projector

Abstract

To provide a projector that can suppress the decrease in cooling efficiency. [Solution] The system comprises a red heat sink 20R1 and a green heat sink 20G1 that generate heat, a heat dissipation plate 210 that generates heat, a second fan 12A that generates cooling air K2 directed toward the red heat sink 20R1 and the green heat sink 20G1, and a duct body D that guides the cooling air K2 toward the red heat sink 20R1 and the green heat sink 20G1. The duct body D includes an interior member 30 that partitions the flow passage T of the cooling air K2, and the heat dissipation plate 210 is positioned to face the cooling air K2 in a direction perpendicular to the direction in which the cooling air K2 flows through the flow passage T2.

Description

Technical Field

[0001] The present invention relates to a projector.

Background Art

[0002] Conventionally, a projector for cooling an electronic device disposed in a first housing portion on the intake side of a fan, and a light source device and an image forming apparatus disposed in a second housing portion on the exhaust side of the fan has been disclosed (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In Patent Document 1, since the device is disposed on the airflow path, the cooling efficiency for the light source device and the image forming apparatus is reduced. That is, there is room for improvement in cooling efficiency.

Means for Solving the Problems

[0005] According to one aspect of the present invention, there is provided a projector including: a first heat generating section that generates heat; a second heat generating section that generates heat; a fan that generates cooling air directed toward the first heat generating section; and a duct main body that guides the cooling air to the first heat generating section, wherein the duct main body includes an interior member that defines a flow path for the cooling air, and the second heat generating section is disposed so as to be able to face the cooling air in a direction orthogonal to a direction in which the cooling air flows through the flow path.

Brief Description of the Drawings

[0006] [Figure 1] It is a perspective view from the front side of the projector of the first embodiment. [Figure 2] This is a rear perspective view of the projector according to the first embodiment. [Figure 3] This diagram schematically shows the general internal configuration of the enclosure in a plan view. [Figure 4] Figure 3 is a schematic partial cross-sectional view showing a cross-section of a projector including a duct formed by the line segment IV-IV. [Figure 5] Figure 3 is a schematic partial cross-sectional view showing a cross-section of the projector including the duct according to the second embodiment, in the range of line segment IV-IV shown in Figure 3. [Figure 6] Figure 3 is a schematic partial cross-sectional view showing a cross-section of the projector including the duct according to the third embodiment, in the range of line segment IV-IV. [Figure 7] This is a schematic partial cross-sectional view showing a cross-section of the projector including the duct according to the fourth embodiment, in the range of line segment IV-IV shown in Figure 3. [Modes for carrying out the invention]

[0007] Embodiments of the projector of the present invention will be described in detail below with reference to the drawings. In the drawings used in the following description, the dimensional scale may be shown differently for each component in order to make them easier to see, and the dimensional ratios of each component may not be the same as in reality. In addition, an XYZ coordinate system may be shown in the drawings in order to maintain consistency between drawings.

[0008] Furthermore, the projector according to the embodiment projects an image to the front. In the following description, terms including "front," "back," "left," "right," "up," and "down" may be used to refer to direction, orientation, and posture. Unless otherwise specified, these terms refer to the directions and orientations when the projector is held in a normal operating state, with the image side projected, i.e., the front side, being defined as "front" and the back side as "back." However, these terms do not define the actual direction, orientation, or posture of the projector according to the embodiment.

[0009] Furthermore, to establish a correspondence between terms related to direction and orientation and the XYZ coordinate system, the forward / backward direction is mapped to the Y-axis direction, the left / right direction to the X-axis direction, and the up / down direction to the Z-axis direction. More specifically, the "+" and "-" in the X-axis direction correspond to "right" and "left," the "+" and "-" in the Y-axis direction correspond to "forward" and "backward," and the "+" and "-" in the Z-axis direction correspond to "up" and "down."

[0010] [First embodiment of a projector] First, a first embodiment of the present invention will be described. Figure 1 is a perspective view of the projector 100 from the front, and Figure 2 is a perspective view of the projector 100 from the rear.

[0011] As shown in Figures 1 and 2, the projector 100 includes a housing 110, a stand 120, a projection optical device 130, a light source device 140, an image generation device 150, and an audio device 160. The projector 100 projects an image toward the front along the optical axis OA.

[0012] The housing 110 is a container with an overall appearance that is roughly rectangular. The housing 110 comprises a plate-shaped front plate section 110A, a rear plate section 110B, a right plate section 110C, a left plate section 110D, an upper plate section 110E, and a lower plate section 110F. Each of the housing 110, namely the front plate section 110A, the rear plate section 110B, the right plate section 110C, the left plate section 110D, the upper plate section 110E, and the lower plate section 110F, is constructed as a double-layered structure that can be separated into upper and lower parts.

[0013] The front plate section 110A and the rear plate section 110B are arranged parallel to the XZ plane and face each other along the Y axis. The right plate section 110C and the left plate section 110D are arranged parallel to the YZ plane and face each other along the X axis. The upper plate section 110E and the lower plate section 110F are arranged parallel to the XY plane and face each other along the Z axis.

[0014] A first intake port 110S1 and a second intake port 110S2 are formed in the lower plate portion 110F. The first intake port 110S1 is formed in a substantially rectangular shape in the front portion and the left portion of the lower plate portion 110F. The second intake port 110S2 is formed in a substantially rectangular shape in the front portion and the right portion of the lower plate portion 110F.

[0015] In each of the first intake port 110S1 and the second intake port 110S2, a large number of slits that penetrate in the thickness direction and extend in the front-rear direction are formed at substantially constant intervals in the left-right direction. A first fan 11A to be described later draws in air through the first intake port 110S1. Similarly, a second fan 12A to be described later draws in air through the second intake port 110S2.

[0016] An exhaust port 110S3 is formed in the rear plate portion 110B. The exhaust port 110S3 is formed in a substantially rectangular shape over substantially the entire length in the left-right direction in the substantially upper portion of the rear plate portion 110B. As will be described later, cooling air K1 supplied from the first fan 11A that has drawn in air from the first intake port 110S1 is discharged from the exhaust port 110S3. Similarly, cooling air K2 supplied from the second fan 12A that has drawn in air from the second intake port 110S2 is discharged from the exhaust port 110S3.

[0017] The stand 120 supports the housing 110 from the lower side. The stand 120 includes a base member 121 and a support member 122. The base member 121 is formed in a substantially rectangular plate shape and is parallel to the XY plane. The support member 122 extends along the up-down direction. The support member 122 is erected vertically from the approximate center of the base member 121 in a plan view. That is, the base end portion of the support member 122 is joined to the approximate center of the base member 121 in a plan view. Further, the distal end portion of the support member 122 is joined to the housing 110.

[0018] The projection optical device 130, the light source device 140, the image generation device 150, and the audio device 160 are accommodated inside the housing 110. However, the distal end 130S of the projection optical device 130 is exposed from the front plate portion 110A.

[0019] The projection optical device 130 projects image light, which is the source of an image, forward. The image light projected from the projection optical device 130 is projected, for example, onto a screen disposed on the front side of the projector 100, whereby an enlarged image is displayed on the screen. The optical axis OA of the projection optical device 130 is parallel to the front-rear direction (Y-axis direction). The light source device 140 supplies light of three primary colors (RGB: Red, Green, Blue) toward the image generation device 150. The light source device 140 is configured with a mercury lamp, a laser light source, an LED (Light Emitting Diode), and the like. The image generation device 150 separates the light supplied from the light source device 140 into three primary colors, further generates image light, and sends the image light to the projection optical device 130. The acoustic device 160 outputs sound.

[0020] Next, the projection optical device 130, the light source device 140, and the image generation device 150 related to image projection will be described. The projection optical device 130, the light source device 140, and the image generation device 150 are planarly arranged inside the housing 110. Figure 3 is a diagram schematically illustrating the schematic internal configuration of the housing 110 in a plan view.

[0021] Inside the housing 110, an intermediate floor portion 110G is provided for partitioning the upper portion and the lower portion inside the housing 110. The intermediate floor portion 110G is formed in a plate shape as a whole, and is held substantially parallel to the XY plane. The projection optical device 130, the light source device 140, and the image generation device 150 are installed on the intermediate floor portion 110G. However, a first opening 110Gh1 is formed in a portion of the intermediate floor portion 110G that faces the first air intake port 110S1 in the vertical direction, and a second opening 110Gh2 is formed in a portion of the intermediate floor portion 110G that faces the second air intake port 110S2 in the vertical direction. Therefore, the upper portion and the lower portion inside the housing 110 communicate with each other via these openings 110Gh1 and 110Gh2. This is to allow the first fan 11A installed above the first opening 110Gh1 and the second fan 12A installed above the second opening 110Gh2 to communicate with the outside of the housing 110, so that air can be sucked into the fans 11A and 12A, as will be described later.

[0022] The projection optical device 130 includes a plurality of projection lenses (not shown). The projection optical device 130 projects image light forward along the optical axis OA from the tip 130S through the plurality of projection lenses (not shown). The projection optical device 130 is installed on the front plate portion 110A of the housing 110 with at least the tip 130S exposed to the outside. In Figures 1 and 3, the tip 130S of the projection optical device 130 is flush with the front plate portion 110A, but it may be positioned in front of or behind the front plate portion 110A.

[0023] The image generation device 150 comprises a red light modulation unit 150R, a green light modulation unit 150G, a blue light modulation unit 150B, and a photosynthesis optical system 151.

[0024] The red light modulation section 150R includes a liquid crystal panel 150RP and polarizing plates (not shown) provided on the incident and exit sides of the liquid crystal panel 150RP, respectively. The green light modulation section 150G includes a liquid crystal panel 150GP and polarizing plates (not shown) provided on the incident and exit sides of the liquid crystal panel 150GP, respectively. The blue light modulation section 150B includes a liquid crystal panel 150BP and polarizing plates (not shown) provided on the incident and exit sides of the liquid crystal panel 150BP, respectively. The photosynthetic optical system 151 is composed of a substantially cubic cross dichroic prism.

[0025] The photosynthetic optical system 151 is located near the rear of the projection optical device 130. The liquid crystal panel 150RP is located near the right side of the photosynthetic optical system 151. The liquid crystal panel 150GP is located near the rear of the photosynthetic optical system 151. The liquid crystal panel 150BP is located near the left side of the photosynthetic optical system 151.

[0026] The light source device 140 includes a red light emitting section 140R, a green light emitting section 140G, and a blue light emitting section 140B.

[0027] The red light emission section 140R includes, for example, a light-emitting element (not shown) that emits red light LR having a red wavelength band of 610 nm to 700 nm, a parallelizing element (not shown) that parallelizes the red light LR, and a substrate (not shown) on which the light-emitting element and the parallelizing element are mounted. The green light emission section 140G includes, for example, a light-emitting element (not shown) that emits green light LG having a green wavelength band of 500 nm to 600 nm, a parallelizing element (not shown) that parallelizes the green light LG, and a substrate (not shown) on which the light-emitting element and the parallelizing element are mounted. The blue light emission section 140B includes, for example, a light-emitting element (not shown) that emits blue light LB having a blue wavelength band of 420 nm to 500 nm, a parallelizing element (not shown) that parallelizes the blue light LB, and a substrate (not shown) on which the light-emitting element and the parallelizing element are mounted.

[0028] The red light emitter 140R is located to the right of the red light modulator 150R. The green light emitter 140G is located behind the green light modulator 150G. The blue light emitter 140B is located to the left of the blue light modulator 150B.

[0029] The red light emitter 140R emits red light LR towards the red light modulator 150R. The green light emitter 140G emits green light LG towards the green light modulator 150G. The blue light emitter 140B emits blue light LB towards the blue light modulator 150B.

[0030] The red light modulation unit 150R modulates the red light LR incident from the red light emission unit 140R according to the image signal. The green light modulation unit 150G modulates the green light LG incident from the green light emission unit 140G according to the image signal. The blue light modulation unit 150B modulates the blue light LB incident from the blue light emission unit 140B according to the image signal.

[0031] The photosynthetic optical system 151 then generates a full-color image light GW by combining the image light of each color from the respective light modulation units 150R, 150G, and 150B, and emits it towards the projection optical device 130. Furthermore, the projection optical device 130 amplifies and projects the image light GW forward.

[0032] Furthermore, a control circuit board 50 is positioned above the projection optical device 130, the light source device 140, and the image generation device 150. The control circuit board 50 performs a series of controls on the projection optical device 130, the light source device 140, and the image generation device 150, from emitting red light LR, green light LG, and blue light LB to projecting the image light GW. In the first embodiment, the control circuit board 50 includes a first control circuit board 51 and a second control circuit board 52.

[0033] The first control circuit board 51 includes the first board 51A. The first control circuit board 51 is a so-called "driver board," and various electronic products such as motors and connectors are mounted on the first board 51A. The second control circuit board 52 includes the second board 52A. The second control circuit board 52 is a microchip for image control, and various electronic products such as memory devices are executed on the second board 52A.

[0034] The first substrate 51A and the second substrate 52A are held parallel to and flush with the XY plane. In the first embodiment, the control circuit board 50 is formed throughout the entire interior of the housing 110 in a plan view. Within this, the first control circuit board 51 occupies 1 / 4 to 1 / 6 of the right rear corner portion, and the second control circuit board 52 occupies the remaining portion.

[0035] In this way, the projection optical device 130, light source device 140, image generation device 150, and first control circuit board 51 and second control circuit board 52 are arranged inside the housing 110, so that the projector 100's final function is to project the image light GW forward and enlarge it, projecting the image onto a screen or the like.

[0036] Incidentally, the various electronic products (modules) 130, 140, 150, 51, and 52 that make these projectors 100 functional generate heat during the process of realizing their functions. In other words, the various electronic products (modules) 130, 140, 150, 51, and 52 can become heat sources. On the other hand, from the perspective of maintaining the quality of the projector 100 as a product, temperature control is extremely important in the projector 100. In other words, if the temperature of the projector 100 exceeds the control value, it may lead to a deterioration in quality. Therefore, measures are taken inside the projector 100 to suppress the rise in temperature. That is, the projector 100 is equipped with a cooling structure to suppress the rise in temperature.

[0037] Next, we will describe the structure for cooling various electronic products 130, 140, 150, 51, and 52.

[0038] As shown in Figure 3, an interior member 30 is provided in the intermediate floor section 110G inside the housing 110. The interior member 30 comprises an interior wall section 30A and an interior ceiling section 30B (not shown in Figure 3). The interior wall section 30A is erected substantially perpendicular to the intermediate floor section 110G. The interior wall section 30A is formed in a substantially U-shape with the opening facing rear in a plan view. That is, the interior wall section 30A comprises an interior left wall section 30AL, an interior right wall section 30AR, and an interior front wall section 30AF. Furthermore, as will be described later, the interior ceiling section 30B is connected to the upper end of the interior wall section 30A.

[0039] The interior right wall section 30AR extends generally in the front-to-back direction and is located near the right panel section 110C. The interior left wall section 30AL extends generally in the front-to-back direction and is located to the left of the interior right wall section 30AR. The interior front wall section 30AF extends generally in the left-to-right direction and constitutes the front end of the interior wall section 30A. The interior front wall section 30AF is located near the front panel section 110A and is connected at approximately a right angle to the front ends of the interior left wall section 30AL and the interior right wall section 30AR. The rear ends of the interior left wall section 30AL and the interior right wall section 30AR abut against the rear panel section 110B.

[0040] As the interior wall 30A is erected on the intermediate floor 110G, the planar space above the intermediate floor 110G is separated (divided) into the exterior and interior of the interior wall 30A. In the following, the area outside the interior wall 30A in plan view will be referred to as the "first cooling area S1," and the area outside the interior wall 30A will be referred to as the "second cooling area S2."

[0041] A first cooling device 11 for cooling the first cooling area S1 is installed in the left front corner of the first cooling area S1. The first cooling device 11 includes a first fan 11A. The first fan 11A is, for example, a centrifugal fan that rotates around a rotation axis extending in the left-right direction. The first fan 11A is positioned directly above a first opening 110Gh1 ​​that communicates with the first air intake port 110S1. The first fan 11A draws in air through the first air intake port 110S1 and the first opening 110Gh1 ​​and sends it out to the rear. This air is supplied to the entire first cooling area S1 as cooling air K1.

[0042] The first cooling region S1 contains the main electronic components of the projector 100: the projection optical unit 130, the light source unit 140, and the image generation unit 150. Therefore, the projection optical unit 130, the light source unit 140, and the image generation unit 150 are directly cooled by the cooling air K1. Above the projection optical unit 130, the light source unit 140, and the image generation unit 150 in the first cooling region S1 is the second control circuit board 52. Therefore, the second control circuit board 52 is directly cooled from below by the cooling air K1. The cooling air K1, which has been heated by cooling the projection optical unit 130, the light source unit 140, the image generation unit 150, and the second control circuit board 52, is discharged from the exhaust port 110S3.

[0043] A second cooling device 12 for cooling the second cooling area S2 is installed at the front end of the second cooling area S2. The second cooling device 12 includes a second fan 12A. The second fan 12A is, for example, a centrifugal fan that rotates around a rotation axis extending in the left-right direction. The second fan 12A is positioned directly above a second opening 110Gh2 that communicates with the second air intake port 110S2. The second fan 12A draws in air through the second air intake port 110S2 and the second opening 110Gh2 and sends it out to the rear. This air is supplied to the entire second cooling area S2 as cooling air K2.

[0044] Furthermore, in the second cooling region S2, a space is formed by the interior left wall 30AL, interior right wall 30AR, interior front wall 30AF, interior ceiling 30B, and intermediate floor 110G, which substantially close the cross section perpendicular to the front-rear direction in the circumferential (radial) direction. This space forms a flow passage T for blowing cooling air K2. That is, the interior left wall 30AL, interior right wall 30AR, interior front wall 30AF, interior ceiling 30B, and intermediate floor 110G function as a duct. Hereafter, the members that form this flow passage T may be referred to as the "duct body D".

[0045] Here, we will describe the heat dissipation structure for the blue light emission section 140B, the green light emission section 140G, and the red light emission section 140R.

[0046] A blue heat dissipation section 20B is connected to the left end of the blue light emission section 140B in a heat-transferable manner to dissipate the heat generated by the blue light emission section 140B. The blue heat dissipation section 20B includes a heat sink 20B1 (blue heat sink 20B1). The blue heat sink 20B1 has multiple metal plates (not shown) arranged parallel to the YZ plane with gaps between them in the front-to-back direction.

[0047] A red heat dissipation section 20R is connected to the right end of the red light emission section 140R to dissipate the heat generated by the red light emission section 140R. The red heat dissipation section 20R includes a heat sink 20R1 (red heat sink 20R1). The red heat sink 20R1 has multiple metal plates (not shown) arranged parallel to the YZ plane with gaps between them in the front-to-back direction.

[0048] A green heat dissipation section 20G is connected to the rear end of the green light emission section 140G in a heat-transferable manner to dissipate the heat generated by the green light emission section 140G. The green heat dissipation section 20G includes a heat sink 20G1 (green heat sink 20G1) and a heat pipe 20G2 (green heat pipe 20G2). The green heat pipe 20G2 is made of a metal pipe material. The green heat pipe 20G2 is connected to the rear end of the green light emission section 140G and extends significantly to the right from the green light emission section 140G. The green heat sink 20G1 is connected in a heat-transferable manner to the portion of the green heat pipe 20G2 that is not in contact with the green light emission section 140G. The green heat sink 20G1 has multiple metal plates (not shown) parallel to the YZ plane, spaced apart in the left-right direction.

[0049] Thus, heat dissipation sections 20R, 20G, and 20B are connected to each light emission section 140R, 140G, and 140B in a heat-transferable manner. Therefore, these heat dissipation sections 20R, 20G, and 20B, together with each light emission section 140R, 140G, and 140B, can also act as heat sources. In other words, the heat dissipation sections 20R, 20G, and 20B, as well as the heat sinks 20R1, 20G1, and 20B1, constitute the "first heat generating section" of the present invention.

[0050] Furthermore, the blue light emitter 140B and a portion of the green heat pipe 20G2 are located in the first cooling region S1. Therefore, the blue light emitter 140B and a portion of the green heat pipe 20G2 are directly cooled by the cooling air K1. On the other hand, the green heat dissipation section 20G and the red heat dissipation section 20R are located in the second cooling region S2. Therefore, the green heat dissipation section 20G and the red heat dissipation section 20R are directly cooled by the cooling air K2. In addition, the second cooling device 12 cools the entire second cooling region S2, but the second fan 12A of the second cooling device 12 directs the cooling air K2 towards the green heat dissipation section 20G and the red heat dissipation section 20R located in the second cooling region S2. In other words, the main targets of cooling by the second fan 12A of the second cooling device 12 are the green heat dissipation section 20G and the red heat dissipation section 20R.

[0051] Next, the duct body D will be described. Figure 4 is a schematic partial cross-sectional view showing a cross-section of the projector 100 including the duct body D, indicated by the line segment IV-IV shown in Figure 3. As shown in Figure 4, the duct body D is mainly composed of the interior wall section 30A, the interior ceiling section 30B, and the intermediate floor section 110G. The second fan 12A of the second cooling device 12 is located at the front end inside the duct body D, and the second fan 12A sends cooling air K2 toward the rear red heat sink 20R1 and green heat sink 20G1.

[0052] In the first embodiment, the red heat sink 20R1 is positioned upstream of the green heat sink 20G1. Therefore, the cooling air K2 first cools the red heat sink 20R1, and then cools the green heat sink 20G1. An exhaust port 110S3 is formed in the rear plate portion 110B connected to the rear end of the duct body D. Therefore, the cooling air K2 flowing through the flow passage T is discharged to the outside of the housing 110 through the exhaust port 110S3.

[0053] Furthermore, the first control circuit board 51 and the second control circuit board 52 are positioned above the interior ceiling portion 30B, with a small gap between them and the interior ceiling portion 30B, and are held in the XY plane. In Figure 4, the first control circuit board 51 is positioned in the range from the rear end of the duct body D to approximately the center of the red heat sink 20R1 in the front-rear direction, and the second control circuit board 52 is positioned in the range in front of approximately the center of the red heat sink 20R1.

[0054] A heat dissipation section 21 is connected to the lower surface 51AS of the first substrate 51A included in the first control circuit board 51 in a heat transfer manner for dissipating heat generated by the first control circuit board 51, and more specifically, by various electronic components (not shown) mounted on the first substrate 51A. The heat dissipation section 21 comprises a plate-shaped heat sink 210 and a heat sink column 211.

[0055] The heat sink 210 is held parallel to the first substrate 51A at a slight distance. The shape of the heat sink 210 in plan view is a roughly rectangular shape, smaller than the first substrate 51A. In plan view, the center position of the heat sink 210 is approximately the same as the center position of the first substrate 51A. Multiple heat dissipation columns 211 are erected approximately vertically on the heat sink 210. The multiple heat dissipation columns 211 are connected to the lower surface 51AS of the first substrate 51A in a heat-transferable manner. That is, the heat sink 210 is connected to the first substrate 51A in a heat-transferable manner via the multiple heat dissipation columns 211. Therefore, the heat sink 210, together with the first control circuit board 51, can also be a heat source. In other words, the heat dissipation section 21, and furthermore the heat sink 210, constitute the "second heat-generating section" of the present invention.

[0056] The heat sink 210 is fitted into a through-hole 30Ba formed in the interior ceiling portion 30B. That is, the heat sink 210 constitutes part of the duct body D and faces the airflow passage T. Therefore, the heat sink 210 is cooled by the cooling air K2 flowing through the airflow passage T. Thus, the first control circuit board 51 is indirectly cooled. In this way, the heat sink 210, and by extension the first control circuit board 51, are cooled by the cooling air K2, which is mainly used to cool the red heat sink 20R1 and the green heat sink 20G1. Therefore, the heat sink 210, and by extension the first control circuit board 51, are positioned as secondary targets for cooling by the second fan 12A of the second cooling device 12.

[0057] In the following, the duct body D, including the interior ceiling section 30B and the heat sink 210, will be referred to as the "duct body ceiling section DB". Similarly, the part including the interior left wall section 30AL, which constitutes the left wall of the duct body D, will be referred to as the "duct body left wall section DL", the part including the interior right wall section 30AR, which constitutes the right wall of the duct body D, will be referred to as the "duct body right wall section DR", and the part including the interior front wall section 30AF, which constitutes the front wall of the duct body D, will be referred to as the "duct body front wall section DF". Furthermore, the part including the intermediate floor section 110G, which constitutes the floor of the duct body D, will be referred to as the "duct body floor section DC".

[0058] Furthermore, in the first embodiment, the heat sink 210 is positioned downstream of the red heat sink 20R1 in the front-rear direction. Moreover, the heat sink 210 is positioned at approximately the same location as the green heat sink 20G1 in the front-rear direction and faces the green heat sink 20G1 in the vertical direction. In addition, the heat sink 210 is positioned flush with the interior ceiling portion 30B. Furthermore, in the duct body D, a part of the interior ceiling portion 30B is formed on the rear side of the heat sink 210. That is, the heat sink 210 does not constitute the rear end of the duct body D.

[0059] Furthermore, the distance from the interior ceiling 30B to the intermediate floor 110G of the red heatsink 20R1, which is positioned relatively upstream, is approximately the same as the height of the front upper flow passage T11 above the red heatsink 20R1 and the height of the front lower flow passage T12 below the red heatsink 20R1. Moreover, the distance from the interior ceiling 30B to the intermediate floor 110G of the green heatsink 20G1, which is positioned relatively downstream, is approximately the same as the height of the rear upper flow passage T21 above the green heatsink 20G1 and the height of the rear lower flow passage T22 below the green heatsink 20G1.

[0060] As described above, the projector 100 of the first embodiment includes a second fan 12A that generates cooling air K2 directed toward the red heat sink 20R1 and the green heat sink 20G1 as heat sources, and a duct body D that guides the cooling air K2 toward the red heat sink 20R1 and the green heat sink 20G1. The duct body D includes an interior member 30 that partitions the flow passage T of the cooling air K2, and the heat sink 210 as a heat source is positioned to face the cooling air K2 in a direction perpendicular to the direction in which the cooling air K2 flows through the flow passage T. Therefore, the heat sink 210 can be effectively cooled while utilizing the cooling of the red heat sink 20R1 and the green heat sink 20G1.

[0061] Furthermore, according to the projector 100 of the first embodiment, a through-hole 30Ba is formed in the thickness direction through the interior ceiling portion 30B of the interior member 30 for arranging the heat sink 210, and the heat sink 210 is placed in the through-hole 30Ba, and the interior ceiling portion 30B and the heat sink 210 constitute the duct body ceiling portion DB of the duct body D. Therefore, the internal structure of the projector 100 can be made more compact and the cooling efficiency of the heat sink 210 can be improved.

[0062] [Other embodiments of the projector besides the first embodiment] Next, embodiments other than the first embodiment of the present invention (other embodiments) will be described. In the following, the differences between the other embodiments and the first embodiment will be mainly described. In addition, the same reference numerals and terms will be used for the same configuration or similarly corresponding configuration in the other embodiments. In the other embodiments, the configuration of the duct body ceiling portion DB and the heat dissipation portion 21 will mainly differ from that of the first embodiment.

[0063] First, a second embodiment will be described as another embodiment. Figure 5 is a schematic partial cross-sectional view showing a cross-section of the projector 100 including the duct body D according to the second embodiment in the range of line segment IV-IV shown in Figure 3. As shown in Figure 5, in the second embodiment, a ceiling opening DBh1 is formed in the interior ceiling portion 30B, and the duct body ceiling portion DB is interrupted in the front-to-back direction.

[0064] Furthermore, the shape of the heat sink 210, including its length in the front-to-back direction, and its position in the front-to-back direction are the same as in the first embodiment. The ceiling opening DBh1 is formed between the green heat sink 20G1 and the heat sink 210 in the vertical direction. Moreover, the length of the ceiling opening DBh1 in the front-to-back direction is shorter than the length of the heat sink 210 in the front-to-back direction. The front-to-back center position of the ceiling opening DBh1 and the front-to-back center position of the heat sink 210 are approximately the same.

[0065] The rear end of the portion of the interior ceiling section 30B in front of the ceiling opening DBh1 is sloped upward as it moves towards the rear. Hereinafter, this sloped portion will be referred to as the "guide section 30B1". A gap is formed between the tip of the guide section 30B1 and the heat sink 210, but the guide section 30B1 extends to the vicinity of the heat sink 210.

[0066] Furthermore, the portion of the interior ceiling section 30B rearward from the ceiling opening DBh1 is formed along the front-rear direction, excluding the guide section 30B1 of the interior ceiling section 30B in front of the ceiling opening DBh1. Therefore, the vertical distance between the front tip of the portion of the interior ceiling section 30B rearward from the ceiling opening DBh1 and the heat sink 210 is longer than the vertical distance between the rear tip of the front portion of the interior ceiling section 30B, i.e., the tip of the guide section 30B1 and the heat sink 210. Hereinafter, the gap between the front tip of the portion of the interior ceiling section 30B rearward from the ceiling opening DBh1 and the heat sink 210 will be referred to as the "detention avoidance opening DBh2".

[0067] Here, we will explain why the projector 100 has a guide section 30B1, a ceiling opening DBh1, and a stop-relief opening DBh2 in the second embodiment. However, as shown in Figure 5, as a prerequisite, the height of the green heat sink 20G1 is higher in the second embodiment compared to the first embodiment. Furthermore, the upper end position of the green heat sink 20G1 is higher than the upper end position of the red heat sink 20R1. Therefore, if the interior ceiling section 30B is formed along the front-rear direction as in the first embodiment, the height of the rear upper flow passage T21 will be lower than the height of the front upper flow passage T11. As a result, the cooling efficiency to the green heat sink 20G1 and the heat sink 210 will decrease.

[0068] Therefore, the reason the projector 100 has a ceiling opening DBh1 is to position the heat sink 210 above the part of the interior ceiling section 30B that is in front of the ceiling opening DBh1, excluding the guide section 30B1, thereby securing the height of the rear upper airflow passage T21 and reducing the decrease in cooling efficiency to the green heat sink 20G1 and the heat sink 210. Furthermore, the reason the projector 100 has a guide section 30B1 is to guide the cooling air K2 along the guide section 30B1 to the heat sink 210, thereby reducing the decrease in cooling efficiency to the heat sink 210. In addition, the reason the projector 100 has a stagnation-avoidance opening DBh2 is to prevent the cooling air K2 that has cooled the heat sink 210 from stagnating between the heat sink 210 and the part of the interior ceiling section 30B that is in front of the ceiling opening DBh1, thereby reducing the decrease in cooling efficiency to the green heat sink 20G1 and the heat sink 210.

[0069] Furthermore, in the second embodiment, the lower end position of the green heatsink 20G1 is lower than the lower end position of the red heatsink 20R1 compared to the first embodiment. The vertical distance from the lower end position of the green heatsink 20G1 to the intermediate floor portion 110G is shorter than the vertical distance from the upper end position of the green heatsink 20G1 to the interior ceiling portion 30B excluding the guide portion 30B1. Therefore, the cooling air K2 flows more easily over the upper side of the green heatsink 20G1 than over the lower side. As a result, the decrease in cooling efficiency to the heat sink 210 can be reduced.

[0070] As in this second embodiment, even when the main object to be cooled located downstream of the cooling air K2 is larger than the main object to be cooled located upstream of the cooling air K2, by providing at least a ceiling opening DBh1 between the secondary object to be cooled, consisting of the first control circuit board 51 and the heat dissipation unit 21, and the main object to be cooled located downstream, it is possible to efficiently cool both the main object to be cooled and the secondary object to be cooled located downstream while maintaining the cooling efficiency to the main object to be cooled upstream.

[0071] Furthermore, since the guide section 30B1 is provided, the cooling efficiency of the secondary cooling target can be improved. In addition, since the stagnation avoidance opening DBh2 is provided, the decrease in the cooling efficiency of the main cooling target and the secondary cooling target located downstream can be suppressed. Moreover, since the vertical distance from the main cooling target located downstream to the duct body floor section DC is shorter than the vertical distance from the secondary cooling target to the duct body ceiling section DB, the decrease in the cooling efficiency of the secondary cooling target can be suppressed.

[0072] In the second embodiment, the cooling air K2 flowing over the red heat sink 20R1 flows downstream along the guide portion 30B1 and then continues downstream along the heat sink 210. Therefore, the heat sink 210 is not flush with the interior ceiling portion 30B, but is spaced apart from it. However, as in the first embodiment, it forms the duct body ceiling portion DB together with the interior ceiling portion 30B. In addition, the vertical position of the first substrate 51A in the second embodiment is the same as in the first embodiment, while the vertical position of the heat sink 210 in the second embodiment is higher than in the first embodiment. Consequently, the height of the heat sink column 211 is shorter in the second embodiment.

[0073] Furthermore, the guide section 30B1 and the stop avoidance opening DBh2, or both or one of them, may not be provided. Moreover, the vertical distance from the lower end position of the green heat sink 20G1 to the intermediate floor section 110G and the vertical distance from the upper end position of the green heat sink 20G1 to the portion of the interior ceiling section 30B excluding the guide section 30B1 may be approximately the same.

[0074] Next, a third embodiment will be described as another embodiment. Figure 6 is a schematic partial cross-sectional view showing a cross-section of the projector 100 including the duct body D according to the third embodiment in the range of line segment IV-IV shown in Figure 3. As shown in Figure 6, in the third embodiment, the front-rear positions of the first substrate 51A, the heat dissipation section 21, and the green heat sink 20G1 are the same as in the first embodiment. However, the rear end of the interior member 30 is located between the green heat sink 20G1 and the red heat sink 20R1, and the ceiling section DB of the duct body is interrupted in the front-rear direction upstream of the heat dissipation section 21 and the green heat sink 20G1. In other words, the heat dissipation section 21 and the green heat sink 20G1 are located outside the duct body D.

[0075] However, the heat dissipation section 21 is connected to the rear end of the interior ceiling section 30B. Therefore, the cooling air K2 that flows backward through the inside of the duct body D continues to flow backward along the heat dissipation section 21. As a result, the heat dissipation section 21 and the green heat sink 20G1 are cooled by the cooling air K2.

[0076] As in the third embodiment, by arranging the heat dissipation section 21 and the green heat sink 20G1, which are the targets of the cooling air K2, outside the duct body D, the degree of design freedom for the inside of the housing 110 can be improved.

[0077] Next, a fourth embodiment will be described as another embodiment. Figure 7 is a schematic partial cross-sectional view showing a cross-section of the projector 100 including the duct body D according to the fourth embodiment in the range of line segment IV-IV shown in Figure 3. As shown in Figure 7, in the fourth embodiment, the interior ceiling portion 30B is formed up to the tip position of the first substrate 51A, and the vertical position of the first substrate 51A is the same as the vertical position of the interior ceiling portion 30B. That is, the first substrate 51A together with the interior ceiling portion 30B forms the duct body ceiling portion DB. Therefore, in the fourth embodiment, a heat dissipation portion 21 is not provided as in the first to third embodiments, and the first substrate 51A is cooled directly by the cooling air K2. This reduces the number of parts and improves the cooling efficiency to the first control circuit board 51.

[0078] [Example of a modification of the above embodiment] It should be noted that the present invention is not necessarily limited to the embodiments described above, and various modifications can be made without departing from the spirit of the invention. The first to fourth embodiments are merely illustrative and do not limit the present invention in any way. Therefore, it is naturally possible to make various modifications to the present invention without departing from its essence. Hereinafter, examples of modifications according to the above embodiments will be described. It should also be noted that the modifications described below can be combined as appropriate.

[0079] The specific configuration for projecting images, such as the projection optical device 130, the light source device 140, and the image generation device 150, is not limited to the above embodiment and may be modified as appropriate.

[0080] The housing 110 has a double structure that can be divided vertically, and the projection optical device 130, light source device 140, image generation device 150, first control circuit board 51 and second control circuit board 52, and interior members 30 are arranged on the upper side of the intermediate floor 110G, but they may also be arranged on the lower side of the intermediate floor 110G. In addition, the housing 110 is provided with multiple members (partition members) that divide the internal space vertically, such as the intermediate floor 110G, and the interior members 30, etc. may be arranged on any of the partition members. Alternatively, the interior members 30, etc. may be arranged on the bottom surface of a housing that is lower in height than the above embodiment and is not divided vertically.

[0081] The primary targets of cooling by the cooling air K2 are the red heat dissipation section 20R and the green heat dissipation section 20G, but the specific contents of these primary targets are not particularly limited and may be changed as appropriate. Electronic products such as electronic devices, electronic components, and circuit boards may also be the primary targets of cooling by the cooling air K2.

[0082] Furthermore, the primary target of cooling by the cooling air K2 may be one or more. If there is one primary target of cooling by the cooling air K2, the heat dissipation unit 21 may be positioned above the primary target of cooling by the cooling air K2. In this case, the cooling structure relating to the primary target of cooling by the cooling air K2 and the heat dissipation unit 21, which is a secondary target of cooling by the cooling air K2, can be made more compact. Alternatively, if there is one primary target of cooling by the cooling air K2, the heat dissipation unit 21 may be positioned downstream of the primary target of cooling by the cooling air K2. In this case, the cooling efficiency for the primary target of cooling by the cooling air K2 can be improved. Note that the upper and downstream sides in these examples of modifications may be the upstream tip position or the center position in relation to the flow direction of the cooling air K2 of the primary target of cooling by the cooling air K2 and the heat dissipation unit 21.

[0083] The secondary targets of cooling by the cooling air K2 are the heat dissipation unit 21 and the first control circuit board 51, but the specific contents of these secondary targets are not particularly limited and may be changed as appropriate. Only one of the heat dissipation unit 21 and the first control circuit board 51 may be designated as a secondary target of cooling by the cooling air K2. Alternatively, heat-generating electrical equipment other than circuit boards, such as electronic devices, may be designated as a secondary target of cooling by the cooling air K2.

[0084] The heat dissipation section 21 is located on the ceiling section DB of the duct body D, but its position in a cross-section perpendicular to the direction in which the cooling air K2 flows is not particularly limited and may be changed as appropriate. For example, the heat dissipation section 21 may be located on the right wall section DR of the duct body, the left wall section DL of the duct body, or the floor section DC of the duct body. Alternatively, the heat dissipation section 21 may be located across multiple sections, such as the ceiling section DB and the right wall section DR of the duct body, or the left wall section DL and the floor section DC of the duct body. Furthermore, although the cross-sectional shape of the flow passage T through which the cooling air K2 flows perpendicular to the direction in which the cooling air K2 flows is rectangular, this cross-sectional shape is not particularly limited and may be changed as appropriate.

[0085] The flow path T is formed in a straight line, but it may also be formed in an arc or a curved shape. Alternatively, the flow path T may bend along its course.

[0086] (Summary of this disclosure) A summary of this disclosure is provided below.

[0087] (Note 1) A first heat-generating element that emits heat, The second heat-generating element, A fan that generates cooling air directed towards the first heat-generating component, The system includes a duct body that guides the cooling air to the first heat-generating section, The duct body includes interior members that partition the airflow path for the cooling air, The projector wherein the second heat-generating element is arranged to face the cooling air in a direction perpendicular to the direction in which the cooling air flows through the flow passage. According to this, the second heat-generating element can be effectively cooled while utilizing the cooling of the first heat-generating element.

[0088] (Note 2) The first heating element is arranged inside the interior member. The projector as described in Appendix 1, wherein the second heat-generating element faces the first heat-generating element in a direction perpendicular to the direction in which the cooling air flows through the flow passage. According to this, the arrangement of the first and second heat-generating elements can be made more compact, and the cooling efficiency can be improved.

[0089] (Note 3) The projector as described in Appendix 1, wherein the second heat-generating element is located downstream of the cooling airflow from the first heat-generating element. According to this, the decrease in the cooling efficiency of the first heat-generating element can be suppressed.

[0090] (Note 4) The interior member has through-holes formed in the thickness direction for arranging the second heating element. The projector according to any one of Appendix 1 to Appendix 3, wherein the second heating element is positioned in the through-hole, and the interior member and the second heating element constitute the duct body. According to this, the internal structure of the projector can be made more compact, and the heat generation efficiency of the second heat-generating element can be improved.

[0091] (Note 5) The projector according to any one of Appendix 1 to Appendix 3, wherein the second heat-generating element is arranged in parallel with the interior member, connected to the downstream side of the cooling air, and is located outside the duct body. According to this, the decrease in the cooling efficiency of the first heat-generating element can be suppressed.

[0092] (Note 6) A projector according to any one of Appendix 1 to Appendix 4, wherein a part of the interior member is formed downstream of the cooling air of the second heat-generating section, and an opening for passing the cooling air is formed between the part of the interior member and the second heat-generating section.

[0093] (Note 7) The second heating element includes a heat source and a heat dissipation element that dissipates heat from the heat source. The projector according to any one of Appendix 1 to Appendix 6, wherein the heat dissipation section is arranged to face the cooling air in a direction perpendicular to the direction in which the cooling air flows through the flow passage. This improves the degree of freedom in arranging the heat source of the second heating element.

[0094] (Note 8) The heat dissipation section includes a plate-shaped heat dissipation plate. The projector according to Appendix 7, wherein the heat sink is arranged so as to be able to face the cooling air in a direction perpendicular to the direction in which the cooling air flows through the flow passage. According to this, the duct itself can be made more compact.

[0095] (Note 9) The heat source includes a circuit board on which electronic components are mounted, The interior member has through-holes formed in the thickness direction for arranging the circuit board, The projector as described in Appendix 7, wherein the circuit board is placed in the through-hole, and the interior member and the circuit board constitute the duct body. According to this, it is possible to improve the efficiency of cooling the heat source while keeping the number of parts to a minimum.

[0096] (Note 10) A projector according to any one of Appendix 1 to 4, or Appendix 6, or Appendix 7 to 9 without referring to Appendix 5. According to this, the decrease in the cooling efficiency of the second heat-generating element can be suppressed. [Explanation of Symbols]

[0097] 100...Projector, 110...Housing, 12...Second cooling device, 12A...Second fan, 20G...Green heat dissipation section (first heat generation section), 20G1...Green heat sink (first heat generation section), 20R...Red heat dissipation section, 20R1...Red heat sink, 21...Heat dissipation section (first heat generation section), 210...Heat sink plate (first heat generation section), 30...Interior component, 30Ba...Through hole, 51...First control circuit board, 51A...First board, D...Duct body, DBh1...Ceiling opening, DBh2...Stagnation avoidance opening (opening), K2...Cooling air, T...Flow path

Claims

1. A first heat-generating element that emits heat, A second heat-generating element that emits heat, A fan that generates cooling air directed towards the first heat-generating section, The system includes a duct body that guides the cooling air to the first heat-generating section, The duct body includes interior members that partition the airflow path for the cooling air, The projector wherein the second heat-generating element is arranged to face the cooling air in a direction perpendicular to the direction in which the cooling air flows through the flow passage.

2. The first heating element is arranged inside the interior member. The projector according to claim 1, wherein the second heat-generating element faces the first heat-generating element in a direction perpendicular to the direction in which the cooling air flows through the flow passage.

3. The projector according to claim 1, wherein the second heat-generating element is arranged downstream of the cooling air from the first heat-generating element.

4. The interior member has through holes formed in the thickness direction for arranging the second heating element. The projector according to claim 1, wherein the second heating element is disposed in the through hole, and the interior member and the second heating element constitute the duct body.

5. The projector according to claim 1, wherein the second heat-generating element is arranged in parallel with the interior member, connected to the downstream side of the cooling airflow, and is located outside the duct body.

6. The projector according to claim 1, wherein a part of the interior member is formed downstream of the cooling air of the second heat-generating section, and an opening for passing the cooling air is formed between the part of the interior member and the second heat-generating section.

7. The second heating element includes a heat source and a heat dissipation element that dissipates heat from the heat source. The projector according to any one of claims 1 to 6, wherein the heat dissipation section is arranged to face the cooling air in a direction perpendicular to the direction in which the cooling air flows through the flow passage.

8. The heat dissipation section includes a plate-shaped heat dissipation plate. The projector according to claim 7, wherein the heat sink is arranged so as to be able to face the cooling air in a direction perpendicular to the direction in which the cooling air flows through the flow passage.

9. The heat source includes a circuit board on which electronic components are mounted, The interior member has through-holes formed in the thickness direction for arranging the circuit board, The projector according to claim 7, wherein the circuit board is placed in the through hole, and the interior member and the circuit board constitute the duct body.

10. The projector according to claim 2, wherein the flow passages are formed on both sides of the first heating element in a direction perpendicular to the direction in which the cooling air flows, the first heating element and the second heating element face each other with one side of the flow passages formed on both sides in between, and in a direction perpendicular to the direction in which the cooling air flows, one side of the flow passages formed on both sides is wider than the other side.

Images