Detection device

Abstract

To provide a detection device that can detect colonies with high accuracy. [Solution] The detection device comprises a housing, a light source that emits light, a planar light sensor in which a plurality of light sensors for detecting light from the light source are arranged in two dimensions, a detection object placement unit provided so that the detection object can be placed between the light source and the planar light sensor, and a control circuit for controlling the light sensor. The detection object is a culture medium contained in a container dish, and the detection object placement unit has at least one first temperature sensor at a position in contact with the dish that acquires first temperature data of the dish, and the control circuit captures an image of the detection object and generates image data when the difference between second temperature data outside the detection object placement unit and the first temperature data falls within a predetermined temperature range.

Description

Technical Field

[0001] The present disclosure relates to a detection device.

[0002] There is known a device that captures an image of a Petri dish on which a culture medium for culturing a culture target such as bacteria is formed, acquires the image, and detects colonies formed by the culture target on the culture medium from the image (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the processes related to colony detection, measures such as maintaining a more favorable environment for the culture target and suppressing spoilage of the culture medium are implemented. As part of such measures, Petri dishes may be placed in an environment that is relatively lower in temperature than the outside air. This may cause condensation to form on the Petri dishes. The condensation formed on the Petri dish may cause shadows in the image obtained by imaging the Petri dish. The shadows caused by condensation in such an image may be difficult to distinguish from the shadows caused by colonies in such an image. For this reason, condensation and colonies may be confused, which may reduce the colony detection accuracy.

[0005] The present disclosure has been made in view of the above problems, and an object thereof is to provide a detection device capable of detecting colonies with high accuracy.

Means for Solving the Problems

[0006] A detection device according to one aspect of the present disclosure comprises a housing, a light source that emits light, a planar light sensor in which a plurality of light sensors for detecting light from the light source are arranged two-dimensionally, a detection object placement unit provided so as to be able to place the detection object between the light source and the planar light sensor, and a control circuit for controlling the light sensor, wherein the detection object is a culture medium contained in a container dish, the detection object placement unit has at least one first temperature sensor at a position in contact with the dish for acquiring first temperature data of the dish, and the control circuit captures the detection object and generates image data when the difference between second temperature data outside the detection object placement unit and the first temperature data falls within a predetermined temperature range. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 shows the main components of the detection device. [Figure 2] Figure 2 shows an example configuration of the detection area and wiring area. [Figure 3] Figure 3 is a circuit diagram showing the circuit configuration of the light sensor. [Figure 4] Figure 4 is a schematic diagram showing an example of a light source configuration. [Figure 5] Figure 5 is a schematic diagram illustrating an example of the detection system configuration. [Figure 6] Figure 6 is a schematic diagram showing the relationship between one detection device and the external configuration. [Figure 7] Figure 7 is a block diagram showing an example of the configuration of the control circuit according to Embodiment 1. [Figure 8] Figure 8 is a schematic diagram showing the main components of the detection device and the structure of each part, including the object to be detected, which is installed in the detection device. [Figure 9] Figure 9 is a schematic plan view showing the object to be detected, placed on a light-transmitting member, as seen from the side of the planar light sensor. [Figure 10] Figure 10 is a flowchart illustrating the process of detecting colonies. [Figure 11]Figure 11 is a schematic diagram showing the main configuration of the detection device according to Embodiment 2 and the structure of each part, including the object to be detected, which is installed in the detection device. [Figure 12] Figure 12 is a schematic plan view showing the detection device shown in Figure 11 as seen from the side of the planar light sensor. [Figure 13] Figure 13 is a flowchart illustrating the process of detecting colonies in the detection device according to Embodiment 2. [Figure 14] Figure 14 is a flowchart illustrating the process of detecting colonies in the detection device according to Embodiment 3. [Figure 15] Figure 15 is a schematic diagram showing the main configuration of the detection device according to Embodiment 4 and the structure of each part, including the object to be detected, which is installed in the detection device. [Figure 16] Figure 16 is a flowchart illustrating the process of detecting colonies in the detection device according to Embodiment 4. [Figure 17] Figure 17 is a schematic diagram showing the main configuration of the detection device according to Embodiment 5 and the structure of each part, including the object to be detected, which is installed in the detection device. [Modes for carrying out the invention]

[0008] The embodiments of this disclosure will be described below with reference to the drawings. It should be noted that the disclosure is merely an example, and modifications that a person skilled in the art could easily conceive of while maintaining the spirit of the invention are naturally included within the scope of this disclosure. Furthermore, the drawings may schematically represent the width, thickness, shape, etc., of parts in order to clarify the explanation, but these are merely examples and do not limit the interpretation of this disclosure. In addition, in this specification and the drawings, elements similar to those described above in previously shown drawings are denoted by the same reference numerals, and detailed explanations may be omitted as appropriate.

[0009] (Embodiment 1) Figure 1 is a diagram showing the main configuration of a detection device. The detection device 1 includes a planar photosensor 10, a light source panel 20, and a control circuit 30. The planar photosensor 10 and the light source panel 20 of the detection device 1 are connected to a control board 101. The control board 101 is provided with a control circuit 102 and the like.

[0010] In the planar photosensor 10, a detection region SA (see FIG. 2) is provided on a substrate 11. Further, a reset circuit 13, a scanning circuit 14, and a wiring region VA are mounted on the substrate 11. The configuration on the detection region SA, the reset circuit 13, and the scanning circuit 14 are connected to a detection circuit 15 via the wiring region VA.

[0011] The light source panel 20 has a light emitting region LA that irradiates light to the detection region SA. In the light source panel 20, a light source 22 is provided on a substrate 21. The light source 22 has a light emitting element such as an LED (Light Emitting Diode), and is arranged in the light emitting region LA. In the example shown in FIG. 1, the plurality of light sources 22 are arranged in a matrix on the substrate 21.

[0012] The light source panel 20 is provided with a light source drive circuit 23. Under the control of the control circuit 30, the light source drive circuit 23 controls whether each of the plurality of light sources 22 is lit and the luminance during lighting. The plurality of light sources 22 may be provided such that light emission can be controlled individually, or may be provided so as to emit light collectively.

[0013] The control circuit 30 performs various types of processing related to the operation of the detection device 1. Specifically, the control circuit 30 is a circuit capable of implementing a plurality of functions, such as an FPGA (Field Programmable Gate Array) or an ASIC (Application Specific Integrated Circuit). The control circuit 30 is connected to the detection circuit 15 via a wiring portion 19, and obtains an output from the detection circuit 15. Further, the control circuit 30 is connected to the light source drive circuit 23 via a wiring portion 29, and performs processing related to lighting of the light sources 22, such as determining the lighting pattern of the light sources 22.

[0014] Further, the control circuit 30 performs processing related to colony detection on a detection target 200 (see FIG. 6 and FIG. 7) which will be described later.

[0015] Although not illustrated, the detection device 1 is provided with an analog / digital conversion circuit, a digital / analog conversion circuit, and the like. The analog / digital conversion circuit enables the output from the optical sensor WA (see FIG. 2) transmitted via the detection circuit 15 to be handled by arithmetic processing of the control circuit 30. The digital / analog conversion circuit makes it possible to use digital signals generated by the arithmetic processing of the control circuit 30 for operation control of the planar optical sensor 10 and the light source panel 20. For these circuits, for example, a part or all of them may be included in the control circuit 30, may be functions exhibited by circuits mounted on a flexible printed circuit board (FPC: Flexible Printed Circuits) provided as the wiring portion 19 and the wiring portion 29, or may be mounted on the detection device 1 by other methods.

[0016] FIG. 2 is a diagram showing a configuration example of a detection region and a wiring region. A plurality of optical sensors WA (FIG. 3) are provided in the detection region SA. In the embodiment, as shown in FIG. 2, the plurality of optical sensors WA are arranged in a matrix along a first direction Dx and a second direction Dy. The first direction Dx and the second direction Dy are orthogonal to each other. In the following description, when referred to as a third direction Dz, the third direction Dz refers to a direction orthogonal to the first direction Dx and the second direction Dy.

[0017] The reset circuit 13 is connected to reset signal transmission lines 51, 52, ···, 5r. Hereinafter, when referred to as a reset signal transmission line 5, the reset signal transmission line 5 refers to any one of the reset signal transmission lines 51, 52, ···, 5r. The reset signal transmission line 5 is a wiring extending along the first direction Dx. In the example shown in FIG. 2, r reset signal transmission lines 5 are arranged side by side in the second direction Dy. r is a natural number of 2 or more. The r reset signal transmission lines 5 are connected to the reset circuit 13 at one end side in the first direction Dx.

[0018] The scanning circuit 14 is connected to the scanning lines 61, 62, ..., 6r. Hereafter, when scanning line 6 is mentioned, it refers to one of the scanning lines 61, 62, ..., 6r. Scanning line 6 is a wiring that runs along the first direction Dx. In the example shown in Figure 2, r scanning lines 6 are arranged in the second direction Dy. These r scanning lines 6 are connected to the scanning circuit 14 at the other end of the first direction Dx.

[0019] As shown in Figure 2, the reset signal transmission line 5 and the scan line 6 are arranged alternately in the second direction Dy within the detection region SA. Although the reset circuit 13 and scan circuit 14 exemplified in Figures 1 and 2 are positioned opposite each other across the detection region SA, the layout of the reset circuit 13 and scan circuit 14 is not limited to this and can be changed as appropriate.

[0020] Furthermore, signal lines 71, 72, ..., 7q are provided within the detection area SA. Hereafter, when signal line 7 is mentioned, it refers to one of signal lines 71, 72, ..., 7q. Signal line 7 is a wiring that runs along the second direction Dy.

[0021] In the example shown in Figure 2, q signal lines 7 are arranged in the first direction Dx, where q is a natural number greater than or equal to 2. Each of these q signal lines 7 is connected at one end in the second direction Dy to one of the multiple switches (for example, switch SW1, switch SW2, switch SW3, or switch SW4) of the multiplexer 40.

[0022] The multiplexer 40 is installed within the wiring area VA. The multiplexer 40 has multiple switches. In the example shown in Figure 2, these multiple switches are shown as switches SW1, SW2, SW3, and SW4. The multiple switches of one multiplexer 40 each turn ON (conductive) at different timings. While one of the multiple switches of one multiplexer 40 is ON (conductive), the other switches are OFF (non-conductive). The number of multiplexers 40 depends on the number of signal lines 7 (q). If the number of switches is p, then the number of multiplexers 40 should be q / p. If there are multiple multiplexers 40, each of the multiple multiplexers 40 is connected to the detection circuit 15 via individual wirings 401, 402, ..., 40p.

[0023] Note that the connection of the signal line 7 to the detection circuit 15 via the multiplexer 40 is merely an example and is not limited to this; the signal line 7 may also be individually directly connected to the detection circuit 15 within the wiring area VA. Within the wiring area VA, the reset circuit 13 is connected to the detection circuit 15 via wiring 131. Within the wiring area VA, the scanning circuit 14 is connected to the detection circuit 15 via wiring 141.

[0024] The detection circuit 15 is involved in detecting light by the PD82 (see Figure 3) provided on the optical sensor WA, and controls the operating timing of the reset circuit 13 and the scanning circuit 14. The output from the optical sensor WA is also input to the detection circuit 15. The detection circuit 15 converts the signal input from the optical sensor WA into data that can be interpreted by the control circuit 30 and outputs it to the control circuit 30. In this embodiment, the detection circuit 15 is an MCU (Micro Controller Unit).

[0025] Figure 3 is a circuit diagram showing the circuit configuration of the optical sensor. Note that the first direction Dx and the second direction Dy in Figure 3 merely correspond to the directions of the reset signal transmission line 5, scan line 6, and signal line 7, and do not strictly represent the relative positional relationship of the circuit configuration within the optical sensor WA.

[0026] As shown in Figure 3, the optical sensor WA is equipped with switching element 81, PD82, transistor element 83, and switching element 85. PD82 is a photodiode (PD). Switching elements 81, 85 and the transistor element are MOSFETs (Metal Oxide Semiconductor Field Effect Transistors).

[0027] The gate of the switching element 81 is connected to the reset signal transmission line 5. A reset potential VReset is applied to either the source or drain of the switching element 81. The cathode of PD82 and the gate of transistor element 83 are connected to the other source or drain of the switching element 81. Hereinafter, when the connection part CP is mentioned, it refers to the other part, the location where the cathode of PD82 and the gate of transistor element 83 are connected. A reference potential VCOM is also applied from the anode side of PD82. The potential difference between the reset potential VReset and the reference potential VCOM is predetermined, but the potentials of the reset potential VReset and the reference potential VCOM may be variable. Note that the reset potential VReset is at a higher potential than the reference potential VCOM.

[0028] The drain of transistor element 83, which functions as a source follower, is supplied with the output source potential VPP2. The source of transistor element 83 is connected to either the source or the drain of switching element 85. The other source or drain of switching element 85 is connected to signal line 7. The gate of switching element 85 is connected to scan line 6.

[0029] The reset potential VReset, the reference potential VCOM, and the output source potential VPP2 are supplied by the detection circuit 15 to the optical sensor WA based on power supplied, for example, via a power supply circuit (not shown) connected to the detection circuit 15. The output form of these potentials is not limited to this and can be changed as appropriate.

[0030] The output source potential VPP2 is predetermined. Furthermore, the source potential of transistor element 83 is lower than the output potential of PD82 by the gate-source voltage (Vth) of transistor element 83. In this case, the source potential of transistor element 83 depends on the reset potential VReset and the reference potential VCOM. The output potential of PD82 depends on the photovoltaic power generated by PD82 in response to the light detected by PD82 during the exposure period.

[0031] When the gate of the switching element 85 is turned ON by a gate signal provided from the scanning circuit 14 via the scanning line 6, the source-drain of the switching element 85 becomes conductive. As a result, the signal (potential) transmitted to the switching element 85 via the transistor element 83 is transmitted to the signal line 7 through the switching element 85. In this way, an output is generated from the optical sensor WA. Hereafter, when referred to as the gate signal, the gate signal refers to the signal (potential) provided from the scanning circuit 14 via the scanning line 6. The scanning circuit 14 is a circuit that outputs the gate signal. As explained with reference to Figures 2 and 3, multiple optical sensors WA connected to the scanning line 6 and the signal line 7 are arranged in a matrix in the detection area SA of the planar optical sensor 10. Here, the scanning line 6 is provided along the first direction Dx and is configured to transmit a gate signal that generates an output from the optical sensor WA. The signal line 7 is configured to transmit the output of the optical sensor WA along the second direction Dy.

[0032] The output of one PD82 provided on a single light sensor WA corresponds to the intensity of light detected by the PD82 within a predetermined exposure period. The output of the PD82 is reset in response to a signal provided by the reset circuit 13 via the reset signal transmission line 5. When the gate of the switching element 81 is turned ON by this signal, the source-drain connection of the switching element 81 becomes conductive. This resets the potential of the connection CP to the reset potential VReset.

[0033] Figure 4 is a schematic diagram showing an example of the configuration of a light source. As shown in Figure 4, the light source 22 has a first light source 22R, a second light source 22G, and a third light source 22B. The first light source 22R, the second light source 22G, and the third light source 22B each emit light of a different color. In this embodiment, the first light source 22R emits red (R) light. The second light source 22G emits green (G) light. The third light source 22B emits blue (B) light.

[0034] As shown in the "First Example" in Figure 4, the light source 22 has, for example, a light-emitting region 2201 and a frame region 2202. In the light-emitting region 2201, a first light source 22R, a second light source 22G, and a third light source 22B, which are square in shape from a planar viewpoint, are arranged along the second direction Dy. The frame region 2202 is a frame-shaped region that borders the light-emitting region 2201. The width D1 of the light-emitting region 2201 in the first direction Dx is smaller than the width D2 of the frame region 2202 in the first direction Dx. The height H1 of the light-emitting region 2201 in the second direction Dy is smaller than the height H2 of the frame region 2202 in the second direction Dy. The spacing H3, which is the distance between the first light source 22R and the second light source 22G, and the distance between the second light source 22G and the third light source 22B, is less than half of the height H1. In the "First Example" of Figure 4, the width D1 and height H1 are equal, and the width D2 and height H2 are equal, but at least one of these may be different. Furthermore, the light source 22 may be replaced with a different form, such as the light source 22A shown in the "Second Example" of Figure 4. In light source 22A, the longitudinal directions of the first light source 22R, the second light source 22G, and the third light source 22B are aligned with the second direction Dy, and they are arranged in the order of first light source 22R, second light source 22G, and third light source 22B from one side to the other in the first direction Dx. The first and second examples of Figure 4 are examples of the forms of light sources according to this disclosure and are not limited thereto. The shapes of the first light source 22R, the second light source 22G, and the third light source 22B in a planar view and the positional relationship of the first light source 22R, the second light source 22G, and the third light source 22B can be changed as appropriate. A planar viewpoint is a viewpoint that directly views the plane (Dx-Dy plane) along which the first direction Dx and the second direction Dy lie.

[0035] Figure 5 is a schematic diagram illustrating an example of the configuration of a detection system. As shown in Figure 5, the detection system 100 includes a plurality of detection devices 1, a host IC 70, and a connection circuit 125. The plurality of detection devices 1 are electrically connected to a common host IC 70 via the connection circuit 125.

[0036] The incubator 120 shown in Figure 5 is maintained in an environment (temperature, humidity, etc.) suitable for culturing the substance to be detected 200 with its door closed. Multiple detection devices 1 are placed inside the incubator 120.

[0037] The host IC 70 shown in Figure 5 is an information processing device such as a PC (Personal Computer). The host IC 70 has a storage unit 7100, an arithmetic unit 7200, an input unit 7300, and a display unit 7400.

[0038] The memory unit 710 has a storage device for storing programs and the like. This storage device is a non-volatile storage device such as an SSD (Solid State Drive), HDD (Hard Disk Drive), or flash memory.

[0039] Furthermore, the memory unit 710 has RAM (Random Access Memory) which functions as a memory area temporarily used during execution processing by the arithmetic unit 720.

[0040] The arithmetic unit 720 has an arithmetic circuit that functions as a CPU (Central Processing Unit). The arithmetic unit 720 reads data stored in the storage unit 710, reads the programs and other data contained in that data, and executes them to perform various processes related to the operation of the host IC 70. The programs and other data refer to software programs and data containing information referenced during the execution of those software programs.

[0041] The input unit 730 has an input device that is capable of receiving external input operations to the host IC 70. This input device is, for example, at least one of the following, but is not limited to a keyboard or mouse. The input device may also have other forms, such as a touch panel integrated with the display unit 740.

[0042] The display unit 740 outputs a display corresponding to the processing performed by the calculation unit 720. The display unit 740 is, for example, a liquid crystal display, an organic EL (Electro-Luminescence) display, etc., but is not limited to these, and may output a display using other methods.

[0043] Figure 6 is a schematic diagram showing the relationship between one detection device and the external configuration. As shown in Figure 6, the connection between the detection device 1 and the connection circuit 125 is made by the connection between the control circuit 30 and the connection circuit 125. Also, as shown in Figure 6 and Figure 7 described later, the planar light sensor 10 and the light source panel 20 face each other. Furthermore, the object to be detected 200 can be placed between the planar light sensor 10 and the light source panel 20.

[0044] Note that Figure 6 only provides a general overview of the relationship between the planar light sensor 10, the light source panel 20, and the object to be detected 200. The specific structure for installing the object to be detected 200 between the planar light sensor 10 and the light source panel 20 will be explained with reference to Figure 8.

[0045] Figure 7 is a block diagram showing an example configuration of a control circuit according to the embodiment. As shown in Figure 7, the control circuit 30 includes an image processing circuit 320, an image output circuit 321, and a storage circuit 322.

[0046] As shown in Figure 7, the image processing circuit 320 performs predetermined processing on each of the multiple image data I(n) acquired at predetermined intervals by the planar light sensor 10 (where n is a natural number). Specifically, the image processing circuit 320 calculates the difference between the image data I(n) acquired during the predetermined period and the initial image data Ib, and generates the difference image data Id.

[0047] The image output circuit 321 outputs an output image signal, generated based on the image data I(n) acquired by the planar light sensor 10, to the display unit 740 of the host IC 70.

[0048] The memory circuit 322 stores various information such as a predetermined threshold, multiple image data I(n) acquired at predetermined intervals, differential image data Id, temperature data, and a predetermined temperature range.

[0049] Figure 8 is a schematic diagram showing the main components of the detection device and the structure of each part, including the object to be detected, which is installed in the detection device. The object to be detected 200 is a culture medium 215 contained in a container dish 210. The container further has a lid 220. Specifically, the dish 210 is a Petri dish. The lid 220 is the lid of the dish 210. As shown in Figure 6, which will be described later, the inner diameter of the annular side wall of the lid 220 is greater than or equal to the outer diameter of the annular side wall of the dish 210. That is, the lid 220 has a cylindrical outer wall that covers the cylindrical outer wall of the dish 210 from the outside. The culture medium 215 is a culture medium in which colonies can be cultured. Hereinafter, when simply referred to as a colony, a colony is a culture target that is formed in the object to be detected 200 and cultured in the culture medium 215. The culture target is an object that is expected to be cultured in the culture medium 215, such as biological tissue or microorganisms. The culture medium 215 exhibits light transmission to such an extent that the degree of light transmission changes depending on the presence or absence of colonies and the thickness of the colonies. The object to be detected 200 is placed on the light-transmitting member 91. The light-transmitting member 91 is a plate-shaped member made of colorless glass or a colorless synthetic resin that has light transmission properties.

[0050] Furthermore, as shown in Figure 8, the object to be detected mounting section 99 has a first temperature sensor 80 that acquires first temperature data at a position in contact with the dish 210. The first temperature sensor 80 measures the temperature of the culture medium in the dish 210. Note that the first temperature data may be data in which the temperature of a portion of the culture medium 215 has been measured.

[0051] Figure 9 is a schematic plan view showing the object to be detected placed on the light-transmitting member as seen from the planar light sensor side. As shown in Figure 9, the light-transmitting member 91 is a circular member with a diameter that can accommodate the object to be detected 200 inside from a planar viewpoint. The light-transmitting member 91 forms a light-transmitting region between the planar light sensor 10 and the light source panel 20 that can accommodate the object to be detected 200 inside. The light-transmitting member 91 is in contact with the light-shielding member 92 at its outer edge. The light-shielding member 92 is a plate-shaped member into which the light-transmitting member 91 is fitted. The light-shielding member 92 exhibits light-shielding properties.

[0052] The edge 95 shown in Figure 9 is the outer edge of the light-transmitting member 91 and the inner edge of the light-shielding member 92 into which the light-transmitting member 91 is fitted. The edge 95 is a circle in a planar view. Alternatively, a light-transmitting region within the edge 95 may be formed when the light-transmitting member, which functions as the light-transmitting member 91, overlaps with the light-shielding member 92, which has been cut out in a circular shape to form the inner edge corresponding to the edge 95. In this case, the light-transmitting member 91 does not need to be disc-shaped.

[0053] In this embodiment, a diffuser plate 25 is provided on the light source panel 20 side of the light-transmitting member 91. The diffuser plate 25 is an optical member that diffuses light. The diffuser plate 25 is positioned between the light-transmitting member 91 and the light-emitting region LA of the light source panel 20. When the diffuser plate 25 receives light emitted from the light-emitting region LA from the light source panel 20 side, it transmits the light to the light-transmitting member 91 side, thereby further diffusing the direction of light propagation. This makes the light from the light-emitting region LA, formed by a collection of multiple light sources 22 arranged in two dimensions, more uniform from a planar viewpoint.

[0054] As shown in Figure 8, in this embodiment, an elastic member 93 is provided between the light-shielding member 92 and the light source panel 20. The elastic member 93 is an elastic member that biases the light-shielding member 92 toward the planar light sensor 10. Specifically, the elastic member 93 is, for example, a cylindrical compression coil spring as shown in Figure 8. The object to be detected 200, placed on the light-transmitting member 91, is pressed against a member 26 provided between the planar light sensor 10 and the light-transmitting member 91 by the biasing force that the elastic member 93 exerts on the light-shielding member 92. In this embodiment, the object to be detected mounting section 99 is composed of the light-transmitting member 91, the light-shielding member 92, and the elastic member 93. In other words, the object to be detected mounting section 99 has a light-transmitting member 91 on which the object to be detected is placed, and a light-shielding member 92 which is a light-shielding member that supports the light-transmitting member from its outer circumference.

[0055] Component 26 functions as an optical component that limits the light emitted from the light-emitting region LA of the light source panel 20 to the planar light sensor 10. Specifically, component 26 has one of the following: a plate-shaped louver, a cylindrical aperture, or a microlens. A plate-shaped louver is a plurality of parallel plate-shaped structures whose plate surfaces are aligned along the third direction Dz. It is desirable that the structure be made of a material with strong light-absorbing properties. A cylindrical aperture is a cylindrical opening that penetrates the base of component 26 along a plane perpendicular to the third direction Dz (Dx-Dy plane) in the third direction Dz. It is desirable that the base be made of a material with strong light-absorbing properties. A microlens is a tiny lens whose optical axis is aligned along the third direction Dz. It is desirable that the base of component 26 supporting the microlens be made of a material with strong light-absorbing properties. Regardless of the form of the component 26, as an optical component, the component 26 is provided with the purpose of limiting the direction of propagation of light emitted from the light source 22 and reaching the planar light sensor 10 to the third direction Dz or a direction with a shallower inclination angle with respect to the third direction Dz.

[0056] The opposing third direction Dz of the light-emitting region LA of the light source panel 20 and the detection region SA of the planar light sensor 10 is held by the housing 90. The housing 90 is a heat-insulating and light-shielding housing provided to pre-house the light source panel 20, elastic member 93, diffuser plate 25, light-transmitting member 91, light-shielding member 92, member 26, and planar light sensor 10 inside. Inside the housing 90, the planar light sensor 10, member 26, and light source 22 are arranged in order. The positional relationship of each component shown in Figure 8 is established when the object to be detected 200 is placed between member 26 and light-transmitting member 91. In this embodiment, the object to be detected 200 is placed on the light-transmitting member 91 such that the lid 220 side of the object to be detected 200 abuts against the light-transmitting member 91. In other words, the object to be detected 200 is placed between the planar light sensor 10 and the light source panel 20 such that the lid 220 is positioned relatively below and the dish 210 is positioned relatively above.

[0057] As described above with reference to Figure 8, the detection device 1 of the embodiment has a structure that allows the object to be detected 200 to be placed between the planar light sensor 10 and the light source panel 20. In the placed object to be detected 200, the bottom surface of the dish 210 on which the culture medium 215 is formed is aligned with the detection area SA of the planar light sensor 10 and the light emission area LA of the light source panel 20.

[0058] Light emitted from the light-emitting region LA of the light source panel 20 is diffused by the diffuser plate 25, passes through the light-transmitting member 91, the object to be detected 200, and member 26, and reaches the detection region SA of the planar light sensor 10. Thus, the planar light sensor 10 is configured to output data that reflects the intensity of light emitted from the light source 22, passing through the object to be detected 200, and reaching multiple light sensors WA. The data referred to here is based on the set of outputs of multiple light sensors WA and can be considered as image data. The image referred to here is an arrangement of multiple pixels, where the output of one light sensor WA is considered as one pixel, and the pixels are arranged to correspond to the arrangement of light sensors WA in the detection region SA. Hereafter, unless otherwise specified, when simply referred to as an image, it refers to the set of outputs of multiple light sensors WA. Also, unless otherwise specified, when simply referred to as a pixel, it refers to the output of a light sensor WA. In practice, however, processing such as analog / digital conversion is performed to treat the output of a light sensor WA as a pixel. In this embodiment, the relevant processing is performed by the detection circuit 15 as described above, but it may also be performed by the control circuit 30.

[0059] The intensity of light reaching the detection area SA is affected by the degree of light transmission through the culture medium 215. Furthermore, the uniformity of the light reaching the detection area SA is affected by the degree of light diffusion between the planar light sensor 10 and the light source panel 20.

[0060] Furthermore, as shown in Figure 8, the detection device 1 further includes an optical directional control element 60. The optical directional control element 60 is positioned between the object to be detected mounting section 99 and the planar light sensor 10. Specifically, the optical directional control element 60 is provided on the light-transmitting member 91. The optical directional control element 60 is an optical element that transmits the component of light irradiated from the light source panel 20 that travels in a direction perpendicular to the planar light sensor 10 toward the PD82. The optical directional control element 60 is also called a collimated aperture or collimator. Alternatively, the detection device 1 may have a configuration that includes a louver or microlens instead of a collimator.

[0061] Figure 10 is a flowchart illustrating the process of detecting colonies. As shown in Figure 10, first, the first temperature sensor 80 acquires first temperature data (step ST111).

[0062] The second temperature data is the set temperature inside the incubator 120. This second temperature data can be input externally. The temperature inside the incubator 120 is changed according to the externally input set temperature. The second temperature data is stored in the memory unit 710.

[0063] The control circuit 30 reads the second temperature data stored in the memory unit 710 to the memory circuit 322 (step ST112). The second temperature data is stored in the memory circuit 322.

[0064] Next, the control circuit 30 determines whether the second temperature data is the dew point temperature (step ST113). The memory unit 710 stores the dew point temperature itself as a set value. The control circuit 30 reads the dew point temperature data stored in the memory unit 710 to the memory circuit 322. The dew point temperature is the temperature at which condensation begins to form around the dish 210.

[0065] If the control circuit 30 determines that the second temperature data is not the dew point temperature (step ST113: No), the control circuit 30 determines whether the difference between the second temperature data and the first temperature data is within a predetermined temperature range (for example, -0.1°C or more and +0.1°C or less) (step ST114).

[0066] A predetermined temperature range is stored in the memory circuit 322. The control circuit 30 executes the process of step ST114 based on the predetermined temperature range stored in the memory circuit 322.

[0067] In step ST114, if the difference between the first temperature data and the second temperature data exceeds a predetermined temperature range (step ST114: No), the control circuit 30 determines that condensation has occurred around the dish 210, waits for a predetermined time, and returns to the start (step ST115). The predetermined time can be set and changed by operating the input section 730 of the host IC 70, and the information of the set predetermined time is stored in the memory circuit 322. The predetermined time is, for example, about 5 minutes.

[0068] If the difference between the first temperature data and the second temperature data does not exceed a predetermined temperature range (step ST114: Yes), the control circuit 30 determines that the first temperature is sufficiently close to the second temperature and proceeds to step 116.

[0069] If the control circuit 30 determines that the second temperature data is the dew point temperature (step ST113: Yes), the control circuit 30 determines whether the first temperature data is greater than the second temperature data (step ST117).

[0070] In step ST117, if the first temperature data is smaller than the second temperature data (step ST117: No), the control circuit 30 determines that condensation has occurred on the outer circumference of the dish 210, waits for a predetermined time, and returns to the start (step ST118).

[0071] If the first temperature data is greater than the second temperature data (step ST117: Yes), the control circuit 30 determines that the first temperature is sufficiently close to the second temperature and proceeds to step 116.

[0072] The control circuit 30 instructs the optical sensor WA to image the object to be detected 200 and generate and acquire initial image data Ib (step ST116). The initial image data Ib is image data based on sensor values ​​obtained by scanning multiple photodiodes 82 of the optical sensor WA in the initial state (for example, the time after power-on). The acquired initial image data Ib is stored in the memory circuit 322 of the control circuit 30.

[0073] The optical sensor WA waits for a predetermined time after acquiring the initial image data Ib (step ST119). The predetermined time can be set and changed by operating the input unit 730 of the host IC 70, and the information of the set predetermined time is stored in the memory circuit 313. The predetermined time is, for example, about 5 minutes.

[0074] After a predetermined time has elapsed since the last detection, the optical sensor WA scans multiple photodiodes 82 to generate and acquire image data I(n) (step ST120). The image data I(n) acquired at predetermined intervals is stored in the memory circuit 322.

[0075] The acquired image data I(n), and various differential image data Id and various information generated based on the image data I(n), are stored in the memory circuit 313 of the control circuit 30 as appropriate.

[0076] The image processing circuit 320 calculates the difference between the initial image data Ib acquired in step ST116 and the image data I(n) acquired in step ST120, and calculates the difference image data Id (step ST121).

[0077] The image processing circuit 320 compares the generated differential image data Id with a predetermined threshold (step ST122). More specifically, it compares the difference data of the sensor values ​​for each PD82 in the differential image data Id with a predetermined threshold Th. If the difference data is less than or equal to the predetermined threshold Th (step ST122, No), it determines that the detected object 200 is not growing and returns to step ST119.

[0078] If the differential image data Id is greater than a predetermined threshold (step ST122, Yes), the control circuit 30 determines that the detected object 200 has grown and executes the colony detection process (step ST123).

[0079] This prevents condensation around the dish 210 from affecting the light detection results of the planar light sensor 10. In other words, the detection device 1 can detect colonies with high accuracy.

[0080] (Embodiment 2) Figure 11 is a schematic diagram showing the main configuration of the detection device according to Embodiment 2 and the structure of each part, including the object to be detected, installed in the detection device. Figure 12 is a schematic plan view showing the detection device shown in Figure 11 as seen from the side of the planar light sensor. In the following description, the same reference numerals are used for components similar to those in Embodiment 1, and redundant explanations are omitted.

[0081] As shown in Figures 11 and 12, a heater 300 is provided inside the housing 90. When current flows through the heater 300, the heater 300 raises the ambient temperature. The temperature of the object to be detected 200 changes according to the temperature of the heater 300. For example, a resistance heating type heater 300 can be used. As shown in Figure 12, in a plan view, the heater 300 is arranged around at least one of the following inside the housing 90: the planar light sensor 10, the object to be detected mounting section 99, and the light source 22. Also, as shown in Figures 11 and 12, the heater 300 is arranged around the substrate 21.

[0082] Furthermore, as shown in Figure 11, the detection device 1A according to Embodiment 3 includes a second temperature sensor 810 inside the housing 90.

[0083] The second temperature sensor 810 is positioned at a distance from the object to be detected installation section 99. The second temperature sensor 810 controls the temperature of the heater 300, for example, by PID control or ON-OFF control, and sets the internal temperature of the housing 90 to the optimal temperature for colony cultivation (for example, around 37°C).

[0084] Furthermore, since the heater 300 is installed inside the housing 90, the environment (temperature, humidity, etc.) inside the housing 90 can be maintained in a suitable state for culturing the object to be detected 200, and therefore the heater 300 can be used as a substitute for the incubator 120.

[0085] Furthermore, the detection device 1 also includes a light-shielding member 310. As shown in Figures 5 and 7, the light-shielding member 310 is located inside the housing 90, adjacent to the heater 300.

[0086] This makes it possible to suppress the scattering of light emitted from the heater 300 and its incidence onto the planar light sensor 10.

[0087] Figure 13 is a flowchart illustrating the process of detecting colonies in the detection device according to Embodiment 2. As shown in Figure 13, first, the first temperature sensor 80 acquires first temperature data (step ST211).

[0088] Next, the second temperature sensor 810 acquires second temperature data (step ST212). The second temperature data is the temperature inside the housing 90.

[0089] Next, the control circuit 30 determines whether the second temperature data from step ST212 is the dew point temperature (step ST213). The memory unit 710 stores the dew point temperature itself as a set value. If the control circuit 30 determines that the second temperature data is not the dew point temperature (step ST213: No), the control circuit 30 proceeds to step ST214. If the control circuit 30 determines that the second temperature data is not the dew point temperature (step ST213: Yes), the control circuit 30 proceeds to step ST217.

[0090] The processing in steps ST214 to ST223 corresponds to steps ST113 to ST123, and since the processing is similar, a detailed explanation is omitted.

[0091] This prevents condensation around the dish 210 from affecting the light detection results of the planar light sensor 10. In other words, the detection device 1 can detect colonies with high accuracy.

[0092] (Embodiment 3) Figure 14 is a flowchart illustrating the process of detecting colonies in the detection device according to Embodiment 3. In the following description, the same reference numerals are used for components similar to those in Embodiment 1, and redundant explanations are omitted.

[0093] As shown in Figure 14, first, the first temperature sensor 80 acquires the first temperature data (step ST311).

[0094] Next, the control circuit 30 reads the second temperature data stored in the memory unit 710 to the memory circuit 322 (step ST312).

[0095] Next, the control circuit 30 reads the humidity data stored in the memory unit 710 to the memory circuit 322 (step ST313).

[0096] The humidity data is the humidity inside the incubator 120. Humidity data can be input from an external source. The humidity data is stored in the memory unit 710.

[0097] The control circuit 30 calculates the dew point temperature based on the second temperature data from step ST312 and the humidity data from step ST313 (step ST314). The memory circuit 322 stores a database of dew point temperature conversions based on temperature and humidity, as well as a dew point temperature conversion formula. The control circuit 30 provides the second temperature data and the setting data set in the incubator 120 to the dew point temperature conversion database and the dew point temperature conversion formula, calculates the dew point temperature, and stores it in the memory unit 710.

[0098] The control circuit 30 determines whether the first temperature data is greater than the dew point temperature (step ST315).

[0099] If the first temperature data is less than the dew point temperature (step ST315: No), the control circuit 30 determines that condensation has occurred on the outer circumference of the dish 210, waits for a predetermined time, and returns to the start (step ST316).

[0100] If the first temperature data is greater than the dew point temperature (step ST315: Yes), the control circuit 30 determines that the first temperature is sufficiently close to the dew point temperature and proceeds to step 317.

[0101] The processes from steps ST317 to ST322 correspond to the processes from steps ST116 to ST123 in Embodiment 1, and since they are similar processes, a detailed explanation is omitted.

[0102] This makes it possible to suppress the effect of condensation around the dish 210 on the light detection results by the planar light sensor 10. In other words, colonies can be detected with high accuracy.

[0103] (Embodiment 4) Figure 15 is a schematic diagram showing the main configuration of the detection device according to Embodiment 4 and the structure of each part, including the object to be detected, which is installed in the detection device. Figure 16 is a flowchart illustrating the process of detecting colonies in the detection device according to Embodiment 4. In the following description, the same reference numerals are used for components similar to those in Embodiment 1, and redundant explanations are omitted.

[0104] As shown in Figure 15, the detection device 1B of Embodiment 3 includes a hygrometer 820 inside the housing 90. The hygrometer 820 may also be a humidity sensor.

[0105] As shown in Figure 16, first, the first temperature sensor 80 acquires the first temperature data (step ST411).

[0106] Next, the second temperature sensor 810 acquires second temperature data (step ST412).

[0107] Next, the control circuit 30 acquires humidity data from the hygrometer 820 (step ST413). The humidity data represents the temperature inside the enclosure 90.

[0108] The control circuit 30 calculates the dew point temperature based on the second temperature data from step ST412 and the humidity data from step ST413 (step ST414). The memory circuit 322 stores a database of dew point temperature conversions based on temperature and humidity, as well as a dew point temperature conversion formula. The control circuit 30 provides the second temperature data and the humidity data obtained from the hygrometer 820 to the dew point temperature conversion database and the dew point temperature conversion formula, calculates the dew point temperature, and stores it in the memory unit 710.

[0109] The control circuit 30 determines whether the first temperature data is greater than the dew point temperature (step ST415).

[0110] If the first temperature data is less than the dew point temperature (step ST415: No), the control circuit 30 determines that condensation has occurred on the outer circumference of the dish 210, waits for a predetermined time, and returns to the start (step ST416).

[0111] If the first temperature data is greater than the dew point temperature (step ST415: Yes), the control circuit 30 determines that the first temperature is sufficiently close to the dew point temperature and proceeds to step 417.

[0112] The processes in steps ST417 to ST422 correspond to the processes in steps ST116 to ST123 of Embodiment 1, and since they are similar, a detailed explanation is omitted.

[0113] This prevents condensation around the dish 210 from affecting the light detection results of the planar light sensor 10. In other words, the detection device 1 can detect colonies with high accuracy.

[0114] (Embodiment 5) Figure 17 is a schematic diagram showing the main configuration of the detection device according to Embodiment 5 and the structure of each part, including the object to be detected, which is installed in the detection device. In the following description, the same reference numerals are used for components that are the same as in Embodiment 1, and redundant explanations are omitted.

[0115] As shown in Figure 17, in the detection device 1C according to Embodiment 5, multiple first temperature sensors 80 are arranged at positions on the lid that are in contact with the dish. In the detection device 1C of Embodiment 4, two first temperature sensors are arranged, but three or more may be arranged.

[0116] The control circuit 30 captures an image of the object to be detected 200 and generates image data when the difference between the second temperature data and the first temperature data measured by each of the multiple first temperature sensors 80 falls within a predetermined temperature range.

[0117] This makes it possible to suppress the effect of condensation around the dish 210 on the light detection results by the planar light sensor 10. In other words, colonies can be detected with high accuracy.

[0118] Furthermore, any other effects and advantages brought about by the embodiments described herein that are obvious from this specification or that can be appropriately conceived by those skilled in the art are naturally provided by this disclosure. [Explanation of symbols]

[0119] 1, 1A, 1B, 1C detection devices 10 Planar light sensor 22 Light source 26 components 60 Light directivity control element 710 Storage section 80 First temperature sensor 810 Second temperature sensor 820 Hygrometer 90 cabinets 91 Light-transmitting member 92 Light-shielding material 99 Detected object installation section 200 objects to be detected 322 Memory circuit WA Optical Sensor 210 dishes 300 Heater

Claims

1. The casing and A light source that emits light, A planar light sensor in which multiple light sensors for detecting light from the aforementioned light source are arranged in a two-dimensional manner, A detection object installation unit is provided so as to be able to install the detection object between the light source and the planar light sensor, A control circuit for controlling the aforementioned optical sensor, Equipped with, The object to be detected is a culture medium contained in a container dish. The object to be detected installation unit has at least one first temperature sensor at a position in contact with the dish, which acquires first temperature data of the dish. The control circuit, when the difference between the second temperature data from outside the object to be detected installation area and the first temperature data falls within a predetermined temperature range, captures an image of the object to be detected and generates image data. Detection device.

2. The control circuit includes a memory circuit, The second temperature data can be input from an external source. The second temperature data is stored in the memory circuit. The detection device according to claim 1.

3. The housing is equipped with a second temperature sensor inside, The second temperature sensor is positioned at a distance from the object to be detected installation section. The second temperature data is acquired by the second temperature sensor. The detection device according to claim 1.

4. A heater is provided inside the aforementioned enclosure. The detection device according to claim 3.

5. The control circuit includes a memory circuit, The predetermined temperature range is stored in the memory circuit. The detection device according to claim 2.

6. The second temperature data is the dew point temperature. The control circuit, when the first temperature data is greater than the second temperature data, captures an image of the object to be detected and generates image data. The detection device according to claim 5.

7. The humidity data outside the detection target installation area can be input from an external source. The humidity data is stored in the memory circuit. The dew point temperature is calculated based on the second temperature data and the humidity data. The detection device according to claim 5.

8. A hygrometer is provided inside the aforementioned enclosure. The dew point temperature is calculated based on the humidity data measured by the hygrometer and the second temperature data. The detection device according to claim 5.

9. The object to be detected installation section has a lid for housing the dish, Multiple first temperature sensors are arranged at positions on the lid that are in contact with the dish. The control circuit, when the difference between the second temperature data and the first temperature data measured by each of the first temperature sensors falls within a predetermined temperature range, captures an image of the object to be detected and generates image data. The detection device according to claim 2.

10. Further equipped with an optically directional control element, The optical directional control element is positioned between the object to be detected and the planar light sensor. The detection device according to any one of claims 4, 6, 7, 8, or 9.

Images