Heat dissipation structure of printed circuit board components

Abstract

This invention provides a heat dissipation structure that allows both through-hole mounted electronic components and surface-mounted electronic components on a printed circuit board to be cooled by the same heat sink. [Solution] The heat dissipation structure includes a heat sink and a first heat conductive member, the heat sink receives heat from a first component inserted and mounted on a printed circuit board and a second component surface mounted on a printed circuit board, and receives heat from at least one of the first component and the second component via the first heat conductive member.

Description

Technical Field

[0001] The present disclosure relates to a heat dissipation structure for a component mounted on a printed circuit board.

Background Art

[0002] By densely mounting low-loss power semiconductor devices using SiC (silicon carbide), GaN (gallium nitride), or the like, downsizing of equipment is enabled. In high-density mounting, package-type lead components and modules such as TO-3P, as well as surface-mount components, are targeted. For components that reach high temperatures during operation (heat-generating components), a heat dissipator such as a heat sink is attached.

[0003] As methods for mounting components on a printed circuit board by soldering, through-hole mounting and surface mounting are known. In order to cool heat-generating components, for electronic components having leads that are through-hole mounted (hereinafter referred to as through-hole mounted components), it is known to attach a heat dissipator to a package (molded portion) in which a semiconductor element is sealed. For electronic components that are surface-mounted (hereinafter referred to as surface-mount components), as disclosed in, for example, Patent Document 1 below, it is known to attach a heat dissipator to the back surface (solder surface) of the mounting surface (component surface) of the electronic component on the printed circuit board.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Heat sinks attached to through-hole components are positioned away from the printed circuit board (PCB). On the other hand, heat sinks for surface-mount components are positioned in contact with the PCB. Therefore, in high-density mounting, even when surface-mount and through-hole components are positioned close together on the PCB, it is not possible to attach a common heat sink to both, and separate heat sinks must be attached. This increases the number of components. The number of spacers used to fix the heat sinks to the PCB also increases, increasing the manufacturing process. Furthermore, in high-density mounting, the spacing between mounted components is narrow, and an increase in the number of spacers used to fix the heat sinks to the PCB makes the layout design on the PCB more difficult.

[0006] Therefore, the present disclosure aims to provide a heat dissipation structure that can cool both through-hole mounted electronic components and surface-mounted electronic components on a printed circuit board using the same heat sink. [Means for solving the problem]

[0007] A heat dissipation structure according to a certain aspect of the present disclosure includes a heat sink and a first heat conductive member, wherein the heat sink receives heat from a first component inserted and mounted on a printed circuit board and a second component surface mounted on the printed circuit board, and receives heat from at least one of the first component and the second component via the first heat conductive member. [Effects of the Invention]

[0008] According to this disclosure, a heat dissipation structure can be provided that allows for the cooling of both through-hole mounted electronic components and surface-mounted electronic components on a printed circuit board using the same heat sink. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a schematic diagram showing a heat dissipation structure according to an embodiment of the present disclosure. [Figure 2] Figure 2 is a schematic diagram showing a heat dissipation structure placed on a printed circuit board in which semiconductor modules are mounted in place of through-hole components, as shown in Figure 1. [Figure 3] Figure 3 is a schematic diagram showing the heat dissipation structure according to the first modified example. [Figure 4] Figure 4 is a schematic diagram showing the heat dissipation structure according to the second modified example. [Figure 5] Figure 5 is a schematic diagram showing the heat dissipation structure according to the third modified example. [Figure 6] Figure 6 is a schematic diagram showing the heat dissipation structure according to the fourth modified example. [Figure 7] Figure 7 is a schematic diagram showing the heat dissipation structure according to the fifth modified example. [Modes for carrying out the invention]

[0010] [Description of Embodiments in this Disclosure] The embodiments of this disclosure are listed below for explanation. At least some of the embodiments described below may be combined in any way.

[0011] (1) A heat dissipation structure relating to the first aspect of this disclosure includes a heat sink and a first heat conductive member, wherein the heat sink receives heat from a first component inserted into a printed circuit board and a second component surface-mounted on a printed circuit board, and receives heat from at least one of the first component and the second component via the first heat conductive member. This allows inserted components and surface-mounted components mounted on a printed circuit board to be cooled by the same heat sink. Therefore, an increase in the number of components and manufacturing processes can be suppressed. Furthermore, in high-density mounting, the layout design on the printed circuit board becomes easier.

[0012] (2) In (1) above, the printed circuit board has a first substrate surface and a second substrate surface, the first component may be mounted on the first substrate surface, the heat sink and the first heat conductive member may be located on the side of the second substrate surface, and the heat sink may receive heat from the first component via a predetermined portion of the second substrate surface corresponding to the position on the first substrate surface on which the first component is mounted, and via the first heat conductive member. This allows heat generated by a surface-mount component (first component) mounted on the opposite side of the heat sink to be transmitted to the heat sink, thereby cooling the surface-mount component.

[0013] (3) In the above (2), the heat radiator may be in contact with the first thermally conductive member and the second component mounted on the second substrate surface. Thereby, the surface-mounted component and the insertion-mounted component mounted on different surfaces of the printed circuit board can be cooled by the same heat radiator.

[0014] (4) In the above (2) or (3), the first thermally conductive member may be in contact with the electrically insulating member disposed at a predetermined portion of the second substrate surface. Thereby, the heat radiator formed of a conductive member such as metal can be disposed even in the portion where the wiring pattern of the printed circuit board is disposed.

[0015] (5) In the above (1), the printed circuit board may have a first substrate surface and a second substrate surface, the first component may be mounted on the first substrate surface, the heat radiator and the first thermally conductive member may be located on the first substrate surface side, the heat radiator may be in contact with the first surface of the first thermally conductive member, and the second surface of the first thermally conductive member different from the first surface may be in contact with the first component. Thereby, in the printed circuit board, heat generated by the surface-mounted component (the first component) mounted on the same side as the heat radiator can be transferred to the heat radiator, and the surface-mounted component can be cooled.

[0016] (6) In the above (5), the heat radiator may further be in contact with the second component mounted on the first substrate surface. Thereby, the surface-mounted component and the insertion-mounted component mounted on the same surface of the printed circuit board can be cooled by the same heat radiator.

[0017] (7) In the above (5), the heat dissipation structure may further include a second thermally conductive member located on the first substrate surface side, the second component may be mounted on the second substrate surface, the heat radiator may further be in contact with the third surface of the second thermally conductive member, and the fourth surface of the second thermally conductive member different from the third surface may be in contact with a predetermined portion of the first substrate surface corresponding to the position on the second substrate surface where the second component is mounted. Thereby, the surface-mounted component mounted on the same side as the heat radiator and the insertion-mounted component mounted on the opposite side of the heat radiator can be cooled by the same heat radiator.

[0018] (8) In the above (1), the printed board may have a first board surface and a second board surface, the first component may be mounted on the first board surface, the second component may be mounted on the second board surface, the radiator and the first thermally conductive member may be located on the first board surface side, the radiator may be in contact with the first component and the first surface of the first thermally conductive member, and the second surface of the first thermally conductive member, which is different from the first surface, may be in contact with a predetermined portion of the first board surface corresponding to the position on the second board surface where the second component is mounted. Accordingly, the surface-mounted component mounted on the same side as the radiator and the insertion-mounted component mounted on the opposite side of the radiator can be cooled by the same radiator.

[0019] (9) In any one of the above (1) to (8), the first thermally conductive member may be formed of a metal. This enhances the cooling effect on the heat-generating component.

[0020] (10) In any one of the above (1) to (9), the first thermally conductive member may be formed integrally with the radiator. This further increases thermal conductivity and further enhances the cooling effect on the heat-generating component.

[0021] (11) In the above (7), the first thermally conductive member and the second thermally conductive member may be formed integrally with the radiator. This further increases thermal conductivity and further enhances the cooling effect on the heat-generating component.

[0022] (12) A heat dissipation structure according to a second aspect of the present disclosure includes a radiator, the radiator receives heat from a first component surface-mounted on the first board surface of a printed board and a second component insertion-mounted on the first board surface of the printed board, is in contact with a predetermined portion of the second board surface corresponding to the position on the first board surface where the first component is mounted, and has a recess that contacts the second component and accommodates the second component. Accordingly, the insertion-mounted component and the surface-mounted component mounted on the printed board can be cooled by the same radiator. Therefore, increases in the number of components and manufacturing steps can be suppressed.

[0023] [Details of Embodiments of the Present Disclosure] In the following embodiments, identical parts are assigned the same reference numeral. Their names and functions are also identical. Therefore, detailed descriptions of them will not be repeated.

[0024] Referring to Figure 1, the heat dissipation structure 100 according to the embodiment of this disclosure includes a heat sink 102 and a heat conduction member 104. The heat sink 102 has a heat receiving surface and a heat dissipation surface. The heat sink 102 is, for example, a heat sink having a base plate 102a and a plurality of fins 102b. The heat receiving surface of the heat sink 102 is the surface of the base plate 102a that is in contact with the heat-generating component (object to be cooled), which is the heat source, and the heat dissipation surface is formed by the fins 102b. The heat receiving surface of the base plate 102a absorbs heat from the heat-generating component. The base plate 102a transfers the heat absorbed from the heat receiving surface to the fins 102b, which are the heat dissipation surface. The fins 102b are formed in a shape such as a thin plate or needle shape, arranged with predetermined gaps to increase the contact area with air. The heat conduction member 104 is a rectangular parallelepiped block. Both the heat sink 102 and the heat conduction member 104 are made of a material with high thermal conductivity (for example, metal (for example, aluminum or copper)). If the heat sink 102 and the heat conduction member 104 are made of metal, the cooling effect of the heat-generating components will be enhanced.

[0025] The heat sink 102 is fixed to the substrate surface 200S of the printed circuit board 200 by screws (not shown) via a plurality of spacers 206. The heat conductive member 104 is pressed and fixed to the substrate surface 200S by the heat sink 102, which is fixed to the substrate surface 200S via the spacers 206.

[0026] On the printed circuit board 200, surface-mount components 202 are soldered to the board surface 200C, and through-hole components 204 with leads are soldered to the board surface 200S. The surface-mount components 202 and through-hole components 204 are heat-generating components (objects to be cooled). Of the two sides of the printed circuit board 200, the board surface 200C is, for example, the component side, and is the side on which more components are mounted on the printed circuit board 200. The board surface 200S is the solder side, and is the back surface of the component side (board surface 200C). The heat sink 102 contacts the package (molded portion) in which the semiconductor component is housed in the through-hole component 204 and is fixed to the board surface 200S as described above. The package is made of resin, metal, or ceramic, etc. The heat conductive member 104 contacts a predetermined portion of the board surface 200S corresponding to the portion on which the surface-mount components 202 are mounted and is fixed to the board surface 200S as described above. If a wiring pattern (such as a copper foil pattern) is arranged in a predetermined portion where the heat conductive member 104 contacts the substrate surface 200S, an electrical insulating member (such as an insulating sheet) is placed between the heat conductive member 104 and the substrate surface 200S. An insulating member may also be placed between the heat sink 102 and the through-hole mounted component 204. The insulating member to be placed is preferably an insulating heat dissipation sheet with high thermal conductivity.

[0027] When the through-hole component 204 is in operation, the heat generated from the package is transferred from the heat-receiving surface of the heat sink 102 to the base plate 102a, and then dissipated into the air through the fins 102b that form the heat-dissipating surface. When the surface-mount component 202 is in operation, the heat generated is transferred via the printed circuit board 200 to the heat-conducting member 104, and further transferred to the base plate 102a, and then dissipated into the air through the fins 102b. As a result, the surface-mount component 202 and the through-hole component 204 are cooled. As described above, since the heat sink 102 is in contact with the through-hole component 204 and the heat-conducting member 104 is placed between the printed circuit board 200 and the heat sink 102, the heat sink 102 can receive and dissipate heat from the surface-mount component 202 and the through-hole component 204, thereby cooling the surface-mount component 202 and the through-hole component 204. In other words, through-hole components and surface-mount components mounted on different sides of the printed circuit board can be cooled by the same heat sink. Therefore, the increase in the number of components and manufacturing processes can be suppressed. In addition, the increase in the number of spacers used to fix the heat sink to the printed circuit board can be suppressed, making the layout design on the printed circuit board easier in high-density mounting.

[0028] As described above, by placing the heat conductive member 104 between the printed circuit board 200 and the heat sink 102, heat generated by the surface-mount components 202 mounted on the board surface 200C opposite to the board surface 200S on which the heat sink 102 is located can be transferred to the heat sink 102. Therefore, the heat sink 102 can cool the surface-mount components 202.

[0029] The above describes the case where the through-hole components mounted on the printed circuit board are discrete components, but is not limited to this. The through-hole components may also be semiconductor modules containing multiple semiconductor elements. Referring to Figure 2, a heat dissipation structure 100 is placed on a printed circuit board 200 on which surface-mount components 202 are mounted on substrate surface 200C and semiconductor module 210 is mounted on substrate surface 200S. Figure 2 is the same as in Figure 1, but with the through-hole component 204 replaced by semiconductor module 210. In Figure 2, elements with the same reference numerals as in Figure 1 are the same as in Figure 1. Therefore, redundant explanations will not be repeated.

[0030] In the case of Figure 2, the heat dissipation structure 100 can also cool the surface-mount components 202 and the semiconductor module 210. Specifically, the heat generated when the semiconductor module 210 is operating is transferred to the heat sink 102 and dissipated into the air through the fins. The heat generated when the surface-mount components 202 are operating is transferred in the same order as in Figure 1: through the printed circuit board 200, the heat conductive member 104, and the heat sink 102, and dissipated into the air through the fins. Since the heat sink 102 is in contact with the semiconductor module 210 and the heat conductive member 104 is placed between the printed circuit board 200 and the heat sink 102, the heat sink 102 receives heat from the surface-mount components 202 and the semiconductor module 210 and dissipates it, thereby cooling the surface-mount components 202 and the semiconductor module 210. In other words, through-hole components and surface-mount components mounted on different sides of the printed circuit board can be cooled by the same heat sink. Therefore, the increase in the number of components and manufacturing processes can be suppressed. Furthermore, it is possible to suppress the increase in the number of spacers used to fix the heat sink to the printed circuit board, making it easier to design the layout on the printed circuit board in high-density mounting.

[0031] (First variation) The above describes a case where surface-mount components and through-hole components are mounted on different sides of the printed circuit board, but is not limited to this. The heat dissipation structure according to the first modified example cools surface-mount components and through-hole components mounted on the same side of the printed circuit board.

[0032] Referring to Figure 3, the heat dissipation structure 120 according to the first modified example of this disclosure includes a heat sink 102 and a heat conductive member 122. The heat sink 102 is the same as that in Figure 1. The heat conductive member 122 is a rectangular block, similar to the heat conductive member 104 shown in Figure 1, and is made of a material with high thermal conductivity (e.g., metal). The heat conductive member 122 is pressed and fixed to the heat generating component (surface mount component 202 described later) by the heat sink 102, which is fixed to the surface mount component 202 via a spacer 206.

[0033] In the printed circuit board 200 of Figure 3, unlike the printed circuit board 200 of Figure 1, surface-mount components 202 and through-hole components 204 are mounted on the board surface 200S. The through-hole components 204 are in contact with the heat sink 102, as in Figure 1. One surface of the heat conductive member 122 is in contact with the surface-mount components 202, and the opposite surface is in contact with the heat sink 102. Therefore, the heat dissipation structure 120 can cool the surface-mount components 202 and the through-hole components 204. Specifically, the heat generated when the through-hole components 204 are operating is transferred to the heat sink 102, as in Figure 1, and dissipated into the air through the fins. The heat generated when the surface-mount components 202 are operating is transferred from the heat conductive member 122 to the heat sink 102 and dissipated into the air through the fins. Since the heat sink 102 is in contact with the through-hole component 204, and a heat conductive member 122 is placed between the surface-mount component 202 and the heat sink 102, the heat sink 102 receives heat from both the surface-mount component 202 and the through-hole component 204 and dissipates it, thereby cooling both components. In other words, through-hole components and surface-mount components mounted on the same side of the printed circuit board can be cooled by the same heat sink. Therefore, the increase in the number of components and manufacturing steps can be suppressed. In addition, the increase in the number of spacers used to fix the heat sink to the printed circuit board can be suppressed, making the layout design on the printed circuit board easier in high-density mounting.

[0034] Although the height of the surface-mount component 202 is smaller than the package height of the through-hole component 204 (distance from the substrate surface 200S), as described above, the placement of the heat conduction member 122 between the surface-mount component 202 and the heat sink 102 allows the heat generated by the surface-mount component 202 mounted on the same side as the heat sink 102 to be transferred to the flat heat-receiving surface of the heat sink 102. Therefore, the heat sink 102 can cool the surface-mount component 202.

[0035] In Figure 3, the case in which the surface-mount component 202 and the through-hole component 204 are mounted on the substrate surface 200S is explained, but the surface-mount component 202 and the through-hole component 204 may also be mounted on the substrate surface 200C. In that case, the heat dissipation structure 120 is placed on the substrate surface 200C side, and a heat conductive member 122 is placed between the surface-mount component 202 and the heat sink 102, as in Figure 3, so that the heat sink 102 is in contact with the heat conductive member 122 and the through-hole component 204.

[0036] (Second variation) Figure 1 illustrates a case where surface-mount components mounted on the component side and through-hole components mounted on the solder side are to be cooled, but the heat dissipation structure is not limited to this. The second modified example of the heat dissipation structure cools through-hole components mounted on the component side and surface-mount components mounted on the solder side.

[0037] Referring to Figure 4, the heat dissipation structure 130 according to the second modified example of this disclosure includes a heat sink 102 and a heat conductive member 132. The heat sink 102 is the same as that in Figure 1. The heat conductive member 132 is a rectangular block, similar to the heat conductive member 104 shown in Figure 1, and is made of a material with high thermal conductivity (e.g., metal). The heat sink 102 is fixed to the substrate surface 200S by contacting the surface mount component 202 via a spacer 206. The heat conductive member 132 is pressed and fixed to the substrate surface 200S by the heat sink 102. The height of the heat conductive member 132 (i.e., the distance between the heat receiving surface of the heat sink 102 and the substrate surface 200S) is the same as the distance between the top surface (the side furthest from the printed circuit board 200) of the surface mount component 202 mounted on the substrate surface 200S and the substrate surface 200S.

[0038] In the printed circuit board 200 shown in Figure 4, unlike the printed circuit board 200 shown in Figure 1, surface-mount components 202 are mounted on the board surface 200S, and through-hole components 204 are mounted on the board surface 200C. An electrical insulating sheet 134 is placed between the package of the through-hole component 204 and the board surface 200C. The insulating sheet 134 is made of, for example, a material with high thermal conductivity. The surface-mount component 202 is in contact with the heat sink 102 as described above. The heat conductive member 132 is in contact with a predetermined portion of the board surface 200S corresponding to the portion on which the through-hole component 204 is mounted, and is fixed to the board surface 200S as described above.

[0039] The heat generated during the operation of the surface-mount component 202 is transferred to the heat sink 102 and dissipated into the air through its fins. The heat generated during the operation of the through-hole component 204 is transferred to the heat conductive member 132 via the insulating sheet 134 and the printed circuit board 200, and further transferred to the heat sink 102, where it is dissipated into the air through its fins. As a result, the surface-mount component 202 and the through-hole component 204 are cooled. As described above, since the heat sink 102 is in contact with the surface-mount component 202 and the heat conductive member 132 is placed between the printed circuit board 200 and the heat sink 102, the heat sink 102 can receive and dissipate heat from the surface-mount component 202 and the through-hole component 204, thereby cooling the surface-mount component 202 and the through-hole component 204. In other words, through-hole components and surface-mount components mounted on different sides of the printed circuit board can be cooled by the same heat sink. Therefore, the increase in the number of components and manufacturing processes can be suppressed. Furthermore, it is possible to suppress the increase in the number of spacers used to fix the heat sink to the printed circuit board, making it easier to design the layout on the printed circuit board in high-density mounting.

[0040] (Third variation) In the second modified example described above (see Figure 4), the case in which the heat sink is in direct contact with the surface-mount component was explained, but the example is not limited to this. In the heat dissipation structure according to the third modified example, a heat conductive member is also placed between the surface-mount component and the heat sink.

[0041] Referring to Figure 5, the heat dissipation structure 140 according to the third modified example of this disclosure includes a heat sink 102, a heat conduction member 122, and a heat conduction member 142. The heat sink 102 is the same as that shown in Figures 1 to 4. The heat conduction members 122 and 142 are rectangular parallelepiped blocks, similar to the heat conduction member 104 shown in Figure 1, and are made of a material with high thermal conductivity (e.g., metal). The heat conduction member 122 is the same as that shown in Figure 3 (first modified example). That is, the heat conduction member 122 is pressed and fixed to the top surface of the surface mount component 202 by the heat sink 102, which is fixed to the substrate surface 200S via a spacer 206. The heat conduction member 142 is similarly pressed and fixed to the substrate surface 200S by the heat sink 102.

[0042] On the printed circuit board 200, surface-mount components 202 are mounted on the board surface 200S, and through-hole components 204 are mounted on the board surface 200C. As described above, the heat conductive member 122 is in contact with the surface-mount components 202 and the heat sink 102, and the heat conductive member 142 is in contact with the heat sink 102 and a predetermined portion of the board surface 200S corresponding to the portion on which the through-hole components 204 are mounted. Therefore, the heat dissipation structure 140 can cool the surface-mount components 202 and the through-hole components 204. Specifically, the heat generated when the surface-mount components 202 are operating is transferred from the heat conductive member 122 to the heat sink 102 and dissipated into the air through the fins of the heat sink 102. The heat generated when the through-hole components 204 are operating is transferred to the heat conductive member 142 via the insulating sheet 134 and the printed circuit board 200, and further transferred to the heat sink 102 and dissipated into the air through the fins of the heat sink 102. As a result, the surface-mount components 202 and through-hole components 204 are cooled by the heat sink 102. That is, through-hole components and surface-mount components mounted on different sides of the printed circuit board can be cooled by the same heat sink. Therefore, an increase in the number of components and manufacturing steps can be suppressed. In addition, an increase in the number of spacers used to fix the heat sink to the printed circuit board can be suppressed, making the layout design on the printed circuit board easier in high-density mounting. By providing the heat conductive member 122, the surface-mount components 202 can be cooled even when the height of the surface-mount components 202 is low, making it difficult to bring the heat sink 102 into direct contact with the surface-mount components 202 as shown in Figure 4.

[0043] (Fourth variation) Figures 1, 2, 4, and 5 above illustrate the case where the heat conductive material is in direct contact with the printed circuit board. However, if wiring patterns are located in the area of ​​the printed circuit board where the heat conductive material makes contact, electrical insulation becomes necessary.

[0044] Referring to Figure 6, the heat dissipation structure 150 according to the fourth modified example of this disclosure includes a heat sink 102, a heat conductive member 152, and an insulating sheet 154. The heat sink 102 is the same as that in Figures 1 to 4. The heat conductive member 152 is a rectangular block, similar to the heat conductive member 104 shown in Figure 1, and is made of a material with high thermal conductivity (e.g., metal). The insulating sheet 154 is made of, for example, an electrically insulating material with high thermal conductivity. The heat sink 102 is in contact with the package of the through-hole component 204 and is fixed to the substrate surface 200S via a spacer 206. The heat conductive member 152 is pressed and fixed to the insulating sheet 154 by the heat sink 102.

[0045] In the printed circuit board 200 shown in Figure 6, surface-mount components 202 are mounted on the board surface 200C, and through-hole components 204 are mounted on the board surface 200S. A wiring pattern 220 is placed in the area where the surface-mount components 202 are mounted, and the wiring pattern 220 is electrically connected to a wiring pattern 222 located on the board surface 200S via vias 224. The insulating sheet 154 is positioned in contact with the wiring pattern 222 located in a predetermined area of ​​the board surface 200S corresponding to the area where the surface-mount components 202 are mounted. As described above, the heat conductive member 152 is pressed against the insulating sheet 154 by a heat sink 102 fixed to the board surface 200S via a spacer 206.

[0046] The heat dissipation structure 150 can cool the surface-mount components 202 and through-hole components 204. Specifically, the heat generated when the through-hole components 204 are operating is transferred to the heat sink 102 and dissipated into the air through the fins. The heat generated when the surface-mount components 202 are operating is transferred in the following order: printed circuit board 200, insulating sheet 154, heat conductive member 152, and heat sink 102, and dissipated into the air through the fins. Since the heat sink 102 is in contact with the through-hole components 204 and the heat conductive member 152 is placed between the printed circuit board 200 and the heat sink 102, the heat sink 102 receives heat from the surface-mount components 202 and through-hole components 204 and dissipates it, thereby cooling the surface-mount components 202 and through-hole components 204. In other words, through-hole components and surface-mount components mounted on different sides of the printed circuit board can be cooled by the same heat sink. Therefore, the increase in the number of components and manufacturing processes can be suppressed. Furthermore, it is possible to suppress the increase in the number of spacers used to fix the heat sink to the printed circuit board, making it easier to design the placement on the printed circuit board in high-density mounting. By providing the insulating sheet 154, a heat sink made of a conductive material such as metal can be placed even in the area where the wiring pattern of the printed circuit board is located.

[0047] (Fifth variation) The above describes a heat dissipation structure that includes a heat sink and a heat conductive member, but is not limited to this. The heat dissipation structure according to the fifth modified example does not include a heat conductive member.

[0048] Referring to Figure 7, the fifth modified example of the present disclosure, a heat dissipation structure 160, includes a heat sink 162. The heat sink 162 is, for example, a heat sink having a base portion 162a and fins 162b. The heat sink 162 has a recess 164. The recess 164 accommodates a heat-generating component, and the wall surface defining the recess 164 is in contact with the heat-generating component. The heat-receiving surface of the heat sink 162 is the surface of the base portion 162a that is in contact with the heat source (including the wall surface defining the recess 164), and the heat-dissipating surface is formed by the fins 162b. The heat-receiving surface of the base portion 162a is attached to the heat-generating component and absorbs heat. The base portion 162a transfers the heat absorbed from the heat-receiving surface to the fins 162b (heat-dissipating surface). The fins 162b are formed in a shape such as a thin plate or needle, arranged with predetermined gaps to increase the contact area with air. The heat sink 162 is made of a material with high thermal conductivity (for example, metal). The heat sink 162 is fixed to the substrate surface 200S of the printed circuit board 200 by screws (not shown).

[0049] On the printed circuit board 200, surface-mount components 202 are mounted on board surface 200C, and through-hole components 204 are mounted on board surface 200S. The base portion 162a is in contact with a predetermined portion of board surface 200S corresponding to the portion of board surface 200C on which the surface-mount components 202 are mounted. The recess 164 of the heat sink 162 accommodates the through-hole components 204, and the wall surface defining the recess 164 is in contact with the package of the through-hole components 204.

[0050] The heat generated from the package during the operation of the through-hole component 204 is transferred to the base portion 162a of the heat sink 162 and dissipated into the air through the fins 162b. The heat generated during the operation of the surface-mount component 202 is transferred to the base portion 162a via the printed circuit board 200 and dissipated into the air through the fins 162b. As a result, the surface-mount component 202 and the through-hole component 204 are cooled. In other words, through-hole components and surface-mount components mounted on different sides of the printed circuit board can be cooled by the same heat sink. Therefore, the increase in the number of components and manufacturing steps can be suppressed.

[0051] Furthermore, in the heat dissipation structures shown in Figures 1 to 6 above, the heat sink and the heat conduction member may be formed as a single unit, as in the heat dissipation structure 160 in Figure 7. For example, in Figure 1, the heat sink 102 and the heat conduction member 104 may be formed as a single unit. This increases thermal conductivity and enhances the cooling effect of heat-generating components.

[0052] Furthermore, in Figure 5, the heat sink 102 and the heat conductive member 122 may be formed as a single unit, the heat sink 102 and the heat conductive member 142 may be formed as a single unit, or the heat sink 102 and the heat conductive member 122 and the heat conductive member 142 may be formed as a single unit. This will result in higher thermal conductivity and an improved cooling effect for heat-generating components.

[0053] The above describes the case where the heat conductive member is made of metal, but it is not limited to this. It may also be a flexible composite member containing a conductive filler.

[0054] The present disclosure has been described above by describing embodiments, but the embodiments described above are illustrative and the present disclosure is not limited to the embodiments described above. The scope of the present disclosure is as indicated by each claim of the claims, with reference to the description of the detailed description of the invention, and includes all modifications within the meaning and scope equivalent to the wording contained herein. [Explanation of Symbols]

[0055] 100, 120, 130, 140, 150, 160 heat dissipation structure 102, 162 Heatsink 102a Base plate 102b, 162b fins 104, 122, 132, 142, 152 Heat conductive material 134, 154 Insulating Sheets 162a Base section 164 recess 200 Printed Circuit Boards 200C, 200S board surface 202 Surface Mount Components 204 Insertion Mount Components 206 Spacer 210 Semiconductor Modules 220, 222 wiring patterns 224 Beer

Claims

1. Heat sink and Includes a first heat conductive member, The aforementioned heat sink is Heat is received from the first component inserted and mounted on the printed circuit board and the second component surface-mounted on the printed circuit board. A heat dissipation structure that receives heat from at least one of the first component and the second component via the first heat conductive member.

2. The printed circuit board has a first substrate surface and a second substrate surface, The first component is mounted on the first substrate surface, The heat sink and the first heat conduction member are located on the side of the second substrate surface, The heat dissipation structure according to claim 1, wherein the heat sink receives heat from the first component via a predetermined portion of the second substrate surface corresponding to the position on the first substrate surface on which the first component is mounted, and a first heat conductive member.

3. The heat dissipation structure according to claim 2, wherein the heat sink is in contact with the first heat conductive member and the second component mounted on the second substrate surface.

4. The heat dissipation structure according to claim 2 or 3, wherein the first heat conductive member is in contact with an electrical insulating member disposed on the predetermined portion of the second substrate surface.

5. The printed circuit board has a first substrate surface and a second substrate surface, The first component is mounted on the first substrate surface, The heat sink and the first heat conduction member are located on the side of the first substrate surface, The heat sink is in contact with the first surface of the first heat conductive member, The heat dissipation structure according to claim 1, wherein the second surface of the first heat conductive member, which is different from the first surface, is in contact with the first component.

6. The heat dissipation structure according to claim 5, wherein the heat sink is in further contact with the second component mounted on the first substrate surface.

7. The system further includes a second heat conductive member located on the side of the first substrate surface, The second component is mounted on the second substrate surface, The heat sink further contacts the third surface of the second heat conduction member, The heat dissipation structure according to claim 5, wherein the fourth surface of the second heat conductive member, which is different from the third surface, is in contact with a predetermined portion of the first substrate surface corresponding to a position on the second substrate surface on which the second component is mounted.

8. The printed circuit board has a first substrate surface and a second substrate surface, The first component is mounted on the first substrate surface, The second component is mounted on the second substrate surface, The heat sink and the first heat conduction member are located on the side of the first substrate surface, The heat sink is in contact with the first component and the first surface of the first heat conductive member. The heat dissipation structure according to claim 1, wherein the second surface of the first heat conductive member, which is different from the first surface, is in contact with a predetermined portion of the first substrate surface corresponding to a position on the second substrate surface on which the second component is mounted.

9. The heat dissipation structure according to any one of claims 1 to 3 and 5 to 8, wherein the first heat conductive member is formed of metal.

10. The heat dissipation structure according to any one of claims 1 to 3 and 5 to 8, wherein the first heat conductive member is formed integrally with the heat sink.

11. The heat dissipation structure according to claim 7, wherein the first heat conductive member and the second heat conductive member are integrally formed with the heat sink.

12. Including the heat sink, The aforementioned heat sink is Heat is received from a first component surface-mounted on the first substrate surface of the printed circuit board and a second component insert-mounted on the second substrate surface of the printed circuit board. It contacts a predetermined portion of the second substrate surface corresponding to the position on the first substrate surface on which the first component is mounted, A heat dissipation structure having a recess that contacts the second component and accommodates the second component.

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