Grinding device

Abstract

In a polishing apparatus equipped with a mechanism for replacing polishing pads, the load on the rotation axis and bearings of the polishing table is reduced. [Solution] A polishing apparatus is proposed comprising: a polishing table defining a polishing pad holding surface for holding a polishing pad; first and second polishing pad holding modules configured such that the polishing pad supplied from the first polishing pad holding module is wound onto the second polishing pad holding module, causing the polishing pad to slide along the polishing pad holding surface; and a weight adjustment module having a guide member extending in the direction in which the polishing pad slides along the polishing pad holding surface, and a weight member configured to be movable along the guide member.

Description

Technical Field

[0001] The present invention relates to a polishing apparatus.

Background Art

[0002] In semiconductor manufacturing processes, a polishing (CMP: Chemical Mechanical Polishing) apparatus is used to polish substrates. As an example, in a polishing apparatus, a substrate is polished by pressing the substrate against a polishing pad held on a table. As such a polishing apparatus, an apparatus provided with two holding modules that hold a polishing pad wound in a roll shape has been proposed (see, for example, Patent Document 1). In this apparatus, the polishing pad can be slid on the table by supplying the polishing pad from one holding module and winding up the polishing pad with the other holding module. The polishing pad is a consumable item, and this apparatus can automatically update the polishing pad held on the table to an unused portion of the polishing pad.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the apparatus described in Patent Document 1, when polishing a substrate, the substrate is pressed against a polishing pad on the table while the table rotates. As described above, the table is equipped with two holding modules and a polishing pad, and these also rotate together with the rotation of the table, so a large load is placed on the rotation axis and bearings that rotate the table. Here, in order to reduce the load on the rotation axis and bearings of the table, it is preferable that the weight of the table is not uneven with respect to the rotation axis. Incidentally, in the apparatus described in Patent Document 1, the longer the overall length of the rolled polishing pad, that is, the larger the rolled polishing pad used, the more polishing pads can be automatically replaced on the table. However, the larger the rolled polishing pad used, the more uneven the weight of the table becomes, and this weight unevenness changes depending on the use of the polishing pad. In other words, when there is a large unused portion of the polishing pad, the polishing pad held in the supply-side holding module is heavy, and when there is a large unused portion of the polishing pad, the polishing pad held in the winding-side holding module becomes heavy.

[0005] The present invention has been made to solve at least some of the above-mentioned problems, and one of its objectives is to provide a polishing apparatus that can reduce the load on the rotation axis and bearings of the polishing table, in a polishing apparatus equipped with a mechanism that can replace the polishing pad held in the polishing table. [Means for solving the problem]

[0006] According to one embodiment of the present invention, a polishing apparatus for polishing a substrate using a polishing pad comprises a polishing table configured to rotate and defining a polishing pad holding surface for holding the polishing pad, and first and second polishing pad holding modules configured to rotate integrally with the polishing table and configured to hold the polishing pad wound in a roll shape, wherein the polishing pad supplied from the first polishing pad holding module is wound onto the second polishing pad holding module, causing the polishing pad to slide along the polishing pad holding surface. A polishing apparatus is proposed, comprising a weight adjustment module having a guide member extending in a direction in which the polishing pad slides along the polishing pad holding surface, and a weight member configured to be movable along the guide member. [Brief explanation of the drawing]

[0007] [Figure 1] This is a front view of a polishing apparatus according to one embodiment of the present disclosure. [Figure 2] This is a plan view of the polishing table of the polishing machine. [Figure 3] This is a plan view showing an example of the arrangement of components mounted or attached to a polishing table. [Figure 4] This is a cross-sectional view showing the schematic configuration of the polishing table in this embodiment. [Figure 5A] This is a diagram illustrating the feeding mechanism of the polishing pad P1. [Figure 5B] This is a diagram illustrating the feeding mechanism of the polishing pad P1. [Figure 5C] This is a diagram illustrating the feeding mechanism of the polishing pad P1. [Figure 6A] This diagram illustrates the adjustment of the center of gravity of the polishing table using the weight adjustment module of this embodiment. [Figure 6B] This diagram illustrates the adjustment of the center of gravity of the polishing table using the weight adjustment module of this embodiment. [Modes for carrying out the invention]

[0008] Embodiments of the present invention will be described below with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and redundant descriptions are omitted.

[0009] Figure 1 is a front view of a polishing apparatus 1000 according to one embodiment of the present disclosure. Figure 2 is a plan view of the polishing table 30 of the polishing apparatus 1000. The polishing apparatus 1000 has the function of polishing a substrate WF using a polishing pad P1. Here, "substrate" includes not only semiconductor substrates, glass substrates, liquid crystal substrates, and printed circuit boards, but also magnetic recording media, magnetic recording sensors, mirrors, optical elements, micro-mechanical elements, or partially manufactured integrated circuits, and any other object to be processed. The substrate WF can be any shape, including polygons and circles. The polishing apparatus 1000 of this embodiment comprises a polishing table 30, a top ring 40, and a controller 900.

[0010] The polishing table 30, for example, has a substantially T-shape in a side view (see Figure 1) and a rectangular shape in a top view (see Figure 2). The polishing table 30 comprises a polishing table body 31 and a tabletop 32 that defines the upper surface on which the sub-pad SP is placed. In this embodiment, the polishing table 30 supports a polishing pad P1 for polishing the substrate WF via the sub-pad SP.

[0011] The sub-pad SP can be any pad capable of polishing with the desired precision, and can be made of various materials and dimensions. For example, the sub-pad SP has a roughly rectangular shape and is made of resin or nonwoven fabric. The sub-pad SP can be attached to the upper surface of the tabletop 32 with an adhesive or the like. The upper surface of the sub-pad SP defines the polishing pad holding surface SP1 that holds the polishing pad P1. The sub-pad SP is a consumable item and can be replaced at any desired time. However, the polishing table 30 does not need to be provided with a sub-pad SP. If the polishing table 30 does not have a sub-pad SP, the upper surface of the tabletop 32 defines the polishing pad holding surface.

[0012] The polishing pad P1 is placed on the polishing pad holding surface SP1, which is the upper surface of the sub-pad SP, and is attracted by the sub-pad suction hole SP8 (Figure 4), which opens into the polishing pad holding surface SP1 (described later). The upper surface of the polishing pad P1 (the surface opposite to the surface in contact with the polishing pad holding surface SP1) constitutes the polishing surface for polishing the substrate WF.

[0013] In this embodiment, a supply hole 37 for supplying polishing fluid such as slurry is provided near the center of the polishing table 30 (see Figure 2). Holes are formed in the sub-pad SP and the polishing pad P1 at positions corresponding to the supply hole 37. As a result, when polishing the substrate WF, the polishing fluid is supplied from the supply hole 37 to the polishing surface of the polishing pad P1. This configuration is particularly suitable for supplying polishing fluid even when the substrate WF continues to cover the center of the polishing surface during polishing. Although four supply holes 37 are shown in Figure 2, the number of supply holes 37 is not particularly limited and may be 1 to 3 or 5 or more. In addition, the polishing apparatus 1000 may be configured to supply polishing fluid to the polishing pad P1 from a polishing fluid supply port such as a nozzle provided above the polishing pad P1, instead of or in addition to the supply hole 37.

[0014] Further, the polishing table 30 is configured to be capable of rotating (spinning) around a central axis (spinning axis) C1 perpendicular to the polishing surface by a motor 38. As an example, the central axis C1 extends vertically through the center of the polishing pad holding surface SP1 of the sub-pad SP.

[0015] The top ring 40 is arranged above the polishing table 30 so as to be movable up and down. The top ring 40 is configured to be capable of detachably holding the substrate WF, which is the object to be polished, with the surface to be polished of the substrate WF facing downward (toward the polishing pad P1). The top ring 40 is configured to be capable of rotating (spinning) around a central axis C2. Note that, as an example, the central axis C2 extends in the vertical direction and extends parallel to the central axis C1. During polishing, in a state where polishing liquid is supplied from the supply holes 37 to the polishing surface of the polishing pad P1, the substrate WF is pressed against the polishing surface of the polishing pad P1 by the top ring 40 and polished. As such, the polishing apparatus 1000 is configured to polish the substrate WF by bringing the polishing pad P1 and the substrate WF into contact with each other and causing them to perform rotational motion relative to each other in the presence of the polishing liquid.

[0016] Further, the polishing apparatus 1000 includes, as an example, an atomizer (not shown). The atomizer has a function of removing polishing liquid, polishing products, polishing pad residues from dressing, and the like on the polishing surface by supplying at least one of a liquid (for example, pure water) and a gas (for example, nitrogen gas) to the polishing surface.

[0017] Further, as shown in FIG. 1, the polishing apparatus 1000 includes a first polishing pad holding module 310 and a second polishing pad holding module 320. The first and second polishing pad holding modules 310, 320 can be arranged below the overhanging portions projecting from both sides of the T-shaped polishing table 30. In the example shown in FIG. 1, the first and second polishing pad holding modules 310, 320 are located on opposite sides with respect to the central axis C1 of the polishing table 30. The first and second polishing pad holding modules 310, 320 are configured to be rotatable integrally with the polishing table 30 around the central axis C1.

[0018] The first polishing pad holding module 310 is configured to hold the supply roll 100 in a state where the center of the supply roll 100 extends in the horizontal direction. The supply roll 100 is, for example, an unused roll-shaped pad in which the supply polishing pad P1 is wound into a roll. The aspect of the first polishing pad holding module 310 is not particularly limited as long as it can rotatably hold the supply roll 100, and may be, for example, a support base that rotatably supports the rotating shaft of the supply roll 100. Further, the second polishing pad holding module 320 is configured to hold the take-up roll 200 in a state where the center of the take-up roll 200 extends in the horizontal direction. The take-up roll 200 is, for example, a used roll-shaped pad in which the polishing pad P1 that has passed above the polishing table 30 is wound into a roll. The aspect of the second polishing pad holding module 320 is not particularly limited as long as it can rotatably hold the take-up roll 200, and may be, for example, a support base that rotatably supports the rotating shaft of the take-up roll 200.

[0019] As shown in FIG. 1, the polishing apparatus 1000 includes a first centering roller 110, a first tension roller 120, a second centering roller 210, and a second tension roller 220, which are configured to have the polishing pad P1 trained thereon to guide the polishing pad P1. The first centering roller 110 and the first tension roller 120 are rollers that the polishing pad P1 delivered from the supply roll 100 comes into contact with before reaching the polishing pad holding surface SP1 or above it. In other words, the first centering roller 110 and the first tension roller 120 are configured to come into contact with the polishing pad P1 extending from the supply roll 100 to a position above the polishing table 30. The second centering roller 210 and the second tension roller 220 are rollers that the polishing pad P1 that has passed above the polishing pad holding surface SP1 comes into contact with before being taken up by the take-up roll 200.

[0020] The first centering roller 110 is positioned diagonally below the supply roll 100 such that its axis of rotation extends substantially horizontally. Similarly, the second centering roller 210 is positioned diagonally below the winding roll 200 such that its axis of rotation extends substantially horizontally. By positioning the first centering roller 110 and the second centering roller 210 below the supply roll 100 and the winding roll 200, respectively, it is possible to suppress the abrasive fluid on the polishing surface from traveling along the polishing pad P1 to the supply roll 100 or the winding roll 200 and adversely affecting the supply roll 100 or the winding roll 200. At least one of the first centering roller 110 and the second centering roller 210 may have a shape in which the outer diameter increases toward the center in the longitudinal direction (rotation axis direction). This makes it less likely for the polishing pad P1 to shift in the longitudinal direction of the first centering roller 110 or the second centering roller 210, and less likely to meander.

[0021] The first tension roller 120 is a roller positioned above the first centering roller 110. The second tension roller 220 is a roller positioned above the second centering roller 210. The first tension roller 120 and the second tension roller 220 are positioned along the upper surface of the polishing table 30 or the polishing pad holding surface SP1, or to the side of the upper surface of the polishing table 30 or the polishing pad holding surface SP1. In this embodiment, the first tension roller 120 is positioned along the first side (the right side in Figure 2) of the polishing pad holding surface SP1, and the second tension roller 220 is positioned along the second side (the left side in Figure 2) which is opposite to the first side of the polishing pad holding surface SP1. In this embodiment, when a predetermined tension is applied to the polishing pad P1, the polishing pad P1 is configured to extend substantially parallel to the polishing pad holding surface SP1 between the first tension roller 120 and the second tension roller 220. Here, as an example, the first tension roller 120 and the second tension roller 220 may support the polishing pad P1 at the same height as the polishing pad holding surface SP1. The first tension roller 120 and the second tension roller 220 are, for example, cylindrical in shape from the viewpoint of stretching the polishing pad P1 horizontally.

[0022] The polishing device 1000 further includes a first motor 130 that drives the rotation of the supply roll 100 and a second motor 230 that drives the rotation of the take-up roll 200. The first motor 130 and the second motor 230 are controlled by a controller 900. The first motor 130 and the second motor 230 are connected to the rotating shafts of the supply roll 100 and the take-up roll 200 via a transmission mechanism (not shown) that transmits rotational force, such as a timing belt. The first motor 130 and the second motor 230 may be positioned below the overhangs that extend from both sides of the T-shaped polishing table 30. As an example, the first motor 130 and the second motor 230 are positioned inside the supply roll 100 and the take-up roll 200 (on the side of the central axis C1).

[0023] In the polishing device 1000, the direction of movement of the polishing pad P1 supplied from the supply roll 100 is The direction of movement of the polishing pad P1 is changed by the first centering roller 110 and the first tension roller 120. The polishing pad P1 then slides horizontally along the polishing pad holding surface SP1. Subsequently, the direction of movement of the polishing pad P1 is changed by the second tension roller 220 and the second centering roller 210. The polishing pad P1 is then wound onto the winding roll 200. In this way, the polishing device 1000 is configured so that the polishing pad P1 can slide along the polishing pad holding surface SP1. Therefore, in the polishing device 1000, the used and worn portion of the polishing pad P1 can be replaced by sliding it and replacing it with an unused portion.

[0024] Furthermore, the polishing table 30 is equipped with a weight adjustment module 35 for adjusting the center of gravity of the polishing table 30. The weight adjustment module 35 may be positioned below the protruding portions on both sides of the T-shaped polishing table 30. The weight adjustment module 35 is configured to be rotatable about a central axis C1, integral with the polishing table 30. The weight adjustment module 35 has a guide member 352 and a weight member 354 that is movable along the guide member 352. The guide member 352 extends in the direction in which the polishing pad P1 slides along the polishing pad holding surface SP1 (left and right direction in Figure 1). The guide member 352 may be composed of, for example, a long rod, rail, or ball screw. The weight member 354 moves along the guide member 352 and changes the position of the center of gravity of the polishing table 30 in the direction along the guide member 352. For example, the weight member 354 can be made of a metal such as lead, or a resin. The dimensions and material of the weight member 354 can be determined based on the weight of the supply roll 100 and winding roll 200 held in the first and second polishing pad holding modules 310 and 320.

[0025] Furthermore, the polishing table 30 is equipped with a drive source 356 that moves the weight member 354 along the guide member 352. Various known mechanisms can be used as the drive source 356. For example, the drive source 356 may be a motor that rotates the guide member 352, which is composed of a ball screw, or it may be a fluid actuator. The drive source 356 is controlled by a controller 900. The polishing table 30 also has a sensor (not shown) for detecting the position of the weight member 354, and the controller 900 may control the weight adjustment module (drive source 356) to control the position of the weight member 354 based on the detection signal from the sensor.

[0026] Figure 3 is a plan view showing an example of the arrangement of components mounted or attached to the polishing table 30. The polishing table body 31 and tabletop 32 are not shown in Figure 3. As shown, the first and second polishing pad holding modules 310, 320 (supply roll 100, take-up roll 200) are located on opposite sides of the central axis C1 of the polishing table 30. In other words, the supply roll 100 is positioned along the first side of the polishing pad holding surface SP1, and the take-up roll 200 is positioned along the second side of the polishing pad holding surface SP1, which is opposite the first side. Also, as shown in Figure 3, the weight adjustment module 35 comprises two guide members 352 and a weight member 354, positioned on opposite sides of the central axis C1 of the polishing table 30. In other words, the first guide member 352 and the weight member 354 are positioned along the third side of the polishing pad holding surface SP1, which is perpendicular to the first and second sides. Furthermore, the second guide member 352 and the weight member 354 are positioned along the fourth side of the polishing pad holding surface SP1, which is opposite to the third side. This weight adjustment module 35 prevents the center of gravity of the polishing table 30 from shifting in a direction perpendicular to the axial direction of the supply roll 100 and the winding roll 200 (lateral direction in Figure 3).

[0027] Furthermore, the first motor 130 and the second motor 230 are positioned perpendicular to the polishing pad holding surface SP1. When viewed from the front, the motors should be positioned in a position that is point-symmetric with respect to the central axis C1 of the polishing table 30. For example, as shown in Figure 3, the first motor 130 should be positioned on one axial end of the supply roll 100 (the lower side in Figure 3), and the second motor 230 should be positioned on the other axial end of the winding roll 200 (the upper side in Figure 3). This arrangement allows the center of gravity of the polishing table 30 to be close to the central axis C1.

[0028] The polishing apparatus 1000 includes a first displacement meter 140 for measuring the radius R100 of the supply roll 100 and a second displacement meter 240 for measuring the radius R200 of the winding roll 200. Detection signals from the first displacement meter 140 and the second displacement meter 240 are input to the controller 900. The first and second displacement meter 140 and 240 are configured, for example, to measure the radii R100 and R200 by measuring the radial displacement of the outer surface of the polishing pad P1 on the supply roll 100 and the winding roll 200 from the center of the winding of the polishing pad P1. The first and second displacement meter 140 and 240 may consist of a laser displacement meter, a contact-type displacement meter, an image sensor, etc. Although not limited thereto, the first displacement meter 140 detects a first position A1 located in the end region of one axial end (upper side in Figure 3) of the supply roll 100. Furthermore, the second displacement meter 240 detects a second position A2 located in the end region of the other end (lower side in Figure 3) in the axial direction of the winding roll 200. This is based on the fact that the central region in the axial direction of the supply roll 100 and the winding roll 200 is affected by the centrifugal force accompanying the rotation of the polishing table 30, which may cause discrepancies in detection by the displacement meter. In addition, the first displacement meter 140 and the second displacement meter 240 are preferably positioned so as to be point-symmetric with respect to the central axis C1 when viewed in a direction perpendicular to the polishing pad holding surface SP1. This arrangement allows the center of gravity of the polishing table 30 to be brought closer to the central axis C1. Note that the polishing device 1000 may be equipped with only one of the first displacement meter 140 and the second displacement meter 240, and may measure only one of the radii R100 and R200.

[0029] Figure 4 is a cross-sectional view showing a schematic configuration of the polishing table 30 of this embodiment. As shown in the figure, the polishing table 30 of this embodiment includes a plurality of suction holes 328 opening on the upper surface of the polishing table 30, and a flow path 90 that is in fluid communication with the plurality of suction holes 328. The plurality of suction holes 328 are through holes that penetrate the tabletop 32 of the polishing table 30 in the thickness direction. The polishing apparatus 1000 further includes a vacuum source 91, a fluid supply source 92, and a pressure gauge 93 for measuring the pressure of the flow path 90. The flow path 90 may include a valve (not shown) and be configured to selectively fluid-connect the plurality of suction holes 328 to either the vacuum source 91 or the fluid supply source 92. Alternatively, the plurality of suction holes 328 may be fluid-connected to the vacuum source 91, and a fluid supply hole provided separately from the plurality of suction holes 328 may be fluid-connected to the fluid supply source 92. Note that the polishing apparatus 1000 does not necessarily have to include a fluid supply source 92. The sub-pad SP has multiple sub-pad suction holes SP8 formed at positions corresponding to the multiple suction holes 328. The sub-pad suction holes SP8 penetrate the plate-shaped sub-pad SP in the thickness direction. The sub-pad SP is positioned on the upper surface of the polishing table 30 such that the multiple sub-pad suction holes SP8 communicate with the multiple suction holes 328 formed on the upper surface of the polishing table 30.

[0030] When the polishing pad P1 is held on the polishing pad holding surface SP1, the controller 900 controls the vacuum source 91 to apply negative pressure to the flow path 90. This causes the polishing pad P1, which is above the sub-pad SP, to be vacuum-adsorbed to the polishing pad holding surface SP1. When the polishing pad P1 is to be detached from the polishing pad holding surface SP1, the controller 900 controls the fluid supply source 92 to supply fluid to the flow path 90. This causes the fluid to be ejected from the sub-pad adsorption hole SP8, promoting the separation of the polishing pad P1 from the polishing pad holding surface SP1. This injection of fluid is called blowing. The fluid supplied from the fluid supply source 92 for blowing can, for example, be a gas such as nitrogen or air, or a fluid such as water.

[0031] Next, the feeding operation of the polishing pad P1 by the polishing apparatus 1000 of this embodiment will be described. Figures 5A to 5C are diagrams illustrating the feeding operation of the polishing pad P1. As described above, when the substrate WF is polished, the substrate WF held by the top ring 40 is pressed against the polishing pad P1 while the polishing pad P1 is held by suction to the polishing pad holding surface SP1 (see Figure 5A). Then, the feeding operation of the polishing pad P1 is performed, for example, when a predetermined number of substrates WF (one or several) are polished, or when an external input is made by the user. Prior to the feeding operation of the polishing pad P1, the controller 900 may rotate the polishing table 30 to remove the liquid on the polishing pad P1.

[0032] During the feeding operation of the polishing pad P1, the controller 900 first stops the supply of negative pressure from the vacuum source 91 (see Figure 5B). At this time, the controller 900 may also control the fluid supply source 92 to blow (inject fluid) between the polishing pad holding surface SP1 and the polishing pad P1. This can promote the separation of the polishing pad P1 from the polishing pad holding surface SP1.

[0033] Next, the controller 900 controls the first motor 130 and the second motor 230 to supply the polishing pad P1 from the supply roll 100 and to wind up the polishing pad P1 with the winding roll 200 (see Figure 5C). As a specific example, although not limited to this, the controller 900 drives the first motor 130 to supply the polishing pad P1 from the supply roll 100 so that the feed speed of the polishing pad P1 is constant, and drives the second motor 230 with a predetermined torque limit value to wind up the polishing pad P1 with the winding roll 200. At this time, under torque limiting, the target winding speed of the winding roll 200 is set to be greater than the feed speed V1 of the supply roll 100, so that the winding roll 200 rotates at a winding speed equal to the feed speed V1 and pulls the polishing pad P1 with a torque corresponding to the torque limit value. As a result, the polishing pad P1 is sent from the supply roll 100 to the winding roll 200 in a taut state. In other words, the feed rate V1 of the supply roll 100 is the same as the effective winding speed of the winding roll 200. Note that blowing may be continued when the polishing pad P1 is being fed.

[0034] Next, when the desired amount of polishing pad P1 has been fed, the controller 900 stops the first motor 130 and the second motor 230 and supplies negative pressure from the vacuum source 91. This causes the updated polishing pad P1 to be held in place by suction on the polishing pad holding surface SP1 (see Figure 5A). Through these operations, the polishing device 1000 can feed the polishing pad P1.

[0035] Furthermore, the controller 900 may refer to the feed speed of the polishing pad P1 by the first motor 130 and the second motor 230, and if the speed difference between the winding speed of the winding roll 200 and the supply speed of the supply roll 100 is greater than or equal to a threshold, it may stop the feeding operation or issue an error notification.

[0036] Figures 6A and 6B illustrate the adjustment of the center of gravity of the polishing table 30 by the weight adjustment module 35 of this embodiment. Figure 6A shows a state where a large amount of polishing pad P1 is wound on the supply roll 100 and a small amount of polishing pad P1 is wound on the take-up roll 200. In the state shown in Figure 6A, because the weight of the supply roll 100 is greater than that of the take-up roll 200, a relatively large weight acts on the polishing table 30 on the supply roll 100 side, causing a weight imbalance with respect to the central axis C1. To eliminate this weight imbalance, the controller 900 positions the weight member 354 on the take-up roll 200 side, the greater the weight of the supply roll 100 is compared to the take-up roll 200. Then, as described above, as the substrate WF is polished, the polishing pad P1 is supplied from the supply roll 100 and wound on the take-up roll 200, and the polishing pad P1 is fed. As a result, the weight of the supply roll 100 decreases and the weight of the take-up roll 200 decreases. The amount increases. Figure 6B shows a state where the amount of polishing pad P1 wound on the supply roll 100 is small, and the amount of polishing pad P1 wound on the take-up roll 200 is large. In the state shown in Figure 6B, the weight of the supply roll 100 is small compared to the take-up roll 200, and the weight acting on the polishing table 30 is different from the state shown in Figure 6A. To compensate for the change in the center of gravity due to this change in weight, the controller 900 moves the weight member 354 towards the supply roll 100 as the weight of the supply roll 100 decreases compared to the take-up roll 200.

[0037] For example, the controller 900 may receive the initial weight of the supply roll 100 and the winding roll 200 via external input or the like. The controller 900 can then set the position of the weight member 354 at the start of use based on the initial weight of the supply roll 100 and the winding roll 200. Alternatively, the position of the weight member 354 at the start of use may be set in the controller 900 via external input. For example, the controller 900 can control the weight adjustment module 35 based on detections by the first and second displacement gauges 140 and 240. As a specific example, the controller 900 calculates the amount of polishing pad P1 wound around the supply roll 100 and the winding roll 200 based on the radii R100 and R200 detected by the first and second displacement gauges 140 and 240. The controller 900 then controls the weight adjustment module 35 so that the greater the weight of the supply roll 100 relative to the winding roll 200, the more the weight member 354 is positioned towards the winding roll 200, based on the calculated amount of polishing pad P1. The controller 900 also controls the weight adjustment module 35 so that the less the weight of the supply roll 100 relative to the winding roll 200, the more the weight member 354 is positioned towards the supply roll 100, based on the calculated amount of polishing pad P1. For example, when the weight of the winding roll 200 and the weight of the supply roll 100 are equal, the controller 900 positions the weight member 354 in the center of the third and fourth sides of the polishing table 30. For example, when the polishing pad P1 wound on the supply roll 100 is depleted, the controller 900 controls the weight adjustment module 35 so that the weight member 354 moves along the third and fourth sides of the polishing table 30 to a position opposite to its initial position. Thus, in the polishing table 30 of this embodiment, the center of gravity of the polishing table 30 can be adjusted by the weight adjustment module 35, thereby reducing the load on the rotation axis and bearings of the polishing table 30.

[0038] <Variation> In the embodiment described above, the controller 900 controls the weight adjustment module 35 based on detection by the first and second displacement gauges 140 and 240. However, the controller 900 may control the weight adjustment module 35 based on other information instead of or in addition to detection by the first and second displacement gauges 140 and 240. For example, the controller 900 may control the weight adjustment module 35 based on the operation history of the first and second motors 130 and 230. Also, for example, the polishing device 1000 may have sensors for detecting the weight of the supply roll 100 or the take-up roll 200 held by the first or second polishing pad holding modules 310 and 320. The controller 900 may then move the weight member 354 toward the take-up roll 200 if the weight of the supply roll 100 is greater than the weight of the take-up roll 200, based on the detected weight. Furthermore, the controller 900 should move the weight member 354 towards the supply roll 100 if the weight of the supply roll 100 is smaller than the weight of the winding roll 200, based on the detected weight.

[0039] In the embodiment described above, the controller 900, which controls the entire polishing device 1000, controls the weight adjustment module 35 based on detections by the first and second displacement gauges 140 and 240. However, the polishing device 1000 is controlled separately from the controller 900, A separate controller (hereinafter referred to as "the separate controller") may be provided for controlling the weight adjustment module 35. In this case, detection (detection signal) from the first and second displacement gauges 140 and 240 is input to the separate controller, and the separate controller controls the weight adjustment module 35 based on the detection signal, similar to the control by the controller 900 described above. The separate controller may be provided on the polishing table 30 and configured to rotate integrally with the polishing table 30 about the central axis C1. In this way, the first and second displacement gauges 140 and 240 can be connected to the separate controller, and the weight adjustment module 35 (drive source 356) can be connected to the separate controller without the need for a rotary switch or the like, and the polishing device 1000 can be made into a simpler configuration.

[0040] In the embodiment described above, the polishing device 1000 includes a first centering roller 110, a first tension roller 120, a second centering roller 210, and a second tension roller 220. However, the polishing device 1000 may not include at least some of the first centering roller 110, the first tension roller 120, the second centering roller 210, and the second tension roller 220. Also, in the embodiment described above, the polishing table 30 holds the polishing pad P1 on the polishing pad holding surface SP1 by vacuum suction, but it may not include a vacuum suction mechanism.

[0041] The embodiment described above can also be described in the following form. [Embodiment 1] According to Embodiment 1, a polishing apparatus for polishing a substrate using a polishing pad is proposed, comprising: a polishing table configured to be rotatable and defining a polishing pad holding surface for holding the polishing pad; first and second polishing pad holding modules configured to be rotatable integrally with the polishing table and configured to hold the polishing pad wound in a roll shape, wherein the polishing pad supplied from the first polishing pad holding module is wound onto the second polishing pad holding module, causing the polishing pad to slide along the polishing pad holding surface; and a weight adjustment module having a guide member extending in the direction in which the polishing pad slides along the polishing pad holding surface, and a weight member configured to be movable along the guide member. According to Embodiment 1, in a polishing apparatus equipped with a mechanism for replacing the polishing pad, the load on the rotation axis and bearings of the polishing table can be reduced.

[0042] [Embodiment 2] According to embodiment 2, embodiment 1 is further provided with a drive source for moving the weight member along the guide member. According to embodiment 2, the drive source can be driven to move the weight member.

[0043] [Embodiment 3] According to Embodiment 3, in Embodiment 2, the weight member is positioned on the second polishing pad holding module side when the amount of polishing pads held in the second polishing pad holding module is less than the amount of polishing pads held in the first polishing pad holding module, and the weight member is positioned on the second polishing pad holding module side when the amount of polishing pads held in the second polishing pad holding module is greater than the amount of polishing pads held in the first polishing pad holding module. This further includes a controller that controls the drive source. According to Embodiment 3, the load on the rotation axis and bearings of the polishing table can be reduced by control by the controller.

[0044] [Embodiment 4] According to Embodiment 4, in Embodiment 3, a displacement meter is provided for detecting the roll diameter of the polishing pad held in at least one of the first polishing pad holding module and the second polishing pad holding module, and the controller acquires the amount of the polishing pad held in at least one of the first polishing pad holding module and the second polishing pad holding module based on the roll diameter of the polishing pad detected by the displacement meter. According to Embodiment 4, the controller can be controlled based on detection by the displacement sensor.

[0045] [Embodiment 5] According to Embodiment 5, in Embodiment 4, the displacement meter includes a first displacement meter for detecting the roll diameter of the polishing pad held in the first polishing pad holding module, and a second displacement meter for detecting the roll diameter of the polishing pad held in the second polishing pad holding module. The first displacement meter detects a first position located in the end region on one end of the rolled polishing pad, and the second displacement meter detects a second position located in the end region on the other end of the rolled polishing pad. According to Embodiment 5, the controller can be controlled based on the detections by the first and second displacement meter.

[0046] [Embodiment 6] According to Embodiment 6, in Embodiments 1 to 5, the first polishing pad holding module has a first motor as a drive source for supplying the polishing pad wound in a roll, and the second polishing pad holding module has a second motor as a drive source for winding up the polishing pad wound in a roll. The first motor and the second motor are configured to rotate integrally with the table and are positioned at a point-symmetric position with respect to the axis of rotation of the table when viewed in a direction perpendicular to the polishing pad holding surface. According to Embodiment 6, the load acting on the rotation axis or bearing of the polishing table due to the weight of the first motor and the second motor can be reduced.

[0047] [Form 7] According to Form 7, in Forms 1 to 6, the first tension roller is configured to be rotatable integrally with the table and has a rotation axis arranged along the first side of the polishing pad holding surface, on which the polishing pad is placed; and the second tension roller is configured to be rotatable integrally with the table and has a rotation axis arranged along the second side of the polishing pad holding surface that is opposite to the first side, on which the polishing pad is placed.

[0048] [Embodiment 8] According to Embodiment 8, in Embodiments 1 to 7, the polishing pad holding surface has suction holes that are connected to a vacuum source. According to Embodiment 8, the polishing pad can be vacuum-adsorbed to the polishing pad holding surface.

[0049] The embodiments of the present invention and their respective modifications have been described above. It goes without saying that the examples described above are for the purpose of facilitating understanding of the present invention and do not limit it. The present invention can be modified and improved as appropriate without departing from its spirit, and equivalents thereof are included in the present invention. Furthermore, any combination or omission of the components described in the claims and specification is possible to the extent that at least a part of the above-described problems can be solved or at least a part of the effects can be achieved. As an example, the drive control of the first motor 130 and the second motor 230 described in the second embodiment can be applied to other embodiments. [Explanation of Symbols]

[0050] 30, 30B, 30C… Polishing Tables 31… Polishing table body 31a…Cooling groove 32... Tabletop 35…Weight adjustment module 38…motor 40…Top ring 91...Vacuum source 92...Fluid supply source 100... Supply Roll 110...First centering roller 120...First tension roller 130...First motor 140...First displacement sensor 150…Drive mechanism 200... Reel roll 210... Second centering roller 220...Second tension roller 230... Second motor 240... Second displacement gauge 310...First polishing pad holding module 320...Second polishing pad holding module 328…Suction hole 352... Guide member 354...Weight component 356... Power source 900... Controller 1000...polishing equipment C1…center axis P1... Polishing pad SP... Sub-pad SP1... Polishing pad holding surface WF... Circuit board

Claims

1. A polishing apparatus for polishing a substrate using a polishing pad, A polishing table configured to rotate and defining a polishing pad holding surface for holding the polishing pad, First and second polishing pad holding modules are configured to be rotatable integrally with the polishing table and to hold the polishing pad wound in a roll, wherein the polishing pad supplied from the first polishing pad holding module is wound onto the second polishing pad holding module, causing the polishing pad to slide along the polishing pad holding surface, A weight adjustment module having a guide member extending in a direction in which the polishing pad slides along the polishing pad holding surface, and a weight member configured to be movable along the guide member, A polishing device equipped with the following features.

2. The polishing apparatus according to claim 1, further comprising a drive source for moving the weight member along the guide member.

3. The polishing apparatus according to claim 2, further comprising a controller for controlling the drive source such that the weight member is positioned toward the second polishing pad holding module when the amount of polishing pads held in the second polishing pad holding module is less than the amount of polishing pads held in the first polishing pad holding module, and the weight member is positioned toward the second polishing pad holding module when the amount of polishing pads held in the second polishing pad holding module is greater than the amount of polishing pads held in the first polishing pad holding module.

4. The first polishing pad holding module and the second polishing pad holding module are equipped with a displacement meter for detecting the roll diameter of the polishing pad held in at least one of them, The controller acquires the amount of polishing pad held in at least one of the first polishing pad holding module and the second polishing pad holding module based on the roll diameter of the polishing pad detected by the displacement meter. The polishing apparatus according to claim 3.

5. The displacement meter includes a first displacement meter for detecting the roll diameter of the polishing pad held in the first polishing pad holding module, and a second displacement meter for detecting the roll diameter of the polishing pad held in the second polishing pad holding module. The first displacement sensor detects a first position located in the end region of one end of the rolled polishing pad, The second displacement sensor detects a second position located in the end region on the other end of the rolled polishing pad. The polishing apparatus according to claim 4.

6. The first polishing pad holding module has a first motor as a drive source for supplying the polishing pad wound in a roll shape, The second polishing pad holding module has a second motor as a drive source for winding up the polishing pad which is wound in a roll shape, The first motor and the second motor are configured to rotate integrally with the polishing table and are positioned so as to be point-symmetric with respect to the axis of rotation of the polishing table when viewed in a direction perpendicular to the polishing pad holding surface. The polishing apparatus according to any one of claims 1 to 5.

7. A first tension roller configured to be rotatable integrally with the polishing table, having a rotation axis positioned along the first side of the polishing pad holding surface, on which the polishing pad is placed; A second tension roller configured to be rotatable integrally with the polishing table, having a rotation axis positioned along the second side opposite to the first side of the polishing pad holding surface, on which the polishing pad is placed; Equipped with, The polishing apparatus according to any one of claims 1 to 5.

8. The polishing apparatus according to any one of claims 1 to 5, wherein the polishing pad holding surface has adsorption holes that are connected to a vacuum source.

Images