Method for manufacturing a laminate, laminate, and intermediate laminate

Abstract

The present invention provides a method for manufacturing a laminate that can clearly define the outline of the window portion, form a high-definition window portion, and allow the luster of the metal layer to be visually observed through the window portion. [Solution] According to one aspect of the present invention, a method for manufacturing a laminate 10 is provided, comprising the steps of: preparing an intermediate laminate 60A comprising a transparent or translucent substrate 11, a base layer 12 that can be removed by irradiation with laser light, a pattern layer 13, and a metallic layer 15 disposed within the substrate 11 and having lustrous properties, wherein the distance between the base layer 12 and the metallic layer 15 in the thickness direction of the substrate 11 is 0.20 mm or more; and irradiating a portion of the intermediate laminate 60A from the pattern layer 11 side with laser light to remove the base layer 12 and the pattern layer 13 so as to penetrate them, thereby forming a window portion 14 and obtaining a laminate 10 in which the metallic layer 15 inside the substrate 11 can be seen through the window portion 14.

Description

Technical Field

[0001] The present invention relates to a method for producing a laminate, a laminate, and an intermediate laminate.

Background Art

[0002] In recent years, cards such as IC cards are required to have design properties. Under such circumstances, a technology has been developed in which a part of a card is made transparent so that a metal layer disposed inside the card can be visually recognized (see, for example, Patent Document 1). As a technology for making a part of a card transparent, for example, there is a technology in which a window part is formed in a part of a pattern layer formed on a transparent card substrate to expose a part of the card substrate. In this case, the pattern layer having the window part is formed by printing the pattern layer excluding the region where the window part is planned to be formed.

[0003] Further, at present, from the viewpoint of enhancing design properties, it is demanded to partially change the texture of the card surface. For example, it is demanded that a part of the surface of the card has a matte tone and the other part has a mirror surface tone, or a part of the surface of the card has a mirror surface tone and the other part has a matte tone.

[0004] As a method for making such a part have a matte tone and the other part have a mirror surface tone or the like, for example, a method using a hot press plate such as a stainless steel plate used at the time of manufacturing a card can be considered. In this method, since the card is integrally formed by hot pressing in which two or more plastic sheets are laminated and the plastic sheets or the like are heated and pressurized, a part of the mirror-surface-shaped hot press plate used during hot pressing is made to have a matte tone, and the shape of the hot press plate partially having the matte tone is transferred to the surface of the card, so that a part of the surface of the card is made to have a matte tone and the other part is made to have a mirror surface tone. Further, it has been proposed that by forming a transfer ink layer on a part of the matte surface, a part of the surface is made to have a matte tone and the remaining part is made to have a mirror surface tone (see, for example, Patent Document 2).

Prior Art Documents

Patent Documents

[0005] [Patent Document 1] Special Publication No. 2015-529578 [Patent Document 2] Japanese Patent Publication No. 2020-179552 [Overview of the project] [Problems that the invention aims to solve]

[0006] However, regarding the formation of the window area, if the pattern layer is printed multiple times, the outline of the window area may become unclear due to printing misalignment. Also, if the window area is formed with a high-definition pattern such as fine lines, printing misalignment may cause the window area to become distorted, making it impossible to properly see the metal layer.

[0007] Furthermore, regarding making part of the card surface matte and other parts mirror-like, when using a hot-pressed sheet metal, achieving a matte finish requires shot blasting or sandblasting the surface of the sheet metal, which is time-consuming during manufacturing and increases production costs. Additionally, it is difficult to accommodate numerous raised and recessed designs.

[0008] The present invention was made to solve the above problems. Specifically, the objective is to provide a method for manufacturing a laminate that can produce a clear outline of a window portion, form a high-definition window portion, and allow the luster of the metal layer to be visually observed through the window portion, an intermediate laminate used for manufacturing such a laminate, and a laminate with excellent design that allows the luster of the metal layer to be visually observed through the window portion, and in which the surface quality of the exposed area exposed from the window portion differs from that of the surface of the pattern layer. [Means for solving the problem]

[0009] [1] A method for manufacturing a laminate, comprising the steps of: preparing an intermediate laminate comprising a transparent or translucent substrate, a base layer formed on the first surface side of the substrate and removable by laser irradiation, a pattern layer formed on the surface of the base layer opposite to the surface on the substrate side, and a metallic layer disposed within the substrate and having lustrous properties, wherein the distance between the base layer and the metallic layer in the thickness direction of the substrate is 0.20 mm or more; and irradiating a portion of the intermediate laminate with laser light from the pattern layer side to remove the base layer and the pattern layer so as to penetrate the thickness direction of the intermediate laminate to form a window, and obtaining a laminate in which the metallic layer inside the substrate can be seen through the window.

[0010] [2] The method for manufacturing a laminate according to [1], wherein the metal layer is composed of a metal that becomes transparent or semi-transparent upon irradiation with the laser light, and the laser light is irradiated at an output that does not cause the metal layer to become transparent or semi-transparent.

[0011] [3] The method for manufacturing a laminate according to [1] or [2], wherein the first surface of the substrate has an exposed region exposed by the formation of the window portion, and the ratio of the arithmetic mean roughness of the exposed region to the arithmetic mean roughness of the surface of the pattern layer is 4.0 or more and 7.5 or less.

[0012] [4] A method for manufacturing a laminate according to any one of the above [1] to [3], wherein the laminate is a card or a booklet.

[0013] [5] The method for manufacturing a laminate according to [4] above, wherein the card is an IC card.

[0014] [6] A laminate comprising a transparent or translucent substrate, a base layer formed on a first surface side of the substrate, and a pattern layer formed on the surface of the base layer opposite to the surface on the substrate side, wherein the laminate comprises a window portion that penetrates the base layer and the pattern layer in the thickness direction of the laminate, and a metallic layer disposed within the substrate, visible through the window portion, and having lustrous properties, wherein the first surface of the substrate has an exposed region exposed through the window portion, and the ratio of the arithmetic mean roughness of the exposed region to the arithmetic mean roughness of the surface of the pattern layer is 4.0 or more and 7.5 or less.

[0015] [7] The laminate according to [6] above, wherein the distance between the base layer and the metal layer in the thickness direction of the laminate is 0.20 mm or more.

[0016] [8] The laminate according to [6] or [7] above, wherein the laminate is a card or a booklet.

[0017] [9] The laminate described in [8] above, wherein the card is an IC card.

[0018]

[10] An intermediate laminate comprising a transparent or translucent substrate, a base layer disposed on the first surface side of the substrate and removable by laser irradiation, a pattern layer formed on the surface of the base layer opposite to the surface on the substrate side, and a metallic layer disposed within the substrate and having lustrous properties, wherein the distance between the base layer and the metallic layer in the thickness direction of the substrate is 0.20 mm or more. [Effects of the Invention]

[0019] According to one aspect of the present invention, it is possible to provide a method for manufacturing a laminate in which the outline of the window portion can be made clear, a high-definition window portion can be formed, and the luster of the metal layer can be visually observed through the window portion, and an intermediate laminate used for manufacturing such a laminate. Furthermore, according to another aspect of the present invention, it is possible to provide a laminate in which the luster of the metal layer can be visually observed through the window portion, and which has excellent design properties in which the surface quality of the exposed area exposed from the window portion differs from that of the surface of the pattern layer. [Brief explanation of the drawing]

[0020] [Figure 1] Figure 1 is a schematic plan view of the layered product according to the embodiment. [Figure 2] Figure 2 is an A-A cross-sectional view in Figure 1. [Figure 3] Figure 3 is an enlarged view of a part of the layered product shown in Figure 2. [Figure 4] Figure 4 is a B-B cross-sectional view in Figure 1. [Figure 5] Figure 5 is a schematic plan view of the multi-imposition first intermediate layered product according to the embodiment. [Figure 6] Figure 6 is a schematic plan view of each first intermediate layered product according to the embodiment. [Figure 7] Figure 7 is a C-C cross-sectional view in Figure 6. [Figure 8] Figure 8 is a D-D cross-sectional view in Figure 6. [Figure 9] Figure 9 is a schematic cross-sectional view showing the manufacturing process of the layered product according to the embodiment. [Figure 10] Figure 10A and Figure 10B are schematic diagrams showing the manufacturing process of the layered product according to the embodiment. [Figure 11] Figure 11 is a schematic diagram showing the manufacturing process of the layered product according to the embodiment. [Figure 12] Figure 12A and Figure 12B are schematic diagrams showing the manufacturing process of the layered product according to the embodiment. [Figure 13] Figure 13A and Figure 13B are schematic diagrams showing the manufacturing process of the layered product according to the embodiment. [Figure 14] Figure 14 is a schematic diagram showing the manufacturing process of the layered product according to the embodiment. [Mode for Carrying Out the Invention]

[0021] Hereinafter, a method for manufacturing a laminate, a laminate, and an intermediate laminate according to an embodiment of the present invention will be described with reference to the drawings. Figure 1 is a schematic plan view of the laminate according to this embodiment, Figure 2 is a cross-sectional view AA in Figure 1, Figure 3 is an enlarged view of a part of the laminate shown in Figure 2, and Figure 4 is a cross-sectional view BB in Figure 1. Figure 5 is a schematic plan view of the multi-panel first intermediate laminate according to this embodiment, Figure 6 is a schematic plan view of each first intermediate laminate according to this embodiment, Figure 7 is a cross-sectional view CC in Figure 6, and Figure 8 is a cross-sectional view DD in Figure 6. Figures 9, 10A, 10B, 11, 12A, 12B, 13A, 13B, and 14 are schematic cross-sectional views showing the manufacturing process of the laminate according to this embodiment.

[0022] <<<Laminate>>> The laminate 10 shown in Figures 1 and 2 comprises a transparent or translucent base 11, a base layer 12 formed on the first surface 11A side of the base 11 and removable by laser irradiation, a pattern layer 13 formed on the side of the base layer 12 opposite to the surface facing the base 11, a metallic layer 15 disposed within the base 11 and having luminescence, and window portions 14 that penetrate the base layer 12 and the pattern layer 13 in the thickness direction of the laminate 10 (Z direction or -Z direction in Figure 2).

[0023] The laminate 10 is a dual-interface IC card capable of contact and contactless communication with external devices. As shown in Figure 4, the laminate 10 comprises an IC module 20 located in a recess 11C of a substrate 11, a pair of conductive plates 30, part of which are located inside the substrate 11, an antenna 40 located inside the substrate 11, and a conductive adhesive layer 50 located between the IC module 20 and the conductive plates 30, which electrically connects the IC module 20 and the conductive plates 30.

[0024] The laminate 10 is a dual-interface IC card, but the laminate is not particularly limited and can be any card or booklet. Examples of cards include a dual-interface IC card, a contact-type IC card that communicates with external devices via external connection terminals on the card surface, a contactless IC card that communicates with external devices via electromagnetic induction or the like through an antenna, or a security card. An example of a booklet is a passport.

[0025] In Figure 4, the IC module 20 and the antenna 40 are electrically connected using a conductive plate 30 and a conductive adhesive layer 50, but the method of electrically connecting the IC module 20 and the antenna 40 is not particularly limited.

[0026] The surface 10A of the laminate 10 consists of the surface 13A of the pattern layer 13, the surface of the IC module 20, and the exposed area 11A1 of the first surface 11A of the substrate 11 exposed through the window portion 14. The back surface 10B of the laminate 10 consists of the surface 116A of the oversheet layer 116, which will be described later.

[0027] <<Base>> As described above, the substrate 11 is transparent or translucent. In this specification, "transparent" means that the visible light transmittance, which is the transmittance in the visible light region (wavelength 380 nm to 780 nm), is 80% or more, and "translucent" means that the visible light transmittance is 5% or more and less than 80%. "Transparent" may be either colorless transparent or colored transparent, and "translucent" may be either colorless translucent or colored translucent. Because the substrate 11 is a transparent or translucent layer, for example, when laser light is irradiated from the pattern layer 13 side, the laser light can reach the base layer 13. The visible light transmittance shall be measured using a spectrophotometer equipped with an integrating sphere.

[0028] Furthermore, for the sake of explanation, we will set up an XYZ coordinate system for the base body 11. First, the normal direction of the first face 11A of the base body 11 will be the Z axis. Then, the direction from the second face 11B, which is opposite to the first face 11A of the base body 11, toward the first face 11A will be defined as the +Z direction or upward in the thickness direction, and the opposite direction will be defined as the -Z direction or downward in the thickness direction.

[0029] Furthermore, when the base body 11 is viewed from the +Z direction, the X-axis is defined as a straight line perpendicular to both short sides of the base body 11, which has a long side and a short side as described later, and to the Z-axis. The direction from one short side closer to the recess 11C toward the other short side is defined as the +X direction or right direction, and the opposite direction is defined as the -X direction or left direction. In addition, the Y-axis is defined as an axis perpendicular to the X-axis and the Z-axis, and the direction from one long side farther from the recess 11C toward the other long side is defined as the +Y direction or upward, and the opposite direction is defined as the -Y direction or downward.

[0030] As shown in Figure 2, the substrate 11 has a structure in which an oversheet layer 111, a core layer 112, a core layer 113, an inner layer 114, a core layer 115, and an oversheet layer 116 are stacked in this order in the depth direction (-Z direction) from the first surface 11A to the second surface 11B. For example, a magnetic stripe may be embedded on the surface of the oversheet layer 111 opposite to the core layer 112. This allows it to be used as a credit card from which information on the magnetic stripe can be read.

[0031] <Oversheet layer> For the oversheet layers 111 and 116, the same material as the inner layer 114 is usually used, but a transparent material with a thickness of approximately 0.03 mm to 0.18 mm is often used. From the viewpoint of preventing curling when the laminate is integrated by heat pressing or the like, it is preferable that the thicknesses of the oversheet layers 111 and 116 are the same, but they do not necessarily have to be the same.

[0032] The materials for the oversheet layers 111 and 116 can be any material that adheres when heated. However, even if the oversheet layers themselves do not adhere when heated, they can be integrated by adding a layer of a known adhesive that generates adhesive force when heated between the oversheet layer 111 and the core layer 112, or between the oversheet layer 116 and the core layer 115.

[0033] <Core Layer> The core layers 112, 113, and 115 are not particularly limited, but examples include plastic sheets. Examples of plastic sheets include single films or composite films thereof of polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, copolymer polyester, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, polystyrene, ABS, polyacrylic acid ester, polypropylene, polyethylene, polyurethane, etc.

[0034] The thicknesses of the core layers 112, 113, and 115 can be appropriately selected considering the overall thickness of the laminate 10, but for example, they may be between 0.03 mm and 0.45 mm. In this case, the above thicknesses of the core layers 112, 113, and 115 refer to the thickness of each individual core layer 112, 113, and 115. Note that the core layers 112, 113, and 115 may be a laminated structure of two or more layers.

[0035] <Inner layer> The inner layer 114 is not particularly limited, but examples include the plastic sheets described in the sections for core layers 112, 113, and 115. The thickness of the inner layer 114 can be appropriately selected considering the overall thickness of the laminate 10, but for example, it may be around 0.03 mm to 0.45 mm.

[0036] <<Underlayer>> The base layer 12 is a layer that can be removed by laser irradiation. Specifically, when the base layer 12 is irradiated with laser light, it is heated, melted, and removed by evaporation. The base layer 12 may also have the function of concealing the antenna 40 and other components located inside the substrate 11.

[0037] The materials constituting the base layer 12 are not particularly limited as long as they can be melted and evaporated by irradiation with laser light, but it is preferable that the base layer 12 contains a laser light absorbing material consisting of at least one of the following: metal powder, metal oxide powder, and carbon black powder, and a resin. Examples of metal powders include gold, silver, aluminum, and tin powders, and examples of metal oxide powders include titanium white and zinc oxide powders. The metal powder or metal oxide powder may be one type of metal powder or metal oxide powder, or two or more types of metal powder or metal oxide powder may be used. Among the metal powders, aluminum powder is preferred from the viewpoint of manufacturing cost.

[0038] The content of the laser light absorbing material in the base layer 12 is preferably 10% by mass or more and 20% by mass or less relative to the mass of the base layer 12. With such a content, a portion of the base layer 12 can be removed by laser irradiation.

[0039] Examples of resins included in the base layer 12 include thermoplastic resins such as vinyl chloride, vinyl acetate, vinyl alcohol, acrylic resin, polyester resin, polyurethane resin and copolymers thereof, thermosetting resins such as epoxy resin, phenolic resin, and melamine resin, and ionizing radiation curable resins such as ultraviolet curable resins.

[0040] The thickness of the base layer 12 is not particularly limited, but is preferably, for example, 1 μm or more and 10 μm or less. If the thickness of the base layer 12 is 1 μm or more, not only the base layer 12 but also the pattern layer 13 can be reliably removed, and if it is 10 μm or less, the laser power required for removal can be reduced. The lower limit of the thickness of the base layer 12 is preferably 3 μm or more, and the upper limit is preferably 7 μm or less. For example, the thickness of the base layer 12 may be 3 μm or more and 7 μm or less.

[0041] The base layer 12 can be formed by coating the first surface 11A of the substrate 11 with an ink containing a laser light absorber and a resin, as described later. This ink may also contain known additives. As for the coating method, known printing methods such as screen printing, gravure printing, and flexographic printing can be used.

[0042] <<Pattern Layer>> The pattern layer 13 is a layer for forming any pattern such as pictures, photographs, letters, numbers, figures, symbols, or designs on the surface 10A of the laminate 10.

[0043] The thickness of the pattern layer 13 is not particularly limited, but is preferably, for example, 0.1 μm or more and 10 μm or less. If the thickness of the pattern layer 13 is 0.1 μm or more, a visible color tone can be expressed, and if it is 10 μm or less, the laser power can reach the base layer 12 without being hindered. The lower limit of the thickness of the pattern layer 13 is preferably 0.5 μm or more or 1 μm or more, and the upper limit is preferably 7 μm or less or 5 μm or more. For example, the thickness of the pattern layer 13 may be 0.5 μm or more and 7 μm or less or 1 μm or more and 5 μm or less.

[0044] The pattern layer 13 contains coloring agents such as dyes and pigments, and a binder resin. The pattern layer 13 may have multiple colors or a single color. The pattern layer 13 can be formed by a printing method, similar to the base layer 12.

[0045] <<Window section>> The window section 14 is provided so as to penetrate the base layer 12 and the pattern layer 13, but the window section 14 does not penetrate the base body 11.

[0046] The shape and size of the window portion 14 are not particularly limited and can be freely changed by irradiation with laser light as described later. For example, if the laminate 10 is a laminate containing information such as an IC card or passport, information such as a name and / or card number or passport number may be formed in the window portion 14 by irradiation with laser light. If the laminate 10 is a laminate that does not contain information, a desired design may be obtained by forming a window portion 14 of a desired shape.

[0047] The window portion 14 may have sharp corners. As described above, when the pattern layer is formed by printing, there is a risk that the outline of the window portion will become unclear due to printing misalignment, and when trying to create a high-definition shape, there is a risk that the window portion will be filled with ink and become distorted. In particular, if the window portion has sharp corners, the tip of the sharp corner is thin, so printing is prone to misalignment. However, when the window portion 14 is formed by irradiation with laser light as in this embodiment, even if the window portion has sharp corners, the outline of the window portion 14 is less likely to become unclear, and the distortion of the window portion 14 can be suppressed. The angle of the sharp corner of the window portion 14 may be less than 90°, 70° or less, 50° or less, 30° or less, or 10° or less.

[0048] In the laminate 10, a portion of the first surface 11A of the base body 11 is exposed through the window portion 14. The ratio of the arithmetic mean roughness Ra of the exposed area 11A1 to the arithmetic mean roughness Ra of the surface 13A of the pattern layer 13 (arithmetic mean roughness Ra of the exposed area 11A1 / arithmetic mean roughness Ra of the surface 13A of the pattern layer 13) is preferably 4.0 or more and 7.5 or less. If this ratio is 4.0 or more, the observer of the laminate 10 can perceive that the exposed area 11A1 has a different surface texture from the surface 13A of the pattern layer 13, specifically, that the surface 13A of the pattern layer 13 is mirror-like and the exposed area 11A1 is matte-like, thereby improving the aesthetic appeal. Furthermore, if this ratio is 7.5 or less, wear near the boundary between the pattern layer 13 and the exposed area 11A1 can be suppressed. The lower limit of this ratio is more preferably 4.5 or higher or 5.0 or higher, and the upper limit is more preferably 7.0 or lower or 6.5 or lower. For example, this ratio is preferably 4.5 or higher and 7.0 or lower or 5.0 or higher and 6.5 or lower.

[0049] The arithmetic mean roughness Ra of the exposed area 11A1 is preferably 0.30 μm or more and 0.50 μm or less. If the arithmetic mean Ra of the exposed area 11A1 is 0.30 μm or more, a slightly matte exposed area 11A1 can be obtained, thereby enhancing the design. If the arithmetic mean Ra of the exposed area 11A1 is 0.50 μm or less, the transparency of the exposed area 11A1 can be maintained. The lower limit of the above arithmetic mean roughness Ra of the exposed area 11A1 is preferably 0.35 μm or more or 0.40 μm or more, and the upper limit is preferably 0.47 μm or less or 0.45 μm or less. For example, the above arithmetic mean roughness Ra of the exposed area 11A1 may be 0.35 μm or more and 0.47 μm or less or 0.40 μm or more and 0.45 μm or less. As will be described later, since laser light is irradiated when forming the window portion 14, an exposed area 11A1 having such arithmetic mean roughness can be obtained.

[0050] The definition of arithmetic mean roughness Ra shall conform to JIS B0601:2013. The arithmetic mean roughness Ra is based on the description of parameters in the height direction in 4.2 as stated in JIS B0601:2013. The arithmetic mean roughness Ra is a value measured by a surface roughness meter (for example, model number "SURFCOM480A", manufactured by Tokyo Seimitsu Co., Ltd.).

[0051] <<Metal layer>> The metal layer 15 has a glossy appearance. The glossy appearance of the metal layer 15 gives the laminate 10 a high-quality feel. In this specification, "glossy appearance" means that when the metal layer is viewed through the window, it has a metallic luster or a shine that resembles a metallic luster.

[0052] The metal layer 15 may be the reflective layer of the hologram sheet. In this case, a hologram sheet comprising a transparent hologram layer and a metal layer 15 laminated on the hologram layer is arranged within the substrate 11. The metal layer 15 may be a vapor-deposited layer. In Figure 2, the metal layer 15 is arranged between the oversheet layer 111 and the core layer 112, but the position of the metal layer 15 is not particularly limited as long as it is within the substrate 11.

[0053] The metal layer 15 may be composed of a metal that becomes transparent or semi-transparent when irradiated with laser light. When such a material is irradiated with laser light, the irradiated portion becomes transparent or semi-transparent due to alteration such as oxidation. Examples of such metals include aluminum, zinc, indium, tin, and titanium. Among these, aluminum is preferred from the viewpoint of manufacturing cost.

[0054] The distance D (see Figure 3) between the base layer 12 and the metal layer 15 in the thickness direction of the base 11 (Z direction or -Z direction in Figure 3) is preferably 0.20 mm or more. If the distance D is 0.20 mm or more, the distance of the metal layer 15 from the base layer 12 is increased, so when the metal layer 15 is viewed through the window portion 14, a sense of depth is created, and the design can be further enhanced. Also, if the distance D is 0.20 mm or more, the transparency or translucency of the metal layer 15 can be suppressed when the window portion 14 is formed by irradiation with laser light. Note that if the distance D is 0.20 mm or more, the transparency or translucency of the metal layer 15 can be suppressed by adjusting the output of the laser light, but if the distance D is less than 0.20 mm, the base layer and the metal layer are too close, so even if the output of the laser light is adjusted, the metal layer may become transparent or translucent, or the base layer or pattern layer may remain.

[0055] The lower limit of distance D is preferably 0.25 mm or more, or 0.30 mm or more, and the upper limit is preferably 0.70 mm or less, 0.60 mm or less, or 0.50 mm or less. Distance D may also be, for example, 0.20 mm or more and 0.70 mm or less, 0.25 mm or more and 0.60 mm or less, or 0.30 mm or more and 0.50 mm or less.

[0056] The thickness of the metal layer 15 is not particularly limited, but is preferably, for example, 5 nm or more and 1 μm or less. If the thickness of the metal layer 15 is thin, the luster of the metal layer 15 may not be sufficiently visible when the exposed area 11A1 is exposed due to the pattern layer 13 etc. being scraped away. However, if the thickness of the metal layer 15 is 5 nm or more, the luster of the metal layer 15 can be sufficiently visible when the exposed area 11A1 is exposed. Furthermore, if the thickness of the metal layer 15 is 1 μm or less, costs can be reduced while maintaining luster. The lower limit of this thickness is preferably 8 nm or more or 10 nm or more, and the upper limit is preferably 500 nm or less or 100 nm or less. For example, this thickness may be 8 nm or more and 500 nm or less or 10 nm or more and 100 nm or less.

[0057] <<ICモジュール> > As shown in Figure 4, the IC module 20 comprises a flat substrate 21, an external connection terminal 22 located on the front surface 21A side of the substrate 21, a terminal 23 located on the back surface 21B side of the substrate 21, an IC chip 24 located on the back surface 21B side of the substrate 21, a molded portion 25 covering the IC chip 24, and a wire 26, such as a gold wire, that electrically connects the terminal 23 and the IC chip 24. Note that the wire electrically connecting the external connection terminal 22 and the IC chip 24 is not shown.

[0058] <Circuit board, external connection terminals, and terminals> The substrate 21 can be a flexible resin film such as glass epoxy resin or polyimide resin. The external connection terminals 22 and 23 are made of patterned copper foil. Specifically, copper foil is provided on the front surface 21A and back surface 21B of the substrate 21, and the external connection terminals 22 and 23 are formed by etching the copper foil into a predetermined pattern. In addition, the substrate 21 is pre-provided with multiple through holes (not shown) for wire bonding to the external connection terminals 22.

[0059] <ICチップ> The IC chip 24 is fixed to the back surface 21B of the substrate 21 via an adhesive (not shown). Specifically, it is positioned in the center of the terminal 23 forming surface of the substrate 21. The IC chip 24 includes a CPU for controlling the operation of both contact and contactless communication, a storage device such as RAM, EEPROM, and flash memory, and various circuits such as an interface circuit and a power generation circuit for decoding input signals and generating output signals for contact and contactless communication.

[0060] <Molded part> The molded portion 25 is intended to protect the IC chip 24 and wires 26 from external forces and environmental loads. A UV-curable resin or a thermosetting resin is used as the molded portion 25.

[0061] <<Conductive Plate>> The conductive plate 30 is a conductive plate-shaped member. A portion of the conductive plate 30 is exposed within the recess 11C, specifically within the first recess 11D. That is, as shown in Figure 4, the conductive plate 30 comprises an exposed portion 31 that is exposed within the first recess 11D and a non-exposed portion 32 located within the substrate 11. The conductive plate 30 is electrically connected to the IC module 20 via a conductive adhesive layer 50.

[0062] The thickness of the conductive plate 30 is preferably 70 μm or more and 150 μm or less, and more preferably 80 μm or more and 120 μm or less.

[0063] The constituent material of the conductive plate 30 is not particularly limited as long as it is a conductive material. Suitable materials include, for example, metal materials such as copper and aluminum. Among these, copper is preferred from the viewpoint of cost and durability. Furthermore, to improve weldability, the conductive plate 30 may be formed, for example, by silver plating a copper alloy.

[0064] <<Antenna>> The antenna 40 is coiled, as shown in Figure 1, and is composed of antenna wires. The antenna 40 has a pair of ends 41. The ends 41 of the antenna 40 are electrically connected to the conductive plate 30, and thus electrically connected to the IC module 20. This constitutes a contactless communication circuit. This communication circuit may, for example, perform proximity communication using the HF frequency band of 13.56 MHz, or it may perform communication using another frequency band, such as the UHF frequency band of 920 MHz.

[0065] When a dual-interface IC card is held over an external device such as a reader / writer, the communication circuit generates an electric current due to the magnetic field formed by the reader / writer, supplying power to the IC chip. This enables the IC chip to be driven, allowing for contactless transmission and reception of information with the reader / writer, as well as reading and rewriting information in the memory.

[0066] The antenna wire constituting the antenna 40 is typically formed from a coated conductor, in which a copper wire is covered with an insulating material. Alternatively, copper alloy wires such as Cu-Ni, Cu-Cr, Cu-Zn, Cu-Sn, and Cu-Be, or various metal wires and metal alloy wires such as iron, stainless steel, and aluminum can also be selected. Using coated conductors as antenna wires allows for cheaper manufacturing compared to methods such as copper foil etching.

[0067] The diameter of the antenna wire is not particularly limited as long as it ensures the characteristics of a non-contact communication circuit, but for example, it can be 0.03 mm or more and 0.30 mm or less, preferably 0.05 mm or more and 0.15 mm or less. By using the latter range, durability against heat and pressure from embedding and external forces from cutting can be improved, and good communication characteristics can be ensured.

[0068] <<Conductive adhesive layer>> The conductive adhesive layer 50 is placed between the IC module 20 and the exposed portion 31 of the conductive plate 30. By placing the conductive adhesive layer 50, the IC module 20 and the conductive plate 30 can be electrically and mechanically connected, so the IC module 20 and the antenna 40 can be electrically connected.

[0069] As the conductive adhesive layer 50, an anisotropic conductive film (ACF) or anisotropic conductive paste (ACP) can be used. Alternatively, a conductive paste or solder paste in which silver particles are dispersed as a filler in epoxy resin may also be used. In particular, if an anisotropic conductive film is used, the anisotropic conductive film can be heat-laminated over the entire back surface of the substrate 21 of the IC module 20, and after embedding the IC module 20 in the recess 11C of the pre-cut base body 11, it can be heat-pressed at a predetermined temperature and load. This makes it easy to electrically connect the IC module 20 and the conductive plate 30. Furthermore, since a mechanical connection of the IC module 20 to the base body 11 can be made simultaneously, the mounting process of the IC module 20 to the base body 11 can be simplified.

[0070] The electrical connection between the IC module 20 and the conductive plate 30, and the mechanical connection between the IC module 20 and the substrate 11, when an anisotropic conductive film is used as the conductive adhesive layer 50, can be described as follows. The conductive adhesive layer 50 has a structure in which conductive particles, in which a metal film is formed around a spherical resin or spherical metal, are dispersed in an adhesive, which is a binder containing adhesive components. The conductive particles may be resin coated with nickel or gold, or they may be solder particles. Various types of solder particles can be used, such as SnPb-based, SnAgCu-based, SnCu-based, SnZnBi-based, SnAgInBi-based, SnZnAl-based, or alloys of these with other metals. These structures are the same even when an anisotropic conductive paste is used.

[0071] <<<<Manufacturing method for laminates>>> The laminate 10 can be manufactured by the following method. First, a multi-panel first intermediate laminate 60 shown in Figure 5 is prepared. The multi-panel first intermediate laminate 60 is made by multi-paneling two or more first intermediate laminates 60A as shown in Figures 5 and 6. In this embodiment, the laminate 10 is manufactured using the multi-panel first intermediate laminate 60, but the laminate 10 may also be manufactured using the first intermediate laminate 60A alone instead of the multi-panel first intermediate laminate 60.

[0072] As shown in Figure 7, the first intermediate laminate 60A comprises a transparent or translucent base 11, a base layer 12 formed on the first surface 11A side of the base 11 and removable by laser irradiation, a pattern layer 13 formed on the side of the base layer 12 opposite to the surface facing the base 11, and a metal layer 15 placed inside the base 11. Note that the first intermediate laminate 60A does not have a window portion 14.

[0073] The first intermediate laminate 60A preferably has a mark 61 provided at the boundary or inside the boundary of the area 60B where the window portion 14 is to be formed on the surface 13A of the pattern layer 13, as shown in Figure 6. Having such a mark 61 makes it possible to confirm the misalignment of the window portion 14 when it is formed.

[0074] Since the laminate 10 is a dual-interface IC card, as shown in Figure 8, the first intermediate laminate 60A also includes a pair of conductive plates 30 arranged inside the base 11 and an antenna 40 arranged inside the base 11. The first intermediate laminate 60A does not have a recess 11C. In the first intermediate laminate 60A, a portion of the conductive plate 30 is exposed to the recess 11C when the recess 11C is formed, so in the first intermediate laminate 60A, it is not exposed.

[0075] First, as shown in Figure 9, a conductive plate 30 is placed on one surface 113A of the core layer 113. After placing the conductive plate 30 on surface 113A of the core layer 113, an antenna 40 having an end portion 41 is formed on surface 113A of the core layer 113. Then, a portion of the end portion 41 of the antenna 40 is welded to the surface 30A of the conductive plate 30 opposite to the surface in contact with the core layer 113 to form a welded portion 41A. This gives the antenna sheet 70. The conductive plate 30 and the portion of the antenna 40 other than the end portion 41 may be embedded in surface 113A of the core layer 113.

[0076] Next, as shown in Figure 10A, the oversheet layer 111, metal layer 15, core layer 112, antenna sheet 70, inner layer 114, core layer 115, and oversheet layer 116 are stacked in this order to obtain a multi-faceted metal layer / antenna-attached substrate precursor 80. The antenna sheet 70 is positioned so that the antenna 40 faces the inner layer 114. As a result, the antenna 40 is sandwiched between the core layer 113 and the inner layer 114.

[0077] Subsequently, as shown in Figure 10B, the multi-panel metal layer / substrate precursor 80 with antenna is sandwiched between heat-press plates 90, such as stainless steel plates, from above and below in the thickness direction, and the multi-panel metal layer / substrate precursor 80 with antenna is heated and pressurized through the heat-press plates 90. Through this heat-pressing process, a multi-panel metal layer 15 and a substrate 11 with antenna 40, in which each sheet is integrated, can be obtained. Furthermore, if any of the layers constituting the multi-panel metal layer / substrate precursor 80 has heat resistance that prevents heat fusion at a predetermined temperature, an adhesive sheet that heats together at a predetermined temperature is sandwiched between each layer, or an adhesive is applied, and then the heat-pressing process is performed on these to obtain an integrated multi-panel metal layer 15 and a substrate 11 with antenna 40.

[0078] After obtaining the multi-panel metal layer 15 and the substrate 11 with the antenna 40, as shown in Figure 11, the base layer 12 and the pattern layer 13 are formed in this order on the first surface 11A of the multi-panel metal layer 15 and the substrate 11 with the antenna 40 by a printing method. This obtains the multi-panel first intermediate laminate 60. Alternatively, the pattern layer 13 and the base layer 12 may be formed in this order on a transfer substrate, and the base layer 12 and pattern layer 13 may be transferred to the first surface 11A of the substrate 11 to form the base layer 12 and pattern layer 13 on the first surface 11A of the substrate 11.

[0079] After forming the multi-panel first intermediate laminate 60, the first intermediate laminate 60A is punched out from the multi-panel first intermediate laminate 60 to separate it into individual pieces. Then, as shown in Figure 12A, the first recess 11D is formed in the first intermediate laminate 60A. Specifically, the pattern layer 13, the base layer 12, and the substrate 11 are cut from the surface of the first intermediate laminate 60A in the depth direction (-Z direction). This cutting is continued until the conductive plate 30 is exposed.

[0080] Next, as shown in Figure 12B, a portion of the bottom surface 11D1 of the first recess 11D is further cut to form the second recess 11E. This cutting is performed so that the diameter of the hole in the second recess 11E is smaller than the diameter of the hole in the first recess 11D. As a result, a base body 11 is obtained that consists of the first recess 11D and the second recess 11E, and has a recess 11C with a step between the bottom surfaces 11D1 and 11E1.

[0081] On the other hand, as shown in Figure 13A, a conductive adhesive layer 50 is formed on the terminals 23 of the IC module 20.

[0082] Subsequently, as shown in Figure 13B, the terminal 23 and the conductive plate 30 are electrically connected via the conductive adhesive layer 50, and the IC module 20 is placed in the recess 11C such that the molded portion 25 is located in the second recess 11E. This electrically connects the IC module 20 and the antenna 40 via the conductive adhesive layer 50, and the second intermediate laminate 100 is obtained.

[0083] After preparing the second intermediate laminate 100, a laser beam is shone from the pattern layer 13 side onto a desired area of ​​the second intermediate laminate 100, as shown in Figure 14. This causes the base layer 12 to melt and be removed by scattering, and the pattern layer 13 is also removed. As a result, a laminate 10 with a window portion 14 is formed.

[0084] The laser oscillator that generates the laser light is not particularly limited as long as it can generate laser light of a wavelength absorbed by the laser light absorbing material constituting the base layer 12, but examples include ultraviolet (UV) lasers (wavelength 355 nm), Nd:YAG lasers (wavelength 1064 nm / 532 nm), Nd:YVO4 lasers (wavelength 1064 nm), and carbon dioxide lasers (wavelength 10600 nm).

[0085] Preferably, the laser beam is irradiated at an output that can remove the base layer 12 and the pattern layer 13, but does not make the metal layer 15 transparent or semi-transparent. By irradiating with laser beam at such an output, the transparency or semi-transparency of the metal layer 15 can be suppressed, so that the metal layer 15 can be made visible in the desired shape. The output of the laser beam may be, for example, 30 to 60 in the power setting value of the MD-U1000C laser marker manufactured by Keyence Corporation.

[0086] According to this embodiment, a window portion 14 is formed by irradiating a portion of the first intermediate laminate 60A with laser light from the pattern layer 13 side and removing the base layer 12 and the pattern layer 13 so as to penetrate through the thickness direction of the first intermediate laminate 60A. As a result, the outline of the window portion 14 can be made clear, a high-definition window portion 14 can be formed, and the luster of the metal layer 15 inside the substrate 11 can be visually observed through the window portion 14.

[0087] According to this embodiment, the laminate 10 comprises a transparent or translucent base body 11, a base layer 12 formed on the first surface 11A side of the base body 11, a pattern layer 13 formed on the side of the base layer 12 opposite to the surface facing the base body 11, window portions 14 penetrating the base layer 12 and the pattern layer 13 in the thickness direction of the laminate 10, and a metallic layer 15 disposed within the base body 11, visible through the window portions 14, and having lustrous properties. The first surface 11A of the base body 11 has an exposed region 11A1 exposed through the window portions 14, and the ratio of the arithmetic mean roughness of the exposed region 11A1 to the arithmetic mean roughness of the surface 13A of the pattern layer 13 is 4.0 or more and 7.5 or less. Therefore, the lustrous properties of the metallic layer 15 can be seen through the window portions 14, and a laminate 10 with excellent design properties can be provided in which the surface quality of the exposed region 11A1 differs from that of the surface 13A of the pattern layer 13. [Examples]

[0088] To illustrate the present invention in detail, examples are given below, but the present invention is not limited to these examples.

[0089] <Example 1> Two conductive plates made of copper, each 6 mm long, 6 mm wide, and 0.1 mm thick, were bonded to a predetermined area on one side of a white inner core layer (Mitsubishi Chemical Corporation's "Diafix PG-WHI") made of glycol-modified PET resin (PET-G resin) with a thickness of 0.20 mm. Next, an antenna made of copper wire with a diameter of 0.11 mm was embedded in the aforementioned surface of the core layer. Then, a portion of the end of the antenna was welded to the exposed area of ​​the conductive plate opposite to the surface in contact with the inner core layer, forming a 2 mm long welded section. This formed an antenna sheet.

[0090] Subsequently, a transparent upper oversheet made of PET-G resin with a thickness of 0.10 mm (Diafix PG-MCT manufactured by Mitsubishi Chemical Corporation), a transparent upper core layer made of PET-G resin with a thickness of 0.20 mm (Diafix PG-MCT manufactured by Mitsubishi Chemical Corporation), a hologram sheet comprising a transparent hologram layer with a thickness of 0.02 mm and an opaque aluminum vapor deposition layer with a thickness of 10 nm formed on the hologram layer, the antenna sheet, a transparent lower core layer made of glycol-modified PET resin (PET-G resin) with a thickness of 0.20 mm (Diafix PG-MCT manufactured by Mitsubishi Chemical Corporation), and a transparent lower oversheet made of PET-G resin with a thickness of 0.10 mm (Diafix PG-MCT manufactured by Mitsubishi Chemical Corporation) were laminated in this order to form a hologram and an antenna-equipped substrate precursor. In the hologram and antenna-equipped substrate precursor, the antenna sheet was positioned so that the antenna was on the inner layer side. Then, a hologram and an antenna-equipped substrate precursor were sandwiched between hot-pressed plates, and the hologram and antenna-equipped substrate precursor were heated to 120°C and pressurized at 2 MPa to integrate them, thereby obtaining an antenna-equipped substrate comprising a substrate having an upper oversheet layer, a hologram sheet, an upper core layer, a middle core layer, a lower core layer, and a lower oversheet layer, and an antenna.

[0091] Then, a 2 mm thick base layer was printed on the upper oversheet layer of the hologram sheet and the substrate with antenna using an ink containing aluminum powder and vehicle (VAHS NO2 Silver, manufactured by Showa Ink Industries Co., Ltd.), and a 0.5 mm thick upper pattern layer was formed on the base layer using an ink (UV Carton (Process Color), manufactured by DIC Graphics Co., Ltd.). This obtained an intermediate laminate. In the intermediate laminate, the distance between the base layer and the aluminum vapor deposition layer was 0.30 mm.

[0092] Subsequently, a laser beam under the following conditions was irradiated from the pattern layer side in the thickness direction of the intermediate laminate to remove the base layer and the pattern layer, forming a first window consisting of letters and symbols under the following conditions that penetrated the base layer and the pattern layer, and a second rectangular window measuring 5 mm vertically x 10 mm horizontally. As a result, a laminate was obtained in which a portion of the upper oversheet was exposed through the first and second windows, and the aluminum vapor-deposited layer of the hologram sheet was visible through the first and second windows. (Laser irradiation conditions) • Laser device name: KEYENCE Corporation laser marker "MD-U1000C" • Laser light source: UV laser • Laser wavelength: 355nm • Power setting: 40 • Speed ​​setting: 1000

[0093] (Character condition) Font: MS P Gothic • Character height: 3.5mm (Font size: 10pt) Line width: 0.5mm or less • Character types: "TEST", "1234", "★◆●▲" (filled inside characters and symbols)

[0094] <Example 2> In Example 2, the laminated materials consisted of a transparent upper oversheet made of PET-G resin with a thickness of 0.05 mm ("Diafix PG-MCT" manufactured by Mitsubishi Chemical Corporation), a transparent upper core layer made of PET-G resin with a thickness of 0.20 mm ("Diafix PG-MCT" manufactured by Mitsubishi Chemical Corporation), a transparent inner layer made of PET-G resin with a thickness of 0.20 mm ("Diafix PG-MCT" manufactured by Mitsubishi Chemical Corporation), a transparent hologram layer with a thickness of 0.02 mm, and a 10n layer formed on the hologram layer. A laminate was obtained in the same manner as in Example 1, except that the hologram sheet comprising an opaque aluminum vapor-deposited layer of m, the antenna sheet, a transparent lower core layer made of glycol-modified PET resin (PET-G resin) with a thickness of 0.10 mm ("Diafix PG-MCT" manufactured by Mitsubishi Chemical Corporation), and a transparent lower oversheet made of PET-G resin with a thickness of 0.05 mm ("Diafix PG-MCT" manufactured by Mitsubishi Chemical Corporation) were changed, and the distance between the base layer and the aluminum vapor-deposited layer was set to 0.45 mm.

[0095] <Example 3> In Example 3, the laminate was obtained in the same manner as in Example 1, except that the materials to be laminated were changed to a transparent upper oversheet made of PET-G resin with a thickness of 0.20 mm ("Diafix PG-MCT" manufactured by Mitsubishi Chemical Corporation), a transparent upper core layer made of PET-G resin with a thickness of 0.20 mm ("Diafix PG-MCT" manufactured by Mitsubishi Chemical Corporation), a transparent inner layer made of PET-G resin with a thickness of 0.20 mm ("Diafix PG-MCT" manufactured by Mitsubishi Chemical Corporation), a hologram sheet comprising a transparent hologram layer with a thickness of 0.02 mm and an opaque aluminum vapor deposition layer with a thickness of 10 nm formed on the hologram layer, the above antenna sheet, and a transparent lower oversheet made of PET-G resin with a thickness of 0.05 mm ("Diafix PG-MCT" manufactured by Mitsubishi Chemical Corporation), and the distance between the base layer and the aluminum vapor deposition layer was set to 0.60 mm.

[0096] <Comparative Example 1> In Comparative Example 1, the window portion was formed by printing the pattern layer and the base layer. Specifically, the laminate was formed by the following procedure.

[0097] First, a hologram sheet and an antenna-equipped substrate with the same structure were obtained using the same procedure as in Example 1. Then, a 2 mm thick base layer was printed on the upper oversheet layer of the hologram sheet and antenna-equipped substrate using an ink containing aluminum powder and vehicle (VAHS NO2 Silver, manufactured by Showa Ink Industries Co., Ltd.), and a 0.5 mm thick pattern layer was formed on the base layer using an ink (UV Carton (Process Color), manufactured by DIC Graphics Co., Ltd.). Here, the pattern layer and base layer had a first window consisting of letters and symbols under the following conditions, and a second rectangular window measuring 5 mm vertically x 10 mm horizontally. As a result, a laminate was obtained in which a portion of the upper oversheet was exposed through the first and second windows, and the aluminum vapor-deposited layer of the hologram sheet was visible through the windows. (Character condition) Font: MS P Gothic • Character height: 3.5mm (Font size: 10pt) Line width: 0.5mm or less • Character types: "TEST", "1234", "★◆●▲" (filled inside characters and symbols)

[0098] <Comparative Example 2> In Comparative Example 2, the laminated materials consisted of a transparent upper oversheet made of PET-G resin with a thickness of 0.05 mm (Mitsubishi Chemical Corporation's "Diafix PG-MCT"), a transparent upper core layer made of PET-G resin with a thickness of 0.10 mm (Mitsubishi Chemical Corporation's "Diafix PG-MCT"), a hologram sheet comprising a transparent hologram layer with a thickness of 0.02 mm and an opaque aluminum vapor deposition layer with a thickness of 10 nm formed on the hologram layer, the above antenna sheet, and a glycol-modified PET resin (PE) with a thickness of 0.20 mm. A laminate was obtained in the same manner as in Example 1, except that the following were changed: a transparent inner layer made of T-G resin (Mitsubishi Chemical Corporation's "Diafix PG-MCT"), a transparent lower core layer made of glycol-modified PET resin (PET-G resin) with a thickness of 0.20 mm (Mitsubishi Chemical Corporation's "Diafix PG-MCT"), and a transparent lower oversheet made of PET-G resin with a thickness of 0.05 mm (Mitsubishi Chemical Corporation's "Diafix PG-MCT"), and the distance between the base layer and the aluminum vapor-deposited layer was set to 0.15 mm.

[0099] <Window contour evaluation> In the laminates according to Examples 1-3 and Comparative Examples 1 and 2, the clarity of the outlines of the first window portion (letters and symbols) was evaluated. The evaluation criteria were as follows. A: The outlines of the letters and symbols were clear. B: The outlines of letters and symbols were slightly unclear. C: The outlines of letters and symbols were clearly indistinct.

[0100] <Window shape evaluation> The shape of the first window portion (letters and symbols) was evaluated in the laminates according to Examples 1-3 and Comparative Examples 1 and 2. The evaluation criteria were as follows. A: The desired shape of the first window portion was obtained without any part of the first window portion being crushed. B: Although a small portion of the first window section was slightly crushed, the first window section was obtained with a shape that was generally as desired. C: At least a portion of the first window section was crushed, and the desired shape of the first window section was not obtained.

[0101] <Evaluation of the luster of aluminum vapor-deposited layers> In the laminates according to Examples 1-3 and Comparative Examples 1 and 2, the glossiness of the aluminum vapor-deposited layer visible through the first window was evaluated. The evaluation criteria were as follows. A: The overall luster of the aluminum vapor-deposited layer visible from the first window was confirmed. B: The luster of the aluminum vapor-deposited layer visible from the first window was not confirmed in at least some parts.

[0102] <Arithmetic mean roughness Ra measurement> The arithmetic mean roughness Ra of the surface was measured in the laminates according to Examples 1-3 and Comparative Example 1. Specifically, using a surface roughness meter (also called a surface roughness measuring instrument) (product number "SURFCOM480A", manufactured by Tokyo Seimitsu Co., Ltd.), the arithmetic mean roughness Ra of the exposed area of ​​the upper oversheet exposed through the second window of each laminate and the surface of the pattern layer were measured at two points each, and the average values ​​are shown in Table 1. The ratio of the arithmetic mean roughness Ra of the exposed area to the arithmetic mean roughness Ra of the surface of the pattern layer is also shown in Table 1. During measurement, the system settings were set to "roughness measurement", the tilt correction to "both ends", the filter to "Gaussian", the measurement speed to 0.6 mm / sec, the cutoff value to 0.8 mm, and the reference length (sampling length) Ir to 0.8 mm. Note that since the line width of the first window is 0.5 mm or less, it is difficult to measure the arithmetic mean roughness there, so the arithmetic mean roughness was measured using the second window.

[0103] The results are shown in Table 1 below. [Table 1]

[0104] As shown in Table 1, in the laminate according to Comparative Example 1, the first window portion was formed by printing on the pattern layer, so although the luster of the aluminum vapor-deposited layer could be confirmed overall, the outline of the first window portion was unclear, and part of the first window portion was crushed, so the first window portion of the desired shape could not be obtained. In the laminate according to Comparative Example 2, the distance between the base layer and the aluminum vapor-deposited layer was 0.15 mm, so the base layer and pattern layer were removed by laser irradiation, but part of the aluminum vapor-deposited layer became transparent, so the luster of the aluminum vapor-deposited layer could only be confirmed partially.

[0105] In contrast, in the laminates according to Examples 1 to 3, the first window portion was formed by irradiating the laminate with laser light in the thickness direction to remove the base layer and the pattern layer. As a result, the outline of the first window portion was clear, and no part of the first window portion was crushed, obtaining the desired shape. Furthermore, in the laminates according to Examples 1 to 3, the distance between the base layer and the aluminum vapor-deposited layer was 0.20 mm or more. Although the base layer and the pattern layer were removed by laser irradiation, the aluminum vapor-deposited layer did not become transparent, and the overall luster of the aluminum vapor-deposited layer visible through the first window portion was confirmed.

[0106] In the laminate according to Comparative Example 1, the second window portion was formed by printing on the pattern layer, so the arithmetic mean roughness Ra of the exposed area and the arithmetic mean roughness Ra of the surface of the pattern layer were approximately the same. In contrast, in the laminates according to Examples 1 to 3, the second window portion was formed by irradiation with laser light, so the surface of the exposed area was roughened, and the ratio of the arithmetic mean roughness Ra of the exposed area to the arithmetic mean roughness Ra of the surface of the pattern layer was in the range of 4.0 to 7.5. [Explanation of Symbols]

[0107] 10…Laminate 11...Base 11A...Side 1 11A1…Exposed area 12…base layer 13…Picture layer 14…Window section 15...Metal layer

Claims

1. A step of preparing an intermediate laminate comprising: a transparent or translucent substrate; a base layer formed on the first surface side of the substrate and removable by laser irradiation; a pattern layer formed on the surface of the base layer opposite to the surface on the substrate side; and a metallic layer disposed within the substrate and having lustrous properties, wherein the distance between the base layer and the metallic layer in the thickness direction of the substrate is 0.20 mm or more. A step of irradiating a portion of the intermediate laminate with laser light from the pattern layer side to remove the base layer and the pattern layer so as to penetrate the thickness direction of the intermediate laminate, thereby forming a window portion and obtaining a laminate in which the metal layer inside the substrate can be seen through the window portion, A method for manufacturing a laminate, comprising the above.

2. The method for manufacturing a laminate according to claim 1, wherein the metal layer is composed of a metal that becomes transparent or semi-transparent upon irradiation with the laser light, and the laser light is irradiated at an output that does not cause the metal layer to become transparent or semi-transparent.

3. The method for manufacturing a laminate according to claim 1, wherein the first surface of the substrate has an exposed region exposed by the formation of the window portion, and the ratio of the arithmetic mean roughness of the exposed region to the arithmetic mean roughness of the surface of the pattern layer is 4.0 or more and 7.5 or less.

4. The method for manufacturing a laminate according to claim 1, wherein the laminate is a card or a booklet.

5. The method for manufacturing a laminate according to claim 4, wherein the card is an IC card.

6. A laminate comprising a transparent or translucent substrate, a base layer formed on the first surface side of the substrate, and a pattern layer formed on the surface of the base layer opposite to the surface facing the substrate, The laminate comprises a window portion that penetrates the base layer and the pattern layer in the thickness direction of the laminate, and a metallic layer disposed within the substrate, visible through the window portion, and having lustrous properties. The first surface of the substrate has an exposed region that is exposed through the window portion, A laminate in which the ratio of the arithmetic mean roughness of the exposed area to the arithmetic mean roughness of the surface of the pattern layer is 4.0 or more and 7.5 or less.

7. The laminate according to claim 6, wherein the distance between the base layer and the metal layer in the thickness direction of the laminate is 0.20 mm or more.

8. The laminate according to claim 6, wherein the laminate is a card or a booklet.

9. The laminate according to claim 8, wherein the card is an IC card.

10. A transparent or translucent substrate, and a base layer disposed on the first surface side of the substrate, which can be removed by laser irradiation. A pattern layer formed on the side of the base layer opposite to the side facing the substrate, The substrate comprises a metallic layer that is disposed within the substrate and has a glossy surface, An intermediate laminate in which the distance between the base layer and the metal layer in the thickness direction of the substrate is 0.20 mm or more.

Images