Grinding device

Abstract

The present invention provides a polishing device that allows a polishing pad held on a polishing table to be smoothly removed from the polishing table. [Solution] A polishing apparatus for polishing a substrate using a polishing pad is proposed, comprising a polishing table configured to rotate and defining a polishing pad holding surface for holding the polishing pad, the polishing pad holding surface having suction holes connected to a vacuum source, and the polishing table comprising a movable member configured to move between a protruding state that protrudes from the polishing pad holding surface and pushes the polishing pad held on the polishing table away from the polishing pad holding surface, and a retracted state in which it does not protrude from the polishing pad holding surface.

Description

Technical Field

[0001] The present invention relates to a polishing apparatus.

Background Art

[0002] In semiconductor manufacturing processes, a polishing (CMP: Chemical Mechanical Polishing) apparatus is used to polish substrates. An example of such a polishing apparatus is disclosed in Patent Document 1. The polishing apparatus (polishing apparatus) disclosed in Patent Document 1 includes a polishing table, and the polishing table is provided with a suction holding portion for holding a polishing pad by vacuum suction on the upper surface thereof. The suction holding portion is configured by connecting a vacuum source such as a vacuum pump to a plurality of vacuum suction holes opened on the upper surface of the polishing table. Thereby, in this polishing apparatus, the polishing pad can be suction-held on the upper surface of the polishing table. As a result, the polishing pad is prevented from being displaced relative to the polishing table during polishing.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of Invention

Problems to be Solved by the Invention

[0004] In the above-described polishing table, when replacing the polishing pad, the vacuum suction of the polishing pad is stopped, and the polishing pad is peeled off and removed from the polishing table. However, for example, due to polishing liquid entering between the polishing pad and the polishing table, or due to the material of the polishing pad or the polishing table, the polishing pad and the polishing table may adhere to each other. Therefore, even if the vacuum suction of the polishing pad is stopped, it may be difficult to smoothly remove the polishing pad from the polishing table.

[0005] The present invention has been made to solve at least some of the above-mentioned problems, and one of its objectives is to provide a polishing apparatus that can smoothly remove a polishing pad held on a polishing table from the polishing table. [Means for solving the problem]

[0006] According to one embodiment of the present invention, a polishing apparatus for polishing a substrate using a polishing pad is proposed, comprising a polishing table configured to rotate and defining a polishing pad holding surface for holding the polishing pad, wherein the polishing pad holding surface has suction holes connected to a vacuum source, and the polishing table comprises a movable member configured to move between a protruding state in which it protrudes from the polishing pad holding surface and pushes the polishing pad held on the polishing table away from the polishing pad holding surface, and a retracted state in which it does not protrude from the polishing pad holding surface. [Brief explanation of the drawing]

[0007] [Figure 1] This is a front view of a polishing apparatus according to one embodiment of the present disclosure. [Figure 2] This is a plan view of the polishing table of the polishing machine. [Figure 3] This is a cross-sectional view showing the schematic configuration of the polishing table in this embodiment. [Figure 4] This figure shows an example of a movable member and drive mechanism in the retracted position. [Figure 5] This figure shows an example of a movable member and drive mechanism in a protruding state. [Figure 6] This is a schematic plan view showing the polishing table of this embodiment. [Figure 7A] This is a diagram illustrating the feeding mechanism of the polishing pad P1. [Figure 7B] This is a diagram illustrating the feeding mechanism of the polishing pad P1. [Figure 7C] This is a diagram illustrating the feeding mechanism of the polishing pad P1. [Figure 8A]This is a diagram illustrating the feeding operation of the polishing table in the second embodiment. [Figure 8B] This is a diagram illustrating the feeding operation of the polishing table in the second embodiment. [Figure 8C] This is a diagram illustrating the feeding operation of the polishing table in the second embodiment. [Figure 8D] This is a diagram illustrating the feeding operation of the polishing table in the second embodiment. [Figure 9] This figure shows a schematic configuration of the polishing table in the third embodiment. [Modes for carrying out the invention]

[0008] Embodiments of the present invention will be described below with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and redundant descriptions are omitted.

[0009] <First Embodiment> Figure 1 is a front view of a polishing apparatus 1000 according to one embodiment of the present disclosure. Figure 2 is a plan view of the polishing table 30 of the polishing apparatus 1000. The polishing apparatus 1000 has the function of polishing a substrate WF using a polishing pad P1. Here, "substrate" includes not only semiconductor substrates, glass substrates, liquid crystal substrates, and printed circuit boards, but also magnetic recording media, magnetic recording sensors, mirrors, optical elements, micro-mechanical elements, or partially manufactured integrated circuits, and any other object to be processed. The substrate WF can be any shape, including polygons and circles. The polishing apparatus 1000 of this embodiment comprises a polishing table 30, a top ring 40, and a controller 900.

[0010] The polishing table 30, for example, has a substantially T-shape in a side view (see Figure 1) and a rectangular shape in a top view (see Figure 2). The polishing table 30 comprises a polishing table body 31 and a tabletop 32 that defines the upper surface on which the sub-pad SP is placed. In this embodiment, the polishing table 30 supports a polishing pad P1 for polishing the substrate WF via the sub-pad SP.

[0011] The sub-pad SP is not particularly limited as long as polishing can be performed with desired accuracy, and various materials, dimensions, and the like can be adopted. As an example, the sub-pad SP has a substantially rectangular parallelepiped shape and is formed of resin or non-woven fabric. The sub-pad SP can be provided by being adhered to the upper surface of the table top 32 with an adhesive or the like. The upper surface of the sub-pad SP defines a polishing pad holding surface SP1 that holds the polishing pad P1. The sub-pad SP can be a consumable item and can be replaced at a desired timing. However, the polishing table 30 may not be provided with the sub-pad SP. When the polishing table 30 does not include the sub-pad SP, the upper surface of the table top 32 defines the polishing pad holding surface.

[0012] The polishing pad P1 is arranged on the polishing pad holding surface SP1 which is the upper surface of the sub-pad SP, and is sucked through a sub-pad suction hole SP8 (FIG. 3) which will be described later and opens to the polishing pad holding surface SP1. The upper surface of the polishing pad P1 (the surface opposite to the surface in contact with the polishing pad holding surface SP1) constitutes a polishing surface for polishing the substrate WF.

[0013] In the present embodiment, a supply hole 37 for supplying a polishing liquid such as slurry is provided in the vicinity of the center of the polishing table 30 (see FIG. 2). Holes are formed in the sub-pad SP and the polishing pad P1 at positions corresponding to the supply holes 37. Thereby, when polishing the substrate WF, the polishing liquid is supplied from the supply hole 37 to the polishing surface of the polishing pad P1. Such a configuration can suitably supply the polishing liquid even particularly when the substrate WF continues to cover the center of the polishing surface during polishing. Although four supply holes 37 are shown in FIG. 2, the number of the supply holes 37 is not particularly limited, and may be 1 to 3, or 5 or more. In addition, the polishing apparatus 1000 is configured such that the supply holes 3 7 may be replaced or supplemented with a polishing liquid supply port such as a nozzle provided above the polishing pad P1 to supply the polishing liquid to the polishing pad P1.

[0014] Further, the polishing table 30 is configured to be capable of rotating (spinning) around a central axis (spinning axis) C1 perpendicular to the polishing surface by a motor 38. As an example, the central axis C1 extends in the vertical direction through the center of the polishing pad holding surface SP1 of the sub-pad SP.

[0015] The top ring 40 is disposed above the polishing table 30 so as to be movable up and down. The top ring 40 is configured to be capable of detachably holding the substrate WF, which is the object to be polished, with the surface to be polished of the substrate WF facing downward (toward the polishing pad P1). The top ring 40 is configured to be capable of rotating (spinning) around a central axis C2. As an example, the central axis C2 extends in the vertical direction and extends parallel to the central axis C1. During polishing, in a state where the polishing liquid is supplied from the supply hole 37 to the polishing surface of the polishing pad P1, the substrate WF is pressed against the polishing surface of the polishing pad P1 by the top ring 40 to be polished. As described above, the polishing apparatus 1000 is configured to polish the substrate WF by bringing the polishing pad P1 and the substrate WF into contact with each other and causing them to perform rotational motions relative to each other in the presence of the polishing liquid.

[0016] Further, the polishing apparatus 1000 includes, as an example, an atomizer (not shown). The atomizer has a function of removing the polishing liquid, polishing products, polishing pad residues from dressing, and the like on the polishing surface by supplying at least one of a liquid (e.g., pure water) and a gas (e.g., nitrogen gas) to the polishing surface.

[0017] Further, as shown in FIG. 1, the polishing apparatus 1000 includes a first polishing pad holding module 310 and a second polishing pad holding module 320. The first and second polishing pad holding modules 310, 320 can be arranged below overhanging portions that overhang on both sides of the T-shaped polishing table 30. In the example shown in FIG. 1, the first and second polishing pad holding modules 310, 320 are located on opposite sides with respect to the central axis C1 of the polishing table 30. The first and second polishing pad holding modules 310, 320 are configured to be rotatable integrally with the polishing table 30 around the central axis C1.

[0018] The first polishing pad holding module 310 is configured to hold the supply roll 100 with its center extending horizontally. The supply roll 100 is, for example, a roll of unused polishing pads P1 wound into a roll. The configuration of the first polishing pad holding module 310 is not particularly limited as long as it can rotatably hold the supply roll 100, and could be, for example, a support base that rotatably supports the rotating shaft of the supply roll 100. The second polishing pad holding module 320 is configured to hold the winding roll 200 with its center extending horizontally. The winding roll 200 is, for example, a roll of used polishing pads P1 that have passed over the polishing table 30 wound into a roll. The configuration of the second polishing pad holding module 320 is not particularly limited as long as it can rotatably hold the winding roll 200, and could be, for example, a support base that rotatably supports the rotating shaft of the winding roll 200.

[0019] As shown in Figure 1, the polishing device 1000 comprises a first supply-side roller 110, a second supply-side roller (first tension roller) 120, a first winding-side roller 210, and a second winding-side roller (second tension roller) 220, all configured to support and guide the polishing pad P1. The first supply-side roller 110 and the second supply-side roller 120 are rollers that contact the polishing pad P1 delivered from the supply roll 100 before it reaches the polishing pad holding surface SP1 or above it. In other words, the first supply-side roller 110 and the second supply-side roller 120 are configured to contact the polishing pad P1 from the supply roll 100 to above the polishing table 30. The winding-side roller 220 is a roller that contacts the polishing pad P1, which has passed over the polishing pad holding surface SP1, before it is wound onto the winding roll 200.

[0020] The first supply-side roller 110 is positioned diagonally below the supply roll 100 such that its axis of rotation extends substantially horizontally. Similarly, the first take-up-side roller 210 is positioned diagonally below the take-up roll 200 such that its axis of rotation extends substantially horizontally. By positioning the first supply-side roller 110 and the first take-up-side roller 210 below the supply roll 100 and the take-up roll 200, respectively, it is possible to suppress the polishing fluid on the polishing surface from traveling along the polishing pad P1 to the supply roll 100 or the take-up roll 200 and adversely affecting the supply roll 100 or the take-up roll 200. At least one of the first supply-side roller 110 and the first take-up-side roller 210 may have a shape in which the outer diameter increases toward the center in the longitudinal direction (rotation axis direction). This makes it less likely for the polishing pad P1 to shift in the longitudinal direction of the first supply-side roller 110 or the first take-up-side roller 210, and less likely to meander.

[0021] The second supply-side roller 120 is a roller positioned above the first supply-side roller 110. The second winding-side roller 220 is a roller positioned above the first winding-side roller 210. The second supply-side roller 120 and the second winding-side roller 220 are positioned along the upper surface of the polishing table 30 or the polishing pad holding surface SP1, or to the side of the upper surface of the polishing table 30 or the polishing pad holding surface SP1. In this embodiment, the second supply-side roller 120 is positioned along the first side (the right side in Figure 2) of the polishing pad holding surface SP1, and the second winding-side roller 220 is positioned along the second side (the left side in Figure 2) of the polishing pad holding surface SP1, which is opposite to the first side. In this embodiment, when a predetermined tension is applied to the polishing pad P1, the polishing pad P1 is configured to extend substantially parallel to the polishing pad holding surface SP1 between the second supply-side roller 120 and the second winding-side roller 220. Here, as an example, the second supply-side roller 120 and the second winding-side roller 220 may support the polishing pad P1 at the same height as the polishing pad holding surface SP1. The second supply-side roller 120 and the second winding-side roller 220 are, for example, cylindrical in shape from the viewpoint of stretching the polishing pad P1 horizontally.

[0022] The polishing device 1000 further includes a first motor 130 that drives the rotation of the supply roll 100 and a second motor 230 that drives the rotation of the take-up roll 200. The first motor 130 and the second motor 230 are controlled by a controller 900. The first motor 130 and the second motor 230 are connected to the rotating shafts of the supply roll 100 and the take-up roll 200 via a transmission mechanism (not shown) that transmits rotational force, such as a timing belt. The first motor 130 and the second motor 230 may be positioned below the overhangs that extend from both sides of the T-shaped polishing table 30. As an example, the first motor 130 and the second motor 230 are positioned inside the supply roll 100 and the take-up roll 200 (on the side of the central axis C1).

[0023] In the polishing device 1000, the direction of movement of the polishing pad P1 supplied from the supply roll 100 is changed by the first supply-side roller 110 and the second supply-side roller 120. The polishing pad P1 then slides horizontally along the polishing pad holding surface SP1. Subsequently, the direction of movement of the polishing pad P1 is changed by the second winding-side roller 220 and the first winding-side roller 210. The polishing pad P1 is then wound onto the winding roll 200. In this way, the polishing device 1000 is configured so that the polishing pad P1 can slide along the polishing pad holding surface SP1. Therefore, in the polishing device 1000, the worn portion of the polishing pad P1 can be replaced by sliding it and replacing it with an unused portion.

[0024] Figure 3 is a cross-sectional view showing a schematic configuration of the polishing table 30 of this embodiment. As shown in the figure, the polishing table 30 of this embodiment includes a plurality of suction holes 328 opening on the upper surface of the polishing table 30, and a flow path 90 that is in fluid communication with the plurality of suction holes 328. The plurality of suction holes 328 are through holes that penetrate the tabletop 32 of the polishing table 30 in the thickness direction. The polishing apparatus 1000 further includes a vacuum source 91, a fluid supply source 92, and a pressure gauge 93 for measuring the pressure of the flow path 90. The flow path 90 may include a valve (not shown) and be configured to selectively fluid-connect the plurality of suction holes 328 to either the vacuum source 91 or the fluid supply source 92. Alternatively, the plurality of suction holes 328 may be fluid-connected to the vacuum source 91, and a fluid supply hole provided separately from the plurality of suction holes 328 may be fluid-connected to the fluid supply source 92. Note that the polishing apparatus 1000 does not necessarily have to include the fluid supply source 92. The sub-pad SP has multiple sub-pad suction holes SP8 formed at positions corresponding to the multiple suction holes 328. The sub-pad suction holes SP8 penetrate the plate-shaped sub-pad SP in the thickness direction. The sub-pad SP is positioned on the upper surface of the polishing table 30 such that the multiple sub-pad suction holes SP8 communicate with the multiple suction holes 328 formed on the upper surface of the polishing table 30.

[0025] When the polishing pad P1 is held on the polishing pad holding surface SP1, the controller 900 controls the vacuum source 91 to apply negative pressure to the flow path 90. This causes the polishing pad P1, which is above the sub-pad SP, to be vacuum-adsorbed to the polishing pad holding surface SP1. When the polishing pad P1 is to be detached from the polishing pad holding surface SP1, the controller 900 controls the fluid supply source 92 to supply fluid to the flow path 90. This causes the fluid to be ejected from the sub-pad adsorption hole SP8, promoting the separation of the polishing pad P1 from the polishing pad holding surface SP1. This injection of fluid is called blowing. The fluid supplied from the fluid supply source 92 for blowing can, for example, be a gas such as nitrogen or air, or a fluid such as water.

[0026] In this embodiment, the polishing table body 31 has a plurality of cooling grooves 31a formed therein. The upper part of the cooling grooves 31a is blocked by the table top 32. This allows the cooling grooves 31a to function as flow paths. For example, the flow paths defined by the cooling grooves 31a are provided at a distance from the adsorption holes 328 and the flow path 90 so as not to communicate with them. The cooling grooves 31a are in fluid communication with a cooling water supply source (not shown). This allows cooling water to flow through the cooling grooves 31a. With this configuration, the substrate WF can be polished while the polishing table 30 is cooled.

[0027] Furthermore, the polishing table 30 of this embodiment includes a movable member 330 that can move in a direction perpendicular to the polishing pad holding surface SP1 (vertical direction), and a drive mechanism 340 that moves the movable member 330. The movable member 330 can move between a protruding state in which it protrudes from the polishing pad holding surface SP1 and a retracted state in which it does not protrude from the polishing pad holding surface SP1. Figure 4 shows an example of the movable member 330 and drive mechanism 340 in the retracted state, and Figure 5 shows an example of the movable member 330 and drive mechanism 340 in the protruding state. As shown in Figures 3 to 5, the movable member 330 is positioned in an opening 338 that opens on the upper surface of the polishing table 30 separately from the suction holes 328, and is movable up and down within the opening 338. The movable member 330 is not limited, but as an example it is made of resin and has a generally cylindrical shape. Furthermore, in the examples shown in Figures 3 to 5, the movable member 330 has a flange portion 331, and the opening 338 has a contact portion 339 formed to be smaller in size than the flange portion 331. As a result, as shown in Figure 5, when in the protruding state, the flange portion 331 and the contact portion 339 come into contact, restricting further movement of the movable member 330.

[0028] In this embodiment, the drive mechanism 340 comprises a diaphragm 342 and a first pressure regulating mechanism 344. The diaphragm 342 defines a pressure chamber 343 within the opening 338, and the first pressure regulating mechanism 344 is connected to the pressure chamber 343. A movable member 330 is positioned on the diaphragm 342. In addition, the polishing table 30 of this embodiment is equipped with a stopper 348 on which the movable member 330 on the diaphragm 342 is placed when it is in the retracted state. With this configuration, when no pressure is supplied to the pressure chamber 343, the entire movable member 330 is in a retracted state where it does not protrude from the polishing pad holding surface SP1 (see Figure 4). In the retracted state, the movable member 330 is positioned on the stopper 348 via the diaphragm 342. Note that in the retracted state, the movable member 330 may protrude from the upper surface of the polishing table 30, or it may be positioned below the upper surface without protruding from the upper surface of the polishing table 30. On the other hand, when the inside of the pressure chamber 343 is pressurized by the first pressure adjustment mechanism 344, the diaphragm 342 expands upward, and a part of the movable member 330 comes out of the opening 338 and protrudes from the polishing pad holding surface SP1 (see Figure 5). In the protruding state, the flange portion 331 of the movable member 330 and the contact portion 339 of the opening 338 come into contact, restricting upward movement. Also, in the protruding state, the movable member 330 protrudes from the polishing pad holding surface SP1, pushing the polishing pad P1 placed on the polishing pad holding surface SP1 and physically separating it from the polishing pad holding surface SP1. The diaphragm 342 can be any type that displaces in accordance with the pressure in the pressure chamber 343, and a bellows diaphragm is one example. The first pressure adjustment mechanism 344 can be any type that can adjust the pressure in the pressure chamber 343 by supplying a fluid such as machine material or liquid to the pressure chamber 343, and a fluid supply source 92 may be used. Furthermore, although not limited, it is preferable that the corners of the top of the movable member 330 are rounded so as not to damage the polishing pad P1 by contact with it.

[0029] Furthermore, in the polishing table 30 of this embodiment, a second pressure adjustment mechanism 345 is connected to the space where the movable member 330 is located within the opening 338, that is, the space outside the pressure chamber 343 within the opening 338. The second pressure adjustment mechanism 345 can be any device capable of pressurizing the opening 338 by supplying a fluid such as a machine or liquid, and a fluid supply source 92 may be used. By supplying a first pressure higher than the ambient pressure in the polishing device 1000 into the opening 338 from the second pressure adjustment mechanism 345, fluid flows out from the gap between the movable member 330 and the opening 338. This prevents polishing fluid and the like from flowing into the opening 338. In this configuration, when moving the movable member 330 to the protruding state, the first pressure adjustment mechanism 344 may supply a second pressure higher than the first pressure to the pressure chamber 343 to inflate the diaphragm 342. Furthermore, when moving the movable member 330 to the retracted position, it is preferable to open the pressure chamber 343 to the atmosphere, or to supply a third pressure lower than the first pressure to the pressure chamber 343 from the first pressure adjustment mechanism 344.

[0030] Figure 6 is a schematic plan view of the polishing table 30 of this embodiment. As one example, the movable members 330 are arranged over the entire area of ​​the tabletop 32. As another example, the movable members 330 are not arranged in the area of ​​the polishing pad holding surface SP1 that the substrate WF contacts (the area R1 enclosed by the dashed line in Figure 6), but are arranged in the area of ​​the polishing pad holding surface SP1 that the substrate WF does not contact. As yet another example, the movable members 330 are arranged at a position further from the central axis C1 of the polishing table 30 than the suction holes 328. As yet another example, the movable members 330 are not arranged in the area of ​​the polishing table 30 where the cooling grooves 31a are provided, but are arranged in the area where the cooling grooves 31a are not provided. The position and number of movable members 330 may be determined by experiment or simulation, and the movable members 330 may be provided in any manner. As one example, the movable members 330 are arranged in positions that are rotationally symmetrical around the central axis C1.

[0031] Furthermore, the polishing device 1000 does not necessarily have to include the second pressure adjustment mechanism 345. Also, the drive mechanism 340 is not limited to one that moves the movable member 330 by adjusting the pressure in the pressure chamber 343 defined by the diaphragm 342, but can employ various known mechanisms that can move the movable member 330.

[0032] Next, the feeding operation of the polishing pad P1 by the polishing apparatus 1000 of this embodiment will be described. Figures 7A to 7C are diagrams illustrating the feeding operation of the polishing pad P1. As described above, when the substrate WF is polished, the substrate WF held by the top ring 40 is pressed against the polishing pad P1 while the polishing pad P1 is held in place by suction on the polishing pad holding surface SP1 (see Figure 7A). Then, the feeding operation of the polishing pad P1 is performed, for example, when a predetermined number of substrates WF (one or several) are polished, or when an external input is made by the user. Prior to the feeding operation of the polishing pad P1, the controller 900 may rotate the polishing table 30 to remove the liquid on the polishing pad P1.

[0033] During the feeding operation of the polishing pad P1, the controller 900 first stops the supply of negative pressure from the vacuum source 91 and moves the movable member 330 to a protruding state (see Figure 7B). Note that in Figure 7B, the movable member 330 is drawn larger for ease of understanding. As the movable member 330 moves to the protruding state, it comes into contact with the back surface of the polishing pad P1 (the surface that rests on the polishing pad holding surface SP1), and can push the polishing pad P1 away from the polishing pad holding surface SP1. This allows the polishing pad P1 to be smoothly removed from the polishing table 30 even when the polishing pad P1 and the polishing pad holding surface SP1 are stuck together. In addition, the controller 900 may move the movable member 330 to the protruding state and control the fluid supply source 92 to blow (inject fluid) between the polishing pad holding surface SP1 and the polishing pad P1. This can further promote the separation of the polishing pad P1 from the polishing pad holding surface SP1.

[0034] Next, the controller 900 controls the first motor 130 and the second motor 230 to supply the polishing pad P1 from the supply roll 100 and to wind up the polishing pad P1 with the winding roll 200 (see Figure 7C). As a result, the polishing pad P1 slides along the polishing pad holding surface SP1 and is fed. When the polishing pad P1 is fed, for example, the movable member 330 is moved to a retracted position. Also, blowing may be continued when the polishing pad P1 is fed. When the desired amount of polishing pad P1 has been fed, the controller 900 stops the first motor 130 and the second motor 230. Then, with the movable member 330 in the retracted position and blowing stopped, the controller 900 supplies negative pressure from the vacuum source 91. As a result, the updated polishing pad P1 is held in place by suction on the polishing pad holding surface SP1 (see Figure 7A). The polishing device 1000 can feed the polishing pad P1 through these operations.

[0035] The controller 900 may also refer to the feed speed of the polishing pad P1 by the first motor 130 and the second motor 230, and if the speed difference between the winding speed of the winding roll 200 and the supply speed of the supply roll 100 is greater than or equal to a threshold, it may stop the feeding operation or issue an error notification. In this case, the controller 900 may perform a retry operation in which it controls the first motor 130 and the second motor 230 after putting the movable member 330 into an extended state again. In the retry operation, the controller 900 may control the first pressure adjustment mechanism 344 so that a higher pressure is supplied to the pressure chamber 343 than the pressure supplied last time.

[0036] <Second Embodiment> Figures 8A to 8D are diagrams illustrating the feeding operation of the polishing table 30B of the second embodiment. The polishing table 30B of the second embodiment differs from the embodiment described above in the positions of the second supply-side roller 120 and the second winding-side roller 220, but the other configurations are the same as those of the embodiment described above. In other words, in the polishing table 30B of the second embodiment, the second supply-side roller (first tension roller) 120 and the second winding-side roller (second tension roller) 220 are arranged to support the polishing pad P1 at a position higher than the polishing pad holding surface SP1. The polishing pad P1 in the polishing table 30B of this second embodiment is described below. The feeding operation will now be explained. Note that the polishing table 30B in the second embodiment does not necessarily have to be equipped with a movable member 330. The movable member 330 is not shown in Figures 8A to 8D. Also, in the feeding operation in the second embodiment, the movable member 330 only needs to operate in the same manner as the feeding operation described above with reference to Figures 7A to 7C, and the operation of the movable member 330 will not be explained in the following description.

[0037] In the polishing table 30B of the second embodiment, when the substrate WF is polished, the substrate WF held by the top ring 40 is pressed against the polishing pad P1 while the polishing pad P1 is held by suction to the polishing pad holding surface SP1 (see Figure 8A). When feeding the polishing pad P1, first the controller 900 stops the supply of negative pressure from the vacuum source 91. The controller 900 also controls the first motor 130 to stop the rotation of the supply roll 100, and controls the second motor 230 to cause the winding roll 200 to wind the polishing pad P1 at a torque limit value (see Figure 8B). At this time, since the rotation of the supply roll 100 is stopped, the winding roll 200 hardly winds up the polishing pad P1. The torque limit value is a torque set to apply a constant tension to the polishing pad P1, and can be set based on the radius of the supply roll 100 as an example. Here, since the second supply-side roller 120 and the second winding-side roller 220 are positioned higher than the polishing pad holding surface SP1, the polishing pad P1 is stretched between the second supply-side roller 120 and the second winding-side roller 220, which promotes the separation of the polishing pad P1 from the polishing pad holding surface SP1. The controller 900 controls the first motor 130 and the second motor 230, and may also control the fluid supply source 92 to blow (inject fluid) between the polishing pad holding surface SP1 and the polishing pad P1. This further promotes the separation of the polishing pad P1 from the polishing pad holding surface SP1.

[0038] Next, the controller 900 drives the first motor 130 to supply the polishing pad P1 from the supply roll 100 so that the feed speed of the polishing pad P1 remains constant, and drives the second motor 230 at the torque limit value to wind the polishing pad P1 onto the winding roll 200 (see Figure 8C). At this time, under torque limitations, the target winding speed of the winding roll 200 is set to be greater than the feed speed V1 of the supply roll 100, so that the winding roll 200 rotates at a winding speed equal to the feed speed V1 and pulls the polishing pad P1 with tension corresponding to the torque limit value. As a result, the polishing pad P1 is fed from the supply roll 100 to the winding roll 200 in a taut state. In other words, the feed speed V1 of the supply roll 100 becomes the same as the effective winding speed of the winding roll 200.

[0039] Next, once the desired amount of polishing pad P1 has been fed, the controller 900 stops driving the first motor 130 and the second motor 230 (see Figure 8D) and supplies negative pressure from the vacuum source 91. This causes the updated polishing pad P1 to be attracted and held on the polishing pad holding surface SP1 (see Figure 8A). The polishing device 1000 can feed the polishing pad P1 through these operations. If the position of the second supply-side roller 120 and the second winding-side roller 220 is high and the polishing pad P1 is not adequately attracted to the polishing pad holding surface SP1, the controller 900 may drive the second motor 230 to reverse the rotation of the winding roll 200. This allows the polishing pad P1 to loosen and approach the polishing pad holding surface SP1, thereby promoting the attraction of the polishing pad P1 to the polishing pad holding surface SP1. Furthermore, the controller 900 may determine that the polishing pad P1 has not been adsorbed onto the polishing pad holding surface SP1 if the pressure in the adsorption hole 328 does not reach a predetermined pressure. In addition, the controller 900 may issue an error notification if the pressure in the adsorption hole 328 does not reach a predetermined pressure even after applying negative pressure to the adsorption hole 328 for a predetermined period of time.

[0040] <Third Embodiment> Figure 9 shows a schematic diagram of the configuration of the polishing table 30C of the third embodiment. The polishing table 30C of the third embodiment differs from the embodiments described above in that the second supply-side roller 120 and the second winding-side roller 220 are configured to move vertically, while the other configurations are the same as those of the embodiments described with reference to Figure 1, etc. In the polishing table 30C of the third embodiment, the second supply-side roller (first tension roller) 120 and the second winding-side roller (second tension roller) 220 are configured to move vertically between a first position in which the polishing pad P1 is supported at approximately the same height as the polishing pad holding surface SP1, and a second position in which the polishing pad P1 is supported at a position higher than the polishing pad holding surface SP1. The polishing table 30C also includes a drive mechanism 150 for moving the second supply-side roller 120 and the second winding-side roller 220 vertically. Various known mechanisms, such as a ball screw mechanism, can be used as the drive mechanism 150.

[0041] In this third embodiment of the polishing table 30C, the controller 900 positions the second supply-side roller 120 and the second winding-side roller 220 in the first position when the polishing pad P1 is held by suction on the polishing pad holding surface SP1. The controller 900 also positions the second supply-side roller 120 and the second winding-side roller 220 in the second position when feeding the polishing pad P1. At this time, the controller 900 may set at least one of the first motor 130 and the second motor 230 to a free-run state (a state in which the rotation of the motor is not electromagnetically restrained and rotates according to external force). This makes it easy to move the second supply-side roller 120 and the second winding-side roller 220 to the second position. By moving the second supply-side roller 120 and the second winding-side roller 220 to the second position, separation of the polishing pad P1 from the polishing pad holding surface SP1 can be facilitated, similar to what was described in the polishing table 30B of the second embodiment.

[0042] In the third embodiment, both the second supply-side roller 120 and the second winding-side roller 220 are configured to be movable vertically. However, in the polishing table 30C, only one of the second supply-side roller 120 or the second winding-side roller 220 may be configured to be movable vertically. Furthermore, the polishing table 30C is provided with a drive mechanism 150 for moving the second supply-side roller 120 and the second winding-side roller 220 vertically. However, the polishing table 30C does not need to be provided with a drive mechanism 150. As an example, the second supply-side roller 120 may be lifted upward by outputting a torque of a predetermined torque or more from the second motor 230.

[0043] <Variation> In the embodiment described above, the polishing device 1000 is configured to feed the polishing pad P1 from the supply roll 100 to the winding roll 200. However, the polishing device 1000 does not necessarily have a feeding mechanism for the polishing pad P1, and as an example, the polishing pad P1 may be held by being adhered to the polishing pad holding surface SP1.

[0044] The embodiment described above can also be described in the following form. [Embodiment 1] According to Embodiment 1, a polishing apparatus for polishing a substrate using a polishing pad is proposed, comprising a polishing table configured to rotate and defining a polishing pad holding surface for holding the polishing pad, the polishing pad holding surface having suction holes connected to a vacuum source, and the polishing table comprising a movable member configured to move between a protruding state that protrudes from the polishing pad holding surface and pushes the polishing pad held on the polishing table away from the polishing pad holding surface, and a retracted state that does not protrude from the polishing pad holding surface. According to Embodiment 1, the polishing pad held on the polishing table can be smoothly removed from the polishing table.

[0045] [Embodiment 2] According to embodiment 2, embodiment 1 further includes a drive mechanism for moving the movable member between the protruding state and the retracted state. According to embodiment 2, the movable member can be moved between the protruding state and the retracted state by the drive mechanism.

[0046] [Embodiment 3] According to Embodiment 3, in Embodiment 2, the drive mechanism has a diaphragm that defines a pressure chamber connected to a pressure adjustment mechanism, and the movable member is moved by adjusting the pressure in the pressure chamber by the pressure adjustment mechanism. According to Embodiment 2, the movable member can be moved between a protruding state and a retracted state by adjusting the pressure in the pressure chamber.

[0047] [Embodiment 4] According to Embodiment 4, in Embodiment 3, the polishing table has a housing space for housing the movable member, a second pressure adjustment mechanism is connected to the housing space, and the polishing device includes a controller that controls the pressure adjustment mechanism and the second pressure adjustment mechanism so as to supply a first pressure higher than the ambient pressure to the housing space and a second pressure higher than the first pressure to the pressure chamber when the movable member is moved from the protruding state to the retracted state. According to Embodiment 4, it is possible to suppress the inflow of polishing liquid and the like into the housing space.

[0048] [Form 5] According to Form 5, in Forms 1 to 4, when viewed from a direction perpendicular to the polishing pad holding surface, the movable member is positioned further from the rotation axis of the polishing table than the suction holes. According to Form 5, it is possible to suppress the complexity of the configuration of the region in which the suction holes are formed.

[0049] [Embodiment 6] According to Embodiment 6, in Embodiments 1 to 5, the polishing pad holding module comprises a first polishing pad holding module configured to be rotatable integrally with the polishing table and to hold the polishing pad wound in a roll shape, and a second polishing pad holding module configured to be rotatable integrally with the polishing table and to hold the polishing pad wound in a roll shape, wherein the polishing pad supplied from the first polishing pad holding module is wound onto the second polishing pad holding module, causing the polishing pad to slide along the polishing pad holding surface. According to Embodiment 6, the polishing pad can be fed along the polishing pad holding surface.

[0050] [Embodiment 7] According to Embodiment 7, in Embodiment 6, a first tension roller is configured to be rotatable integrally with the polishing table, having a rotation axis positioned along the first side of the polishing pad holding surface, on which the polishing pad is placed; and a second tension roller is configured to be rotatable integrally with the polishing table, having a rotation axis positioned along the second side of the polishing pad holding surface opposite to the first side, on which the polishing pad is placed. The polishing pad holding surface is defined as the upper surface of the polishing table, and at least one of the first tension roller and the second tension roller is configured to support the polishing pad at a position higher than the polishing pad holding surface. According to Embodiment 7, the polishing pad held on the polishing table can be smoothly removed from the polishing table.

[0051] [Embodiment 8] According to Embodiment 8, in Embodiment 7, at least one of the first tension roller and the second tension roller is configured to be movable in the vertical direction and to support the polishing pad at the same height as the polishing pad holding surface and at a position higher than the polishing pad holding surface. According to Embodiment 8, the polishing pad held on the polishing table can be smoothly removed from the polishing table.

[0052] [Embodiment 9] According to embodiment 9, a polishing apparatus for polishing a substrate using a polishing pad is configured to be rotatable and has a polishing pad holding surface defined on its upper surface for holding the polishing pad. A polishing apparatus is proposed comprising: a polishing table; a first polishing pad holding module configured to be rotatable integrally with the polishing table and configured to hold the polishing pad wound in a roll; a second polishing pad holding module configured to be rotatable integrally with the polishing table and configured to hold the polishing pad wound in a roll; a first tension roller configured to be rotatable integrally with the polishing table and having a rotation axis positioned along a first side of the polishing pad holding surface, on which the polishing pad is placed; and a second tension roller configured to be rotatable integrally with the polishing table and having a rotation axis positioned along a second side of the polishing pad holding surface opposite to the first side, on which the polishing pad is placed; wherein at least one of the first tension roller and the second tension roller is configured to support the polishing pad at a position higher than the polishing pad holding surface; and the polishing pad supplied from the first polishing pad holding module is wound onto the second polishing pad holding module, causing the polishing pad to slide along the polishing pad holding surface. According to embodiment 9, the polishing pad held on the polishing table can be smoothly removed from the polishing table.

[0053] [Embodiment 10] According to embodiment 10, in embodiment 9, at least one of the first tension roller and the second tension roller is configured to be movable in the vertical direction and to be able to support the polishing pad at the same height as the polishing pad holding surface and at a position higher than the polishing pad holding surface. According to embodiment 10, the polishing pad held on the polishing table can be smoothly removed from the polishing table.

[0054] The embodiments of the present invention and their respective modifications have been described above. It goes without saying that the examples described above are for the purpose of facilitating understanding of the present invention and do not limit it. The present invention can be modified and improved as appropriate without departing from its spirit, and equivalents thereof are included in the present invention. Furthermore, any combination or omission of the components described in the claims and specification is possible to the extent that at least a part of the above-described problems can be solved or at least a part of the effects can be achieved. As an example, the drive control of the first motor 130 and the second motor 230 described in the second embodiment can be applied to other embodiments. [Explanation of Symbols]

[0055] 30, 30B, 30C… Polishing Tables 31… Polishing table body 31a…Cooling groove 32... Tabletop 38…motor 40…Top ring 91...Vacuum source 92...Fluid supply source 100... Supply Roll 110...First supply side roller 120...Second supply side roller (first tension roller) 130...First motor 150…Drive mechanism 200... Reel roll 210...First winding side roller 220...Second winding roller (second tension roller) 230... Second motor 310...First polishing pad holding module 320...Second polishing pad holding module 328…Suction hole 330…Movable parts 340…Drive mechanism 342... Diaphragm 343... Pressure Chamber 344...First pressure regulating mechanism 345...Second pressure regulating mechanism 348... Stopper 900... Controller 1000...polishing equipment C1…center axis P1... Polishing pad SP... Sub-pad SP1... Polishing pad holding surface WF... Circuit board

Claims

1. A polishing apparatus for polishing a substrate using a polishing pad, It comprises a polishing table configured to rotate and defining a polishing pad holding surface for holding the polishing pad, The polishing pad holding surface has suction holes that are connected to a vacuum source. The polishing table includes a movable member configured to move between a protruding state, where it protrudes from the polishing pad holding surface and pushes the polishing pad held on the polishing table away from the polishing pad holding surface, and a retracted state, where it does not protrude from the polishing pad holding surface. Polishing equipment.

2. The polishing apparatus according to claim 1, further comprising a drive mechanism for moving the movable member between the protruding state and the retracted state.

3. The polishing apparatus according to claim 2, wherein the drive mechanism has a diaphragm that defines a pressure chamber connected to a pressure adjustment mechanism, and moves the movable member by adjusting the pressure in the pressure chamber by the pressure adjustment mechanism.

4. The polishing table has a storage space formed therein in which the movable member is housed. A second pressure regulating mechanism is connected to the aforementioned containment space. The polishing apparatus includes a controller that controls the pressure adjustment mechanism and the second pressure adjustment mechanism so as to supply a first pressure higher than the ambient pressure to the housing space and a second pressure higher than the first pressure to the pressure chamber when the movable member is moved from the protruding state to the retracted state. The polishing apparatus according to claim 3.

5. The polishing apparatus according to claim 1, wherein, when viewed from a direction perpendicular to the polishing pad holding surface, the movable member is positioned further from the axis of rotation of the polishing table than the suction hole.

6. A polishing apparatus according to any one of claims 1 to 5, A first polishing pad holding module is configured to be rotatable integrally with the polishing table and to hold the polishing pad wound in a roll shape, A second polishing pad holding module is configured to be rotatable integrally with the polishing table and to hold the polishing pad wound in a roll shape, Equipped with, The polishing pad supplied from the first polishing pad holding module is wound onto the second polishing pad holding module, thereby configuring the polishing pad to slide along the polishing pad holding surface. Polishing equipment.

7. A first tension roller configured to be rotatable integrally with the polishing table, having a rotation axis positioned along the first side of the polishing pad holding surface, on which the polishing pad is placed; A second tension roller configured to be rotatable integrally with the polishing table, having a rotation axis positioned along the second side opposite to the first side of the polishing pad holding surface, on which the polishing pad is placed; Equipped with, The polishing pad holding surface is defined on the upper surface of the polishing table, At least one of the first tension roller and the second tension roller is configured to support the polishing pad at a position higher than the polishing pad holding surface. The polishing apparatus according to claim 6.

8. The polishing apparatus according to claim 7, wherein at least one of the first tension roller and the second tension roller is configured to be movable in the vertical direction and to support the polishing pad at the same height as the polishing pad holding surface and at a position higher than the polishing pad holding surface.

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