Liquid dispensing device

Abstract

The present invention provides a liquid dispensing device that can stabilize the liquid dispensing operation of the dispensing head. [Solution] The liquid discharge device 100 includes a nozzle plate 71 on which a plurality of nozzles 78 for discharging liquid are formed, a discharge head 70 having an actuator 76 and a head drive unit 79 that drives the actuator 76 to discharge liquid from the nozzles 78, a substrate 81 having a substrate surface 81a extending in a crossing direction D that intersects with the nozzle plate 71, an electronic component provided on the substrate surface 81a for controlling the head drive unit 79, a liquid flow path pipe 46 which is a flow path for liquid supplied to the nozzles 78, and a support body 50 that supports the discharge head 70, wherein the support body 50 has a support plate portion 255 that faces the substrate surface 81a and extends in the crossing direction D, an electronic component contact portion that is in thermal contact with the electronic component, and a pipe contact portion 18 that is in thermal contact with the liquid flow path pipe 46.

Description

Technical Field

[0001] The present invention relates to a liquid ejection apparatus.

Background Art

[0002] As a liquid ejection apparatus, the apparatus disclosed in Patent Document 1 is known.

[0003] This liquid ejection apparatus has a preheating flow path that sends ink supplied to the head system to a sub-tank while raising the temperature of the ink by a heater module. Thereby, the temperature of the liquid supplied to the liquid ejection head can be suitably adjusted.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0005] Incidentally, the apparatus of Patent Document 1 has problems in that power consumption increases and the structure becomes complicated.

Means for Solving the Problem

[0006] To solve the above problems, a liquid discharge device according to one embodiment comprises a nozzle plate having a plurality of nozzles formed thereon for discharging liquid, a discharge head having an actuator and a head drive unit for driving the actuator to discharge the liquid from the nozzles, a substrate having a substrate surface extending in a direction intersecting with respect to the nozzle plate, an electronic component provided on the substrate surface for controlling the head drive unit, a liquid flow path pipe which is a flow path for the liquid supplied to the nozzles, and a support body for supporting the discharge head, wherein the support body has a support plate portion facing the substrate surface and extending in the direction intersecting, an electronic component contact portion that is in thermal contact with the electronic component, and a pipe contact portion that is in thermal contact with the liquid flow path pipe.

[0007] This configuration allows for the stable liquid dispensing operation of the dispensing head with a simple setup by utilizing the heat generated from the electronic components on the circuit board. [Effects of the Invention]

[0008] This invention has the effect of stabilizing the liquid dispensing operation of the dispensing head by using the heat emitted from the electronic components on the substrate. [Brief explanation of the drawing]

[0009] [Figure 1] This is a plan view showing an example configuration of a liquid dispensing device. [Figure 2] Figure 1 is a plan view showing an example of the main components of the liquid dispensing device's line head, as seen from the nozzle side. [Figure 3] Figure 1 is a perspective view showing an example of a head unit for a liquid dispensing device. [Figure 4] Figure 1 is a cross-sectional view of the main part of the discharge head of the liquid dispensing device. [Figure 5] Figure 1 is a side view showing an example of a head unit for a liquid dispensing device. [Figure 6] Figure 1 is a side view showing an example of the head unit of the liquid dispensing device, and is a view of the first surface from the normal direction. [Figure 7]This is a side view showing an example of a head unit for a liquid dispensing device in another example. [Figure 8] This is a side view showing an example of a head unit for a liquid dispensing device in another example. [Modes for carrying out the invention]

[0010] The embodiments will be described below with reference to the drawings. However, the present invention is not limited to the embodiments described below. Furthermore, throughout the following drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant descriptions thereof are omitted.

[0011] (Embodiment 1) Figure 1 is a plan view showing an example of the configuration of a liquid dispensing device 100 according to Embodiment 1.

[0012] The liquid ejection device 100 is a device that prints an image onto a recording medium 101 using liquid ejected from an ejection head 70 based on image data. In the following description, the liquid ejection device 100 is an inkjet printer that ejects ink. The liquid ejection device 100 includes a housing 20, a platen 2 located inside the housing 20, one or more line heads 3, two rollers 4, and a control device 5. Note that the number of line heads 3 and rollers 4 is not limited to the example in Figure 1. Thus, in this embodiment, the liquid ejection device 100 is a line-head type inkjet printer, and printing is performed by the process of ejecting ink from the line heads 3 while moving the recording medium 101.

[0013] A recording medium 101 to be used in the liquid dispensing device 100 is placed on the platen 2. The recording medium 101 is, for example, recording paper. Rollers 4 are positioned at both ends of the platen 2 in the direction of transport of the recording medium 101, and the recording medium 101 is transported by the rotation of the rollers 4.

[0014] In this embodiment, the liquid dispensing device 100 includes four line heads 3. Each of the four line heads 3 corresponds, for example, to cyan, magenta, yellow, and black. The line heads 3 have a rectangular shape in plan view, and are positioned opposite the platen 2 such that the transport direction in which the recording medium 101 is transported is the shorter side, and the direction perpendicular to the transport direction is the longer side. Each line head 3 is positioned in a line between two rollers 4 with a gap between them so that their longer sides face each other.

[0015] The control device 5 includes a control unit such as an ASIC (Application Specific Integrated Circuit) or FPGA (Field Programmable Gate Array), and a storage unit such as a ROM (Read Only Memory), RAM (Random Access Memory), or EEPROM (Electrically Erasable Programmable Read-Only Memory). The control device 5 is capable of communicating with external devices such as a personal computer. The control device 5 controls the operation of each line head 3 and each roller 4 according to a program stored in the storage unit, based on instructions from an external device or an operating unit of the liquid dispensing device 100. The control unit of the control device 5 may include a CPU (Central Processing Unit) or MPU (Microprocessor Unit) instead of an ASIC or FPGA.

[0016] The control device 5 operates the motors to control the movement of each roller 4 and transport the recording medium 101. While the recording medium 101 is being transported, the control device 5 operates each line head 3 to discharge liquid onto the recording medium 101.

[0017] FIG. 2 is a plan view illustrating an example of the main configuration of the line head 3 of the present embodiment as viewed from the nozzle surface side. The line head 3 extends in a direction intersecting or orthogonal to the transport direction of the recording medium 101. The line head 3 includes a unit support plate 30 that is rectangular in plan view, a plurality of head units 6 that are fitted into openings provided in the unit support plate 30 and held by the unit support plate 30, and the like. The head units 6 are placed on the unit support plate 30, and the unit support plate 30 holds the head units 6. Note that in the example of FIG. 2, the line head 3 is configured to include nine head units 6, but the number of head units 6 is not limited to nine.

[0018] The head units 6 are arranged in two rows in the transport direction of the recording medium 101. In one row, four head units 6 are arranged along the direction in which the line head 3 extends, and in the other row, five head units 6 are arranged along the B direction. Ejection ports of a plurality of nozzles 78 are provided on the nozzle surface of each head unit 6. Note that the ejection ports of the nozzles 78 are schematically illustrated for convenience, and differ from the actual arrangement and number.

[0019] The line head 3 is provided with a reservoir that stores liquid. The reservoir is connected to a liquid cartridge. The reservoir receives supply of liquid from the liquid cartridge and stores a required amount of liquid. The reservoir supplies liquid to the head units 6 via a flow path. The reservoir controls the temperature of the liquid.

[0020] FIG. 3 is a perspective view illustrating an example of the head unit 6 of the present embodiment. The head unit 6 is detachably attached to the main body of the line head 3. As shown in FIG. 3, the head unit 6 includes an ejection head 70, an electronic circuit board 80, a tank 35, and a pair of liquid flow path pipes 46. The liquid flow path pipes 46 are flow paths for the liquid ejected from the nozzles 78.

[0021] Figure 4 is a cross-sectional view of the main part of the discharge head 70 of this embodiment. As shown in Figure 4, the discharge head 70 has a nozzle plate 71, a liquid flow path member 72, a frame 73, and a fixing frame 75. The nozzle plate 71, liquid flow path member 72, frame 73, and fixing frame 75 are stacked in the order of nozzle plate 71, liquid flow path member 72, frame 73, and fixing frame 75.

[0022] Furthermore, the discharge head 70 has internal liquid flow paths 41 formed in the frame 73 and the fixing frame 75. The internal liquid flow paths 41 are channels for guiding liquid to the liquid flow path member 72 and for returning liquid from the liquid flow path member 72 to the reservoir. The internal liquid flow paths 41 open at both ends on the outer surface of the fixing frame 75. Liquid flow path pipes 46 are connected to both ends of the internal liquid flow paths 41. The liquid flow path pipes 46 extend in a crossing direction D that intersects with respect to the nozzle plate 71.

[0023] The fixing frame 75 is placed on the unit support plate 30 and fixed to the unit support plate 30.

[0024] The frame 73 has a recess 73a formed on the surface facing the liquid flow channel member 72.

[0025] The liquid flow channel member 72 is composed of multiple metal plates stacked in a cross direction D. The liquid flow channel member 72 includes a pressure chamber 72a formed to be continuous with a plurality of nozzles 78, and a diaphragm 72b. The pressure chamber 72a has an opening and is connected to the internal liquid flow channel 41 and the nozzles 78. The diaphragm 72b closes the opening of the pressure chamber 72a.

[0026] The outer surface of the nozzle plate 71 forms the nozzle surface. Multiple nozzles 78 for discharging liquid are formed on the nozzle plate 71.

[0027] Furthermore, the discharge head 70 includes a head drive unit 79, an actuator 76, and a connector 77.

[0028] The head drive unit 79 is fixed to a recess 73a of the frame 73. The head drive unit 79 is, for example, an integrated circuit. The actuator 76 is fixed to the surface of the liquid flow channel member 72 facing the frame 73. The actuator 76 includes a piezoelectric layer for discharging liquid from the nozzle 78. The actuator 76 is located inside the recess 73a of the frame 73. The connector 77 connects the actuator 76 to the head drive unit 79. The connector 77 is, for example, COF (Chip On Film) and is in the form of a flexible sheet.

[0029] The control signal from the control device 5 is input to the head drive unit 79. The head drive unit 79 outputs a drive signal based on the control signal to the actuator 76 via the connector 77. When the drive signal is input to the actuator 76, the piezoelectric layer operates, causing the diaphragm 72b to vibrate, and liquid is discharged from the nozzle 78. In other words, the head drive unit 79 drives the actuator 76 to discharge liquid from the nozzle 78. The actuator 76 and the head drive unit 79 generate heat, and the temperature of the liquid flow path member 72 and other components also rises.

[0030] Figure 5 is a side view showing an example of the head unit 6 of this embodiment. As shown in Figure 5, the electronic circuit board 80 includes an electronic circuit that controls the head drive unit 79. The electronic circuit board 80 has a substrate 81 and one or more electronic components mounted on the substrate surface 81a of the substrate 81. The substrate 81 is, for example, a printed circuit board. The substrate surface 81a of the substrate 81 extends in a crossing direction D that intersects or is perpendicular to the nozzle plate 71.

[0031] The electronic component controls the head drive unit 79. The electronic component generates heat when controlling the head drive unit 79. The electronic circuit board 80 includes, for example, a first electronic component 82 and a second electronic component 83 as electronic components that generate a large amount of heat. The first electronic component 82 and the second electronic component 83 include, for example, an integrated circuit such as an FPGA (Field Programmable Gate Array) and an outer shell that encloses the integrated circuit. The top surface of the outer shell of the electronic component is a flat surface. The first electronic component 82 and the second electronic component 83 have different footprints. For example, the footprint of the second electronic component 83 is smaller than that of the first electronic component 82. Also, in the intersecting direction D, the second electronic component 83 is located further from the ejection head 70 than the first electronic component 82.

[0032] Tank 35 receives liquid from the reservoir and stores it. Tank 35 also raises the temperature of the stored liquid.

[0033] As shown in Figure 3, the head unit 6 further includes a support structure 50 which holds a pair of liquid flow path tubes 46. The support structure 50 includes a top plate 48, a bottom plate 49, and a support plate portion 55. The head unit 6 also includes a case 66 which covers the internal structure.

[0034] The top plate 48 is located on a plane that intersects or is perpendicular to the intersecting direction D. The top plate 48 has two sockets 48a. Each of the two sockets 48a is connected to a pair of liquid flow pipes 46. That is, the pair of liquid flow pipes 46 connect the tank 35 and the discharge head 70. The sockets 48a communicate with the tank 35. The sockets 48a are also connected to external piping. The external piping includes piping through which liquid supplied to the head unit 6 passes, and piping through which liquid discharged from the head unit 6 passes.

[0035] The bottom plate 49 is located on a plane that intersects or is perpendicular to the intersecting direction D, and extends approximately parallel to the top plate 48, with a gap between them. The bottom plate 49 is fixed to the discharge head 70. The bottom plate 49 is made of a material with high thermal conductivity, such as metal.

[0036] The support plate portion 55 connects the top plate 48 and the bottom plate 49 and extends in the intersecting direction D. As shown in Figure 3, the support plate portion 55 has a substrate holding portion 58 that extends toward the substrate 81. The substrate 81 is fixed to the substrate holding portion 58. The support plate portion 55 is made of a material with high thermal conductivity, such as metal.

[0037] As shown in Figure 5, the support plate portion 55 is a plate-like body and includes a first surface 56 facing the substrate surface 81a of the substrate 81, and a second surface 57 which is the surface opposite to the first surface 56. The second surface 57 faces the pair of liquid flow channels 46. The pair of liquid flow channels 46 pass through the space outside the second surface 57. In other words, the support plate portion 55 is located between the electronic circuit board 80 and the pair of liquid flow channels 46.

[0038] The end of the support plate portion 55 on the top plate 48 side is bent so that it intersects or is perpendicular to the intersecting direction D. The bent end of the support plate portion 55 abuts against the top plate 48 and is fixed to the top plate 48. The end of the support plate portion 55 on the bottom plate 49 side is bent so that it intersects or is perpendicular to the intersecting direction D. The bent end of the support plate portion 55 abuts against the bottom plate 49 and is fixed to it. In other words, the support plate portion 55 of the support body 50 contacts the discharge head 70 via the bottom plate 49. Contact means contact that allows heat to be transferred, and includes both direct contact and indirect contact via a heat-conductive member. In this way, the support body 50 supports the discharge head 70. The support plate portion 55 has a first portion 11, a second portion 12, and a stepped portion 60.

[0039] The first part 11 includes a main body 52, a first protrusion 53, and a second protrusion 54. The main body 52, the first protrusion 53, and the second protrusion 54 are independent elements, but they may also be a single integrated element.

[0040] The main body 52 is a plate-like body, has a certain thickness, and extends in the intersecting direction D.

[0041] The first protrusion 53 is a plate-like body, and its inner surface is fixed to the first surface 56 of the main body 52. ​​The middle portion of the first protrusion 53 in the intersecting direction D is bent into a convex shape. The first protrusion 53 projects from the first surface 56 toward the first electronic component 82. The outer surface of the middle portion of the first protrusion 53 is a flat surface and forms the first electronic component contact portion 16. The first electronic component contact portion 16 is the part that faces the first electronic component 82 and contacts the first electronic component 82 via the heat transfer portion 65. In other words, the first electronic component contact portion 16 is the part that contacts the heat transfer portion 65.

[0042] The second protrusion 54 is a plate-like body, and its inner surface is fixed to the first surface 56 of the main body 52. ​​The middle portion of the second protrusion 54 in the intersecting direction D is bent into a convex shape. The second protrusion 54 projects from the first surface 56 toward the second electronic component 83. The outer surface of the middle portion of the second protrusion 54 is a flat surface and forms the second electronic component contact portion 17. The second electronic component contact portion 17 is the part that faces the second electronic component 83 and contacts the second electronic component 83 via the heat transfer portion 65. In other words, the second electronic component contact portion 17 is the part that contacts the heat transfer portion 65.

[0043] The heat transfer section 65 is sandwiched between the electronic component contact area and the electronic component, bringing the contact area and the electronic component into thermal contact. In this embodiment, multiple heat transfer sections 65 are provided, sandwiched between the first electronic component contact area 16 and the first electronic component 82, and between the second electronic component contact area 17 and the second electronic component 83. By sandwiching the heat transfer section 65 between the electronic component contact areas 16, 17 and the electronic components 82, 83, it is possible to prevent gaps from forming between the electronic component contact area and the electronic component, thereby increasing the heat transfer efficiency. The heat transfer section 65 is, for example, a flexible resin, paste, or liquid metal with thermal conductivity containing carbon particles.

[0044] Figure 6 is a side view showing an example of a head unit 6, and is a view of the first surface 56 from the normal direction. As shown in Figure 6, the area of ​​the second electronic component contact area 17 is smaller than the area of ​​the first electronic component contact area 16.

[0045] Furthermore, the areas of the first electronic component contact portion 16 and the second electronic component contact portion 17 are larger than the areas of the top surfaces of the first electronic component 82 and the second electronic component 83, respectively. This increases the heat capacity of the first protrusion 53 and the second protrusion 54, thereby reducing the thermal resistance.

[0046] As shown in Figure 5, the second portion 12 is continuous with the first portion 11 and extends in the intersecting direction D with a constant thickness on the side closer to the discharge head 70 than the first portion 11, with its end contacting the bottom plate 49. The end of the second portion 12 forms the head contact portion 19. The head contact portion 19 is the part that is in thermal contact with the discharge head 70. On the first surface 56, the second portion 12 is located on the same plane as the first portion 11. On the other hand, on the second surface 57, the second portion 12 is located outside the first portion 11, and a step is formed between the second portion 12 and the first portion 11, forming a stepped portion 60. That is, on the second surface 57, the second portion 12 protrudes toward the liquid flow channel 46 and contacts the liquid flow channel 46. In the direction in which the second portion 12 protrudes, the top surface of the second portion 12 forms the pipe contact portion 18. The pipe contact portion 18 is the part that comes into contact with the liquid flow channel pipe 46.

[0047] When the head unit 6 is driven, the heat generated by the first electronic component 82 and the second electronic component 83 is transferred to the liquid flow channel 46 via the support 50. This heats the liquid that is heated in the tank 35 and flows through the liquid flow channel 46 toward the discharge head 70. This prevents the temperature of the liquid heated in the tank 35 from decreasing as it flows through the liquid flow channel 46, thereby stabilizing the liquid discharge operation of the discharge head 70. Furthermore, by using the heat generated from the electronic components 82 and 83 of the electronic circuit board 80, the liquid discharge operation of the discharge head 70 can be stabilized with a simple configuration.

[0048] (Embodiment 2) The following will focus on the differences between Embodiment 2 and Embodiment 1. Figure 7 is a side view showing an example of a head unit 206 of a liquid dispensing device according to Embodiment 2. The basic configuration of Embodiment 2 is the same as that of Embodiment 1, with differences in the configuration of the support plate.

[0049] The support plate portion 255 of the head unit 6 in Embodiment 2 has a first portion 211, a second portion 212, a third portion 213, and a stepped portion 260.

[0050] The first part 211 includes a fourth part 214, a fifth part 215, and a sixth part 216. The sixth part 216 has a first surface 56 which forms the first electronic component contact portion 16. The fourth part 214 is a portion that extends in the intersecting direction D with a constant thickness on the side closer to the discharge head 70 than the first electronic component contact portion 16. The fifth part 215 is a portion that extends in the intersecting direction D with a constant thickness on the side further away from the discharge head 70 than the first electronic component contact portion 16. The fourth part 214 is thicker than the fifth part 215. This makes it possible to reduce the thermal resistance of the portion through which heat moves from the second electronic component contact portion 17 towards the pipe contact portion 18, in addition to the heat moving from the first electronic component contact portion 16 towards the pipe contact portion 18. The fifth part 215 includes a main body 52 and a second protrusion 54.

[0051] The second portion 212 is located closer to the discharge head 70 than the first portion 211. The second portion 212 is continuous with the fourth portion 214, has the same thickness as the fourth portion 214, extends in the intersecting direction D, and its end abuts against the bottom plate 49. The end of the second portion 212 forms a head contact portion 19 that is in thermal contact with the discharge head 70.

[0052] The third portion 213 is located closer to the discharge head 70 than the first portion 211. The third portion 213 extends parallel to the second portion 212 between the second portion 212 and the liquid flow channel 46.

[0053] The stepped portion 260 connects the first portion 211, the second portion 212, and the third portion 213. On the second surface 57, the stepped portion 260 forms a step between the first portion 211 and the third portion 213. The third portion 213 extends from the stepped portion 260 toward the discharge head 70 in the intersecting direction D, and the third portion 213 contacts the liquid flow path pipe 46 to form a pipe contact portion 18.

[0054] When the head unit 6 is driven, the heat generated by the first electronic component 82 and the second electronic component 83 is transferred to the liquid flow channel 46 via the support 50. This heats the liquid flowing through the liquid flow channel 46, stabilizing the liquid discharge operation of the discharge head 70. Furthermore, since the second portion 212 and the third portion 213 branch off from the first portion 211 at the stepped portion 260, the amount of heat transferred from the electronic components 82 and 83 to the liquid flow channel 46 can be adjusted. This further stabilizes the liquid discharge operation of the discharge head 70.

[0055] (Embodiment 3) The following will focus on the differences between Embodiment 3 and Embodiment 2. Figure 8 is a side view showing an example of a head unit 306 of a liquid dispensing device according to Embodiment 3. The basic configuration of Embodiment 3 is the same as that of Embodiment 2, with differences in the configuration of the support plate.

[0056] The support plate portion 355 of the head unit 306 in Embodiment 3 includes a first portion 311, a second portion 312, and a stepped portion 360.

[0057] The first part 311 is configured similarly to the first part 211 of the second embodiment described above. The second part 312 is located closer to the discharge head 70 than the first part 311. The stepped portion 360 connects the first part 311 and the second part 312. The stepped portion 360 forms a step between the first part 311 and the second part 312 on the second surface 57. The second part 312 extends from the stepped portion 360 toward the discharge head 70 in the intersecting direction D, and the second part 312 contacts the liquid flow channel pipe 46 to form a pipe contact portion 18. In addition, the end of the second part 312 abuts against the bottom plate 49 and forms a head contact portion 19 that is in thermal contact with the discharge head 70.

[0058] From the above description, many improvements and other embodiments of the present invention will be apparent to those skilled in the art. Therefore, the above description should be interpreted as illustrative only and is provided for the purpose of teaching those skilled in the art the best mode of carrying out the invention. The details of its structure and / or function can be substantially modified without departing from the spirit of the invention. [Explanation of Symbols]

[0059] D Cross direction 16 First electronic component contact area 17. Second electronic component contact area 18 Pipe contact part 19 Head contact area 46 Liquid flow channel tubes 50 Support 55 Support plate part 56 Page 1 57 2nd page 70 Discharge head 71 Nozzle Plate 76 Actuators 78 nozzles 79 Head drive unit 81 circuit boards 81a Substrate surface 82 First Electronic Components 83 Second Electronic Components 100 Liquid dispensing device

Claims

1. A discharge head having a nozzle plate with multiple nozzles formed thereon for discharging liquid, an actuator, and a head drive unit that drives the actuator to discharge the liquid from the nozzles, A substrate having a substrate surface extending in a direction intersecting the nozzle plate, An electronic component provided on the substrate surface for controlling the head drive unit, A liquid flow channel tube which is a flow path for the liquid supplied to the nozzle, The system includes a support that supports the discharge head, The liquid dispensing device comprises a support plate portion facing the substrate surface and extending in the intersecting direction, an electronic component contact portion that is in thermal contact with the electronic component, and a tube contact portion that is in thermal contact with the liquid flow channel tube.

2. The liquid dispensing apparatus according to claim 1, wherein the support has a head contact portion that is in thermal contact with the dispensing head.

3. The support plate portion of the support is The first portion on which the electronic component contact portion is provided, A second portion is provided in the portion where the head contact portion is located, and is located closer to the discharge head than the first portion, The part having the pipe contact portion is provided and having a third portion that is parallel to the second portion, The liquid dispensing device according to claim 2, wherein the support has a stepped portion connecting the first portion, the second portion, and the third portion.

4. The liquid dispensing device according to claim 3, wherein the third portion extends in the intersecting direction from the stepped portion toward the dispensing head, and the third portion contacts the liquid flow path pipe to form the pipe contact portion.

5. The aforementioned electronic component includes a first electronic component and a second electronic component, The aforementioned electronic component contact portion is A first electronic component contact portion that is in thermal contact with the first electronic component, A second electronic component contact portion that is in thermal contact with the second electronic component, A liquid dispensing device according to claim 1, having the following features.

6. The aforementioned substrate is A first protrusion extends from the support plate portion toward the first electronic component and has a contact portion with the first electronic component, A second protrusion extends from the support plate portion toward the second electronic component and has a contact portion with the second electronic component, A liquid dispensing device according to claim 5, having the following features.

7. The liquid dispensing device according to claim 6, wherein the area of ​​the second electronic component contact portion of the second protrusion is smaller than the area of ​​the first electronic component contact portion of the first protrusion.

8. The liquid dispensing device according to claim 1, further comprising a heat transfer portion sandwiched between the electronic component contact portion and the electronic component, which brings the electronic component contact portion and the electronic component into thermal contact.

9. The liquid dispensing device according to claim 1, wherein the area of ​​the electronic component contact portion is larger than the area of ​​the top surface of the electronic component.

10. The support plate portion of the support is The first portion on which the electronic component contact portion is provided, A fourth portion is adjacent to the first portion and has a certain thickness on the side closer to the discharge head than the electronic component contact portion and extends in the intersecting direction, A fifth portion is adjacent to the first portion and has a certain thickness on the side further away from the discharge head than the electronic component contact portion and extends in the intersecting direction, It has, The liquid dispensing device according to claim 1, wherein the fourth portion is thicker than the fifth portion.

11. The tank comprises a tank for storing the aforementioned liquid, The liquid discharge device according to claim 1, wherein the liquid flow path pipe connects the tank and the discharge head.

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