts the amount of exhaust.
[0039] The inner nozzle unit 5i is a unit for cleaning and drying the inner surface of the storage container body 20a of the FOUP 20. The inner nozzle unit 5i is positioned within the storage space of the storage container body 20a, which is supported by the support part 5c, and supplies cleaning liquid or gas to the inner surface that forms the storage space. Specifically, the inner surface of the storage container body 20a to be cleaned and dried consists of the four circumferential surfaces (side surfaces) 20a1 that surround the opening of the storage container body 20a, and the top surface 20a2 that faces the opening of the storage container body 20a. Figure 2 schematically shows the inner nozzle unit 5i. Details of the inner nozzle unit 5i will be described later.
[0040] The outer nozzle unit 5h is a unit for cleaning and drying the outer surface of the storage container body 20a and the aforementioned inner surface of the door 20b of the FOUP 20. The outer nozzle unit 5h is positioned outside the storage container body 20a, which is supported by the support part 5c, and supplies cleaning liquid or gas to the outer surface of the storage container body. The outer nozzle unit 5h comprises a nozzle unit 5h1, a cleaning liquid nozzle 5h2, and a gas nozzle 5h3.
[0041] The nozzle unit 5h1 is designed to clean and dry the four outer surfaces 20a3 corresponding to the four circumferential surfaces 20a1. Figure 2 schematically shows the nozzle unit 5h1. Details of the nozzle unit 5h1 will be described later.
[0042] The cleaning solution nozzle 5h2 cleans the outer surface 20a4 corresponding to the top surface 20a2 and the inner surface of the door 20b held by the holding part 5b1. The cleaning solution nozzle 5h2 supplies cleaning solution (chemical solution or pure water) to the outer surface 20a4 of the storage container body 20a of the FOUP 20 from above (outside). The cleaning solution nozzle 5h2 also supplies cleaning solution to the inner surface of the door 20b from below. The cleaning solution nozzle 5h2 is provided to swing along a horizontal plane. The cleaning solution nozzle 5h2 comprises a rotating support column that is vertically mounted from the bottom 5a1 of the cleaning tank body 5a, passing through the partition plate 5j, a horizontally extending swinging arm fixed to the upper end of this support column, and a horizontally extending nozzle section provided at the tip of the swinging arm. One or more nozzles are provided in the nozzle section. The nozzle is, for example, a two-fluid nozzle. For example, the nozzle, while in a oscillating state, supplies cleaning fluid to the upper outer surface 20a4 of the storage container body 20a supported by the support part 5c, and to the inner surface of the door 20b held by the holding part 5b1, thereby cleaning the entire outer surface 20a4 and the entire inner surface of the door 20b. A supply pipe for supplying cleaning fluid to the cleaning fluid nozzle 5h2 is provided inside the support column. A cleaning fluid storage tank containing cleaning fluid is connected to the supply pipe, and the cleaning fluid stored in the cleaning fluid storage tank is supplied to the cleaning fluid nozzle 5h2 via the supply pipe, and the cleaning fluid supplied to the cleaning fluid nozzle 5h2 is then supplied from the cleaning fluid nozzle 5h2 to the outer surface 20a4 and the inner surface of the door 20b.
[0043] The gas nozzle 5h3 dries the inner surface of the door 20b, which is held by the outer surface 20a4 and the holding part 5b1. The gas nozzle 5h3 supplies gas (for example, gas heated to a predetermined temperature) to the outer surface 20a4 from above. The gas nozzle 5h3 also supplies gas to the inner surface of the door 20b from below. The gas nozzle 5h3 is installed to swing along a horizontal plane. The gas nozzle 5h3 comprises a rotating support column that is vertically installed from the bottom 5a1 of the washing tank body 5a, passing through the partition plate 5j, a horizontally extending swinging arm fixed to the upper end of the support column, and a horizontally extending nozzle section provided at the tip of the swinging arm. The nozzle section is provided with one or more nozzles. For example, the nozzle, while in a oscillating state, dries the outer surface 20a4 of the storage container body 20a, which is supported by the support part 5c, and the inner surface of the door 20b, which is held by the holding part 5b1, by supplying gas to these surfaces. A supply pipe for supplying gas to the gas nozzle 5h3 is provided inside the support column. A gas storage tank containing gas heated to a predetermined temperature is connected to the supply pipe, and the gas stored in the gas storage tank is supplied to the gas nozzle 5h3 via the supply pipe, and the gas supplied to the gas nozzle 5h3 is then supplied from the gas nozzle 5h3 to the outer surface 20a4 and the inner surface of the door 20b.
[0044] Here, the cleaning solution nozzle 5h2 is in a standby position that does not interfere with the storage container body 20a when the storage container body 20a is being loaded into the cleaning tank body 5a, when the storage container body 20a is being loaded into the cleaning tank body 5a, when the storage container body 20a is being loaded into the cleaning tank body 5a, and when the door 20b is held in place by the holding part 5b1 and the lid 5b is closed, then the cleaning solution nozzle 5h2 rotates and moves to a cleaning position above the storage container body 20a supported by the support part 5c and below the door 20b held in place by the holding part 5b1. When cleaning is finished, the cleaning solution nozzle 5h2 rotates and moves to the standby position.
[0045] Furthermore, for example, the gas nozzle 5h3 is in a standby position that does not interfere with the storage container body 20a when the storage container body 20a is being loaded into the cleaning tank body 5a, when the storage container body 20a is being unloaded from the cleaning tank body 5a, and when the storage container body 20a is being cleaned. When cleaning is complete, the gas nozzle 5h3 rotates and moves to a drying position above the storage container body 20a supported by the support part 5c and below the door 20b held by the holding part 5b1. When drying is complete, the gas nozzle 5h3 rotates and moves to the standby position.
[0046] Next, the nozzle unit 5h1 of the outer nozzle unit 5h and the inner nozzle unit 5i will be described with reference to Figures 3 to 8. Figures 3 to 8 show only the elements necessary to explain the nozzle unit 5hi and the inner nozzle unit 5i among the elements constituting the wafer storage container cleaning apparatus 1 according to the embodiment, and other elements are omitted from the illustration. For example, in Figures 3 to 8, the cleaning tank body 5a and lid 5b, excluding the bottom 5a1, and the configuration arranged between the support 5c and the bottom 5a1 are omitted from the illustration.
[0047] Figures 3 and 4 are side views showing the schematic configuration inside the cleaning tank 5, viewed from the short side of the storage container body 20a housed within the cleaning tank 5. Figures 5 and 6 are side views showing the schematic configuration inside the cleaning tank 5, viewed from the long side of the storage container body 20a housed within the cleaning tank 5. Figures 7 and 8 are plan views showing the schematic configuration inside the cleaning tank 5. Compared to Figure 7, Figure 8 omits the illustration of the top nozzle unit 5i3. Also, Figures 7 and 8 omit the illustration of the distance sensor 5h17.
[0048] The outer nozzle unit 5h comprises four nozzle units 5h1, as shown in Figures 3-8. The four nozzle units 5h1 are positioned opposite four outer surfaces 20a3 that connect to the opening of the storage container body 20a.
[0049] The nozzle unit 5h1 includes a support column 5h11, a lifting mechanism 5h12, a horizontal movement mechanism 5h13, a nozzle head 5h14, a cleaning liquid nozzle 5h15, a gas nozzle 5h16, and a distance sensor 5h17.
[0050] The support column 5h11 is a rectangular prism-shaped member erected perpendicular to the base 5a1 so as to extend in the vertical direction (the direction indicated by the double arrow 5h20). The lifting mechanism 5h12 is equipped with a drive mechanism such as a motor and is provided so as to be movable in the vertical direction relative to the support column 5h11. The lifting mechanism 5h12 is an example of the first external moving device. The lifting mechanism 5h12 is provided with a horizontal moving mechanism 5h13 so as to extend in the horizontal direction (the direction indicated by the double arrow 5h21). The nozzle head 5h14 is provided so as to be movable in the horizontal direction on the horizontal moving rail 5h13a of the horizontal moving mechanism 5h13. The nozzle head 5h14 is formed in the shape of a long rod in the horizontal direction. The horizontal moving mechanism 5h13 is equipped with a drive mechanism such as a motor and moves the nozzle head 5h14 in the horizontal direction under the control of the control unit 7. The horizontal movement mechanism 5h13 is an example of a second external movement device. In this configuration, the nozzle unit 5h1 is controlled by the control unit 7 to move the nozzle head 5h14 vertically and horizontally, moving closer to / away from the storage container body 20a.
[0051] Note that the position of nozzle head 5h14 shown by a solid line in Figures 3 and 5, and the position of nozzle head 5h14 shown by a dashed line in Figures 4 and 6, represent the highest position of nozzle head 5h14 in the vertical direction. Similarly, the position of nozzle head 5h14 shown by a solid line in Figures 4 and 6, and the position of nozzle head 5h14 shown by a dashed line in Figures 3 and 5, represent the lowest position of nozzle head 5h14 in the vertical direction. Likewise, the positions of cleaning liquid nozzle 5h15 and gas nozzle 5h16 shown by solid lines in Figures 3 and 5 represent the highest position of cleaning liquid nozzle 5h15 and gas nozzle 5h16 in the vertical direction. Similarly, the positions of cleaning liquid nozzle 5h15 and gas nozzle 5h16 shown by solid lines in Figures 4 and 6 represent the lowest position of cleaning liquid nozzle 5h15 and gas nozzle 5h16 in the vertical direction.
[0052] As shown in Figures 7 and 8, each of the four nozzle heads 5h14 has a length corresponding to the length (horizontal dimension) of the opposing outer surface 20a3 of each of the four nozzle heads 5h14. Specifically, each of the four nozzle heads 5h14 has a length slightly shorter than the length of the opposing outer surface 20a3 of each of the four nozzle heads 5h14.
[0053] Furthermore, the nozzle head 5h14 is equipped with multiple sets of nozzles, each set consisting of a cleaning liquid nozzle 5h15 for discharging cleaning liquid and a gas nozzle 5h16 for discharging gas (such as N2 or CDA), arranged horizontally at predetermined intervals. In the example shown in Figures 7 and 8, the nozzle head 5h14 facing the short side of the storage container body 20a is equipped with four sets of cleaning liquid nozzles 5h15 and gas nozzles 5h16. The nozzle head 5h14 facing the long side of the storage container body 20a is equipped with five sets of cleaning liquid nozzles 5h15 and gas nozzles 5h16.
[0054] The highest and lowest positions of the nozzle head 5h14, as well as the spacing and number of pairs of cleaning liquid nozzles 5h15 and gas nozzles 5h16, can be determined according to the angle at which the cleaning liquid or gas discharged from each nozzle diffuses. For example, if the diffusion angle of the cleaning liquid or gas discharged from each nozzle is approximately 90°, and the cleaning liquid or gas diffuses in a conical shape, the entire storage container body 20a can be cleaned with the highest and lowest positions and the spacing of the pairs of cleaning liquid nozzles 5h15 and gas nozzles 5h16 as shown in Figures 3 to 8.
[0055] The cleaning solution nozzle 5h15 cleans the outer surface 20a3 of the storage container body 20a. For example, the cleaning solution nozzle 5h15 supplies cleaning solution to the outer surface 20a3 from the side. The cleaning solution nozzle 5h15 cleans the outer surface 20a3 of the storage container body 20a, which is supported by the support part 5c, by supplying cleaning solution to the outer surface 20a3. A supply pipe (not shown) for supplying cleaning solution to the cleaning solution nozzle 5h15 is provided inside the support column 5h11. A cleaning solution storage tank (not shown) containing cleaning solution is connected to the supply pipe, and the cleaning solution stored in the cleaning solution storage tank is supplied to the cleaning solution nozzle 5h15 via the supply pipe, and the cleaning solution supplied to the cleaning solution nozzle 5h15 is supplied from the cleaning solution nozzle 5h15 to the outer surface 20a3.
[0056] The gas nozzle 5h16 dries the outer surface 20a3 of the storage container body 20a. The gas nozzle 5h16 supplies gas (for example, gas heated to a predetermined temperature) to the outer surface 20a3 from the side. The gas nozzle 5h16 dries the outer surface 20a3 of the storage container body 20a, which is supported by the support part 5c, by supplying gas to the outer surface 20a3 of the storage container body 20a. A supply pipe (not shown) for supplying gas to the gas nozzle 5h16 is provided inside the support column 5h11. A gas storage tank (not shown) containing gas heated to a predetermined temperature is connected to the supply pipe, and the gas stored in the gas storage tank is supplied to the gas nozzle 5h16 via the supply pipe, and the gas supplied to the gas nozzle 5h16 is supplied from the gas nozzle 5h16 to the outer surface 20a3.
[0057] As described above, the cleaning solution nozzle 5h15 supplies cleaning solution to the outer surface 20a3 of the storage container body 20a. The gas nozzle 5h16 supplies gas to the outer surface 20a3 of the storage container body 20a. The cleaning solution nozzle 5h15 and the gas nozzle 5h16 are examples of external nozzles.
[0058] The distance sensor 5h17 is attached to the nozzle head 5h14 and detects the distance between the cleaning liquid nozzle 5h15 and the outer surface 20a3 facing the cleaning liquid nozzle 5h15 in the horizontal direction, and the distance between the gas nozzle 5h16 and the outer surface 20a3 facing the gas nozzle 5h16 in the horizontal direction, and transmits a signal indicating the detected distance to the control unit 7. The distance sensor 5h17 performs this distance detection at predetermined time intervals. The distance sensor 5h17 is, for example, attached to the center of the nozzle head 5h14 in the longitudinal direction, facing the outer surface 20a3 of the storage container body 20a. However, the mounting position of the distance sensor 5h17 can be determined according to the shape of the outer surface 20a3. The distance sensor 5h17 is an example of a second distance detection unit.
[0059] As shown in Figures 3 to 8, the inner nozzle unit 5i comprises two circumferential nozzle units (two side nozzle units) 5i1, two circumferential nozzle units 5i2 (see Figures 5 and 8), one top nozzle unit 5i3, a support column 5i4, a lifting cylinder 5i5, a lifting plate 5i6, and a lifting drive mechanism (not shown).
[0060] The two circumferential nozzle units 5i1 are positioned opposite to two of the four circumferential surfaces 20a1 of the storage container body 20a, which correspond to the long sides of the opening of the storage container body 20a.
[0061] Furthermore, the two circumferential nozzle units 5i2 are positioned opposite to two of the four circumferential surfaces 20a1 of the storage container body 20a, which correspond to the short sides of the opening of the storage container body 20a.
[0062] Each of the two circumferential nozzle units 5i1 and 5i2 is configured to be individually movable horizontally. Specifically, each of the two circumferential nozzle units 5i1 is configured to be individually movable horizontally (in the direction indicated by the double-headed arrow 5i70 in Figure 8). Similarly, each of the two circumferential nozzle units 5i2 is configured to be individually movable horizontally (in the direction indicated by the double-headed arrow 5i71 in Figure 8). However, since the two circumferential nozzle units 5i1 and 5i2 are mounted on a single lifting plate 5i6, they are configured to be movable together vertically (in the direction indicated by the double-headed arrow 5i72), rather than individually.
[0063] As shown in Figure 2, the support column 5i4 is a cylindrical member erected perpendicular to the base 5a1 so as to extend vertically. A top surface nozzle unit 5i3 is attached to the upper end of the support column 5i4. The lifting cylinder 5i5 is a cylindrical member and is provided so as to surround the support column 5i4. The lifting cylinder 5i5 is supported by the support column 5i4 so as to be movable vertically by a lifting drive mechanism (not shown). The lifting drive mechanism moves the lifting cylinder 5i5 vertically under the control of the control unit 7. A lifting plate 5i6 is attached to the upper end of the lifting cylinder 5i5. In this way, the lifting cylinder 5i5 and the lifting drive mechanism move the two circumferential nozzle units 5i1 and the two circumferential nozzle units 5i2 vertically, that is, in a direction perpendicular to the support surface 5c1 of the support part 5c shown in Figure 2. The lifting cylinder 5i5 and the lifting drive mechanism are an example of a first internal moving device.
[0064] As shown in Figures 5 and 8, the circumferential nozzle unit 5i1 comprises a horizontal movement rail 5i11, a nozzle head 5i12, a cleaning fluid nozzle 5i13, a gas nozzle 5i14, and a distance sensor 5i15. The circumferential nozzle unit 5i1 also includes a horizontal movement mechanism (not shown). The horizontal movement rail 5i11 is provided on the lifting plate 5i6 so as to extend horizontally (in the direction indicated by the double arrow 5i70). The nozzle head 5i12 is provided so as to be able to move horizontally on the horizontal movement rail 5i11 by the horizontal movement mechanism (not shown). The horizontal movement mechanism, under the control of the control unit 7, moves the nozzle head 5i12 horizontally (in the direction indicated by the double arrow 5i70). Thus, the horizontal movement rail 5i11 and the horizontal movement mechanism move the nozzle head 5i12, which is equipped with a cleaning fluid nozzle 5i13 and a gas nozzle 5i14, in the horizontal direction, that is, in a direction along the support surface 5c1 of the support portion 5c shown in Figure 2. The horizontal movement rail 5i11 and the horizontal movement mechanism are an example of a second internal movement device.
[0065] The nozzle head 5i12 is equipped with multiple nozzle sets, each consisting of a cleaning liquid nozzle 5i13 for discharging cleaning liquid and a gas nozzle 5i14 for discharging gas. In the example shown in Figure 8, the nozzle head 5i12 is equipped with four sets of cleaning liquid nozzles 5i13 and gas nozzles 5i14 (nozzle sets). Of the four nozzle sets, the two sets located at both ends are mounted diagonally to the nozzle head 5i12 so as to face the corner portion (corner) formed by the circumferential surface 20a1 corresponding to the long side of the opening of the storage container body 20a and the circumferential surface 20a1 adjacent to that circumferential surface 20a1. The nozzle sets located at both ends supply cleaning liquid or gas toward the corner portion.
[0066] Of the four sets of nozzles, we will describe the two sets of nozzles located in the center of the nozzle head 5i12, rather than the two sets located at both ends. For example, the cleaning liquid nozzles 5i13 of these two sets of nozzles clean the circumferential surface 20a1 of the storage container body 20a that corresponds to the long side of the opening (the circumferential surface 20a1 facing the cleaning liquid nozzles 5i13). For example, the cleaning liquid nozzles 5i13 supply cleaning liquid to the circumferential surface 20a1 located opposite to them from the front. The cleaning liquid nozzles 5i13 clean the circumferential surface 20a1 of the storage container body 20a, which is supported by the support part 5c, by supplying cleaning liquid to the circumferential surface 20a1. A supply pipe (not shown) for supplying cleaning liquid to the cleaning liquid nozzles 5i13 is provided inside the lifting cylinder 5i5. A cleaning fluid storage tank (not shown) containing cleaning fluid is connected to the supply piping. The cleaning fluid stored in the cleaning fluid storage tank is supplied to the cleaning fluid nozzle 5i13 via the supply piping, and the cleaning fluid supplied to the cleaning fluid nozzle 5i13 is then supplied from the cleaning fluid nozzle 5i13 to the surrounding surface 20a1.
[0067] Furthermore, the centrally located gas nozzle 5i14 dries the circumferential surface 20a1 of the storage container body 20a (the circumferential surface 20a1 facing the gas nozzle 5i14). The gas nozzle 5i14 supplies gas (for example, gas heated to a predetermined temperature) from the front to the circumferential surface 20a1 located opposite it. The gas nozzle 5i14 dries the circumferential surface 20a1 of the storage container body 20a, which is supported by the support part 5c, by supplying gas to the circumferential surface 20a1. A supply pipe (not shown) for supplying gas to the gas nozzle 5i14 is provided inside the lifting cylinder 5i5. A gas storage tank (not shown) containing gas heated to a predetermined temperature is connected to the supply piping. The gas stored in the gas storage tank is supplied to the gas nozzle 5i14 via the supply piping, and the gas supplied to the gas nozzle 5i14 is then supplied from the gas nozzle 5i14 to the surrounding surface 20a1.
[0068] As described above, the cleaning solution nozzle 5i13 supplies cleaning solution to the circumferential surface 20a1 of the storage container body 20a. The gas nozzle 5i14 supplies gas to the circumferential surface 20a1 of the storage container body 20a. The spacing and number of pairs of cleaning solution nozzles 5i13 and gas nozzles 5i14 can be determined according to the diffusion angle of the cleaning solution or gas discharged from each nozzle. The cleaning solution nozzle 5i13 and gas nozzle 5i14 are examples of internal nozzles.
[0069] The distance sensor 5i15 is attached to the nozzle head 5i12. The distance sensor 5i15 detects the horizontal distance between itself and the opposing circumferential surface 20a1 and transmits a signal indicating the detected distance to the control unit 7. The distance sensor 5i15 performs this distance detection at predetermined time intervals. The distance sensor 5i15 is an example of a first distance detection unit.
[0070] The circumferential nozzle unit 5i2 comprises a horizontal movement rail 5i21, a nozzle head 5i22, a cleaning fluid nozzle 5i23, a gas nozzle 5i24, and a distance sensor 5i25. The circumferential nozzle unit 5i2 also includes a horizontal movement mechanism (not shown). The horizontal movement rail 5i21 is provided on the lifting plate 5i6 so as to extend horizontally (in the direction indicated by the double arrow 5i71 in Figure 8). The nozzle head 5i22 is provided so as to be able to move horizontally on the horizontal movement rail 5i21 by the horizontal movement mechanism. That is, the nozzle head 5i22 can move in a direction toward / away from the circumferential surface 20a1 corresponding to the short side of the opening of the storage container body 20a. The horizontal movement mechanism, under the control of the control unit 7, moves the nozzle head 5i22 horizontally (in the direction indicated by the double arrow 5i71). Thus, the horizontal movement rail 5i21 and the horizontal movement mechanism move the nozzle head 5i22, which is equipped with a cleaning liquid nozzle 5i23 and a gas nozzle 5i24, in the horizontal direction, that is, in the direction along the support surface 5c1 of the support portion 5c shown in Figure 2. The horizontal movement rail 5i21 and the horizontal movement mechanism are an example of a second internal movement device.
[0071] The nozzle head 5i22 includes at least one nozzle pair, each consisting of a cleaning liquid nozzle 5i23 for discharging cleaning liquid and a gas nozzle 5i24 for discharging gas. In the example shown in Figure 8, the nozzle head 5i22 includes one pair of cleaning liquid nozzles 5i23 and gas nozzles 5i24 (nozzle pair). The spacing and number of pairs of cleaning liquid nozzles 5i23 and gas nozzles 5i24 can be determined according to the diffusion angle of the cleaning liquid or gas discharged from each nozzle.
[0072] The cleaning liquid nozzle 5i23 cleans the circumferential surface 20a1 of the storage container body 20a, which is supported by the support part 5c, by supplying cleaning liquid from the front to the circumferential surface 20a1 facing the cleaning liquid nozzle 5i23. A supply pipe (not shown) for supplying cleaning liquid to the cleaning liquid nozzle 5i23 is provided inside the lifting cylinder 5i5. A cleaning liquid storage tank (not shown) containing cleaning liquid is connected to the supply pipe, and the cleaning liquid stored in the cleaning liquid storage tank is supplied to the cleaning liquid nozzle 5i23 via the supply pipe, and the cleaning liquid supplied to the cleaning liquid nozzle 5i23 is then supplied from the cleaning liquid nozzle 5i23 to the circumferential surface 20a1.
[0073] The gas nozzle 5i24 dries the circumferential surface 20a1 of the storage container body 20a, which is supported by the support part 5c, by supplying gas (for example, gas heated to a predetermined temperature) from the front to the circumferential surface 20a1 facing the gas nozzle 5i24. A supply pipe (not shown) for supplying gas to the gas nozzle 5i24 is provided inside the lifting cylinder 5i5. A gas storage tank (not shown) containing gas heated to a predetermined temperature is connected to the supply pipe, and the gas stored in the gas storage tank is supplied to the gas nozzle 5i24 via the supply pipe, and the gas supplied to the gas nozzle 5i24 is supplied from the gas nozzle 5i24 to the circumferential surface 20a1.
[0074] As described above, the cleaning solution nozzle 5i23 supplies cleaning solution to the circumferential surface 20a1 from the central side of the storage space of the storage container body 20a. The gas nozzle 5i24 supplies gas to the circumferential surface 20a1 from the central side of the storage space of the storage container body 20a. The cleaning solution nozzle 5i23 and the gas nozzle 5i24 are examples of internal nozzles.
[0075] The distance sensor 5i25 is attached to the nozzle head 5i22 and detects the horizontal distance between it and the opposing circumferential surface 20a1, and transmits a signal indicating the detected distance to the control unit 7. The distance sensor 5i25 performs this distance detection at predetermined time intervals. The distance sensor 5i25 is an example of a first distance detection unit.
[0076] Figure 9 is an enlarged view of the top nozzle unit 5i3 shown in Figure 7. As shown in Figure 9, the top nozzle unit 5i3 comprises a support base 5i50, one nozzle head 5i31, four nozzle heads 5i34, and four nozzle heads 5i41.
[0077] The support base 5i50 supports the nozzle heads 5i31, 5i34, and 5i41. The support base 5i50 is a flat plate-shaped member with a rectangular shape in plan view and is attached to the upper end of the support column 5i4. The support base 5i50 is equipped with one nozzle head 5i31, four nozzle heads 5i34, and four nozzle heads 5i41 in a 3x3 arrangement. The nozzle heads 5i31, 5i34, and 5i41 are cubic in shape. Therefore, the nozzle heads 5i31, 5i34, and 5i41 have a top surface, a bottom surface, and four sides.
[0078] In a 3x3 arrangement of nozzle heads 5i31, 5i34, and 5i41, nozzle head 5i31 is located in the center. The four nozzle heads 5i34 are located at the "corners" of the 3x3 arrangement. The four nozzle heads 5i41 are located between the four nozzle heads 5i34 that are located at the "corners" of the 3x3 arrangement.
[0079] As shown in Figure 9, the nozzle head 5i31 is equipped with one nozzle set consisting of a cleaning liquid nozzle 5i32 for discharging cleaning liquid and a gas nozzle 5i33 for discharging gas. The cleaning liquid nozzle 5i32 and gas nozzle 5i33 set is located on the upper surface of the nozzle head 5i31. The cleaning liquid nozzle 5i32 discharges cleaning liquid directly upward. The gas nozzle 5i33 discharges gas directly upward. The cleaning liquid nozzle 5i32 and the gas nozzle 5i33 are located directly below the center of the top surface 20a2. Therefore, the cleaning liquid nozzle 5i32 cleans the center of the top surface 20a2 by supplying cleaning liquid to the center of the top surface 20a2. The gas nozzle 5i33 dries the center of the top surface 20a2 by supplying gas to the center of the top surface 20a2.
[0080] Furthermore, each of the four nozzle heads 5i34 is equipped with three sets of cleaning liquid nozzles that discharge cleaning liquid diagonally upward and gas nozzles that discharge gas diagonally upward. One set consists of a cleaning liquid nozzle 5i35 that supplies cleaning liquid to the upper part of the circumferential surface 20a1 and a gas nozzle 5i36 that discharges gas to the upper part of the circumferential surface 20a1. The set of cleaning liquid nozzle 5i35 and gas nozzle 5i36 is provided on one of the four sides of the nozzle head 5i34 that directly faces the circumferential surface 20a1. The cleaning liquid nozzle 5i35 cleans the upper part of the circumferential surface 20a1 and the peripheral edge of the top surface 20a2 by supplying cleaning liquid to the upper part of the circumferential surface 20a1 and the peripheral edge of the top surface 20a2 that are facing each other. Furthermore, the gas nozzle 5i36 dries the upper part of the circumferential surface 20a1 and the peripheral edge of the top surface 20a2 by supplying gas to the upper part of the circumferential surface 20a1 and the peripheral edge of the top surface 20a2. Note that "directly facing" means facing each other without any other nozzle heads 5i31, 5i34, 5i41, etc. being interposed between them.
[0081] The other set consists of a cleaning liquid nozzle 5i37 that supplies cleaning liquid to the upper part of the opposing circumferential surface 20a1 and the peripheral edge of the top surface 20a2, and a gas nozzle 5i38 that discharges gas to the upper part of the opposing circumferential surface 20a1 and the peripheral edge of the top surface 20a2. The cleaning liquid nozzle 5i37 and gas nozzle 5i38 set is provided on the other side of the nozzle head 5i34 that directly faces the circumferential surface 20a1. The cleaning liquid nozzle 5i37 cleans the upper part of the opposing circumferential surface 20a1 and the peripheral edge of the top surface 20a2 by supplying cleaning liquid to the upper part of the opposing circumferential surface 20a1 and the peripheral edge of the top surface 20a2. The gas nozzle 5i38 dries the upper part of the opposing circumferential surface 20a1 and the peripheral edge of the top surface 20a2 by supplying gas to the upper part of the opposing circumferential surface 20a1 and the peripheral edge of the top surface 20a2.
[0082] Another set consists of a cleaning liquid nozzle 5i39 that supplies cleaning liquid to the corner formed by the two opposing circumferential surfaces 20a1 and top surface 20a2 of the two nozzle sets described above, and a gas nozzle 5i40 that supplies gas to the same corner. The cleaning liquid nozzle 5i39 and gas nozzle 5i40 set is provided on the upper surface of the nozzle head 5i34. The cleaning liquid nozzle 5i39 cleans the corner by supplying cleaning liquid to it. The gas nozzle 5i38 dries the corner by supplying gas to it.
[0083] Furthermore, each of the four nozzle heads 5i41 is equipped with a set of cleaning liquid nozzles 5i42 that supply cleaning liquid to the upper part of the opposing circumferential surface 20a1 and the peripheral edge of the top surface 20a2, and a gas nozzle 5i43 that supplies gas to the upper part of the opposing circumferential surface 20a1 and the peripheral edge of the top surface 20a2. The set of cleaning liquid nozzles 5i42 and gas nozzles 5i43 is provided on the side of the nozzle head 5i41 that directly faces the circumferential surface 20a1. In addition, each of the four nozzle heads 5i41 is equipped with a set of cleaning liquid nozzles 5i44 that supply cleaning liquid between the central part and the peripheral edge of the top surface 20a2, and a gas nozzle 5i45 that supplies gas to the area in between. The set of cleaning liquid nozzles 5i44 and gas nozzles 5i45 is provided on the upper surface of the nozzle head 5i41. The cleaning liquid nozzle 5i42 cleans the upper part of the opposing circumferential surface 20a1 and the peripheral edge of the top surface 20a2 by supplying cleaning liquid to the upper part of the opposing circumferential surface 20a1 and the peripheral edge of the top surface 20a2. The gas nozzle 5i43 dries the upper part of the opposing circumferential surface 20a1 and the peripheral edge of the top surface 20a2 by supplying gas to the upper part of the opposing circumferential surface 20a1 and the peripheral edge of the top surface 20a2. The cleaning liquid nozzle 5i44 cleans the area between the center and the peripheral edge of the top surface 20a2 by supplying cleaning liquid between the center and the peripheral edge of the top surface 20a2. The gas nozzle 5i45 dries the area between the center and the peripheral edge of the top surface 20a2 by supplying gas between the center and the peripheral edge of the top surface 20a2.
[0084] Inside the support column 5i4, there is a supply pipe (not shown) for supplying cleaning fluid to the multiple cleaning fluid nozzles 5i32, 5i35, 5i37, 5i39, 5i42, and 5i44 provided by the top nozzle unit 5i3. A cleaning fluid storage tank (not shown) containing cleaning fluid is connected to the supply pipe, and the cleaning fluid stored in the cleaning fluid storage tank is supplied to the multiple cleaning fluid nozzles via the supply pipe, and the cleaning fluid supplied to the multiple cleaning fluid nozzles is discharged from the multiple cleaning fluid nozzles.
[0085] Furthermore, a supply pipe (not shown) is provided inside the support column 5i4 for supplying gas to the aforementioned multiple gas nozzles 5i33, 5i36, 5i38, 5i40, 5i43, and 5i45 provided by the top nozzle unit 5i3. A gas storage tank (not shown) containing gas heated to a predetermined temperature is connected to the supply pipe, and the gas stored in the gas storage tank is supplied to the multiple gas nozzles via the supply pipe, and the gas supplied to the multiple gas nozzles is discharged from the multiple gas nozzles.
[0086] As described above, the multiple cleaning fluid nozzles 5i32, 5i35, 5i37, 5i39, 5i42, 5i44 and the multiple gas nozzles 5i33, 5i36, 5i38, 5i40, 5i43, 5i45 provided by the top nozzle unit 5i3 supply cleaning fluid or gas to the top surface 20a2 in the storage space of the storage container body 20a supported by the support part 5c. The multiple cleaning fluid nozzles 5i32, 5i35, 5i37, 5i39, 5i42, 5i44 and the multiple gas nozzles 5i33, 5i36, 5i38, 5i40, 5i43, 5i45 provided by such a top nozzle unit 5i3 are examples of top nozzles.
[0087] An example of the configuration of the wafer storage container cleaning apparatus 1 according to this embodiment has been described. It should be noted that the on / off switching of the cleaning liquid nozzles and the on / off switching of the gas nozzles can be controlled independently on a nozzle head basis.
[0088] Next, an example of the operation of the outer nozzle unit 5h and the inner nozzle unit 5i according to the embodiment will be described. Here, we will describe the cases in which the outer nozzle unit 5h and the inner nozzle unit 5i wash the storage container body 20a and dry the storage container body 20a.
[0089] First, we will describe the case in which the outer nozzle unit 5h and the inner nozzle unit 5i perform a cleaning process to clean the storage container body 20a. The control unit 7 moves the nozzle head 5h14 of the outer nozzle unit 5h in the vertical and horizontal directions, and supplies cleaning liquid to the outer surface 20a3 of the storage container body 20a from the cleaning liquid nozzle 5h15 provided on the nozzle head 5h14. The control unit 7 also moves the circumferential nozzle unit 5i1 and the circumferential nozzle unit 5i2 of the inner nozzle unit 5i in the vertical direction, and moves the nozzle head 5i12 of the circumferential nozzle unit 5i1 and the nozzle head 5i22 of the circumferential nozzle unit 5i2 in the horizontal direction, and supplies cleaning liquid to the circumferential surface 20a1 of the storage container body 20a from the multiple cleaning liquid nozzles of the inner nozzle unit 5i.
[0090] Next, we will describe the case in which the outer nozzle unit 5h and the inner nozzle unit 5i perform a drying process to dry the storage container body 20a. The control unit 7 moves the nozzle head 5h14 of the outer nozzle unit 5h in the vertical and horizontal directions, and supplies gas to the outer surface 20a3 of the storage container body 20a from the gas nozzle 5h16 provided on the nozzle head 5h14. The control unit 7 also moves the circumferential nozzle unit 5i1 and the circumferential nozzle unit 5i2 of the inner nozzle unit 5i in the vertical direction, and moves the nozzle head 5i12 of the circumferential nozzle unit 5i1 and the nozzle head 5i22 of the circumferential nozzle unit 5i2 in the horizontal direction, and supplies gas to the circumferential surface 20a1 of the storage container body 20a from the multiple gas nozzles of the inner nozzle unit 5i.
[0091] In the washing and drying processes, the nozzle head 5h14 and the circumferential nozzle unit 5i1 and circumferential nozzle unit 5i2 may rise only once from their respective lowest positions to their respective highest positions, or descend only once from their respective highest positions to their respective lowest positions, or reciprocate one or more times between their respective highest and lowest positions.
[0092] When the nozzle head 5h14 and the circumferential nozzle units 5i1 and 5i2 reciprocate once or multiple times between their respective highest and lowest positions, the cleaning liquid or gas may be supplied to the storage container body 20a both during the descent and the ascent. In other words, the cleaning liquid or gas may always be supplied to the storage container body 20a. Alternatively, the cleaning liquid or gas may be supplied to the storage container body 20a only during the descent or only during the ascent.
[0093] When the nozzle head 5h14 and the circumferential nozzle units 5i1 and 5i2 move back and forth multiple times between their respective highest and lowest positions, the respective lifting and lowering speeds and the number of repetitions for each of the nozzle head 5h14, circumferential nozzle unit 5i1, and circumferential nozzle unit 5i2 can be determined by experiment or simulation. Similarly, when the nozzle head 5h14 and the circumferential nozzle units 5i1 and 5i2 move up or down only once, the respective lifting or lowering speeds for each of the nozzle head 5h14, circumferential nozzle unit 5i1, and circumferential nozzle unit 5i2 can also be determined by experiment or simulation.
[0094] In this embodiment, when raising or lowering the nozzle heads 5h14, 5i12, and 5i22, respectively, the control unit 7 moves the nozzle heads 5h14, 5i12, and 5i22 individually in the horizontal direction so that the horizontal distance between each of the cleaning liquid nozzles 5h15, 5i13, and 5i23 and each of the surfaces (outer surface 20a3, circumferential surface 20a1) to be cleaned by the cleaning liquid nozzles 5h15, 5i13, and 5i23 is maintained at a preset distance. The "pre-set distance" referred to here is the distance at which the cleaning liquid supplied from the nozzles can obtain the intended cleaning force, and includes a range of a certain allowable distance.
[0095] For example, as shown in Figure 3, when the control unit 7 raises or lowers the nozzle head 5h14 during the cleaning process, it moves the nozzle head 5h14 horizontally so that the horizontal distance between the cleaning liquid nozzle 5h15 and the outer surface 20a3 of the object to be cleaned by the cleaning liquid nozzle 5h15 is maintained at a preset distance L1 (a predetermined second distance).
[0096] Furthermore, as shown in Figure 5, for example, when the control unit 7 raises or lowers the nozzle head 5i12 during the cleaning process, it moves the nozzle head 5i12 horizontally so that the horizontal distance between the cleaning liquid nozzle 5i13 and the circumferential surface 20a1 of the object being cleaned by the cleaning liquid nozzle 5i13 is maintained at a preset distance L2 (a predetermined first distance). Similarly, when the control unit 7 raises or lowers the nozzle head 5i22, it moves the nozzle head 5i22 horizontally so that the horizontal distance between the cleaning liquid nozzle 5i23 and the circumferential surface 20a1 of the object being cleaned by the cleaning liquid nozzle 5i23 is maintained at a preset distance.
[0097] Furthermore, when the control unit 7 raises or lowers nozzle heads 5h14, 5i12, and 5i22 during the drying process, it individually moves nozzle heads 5h14, 5i14, and 5i24 horizontally so that the horizontal distance between each of the gas nozzles 5h16, 5i14, and 5i24 and each of the surfaces (outer surface 20a3, circumferential surface 20a1) being dried by the gas nozzles 5h16, 5i14, and 5i24 is maintained at a preset distance. The "pre-set distance" here refers to the distance at which the intended drying effect is obtained from the gas supplied from the nozzles, and includes a range of a certain allowable distance.
[0098] In this embodiment, when raising or lowering the nozzle heads 5h14, 5i12, and 5i22, the control unit 7 can control the amount of horizontal movement of the nozzle heads 5h14, 5i12, and 5i22 in real time based on the detected value of the distance sensor. For example, in the cleaning process, the control unit 7 receives a signal transmitted from the distance sensor 5h17 and moves the nozzle head 5h14 horizontally based on the distance indicated by the received signal, so that the horizontal distance between the cleaning liquid nozzle 5h15 and the outer surface 20a3 is maintained at a preset distance L1. To illustrate with an example, the control unit 7 moves the nozzle head 5h14 horizontally so that the distance indicated by the signal transmitted from the distance sensor 5h17 is distance L1, thereby maintaining the horizontal distance between the cleaning liquid nozzle 5h15 and the outer surface 20a3 at a preset distance L1. Similarly, during the drying process, the control unit 7 receives a signal transmitted from the distance sensor 5h17 and moves the nozzle head 5h14 horizontally based on the distance indicated by the received signal, so that the horizontal distance between the gas nozzle 5h16 and the circumferential surface 20a1 is maintained at a preset distance.
[0099] Furthermore, during the cleaning process, the control unit 7 receives a signal transmitted from the distance sensor 5i15 and moves the nozzle head 5i12 horizontally based on the distance indicated by the received signal so that the horizontal distance between the cleaning liquid nozzle 5i13 and the circumferential surface 20a1 is maintained at a preset distance L2. Similarly, the control unit 7 receives a signal transmitted from the distance sensor 5i15 and moves the nozzle head 5i12 horizontally based on the distance indicated by the received signal so that the horizontal distance between the gas nozzle 5i14 and the circumferential surface 20a1 is maintained at a preset distance.
[0100] Furthermore, during the cleaning process, the control unit 7 receives a signal transmitted from the distance sensor 5i25 and moves the nozzle head 5i22 horizontally based on the distance indicated by the received signal so that the horizontal distance between the cleaning liquid nozzle 5i23 and the circumferential surface 20a1 is maintained at a preset distance. Similarly, the control unit 7 receives a signal transmitted from the distance sensor 5i25 and moves the nozzle head 5i22 horizontally based on the distance indicated by the received signal so that the horizontal distance between the gas nozzle 5i24 and the circumferential surface 20a1 is maintained at a preset distance.
[0101] In this manner, the control unit 7 controls the inner nozzle unit 5i so that the inner nozzles (cleaning liquid nozzle 5i13, gas nozzle 5i14, cleaning liquid nozzle 5i23, gas nozzle 5i24) are raised or lowered while maintaining a predetermined first distance (distance L2) from the circumferential surface 20a1, and that the inner nozzles supply cleaning liquid or gas to the circumferential surface 20a1. The control unit 7 also controls the outer nozzle unit 5h so that the outer nozzles (cleaning liquid nozzle 5h15, gas nozzle 5h16) are raised or lowered while maintaining a predetermined second distance (distance L1) from the outer surface 20a3, and that the outer nozzles supply cleaning liquid or gas to the outer surface 20a3.
[0102] Furthermore, the control unit 7 moves the inner nozzle while maintaining a predetermined first distance from the circumferential surface 20a1 based on the distance detected by the distance sensors 5i15 and 5i25. Also, the control unit 7 moves the outer nozzle while maintaining a predetermined second distance from the outer surface 20a3 based on the distance detected by the distance sensor 5h17.
[0103] Thus, in the wafer storage container cleaning apparatus 1 according to this embodiment, the horizontal distance between the cleaning liquid nozzle or gas nozzle and the surface to be processed is maintained at a preset distance during the cleaning and drying processes. Therefore, variations in the distance between the cleaning liquid nozzle or gas nozzle and the surface to be processed can be suppressed, and consequently, the occurrence of cleaning and drying defects can be suppressed.
[0104] The shape of the storage container body 20a can be obtained from design data or measurements. From the obtained shape of the storage container body 20a, the relationship between the vertical movement amount (movement in the up and down direction) and the horizontal movement amount, which is necessary to maintain the horizontal distance between the cleaning liquid nozzle or gas nozzle and the surface to be treated (outer surface 20a3, circumferential surface 20a1) at a predetermined distance, can be determined in advance. Therefore, information showing the relationship between the determined vertical movement amount (movement in the up and down direction) and the horizontal movement amount may be stored in advance on the HDD of the control unit 7, and the control unit 7 may move the nozzle head in the vertical and horizontal directions based on this information.
[0105] Alternatively, instead of controlling the amount of horizontal movement in real time based on the distance sensor's detection value, the distance sensor may be scanned in the vertical direction (up and down direction) of the storage container body 20a before the washing or drying process begins to measure the relationship between the position in the vertical direction and the distance to the storage container body 20a. The information showing this relationship may then be stored in advance in the HDD of the control unit 7, and the control unit 7 may move the nozzle head in the vertical and horizontal directions based on the stored information.
[0106] Furthermore, the control unit 7 may simultaneously discharge cleaning liquid or gas from all nine nozzle heads of the top nozzle unit 5i3 and simultaneously stop the discharge of cleaning liquid or gas. However, the control unit 7 may also change the timing of discharge and cessation of discharge of cleaning liquid or gas for each nozzle head of the top nozzle unit 5i3.
[0107] For example, in the drying process, the control unit 7 may control the timing of gas supply from multiple gas nozzles so that the area to which gas is supplied gradually expands from the center outward on the top surface 20a2. This improves the efficiency of removing droplets adhering to the top surface 20a2.
[0108] For example, the control unit 7 discharges gas from the gas nozzle 5i33 of the nozzle head 5i31, which is located in the center of a 3x3 arrangement. The gas nozzle 5i33 supplies gas to the central part of the top surface 20a2. The gas nozzle 5i33 is an example of a central nozzle.
[0109] After a preset time t1 has elapsed since the gas nozzle 5i33 began to discharge gas, the control unit 7 discharges gas from the gas nozzles located on the upper surfaces of the eight nozzle heads located on the outer periphery of the 3x3 arrangement, excluding the center. The gas nozzles located on the upper surfaces of the eight nozzle heads on the outer periphery supply gas to the outer periphery of the top surface 20a2 outside the central part (between the central part and the peripheral part of the top surface 20a2). The gas nozzles located on the upper surfaces of the eight nozzle heads on the outer periphery are an example of outer periphery nozzles. In this way, after the gas nozzle 5i33 begins supplying gas to the central part of the top surface 20a2, the control unit 7 controls the inner nozzle unit 5i to begin supplying gas to the outer periphery of the top surface 20a2 using the gas nozzles located on the upper surfaces of the eight nozzle heads on the outer periphery. As a result, the cleaning fluid that has been moved from the center to the outer edge of the top surface 20a2 by the supply of gas from the central nozzle is moved further towards the outer edge, while the cleaning fluid that was adhering to the outer edge rather than the center is prevented from moving towards the center and moves towards the outer edge.
[0110] After a time t2 has elapsed since the start of discharging gas from the gas nozzles located on the upper surfaces of the eight nozzle heads, the control unit 7 discharges gas from the gas nozzles located on the sides of the eight nozzle heads on the outer perimeter. In the 3x3 arrangement, two gas nozzles are provided on two sides of the four nozzle heads located at the "corners" among the eight nozzle heads on the outer perimeter. Therefore, the control unit 7 discharges gas from the two gas nozzles provided on the two sides of the four nozzle heads located at the "corners". As a result, the cleaning liquid that has moved to the outer perimeter of the top surface 20a2 moves to the circumferential surface 20a1.
[0111] Furthermore, the gas nozzle that started discharging gas first will continue supplying gas even after the next gas nozzle starts discharging gas. The control unit 7 may stop gas discharge from all nozzle heads simultaneously. Alternatively, the control unit 7 may stop gas discharge in the following order: the gas nozzle 5i33 of the nozzle head 5i31 located in the center of the 3x3 arrangement, the gas nozzles located on the top surfaces of the eight nozzle heads on the outer perimeter, and the gas nozzles located on the sides of the eight nozzle heads on the outer perimeter.
[0112] In this way, the area to which the gas is supplied can be gradually expanded from the center of the top surface 20a2, and the cleaning liquid adhering to the top surface 20a2 of the storage container body 20a can be gradually moved from the center of the top surface 20a2 to the circumferential surface 20a1. This makes it possible to efficiently remove the cleaning liquid from the top surface 20a2.
[0113] Furthermore, when the control unit 7 controls the timing of gas supply by multiple gas nozzles as described above, the timing of gas discharge must differ between the gas nozzles located on the top surface and the gas nozzles located on the sides of the eight nozzle heads located on the outer circumference. In such cases, the system can be configured to allow the gas discharge to be turned on or off for each gas nozzle.
[0114] Furthermore, if the control unit 7 controls the timing of gas supply by multiple gas nozzles as described above, the control unit 7 may also control the timing of gas supply by gas nozzles 5i14 and 5i24 of the circumferential nozzle units 5i1 and 5i2. For example, after time t3 has elapsed since the start of gas discharge from the gas nozzles located on the sides of the eight nozzle heads on the outer circumference, the control unit 7 starts supplying gas to the circumferential surface 20a1 with gas nozzle 5i14 while circumferential nozzle unit 5i1 is in its highest position, and starts supplying gas to the circumferential surface 20a1 with gas nozzle 5i24 while circumferential nozzle unit 5i2 is in its highest position. Then, while continuing to supply gas by gas nozzles 5i14 and 5i24, the control unit 7 lowers circumferential nozzle units 5i1 and 5i2 from their highest position to their lowest position.
[0115] As described above, the control unit 7 starts supplying gas to the top surface 20a2 in the storage space of the storage container body 20a using the gas nozzles of the top surface nozzle unit 5i3, and then controls the inner nozzle unit 5i to start supplying gas to the circumferential surface 20a1 in the storage space.
[0116] As a result, droplets of cleaning fluid that have been moved from the center of the top surface 20a2 towards the edges (outer circumference) of the top surface 20a2 by the top surface nozzle unit 5i3 and moved to the circumferential surface 20a1 are then moved downward along the circumferential surface 20a1 by the circumferential surface nozzle units 5i1 and 5i2. This allows for the removal of the cleaning fluid droplets in a series of steps, enabling efficient removal of the cleaning fluid.
[0117] In addition, during the drying process, the control unit 7 may, after supplying gas to the outer surface 20a4 with the gas nozzle 5h3 to remove droplets of cleaning solution adhering to the outer surface 20a4, supply gas to the outer surface 20a3 with the gas nozzle 5h16 provided in the nozzle unit 5h1 of the outer nozzle unit 5h.
[0118] Furthermore, while we have described an example in which a single nozzle head is equipped with a cleaning fluid nozzle and a gas nozzle as a set, the cleaning fluid nozzle and the gas nozzle may each be provided on a separate nozzle head.
[0119] Furthermore, although an example of horizontally moving a nozzle head equipped with multiple nozzles has been described, each of the multiple nozzles may be configured to be individually movable horizontally, and each of the multiple nozzles may be moved horizontally individually. This makes it possible to maintain a predetermined distance between each nozzle and the outer surface 20a3 or circumferential surface 20a1 of the storage container body 20a, even if there are differences in the undulations at each nozzle position within the same outer surface 20a3 or the same circumferential surface 20a1.
[0120] Here, referring to Figure 10, a wafer storage container cleaning apparatus will be described in which, with nozzles such as cleaning solution nozzles and gas nozzles fixed in place, the storage container body is rotated with the opening of the storage container body facing downwards, while cleaning solution or gas is supplied to the nozzles into the storage container body. The change in distance between the nozzle and the storage container body 200a is, assuming the nozzle position is fixed, half the difference between the diagonal length L11 on the opening side of the storage container body 200a and the length L12 on the short side (L11-L12) ((L11-L12) / 2), as shown in Figure 10. In contrast, as in this embodiment, when the storage container body 20a is not rotated, the change in distance between the nozzle and the storage container body 20a is, even if the nozzle position is fixed, half the difference between the length L14 on the opening side of the storage container body 20a and the length L13 on the opposite side (L14-L13) ((L14-L13) / 2). Therefore, the amount of change is significantly less in the wafer storage container cleaning apparatus 1 according to this embodiment than in a wafer storage container cleaning apparatus in which the nozzle is fixed and the storage container body rotates. For these reasons, if the amount of change in the distance between the nozzle and the storage container body 20a is acceptable at the nozzle (not enough to cause poor cleaning or drying), then in this embodiment, the wafer storage container cleaning apparatus 1 does not need to have a configuration that moves the nozzle head horizontally.
[0121] Furthermore, although the example described uses a FOUP as the wafer storage container cleaned by the wafer storage container cleaning apparatus 1, it is not limited to this. For example, it can also be applied to so-called PANEL FOUPs that house glass panels used in the manufacturing process of panel-level packages, etc. In other words, the term "wafer" broadly refers not only to semiconductor wafers manufactured from silicon single crystals, etc., but also to substrates used for pattern formation in the manufacturing process of semiconductor packages.
[0122] Although embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, and combinations can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of Symbols]
[0123] 1. Wafer storage container cleaning device 5. Washing tank 7 Control Unit
Claims
1. A wafer storage container comprising a storage container body having a storage space for storing wafers and an opening communicating with the storage space, and a door that closes the opening, wherein the storage container body is supported by a support portion having a support surface that supports the opening facing downward, An inner nozzle unit is provided so as to be located within the storage space of the storage container body supported by the support portion, and supplies cleaning liquid or gas to the inner surface forming the storage space, An outer nozzle unit is provided so as to be located outside the storage container body supported by the support portion, and supplies cleaning liquid or gas to the outer surface of the storage container body, Equipped with, The aforementioned inner nozzle unit is The inner surface, specifically the circumferential surface surrounding the opening, is provided with a plurality of inner nozzles for supplying cleaning liquid or gas. A first inner moving device moves the plurality of inner nozzles in a direction perpendicular to the support surface in the support portion, Equipped with, The aforementioned outer nozzle unit is The outer surface of the storage container body is provided with a plurality of outer nozzles for supplying cleaning liquid or gas, A first outer moving device that moves the plurality of outer nozzles in a direction perpendicular to the support surface, Equipped with, Wafer storage container cleaning device.
2. The inner nozzle unit includes a second inner moving device that moves the plurality of inner nozzles in a direction along the support surface in the support portion, The outer nozzle unit includes a second outer moving device for moving the plurality of outer nozzles in a direction along the support surface. A wafer storage container cleaning apparatus according to claim 1.
3. The system includes a control unit that controls the inner nozzle unit so that the inner nozzle supplies cleaning liquid or gas to the circumferential surface while moving the inner nozzle while maintaining a predetermined first distance from the circumferential surface, and a control unit that controls the outer nozzle unit so that the outer nozzle supplies cleaning liquid or gas to the outer surface while moving the outer nozzle while maintaining a predetermined second distance from the outer surface. The wafer storage container cleaning apparatus according to claim 2.
4. The inner nozzle unit is equipped with a top nozzle that supplies cleaning liquid or gas to the top surface of the storage space of the storage container body supported by the support portion. A wafer storage container cleaning apparatus according to claim 3.
5. The inner nozzle unit includes a first distance detection unit that detects the distance between the inner nozzle and the circumferential surface facing the inner nozzle, The outer nozzle unit includes a second distance detection unit for detecting the distance between the outer nozzle and the outer surface facing the outer nozzle. The control unit moves the inner nozzle while maintaining a predetermined first distance from the circumferential surface based on the distance detected by the first distance detection unit, and moves the outer nozzle while maintaining a predetermined second distance from the outer surface based on the distance detected by the second distance detection unit. A wafer storage container cleaning apparatus according to claim 3.
6. The control unit controls the inner nozzle unit to start supplying gas to the circumferential surface of the storage space after starting to supply gas to the top surface of the storage space using the top surface nozzle. The wafer storage container cleaning apparatus according to claim 4.
7. The aforementioned top surface nozzle is A central nozzle for supplying gas to the center of the top surface, The system comprises at least an outer peripheral nozzle that supplies gas to the outer peripheral portion of the central part of the top surface, The control unit controls the inner nozzle unit to start supplying gas to the outer periphery through the outer nozzle after starting to supply gas to the central part through the central nozzle. The wafer storage container cleaning apparatus according to claim 6.
8. Each of the inner nozzle unit and the outer nozzle unit comprises a nozzle for supplying cleaning fluid and a nozzle for supplying gas. A wafer storage container cleaning apparatus according to claim 1.
Citation Information
Patent Citations
Wafer storage container cleaning device
JP2024045013A