Polishing apparatus and polishing method

Abstract

To position the polishing pad smoothly, efficiently, and reproducibly in the correct location. [Solution] The polishing apparatus includes a first drive unit that drives the rotation of a supply roll to supply the polishing pad, which is wound on a supply roll, to the pad placement surface on the upper side of the polishing table; a second drive unit that drives the rotation of a winding roll to wind the polishing pad, which has passed over the polishing table, onto a winding roll; and a control unit. When supplying the polishing pad to the pad placement surface, the control unit controls the first drive unit to rotate the supply roll so that the polishing pad is fed at a set feed rate, and controls the second drive unit to rotate the winding roll with the aim of winding the polishing pad at a winding speed greater than the feed rate, while limiting the torque of the second drive unit to less than or equal to a torque limit value.

Description

Technical Field

[0001] The present invention relates to a polishing apparatus and a polishing method.

Background Art

[0002] In the manufacturing process of semiconductor devices, planarization technology for the surface of semiconductor devices is becoming increasingly important. As a planarization technology, chemical mechanical polishing (CMP) is known. In this chemical mechanical polishing, a polishing apparatus is used to supply a polishing liquid (slurry) containing abrasive grains such as silica (SiO₂) and / or ceria (CeO₂) to a polishing pad, while a substrate such as a semiconductor wafer is brought into sliding contact with the polishing pad to perform polishing.

[0003] A polishing apparatus having a polishing pad that is wound around one of a pair of rolls, taken up by the other, and travels along the upper surface of a polishing table or the like has been proposed (see Patent Documents 1 to 4).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Summary of Invention

Problems to be Solved by the Invention

[0005] In the polishing apparatus described above, it is desirable to position the polishing pad smoothly, efficiently, and reproducibly in the appropriate position relative to the polishing table. Patent Document 1 discloses that the tension of the polishing pad can be adjusted by adjusting the rotational speed of the winding roll and the winding roll.

[0006] The present invention has been made in view of the above circumstances, and one of its objectives is to provide a polishing apparatus or polishing method that can smoothly, efficiently, and reproducibly position a polishing pad in an appropriate position relative to a polishing table. [Means for solving the problem]

[0007] According to one embodiment of the present invention, the polishing apparatus comprises a polishing table for supporting a polishing pad, a first drive unit for driving the rotation of the supply roll to supply the polishing pad, which is wound on a supply roll, to a pad placement surface on the upper side of the polishing table, a second drive unit for driving the rotation of the winding roll to wind the polishing pad, which has passed over the polishing table, onto a winding roll, and a control device for controlling the first drive unit and the second drive unit, and is a polishing apparatus that polishes an object by bringing the polishing pad into contact with the object, wherein the control device is configured to control the first drive unit when supplying the polishing pad to the pad placement surface, to rotate the supply roll so as to feed the polishing pad at a set feed speed, and to control the second drive unit, to rotate the winding roll with the aim of winding the polishing pad at a winding speed greater than the feed speed, while limiting the torque of the second drive unit to less than or equal to the torque limit value.

[0008] According to another embodiment of the present invention, the polishing method comprises a polishing table for supporting a polishing pad and a pad wound on a supply roll on the pad placement surface above the polishing table. A polishing method for polishing an object by bringing the polishing pad into contact with the object, using a polishing apparatus comprising: a first drive unit for driving the rotation of the supply roll for supplying; and a second drive unit for driving the rotation of the winding roll for winding the polishing pad that has passed over the polishing table onto the winding roll, wherein, when supplying the polishing pad to the pad placement surface, the first drive unit rotates the supply roll so that the polishing pad is fed at a set feed rate, and the second drive unit rotates the winding roll with the aim of feeding the polishing pad at a winding speed greater than the feed rate, while limiting the torque of the second drive unit to less than or equal to the torque limit value. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic side view showing the configuration of a polishing apparatus according to one embodiment. [Figure 2] This is a schematic plan view showing the configuration of a polishing apparatus according to one embodiment. [Figure 3] This is a side view showing the first supply-side roller. [Figure 4] This is a schematic side view of a polishing apparatus to illustrate the supply of polishing pads. [Figure 5] This is a schematic side view of the polishing apparatus, showing the radius of the supply roll and the radius of the winding roll. [Figure 6] This is a conceptual diagram showing an example of a contact-type displacement sensor. [Figure 7] This is a schematic side view of a polishing apparatus showing an imaging device. [Figure 8] This is an enlarged cross-sectional view of a polishing table, schematically showing the flow path from the pad placement surface. [Figure 9A] This is a schematic diagram showing one step in the process of placing a polishing pad on the pad placement surface. [Figure 9B] This is a schematic diagram showing one step in the process of placing a polishing pad on the pad placement surface. [Figure 9C] This is a schematic diagram showing one step in the process of placing a polishing pad on the pad placement surface. [Figure 9D] This is a schematic diagram showing one step when arranging the polishing pad on the pad arrangement surface. [Figure 10A] This is a schematic diagram showing one step of the feeding operation of the polishing pad. [Figure 10B] This is a schematic diagram showing one step of the feeding operation of the polishing pad. [Figure 10C] This is a schematic diagram showing one step of the feeding operation of the polishing pad. [Figure 10D] This is a schematic diagram showing one step of the feeding operation of the polishing pad. [Figure 10E] This is a schematic diagram showing one step of the feeding operation of the polishing pad. [Figure 10F] This is a schematic diagram showing one step of the feeding operation of the polishing pad. [Figure 10G] This is a schematic diagram showing one step of the feeding operation of the polishing pad. [Figure 11] This is a flowchart showing the flow of the polishing method according to one embodiment. [Figure 12] This is a schematic side view of the polishing apparatus for explaining the detection of the remaining amount of the supply roll. [Figure 13] This is a schematic side view of the polishing apparatus for explaining the detection of cutting of the polishing pad. [Figure 14] This is a schematic side view of the polishing apparatus for explaining the detection of sticking of the polishing pad. [Figure 15] This is a schematic diagram for explaining the setting of the tension of the polishing pad. [Figure 16] This is a schematic diagram for explaining the setting of the tension of the polishing pad. [Figure 17] This is a flowchart showing the flow of an example of the setting of the tension of the polishing pad. [Figure 18A] This is a schematic plan view of the polishing pad. [Figure 18B] This is a schematic plan view showing the alignment between the through-hole of the polishing pad and the supply hole of the pad arrangement surface. [Figure 19] This is a schematic plan view showing another example of the alignment between the through-hole of the polishing pad and the supply hole of the pad arrangement surface. [Figure 20]This is a schematic side view showing an example of cover arrangement in a polishing apparatus. [Figure 21] This is a schematic plan view of a polishing apparatus, showing a general example of a grinding fluid reservoir. [Figure 22] This is a schematic side view of a polishing apparatus to illustrate the replacement of the supply roll. [Figure 23] This is a plan view of the jig. [Figure 24] This is a side view of the jig. [Figure 25] This is a schematic diagram showing how to use the jig. [Figure 26] This is a schematic side view of a polishing apparatus showing a lateral atomizer. [Modes for carrying out the invention]

[0010] Embodiments of the present invention will be described below with reference to the accompanying drawings. In the accompanying drawings, identical or similar elements are denoted by identical or similar reference numerals, and redundant descriptions of identical or similar elements may be omitted in the description of each embodiment. Furthermore, the features shown in each embodiment are applicable to other embodiments insofar as they do not contradict each other.

[0011] In this specification, "substrate" includes not only semiconductor substrates, glass substrates, liquid crystal substrates, and printed circuit boards, but also magnetic recording media, magnetic recording sensors, mirrors, optical elements, micro-mechanical elements, or partially fabricated integrated circuits, and any other object to be processed. Substrates include any shape, including polygons and circles.

[0012] Figure 1 is a schematic side view showing a polishing apparatus 1000 according to one embodiment of the present disclosure. Figure 2 is a schematic plan view of the polishing apparatus 1000 including the polishing table 30. The polishing apparatus 1000 has the function of polishing a substrate WF such as a wafer, for example. As shown in Figure 1, the polishing apparatus 1000 includes, for example, a polishing table 30, a top ring 40, and a control device 900.

[0013] The polishing table 30, for example, has a substantially T-shape in a side view (see Figure 1) and a rectangular shape in a top view (see Figure 2). The polishing table 30 comprises a polishing table body 31 and a tabletop 32 that defines the upper surface on which the sub-pad SP is placed. The polishing table 30 is configured to be able to suck up the polishing pad P1 through the suction holes of the sub-pad SP placed on the tabletop 32. The polishing table 30 supports the polishing pad P1 for polishing the substrate WF via the sub-pad SP.

[0014] The material of the sub-pad SP is not particularly limited as long as it can be polished to the desired precision, and known materials can be used. For example, the sub-pad SP has a roughly rectangular shape and is made of resin or nonwoven fabric. The sub-pad SP can be attached to the tabletop 32 with an adhesive or the like. The sub-pad SP is a consumable item and can be replaced at the desired time.

[0015] The polishing pad P1 is placed on the pad placement surface S1, which is the upper surface of the sub-pad SP, and is attracted through the sub-pad suction hole SP8 (Figure 8), which opens into the pad placement surface S1 (described later). The upper surface of the polishing pad P1 opposite to the side where the sub-pad SP is placed forms a polishing surface for polishing the substrate WF. In other words, the polishing pad P1 is supplied and placed on the pad placement surface S1 on the upper side of the polishing table 30. In addition, four supply holes 37 for supplying polishing fluid such as slurry are provided near the center of the polishing table 30 (see Figure 2).

[0016] The sub-pad SP and polishing pad P1 are provided with holes at positions corresponding to the four supply holes 37. This allows polishing fluid to be supplied to the polishing surface of the polishing pad P1 from the four supply holes 37 during polishing of the substrate WF. This configuration allows for suitable supply of polishing fluid when the substrate WF continues to cover the center of the polishing surface during polishing. In the example in Figure 2, the contour of the polishing surface is shown by a dashed line R1, and the contour of the substrate WF during polishing is illustrated by a dashed line. In the polishing apparatus 1000, the polishing pad P1 slides above the polishing table 30. As will be described later, the polishing apparatus 1000 can move the polishing pad P1 so that the through holes in the polishing pad P1 coincide with the four supply holes 37. The number of supply holes 37 is not particularly limited and may be 1-3 or 5 or more. Furthermore, in another embodiment of this disclosure, the polishing fluid is supplied not from the supply holes 37, but from a polishing fluid supply port such as a nozzle located above the polishing pad P1. The polishing device 1000 may be configured to supply polishing fluid to the polishing pad P1. That is, the polishing device 1000 may have a polishing fluid supply port for supplying polishing fluid to the polishing pad P1. The size of the substrate WF is not particularly limited and may be less than half the size of the polishing surface.

[0017] The polishing table 30 is driven by a motor (not shown) and is configured to rotate around a central axis C1 (Figure 1). Such a motor may, for example, be located below the polishing table 30 and rotatably support it. The central axis C1 may, for example, extend vertically.

[0018] The top ring 40 is positioned above the polishing table 30 so as to be able to move up and down. The top ring 40 is configured to detachably hold the substrate WF, which is the object to be polished, with the surface to be polished facing downwards. Furthermore, the top ring 40 is configured to be rotatable about a central axis C2. For example, the central axis C2 extends in the vertical direction. In other words, the central axis C2 extends in the same direction as the central axis C1. During polishing, polishing fluid is supplied to the polishing surface of the polishing pad P1 from the supply hole 37, and the substrate WF is pressed against the polishing surface of the polishing pad P1 by the top ring 40 and polished. The pressing by the top ring 40 may be mechanically applied by driving a drive device such as a motor, or it may be applied by an airbag filled with pressurized gas. In this way, the polishing apparatus 1000 is configured to polish the substrate WF by bringing the polishing pad P1 and the substrate WF into contact and causing them to rotate relative to each other in the presence of polishing fluid.

[0019] Furthermore, the polishing apparatus 1000 may include, as an example, an atomizer (not shown). The atomizer has the function of removing polishing liquid, polishing products, polishing pad residue from the dressing, etc., from the polishing surface by supplying a mixed fluid of liquid (e.g., pure water) and gas (e.g., nitrogen gas) or liquid (e.g., pure water) to the polishing surface.

[0020] As shown in Figure 1, the polishing apparatus 1000 includes a supply roll holding member 310 and a winding roll holding member 320. The supply roll holding member 310 and the winding roll holding member 320 can be positioned below the protruding portions on both sides of the T-shaped polishing table 30.

[0021] The supply roll holding member 310 rotatably holds the supply roll 100 to feed out the polishing pad P1. The supply roll holding member 310 is configured to rotate about a central axis C1, integrally with the polishing table 30. The supply roll 100 is, for example, a roll-shaped pad in which an unused polishing pad P1 for supply is wound in a roll shape. The end of the polishing pad P1 is fixed to the rotating shaft of the supply roll 100. The polishing device 1000 and the supply roll 100 constitute the polishing system 1100. The supply roll holding member 310 can hold the supply roll 100 with its rotating shaft extending horizontally. The form of the supply roll holding member 310 is not particularly limited as long as it can rotatably hold the supply roll 100, and may be, for example, a support base that rotatably supports the rotating shaft of the supply roll 100. The supply roll holding member 310 may have a cover to protect the supply roll 100. The supply roll holding member 310 may be a case that houses the supply roll 100.

[0022] The winding roll holding member 320 rotatably holds the winding roll 200 so as to wind up the polishing pad P1. The winding roll holding member 320 is configured to rotate integrally with the polishing table 30 about a central axis C1. The winding roll 200 is, for example, a roll-shaped pad in which a used polishing pad P1 that has passed over the polishing table 30 is wound into a roll. The winding roll holding member 320 can hold the winding roll 200 with its rotation axis extending horizontally. The embodiment of 320 is not particularly limited as long as it can rotatably hold the winding roll 200, and may be, for example, a support base that rotatably supports the rotating shaft of the winding roll 200. The winding roll holding member 320 may have a cover to protect the winding roll 200. The winding roll holding member 320 may also be a case that houses the winding roll 200. In the following figures, the supply roll holding member 310 and the winding roll holding member 320 are omitted from the illustration.

[0023] As shown in Figure 1, the polishing device 1000 includes a first supply-side roller 110, a second supply-side roller 120, a first winding-side roller 210, and a second winding-side roller 220, all configured to guide the polishing pad P1. The first supply-side roller 110 and the second supply-side roller 120 are rollers that contact the polishing pad P1 delivered from the supply roll 100 before it reaches the pad placement surface S1 or above it. In other words, the first supply-side roller 110 and the second supply-side roller 120 are configured to contact the polishing pad P1 from the supply roll 100 up to above the polishing table 30. The first winding-side roller 210 and the second winding-side roller 220 are rollers that contact the polishing pad P1 after it has passed above the pad placement surface S1 before it is wound onto the winding roll 200.

[0024] Figure 3 is a side view showing the first supply-side roller 110. The first supply-side roller 110 extends in the direction of its long axis, but has a shape in which its outer diameter increases towards its center. The polishing pad P1 contacts the first supply-side roller 110 at an angle with respect to the direction in which the first supply-side roller 110 extends. This makes it difficult for the polishing pad P1 to shift in the direction in which the first supply-side roller 110 extends, and prevents it from meandering. The first supply-side roller 110 is positioned diagonally below the supply roll 100 such that its axis of rotation extends in a substantially horizontal direction. By positioning the first supply-side roller 110 below the supply roll 100, it is possible to suppress the polishing fluid on the polishing surface from traveling along the polishing pad P1 to the supply roll 100 and adversely affecting the supply roll 100.

[0025] The first winding-side roller 210 is positioned diagonally below the winding roll 200 such that its axis of rotation extends almost horizontally. The first winding-side roller 210 may have the same shape as the first supply-side roller 110, or it may be cylindrical. By positioning the first winding-side roller 210 below the winding roll 200, it is possible to suppress the polishing fluid on the polishing surface from traveling along the polishing pad P1 to the winding roll 200 and adversely affecting the winding roll 200.

[0026] The second supply-side roller 120 is a roller positioned above the first supply-side roller 110. The second winding-side roller 220 is a roller positioned above the first winding-side roller 210. The second supply-side roller 120 and the second winding-side roller 220 are positioned along the upper surface of the polishing table 30 or the pad placement surface S1, and to the side of the upper surface of the polishing table 30 or the pad placement surface S1. As will be described later, when a predetermined tension is applied to the polishing pad P1, the polishing pad P1 is configured to extend between the second supply-side roller 120 and the second winding-side roller 220 substantially parallel to the pad placement surface S1. At this time, a gap is formed between the polishing pad P1 and the pad placement surface S1, and this gap is wide enough so that the polishing pad P1 is attracted to the pad placement surface S1 by suction through the suction holes of the sub-pad SP. From the viewpoint of stretching the polishing pad P1 horizontally, the second supply-side roller 120 and the second winding-side roller 220 are preferably cylindrical.

[0027] In the polishing apparatus 1000, the direction of movement of the polishing pad P1 supplied from the supply roll 100 is changed by the first supply side roller 110 and the second supply side roller 120 as shown by the arrows in Figure 1. The polishing pad P1 is then placed on the upper surface of the polishing table 30 or the pad placement surface S1 The polishing pad P1 slides horizontally along the surface. Then, the direction of movement of the polishing pad P1 is changed by the second winding roller 220 and the first winding roller 210. The polishing pad P1 is then wound onto the winding roll 200. In this way, the polishing device 1000 is configured so that the polishing pad P1 can slide above the polishing table 30. Therefore, in the polishing device 1000, the used and deteriorated portion of the polishing pad P1 is slid and replaced with an undeteriorated portion. The sliding and replacement of the polishing pad P1 may be performed each time a predetermined number of substrates WF are polished, or it may be performed each time a substrate WF is polished. The amount by which the polishing pad P1 is slid may be such that only a portion of the used polishing surface is renewed, or it may be slid all over so that the entire used polishing surface above the pad placement surface S1 is renewed. For example, after polishing each substrate WF, the polishing pad P1 may be shifted by a distance shorter than the length of the pad placement surface S1 along the direction of movement of the polishing pad P1, for example, by a distance shorter than half or one-third of that length.

[0028] The control device 900 (Figure 1) includes at least one information processing device, such as a general-purpose computer or a dedicated computer. At least a portion of the data processed by the control device 900 may be stored on a remote server or the like. The control device 900 includes an arithmetic unit 910, a memory 920, and a storage device 930. The arithmetic unit 910 includes a processor such as a central processing unit (CPU). The storage device 930 includes a non-volatile storage medium such as a solid-state drive and can store a program that controls the supply of the polishing pad P1, etc. This program may be obtained from a recording medium such as a DVD-ROM, or obtained via a network. The arithmetic unit 910 performs various processes by reading the program stored in the storage device 930, etc., into the memory 920 and executing it. The physical configuration of the control device 900 is not particularly limited, as long as it can be controlled by the control device 900.

[0029] As shown in Figure 4, the polishing apparatus 1000 further comprises a first drive unit 130 that drives the rotation of the supply roll 100 and a second drive unit 230 that drives the rotation of the winding roll 200. The first drive unit 130 and the second drive unit 230 are controlled by a control device 900.

[0030] The first drive unit 130 drives the rotation of the supply roll 100 in order to supply the polishing pad P1 wound around the supply roll 100 to the pad placement surface S1 on the upper side of the polishing table 30. The first drive unit 130 includes a motor and is configured so that the rotational speed of the supply roll 100 can be controlled by the control device 900. Hereinafter, "rotational speed" refers to the angular velocity of rotation. In particular, if the torque is not limited, the control device 900 controls the first drive unit 130 so that the supply roll 100 rotates at the set rotational speed. Preferably, the first drive unit 130 is connected to the rotational shaft of the supply roll 100 by a component that transmits rotational force, such as a timing belt. The first drive unit 130 can be located below the protruding portions on both sides of the T-shaped polishing table 30. In addition, the rotational shaft of the supply roll 100 and the first drive unit 130 may be directly connected in order to eliminate mechanical losses such as timing belts and pulleys. Although the device becomes larger because the first drive unit 130 protrudes outside the polishing table, it has the advantage of improving the precision of tension control of the polishing pad P1.

[0031] The second drive unit 230 drives the rotation of the winding roll 200 in order to wind the polishing pad P1 that has passed over the polishing table 30 onto the winding roll 200. The second drive unit 230 includes a motor and is configured so that the rotational speed of the winding roll 200 can be controlled by the control device 900. Preferably, the second drive unit 230 is connected to the rotating shaft of the winding roll 200 by a component that transmits rotational force, such as a timing belt. The second drive unit 230 is located below the protruding portions that extend out on both sides of the T-shaped polishing table 30. This is possible. Furthermore, from the viewpoint of eliminating mechanical losses such as timing belts and pulleys, and improving the accuracy of tension control of the polishing pad P1, the rotating shaft of the winding roll 200 and the second drive unit 230 may be directly connected.

[0032] Furthermore, the control device 900 sets a torque limit value, which is an upper limit on the torque when the second drive unit 230 rotates the winding roll 200. The control device 900 controls the rotational speed of the second drive unit 230 with torque below the torque limit value. Therefore, if the winding speed of the winding roll 200 set by the control of the second drive unit 230 is faster than the feed speed of the supply roll 100 set by the control of the first drive unit 130, the supply roll 100 will rotate at the feed speed set by the first drive unit 130, which has no torque limit. In the following, unless otherwise specified, the torque limit value refers to the torque limit value for the second drive unit 230.

[0033] When supplying a polishing pad P1 to the pad placement surface S1, the control device 900 controls the first drive unit 130 to rotate the supply roll 100 so that the polishing pad P1 is fed at a set feed speed, and simultaneously controls the second drive unit 230 to rotate the winding roll 200 with the goal of winding the polishing pad P1 at a winding speed greater than the feed speed, while limiting the torque of the second drive unit 230 to less than or equal to the torque limit value. The torque of the first drive unit 130 can be greater than the torque limit value of the second drive unit 230. Hereinafter, the torque of the first drive unit 130 will be referred to as the first torque, and the torque of the second drive unit 230 will be referred to as the second torque. Note that "supplying a polishing pad P1 to the pad placement surface S1" means sending the polishing pad P1 from the supply roll 100 and moving the polishing pad P1 that is not being used for polishing on the pad placement surface upwards on the pad placement surface S1.

[0034] Figure 4 is a schematic side view illustrating the supply of the polishing pad P1 to the pad placement surface S1 in this embodiment. The control device 900 drives the supply roll 100 to rotate at a first rotational speed W1 by the first drive device 130 in order to achieve the set feed rate V1. The feed rate V1 is the product of the first rotational speed W1 and the radius R100 of the supply roll 100 (Figure 5). Since there is no first torque limit on the first drive device 130 and the second torque of the second drive device 230 is limited to a torque limit value, the supply roll 100 is driven by the first drive device 130 and rotates at the first rotational speed W1, feeding the polishing pad P1 at the feed rate V1.

[0035] On the other hand, the second drive unit 230 attempts to rotate the winding roll 200 at a winding speed greater than the feed speed V1, but can only increase the second torque up to the torque limit value. Therefore, the second drive unit 230 applies a second torque AT2 corresponding to the torque limit value to the winding roll 200, and rotates the winding roll 200 at a second rotational speed W2 corresponding to a winding speed equal to the feed speed V1. The winding speed is the product of the second rotational speed and the radius R200 of the winding roll 200 (Figure 5). Under the control of the control device 900, the first drive unit 130 applies a first torque AT1 to the supply roll 100 in the opposite direction to the direction of rotation of the supply roll 100, in order to counteract the second torque AT2 corresponding to the torque limit value, so that the feed speed V1 of the supply roll 100 does not increase due to being pulled by the winding roll 200.

[0036] The second torque AT2 and the first torque AT1, which correspond to the torque limit value, provide tension to the polishing pad P1. The control device 900 can adjust the tension to the polishing pad P1 by setting the torque limit value of the second drive device 230. It is preferable that the control device 900 applies a substantially constant tension to the polishing pad P1 and supplies the polishing pad P1 to the pad placement surface S1 at a substantially constant speed.

[0037] In this embodiment, the control device 900 controls the first drive unit 130 and the second drive unit 230 This type of control allows the polishing pad P1 to be supplied at a desired speed while applying appropriate tension to it. Therefore, the polishing pad P1 can be smoothly, efficiently, and reproducibly positioned in the correct location on the polishing table 30. This contributes to stable polishing and efficient replacement of the polishing pad P1.

[0038] The control device 900 can set the first rotational speed W1 of the supply roll 100 based on at least one of the measured radius R100 of the supply roll 100 and the measured radius R200 of the winding roll 200. The feed rate V1 of the polishing pad P1 is the product of the first rotational speed W1 and the radius R100 of the supply roll 100. Therefore, by setting the first rotational speed W1 based on the measured radius R100 of the supply roll 100, the polishing pad P1 can be fed at an appropriate feed rate V1. The sum of the amount of polishing pad P1 on the supply roll 100 and the amount of polishing pad P1 on the winding roll 200 can be stored in advance in a storage device 930 or the like as the amount of polishing pad P1 on a supply roll 100 that is not being used at all. The thickness of the polishing pad P1 may be stored in advance in a storage device 930 or the like, or it may be calculated from the feed rate of the supply roll 100 or the winding rate of the winding roll 200 and the change in the radius R100 of the supply roll 100 or the radius R200 of the winding roll 200. The feed rate of the supply roll 100 or the winding rate of the winding roll 200 can be calculated based on the integration of the feed speed or the winding speed. Alternatively, a proximity sensor placed on or near the polishing table 30 may detect that the supply roll 100 or the winding roll 200 has rotated each time it completes one revolution, and the feed rate or winding rate may be calculated based on the output from the proximity sensor. Therefore, if one of the radii R100 of the supply roll 100 or the radius R200 of the winding roll 200 is known, the other can also be calculated, and the first rotation speed W1 can be set based on the measured radius R200 of the winding roll 200.

[0039] The control device 900 can set the torque limit value based on at least one of the measured radius R100 of the supply roll 100 and the measured radius R200 of the winding roll 200. The second torque AT2 corresponding to the torque limit value can be approximated by the product of the tension of the polishing pad P1 and the radius R200 of the winding roll 200 (Figure 5). Therefore, by deriving or setting the torque limit value based on the measured radius R200 of the winding roll 200, the appropriate tension can be applied to the polishing pad P1 with greater precision.

[0040] Figure 5 is a conceptual diagram showing an example of a method for measuring the radius R100 of the supply roll 100 and the radius R200 of the winding roll 200. The polishing apparatus 1000 includes a first displacement meter 140 for measuring the radius R100 of the supply roll 100 and a second displacement meter 240 for measuring the radius R200 of the winding roll 200. In the example in Figure 5, the first displacement meter 140 is a laser displacement meter and is configured to measure the radius R100 of the supply roll 100 by measuring the radial displacement of the outer surface of the polishing pad P1 on the supply roll 100 from the center of the winding of the polishing pad P1. The second displacement meter 240 is a laser displacement meter and is configured to measure the radius R200 of the winding roll 200 by measuring the radial displacement of the outer surface of the polishing pad P1 on the winding roll 200 from the center of the winding of the polishing pad P1. By measuring the radius R100 or radius R200 using a laser displacement meter, it is possible to prevent the displacement meter from contacting the supply roll 100 or the winding roll 200 and causing adverse effects. By measuring both the radius R100 of the supply roll 100 and the radius R200 of the winding roll 200, the torque limit value and the rotational speed of the supply roll 100 and the winding roll 200 can be set more precisely. Alternatively, only one of the radii R100 of the supply roll 100 or the radius R200 of the winding roll 200 may be measured using the first displacement meter 140 or the second displacement meter 240.

[0041] The control device 900 calculates the radius R100 of the supply roll 100 based on the signal or data of the displacement of the supply roll 100 obtained by the first displacement gauge 140, and stores it in the storage device 930, etc. It can be stored in a memory device. Similarly, the control device 900 can calculate the radius R200 of the winding roll 200 based on the signal or data of the displacement of the winding roll 200 obtained by the second displacement gauge 240 and store it in a memory device 930 or the like.

[0042] Figure 6 is a conceptual diagram showing another example of a method for measuring the radius R100 of the supply roll 100 and the radius R200 of the winding roll 200. In this example, the first displacement meter 140A is composed of a contact-type displacement meter. The first displacement meter 140A comprises a displacement meter body 141, a movable member 142, and a contact element 143. The movable member 142 is extended and retractable to the displacement meter body 141, and the contact element 143 is rotatably connected to the movable member 142 at the end of the movable member 142 in the extension and retraction direction. The first displacement meter 140A is configured to measure the displacement of the outer surface of the supply roll 100 by the movement of the movable member 142 due to the contact of the contact element 143 with the supply roll 100. The rotation of the contact element 143 suppresses adverse effects on measurement, such as the movable member 142 moving in an unintended direction due to friction of the rotating supply roll 100, and allows for more accurate measurement of the radius R100 of the supply roll 100 while supplying the polishing pad P1. In optical measurements, the measurement accuracy may be degraded by grooves on the surface of the polishing pad P1, but in a contact-type displacement meter, this risk can be eliminated by making the contact element 143 sufficiently larger than the grooves. Also, in optical measurements, the measurement accuracy may be degraded by the transparency of the polishing pad P1, but this risk can be eliminated in a contact-type displacement meter. The first displacement meter 140A described above may be used as the second displacement meter 240. Furthermore, in order to reduce the deterioration of measurement accuracy due to grooves in the polishing pad P1, the supply roll 100 may be wound so that the polishing surface is on the inside.

[0043] Figure 7 is a conceptual diagram showing yet another example of a method for measuring the radius R100 of the supply roll 100 and the radius R200 of the winding roll 200. In this example, the first displacement sensor 140B is configured as an imaging device (first imaging device) for capturing an image of the supply roll 100. The first displacement sensor 140B is preferably positioned to capture an image including dimensions perpendicular to the rotation axis of the supply roll 100. The second displacement sensor 240B is configured as an imaging device for capturing an image of the winding roll 200. The second displacement sensor 240B is preferably positioned to capture an image including dimensions perpendicular to the rotation axis of the winding roll 200. The imaging data (first imaging data) obtained by imaging with the first displacement sensor 140B is transmitted to the control device 900 and can be stored in the storage device 930, etc. The imaging data obtained by imaging with the second displacement sensor 240B is transmitted to the control device 900 and can be stored in the storage device 930, etc.

[0044] The control device 900 can derive the radius R100 of the supply roll 100 from imaging data obtained by imaging with the first displacement sensor 140B. For example, the control device 900 can extract image features from the imaging data, calculate the width of the supply roll 100 in the direction perpendicular to the rotation axis, and set half of that width as the radius R100. Similarly, the control device 900 can derive the radius R200 of the winding roll 200 from imaging data obtained by imaging with the second displacement sensor 240B. The polishing device 1000 can measure the radius R100 of the supply roll 100 or the radius R200 of the winding roll 200 with a simple configuration by including an imaging device that captures images of the supply roll 100 or the winding roll 200.

[0045] The control device 900 may also derive the radius R100 of the supply roll 100 or the radius R200 of the winding roll 200 based on the ratio of the torques of the first drive unit 130 and the second drive unit 230 when a constant torque is applied to the drive units 130 and 230 that drive the other, while preventing one of the supply roll 100 and the winding roll 200 from rotating. In the example in Figure 4, the control device 900 controls the first drive unit 130 so that the supply roll 100 does not rotate, in other words, so that the first rotational speed W1 becomes 0. An arbitrary torque limit value is set for the second torque AT2 as appropriate. At this time, the second torque AT2 is set relative to the first torque AT1. The ratio of the two torques AT2 is based on the reciprocal of the ratio of the radius R200 of the winding roll 200 to the radius R100 of the supply roll 100. Therefore, the control device 900 can derive the radius R100 of the supply roll 100 and the radius R200 of the winding roll 200 based on the ratio of the second torque AT2 to the first torque AT1, the total length of the polishing pad P1 before the start of supplying the polishing pad P1 on the supply roll 100, and the thickness of the polishing pad P1, etc. This makes it possible to derive the radius R100 of the supply roll 100 and the radius R200 of the winding roll 200 without installing the first displacement meter 140 and the second displacement meter 240. In this case, since the accuracy of torque measurement decreases during the feeding operation of the polishing pad P1, the radius R100 may be calculated by subtracting the contribution of the supplied polishing pad P1 to the radius R100 from the radius R100 of the supply roll 100 calculated when the supply of the polishing pad P1 stops. The same applies to the radius R200 of the winding roll 200 during the feeding operation.

[0046] The control device 900 may set a torque limit value based on correlation data showing the correlation between the torque of the second drive device 230 and the tension applied to the polishing pad P1. In the correlation data, the second torque and the tension applied to the polishing pad P1 are associated for each value of the radius R200 of the winding roll 200. When acquiring the correlation data, the radius R200 of the winding roll 200 is set appropriately, and the tension of the polishing pad P1 can be measured above the polishing table 30 using a load measuring instrument such as a push-pull gauge via the first winding-side roller 210 and the second winding-side roller 220 from the winding roll 200. At this time, the value of the second torque can be changed, and the values ​​of the second torque and tension can be obtained for multiple measurement points. For example, the relationship between the second torque and tension can be obtained by measurement for the maximum radius R200 usable for polishing, the minimum radius R200 usable for polishing, and radii R200 in between these two values. The correlation data obtained in this way can be stored in advance in a storage device 930 or the like.

[0047] As described above, the torque of the second drive unit 230 can be calculated and set by the product of the required tension of the polishing pad P1 and the radius R200 of the winding roll 200, but deviations may occur in practice due to mechanical losses, etc. By setting a torque limit value based on correlation data measured in advance, the appropriate tension can be applied to the polishing pad P1 with greater precision.

[0048] Figure 8 is a schematic cross-sectional view of the polishing table 30 showing a plurality of suction holes 328 formed in the polishing table 30 and a flow path 90 communicating with the plurality of suction holes 328. The polishing table 30 comprises a plurality of suction holes 328 opening in the upper surface 35 of the polishing table 30 and a flow path 90 that is fluidly connected to the plurality of suction holes 328. The plurality of suction holes 328 are through holes that penetrate the tabletop 32 of the polishing table 30 in the thickness direction. The polishing apparatus 1000 may further include a fluid source 92 and a pressure gauge 93 for measuring the pressure of the flow path 90. The flow path 90 may include a valve (not shown) and be configured to selectively fluid-connect the plurality of suction holes 328 to either a vacuum source 91 such as a pump or ejector or a fluid source 92. Alternatively, some of the plurality of suction holes 328 may be fluidly connected to the vacuum source 91 and other parts may be fluidly connected to the fluid source 92. The sub-pad SP has a plurality of sub-pad suction holes SP8 formed at positions corresponding to the plurality of suction holes 328. The sub-pad suction holes SP8 penetrate the plate-shaped sub-pad SP in the thickness direction. The sub-pad SP is arranged on the upper surface 35 of the polishing table 30 such that multiple sub-pad suction holes SP8 overlap with multiple suction holes 328 along the upper surface 35.

[0049] When placing the polishing pad P1 on the pad placement surface S1, the control device 900 controls the vacuum source 91 to perform suction. The vacuum source 91 performs suction through a plurality of suction holes 328 and a plurality of sub-pad suction holes SP8 that are fluidly connected to the vacuum source 91, and the polishing pad P1 above the sub-pad SP is vacuum-adsorbed to the pad placement surface S1. When removing the polishing pad P1 from the pad placement surface S1, the control device 900 opens the inside of the flow path 90 to the atmosphere and breaks the vacuum. Alternatively, by introducing fluid from the fluid source 92 into the flow path 90 and injecting the fluid from multiple sub-pad adsorption holes SP8, the separation of the polishing pad P1 from the pad placement surface S1 can be promoted. This injection of fluid is called blowing. The operation of separating the polishing pad P1 by venting to the atmosphere or blowing is called roll pad release. Depending on the combination of polishing pad P1 and sub-pad SP, the ease with which the polishing pad P1 detaches will differ, so whether to vent to the atmosphere or perform a blowing operation can be set according to conditions such as this combination. Alternatively, if detachment of the polishing pad P1 cannot be confirmed, control such as switching from venting to the atmosphere to blowing may be performed. The fluid for blowing contained in the fluid source 92 is not particularly limited as long as polishing can be performed with the desired precision, and can be a gas, a liquid, or both.

[0050] HP operation The polishing apparatus 1000 is configured, for example, to perform an HP (home position) operation as a preparatory operation before polishing the substrate WF. The HP operation will be explained below with reference to Figures 9A to 9D. Figures 9A to 9D are schematic diagrams for illustrating the HP operation. In Figures 9A to 10G, the upward arrow A91 schematically indicates blowing, and the downward arrow A92 schematically indicates suction by the vacuum source 91. Alternatively, the polishing pad P1 may be separated from the pad placement surface S1 by venting to the atmosphere instead of blowing.

[0051] When the polishing device 1000 starts HP operation, the control device 900 causes the polishing table 30 to blow the polishing pad P1 (see Figure 9A). As a result, fluid is sprayed from multiple sub-pad adsorption holes SP8 (Figure 8) toward the polishing pad P1. Consequently, the polishing pad P1 is detached from the pad placement surface S1.

[0052] Next, the control device 900 sets a torque limit value corresponding to the desired tension while keeping the rotation of the supply roll 100 stopped, and drives the rotation of the winding roll 200 by the second drive device 230 (see Figure 9B). At this time, the second drive device 230 cannot wind up the polishing pad P1 due to the torque limit, but tension is applied to the polishing pad P1. At this time, in order to maintain the stopping of the rotation of the supply roll 100, the first drive device 130 applies a first torque to the polishing pad P1 that counteracts the second torque of the second drive device 230. As a result, the polishing pad P1 is stretched taut. Next, the control device 900 causes the polishing table 30 to suck up the polishing pad P1 (see Figure 9C). As a result, the polishing pad P1 adheres to the pad placement surface S1 of the sub-pad SP while being stretched taut.

[0053] Next, the control device 900 stops the second drive device 230 from driving the winding roll 200 (see Figure 9D). After that, the control device 900 may terminate the operation flow. By performing the above operations, the polishing device 1000 can hold the polishing pad P1 in a taut state on the pad placement surface S1. While the polishing pad P1 is attached to the pad placement surface S1, the first torque and the second torque may be applied to the polishing pad P1 to maintain the tension.

[0054] Feed operation Figures 10A to 10G are schematic diagrams illustrating the feeding operation. The feeding operation of the polishing pad P1 by the polishing device 1000 will be explained with reference to Figures 10A to 10G. As an example, the feeding operation starts from the state after the HP operation is completed (see Figure 9D).

[0055] When the polishing device 1000 starts feeding the polishing pad P1, the control device 900 drives a motor (not shown) that drives the rotation of the polishing table 30, causing the polishing table 30 to rotate (see Figure 10A). This causes excess liquid on the polishing pad to move and be removed by centrifugal force. In Figure 10A, the rotation of the polishing table 30 is schematically shown by arrow A10. When the atomizer is spraying liquid onto the polishing surface, the control device 900 controls the polishing table 30 The atomizer is stopped before it starts rotating. The control device 900 then stops the motor that drives the rotation of the polishing table 30.

[0056] Next, the control device 900 causes the polishing pad P1 to blow against the polishing table 30 (see Figure 10B). This causes the polishing pad P1 to peel off from the pad placement surface S1 of the sub-pad SP.

[0057] Next, the control device 900 stops the rotation of the supply roll 100 and drives the second drive unit 230 to rotate the winding roll 200 with a predetermined torque limit value (see Figure 10C). At this time, the second drive unit 230 cannot wind up the polishing pad P1 due to the torque limit, but the polishing pad P1 is stretched taut. In this state, the control device 900 resets the feed amount of the polishing pad P1 to zero.

[0058] Next, the control device 900 drives the first drive device 130 to rotate the supply roll 100 so that the feed speed of the polishing pad P1 remains constant, and starts feeding the polishing pad P1 (see Figure 10D). At this time, under torque limitations, the target winding speed of the winding roll 200 is set to be greater than the feed speed V1 of the supply roll 100. Therefore, the winding roll 200 rotates at a winding speed equal to the feed speed V1 and pulls the polishing pad P1 with a second torque corresponding to the torque limit value. As a result, the polishing pad P1 is fed from the supply roll 100 to the winding roll 200 in a taut state. That is, the feed speed V1 of the supply roll 100 becomes the same as the effective winding speed of the winding roll 200. The torque limit value when starting to feed the polishing pad P1 can be the same as the torque limit value when the feed amount is reset to zero.

[0059] Furthermore, while the polishing pad P1 is being fed from the supply roll 100, it is preferable for the control device 900 to measure the radius R100 of the supply roll 100 and the radius R200 of the winding roll 200 in real time. The control device 900 can calculate the feed amount of the polishing pad P1 from the rotational speed of the first drive device 130 and the radius R100 of the supply roll 100, and calculate the winding amount from the rotational speed of the second drive device 230 and the radius R200 of the winding roll 200. When the difference between the supply-side feed amount and the winding amount exceeds a threshold, the control device 900 may detect an abnormality, stop the feeding operation as appropriate, and issue a warning by sound or display on a display device (not shown).

[0060] Changes in radii R100 and R200 affect the feed rate V1, winding rate, and tension of the polishing pad P1. Therefore, it is preferable that the control device 900 adjusts the rotational speed of the supply roll 100 and winding roll 200, as well as the torque limit value, based on the changes in radii R100 and R200, so that the feed rate V1, winding rate, and tension of the polishing pad P1 do not change.

[0061] Next, when a predetermined amount of polishing pad P1 is sent from the supply roll 100 to the winding roll 200, the control device 900 stops the rotation of the supply roll 100 by the first drive device 130 (see Figure 10E). At this time, the second drive device 230 is winding up the polishing pad P1 with a predetermined torque, but the second drive device 230 is unable to wind up the polishing pad P1 due to torque limitations.

[0062] Next, the control device 900 causes the polishing table 30 to suck up the polishing pad P1 (see Figure 10F). As a result, the polishing pad P1 adheres tightly to the pad placement surface S1 of the sub-pad SP.

[0063] Next, the control device 900 controls the rotation of the winding roll 200 by the second drive device 230. The operation is stopped (see Figure 10G). After that, the control device 900 terminates the operation flow. By performing the operations described above, the polishing device 1000 can feed the polishing pad P1.

[0064] Figure 11 is a flowchart showing the flow of the polishing method according to this embodiment. This polishing method can be executed by the arithmetic unit 910 of the control device 900. In step S100, the HP operation described above is performed. The HP operation causes the polishing pad P1 to be properly attracted to the pad placement surface S1. After step S100, step S101 is performed. In step S101, the substrate WF is polished. The control device 900 controls the polishing table 30 and the top ring 40, etc., to polish the substrate WF. After step S101, step S102 is performed.

[0065] In step S102, the control device 900 determines whether the conditions for supplying the polishing pad P1 to the pad placement surface S1 are met. The control device 900 can, for example, supply the polishing pad P1 to the pad placement surface S1 after polishing a predetermined number of substrates WF. If the conditions for supplying the polishing pad P1 are met, the control device 900 starts step S103. If the conditions for supplying the polishing pad P1 are not met, the control device 900 starts step S101.

[0066] In step S103, the control device 900 blows the polishing pad P1, removing the polishing pad P1 from the pad placement surface S1. After step S103, step S104 is performed.

[0067] In step S104, the control device 900 resets the feed amount to zero. The control device 900 also sets the feed rate V1 of the polishing pad P1 based on user input or data stored in the storage device 930, etc. The feed rate V1 can be set based on polishing conditions, etc. After step S104, step S105 is performed. In step S105, the control device 900 sets the torque setting value, etc. The control device 900 can set the torque limit value of the second drive device 230 based on correlation data and the radius 200 of the winding roll 200. Furthermore, the control device 900 sets the first rotational speed W1 of the supply roll 100 from the measured radius R100 of the supply roll 100 and the feed rate V1, and sets the second rotational speed of the winding roll 200 so that the target winding speed is greater than the feed rate V1. After step S105, step S106 is performed.

[0068] In step S106, the control device 900 controls the first drive unit 130 and the second drive unit 230 based on the set torque limit value, etc., to deliver the polishing pad P1 from the supply roll 100. After step S106, step S107 is performed.

[0069] In step S107, the control device 900 determines whether the polishing pad P1 has been fed out at the set feed rate. If it is determined that the polishing pad P1 has been fed out at the set feed rate, step S108 is started. If the polishing pad P1 has not been fed out at the set feed rate, step S105 is performed.

[0070] In step S108, the control device 900 controls the vacuum source 91 to vacuum-adhere the polishing pad P1 to the pad placement surface S1. After step S108, step S101 is started.

[0071] Variation 1 In the above embodiment, the control device 900 may detect that the remaining amount of polishing pad P1 on the supply roll 100 is low. The control device 900 then uses the first displacement gauge 140 to When the measured radius R100 of the supply roll 100 falls below a predetermined threshold, the feeding of the polishing pad P1 may be stopped, or the user may be notified that there is little polishing pad P1 remaining on the supply roll 100 by sound or display on an unillustrated display device.

[0072] Figure 12 is a schematic diagram showing an example of another method for detecting the remaining amount of the supply roll 100. When the supply roll 100 continues to feed the polishing pad P1 even after it has been depleted, the supply roll 100 begins to wind up the polishing pad P1. At this time, the supply roll 100 pulls the polishing pad P1 with a first torque AT1 that is greater than the second torque AT2 limited by the torque limit value, and winds up the polishing pad P1 at a winding speed equal to the set feed speed V1. The winding roll 200 then feeds out the polishing pad P1 that has already been wound up at the feed speed V1. When the supply roll 100 begins to wind up the polishing pad P1, the first torque AT1 and the second torque AT2 are reversed in direction and their signs are reversed.

[0073] If the control device 900 detects a change in the sign of the torque of the first drive unit 130 or the second drive unit 230, it may notify the user that the remaining amount of polishing pad P1 on the supply roll 100 is low by sound or display on a display device (not shown).

[0074] In this modified polishing apparatus 1000, the control device 900 detects when the polishing pad P1 of the supply roll 100 is running low based on the radius R100 of the supply roll 100 or the torque of the first drive unit 130 or the second drive unit 230. This allows for detection of the remaining amount of the polishing pad P1 while the polishing pad P1 is being fed, making it possible to more reliably prompt the user to replace the supply roll 100.

[0075] Variation 2 In the above embodiment, the control device 900 may detect the cutting of the polishing pad P1. Figure 13 is a schematic diagram showing the method for detecting the cutting of the polishing pad P1 in this modified example. When the polishing pad P1 is cut, the supply roll 100 continues to feed the polishing pad P1 at the same feed speed V1 as before, and the winding roll 200 begins to rotate at a winding speed faster than the feed speed V1, which was set as the target winding speed. The second torque decreases because the tension with the first torque is relieved, and it falls below the torque limit value.

[0076] When the control device 900 supplies the polishing pad P1 to the pad placement surface S1, if the torque of the second drive unit 230 remains below the torque limit value for a predetermined time, it can stop supplying the polishing pad P1 or issue a warning. This reduces the risk of wasting the polishing pad P1 or damaging parts of the polishing device 1000 by allowing the supply roll 100 and winding roll 200 to rotate with the polishing pad P1 cut. The predetermined time can be, for example, 5 to 10 seconds. The warning can be issued by sound or display on a display device (not shown) to inform the user that the polishing pad P1 may be cut.

[0077] Variation 3 In the above embodiment, the control device 900 may detect when the polishing pad P1 is stuck to the pad placement surface S1 or the polishing table 30. Figure 14 is a schematic diagram showing the method for detecting the sticking of the polishing pad P1 in this modified example. In Figure 14, the polishing pad P1 is stuck to the pad placement surface S1 in the sticking area S10 on the pad placement surface S1. At this time, the rotation of the winding roll 200 stops because the polishing pad P1 cannot be wound up due to the sticking and the torque limit value. The supply roll 100 can continue to feed the polishing pad P1 at the set feed speed V1.

[0078] When the control device 900 supplies the polishing pad P1 to the pad placement surface S1, the supply roll If the difference obtained by subtracting the measured winding speed of the winding roll 200 from the feed speed V1 of 100 exceeds a threshold, the supply of the polishing pad P1 can be stopped or a warning can be issued. This reduces the risk of wasting the polishing pad P1 or damaging parts of the polishing device 1000 due to the supply roll 100 rotating with the polishing pad P1 stuck to it. The threshold can be set appropriately, for example, to half of the feed speed V1. In the case of a warning, the user can be notified that the polishing pad P1 may be stuck, through sound or a display on a display device not shown.

[0079] Variation 4 In the above embodiment, appropriate tension is applied to the polishing pad P1 based on the torque limit value. The control device 900 may apply different tensions to the polishing pad P1 based on the radius R100 of the supply roll 100.

[0080] Figures 15 and 16 are schematic diagrams showing how to set the tension of the polishing pad P1 in this modified example. When the radius R100 of the supply roll 100 is small, the polishing pad P1 delivered from the supply roll 100 is wound around the supply roll 100 with a larger curvature. Therefore, the smaller the radius R100 of the supply roll 100, the more easily the polishing pad P1 bends. For this reason, in the example of Figure 15, the control device 900 sets the torque limit value to apply a tension T of 10N, but in the example of Figure 16, where the radius R100 of the supply roll 100 is smaller than in Figure 15, the torque limit value can be set to apply a tension T of 20N, which is larger than in Figure 15.

[0081] The control device 900 can set a torque limit value such that when supplying the polishing pad P1 to the pad placement surface S1, the smaller the radius R100 of the supply roll 100, the stronger the tension applied. This allows for stronger tension T to be applied to the easily bent polishing pad P1, thereby more reliably extending the polishing pad P1 horizontally and enabling smooth, efficient, and reproducible placement of the polishing pad P1 in the appropriate position on the polishing table 30.

[0082] Variation 5 In the above embodiment, whether the polishing pad P1 is under appropriate tension may be determined based on the pressure in the flow path 90 during suction through the multiple suction holes 328 (Figure 8) of the polishing table 30.

[0083] Figure 17 is a flowchart illustrating the process for setting the tension of the polishing pad P1 in this modified example. The control device 900 stops the delivery of the polishing pad P1 from the supply roll 100 by the first drive device 130 and drives the rotation of the winding roll 200 by the second drive device 230 under the limitation of the torque limit value. Due to the limitation based on the torque limit value, the winding roll 200 does not rotate, and tension based on the torque limit value is applied to the polishing pad P1.

[0084] In this state, in step S201, the control device 900 performs vacuum suction of the polishing pad P1 onto the pad placement surface S1. The control device 900 performs suction by the vacuum source 91 through a plurality of suction holes 328. The polishing pad P1 is adsorbed onto the pad placement surface S1. After step S201, step S202 is performed.

[0085] In step S202, the control device 900 determines whether a leak has been detected by the suction from the vacuum source 91. If the pressure in the flow path 90 measured by the pressure gauge 93 is above a threshold, the control device 900 determines that a leak has been detected and starts step S203. If sufficient tension is not applied to the polishing pad P1, wrinkles or bends will form in the polishing pad P1. When vacuum suction occurs, a gap is formed between the pad and the pad placement surface S1. This gap causes leakage. In the case of leakage, the polishing pad P1 is not positioned horizontally on the pad placement surface S1, which can lead to uneven polishing. Therefore, it is desirable to vacuum suction the polishing pad P1 again with stronger tension. If the pressure in the flow path 90 measured by the pressure gauge 93 is below the threshold, the control device 900 determines that no leak was detected and terminates the tension setting process, assuming that the appropriate tension is currently applied.

[0086] In step S203, the control device 900 blows the polishing pad P1 and sets the torque limit to a higher value. This applies stronger tension to the polishing pad P1. After step S203, step S201 is performed.

[0087] In this modified example, when the polishing pad P1 is placed on the pad placement surface S1, the control device 900 monitors the pressure in the flow path 90 while applying suction with the vacuum source 91, and sets the torque limit value to a higher value if a leak is detected. This allows the device to apply appropriate tension to the polishing pad P1 while testing whether the polishing pad P1 is properly placed on the pad placement surface S1.

[0088] Variation 6 In the above embodiment, alignment of the through-hole of the polishing pad P1 and the supply hole 37 is necessary in order to properly supply the polishing fluid onto the polishing pad P1 from the supply hole 37 (Figure 2). The polishing pad P1 may have markers for this alignment.

[0089] Figure 18A is a plan view showing a polishing pad P1 according to this modified example. The polishing pad P1 has a plurality of through holes 101. The plurality of through holes 101 are arranged in a pattern corresponding to the pattern of the supply holes 37. In this modified example, since four supply holes 37 are formed at the vertices of a square on the upper surface of the polishing table 30, rows of the plurality of through holes 101 are formed in the direction of movement of the polishing pad P1 so that a square pattern appears periodically in the direction of movement of the polishing pad P1 (left and right direction in the figure).

[0090] The polishing pad P1 further comprises alignment markers 102, each comprising a first marker 102A and a second marker 102B. The markers 102 may be aligned in the direction of movement of the polishing pad, or the first marker 102A and the second marker 102B may be arranged alternately. The first marker 102A and the second marker 102B may differ from the portion of the polishing pad P1 surrounding the marker 102 in at least one of hue, saturation, and lightness. The second marker 102B may be formed to be longer in the direction of movement of the polishing pad P1 than the first marker 102A, with respect to the ability to accurately confirm the position of the polishing pad P1 using the first marker 102A and to provide auxiliary information when the polishing pad P1 is not in the correct position using the second marker 102B.

[0091] The modified polishing system 1100 comprises a polishing device 1000 and a supply roll 100, the polishing table 30 is provided with a supply hole 37, and the polishing pad P1 of the supply roll 100 may be provided with a plurality of through holes 101 located at positions corresponding to the supply hole 37 and a marker 102.

[0092] Figure 18B is a conceptual diagram showing a method for aligning the through hole 101 of the polishing pad P1 with the supply hole 37 according to this modified example. The polishing device 1000 further includes a marker detector 60 that detects the alignment marker 102. On the pad placement surface S1, the detection position of the marker detector 60 can be configured such that the first marker 102A and the second marker 102B, which are aligned in the direction of movement of the polishing pad P1, pass through it. Furthermore, when the first marker 102A is detected, the supply hole 37 and the through hole 101 of the polishing pad P1 can be configured to overlap. In other words, the pitch of the through-hole 101 and the pitch of the first marker 102A can be made equal in the direction of movement. The marker detector 60 may be configured to alternately detect the first marker 102A and the second marker 102B as the polishing pad P1 moves when the polishing pad P1 is being fed out. The control device 900 adjusts the feed speed V1 and the stopping timing of the polishing pad P1 based on the timing of detection of the second marker 102B, the duration of detection, etc., and stops the polishing pad P1 when the marker detector 60 detects the first marker 102A.

[0093] In this modified example, the control device 900 controls the first drive unit 130 or the second drive unit 230 to align the supply hole 37 with the multiple through holes 101 based on the detection of the marker 102 by the marker detector 60. This allows the polishing pad P1 to be positioned on the pad placement surface S1 so that polishing fluid can be properly supplied from the supply hole 37.

[0094] Variation 7 In the modified example 6, instead of detecting the marker 102, the position of the through-hole 101 may be detected by imaging in order to align the through-hole 101 and the supply hole 37 of the polishing pad P1.

[0095] Figure 19 is a conceptual diagram illustrating the alignment of the through-hole 101 and the supply hole 37 in this modified example. The polishing apparatus 1000 includes a through-hole imaging device (second imaging device) 61 for imaging the through-hole 101. From the viewpoint of detecting the through-hole 101 more precisely even when the polishing pad P1 expands and contracts due to tension, it is preferable that the through-hole imaging device 61 be positioned directly above the supply hole 37. However, it is not limited to this, and the through-hole imaging device 61 may be positioned at a distance from the supply hole 37, such as 2 to 5 times the pitch of the supply hole 37, in the direction of movement of the polishing pad P1. The polishing apparatus 1000 may also be equipped with an illumination device, such as a backlight (not shown), so that the through-hole imaging device 61 can image more clearly, and the control device 900 may turn on the illumination device and perform imaging of the through-hole imaging device 61.

[0096] The control device 900 can extract features from the imaging data (second imaging data) obtained by imaging the through-hole 101 with the through-hole imaging device 61 through-hole imaging device, and derive the position of the through-hole 101 through image processing. The control device 900 can refer to the position of the supply hole 37 which is stored in advance in the storage device 930 or the like. Based on the position of the supply hole 37 and the derived position of the through-hole 101, the control device 900 adjusts the feed speed V1 and stopping timing of the polishing pad P1, and stops the polishing pad P1 when the through-hole 101 overlaps with the supply hole 37.

[0097] The polishing apparatus 1000 of this modified example further includes a through-hole imaging device 61 for capturing images of multiple through-holes 101, and the control device 900 controls the first drive device 130 or the second drive device 230 to align the supply hole 37 with the multiple through-holes 101 based on the imaging data obtained by the through-hole imaging device 61. This allows the polishing pad P1 to be placed on the pad placement surface S1 in a simple configuration that does not require markers or the like, so that polishing fluid can be properly supplied from the supply hole 37.

[0098] Variation 8 Figure 20 is a schematic diagram showing the polishing apparatus 1000A according to this modified example. The polishing apparatus 1000A according to this modified example has substantially the same configuration as the polishing apparatus 1000 of the above-described embodiment, but differs from the polishing apparatus 1000 in that it includes a cover 51, a side cover 52, and a polishing fluid receiver 500.

[0099] The cover 51 is positioned below the supply roll 100 and is provided to prevent the polishing fluid that has fallen below the polishing table 30 from splashing and contaminating the supply roll 100 due to the high-speed rotation of the polishing table 30. The cover 51 rotates integrally with the polishing table 30. They can be rotatably positioned. As shown in Figure 20, a cover 51 may also be positioned below the winding roll 200 to protect the winding roll 200 or components in its vicinity. Covers 51 may also be positioned below the first drive unit 130, the second drive unit 230, the first displacement meter 140, and the second displacement meter 240. Thus, the polishing apparatus 1000A may further include covers 51 positioned below at least one of the supply roll 100, the winding roll 200, the first drive unit 130, and the second drive unit 230.

[0100] The side cover 52 is a cover that extends from the top to the bottom on the side of the polishing table 30. The side cover 52 covers the sides of the supply roll 100 and the winding roll 200, and suppresses contamination of the supply roll 100 etc. by polishing fluid from the top surface 35 etc. of the polishing table 30. The side cover 52 may be arranged to rotate integrally with the polishing table 30. From the viewpoint of preventing polishing fluid from entering the inside of the side cover, it is preferable that the side cover 52 is arranged to be in close contact with an O-ring (not shown) provided on the outer circumference of the polishing table 30 from the outer circumference side. The side cover 52 may be rectangular in shape when viewed from above, matching the shape of the polishing table 30. Multiple side covers 52 may be combined to form an integral cylindrical shape or the like that matches the shape of the polishing table 30. This makes it easy to replace the supply roll 100 etc.

[0101] The abrasive fluid receiver 500 is a storage container for preventing splashing of the abrasive fluid and for efficiently collecting the abrasive fluid. The abrasive fluid receiver 500 may be configured not to rotate. As shown in Figure 20, the abrasive fluid receiver 500 may be positioned to cover below the polishing table 30 and the supply roll 100, and to the sides of the first supply side roller 110, the second supply side roller 120, the first winding side roller 210, and the second winding side roller 220.

[0102] Figure 21 is a schematic plan view of the abrasive fluid tray 500. The abrasive fluid tray 500 includes a maintenance section 510. The maintenance section 510 provides space for the user to access the area below the polishing table 30. In the maintenance section 510, the distance between the outer circumferential wall of the abrasive fluid tray 500 and the polishing table 30 is greater than in other parts, and this space between the polishing table 30 and the outer circumferential wall constituting the maintenance section 510 may be used to replace the supply roll 100 or other parts. The abrasive fluid tray 500 may also include a drain port (not shown). The liquid discharged from the drain port is disposed of after being appropriately treated, such as by removing abrasive particles.

[0103] Figure 22 is a schematic diagram showing an example of how to replace the supply roll 100. The control device 900 rotates the polishing table 30 and stops it when the supply roll 100 is positioned in the maintenance section 510. The user then cuts the polishing pad P1 and removes the side cover 52 in the maintenance section 510. After this, the user can remove the used supply roll 100 from the supply roll holding member 310 (Figure 1) (see arrow A100) and install the new supply roll 100 in the supply roll holding member 310. The side cover 52 is then reattached. When replacing the winding roll 200, the control device 900 rotates the polishing table 30 so that the winding roll 200 is positioned in the maintenance section 510, and the user replaces the winding roll 200. After replacing the supply roll 100 and the winding roll 200, it is necessary to connect the polishing pad P1 on the supply roll 100 side and the polishing pad P1 on the winding roll 200 side.

[0104] Figure 23 is a plan view showing a jig 400 for connecting the polishing pad P1 on the supply roll side and the polishing pad P1 on the winding roll 200 side. Figure 24 is a side view of the jig 400. The jig 400 comprises a bottom plate 410 and linear side walls 420 projecting in the thickness direction of the bottom plate 410 from both sides of the bottom plate 410. The side walls 420 comprises a first side wall 421 and a second side wall 422. The length L400 between the first side wall 421 and the second side wall 422 is the distance of movement of the polishing pad P1. It is approximately the same as the width perpendicular to the direction and thickness.

[0105] Figure 25 is a schematic diagram showing the connection of polishing pads P1 using the jig 400. The polishing pads P1 are shown by dashed lines. By taking advantage of the fact that the distance L400 between the first side wall 421 and the second side wall 422 is approximately the same as the width of the polishing pad P1, one polishing pad P1 is placed on one side of the jig 400 in the direction in which the side wall 420 extends, and the other polishing pad P1 is placed on the other side. The position of the polishing pads P1 in the direction perpendicular to the direction of movement and thickness (left-right direction in the figure) is adjusted using the first side wall 421 and the second side wall 422. Once the position is adjusted, the two polishing pads P1 can be bonded together with adhesive tape or the like.

[0106] Modification 9 In the above-described embodiment, the polishing apparatus 1000 may include a lateral atomizer that sprays liquid onto the polishing pads P1 located to the sides of the polishing table 30 before they are delivered from the supply roll 100 and reach above the polishing table 30.

[0107] Figure 26 is a conceptual diagram showing the polishing apparatus 1000B of this modified example. The polishing apparatus 1000B has substantially the same configuration as the polishing apparatus 1000A of the above-described embodiment, but differs from the polishing apparatus 1000A in that it has a lateral atomizer 70. The lateral atomizer 70 is located in the maintenance section 510 of the abrasive fluid receiver 500. The position of the lateral atomizer 70 is not particularly limited as long as it can spray liquid onto the polishing pad P1 on the side of the polishing table 30. The liquid sprayed by the lateral atomizer 70 is not particularly limited as long as it can suppress drying of the polishing pad P1, and can be, for example, pure water.

[0108] In the illustrated example, the lateral atomizer 70 has a support member 71 extending in the vertical direction and a plurality of nozzles 72 arranged vertically on the support member 71, and is configured to spray liquid radially inward as the polishing table 30 rotates. The lateral atomizer 70 has a valve (not shown), and the control device 900 may spray liquid at a set timing by switching this valve. For example, the position of the polishing table 30 in rotation may be detected by a detector (not shown), and liquid may be sprayed only on the unused supply-side polishing pad P1, and not on the used winding-side polishing pad P1. Also, when the rotation speed of the polishing table 30 is high, the polishing liquid may scatter, but when the rotation speed of the polishing table 30 is low, the polishing liquid may flow down to the side due to centrifugal force, so the control device 900 may be configured to spray liquid on the polishing pad P1 on the side of the polishing table 30 when the rotation speed of the polishing table 30 is above a threshold.

[0109] This modified polishing apparatus 1000B further includes a lateral atomizer 70 for spraying liquid from the supply roll 100 onto a polishing pad P1 that extends upward along the side of the polishing table 30. This reduces the risk of the liquid drying out on the polishing pad P1 on the side of the polishing table 30, especially when the rotation speed of the polishing table 30 is high. It also washes away abrasive particles on the polishing pad P1. Therefore, it is possible to suppress the drying of the polishing liquid and the adhesion of abrasive particles to the polishing pad P1, which would adversely affect the substrate WF.

[0110] The embodiments described above can also be described in the following forms. [Embodiment 1] According to Embodiment 1, a polishing apparatus is proposed, the polishing apparatus comprising: a polishing table for supporting a polishing pad; a first drive unit for driving the rotation of the supply roll in order to supply the polishing pad, which is wound on a supply roll, to the pad placement surface on the upper side of the polishing table; a second drive unit for driving the rotation of the winding roll in order to wind the polishing pad, which has passed over the polishing table, onto the winding roll; and a control device for controlling the first drive unit and the second drive unit, the polishing apparatus polishes an object by bringing the polishing pad into contact with the object, the control device supplies the polishing pad to the pad placement surface. When doing so, the first drive unit is controlled to allow the torque of the first drive unit to exceed a torque limit value, and the supply roll is rotated to feed the polishing pad at a set feed speed. The second drive unit is controlled to limit the torque of the second drive unit to less than or equal to the torque limit value, and the winding roll is rotated with the aim of winding the polishing pad at a winding speed greater than the feed speed. According to Embodiment 1, the polishing pad can be smoothly, efficiently, and reproducibly positioned in an appropriate location relative to the polishing table, and a polishing apparatus that enables stable and efficient polishing can be provided.

[0111] [Embodiment 2] According to Embodiment 2, in Embodiment 1, the control device sets the torque limit value based on at least one of the measured radius of the supply roll and the measured radius of the winding roll. According to Embodiment 2, the tension of the polishing pad can be set more precisely by reflecting changes in the radius of the supply roll, etc.

[0112] [Embodiment 3] According to embodiment 3, embodiment 2 further comprises a contact-type displacement meter or a laser displacement meter for measuring the radius of the supply roll or the radius of the winding roll. According to embodiment 3, the radius of the supply roll or the radius of the winding roll can be measured more reliably.

[0113] [Embodiment 4] According to Embodiment 4, in Embodiment 3, the contact-type displacement meter is equipped with a rotatable contact element. According to Embodiment 4, adverse effects on measurement due to friction between the contact-type displacement meter and the rotating supply roll or winding roll are suppressed, and the radius of the supply roll or winding roll can be measured more precisely while supplying the polishing pad.

[0114] [Embodiment 5] According to Embodiment 5, Embodiment 2 further comprises a first imaging device that captures images of the supply roll or the winding roll, and the control device derives the radius of the supply roll or the winding roll from the first imaging data obtained from the imaging. According to Embodiment 5, the radius of the supply roll or the winding roll can be derived with a simple configuration.

[0115] [Embodiment 6] According to Embodiment 6, in Embodiment 2, the control device derives the radius of the supply roll or the radius of the winding roll based on the ratio of the torques of the first drive unit and the second drive unit when a constant torque is applied to the drive unit that drives the other, while preventing either the supply roll or the winding roll from rotating. According to Embodiment 6, the radius of the supply roll or the radius of the winding roll can be derived without the need to install a displacement meter.

[0116] [Embodiment 7] According to Embodiment 7, in any of Embodiments 1 to 6, the control device detects when the polishing pad on the supply roll is running low based on the radius of the supply roll or a change in the torque of the first or second drive unit. According to Embodiment 7, the remaining amount of the polishing pad can be detected while the polishing pad is being fed, and the user can be more reliably prompted to replace the supply roll.

[0117] [Embodiment 8] According to Embodiment 8, in any of Embodiments 1 to 7, when the control device supplies the polishing pad to the pad placement surface, if a predetermined time has elapsed while the torque of the second drive unit remains below the torque limit value, the control device stops supplying the polishing pad or issues a warning. According to Embodiment 8, the supply roll and winding roll rotate with the polishing pad cut, which reduces the risk of wasting the polishing pad or damaging the parts of the polishing device.

[0118] [Embodiment 9] According to Embodiment 9, in any of Embodiments 1 to 8, when the control device supplies the polishing pad to the pad placement surface, if the difference obtained by subtracting the measured winding speed of the winding roll from the feed speed of the supply roll is greater than or equal to a threshold, the control device stops supplying the polishing pad or issues a warning. According to Embodiment 9, the risk of wasting polishing pads or damaging parts of the polishing device by having the supply roll rotate with the polishing pad stuck to it can be reduced.

[0119] [Embodiment 10] According to embodiment 10, in any of embodiments 1 to 9, the control device sets the torque limit value based on correlation data showing the correlation between the torque of the second drive device and the tension applied to the polishing pad. According to embodiment 10, the tension of the polishing pad can be set more precisely based on previously obtained data.

[0120] [Embodiment 11] According to Embodiment 11, in any of Embodiments 1 to 10, the control device sets the torque limit value such that when supplying the polishing pad to the pad placement surface, the smaller the radius of the supply roll, the stronger the tension applied. According to Embodiment 11, by applying stronger tension to a bendable polishing pad, the polishing pad can be positioned more reliably, smoothly, efficiently, and reproducibly in the appropriate position on the polishing table.

[0121] [Embodiment 12] According to embodiment 12, in any of embodiments 1 to 11, the polishing table includes a plurality of suction holes opening on the upper surface of the polishing table and a flow path that fluidly connects the plurality of suction holes to a vacuum source, and the control device monitors the pressure in the flow path while applying suction with the vacuum source when the polishing pad is placed on the pad placement surface, and sets the torque limit value to a higher value if a leak is detected. According to embodiment 12, it is possible to apply appropriate tension to the polishing pad while actually testing whether the polishing pad is properly placed on the pad placement surface.

[0122] [Embodiment 13] According to embodiment 13, in any of embodiments 1 to 12, the polishing table is provided with a supply hole for supplying liquid to the polishing pad, the polishing pad is provided with a plurality of through holes and alignment markers, the polishing device further includes a marker detector for detecting the markers, and the control device controls the first drive unit or the second drive unit to align the supply hole with the plurality of through holes based on the detection of the markers by the marker detector. According to embodiment 13, the polishing pad can be positioned on the pad placement surface so that polishing liquid can be supplied properly from the supply hole more reliably or efficiently.

[0123] [Embodiment 14] According to embodiment 14, in any of embodiments 1 to 13, the polishing table is provided with a supply hole for supplying liquid to the polishing pad, the polishing pad is provided with a plurality of through holes, the polishing apparatus further comprises a second imaging device for capturing images of the plurality of through holes, and the control device controls the first drive device or the second drive device to align the supply hole with the plurality of through holes based on the second imaging data obtained by the imaging by the second imaging device. According to embodiment 14, the polishing pad can be placed on the pad placement surface S1 so that polishing liquid can be properly supplied from the supply hole with a simple configuration that does not require markers or the like.

[0124] [Embodiment 15] According to embodiment 15, in any embodiment 1 to 14, a cover is further provided located below at least one of the supply roll, the winding roll, the first drive unit, and the second drive unit. According to embodiment 15, it is possible to suppress the contamination of the supply roll and the like by the supply roll caused by splashing of polishing liquid that has fallen below the polishing table due to the high-speed rotation of the polishing table.

[0125] [Embodiment 16] According to embodiment 16, in any of embodiments 1 to 15, a lateral atomizer is further provided for spraying liquid from the supply roll onto the polishing pad which extends upward along the side of the polishing table. According to embodiment 16, it is possible to suppress the drying of the polishing liquid on the polishing pad on the side of the polishing table, which causes the abrasive particles to adhere to the polishing pad and adversely affect the substrate.

[0126] [Embodiment 17] According to embodiment 17, in any of embodiments 1 to 16, the invention further comprises a first supply-side roller and a second supply-side roller that contact the polishing pad from the supply roll to above the polishing table, wherein the second supply-side roller is cylindrical and positioned laterally along the upper surface of the polishing table, and the first supply-side roller is positioned below the supply roll and has a diameter that increases towards the center. According to embodiment 17, it is possible to suppress the meandering of the polishing pad while suppressing contamination of the supply roll by the polishing liquid.

[0127] [Embodiment 18] According to Embodiment 18, a polishing method is proposed, the polishing method being a polishing method for polishing an object by bringing the polishing pad into contact with the object using a polishing apparatus comprising: a polishing table for supporting a polishing pad; a first drive device for driving the rotation of the supply roll in order to supply the supply roll, on which the polishing pad is wound in a roll shape, to the pad placement surface on the upper side of the polishing table; and a second drive device for driving the rotation of the winding roll in order to wind the polishing pad that has passed over the polishing table onto the winding roll. The method includes, when supplying the polishing pad to the pad placement surface, the first drive device rotating the supply roll so as to feed the polishing pad at a set feed speed, and the second drive device rotating the winding roll with the aim of feeding the polishing pad at a winding speed greater than the feed speed, while limiting the torque of the second drive device to less than or equal to the torque limit value. According to Embodiment 18, the polishing pad can be smoothly, efficiently, and reproducibly positioned in an appropriate location relative to the polishing table, enabling stable and efficient polishing.

[0128] Although several embodiments of the present invention have been described above, the embodiments described above are for the purpose of facilitating understanding of the present invention and do not limit it. The present invention can be modified and improved without departing from its spirit, and of course, equivalents thereof are included in the present invention. Furthermore, any combination or omission of the components described in the claims and specification is possible to the extent that at least some of the above-mentioned problems can be solved or at least some of the effects can be achieved. [Explanation of Symbols]

[0129] 30 polishing tables 32 Tabletop 35 Top surface of the polishing table 37 Supply hole 40 Top Ring 51 Cover 60 Marker Detectors 61 Through-hole imaging device 70 Side Atomizer 90 flow channels 91 Vacuum source 93 Pressure gauge 100 supply rolls 101 Through-hole of polishing pad 102 markers 102A First Marker 102B Second Marker 110 First supply side roller 120 Second supply side roller 130 First drive unit 140, 140A, 140B First displacement gauge 143 Contactor 200 rolls 210 First winding side roller 220 Second winding side roller 230 Second drive unit 240, 240B Second displacement gauge 328 Adsorption hole 400 jigs 500 Abrasive fluid holder 900 Control Unit 910 Arithmetic unit 920 memory 930 Storage device 1000,1000A,1000B polishing equipment 1100 Polishing System AT1 First Torque AT2 Second Torque C1 Polishing table central axis P1 Polishing Pad R100 Radius of the feed roll R200 Radius of the winding roll S1 Pad placement surface SP Subpad SP8 Sub-pad suction holes T tension V1 feed rate W1 First rotation speed WF board

Claims

1. A polishing table for supporting the polishing pad, A first drive device drives the rotation of the supply roll in order to supply the polishing pad wound on the supply roll to the pad placement surface on the upper side of the polishing table, A second drive device drives the rotation of the winding roll in order to wind the polishing pad that has passed over the polishing table onto the winding roll, A control device for controlling the first drive unit and the second drive unit, Equipped with, A polishing device that polishes an object by bringing the polishing pad into contact with the object, When the control device supplies the polishing pad to the pad placement surface, The first drive unit is controlled to rotate the supply roll so that the polishing pad is fed at a set feed rate. A polishing apparatus configured to control the second drive unit and rotate the winding roll with the aim of winding the polishing pad at a winding speed greater than the feed speed, while limiting the torque of the second drive unit to less than or equal to a torque limit value.

2. The polishing apparatus according to claim 1, wherein the control device sets the torque limit value based on at least one of the measured radius of the supply roll and the measured radius of the winding roll.

3. The polishing apparatus according to claim 2, further comprising a contact-type displacement meter or a laser displacement meter for measuring the radius of the supply roll or the radius of the winding roll.

4. The polishing apparatus according to claim 3, wherein the contact-type displacement sensor comprises a rotatable contact element.

5. The system further comprises a first imaging device for capturing images of the supply roll or the winding roll, The polishing apparatus according to claim 2, wherein the control device derives the radius of the supply roll or the radius of the winding roll from the first imaging data obtained by the imaging.

6. The polishing apparatus according to claim 2, wherein the control device derives the radius of the supply roll or the radius of the winding roll based on the ratio of the torques of the first drive unit and the second drive unit when a constant torque is applied to a drive unit that drives the other, while preventing either the supply roll or the winding roll from rotating.

7. The polishing apparatus according to any one of claims 1 to 6, wherein the control device detects when the polishing pad on the supply roll is running low based on the radius of the supply roll or a change in the torque of the first drive unit or the second drive unit.

8. The polishing apparatus according to any one of claims 1 to 6, wherein the control device stops supplying the polishing pad or issues a warning if a predetermined time has elapsed while the torque of the second drive unit remains below the torque limit value when supplying the polishing pad to the pad placement surface.

9. The polishing apparatus according to any one of claims 1 to 6, wherein the control device, when supplying the polishing pad to the pad placement surface, stops supplying the polishing pad or issues a warning if the difference obtained by subtracting the measured winding speed of the winding roll from the feed speed of the supply roll is greater than or equal to a threshold.

10. The polishing apparatus according to any one of claims 1 to 6, wherein the control device sets the torque limit value based on correlation data showing the correlation between the torque of the second drive device and the tension applied to the polishing pad.

11. The polishing apparatus according to any one of claims 1 to 6, wherein the control device sets the torque limit value so that when supplying the polishing pad to the pad placement surface, the smaller the radius of the supply roll, the stronger the tension applied.

12. The polishing table comprises a plurality of adsorption holes opening on the upper surface of the polishing table, and a flow path that fluidly connects the plurality of adsorption holes to a vacuum source. The polishing apparatus according to any one of claims 1 to 6, wherein the control device monitors the pressure in the flow path while applying suction with the vacuum source when the polishing pad is placed on the pad placement surface, and sets the torque limit value to a higher value when a leak is detected.

13. The polishing table is provided with a supply hole for supplying liquid to the polishing pad, The polishing pad comprises a plurality of through holes and alignment markers, The polishing apparatus further comprises a marker detector for detecting the marker, The polishing apparatus according to any one of claims 1 to 6, wherein the control device controls the first drive unit or the second drive unit to align the supply hole with the plurality of through holes based on the detection of the marker by the marker detector.

14. The polishing table is provided with a supply hole for supplying liquid to the polishing pad, The polishing pad has a plurality of through holes, The polishing apparatus further comprises a second imaging device for capturing images of the plurality of through holes. The polishing apparatus according to any one of claims 1 to 6, wherein the control device controls the first drive device or the second drive device to align the supply hole with the plurality of through holes based on the second imaging data obtained by the second imaging device.

15. The polishing apparatus according to any one of claims 1 to 6, further comprising a cover disposed below the supply roll, the winding roll, the first drive unit, and at least one of the second drive unit.

16. The polishing apparatus according to any one of claims 1 to 6, further comprising a lateral atomizer for spraying liquid from the supply roll onto the polishing pad extending upward along the side of the polishing table.

17. The system further comprises a first supply-side roller and a second supply-side roller that contact the polishing pad from the supply roll to above the polishing table, The second supply-side roller is positioned along the upper surface of the polishing table, to the side of the upper surface, and is cylindrical in shape. The polishing apparatus according to any one of claims 1 to 6, wherein the first supply-side roller is positioned below the supply roll and has a diameter that increases toward the center.

18. A polishing table for supporting the polishing pad, A first drive device drives the rotation of the supply roll in order to supply the polishing pad wound on the supply roll to the pad placement surface on the upper side of the polishing table, A second drive device drives the rotation of the winding roll in order to wind the polishing pad that has passed over the polishing table onto the winding roll, A polishing method for polishing an object by bringing the polishing pad into contact with the object using a polishing apparatus equipped with the following: The above method, when supplying the polishing pad to the pad placement surface, The first drive device rotates the supply roll to feed the polishing pad at a set feed rate, A polishing method comprising rotating the winding roll with the aim of feeding the polishing pad at a winding speed greater than the feed speed, while limiting the torque of the second drive unit to less than or equal to a torque limit value.

Images