Cards and methods for manufacturing cards

Abstract

This invention provides a card with security features that prevent malicious third parties from easily viewing the information, and a method for manufacturing such a card. [Solution] According to one aspect of the present invention, a card 10 is provided comprising a base body 11 and a pattern layer 12 formed on a first surface 11A of the base body 11, wherein the card 10 comprises an information display layer 13 formed on a second surface 11B and having an information display area 13C, and a half-mirror layer 14 including a metal vapor deposition layer or a metal oxide vapor deposition layer, wherein the pattern layer 12 has a window portion 12A that penetrates the pattern layer 12 so as to include a region R1 corresponding to the information display area 13C, the card 10 has only one half-mirror layer 14, the half-mirror layer 14 is positioned on the first surface 10A side of the card 10 from the information display area 13C so as to include a region R2 corresponding to the information display area 13, and the surface 13B of the information display layer 13 opposite to the surface 13A on the base body 11 side is exposed.

Description

TECHNICAL FIELD

[0001] The present invention relates to a card and a method for manufacturing the card. BACKGROUND ART

[0002] For example, on cards such as credit cards, confidential information such as the holder name, card number, expiration date, and security code may be printed (see, for example, Patent Document 1). If confidential information is leaked to a malicious third party, the third party may impersonate the card holder and use the card fraudulently. PRIOR ART DOCUMENTS PATENT DOCUMENTS

[0003] PATENT DOCUMENT 1 Japanese Unexamined Patent Application Publication No. 2019-139811 SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION

[0004] However, in current cards, since confidential information is often printed on the front surface or back surface of the card, there is a problem that it is easily visible to third parties. For this reason, security properties that prevent malicious third parties from easily viewing the confidential information on cards are required.

[0005] The present invention has been made to solve the above problems. That is, an object of the present invention is to provide a card having security properties that prevent a malicious third party from easily viewing information, and a method for manufacturing a card that is capable of manufacturing such a card. MEANS FOR SOLVING THE PROBLEMS

[0006] [1] A card having a transparent or translucent substrate having a first face and a second face opposite to the first face, a pattern layer formed on the first face of the substrate, and the first face comprising an information display layer formed on the second face of the substrate and having an information display section on which information is displayed, and a half-mirror layer including a metal vapor deposition layer or a metal oxide vapor deposition layer, wherein the first face of the substrate is located on the first face side of the card from the second face of the substrate, the pattern layer has a window that penetrates the pattern layer such that it includes a region corresponding to the information display section in the thickness direction of the card, the card has only one half-mirror layer, the half-mirror layer is located on the first face side of the card from the information display section such that it includes a region corresponding to the information display section in the thickness direction of the card, and the side of the information display layer opposite to the substrate side is exposed.

[0007] [2] The card according to [1] above, wherein the information display layer further comprises an information non-display portion where the information is not displayed, and the information non-display portion is light-transmitting.

[0008] [3] The card according to [1] or [2] above, wherein the half-mirror layer is disposed within the substrate.

[0009] [4] The card according to [1] or [2], wherein the half-mirror layer is disposed on the first surface of the substrate and within the window portion.

[0010] [5] The card described in any one of the above paragraphs [1] to [4], wherein the card is an IC card.

[0011] [6] A method for manufacturing a card comprising a transparent or translucent substrate having a first surface and a second surface opposite to the first surface, and a pattern layer formed on the first surface of the substrate, comprising the steps of: preparing an intermediate laminate comprising the substrate and a half-mirror layer disposed within the substrate and including a metal vapor deposition layer or a metal oxide vapor deposition layer; forming the pattern layer having a window on the first surface of the substrate; and forming an information display layer having an information display section on which information is displayed on the second surface of the substrate, wherein the window penetrates the pattern layer such that it includes a region corresponding to the information display section in the thickness direction of the intermediate laminate, the half-mirror layer is formed such that it includes a region corresponding to the information display section in the thickness direction of the intermediate laminate, and the card has only one half-mirror layer, and the surface of the information display layer opposite to the substrate side is exposed.

[0012] [7] A method for manufacturing a card comprising a transparent or translucent substrate having a first surface and a second surface opposite to the first surface, and a pattern layer formed on the first surface of the substrate, the method comprising the steps of: preparing the substrate; forming the pattern layer having a window on the first surface of the substrate; forming a half-mirror layer on the first surface of the substrate and within the window; and forming an information display layer having an information display section on which information is displayed on the second surface of the substrate, wherein the window penetrates the pattern layer such that it includes a region corresponding to the information display section in the thickness direction of the substrate, the half-mirror layer is formed such that it includes a region corresponding to the information display section in the thickness direction of the substrate, the card has only one half-mirror layer, and the surface of the information display layer opposite to the substrate side is exposed.

[0013] [8] The method for manufacturing a card according to [6] or [7], wherein the information display layer further has an information non-display portion where the information is not displayed, and the information non-display portion is light-transmitting.

[0014] [9] The method for manufacturing a card according to any one of the above [6] to [8], wherein the card is an IC card. [Effects of the Invention]

[0015] According to one aspect of the present invention, it is possible to provide a card having security properties such that a malicious third party cannot easily visually recognize information, and a method for manufacturing a card that enables the production of such a card body. [Brief Description of the Drawings]

[0016] [Figure 1] Figure 1 is a schematic plan view of the card according to the first embodiment. [Figure 2] Figure 2 is an A-A cross-sectional view in Figure 1. [Figure 3] Figure 3 is a B-B cross-sectional view in Figure 1. [Figure 4] Figure 4 is a schematic plan view of the multi-imposition first intermediate laminate according to the first embodiment. [Figure 5] Figure 5 is a schematic plan view of each first intermediate laminate according to the first embodiment. [Figure 6] Figure 6 is a C-C cross-sectional view in Figure 5. [Figure 7] Figure 7 is a D-D cross-sectional view in Figure 5. [Figure 8] Figures 8A and 8B are schematic diagrams illustrating the manufacturing process of the card according to the first embodiment. [Figure 9] Figures 9A and 9B are schematic diagrams illustrating the manufacturing process of the card according to the first embodiment. [Figure 10] Figures 10A and 10B are schematic diagrams illustrating the manufacturing process of the card according to the first embodiment. [Figure 11] Figures 11A and 11B are schematic diagrams illustrating the manufacturing process of the card according to the first embodiment. [Figure 12] Figures 12A and 12B are schematic diagrams illustrating the manufacturing process of the card according to the first embodiment. [Figure 13]FIG. 13A is a schematic cross-sectional view of the card when a light source disposed on the first surface side of the card is turned on, in a case where an observer views the card according to the first embodiment from the first surface side, and FIG. 13B is a plan view showing a state in the vicinity of a window portion of the card at that time. [Figure 14] FIG. 14A is a schematic cross-sectional view of the card when a light source disposed on the second surface side of the card is turned on, in a case where an observer views the card according to the first embodiment from the first surface side, and FIG. 14B is a plan view showing a state in the vicinity of a window portion of the card at that time. [Figure 15] FIG. 15 is a schematic plan view of a card according to the second embodiment. [Figure 16] FIG. 16 is an E-E cross-sectional view in FIG. 15. [Figure 17] FIG. 17 is an F-F cross-sectional view in FIG. 15. [Figure 18] FIG. 18A and FIG. 18B are schematic views showing a manufacturing process of a card according to the second embodiment. [Figure 19] FIG. 19A and FIG. 19B are schematic views showing a manufacturing process of a card according to the second embodiment. [Figure 20] FIG. 20A is a schematic cross-sectional view of the card when a light source disposed on the first surface side of the card is turned on, in a case where an observer views the card according to the second embodiment from the first surface side, and FIG. 20B is a plan view showing a state in the vicinity of a window portion of the card at that time. [Figure 21] FIG. 21A is a schematic cross-sectional view of the card when a light source disposed on the second surface side of the card is turned on, in a case where an observer views the card according to the second embodiment from the first surface side, and FIG. 21B is a plan view showing a state in the vicinity of a window portion of the card at that time. [Figure 22] FIG. 22A is a photograph capturing a state when the card according to Example 1 is observed from the first surface side with the light source located on the first surface side of the card turned on, and FIG. 22B is a photograph capturing a state when the card according to Example 1 is observed from the first surface side with the light source located on the second surface side of the card turned on. [Figure 23] Figure 23A is a photograph taken when the light source located on the first side of the card according to Example 2 is turned on and the card is observed from the first side, and Figure 23B is a photograph taken when the light source located on the second side of the card according to Example 2 is turned on and the card is observed from the first side. [Figure 24] Figure 24 is a photograph taken when the light source located on the first side of the card according to Comparative Example 1 was turned on, and the card was observed from the first side. [Modes for carrying out the invention]

[0017] [First Embodiment] Hereinafter, a card and a method for manufacturing the card according to the first embodiment of the present invention will be described with reference to the drawings. Figure 1 is a schematic plan view of the card according to this embodiment, Figure 2 is a cross-sectional view AA in Figure 1, and Figure 3 is a cross-sectional view BB in Figure 1. Figure 4 is a schematic plan view of the multi-panel first intermediate laminate according to this embodiment, Figure 5 is a schematic plan view of each first intermediate laminate according to this embodiment, Figure 6 is a cross-sectional view CC in Figure 5, and Figure 7 is a cross-sectional view DD in Figure 5. Figures 8A, 8B, 9A, 9B, 10A, 10B, 11A, 11B, 12A, and 12B are schematic diagrams showing the manufacturing process of the card according to this embodiment. Figure 13A is a schematic diagram showing a cross-section of the card when a light source placed on the first side of the card is lit, when an observer views the card according to the first embodiment from the first side, and Figure 13B is a plan view showing the area near the window of the card at that time. Figure 14A is a schematic diagram showing a cross-section of the card when an observer views the card according to the first embodiment from the first side and a light source located on the second side of the card is illuminated, and Figure 14B is a plan view showing the area around the window portion of the card at that time.

[0018] <<<Card>>> The card 10 shown in Figures 1 to 3 comprises a transparent or translucent base 11 having a first surface 11A and a second surface 11B opposite to the first surface 11A, a pattern layer 12 formed on the first surface 11A of the base 11 and having a window portion 12A, an information display layer 13 formed on the second surface 11B of the base 11, and a half-mirror layer 14 disposed within the base 11. The card 10 has only one half-mirror layer 14. In this specification, "a card has only one half-mirror layer" means that no other half-mirror layers are provided between different layers or on different surfaces than the half-mirror layer, and even if another half-mirror layer is provided between the same layers or on the same surface as the half-mirror layer, the card is considered to have only one half-mirror layer.

[0019] Card 10 has a first surface 10A and a second surface 10B opposite to the first surface 10A. The first surface 10A of card 10 consists of the surface 12B of the pattern layer 12, the surface of the IC module 20 (described later), and the exposed area 11A1 of the first surface 11A of the base body 11 exposed through the window portion 12A. The second surface 10B of card 10 consists of the surface 13B of the information display layer 13 opposite to the surface 13A on the base body 11 side. That is, the surface 13B of the information display layer 13 is exposed. Because the surface 13B of the information display layer 13 is exposed, confidential information and other information can be printed using conventional technologies such as ultragraphic printing.

[0020] Card 10 is a dual-interface IC card capable of contact and contactless communication with external devices. As shown in Figure 3, card 10 comprises an IC module 20 located in a recess 11C of a substrate 11, a pair of conductive plates 30, part of which are located inside the substrate 11, an antenna 40 located inside the substrate 11, and a conductive adhesive layer 50 located between the IC module 20 and the conductive plates 30, which electrically connects the IC module 20 and the conductive plates 30.

[0021] Card 10 is a dual-interface IC card, but the card itself is not particularly limited. Examples include, in addition to a dual-interface IC card, a contact-type IC card that communicates with external devices via external connection terminals on the card surface, a contactless IC card that communicates with external devices via electromagnetic induction or the like through an antenna, or a security card. A booklet-type card is an example of a passport.

[0022] In Figure 3, the IC module 20 and the antenna 40 are electrically connected using a conductive plate 30 and a conductive adhesive layer 50, but the method of electrically connecting the IC module 20 and the antenna 40 is not particularly limited.

[0023] <<Base>> As described above, the substrate 11 is transparent or translucent. In this specification, "transparent" means that the visible light transmittance, which is the transmittance in the visible light region (wavelength 380 nm to 780 nm), is 80% or more, and "translucent" means that the visible light transmittance is 5% or more and less than 80%. "Transparent" may be either colorless transparent or colored transparent, and "translucent" may be either colorless translucent or colored translucent. Because the substrate 11 is a transparent or translucent layer, for example, when light is incident on the card 10 from the second surface 10B side, light can be emitted from the window portion 12A. The visible light transmittance shall be measured using a spectrophotometer equipped with an integrating sphere.

[0024] Furthermore, for the sake of explanation, we will set up an XYZ coordinate system for the base body 11. First, the normal direction of the first face 11A of the base body 11 will be the Z axis. Then, the direction from the second face 11B, which is opposite to the first face 11A of the base body 11, toward the first face 11A will be defined as the +Z direction or upward in the thickness direction, and the opposite direction will be defined as the -Z direction or downward in the thickness direction.

[0025] Furthermore, when the base body 11 is viewed from the +Z direction, the X-axis is defined as a straight line perpendicular to both short sides of the base body 11, which has a long side and a short side as described later, and to the Z-axis. The direction from one short side closer to the recess 11C toward the other short side is defined as the +X direction or right direction, and the opposite direction is defined as the -X direction or left direction. In addition, the Y-axis is defined as an axis perpendicular to the X-axis and the Z-axis, and the direction from one long side farther from the recess 11C toward the other long side is defined as the +Y direction or upward, and the opposite direction is defined as the -Y direction or downward.

[0026] As shown in Figure 2, the substrate 11 has a structure in which an oversheet layer 111, a core layer 112, an inner layer 113, a core layer 114, an inner layer 115, a core layer 116, and an oversheet layer 117 are stacked in this order in the depth direction (-Z direction) from the first surface 11A to the second surface 11B. For example, a magnetic stripe may be embedded on the surface of the oversheet layer 111 opposite to the core layer 112. This allows it to be used as a credit card from which information on the magnetic stripe can be read.

[0027] <Oversheet layer> For the oversheet layers 111 and 117, the same material as the inner layer 115 is usually used, but a transparent material with a thickness of approximately 0.03 mm to 0.18 mm is often used. From the viewpoint of preventing curling when the cards are integrated by heat pressing or the like, as described later, it is preferable that the thicknesses of the oversheet layers 111 and 117 are the same, but they do not necessarily have to be the same.

[0028] The materials for the oversheet layers 111 and 117 can be any material that exhibits adhesive properties upon heating. However, even if the oversheet layers themselves do not exhibit adhesive properties upon heating, the two can be integrated by adding a layer of a known adhesive that generates adhesive force upon heating between the oversheet layer 111 and the core layer 112, or between the oversheet layer 117 and the core layer 116.

[0029] <Core Layer> The core layers 112, 114, and 116 are not particularly limited, but examples include plastic sheets. Examples of plastic sheets include single films or composite films thereof of polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, copolymer polyester, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, polystyrene, ABS, polyacrylic acid ester, polypropylene, polyethylene, polyurethane, etc.

[0030] The thicknesses of the core layers 112, 114, and 116 can be appropriately selected considering the overall thickness of the card 10, but for example, they may be between 0.03 mm and 0.45 mm. In this case, the above thicknesses of the core layers 112, 114, and 116 refer to the thickness of each individual core layer 112, 114, and 116. Note that the core layers 112, 114, and 116 may be a laminated structure of two or more layers.

[0031] <Inner layer> The inner layers 113 and 115 are not particularly limited, but examples include the plastic sheets described in the sections for core layers 112, 114, and 116. The thickness of the inner layers 113 and 115 can be appropriately selected considering the overall thickness of the card 10, but may be, for example, 0.03 mm or more and 0.45 mm or less.

[0032] <<Pattern Layer>> The image layer 12 is a layer for forming any image, such as pictures, photographs, letters, numbers, figures, symbols, patterns, etc., on the first side 10A of the card 10.

[0033] The thickness of the pattern layer 12 is not particularly limited, but is preferably, for example, 0.1 μm or more and 10 μm or less. If the thickness of the pattern layer 12 is 0.1 μm or more, a visible color tone can be expressed, and if it is 10 μm or less, the step difference between the pattern layer 12 and the window portion 12A can be suppressed when the pattern layer 12 is formed by the transfer method, and the appearance quality after heat pressing can be improved. The lower limit of the thickness of the pattern layer 12 is preferably 0.5 μm or more or 1 μm or more, and the upper limit is preferably 7 μm or less or 5 μm or less. For example, the thickness of the pattern layer 12 may be 0.5 μm or more and 7 μm or less or 1 μm or more and 5 μm or less.

[0034] The pattern layer 12 contains a coloring agent such as a dye or pigment and a binder resin. The pattern layer 12 may have multiple colors or a single color. The pattern layer 12 can be formed by coating the first surface 11A and the second surface 11B of the substrate 11 with an ink containing a coloring agent and a binder resin, as described later. This ink may also contain known additives. Known printing methods such as screen printing, gravure printing, and flexographic printing can be used as coating methods.

[0035] <Window section> The window portion 12A is provided so as to penetrate the pattern layer 12 in the thickness direction (Z direction (+Z direction or -Z direction)) of the card 10.

[0036] The window portion 12A is provided so as to include an area R1 corresponding to the information display portion 13C in the thickness direction of the card 10.

[0037] The shape and size of the window portion 12A are not particularly limited, as long as they are provided so as to include the area R1 (see Figure 2) corresponding to the information display portion 13C of the information display layer 13 in the thickness direction (Z direction) of the card 10. For example, it may be rectangular as shown in Figure 1, or it may be circular or elliptical. Since the window portion 12A can be formed by printing the pattern layer 12, the shape and size of the window portion 12A can be freely changed by printing the pattern layer 12.

[0038] <<Information display section>> Information is displayed on the information display layer 13. The information is not particularly limited, but confidential information is one example. Confidential information may include the cardholder's name, card number, expiration date, security code, etc.

[0039] The information display layer 13 shown in Figure 2 is located on the second surface 11B of the substrate 11, specifically on the surface of the oversheet layer 117. The information display layer 13 has an information display section 13C where information is displayed and an information non-display section 13D where no information is displayed. The information non-display section 13D is the part of the information display layer 13 other than the information display section 13C.

[0040] It is preferable that the information-displaying section 13D is light-transmitting. The light-transmitting nature of the information-displaying section 13D allows the information on the information display section 13C to be visible through the half-mirror layer 14 when light is incident on the card 10 from the second surface 10B side. If the information on the information display section 13C can be seen through the half-mirror layer 14 when light is incident on the card 10 from the second surface 10B side, then it can be determined that the information-displaying section 13D is light-transmitting.

[0041] The method for forming the information display layer 13 is not particularly limited, but it is formed by known printing methods such as screen printing, gravure printing, and flexographic printing. The confidential information displayed in the information display section 13C may be printed simultaneously with the printing of the information display layer 13, or it may be printed using methods that have been used to print confidential information in conventional card technologies, such as transfer printing methods like Ultragraphics or laser color printing.

[0042] When the information display layer 13 is formed by a printing method, the thickness of the information display layer 13 is not particularly limited, but is preferably, for example, 0.1 μm or more and 20 μm or less. If the thickness of the information display layer 13 is 0.1 μm or more, the information on the information display section 13C can be viewed through the half mirror layer 14 when light is incident on the card 10 from the second surface 10B side. If irregularities are formed on the information display section, there is a risk that the information may be visible through the half mirror layer due to the irregularities, but if the thickness is 20 μm or less, the occurrence of irregularities on the information display layer 13 can be suppressed, so the information can be more reliably concealed by the half mirror layer 14. The lower limit of the thickness of the information display layer 13 is preferably 0.5 μm or more or 1 μm or more, and the upper limit is preferably 10 μm or less or 5 μm or less. For example, the thickness of the information display layer 13 may be 0.5 μm or more and 10 μm or less or 1 μm or more and 5 μm or less.

[0043] <<Half-mirror layer>> The half-mirror layer 14 is arranged within the substrate 11 such that it includes a region R1 corresponding to the information display section 13C in the thickness direction of the card 10.

[0044] The half-mirror layer 14 is positioned on the first surface 10A side of the information display section 13C so as to conceal the information on the information display section 13C when an observer observes the card 10 from the window section 12A side and light is incident on the card 10 from the window section 12A side. In Figure 2, the half-mirror layer 14 is positioned between the core layer 112 and the inner layer 113, but the half-mirror layer 14 may be positioned between other layers in the substrate 11 as long as it is positioned on the first surface 10A side of the information display section 13C.

[0045] The half-mirror layer 14 comprises a metal vapor-deposited layer or a metal oxide vapor-deposited layer. The half-mirror layer 14 may have a laminated structure comprising a transparent substrate in addition to the metal vapor-deposited layer or metal oxide vapor-deposited layer. The half-mirror layer 14 may also have an adhesive layer.

[0046] The half-mirror layer 14 may be a hologram sheet. By using a hologram sheet for the half-mirror layer 14, the visibility of information viewed through the window portion 12A when light is incident from the second surface 10B side can be improved. When a hologram sheet is used as the half-mirror layer 14, the half-mirror layer 14 comprises a hologram layer and a metal vapor-deposited layer or metal oxide vapor-deposited layer formed on the hologram layer. In this case, the metal vapor-deposited layer or metal oxide vapor-deposited layer is a reflective layer.

[0047] Examples of metals that constitute the metal deposition layer include aluminum, zinc, tin, copper, nickel, chromium, titanium, gold, silver, and indium. Among these, aluminum is preferred from the viewpoint of manufacturing cost. Examples of metal oxides that constitute the metal oxide deposition layer include silicon oxide and aluminum oxide. The metal deposition layer or metal oxide deposition layer can be formed using known deposition methods. Examples of known deposition methods include vacuum deposition, sputtering, and ion plating.

[0048] The thickness of the metal vapor-deposited layer or metal oxide vapor-deposited layer is not particularly limited, but is preferably, for example, 5 nm or more and 1 μm or less. If this thickness is 5 nm or more, for example, the concealment of information in a steady state (when light is not irradiated from the side opposite to the side of the card 10 being viewed) can be improved, and if it is 1 μm or less, the visibility of the information when light is irradiated from the side opposite to the side of the card 10 being viewed can be improved. The lower limit of this thickness is preferably 8 nm or more or 10 nm or more, and the upper limit is preferably 500 nm or less or 100 nm or less. For example, this thickness may be 8 nm or more and 500 nm or less or 10 nm or more and 100 nm or less.

[0049] <<ICモジュール> > As shown in Figure 3, the IC module 20 comprises a flat substrate 21, an external connection terminal 22 located on the front surface 21A side of the substrate 21, a terminal 23 located on the back surface 21B side of the substrate 21, an IC chip 24 located on the back surface 21B side of the substrate 21, a molded portion 25 covering the IC chip 24, and a wire 26, such as a gold wire, that electrically connects the terminal 23 and the IC chip 24. Note that the wire electrically connecting the external connection terminal 22 and the IC chip 24 is not shown.

[0050] <Circuit board, external connection terminals, and terminals> The substrate 21 can be a flexible resin film such as glass epoxy resin or polyimide resin. The external connection terminals 22 and 23 are made of patterned copper foil. Specifically, copper foil is provided on the front surface 21A and back surface 21B of the substrate 21, and the external connection terminals 22 and 23 are formed by etching the copper foil into a predetermined pattern. In addition, the substrate 21 is pre-provided with multiple through holes (not shown) for wire bonding to the external connection terminals 22.

[0051] <ICチップ> The IC chip 24 is fixed to the back surface 21B of the substrate 21 via an adhesive (not shown). Specifically, it is positioned in the center of the terminal 23 forming surface of the substrate 21. The IC chip 24 includes a CPU for controlling the operation of both contact and contactless communication, a storage device such as RAM, EEPROM, and flash memory, and various circuits such as an interface circuit and a power generation circuit for decoding input signals and generating output signals for contact and contactless communication.

[0052] <Molded part> The molded portion 25 is intended to protect the IC chip 24 and wires 26 from external forces and environmental loads. A UV-curable resin or a thermosetting resin is used as the molded portion 25.

[0053] <<Conductive Plate>> The conductive plate 30 is a conductive plate-shaped member. A portion of the conductive plate 30 is exposed within the recess 11C, specifically within the first recess 11D. That is, as shown in Figure 3, the conductive plate 30 comprises an exposed portion 31 that is exposed within the first recess 11D and a non-exposed portion 32 located within the substrate 11. The conductive plate 30 is electrically connected to the IC module 20 via a conductive adhesive layer 50.

[0054] The thickness of the conductive plate 30 is preferably 70 μm or more and 150 μm or less, and more preferably 80 μm or more and 120 μm or less.

[0055] The constituent material of the conductive plate 30 is not particularly limited as long as it is a conductive material. Suitable materials include, for example, metal materials such as copper and aluminum. Among these, copper is preferred from the viewpoint of cost and durability. Furthermore, to improve weldability, the conductive plate 30 may be formed, for example, by silver plating a copper alloy.

[0056] <<Antenna>> The antenna 40 is coiled and consists of an antenna wire. The antenna 40 has a pair of ends 41. The ends 41 of the antenna 40 are electrically connected to the conductive plate 30 and thus electrically connected to the IC module 20. This constitutes a contactless communication circuit. This communication circuit may, for example, perform proximity communication using the HF frequency band of 13.56 MHz, or it may perform communication using another frequency band, such as the UHF frequency band of 920 MHz.

[0057] When a dual-interface IC card is held over an external device such as a reader / writer, the communication circuit generates an electric current due to the magnetic field formed by the reader / writer, supplying power to the IC chip. This enables the IC chip to be driven, allowing for contactless transmission and reception of information with the reader / writer, and enabling reading and rewriting of information in the memory.

[0058] The antenna wire constituting the antenna 40 is typically formed from a coated conductor, in which a copper wire is covered with an insulating material. Alternatively, copper alloy wires such as Cu-Ni, Cu-Cr, Cu-Zn, Cu-Sn, and Cu-Be, or various metal wires and metal alloy wires such as iron, stainless steel, and aluminum can also be selected. Using coated conductors as antenna wires allows for cheaper manufacturing compared to methods such as copper foil etching.

[0059] The diameter of the antenna wire is not particularly limited as long as it ensures the characteristics of a non-contact communication circuit. For example, it can be 0.03 mm or more and 0.30 mm or less, preferably 0.05 mm or more and 0.15 mm or less. By using the latter range, durability against external forces from heat and pressure during embedding and cutting can be improved, and good communication characteristics can be ensured.

[0060] <<Conductive adhesive layer>> The conductive adhesive layer 50 is placed between the IC module 20 and the exposed portion 31 of the conductive plate 30. By placing the conductive adhesive layer 50, the IC module 20 and the conductive plate 30 can be electrically and mechanically connected, so the IC module 20 and the antenna 40 can be electrically connected.

[0061] As the conductive adhesive layer 50, an anisotropic conductive film (ACF) or anisotropic conductive paste (ACP) can be used. Alternatively, a conductive paste or solder paste in which silver particles are dispersed as a filler in epoxy resin may also be used. In particular, if an anisotropic conductive film is used, the anisotropic conductive film can be heat-laminated over the entire back surface of the substrate 21 of the IC module 20, and after embedding the IC module 20 in the recess 11C of the pre-cut base body 11, it can be heat-pressed at a predetermined temperature and load. This makes it easy to electrically connect the IC module 20 and the conductive plate 30. Furthermore, since a mechanical connection of the IC module 20 to the base body 11 can be made simultaneously, the mounting process of the IC module 20 to the base body 11 can be simplified.

[0062] The electrical connection between the IC module 20 and the conductive plate 30, and the mechanical connection between the IC module 20 and the substrate 11, when an anisotropic conductive film is used as the conductive adhesive layer 50, can be described as follows. The conductive adhesive layer 50 has a structure in which conductive particles, in which a metal film is formed around a spherical resin or spherical metal, are dispersed in an adhesive, which is a binder containing adhesive components. The conductive particles may be resin coated with nickel or gold, or they may be solder particles. Various types of solder particles can be used, such as SnPb-based, SnAgCu-based, SnCu-based, SnZnBi-based, SnAgInBi-based, SnZnAl-based, or alloys of these with other metals. These structures are the same even when an anisotropic conductive paste is used.

[0063] <<<Card Manufacturing Method>>> The card 10 can be manufactured by the following method. First, a multi-panel first intermediate laminate 60 shown in Figure 4 is prepared. The multi-panel first intermediate laminate 60 is made by multi-paneling two or more first intermediate laminates 60A as shown in Figures 4 and 5. In this embodiment, the card 10 is manufactured by separating the first intermediate laminates 60A from the multi-panel first intermediate laminate 60 into individual pieces, but the card 10 may also be manufactured using the first intermediate laminate 60A individually instead of the multi-panel first intermediate laminate 60.

[0064] Each first intermediate laminate 60A in the multi-panel first intermediate laminate 60 comprises a transparent or translucent base 11 having a first surface 11A and a second surface 11B opposite to the first surface 11A, as shown in Figure 6, and a half-mirror layer 14 disposed within the base 11. The half-mirror layer 14 is provided to include a planned area R2 for forming an information display section 13C in the thickness direction of the first intermediate laminate 60A.

[0065] The first intermediate laminate 60A has a first surface 60B and a second surface 60C opposite to the first surface 60B. The first surface 60B of the first intermediate laminate 60A is made from the first surface 11A of the base 11. The second surface 60C of the first intermediate laminate 60A is made from the second surface 11B of the base 11.

[0066] Since card 10 is a dual-interface IC card, as shown in Figure 7, the first intermediate stack 60A also includes a pair of conductive plates 30 arranged inside the base 11 and an antenna 40 arranged inside the base 11. The first intermediate stack 60A does not have a recess 11C. In the first intermediate stack 60A, a portion of the conductive plate 30 is exposed to the recess 11C when the recess 11C is formed, so in the first intermediate stack 60A, it is not exposed.

[0067] When manufacturing the first intermediate laminate 60A, first, a conductive plate 30 is placed on one surface 114A of the core layer 114, as shown in Figure 8A. After placing the conductive plate 30 on the surface 114A of the core layer 114, an antenna 40 having an end portion 41 is formed on the surface 114A of the core layer 114. Then, a portion of the end portion 41 of the antenna 40 is welded to the surface 30A of the conductive plate 30 opposite to the surface in contact with the core layer 114 to form a welded portion 41A. This gives rise to the antenna sheet 70. The conductive plate 30 and the portions of the antenna 40 other than the end portion 41 may be embedded in the surface 114A of the core layer 114.

[0068] Furthermore, as shown in Figure 8B, a half-mirror layer 14 is attached to one surface 112A of the core layer 112 using an adhesive or the like.

[0069] Next, as shown in Figure 9A, the oversheet layer 111, the core layer 112 with the half-mirror layer 14, the inner layer 113, the antenna sheet 70, the inner layer 115, the core layer 116, and the oversheet layer 117 are stacked in this order to obtain the multi-panel first intermediate laminate precursor 80. In the multi-panel first intermediate laminate precursor 80, the antenna sheet 70 is positioned so that the antenna 40 faces the inner layer 115. As a result, the antenna 40 is positioned between the core layer 114 and the inner layer 115. Also, the core layer 112 with the half-mirror layer 14 is positioned so that the half-mirror layer 14 faces the inner layer 113. As a result, the half-mirror layer 14 is positioned between the core layer 112 and the inner layer 113.

[0070] Subsequently, as shown in Figure 9B, the multi-panel first intermediate laminate precursor 80 is sandwiched between heat press plates 90, such as stainless steel plates, from above and below in the thickness direction, and the multi-panel first intermediate laminate precursor 80 is heated and pressurized through the heat press plates 90. By going through this heat press process, a multi-panel first intermediate laminate 60 in which each sheet is integrated can be obtained. Furthermore, if any of the layers constituting the multi-panel first intermediate laminate precursor 80 has heat resistance that prevents heat fusion at a predetermined temperature, an adhesive sheet that heats together at a predetermined temperature is sandwiched between each layer, or an adhesive is applied, and then the heat press process is performed on these to obtain an integrated multi-panel first intermediate laminate 60.

[0071] After obtaining the multi-panel first intermediate laminate 60, a pattern layer 12 having window portions 12A is formed on the first surface 11A of the base body 11 by printing, as shown in Figure 10A. The window portions 12A are formed to include each planned region R2 in the thickness direction of the multi-panel first intermediate laminate 60.

[0072] The pattern layer 12 may be formed not only by printing but also by a transfer method. When forming the pattern layer by a transfer method, for example, the pattern layer 12 may be formed on a transfer substrate, and the pattern layer 12 may be transferred to the first surface 11A of the base body 11 to form the pattern layer 12 on the first surface 11A of the base body 11.

[0073] Furthermore, as shown in Figure 10B, an information display layer 13 having an information display section 13C and an information non-display section 13D is formed on the second surface 11B of the substrate 11 by a transfer method. For example, the information display layer 13 is formed on a transfer substrate, and the information display layer 13 is transferred to the second surface 11B of the substrate 11 to form the information display layer 13 on the second surface 11B of the substrate 11. The information display layer 13 is formed on the second surface 11B such that the information display section 13C is positioned in the planned area R2. Alternatively, the information display section 13C may not be formed at this stage, but may be formed after the IC module 20 is embedded (described later) by printing using a transfer printing method or a laser color printing method.

[0074] This results in a poly-panel second intermediate laminate 100 in which a pattern layer 12 and an information display layer 13 are formed on the poly-panel first intermediate laminate 60, as shown in Figure 10B. In the poly-panel second intermediate laminate 100, the window portion 12A and the half-mirror layer 14 are arranged to include a region R1 (see Figure 10B) corresponding to the information display portion 13C of the information display layer 13 in the thickness direction (Z direction) of the poly-panel second intermediate laminate 100. In the poly-panel second intermediate laminate 100, the information of the information display portion 13C is hidden by the half-mirror layer 14 in the thickness direction of the poly-panel second intermediate laminate 100.

[0075] After forming the multi-faceted second intermediate laminate 100, the second intermediate laminate is punched out to separate it into individual pieces. Then, as shown in Figure 11A, the first recess 11D is formed in the second intermediate laminate 100A. Specifically, the pattern layer 12 and the base 11 are cut from the surface of the second intermediate laminate 90A in the depth direction (-Z direction) of the second intermediate laminate 90A. This cutting is continued until the conductive plate 30 is exposed.

[0076] Next, as shown in Figure 11B, a portion of the bottom surface 11D1 of the first recess 11D is further cut to form the second recess 11E. This cutting is performed so that the diameter of the hole in the second recess 11E is smaller than the diameter of the hole in the first recess 11D. As a result, a base body 11 is obtained that consists of the first recess 11D and the second recess 11E, and has a recess 11C with a step between the bottom surfaces 11D1 and 11E1.

[0077] On the other hand, as shown in Figure 12A, a conductive adhesive layer 50 is formed on the terminals 23 of the IC module 20.

[0078] Subsequently, as shown in Figure 12B, the terminal 23 and the conductive plate 30 are electrically connected via the conductive adhesive layer 50, and the IC module 20 is placed in the recess 11C such that the molded portion 25 is located in the second recess 11E. This electrically connects the IC module 20 and the antenna 40 via the conductive adhesive layer 50, and the card 10 is obtained. After embedding the IC module 20, information such as confidential information may be printed using UltraGraphics or laser color printing to form the information display section 13C.

[0079] According to this embodiment, the half-mirror layer 14 is provided on the first surface 10A side of the information display section 13C of the information display layer 13. Therefore, when both the light source L and the observer are positioned on the first surface 10A side of the card 10, the light from the light source L is reflected by the half-mirror layer 14, so the observer cannot see the information displayed on the information display layer 13 (see Figures 13A and 13B). However, when the observer is positioned on the first surface 10A side of the card 10 and the light source L is positioned on the second surface 10B side of the card 10, the light from the light source L passes through the half-mirror layer 14, so the observer can see the information displayed on the information display layer 13, for example, "1234" (see Figures 14A and 14B). As a result, even if the card 10 has only one half-mirror layer 14, security can be obtained such that a malicious third party cannot easily see the information on the information display layer 13.

[0080] According to this embodiment, since the half-mirror layer 14 is located within the substrate 11, it is difficult for a malicious third party to peel off the half-mirror layer 14 and read the information. Therefore, a higher level of security can be obtained.

[0081] [Second Embodiment] Hereinafter, a card and a method for manufacturing the card according to the second embodiment of the present invention will be described with reference to the drawings. Figure 15 is a schematic plan view of the card according to this embodiment, Figure 16 is a cross-sectional view of EE in Figure 15, and Figure 17 is a cross-sectional view of FF in Figure 15. Figures 18A, 18B, 19A, and 19B are schematic diagrams showing the manufacturing process of the card according to this embodiment. Figure 20A is a schematic diagram showing a cross-section of the card when a light source placed on the first side of the card is turned on, as viewed by an observer from the first side of the card according to the second embodiment, and Figure 20B is a plan view showing the area around the window of the card at that time. Figure 21A is a schematic diagram showing a cross-section of the card when a light source placed on the second side of the card is turned on, as viewed by an observer from the first side of the card according to the second embodiment, and Figure 21B is a plan view showing the area around the window of the card at that time.

[0082] <<<Card>>> The card 120 shown in Figures 15 to 17 comprises a transparent or translucent base 11 having a first surface 11A and a second surface 11B opposite to the first surface 11A, a pattern layer 12 formed on the first surface 11A side of the base 11 and having a window portion 12A, an information display layer 13 formed on the second surface 11B side of the base 11, and a half-mirror layer 121. The window portion 12A and the half-mirror layer 121 are provided to include a region R1 (see Figure 16) in the thickness direction (Z direction) of the card 120 that corresponds to the information display portion 13C of the information display layer 13.

[0083] Card 120 has a first surface 120A and a second surface 120B opposite to the first surface 120A. The first surface 120A of card 120 consists of the surface of the image layer 12, the surface of the IC module 20, and the surface of the half-mirror layer 121. The second surface 120B of card 120 consists of the surface 13B of the information display layer 13.

[0084] <<Half-mirror layer>> The half-mirror layer 121 is the same as the half-mirror layer 14, except for its positioning. Specifically, the half-mirror layer 121 is positioned on the first surface 11A and within the window portion 12A so as to conceal the information displayed on the information display section 13C. The half-mirror layer 121 shown in Figure 16 is in contact with the first surface 11A.

[0085] <<<Card Manufacturing Method>>> The card 120 can be manufactured by the following method. First, a multi-panel first intermediate laminate is prepared, in which two or more first intermediate laminates 130 shown in Figure 18A are mounted on top of each other. In this embodiment, the card 120 is manufactured by separating the first intermediate laminates 130 from the multi-panel first intermediate laminate, but the card 120 may also be manufactured using the first intermediate laminates 130 individually instead of the multi-panel intermediate laminate.

[0086] The first intermediate laminate 130 is the same as the first intermediate laminate 60A, except that it does not have a half-mirror layer 14.

[0087] After preparing the multi-panel first intermediate laminate, a pattern layer 12 having a window portion 12A is formed on the first surface 11A of the base body 11 by printing, as shown in Figure 18B, according to the procedure described in the first embodiment.

[0088] On the other hand, as shown in Figure 19A, a transfer sheet 140 is prepared on a transfer substrate 141 in which a half-mirror layer 121 and an adhesive layer (not shown) are formed in that order, with the half-mirror layer being sized to fit inside the window portion 12A.

[0089] Then, using the transfer sheet 140, a half-mirror layer 121 is formed on the first surface 11A and within the window portion 12A, as shown in Figure 19B, by a transfer method such as thermal transfer. When transferring the half-mirror layer 121 by thermal transfer, the process is carried out at a temperature of, for example, 150°C to 200°C.

[0090] Furthermore, as shown in Figure 19C, an information display layer 13 having an information display section 13C and an information non-display section 13D is formed on the second surface 11B of the substrate 11 by a transfer method. This results in a multi-panel second intermediate laminate having a second intermediate laminate 150.

[0091] After forming the multi-panel second intermediate laminate, the second intermediate laminate 150 is separated into individual pieces using the same procedure as in the first embodiment, forming recesses 11C, and the IC module 20 is placed in the recesses 11C. This yields the card 120.

[0092] According to this embodiment, the half-mirror layer 121 is provided on the first surface 120A side of the information display section 13C. Therefore, when both the light source L and the observer are positioned on the first surface 120A side of the card 120, the light from the light source L is reflected by the half-mirror layer 121, so the observer cannot see the information displayed on the information display section 13C (see Figures 20A and 20B). However, when the observer is positioned on the first surface 120A side of the card 120, and the light source L is positioned on the second surface 120B side of the card 120, the light from the light source L passes through the half-mirror layer 121, so the observer can see the information displayed on the information display section 13C, for example, "1234" (see Figures 21A and 21B). As a result, even if the card 120 has only one half-mirror layer 14, a level of security can be obtained that prevents malicious third parties from easily viewing the information. [Examples]

[0093] To illustrate the present invention in detail, examples are given below, but the present invention is not limited to these descriptions. Figure 21A is a schematic diagram showing a cross-section of a card when a light source located on the second side of the card is turned on, when an observer views the card according to the second embodiment from the first side, and Figure 21B is a plan view showing the area around the window portion of the card at that time. Figure 22A is a photograph taken when the light source located on the first side of the card according to Embodiment 1 is turned on and the card is observed from the first side, and Figure 22B is a photograph taken when the light source located on the second side of the card according to Embodiment 1 is turned on and the card is observed from the first side. Figure 23A is a photograph taken when the light source located on the first side of the card according to Embodiment 2 is turned on and the card is observed from the first side, and Figure 23B is a photograph taken when the light source located on the second side of the card according to Embodiment 2 is turned on and the card is observed from the first side. Figure 24 is a photograph taken when the light source located on the first side of the card according to Comparative Example 1 was turned on, and the card was observed from the first side.

[0094] <Example 1> Two conductive plates made of copper, each 6 mm long, 6 mm wide, and 0.1 mm thick, were bonded to a predetermined area on one side of a transparent inner core layer (Mitsubishi Chemical Corporation's "Diafix PG-MCT") made of glycol-modified PET resin (PET-G resin) with a thickness of 0.20 mm. Next, an antenna made of copper wire with a diameter of 0.11 mm was embedded in the aforementioned surface of the core layer. Then, a portion of the end of the antenna was welded to the exposed surface of the conductive plate opposite to the surface in contact with the inner core layer, forming a 2 mm long welded section. This formed an antenna sheet.

[0095] Furthermore, a half-mirror layer was attached to one side of a transparent upper core layer (Mitsubishi Chemical Corporation's "Diafix PG-MCT") made of glycol-modified PET resin (PET-G resin) with a thickness of 0.15 mm. This half-mirror layer consisted of a base layer made of transparent PET resin with a thickness of 0.02 mm, a hologram layer made of acrylic resin with a thickness of 1 μm, an opaque aluminum vapor-deposited layer with a thickness of 10 nm, and an adhesive layer, in that order. This resulted in an upper core layer with a half-mirror layer. The half-mirror layer was attached so that the aluminum vapor-deposited layer faced the upper core layer.

[0096] Subsequently, a transparent upper oversheet layer made of PET-G resin with a thickness of 0.05 mm (Mitsubishi Chemical Corporation's "Diafix PG-MCT"), the upper core layer with the above half-mirror layer, a transparent upper inner layer made of PET-G resin with a thickness of 0.10 mm (Mitsubishi Chemical Corporation's "Diafix PG-MCT"), an antenna sheet, a transparent lower inner layer made of PET-G resin with a thickness of 0.10 mm (Mitsubishi Chemical Corporation's "Diafix PG-MCT"), a transparent lower core layer made of glycol-modified PET resin (PET-G resin) with a thickness of 0.15 mm (Mitsubishi Chemical Corporation's "Diafix PG-MCT"), and a transparent lower oversheet layer made of PET-G resin with a thickness of 0.05 mm (Mitsubishi Chemical Corporation's "Diafix PG-MCT") were laminated in this order to form an intermediate laminate precursor. In the intermediate laminate precursor, the upper core layer with the half-mirror layer was positioned so that the half-mirror layer was on the upper inner layer side, and the antenna sheet was positioned so that the antenna was on the lower inner layer side.

[0097] Then, the intermediate laminate precursor was heated to 120°C and pressurized at 2 MPa between the hot-pressed sheets to integrate them, and an intermediate laminate was obtained comprising a transparent substrate having an upper oversheet layer, an upper core layer, an upper inner layer, a middle core layer, a lower inner layer, a lower core layer, and a lower oversheet layer, a half-mirror layer, and an antenna.

[0098] Furthermore, when the visible light transmittance of the substrate was measured using a spectrophotometer equipped with an integrating sphere (AS ONE Corporation's "Spectrophotometer ASV11D-H"), the visible light transmittance of the substrate was 80% or higher, indicating that it was "transparent". In addition, when the visible light transmittance of the half-mirror layer was measured using a spectrophotometer equipped with an integrating sphere (AS ONE Corporation's "Spectrophotometer ASV11D-H"), the visible light transmittance was less than 5%, indicating that it was "opaque".

[0099] Next, a 3mm thick pattern layer was formed on the upper oversheet layer of the intermediate laminate using ink ("UV Carton (Process Color)" manufactured by DIC Graphics Co., Ltd.), which had two windows of different sizes that penetrated the pattern layer in the thickness direction (hereinafter, the larger window will be referred to as "Large Window" and the smaller window as "Small Window"). The Large Window was rectangular, measuring 12mm vertically and 16mm horizontally, while the Small Window was rectangular, measuring 8.5mm vertically and 16mm horizontally.

[0100] Furthermore, an information display layer was formed on the lower oversheet layer of the intermediate laminate by the following transfer method. First, a transfer sheet was prepared by forming a 1 μm thick release layer and a 0.5 μm thick information display layer in that order on one side of a transfer substrate made of PET resin with a thickness of 0.02 mm. The information display layer was formed by a printing method and had an information display area where information was displayed and an information non-display area where no information was displayed.

[0101] Then, using a transfer sheet, the information display layer was transferred onto the lower oversheet of the intermediate laminate at a temperature of 200°C. This resulted in the creation of a card. In the card, the window portion and the half-mirror layer were arranged to include the area corresponding to the information display portion in the thickness direction of the card.

[0102] <Example 2> First, an intermediate laminate was obtained using the same method as in Example 1. However, this intermediate laminate did not include a half-mirror layer.

[0103] Next, a 3mm thick pattern layer was formed on the upper oversheet layer of the intermediate laminate using ink ("UV Carton (Process Color)" manufactured by DIC Graphics Co., Ltd.), which had two windows of different sizes that penetrated the pattern layer in the thickness direction (hereinafter, the larger window will be referred to as "Large Window" and the smaller window as "Small Window"). The Large Window was rectangular, measuring 12mm vertically and 16mm horizontally, while the Small Window was rectangular, measuring 8.5mm vertically and 16mm horizontally.

[0104] Furthermore, a transfer sheet was prepared by forming the following layers in this order on one side of a transfer substrate made of PET resin with a thickness of 0.02 mm: a release layer with a thickness of 1 μm, a transparent hologram layer with a thickness of 0.02 mm, a half-mirror layer consisting of an opaque aluminum vapor-deposited layer with a thickness of 10 nm, and an adhesive layer made of acrylic resin with a thickness of 1 μm.

[0105] Then, using a transfer sheet, the adhesive layer and the half-mirror layer were transferred into each window section at a temperature of 200°C. This formed the half-mirror layer so that it included the area corresponding to each information display section in the thickness direction of the intermediate laminate.

[0106] Furthermore, an information display layer was formed on the lower oversheet layer of the intermediate laminate using the same procedure as in Example 1. This resulted in the creation of a card. In the card, the window portion and the half-mirror layer were arranged to include an area corresponding to the information display portion in the thickness direction of the card.

[0107] <Comparative Example 1> In Comparative Example 1, a card was obtained in the same manner as in Example 1, except that a half-mirror layer was not placed.

[0108] <Security Assessment> The security of the cards according to Examples 1 and 2 and Comparative Example 1 was evaluated. Specifically, using a light source, the light source was turned on when it was positioned on the first side of the card and when it was positioned on the second side of the card. When the card was observed from the first side in each case, it was evaluated whether the information in the information display section could be confirmed through each window. The evaluation criteria were as follows. A 500 lux fluorescent lamp and a 50 lumen flashlight from a commercially available smartphone were used as the light source. A: When the light source was located on the first side of the card, the information displayed in the information display area could not be seen through each window, and when the light source was located on the second side of the card, the information displayed in the information display area could be seen through each window, so the security was good. B: When the light source was located on the first side of the card, the information displayed in the information display area could be confirmed through each window, or when the light source was located on the second side of the card, the information displayed in the information display area could not be confirmed through each window, therefore the security was poor.

[0109] The results are shown in Table 1 below. [Table 1]

[0110] As shown in Table 1, in the card relating to Comparative Example 1, a half-mirror layer was not placed between the first side of the card and the information display area. Therefore, the information in the information display area could be seen from each window regardless of whether the light source was a fluorescent lamp or a flashlight (see Figure 24). Thus, it was confirmed that when a malicious third party viewed the card relating to Comparative Example 1 from the first side, the information could be easily seen.

[0111] In contrast, in the cards according to Examples 1 and 2, a half-mirror layer was placed between the first side of the card and the information display area. Therefore, whether the light source was a fluorescent lamp or a flashlight, when the light source was located on the first side of the card, the information in the information display area could not be seen from each window (see Figures 22A and 23A). However, when the light source was located on the second side of the card, the information in the information display area could be seen from each window (see Figures 22B and 23B). Thus, it was confirmed that the information could not be easily seen by a malicious third party when viewed from the first side of the card. [Explanation of Symbols]

[0112] 10, 120... cards 10A…Side 1 10B…Second side 11...Base 11A...Side 1 11B…Second side 12…Picture layer 12A... Window section 13…Information display layer 13C…Information display section 13D…Information hidden section 14, 121... Half-mirror layer 60A, 130... First intermediate laminate

Claims

1. A card comprising a transparent or translucent substrate having a first surface and a second surface opposite to the first surface, and a pattern layer formed on the first surface of the substrate, wherein the card has a first surface, An information display layer having an information display section formed on the second surface of the substrate and on which information is displayed, A half-mirror layer comprising a metal vapor-deposited layer or a metal oxide vapor-deposited layer, The first surface of the substrate is located on the first surface side of the card, The pattern layer has a window portion that penetrates the pattern layer such that it includes an area corresponding to the information display portion in the thickness direction of the card, The aforementioned card has only one half-mirror layer, The half-mirror layer is arranged such that it includes an area corresponding to the information display section in the thickness direction of the card, and is positioned on the first side of the card from the information display section. A card in which the side of the information display layer opposite to the side facing the substrate is exposed.

2. The card according to claim 1, wherein the information display layer further comprises an information non-display portion where the information is not displayed, and the information non-display portion is light-transmitting.

3. The card according to claim 1, wherein the half-mirror layer is disposed within the substrate.

4. The card according to claim 1, wherein the half-mirror layer is disposed on the first surface of the substrate and within the window portion.

5. The card according to claim 1, wherein the card is an IC card.

6. A method for manufacturing a card comprising a transparent or translucent substrate having a first surface and a second surface opposite to the first surface, and a pattern layer formed on the first surface of the substrate, A step of preparing an intermediate laminate comprising the substrate and a half-mirror layer disposed within the substrate and including a metal vapor deposition layer or a metal oxide vapor deposition layer, The steps include forming the pattern layer having a window portion on the first surface of the substrate, The process includes the step of forming an information display layer having an information display section on the second surface of the substrate, The window portion penetrates the pattern layer such that it includes a region corresponding to the information display portion in the thickness direction of the intermediate laminate, The half-mirror layer is formed such that it includes a region corresponding to the information display section in the thickness direction of the intermediate laminate. The aforementioned card has only one half-mirror layer, A method for manufacturing a card, wherein the side of the information display layer opposite to the side facing the substrate is exposed.

7. A method for manufacturing a card comprising a transparent or translucent substrate having a first surface and a second surface opposite to the first surface, and a pattern layer formed on the first surface of the substrate, The process of preparing the substrate, The steps include forming the pattern layer having a window portion on the first surface of the substrate, A step of forming a half-mirror layer on the first surface of the substrate and within the window portion, The process includes the step of forming an information display layer having an information display section on the second surface of the substrate, The window portion penetrates the pattern layer such that it includes a region corresponding to the information display portion in the thickness direction of the substrate, The half-mirror layer is formed such that it includes a region corresponding to the information display section in the thickness direction of the substrate. The aforementioned card has only one half-mirror layer, A method for manufacturing a card, wherein the side of the information display layer opposite to the side facing the substrate is exposed.

8. The method for manufacturing a card according to claim 6 or 7, wherein the information display layer further has an information non-display portion where the information is not displayed, and the information non-display portion is light-transmitting.

9. The method for manufacturing a card according to claim 6 or 7, wherein the card is an IC card.

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