Grinding device

Abstract

This disclosure provides a polishing apparatus that is easy to manufacture, even if it has many holes that communicate with a vacuum source and fluid. [Solution] The polishing apparatus according to the present disclosure is a polishing apparatus comprising a rotatable polishing table for holding a polishing pad for polishing a substrate, the polishing table having a connecting groove on its surface, a flow path formed in the polishing table for fluid communication between the connecting groove and a vacuum source, the polishing table being configured such that when a sub-pad having a plurality of holes is attached, the connecting groove fluidly communicates the plurality of holes with each other, and the polishing apparatus being configured to suck the polishing pad through the plurality of holes by vacuuming the connecting groove and holding the polishing pad on the surface of the sub-pad.

Description

Technical Field

[0001] The present invention relates to a polishing apparatus.

Background Art

[0002] In a semiconductor manufacturing process, a polishing (CMP: Chemical Mechanical Polishing) apparatus is used to polish a substrate. An example of such a polishing apparatus is disclosed in Patent Document 1. As shown in FIG. 1 thereof, the polishing apparatus (polishing device) disclosed in Patent Document 1 includes a polishing table 10. The polishing table 10 is provided with a suction holding portion 40 that vacuum-sucks and holds a polishing pad 36 on the upper surface thereof. The suction holding portion 40 includes a plurality of vacuum suction holes opened on the upper surface of the polishing table 10, and is connected to a vacuum source such as a vacuum pump. Thereby, in this polishing apparatus, the polishing pad 36 can be suction-held on the upper surface of the polishing table 10. As a result, the polishing pad 36 is prevented from being displaced relative to the polishing table 10 during polishing.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Summary of Invention

Problems to be Solved by the Invention

[0004] However, if the number of vacuum suction holes provided in the suction holding section 40 is small, the holding force for adsorbing the polishing pad 36 may be insufficient, and the polishing pad 36 may shift relative to the polishing table 10 during polishing. For this reason, a polishing device with many vacuum suction holes in the suction holding section 40 is required. However, if the number of vacuum suction holes provided in the suction holding section 40 is large, the fluid flow path connecting the vacuum source and the multiple vacuum suction holes may become complex. As a result, the processing of the flow path may incur significant costs and time, making the manufacturing of the polishing device more laborious.

[0005] Therefore, one of the objectives of this disclosure is to provide a polishing device that is easy to manufacture, even if it is provided with many holes that communicate with a vacuum source and fluid. [Means for solving the problem]

[0006] The polishing apparatus according to the present disclosure is a polishing apparatus comprising a rotatable polishing table for holding a polishing pad for polishing a substrate, the polishing table having a connecting groove on its surface, a flow path formed in the polishing table for fluid communication between the connecting groove and a vacuum source, the polishing table being configured such that when a sub-pad having a plurality of holes is attached, the connecting groove fluidly communicates the plurality of holes with each other, and the polishing apparatus being configured to suck the polishing pad through the plurality of holes by vacuuming the connecting groove and holding the polishing pad on the surface of the sub-pad. [Brief explanation of the drawing]

[0007] [Figure 1] This is a front view of a polishing apparatus according to one embodiment of the present disclosure. [Figure 2] Figure 1 is a plan view of the table assembly shown. [Figure 3] Figure 1 is a cross-sectional view of the table assembly shown. [Figure 4] Figure 1 is an exploded perspective view showing the structure of the tabletop of the table assembly shown. [Figure 5A] This is a diagram for explaining the HP operation. [Figure 5B] This is a diagram for explaining the HP operation. [Figure 5C] This is a diagram for explaining the HP operation. [Figure 5D] This is a diagram for explaining the HP operation. [Figure 6] This is a flowchart showing one procedure of control processing during HP operation of the control device of Fig. 1. [Figure 7A] This is a diagram for explaining the feeding operation. [Figure 7B] This is a diagram for explaining the feeding operation. [Figure 7C] This is a diagram for explaining the feeding operation. [Figure 7D] This is a diagram for explaining the feeding operation. [Figure 7E] This is a diagram for explaining the feeding operation. [Figure 7F] This is a diagram for explaining the feeding operation. [Figure 7G] This is a diagram for explaining the feeding operation. [Figure 7H] This is a diagram for explaining the feeding operation. [Figure 8] This is a flowchart showing one procedure of control processing during feeding operation of the control device of Fig. 1. [Figure 9] This is a cross-sectional view of a table assembly according to another embodiment of the present disclosure. [Figure 10] This is a cross-sectional view of a table assembly according to still another embodiment of the present disclosure. [Figure 11] This is a cross-sectional view of a table assembly according to yet another embodiment of the present disclosure. [Figure 12] This is an exploded perspective view showing the structure of the table top of the table assembly shown in Fig. 11. [Mode for Carrying Out the Invention]

[0008] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are designated by the same reference numerals, and redundant descriptions thereof will be omitted.

[0009] <<Polishing Apparatus 100>> FIG. 1 is a front view of a polishing apparatus 100 according to an embodiment of the present disclosure. FIG. 2 is a plan view of a table assembly 200 of the polishing apparatus 100. The polishing apparatus 100 has a function of polishing a substrate W such as a wafer as an example. As shown in FIG. 1, the polishing apparatus 100 includes, as an example, a table assembly 200, a motor 110, a top ring 120, and a control device 130. Hereinafter, each component of the polishing apparatus 100 will be described. The table assembly 200 has a substantially T-shape in a side view (see FIG. 1) and a rectangular shape in a plan view (see FIG. 2) as an example. As a result, a constricted portion 202 and a constricted portion 204 are formed on both sides of the table assembly 200 (see FIG. 1). The constricted portion 202 is located opposite to the constricted portion 204 with the central axis C1 interposed therebetween. Further, the upper flat surface 284 of the table assembly 200 is configured to be capable of sucking a polishing pad 300. Thereby, the table assembly 200 can hold the polishing pad 300 for polishing the substrate W.

[0010] The polishing pad 300 is attracted to the flat surface 284 of the table assembly 200. The upper surface of the polishing pad 300 forms a polishing surface for polishing the substrate W. Four slurry supply holes 303 are provided near the center of the table assembly 200 (see Figure 2). The polishing pad 300 has holes positioned corresponding to the four slurry supply holes 303. As a result, when polishing the substrate W, slurry is supplied to the polishing surface of the polishing pad 300 from the four slurry supply holes 303. In the polishing device 100, the polishing pad 300 slides on the table assembly 200 as described later, but the polishing device 100 can move the polishing pad 300 so that the holes in the polishing pad 300 coincide with the four slurry supply holes 303. In another embodiment of the present disclosure, the slurry may be supplied to the polishing pad 300 from a nozzle provided above the polishing pad 300, rather than from the slurry supply holes 303. In other words, the polishing device 100 may be equipped with a nozzle for supplying slurry to the polishing pad 300. .

[0011] For example, the motor 110 is located at the bottom of the table assembly 200 and rotatably supports the table assembly 200 (see Figure 1). This allows the table assembly 200 to rotate around the central axis C1. For example, the central axis C1 extends vertically. The top ring 120 is positioned above the table assembly 200 so as to be vertically movable. The top ring 120 is configured to detachably hold the surface of the substrate W to be polished facing the table assembly 200. Furthermore, the top ring 120 is configured to rotate around the central axis C2. For example, the central axis C2 extends vertically. In other words, the central axis C2 extends in the same direction as the central axis C1. During polishing, slurry is supplied to the polishing surface of the polishing pad 300 from the slurry supply hole 303, and the substrate W, which is the object to be polished, is pressed against the polishing surface of the polishing pad 300 by the top ring 120 and polished.

[0012] Furthermore, the polishing apparatus 100 may include, as an example, an atomizer (not shown). The atomizer has the function of removing slurry, polishing products, polishing pad residue from the dressing, etc., from the polishing surface by supplying a mixed fluid of liquid (e.g., pure water) and gas (e.g., nitrogen gas) or liquid (e.g., pure water) to the polishing surface.

[0013] The polishing device 100 also includes a first polishing pad holding module 310, a second polishing pad holding module 320, two centering rollers 302 and 304, and two tension rollers 306 and 308 (see Figure 1). The first polishing pad holding module 310 is, for example, adjacent to the constricted portion 202. The first polishing pad holding module 310 is configured to rotate integrally with the table assembly 200 about a central axis C1. The first polishing pad holding module 310 is configured to hold the rolled polishing pad 300 with the center of the roll extending horizontally. On the other hand, the second polishing pad holding module 320 is adjacent to the constricted portion 204. In other words, the second polishing pad holding module 320 is located on the opposite side of the first polishing pad holding module 310 via the central axis C1. The second polishing pad holding module 320 is configured to rotate around the central axis C1, integrally with the table assembly 200. The second polishing pad holding module 320 is configured to hold the rolled polishing pad 300 with the center of the roll extending horizontally.

[0014] The centering roller 302 has a cylindrical shape and is positioned diagonally below the first polishing pad holding module 310 so that its center extends horizontally. The centering roller 302 has the function of guiding the polishing pad 300. On the other hand, the centering roller 304 has a cylindrical shape and is positioned diagonally below the second polishing pad holding module 320 so that its center extends horizontally. The centering roller 304 also has the function of guiding the polishing pad 300. In order to prevent the polishing pad 300 from meandering, it is preferable that the centering rollers 302 and 304 have a cylindrical shape (crown roll shape) where the central part is wider than the ends, rather than a perfectly cylindrical shape.

[0015] The tension roller 306 has a cylindrical shape and is positioned above the centering roller 302 with its center extending horizontally. The tension roller 306 has the function of guiding the polishing pad 300. On the other hand, the tension roller 308 has a cylindrical shape and is positioned above the centering roller 302 with its center extending horizontally. The tension roller 308 has the function of guiding the polishing pad 300.

[0016] In the polishing device 100, the direction of movement of the polishing pad 300 supplied from the first polishing pad holding module 310 is changed by the centering roller 302 and the tension roller 306. The polishing pad 300 then slides horizontally along the plane 284 of the table assembly 200. Subsequently, the direction of movement of the polishing pad 300 is changed by the centering roller 304 and the tension roller 308. The polishing pad 300 is then wound onto the second polishing pad holding module 320. In this way, the polishing device 100 is configured so that the polishing pad 300 can slide above the table assembly 200. Therefore, the polishing device 100 allows a worn portion of the polishing pad 300 to slide and be replaced with an unworn portion.

[0017] ≪Table Assembly 200≫ Figure 3 is a cross-sectional view of the table assembly 200. Figure 4 is an exploded perspective view showing the structure of the tabletop 260 of the table assembly 200. Referring to Figure 3, the table assembly 200 includes, as an example, a polishing table 210 and a sub-pad 280. The polishing table 210 includes a table base 220, a table 240, and a tabletop 260. The table base 220, table 240, tabletop 260, sub-pad 280, and polishing pad 300 are arranged in this order, as an example.

[0018] The table base 220 functions as a base and has a plane 222 on its vertically upper side. The table 240 has a roughly rectangular shape and has a plane 242 on its vertically lower side and a plane 244 on its vertically upper side. In other words, plane 242 is the back surface of plane 244. The table 240 is fixed to the table base 220 such that plane 242 is in contact with plane 222. The tabletop 260 has a roughly rectangular shape and has a plane 262 on its vertically lower side and a plane (an example of a surface) 264 on its vertically upper side. In other words, plane 262 is the back surface of plane 264. The tabletop 260 is fixed to the table 240 such that plane 262 is in contact with plane 244.

[0019] The sub-pad 280, for example, has a substantially rectangular shape and is made of rubber, resin, or nonwoven fabric. The sub-pad 280 also has a vertically downward surface 282 and a vertically upward surface 284. In other words, surface 282 is the back surface of surface 284. The sub-pad 280 is attached to the tabletop 260 with an adhesive such that surface 282 is in contact with surface 264. The sub-pad 280 is, for example, a consumable part and is replaced by peeling surface 282 off surface 264. In another embodiment of this disclosure, the sub-pad 280 does not have to be a consumable part and does not have to be replaced. Furthermore, the sub-pad 280 may be attached to the tabletop 260 by screws, clamps, or the like, instead of adhesive.

[0020] The flat surface 284 of the sub-pad 280 contacts the polishing pad 300, thereby providing support for the polishing pad 300. More specifically, the sub-pad 280 is elastic. This allows the sub-pad 280 to mitigate pressure inconsistencies caused by the multiple holes 286 and connecting grooves 266 (described later) during polishing of the substrate W. Furthermore, even if the substrate W is warped, the elastic sub-pad 280 deforms to conform to the warping of the substrate W, thereby applying uniform pressure to the substrate W.

[0021] Furthermore, for example, multiple grooves 246 are formed on the flat surface 244 of the table 240. The tops of the multiple grooves 246 are blocked by the tabletop 260. This allows the multiple grooves 246 to function as flow paths. In addition, the multiple grooves 246 are in fluid communication with a cooling water supply source (not shown). This allows the cooling water to flow through the multiple grooves 246.

[0022] By the way, the slurry used in the polishing apparatus 100 may contain chemicals. Generally, as the temperature rises, the reaction rate of chemicals increases, and the slurry polishes the substrate W. The polishing speed may also increase. If the amount of polishing on the substrate W increases as the table 240 heats up, it will result in differences in the polishing outcome, which is undesirable. In contrast, the polishing apparatus 100 can maintain a constant temperature of the table 240 using cooling water, and as a result, it can suppress differences in the amount of polishing on the substrate W.

[0023] The polishing device 100 also has a tube 102. The table assembly 200 has a plurality of connectors 206. The tube 102 connects the vacuum source 902 to the plurality of connectors 206, and also connects the fluid supply source 903 to the plurality of connectors 206. The plurality of connectors 206 are each connected to one end of a plurality of holes 248 formed in the table 240. On the other hand, the other ends of the plurality of holes 248 are each connected to one end of a plurality of holes 268 formed in the tabletop 260. Furthermore, the other ends of the plurality of holes 268 are each connected to connection grooves 266 formed in the plane 264 of the tabletop 260. In other words, the connection grooves 266 are in fluid communication with the vacuum source 902 and the fluid supply source 903. That is, the tube 102, the plurality of connectors 206, the plurality of holes 248 and the plurality of holes 268 function as flow paths that provide fluid communication between the connection grooves 266 and the vacuum source 902 and the fluid supply source 903. In other words, the multiple holes 268 constitute a flow path 272 that provides fluid communication between the connecting groove 266 and the vacuum source 902 and the fluid supply source 903. The polishing device 100 has a valve (not shown) for switching between fluid communication between the connecting groove 266 and the vacuum source 902 and fluid communication between the connecting groove 266 and the fluid supply source 903. The control device 130 is configured to control this valve. Because the polishing device 100 has this configuration, it can create a vacuum in the connecting groove 266 and supply fluid to the connecting groove 266 as needed. As mentioned above, since the table assembly 200 is configured to rotate, the polishing device 100 may be equipped with a rotary joint (not shown) between the multiple connectors 206 and the vacuum source 902 and the fluid supply source 903 as needed.

[0024] Furthermore, the sub-pad 280 has multiple holes 286 that extend from the plane 284 toward the plane 282 and penetrate the sub-pad 280. These multiple holes 286 are in fluid communication with each other via a connecting groove 266. As a result, when the connecting groove 266 is evacuated, the multiple holes 286 can suck in the polishing pad 300. Consequently, the polishing pad 300 is fixed to the table assembly 200. On the other hand, when fluid is supplied to the connecting groove 266, the fluid is sprayed from the multiple holes 286 onto the polishing pad 300. This blows the polishing pad 300 away from the table assembly 200. As a result, the polishing pad 300 slides more easily when it is being slid.

[0025] As described above, in the polishing apparatus 100, multiple holes 286 are fluidly connected to each other via connecting grooves 266 (see Figures 3 and 4). This makes it easier to manufacture the polishing apparatus 100 even when a larger number of holes 286 are provided. This is because, if the multiple holes 286 are not fluidly connected by connecting grooves 266, the flow paths connecting the multiple holes 286 to the vacuum source 902 and the fluid supply source 903 may become complicated, and it would be necessary to provide a large number of connectors inside the table assembly 200. In contrast, in the polishing apparatus 100, only the easily processed connecting grooves 266 are formed on the flat surface 264 of the tabletop 260 (see Figure 4), enabling fluid communication between the multiple holes 286 to the vacuum source 902 and the fluid supply source 903. For this reason, even when a large number of holes 286 are provided, the manufacturing of the polishing apparatus 100 is easier than that of a polishing apparatus without connecting grooves 266.

[0026] As described above, the polishing device 100 can remove the polishing pad 300 from the table assembly 200 by blowing it with fluid sprayed from multiple holes 286. In this case, if the fluid sprayed from the multiple holes 286 is a gas, there is a risk that the slurry used for polishing the substrate W will be stirred up and contaminate the surrounding equipment. In response to this, the fluid supply source 903 is configured to supply water (pure water) as an example. In other words, the polishing device 100 is configured to supply water The device is configured to spray a liquid from multiple holes 286. Water is heavier than gas and does not easily scatter into the atmosphere. For this reason, the polishing device 100 does not easily stir up the slurry. In another embodiment of the present disclosure, the polishing device 100 may be configured to spray a liquid other than water from multiple holes 286. In yet another embodiment of the present disclosure, the polishing device 100 may be configured to spray a gas from multiple holes 286, although this makes it easier to stir up the slurry, as it allows the polishing pad 300 to be detached from the table assembly 200.

[0027] Furthermore, the polishing apparatus 100 has a gas-liquid separation tank 104 upstream of the vacuum source 902 (see Figure 3). As a result, liquids such as slurry and water supplied during blowing are separated in the gas-liquid separation tank 104 when suction occurs. Consequently, the vacuum source 902 itself does not suck up any liquid.

[0028] Furthermore, the connecting groove 266 has, for example, a grid shape (see Figure 4). In other words, the flat surface 264 of the tabletop 260 has a contact surface 270 that is surrounded by the connecting groove 266 and in contact with the flat surface 282 of the sub-pad 280. As a result, when the polishing pad 300 is sucked in, the contact surface 270 supports the sub-pad 280. Consequently, the flatness of the sub-pad 280 is maintained, and deformation is prevented. This prevents problems such as the sub-pad 280 deforming, blocking the connecting groove 266, and preventing some of the multiple holes 286 from sucking in the polishing pad 300.

[0029] ≪HP operation of polishing device 100≫ The polishing apparatus 100 is configured, for example, to perform an HP (home position) operation as a preparatory operation before polishing the substrate W. The HP operation will be explained below with reference to Figures 5A to 5D and Figure 6. Figures 5A to 5D are diagrams illustrating the HP operation. Figure 6 is a flowchart showing one procedure of the control process of the control device 130 during the HP operation.

[0030] When the polishing device 100 starts HP operation, the control device 130 causes the table assembly 200 to blow the polishing pad 300 in step S102 (see Figure 5A). As a result, fluid is sprayed from multiple holes 286 toward the polishing pad 300. Consequently, the polishing pad 300 is separated from the flat surface 284.

[0031] Next, in step S104, the control device 130 stops the rotation of the polishing pad 300 roll of the first polishing pad holding module 310 and causes the second polishing pad holding module 320 to wind up the polishing pad 300 with a predetermined torque (see Figure 5B). For example, the torque may be determined so that the tension acting on the polishing pad 300 is a constant value or a set value input as a recipe to the control device 130. At this time, the second polishing pad holding module 320 cannot wind up the polishing pad 300 due to the torque limit, but tension is applied to the polishing pad 300. As a result, the polishing pad 300 becomes taut. Next, in step S106, the control device 130 causes the table assembly 200 to suck up the polishing pad 300 (see Figure 5C). As a result, the polishing pad 300 sticks to the flat surface 284 of the table assembly 200 while remaining taut.

[0032] Next, in step S108, the control device 130 stops winding the second polishing pad holding module 320 (see Figure 5D). After step S108, the control device 130 terminates the operation flow. By performing the above operations, the polishing device 100 can hold the polishing pad 300, which is under a predetermined tension, on the sub-pad by suction. The polishing device 100 may polish a predetermined number of substrates W after the HP operation.

[0033] ≪Feed operation of polishing device 100≫ Figures 7A to 7H are diagrams illustrating the feeding operation. Figure 8 is a flowchart showing one step of the control process during the feeding operation of the control device 130. The feeding operation of the polishing pad 300 of the polishing device 100 will be explained with reference to Figures 7A to 7H and Figure 8. As an example, the feeding operation starts from the state after the HP operation is completed (see Figure 7A).

[0034] When the polishing device 100 starts feeding the polishing pad 300, the control device 130, in step S202, causes the motor 110 to rotate the table assembly 200 (see Figure 7B). This removes excess liquid from the polishing pad 300. If the atomizer is spraying liquid onto the polishing surface, the control device 130 stops the atomizer before causing the motor 110 to rotate the table assembly 200. Then, in step S204, the control device 130 causes the motor 110 to stop rotating the table assembly 200.

[0035] Next, in step S206, the control device 130 causes the table assembly 200 to blow the polishing pad 300 (see Figure 7C). This causes the polishing pad 300 to peel off from the flat surface 284 of the sub-pad 280.

[0036] Next, in step S208, the control device 130 stops the rotation of the polishing pad 300 roll of the first polishing pad holding module 310 and causes the second polishing pad holding module 320 to wind up the polishing pad 300 with a predetermined torque (see Figure 7D). For example, the torque may be determined so that the tension acting on the polishing pad 300 is a constant value or a set value input as a recipe to the control device 130. At this time, the second polishing pad holding module 320 cannot wind up the polishing pad 300 due to the torque limit, but a predetermined tension is applied to the polishing pad 300. Next, the control device 130 checks the winding status of the polishing pad 300 in the first polishing pad holding module 310 and the second polishing pad holding module 320 and stores the feed amount of the polishing pad 300 as zero.

[0037] Next, in step S210, the control device 130 causes the first polishing pad holding module 310 to start feeding the polishing pad 300 so that the feed speed of the polishing pad 300 remains constant (see Figure 7E). More specifically, the first polishing pad holding module 310 is set to feed the polishing pad 300 at a predetermined feed speed. On the other hand, the second polishing pad holding module 320 is set to a torque limit value so that a predetermined tension acts on the polishing pad 300. The torque limit value is calculated as the product of the predetermined tension and the pad radius wound onto the second polishing pad holding module 320. Furthermore, the second polishing pad holding module 320 is set to wind up the polishing pad 300 at a winding speed faster than the feed speed of the first polishing pad holding module 310. Therefore, the first polishing pad holding module 310 tries to pull back the polishing pad 300 in opposition to the second polishing pad holding module 320, which is trying to wind up the polishing pad 300 faster. As a result, the polishing pad 300 is fed from the first polishing pad holding module 310 to the second polishing pad holding module 320 at a speed that matches the feed rate set in the first polishing pad holding module 310. Furthermore, the tension acting on the polishing pad 300 matches the tension set in the second polishing pad holding module 320. In other words, the polishing pad 300 is fed at a predetermined speed while being taut under a predetermined tension.

[0038] Furthermore, the control device 130 refers to the feed rate of the polishing pad 300 of the first polishing pad holding module 310 and calculates the feed amount of the polishing pad 300 from the position where the feed amount is zero. In addition, the control device 130 refers to the winding rate of the polishing pad 300 of the second polishing pad holding module 320 and calculates the winding amount of the polishing pad 300 from the position where the feed amount is zero. If the difference between the feed amount of the first polishing pad holding module 310 and the winding amount of the second polishing pad holding module 320 exceeds a certain value, the control device 130 reports an error, indicating that there is some kind of malfunction.

[0039] Next, when a predetermined amount of polishing pad 300 is sent from the first polishing pad holding module 310 to the second polishing pad holding module 320, in step S212, the control device 130 stops the first polishing pad holding module 310 from feeding the polishing pad 300 (see Figure 7F). At this time, the second polishing pad holding module 320 is winding up the polishing pad 300 with a predetermined torque, but the second polishing pad holding module 320 is unable to wind up the polishing pad 300 due to torque limitations.

[0040] Next, in step S214, the control device 130 causes the table assembly 200 to suck the polishing pad 300 (see Figure 7G). As a result, the polishing pad 300 adheres tightly to the flat surface 284 of the table assembly 200.

[0041] Next, in step S216, the control device 130 stops winding the second polishing pad holding module 320 (see Figure 7H). After step S216, the control device 130 terminates the operation flow. By performing the above operations, the polishing device 100 can feed the polishing pad 300.

[0042] Furthermore, the feed amount of the polishing pad 300 in the polishing device 100 may be arbitrarily determined. For example, the polishing device 100 may replace the entire portion of the polishing pad 300 that contacts the substrate W with a new portion in a single feed operation, or it may replace only a portion of the portion of the polishing pad 300 that contacts the substrate W with a new portion in a single feed operation. In addition, the polishing device 100 may perform the feed operation according to the degree of deterioration of the polishing pad. For example, the polishing device 100 may be configured to perform the feed operation after polishing a predetermined number of substrates W.

[0043] ≪Table Assembly 400≫ Figure 9 is a cross-sectional view of a table assembly 400, which is different from the table assembly 200. The polishing device 100 may be equipped with a table assembly 400 instead of a table assembly 200. The table assembly 400 has some components in common with the table assembly 200. Hereinafter, the table assembly 400 will be described focusing on the parts that differ from the table assembly 200, and the common components will be denoted by the same reference numerals in the figures and their descriptions will be omitted.

[0044] Referring to Figure 9, the table assembly 400 includes, as an example, a table base 220, a table 240, a table top 460, a component 480, and a porous component 496. The table base 220, table 240, table top 460, component 480, and polishing pad 300 are arranged in this order, as an example.

[0045] The tabletop 460 has a roughly rectangular shape and has a vertically lower plane 462 and a vertically upper plane 464. In other words, plane 462 is the back surface of plane 464. The tabletop 460 is fixed to the table 240 such that plane 462 is in contact with plane 244. The tabletop 460 is provided with a plurality of holes 468 that connect a plurality of holes 248 and a recess 492 described later. The plurality of holes 468 constitute a flow path 472 that provides fluid communication between the recess 492 and the vacuum source 902 and the fluid supply source 903.

[0046] Member 480, for example, has a roughly rectangular shape and has a vertically lower plane 482 and a vertically upper plane 484. In other words, plane 482 is the back surface of plane 484. Member 480 is fixed to the tabletop 260 such that plane 482 is in contact with plane 464. A rectangular recess 492 is formed in plane 482 of member 480. A porous member 496 having the same shape as the recess 492 is placed inside the recess 492. Since the porous member 496 has many holes inside, fluid can flow inside the porous member 496.

[0047] Furthermore, the component 480 includes, for example, a frame 486 and a sub-pad 488. The frame 486 has a rectangular opening 494 that extends from a flat surface 484 to a recess 492. A sub-pad 488, which has the same shape as the opening 494, is placed inside the opening 494. The sub-pad 488 is made of rubber, resin, or nonwoven fabric and is attached to the porous member 496 with an adhesive. The sub-pad 488 is, for example, a consumable part and is replaced by peeling it off the porous member 496. Also, by contacting the polishing pad 300, the sub-pad 488 has the function of supporting the polishing pad 300.

[0048] Furthermore, the sub-pad 488 of member 480 has a plurality of holes 490 that extend from the plane 484 toward the plane 482 and penetrate through member 480. The plurality of holes 490 are in fluid communication with each other via recesses 492. This makes it easier to manufacture the polishing apparatus 100 having the table assembly 400, even when a larger number of holes 490 are provided. The reason for this is the same as for the polishing apparatus 100 having the table assembly 200, so the explanation of this reason will be omitted.

[0049] Furthermore, in the table assembly 400, the porous member 496 is positioned inside the recess 492. This allows the porous member 496 to support the sub-pad 488 when the table assembly 400 sucks the polishing pad 300. As a result, even if the recess 492 is relatively large, the sub-pad 488 is less likely to deform during suction.

[0050] ≪Table Assembly 500≫ Figure 10 is a cross-sectional view of a table assembly 500, which is separate from table assemblies 200 and 400. The polishing apparatus 100 may also include a table assembly 500 instead of table assemblies 200 and 400. Table assembly 500 has some components in common with table assembly 200. Hereinafter, the table assembly 500 will be described focusing on the parts that differ from table assembly 200, and common components will be denoted by the same reference numerals in the figures and their descriptions will be omitted.

[0051] Referring to Figure 10, the table assembly 500 includes, as an example, a polishing table 510 and a sub-pad 280. The polishing table 510 includes a table base 220, a table 240, and a tabletop 560. The table base 220, table 240, tabletop 560, sub-pad 280, and polishing pad 300 are arranged in this order, as an example.

[0052] The tabletop 560 has a roughly rectangular shape and has a vertically downward surface 562 and a vertically upward surface (an example of a surface) 564. In other words, surface 562 is the back surface of surface 564. The tabletop 560 is fixed to the table 240 such that surface 562 is in contact with surface 244. A connecting groove 566 is formed in surface 564 of the tabletop 560. Multiple holes 286 are in fluid communication with each other via the connecting groove 566.

[0053] Furthermore, the table assembly 500 has multiple holes 568 that constitute a first flow path 502 that fluidly connects the connection groove 266 and the vacuum source 902, and multiple holes 570 that constitute a second flow path 504 that fluidly connects the connection groove 266 and the fluid supply source 903. The first flow path 502 and the second flow path 504 are separated from each other. As a result, the table assembly 500 is less likely to stir up slurry than the table assembly 200 when blowing the polishing pad 300. The reason for this is explained below.

[0054] In the table assembly 200, the holes 268 are used for both suction and blowing (see Figure 3). Therefore, slurry may enter one of the holes 268 during suction. Then, during blowing, this slurry may be ejected from one of the holes 268, potentially causing more slurry to be drawn up.

[0055] In contrast, in the table assembly 500, the first channel 502 and the second channel 504 are separated from each other. As a result, the slurry is less likely to enter the second channel 504 during suction, and less likely to be stirred up during blowing.

[0056] Furthermore, in the polishing apparatus 100 equipped with a table assembly 500, the control device 130 controls the polishing apparatus 100 so that when the fluid in the connecting groove 566 is being sucked in by the vacuum source 902, fluid is supplied to the connecting groove 566 from the second channel 504. As a result, even if slurry enters the connecting groove 566 during suction, it is difficult for the slurry to enter the second channel 504. Consequently, slurry is less likely to be blown up during blowing.

[0057] Furthermore, in the table assembly 500, the cross-section of the second channel 504 is, for example, circular in shape with a diameter of 0.5 mm or less. More specifically, the diameter of the cross-section of the second channel 504 is smaller than the diameter of the cross-section of the first channel 502. Because the diameter of the second channel 504 is relatively small, even if only a small flow rate is supplied from the second channel 504, the slurry is less likely to enter the second channel 504 during suction.

[0058] ≪Table Assembly 600≫ Figure 11 is a cross-sectional view of table assembly 600, which is separate from table assemblies 200, 400, and 500. Figure 12 is an exploded perspective view showing the structure of the tabletop 660 of table assembly 600. The polishing device 100 may include table assembly 600 instead of table assemblies 200, 400, and 500. Table assembly 600 has some components in common with table assembly 200. Hereinafter, the table assembly 600 will be described focusing on the parts that differ from table assembly 200, and common components will be denoted by the same reference numerals in the figures and their descriptions will be omitted.

[0059] Referring to Figure 11, the table assembly 600 includes, as an example, a polishing table 610 and a sub-pad 280. The polishing table 610 includes a table base 220, a table 240, and a table top 660. The table base 220, table 240, table top 660, sub-pad 280, and polishing pad 300 are arranged in this order, as an example.

[0060] The tabletop 660 has a roughly rectangular shape and has a vertically downward surface 662 and a vertically upward surface (an example of a surface) 664. In other words, surface 662 is the back surface of surface 664. The tabletop 660 is fixed to the table 240 such that surface 662 is in contact with surface 244. A connecting groove 666 is formed in surface 664 of the tabletop 660. Multiple holes 286 are in fluid communication with each other via the connecting groove 666. The tabletop 660 also has multiple holes 668 that form a flow path 602 that provides fluid communication between the connecting groove 666 and the vacuum source 902 and the fluid supply source 903. Furthermore, an outer peripheral groove 672 is formed in surface 664 of the tabletop 660, surrounding the connecting groove 666 and separated from the connecting groove 666. Furthermore, the tabletop 660 has multiple holes 670 that constitute a flow path 604 that provides fluid communication between the outer periphery groove 672 and the fluid supply source 903.

[0061] The sub-pad 280 has a plurality of outer peripheral holes 288 that extend from the plane 284 toward the plane 282 and penetrate the sub-pad 280. Furthermore, the plurality of outer peripheral holes 288 are multiple The grooves are positioned to surround the number of holes 286 and are in fluid communication with each other via the outer periphery groove 672. The control device 130 controls the polishing device 100 so that fluid is supplied to the outer periphery groove 672 when the fluid in the connecting groove 666 is sucked out by the vacuum source 902. Because the table assembly 600 has this configuration, it is less likely to stir up slurry when the polishing pad 300 is blown out compared to the table assembly 200. The reason for this is explained below.

[0062] In the table assembly 200, slurry can enter the holes 286 and connecting grooves 266 during suction (see Figure 3). As a result, the slurry in the holes 286 and connecting grooves 266 is blown up. Consequently, a larger amount of slurry may be blown up.

[0063] In contrast, in the table assembly 600, when suction occurs, fluid is supplied to the outer peripheral groove 672 and ejected from the multiple outer peripheral holes 288. The multiple outer peripheral holes 288 are arranged to surround the multiple holes 286. As a result, a region is created around the region where the multiple holes 286 suction the polishing pad 300, where the multiple outer peripheral holes 288 supply fluid. Consequently, the region where the multiple outer peripheral holes 288 supply fluid prevents slurry from entering between the polishing pad 300 and the sub-pad 280 and entering the multiple holes 286. In other words, slurry is less likely to enter the holes 286 and the connecting groove 666.

[0064] On the other hand, during blowing, fluid is sprayed onto the polishing pad 300 from the multiple outer peripheral holes 288 and multiple holes 286, causing the polishing pad 300 to peel off. At this time, since there is not much slurry in the multiple holes 286 and connecting grooves 666, the slurry is not easily stirred up by the fluid passing through the multiple holes 286 and connecting grooves 666. Therefore, the polishing device 100 equipped with the table assembly 600 is less likely to stir up slurry.

[0065] [Note] Some or all of the above embodiments may also be described as follows, but are not limited to the following:

[0066] (Note 1) The polishing apparatus described in Appendix 1 is a polishing apparatus comprising a rotatable polishing table for holding a polishing pad for polishing a substrate, the polishing table having a connecting groove on its surface, a flow path formed in the polishing table for fluid communication between the connecting groove and a vacuum source, the polishing table being configured such that when a sub-pad having a plurality of holes is attached, the connecting groove fluidly communicates the plurality of holes with each other, and the polishing apparatus being configured to suck the polishing pad through the plurality of holes by evacuating the connecting groove and holding the polishing pad on the surface of the sub-pad.

[0067] The polishing apparatus described in Appendix 1 is easier to manufacture than a polishing apparatus that does not have a connecting groove.

[0068] (Note 2) The polishing apparatus relating to Appendix 2 is the polishing apparatus described in Appendix 1, wherein the polishing apparatus has a replaceable sub-pad, and the sub-pad is attached to the surface by an adhesive.

[0069] (Note 3) The polishing apparatus relating to Appendix 3 is the polishing apparatus described in Appendix 1 or 2, wherein the surface is surrounded by the connecting groove and has a contact plane that can contact the sub-pad.

[0070] In the polishing apparatus described in Appendix 3, the flatness of the sub-pad is maintained and deformation of the sub-pad is prevented.

[0071] (Note 4) The polishing apparatus relating to Appendix 4 is the polishing apparatus described in any one of Appendix 1 to 3, wherein the flow path has a second flow path that fluidly connects the connecting groove and the fluid supply source.

[0072] The polishing apparatus described in Appendix 4 can remove the polishing pad from the polishing table by blowing.

[0073] (Note 5) The polishing apparatus relating to Appendix 5 is the polishing apparatus described in Appendix 4, wherein the polishing apparatus is configured such that liquid is sprayed from the plurality of holes.

[0074] The polishing apparatus described in Appendix 5 is less likely to stir up the slurry.

[0075] (Note 6) The polishing apparatus relating to Appendix 6 is the polishing apparatus described in any one of Appendix 1 to 5, wherein the flow path has a first flow path that fluidly connects the connecting groove and the vacuum source, and a second flow path that fluidly connects the connecting groove and the fluid supply source, and the first flow path and the second flow path are separated from each other.

[0076] In the polishing apparatus described in Appendix 6, the slurry is less likely to be stirred up.

[0077] (Note 7) The polishing apparatus relating to Appendix 7 is the polishing apparatus described in Appendix 6, comprising a control device, the control device controlling the polishing apparatus so that fluid is supplied to the connecting groove from the second flow path when the fluid in the connecting groove is being drawn in by the vacuum source.

[0078] In the polishing apparatus described in Appendix 7, the slurry is less likely to be stirred up.

[0079] (Note 8) The polishing apparatus relating to Appendix 8 is the polishing apparatus described in Appendix 6 or 7, wherein the diameter of the cross-section of the second channel is smaller than the diameter of the cross-section of the first channel.

[0080] In the polishing apparatus described in Appendix 8, the slurry is less likely to be stirred up.

[0081] (Note 9) The polishing apparatus according to Appendix 9 is the polishing apparatus described in Appendix 2, comprising a control device, wherein an outer peripheral groove is formed on the surface of the polishing table, surrounding the connecting groove and separated from the connecting groove, a flow path is formed in the polishing table to fluidly communicate the outer peripheral groove and a fluid supply source, a plurality of outer peripheral holes are formed in the sub-pad, the plurality of outer peripheral holes are in fluid communication with each other via the outer peripheral groove, and the control device controls the polishing apparatus so that fluid is supplied to the outer peripheral groove when the fluid in the connecting groove is sucked by the vacuum source.

[0082] In the polishing apparatus described in Appendix 9, the slurry is less likely to be stirred up.

[0083] (Note 10) The polishing apparatus relating to Appendix 10 is a polishing apparatus described in any one of Appendix 1 to 9, comprising a first polishing pad holding module configured to be rotatable integrally with the polishing table and configured to hold the polishing pad wound in a roll shape, and the polishing table and The device comprises a second polishing pad holding module, which is configured to be rotatable to the body and to hold the polishing pad wound in a roll, wherein the polishing pad supplied from the first polishing pad holding module is wound onto the second polishing pad holding module, causing the polishing pad to slide along the surface.

[0084] The embodiments of the present invention and their respective modifications have been described above. It goes without saying that the examples described above are for the purpose of facilitating understanding of the present invention and do not limit it. The present invention can be modified and improved as appropriate without departing from its spirit, and equivalents thereof are included in the present invention. Furthermore, any combination or omission of the components described in the claims and specification is possible to the extent that at least a part of the above-described problems can be solved or at least a part of the effects can be achieved. [Explanation of Symbols]

[0085] 100: Polishing equipment 110: Motor 120: Top Ring 130: Control device 200: Table Assembly 210: Polishing Table 220: Table base 240: Table 260: Tabletop 264: Plane (an example of a surface) 266: Connection groove 268: Hole 270: Contact plane 272: Flow path 280: Sub-pad 282: Plane 284: Plane 286: Hole 288: Peripheral hole 300: Polishing pad 310: First polishing pad holding module 320: Second polishing pad holding module 400: Table Assembly 460: Tabletop 464: Plane 468: Hole 480: Components 482: Plane 484: Plane 488: Sub-pad 490: Hole 492: Recess 496: Porous material 500: Table Assembly 502: First channel 504: Second channel 510: Polishing Table 560: Tabletop 564: Plane (an example of a surface) 566: Connection groove 600: Table Assembly 602: Flow channel 604: Flow channel 610: Polishing table 660: Tabletop 664: Plane (an example of a surface) 666: Connection groove 672: Outer perimeter groove 902: Vacuum source 903: Fluid supply source C1: Central axis W: Circuit board

Claims

1. A polishing device, It features a rotatable polishing table for holding a polishing pad for polishing a substrate, The polishing table has connecting grooves on its surface, The polishing table has a flow path formed therein that allows fluid communication between the connecting groove and the vacuum source. The polishing table is configured such that when a sub-pad with multiple holes is attached, the connecting grooves allow the multiple holes to communicate fluidly with each other. The polishing apparatus is configured such that the polishing pad is sucked through the plurality of holes by vacuuming the connecting groove, and the polishing pad is held on the surface of the sub-pad. Polishing equipment.

2. A polishing apparatus according to claim 1, The polishing device has a replaceable sub-pad, The sub-pad is attached to the surface by an adhesive. Polishing equipment.

3. A polishing apparatus according to claim 1, The surface is surrounded by the connecting groove and has a contact plane that can contact the sub-pad. Polishing equipment.

4. A polishing apparatus according to claim 1, The aforementioned flow path has a second flow path that provides fluid communication between the connecting groove and the fluid supply source. Polishing equipment.

5. The polishing apparatus according to claim 4, The polishing apparatus is configured such that liquid is ejected from the plurality of holes. Polishing equipment.

6. A polishing apparatus according to claim 1, The flow path comprises a first flow path that provides fluid communication between the connection groove and the vacuum source, and a second flow path that provides fluid communication between the connection groove and the fluid supply source. The first channel and the second channel are separated from each other. Polishing equipment.

7. The polishing apparatus according to claim 6, Equipped with a control device, The control device controls the polishing apparatus so that when the fluid in the connecting groove is being drawn in by the vacuum source, fluid is supplied to the connecting groove from the second channel. Polishing equipment.

8. The polishing apparatus according to claim 6, The diameter of the cross-section of the second channel is smaller than the diameter of the cross-section of the first channel. Polishing equipment.

9. The polishing apparatus according to claim 2, Equipped with a control device, The surface of the polishing table surrounds the connecting groove and is separated from the connecting groove. Outer perimeter grooves are formed, The polishing table has a flow path formed therein that allows fluid communication between the outer groove and the fluid supply source. The sub-pad has a plurality of outer peripheral holes surrounding the plurality of holes, The plurality of outer peripheral holes are in fluid communication with each other via the outer peripheral grooves, The control device controls the polishing apparatus so that fluid is supplied to the outer circumferential groove when the fluid in the connecting groove is being sucked out by the vacuum source. Polishing equipment.

10. A polishing apparatus according to any one of claims 1 to 9, A first polishing pad holding module is configured to be rotatable integrally with the polishing table and to hold the polishing pad wound in a roll shape, A second polishing pad holding module is configured to be rotatable integrally with the polishing table and to hold the polishing pad wound in a roll shape, Equipped with, The polishing pad supplied from the first polishing pad holding module is wound onto the second polishing pad holding module, so that the polishing pad slides along the surface. Polishing equipment.

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